SIM (Subscriber Identity Module) power-on method and electronic equipment

Abstract

The invention provides an SIM (Subscriber Identity Module) power-on method and electronic equipment. The method comprises the following steps that: in response to the startup of the electronic equipment, a Modem module powers on an SIM (Subscriber Identity Module) module; the application layer sends a first request message to the Modem module through the first interface, wherein the first request message comprises first power-on configuration; the Modem module determines a first power-on configuration in response to the first request message, and sends a first response message to the first interface; the first interface responds to the first response message and sends a power-on message to the Modem module; and the Modem module adjusts the power-on voltage of the SIM module to the first voltage based on the first power-on configuration in response to the power-on message, and maintains the power-on state of the SIM module. In the application, in the aging test stage of the electronic equipment, the Modem module enables the SIM module to be kept in the power-on state, the SIM module with electrostatic damage can be tested, and the SIM module with electrostatic damage is prevented from leaving a factory.

Description

Technical Field

[0001] The present application relates to the field of terminal technology, and in particular to a SIM module power-on method and electronic equipment. Background Art

[0002] A Subscriber Identity Module (SIM) card is a smart card embedded in an electronic device. The SIM card stores the user's identity information, including country code, mobile network operator, mobile phone number, etc. The SIM card allows the user to switch between different electronic devices and establish a connection with the mobile network. Electronic devices can establish a communication connection with the SIM module through the built-in modem module.

[0003] During the production of electronic equipment, when preparing SIM modules, the production line station may cause electrostatic damage to the SIM module. This damage usually requires the modem module to power on the SIM module before it can be detected. The SIM card is matched by the user after the electronic equipment leaves the factory. Before the SIM card is matched, the SIM module usually cannot be powered on. Therefore, after the SIM module is electrostatically damaged, the conditions for detecting the electrostatic damage of the SIM module are not available before leaving the factory. SIM modules with electrostatic damage may leave the factory at the same time as SIM modules without electrostatic damage.

[0004] If a SIM module with electrostatic damage leaves the factory, after the user inserts the SIM module into the SIM card and uses it for a period of time, the SIM card recognition failure may occur due to the damage to the SIM module. Summary of the invention

[0005] The embodiment of the present application provides a SIM module power-on method and an electronic device. During the aging test phase of the electronic device, the modem module keeps the SIM module in a powered-on state, and SIM modules with electrostatic damage can be tested, thereby preventing SIM modules with electrostatic damage from leaving the factory.

[0006] In a first aspect, an embodiment of the present application provides a SIM module power-on method, comprising: in response to the electronic device being powered on, the modem module powers on the user identity SIM module; the application layer sends a first request message to the modem module through a first interface, the first interface is an interface between the application layer and the modem module, the first request message includes a first power-on configuration, the first power-on configuration includes that the power-on voltage of the SIM module is a first voltage; the modem module responds to the first request message, determines the first power-on configuration, and sends a first response message to the first interface; the first interface responds to the first response message and sends a power-on message to the modem module; the modem module responds to the power-on message, and based on the first power-on configuration, adjusts the power-on voltage of the SIM module to the first voltage, and keeps the SIM module powered on.

[0007] The technical solution shown in the embodiment of the present application is that during the aging test, the Modem module keeps the SIM module in the powered-on state. In this way, if the SIM module has electrostatic damage, the SIM module will stimulate electrostatic damage during the long-term power-on state. If the SIM module does not have electrostatic damage, the SIM module will maintain a normal state during the long-term power-on state. Based on this, SIM modules with electrostatic damage can be tested and intercepted before leaving the factory, thereby preventing SIM modules with electrostatic damage from leaving the factory.

[0008] In one implementation, the first interface includes a first sub-interface and a second sub-interface, and the application layer sends a first request message to the Modem module through the first interface, including: the application layer sends the first request message to the first sub-interface; the first sub-interface converts the first request message into a first format and sends it to the second sub-interface, and the first format matches the type of the second sub-interface; the second sub-interface sends the first request message to the Modem module. In this implementation, the first interface performs format conversion on the first request message and converts the first request message into a format readable by the Modem module, thereby ensuring that the Modem module receives and parses the first request message. In this way, the Modem module can determine the first power-on configuration according to the received first request message, keep the SIM module in a power-on state with a suitable voltage, and ensure the safety and stability of the SIM module during the power-on process.

[0009] In one implementation, the Modem module responds to the first request message, determines the first power-on configuration, and sends the first response message to the first interface, including: the Modem module converts the first response message into a first format and sends it to the second sub-interface; the second sub-interface converts the first response message into a second format and sends it to the first sub-interface, and the second format matches the type of the first sub-interface. With this implementation, the Modem module performs corresponding configuration and responds based on the first request message sent by the first interface, and specifically provides an interaction method between the Modem module and the first interface, so that the first interface can further send a power-on message to the Modem module. In this way, based on the power-on message, the Modem module can keep the SIM module in a powered-on state, and can test out SIM modules with electrostatic damage.

[0010] In one implementation, the first interface sends a power-on message to the Modem module in response to the first response message, including: the first sub-interface creates a power-on message with a first format in response to the first response message and sends it to the second sub-interface; the second sub-interface sends the power-on message to the Modem module. This implementation provides a specific method for the first interface to interact with the Modem module, so that the first interface can further send a power-on message to the Modem module. In this way, based on the power-on message, the Modem module can keep the SIM module in a powered-on state, and can test the SIM module with electrostatic damage.

[0011] In one implementation, the modem module responds to a power-on message, based on a first power-on configuration, adjusts the power-on voltage of the SIM module to a first voltage, and maintains the power-on state of the SIM module, including: the modem module determines the target scenario of the SIM module, the target scenario includes a SIM card tray inserted into the SIM module, no SIM card is embedded in the SIM card tray, and no SIM card is inserted into the SIM module; if the target scenario is a SIM card tray inserted into the SIM module, and no SIM card is embedded in the SIM card tray, the modem module maintains the power-on state of the SIM module; if the target scenario is a SIM card tray not inserted into the SIM module, the modem module maintains the power-on state of the SIM module. With this implementation, the modem module can keep the SIM module in the power-on state in both target scenarios, and can test out SIM modules with electrostatic damage.

[0012] In one implementation, after the modem module adjusts the power-on voltage of the SIM module to the first voltage based on the first power-on configuration in response to the power-on message and keeps the SIM module in the power-on state, the method further includes: the modem module sends a first feedback message to the application layer through the first interface based on the power-on state of the SIM module, and the first feedback message includes whether the SIM module is faulty. With this implementation, the modem module can provide feedback to the application layer after determining whether the SIM module is faulty, so that the tester can determine whether the SIM module is electrostatically damaged, thereby preventing the SIM module with electrostatic damage from leaving the factory.

[0013] In one implementation, the modem module sends a first feedback message to the application layer through the first interface based on the power-on state of the SIM module, including: the modem module creates a first feedback message in a first format based on the power-on state of the SIM module and sends it to the second sub-interface; the second sub-interface converts the first feedback message into a second format and sends it to the first sub-interface, and the first sub-interface sends the first feedback message to the application layer. This implementation provides a specific way for the modem module to interact with the application layer. After determining whether the SIM module is faulty, the modem module can provide feedback to the application layer so that the tester can determine whether the SIM module is electrostatically damaged, thereby preventing the SIM module with electrostatic damage from leaving the factory.

[0014] In one implementation, the first voltage includes at least one of 1.8 V and 3 V. With this implementation, the Modem module provides at least two suitable power-on voltages for the SIM module, thereby ensuring the safety and stability of the power-on process of the SIM module.

[0015] In one implementation, after the Modem module sends a first feedback message to the application layer through the first interface based on the power-on state of the SIM module, the method further includes: the application layer sends a second request message to the Modem module through the first interface in response to the first feedback message, the second request message includes a second power-on configuration, and the second power-on configuration includes that the power-on voltage of the SIM module is a second voltage; the Modem module determines the second power-on configuration in response to the second request message, and sends a second response message to the first interface; the first interface sends a power-off message to the Modem module in response to the second response message; the Modem module adjusts the power-on voltage of the SIM module to the second voltage based on the second power-on configuration in response to the power-off message, and powers off the SIM module according to the second voltage. In this implementation, the application layer sends a second request message to the Modem module through the first interface to terminate the power-on state maintained by the SIM module, so that the SIM module can be powered off to complete the aging test.

[0016] In one implementation, the application layer sends a second request message to the Modem module through the first interface in response to the first feedback message, including: the application layer sends the second request message to the first sub-interface; the first sub-interface converts the second request message into the first format and sends it to the second sub-interface; the second sub-interface sends the second request message to the Modem module. In this implementation, the first interface performs format conversion on the second request message and converts the second request message into a format readable by the Modem module, thereby ensuring that the Modem module receives and parses the second request message. In this way, the Modem module can determine the second power-on configuration according to the received second request message, adjust the SIM module to a voltage that can be powered off, and then execute the power-off process to complete the aging test.

[0017] In one implementation, the modem responds to the second request message, determines the second power-on configuration, and sends the second response message to the first interface, including: the modem module converts the second response message into the first format and sends it to the second sub-interface; the second sub-interface converts the second response message into the second format and sends it to the first sub-interface. With this implementation, the modem module performs corresponding configuration based on the second request message sent by the first interface and responds, and specifically provides an interaction method between the modem module and the first interface, so that the first interface can further send a power-off message to the modem module. In this way, based on the power-off message, the modem module can power off the SIM module and complete the aging test.

[0018] In one implementation, the first interface sends a power-off message to the Modem module in response to the second response message, including: the first sub-interface creates a power-off message with a first format in response to the second response message and sends it to the second sub-interface; the second sub-interface sends the power-off message to the Modem module. This implementation provides a specific method for the first interface to interact with the Modem module, so that the first interface can further send a power-off message to the Modem module, so that based on the power-off message, the Modem module can power off the SIM module and complete the aging test.

[0019] In one implementation, the modem module responds to the power-off message and adjusts the power-on voltage of the SIM module to the second voltage based on the second power-on configuration. After the SIM module is powered off according to the second voltage, the modem module further includes: the modem module sends a second feedback message to the application layer through the first interface based on the power-off state of the SIM module, and the second feedback message includes whether the SIM module has been powered off. With this implementation, the modem module can provide feedback to the application layer after determining whether the SIM module has been powered off, so that the tester can determine that the power-off process of the SIM module has ended and the aging test has been completed.

[0020] In one implementation, the modem module sends a second feedback message to the application layer through the first interface based on the power-off state of the SIM module, including: the modem module creates a second feedback message in a first format based on the power-off state of the SIM module and sends it to the second sub-interface; the second sub-interface converts the second feedback message into a second format and sends it to the first sub-interface, and the first sub-interface sends the second feedback message to the application layer. This implementation provides a specific method for the interaction between the modem module and the application layer. After determining whether the SIM module has been powered off, the modem module can provide feedback to the application layer, so that the tester can determine whether the SIM module has been powered off and complete the aging test.

[0021] In one implementation, the second voltage is 0 V. In this implementation, the Modem module sets a power-off voltage for the SIM module, so that the SIM module can be powered off.

[0022] In one implementation, the application layer includes an aging application package, and the application layer sends a first request message to the Modem module through a first interface, including: the aging application package sends the first request message to the Modem module through the first interface. With this implementation, the application layer can specifically interact with the Modem module through the aging application package.

[0023] In a second aspect, an embodiment of the present application provides an electronic device, comprising: a processor and a memory; the memory stores program instructions, and when the program instructions are executed by the processor, the electronic device executes the method in the first aspect and any implementation method mentioned above.

[0024] In a third aspect, an embodiment of the present application provides a chip system, comprising: a memory and a processor; the memory stores program instructions, and when the program instructions are executed by the processor, the chip system executes the method in the first aspect and any implementation method mentioned above.

[0025] In a fourth aspect, an embodiment of the present application provides a computer storage medium, in which program instructions are stored in the computer-readable storage medium. When the program instructions are executed on a computer, the computer executes the method in the first aspect and any implementation manner described above.

[0026] In a fifth aspect, an embodiment of the present application provides a computer program product. When the computer program product is run on an electronic device, the electronic device executes the method in the first aspect and any implementation manner described above.

[0027] It can be understood that the electronic devices, computer-readable storage media and computer program products provided in the above-mentioned aspects are all applied to the corresponding methods provided above. Therefore, the beneficial effects that can be achieved can refer to the beneficial effects in the corresponding methods provided above and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a structural diagram of a SIM module;

[0029] Figure 2 It is a schematic diagram of the connection between a Modem module and a SIM module;

[0030] Figure 3 is a schematic diagram of the hardware structure of an electronic device provided in an embodiment of the present application;

[0031] Figure 4 is a schematic diagram of the software structure of the electronic device provided in the embodiment of the present application;

[0032] Figure 5 This is a first flow chart of a SIM module power-on method provided in an embodiment of the present application;

[0033] Figure 6 It is a schematic diagram of a scenario in which a modem module according to an embodiment of the present application keeps a SIM module powered on;

[0034] Figure 7 is a schematic diagram of a first interface structure provided in an embodiment of the present application;

[0035] Figure 8 is a second flow chart of a SIM module power-on method provided in an embodiment of the present application;

[0036] Fig. 9 This is a third flow chart of a SIM module power-on method provided in an embodiment of the present application;

[0037] Fig.10 This is a fourth flow chart of a SIM module power-on method provided in an embodiment of the present application;

[0038] Fig.11 It is a structural schematic diagram of a SIM module power-on device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0039] The technical solution of the embodiment of the present application will be clearly described below in conjunction with the drawings in the embodiment of the present application.

[0040] In the description of this application, unless otherwise specified, " / " means "or", for example, A / B can mean A or B. "And / or" in this article is merely a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, "at least one" means one or more, and "plurality" means two or more. The words "first", "second", etc. do not limit the quantity and execution order, and the words "first", "second", etc. do not limit them to be different.

[0041] It should be noted that, in this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in this application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0042] The following first describes the application scenarios of the embodiments of the present application.

[0043] SIM cards are an important part of electronic devices in the communication process. Specifically, SIM cards can verify the user's identity and authorize electronic devices to access mobile networks. SIM cards can store users' contact information, such as mobile phone numbers and names. SIM cards can store received text messages, allowing users to view and send text messages on different devices. SIM cards can store users' personal settings, such as voicemail numbers, network settings, etc. SIM cards can roam in different countries and regions and access local mobile networks. SIM cards can also support data encryption and identity authentication to improve the security of mobile communications.

[0044] The SIM card is usually provided by a network operator. After the SIM card is inserted into the SIM module of the electronic device, the SIM module is assembled, and the electronic device can establish a communication connection with the SIM module through the modem module.

[0045] The modem module in electronic devices is usually integrated on the motherboard using a system on a chip (SoC), which specifically includes the following structure:

[0046] 1. Modem chip. Modem is usually composed of an independent chip, which is used to process the communication and data transmission between electronic equipment and mobile network. The chip is usually composed of baseband processor (BP) and related circuits. Among them, BP is the core part of the modem chip. In the process of communication between electronic equipment and mobile network, BP is responsible for processing the communication of physical layer and data link layer of mobile network, and realizes data modulation and demodulation, communication protocol conversion, signal processing and other functions by executing a series of communication protocols and algorithms.

[0047] 2. Radio frequency (RF) transceiver. The RF transceiver is an interface device between the modem and the antenna of the electronic device. It is used to convert the digital signal generated by the BP into a radio frequency signal suitable for sending to the antenna. At the same time, it converts the received radio frequency signal into a digital signal that the BP can process.

[0048] 3. RF front-end module. The RF front-end module includes components such as power amplifiers, filters, mixers, etc., which are used to process and adjust the gain, frequency, amplitude and other characteristics of the RF signal to ensure the quality and stability of the signal.

[0049] The modem module is connected to the SIM module and can control the power-on status of the SIM module.

[0050] Figure 1 It is a structural diagram of a SIM module.

[0051] like Figure 1 As shown, the SIM module generally includes a SIM card slot 10, which can be set on the side or other positions of the electronic device. The SIM module also includes a SIM card tray 11 matched with the SIM card slot 10, and the SIM card tray 11 is used to embed the SIM card 20. In this way, the user can embed the SIM card 20 into the SIM card tray 11, and insert the SIM card tray 11 into the SIM card slot 10, so that the assembly of the SIM module is completed, and the electronic device can perform mobile network communication based on the connection between the modem module and the SIM module.

[0052] Figure 2 The diagram is a schematic diagram of the connection between a Modem module and a SIM module.

[0053] like Figure 2As shown, the modem chip 12 in the modem module can be connected to the SIM card slot 10 through the interface circuit 13 in the modem module, wherein one end of the interface circuit 13 is a physical interface circuit connected to the SIM card slot 10, and the other end is a logical interface circuit connected to the modem chip 12. The physical interface circuit is a contact interface circuit. When the SIM card 20 is embedded in the SIM card tray 11, and the SIM card tray 11 is inserted into the SIM card slot 10, the metal contact points in the SIM card slot 10 will be connected to the metal contact pieces on the SIM card 20 to form a contact interface circuit. The logical interface circuit is an interface circuit for data exchange and communication at the software level. The interface circuit can transmit the instructions and data of the modem chip 12 to the SIM card 20, and transmit the responses and data in the SIM card 20 back to the modem chip 12. In this way, the modem module and the SIM module can realize data interaction.

[0054] During the production of electronic equipment, when preparing SIM modules, the production line stations may cause electrostatic damage to the SIM modules. Electrostatic damage is the adverse effect of static electricity charges on the surface of objects and the surrounding environment, which may be caused by material friction, human body friction, environmental humidity and other reasons. For example, the metal contact points in the SIM card slot 10 in the SIM module are affected by environmental humidity and electrostatic damage occurs.

[0055] Electrostatic damage may not immediately cause functional failure or obvious physical damage to the electronic device, but may cause minor damage to the internal components of the electronic device. Such damage can usually be detected only after the SIM module is powered on by a modem module. However, the SIM card 20 is matched by the user after the electronic device leaves the factory, and the modem module usually cannot power on the SIM module before the SIM card 20 is matched. Therefore, after the SIM module is electrostatically damaged, the conditions for detecting the electrostatic damage to the SIM module are not available before leaving the factory, and the SIM module with electrostatic damage may leave the factory at the same time as the SIM module without electrostatic damage.

[0056] In this way, if a SIM module with electrostatic damage leaves the factory, after the user inserts the SIM card 20 into the SIM card slot 10 of the SIM module and uses it for a certain period of time, the electrostatic damage gradually accumulates during the user's use, and the problem of SIM module damage causing SIM card 20 recognition failure may occur.

[0057] In order to prevent a SIM module with electrostatic damage from leaving the factory, an embodiment of the present application provides a method for powering on a SIM module.

[0058] The SIM module power-on method provided in the embodiment of the present application can be applied to electronic devices, including but not limited to mobile phones, tablet computers, personal computers, workstation devices, large-screen devices (e.g., smart screens, smart TVs, etc.), wearable devices (e.g., smart bracelets, smart watches), handheld game consoles, home game consoles, virtual reality devices, augmented reality devices, mixed reality devices, etc., in-vehicle smart terminals, etc.

[0059] Figure 3 It is a schematic diagram of the hardware structure of the electronic device provided in the embodiment of the present application.

[0060] like Figure 3 As shown, the electronic device 100 may include a processor 110, a memory 120, a universal serial bus (USB) interface 130, a charging management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2, a mobile communication module 150, a wireless communication module 160, a display screen 170, and a subscriber identification module (SIM) card interface 180, etc.

[0061] It is to be understood that the structure illustrated in the embodiment of the present application does not constitute a specific limitation on the electronic device 100. In other embodiments of the present application, the electronic device 100 may include more or fewer components than shown in the figure, or combine some components, or split some components, or arrange the components differently. The components shown in the figure may be implemented in hardware, software, or a combination of software and hardware.

[0062] The processor 110 may include one or more processing units, for example, the processor 110 may include an application processor (AP), a modem processor, a graphics processor (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural-network processing unit (NPU), etc. Different processing units may be independent devices or integrated into one or more processors.

[0063] The memory 120 can be used to store computer executable program codes, and the executable program codes include instructions. The memory 120 may include a program storage area and a data storage area. Among them, the program storage area may store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc. The data storage area may store data created during the use of the electronic device 100 (such as audio data, a phone book, etc.), etc. In addition, the memory 120 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, a universal flash storage (UFS), etc. The processor 110 executes various functional applications and data processing of the electronic device 100 by running instructions stored in the memory 120, and / or instructions stored in a memory provided in the processor.

[0064] The USB interface 130 is an interface that complies with the USB standard specification, and specifically can be a Mini USB interface, a Micro USB interface, a USB Type C interface, etc. The USB interface 130 can be used to connect a charger to charge the electronic device 100, and can also be used to transfer data between the electronic device 100 and a peripheral device. It can also be used to connect headphones to play audio through the headphones. The interface can also be used to connect other electronic devices, such as AR devices, etc.

[0065] It is understandable that the interface connection relationship between the modules illustrated in the embodiment of the present application is only a schematic illustration and does not constitute a structural limitation on the electronic device 100. In other embodiments of the present application, the electronic device 100 may also adopt different interface connection methods in the above embodiments, or a combination of multiple interface connection methods.

[0066] The charging management module 140 is used to receive charging input from the charger. The charger can be a wireless charger or a wired charger. In some wired charging embodiments, the charging management module 140 can receive charging input from the wired charger through the USB interface 130. In some wireless charging embodiments, the charging management module 140 can receive wireless charging input through the wireless charging coil of the electronic device 100. While the charging management module 140 charges the battery 142, it can also power the electronic device through the power management module 141. The power management module 141 is used to connect the battery 142, the charging management module 140 and the processor 110. The power management module 141 receives input from the battery 142 and / or the charging management module 140, and powers the processor 110, the memory 120, the display screen 170, and the wireless communication module 160.

[0067] The wireless communication function of the electronic device 100 can be implemented through the antenna 1, the antenna 2, the mobile communication module 150, the wireless communication module 160, the modem processor and the baseband processor.

[0068] Antenna 1 and antenna 2 are used to transmit and receive electromagnetic wave signals. Each antenna in electronic device 100 can be used to cover a single or multiple communication frequency bands. Different antennas can also be reused to improve the utilization of antennas. For example, antenna 1 can be reused as a diversity antenna for a wireless local area network. In some other embodiments, the antenna can be used in combination with a tuning switch.

[0069] The mobile communication module 150 can provide solutions for wireless communications including 2G / 3G / 4G / 5G, etc., applied to the electronic device 100. The mobile communication module 150 may include at least one filter, a switch, a power amplifier, a low noise amplifier (LNA), etc. The mobile communication module 150 can receive electromagnetic waves from the antenna 1, and filter, amplify, and process the received electromagnetic waves, and transmit them to the modulation and demodulation processor for demodulation. The mobile communication module 150 can also amplify the signal modulated by the modulation and demodulation processor, and convert it into electromagnetic waves for radiation through the antenna 1. In some embodiments, at least some of the functional modules of the mobile communication module 150 can be set in the processor 110. In some embodiments, at least some of the functional modules of the mobile communication module 150 can be set in the same device as at least some of the modules of the processor 110.

[0070] The modem processor may include a modulator and a demodulator. The modulator is used to modulate the low-frequency baseband signal to be sent into a medium-high frequency signal. The demodulator is used to demodulate the received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then transmits the demodulated low-frequency baseband signal to the baseband processor for processing. After the low-frequency baseband signal is processed by the baseband processor, it is passed to the application processor. The application processor outputs a sound signal through an audio device, or displays an image or video through the display screen 170. In some embodiments, the modem processor may be an independent device. In other embodiments, the modem processor may be independent of the processor 110 and be set in the same device as the mobile communication module 150 or other functional modules.

[0071] The wireless communication module 160 can provide wireless communication solutions including wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), infrared (IR), etc., which are applied to the electronic device 100. The wireless communication module 160 can be one or more devices integrating at least one communication processing module. The wireless communication module 160 receives electromagnetic waves via the antenna 2, modulates the frequency of the electromagnetic wave signal and performs filtering, and sends the processed signal to the processor 110. The wireless communication module 160 can also receive the signal to be sent from the processor 110, modulate the frequency of it, amplify it, and convert it into electromagnetic waves for radiation through the antenna 2.

[0072] In some embodiments, antenna 1 of electronic device 100 is coupled to mobile communication module 150, and antenna 2 is coupled to wireless communication module 160, so that electronic device 100 can communicate with the network and other devices through wireless communication technology.

[0073] The electronic device 100 implements the display function through a GPU, a display screen 170, and an application processor. The GPU is a microprocessor for image processing, which connects the display screen 170 and the application processor. The GPU is used to perform mathematical and geometric calculations for graphics rendering. The processor 110 may include one or more GPUs, which execute program instructions to generate or change display information.

[0074] The display screen 170 is used to display images, videos, etc. The display screen 170 includes a display panel.

[0075] The SIM card interface 180 is used to connect a SIM card. The SIM card can be connected to and separated from the electronic device 100 by inserting it into the SIM card interface 180 or pulling it out from the SIM card interface 180. The electronic device 100 can support 1 or N SIM card interfaces, where N is a positive integer greater than 1. The SIM card interface 180 can support Nano SIM cards, Micro SIM cards, SIM cards, and the like. Multiple cards can be inserted into the same SIM card interface 180 at the same time. The types of the multiple cards can be the same or different. The SIM card interface 180 can also be compatible with different types of SIM cards. The SIM card interface 180 can also be compatible with external memory cards. The electronic device 100 interacts with the network through the SIM card to implement functions such as calls and data communications. In some embodiments, the electronic device 100 uses an eSIM, i.e., an embedded SIM card. The eSIM card can be embedded in the electronic device 100 and cannot be separated from the electronic device 100.

[0076] The software system of the electronic device 100 may adopt a layered architecture, an event-driven architecture, a micro-core architecture, a micro-service architecture, or a cloud architecture. The embodiment of the present application takes the Android system of the layered architecture as an example to exemplify the software structure of the electronic device 100.

[0077] Figure 4 It is a schematic diagram of the software structure of the electronic device provided in the embodiment of the present application.

[0078] like Figure 4 As shown, the layered architecture divides the software into several layers, each with clear roles and division of labor. The layers communicate with each other through software interfaces. In some embodiments, the Android system is divided into four layers based on the telephony architecture, namely, the application (APP) layer, the framework (Framework) layer, the hardware abstraction layer (HAL) and the hardware layer (Hardware).

[0079] The application layer can include a series of application packages.

[0080] like Figure 4 As shown, the application package may include applications such as battery management, camera, gallery, calendar, call, map, navigation, music, video, short message, game, etc. In the embodiment of the present application, the application package also includes an aged Android application package (Android Application Package, APK).

[0081] Among them, the application layer depends on the framework layer. The application layer needs to access the business modules of the framework layer to present specific functions to the user. When the operating system starts, the application layer runs and begins to create the framework layer. After the framework layer is created, the framework layer and the application layer run in the same process.

[0082] The framework layer provides an application programming interface (API) and a programming framework for the applications in the application layer. The framework layer includes some predefined functions.

[0083] like Figure 4 As shown, the framework layer may include a window manager, an input manager, a sensor manager, a phone manager, a resource manager, a notification manager, and the like.

[0084] The input manager can be used to monitor user input events, such as click events and slide events performed by the user's finger on the display screen 170 of the electronic device 100. By monitoring the input events, the electronic device 100 can determine whether the electronic device is being used.

[0085] The sensor manager is used to monitor the data returned by various sensors in the electronic device, such as motion sensor data, proximity light sensor data, temperature sensor data, etc. Using the data returned by each sensor, the electronic device can determine whether it is shaking, or whether the display screen 170 is blocked, etc.

[0086] The hardware abstraction layer is used to provide a unified interface to the upper layer, so that the upper layer software can easily interact with the underlying hardware to achieve decoupling between hardware and software and cross-platform compatibility.

[0087] Among them, the hardware abstraction layer can be used to run a part of the radio interface layer (Radio Interface Layer, RIL). Specifically, the RIL layer can include two parts, RILJ and RILC. RILJ runs in the framework layer based on the Java language, and RILC runs in the hardware abstraction layer based on the C or C++ language. The embodiment of the present application only exemplifies RILC. RILC can provide an interface for operating the Modem module and communicate with the Modem module. The main function of RILC is to convert the request initiated by the upper-layer application into a command that the Modem module can understand, and pass the response of the Modem module back to the upper-layer application. In this way, RILC and the Modem module can complete the scheduling and management of mobile communication functions.

[0088] The hardware layer includes the Modem module.

[0089] It is to be understood that the structure illustrated in the embodiment of the present application does not constitute a specific limitation on the electronic device 100. In other embodiments of the present application, the electronic device may include more or fewer components than shown in the figure, or combine some components, or split some components, or arrange the components differently. The components shown in the figure may be implemented in hardware, software, or a combination of software and hardware.

[0090] Figure 5 This is the first flow chart of a SIM module power-on method provided in an embodiment of the present application.

[0091] like Figure 5 As shown, the method includes the following steps S101-S105.

[0092] Step S101: in response to the electronic device being powered on, the modem module powers on the SIM module.

[0093] The modem module in the embodiment of the present application has the structures of the modem chip, RF transceiver, RF front-end module, etc. described in the above embodiments. The modem module also includes more or less structures than the above embodiments, which will not be described in detail in the embodiment of the present application.

[0094] It should be noted that the embodiment of the present application is performed during the aging test phase of the electronic device. During the aging test phase, after the electronic device is turned on, an aging test can be performed on each component.

[0095] Aging testing is an important stage in the production process of electronic equipment. Aging testing simulates the environmental conditions and load conditions that electronic equipment will face during long-term use, and conducts long-term operation, stress and other related tests on electronic equipment to evaluate the reliability, stability and durability of electronic equipment.

[0096] Specifically, during the aging test phase, based on pre-set test conditions and parameters, such as temperature, humidity, voltage, current, etc., the electronic equipment continues to operate in a simulated usage environment. The operating time is usually several weeks, days or even longer. In this way, the service life of each component of the electronic equipment can be simulated.

[0097] The embodiment of the present application simulates the process of the modem module powering on the SIM module after leaving the factory during the aging test phase.

[0098] It should be noted here that the process in which the modem module powers on the SIM module is not a process in which the modem module directly provides a power-on voltage to the SIM module, but a process in which the power-on voltage of the SIM module is set and then, based on the set power-on voltage, the power control chip is controlled to provide voltage to the SIM module.

[0099] Figure 6 It is a schematic diagram of a scenario in which the Modem module provided in an embodiment of the present application keeps the SIM module powered on.

[0100] like Figure 6 As shown, the interface circuit 13 in the Modem module is connected to the power control chip 30, and the Modem module controls the power control chip 30 to supply power to the metal contact point (also called pin) 131 in the SIM card slot 10. The SIM card slot 10 generally includes a power supply pin VSIM, a clock pin SIMCLKC, a working reset pin SIMRSTC, a signal detection pin SIMDEX and other pins. After the electronic device is started, it will perform self-test and initialization on each component. When the SIM module is detected, the electronic device detects whether the SIM card 20 is inserted based on the information provided by the SIM module. If it is detected that the SIM card 20 is correctly inserted, the SIM module can establish a data connection with the Modem module to perform functions such as surfing the Internet and communication. The Modem module can control the power control chip 30 to continuously supply power to the pin 131. If it is detected that the SIM card 20 is not inserted, or the information of the SIM card 20 cannot be correctly identified and read, the Modem module only controls the power control chip 30 to supply power to the pin 131 at the moment when the electronic device is started, and then controls the power control chip 30 to stop supplying power to the pin 131. In this way, the SIM card slot 10 cannot be powered on. Since the SIM card 20 is inserted into the electronic device by the user after leaving the factory, under normal circumstances, if the SIM card 20 is not inserted into the electronic device before leaving the factory, the SIM card slot 10 cannot be assembled, and the modem module cannot keep the SIM module powered on. Based on this, the embodiment of the present application provides a method in which the modem module can keep the SIM module powered on when the SIM card slot 10 cannot be assembled.

[0101] Step S102, the application layer sends a first request message to the Modem module through the first interface, the first interface is the interface between the application layer and the Modem module, the first request message includes a first power-on configuration, and the first power-on configuration includes that the power-on voltage of the SIM module is a first voltage.

[0102] In one implementation, the application layer includes an aging APK, which is a collection of software tools for performing an aging test on an electronic device. The aging APK calls interfaces of various hardware function modules for cyclic operation, and when a hardware function module fails, the failure is recorded in the electronic device. The aging APK can send a first request message to the Modem module through a first interface.

[0103] In one implementation, the first interface may be an RILC, and the first interface may include a first sub-interface and a second sub-interface.

[0104] Figure 7 This is a schematic diagram of the first interface structure provided in an embodiment of the present application.

[0105] like Figure 7 As shown, RILC may include multiple library files, for example: Rild.so, Ril.so, Qcril.so, Qmi.so.

[0106] Among them, Rild.so is a dynamic link library file of the Radio Interface Layer Daemon (Rild). Based on Rild.so, the electronic device can run Rild, and the framework layer can send a request (Request) through Rild.

[0107] Ril.so is the dynamic link library file of the Radio Interface Layer Library (Ril). Based on Ril.so, Ril dispatches the requests received by Rild, and responds to the request processing results returned by the bottom layer and the messages actively reported by the Modem.

[0108] Qcril.so is The dynamic link library file of the wireless interface layer (Qualcomm Radio Interface Layer, Qcril). Qcril is An interface provided by the company for implementing Ril's processing mechanism, which can be used with The chip platform communicates to process the request received by Ril, and responds to the request processing results returned by the bottom layer and the messages actively reported by the Modem module.

[0109] In one implementation, the first sub-interface is Qcril.

[0110] Qmi.so is The dynamic link library file of Qualcomm Mobile Station ModemInterface (Qmi). Qmi is A message interface protocol provided by the company. Qcril can use Qmi as the underlying message transmission mechanism and pass the request to the Modem module through Qmi, so that Qcril can realize the communication between the Modem module.

[0111] It should be noted that Qmi is not only used for communication between Qcril and Modem modules, but also for communication between other modules, such as mobile data, Global Positioning System (GPS), etc. Qmi provides a standardized message passing mechanism that enables effective collaboration and interaction between different modules.

[0112] In one implementation, the second sub-interface is Qmi.

[0113] In this way, the aging APK can send a first request message to the RILC with Qcril and Qmi.

[0114] It should be noted that the first interface provided in the embodiment of the present application is only for exemplary description. The first interface may be The interface provided by the company may also be an interface provided by other manufacturers. The specific type of the first interface is not limited in the embodiment of the present application. In the following embodiments of the present application, only the first sub-interface is Qcril and the second sub-interface is Qmi for exemplary description.

[0115] Figure 8 This is a second flow chart of a SIM module power-on method provided in an embodiment of the present application.

[0116] like Figure 8 As shown, step S102 may include steps S1021-S1023.

[0117] Step S1021: The application layer sends a first request message to the first sub-interface.

[0118] For example, the aging APK may send a first request message to Qcril. In a specific implementation, the aging APK creates the first request message and sets a first power-on configuration in the first request message, so that the first power-on configuration includes a first voltage for powering on the SIM module.

[0119] According to the international general industry standards such as the International Organization for Standardization (ISO) 7816 and the Global System for Mobile Communications (GSM) 11.11, the power supply voltage of the SIM card should support three power supply voltages, namely 1.8V, 3V and 5V. The SIM card should at least be able to work on electronic devices of 1.8V and 3V. Therefore, in order to simulate the insertion of the SIM card, when the Modem module keeps the SIM module in the power-on state, the first voltage may include at least one of 1.8V or 3V. In the embodiment of the present application, the first voltage includes but is not limited to the above values, and the first voltage may also include 5V. The present application does not limit the specific value of the first voltage.

[0120] Step S1022: The first sub-interface converts the first request message into a first format and sends the converted message to the second sub-interface, where the first format matches the type of the second sub-interface.

[0121] For example, Qcril converts the first request message into a first format and sends it to Qmi.

[0122] Specifically, Qcril can encapsulate the first request message into a first format. Qcril creates a first format corresponding to the request type and parameters of the first request message, and the first format can be a Qmi message structure. The Qmi message structure includes a message header and a message body. The message header contains information such as a message ID, and the message body contains specific request data. Qcril needs to fill the relevant data into the message body of the Qmi message structure according to the parameters of the first request message. This process may involve encoding, packaging and other processing of the parameters. If the first request message contains extended data, Qcril also needs to add the extended data to the Qmi message structure. The extended data is usually used to transmit associated additional information. In this way, Qcril completes the format conversion of the first request message.

[0123] Step S1023: The second sub-interface sends a first request message to the Modem module.

[0124] For example, Qmi sends a first request message to the Modem module. Specifically, Qmi can send the first notification message to Qmi based on inter-process communication (IPC) or other underlying mechanisms.

[0125] Step S103: The modem module determines a first power-on configuration in response to the first request message, and sends a first response message to the first interface.

[0126] The Modem module determines that the first power-on configuration is 1.8V or 3V in response to the first request message, and sends a first response message to the RILC after the first power-on configuration is successfully set.

[0127] It should be noted that at this time, the Modem module only sets the power-on voltage and does not actually power on. The first response message is used to notify the RILC that the first power-on configuration has been successfully set.

[0128] Further Figure 8 As shown, step S103 includes steps S1031-S1032.

[0129] Step S1031: The modem module converts the first response message into a first format and sends the converted format to the second sub-interface.

[0130] Among them, the modem module converts the first response message into the first format, which is the process of the modem module creating the first response message with the Qmi message structure. This process can refer to the process of Qcril converting the first request message into the first format, and this application will not go into details. After the modem module converts the first response message into the first format, the communication interface formed based on IPC or other underlying mechanisms sends the first response message to Qmi.

[0131] Step S1032: The second sub-interface converts the first response message into a second format and sends it to the first sub-interface, where the second format matches the type of the first sub-interface.

[0132] For example, Qmi converts the first response message into the second format and sends it to Qcril. Specifically, after Qmi receives the first response message in the first format, it needs to parse the first response message in the first format to obtain the second format, which is a format that Qcril can understand. This parsing process includes decoding the Qmi message structure, removing the message header, and parsing the message body, so that Qcril can recognize the parsed first response message.

[0133] Step S104: the first interface sends a power-on message to the Modem module in response to the first response message.

[0134] For example, the RILC sends a power-on message to the Modem module in response to the first response message.

[0135] Further Figure 8 As shown, step S104 may include steps S1041 - S1042 .

[0136] Step S1041: In response to the first response message, the first sub-interface creates a power-on message in a first format and sends the message to the second sub-interface.

[0137] For example, Qcril creates a power-on message with a first format in response to the first response message and sends it to Qmi. The process of Qcril sending a power-on message to Qmi can refer to the process of Qcril sending a first request message to Qmi, which is not described in detail in this embodiment of the present application.

[0138] Step S1042: The second sub-interface sends a power-on message to the Modem module.

[0139] For example, Qmi sends a power-on message to the Modem module. The process of Qmi sending a power-on message to the Modem module can refer to the process of Qmi sending a first request message to the Modem module, which will not be described in detail in the embodiment of the present application.

[0140] Step S105 : In response to the power-on message, the modem module adjusts the power-on voltage of the SIM module to the first voltage based on the first power-on configuration, and keeps the SIM module in the powered-on state.

[0141] In a specific implementation, the modem module obtains the first power-on configuration in response to the power-on message, and if the first power-on configuration is 1.8 V, the modem module adjusts the power-on voltage of the SIM module to 1.8 V, and maintains the power-on voltage of the SIM module at 1.8 V. If the first power-on configuration is 3 V, the modem module adjusts the power-on voltage of the SIM module to 3 V, and maintains the power-on voltage of the SIM module at 3 V.

[0142] Since the modem module does not directly provide the power-on voltage to the SIM module, but provides the power-on voltage to the SIM module based on the power control chip, the modem module can send a first request signal to the processor of the electronic device to request the processor to send a power supply instruction to the power control chip. After receiving the first request signal sent by the modem module, the processor sends a power supply instruction to the power control chip, so that the power control chip continues to supply power to the SIM module according to the power supply instruction.

[0143] For some advanced power control chips, a microprocessor may be integrated on the power control chip, so that the Modem module may directly send a first request signal to the power control chip to request the power control chip to supply power to the SIM module, so that the SIM module can remain powered on.

[0144] In a specific implementation, step S105 may include steps S1051 - S1053 .

[0145] Step S1051, the modem module determines the target scenario of the SIM module, the target scenario includes the SIM card tray being inserted into the SIM module, the SIM card tray not being embedded with the SIM card, and the SIM card tray not being inserted into the SIM module.

[0146] Step S1052: If the target scenario is that the SIM module is inserted into the SIM card tray, and there is no SIM card embedded in the SIM card tray, the modem module keeps the SIM module powered on.

[0147] Step S1053: if the target scenario is that the SIM card tray is not inserted into the SIM module, the modem module keeps the SIM module powered on.

[0148] That is to say, when a SIM card is not inserted into an electronic device before leaving the factory, there are only two target scenarios. The first target scenario is that an empty card tray (i.e., a SIM card tray without a SIM card embedded in it) is inserted into the SIM module, and the second scenario is that no card tray is inserted into the SIM module. The embodiments of the present application allow the modem module to keep the SIM module powered on in these two target scenarios.

[0149] The electronic device may determine that the SIM module is in at least one of the above target scenarios in the following manner.

[0150] In one implementation, the electronic device is configured with a display light for displaying the status of the SIM card slot. If the SIM card is correctly inserted into the SIM card slot, the display light is in a lit state. If the SIM card is not inserted into the SIM card slot or the electronic device cannot correctly identify and read the information of the SIM card, the display light is in an off state or a flashing state. The electronic device can detect the current state of the display light. When the display light is not in a lit state, the electronic device can determine that the SIM module is in at least one of the above target scenarios.

[0151] In one implementation, the electronic device may provide an interface for querying the SIM card status, and by calling the corresponding interface, the electronic device may determine whether the SIM card has been correctly inserted into the SIM card slot. If the electronic device does not query the SIM card status, the electronic device may determine that the SIM module is in at least one of the above target scenarios.

[0152] The electronic device may provide more methods for detecting the target scene where the SIM module is located, which will not be described in detail in the embodiments of the present application. When the electronic device determines that the SIM module is in at least one of the above target scenes, the modem module may keep the SIM module powered on.

[0153] After step S105, step S106 is also included.

[0154] Step S106: The modem module sends a first feedback message to the application layer through the first interface based on the power-on status of the SIM module. The first feedback message includes whether the SIM module has a fault.

[0155] For example, the Modem module may send a first feedback message to the aged APK through the RILC based on the power-on status of the SIM module.

[0156] Further Figure 8 As shown, step S106 may include steps S1061-S1063.

[0157] Step S1061: The modem module creates a first feedback message in a first format based on the power-on state of the SIM module, and sends the first feedback message to the second sub-interface.

[0158] For example, the modem module creates a first feedback message in a first format based on the power-on state of the SIM and sends it to Qmi. This process can refer to the process of Qcril converting the first request message into the first format, which is not described in detail in this application. After the modem module converts the first feedback message into the first format, the communication interface formed based on IPC or other underlying mechanisms sends the first feedback message to Qmi.

[0159] Step S1062: The second sub-interface converts the first feedback message into a second format and sends the converted format to the first sub-interface.

[0160] For example, Qmi converts the first feedback message into the second format and sends it to Qcril. This process can refer to the process of Qmi sending the first response message to Qcril, which is not described in detail in this application.

[0161] Step S1063: The first sub-interface sends a first feedback message to the application layer.

[0162] For example, Qcril sends a first feedback message to the aged APK. Specifically, after Qmi sends the first feedback message to Qcril in the Qmi message structure, Qcril parses the Qmi message structure to obtain the message body corresponding to the first feedback message, and Qcril can encapsulate the message body into a second format, which can be a response message structure. The response message structure may include a response code, response data, and other related fields. Among them, the response code may indicate the status of the power-on result, and the response data may contain detailed information on the execution result. In this way, Qcril can send the first feedback message with a response message structure to the aged APK based on the IPC mechanism.

[0163] After receiving the first feedback message, the aging APK parses the response message structure corresponding to the first feedback message, extracts the response code and response data, and determines the status and detailed information of the first feedback message according to the response code and the response data.

[0164] In the embodiment of the present application, the modem keeps the SIM module powered on, and can determine whether the SIM module will have a power-on failure after being powered on for a long time, and feed back the power-on result to the application layer, so that the aging APK can feed back to the tester whether the SIM module has a power-on failure. If the SIM module has a power-on failure, the tester can avoid the SIM module with the failure from leaving the factory.

[0165] After the modem module completes the SIM module power-on process, it is also necessary to perform a power-off process on the SIM module.

[0166] Fig. 9 This is the third flow chart of a SIM module power-on method provided in an embodiment of the present application.

[0167] like Fig. 9 As shown, after step S106, steps S201-S204 are also included.

[0168] Step S201: In response to a first feedback message, the application layer sends a second request message to the Modem module through a first interface. The second request message includes a second power-on configuration. The second power-on configuration includes that the power-on voltage of the SIM module is a second voltage.

[0169] For example, the aged APK sends a second request message to the Modem module through the RILC.

[0170] Fig.10 This is the fourth flow chart of a SIM module power-on method provided in an embodiment of the present application.

[0171] like Fig.10 As shown, step S201 may include steps S2011-S2013.

[0172] Step S2011: The application layer sends a second request message to the first sub-interface.

[0173] For example, the aging APK may send a second request message to Qcril. In a specific implementation, the aging APK creates a second request message and sets a second power-on configuration in the second request message, so that the second power-on configuration includes a second voltage for powering off the SIM module.

[0174] The second voltage may be 0V, so that the modem module may adjust the power-on voltage of the SIM module to 0V to power off the SIM module.

[0175] Step S2012: The first sub-interface converts the second request message into a first format and sends the converted format to the second sub-interface.

[0176] For example, Qcril converts the second request message into the first format and sends it to Qmi. This process can be referred to in step S1022, and this application will not elaborate on it.

[0177] Step S2013: The second sub-interface sends a second request message to the Modem module.

[0178] For example, Qmi sends a second request message to the Modem module. This process can be referred to in step S1023, which will not be described in detail in this application.

[0179] Step S202: The modem module determines a second power-on configuration in response to the second request message, and sends a second response message to the first interface.

[0180] The Modem module determines that the second power-on configuration is 0V in response to the second request message, and sends a second response message to the RILC after the second power-on configuration is successfully set.

[0181] It should be noted that at this time, the Modem module sets the power-on voltage to 0 and does not actually power off. The second response message is used to notify the RILC that the second power-on configuration has been successfully set.

[0182] In a specific implementation, step S202 includes steps S2021-S2022.

[0183] Step S2021: The modem module converts the second response message into the first format and sends it to the second sub-interface.

[0184] For example, the Modem module converts the second response message into the first format and sends it to Qmi. This step can be referred to as step S1031, and this application will not elaborate on it.

[0185] Step S2022: The second sub-interface converts the second response message into a second format and sends it to the first sub-interface.

[0186] For example, Qmi converts the second response message into the second format and sends it to Qcril. This process can be referred to in step S1032, and this application will not elaborate on it.

[0187] Step S203: The first interface sends a power-off message to the Modem module in response to the second response message.

[0188] For example, the RILC sends a power-off message to the Modem module in response to the second response message.

[0189] Step S203 includes steps S2031 - S2032 .

[0190] Step S2031: In response to the second response message, the first sub-interface creates a power-off message in a first format and sends the message to the second sub-interface.

[0191] For example, Qcril creates a power-off message having a first format in response to the second response message, and sends it to Qmi. This process can be referred to in step S1041, and this application will not elaborate on it.

[0192] Step S2032: The second sub-interface sends a power-off message to the Modem module.

[0193] For example, Qmi sends a power-off message to the Modem module. This process can be referred to step S1042, and this application will not elaborate on it.

[0194] Step S204: In response to the power-off message, the modem module adjusts the power-on voltage of the SIM module to a second voltage based on the second power-on configuration, and powers off the SIM module according to the second voltage.

[0195] In a specific implementation, the Modem module obtains the second power-on configuration as 0V in response to the power-off message, so that the Modem module can power off the SIM module.

[0196] Correspondingly, the modem does not directly provide the power-off voltage to the SIM module, and also adjusts the voltage of the SIM module based on the power control chip. Therefore, the modem module can send a second request signal to the processor of the electronic device to request the processor to send a power-off instruction to the power control chip. After receiving the second request signal from the modem, the processor sends a power-off instruction to the power control chip, so that the power control chip adjusts the power-on voltage of the SIM module to 0V according to the power-off instruction and stops supplying power to the SIM module. For some advanced power control chips, a microprocessor can be integrated on the power control chip. In this way, the modem module can also directly send a second request signal to the power control chip to request the power control chip to adjust the power-on voltage of the SIM module to 0V and stop supplying power to the SIM module. In this way, the SIM module can be powered off.

[0197] It should be noted here that the modem module can power off the SIM module in any target scenario of the aforementioned embodiments, and the power-off process is not limited by the target scenario.

[0198] In one implementation, after step S204, step S205 is further included.

[0199] Step S205: The modem module sends a second feedback message to the application layer through the first interface based on the power-off status of the SIM module. The second feedback message includes whether the SIM module has been powered off.

[0200] For example, the Modem module may send a second feedback message to the aged APK through the RILC based on the power-off state of the SIM module.

[0201] Step S205 may include steps S2051 - S2053 .

[0202] Step S2051: The modem module creates a second feedback message in a first format based on the power-off state of the SIM module, and sends the second feedback message to the second sub-interface.

[0203] For example, the Modem module creates a second feedback message in the first format based on the power-off state of the SIM, and sends the second feedback message to the Qmi. This process can be referred to in step S1061, and this application will not elaborate on it.

[0204] Step S2052: The second sub-interface converts the second feedback message into a second format and sends the converted format to the first sub-interface.

[0205] For example, Qmi converts the second feedback message into the second format and sends it to Qcril. This process can be referred to in step S1062, and this application will not elaborate on it.

[0206] Step S2053: The first sub-interface sends a second feedback message to the application layer.

[0207] For example, Qcril sends a second feedback message to the aged APK. This process can be referred to in step S1063, which will not be described in detail in this application.

[0208] After receiving the second feedback message, the aging APK parses the response message structure corresponding to the second feedback message, extracts the response code and response data, and feeds back the status and detailed information of the second feedback message according to the response code and response data.

[0209] In this way, the aged APK can provide feedback to the tester on the power-off status of the SIM module.

[0210] After the modem module powers off the SIM module, the aging test process ends.

[0211] The technical solution shown in the embodiment of the present application is that during the aging test, the Modem module keeps the SIM module in the powered-on state. In this way, if the SIM module has electrostatic damage, the SIM module will stimulate electrostatic damage during the long-term power-on state. If the SIM module does not have electrostatic damage, the SIM module will maintain a normal state during the long-term power-on state. Based on this, SIM modules with electrostatic damage can be tested and intercepted before leaving the factory, thereby preventing SIM modules with electrostatic damage from leaving the factory.

[0212] The above mainly introduces the solution provided by the embodiment of the present application from the perspective of an electronic device. It is understandable that, in order to realize the above functions, the electronic device includes a hardware structure and / or software module corresponding to the execution of each function. Those skilled in the art should easily realize that, in combination with the steps of a communication module aging test method described in each example of the embodiment disclosed in this application, the present application can be implemented in the form of hardware or a combination of hardware and computer software. Whether a function is executed in the form of hardware or electronic device software driving hardware depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0213] The embodiment of the present application can divide the above-mentioned electronic device into functional modules or functional units according to the above-mentioned method example. For example, each functional module or functional unit can be divided corresponding to each function, or two or more functions can be integrated into one processing module. The above-mentioned integrated module can be implemented in the form of hardware or in the form of software functional modules or functional units. Among them, the division of modules or units in the embodiment of the present application is schematic, which is only a logical function division, and there may be other division methods in actual implementation.

[0214] Fig.11 It is a structural schematic diagram of a communication module aging test device provided in an embodiment of the present application.

[0215] like Fig.11 As shown, in one embodiment, the electronic device can Fig.11The hardware device shown implements the corresponding function. The device may include: a touch screen 701, a memory 702, a processor 703 and a communication module 704. The above-mentioned devices may be connected via one or more communication buses 705. The touch screen 701 may include a display panel 7011 and a touch sensor 7012, wherein the display panel 7011 is used to display an image, and the touch sensor 7012 may pass the detected touch operation to the application processor to determine the type of touch event, and provide a visual output related to the touch operation through the display panel 7011. The processor 703 may include one or more processing units, for example: the processor 703 may include an application processor, a modem processor, a graphics processor, an image signal processor, a controller, a video codec, a digital signal processor, a baseband processor, and / or a neural network processor, etc. Among them, different processing units may be independent devices or integrated in one or more processors. The memory 702 is coupled to the processor 703 for storing various software programs and / or computer instructions, and the memory 702 may include a volatile memory and / or a non-volatile memory. When the processor executes the computer instruction, the electronic device may perform the various functions or steps of the above method embodiment.

[0216] When the software program and / or multiple groups of instructions in the memory 702 are executed by the processor 703, the electronic device implements the following method steps: in response to the electronic device being turned on, the modem module powers on the user identity SIM module; the application layer sends a first request message to the Modem module through the first interface, the first interface is the interface between the application layer and the Modem module, the first request message includes a first power-on configuration, and the first power-on configuration includes that the power-on voltage of the SIM module is a first voltage; the Modem module determines the first power-on configuration in response to the first request message, and sends a first response message to the first interface; the first interface sends a power-on message to the Modem module in response to the first response message; the Modem module adjusts the power-on voltage of the SIM module to the first voltage based on the first power-on configuration in response to the power-on message, and keeps the SIM module powered on.

[0217] In one implementation, the first interface includes a first sub-interface and a second sub-interface. When the software program and / or multiple groups of instructions in the memory 702 are executed by the processor 703, the electronic device implements the following method steps: the application layer sends a first request message to the first sub-interface; the first sub-interface converts the first request message into a first format and sends it to the second sub-interface, and the first format matches the type of the second sub-interface; the second sub-interface sends the first request message to the Modem module.

[0218] When the software program and / or multiple groups of instructions in the memory 702 are executed by the processor 703, the electronic device implements the following method steps: the modem module converts the first response message into a first format and sends it to the second sub-interface; the second sub-interface converts the first response message into a second format and sends it to the first sub-interface, and the second format matches the type of the first sub-interface.

[0219] When the software program and / or multiple groups of instructions in the memory 702 are executed by the processor 703, the electronic device implements the following method steps: the first sub-interface creates a power-on message with a first format in response to the first reply message and sends it to the second sub-interface; the second sub-interface sends the power-on message to the Modem module.

[0220] When the software program and / or multiple groups of instructions in the memory 702 are executed by the processor 703, the electronic device implements the following method steps: the modem module determines the target scenario of the SIM module, and the target scenarios include a SIM card tray being inserted into the SIM module, and no SIM card is embedded in the SIM card tray, and no SIM card is inserted into the SIM module; if the target scenario is that the SIM card tray is inserted into the SIM module, and no SIM card is embedded in the SIM card tray, the modem module keeps the SIM module powered on; if the target scenario is that the SIM card tray is not inserted into the SIM module, the modem module keeps the SIM module powered on.

[0221] When the software program and / or multiple groups of instructions in the memory 702 are executed by the processor 703, the electronic device implements the following method steps: the modem module sends a first feedback message to the application layer through the first interface based on the power-on status of the SIM module, and the first feedback message includes whether the SIM module has a fault.

[0222] When the software program and / or multiple groups of instructions in the memory 702 are executed by the processor 703, the electronic device implements the following method steps: the modem module creates a first feedback message in a first format based on the power-on state of the SIM module and sends it to the second sub-interface; the second sub-interface converts the first feedback message into a second format and sends it to the first sub-interface; the first sub-interface sends the first feedback message to the application layer.

[0223] When the software program and / or the multiple groups of instructions in the memory 702 are executed by the processor 703, the electronic device implements the following method steps: the first voltage includes at least one of 1.8V and 3V.

[0224] When the software program and / or multiple groups of instructions in the memory 702 are executed by the processor 703, the electronic device implements the following method steps: the application layer responds to the first feedback message and sends a second request message to the Modem module through the first interface, the second request message includes a second power-on configuration, and the second power-on configuration includes that the power-on voltage of the SIM module is a second voltage; the Modem module responds to the second request message, determines the second power-on configuration, and sends a second response message to the first interface; the first interface responds to the second response message and sends a power-off message to the Modem module; the Modem module responds to the power-off message, adjusts the power-on voltage of the SIM module to the second voltage based on the second power-on configuration, and powers off the SIM module according to the second voltage.

[0225] When the software program and / or multiple groups of instructions in the memory 702 are executed by the processor 703, the electronic device implements the following method steps: the application layer sends a second request message to the first sub-interface; the first sub-interface converts the second request message into a first format and sends it to the second sub-interface; the second sub-interface sends a second request message to the Modem module.

[0226] When the software program and / or multiple groups of instructions in the memory 702 are executed by the processor 703, the electronic device implements the following method steps: the modem module converts the second response message into the first format and sends it to the second sub-interface; the second sub-interface converts the second response message into the second format and sends it to the first sub-interface.

[0227] When the software program and / or multiple groups of instructions in the memory 702 are executed by the processor 703, the electronic device implements the following method steps: the first sub-interface creates a power-off message in a first format in response to the second reply message and sends it to the second sub-interface; the second sub-interface sends the power-off message to the modem module.

[0228] When the software program and / or multiple groups of instructions in the memory 702 are executed by the processor 703, the electronic device implements the following method steps: the modem module sends a second feedback message to the application layer through the first interface based on the power-off status of the SIM module, and the second feedback message includes whether the SIM module has been powered off.

[0229] When the software program and / or multiple groups of instructions in the memory 702 are executed by the processor 703, the electronic device implements the following method steps: the modem module creates a second feedback message in a first format based on the power-off state of the SIM module, and sends it to the second sub-interface; the second sub-interface converts the second feedback message into a second format and sends it to the first sub-interface; the first sub-interface sends the second feedback message to the application layer.

[0230] When the software program and / or the multiple groups of instructions in the memory 702 are executed by the processor 703, the electronic device implements the following method steps: the second voltage is 0V.

[0231] When the software program and / or the plurality of groups of instructions in the memory 702 are executed by the processor 703 , the electronic device implements the following method steps: the aging application package sends a first request message to the Modem module through the first interface.

[0232] An embodiment of the present application also provides an electronic device, including: a processor, a memory and a touch screen; the memory stores program instructions, and when the program instructions are executed by the processor, the electronic device executes each function or step performed in the above method embodiment.

[0233] The embodiment of the present application also provides a chip system, which includes at least one processor and at least one interface circuit. The processor and the interface circuit can be interconnected by lines. For example, the interface circuit can be used to receive signals from other devices (such as a memory of an electronic device). For another example, the interface circuit can be used to send signals to other devices. Exemplarily, the interface circuit can read instructions stored in the memory and send the instructions to the processor. When the instructions are executed by the processor, the electronic device can perform the various steps in the above embodiments. Of course, the chip system can also include other discrete devices, which is not specifically limited in the embodiment of the present application.

[0234] An embodiment of the present application also provides a computer-readable storage medium, which includes computer instructions. When the computer instructions are executed on the above-mentioned electronic device, the electronic device executes each function or step executed in the above-mentioned method embodiment.

[0235] The embodiment of the present application also provides a computer program product. When the computer program product is run on a computer, the computer is enabled to execute each function or step executed in the above method embodiment.

[0236] Through the description of the above implementation methods, technical personnel in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional modules is used as an example. In actual applications, the above-mentioned functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above.

[0237] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another device, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0238] The units described as separate components may or may not be physically separated, and the components shown as units may be one physical unit or multiple physical units, that is, they may be located in one place or distributed in multiple different places. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0239] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0240] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a readable storage medium. Based on this understanding, the technical solution of the embodiment of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, which is stored in a storage medium, including several instructions to enable a device (which can be a single-chip microcomputer, chip, etc.) or a processor (processor) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read only memory (ROM), random access memory (RAM), disk or optical disk and other media that can store program code.

[0241] The above contents are only specific implementation methods of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application shall be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A method for powering on a SIM module, characterized in that: include: In response to the electronic device being powered on, the modem module powers on the subscriber identity SIM module; The application layer sends a first request message to the Modem module through a first interface, where the first interface is an interface between the application layer and the Modem module, where the first request message includes a first power-on configuration, where the first power-on configuration includes that a power-on voltage of the SIM module is a first voltage; The Modem module determines the first power-on configuration in response to the first request message, and sends a first response message to the first interface; The first interface sends a power-on message to the Modem module in response to the first response message; In response to the power-on message, the Modem module adjusts the power-on voltage of the SIM module to the first voltage based on the first power-on configuration, and maintains the power-on state of the SIM module.

2. The SIM module power-on method according to claim 1, characterized in that: The first interface includes a first sub-interface and a second sub-interface, and the application layer sends a first request message to the Modem module through the first interface, including: The application layer sends the first request message to the first sub-interface; The first sub-interface converts the first request message into a first format and sends the first format to the second sub-interface, where the first format matches the type of the second sub-interface; The second sub-interface sends the first request message to the Modem module.

3. The SIM module power-on method according to claim 2, characterized in that: The modem module determines the first power-on configuration in response to the first request message, and sends a first response message to the first interface, including: The Modem module converts the first response message into the first format and sends the converted response message to the second sub-interface; The second sub-interface converts the first response message into a second format and sends the second response message to the first sub-interface, where the second format matches the type of the first sub-interface.

4. The SIM module power-on method according to claim 2, characterized in that: The first interface sends a power-on message to the Modem module in response to the first response message, including: In response to the first response message, the first sub-interface creates the power-on message having the first format and sends the power-on message to the second sub-interface; The second sub-interface sends the power-on message to the Modem module.

5. The SIM module power-on method according to claim 1, characterized in that: The modem module, in response to the power-on message, adjusts the power-on voltage of the SIM module to the first voltage based on the first power-on configuration, and maintains the power-on state of the SIM module, including: The modem module determines a target scenario in which the SIM module is located, wherein the target scenario includes a SIM card tray being inserted into the SIM module, the SIM card not being embedded in the SIM card tray, and the SIM card not being inserted into the SIM module; If the target scenario is that the SIM card tray is inserted into the SIM module, and the SIM card is not embedded in the SIM card tray, the modem module maintains the power-on state of the SIM module; If the target scenario is that the SIM card tray is not inserted into the SIM module, the Modem module maintains the power-on state of the SIM module.

6. The SIM module power-on method according to claim 3, characterized in that: After the Modem module, in response to the power-on message, adjusts the power-on voltage of the SIM module to the first voltage based on the first power-on configuration and maintains the power-on state of the SIM module, the method further includes: The modem module sends a first feedback message to the application layer through the first interface based on the power-on state of the SIM module, where the first feedback message includes whether the SIM module has a fault.

7. The method for powering on a SIM module according to claim 6, characterized in that: The modem module sends a first feedback message to the application layer through the first interface based on the power-on state of the SIM module, including: The Modem module creates the first feedback message in the first format based on the power-on state of the SIM module, and sends the first feedback message to the second sub-interface; The second sub-interface converts the first feedback message into a second format and sends the converted format to the first sub-interface; The first sub-interface sends the first feedback message to the application layer.

8. The method for powering on a SIM module according to any one of claims 1 to 7, characterized in that: The first voltage includes at least one of 1.8V and 3V.

9. The method for powering on a SIM module according to claim 6, characterized in that: After the Modem module sends the first feedback message to the application layer through the first interface based on the power-on state of the SIM module, the method further includes: In response to the first feedback message, the application layer sends a second request message to the Modem module through the first interface, where the second request message includes a second power-on configuration, where the second power-on configuration includes that the power-on voltage of the SIM module is a second voltage; The Modem module determines the second power-on configuration in response to the second request message, and sends a second response message to the first interface; The first interface sends a power-off message to the Modem module in response to the second response message; In response to the power-off message, the Modem module adjusts the power-on voltage of the SIM module to the second voltage based on the second power-on configuration, and powers off the SIM module according to the second voltage.

10. The SIM module power-on method according to claim 9, characterized in that: The application layer sends a second request message to the Modem module through the first interface in response to the first feedback message, including: The application layer sends the second request message to the first sub-interface; The first sub-interface converts the second request message into a first format and sends the converted format to the second sub-interface; The second sub-interface sends the second request message to the Modem module.

11. The method for powering on a SIM module according to claim 9, characterized in that: The modem determines the second power-on configuration in response to the second request message, and sends a second response message to the first interface, including: The Modem module converts the second response message into the first format and sends the converted response message to the second sub-interface; The second sub-interface converts the second response message into a second format and sends the second response message to the first sub-interface.

12. The method for powering on a SIM module according to claim 9, characterized in that: The first interface sends a power-off message to the Modem module in response to the second response message, including: In response to the second response message, the first sub-interface creates the power-off message in the first format and sends the power-off message to the second sub-interface; The second sub-interface sends the power-off message to the Modem module.

13. The method for powering on a SIM module according to claim 9, characterized in that: The modem module, in response to the power-off message, adjusts the power-on voltage of the SIM module to the second voltage based on the second power-on configuration, and after powering off the SIM module according to the second voltage, further includes: The modem module sends a second feedback message to the application layer through the first interface based on the power-off state of the SIM module, where the second feedback message includes whether the SIM module is powered off.

14. The method for powering on a SIM module according to claim 13, characterized in that: The modem module sends a second feedback message to the application layer through the first interface based on the power-off state of the SIM module, including: The Modem module creates, based on the power-off state of the SIM module, the second feedback message in the first format, and sends the second feedback message to the second sub-interface; The second sub-interface converts the second feedback message into a second format and sends the converted format to the first sub-interface; The first sub-interface sends the second feedback message to the application layer.

15. The method for powering on a SIM module according to any one of claims 9 to 14, characterized in that: The second voltage is 0V.

16. The method for powering on a SIM module according to any one of claims 1 to 14, characterized in that: The application layer includes an aging application package, and the application layer sends a first request message to the Modem module through a first interface, including: The aging application package sends the first request message to the Modem module through the first interface.

17. An electronic device, characterized in that: It comprises a processor and a memory; the memory stores program instructions, and when the program instructions are executed by the processor, the electronic device executes the SIM module power-on method as described in any one of claims 1-16.

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