Circuit board assembly and electronic equipment

Abstract

The invention provides a circuit board assembly and electronic equipment, relates to the technical field of electronic products, and enables the circuit board assembly to be installed on the electronic equipment more stably and detached from the electronic equipment more conveniently. The circuit board assembly is provided, the circuit board assembly comprises a circuit board, a first group of electronic components and a support, the circuit board comprises a first surface, and the first group of electronic components are arranged on the first surface. The support is connected to the circuit board and comprises a first support part, the first support part is located on the side facing the first surface and covers a part of the first surface, and at least the part, back to the first surface, of the first support part is of an elastic soft structure.

Description

[0001] This application is based on a divisional application with application number 202310801833.7, application date June 30, 2023, and invention name “A circuit board assembly and electronic device”. The entire contents of the original application are incorporated into this application by reference. Technical Field

[0002] The present application relates to the technical field of electronic products, and in particular to a circuit board assembly and an electronic device. Background Art

[0003] With the development of the information age, users have more diverse demands on the functions of electronic devices and higher requirements on performance. Therefore, in order to meet the above needs, more circuit board components are set in electronic devices to realize various functions of electronic devices. However, in order to improve the user experience, the thinness of the whole machine is also a direction that electronic devices continue to pursue. In the limited space, how to better arrange components, optimize the structural layout, improve performance while ensuring the reliability of the whole machine, and the convenience of disassembly of circuit board components during later maintenance and disassembly, this poses an important challenge to the structural design of the whole machine. Summary of the invention

[0004] The present application provides a circuit board assembly and an electronic device, which enable the circuit board assembly to be installed more stably and disassembled more conveniently.

[0005] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0006] In a first aspect, a circuit board assembly is provided, the circuit board assembly comprising a circuit board, a first group of electronic components and a bracket, the circuit board comprising a first surface, the first group of electronic components being arranged on the first surface. The bracket is connected to the circuit board, the bracket comprising a first bracket portion, the first bracket portion being located on a side facing the first surface, the direction perpendicular to the first surface being the first direction, and at least a portion of the first bracket portion in the first direction being an elastic soft structure.

[0007] The difference from merely bonding the circuit board to other structural parts through the side or surface of the circuit board is that a bracket is provided on the circuit board, and the circuit board assembly is connected to other structural parts with the help of the bracket. On the one hand, compared with connecting to other structural parts through the side of the circuit board, the bracket can provide a larger connection area for the connection of the circuit board assembly, thereby connecting the circuit board assembly to other structural parts more stably and reliably. On the other hand, when disassembling the circuit board assembly, the external force used for disassembly can be directly applied to the bracket to disassemble the circuit board from other structural parts, thereby avoiding damage to the circuit board assembly by directly applying force to the circuit board assembly, thereby improving the stability of the circuit board assembly in use. Furthermore, after the circuit board is installed, the bracket also squeezes the circuit board between two relative structural parts by providing an elastic soft structure, thereby forming an interference fit between the circuit board and other structural parts through the elastic soft structure, making the connection of the circuit board assembly more stable, thereby further improving the stability and reliability of the circuit board assembly after installation.

[0008] In a possible implementation of the first aspect, the first bracket portion includes a substrate portion and an elastic adhesive material, and the substrate portion includes a second surface and a fourth surface opposite to each other, and the second surface faces the first surface. The elastic adhesive material is arranged on the fourth surface, and the elastic adhesive material forms an elastic soft structure. The elastic soft structure adopts an elastic adhesive material, which can play a variety of roles. First, the circuit board assembly can be bonded to other structural parts through the elastic adhesive material; second, the elastic adhesive material is located between the substrate portion and the other structural parts, so that the circuit board assembly and the other structural parts form an interference fit, thereby improving the stability and reliability of the installation of the circuit board assembly; third, when the circuit board assembly collides, the elastic adhesive material has a certain buffering effect, thereby protecting the circuit board assembly, avoiding damage to the circuit board assembly in the collision, and further improving user satisfaction.

[0009] In a possible implementation of the first aspect, the height of the elastic adhesive material protruding from the fourth surface is greater than or equal to 0.05 mm. In this way, the second bracket portion has a limiting effect on the side of the circuit board that the first side faces.

[0010] In a possible implementation of the first aspect, the circuit board further includes a first side surface connected to the first surface, and the bracket further includes a second bracket portion, the second bracket portion is located on the side facing the first side surface, and the second bracket portion is arranged on the second surface.

[0011] In this way, the second bracket part plays a limiting role on the side of the circuit board facing the first side. Specifically, the first bracket part plays a limiting role in the thickness direction of the circuit board, and the second bracket part plays a limiting role in the width direction of the circuit board. Furthermore, in the width direction of the circuit board, the assembly error between the bracket and the circuit board is reduced, and the accuracy of the assembly of the bracket and the circuit board is improved. Further, the stability and reliability of the circuit board assembly installed in the electronic device are also improved.

[0012] In a possible implementation of the first aspect, the circuit board further includes a third side surface opposite to the first side surface, and a fourth side surface and a fifth side surface, and a distance from the first side surface to the third side surface is smaller than a distance from the fourth side surface to the third side surface.

[0013] In this way, the bottom wall of the first avoidance gap faces the side of the second bracket part, and the side wall of the first avoidance gap faces the bottom surface of the second bracket part. When the bracket is installed on the circuit board, the positioning of the bracket can be achieved through the cooperation between the second bracket part and the first avoidance gap. After the bracket is installed on the circuit board, the circuit board can be limited by the bracket and the bottom wall and side wall of the first avoidance gap, thereby ensuring the stability and reliability of the circuit board assembly. In addition, the second bracket part is accommodated in the first avoidance gap, which further ensures the flatness of the overall appearance of the circuit board assembly after the bracket is fixed to the circuit board, thereby facilitating the convenience and accuracy of installing the circuit board assembly on the electronic device.

[0014] In a possible implementation of the first aspect, the circuit board further includes a second side surface connected to the first surface, and the second side surface is also connected to the first side surface. The bracket further includes a third bracket portion, the third bracket portion is located on the side facing the second side surface, and the third bracket portion is arranged on the second surface.

[0015] In this way, the first bracket part plays a limiting role in the thickness direction of the circuit board; the second bracket part plays a limiting role in the width direction of the circuit board; and the third bracket part plays a limiting role in the length direction of the circuit board. Therefore, the bracket limits the circuit board in three directions, thereby reducing the assembly error between the bracket and the circuit board and improving the assembly accuracy of the bracket and the circuit board. This further improves the stability and reliability of the circuit board assembly installed in the electronic device.

[0016] In a possible implementation of the first aspect, a first positioning portion is provided on the circuit board, and a second positioning portion that cooperates with the first positioning portion is provided on the second surface. The cooperation between the first positioning portion and the second positioning portion improves the accuracy of bonding between the bracket and the circuit board, thereby reducing the assembly error between the bracket and the circuit board, further improving the stability and reliability of the connection between the bracket and the circuit board, and improving the assembly accuracy of the circuit board assembly and the electronic device.

[0017] In a possible implementation of the first aspect, the first positioning portion is a notch that runs through the third side surface; the second positioning portion is a protrusion that matches the notch. In this way, when the bracket and the circuit board are assembled, the protrusion is aligned with the groove in the width direction of the circuit board assembly, and after alignment, the protrusion is pushed into the groove to accommodate the protrusion in the groove, thereby achieving positioning of the bracket and the circuit board, improving the accuracy of bonding the bracket and the circuit board, and reducing the assembly error between the bracket and the circuit board, further improving the stability and reliability of the connection between the bracket and the circuit board, and improving the assembly accuracy of the circuit board assembly and the electronic device.

[0018] In a possible implementation of the first aspect, the arrangement direction of the first side surface and the third side surface is the second direction, and in the second direction, the bracket includes a seventh side surface and an eighth side surface that are opposite to each other, the seventh side surface is located on a side of the fourth side surface away from the third side surface, and the eighth side surface is located on a side of the fourth side surface away from the seventh side surface. In this way, after the circuit board assembly is installed in the receiving groove and the back cover of the electronic device is installed on the frame, the circuit board assembly is located between the bottom wall of the receiving groove and the back cover, and the circuit board assembly is in direct contact with the back cover through the bracket to achieve fixation of the circuit board assembly in the second direction. Furthermore, the back cover can form an interference fit relationship with the circuit board assembly to squeeze the circuit board assembly into the receiving groove, further improving the stability and reliability of the circuit board assembly installed in the receiving groove.

[0019] In a possible implementation of the first aspect, the eighth side surface is located between the third side surface and the fourth side surface. In this way, after the circuit board assembly is installed in the receiving groove, the circuit board assembly directly contacts other structural members through the third side surface. The circuit board assembly relies on the circuit board itself for installation and positioning, which reduces the error during assembly of the circuit board assembly and improves the accuracy of installing the circuit board assembly in the electronic device.

[0020] In a possible implementation of the first aspect, in the second direction, a distance from the eighth side surface to the third side surface is less than or equal to 0.15 mm. The circuit board assembly relies on the circuit board itself for installation and positioning, thereby reducing errors during assembly of the circuit board assembly and improving the accuracy of installing the circuit board assembly in the electronic device.

[0021] In a possible implementation of the first aspect, the substrate portion is provided with an avoidance groove, the opening of the avoidance groove faces the first surface, and at least part of the first group of electronic components is accommodated in the avoidance groove. In this way, the circuit board assembly is connected to the accommodation groove by the bracket, thereby improving the stability and reliability of the circuit board assembly fixed in the electronic device. The bracket also leaves an accommodation space for the installation of the electronic components, so that more electronic components can be arranged on the surface of the circuit board, thereby improving the compactness of the circuit board layout.

[0022] In a possible implementation of the first aspect, the circuit board also includes a third surface opposite to the first surface, the second bracket portion also includes a fifth surface opposite to the second surface, and the distance from the third surface to the fourth surface is greater than or equal to the distance from the fifth surface to the fourth surface. In this way, in the width direction of the electronic device, the circuit board assembly is fixed in the receiving groove. In addition, one side surface of the circuit board assembly is connected to the second inner wall surface of the receiving groove through the circuit board itself, further reducing the assembly error between the circuit board assembly and the frame, thereby improving the accuracy of the installation of the circuit board assembly. Furthermore, by direct contact between the third surface and the second inner wall surface, the stability and reliability of the circuit board assembly in use are further improved, avoiding the problem of easy breakage caused by the third surface of the circuit board not being fixed to form a cantilever structure.

[0023] In a possible implementation of the first aspect, the circuit board assembly further includes a protrusion, which is disposed on the fifth surface, extends along the fifth surface in a direction away from the second surface, and protrudes from the third surface. In this way, after the circuit board assembly is installed in the receiving groove, the circuit board assembly can be connected to the second inner wall surface through the protrusion of the bracket. In the width direction of the electronic device, the circuit board assembly is fixed in the receiving groove by the bracket, thereby improving the stability and reliability of the fixing of the circuit board assembly.

[0024] In a possible implementation of the first aspect, the circuit board assembly further includes a second group of electronic components, and the second group of electronic components is disposed on the third surface. In this way, the performance of the electronic device and the diversity of the functions of the electronic device are further improved.

[0025] In a possible implementation of the first aspect, a second avoidance notch is provided on the edge of the bracket, and the second avoidance notch is located on the side of the second bracket portion away from the fifth side, and is located on the side of the third bracket portion away from the third side. The convenience of disassembling the circuit board assembly is further improved by setting the second avoidance notch. When the circuit board assembly is disassembled, the bracket can be applied with force through the second avoidance notch to remove the circuit board assembly from the receiving groove. Specifically, the bracket can be applied with the aid of a crowbar through the second avoidance notch to pry the circuit board assembly out of the receiving groove. When the bracket and the frame are connected by bonding, when disassembling the circuit board assembly, the glue between the bracket and the frame can be melted first, and the circuit board assembly can be taken out through the second avoidance notch after the glue is melted. Therefore, the convenience of disassembling the circuit board assembly is improved by setting the second avoidance notch, and damage to the circuit board assembly during disassembly of the circuit board assembly is avoided, thereby improving the reliability and stability of the use of the circuit board assembly.

[0026] In a possible implementation of the first aspect, the circuit board is connected to at least one of the first bracket portion, the second bracket portion, and the third bracket portion. In this way, the connection between the circuit board and the bracket is not limited to one area on the bracket, and the area connected to the circuit board can be flexibly selected according to the specific structure of the bracket, further improving the flexibility of the connection between the bracket and the circuit board.

[0027] In a possible implementation of the first aspect, the circuit board includes a first end and a second end opposite to each other, and the number of brackets is two, and the two brackets are symmetrically arranged at the first end and the second end. The circuit board is fixed in the receiving groove by the two brackets, and the circuit board assembly can be more stably and reliably connected to the receiving groove.

[0028] In the second aspect, an electronic device is also provided, the electronic device includes a housing and the above-mentioned circuit board assembly, the housing includes a receiving groove, and the receiving groove includes a first inner wall surface and a second inner wall surface relative to each other. The circuit board assembly is located in the receiving groove, and the arrangement direction of the bracket of the circuit board assembly and the circuit board of the circuit board assembly is consistent with the arrangement direction of the first inner wall surface and the second inner wall surface. The bracket of the circuit board assembly is connected to the first inner wall surface, and the circuit board of the circuit board assembly is connected to the second inner wall surface. In this way, in the width direction of the electronic device, the circuit board assembly is fixed in the receiving groove. In addition, one side surface of the circuit board assembly is connected to the second inner wall surface of the receiving groove through the circuit board itself, further reducing the assembly error between the circuit board assembly and the frame, thereby improving the accuracy of the installation of the circuit board assembly. Furthermore, by directly contacting the third surface with the second inner wall surface, the stability and reliability of the circuit board assembly in use are further improved, and the problem of easy breakage caused by the third surface of the circuit board not being fixed to form a cantilever structure is avoided.

[0029] In a possible implementation manner of the second aspect, the accommodating groove further includes a third inner wall surface connected between the first inner wall surface and the second inner wall surface, and a distance between the bracket and the third inner wall surface is less than or equal to 0.15 mm.

[0030] In a possible implementation of the second aspect, the housing further comprises a frame, the frame comprises a sixth surface, and the receiving groove is arranged on the sixth surface. The thickness direction of the circuit board is perpendicular to the thickness direction of the electronic device.

[0031] In a possible implementation of the second aspect, the sixth surface is further provided with an avoidance groove, and the avoidance groove is connected with the accommodating groove. In this way, when the circuit board assembly is disassembled, the bracket can be forcefully applied through the avoidance groove to remove the circuit board assembly from the accommodating groove. Specifically, the bracket can be forcefully applied through the avoidance groove with the aid of a crowbar to pry the circuit board assembly out of the accommodating groove. When the bracket and the frame are connected by bonding, when the circuit board assembly is disassembled, the glue between the bracket and the frame can be melted first, and the circuit board assembly can be taken out through the avoidance groove after the glue is melted. Therefore, the convenience of disassembling the circuit board assembly is improved by providing the avoidance groove, and damage to the circuit board assembly during disassembly is avoided, thereby improving the reliability and stability of the use of the circuit board assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A perspective view of an electronic device provided for some embodiments of the present application;

[0033] Figure 2 for Figure 1 a schematic diagram of the exploded structure of the electronic device shown;

[0034] Figure 3 for Figure 2 An enlarged view of A in FIG.

[0035] Figure 4 A schematic diagram of the structure of a circuit board provided in some embodiments of the present application;

[0036] Figure 5 for Figure 4 The circuit board is mounted on Figure 3 A schematic diagram of the structure in the receiving groove;

[0037] Figure 6 A schematic diagram of the structure of a circuit board assembly provided in some embodiments of the present application;

[0038] Figure 7 for Figure 6 A schematic diagram of a structure in which a circuit board assembly is installed in a receiving groove;

[0039] Figure 8 A schematic diagram of the structure of a bracket provided in some embodiments of the present application;

[0040] Fig. 9 for Figure 7 The schematic diagram of the structure of the bracket observed from the F1 angle;

[0041] Fig.10 for Figure 8 A schematic diagram of the structure of a circuit board provided in some embodiments of the present application;

[0042] Fig.11 for Fig. 9 The bracket is installed on Fig.10 A schematic diagram of the structure of the circuit board in FIG.

[0043] Fig.12 A schematic diagram of the structure of a bracket provided in some other embodiments of the present application;

[0044] Fig.13 for Fig.12 A front view of the bracket in FIG.

[0045] Fig.14 for Fig.13 The schematic diagram of the structure of the bracket observed from the F2 angle;

[0046] Fig.15 A schematic diagram of the structure of a circuit board provided in some other embodiments of the present application;

[0047] Fig.16 for Fig.14 The bracket is installed on Fig.15 A schematic diagram of the structure of the circuit board in FIG.

[0048] Fig.17 for Fig.16 A schematic diagram of a structure in which a circuit board assembly is installed in a receiving groove;

[0049] Fig.18 for Fig.17 A top view of the circuit board assembly installed in the receiving groove;

[0050] Fig.19 A schematic diagram of the structure of a circuit board assembly provided in some further embodiments of the present application;

[0051] Fig. 20 A schematic diagram of the structure of a bracket provided in some other embodiments of the present application;

[0052] Fig.21 for Fig. 20 A schematic structural diagram of the bracket in FIG. 1 observed from the F3 angle;

[0053] Fig. 22 for Fig.21 A schematic diagram of a structure in which the bracket is connected to the circuit board and installed in the receiving groove;

[0054] Fig.23 for Fig. 22 A top view of the circuit board installed in the receiving groove;

[0055] Fig.24 A schematic diagram of a structure of a circuit board assembly provided in some further embodiments of the present application with the bracket omitted;

[0056] Fig.25A schematic diagram of the structure of a circuit board assembly provided in some further embodiments of the present application;

[0057] Fig.26 This is a schematic diagram of the structure in which the bracket provided in some embodiments of the present application is installed in the receiving groove.

[0058] Reference numerals

[0059] 100. electronic device; 10. screen; 11. light-transmitting cover plate; 12. display screen;

[0060] 20, back shell; 21, back cover; 22, frame; S15, sixth surface; 221, receiving groove; 222, inner frame; 223, outer frame; 224, first inner wall surface; 225, second inner wall surface; 226, third inner wall surface; 227, fourth inner wall surface; 228, bottom wall surface; 22a, third avoidance gap; 23, middle plate;

[0061] 30. Circuit board assembly; 31. Circuit board; 31a. First end; 31b. Second end;

[0062] 32. electronic components; S1. first surface; S3. third surface; S4. first side surface; S5. second side surface; S6. third side surface; 33. first positioning portion; S9. sixth side surface; 34. fourth avoidance notch; S11. fourth side surface; S12. fifth side surface;

[0063] 30a, mainboard circuit board assembly; 311, mainboard circuit board 311; 312, electronic components of the mainboard;

[0064] 30b, other circuit board components; 321, other circuit boards; 322, other electronic components; 322a, a first group of electronic components; 322b, a second group of electronic components;

[0065] 40, bracket; S2, second surface; S7, seventh side surface; S8, eighth side surface; 40a, second avoidance gap; S13, fourth surface;

[0066] 41, first bracket part; 411, second positioning part; 412, base plate part; 412a, avoidance groove; 413, elastic rubber material; 414, first rubber material;

[0067] 42, second bracket part; S14, fifth surface; 421, raised portion; 43, third bracket part; 44, bracket receiving groove;

[0068] 50. Flexible circuit board; 51. First part; 52. Second part; 53. Bending part; 60. Elastic connecting member. DETAILED DESCRIPTION

[0069] In the embodiments of the present application, the terms "first", "second", "third", "fourth", and "fifth" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", "third", "fourth", and "fifth" may explicitly or implicitly include one or more of the features.

[0070] In the embodiments of the present application, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0071] In the embodiments of the present application, unless otherwise specified, the description "parallel" means approximately parallel within a certain error range, and the error range may be a range of less than or equal to 5° relative to the absolute parallel deviation angle. The description "perpendicular" means approximately perpendicular within a certain error range, and the error range may be a range of less than or equal to 5° relative to the absolute perpendicular deviation angle.

[0072] In the embodiments of the present application, unless otherwise specified, the description of two objects "overlapping" includes four possible implementations: one object partially overlaps the other object as a whole, the other object partially overlaps the one object as a whole, the one object as a whole overlaps the other object as a whole, and the one object partially overlaps the other object as a part. The description of two objects "overlapping" means that the middle and edges of the two objects completely overlap.

[0073] With the development of the information age, users have more diverse demands on the functions of electronic devices and higher performance requirements. Therefore, in order to meet the above needs, more circuit board components are set up in electronic devices to realize the various functions of electronic devices. However, in order to improve the user experience, the thinness of the whole machine is also a direction that electronic devices continue to pursue. In a limited space, how to better arrange components and optimize the structural layout, improve performance while ensuring the reliability of the whole machine, and the convenience of disassembling circuit board components during later maintenance and disassembly, this poses an important challenge to the structural design of the whole machine.

[0074] Based on this, in order to solve the above problems, the present application provides a circuit board assembly from the perspective of improving the stability of the circuit board assembly installed in the electronic device and facilitating disassembly, and the circuit board assembly is fixed inside the electronic device with the help of a bracket. The circuit board assembly is fixed under the overlap of the bracket and the inner wall of the electronic device, thereby achieving the stability of the circuit board assembly fixed in the electronic device.

[0075] The specific structure of the bracket is described below in conjunction with the specific application scenario of the above-mentioned circuit board assembly.

[0076] The present application provides an electronic device, which may be a user equipment (UE) or a terminal device, etc. For example, the electronic device may be a portable android device (PAD), a personal digital assistant (PDA), a handheld device with a wireless communication function, a computing device, a vehicle-mounted device, a wearable device, a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control, a wireless terminal in self-driving, a wireless terminal in remote medical, a wireless terminal in smart grid, a wireless terminal in transportation safety, a wireless terminal in smart city, a wireless terminal in smart home, and other mobile terminals or fixed terminals. The form of the electronic device is not specifically limited in the embodiments of the present application.

[0077] See also Figure 1 , Figure 1 A stereoscopic diagram of an electronic device 100 is provided for some embodiments of the present application. This embodiment and the following embodiments are exemplified by taking the electronic device 100 as a handheld device with a wireless communication function, which can be, for example, a mobile phone. The electronic device 100 is roughly in the shape of a rectangular plate. Based on this, in order to facilitate the description of the embodiments below, an XYZ coordinate system is established, specifically defining the width direction of the electronic device 100 as the X-axis direction, the length direction of the electronic device 100 as the Y-axis direction, and the thickness direction of the electronic device 100 as the Z-axis direction. It can be understood that the coordinate system of the electronic device 100 can be flexibly set according to actual needs, and no specific limitation is made here. When the electronic device 100 is other products, the electronic device 100 can also be roughly in the shape of a square plate, a circular plate, etc., which is not specifically limited here.

[0078] Please also read Figure 1 and Figure 2 , Figure 2 for Figure 1 The electronic device 100 is a schematic diagram of an exploded structure. The electronic device 100 includes a screen 10, a back cover 20, a circuit board assembly 30, electronic components and a bracket 50.

[0079] Understandably, Figure 1 and Figure 2 The electronic device 100 includes some components, and the actual shape, size, position and structure of these components are not limited to the following. Figure 1 and Figure 2 In some other examples, the electronic device 100 may not include the screen 10.

[0080] The screen 10 is used to display images, videos, etc. The screen 10 includes a transparent cover plate 11 and a display screen 12. The transparent cover plate 11 and the display screen 12 are stacked. The transparent cover plate 11 is mainly used to protect the display screen 12 and prevent dust. The material of the transparent cover plate 11 includes but is not limited to glass. The display screen 12 can be a flexible display screen or a rigid display screen. For example, the display screen 12 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display screen, a mini light-emitting diode (mini light-emitting diode) display screen, a micro light-emitting diode (micro light-emitting diode) display screen, a micro organic light-emitting diode (micro organic light-emitting diode) display screen, a quantum dot light emitting diode (QLED) display screen, and a liquid crystal display (LCD).

[0081] The back cover 20 is connected to the screen 10, and the back cover 20 is used to protect the internal electronic components of the electronic device 100. In some embodiments, please refer to Figure 1 and Figure 2, the back shell 20 may include a back cover 21 and a frame 22. The back cover 21 is located on a side of the display screen 12 away from the light-transmitting cover plate 11, and is spaced apart from the display screen 12. The frame 22 is located between the back cover 21 and the screen 10, and is arranged along the edge of the back cover 21 and the edge of the screen 10. The frame 22 is fixed to the back cover 21. Exemplarily, the frame 22 can be fixedly connected to the back cover 21 by adhesive. The frame 22 can also be an integrally formed structure with the back cover 21, that is, the frame 22 and the back cover 21 are an integral structure. The light-transmitting cover plate 11 is fixed to the frame 22 by gluing. A accommodating cavity is provided in the back shell 20. In some embodiments, the accommodating cavity is located between the screen 10 and the back cover 21.

[0082] In some embodiments, please refer to Figure 2 The electronic device 100 further includes a middle plate 23. The middle plate 23 is fixed to the inner surface of the frame 22. For example, the middle plate 23 can be fixed to the frame 22 by welding. The middle plate 23 can also be an integrally formed structure with the frame 22. The middle plate 23 is used as a structural "skeleton" of the electronic device 100, and is used to support and fix the electronic components in the electronic device 100.

[0083] The structure composed of the middle plate 23 and the frame 22 can also be called a middle frame. On this basis, the accommodating cavity can be located between the middle frame and the back cover 21.

[0084] The circuit board assembly 30 is accommodated in the accommodating cavity. In some embodiments, the circuit board assembly 30 can be fixed to the middle plate 23. In other embodiments, when the electronic device 100 does not include the middle plate 23, the circuit board assembly 30 can also be fixed to the back cover 21 or the frame 22.

[0085] The circuit board assembly 30 is used to realize electrical connection between various electronic components, and the circuit board assembly 30 is used to perform signal control, data signal processing, data signal storage and other operations on the electronic components. Specifically, the circuit board assembly 30 may include a circuit board 31 and electronic components 32 arranged on the surface of the circuit board.

[0086] The circuit board 31 includes a first surface S1 and a third surface S3 facing each other. The first surface S1 and the third surface S3 may be the two largest surfaces of the circuit board 31. The circuit board 31 may include a multi-layer stacking structure formed by alternating and stacking insulating dielectric layers and metal layers in sequence, and a solder resist layer disposed on at least one end surface of the multi-layer stacking structure along its stacking direction, wherein the metal layer has a pattern for forming an internal routing or reference ground of the circuit board 31, based on which the first surface S1 and the third surface S3 may be perpendicular to the stacking direction of the insulating dielectric layers and the metal layers in the multi-layer stacking structure.

[0087] The circuit board 31 may be a double-sided board, or a single-sided board with the first surface S1 used to set electronic components. When the circuit board 31 is a double-sided board, both the first surface S1 and the third surface S3 are provided with electronic components. In other embodiments, the circuit board 31 may also be a single-sided board with the third surface S3 used to set electronic components.

[0088] The circuit board 31 may be a hard circuit board, a flexible circuit board, or a combination of hard and soft circuit boards. This embodiment is exemplified by taking the circuit board 31 as a hard circuit board. Specifically, the circuit board 31 may be a hard printed circuit board (PCB).

[0089] The electronic components 32 include, but are not limited to, chips, resistors, capacitors, inductors, potentiometers, electron tubes, heat sinks, electromechanical components, connectors, semiconductor discrete devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, etc. It should be noted that the number and arrangement of the electronic components 32 in the embodiment of the present application can be set according to actual needs, and the embodiment of the present application does not limit the number and arrangement of the electronic components 32.

[0090] In order to realize the diversity of functions of the electronic device 100, the circuit board assembly 30 may include a plurality of circuit board assemblies 30 for realizing different functions. Specifically, the circuit board assembly 30 may include a main board circuit board assembly 30a and at least one other circuit board assembly 30b. Figure 2 Only one other circuit board assembly 30b is shown, which does not represent a special limitation on the present application. The number of other circuit board assemblies 30b can be two, three, four, etc. Among them, the main board circuit board assembly 30a includes a main board circuit board 311 and electronic components 312 of the main board, and the other circuit board assembly 30b includes other circuit boards 321 and other electronic components 322. The main board circuit board assembly 30a is used as the main board of the electronic device 100, and the other circuit board assembly 30b can be other circuit boards of the electronic device 100, such as a circuit board in a mobile phone for carrying a speaker, a USB interface, a switch side key, and a volume side key, which are not specifically limited here.

[0091] In order to improve the user experience, the electronic device 100 continues to pursue the direction of thinness and lightness of the whole device. Within the limited space of the electronic device 100, the components should be arranged reasonably and the structural layout should be optimized. In order to more efficiently utilize the space of the electronic device 100, the circuit board assembly 30 can be arranged in a variety of layout schemes. Figure 2As shown, the main board circuit board assembly 30a is used as the main board circuit board 311 of the electronic device 100. The main board circuit board 311 is a circuit board 31 with a larger surface area in the electronic device 100, and can be arranged in a plane layout. The surface area of ​​the other circuit board assembly 30b is smaller than that of the main board circuit board 311, and at least part of the other circuit board assembly 30b can be arranged in a vertical layout.

[0092] “Plane layout” means that the thickness direction of the circuit board 31 is parallel to the thickness direction of the electronic device 100, that is, Figure 2 In the Z-axis direction, the parallelism here refers to the parallelism including a certain error, not the absolute parallelism. The parallelism mentioned in the following embodiments is the parallelism including a certain error, which will not be repeated in the following text. Specifically, the mainboard circuit board 311 includes a first surface S1 and a third surface S3 facing each other, the first surface S1 faces the back cover 21, and the third surface S3 faces the middle plate 23. When the mainboard circuit board assembly 30a is a single-sided board, the electronic components 312 of the mainboard can be arranged on the first surface S1, and the mainboard circuit board assembly 30a is bonded to the middle plate 23 by means of the third surface S3. Alternatively, the electronic components 312 of the mainboard are arranged on the third surface S3, and the mainboard circuit board assembly 30a is bonded to the back cover 21 by means of the first surface S1. When the mainboard circuit board assembly 30a is a double-sided board, the electronic components 312 of the mainboard are distributed on the first surface S1 and the third surface S3, and the mainboard circuit board assembly 30a is fixed to the middle plate 23 or the back cover 21 by means of the bracket 40.

[0093] The other circuit board components 30b are fixed in the electronic device 100 in a vertical layout. "Vertical layout" means that the thickness direction of the other circuit boards 31 is perpendicular to the thickness direction of the electronic device 100, that is, perpendicular to the Z-axis direction. The vertical here refers to the verticality including a certain error, not the verticality in an absolute sense. The verticality mentioned in the following embodiments is the verticality including a certain error, which will not be repeated in the following text. The vertical layout can be achieved by setting a receiving groove 221 on the middle frame and setting the other circuit board components 30b in the receiving groove 221. Therefore, compared with the method of only using a plane layout, the combination of the vertical layout and the plane layout can more efficiently utilize the space in the electronic device 100.

[0094] The following will focus on the example of the circuit board assembly 30 being other circuit board assemblies 30b, and will introduce in detail the scenario in which the other circuit board assembly 30b is fixed in the electronic device 100 in a vertical layout manner. For the sake of reading fluency, the other circuit board assembly 30b in the following will be described by its superordinate concept circuit board assembly 30, the other circuit board 31 will be described by its superordinate concept circuit board 31, and the other electronic component 30b will be described by its superordinate concept electronic component 32. In other words, the scenario in which the circuit board assembly 30 is in a vertical layout manner will be introduced in detail.

[0095] See also Figure 3 , Figure 3 for Figure 2 An enlarged view of A in FIG. The frame 22 includes an inner frame 222 and an outer frame 223 facing each other, and a sixth surface S15 connected between the inner frame 222 and the outer frame 223, wherein the inner frame 222 is a frame of the frame 22 facing the inside of the shell, and the outer frame 223 is a frame of the frame 22 facing the outside of the shell. The receiving groove 221 is arranged on the sixth surface S15 between the inner frame 222 and the outer frame 223. The extension direction of the length of the receiving groove 221 can be consistent with the extension direction of the length of the frame 22, that is, it extends along the Y-axis direction. When the circuit board assembly 30 is accommodated in the receiving groove 221, the extension direction of the length of the circuit board assembly 30 is consistent with the extension direction of the length of the frame 22. In this way, the length of the receiving groove 221 can extend to the inner walls of the two ends of the frame 22 in the length direction to meet the requirement of installing a circuit board 31 with a larger length.

[0096] Of course, in some other embodiments, the extension direction of the length of the circuit board 31 may also be inclined at a certain angle relative to the Y-axis direction. In this way, the circuit board 31 can be tilted to leave a certain space to avoid interference with the installation of other devices.

[0097] Figure 3 The description is made by taking the example that the receiving groove 221 is arranged on the frame 22. However, this does not represent a special limitation on the present application. That is to say, in some other embodiments, the receiving groove 221 can also be arranged on the middle plate 23 or the back cover 21. The extension direction of the length of the receiving groove 221 can extend along the X-axis direction, the Y-axis direction, or the Z-axis direction, and can also extend at a certain angle relative to the X-axis direction, the Y-axis direction, or the Z-axis direction. It can be understood that the extension direction of the length of the receiving groove 221 extending in all directions is within the protection scope of the present application.

[0098] The following description will be made by taking an example where the receiving groove 221 is disposed on the frame 22 and the extension direction of the length of the receiving groove 221 is consistent with the extension direction of the length of the frame 22 .

[0099] Please continue reading Figure 3 , the opening of the receiving groove 221 faces the back cover 21. When the circuit board assembly 30 is assembled, the circuit board assembly 30 can be installed in the receiving groove 221 before the back cover 21 is assembled. When the electronic device 100 fails, the circuit board assembly 30 can be directly observed after the back cover 21 is disassembled, and the circuit board assembly 30 can be easily disassembled through the opening. In this way, the assembly and disassembly of the circuit board assembly 30 are facilitated.

[0100] Specifically, the accommodating groove 221 includes a first inner wall surface 224 and a second inner wall surface 225 relative to each other, a third inner wall surface 226 and a fourth inner wall surface 227 relative to each other connected between the first inner wall surface 224 and the second inner wall surface 225, and a bottom wall surface 228 opening toward the accommodating groove 221, and the bottom wall surface 228 is located on the side of the first inner wall surface 224 and the second inner wall surface 225 away from the opening of the accommodating groove 221.

[0101] The extending direction of the first inner wall surface 224 and the extending direction of the second inner wall surface 225 are parallel to the length direction of the electronic device 100, that is, Figure 3 The extension direction of the third inner wall surface 226 and the extension direction of the fourth inner wall surface 227 are parallel to the width direction of the electronic device 100, that is, Figure 3 The bottom wall surface 228 may be connected between the first inner wall surface 224 and the second inner wall surface 225, the bottom wall surface 228 may be connected between the third inner wall surface 226 and the fourth inner wall surface 227, and the bottom wall surface 228 may be connected to the first inner wall surface 224, the second inner wall surface 225, the third inner wall surface 226 and the fourth inner wall surface 227 at the same time.

[0102] This embodiment and the following embodiments are described by taking the connection between the bottom wall surface 228 and the first inner wall surface 224 and the second inner wall surface 225 as an example, and define the line connecting the midpoint D1 of the first inner wall surface 224 and the midpoint D2 of the second inner wall surface 225 as the center line L1 of the bottom wall surface 228, one end of the bottom wall surface 228 extends a certain distance from the center line L1 to the direction of the third inner wall surface 226, and the other end of the bottom wall surface 228 extends a certain distance from the center line L1 to the direction of the fourth inner wall surface 227. Among them, "the midpoint D1 of the first inner wall surface 224" refers to the area on the first inner wall surface 224 where the distance from the third inner wall surface 226 and the distance from the fourth inner wall surface 227 are equal. Similarly, "the midpoint D2 of the second inner wall surface 225" is also defined as above. The length of the bottom wall surface 228 can be between one fifteenth and one tenth of the length of the circuit board 31, and this length does not constitute a special limitation of this application. In this way, the bottom wall surface 228 can not only support the circuit board 31 , but also the hollow areas on both sides of the bottom wall surface 228 can save the weight of the electronic device 100 , thereby improving the user experience.

[0103] See also Figure 4 , Figure 4 A schematic diagram of the structure of a circuit board 31 provided in some embodiments of the present application. Based on the above content, the circuit board 31 is further introduced, and the circuit board 31 also includes a first side surface S4 and a third side surface S6 connected between the first surface S1 and the third surface S3, and a second side surface S5 and a sixth side surface S9 connected between the first surface S1 and the third surface S3, which are opposite to each other.

[0104] See also Figure 5 , Figure 5 for Figure 4 The circuit board 31 is mounted on Figure 3 Schematic diagram of the structure in the receiving groove 221 in FIG. The circuit board assembly 30 is installed in the receiving groove 221, the first surface S1 of the circuit board 31 faces the first inner wall surface 224, the second surface S2 faces the second inner wall surface 225, the first side surface S4 faces the opening of the receiving groove 221, the second side surface S5 faces the third inner wall surface 226, the third side surface S6 faces the bottom wall surface 228, and the sixth side surface S9 faces the fourth inner wall surface 227. The circuit board assembly 30 can be bonded to the inner wall of the receiving groove 221 through at least one of the first surface S1, the second surface S2, the second side surface S5, the third side surface S6 and the sixth side surface S9, or the circuit board 31 is abutted between the back cover 21 and the bottom wall surface 228, and a filler can be arranged between the circuit board 31 and the back cover 21 or between the circuit board 31 and the bottom wall surface 228 to improve the stability of the fixing of the circuit board 31.

[0105] However, the circuit board assembly 30 fixed in the above manner may be unstable for the following reasons: the side area of ​​the circuit board 31 is small, and when the side area is connected to the back cover 21 or the bottom wall 228, the bonding may be unstable. After the circuit board assembly 30 is placed in the receiving groove 221, it may be difficult to disassemble. Since the circuit board 31 is connected to the inner wall of the receiving groove 221 by bonding, when disassembling the circuit board assembly 30, it is difficult to remove the circuit board assembly 30 inside the receiving groove 221 due to the small space. It is necessary to use other disassembly tools to remove the circuit board assembly 30, for example, prying the circuit board 31 out of the receiving groove 221 with a crowbar. However, the circuit board 31 may be easily damaged during the disassembly process.

[0106] In order to solve the above problems, the present application also provides a circuit board assembly 30, see Figure 6 , Figure 6 A schematic diagram of the structure of a circuit board assembly 30 provided in some embodiments of the present application. The difference between the circuit board assembly 30 and the above-mentioned circuit board assembly 30 is that the circuit board assembly 30 also includes a bracket 40. The bracket 40 is described in detail below. The bracket 40 is connected to the circuit board 31. "The bracket 40 is connected to the circuit board 31" means that at least part of the bracket 40 is connected to the circuit board 31 to fix the bracket 40 on the circuit board 31. The bracket 40 includes a first bracket portion 41. In some embodiments, the bracket 40 can be connected to the circuit board 31 through the first bracket portion 41. The first bracket portion 41 is located on the side facing the first surface S1, that is, the first bracket portion 41 and the first group of electronic components 32 are located on the same side of the circuit board 31. The direction perpendicular to the first surface S1 is the first direction, that is, the direction of the X-axis in the figure. At least part of the first bracket portion 41 in the first direction is an elastic soft structure. When the bracket 40 is subjected to a force along the first direction, the elastic soft structure can be compressed and rebounded in the first direction.

[0107] In some embodiments, the material of the bracket 40 includes but is not limited to metals such as stainless steel, aluminum alloy, and titanium alloy. Such materials also have good heat dissipation performance, thereby facilitating the heat dissipation of the electronic device 100, and such materials have high structural strength, which can ensure the stability of the bracket 40 during use. In some other embodiments, the material of the bracket 40 can also be non-metallic materials such as polycarbonate (PC), PC+glass fiber, and ABS plastic (acrylonitrile butadienestyrene plastic). The weight of the bracket 40 made of such materials is lighter, which is conducive to reducing the weight of the electronic device 100, thereby improving the user experience.

[0108] The first bracket portion 41 may be in the shape of a plate, a block, a strip, etc. This embodiment and the following embodiments are described by taking the first bracket portion 41 as a plate as an example, but this does not represent a special limitation on the present application. Further, the first bracket portion 41 may be in the shape of a square plate, a circular plate, an elliptical plate, a special-shaped plate, etc. This embodiment and the following embodiments are described by taking the first bracket portion 41 as a square plate as an example. In this way, the first bracket portion 41 includes a second surface S2 facing the first surface S1, and the first bracket portion 41 can be connected to the circuit board 31 through the second surface S2.

[0109] The first bracket portion 41 can be connected to the circuit board 31 by bonding, clamping, threading, etc. This embodiment and the following embodiments are described by taking the bonding of the first bracket portion 41 to the circuit board 31 as an example. Specifically, an adhesive material is provided between the first bracket portion 41 and the first surface S1 to bond the first bracket portion 41 to the first surface S1. The adhesive material can be made of materials such as adhesive thermally conductive adhesive and thermally conductive gel, which helps to dissipate heat when the electronic device 100 is in use, thereby improving the performance of the electronic device 100. However, the above does not constitute a special limitation on the present application, that is, the use of other adhesive materials also falls within the scope of protection of the present application.

[0110] The material of the elastic soft structure can be rubber, silicone, foam, sponge, etc. Based on the premise that the first bracket part 41 is a square plate, the elastic soft material can be at least part of the square plate in the first direction, and the rest of the square plate is a hard material. The elastic soft material can also be a part protruding from the surface of the square plate, and the elastic soft material protrudes from the square plate in the first direction.

[0111] Based on the above embodiment, the difference from only bonding the circuit board 31 to other structural members through the side or surface is that a bracket 40 is provided on the circuit board 31, and the circuit board assembly 30 is connected to other structural members with the help of the bracket 40. On the one hand, the bracket 40 can provide a larger connection area for the connection of the circuit board assembly 30, thereby connecting the circuit board assembly 30 to other structural members more stably and reliably. On the other hand, when the circuit board assembly 30 is disassembled, force can be directly applied to the bracket 40 to disassemble the circuit board 31 from other structural members, thereby avoiding damage to the circuit board assembly 30 by directly applying force to the circuit board assembly 30, thereby improving the stability of the circuit board assembly 30 in use. Furthermore, after the circuit board 31 is installed, the bracket 40 also squeezes the circuit board 31 between two opposite structural members by providing an elastic soft structure, thereby forming an interference fit between the circuit board 31 and other structural members, making the connection of the circuit board assembly 30 more stable, thereby further improving the stability and reliability of the circuit board assembly 30 after installation.

[0112] See also Figure 7 , Figure 7 for Figure 6 Schematic diagram of the structure in which the circuit board assembly 30 is installed in the receiving groove 221. The surface of the bracket 40 facing away from the circuit board 31 faces the first inner wall surface 224, and the surface of the circuit board 31 facing away from the bracket 40 (that is, the third surface S3 of the circuit board 31) faces the second inner wall surface 225. The circuit board assembly 30 is installed between the first inner wall surface 224 and the second inner wall surface 225. The circuit board assembly 30 can be bonded to the first inner wall surface 224 of the receiving groove 221 through the bracket 40. Furthermore, the elastic soft structure on the bracket 40 forms an interference fit between the circuit board assembly 30 and the first inner wall surface 224 and the second inner wall surface 225, thereby making the circuit board assembly 30 more stably and reliably connected to the receiving groove 221.

[0113] Please continue reading Figure 6 and Figure 7 , the number of the brackets 40 can be set to at least one, that is, the bracket 40 can be set to only one, or two, three, four, etc. The number of the brackets 40 can be determined according to the length of the circuit board 31. For example, when the length of the circuit board 31 is large, the number of the brackets 40 can be set to two. The circuit board 31 includes a first end 31a and a second end 31b opposite to each other, and the first end 31a and the second end 31b are two ends in the length direction of the circuit board 31. The two brackets 40 are symmetrically arranged at the first end 31a and the second end 31b. In this way, the circuit board 31 is fixed in the receiving groove 221 by the two brackets 40, and the circuit board assembly 30 can be more firmly and reliably connected to the receiving groove 221.

[0114] In some other embodiments, when the length of the circuit board 31 is greater, a greater number of brackets 40 may be provided to fix the circuit board assembly 30. When the length of the circuit board 31 is smaller, one bracket 40 may be provided to achieve stability and reliability in the installation of the circuit board assembly 30. Therefore, the present application does not specifically limit the number of brackets 40, and the number of brackets 40 may be selected according to the length of the circuit board 31 and the requirements for the stability of the installation of the circuit board 31. The above embodiments and some of the following embodiments are described by taking the number of brackets 40 as two as an example.

[0115] The specific structure of the first bracket part 41 is introduced below. Figure 8 , Figure 8A schematic diagram of the structure of the bracket 40 provided for some embodiments of the present application. Based on the above introduction to the bracket 40, the first bracket part 41 is in the shape of a square plate, and the first bracket part 41 includes a substrate part 412 and an elastic adhesive 413, and the substrate part 412 is connected to the first surface S1. The elastic adhesive 413 is arranged on the surface of the substrate part 412 that is away from the first surface S1, and the elastic adhesive 413 forms an elastic soft structure. The elastic adhesive 413 covers at least part of the surface of the substrate part 412 that is away from the first surface S1, for example, the elastic adhesive 413 can cover one-third to one-half of the surface of the substrate part 412 that is away from the first surface S1, and the elastic adhesive 413 can also cover the entire surface of the substrate part 412 that is away from the first surface S1. The present application does not specifically limit the coverage area of ​​the elastic adhesive 413. It can be understood that the elastic adhesive 413 can be selected according to the size of the volume of the circuit board 31, and the area size of the elastic adhesive 413 is within the protection scope of the present application.

[0116] The elastic adhesive material 413 may include a portion protruding from the surface of the substrate portion 412 and a portion extending into the interior of the substrate portion 412. Figure 8 The dotted line in the figure indicates the portion. The height of the elastic adhesive 413 protruding from the surface of the substrate portion 412 is greater than or equal to 0.05 mm. For example, the height of the elastic adhesive 413 protruding from the surface of the substrate portion 412 can be 0.05 mm, 0.07 mm, 0.08 mm, 0.1 mm, 0.12 mm, etc. In this way, the extension length of the elastic adhesive 413 is larger, providing a greater elastic force for fixing the circuit board assembly 30, so that the circuit board assembly 30 and the receiving groove 221 are interference-fitted, thereby making the installation of the circuit board assembly 30 more stable and reliable.

[0117] The elastic adhesive material 413 may be integrally formed with the base plate portion 412 , or the elastic adhesive material 413 may be connected to the base plate portion 412 by assembly.

[0118] The elastic adhesive material 413 may be made of adhesive thermally conductive adhesive, thermally conductive gel and other materials, which helps to dissipate heat when the electronic device 100 is in use, thereby improving the performance of the electronic device 100. However, the above does not constitute a special limitation on the present application, that is, the use of other elastic adhesive materials 413 also falls within the protection scope of the present application.

[0119] The elastic soft structure adopts the elastic adhesive material 413, which can play multiple roles. First, the circuit board assembly 30 can be bonded to the first inner wall surface 224 by the elastic adhesive material 413; second, the elastic adhesive material 413 is located between the substrate portion 412 and the first inner wall surface 224, so that the circuit board assembly 30 and the receiving groove 221 form an interference fit, thereby improving the stability and reliability of the installation of the circuit board assembly 30; third, when the circuit board assembly 30 collides, the elastic adhesive material 413 has a certain buffering effect, thereby protecting the circuit board assembly 30, avoiding damage to the circuit board assembly 30 in the collision, and further improving user satisfaction.

[0120] Please also read Fig. 9 and Fig.10 , Fig. 9 for Figure 7 A schematic diagram of the structure of the bracket 40 observed from the F1 angle; Fig.10 A schematic diagram of the structure of a circuit board 31 provided for some embodiments of the present application. A first adhesive material 414 is provided between the first surface S1 of the circuit board 31 and the second surface S2 of the bracket 40, and the bracket 40 is bonded to the circuit board 31 through the first adhesive material 414. In order to improve the accuracy of the cooperation between the bracket 40 and the circuit board 31, the first surface S1 is provided with a first positioning portion 33, and the second surface S2 is provided with a second positioning portion 411 that cooperates with the first positioning portion 33. The cooperation between the first positioning portion 33 and the second positioning portion 411 improves the accuracy of the bonding between the bracket 40 and the circuit board 31, thereby reducing the assembly error between the bracket 40 and the circuit board 31, further improving the stability and reliability of the connection between the bracket 40 and the circuit board 31, and improving the assembly accuracy of the circuit board assembly 30 and the electronic device 100.

[0121] Please continue reading Fig. 9 and Fig.10 , further, the first positioning portion 33 is a notch, and the notch runs through the third side surface S6; the second positioning portion 411 is a bump that matches the notch. In one embodiment, the bump is provided on the bracket 40, and the notch is provided on the circuit board 31. In some other embodiments, the bump is provided on the circuit board 31, and the notch is provided on the bracket 40. This embodiment and the following embodiments are described by taking the example that the bump is provided on the bracket 40 and the notch is provided on the circuit board 31.

[0122] Specifically, the protrusion can be a square block, a round block, an elliptical block, a special-shaped block, etc. protruding from the second surface S2. The shape of the notch is consistent with the shape of the protrusion to accommodate the protrusion. In addition, the notch passes through the third side surface S6, and correspondingly, the protrusion is arranged in the area of ​​the second surface S2 close to the third side surface S6, that is, the area of ​​the second surface S2 that is lower in the Z-axis direction. Please refer to Fig.11 , Fig.11 for Fig. 9 The bracket 40 is installed on Fig.10 Schematic diagram of the structure of the circuit board 31 in FIG. In this way, when the bracket 40 is assembled with the circuit board 31, in the thickness direction of the electronic device 100 (that is, the Z-axis direction), the first positioning portion 33 of the circuit board 31 is aligned with the second positioning portion 411 of the bracket 40, and after alignment, the second positioning portion 411 is pushed into the first positioning portion 33 to accommodate the second positioning portion 411 in the first positioning portion 33, thereby achieving the positioning of the bracket 40 and the circuit board 31, improving the accuracy of bonding between the bracket 40 and the circuit board 31, thereby reducing the assembly error between the bracket 40 and the circuit board 31, further improving the stability and reliability of the connection between the bracket 40 and the circuit board 31, and improving the assembly accuracy of the circuit board assembly 30 and the electronic device 100.

[0123] The above embodiment uses the first bracket portion 41 to fix the circuit board assembly 30 in the width direction of the electronic device 100. Based on this, in order to further improve the stability of the installation of the circuit board assembly 30, please refer to Fig.12 and Fig.13 , Fig.12 A schematic diagram of the structure of a bracket 40 provided in some other embodiments of the present application; Fig.13 for Fig.12 The bracket 40 further includes a second bracket portion 42, which is connected to the first bracket portion 41. Specifically, the second bracket portion 42 can be connected to the second surface S2 of the first bracket portion 41 and is located on the side facing the first side surface S4. In some other embodiments, the second bracket portion 42 can also be connected to other surfaces of the first bracket portion 41, which is not particularly limited here.

[0124] The second bracket portion 42 may be in a block shape, a plate shape, a strip shape, etc., and in this embodiment and the following embodiments, the second bracket portion 42 is in a block shape as an example for description. The second bracket portion 42 may be in a square block shape, a round block shape, an elliptical block shape, etc., and in this embodiment and the following embodiments, the second bracket portion 42 is in a square block shape as an example for description. The second bracket portion 42 includes a seventh surface ( Fig.12), and a fifth surface S14 opposite to the seventh surface. The second bracket portion 42 is connected to the second surface S2 through the seventh surface, and the fifth surface S14 is a square block extending in the direction of the first surface S1. In addition, the second bracket portion 42 extends to at least a portion of the first side surface S4, and "the second bracket portion 42 extends to at least a portion of the first side surface S4" means that the orthographic projection of the first side surface S4 on the second bracket portion 42 overlaps with the second bracket portion 42. "Overlap" means that the orthographic projection of the first side surface S4 on the second bracket portion 42 can be completely overlapped with the second bracket portion 42, and the orthographic projection of the first side surface S4 on the second bracket portion 42 can also overlap with the second bracket portion 42 at least partially.

[0125] The second bracket portion 42 may be in direct contact with the first side surface S4 of the circuit board 31 , or may have a certain gap with the first side surface S4 of the circuit board 31 , or may abut against the first side surface S4 of the circuit board 31 .

[0126] In this way, the second bracket portion 42 plays a limiting role on the side of the circuit board 31 that the first side surface S4 faces. Specifically, the first bracket portion 41 plays a limiting role in the thickness direction of the circuit board 31. Fig.13 In the X-axis direction, the second bracket portion 42 plays a limiting role in the width direction of the circuit board 31, that is, Fig.13 Furthermore, in the width direction of the circuit board 31, the circuit board 31 is more accurately mounted on the circuit board 31 through the cooperation between the second positioning portion 411 and the second bracket portion 42, thereby reducing the assembly error between the bracket 40 and the circuit board 31 and improving the assembly accuracy of the bracket 40 and the circuit board 31. Further, the stability and reliability of the circuit board assembly 30 installed in the electronic device 100 are improved.

[0127] Please also read Fig.13 and Fig.14 , Fig.14 for Fig.13The structural diagram of the bracket 40 is observed from the F2 angle. In the width direction of the circuit board 31, that is, in the Z-axis direction, the bracket 40 includes a seventh side surface S7 and an eighth side surface S8 facing each other, wherein the seventh side surface S7 is the side surface of the bracket 40 close to the first side surface S4. Specifically, the seventh side surface S7 includes a side surface S71 of the first bracket portion 41 and a side surface S72 of the second bracket portion 42, and the side surface S71 of the first bracket portion 41 and the side surface S72 of the second bracket portion 42 are located in the same plane a. In this way, the flatness of the seventh side surface S7 is ensured, and the problem of difficulty in installation caused by the unevenness of the first bracket portion 41 and the second bracket portion 42 is avoided, because the uneven plane has a larger assembly error when it cooperates with other surfaces, and it is difficult to fit and fix with other surfaces.

[0128] In some other embodiments, the side S71 of the first bracket portion 41 and the side S72 of the second bracket portion 42 may not be in the same plane. For example, the side S72 of the second bracket portion 42 may protrude from the side S71 of the first bracket portion 41, and a notch is set in the area of ​​the electronic device 100 opposite to the second bracket portion 42, and the part of the second bracket portion 42 protruding from the first bracket portion 41 cooperates with the notch to facilitate the positioning of the bracket 40 and the electronic device 100 during installation.

[0129] In some embodiments, see Fig.15 and Fig.16 , Fig.15 A schematic diagram of the structure of a circuit board 31 provided in some other embodiments of the present application; Fig.16 for Fig.14 The bracket 40 is installed on Fig.15 The schematic diagram of the structure of the circuit board 31 in FIG. The circuit board 31 also includes a third side S6 opposite to the first side S4, and a fourth side S11 and a fifth side S12, and the distance from the first side S4 to the third side S6 is smaller than the distance from the fourth side S11 to the third side S6. When the bracket 40 is installed on the circuit board 31, the positioning of the bracket 40 can be achieved by the cooperation between the second bracket part 42 and the first side S4, thereby ensuring the stability and reliability of the circuit board assembly 30. In addition, the second bracket part 42 is accommodated in the gap surrounded by the fourth side S11 and the fifth side S12, which further ensures the flatness of the overall appearance of the circuit board assembly 30 after the bracket 40 is fixed to the circuit board 31, thereby facilitating the convenience and accuracy of installing the circuit board assembly 30 on the electronic device 100.

[0130] In the above embodiment, the circuit board assembly 30 is fixed in the width direction of the electronic device 100 by the first bracket part 41, and the circuit board assembly 30 is fixed in the thickness direction of the electronic device 100 by the second bracket part 42. Based on this, in order to further improve the stability of the installation of the circuit board assembly 30, please continue to refer to Fig.12 , Fig.13 and Fig.14 The bracket 40 also includes a third bracket portion 43, which is located on the side facing the third side surface S6 of the circuit board 31. The third bracket portion 43 can be connected to the first bracket portion 41, and the third bracket portion 43 can also be connected to the second bracket portion 42. The third bracket portion 43 can also be connected to both the first bracket portion 41 and the second bracket portion 42. This embodiment and the following embodiments are described by taking the example that the third bracket portion 43 is connected to both the first bracket portion 41 and the second bracket portion 42.

[0131] Please continue reading Fig.12 , Fig.13 and Fig.14 The third bracket part 43 can be in a block shape, a plate shape, a strip shape, etc., and in this embodiment and the following embodiments, the third bracket part 43 is in a block shape as an example for description. The third bracket part 43 can be in a square block shape, a circular block shape, an elliptical block shape, etc., and in this embodiment and the following embodiments, the third bracket part 43 is in a square block shape as an example for description.

[0132] Specifically, the top surface of the third bracket portion 43 faces the second bracket portion 42 and is connected to the second bracket portion 42, and the side surface of the third bracket portion 43 faces the first bracket portion 41 and is connected to the first bracket portion 41. In this way, the first bracket portion 41, the second bracket portion 42 and the third bracket portion 43 form a bracket receiving groove 44. Fig.16 , at least part of the circuit board 31 is accommodated in the accommodating groove 44 of the bracket, specifically, the first surface S1 of the circuit board 31 is connected to the first bracket part 41, the first side surface S4 of the circuit board 31 faces the second bracket part 42, and the second side surface S5 of the circuit board 31 faces the third bracket part 43. The circuit board 31 can directly contact the second bracket part 42 and the third bracket part 43, or the circuit board 31 can have a certain gap with the second bracket part 42 and the third bracket part 43.

[0133] The bracket 40 limits the circuit board 31 in three directions, thereby reducing the assembly error between the bracket 40 and the circuit board 31 and improving the assembly accuracy of the bracket 40 and the circuit board 31. Further, the stability and reliability of the circuit board assembly 30 installed in the electronic device 100 are improved.

[0134] The above embodiments are described by taking the connection between the first surface S1 of the circuit board 31 and the first bracket part 41 as an example. In some other embodiments, the first surface S1 of the circuit board 31 can also be connected to the second bracket part 42, and the first surface S1 of the circuit board 31 can also be connected to the third bracket part 43. In some other embodiments, the first surface S1 of the circuit board 31 can also be connected to two or three of the first bracket part 41, the second bracket part 42, and the third bracket part 43 at the same time to improve the connection strength between the circuit board 31 and the bracket 40. Therefore, the connection between the circuit board 31 and the bracket 40 is not limited to one area on the bracket 40, and the area connected to the circuit board 31 can be flexibly selected according to the specific structure of the bracket 40, further improving the flexibility of the connection between the bracket 40 and the circuit board 31.

[0135] Please continue reading Fig.16 , define the arrangement direction of the first side surface S4 and the third side surface S6 as the second direction, that is, Fig.16 In the Z-axis direction of the bracket 40. In the second direction, the bracket 40 includes a seventh side surface S7 and an eighth side surface S8 facing each other. The seventh side surface S7 is located on the side of the first side surface S4 away from the third side surface S6, and the eighth side surface S8 is located on the side of the first side surface S4 away from the seventh side surface S7. In other words, the seventh side surface S7 is the surface of the bracket 40 facing the opening of the receiving groove 221, and the eighth side surface S8 is arranged opposite to the seventh side surface S7. In the width direction of the circuit board assembly 30, that is, Fig.16 In the Z-axis direction, the seventh side surface S7 of the bracket 40 protrudes from the first side surface S4 of the circuit board 31.

[0136] In this way, after the circuit board assembly 30 is installed in the receiving groove 221, after the back cover 21 of the electronic device 100 is installed on the frame 22, the circuit board assembly 30 is located between the bottom wall of the receiving groove 221 and the back cover 21. The bracket 40 can directly contact the back cover 21 to achieve the fixation of the circuit board assembly 30 in the second direction. Further, the back cover 21 can form an interference fit relationship with the circuit board assembly 30 to squeeze the circuit board assembly 30 into the receiving groove 221, further improving the stability and reliability of the circuit board assembly 30 installed in the receiving groove 221.

[0137] In some other embodiments, the bracket 40 and the back cover 21 may not be in contact, and there may be a certain gap between the bracket 40 and the back cover 21. The bracket 40 and the back cover 21 may also be in contact with each other by means of other structural members. For example, a filler may be provided between the bracket 40 and the back cover 21, and the filler may be squeezed between the bracket 40 and the back cover 21, so as to further improve the stability and reliability of the circuit board assembly 30 installed in the receiving groove 221.

[0138] In some other embodiments, the seventh side surface S7 may be flush with the first side surface S4 , thereby ensuring the flatness of the appearance of the circuit board assembly 30 .

[0139] Please continue reading Fig.16 , the eighth side S8 is located between the first side S4 and the third side S6. That is to say, in the width direction of the circuit board assembly 30, that is, the Z-axis direction in the figure, the third side S6 of the circuit board 31 protrudes from the eighth side S8 of the bracket 40. The height of the third side S6 protruding from the eighth side S8 is greater than or equal to 0.1 mm. The height of the third side S6 protruding from the eighth side S8 can be 0.1 mm, 0.11 mm, 0.13 mm, 0.15 mm, etc. In this way, after the circuit board assembly 30 is installed in the accommodating groove 221, the circuit board assembly 30 directly contacts the bottom wall surface 228 of the accommodating groove 221 through the third side S6. The circuit board assembly 30 relies on the circuit board 31 itself for installation and positioning, reducing the error during assembly of the circuit board assembly 30 and improving the accuracy of the circuit board assembly 30 installed in the electronic device 100.

[0140] See also Fig.17 and Fig.18 , Fig.17 for Fig.16 A schematic diagram of the structure in which the circuit board assembly 30 is installed in the receiving groove 221; Fig.18 for Fig.17 2. The circuit board assembly 30 is installed in the receiving groove 221. After the bracket 40 is installed on the circuit board 31, the circuit board assembly 30 with the bracket 40 is installed in the receiving groove 221 of the frame 22. In the width direction of the electronic device 100, that is, Fig.17 In the X-axis direction, one side surface of the circuit board assembly 30 is connected to the first inner wall surface 224 through the bracket 40, and the other side surface of the circuit board assembly 30 is connected to the second inner wall surface 225 through the third surface S3 of the circuit board 31.

[0141] In this way, in the width direction of the electronic device 100, the circuit board assembly 30 is fixed in the receiving groove 221. In addition, one side surface of the circuit board assembly 30 is connected to the second inner wall surface 225 of the receiving groove 221 through the circuit board 31 itself, further reducing the assembly error between the circuit board assembly 30 and the frame 22, thereby improving the installation accuracy of the circuit board assembly 30. Furthermore, by the direct contact between the third surface S3 and the second inner wall surface 225, the stability and reliability of the circuit board assembly 30 in use are further improved, avoiding the problem of easy breakage caused by the third surface S3 of the circuit board 31 not being fixed to form a cantilever structure.

[0142] Based on the above embodiment, in the length direction of the electronic device 100, that is, Fig.17In the Y-axis direction of the circuit board assembly 30, the circuit board assembly 30 is fixed in the receiving groove 221 through the brackets 40 at both ends. Specifically, the bracket 40 located at the first end 31a of the circuit board 31 is connected to the third inner wall surface 226 of the receiving groove 221, and the bracket 40 located at the second end 31b of the circuit board 31 is connected to the fourth inner wall surface 227 of the receiving groove 221. The distance between the bracket 40 located at the first end 31a and the third inner wall surface 226, and the distance between the bracket 40 located at the second end 31b and the fourth inner wall surface 227 are less than or equal to 0.15 mm. For example, the distance between the bracket 40 located at the first end 31a and the third inner wall surface 226, and the distance between the bracket 40 located at the second end 31b and the fourth inner wall surface 227 can be 0.05 mm, 0.1 mm, and 0.15 mm. In this way, the circuit board assembly 30 is fixed in the receiving groove 221 by the bracket 40 in the length direction of the electronic device 100. On the one hand, the bracket 40 increases the connection area between the circuit board assembly 30 and the receiving groove 221 in the length direction, thereby improving the connection strength of the circuit board assembly 30 fixed in the receiving groove 221, and further improving the stability and reliability of the electronic device 100 during use. On the other hand, when it is necessary to disassemble the circuit board assembly 30, it is sufficient to remove the connection between the bracket 40 and the receiving groove 221. Specifically, the circuit board assembly 30 can be pried up by applying a crowbar to the bracket 40, without applying external force to the circuit board 31, thereby avoiding damage to the circuit board assembly 30 during the disassembly process of the circuit board assembly 30, thereby extending the service life of the electronic device 100 and improving the user experience.

[0143] To further facilitate the removal of the circuit board 31, please continue to refer to Fig.17 In some embodiments, the first inner wall surface 224 is provided with an avoidance groove 22a, and the direction of the avoidance groove 22a is consistent with the direction of the opening of the receiving groove 221. Specifically, the avoidance groove 22a extends from the direction of the first inner wall surface 224 away from the bracket 40, and the avoidance groove 22a penetrates to the opening of the receiving groove 221. In this way, when the circuit board assembly 30 is disassembled, the bracket 40 can be forced through the avoidance groove 22a to remove the circuit board assembly 30 from the receiving groove 221. Specifically, the bracket 40 can be forced through the avoidance groove 22a by means of a pry bar to pry the circuit board assembly 30 out of the receiving groove 221. When the bracket 40 and the frame 22 are connected by bonding, when the circuit board assembly 30 is disassembled, the glue between the bracket 40 and the frame 22 can be melted first, and the circuit board assembly 30 can be taken out through the avoidance groove 22a after the glue is melted. Therefore, by providing the avoidance groove 22 a , the convenience of disassembling the circuit board assembly 30 is improved, and damage to the circuit board assembly 30 when disassembling the circuit board assembly 30 is avoided, thereby improving the reliability and stability of the circuit board assembly 30 .

[0144] Please continue reading Fig.17 and Fig.18 In some other embodiments, in order to facilitate the disassembly of the circuit board assembly 30, a second avoidance notch 40a may be provided on the bracket 40, and the second avoidance notch 40a is provided on the seventh side surface S7, and the opening of the second avoidance notch 40a faces the seventh side surface S7 away from the eighth side surface S8. Further, the second avoidance notch 40a may be provided on the surface of the first bracket portion 41 facing the opening of the receiving groove 221, or on the surface of the second bracket portion 42 facing the opening of the receiving groove 221, or on the surface of the third bracket portion 43 facing the opening of the receiving groove 221. In this embodiment, the second avoidance notch 40a may be provided on the basis of the above embodiment, or the avoidance groove 22a may not be provided, and only the second avoidance notch 40a may be provided.

[0145] The convenience of disassembling the circuit board assembly 30 is further improved by providing the second avoidance notch 40a. When disassembling the circuit board assembly 30, force can be applied to the bracket 40 through the second avoidance notch 40a to remove the circuit board assembly 30 from the receiving groove 221. Specifically, force can be applied to the bracket 40 through the second avoidance notch 40a with the aid of a pry bar to pry the circuit board assembly 30 out of the receiving groove 221. When the bracket 40 and the frame 22 are connected by bonding, when disassembling the circuit board assembly 30, the glue between the bracket 40 and the frame 22 can be melted first, and the circuit board assembly 30 can be taken out through the second avoidance notch 40a after the glue is melted. Therefore, the convenience of disassembling the circuit board assembly 30 is improved by providing the second avoidance notch 40a, and damage to the circuit board assembly 30 when disassembling the circuit board assembly 30 is avoided, thereby improving the reliability and stability of the use of the circuit board assembly 30.

[0146] Please continue reading Fig.17 and Fig.18 In some embodiments, the circuit board assembly 30 also includes a flexible electrical connection structure connected to the circuit board 31. The circuit board assembly 30 can be electrically connected to the main circuit board 311 with the help of the flexible electrical connection structure. The flexible electrical connection structure includes but is not limited to a flexible printed circuit board 50 (flexible printed circuit board, FPC) and a structural member formed by weaving wires and soft materials. In this embodiment, the flexible electrical connection structure 43 is used as an example of the flexible circuit board 50.

[0147] See also Fig.19 , Fig.19A schematic diagram of the structure of a circuit board assembly 30 provided for some further embodiments of the present application. Specifically, the flexible circuit board 50 includes a first portion 51, a second portion 52, and a bending portion 53 connected between the first portion 51 and the second portion 52, and the bending portion 53 is located on the side of the first side S4 of the circuit board 31 away from the third side S6, and the first portion 51 is connected to the circuit board 31. The first side S4 is also provided with a fourth avoidance gap 34 opposite to the bending portion 53, and at least part of the bending portion 53 is accommodated in the fourth avoidance gap 34. "Opposite to the bending portion 53" means that the orthographic projection of the bending portion 53 on the first side S4 overlaps with the first side S4. The first portion 51 is connected to the first surface S1 of the circuit board 31, and extends to the first side S4 along the width direction of the first surface S1. The second portion 52 extends from the surface of the main board circuit board 311 to one side of the first side surface S4. The bending portion 53 connects the first portion 51 and the second portion 52 above the first side surface S4. Since the first portion 51 and the second portion 52 extend in different directions, the bending portion 53 serves to connect the first portion 51 and the second portion 52. In order to ensure the flatness of the overall structure of the circuit board assembly 30, the fourth avoidance notch 34 is provided to accommodate the bending portion 53, so as to prevent the bending portion 53 from protruding from the circuit board assembly 30. Furthermore, the assembly of the circuit board assembly 30 and the frame 22 is more convenient, which is beneficial to the stability and reliability of the installation of the circuit board assembly 30.

[0148] The first part 51 can be a board-to-board (BTB) connector at both ends of the FPC. The FPC is a flexible connector that can be deformed and can flexibly adapt to the spatial layout, so that it is easy to connect the external connection end and the main board circuit board 311. It can be seen that the flexible electrical connection structure is not limited to establishing a connection with the electronic component through the BTB. For example, the components of the electronic device 100 can be provided with springs as the connection ends, and the first part of the flexible electrical connection structure can directly expose copper to connect with the springs, or establish a connection through conductive glue, etc. This embodiment does not make specific restrictions. In some embodiments, the first part 51 can be bonded to the circuit board 31, and the first part 51 can also be welded to the circuit board 31.

[0149] The material of the flexible electrical connection structure can be liquid crystal polymer (LPC), polyimide (PI), modified polyimide (MPI), etc., as long as it can realize the circuit layout function and has a certain bending ability.

[0150] Please continue reading Fig.19, the circuit board assembly 30 also includes an elastic connector 60. When the circuit board assembly 30 is used as the side key circuit board 31 of the electronic device 100, for example, the volume circuit board 31 and the switch circuit board 31 of the electronic device 100. The elastic connector 60 is set corresponding to the side keys on the outer surface of the shell to realize various functions of the electronic device 100. Based on the fact that the third surface S3 of the circuit board 31 is directly connected to the second inner wall surface 225, when the side key is pressed, the side key transfers the external force to the elastic connector 60 on the circuit board 31, and the elastic connector 60 transfers the force to the circuit board 31 after being subjected to the force. Since the third surface S3 of the circuit board 31 is directly connected to the second inner wall surface 225, the second inner wall surface 225 can provide reliable support for the circuit board 31, thereby avoiding structural damage to the circuit board 31 when subjected to external force. In addition, due to the support of the second inner wall surface 225, the circuit board 31 is prevented from elastically deforming when subjected to force, further avoiding the problem of false contact between the side keys and the elastic connector 60 caused by the elastic deformation of the circuit board 31, thereby ensuring the performance of the circuit board assembly 30.

[0151] In some other embodiments, when the circuit board assembly 30 is not used as the side key circuit board 31 of the electronic device 100, the circuit board assembly 30 may also include an elastic connector 60. One side of the elastic connector 60 may be connected to the circuit board 31 by welding, bonding, clamping, or other fixing methods, and the other side of the elastic connector 60 may abut against the first inner wall surface 224.

[0152] Please also read Fig. 20 and Fig.21 , Fig. 20 A schematic diagram of the structure of a bracket 40 provided in some other embodiments of the present application; Fig.21 for Fig. 20 The bracket 40 is a schematic structural diagram of the bracket 40 viewed from the F3 angle. The bracket 40 further includes a protrusion 421, which can be arranged on the second bracket portion 42, on the third bracket portion 43, or on both the second bracket portion 42 and the third bracket portion 43. The arrangement direction of the circuit board 31 and the bracket 40 is defined as the first direction, that is, Fig. 20 In the X-axis direction of FIG. 4 , the protrusion 421 extends along the first direction and protrudes from the third surface S3 in the first direction. In other words, the protrusion 421 extends from the bracket 40 toward the circuit board 31 and protrudes from the third surface S3 of the circuit board 31. Fig. 22 and Fig.23 , Fig. 22 for Fig.21 A structural diagram of the bracket 40 in FIG. 4 being connected to the circuit board 31 and installed in the receiving groove 221; Fig.23 for Fig. 224. A top view of the circuit board 31 in the electronic device 100 is installed in the receiving groove 221. In this way, after the circuit board assembly 30 is installed in the receiving groove 221, the circuit board assembly 30 can be connected to the second inner wall surface 225 through the protrusion 421 of the bracket 40. In the width direction of the electronic device 100, the circuit board assembly 30 is fixed in the receiving groove 221 by the bracket 40, which improves the stability and reliability of the fixing of the circuit board assembly 30.

[0153] As the functions of the electronic device 100 are gradually increased and the performance is gradually improved, more and more electronic components 32 are integrated on the circuit board 31. These electronic components 32 can be dispersed and arranged on opposite sides of the circuit board 31. In other words, the circuit board 31 can be a double-sided board with electronic components 32 integrated on opposite sides. Specifically, based on the above-mentioned bracket 40 including the protrusion 421, please refer to Fig.24 , Fig.24 The schematic diagram of the structure of the circuit board assembly 30 provided in some embodiments of the present application omits the bracket 40. The circuit board assembly 30 includes a first group of electronic components 32 and a second group of electronic components 32. The first group of electronic components 32 is arranged on the first surface S1, and the second group of electronic components 32 is arranged on the third surface S3. In this way, the performance of the electronic device 100 and the diversity of the functions of the electronic device 100 are further improved.

[0154] The above embodiment is described by taking two brackets 40 as an example, and the following description is described by taking one bracket 40 as an example. Fig.25 , Fig.25 A schematic diagram of the structure of the circuit board assembly 30 provided for some other embodiments of the present application. When the length of the circuit board 31 is small, a bracket 40 can be provided to fix the circuit board 31 in the receiving groove 221. The difference from the above embodiment is that the bracket 40 of this embodiment does not need to be provided at both ends of the circuit board 31, and the bracket 40 can be provided in the central area of ​​the circuit board 31, so as to more stably fix the circuit board assembly 30 in the receiving groove 221. The "central area" here refers to an area with a substantially equal distance from the edge of the circuit board 31. In order to avoid the connection between the bracket 40 and the circuit board 31 to reduce the surface of the circuit board 31, resulting in a reduction in the area of ​​the circuit board 31 for bonding the electronic components 32, an avoidance groove 412a is provided on the bracket 40, and the opening of the avoidance groove 412a faces the first surface S1, and at least part of the electronic components 32 is accommodated in the avoidance groove 412a. In this way, the circuit board assembly 30 is connected to the receiving groove 221 by the bracket 40, which improves the stability and reliability of the circuit board assembly 30 fixed in the electronic device 100. The bracket 40 also leaves room for the installation of the electronic components 32 , so that more electronic components 32 can be arranged on the surface of the circuit board 31 , thereby improving the compactness of the layout of the circuit board 31 .

[0155] The above embodiment is described by taking the circuit board 31 as an example of a vertical layout. In some other embodiments, the bracket 40 can also be applied to the scene where the circuit board 31 is arranged in a plane. Fig.26 , Fig.26 The present application provides a schematic diagram of a structure in which the bracket 40 provided in some embodiments is installed in the receiving groove 221. For example, the bracket 40 can also be connected to the main board circuit board 311. Specifically, the main board circuit board 311 includes a first surface S1 facing the bracket 40, and a third surface S3 facing the back cover 21. The main board circuit board 311 is fixed in the receiving groove 221 by the bracket 40. When the circuit board assembly 30 is disassembled, force can be directly applied to the bracket 40 to avoid damage to the circuit board assembly 30, thereby ensuring the quality of the circuit board assembly 30 during use and maintenance and disassembly, and further ensuring the performance of the circuit board assembly 30.

[0156] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0157] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A circuit board assembly, characterized in that: include: A circuit board, the circuit board comprising a first surface and a third surface facing each other; A first group of electronic components, wherein the first group of electronic components is arranged on the first surface; A bracket is connected to the circuit board, the bracket includes a first bracket part, the first bracket part is located on the side facing the first surface and covers a part of the first surface, and at least a part of the first bracket part facing away from the first surface is an elastic soft structure.

2. The circuit board assembly according to claim 1, characterized in that: The first bracket portion comprises: A substrate portion, the substrate portion comprising a second surface and a fourth surface facing each other, the second surface facing the first surface; An elastic adhesive material is disposed on the fourth surface, and the elastic adhesive material forms the elastic soft structure.

3. The circuit board assembly according to claim 2, characterized in that: The circuit board further includes a first side surface connected to the first surface, and the bracket further includes a second bracket portion, the second bracket portion is located on the side facing the first side surface, and the second bracket portion is arranged on the second surface.

4. The circuit board assembly according to claim 3, characterized in that: The circuit board further includes a second side surface connected to both the first surface and the first side surface; The bracket further includes a third bracket portion disposed on the second surface, and the third bracket portion is located on the side toward which the second side surface faces.

5. The circuit board assembly according to claim 4, characterized in that: The circuit board is provided with a first positioning portion, and the second surface is provided with a second positioning portion matched with the first positioning portion, wherein the first positioning portion is a notch that passes through the third side surface; and the second positioning portion is a protrusion that matches with the notch.

6. The circuit board assembly according to claim 5, characterized in that: The arrangement direction of the first side surface and the third side surface is the second direction. In the second direction, the bracket includes a seventh side surface and an eighth side surface opposite to each other. The seventh side surface is located on the side of the fourth side surface away from the third side surface, and the eighth side surface is located on the side of the fourth side surface away from the seventh side surface.

7. The circuit board assembly according to any one of claims 2 to 6, characterized in that: The second bracket portion further includes a fifth surface opposite to the second surface, and a distance from the third surface to the fourth surface is greater than or equal to a distance from the fifth surface to the fourth surface.

8. The circuit board assembly according to any one of claims 1 to 7, characterized in that: The circuit board assembly also includes a second group of electronic components, and the second group of electronic components is arranged on the third surface.

9. The circuit board assembly according to any one of claims 1 to 8, characterized in that: A second avoidance gap is provided at the edge of the bracket.

10. An electronic device, characterized in that: include: A housing, the housing comprising a receiving groove, the receiving groove comprising a first inner wall surface and a second inner wall surface opposite to each other; The circuit board assembly described in any one of claims 1 to 9 is located in the accommodating groove, and the arrangement direction of the bracket of the circuit board assembly and the circuit board of the circuit board assembly is consistent with the arrangement direction of the first inner wall surface and the second inner wall surface.

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