Water-cooling plate runner structure for synchronizing thermal management of electronic component

By designing a water-cooled plate runner structure for synchronous electronic components, the existing battery thermal management system has solved the problems of low heat transfer efficiency and poor heat dissipation uniformity, and more efficient thermal management is achieved, manufacturing costs and process complexity are reduced, and service life and peak efficiency are improved.

CN119890544APending Publication Date: 2025-04-25马鞍山纳百川热交换器有限公司
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202510090523.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-21
Publication Date
2025-04-25

AI Technical Summary

Technical Problem

The existing battery thermal management system has low heat transfer efficiency, poor heat dissipation uniformity, high energy consumption, and the water-cooled plate cannot effectively manage the heat of BMS and other components, resulting in low service life and peak efficiency.

Method used

A water-cooled plate runner structure for synchronous thermal management of electronic components is designed. By designing the upper cold plate as an upward stamping runner structure, it fits all electrical components that need thermal management as much as possible, reducing dependence on thermally conductive structural adhesives, reducing manufacturing costs and process complexity, and controlling the temperature rise and temperature difference of electrical appliances through simulation.

Benefits of technology

It effectively reduces manufacturing costs and process complexity, controls the temperature rise and temperature difference of all electrical appliances through simulation, greatly improving service life and peak service efficiency.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119890544A_ABST
    Figure CN119890544A_ABST
Patent Text Reader

Abstract

The invention discloses a water cooling plate runner structure for synchronous electronic component thermal management, and belongs to the technical field of battery thermal management. A water cooling plate runner structure for synchronous electronic component thermal management comprises an upper cooling plate and a lower cooling plate, the upper cooling plate is attached to the lower cooling plate, an integrally-formed unit attaching plate is arranged on the outer surface of the upper cooling plate, a liquid outlet is formed in one end of the upper cooling plate, and a liquid inlet is formed in one side of the liquid outlet. Interference risks exist in the assembling process of upper and lower cold plates in order to solve small gaps; in order to solve the problems of large blocking gap and internal leakage risk after brazing, the upper cooling plate of the water cooling plate is designed to be in an upward stamping runner structure shape, so that the upper cooling plate is attached to all electrical components needing thermal management as far as possible, the attaching area is more obvious due to upward protrusion of the attaching area, the area needing to be coated with a heat conduction structural adhesive is convenient to control the gluing range and dosage of later engineering, and the production efficiency is improved. And the manufacturing cost and the process complexity are effectively reduced.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present invention relates to the technical field of battery thermal management, and in particular to a water cooling plate flow channel structure for thermal management of synchronous electronic components. Background Art

[0002] At present, the battery thermal management system in the energy storage industry mainly relies on air conditioning cooling, which has low heat transfer efficiency, poor heat dissipation uniformity and higher energy consumption.

[0003] The existing upper cold plate and the battery cell contact surface, the upper cold plate and the DBU / BMS and other electrical components contact surface are not on the same plane, so the water cooling plate is mostly used only for thermal management of the battery cell;

[0004] Since BMS generates little heat, it is mostly fixed on the side wall of the box, and it is impossible to use a water cooling plate for thermal management, which is not conducive to its peak working efficiency and service life;

[0005] If other components such as DBU require a water cooling plate for thermal management, a thick layer of thermal conductive structural adhesive is usually applied to the bottom, resulting in a waste of cost. Summary of the invention

[0006] The purpose of the present invention is to provide a water-cooled plate flow channel structure for thermal management of synchronous electronic components. The upper cold plate of the water-cooled plate is designed with a flow channel structure shape that is stamped upward so that it can fit all electrical components that require thermal management as closely as possible. Since the fitting area is raised upward, the area that requires coating with thermally conductive structural adhesive is more obvious, which facilitates the coating range and amount control of subsequent engineering, effectively reduces manufacturing costs and process complexity, and effectively controls the temperature rise and temperature difference of all electrical appliances through simulation, greatly improving their service life and peak usage efficiency, thereby solving the problems in the prior art.

[0007] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a water-cooled plate flow channel structure for thermal management of synchronous electronic components, comprising an upper cold plate and a lower cold plate, the upper cold plate being bonded to the lower cold plate, the outer surface of the upper cold plate being provided with an integrally formed unit plate, wherein a liquid outlet is provided at one end of the upper cold plate, a liquid inlet is provided at one side of the liquid outlet, liquid shut-off valve tubes are provided on the outer sides of the liquid outlet and the liquid inlet, the liquid shut-off valve tubes are connected to the liquid outlet and the liquid inlet by internal threads, a cooling flow channel is provided on the inner side of the lower cold plate, and a plurality of integrally formed diversion partitions are provided inside the cooling flow channel.

[0008] Furthermore, the liquid outlet and the liquid inlet are connected via a cooling channel, the unit plate corresponds to the cooling channel, a channel partition is provided between the cooling channels, and the channel partition and the lower cold plate are provided as an integrally formed structure.

[0009] Furthermore, a chamber partition is provided on one side of the flow channel partition, and the chamber partition and the lower cold plate are arranged as an integrally formed structure, and the liquid shut-off valve tube includes an inner tube, an outer tube and a shaft disk, and the shaft disk is located between the inner tube and the outer tube, wherein the shaft disk is connected to the inner tube by a slot.

[0010] Furthermore, locking clamps are provided around the shaft disc, and the locking clamps are rotatably connected to the shaft disc. The outer tube is connected to the inner tube through the locking clamps, and the inner tube is respectively installed inside the liquid outlet and the liquid inlet, wherein an inner tube cavity is provided inside the inner tube, and an outer tube cavity is provided inside the outer tube.

[0011] Furthermore, valve discs are provided on the outside of the outer tube cavity and the inner tube cavity, and a plurality of valve holes are provided on the outer surface of the valve disc, wherein the valve disc is respectively connected to the inner tube and the outer tube through a slot, a valve block is provided on the inner side of the valve disc, and a guide column is provided between the valve block and the valve disc.

[0012] Furthermore, the guide column is connected to the valve disc via an internal thread, one end of the guide column extends to the interior of the valve block, and the valve block and the guide column are telescopically connected via a supporting spring, wherein the valve block is respectively located inside the outer tube cavity and the inner tube cavity.

[0013] Furthermore, a sealing rubber ring is provided on the outer surface of the valve block, and the sealing rubber ring is connected to the slot of the valve block tube cover, and the valve block is fitted with the outer tube cavity and the inner tube cavity through the sealing rubber ring.

[0014] Furthermore, the outer tube cavity and the inner tube cavity are interconnected, and an integrally formed push rod is provided at one end of the valve block, wherein the push rod inside the outer tube cavity is connected with the push rod inside the inner tube cavity via a slot.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. The present invention designs the upper cold plate of the water-cooled plate to have a flow channel structure shape that is stamped upward, so that it can fit all electrical components that need to be thermally managed as much as possible. Because the fitting area is convex upward, the area that needs to be coated with thermal conductive structural adhesive is more obvious, which facilitates the coating range and amount control of the subsequent engineering, effectively reduces the manufacturing cost and process complexity, and effectively controls the temperature rise and temperature difference of all electrical appliances through simulation, greatly improving their service life and peak usage efficiency;

[0017] 2. In the present invention, when in use, the coolant enters the interior of the water-cooled plate through the liquid shut-off valve tube at the liquid inlet. At this time, the outer tube and the inner tube are connected and locked by the locking clamp on the outside of the shaft disc. The liquid enters the outer tube cavity through the valve hole on the surface of the valve disc, and then enters the inner tube cavity, and finally flows into the interior of the plate through the valve disc on the other side. When the locking clamp is flipped outward and unfolded, the outer tube and the inner tube will pop out and separate, and the valve block will be pushed out by the support spring. At this time, the valve blocks inside the two groups of pipes will fit with the cavity, and the liquid cannot flow out from the inside of the plate. At the same time, the external coolant cannot be transported to the inside of the plate. In this way, the solenoid valve structure of the transmission can be replaced to realize the opening and closing operation of the plate, thereby avoiding the inability to control the water-cooled plate when a circuit failure occurs. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is the overall front view of the present invention;

[0019] Figure 2 It is a schematic diagram of the structure of the lower cold plate of the present invention;

[0020] Figure 3 It is a schematic diagram of the liquid cut-off valve pipe structure of the present invention;

[0021] Figure 4 It is a schematic diagram of the expanded structure of the liquid cut-off valve tube of the present invention;

[0022] Figure 5 It is a schematic diagram of the cross-sectional structure of the liquid cut-off valve tube of the present invention.

[0023] In the figure: 1. upper cold plate; 2. lower cold plate; 3. liquid shut-off valve tube; 101. unit plate; 102. liquid outlet; 103. liquid inlet; 201. cooling channel; 202. channel partition; 203. chamber partition; 204. flow partition; 301. inner tube; 302. outer tube; 303. shaft disc; 304. valve disc; 3011. inner tube cavity; 3021. outer tube cavity; 3031. locking clamp; 3041. valve hole; 3042. valve block; 3043. sealing rubber ring; 3044. guide column; 3045. support spring; 3046. push rod. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] See also Figure 1-5 , this embodiment provides the following technical solutions:

[0026] Embodiment 1:

[0027] There are differences between theoretical design and actual stamping, so there is a greater risk of gaps in the barrier area; if the gap is small, there is a risk of interference in the assembly process of the upper and lower cold plates; if the barrier gap is large, there is a risk of internal leakage after brazing, and the fluid cannot flow according to the designed direction, which cannot meet the design plan of thermal management;

[0028] See also Figure 1-2 A water-cooled plate flow channel structure for thermal management of synchronous electronic components includes an upper cold plate 1 and a lower cold plate 2, wherein the upper cold plate 1 is bonded to the lower cold plate 2, and an integrally formed unit plate 101 is provided on the outer surface of the upper cold plate 1, wherein a liquid outlet 102 is provided at one end of the upper cold plate 1, a liquid inlet 103 is provided on one side of the liquid outlet 102, and a liquid cut-off valve tube 3 is provided on the outer sides of the liquid outlet 102 and the liquid inlet 103, and the liquid cut-off valve tube 3 is connected to the liquid outlet 102 and the liquid inlet 103 through an internal thread, and the inner surface of the lower cold plate 2 is provided with a liquid cut-off valve tube 3. A cooling channel 201 is provided on the side, and a plurality of integrally formed flow dividers 204 are provided inside the cooling channel 201. The liquid outlet 102 and the liquid inlet 103 are connected via the cooling channel 201. The unit plate 101 corresponds to the cooling channel 201. A channel divider 202 is provided between the cooling channels 201. The channel divider 202 and the lower cold plate 2 are set as an integrally formed structure. A cavity partition 203 is provided on one side of the channel partition 202. The cavity partition 203 and the lower cold plate 2 are set as an integrally formed structure.

[0029] The unit board 101 is formed by punching multi-plane flow channels on the upper cold plate 1, and the assembly gap with the battery cell, DBU, BMS and other electronic components is adjusted. The flow channel of the upper cold plate 1 is punched upward to a height of 3-3.5mm, and the height of the convex bulge of the lower cold plate 2 is 3-7mm; the distance between the R-angle side wall of the convex bulge punched by the lower cold plate and the R-angle side wall of the upper cold plate is 0.5-1mm, which can meet the requirements of full brazing without false welding and internal leakage;

[0030] Embodiment 2:

[0031] The opening and closing control of traditional water cooling plates is mostly solenoid valves. Such valve body structures need to rely on the transmission of circuit signals. Once the body circuit fails, accurate opening and closing control cannot be achieved;

[0032] See also Figure 3-5The liquid cut-off valve tube 3 includes an inner tube 301, an outer tube 302 and a shaft disc 303, wherein the shaft disc 303 is located between the inner tube 301 and the outer tube 302, wherein the shaft disc 303 is connected to the inner tube 301 through a slot, and locking clips 3031 are arranged around the shaft disc 303, and the locking clips 3031 are rotatably connected to the shaft disc 303, and the outer tube 302 is connected to the inner tube 301 through the locking clips 3031, and the inner tube 301 is respectively installed at the liquid outlet 102 and the liquid inlet 103, wherein the inner tube 301 is provided with an inner tube cavity 3011, the outer tube 302 is provided with an outer tube cavity 3021, the outer sides of the outer tube cavity 3021 and the inner tube cavity 3011 are both provided with a valve disc 304, the outer surface of the valve disc 304 is provided with a plurality of valve holes 3041, wherein the valve disc 304 is respectively connected to the inner tube 301 and the outer tube 302 through a slot, the inner side of the valve disc 304 is provided with a valve block 3042, the valve block 304 A guide post 3044 is provided between the valve block 3042 and the valve disc 304, the guide post 3044 is connected to the valve disc 304 through an internal thread, one end of the guide post 3044 extends to the inside of the valve block 3042, the valve block 3042 and the guide post 3044 are telescopically connected through a supporting spring 3045, wherein the valve block 3042 is located inside the outer tube cavity 3021 and the inner tube cavity 3011 respectively, and a sealing rubber ring 3043 is provided on the outer surface of the valve block 3042 The sealing rubber ring 3043 is connected to the valve block 3042 cylinder cover slot, the valve block 3042 is fitted with the outer tube cavity 3021 and the inner tube cavity 3011 through the sealing rubber ring 3043, the outer tube cavity 3021 and the inner tube cavity 3011 are interconnected, and one end of the valve block 3042 is provided with an integrally formed push rod 3046, wherein the push rod 3046 inside the outer tube cavity 3021 is connected to the push rod 3046 inside the inner tube cavity 3011 through the slot;

[0033] The liquid cut-off valve tube 3 is installed inside the liquid outlet 102 and the liquid inlet 103 respectively, and the inner tube 301 is fixed to the liquid outlet 102 and the liquid inlet 103 by a threaded combination. When in use, the coolant enters the interior of the water-cooled plate through the liquid cut-off valve tube 3 at the liquid inlet 103. At this time, the outer tube 302 and the inner tube 301 are connected and locked by the locking clamp 3031 on the outer side of the shaft disc 303. The liquid enters the outer tube cavity 3021 through the valve hole 3041 on the surface of the valve disc 304, and then enters the inner tube cavity 3011, and finally passes through The liquid flows into the interior of the plate through the valve disc 304 on the other side. When the locking clamp 3031 flips outward and unfolds, the outer tube 302 and the inner tube 301 will pop out and separate, and the valve block 3042 will be pushed out by the support spring 3045. At this time, the valve blocks 3042 inside the two sets of pipes will fit with the cavity, and the liquid cannot flow out from the inside of the plate. At the same time, the external coolant cannot be transported to the inside of the plate. In this way, the solenoid valve structure of the transmission can be replaced to realize the opening and closing operation of the plate, thereby avoiding the inability to control the water-cooled plate when a circuit failure occurs.

[0034] Working principle: the coolant enters the interior of the water-cooled plate through the liquid cut-off valve tube 3 at the liquid inlet 103. At this time, the outer tube 302 and the inner tube 301 are connected and locked by the locking clamp 3031 on the outside of the shaft disc 303. The liquid enters the outer tube cavity 3021 through the valve hole 3041 on the surface of the valve disc 304, and then enters the inner tube cavity 3011, and finally flows into the interior of the plate through the valve disc 304 on the other side. When the locking clamp 3031 is flipped outward and unfolded, the outer tube 302 and the inner tube 301 will pop out and separate, and the valve block 3042 will be pushed out by the support spring 3045. At this time, the valve blocks 3042 inside the two sets of pipes will fit with the cavity, and the liquid cannot flow out from the inside of the plate. At the same time, the external coolant cannot be transported to the inside of the plate. In this way, the electromagnetic valve structure of the transmission can be replaced to realize the opening and closing operation of the plate, so as to avoid the inability to control the water-cooled plate when a circuit failure occurs.

[0035] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0036] While the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that many changes, modifications, substitutions and variations can be made to the embodiments without departing from the principles and spirit of the invention.

Claims

1. A water cooling plate flow channel structure for synchronous electronic component thermal management, characterized in that: The invention comprises an upper cold plate (1) and a lower cold plate (2), wherein the upper cold plate (1) is bonded to the lower cold plate (2), and an outer surface of the upper cold plate (1) is provided with an integrally formed unit bond plate (101), wherein a liquid outlet (102) is provided at one end of the upper cold plate (1), and a liquid inlet (103) is provided at one side of the liquid outlet (102), and a liquid shut-off valve tube (3) is provided on the outer sides of the liquid outlet (102) and the liquid inlet (103), and the liquid shut-off valve tube (3) is connected to the liquid outlet (102) and the liquid inlet (103) through internal threads, and a cooling channel (201) is provided on the inner side of the lower cold plate (2), and a plurality of integrally formed flow dividers (204) are provided inside the cooling channel (201).

2. The water cooling plate flow channel structure for synchronous electronic component thermal management according to claim 1, characterized in that: The liquid outlet (102) and the liquid inlet (103) are connected via a cooling channel (201); the unit plate (101) corresponds to the cooling channel (201); a channel partition (202) is provided between the cooling channels (201); the channel partition (202) and the lower cold plate (2) are provided as an integrally formed structure.

3. The water cooling plate flow channel structure for synchronous electronic component thermal management according to claim 2, characterized in that: A chamber partition (203) is provided on one side of the flow channel partition (202); the chamber partition (203) and the lower cold plate (2) are provided as an integrally formed structure; the liquid cut-off valve tube (3) comprises an inner tube (301), an outer tube (302) and a shaft disk (303); the shaft disk (303) is located between the inner tube (301) and the outer tube (302); and the shaft disk (303) is connected to the inner tube (301) via a slot.

4. The water cooling plate flow channel structure for synchronous electronic component thermal management according to claim 3, characterized in that: The shaft disc (303) is provided with locking clamps (3031) on all four sides, and the locking clamps (3031) are rotatably connected to the shaft disc (303). The outer tube (302) is connected to the inner tube (301) through the locking clamps (3031). The inner tube (301) is installed inside the liquid outlet (102) and the liquid inlet (103), respectively, wherein the inner tube (301) is provided with an inner tube cavity (3011), and the outer tube (302) is provided with an outer tube cavity (3021).

5. The water cooling plate flow channel structure for synchronous electronic component thermal management according to claim 4, characterized in that: The outer sides of the outer tube cavity (3021) and the inner tube cavity (3011) are both provided with valve discs (304), and the outer surface of the valve disc (304) is provided with a plurality of valve holes (3041), wherein the valve disc (304) is respectively connected to the inner tube (301) and the outer tube (302) through a slot, and a valve block (3042) is provided on the inner side of the valve disc (304), and a guide column (3044) is provided between the valve block (3042) and the valve disc (304).

6. The water cooling plate flow channel structure for synchronous electronic component thermal management according to claim 5, characterized in that: The guide column (3044) is connected to the valve disc (304) via an internal thread, one end of the guide column (3044) extends to the interior of the valve block (3042), and the valve block (3042) and the guide column (3044) are telescopically connected via a supporting spring (3045), wherein the valve block (3042) is located inside the outer tube cavity (3021) and the inner tube cavity (3011), respectively.

7. The water cooling plate flow channel structure for synchronous electronic component thermal management according to claim 6, characterized in that: The outer surface of the valve block (3042) is provided with a sealing rubber ring (3043), and the sealing rubber ring (3043) is connected to the valve block (3042) tube cover slot. The valve block (3042) is fitted with the outer tube cavity (3021) and the inner tube cavity (3011) through the sealing rubber ring (3043).

8. The water cooling plate flow channel structure for synchronous electronic component thermal management according to claim 7, characterized in that: The outer tube cavity (3021) and the inner tube cavity (3011) are interconnected, and one end of the valve block (3042) is provided with an integrally formed push rod (3046), wherein the push rod (3046) inside the outer tube cavity (3021) and the push rod (3046) inside the inner tube cavity (3011) are connected via a slot.