A SIM module power-on method and electronic device

Abstract

The application provides a SIM module power-on method and an electronic device. The method comprises: in response to the electronic device being turned on, a Modem module powers on a SIM module; an application layer sends a first request message to the Modem module through a first interface, the first request message comprising a first power-on configuration; the Modem module determines the first power-on configuration in response to the first request message, and sends a first response message to the first interface; the first interface sends a power-on message to the Modem module in response to the first response message; and the Modem module adjusts the power-on voltage of the SIM module to a first voltage based on the first power-on configuration, and maintains the power-on state of the SIM module in response to the power-on message. In the application, in the aging test phase of the electronic device, the Modem module keeps the SIM module in the power-on state, so that the SIM module with static damage can be tested, and the SIM module with static damage is prevented from being shipped.

Description

Technical Field

[0001] This application relates to the field of terminal technology, and in particular to a SIM module power-on method and an electronic device. Background Technology

[0002] A Subscriber Identity Module (SIM) card is a smart card embedded in an electronic device. The SIM card stores the user's identity information, including country code, mobile network operator, and phone number. The SIM card allows users to switch between different electronic devices and establish connections with mobile networks. Electronic devices can establish communication connections with the SIM module through a built-in modem module.

[0003] During the manufacturing process of electronic devices, electrostatic discharge (ESD) damage may occur to the SIM module during production line work. This damage is typically detectable only after the modem module powers on the SIM module. However, the SIM card is paired by the user after the electronic device leaves the factory, and the SIM module usually cannot be powered on before the SIM card is paired. Therefore, since ESD damage to the SIM module is not readily available before shipment, SIM modules with ESD damage may be shipped simultaneously with those without.

[0004] If a SIM module is shipped with electrostatic discharge damage, users may experience SIM card recognition failures after inserting a SIM card into the module and using it for a period of time. Summary of the Invention

[0005] This application provides a SIM module power-on method and an electronic device. During the aging test of the electronic device, the modem module keeps the SIM module powered on, which can detect SIM modules with electrostatic damage and prevent SIM modules with electrostatic damage from leaving the factory.

[0006] In a first aspect, embodiments of this application provide a SIM module power-on method, comprising: in response to the power-on of an electronic device, a modem module powering on a user identity SIM module; an application layer sending a first request message to the modem module through a first interface, the first interface being an interface between the application layer and the modem module, the first request message including a first power-on configuration, the first power-on configuration including a power-on voltage of the SIM module being a first voltage; the modem module responding to the first request message, determining the first power-on configuration, and sending a first response message to the first interface; the first interface responding to the first response message, sending a power-on message to the modem module; and the modem module responding to the power-on message, adjusting the power-on voltage of the SIM module to the first voltage based on the first power-on configuration, and maintaining the power-on state of the SIM module.

[0007] The technical solution illustrated in this application embodiment keeps the SIM module powered on during the aging test. This way, if the SIM module has electrostatic discharge (ESD) damage, the prolonged power-on process will trigger ESD; conversely, if the SIM module does not have ESD damage, it will maintain a normal state during the same period. Based on this, SIM modules with ESD damage can be identified and prevented from leaving the factory.

[0008] In one implementation, the first interface includes a first sub-interface and a second sub-interface. The application layer sends a first request message to the modem module through the first interface, including: the application layer sending the first request message to the first sub-interface; the first sub-interface converting the first request message into a first format and sending it to the second sub-interface, the first format matching the type of the second sub-interface; and the second sub-interface sending the first request message to the modem module. Using this implementation, the first interface performs format conversion on the first request message, converting it into a format readable by the modem module. This ensures that the modem module can receive and parse the first request message. Thus, the modem module can determine the first power-on configuration based on the received first request message, maintaining the SIM module in a powered-on state with an appropriate voltage, ensuring the safety and stability of the SIM module during power-on.

[0009] In one implementation, the Modem module responds to a first request message, determines a first power-on configuration, and sends a first response message to a first interface. This includes: the Modem module converting the first response message into a first format and sending it to a second sub-interface; the second sub-interface converting the first response message into a second format and sending it to the first sub-interface, the second format matching the type of the first sub-interface. Using this implementation, the Modem module performs corresponding configuration and responds based on the first request message sent by the first interface. Specifically, it provides an interaction method between the Modem module and the first interface, allowing the first interface to further send a power-on message to the Modem module. Thus, based on the power-on message, the Modem module can keep the SIM module powered on, enabling the testing of SIM modules with electrostatic discharge damage.

[0010] In one implementation, the first interface responds to the first acknowledgment message by sending a power-on message to the Modem module. This includes: the first sub-interface responding to the first acknowledgment message by creating a power-on message with a first format and sending it to the second sub-interface; and the second sub-interface sending the power-on message to the Modem module. This implementation provides a specific method for the first interface to interact with the Modem module, enabling the first interface to further send power-on messages to the Modem module. Based on these power-on messages, the Modem module can keep the SIM module powered on, allowing for the detection of SIM modules with electrostatic discharge (ESD) damage.

[0011] In one implementation, the modem module responds to a power-on message and, based on a first power-on configuration, adjusts the power-on voltage of the SIM module to a first voltage and maintains the SIM module in a powered-on state. This includes: the modem module determining the target scenario of the SIM module, where the target scenario includes a SIM card tray inserted into the SIM module but no SIM card embedded in the tray, and no SIM card tray inserted into the SIM module. If the target scenario is a SIM card tray inserted into the SIM module but no SIM card embedded in the tray, the modem module maintains the SIM module in a powered-on state; if the target scenario is no SIM card tray inserted into the SIM module, the modem module maintains the SIM module in a powered-on state. Using this implementation, the modem module can keep the SIM module powered on in both target scenarios, enabling the testing of SIM modules with electrostatic damage.

[0012] In one implementation, in response to a power-on message, the modem module adjusts the power-on voltage of the SIM module to a first voltage based on a first power-on configuration, and after maintaining the SIM module's power-on state, the modem module further includes: based on the SIM module's power-on state, the modem module sending a first feedback message to the application layer through a first interface. The first feedback message includes whether the SIM module is faulty. Using this implementation, the modem module can provide feedback to the application layer after determining whether the SIM module is faulty, allowing the tester to determine whether the SIM module has electrostatic damage, thereby preventing SIM modules with electrostatic damage from leaving the factory.

[0013] In one implementation, the modem module, based on the power-on state of the SIM module, sends a first feedback message to the application layer through a first interface. This includes: the modem module creating a first feedback message with a first format based on the SIM module's power-on state and sending it to a second sub-interface; the second sub-interface converting the first feedback message into a second format and sending it back to the first sub-interface; and the first sub-interface then sending the first feedback message to the application layer. This implementation provides a specific way for the modem module to interact with the application layer. After determining whether the SIM module is faulty, the modem module can provide feedback to the application layer so that testers can determine whether the SIM module has been damaged by electrostatic discharge (ESD), thereby preventing SIM modules with ESD damage from leaving the factory.

[0014] In one implementation, the first voltage includes at least one of 1.8V and 3V. Using this implementation, the modem module provides the SIM module with at least two suitable power-on voltages, ensuring the safety and stability of the SIM module's power-on process.

[0015] In one implementation, after the Modem module sends a first feedback message to the application layer through a first interface based on the power-on state of the SIM module, the method further includes: the application layer responding to the first feedback message by sending a second request message to the Modem module through the first interface; the second request message includes a second power-on configuration, which includes the SIM module's power-on voltage being a second voltage; the Modem module responding to the second request message by determining the second power-on configuration and sending a second response message to the first interface; the first interface responding to the second response message by sending a power-off message to the Modem module; and the Modem module responding to the power-off message by adjusting the SIM module's power-on voltage to the second voltage based on the second power-on configuration, and powering off the SIM module according to the second voltage. Using this implementation, the application layer sends a second request message to the Modem module through the first interface to terminate the power-on state maintained by the SIM module, thus allowing the SIM module to power off and complete the aging test.

[0016] In one implementation, the application layer responds to the first feedback message by sending a second request message to the modem module through a first interface. This includes: the application layer sending the second request message to the first sub-interface; the first sub-interface converting the second request message into a first format and sending it to a second sub-interface; and the second sub-interface sending the second request message to the modem module. Using this implementation, the first interface performs format conversion on the second request message, converting it into a format readable by the modem module. This ensures that the modem module can receive and parse the second request message. Thus, the modem module can determine the second power-on configuration based on the received second request message, adjust the SIM module to a power-off voltage, and then execute the power-off process to complete the aging test.

[0017] In one implementation, the modem responds to the second request message, determines the second power-on configuration, and sends a second response message to the first interface. This includes: the modem module converting the second response message into a first format and sending it to the second sub-interface; the second sub-interface converting the second response message into a second format and sending it to the first sub-interface. Using this implementation, the modem module performs corresponding configuration and responds based on the second request message sent by the first interface. Specifically, it provides an interaction method between the modem module and the first interface, allowing the first interface to further send a power-down message to the modem module. Thus, based on the power-down message, the modem module can power down the SIM module, completing the aging test.

[0018] In one implementation, the first interface responds to the second response message by sending a power-down message to the Modem module. This includes: the first sub-interface responding to the second response message by creating a power-down message with a first format and sending it to the second sub-interface; and the second sub-interface sending the power-down message to the Modem module. This implementation provides a specific way for the first interface to interact with the Modem module, enabling the first interface to further send a power-down message to the Modem module. Based on this power-down message, the Modem module can power down the SIM module and complete the aging test.

[0019] In one implementation, in response to a power-down message, the modem module adjusts the power-on voltage of the SIM module to a second voltage based on a second power-on configuration. After powering down the SIM module according to the second voltage, the method further includes: the modem module sending a second feedback message to the application layer through a first interface based on the power-down state of the SIM module. The second feedback message indicates whether the SIM module has been powered down. Using this implementation, the modem module can provide feedback to the application layer after determining whether the SIM module has been powered down, allowing the tester to confirm that the power-down process of the SIM module has ended and the aging test is complete.

[0020] In one implementation, the modem module, based on the power-down state of the SIM module, sends a second feedback message to the application layer through a first interface. This includes: the modem module creating a second feedback message with a first format based on the power-down state of the SIM module and sending it to a second sub-interface; the second sub-interface converting the second feedback message into a second format and sending it to the first sub-interface; and the first sub-interface sending the second feedback message to the application layer. This implementation provides a specific way for the modem module to interact with the application layer. The modem module can provide feedback to the application layer after determining whether the SIM module has been powered down, allowing the tester to confirm whether the SIM module has been powered down and complete the aging test.

[0021] In one implementation, the second voltage is 0V. Using this implementation, the modem module sets a power-down voltage for the SIM module, allowing the SIM module to power down.

[0022] In one implementation, the application layer includes an aging application package. The application layer sends a first request message to the modem module through a first interface, including: the aging application package sending the first request message to the modem module through the first interface. Using this implementation, the application layer can specifically interact with the modem module through the aging application package.

[0023] Secondly, embodiments of this application provide an electronic device, including: a processor and a memory; the memory stores program instructions, which, when executed by the processor, cause the electronic device to perform the methods described in the first aspect and any of the implementations above.

[0024] Thirdly, embodiments of this application provide a chip system, including: a memory and a processor; the memory stores program instructions, which, when executed by the processor, cause the chip system to perform the methods described in the first aspect and any of the implementations above.

[0025] Fourthly, embodiments of this application provide a computer storage medium storing program instructions that, when executed on a computer, cause the computer to perform the methods described in the first aspect and any of the implementations above.

[0026] Fifthly, embodiments of this application provide a computer program product that, when run on an electronic device, causes the electronic device to execute the methods described in the first aspect and any of its implementations above.

[0027] Understandably, the electronic devices, computer-readable storage media, and computer program products provided in the above aspects are all applied to the corresponding methods provided above. Therefore, the beneficial effects they can achieve can be referred to the beneficial effects in the corresponding methods provided above, and will not be repeated here. Attached Figure Description

[0028] Figure 1 This is a structural diagram of a SIM module;

[0029] Figure 2 This is a schematic diagram illustrating a connection method between a modem module and a SIM module.

[0030] Figure 3 This is a schematic diagram of the hardware structure of the electronic device provided in the embodiments of this application;

[0031] Figure 4 This is a schematic diagram of the software structure of the electronic device provided in the embodiments of this application;

[0032] Figure 5 This is the first flowchart of a SIM module power-on method provided in an embodiment of this application;

[0033] Figure 6 This is a schematic diagram illustrating a scenario where the Modem module maintains the power-on state of the SIM module, as provided in an embodiment of this application.

[0034] Figure 7 This is a schematic diagram of the first interface structure provided in an embodiment of this application;

[0035] Figure 8 This is a second flowchart of a SIM module power-on method provided in an embodiment of this application;

[0036] Figure 9 This is the third flowchart of a SIM module power-on method provided in an embodiment of this application;

[0037] Figure 10 This is the fourth flowchart of a SIM module power-on method provided in an embodiment of this application;

[0038] Figure 11 This is a schematic diagram of a SIM module power-on device provided in an embodiment of this application. Detailed Implementation

[0039] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings.

[0040] In the description of this application, unless otherwise stated, " / " means "or," for example, A / B can mean A or B. The "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone. Furthermore, "at least one" means one or more, and "multiple" means two or more. The terms "first," "second," etc., do not limit the quantity or order of execution, and "first," "second," etc., do not necessarily imply differences.

[0041] It should be noted that, in this application, the terms "exemplary" or "for example" are used to indicate that something is being described as an example, illustration, or illustration. Any embodiment or design described as "exemplary" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or design solutions. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0042] The application scenarios of the embodiments of this application will be described below first.

[0043] A SIM card is a crucial component of electronic devices during communication. Specifically, a SIM card verifies a user's identity and authorizes the device to access the mobile network. It can store contact information such as phone numbers and names. It can store received text messages, allowing users to view and send messages on different devices. It can store personal settings such as voicemail number and network settings. A SIM card allows roaming and access to local mobile networks in different countries and regions. Furthermore, it supports data encryption and authentication, enhancing the security of mobile communications.

[0044] SIM cards are typically provided by network operators. After the SIM card is inserted into the SIM module of an electronic device, the SIM module is assembled, and the electronic device can establish a communication connection with the SIM module through the modem module.

[0045] Modem modules in electronic devices are typically integrated on the motherboard using a System on a Chip (SoC), and their specific structure includes the following:

[0046] 1. Modem Chip: A modem typically consists of a single chip used to handle communication and data transmission between the electronic device and the mobile network. This chip usually comprises a baseband processor (BP) and related circuitry. The BP is the core component of the modem chip. During communication between the electronic device and the mobile network, the BP is responsible for handling the communication between the physical layer and the data link layer of the mobile network. It executes a series of communication protocols and algorithms to perform functions such as data modulation and demodulation, communication protocol conversion, and signal processing.

[0047] 2. Radio Frequency (RF) Transceiver: An RF transceiver is an interface device between the modem and the antenna of an electronic device. It is used to convert the digital signals generated by the BP into radio frequency signals suitable for transmission to the antenna, and at the same time, convert the received radio frequency signals into digital signals that the BP can process.

[0048] 3. RF front-end module: The RF front-end module includes components such as power amplifiers, filters, and mixers, which are used to process and adjust the gain, frequency, amplitude, and other characteristics of radio frequency signals to ensure signal quality and stability.

[0049] The modem module is connected to the SIM module and can control the power-on status of the SIM module.

[0050] Figure 1 This is a schematic diagram of the structure of a SIM module.

[0051] like Figure 1 As shown, a SIM module typically includes a SIM card slot 10, which can be located on the side of the electronic device or in other positions. The SIM module also includes a SIM card tray 11 that matches the SIM card slot 10, for embedding a SIM card 20. Thus, the user can insert the SIM card 20 into the SIM card tray 11 and then insert the SIM card tray 11 into the SIM card slot 10. This completes the assembly of the SIM module, enabling the electronic device to communicate via mobile networks based on the connection between the modem module and the SIM module.

[0052] Figure 2 This is a schematic diagram illustrating a connection method between a modem module and a SIM module.

[0053] like Figure 2As shown, the Modem chip 12 in the Modem module can be connected to the SIM card slot 10 through the interface circuit 13 in the Modem module. One end of the interface circuit 13 is a physical interface circuit connected to the SIM card slot 10, and the other end is a logical interface circuit connected to the Modem chip 12. The physical interface circuit is a contact-type interface circuit. When the SIM card 20 is inserted into the SIM card tray 11 and the SIM card tray 11 is inserted into the SIM card slot 10, the metal contact points in the SIM card slot 10 connect with the metal contact pieces on the SIM card 20, forming a contact-type interface circuit. The logical interface circuit is an interface circuit for data exchange and communication at the software level. This interface circuit can transmit the instructions and data of the Modem chip 12 to the SIM card 20 and transmit the responses and data from the SIM card 20 back to the Modem chip 12. In this way, the Modem module and the SIM module can achieve data interaction.

[0054] During the manufacturing process of electronic devices, electrostatic discharge (ESD) damage may occur to the SIM modules at production line stations during their fabrication. ESD damage is the adverse effect of static charge accumulating on the surface of an object on the object and its surrounding environment. It can be caused by various factors such as material friction, human friction, and ambient humidity. For example, the metal contact points within the SIM card slot 10 of the SIM module may experience ESD damage due to ambient humidity.

[0055] Electrostatic discharge (ESD) damage may not immediately cause functional malfunctions or obvious physical damage to electronic devices. Instead, it causes minor damage to internal components. This damage is usually detectable only after the SIM module is powered on by the modem module. However, the SIM card 20 is matched by the user at the factory. Before the SIM card 20 is matched, the modem module typically cannot power on the SIM module. Therefore, if an ESD damage occurs to the SIM module, the factory cannot detect it before shipment. SIM modules with ESD damage may be shipped simultaneously with those without.

[0056] Thus, if a SIM module with electrostatic damage is manufactured, after a user inserts a SIM card 20 into the SIM card slot 10 of the SIM module and uses it for a certain period of time, the electrostatic damage will gradually accumulate during the user's use, which may easily lead to the SIM module being damaged and causing the SIM card 20 to fail to be recognized.

[0057] To prevent SIM modules with electrostatic discharge damage from leaving the factory, this application provides a method for powering on a SIM module.

[0058] The SIM module power-on method provided in this application can be applied to electronic devices. These electronic devices include, but are not limited to, mobile phones, tablets, personal computers, workstations, large-screen devices (e.g., smart screens, smart TVs), wearable devices (e.g., smart bracelets, smartwatches), handheld game consoles, home game consoles, virtual reality devices, augmented reality devices, mixed reality devices, and in-vehicle smart terminals.

[0059] Figure 3 This is a schematic diagram of the hardware structure of the electronic device provided in the embodiments of this application.

[0060] like Figure 3 As shown, the electronic device 100 may include a processor 110, a memory 120, a universal serial bus (USB) interface 130, a charging management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2, a mobile communication module 150, a wireless communication module 160, a display screen 170, and a subscriber identification module (SIM) card interface 180, etc.

[0061] It is understood that the structures illustrated in the embodiments of this application do not constitute a specific limitation on the electronic device 100. In other embodiments of this application, the electronic device 100 may include more or fewer components than illustrated, or combine some components, or split some components, or have different component arrangements. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0062] Processor 110 may include one or more processing units, such as application processors (APs), modem processors, graphics processing units (GPUs), image signal processors (ISPs), controllers, video codecs, digital signal processors (DSPs), baseband processors, and / or neural network processing units (NPUs). These different processing units may be independent devices or integrated into one or more processors.

[0063] The memory 120 can be used to store computer executable program code, including instructions. The memory 120 may include a program storage area and a data storage area. The program storage area may store the operating system, at least one application program required for a function (such as sound playback, image playback, etc.), etc. The data storage area may store data created during the use of the electronic device 100 (such as audio data, phonebook, etc.). Furthermore, the memory 120 may include high-speed random access memory, and may also include non-volatile memory, such as at least one disk storage device, flash memory device, universal flash storage (UFS), etc. The processor 110 executes various functional applications and data processing of the electronic device 100 by running instructions stored in the memory 120 and / or instructions stored in memory located within the processor.

[0064] USB port 130 is a USB standard compliant interface, specifically a Mini USB port, Micro USB port, USB Type-C port, etc. USB port 130 can be used to connect a charger to charge electronic device 100, and can also be used for data transfer between electronic device 100 and peripheral devices. It can also be used to connect headphones for audio playback. This interface can also be used to connect other electronic devices, such as AR devices.

[0065] It is understood that the interface connection relationships between the modules illustrated in the embodiments of this application are merely illustrative and do not constitute a structural limitation on the electronic device 100. In other embodiments of this application, the electronic device 100 may also employ different interface connection methods or combinations of multiple interface connection methods as described in the above embodiments.

[0066] The charging management module 140 receives charging input from a charger, which can be a wireless charger or a wired charger. In some wired charging embodiments, the charging management module 140 receives charging input from the wired charger via a USB interface 130. In some wireless charging embodiments, the charging management module 140 receives wireless charging input via the wireless charging coil of the electronic device 100. While charging the battery 142, the charging management module 140 can also supply power to the electronic device via the power management module 141. The power management module 141 connects the battery 142, the charging management module 140, and the processor 110. The power management module 141 receives input from the battery 142 and / or the charging management module 140, and supplies power to the processor 110, memory 120, display screen 170, and wireless communication module 160, etc.

[0067] The wireless communication function of electronic device 100 can be realized through antenna 1, antenna 2, mobile communication module 150, wireless communication module 160, modem processor and baseband processor, etc.

[0068] Antenna 1 and antenna 2 are used to transmit and receive electromagnetic wave signals. Each antenna in electronic device 100 can be used to cover one or more communication frequency bands. Different antennas can also be multiplexed to improve antenna utilization. For example, antenna 1 can be multiplexed as a diversity antenna for a wireless local area network. In some other embodiments, the antennas can be used in conjunction with tuning switches.

[0069] The mobile communication module 150 can provide solutions for wireless communication, including 2G / 3G / 4G / 5G, applied to the electronic device 100. The mobile communication module 150 may include at least one filter, switch, power amplifier, low noise amplifier (LNA), etc. The mobile communication module 150 can receive electromagnetic waves via antenna 1, and perform filtering, amplification, and other processing on the received electromagnetic waves before transmitting them to a modem processor for demodulation. The mobile communication module 150 can also amplify the signal modulated by the modem processor and convert it into electromagnetic waves for radiation via antenna 1. In some embodiments, at least some functional modules of the mobile communication module 150 may be housed in the processor 110. In some embodiments, at least some functional modules of the mobile communication module 150 and at least some modules of the processor 110 may be housed in the same device.

[0070] The modem processor may include a modulator and a demodulator. The modulator modulates the low-frequency baseband signal to be transmitted into a mid-to-high frequency signal. The demodulator demodulates the received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then transmits the demodulated low-frequency baseband signal to the baseband processor for processing. After processing by the baseband processor, the low-frequency baseband signal is transmitted to the application processor. The application processor outputs a sound signal through an audio device or displays an image or video through the display screen 170. In some embodiments, the modem processor may be a separate device. In other embodiments, the modem processor may be independent of the processor 110 and may be housed in the same device as the mobile communication module 150 or other functional modules.

[0071] The wireless communication module 160 can provide solutions for wireless communication applications on the electronic device 100, including wireless local area networks (WLANs) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), and infrared (IR) technologies. The wireless communication module 160 can be one or more devices integrating at least one communication processing module. The wireless communication module 160 receives electromagnetic waves via antenna 2, performs frequency modulation and filtering of the electromagnetic wave signals, and sends the processed signal to processor 110. The wireless communication module 160 can also receive signals to be transmitted from processor 110, perform frequency modulation and amplification, and convert them into electromagnetic waves for radiation via antenna 2.

[0072] In some embodiments, antenna 1 of electronic device 100 is coupled to mobile communication module 150, and antenna 2 is coupled to wireless communication module 160, so that electronic device 100 can communicate with networks and other devices through wireless communication technology.

[0073] Electronic device 100 implements display functions through a GPU, a display screen 170, and an application processor. The GPU is a microprocessor for image processing, connected to the display screen 170 and the application processor. The GPU is used to perform mathematical and geometric calculations and for graphics rendering. Processor 110 may include one or more GPUs, which execute program instructions to generate or modify display information.

[0074] The display screen 170 is used to display images, videos, etc. The display screen 170 includes a display panel.

[0075] The SIM card interface 180 is used to connect a SIM card. The SIM card can be inserted into or removed from the SIM card interface 180 to make contact with and separate from the electronic device 100. The electronic device 100 can support one or N SIM card interfaces, where N is a positive integer greater than 1. The SIM card interface 180 can support Nano SIM cards, Micro SIM cards, SIM cards, etc. Multiple cards can be inserted into the same SIM card interface 180 simultaneously. The multiple cards can be of the same or different types. The SIM card interface 180 is also compatible with different types of SIM cards. The SIM card interface 180 is also compatible with external memory cards. The electronic device 100 interacts with the network through the SIM card to realize functions such as calls and data communication. In some embodiments, the electronic device 100 uses an eSIM, i.e., an embedded SIM card. The eSIM card can be embedded in the electronic device 100 and cannot be separated from the electronic device 100.

[0076] The software system of electronic device 100 can adopt a layered architecture, event-driven architecture, microkernel architecture, microservice architecture, or cloud architecture. This application embodiment uses the layered architecture Android system as an example to exemplify the software structure of electronic device 100.

[0077] Figure 4 This is a schematic diagram of the software structure of the electronic device provided in the embodiments of this application.

[0078] like Figure 4 As shown, the layered architecture divides the software into several layers, each with a clear role and division of labor. Layers communicate with each other through software interfaces. In some embodiments, the Android system is divided into four layers based on a Telephony architecture, from top to bottom: the application (APP) layer, the framework layer, the hardware abstraction layer (HAL), and the hardware layer.

[0079] The application layer can include a series of application packages.

[0080] like Figure 4 As shown, the application package may include applications such as battery management, camera, gallery, calendar, call, map, navigation, music, video, SMS, and games. In this embodiment, the application package also includes an aged Android Application Package (APK).

[0081] The application layer depends on the framework layer. The application layer needs to access the business modules of the framework layer to present specific functions to the user. When the operating system starts, the application layer is run and the framework layer is created. After the framework layer is created, the framework layer and the application layer are run in the same process.

[0082] The framework layer provides the application programming interface (API) and programming framework for applications in the application layer. The framework layer includes some predefined functions.

[0083] like Figure 4 As shown, the framework layer may include a window manager, an input manager, a sensor manager, a phone manager, a resource manager, a notification manager, etc.

[0084] The input manager can be used to listen for user input events, such as clicks and swipes performed by the user's finger on the display screen 170 of the electronic device 100. By listening to input events, the electronic device 100 can determine whether it is in use.

[0085] The sensor manager is used to monitor data returned by various sensors in an electronic device, such as motion sensor data, proximity sensor data, and temperature sensor data. Using this data, the electronic device can determine if it is experiencing vibrations or if the display screen is obstructed.

[0086] The hardware abstraction layer provides a unified interface to the upper layers, enabling upper-layer software to easily interact with the lower-layer hardware, thereby achieving decoupling between hardware and software and cross-platform compatibility.

[0087] The Hardware Abstraction Layer (HAL) can be used to run a portion of the Radio Interface Layer (RIL). Specifically, the RIL layer can include two parts: RILJ and RILC. RILJ runs in the framework layer based on the Java language, while RILC runs in the hardware abstraction layer based on the C or C++ language. This embodiment only illustrates the RILC example. The RILC can provide an interface for operating the Modem module and communicate with it. The main function of the RILC is to convert requests initiated by the upper-layer application into commands that the Modem module can understand, and to pass the Modem module's response back to the upper-layer application. In this way, the RILC and the Modem module can complete the scheduling and management of mobile communication functions.

[0088] The hardware layer includes the Modem module.

[0089] It is understood that the structures illustrated in the embodiments of this application do not constitute a specific limitation on the electronic device 100. In other embodiments of this application, the electronic device may include more or fewer components than illustrated, or combine some components, or split some components, or have different component arrangements. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0090] Figure 5 This is the first flowchart of a SIM module power-on method provided in an embodiment of this application.

[0091] like Figure 5 As shown, the method includes the following steps S101-S105.

[0092] In step S101, in response to the power-on of the electronic device, the Modem module powers on the SIM module.

[0093] The modem module in this application embodiment has the structure described in the above embodiments, including the modem chip, RF transceiver, and RF front-end module. The modem module may also include more or fewer structures than those described in the above embodiments, which will not be elaborated in this application embodiment.

[0094] It should be noted that the embodiments of this application are conducted during the aging test phase of the electronic device. During the aging test phase, after the electronic device is powered on, aging tests can be performed on each component.

[0095] Aging testing is a crucial stage in the production of electronic devices. Aging testing simulates the environmental conditions and loads faced by electronic devices during long-term use, subjecting them to prolonged operation, stress, and other related tests to evaluate their reliability, stability, and durability.

[0096] Specifically, in the aging test phase, based on pre-set test conditions and parameters, such as temperature, humidity, voltage, and current, electronic devices run continuously in a simulated usage environment for a period of several weeks, days, or even longer. This allows for the simulation of the lifespan of various components of the electronic device.

[0097] The embodiments of this application simulate the process of the Modem module powering on the SIM module after leaving the factory during the aging test phase.

[0098] It should be noted that the process of the modem module powering on the SIM module is not a process in which the modem module directly provides power-on voltage to the SIM module. Instead, it is a process in which the modem module sets the power-on voltage of the SIM module, and then controls the power control chip to provide voltage to the SIM module based on the set power-on voltage.

[0099] Figure 6 This is a schematic diagram illustrating a scenario where the Modem module keeps the SIM module powered on, as provided in an embodiment of this application.

[0100] like Figure 6 As shown, the interface circuit 13 in the Modem module is connected to the power control chip 30. The Modem module controls the power control chip 30 to supply power to the metal contact point (also called pin) 131 in the SIM card slot 10. The SIM card slot 10 typically includes multiple pins such as the power supply pin VSIM, the clock pin SIMCLKC, the work reset pin SIMRSTC, and the signal detection pin SIMDEX. After the electronic device starts up, it performs self-tests and initializations on various components. When testing the SIM module, the electronic device checks whether the SIM card 20 is inserted based on the information provided by the SIM module. If the SIM card 20 is correctly inserted, the SIM module can establish a data connection with the Modem module and perform functions such as internet access and communication. The Modem module can control the power control chip 30 to continuously supply power to pin 131. If the SIM card 20 is not inserted, or the information of the SIM card 20 cannot be correctly identified and read, the Modem module only controls the power control chip 30 to supply power to pin 131 for a moment when the electronic device starts up, and then controls the power control chip 30 to stop supplying power to pin 131. In this way, the SIM card slot 10 cannot be powered on. Since the SIM card 20 is inserted into the electronic device by the user after it leaves the factory, under normal circumstances, if the SIM card 20 is not inserted before the electronic device leaves the factory, the SIM card slot 10 cannot be fully assembled, and the modem module cannot keep the SIM module powered on. Based on this, the embodiments of this application provide a method in which the modem module can keep the SIM module powered on even when the SIM card slot 10 cannot be fully assembled.

[0101] In step S102, the application layer sends a first request message to the modem module through the first interface. The first interface is the interface between the application layer and the modem module. The first request message includes a first power-on configuration, which includes that the power-on voltage of the SIM module is a first voltage.

[0102] In one implementation, the application layer includes an aging APK, which is a collection of software tools used for aging tests of electronic devices. The aging APK calls the interfaces of various hardware functional modules and runs in a loop. When a hardware functional module fails, the aging APK records the failure in the electronic device. The aging APK can send a first request message to the Modem module through a first interface.

[0103] In one implementation, the first interface can be RILC, and the first interface may include a first sub-interface and a second sub-interface.

[0104] Figure 7 This is a schematic diagram of the first interface structure provided in the embodiments of this application.

[0105] like Figure 7 As shown, RILC can include multiple library files, such as Rild.so, Ril.so, Qcril.so, and Qmi.so.

[0106] Rild.so is the dynamic link library file for the Radio Interface Layer Daemon (Rild). Based on Rild.so, electronic devices can run Rild, and the framework layer can send requests through Rild.

[0107] Ril.so is a dynamic link library file for the Radio Interface Layer Library (Ril). Based on Ril.so, Ril dispatches requests received by Rild and responds to the request processing results returned by the underlying layer and messages actively reported by the Modem.

[0108] Qcril.so is The dynamic link library file for the Qualcomm Radio Interface Layer (Qcril). Qcril is... The company provides an interface for implementing Ril's processing mechanism, which can interact with... The chip platform communicates to process requests received by Ril and responds to the request processing results returned by the underlying layer and the messages actively reported by the Modem module.

[0109] In one implementation, the first sub-interface is Qcril.

[0110] Qmi.so is The dynamic link library file for the Qualcomm Mobile Station Modem Interface (QMI). QMI is... The company provides a message interface protocol. Qcril can use Qmi as the underlying message passing mechanism to pass requests to the Modem module, thus enabling communication between Qcril and the Modem module.

[0111] It is important to note that Qmi is not only used for communication between Qcril and the Modem module, but also for communication between other modules, such as mobile data and Global Positioning System (GPS). Qmi provides a standardized messaging mechanism that enables effective collaboration and interaction between different modules.

[0112] In one implementation, the second sub-interface is Qmi.

[0113] In this way, the aging APK can send a first request message to the RILC with Qcril and Qmi.

[0114] It should be noted that the first interface provided in this application embodiment is only for illustrative purposes, and the first interface may be used in the implementation of this application. The interface provided by the company can also be an interface provided by other manufacturers. This application does not limit the specific type of the first interface in its embodiments. In the following embodiments of this application, only the first sub-interface Qcril and the second sub-interface Qmi are used as examples for illustration.

[0115] Figure 8 This is the second flowchart of a SIM module power-on method provided in an embodiment of this application.

[0116] like Figure 8 As shown, step S102 may include steps S1021-S1023.

[0117] Step S1021: The application layer sends a first request message to the first sub-interface.

[0118] For example, the aging APK can send a first request message to Qcril. In a specific implementation, the aging APK creates the first request message and sets a first power-on configuration within the first request message, such that the first power-on configuration includes a first voltage for powering on the SIM module.

[0119] According to international industry standards such as ISO 7816 and GSM 11.11, the power supply voltage of a SIM card should support three power supply voltages: 1.8V, 3V, and 5V. The SIM card should at least be able to operate on electronic devices with 1.8V and 3V. Therefore, to simulate the powered-on state of the SIM module when the SIM card is inserted, the first voltage may include at least one of 1.8V or 3V. In the embodiments of this application, the first voltage includes, but is not limited to, the values ​​mentioned above; the first voltage may also include 5V. This application does not limit the specific value of the first voltage.

[0120] In step S1022, the first sub-interface converts the first request message into a first format and sends it to the second sub-interface. The first format matches the type of the second sub-interface.

[0121] For example, Qcril converts the first request message into the first format and then sends it to Qmi.

[0122] Specifically, Qcril can encapsulate a first request message into a first format. Based on the request type and parameters of the first request message, Qcril creates a corresponding first format, which can be a Qmi message structure. The Qmi message structure includes a header and a body. The header contains information such as the message ID, and the body contains the specific request data. Qcril needs to populate the relevant data into the body of the Qmi message structure according to the parameters of the first request message. This process may involve parameter encoding, packaging, and other processing. If the first request message contains extended data, Qcril also needs to add the extended data to the Qmi message structure. The extended data is typically used to transmit associated additional information. In this way, Qcril completes the format conversion of the first request message.

[0123] Step S1023: The second sub-interface sends a first request message to the Modem module.

[0124] For example, Qmi sends a first request message to the Modem module. Specifically, Qmi can send the first notification message to Qmi based on inter-process communication (IPC) or other underlying mechanisms.

[0125] In step S103, the Modem module responds to the first request message, determines the first power-on configuration, and sends a first response message to the first interface.

[0126] In this module, the Modem module responds to the first request message, determines the first power-on configuration as 1.8V or 3V, and sends the first response message to the RILC after the first power-on configuration is successfully set.

[0127] It should be noted that at this point, the Modem module only sets the power-on voltage and does not actually power on. The first response message is used to notify the RILC that the first power-on configuration has been successfully set.

[0128] Further as Figure 8 As shown, step S103 includes steps S1031-S1032.

[0129] In step S1031, the Modem module converts the first response message into the first format and then sends it to the second sub-interface.

[0130] The process by which the Modem module converts the first response message into a first format is the process by which the Modem module creates a first response message with a Qmi message structure. This process can be referenced in the section on how Qcril converts a first request message into a first format, and will not be elaborated upon here. After converting the first response message into the first format, the Modem module sends the first response message to Qmi through a communication interface formed based on IPC or other underlying mechanisms.

[0131] In step S1032, the second sub-interface converts the first response message into a second format and sends it to the first sub-interface. The second format matches the type of the first sub-interface.

[0132] For example, Qmi converts the first response message into a second format before sending it to Qcril. Specifically, after receiving the first response message in the first format, Qmi needs to parse it to obtain the second format, which is a format that Qcril can understand. This parsing process includes decoding the Qmi message structure, removing the message header, and parsing the message body, so that Qcril can recognize the parsed first response message.

[0133] In step S104, the first interface responds to the first response message by sending a power-on message to the Modem module.

[0134] For example, RILC responds to the first acknowledgement message by sending a power-on message to the Modem module.

[0135] Further as Figure 8 As shown, step S104 may include steps S1041-S1042.

[0136] In step S1041, the first sub-interface responds to the first response message, creates a power-on message with a first format, and sends it to the second sub-interface.

[0137] For example, in response to the first response message, Qcril creates a power-on message with a first format and sends it to Qmi. The process of Qcril sending the power-on message to Qmi can be referred to the process of Qcril sending the first request message to Qmi described above, and will not be repeated in this embodiment.

[0138] In step S1042, the second sub-interface sends a power-on message to the Modem module.

[0139] For example, Qmi sends a power-on message to the modem module. The process of Qmi sending a power-on message to the modem module can be referred to the process of Qmi sending a first request message to the modem module described above, and will not be repeated in this embodiment.

[0140] In step S105, the Modem module responds to the power-on message, adjusts the power-on voltage of the SIM module to the first voltage based on the first power-on configuration, and maintains the power-on state of the SIM module.

[0141] In the specific implementation, the Modem module responds to the power-on message and obtains the first power-on configuration. If the first power-on configuration is 1.8V, the Modem module adjusts the power-on voltage of the SIM module to 1.8V and maintains it at 1.8V. If the first power-on configuration is 3V, the Modem module adjusts the power-on voltage of the SIM module to 3V and maintains it at 3V.

[0142] Since the modem module does not directly provide power to the SIM module, but rather relies on the power control chip, the modem module can send a first request signal to the processor of the electronic device to request the processor to issue a power supply command to the power control chip. After receiving the first request signal from the modem module, the processor issues a power supply command to the power control chip, so that the power control chip continuously supplies power to the SIM module according to the power supply command.

[0143] For some advanced power control chips, a microprocessor can be integrated on the power control chip. In this way, the modem module can directly send a first request signal to the power control chip to request power to the SIM module. This allows the SIM module to remain powered on.

[0144] In a specific implementation, step S105 may include steps S1051-S1053.

[0145] Step S1051: The Modem module determines the target scenario in which the SIM module is located. The target scenario includes a SIM card tray inserted into the SIM module, and no SIM card embedded in the SIM card tray, and no SIM card tray inserted into the SIM module.

[0146] Step S1052: If the target scenario is that a SIM card tray is inserted into the SIM module and no SIM card is embedded in the SIM card tray, the Modem module keeps the SIM module powered on.

[0147] Step S1053: If the target scenario is that no SIM card tray is inserted into the SIM module, the Modem module keeps the SIM module powered on.

[0148] In other words, when no SIM card is inserted before the electronic device leaves the factory, there are only two target scenarios. The first target scenario is that an empty card tray (i.e., a SIM card tray without an embedded SIM card) is inserted into the SIM module, and the second scenario is that no card tray is inserted into the SIM module. The embodiments of this application allow the modem module to keep the SIM module powered on in both of these target scenarios.

[0149] Electronic devices can determine that the SIM module is in at least one of the above-mentioned target scenarios in the following ways.

[0150] In one implementation, the electronic device is equipped with an indicator light to display the status of the SIM card slot. If the SIM card is correctly inserted into the SIM card slot, the indicator light is on; if the SIM card is not inserted into the SIM card slot or the electronic device cannot correctly identify and read the SIM card information, the indicator light is off or flashing. The electronic device can detect the current status of the indicator light, and when the indicator light is off, the electronic device can determine that the SIM module is in at least one of the aforementioned target scenarios.

[0151] In one implementation, the electronic device can provide an interface to query the SIM card status. By calling the corresponding interface, the electronic device can determine whether the SIM card has been correctly inserted into the SIM card slot. If the electronic device cannot find the SIM card status, it can determine that the SIM module is in at least one of the aforementioned target scenarios.

[0152] Electronic devices can provide more ways to detect the target scenario in which the SIM module is located, which will not be elaborated in the embodiments of this application. When the electronic device determines that the SIM module is in at least one of the above-mentioned target scenarios, it can keep the SIM module powered on through the modem module.

[0153] After step S105, step S106 is also included.

[0154] In step S106, the Modem module sends a first feedback message to the application layer through the first interface based on the power-on status of the SIM module. The first feedback message includes whether the SIM module is faulty.

[0155] For example, the Modem module can send the first feedback message to the aging APK via RILC based on the power-on status of the SIM module.

[0156] Further as Figure 8 As shown, step S106 may include steps S1061-S1063.

[0157] In step S1061, the Modem module creates a first feedback message with a first format based on the power-on state of the SIM module and sends it to the second sub-interface.

[0158] For example, the modem module creates a first feedback message with a first format based on the SIM's power-on state and sends it to Qmi. This process can be referenced in the Qcril documentation on converting a first request message into a first format, and will not be elaborated upon here. After converting the first feedback message into the first format, the modem module sends the first feedback message to Qmi via a communication interface formed based on IPC or other underlying mechanisms.

[0159] In step S1062, the second sub-interface converts the first feedback message into a second format and then sends it to the first sub-interface.

[0160] For example, Qmi converts the first feedback message into a second format and then sends it to Qcril. This process can be found in the documentation on Qmi sending the first response message to Qcril, and will not be elaborated upon here.

[0161] Step S1063: The first sub-interface sends a first feedback message to the application layer.

[0162] For example, Qcril sends a first feedback message to the aging APK. Specifically, after Qmi sends the first feedback message to Qcril in a Qmi message structure, Qcril parses the Qmi message structure to obtain the message body corresponding to the first feedback message. Qcril can then encapsulate this message body into a second format, which can be a response message structure. The response message structure can include a response code, response data, and other relevant fields. The response code can indicate the status of the power-on result, and the response data can contain detailed information about the execution result. In this way, Qcril can send the first feedback message with the response message structure to the aging APK based on the IPC mechanism.

[0163] After receiving the first feedback message, the aging APK parses the response message structure corresponding to the first feedback message, extracts the response code and response data, and determines the status and detailed information of the first feedback message based on the response code and response data.

[0164] In this embodiment, the modem keeps the SIM module powered on, which allows it to determine whether a power-on failure will occur after the SIM module has been powered on for an extended period. The modem then feeds the power-on result back to the application layer. This allows the aging APK to provide feedback to the tester regarding the presence of a power-on failure in the SIM module. If a power-on failure is detected, the tester can prevent the defective SIM module from leaving the factory.

[0165] After the Modem module completes the power-on process for the SIM module, it is also necessary to perform a power-off process for the SIM module.

[0166] Figure 9 This is the third flowchart of a SIM module power-on method provided in an embodiment of this application.

[0167] like Figure 9 As shown, after step S106, steps S201-S204 are also included.

[0168] In step S201, the application layer responds to the first feedback message by sending a second request message to the Modem module through the first interface. The second request message includes a second power-on configuration, which includes that the power-on voltage of the SIM module is a second voltage.

[0169] For example, the aging APK sends a second request message to the Modem module via RILC.

[0170] Figure 10 This is the fourth flowchart of a SIM module power-on method provided in an embodiment of this application.

[0171] like Figure 10 As shown, step S201 may include steps S2011-S2013.

[0172] In step S2011, the application layer sends a second request message to the first sub-interface.

[0173] For example, the aging APK can send a second request message to Qcril. In a specific implementation, the aging APK creates the second request message and sets a second power-on configuration within the second request message, such that the second power-on configuration includes a second voltage for powering down the SIM module.

[0174] The second voltage can be 0V, so that the modem module can adjust the power-on voltage of the SIM module to 0V, thereby powering down the SIM module.

[0175] In step S2012, the first sub-interface converts the second request message into the first format and then sends it to the second sub-interface.

[0176] For example, Qcril converts the second request message into the first format and then sends it to Qmi. This process can be referred to in step S1022, and will not be described in detail here.

[0177] In step S2013, the second sub-interface sends a second request message to the Modem module.

[0178] For example, Qmi sends a second request message to the Modem module. This process can be referred to in step S1023, and will not be described in detail here.

[0179] In step S202, the Modem module responds to the second request message, determines the second power-on configuration, and sends a second response message to the first interface.

[0180] In response to the second request message, the Modem module determines that the second power-on configuration is 0V, and after the second power-on configuration is successfully set, sends a second response message to the RILC.

[0181] It should be noted that at this point, the Modem module sets the power-on voltage to 0 and does not actually power off. The second response message is used to notify the RILC that the second power-on configuration has been successfully set.

[0182] In specific implementation, step S202 includes steps S2021-S2022.

[0183] In step S2021, the Modem module converts the second response message into the first format and then sends it to the second sub-interface.

[0184] For example, the Modem module converts the second response message into the first format and then sends it to Qmi. This step can be found in step S1031, and will not be described in detail here.

[0185] In step S2022, the second sub-interface converts the second response message into a second format and then sends it to the first sub-interface.

[0186] For example, Qmi converts the second response message into a second format and then sends it to Qcril. This process can be referred to in step S1032, and will not be described in detail here.

[0187] In step S203, the first interface responds to the second response message by sending a power-down message to the Modem module.

[0188] For example, RILC responds to the second acknowledgment message by sending a power-down message to the Modem module.

[0189] Step S203 includes steps S2031-S2032.

[0190] In step S2031, the first sub-interface responds to the second response message by creating a power-down message with a first format and sending it to the second sub-interface.

[0191] For example, in response to the second reply message, Qcril creates a power-down message with a first format and sends it to Qmi. This process can be referred to in step S1041, which will not be elaborated upon here.

[0192] In step S2032, the second sub-interface sends a power-off message to the Modem module.

[0193] For example, Qmi sends a power-off message to the Modem module. This process can be referred to in step S1042, and will not be described in detail here.

[0194] In step S204, the Modem module responds to the power-down message, adjusts the power-on voltage of the SIM module to the second voltage based on the second power-on configuration, and powers down the SIM module according to the second voltage.

[0195] In the specific implementation, the Modem module responds to the power-down message and obtains the second power-on configuration as 0V, so that the Modem module can power down the SIM module.

[0196] Correspondingly, the modem does not directly provide the power-down voltage to the SIM module. Instead, the power control chip adjusts the SIM module's voltage. Therefore, the modem module can send a second request signal to the electronic device's processor, requesting the processor to issue a power-down command to the power control chip. Upon receiving the second request signal, the processor issues a power-down command to the power control chip, causing it to adjust the SIM module's power-on voltage to 0V, thus stopping power supply to the SIM module. For some advanced power control chips, a microprocessor can be integrated. In this case, the modem module can also directly send a second request signal to the power control chip, requesting it to adjust the SIM module's power-on voltage to 0V, stopping power supply to the SIM module. This allows the SIM module to power down.

[0197] It should be noted that the Modem module can power down the SIM module in any of the target scenarios described in the foregoing embodiments, and the power-down process is not limited by the target scenario.

[0198] In one implementation, step S204 is followed by step S205.

[0199] In step S205, the Modem module sends a second feedback message to the application layer through the first interface based on the power-off state of the SIM module. The second feedback message includes whether the SIM module has been powered off.

[0200] For example, the modem module can send a second feedback message to the aging APK via RILC based on the power-off state of the SIM module.

[0201] Step S205 may include steps S2051-S2053.

[0202] In step S2051, the Modem module creates a second feedback message with a first format based on the power-down state of the SIM module and sends it to the second sub-interface.

[0203] For example, the modem module creates a second feedback message with a first format based on the SIM's power-off state and sends the second feedback message to the Qmi. This process can be referred to in step S1061, and will not be described in detail here.

[0204] In step S2052, the second sub-interface converts the second feedback message into a second format and then sends it to the first sub-interface.

[0205] For example, Qmi converts the second feedback message into a second format and then sends it to Qcril. This process can be found in step S1062, and will not be described in detail here.

[0206] In step S2053, the first sub-interface sends a second feedback message to the application layer.

[0207] For example, Qcril sends a second feedback message to the aging APK. This process can be found in step S1063, which will not be described in detail here.

[0208] After receiving the second feedback message, the aging APK parses the response message structure corresponding to the second feedback message, extracts the response code and response data, and returns the status and detailed information of the second feedback message based on the response code and response data.

[0209] In this way, the aging APK can provide feedback to the tester on the power-down status of the SIM module.

[0210] The aging test process ends after the modem module powers down the SIM module.

[0211] The technical solution illustrated in this application embodiment keeps the SIM module powered on during the aging test. This way, if the SIM module has electrostatic discharge (ESD) damage, the prolonged power-on process will trigger ESD; conversely, if the SIM module does not have ESD damage, it will maintain a normal state during the same period. Based on this, SIM modules with ESD damage can be identified and prevented from leaving the factory.

[0212] The above primarily describes the solutions provided by the embodiments of this application from the perspective of electronic devices. It is understood that, in order to achieve the above functions, the electronic device includes corresponding hardware structures and / or software modules for executing each function. Those skilled in the art should readily recognize that the communication module aging test method steps described in conjunction with the embodiments disclosed in this application can be implemented in hardware or a combination of hardware and computer software. Whether a function is executed in hardware or by software-driven hardware depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0213] This application embodiment can divide the above-described electronic device into functional modules or functional units according to the above method examples. For example, each function can be divided into its own functional modules or functional units, or two or more functions can be integrated into one processing module. The integrated module can be implemented in hardware or as a software functional module or functional unit. The module or unit division in this application embodiment is illustrative and represents only one logical functional division; other division methods may be used in actual implementation.

[0214] Figure 11 This is a schematic diagram of the structure of a communication module aging test device provided in an embodiment of this application.

[0215] like Figure 11 As shown, in one embodiment, the electronic device can... Figure 11The hardware device shown implements the corresponding functions. This device may include: a touchscreen 701, a memory 702, a processor 703, and a communication module 704. These devices can be connected via one or more communication buses 705. The touchscreen 701 may include a display panel 7011 and a touch sensor 7012. The display panel 7011 is used to display images, and the touch sensor 7012 can transmit detected touch operations to the application processor to determine the touch event type. The display panel 7011 provides visual output related to the touch operation. The processor 703 may include one or more processing units, such as an application processor, a modem processor, a graphics processor, an image signal processor, a controller, a video codec, a digital signal processor, a baseband processor, and / or a neural network processor. Different processing units may be independent devices or integrated into one or more processors. The memory 702 is coupled to the processor 703 and is used to store various software programs and / or computer instructions. The memory 702 may include volatile memory and / or non-volatile memory. When the processor executes computer instructions, the electronic device can perform various functions or steps of the above method embodiments.

[0216] When the software program and / or multiple sets of instructions in the memory 702 are executed by the processor 703, the electronic device performs the following method steps: In response to the electronic device being powered on, the modem module powers on the user identity SIM module; the application layer sends a first request message to the modem module through a first interface, the first interface being the interface between the application layer and the modem module, the first request message including a first power-on configuration, the first power-on configuration including the SIM module's power-on voltage being a first voltage; the modem module, in response to the first request message, determines the first power-on configuration and sends a first response message to the first interface; the first interface, in response to the first response message, sends a power-on message to the modem module; the modem module, in response to the power-on message, adjusts the SIM module's power-on voltage to the first voltage based on the first power-on configuration, and maintains the SIM module's power-on state.

[0217] In one implementation, the first interface includes a first sub-interface and a second sub-interface. When the software program and / or multiple sets of instructions in the memory 702 are executed by the processor 703, the electronic device performs the following method steps: the application layer sends a first request message to the first sub-interface; the first sub-interface converts the first request message into a first format and sends it to the second sub-interface, the first format matching the type of the second sub-interface; the second sub-interface sends the first request message to the Modem module.

[0218] When the software program and / or multiple sets of instructions in the memory 702 are executed by the processor 703, the electronic device performs the following steps: the modem module converts the first response message into a first format and sends it to the second sub-interface; the second sub-interface converts the first response message into a second format and sends it to the first sub-interface, wherein the second format matches the type of the first sub-interface.

[0219] When the software program and / or multiple sets of instructions in the memory 702 are executed by the processor 703, the electronic device performs the following method steps: the first sub-interface responds to the first acknowledgment message, creates a power-on message with a first format, and sends it to the second sub-interface; the second sub-interface sends the power-on message to the Modem module.

[0220] When the software program and / or multiple sets of instructions in the memory 702 are executed by the processor 703, the electronic device performs the following method steps: the modem module determines the target scenario in which the SIM module is located, the target scenario including the SIM card tray being inserted into the SIM module and no SIM card being embedded in the SIM card tray, and the SIM card tray not being inserted into the SIM module; if the target scenario is the SIM card tray being inserted into the SIM module and no SIM card being embedded in the SIM card tray, the modem module maintains the SIM module in a powered-on state; if the target scenario is the SIM card tray not being inserted into the SIM module, the modem module maintains the SIM module in a powered-on state.

[0221] When the software program and / or multiple sets of instructions in the memory 702 are executed by the processor 703, the electronic device performs the following method steps: the modem module sends a first feedback message to the application layer through the first interface based on the power-on state of the SIM module. The first feedback message includes whether the SIM module is faulty.

[0222] When the software program and / or multiple sets of instructions in the memory 702 are executed by the processor 703, the electronic device performs the following steps: the modem module creates a first feedback message with a first format based on the power-on state of the SIM module and sends it to the second sub-interface; the second sub-interface converts the first feedback message into a second format and sends it to the first sub-interface; the first sub-interface sends the first feedback message to the application layer.

[0223] When the software program and / or multiple sets of instructions in the memory 702 are executed by the processor 703, the electronic device performs the following method steps: the first voltage includes at least one of 1.8V and 3V.

[0224] When the software program and / or multiple sets of instructions in the memory 702 are executed by the processor 703, the electronic device performs the following method steps: In response to the first feedback message, the application layer sends a second request message to the modem module through the first interface. The second request message includes a second power-on configuration, which includes that the power-on voltage of the SIM module is a second voltage. In response to the second request message, the modem module determines the second power-on configuration and sends a second response message to the first interface. In response to the second response message, the first interface sends a power-off message to the modem module. In response to the power-off message, the modem module adjusts the power-on voltage of the SIM module to the second voltage based on the second power-on configuration and powers off the SIM module according to the second voltage.

[0225] When the software program and / or multiple sets of instructions in the memory 702 are executed by the processor 703, the electronic device performs the following steps: the application layer sends a second request message to the first sub-interface; the first sub-interface converts the second request message into a first format and sends it to the second sub-interface; the second sub-interface sends the second request message to the Modem module.

[0226] When the software program and / or multiple sets of instructions in the memory 702 are executed by the processor 703, the electronic device performs the following steps: the modem module converts the second response message into a first format and sends it to the second sub-interface; the second sub-interface converts the second response message into a second format and sends it to the first sub-interface.

[0227] When the software program and / or multiple sets of instructions in the memory 702 are executed by the processor 703, the electronic device performs the following method steps: the first sub-interface responds to the second acknowledgment message, creates a power-down message with a first format, and sends it to the second sub-interface; the second sub-interface sends the power-down message to the Modem module.

[0228] When the software program and / or multiple sets of instructions in the memory 702 are executed by the processor 703, the electronic device performs the following method steps: the modem module sends a second feedback message to the application layer through the first interface based on the power-off state of the SIM module. The second feedback message includes whether the SIM module has been powered off.

[0229] When the software program and / or multiple sets of instructions in the memory 702 are executed by the processor 703, the electronic device performs the following steps: the modem module creates a second feedback message with a first format based on the power-down state of the SIM module and sends it to the second sub-interface; the second sub-interface converts the second feedback message into a second format and sends it to the first sub-interface; the first sub-interface sends the second feedback message to the application layer.

[0230] When the software program and / or multiple sets of instructions in the memory 702 are executed by the processor 703, the electronic device performs the following method steps: the second voltage is 0V.

[0231] When the software program and / or multiple sets of instructions in the memory 702 are executed by the processor 703, the electronic device performs the following method steps: the aging application package sends a first request message to the Modem module through the first interface.

[0232] This application also provides an electronic device, including: a processor, a memory, and a touch screen; the memory stores program instructions, which, when executed by the processor, cause the electronic device to perform the various functions or steps performed in the above method embodiments.

[0233] This application also provides a chip system including at least one processor and at least one interface circuit. The processor and the interface circuit are interconnected via lines. For example, the interface circuit can be used to receive signals from other devices (e.g., the memory of an electronic device). As another example, the interface circuit can be used to send signals to other devices. Exemplarily, the interface circuit can read instructions stored in the memory and send the instructions to the processor. When the instructions are executed by the processor, the electronic device can perform the steps in the above embodiments. Of course, the chip system may also include other discrete devices, and this application does not specifically limit this.

[0234] This application also provides a computer-readable storage medium including computer instructions that, when executed on the electronic device, cause the electronic device to perform various functions or steps performed in the above method embodiments.

[0235] This application also provides a computer program product that, when run on a computer, causes the computer to perform the various functions or steps performed in the above method embodiments.

[0236] Through the above description of the embodiments, those skilled in the art can clearly understand that, for the sake of convenience and brevity, only the division of the above functional modules is used as an example. In actual applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above.

[0237] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another device, or some features may be ignored or not executed. Furthermore, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0238] The units described as separate components may or may not be physically separate. A component shown as a unit can be one or more physical units; that is, it can be located in one place or distributed in multiple different locations. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0239] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0240] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a readable storage medium. Based on this understanding, the technical solutions of the embodiments of this application, essentially or in other words, the parts that contribute to the prior art, or all or part of the technical solutions, can be embodied in the form of a software product. This software product is stored in a storage medium and includes several instructions to cause a device (which may be a microcontroller, chip, etc.) or processor to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0241] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A SIM module power-up method, comprising: The application relates to a method for adjusting the power-on voltage of a SIM module of an electronic device. In response to the electronic device being powered on, a Modem module is powered on; An application layer sends a first request message to the Modem module through a first interface, the first interface being an interface between the application layer and the Modem module, and the first request message including a first power-on configuration, the first power-on configuration including the power-on voltage of the SIM module being a first voltage; The Modem module determines the first power-on configuration in response to the first request message and sends a first response message to the first interface; The first interface sends a power-on message to the Modem module in response to the first response message; The Modem module adjusts the power-on voltage of the SIM module to the first voltage based on the first power-on configuration and determines a target scenario in which the SIM module is located, the target scenario including the SIM module being inserted into a SIM card holder and the SIM card holder not being embedded with a SIM card and the SIM module not being inserted into the SIM card holder; If the target scenario is the SIM module being inserted into the SIM card holder and the SIM card holder not being embedded with the SIM card, the Modem module sends a first request signal to a processor to make the processor issue a power supply instruction to a power control chip based on the first request signal, so that the power control chip keeps the power-on state of the SIM module according to the power supply instruction; If the target scenario is the SIM module not being inserted into the SIM card holder, the Modem module sends a first request signal to the processor to make the processor issue a power supply instruction to the power control chip based on the first request signal, so that the power control chip keeps the power-on state of the SIM module according to the power supply instruction; The Modem module sends a first feedback message to the application layer through the first interface based on the power-on state of the SIM module, the first feedback message including whether the SIM module has a fault.

2. The SIM module power-up method of claim 1, wherein, The first interface includes a first sub-interface and a second sub-interface, and the application layer sends the first request message to the Modem module through the first interface, including: The application layer sends the first request message to the first sub-interface; The first sub-interface converts the first request message into a first format and sends the first request message to the second sub-interface, the first format matching the type of the second sub-interface; The second sub-interface sends the first request message to the Modem module.

3. The SIM module power-up method of claim 2, wherein, The Modem module determines the first power-on configuration in response to the first request message and sends a first response message to the first interface, including: The Modem module converts the first response message into the first format and sends the first response message to the second sub-interface; The second sub-interface converts the first response message into a second format and sends the first response message to the first sub-interface, the second format matching the type of the first sub-interface.

4. The SIM module power-up method of claim 2, wherein, The first interface sends a power-on message to the Modem module in response to the first response message, including: The first sub-interface creates the power-on message in the first format in response to the first response message and sends it to the second sub-interface; The second sub-interface sends the power-on message to the Modem module.

5. The SIM module power-up method of claim 4, wherein, The Modem module sends a first feedback message to the application layer through the first interface based on the power-on state of the SIM module, including: The Modem module creates the first feedback message in the first format based on the power-on state of the SIM module and sends it to the second sub-interface; The second sub-interface sends the first feedback message to the first sub-interface after converting it to a second format; The first sub-interface sends the first feedback message to the application layer.

6. The SIM module power-up method of any of claims 1-5, wherein, The first voltage includes at least one of 1.8V and 3V.

7. The SIM module power-up method of claim 4, wherein, After the Modem module sends a first feedback message to the application layer through the first interface based on the power-on state of the SIM module, it further includes: The application layer sends a second request message to the Modem module through the first interface in response to the first feedback message, the second request message including a second power-on configuration, the second power-on configuration including a second voltage for the power-on voltage of the SIM module; The Modem module determines the second power-on configuration in response to the second request message and sends a second response message to the first interface; The first interface sends a power-off message to the Modem module in response to the second response message; The Modem module adjusts the power-on voltage of the SIM module to the second voltage based on the second power-on configuration in response to the power-off message and powers off the SIM module according to the second voltage.

8. The SIM module power-up method of claim 7, wherein, The application layer sends a second request message to the Modem module through the first interface in response to the first feedback message, including: The application layer sends the second request message to the first sub-interface; The first sub-interface sends the second request message to the second sub-interface after converting it to the first format; The second sub-interface sends the second request message to the Modem module.

9. The SIM module power-up method of claim 7, wherein, The Modem determines the second power-on configuration in response to the second request message and sends a second response message to the first interface, including: The Modem module sends the second response message to the second sub-interface after converting it to the first format; The second sub-interface sends the second response message to the first sub-interface after converting it to the second format.

10. The SIM module power-up method of claim 7, wherein, The first interface sends a power-off message to the Modem module in response to the second response message, including: The first sub-interface creates the power-off message in the first format in response to the second response message and sends it to the second sub-interface; The second sub-interface sends the power-off message to the Modem module.

11. The SIM module power-up method of claim 7, wherein, The Modem module, in response to the power-down message, adjusts the power-on voltage of the SIM module to the second voltage based on the second power-on configuration, and after powering down the SIM module according to the second voltage, further comprises: The Modem module sends a second feedback message to the application layer through the first interface based on the power-down state of the SIM module, and the second feedback message comprises whether the SIM module has been powered down.

12. The SIM module power-up method of claim 11, wherein, The Modem module sends a second feedback message to the application layer through the first interface based on the power-down state of the SIM module, comprising: The Modem module creates the second feedback message in the first format based on the power-down state of the SIM module and sends it to the second sub-interface; The second sub-interface converts the second feedback message into a second format and sends it to the first sub-interface; The first sub-interface sends the second feedback message to the application layer.

13. The SIM module power-up method of any of claims 7-12, wherein, The second voltage is 0V.

14. The SIM module power-up method of any of claims 7-12, wherein, The application layer comprises an aging application package, and the application layer sends a first request message to the Modem module through a first interface, comprising: The aging application package sends the first request message to the Modem module through the first interface.

15. An electronic device, comprising: comprising a processor and a memory; the memory stores program instructions, when the program instructions are executed by the processor, the electronic device executes the SIM module power-on method as claimed in any one of claims 1-14.

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