Display device and electronic apparatus

Abstract

The invention relates to a display device and electronic equipment. The display device includes a display panel including two pixels spaced apart from each other and a transmissive region between the two pixels. An input sensing portion is disposed on the display panel and includes a sensing electrode and a trace electrically connected to the sensing electrode. The metal layer is located on the display panel. The metal layer is disposed between the two pixels and surrounds the transmissive region. The metal layer includes a first hole positioned in the transmissive region. The first aperture has a first width. The optical function part is located on the metal layer. The optical function portion includes a second hole overlapping the first hole. The second aperture has a second width greater than the first width.

Description

[0001] This application is a divisional patent application of the invention patent application with application date of August 10, 2020, application number 202010797089.4, and invention name “Display Device”. Technical Field

[0002] The present disclosure relates to a display device and an electronic device. Background Art

[0003] Display devices have been incorporated into an increasingly wide variety of electronic devices. As display devices have become thinner and lighter, the range of uses of display devices has also increased accordingly.

[0004] The size of a display area of ​​a display device has increased, and various functions have been added to the display device. A display device having a display area including various functions in addition to image display has been developed. Summary of the invention

[0005] The display device may include a transmissive region capable of transmitting light within the display region as a region for adding various functions. When the display device includes the transmissive region, the light emitting diode may be damaged by external light incident on the transmissive region, and the structure near the transmissive region may be relatively weak to external static electricity. One or more exemplary embodiments include a high-quality display device. However, the one or more exemplary embodiments are merely examples, and the scope of the present disclosure is not limited thereto.

[0006] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of provided embodiments of the disclosure.

[0007] According to one or more exemplary embodiments, a display device includes a display panel, the display panel including two pixels spaced apart from each other and a transmissive region located between the two pixels. An input sensing portion is disposed on the display panel and includes a sensing electrode and a trace electrically connected to the sensing electrode. A metal layer is disposed on the display panel. The metal layer is disposed between the two pixels and surrounds the transmissive region. The metal layer includes a first hole positioned in the transmissive region. The first hole has a first width. An optical function portion is disposed on the metal layer. The optical function portion includes a second hole overlapping the first hole. The second hole has a second width greater than the first width.

[0008] The optical function portion may cover only a partial portion of the metal layer.

[0009] The optical function portion may include at least one optical device selected from a polarizer, a retarder, a destructive interference structure, and a combination of a color filter and a black matrix.

[0010] The metal layer may include the same material as that of the traces.

[0011] The metal layer may include at least one selected from molybdenum (Mo), magnesium (Mg), silver (Ag), titanium (Ti), copper (Cu), aluminum (Al), and alloys thereof.

[0012] The display device may further include at least one wire disposed outside the metal layer.

[0013] The at least one line may include a plurality of material portions spaced apart from each other, the opening portion being located between the plurality of material portions, and the plurality of material portions being arranged along an outer edge of the metal layer.

[0014] The at least one line may include: a first line, including a plurality of first material portions spaced apart from each other, a first opening portion located between the plurality of first material portions, and the first material portions being arranged along an outer edge of the metal layer; and a second line, arranged along the outer edge of the metal layer while being spaced apart from the first line, and the second line includes a plurality of second material portions spaced apart from each other, and a second opening portion located between the plurality of second material portions.

[0015] The first opening portion may overlap one of the plurality of second material portions in a radial direction away from the center of the transmission area, and the second opening portion may overlap one of the plurality of first material portions in the radial direction away from the center of the transmission area.

[0016] The display device may further include a dummy electrode positioned between adjacent sensing electrodes. The first opening portion or the second opening portion may be arranged adjacent to the dummy electrode.

[0017] The display panel may include: a substrate; a display layer located on the substrate and including the two pixels; and an encapsulation substrate located on the display layer.

[0018] The display layer may include a hole corresponding to the transmission area, and an upper surface of the substrate and a lower surface of the encapsulation substrate may face each other through the hole of the display layer.

[0019] The metal layer may include a plurality of material portions spaced apart from one another.

[0020] The display device may further include: a window located on the optical function portion; and an optically transparent adhesive layer located between the optical function portion and the window.

[0021] The window may include a light shielding unit overlapping a portion of the metal layer.

[0022] At least one of the substrate and the packaging member may include a glass material.

[0023] According to one or more exemplary embodiments, a display device includes a display panel, the display panel including two pixels spaced apart from each other and a first area between the two pixels. An input sensing portion is located on the display panel and includes a sensing electrode and a trace electrically connected to the sensing electrode. A metal layer is located on the display panel. The metal layer is disposed between the two pixels and surrounds the first area. The metal layer includes a first hole positioned in the first area.

[0024] The metal layer includes the same material as that of the traces.

[0025] The input sensing portion includes: at least one conductive layer including the sensing electrode or the trace; and an insulating layer located on the conductive layer, wherein the metal layer includes a material that is the same as that of the at least one conductive layer.

[0026] The insulating layer includes a hole having a width corresponding to the first region.

[0027] The insulating layer covers an edge of the metal layer defining the first hole.

[0028] The metal layer includes at least one selected from molybdenum (Mo), magnesium (Mg), silver (Ag), titanium (Ti), copper (Cu), aluminum (Al), and alloys of these materials.

[0029] The sensing electrode includes two sensing electrodes spaced apart from each other, and the metal layer is located between the two sensing electrodes.

[0030] The display device further includes at least one line arranged between an outer edge of the metal layer and the two sensing electrodes.

[0031] The at least one line includes a first line including a plurality of first material portions spaced apart from one another, and at least one first opening portion is located between the plurality of first material portions.

[0032] The at least one line further includes: a second line disposed closer to the metal layer than the first line; and the second line includes a plurality of second material portions spaced apart from each other, and at least one second opening portion is located between the plurality of second material portions.

[0033] An area of ​​each of the plurality of second material portions is greater than an area of ​​each of the plurality of first material portions.

[0034] The display device further includes a dummy electrode positioned between the sensing electrodes adjacent to the metal layer among the sensing electrodes, wherein the first opening portion is adjacent to the dummy electrode.

[0035] The display device further includes an optical function portion located on the metal layer.

[0036] The optical function portion includes a second hole overlapping the first hole, the second hole being larger than the first hole.

[0037] The optical function portion includes at least one optical device selected from a polarizer, a retarder, a destructive interference structure, and a combination of a color filter and a black matrix.

[0038] The display panel further includes: a substrate; a display layer located on the substrate and including the two pixels; and an encapsulation member located on the display layer.

[0039] The display layer includes a hole having a width corresponding to the first region; and an upper surface of the substrate and a lower surface of the packaging member face each other through the hole of the display layer.

[0040] At least one of the substrate and the packaging member includes a glass material.

[0041] According to one or more exemplary embodiments, a display device includes a display layer having a plurality of pixels arranged in a second area of ​​the display device. A first area is arranged between two adjacent pixels located in the second area. The first area includes a transmission area and a component arranged in the first area. A third area is arranged between the second area and the first area. A metal layer is arranged in the third area. The metal layer has a first hole positioned in the transmission area. The first hole has a first width. The display layer includes a second hole positioned in the transmission area, the second hole having a second width less than the first width. An optical function portion is arranged on the metal layer. The optical function portion includes a third hole overlapping the second hole and the first hole. The third hole has a third width greater than the first width. The first hole, the second hole, and the third hole form a fourth hole that prevents the field of view of the component from being restricted. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] The above and other aspects, features and advantages of certain exemplary embodiments of the inventive concept will become more apparent through the following description in conjunction with the accompanying drawings, in which:

[0043] Figure 1 is a perspective view of a display device according to an exemplary embodiment of the inventive concept;

[0044] Figure 2A and Figure 2B According to an exemplary embodiment of the present invention, Figure 1 A cross-sectional view of the display device taken along line II-II';

[0045] FIG. 3A to FIG. 3C is a cross-sectional view of a display panel according to an exemplary embodiment of the inventive concept;

[0046] FIG. 4A to FIG. 4C is a cross-sectional view of a display panel according to an exemplary embodiment of the inventive concept;

[0047] Figure 5 is a top plan view of a display panel according to an exemplary embodiment of the inventive concept;

[0048] Figure 6 is an equivalent circuit diagram of one pixel of a display panel according to an exemplary embodiment of the inventive concept;

[0049] Figure 7 is a top plan view of a portion of a display panel according to an exemplary embodiment of the inventive concept;

[0050] Figure 8 According to an exemplary embodiment of the present invention, Figure 7 A cross-sectional view of a pixel taken along line VIII-VIII';

[0051] Fig. 9 is a top plan view of an input sensing portion of a display panel according to an exemplary embodiment of the inventive concept;

[0052] Fig.10 is a cross-sectional view of a stacked structure of an input sensing part according to an exemplary embodiment of the inventive concept;

[0053] Fig.11A is a top plan view of a first conductive layer of an input sensing part according to an exemplary embodiment of the inventive concept;

[0054] Fig. 11B is a top plan view of a second conductive layer of an input sensing part according to an exemplary embodiment of the inventive concept;

[0055] Fig. 12A are a top plan view and an enlarged view of a first conductive layer of an input sensing part according to an exemplary embodiment of the inventive concept;

[0056] Fig. 12B are a top plan view and an enlarged view of a second conductive layer of an input sensing part according to an exemplary embodiment of the inventive concept;

[0057] Fig.13A is a perspective view of a portion of an input sensing portion according to an exemplary embodiment of the present inventive concept;

[0058] Fig. 13B is an input sensing portion according to an exemplary embodiment of the inventive concept. Fig.13A A cross-sectional view taken along line XIII-XIII';

[0059] Fig.14 is a top plan view of a portion of a display device according to an exemplary embodiment of the inventive concept;

[0060] Fig.15 is a cross-sectional view of a display device according to an exemplary embodiment of the inventive concept;

[0061] FIG. 16A to FIG. 16D is a cross-sectional view of a method of assembling a display device according to an exemplary embodiment of the inventive concept;

[0062] Fig.17 is a cross-sectional view of a display device according to an exemplary embodiment of the inventive concept;

[0063] Fig.18 is a top plan view of a portion of a display device according to an exemplary embodiment of the inventive concept;

[0064] Fig.19 and Fig. 20 is a cross-sectional view of a display device according to an exemplary embodiment of the inventive concept;

[0065] Fig.21 are a top plan view and an enlarged view of a portion of a display device according to an exemplary embodiment of the inventive concept;

[0066] Fig. 22 yes Fig.21 an enlarged view of section XXII;

[0067] Fig.23 is a cross-sectional view of a display device according to an exemplary embodiment of the inventive concept;

[0068] FIG. 24A to FIG. 24F is a top plan view of a portion of a display device according to an exemplary embodiment of the inventive concept;

[0069] Fig.25 is a top plan view of an input sensing portion of a display device according to an exemplary embodiment of the inventive concept;

[0070] Fig.26 According to an exemplary embodiment of the present invention, Fig.25 A cross-sectional view of an input sensing portion of the display device taken along line XXVIb-XXVIb′ and line XXVIa-XXVIa′; and

[0071] Fig. 27 is a cross-sectional view of a display device according to an exemplary embodiment of the inventive concept. DETAILED DESCRIPTION

[0072] Now will be referred to in detail embodiment, the example of embodiment is shown in the accompanying drawings, wherein the same reference numerals refer to the same elements from time to time. In this respect, the exemplary embodiments of the present invention can have different forms and should not be construed as being limited to the description set forth herein. Therefore, the exemplary embodiments are described below only by reference to the accompanying drawings to illustrate the various aspects of the present invention. As used herein, the term "and / or" includes any combination and all combinations of one or more related listed items. Throughout this disclosure, the statement "at least one (kind) of a, b and c" indicates only a, only b, only c, both a and b, both a and c, both b and c, all a, b and c or their variations.

[0073] One or more exemplary embodiments of the inventive concept will be described in more detail below with reference to the accompanying drawings. Regardless of the figure numbers, those components that are the same or corresponding are given the same reference numerals, and redundant descriptions are omitted.

[0074] It will be understood that although the terms "first", "second", etc. may be used herein to describe various components, these components should not be limited by these terms. These terms are only used to distinguish one component from another component.

[0075] As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0076] It will also be understood that the terms “comprises” and / or “comprising” used herein specify the presence of stated features or components, but do not preclude the presence or addition of one or more other features or components.

[0077] It will be understood that when a layer, region or component is referred to as being "formed on" another layer, region or component, the layer, region or component may be directly or indirectly formed on the other layer, region or component. For example, there may be intervening layers, regions or components.

[0078] For convenience of explanation, the sizes of elements in the drawings may be exaggerated. For example, since the sizes and thicknesses of components in the drawings are arbitrarily shown for convenience of explanation, the following exemplary embodiments are not limited thereto.

[0079] When a specific exemplary embodiment can be implemented differently, a specific process order can be performed differently from the described order. For example, two processes described successively can be performed substantially simultaneously, or can be performed in the reverse order of the described order.

[0080] It will also be understood that when a layer, region, or component is referred to as being "connected" or "coupled" to another layer, region, or component, the layer, region, or component may be directly connected or coupled to the other layer, region, or component, or there may be intervening layers, regions, or components. For example, when a layer, region, or component is referred to as being "electrically connected" or "electrically coupled" to another layer, region, or component, the layer, region, or component may be directly electrically connected or coupled to the other layer, region, or component, or there may be intervening layers, regions, or components.

[0081] Figure 1 is a schematic perspective view of a display device 1 according to an exemplary embodiment.

[0082] Reference Figure 1 , the display device 1 may include a first area A1 and a second area A2 surrounding the first area A1. In the second area A2, a plurality of pixels (e.g., an array of pixels) may be arranged, and an image may be displayed on the display device 1 via light emitted by the array of pixels according to an image signal. The second area A2 may correspond to an effective area (e.g., a display area) capable of displaying an image. In an exemplary embodiment, the first area A1 may be completely surrounded by the second area A2. For example, as in Figure 1 As shown in the exemplary embodiment of , the first area A1 may be circular in shape and may be surrounded by the second area A2 on all sides thereof (e.g., in the x and / or y directions). However, the exemplary embodiments of the present inventive concept are not limited thereto. For example, in other embodiments, the first area A1 may have a variety of different shapes and positions, and the first area A1 may not be surrounded by the second area A2 on all sides. The first area A1 may be configured to accommodate components that can provide various functions to the display device 1. For example, in an exemplary embodiment, the component may include a camera or sensor that utilizes light, and the first area A1 may correspond to a transmissive area that can transmit or receive light (such as light from a sensor or light traveling toward a camera).

[0083] As in Figure 1As shown in the exemplary embodiment of , the third area A3 may be included between the first area A1 and the second area A2. The third area A3 may be a non-display area in which no pixels are arranged. The display device 1 may also include a fourth area A4 surrounding the second area A2. The fourth area A4 may also be a non-display area in which no pixels are arranged. In the fourth area A4, various types of wiring and circuits may be arranged. The fourth area A4 may surround all sides of the second area A2. For example, as in Figure 1 As shown in the exemplary embodiment of FIG. 5 , the second area A2 may be rectangular, and the fourth area A4 may surround all four sides of the second area A2 (eg, in the x and / or y directions).

[0084] Each of the plurality of pixels of the display device 1 may include a light emitting diode as a display element that emits light of a specific color. In an exemplary embodiment, the light emitting diode may include an organic light emitting diode, and the organic light emitting diode includes an organic material as an emission layer. However, the exemplary embodiments of the inventive concept are not limited thereto. In another exemplary embodiment, the light emitting diode may include an inorganic light emitting diode. Alternatively, the light emitting diode may include a quantum dot. For ease of description, an embodiment in which the light emitting diode includes an organic light emitting diode will now be described.

[0085] exist Figure 1 In an exemplary embodiment of the present invention, the first area A1 is positioned at a central portion of the second area A2 in a width direction (e.g., an x ​​direction). However, exemplary embodiments of the present invention are not limited thereto. For example, in another exemplary embodiment, the first area A1 may be arranged to be offset to the left or right in the width direction of the display device 1. The first area A1 may be positioned at various positions, such as being arranged at the upper side, the center, or the lower side in the length direction (e.g., the y direction) of the display device 1. In an exemplary embodiment in which the first area A1 is positioned at an edge of the second area A2, the fourth area A4 may surround at least one side of the first area A1, and the second area A2 may not surround each side of the first area A1.

[0086] exist Figure 1 In the exemplary embodiment of FIG. 1 , the display device 1 includes a single first area A1 . However, in other exemplary embodiments, the display device 1 may include a plurality of first areas A1 .

[0087] Figure 2A and Figure 2B are schematic cross-sectional views of a display device 1 according to an exemplary embodiment, and may each correspond to a cross-sectional view taken along Figure 1 A cross section taken along line II-II'.

[0088] Reference Figure 2A, the display device 1 may include a display panel 10, an input sensing portion 40 and an optical function portion 50 sequentially arranged on the display panel 10 (for example, in the z direction). The window 60 may cover the optical function portion 50, the input sensing portion 40 and the display panel 10. For example, as in Figure 2A As shown in the exemplary embodiment of , the window 60 can be directly disposed on the optical function part 50 (e.g., in the z direction). An adhesive layer such as an optically clear adhesive OCA can couple the window 60 to a component below it, such as the optical function part 50. In an exemplary embodiment, the display device 1 can be included in any of a variety of electronic devices (such as a mobile phone, a tablet personal computer, a notebook computer, a smart watch, etc.).

[0089] The display panel 10 may include a plurality of light emitting diodes arranged in the second area A2. The input sensing portion 40 may acquire coordinate information according to an external input such as a touch event (e.g., a touch input from a user's finger). The input sensing portion 40 may include a sensing electrode (or touch electrode) and a trace line connected to the sensing electrode. The input sensing portion 40 may be arranged on the display panel 10. In an exemplary embodiment, the input sensing portion 40 may sense an external input according to a mutual capacitance (capacitive) method or a self-capacitance method.

[0090] In an exemplary embodiment, the input sensing portion 40 may be formed directly on the display panel 10 (eg, in the z direction). Alternatively, the input sensing portion 40 may be formed separately and then fixed to the display panel 10 via an adhesive layer such as an optically clear adhesive OCA. Figure 2A As shown in the exemplary embodiment of FIG. 1 , the input sensing part 40 may be directly formed on the display panel 10 , and an adhesive layer may not be provided between the input sensing part 40 and the display panel 10 .

[0091] In an exemplary embodiment, the optical function portion 50 may include an anti-reflection layer. The anti-reflection layer may reduce the reflectivity of light (such as external light incident from an external source through the window 60 toward the display panel 10). In an exemplary embodiment, the anti-reflection layer may include a phase retarder and a polarizer. The phase retarder may be a film type or a liquid coating type, and may include a λ / 2 phase retarder and / or a λ / 4 phase retarder. However, exemplary embodiments of the present invention are not limited thereto. The polarizer may also be a film type or a liquid coating type. The film type may include a stretchable synthetic resin film, and the liquid coating type may include liquid crystals arranged in a predetermined arrangement. The phase retarder and the polarizer may also include protective films, respectively. However, exemplary embodiments of the present invention are not limited thereto.

[0092] According to another exemplary embodiment, the anti-reflection layer may include a black matrix and a color filter. The color filter may be arranged based on the arrangement of the colors of the light beams emitted by the pixels of the display panel 10. In another exemplary embodiment, the anti-reflection layer may include a destructive interference structure. The destructive interference structure may include a first reflective layer and a second reflective layer arranged on different layers. The first reflected light and the second reflected light reflected by the first reflective layer and the second reflective layer, respectively, may destructively interfere with each other, and thus the reflectivity of the external light may be reduced.

[0093] In an exemplary embodiment, the optical function portion 50 may include a lens layer. The lens layer may improve emission efficiency or reduce color deviation of light emitted from the display panel 10. The lens layer may include a layer having a concave lens shape or a convex lens shape, and / or may include a plurality of layers having different refractive indices, respectively. In an exemplary embodiment, the optical function layer 50 may include both an anti-reflection layer and a lens layer, or may include only one of the anti-reflection layer and the lens layer.

[0094] The input sensing portion 40 and the optical function portion 50 may each include a hole. Figure 2A As shown in the exemplary embodiment of , the input sensing portion 40 may include a first hole 40H passing from the top surface of the input sensing portion 40 to the bottom surface of the input sensing portion 40. The optical function portion 50 may include a second hole 50H passing from the top surface of the optical function portion 50 to the bottom surface of the optical function portion 50. The first hole 40H and the second hole 50H may be arranged in the first area A1 and may overlap each other (e.g., in the z direction). In an exemplary embodiment, the widths of the first hole 40H and the second hole 50H (e.g., the lengths in the x direction) may correspond to the width of the first area A1. Figure 2A In the exemplary embodiment shown in , the first hole 40H and the second hole 50H completely overlap each other (e.g., in the z-direction). However, in other exemplary embodiments, the first hole 40H and the second hole 50H may only partially overlap each other (e.g., in the z-direction). According to another exemplary embodiment, Figure 2B As shown in FIG. 1 , in addition to the first hole 40H of the input sensing portion 40 and the second hole 50H of the optical function portion 50, the display panel 10 may further include a third hole 10H. The third hole 10H is arranged in the first area A1 and overlaps with the first hole 40H and the second hole 50H (for example, in the z direction). For example, Figure 2BAs shown in the exemplary embodiment of the present invention, the third hole 10H may completely overlap the first hole 40H and the second hole 50H. However, exemplary embodiments of the present inventive concept are not limited thereto. The third hole 10H may have a width corresponding to the width of the first area A1 (e.g., a length in the x direction). In an exemplary embodiment in which the adhesive layer between the window 60 and the optical function portion 50 includes an optically transparent adhesive OCA, the adhesive layer may not include a hole in the first area A1.

[0095] The component 20 may be positioned in the first area A1. Figure 2A , Figure 2B As shown in the exemplary embodiment of , the component 20 can be positioned in the first area A1 below the display panel 10 and the third hole 10H of the display panel 10. In an exemplary embodiment, the component 20 may include an electronic component. For example, the component 20 may be an electronic component that utilizes light or sound. For example, the electronic component may include: a sensor that receives and utilizes light (such as an infrared sensor), a camera that receives light and takes an image, a sensor that outputs and senses light or sound to measure distance or recognize fingerprints, etc., a small lighting element that outputs light, a speaker that outputs sound, etc. Electronic components that utilize light can utilize light in various wavelength bands, such as visible light, infrared light, and ultraviolet light. Electronic components that utilize sound can utilize sound in various frequency bands, such as ultrasound. According to some exemplary embodiments, the first area A1 may be a transmission area for transmitting light output from the component 20 to the outside or traveling from the outside toward the component 20.

[0096] According to another exemplary embodiment in which the display device 1 is used as a smart watch or a dashboard for a car, the component 20 may be a member such as a clock element (e.g., a clock hand) or a pointer indicating predetermined information (e.g., a vehicle speed, etc.). In an exemplary embodiment in which the display device 1 includes a clock hand or a dashboard for a car, the component 20 may be exposed to the outside through the window 60, and the window 60 may include an opening in the first area A1 that overlaps (e.g., in the z direction) with the optical function portion 50, the input sensing portion 40, and / or the hole of the display panel 10. For example, the opening may have a width corresponding to the first area A1.

[0097] As described above, the component 20 may include an element (elements) that adds a function to the display device 1 , or may include an element such as an accessory that improves the aesthetic value of the display panel 10 .

[0098] FIG. 3A to FIG. 3C is a schematic cross-sectional view of a display panel 10 according to an exemplary embodiment of the inventive concept.

[0099] Reference FIG. 3A to FIG. 3C, the display panel 10 includes a display layer 200 disposed on a substrate 100. For example, as in FIG. 3A to FIG. 3C As shown in the exemplary embodiment of FIG. 1 , the display layer 200 may be directly disposed on the substrate 100 (eg, in the z direction). In the exemplary embodiment, the substrate 100 may include a glass material, or may include a polymer resin. For example, the substrate 100 may include a substrate mainly including SiO 2 glass material or resin such as reinforced plastic.

[0100] The display layer 200 may be positioned in the second area A2 and may include a plurality of pixels. Each of the plurality of pixels included in the display layer 200 may include a pixel circuit and a display element electrically connected to the pixel circuit. The pixel circuit may include at least one transistor and at least one storage capacitor, and the display element may include a light emitting diode, such as an organic light emitting diode (OLED), etc.

[0101] The display layer 200 may be covered by the encapsulation substrate 300A. In an exemplary embodiment, the encapsulation substrate 300A may include a glass material, or may include a polymer resin. For example, the encapsulation substrate 300A may include a substrate mainly including SiO 2 The encapsulation substrate 300A may be arranged to face the substrate 100, and the sealant ST may be disposed between the substrate 100 and the encapsulation substrate 300A (e.g., in the z direction). The sealant ST may be positioned in the fourth area A4 and may completely surround the display layer 200 between the substrate 100 and the encapsulation substrate 300A (e.g., in the x and / or y directions). For example, when viewed from the z direction, the second area A2 may be completely surrounded by the sealant ST.

[0102] A portion of the display layer 200 (eg, a portion in the first area A1) may be removed. Figure 3A As shown in the exemplary embodiment of , the display layer 200 may include a fourth hole 200H having a width (e.g., a length in the x direction) corresponding to the width of the first area A1 and the third area A3. In addition to the pixel circuit and the display element, the display layer 200 may further include an insulating layer. The insulating layer may be arranged between wirings connected to each pixel circuit, between electrodes, and / or between electrodes of the display element. For example, the fourth hole 200H may be formed by overlapping holes (e.g., in the z direction) of the insulating layer included in the display layer 200. The fourth hole 200H of the display layer 200 may be formed to completely penetrate the display layer 200 from the top surface of the display layer 200 to the bottom surface of the display layer 200.

[0103] Reference Figure 3B, the encapsulation substrate 300A of the display panel 10 may include a fifth hole 300AH positioned in the first area A1. The fifth hole 300AH may penetrate the encapsulation substrate 300A from the top surface of the encapsulation substrate 300A to the bottom surface of the encapsulation substrate 300A. The fifth hole 300AH of the encapsulation substrate 300A may overlap with the fourth hole 200H of the display layer 200 (e.g., in the z direction). For example, as in Figure 3B As shown in the exemplary embodiment of FIG. 1 , the fifth hole 300AH may have a width (eg, a length in the x direction) corresponding to the width of the first area A1. The sealant ST may be located between the substrate 100 and the package substrate 300A (eg, in the z direction). Figure 3B As shown in the exemplary embodiment of FIG. 1 , in addition to the fourth area A4, the sealant ST may be positioned in the third area A3 to prevent external foreign matter from penetrating into the display layer 200 via the fifth hole 300AH. The display layer 200 may be positioned in a space defined by the substrate 100, the encapsulation substrate 300A, the sealant ST of the third area A3, and the sealant ST of the fourth area A4.

[0104] Reference Figure 3C , the substrate 100 of the display panel 10 may further include a sixth hole 100H positioned in the first area A1. For example, the sixth hole 100H may have a width corresponding to the width of the first area A1 (e.g., a length in the x direction). The sixth hole 100H of the substrate 100, the fourth hole 200H of the display layer 200, and the fifth hole 300AH of the encapsulation substrate 300A may overlap with each other (e.g., in the z direction). The fourth hole 200H, the fifth hole 300AH, and the sixth hole 100H overlapping each other in the first area A1 may collectively form a third hole 10H formed in the display panel 10.

[0105] FIG. 4A to FIG. 4C is a schematic cross-sectional view of a display panel 10 ′ according to an exemplary embodiment of the inventive concept.

[0106] Reference Figure 4A , the display layer 200 may be arranged on the substrate 100, and the display layer 200 may be covered by an encapsulation member formed by a thin film encapsulation layer 300B. The thin film encapsulation layer 300B may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. For example, as in Figure 4AAs shown in the exemplary embodiment of the present invention, the thin film encapsulation layer 300B may include a first inorganic encapsulation layer 310 and a second inorganic encapsulation layer 330 and an organic encapsulation layer 320 located between the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330. However, the exemplary embodiments of the present invention are not limited thereto, and the thin film encapsulation layer 300B may have various configurations. In an exemplary embodiment, each of the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include one or more inorganic insulating materials. For example, the inorganic insulating material may include at least one compound selected from aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The organic encapsulation layer 320 may include a polymer material. For example, in an exemplary embodiment, the polymer material may include at least one compound selected from acrylic resin, epoxy resin, polyimide, and polyethylene. For example, the organic encapsulation layer 320 may include an acrylic resin such as polymethyl methacrylate or polyacrylic acid. However, the exemplary embodiments of the present invention are not limited thereto.

[0107] In an exemplary embodiment, the substrate 100 may include a polymer resin and may be a multi-layer. For example, the substrate 100 may include a first base layer 101, a first barrier layer 102, a second base layer 103, and a second barrier layer 104 sequentially stacked.

[0108] Each of the first base layer 101 and the second base layer 103 may include a polymer resin. For example, the first base layer 101 and the second base layer 103 may each include a polymer resin such as at least one compound selected from polyethersulfone, polyarylate, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate, and cellulose acetate propionate.

[0109] The first barrier layer 102 and the second barrier layer 104 may each be a barrier layer that prevents penetration of external foreign substances, and may be a single layer or a multilayer including an inorganic material such as silicon nitride, silicon oxynitride, or silicon oxide.

[0110] In the exemplary embodiment in which the display panel 10 ′ includes the substrate 100 and the thin film encapsulation layer 300B, each of which is a multi-layer, the flexibility of the display panel 10 ′ may be improved.

[0111] Reference Figure 4A , the thin film encapsulation layer 300B may include a seventh hole 300BH positioned in the first area A1. Figure 4AAs shown in the exemplary embodiment of , the seventh hole 300BH may have a width (e.g., a length in the x direction) corresponding to the width of the first area A1. The seventh hole 300BH may overlap (e.g., in the z direction) with the sixth hole 100H of the substrate 100 and the fourth hole 200H of the display layer 200. The fourth hole 200H, the sixth hole 100H, and the seventh hole 300BH overlapping each other may form the third hole 10H of the display panel 10'.

[0112] According to another exemplary embodiment, Figure 4B As shown in , the thin film encapsulation layer 300B and the display layer 200 may include the seventh hole 300BH and the fourth hole 200H positioned in the first area A1. However, the substrate 100 may not include a hole. Alternatively, as shown in Figure 4C As shown in the exemplary embodiment of FIG. 1 , the fourth hole 200H may be positioned in the first area A1, and the thin film encapsulation layer 300B and the substrate 100 may not include a hole.

[0113] Figure 5 is a schematic plan view of a display panel 10 according to an exemplary embodiment of the inventive concept, and Figure 6 is a schematic equivalent circuit diagram of one pixel P of the display panel 10 according to an exemplary embodiment of the inventive concept.

[0114] exist Figure 5 In the exemplary embodiment of the present invention, the form of the display panel 10 can be the same as that of the above reference Figure 1 The display device 1 described in the form is substantially the same. For example, the display panel 10 may include a first area A1, a second area A2 surrounding the first area A1, a third area A3 between the first area A1 and the second area A2, and a fourth area A4 surrounding the second area A2.

[0115] The display panel 10 may include a plurality of pixels P arranged in the second area A2. However, for ease of explanation, Figure 5 Only a single pixel P is shown. Figure 6 As shown in , each pixel P may include a pixel circuit PC and an organic light emitting diode OLED as a display element connected to the pixel circuit PC. The pixel circuit PC may include a first transistor T1, a second transistor T2, and a storage capacitor Cst. In an exemplary embodiment, each pixel P may emit, for example, red light, green light, or blue light via the organic light emitting diode OLED, or may emit red light, green light, blue light, or white light. However, exemplary embodiments of the inventive concept are not limited thereto. The first transistor T1 and the second transistor T2 may be implemented using a thin film transistor.

[0116] The second transistor T2 as a switching transistor may be connected to the scan line SL and the data line DL. The second transistor T2 may transmit a data voltage received via the data line DL to the first transistor T1 based on a switching voltage received via the scan line SL. The storage capacitor Cst may be connected to the second transistor T2 and the driving voltage line PL. The storage capacitor Cst may store a voltage corresponding to a difference between a voltage received from the second transistor T2 and a first power supply voltage ELVDD supplied to the driving voltage line PL.

[0117] The first transistor T1 as a driving transistor may be connected to the driving voltage line PL and the storage capacitor Cst. The first transistor T1 may control the driving current flowing from the driving voltage line PL to the organic light emitting diode OLED according to the voltage value stored in the storage capacitor Cst. The organic light emitting diode OLED may emit light having a specific brightness level according to the magnitude of the driving current. The opposite electrode (e.g., cathode) of the organic light emitting diode OLED may receive the second power supply voltage ELVSS.

[0118] although Figure 6 The exemplary embodiment of the present invention includes a pixel circuit PC having two transistors and one storage capacitor, but the exemplary embodiments of the present invention are not limited thereto. For example, the number of transistors and the number of storage capacitors may be changed according to the design of the pixel circuit PC. In addition, although Figure 6 The first transistor T1 and the second transistor T2 of the exemplary embodiment each have a single gate electrode, but in other exemplary embodiments, at least one of the first transistor T1 and the second transistor T2 may have a double gate electrode, etc.

[0119] Return to reference Figure 5, the third area A3 may surround the first area A1. The third area A3 is an area in which display elements such as organic light emitting diodes are not arranged. The signal lines configured to provide signals to the pixels P in the second area A2 may be arranged around the first area A1, and may be arranged in the third area A3 or across the third area A3. The fourth area A4 may include a first scan driver 1100 and a second scan driver 1200, each of which provides a scan signal to each pixel P, a data driver 1300 that provides a data signal to each pixel P, and a main power wiring for providing a first power supply voltage ELVDD and a second power supply voltage ELVSS. For example, the first scan driver 1100 may be arranged at the left edge of the substrate 100 in the fourth area A4 (e.g., in the x direction). The second scan driver 1200 may be arranged at the right edge of the substrate 100 in the fourth area A4 (e.g., in the x direction). The first scan driver 1100 and the second scan driver 1200 may each be positioned in the fourth area A4, and may be respectively arranged on opposite sides (e.g., left and right sides in the x-direction) of the second area A2, with the second area A2 being located between the first scan driver 1100 and the second scan driver 1200. However, exemplary embodiments of the inventive concept are not limited thereto. For example, in other exemplary embodiments, the display panel 10 may include only the first scan driver 1100. In addition, the arrangement of the first scan driver 1100 and / or the second scan driver 1200 in the fourth area A4 may be changed.

[0120] exist Figure 5 In the embodiment, the data driver 1300 is positioned at one edge of the substrate 100, such as the bottom edge of the substrate 100 (e.g., in the y direction). However, exemplary embodiments of the inventive concept are not limited thereto. For example, in another exemplary embodiment, the data driver 1300 may be positioned on a flexible printed circuit board (FPCB) that is electrically connected to a pad disposed on one side of the display panel 10.

[0121] Figure 7 is a top plan view of a portion of a display panel according to an exemplary embodiment of the inventive concept.

[0122] Reference Figure 7 , some pixels P formed in the second area A2 may be spaced apart from each other around the first area A1. Figure 7 As shown in the exemplary embodiment of FIG. 1 , the first area A1 may be positioned between two pixels P arranged in the x direction. The first area A1 may also be positioned between two pixels P arranged in the x direction. Figure 7 Between two pixels P in the y direction.

[0123] Two pixels P arranged in the y direction with the first area A1 therebetween may be electrically connected to the same data line DL, and the data line DL may be bent or curved in the third area A3. For example, a portion of the data line DL may be bent or curved in the third area A3 and extend along the edge of the first area A1. Figure 7 As shown in the exemplary embodiment of the present invention, a portion of the data line DL may have a similar curvature to the edge of the first area A1, and may extend along the perimeter of the first area A1 in such a manner that the distance between the data line DL and the first area A1 remains substantially constant within the third area A3. However, the exemplary embodiments of the present inventive concept are not limited thereto. The data line DL may include a first portion DL-L1 and a second portion DL-L2 extending in the y direction and spanning the second area A2, and a third portion DL-D connected to the first portion DL-L1 and the second portion DL-L2 and extending along the arc of the first area A1 within the third area A3.

[0124] In an exemplary embodiment, two pixels P arranged in the x direction with the first area A1 therebetween may be electrically connected to different scan lines SL, respectively. For example, the scan line SL located on the left side of the first area A1 (eg, in the x direction) may be electrically connected to the scan line SL described above with reference to FIG. Figure 5 The first scan driver 1100 described above, and the scan lines SL located on the right side of the first area A1 (eg, in the x direction) may be electrically connected to the scan lines SL described above with reference to FIG. Figure 5 The second scan driver 1200 described above. The display panel 10 includes Figure 5 In the embodiment of two driving circuits shown in , the pixels P located at both sides (eg, lateral sides in the x-direction) of the first area A1 may be electrically connected to the scan lines SL spaced apart from each other.

[0125] According to another exemplary embodiment, when the second scan driving circuit 1200 is omitted, two pixels P arranged in the x direction with the first area A1 therebetween can be connected to the same scan line, and the scan line can include a portion extending in an arc direction of the first area A1 within the third area A3 (for example, a third portion DL-D similar to the data line DL).

[0126] Figure 8 is a cross-sectional view of a pixel according to an exemplary embodiment, and may correspond to a cross-sectional view along Figure 7 A cross section taken along line VIII-VIII'.

[0127] Reference Figure 8 , the pixel circuit PC may be arranged on the substrate 100, and the organic light emitting diode OLED electrically connected to the pixel circuit PC may be arranged on the pixel circuit PC. FIG. 3A to FIG. 3C and FIG. 4A to FIG. 4C As described, in an exemplary embodiment, the substrate 100 may include, for example, a glass material or a polymer resin. The substrate 100 may be a single layer or a plurality of layers.

[0128] The buffer layer 201 for preventing impurities from penetrating into the semiconductor layer Act of the thin film transistor TFT may be disposed on the substrate 100. Figure 8 As shown in the exemplary embodiment of , the bottom surface of the buffer layer 201 may directly contact the top surface of the substrate 100. In the exemplary embodiment, the buffer layer 201 may include an inorganic insulating material such as at least one compound selected from silicon nitride, silicon oxynitride, and silicon oxide, and may be a single layer or a plurality of layers including the inorganic insulating material.

[0129] The pixel circuit PC may be disposed on the buffer layer 201. The pixel circuit PC may include a thin film transistor TFT and a storage capacitor Cst. The thin film transistor TFT may include a semiconductor layer Act, a gate electrode GE, a source electrode SE, and a drain electrode DE. Figure 8 The thin film transistor TFT may correspond to the above reference Figure 6 One of the transistors described, such as a driver transistor. Figure 8 In an exemplary embodiment of the present invention, the thin film transistor TFT is a top gate type, wherein the gate electrode GE is arranged on the semiconductor layer Act, and the gate insulating layer 203 is located between the gate electrode GE and the semiconductor layer Act. In this embodiment, the display device may be a top emission type display device. However, according to another exemplary embodiment, the thin film transistor TFT may be a bottom gate type, and the display device may be a bottom emission type display device. In another exemplary embodiment, the display device may be a double-sided emission type display device.

[0130] In an exemplary embodiment, the semiconductor layer Act may include polycrystalline silicon. Alternatively, the semiconductor layer Act may include, for example, at least one compound selected from amorphous silicon, an oxide semiconductor, and an organic semiconductor. The gate electrode GE may include a low-resistance metal material. The gate electrode GE may include at least one conductive material selected from molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and may be formed as a multilayer or single layer including the foregoing materials.

[0131] The gate insulating layer 203 is disposed between the semiconductor layer Act and the gate electrode GE. For example, the bottom surface of the gate insulating layer 203 may directly contact the top surface of the semiconductor layer Act, and the top surface of the gate insulating layer 203 may directly contact the bottom surface of the gate electrode GE. The gate insulating layer 203 may include an inorganic insulating material, such as at least one compound selected from silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, and hafnium oxide. The gate insulating layer 203 may be a single layer or a multilayer including the aforementioned materials.

[0132] The source electrode SE and the drain electrode DE may include a highly conductive material. For example, each of the source electrode SE and the drain electrode DE may include a conductive material including at least one selected from Mo, Al, Cu, Ti, and alloys thereof, and each of the source electrode SE and the drain electrode DE may be a multilayer or a single layer including the foregoing materials. According to an exemplary embodiment, each of the source electrode SE and the drain electrode DE may be formed as a multilayer of Ti / Al / Ti.

[0133] The storage capacitor Cst may include a lower electrode CE1 and an upper electrode CE2 overlapping each other, with the first interlayer insulating layer 205 located between the lower electrode CE1 and the upper electrode CE2. The storage capacitor Cst and the thin film transistor TFT may overlap each other (eg, in the z direction). Figure 8 As shown in the exemplary embodiment of , the gate electrode GE of the thin film transistor TFT is the lower electrode CE1 of the storage capacitor Cst. However, in another exemplary embodiment, the storage capacitor Cst and the thin film transistor TFT may not overlap each other (e.g., in the z direction). The storage capacitor Cst may be covered by the second interlayer insulating layer 207. For example, as in Figure 8 As shown in the exemplary embodiment of FIG. 8 , the second interlayer insulating layer 207 may be disposed directly on the storage capacitor Cst (eg, in the z-direction).

[0134] In an exemplary embodiment, the first interlayer insulating layer 205 and the second interlayer insulating layer 207 may each include an inorganic insulating material such as at least one compound selected from silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, and hafnium oxide. Each of the first interlayer insulating layer 205 and the second interlayer insulating layer 207 may be a single layer or a multilayer including the foregoing materials.

[0135] The pixel circuit PC including the thin film transistor TFT and the storage capacitor Cst may be covered by the first organic insulating layer 209. Figure 8As shown in the exemplary embodiment of , the first organic insulating layer 209 may be directly disposed on the second interlayer insulating layer 207 and the source electrode SE and the drain electrode DE (e.g., in the z direction). The first organic insulating layer 209 is a planarized insulating layer, and the upper surface of the first organic insulating layer 209 may have a substantially flat surface (e.g., extending in the x direction parallel to the upper surface of the substrate 100). In an exemplary embodiment, the first organic insulating layer 209 may include an organic insulating material, such as a commercially available polymer (e.g., polymethyl methacrylate (PMMA) or polystyrene (PS)), a polymer derivative having a phenolic group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine-based polymer, a paraxylene polymer, a vinyl alcohol polymer, or a blend thereof. According to an exemplary embodiment, the first organic insulating layer 209 may include polyimide.

[0136] The contact metal CM may be located on the first organic insulating layer 209. The contact metal CM may include a conductive material including at least one selected from Mo, Al, Cu, Ti, and alloys thereof, and the contact metal CM may be formed as a multilayer or a single layer including the foregoing materials. In an exemplary embodiment, the contact metal CM may include the same material as that included in the source electrode SE or the drain electrode DE of the thin film transistor TFT. According to an exemplary embodiment, the contact metal CM may be formed as a multilayer of Ti / Al / Ti.

[0137] The second organic insulating layer 211 may be disposed on the contact metal CM. Figure 8 As shown in the exemplary embodiment of the present invention, the second organic insulating layer 211 may be directly disposed on the contact metal CM and the first organic insulating layer 209 (e.g., in the z direction). The upper surface of the second organic insulating layer 211 may include a substantially flat surface (e.g., extending in the x direction parallel to the upper surface of the substrate 100). In an exemplary embodiment, the second organic insulating layer 211 may include an organic insulating material, such as a commercially available polymer (e.g., polymethyl methacrylate (PMMA) or polystyrene (PS)), a polymer derivative having a phenolic group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine-based polymer, a paraxylene polymer, a vinyl alcohol polymer, or a blend thereof. According to an exemplary embodiment, the second organic insulating layer 211 may include polyimide. In an exemplary embodiment, an inorganic insulating layer may be further disposed between the first organic insulating layer 209 and the second organic insulating layer 211.

[0138] The pixel electrode 221 may be disposed on the second organic insulating layer 211. Figure 8As shown in the exemplary embodiment of FIG. 1 , the pixel electrode 221 may be disposed directly on the organic insulating layer 211 (eg, in the z direction). In the exemplary embodiment, the pixel electrode 221 may include at least one conductive oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3 ), indium gallium oxide (IGO) or aluminum zinc oxide (AZO). According to another exemplary embodiment, the pixel electrode 221 may include a reflective layer, which includes, for example, at least one selected from silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr) and alloys of these materials. According to another exemplary embodiment, the pixel electrode 221 may also include a reflective layer located above / below the aforementioned reflective layer and composed of ITO, IZO, ZnO and In 2 O 3 A film formed by at least one compound selected from

[0139] The pixel defining layer 215 may be disposed on the pixel electrode 221. Figure 8 As shown in the exemplary embodiment of , the pixel defining layer 215 may be directly disposed on the pixel electrode 221 (e.g., in the z direction). The pixel defining layer 215 may include an opening, through which the upper surface of the pixel electrode 221 is exposed. For example, the opening may be formed in the central portion of the pixel electrode 221. The pixel defining layer 215 may cover the edge of the pixel electrode 221. For example, the pixel defining layer 215 may cover the lateral edge of the pixel electrode 221 (e.g., in the x direction). In an exemplary embodiment, the pixel defining layer 215 may include an organic insulating material. Alternatively, the pixel defining layer 215 may include an inorganic insulating material, such as at least one compound selected from silicon nitride, silicon oxynitride, and silicon oxide. Alternatively, the pixel defining layer 215 may include an organic insulating material and an inorganic insulating material.

[0140] The intermediate layer 222 may include an emission layer 222b. The emission layer 222b may include, for example, an organic material. The emission layer 222b may include a low molecular weight organic material or a high molecular weight organic material that emits light of a specific color. The intermediate layer 222 may include a first functional layer 222a located below the emission layer 222b and / or a second functional layer 222c located above the emission layer 222b. For example, as in Figure 8 As shown in the exemplary embodiment of FIG. 2 , the top surface of the first functional layer 222a may contact the bottom surface of the emission layer 222b. The top surface of the emission layer 222b may contact the bottom surface of the second functional layer 222c.

[0141] The first functional layer 222a may be a single layer or multiple layers. For example, in an exemplary embodiment, the first functional layer 222a includes a polymer organic material. The first functional layer 222a may be a hole transport layer (HTL) having a single layer structure, and may include poly (3,4-ethylenedioxythiophene) (PEDOT) and / or polyaniline (PANI). In an exemplary embodiment in which the first functional layer 222a includes a low molecular weight material, the first functional layer 222a may include a hole injection layer (HIL) and a hole transport layer (HTL).

[0142] In an exemplary embodiment, the intermediate layer 222 may not include the second functional layer 222c. For example, when the first functional layer 222a and the emission layer 222b include a high molecular weight material, the second functional layer 222c may be formed. The second functional layer 222c may be a single layer or a plurality of layers. The second functional layer 222c may include an electron transport layer (ETL) and / or an electron injection layer (EIL).

[0143] The emission layer 222b of the intermediate layer 222 may be arranged in each pixel in the second region A2. The emission layer 222b may be arranged to overlap with the opening of the pixel defining layer 215 or / and the pixel electrode 221 (e.g., in the z direction). Each of the first functional layer 222a and the second functional layer 222c of the intermediate layer 222 may be a single body, and therefore, each of the first functional layer 222a and the second functional layer 222c of the intermediate layer 222 may not only be formed as described above, but also may be formed as described above. Figure 5 The second area A2 described above may also be formed Figure 5 In the third area A3 described.

[0144] In an exemplary embodiment, the relative electrode 223 may include a conductive material having a low work function. For example, the relative electrode 223 may include a (semi) transparent layer, which includes, for example, at least one selected from silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca) and alloys of these materials. Alternatively, the relative electrode 223 may also include a conductive material such as ITO, IZO, ZnO or In on the (semi) transparent layer including any of the above materials. 2 O 3 In an exemplary embodiment, the opposing electrode 223 as a single body may be formed to extend (eg, in the x direction) to cover the plurality of pixel electrodes 221 within the second area A2. In an exemplary embodiment, the intermediate layer 222 and the opposing electrode 223 may be formed via thermal deposition. However, exemplary embodiments of the inventive concept are not limited thereto.

[0145] The spacer 217 may be disposed on the pixel defining layer 215. For example, the bottom surface of the spacer 217 may directly contact the top surface of the pixel defining layer 215. In an exemplary embodiment, the spacer 217 may include an organic insulating material such as polyimide. Alternatively, the spacer 217 may include an inorganic insulating material such as silicon nitride or silicon oxide, or may include an inorganic insulating material and an organic insulating material.

[0146] According to an exemplary embodiment, the spacer 217 may include a material different from that included in the pixel defining layer 215. Alternatively, the spacer 217 may include the same material as that included in the pixel defining layer 215. In the present embodiment, the pixel defining layer 215 and the spacer 217 may be formed together, such as in a mask process using a half-tone mask, etc. According to an exemplary embodiment, the pixel defining layer 215 and the spacer 217 may each include polyimide.

[0147] The cover layer 230 may be positioned on the opposing electrode 223. For example, as in Figure 8 As shown in the exemplary embodiment of , the cover layer 230 may be disposed directly on the opposite electrode (eg, in the z-direction). In an exemplary embodiment, the cover layer 230 may include lithium fluoride (LiF), an inorganic material, or / and an organic material. According to another exemplary embodiment, the cover layer 230 may be omitted.

[0148] Fig. 9 is a schematic top plan view of an input sensing part 40 on a display panel according to an exemplary embodiment of the inventive concept.

[0149] Reference Fig. 9 , the input sensing portion 40 may include a first sensing electrode 410, first traces 415-1 to 415-4 (i.e., first traces 415-1, 415-2, 415-3, and 415-4) connected to the first sensing electrode 410, a second sensing electrode 420, and second traces 425-1 to 425-5 (i.e., second traces 425-1, 425-2, 425-3, 425-4, and 425-5) connected to the second sensing electrode 420. The first sensing electrode 410 and the second sensing electrode 420 may be arranged in the second area A2, and the first traces 415-1 to 415-4 and the second traces 425-1 to 425-5 may be arranged in the fourth area A4.

[0150] The first sensing electrodes 410 may be arranged in the y direction, and the second sensing electrodes 420 may be arranged in the x direction intersecting the y direction. The first sensing electrodes 410 arranged in the y direction may be connected to each other via the first connecting electrodes 411 therebetween, and may form first sensing lines 410C1 to 410C4 (i.e., first sensing lines 410C1, 410C2, 410C3, and 410C4). The second sensing electrodes 420 arranged in the x direction may be connected to each other via the second connecting electrodes 421 therebetween, and may form second sensing lines 420R1 to 420R5 (i.e., second sensing lines 420R1, 420R2, 420R3, 420R4, and 420R5). The first sensing lines 410C1 to 410C4 and the second sensing lines 420R1 to 420R5 may cross each other. For example, the first sensing lines 410C1 to 410C4 may be perpendicular to the second sensing lines 420R1 to 420R5. Although for ease of description, Fig. 9 The exemplary embodiment shown in FIG. 4 includes four first sensing lines 410C1 to 410C4 and five second sensing lines 420R1 to 420R5 , but exemplary embodiments of the inventive concept are not limited thereto, and the number of first and second sensing lines arranged in the first area A1 may vary.

[0151] The first sensing lines 410C1 to 410C4 may be connected to the pads of the sensing signal pad unit 440 through the first traces 415-1 to 415-4 disposed in the fourth area A4. In an exemplary embodiment, the sensing signal pad unit 440 may be disposed at the bottom edge of the input sensing portion 40 (e.g., in the y direction) in the fourth area A4. For example, the first traces 415-1 to 415-4 may have a dual routing structure, wherein the first traces 415-1 to 415-4 are connected to each of the top and bottom of the first sensing lines 410C1 to 410C4. The first traces 415-1 to 415-4 connected to the top and bottom of the first sensing lines 410C1 to 410C4 may be connected to the corresponding pads, respectively.

[0152] The second sensing lines 420R1 to 420R5 may be connected to the pads of the sensing signal pad unit 440 through second traces 425-1 to 425-5 disposed in the fourth area A4 (eg, right side of the fourth area A4 in the x direction). For example, the second traces 425-1 to 425-5 may be connected to corresponding pads, respectively.

[0153] The first area A1 is where the arrangement can be as mentioned above Figure 2A and Figure 2BTherefore, no sensing electrode may be arranged in the first area A1. The metal layer 450 may be arranged near the first area A1, for example, in the third area A3, which will be described in detail later.

[0154] Fig. 9 A dual routing structure is shown in which the first traces 415-1 to 415-4 are connected to each of the top and bottom of the first sensing lines 410C1 to 410C4. Such a dual routing structure can improve the sensing sensitivity. However, the exemplary embodiments of the inventive concept are not limited thereto. According to another exemplary embodiment, the first traces 415-1 to 415-4 may have a single routing structure in which the first traces 415-1 to 415-4 are connected only to the top or bottom of the first sensing lines 410C1 to 410C4.

[0155] Fig.10 is a cross-sectional view of a stack structure of an input sensing part 40 according to an exemplary embodiment of the inventive concept.

[0156] Reference Fig.10 , the input sensing portion 40 may include a first conductive layer CML1 and a second conductive layer CML2. A first insulating layer 43 may be disposed between the first conductive layer CML1 and the second conductive layer CML2 (eg, in the z direction), and a second insulating layer 45 may be disposed on the second conductive layer CML2. Fig. 9 The described first sensing electrode 410 , the first connection electrode 411 , the second sensing electrode 420 , and the second connection electrode 421 may each be included in the first conductive layer CML1 or the second conductive layer CML2 .

[0157] The first conductive layer CML1 and the second conductive layer CML2 may include, for example, a metal layer or a transparent conductive layer. In an exemplary embodiment, the metal layer may include at least one selected from Mo, Mg, Ag, Ti, Cu, Al, and alloys thereof. In an exemplary embodiment, the transparent conductive layer may include a transparent conductive oxide, such as at least one compound selected from indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and indium tin zinc oxide (ITZO). Alternatively, the transparent conductive layer may include a conductive polymer (e.g., PEDOT), a metal nanowire, or graphene, etc.

[0158] The first conductive layer CML1 and the second conductive layer CML2 may be a single layer or multiple layers. In an exemplary embodiment in which the first conductive layer CML1 and the second conductive layer CML2 are single layers, the first conductive layer CML1 and the second conductive layer CML2 may each include a metal layer or a transparent conductive layer, and the materials of the metal layer and the transparent conductive layer may be as described above. In an exemplary embodiment, the first conductive layer CML1 or the second conductive layer CML2 may include a single metal layer. The single metal layer may include a Mo layer or an alloy layer of Mo and another metal element. In an exemplary embodiment, the first conductive layer CML1 or the second conductive layer CML2 may include multiple metal layers. The multiple metal layers may include, for example, three layers (such as Ti / Al / Ti layers) or two layers (such as Mo / Mg layers). Alternatively, the multiple metal layers may include a metal layer and a transparent conductive layer. The first conductive layer CML1 and the second conductive layer CML2 may have different stacking structures, or may have the same stacking structure. For example, the first conductive layer CML1 may include a metal layer, and the second conductive layer CML2 may include a transparent conductive layer. Alternatively, the first conductive layer CML1 and the second conductive layer CML2 may include the same metal layer.

[0159] The materials of the first conductive layer CML1 and the second conductive layer CML2 and the layout of the sensing electrodes included in the first conductive layer CML1 and the second conductive layer CML2 can be determined by taking the sensing sensitivity into consideration. RC delay affects the sensing sensitivity. Since the sensing electrode including the metal layer has a smaller resistance than the sensing electrode including the transparent conductive layer, the RC value can be reduced. Therefore, the charging time period of the capacitor defined between the sensing electrodes can be reduced. Compared with the sensing electrode including the metal layer, the sensing electrode including the transparent conductive layer is not visible to the user. Therefore, the input area can be increased by using the sensing electrode including the transparent conductive layer, thereby increasing the capacitance.

[0160] Each of the first insulating layer 43 and the second insulating layer 45 may include an inorganic insulating material or / and an organic insulating material. In an exemplary embodiment, the inorganic insulating material may include at least one compound selected from silicon oxide, silicon nitride, and silicon oxynitride, and the organic insulating material may include at least one polymer organic material.

[0161] In an exemplary embodiment, the above reference Fig. 9 Some of the first sensing electrodes 410 and the second sensing electrodes 420 and the first connection electrodes 411 and the second connection electrodes 421 described above may be positioned in the first conductive layer CML1, and Fig. 9 The remaining electrodes of the described first and second sensing electrodes 410 and 420 and the first and second connection electrodes 411 and 421 may be positioned in the second conductive layer CML2 .

[0162] In an exemplary embodiment, the first conductive layer CML1 may include Fig. 9 The first connection electrode 411 and the second conductive layer CML2 may include Fig. 9 The first sensing electrode 410 and the second sensing electrode 420 and Fig. 9 According to another exemplary embodiment, the first conductive layer CML1 may include Fig. 9 The first sensing electrode 410 and the second sensing electrode 420 and Fig. 9 The second connection electrode 421, and the second conductive layer CML2 may include Fig. 9 According to another exemplary embodiment, the first conductive layer CML1 may include Fig. 9 The first sensing electrode 410 and Fig. 9 The first connection electrode 411 and the second conductive layer CML2 may include Fig. 9 The second sensing electrode 420 and Fig. 9 In the present embodiment, the first sensing electrode 410 and the first connecting electrode 411 are included in the same layer and are formed integrally with each other, and the second sensing electrode 420 and the second connecting electrode 421 are also included in the same layer and may be formed integrally with each other. Therefore, the insulating layer between the first conductive layer CML1 and the second conductive layer CML2 may not include a contact hole. According to another exemplary embodiment, the first conductive layer CML1 may include Fig. 9 The first sensing electrode 410, Fig. 9 The first connection electrode 411 and the second auxiliary electrode, and the second conductive layer CML2 may include Fig. 9 The second sensing electrode 420, Fig. 9 The second connection electrode 421 and the first auxiliary electrode. In the present embodiment, the first sensing electrode 410 and the first connection electrode 411 may be included in the same layer and formed integrally with each other, and the second sensing electrode 420 and the second connection electrode 421 may also be included in the same layer and formed integrally with each other. In an exemplary embodiment, the first auxiliary electrode may have the same shape as each of the first sensing electrodes 410 in the first sensing electrodes 410, and the first auxiliary electrode and the first sensing electrode 410 may be electrically connected to each other through a contact hole of the insulating layer between the first auxiliary electrode and the first sensing electrode 410. Similarly, the second auxiliary electrode may have the same shape as each of the second sensing electrodes 420 in the second sensing electrodes 420, and the second auxiliary electrode and the second sensing electrode 420 may be electrically connected to each other through a contact hole of the insulating layer between the second auxiliary electrode and the second sensing electrode 420.

[0163] Fig.10The input sensing part 40 is shown to include a first conductive layer CML1, a first insulating layer 43, a second conductive layer CML2, and a second insulating layer 45. However, according to another embodiment, a layer including an inorganic insulating material or an organic insulating material may be further arranged below the first conductive layer CML1 (eg, in the z direction).

[0164] Fig.11A is a top plan view of a first conductive layer CML1 of an input sensing part 40 according to an exemplary embodiment of the inventive concept, and Fig. 11B is a top plan view of the second conductive layer CML2 of the input sensing part 40 according to an exemplary embodiment of the inventive concept.

[0165] As in Fig.11A and Fig. 11B As shown in the exemplary embodiment of FIG. 4 , the first conductive layer CML1 may include a first connection electrode 411 , and the second conductive layer CML2 may include a first sensing electrode 410 , a second sensing electrode 420 , and a second connection electrode 421 .

[0166] The second sensing electrodes 420 may be connected to each other through the second connection electrode 421 disposed on the same layer as the second sensing electrode 420. For example, in an exemplary embodiment, the second sensing electrode 420 may include the same material as that included in the second connection electrode 421 and may be integrally formed. The first sensing electrodes 410 may be connected to each other through the first connection electrode 411 disposed on a different layer (e.g., the first conductive layer CML1). Fig.11A As shown in FIG. 1 , the first insulating layer 43 may include a contact hole CNT. The first connection electrode 411 may be electrically connected to an adjacent first sensing electrode 410 (eg, a first sensing electrode 410 overlapping the first connection electrode 411 in the z direction) on the second conductive layer CML2 through the contact hole CNT provided in the first insulating layer 43 .

[0167] In an exemplary embodiment in which each of the first sensing electrode 410 and the second sensing electrode 420 includes a transparent conductive layer, the first sensing electrode 410 and the second sensing electrode 420 may have a Fig. 11B , and may have an area corresponding to the aforementioned shape, and therefore, the first sensing electrode 410 and the second sensing electrode 420 may have a relatively large input area compared to the mesh-type sensing electrode described below, and may have a high capacitance. In an exemplary embodiment in which each of the first sensing electrode 410 and the second sensing electrode 420 includes a transparent conductive layer, the second conductive layer CML2 may be formed of a transparent conductive material, and the first conductive layer CML1 may be formed of a metal.

[0168] although FIG. 11A to FIG. 11B The exemplary embodiment of the present invention shows a first conductive layer CML1 including a first connection electrode 411 and a second conductive layer CML2 including a first sensing electrode 410, a second sensing electrode 420, and a second connection electrode 421, but exemplary embodiments of the present inventive concept are not limited thereto. For example, in another exemplary embodiment, the second conductive layer CML2 may include the first connection electrode 411, and the first conductive layer CML1 may include the first sensing electrode 410, the second sensing electrode 420, and the second connection electrode 421.

[0169] Fig. 12A is a top plan view of a first conductive layer CML1 of an input sensing part 40 according to an exemplary embodiment of the inventive concept, and Fig. 12B is a top plan view of the second conductive layer CML2 of the input sensing part 40 according to an exemplary embodiment of the inventive concept.

[0170] Reference Fig.10 , Fig. 12A and Fig. 12B , the first sensing electrodes 410 and the second sensing electrodes 420 and the first connection electrodes 411 and the second connection electrodes 421 may have a mesh (or grid or lattice) shape. In an exemplary embodiment in which the first sensing electrodes 410 and the second sensing electrodes 420 include a metal layer, the first sensing electrodes 410 and the second sensing electrodes 420 may have a mesh (or grid or lattice) shape. Fig. 12A and Fig. 12B The grid shape shown in is shaped so as to prevent the metal layer from being visible to the user and / or so as to transmit light emitted from the light emitting diode of each pixel.

[0171] like Fig. 12A and Fig. 12B As shown in the enlarged view of , the first sensing electrode 410 and the second sensing electrode 420 may be a mesh-like metal layer including holes 410H and 420H, respectively. The holes 410H and 420H may be arranged to overlap with the light emitting region PE of the pixel. The first connection electrode 411 and the second connection electrode 421 may include a mesh-like metal layer, respectively.

[0172] like Fig. 12A As shown in , the first sensing electrodes 410 may be connected to each other through the first connection electrode 411, which is disposed on the same layer as the layer on which the first sensing electrodes 410 are disposed. Fig. 12B As shown in , the second sensing electrodes 420 may be connected to each other through a second connection electrode 421 disposed on the same layer as the layer on which the second sensing electrodes 420 are disposed.

[0173] As in Fig. 12AAs shown in the exemplary embodiment of FIG. 1 , the first conductive layer CML1 may include a second auxiliary electrode 422. The second auxiliary electrodes 422 may overlap with the second sensing electrodes 420, respectively (e.g., overlap in the z direction). The second auxiliary electrodes 422 of the first conductive layer CML1 may be electrically connected to the second sensing electrodes 420 of the second conductive layer CML2 through contact holes CNT formed in the first insulating layer.

[0174] The second conductive layer CML2 may include Fig. 12B , and the first auxiliary electrodes 412 may overlap with the first sensing electrodes 410, respectively (e.g., overlap in the z direction). The first auxiliary electrodes 412 of the second conductive layer CML2 may be electrically connected to the overlapped first sensing electrodes 410 of the first conductive layer CML1 through contact holes CNT formed in the first insulating layer.

[0175] Fig.13A is a perspective view of a portion of an input sensing portion 40 according to an exemplary embodiment of the present inventive concept, and Fig. 13B According to an exemplary embodiment of the present invention, Fig.13A A cross-sectional view taken along line XIII-XIII'.

[0176] Reference Fig.10 , Fig.13A and Fig. 13B , two first sensing electrodes 410 (for example, arranged in the y direction) may be connected to each other through the first connection electrode 411, and two second sensing electrodes 420 (for example, arranged in the x direction) may be connected to each other through the second connection electrode 421. The first sensing electrodes 410, the second sensing electrodes 420, and the second connection electrodes 421 may be formed on the same layer (such as the first conductive layer CML1 or the second conductive layer CML2).

[0177] The first connection electrode 411 may extend in the y direction and may intersect the second connection electrode 421 extending in the x direction. The first connection electrode 411 may be positioned on an island-type first insulating layer 43' (hereinafter, referred to as a first insulating pattern) disposed between the first connection electrode 411 and the second connection electrode 421. The first insulating pattern 43' may be disposed at each intersection of the first connection electrode 411 and the second connection electrode 421.

[0178] In an exemplary embodiment, each first insulating pattern 43' may include an organic material or an inorganic material. According to an exemplary embodiment, each first insulating pattern 43' may include a material selected from at least one of a photosensitive material, silicon oxide, titanium oxide, zinc oxide, silicon nitride, aluminum nitride, and tantalum oxide.

[0179] Such as the above reference Fig.10 The insulating layer of the described second insulating layer 45 may be positioned on the first connection electrode 411. The second insulating layer 45 may cover the first and second sensing electrodes 410 and 420 and the first and second connection electrodes 411 and 421 (eg, in the z direction).

[0180] Fig.13A and Fig. 13B It is shown that the first conductive layer CML1 is positioned directly on the display panel 10. However, according to another exemplary embodiment, an insulating layer including an inorganic material or an organic material may be disposed between the display panel 10 and the first conductive layer CML1 (eg, in the z direction).

[0181] Fig.14 is a top plan view of a portion of a display device according to an exemplary embodiment of the inventive concept.

[0182] Reference Fig.14 , the first sensing electrodes 410 may be arranged in the y direction, the second sensing electrodes 420 may be arranged in the x direction, and adjacent second sensing electrodes 420 may be connected to each other through the second connection electrode 421 positioned therebetween. Adjacent first sensing electrodes 410 may be connected to each other via the first connection electrodes 411. The first connection electrode 411 may include an island portion 411b spaced apart from the first sensing electrode 410 (e.g., in the y direction). The island portion 411b may be arranged in a hole formed in the second connection electrode 421, and may be spaced apart from the second connection electrode 421 (e.g., in the z direction) to be electrically insulated from the second connection electrode 421.

[0183] One of the adjacent (e.g., adjacent in the y direction) first sensing electrodes 410 may be connected to the island portion 411b via a first bridge portion 411a, and another adjacent first sensing electrode 410 may be connected to the island portion 411b via a second bridge portion 411c. The first bridge portion 411a and the second bridge portion 411c may be spaced apart in the y direction. The first connection electrode 411 may include a first bridge portion 411a, an island portion 411b, and a second bridge portion 411c that are physically or electrically connected to each other. According to an exemplary embodiment, the island portion 411b may be arranged on the same layer on which the first sensing electrode 410, the second sensing electrode 420, and the second connection electrode 421 are arranged. For example, Fig.10 The second conductive layer CML2 may include an island portion 411b, a first sensing electrode 410, a second sensing electrode 420, and a second connection electrode 421. The first bridge portion 411a and the second bridge portion 411c may be arranged on a layer different from the layer on which the island portion 411b is arranged. Fig.10The first conductive layer CML1 may include a first bridge portion 411 a and a second bridge portion 411 c .

[0184] The dummy electrode 430 may be disposed between the first sensing electrode 410 and the second sensing electrode 420 adjacent to each other. Fig.14 As shown in , the dummy electrode 430 may include a first dummy electrode 431 and a second dummy electrode 432 each extending along an edge of the first sensing electrode 410 or the second sensing electrode 420. For example, the first dummy electrode 431 and the second dummy electrode 432 may each extend in a zigzag shape. The first dummy electrode 431 may extend along an edge of the first sensing electrode 410, and the second dummy electrode 432 may extend along an edge of the second sensing electrode 420. However, exemplary embodiments of the inventive concept are not limited thereto, and the first dummy electrode and the second dummy electrode may have various arrangements. The dummy electrode 430 may be arranged to improve the sensing sensitivity. The dummy electrode 430 may be a floating electrode.

[0185] In an exemplary embodiment, first sensing electrode 410 and second sensing electrode 420 arranged around first area A1 may have a different shape from other sensing electrodes. First sensing electrode 410 and second sensing electrode 420 adjacent to first area A1 may have a smaller area than other sensing electrodes.

[0186] For example, as in Fig.14 As shown in the exemplary embodiment of , each of the first sensing electrode 410 and the second sensing electrode 420 adjacent to the first area A1 may have a curved edge, and the arrangement of the respective adjacent curved edges of the first sensing electrode 410 and the second sensing electrode 420 may generally form a circular shape surrounding the first area A1. For example, in the exemplary embodiment, the adjacent curved edges of the first sensing electrode 410 and the second sensing electrode 420 may correspond to the edge of the third area A3. However, in other exemplary embodiments, the third area A3 may be further disposed within the perimeter formed by the adjacent curved edges of the first sensing electrode 410 and the second sensing electrode 420.

[0187] As in Figure 14 to Figure 15As shown in the exemplary embodiment of , the metal layer 450 may be arranged in the third area A3, which is disposed between the first area A1 and the first sensing electrode 410 and the second sensing electrode 420. Because the first sensing electrode 410 and the second sensing electrode 420 are arranged in the second area A2 as an active area, a light emitting diode such as an organic light emitting diode may be arranged below the first sensing electrode 410 and the second sensing electrode 420. Because the first area A1 is capable of transmitting light, angled incident light from the outside (e.g., light traveling at an oblique angle relative to the thickness direction of the display device 1) may pass through the first area A1 and reach the light emitting diode. When the light emitting diode is exposed to external light (e.g., incident sunlight), the layer included in each light emitting diode or the layer arranged around the light emitting diode may shrink. However, according to an exemplary embodiment, the metal layer 450 arranged around the first area A1 may block external light from reaching the light emitting diode.

[0188] The metal layer 450 may surround the first area A1 while having a specific width (e.g., length in the x and / or y direction). In an exemplary embodiment, in a plan view (e.g., for the z direction), the metal layer 450 may have a ring shape surrounding the first area A1. In an exemplary embodiment, the metal layer 450 may include at least one selected from Mo, Mg, Ag, Ti, Cu, Al, and alloys thereof. For example, the metal layer 450 may include Mo, or may include MoMg. The metal layer 450 may be in a floating state, wherein the metal layer 450 is electrically isolated from the elements around it (such as the first sensing electrode 410 and the second sensing electrode 420 and the dummy electrode 430).

[0189] Fig.15 According to an exemplary embodiment of the present invention, Fig.14 A cross-sectional view taken along line XV-XV'.

[0190] Reference Fig.15In an exemplary embodiment of the present invention, the display layer 200 arranged on the substrate 100 includes a plurality of pixels, for example, an organic light emitting diode, arranged in the second area A2. Because the first area A1 is capable of transmitting light, a component such as a sensor or a camera CMR arranged in the first area A1 can emit light toward the outside and / or receive external light. Because light can travel in various directions, when there is no metal layer 450, as indicated by the dotted line, the incident external light OL obliquely angled toward the substrate 100 can travel toward the display layer 200. However, according to an exemplary embodiment of the inventive concept, the metal layer 450 is arranged to surround the first area A1, thereby reflecting the angled incident external light OL toward the window 60 and away from the display layer 200, thereby preventing the external light OL from reaching the display layer 200. The metal layer 450 may include an eighth hole 450H positioned in the first area A1.

[0191] Metal layer 450 may be positioned on package member 300. For example, as in Fig.15 As shown in the exemplary embodiment of FIG. 4 , the metal layer 450 may be disposed directly on the package member 300 (eg, in the z-direction). However, exemplary embodiments of the inventive concept are not limited thereto. Fig.15 The encapsulating member 300 encapsulates the display layer 200, and thus can be as described above with reference to FIG. 3A to FIG. 3C The rigid packaging substrate described above may be FIG. 4A to FIG. 4C A flexible thin film encapsulation layer is described.

[0192] The metal layer 450 may be arranged below the first sensing electrode 410 (eg, in the z direction), and the first insulating layer 43 of the input sensing unit 40 is disposed between the metal layer 450 and the first sensing electrode 410. Fig.15 As shown in the exemplary embodiment of , the first insulating layer 43 may be directly disposed on the top surface of the package member 300 and the top and side surfaces of the metal layer 450. The first sensing electrode 410 may be covered by the second insulating layer 45. For example, as in Fig.15 As shown in the exemplary embodiment of FIG. 4 , the second insulating layer 45 may be directly disposed on the top and side surfaces of the first sensing electrode 410 and the first insulating layer 43 .

[0193] The optical function portion 50 may be disposed on the input sensing portion 40. For example, the bottom of the optical function portion 50 may contact the top of the input sensing portion 40. The optical function portion 50 may include a second hole 50H positioned in the first area A1. The optical function portion 50 may include an external light reflecting component such as a phase retarder and / or a polarizer to prevent reflection of the external light OL. Alternatively, the optical function portion 50 may include an external light reflecting component such as a combination of a color filter and a black matrix or a destructive interference structure to prevent reflection of the external light OL.

[0194] The width of the second hole 50H of the optical function part 50 (e.g., the length in the x and / or y direction) may be greater than the width of the eighth hole 450H of the metal layer 450. In an exemplary embodiment in which each hole is circular (e.g., when viewed from the z direction in a plan view), the respective widths may be described as diameters. The method of forming the second hole 50H of the optical function part 50 and the eighth hole 450H of the metal layer 450 so that the second hole 50H and the eighth hole 450H have substantially the same diameter may limit the field of view of components such as a camera CMR (e.g., a wide-angle camera) in the first area A1. When the optical function part 50 includes an external light reflecting component such as a relatively thick polarizer, the limitation on the field of view may be more significant. Due to process errors that may be generated in the process of aligning the second hole 50H of the optical function part 50 with the first area A1 during the manufacture of the display device, the limitation on the field of view may also be more significant. However, according to an exemplary embodiment of the inventive concept, the second hole 50H of the optical function part 50 is formed to have a larger diameter (e.g., width) than the eighth hole 450H of the metal layer 450, thereby preventing the above-mentioned field of view limitation from occurring and also preventing damage to the image captured by the camera CMR. The window 60 may be arranged on the optical function part 50 by an optically transparent adhesive OCA. For example, as in Fig.15 As shown in the exemplary embodiment of , the window 60 may be disposed on the optical function part 50 (eg, in the z-direction), with the optically clear adhesive OCA disposed between the window 60 and the optical function part 50 .

[0195] FIG. 16A to FIG. 16D is a cross-sectional view of a method of assembling a display device according to an exemplary embodiment of the inventive concept.

[0196] Reference Fig.16A , a display layer 200 is formed on the substrate 100. The display layer 200 may sequentially include an insulating layer, a pixel circuit, and a light emitting diode as a display element electrically connected to the pixel circuit, respectively. Each pixel circuit has an electronic component, such as a transistor and a capacitor each including an electrode positioned between insulating layers. The display layer 200 may be formed to include a fourth hole 200H. For example, in an exemplary embodiment, in a plurality of processes for respectively forming a plurality of layers constituting the display layer 200, respective portions of the plurality of layers corresponding to the first area A1 may be removed, and the respective portions of the plurality of layers removed may overlap each other (e.g., in the z direction), thereby forming the fourth hole 200H.

[0197] In an exemplary embodiment, in a separate process among the above-mentioned processes of forming the display layer 200, the metal layer 450 and the input sensing part 40 may be formed on the package substrate 300A. The input sensing part 40 may have a stacked structure in which a first conductive layer CML1, a first insulating layer 43, a second conductive layer CML2, and a second insulating layer 45 are stacked (for example, in the z direction). The sensing electrode, the connecting electrode, and the trace of the input sensing part 40 may be included in the first conductive layer CML1 or the second conductive layer CML2. As in Fig.16A As shown in the exemplary embodiment of FIG. 4 , the first conductive layer CML1 may include a first trace 415 and a second trace 425 located in the fourth area A4 , and the second conductive layer CML2 may include a first sensing electrode 410 .

[0198] In an exemplary embodiment, the metal layer 450 may be formed in a process of forming the first conductive layer CML1. In an exemplary embodiment, the metal layer 450 may include the same material as that included in the first conductive layer CML1. For example, the metal layer 450 may include the same material as that included in the first trace 415 or / and the second trace 425, and may be positioned on the same layer on which the second trace 425 and / or the first trace 415 are positioned.

[0199] Reference Fig. 16B , the substrate 100 on which the display layer 200 has been formed and the encapsulation substrate 300A on which the metal layer 450 and the input sensing portion 40 have been formed can be arranged to face each other. The substrate 100 and the encapsulation substrate 300A can be coupled to each other by forming a sealant ST between the substrate 100 and the encapsulation substrate 300A. The sealant ST may be formed between the upper surface of the substrate 100 and the lower surface of the encapsulation substrate 300A in the fourth area A4. In an exemplary embodiment, the sealant ST may extend (e.g., in the x and / or y direction) to completely surround the display layer 200. In an exemplary embodiment, the sealant ST may include glass frit, which is a glass material for making glass. The glass frit may be cured, such as by exposure to a laser beam, etc. Alternatively, the sealant ST may include a material such as an epoxy resin.

[0200] Reference Fig. 16C , the optical function portion 50 is formed on the input sensing portion 40. The optical function portion 50 may be formed on the input sensing portion 40 so that the second hole 50H of the optical function portion 50 is positioned in the first area A1. Fig. 16CAs shown in the exemplary embodiment of , the second hole 50H may also be provided in the third area A3. The second hole 50H of the optical function portion 50 may be formed to be larger (e.g., a larger diameter in the x-direction and / or the y-direction) than the eighth hole 450H of the metal layer 450. Therefore, the optical function portion 50 may overlap only a portion (e.g., a partial portion) of the metal layer 450 (e.g., in the z-direction), and the optical function portion 50 may not overlap a portion of the metal layer 450. In an exemplary embodiment, a layer including an inorganic material or an organic material may be provided between the input sensing portion 40 and the optical function portion 50.

[0201] Reference Fig.16D , the window 60 may be attached to the optical function part 50 by an optically transparent adhesive OCA disposed on the rear surface of the window 60. Fig.16D As shown in the exemplary embodiment of , because the optically clear adhesive OCA includes a material having a relatively high transmittance, the optically clear adhesive OCA may not include a hole corresponding to the first area A1. Alternatively, the optically clear adhesive OCA may have a hole corresponding to the first area A1.

[0202] Fig.17 is a cross-sectional view of a display device according to an exemplary embodiment of the inventive concept.

[0203] Reference Fig.17 , a buffer layer 201, a gate insulating layer 203, a first interlayer insulating layer 205, a second interlayer insulating layer 207, a first organic insulating layer 209 and a second organic insulating layer 211 are arranged on the substrate 100. For example, as in Fig.17 As shown in the exemplary embodiment of the present invention, the buffer layer 201, the gate insulating layer 203, the first interlayer insulating layer 205, the second interlayer insulating layer 207, the first organic insulating layer 209 and the second organic insulating layer 211 may be stacked one on top of another (e.g., in the z direction). Each pixel circuit PC may include a thin film transistor and a storage capacitor, and the semiconductor layer and electrode of the thin film transistor and the electrode of the storage capacitor may be arranged on the aforementioned insulating layer.

[0204] The pixel electrode 221 may be connected to the contact metal CM via the contact hole of the second organic insulating layer 211, and the contact metal CM may be connected to the thin film transistor of the pixel circuit PC via the contact hole of the first organic insulating layer 209. According to another exemplary embodiment, the contact metal CM may not be included on the substrate 100.

[0205] The pixel defining layer 215 disposed on the pixel electrode 221 may include an opening overlapping the pixel electrode 221 , and the opening of the pixel defining layer 215 may define a light emitting region. Fig.17 The light emitting area EA may correspond to Fig. 12A and Fig. 12B The first functional layer 222a, the emission layer 222b, the second functional layer 222c and the cover layer 230 may be sequentially stacked (eg, in the z direction) on the pixel defining layer 215. The materials and features of the display layer 200 disposed on the substrate 100 are the same as those described above with reference to Figure 8 The materials and features described are the same.

[0206] The display device 1 may include a first area A1 between pixels (eg, light emitting diodes each including a stack of a pixel electrode 221, an emission layer 222b, and an opposing electrode 223). The display layer 200 may include a fourth hole 200H positioned in the first area A1.

[0207] The fourth hole 200H may be formed by overlapping through holes respectively formed in the insulating layers of the display layer 200. The insulating layers of the display layer 200 (e.g., the buffer layer 201, the gate insulating layer 203, the first interlayer insulating layer 205, the second interlayer insulating layer 207, the first organic insulating layer 209, the second organic insulating layer 211, and the pixel defining layer 215) may respectively include through holes positioned in the first area A1. The fourth hole 200H may be defined by an insulating layer defining a small hole in the insulating layer of the display layer 200. For example, as in Fig.17 As shown in the exemplary embodiment of FIG. 2 , the fourth hole 200H may be defined by a side surface of the first organic insulating layer 209 .

[0208] Similar to the insulating layer of the display layer 200 , the first functional layer 222 a , the second functional layer 222 c , the opposite electrode 223 , and the cover layer 230 may respectively include holes formed by removing portions corresponding to the first area A1 .

[0209] The encapsulation substrate 300A may be arranged to face the substrate 100. In the first area A1, the material included in the display layer 200 is not arranged between the lower surface of the encapsulation substrate 300A and the upper surface of the substrate 100. For example, the upper surface of the substrate 100 may directly face the lower surface of the encapsulation substrate 300A in the first area A1, and no layer may be provided between the upper surface of the substrate 100 and the lower surface of the encapsulation substrate 300A.

[0210] In an exemplary embodiment, the encapsulation substrate 300A may include the same material as the substrate 100, and may have the same refractive index as the substrate 100. For example, each of the substrate 100 and the encapsulation substrate 300A may have a refractive index of about 1.3 to about 1.7, for example, a refractive index of about 1.5. However, exemplary embodiments of the inventive concept are not limited thereto.

[0211] The metal layer 450 may be disposed in the third area A3. The metal layer 450 may overlap (eg, in the z-direction) the respective third portions DL-D of the plurality of data lines disposed in the third area A3.

[0212] The metal layer 450 may directly contact the upper surface of the package substrate 300A. For example, the bottom of the metal layer 450 may be directly disposed on the upper surface of the package substrate 300A (e.g., in the z direction). In an exemplary embodiment, the metal layer 450 may be formed in a process of forming the input sensing portion 40 (e.g., a process of forming a trace and a first connection electrode). For example, Fig.17 The first trace 415 and the metal layer 450 positioned in the fourth area A4 are shown disposed directly on the upper surface of the package substrate 300A. At least one of the traces (eg, the first trace 415) positioned in the fourth area A4 may overlap the sealant ST (eg, in the z direction).

[0213] The first insulating layer 43 formed of silicon nitride, silicon oxide, or silicon oxynitride may be disposed on the metal layer 450. For example, the first insulating layer 43 may be directly disposed on the metal layer 450 (e.g., in the z direction). The sensing electrode such as the first sensing electrode 410 and the second insulating layer 45 may be sequentially disposed on the first insulating layer 43 (e.g., in the z direction). The first insulating layer 43 and the second insulating layer 45 may include a ninth hole 43H and a tenth hole 45H positioned in the first area A1, respectively. The end of the first insulating layer 43 defining the ninth hole 43H may cover the inner edge of the metal layer 450 (e.g., the edge adjacent to the first area A1 in the x direction), and the end of the second insulating layer 45 defining the tenth hole 45H may cover the end of the first insulating layer 43. In an exemplary embodiment, the first insulating layer 43 and the second insulating layer 45 may include the same material, or may include different materials. Each of the first insulating layer 43 and the second insulating layer 45 may include an inorganic insulating material or an organic insulating material.

[0214] The optical function part 50 may be arranged to cover a portion of the metal layer 450, and the optically transparent adhesive OCA and the window 60 may be arranged on the optical function part 50. A shading unit 61 covering a component such as the first trace 415 arranged in the fourth area A4 may be arranged on the rear surface of the window 60. In an exemplary embodiment, the shading unit 61 covering the dead area may include a colored layer. For example, the shading unit 61 may include layers of various colors such as white, black, silver, gold, and pink. In an exemplary embodiment, the shading unit 61 may have a shape of a polygonal ring or frame surrounding the second area A2. For example, the shading unit 61 may have a shape approximating a quadrilateral ring or frame.

[0215] The second hole 50H of the optical function part 50 may overlap (e.g., in the z direction) with the eighth hole 450H of the metal layer 450. With respect to alignment errors during the assembly process of the display device and / or the quality of an image captured by a camera due to the field of view of the camera when the component 20 is a camera, the first width W1 (e.g., the length in the x direction and / or the y direction) of the eighth hole 450H of the metal layer 450 may be smaller than the second width W2 of the second hole 50H of the optical function part 50. The first width W1 of the eighth hole 450H may be greater than the third width W3 of the fourth hole 200H of the display layer 200. The first width W1, the second width W2, and the third width W3 may be smaller than the distance between two adjacent pixels having the first area A1 therebetween, such as the distance W4 between the light emitting areas EA of the two adjacent pixels.

[0216] although Fig.17 An exemplary embodiment includes a metal layer 450 disposed below the first insulating layer 43 (e.g., in the z direction), but exemplary embodiments of the inventive concept are not limited thereto. According to another exemplary embodiment, the sensing electrodes including the first sensing electrode 410 and the second connection electrode may be disposed below the first insulating layer 43, the trace may be disposed above the first insulating layer 43, and the metal layer 450 may be formed together when the trace is formed, so that the metal layer 450 may be disposed above the first insulating layer 43 (e.g., in the z direction).

[0217] Fig.18 is a top plan view of a portion of a display device according to an exemplary embodiment of the inventive concept and illustrates a relationship between a metal layer and an optical function part.

[0218] Reference Fig.18 , the second width W2 (eg, length in the x direction) of the second hole 50H of the optical function portion 50 is formed to be greater than the first width W1 of the eighth hole 450H of the metal layer 450. Fig.18 As shown in the exemplary embodiment of FIG. 4 , the optical function portion 50 may cover a portion of the metal layer 450 , for example, an outer edge 450 oe ​​of the metal layer 450 .

[0219] In an exemplary embodiment, the optical function part 50 may be arranged to cover the entire second area A2 in a plan view (eg, from the z direction). For example, the optical function part 50 may cover the first and second sensing electrodes 410 and 420 and the dummy electrode 430 .

[0220] Fig.19 and Fig. 20 is a schematic cross-sectional view of a display device according to an exemplary embodiment of the inventive concept.

[0221] Reference Fig.19 and Fig. 20 , as mentioned above Fig.17 As described above, the display layer 200 may be arranged on the substrate 100, and the display layer 200 may be covered by the encapsulation substrate 300A. The metal layer 450 and the input sensing portion 40 may be arranged on the encapsulation substrate 300A, and the optical function portion 50 may be positioned on the input sensing portion 40. The stacking structure from the substrate 100 to the optical function portion 50 and the features according to the stacking structure are similar to those described above with reference to Fig.17 The contents described are the same, therefore, we will now focus on and describe the differences between them.

[0222] The shading unit may be arranged on the rear surface of the window 60. The shading unit may include a first shading unit 61a arranged in the third area A3 and a second shading unit 61b arranged in the fourth area A4. In a plan view (e.g., as viewed from the z direction), the first shading unit 61a may have a shape of a ring surrounding the first area A1. The second shading unit 61b may have a shape of a ring surrounding the second area A2. For example, the first shading unit 61a may have a shape of a circular ring or frame surrounding the first area A1, and the second shading unit 61b may have a shape of a polygonal ring or frame surrounding the second area A2. For example, the second shading unit 61b may have a shape of a ring or frame that is approximately a quadrilateral. However, exemplary embodiments of the inventive concept are not limited thereto, and the first shading unit 61a and the second shading unit 61b may have a variety of different shapes. The second shading unit 61b may correspond to Fig.17 The shading unit 61 of the fourth area A4.

[0223] The first light shielding unit 61a and the second light shielding unit 61b may be colored layers. The second light shielding unit 61b and the first light shielding unit 61a may have different colors. For example, in an exemplary embodiment, the first light shielding unit 61a may have black, and the second light shielding unit 61b may have various colors such as white, silver, gold, and pink.

[0224] In an exemplary embodiment in which the assembly 20 includes a camera having a relatively narrow field of view or includes a sensor that is relatively free in terms of field of view, the first light shielding unit 61a described above may be arranged on the rear surface of the window 60. The first light shielding unit 61a formed to surround the first area A1 may include an eleventh hole 61ah positioned in the first area A1, and as Fig.19 As shown in FIG. 5 , the fifth width W5 of the eleventh hole 61ah may be substantially equal to or greater than the second width W2 of the optical function portion 50. Alternatively, as Fig. 20 As shown in FIG. 4 , the fifth width W5 ′ of the eleventh hole 61 ah ′ may be substantially equal to or greater than the first width W1 of the eighth hole 450H of the metal layer 450 .

[0225] Fig.21 is a top plan view of a portion of a display device according to an exemplary embodiment of the inventive concept, and Fig. 22 According to an exemplary embodiment of the present invention Fig.21 Enlarged plan view of section XXII.

[0226] Reference Fig.21 , the display device may include one or more lines each extending at the periphery of the metal layer 450 in the third area A3. The one or more lines are configured to prevent damage to the input sensing part 40 due to electrostatic discharge (ESD) that may flow through the metal layer 450, and thus may be arranged outside the metal layer 450. Fig.21 The exemplary embodiment shows first, second, and third lines 461, 462, and 463 positioned between metal layer 450 and first and second sensing electrodes 410 and 420 in third area A3 (eg, in the x-direction and / or the y-direction).

[0227] Each of the first line 461, the second line 462, and the third line 463 may have a ring shape having a width (e.g., a length in the x direction) smaller than the width W0 of the metal layer 450. The first line 461, the second line 462, and the third line 463 may be spaced apart from each other. In an exemplary embodiment, each of the first line 461, the second line 462, and the third line 463 may include a conductive material.

[0228] Each of the first line 461, the second line 462, and the third line 463 may include an opening. Fig.21 In the enlarged view of the upper side of the third line 463, the third line 463 may include third material portions 463P spaced apart from each other, and the third opening portion 463O is located between the third material portions 463P spaced apart from each other. In an exemplary embodiment, the third material portion 463P may include a conductive material such as a metal. Similarly, the second line 462 may include second material portions 462P spaced apart from each other, and the second opening portion 462O is located between the second material portions 462P spaced apart from each other. The second material portion 462P may include a conductive material such as a metal.

[0229] The third line 463 may include a plurality of third opening portions 463O. In an exemplary embodiment, the third opening portions 463O may be arranged at positions of 0°, 90°, 180°, and 270° relative to the center C of the first area A1, and the third line 463 may include four third material portions 463P. However, exemplary embodiments of the inventive concept are not limited thereto, and the third opening portions 463O may be arranged at various intervals or may be arranged at random intervals.

[0230] The second line 462 may include a plurality of second opening portions 462O. According to an exemplary embodiment, the second opening portions 462O may be arranged at positions of 0°, 45°, 90°, 135°, 180°, 225°, 270°, and 315° relative to the center C of the first area A1, and thus the second line 462 may include eight second material portions 462P. However, exemplary embodiments of the inventive concept are not limited thereto.

[0231] In an exemplary embodiment, the third line 463 relatively close to the metal layer 450 (e.g., in the x-direction and / or the y-direction) may include a smaller number of material portions than the second line 462 relatively far from the metal layer 450, and the area of ​​each second material portion 462P may be smaller than the area of ​​each third material portion 463P. The area of ​​the material portion included in the metal layer 450 may decrease in a direction away from the metal layer 450, so that the material portion may have a smaller amount of charge in the direction away from the metal layer 450.

[0232] The first line 461 may also include an opening portion, and the opening portion of the first line 461 may be formed at a position different from the second opening portion 462O and the third opening portion 463O.

[0233] Reference Fig. 22 , the first opening portion 461O of the first line 461 may be arranged adjacent to the dummy electrode 430 (e.g., immediately adjacent in the x and / or y directions). For example, the first opening portion 461O may be arranged adjacent to the first dummy electrode 431 and the second dummy electrode 432, respectively. In an exemplary embodiment, one first opening portion 461O may be arranged adjacent to the center of the first width L1 of the first dummy electrode 431, and another first opening portion 461O may be arranged adjacent to the center of the second width L2 of the second dummy electrode 432.

[0234] Since the display device includes the above reference Fig.21 and Fig. 22 The first line 461, the second line 462, and the third line 463 described above are formed so that even when ESD flows in via the metal layer 450, the ESD can travel from the third line 463 to the second line 462. When the ESD travels from the third material portion 463P to the second material portion 462P having a relatively smaller area than the third material portion 463P, the electrical change amount of the ESD is reduced. When the ESD travels toward the first line 461 via the second line 462, because the first opening portion 461O is arranged adjacent to the dummy electrode 430, the damage caused by the ESD is guided to the dummy electrode 430. Therefore, damage to the first sensing electrode 410 and the second sensing electrode 420 can be prevented.

[0235] Fig.23 is a schematic cross-sectional view of a display device according to an exemplary embodiment of the inventive concept.

[0236] Reference Fig.23 , the first line 461, the second line 462, and the third line 463 may be further arranged in the third area A3. The first line 461, the second line 462, and the third line 463 may be arranged on the same layer on which the metal layer 450 and / or the trace 415 are arranged. For example, the first line 461, the second line 462, the third line 463, the metal layer 450, and the trace 415 may be positioned on the package substrate 300A and may include the same material. For example, as in Fig.23 As shown in the exemplary embodiment of FIG. 4 , the bottom surfaces of the first line 461 , the second line 462 , the third line 463 , the metal layer 450 , and the trace 415 may directly contact the top surface of the package substrate 300A.

[0237] exist Fig.23 In an exemplary embodiment of the present invention, the first line 461, the second line 462, the third line 463 and the metal layer 450 are arranged on Fig.23 461, the second line 462, the third line 463, the metal layer 450 and the trace 415 may be arranged above the first insulating layer 43. However, exemplary embodiments of the inventive concept are not limited thereto. For example, in another exemplary embodiment, the sensing electrode including the first sensing electrode 410 and the second connection electrode may be arranged below the first insulating layer 43, and the first line 461, the second line 462, the third line 463, the metal layer 450 and the trace 415 may be arranged above the first insulating layer 43.

[0238] The features of the structures other than the first line 461, the second line 462, and the third line 463 and other structures are the same as those mentioned above. Fig.17 The structures described are the same, so redundant descriptions thereof will be omitted.

[0239] FIG. 24A to FIG. 24F is an enlarged top plan view of a portion of a display device according to an embodiment.

[0240] Reference Fig.24A , the metal layer 450, the third line 463, the second line 462, and the first line 461 may be arranged around the first area A1. The metal layer 450, the third line 463, the second line 462, and the first line 461 may include the same Fig.21 and Fig. 22 However, as in Fig.24A As shown in the exemplary embodiment of FIG. 4 , each of the first line 461, the second line 462, and the third line 463 may not include any openings. Fig.24AAs shown in , the peripheral metal layer 470 may be further arranged around the first area A1. The peripheral metal layer 470 may be arranged on the same layer on which the metal layer 450, the third line 463, the second line 462, and the first line 461 are arranged, and may include the same material as the material included in the metal layer 450, the third line 463, the second line 462, and the first line 461. Similar to the metal layer 450, the peripheral metal layer 470 may be in a floating state. Alternatively, the peripheral metal layer 470 may be electrically connected to an adjacent sensing electrode. In the present embodiment, the peripheral metal layer 470 may be used as an auxiliary sensing electrode or as a connecting electrode connecting the sensing electrodes to each other.

[0241] According to other exemplary embodiments, referring to Fig. 24B and Fig.24C The metal layer 450, the third line 463, the second line 462, and the first line 461 may be arranged in the third area A3 and surround the first area A1. The detailed structure of the third line 463, the second line 462, and the first line 461 may be the same as that of the above reference. Fig.21 and Fig. 22 Same as described.

[0242] The metal layer 450 may include a plurality of material portions 450P separated from each other by a plurality of slit lines. Fig. 24B As shown in , the metal layer 450 may include a plurality of material portions 450P patterned by first slit lines 450S1 and second slit lines 450S2 that are crossed with each other. The first slit lines 450S1 may each extend in the x-direction, and the second slit lines 450S2 may each extend in the y-direction. The plurality of material portions 450P may be arranged to be spaced apart from each other in the column direction and the row direction. However, exemplary embodiments of the inventive concept are not limited to this specific arrangement of the first slit lines and the second slit lines. In other exemplary embodiments, the slit lines may have various different arrangements.

[0243] For example, Fig.24C As shown in FIG, the metal layer 450 may include third slit lines 450S3 each extending in a circumferential direction of the first area A1 and fourth slit lines 450S4 crossing the third slit lines 450S3. Due to the third slit lines 450S3 and the fourth slit lines 450S4, the metal layer 450 may include a plurality of material portions 450P.

[0244] According to another exemplary embodiment, referring to Fig.24D , the metal layer 450, the third line 463, the second line 462, and the first line 461 may be arranged around the first area A1. The metal layer 450, the third line 463, the second line 462, and the first line 461 may include the same Fig.21 and Fig. 22However, as in Fig.24D As shown in the exemplary embodiment of , each of the first line 461, the second line 462, and the third line 463 may not include any openings. The peripheral metal layer 470 may be further arranged around the first area A1. The peripheral metal layer 470 may include a plurality of portions 470a to 470n separated from each other by the fifth slit line 470S5. The plurality of portions 470a, ..., and 470n may each extend in a circumferential direction to surround the first area A1.

[0245] according to Fig.24E In an exemplary embodiment, the metal layer 450 may be arranged around the first area A1, and the metal layer 450 may include a plurality of portions 450a to 450m separated from each other by the sixth slit line 450S6. The plurality of portions 450a to 450m may each extend in a circumferential direction to surround the first area A1.

[0246] according to Fig.24F In an exemplary embodiment of the present invention, the metal layer 450 may be arranged around the first area A1, and the metal layer 450 may include a plurality of portions 450a to 450m separated from each other by the seventh slit line 450S7 and the eighth slit line 450S8. The seventh slit lines 450S7 may each extend in a circumferential direction to surround the first area A1. The eighth slit lines 450S8 may each extend to intersect with the seventh slit line 450S7. Each of the eighth slit lines 450S8 may not extend continuously, but may extend intermittently so that the portions of each eighth slit line 450S8 alternate with each other. Therefore, the first material portion 450a of the metal layer 450 may overlap with two adjacent second material portions 450b arranged outside the first material portion 450a, and the eighth slit line 450S8 located between the two adjacent second material portions 450b may overlap with the first material portion 450a.

[0247] Fig.25 is a top plan view of an input sensing part 40 ′ of a display device according to an exemplary embodiment of the inventive concept.

[0248] Reference Fig.25 , the input sensing portion 40' may include a plurality of sensing electrodes 400 and a plurality of traces 435. The plurality of sensing electrodes 400 may be arranged in the second area A2, and each has unique coordinate information.

[0249] For example, as in Fig.25As shown in the exemplary embodiment of , a plurality of sensing electrodes 400 may be arranged in, for example, a matrix shape. A plurality of sensing electrodes 400 may be arranged around a first area A1 and may be respectively connected to traces 435. Some traces 435 may be arranged in a second area A2, and other traces 435 may be arranged in a fourth area A4. In an exemplary embodiment, a plurality of sensing electrodes 400 may obtain coordinate information according to a self-capacitance method or a mutual capacitance method. Each sensing electrode 400 may have a grid structure.

[0250] Fig.26 is a cross-sectional view of an input sensing portion 40 ′ according to an exemplary embodiment of the inventive concept, and shows a Fig.25 A cross section taken along line XXVIa-XXVIa' and line XXVIb-XXVIb'.

[0251] Reference Fig.26 The input sensing part 40' may be disposed on the display panel 10 and may include a conductive layer CML and a first insulating layer 43 covering the conductive layer CML, the conductive layer CML including the sensing electrode 400. The conductive layer CML may include the sensing electrode 400 and the trace 435. For example, the sensing electrode 400 and the trace 435 may be formed together in the same process and may include the same material.

[0252] In an exemplary embodiment, the conductive layer CML of the sensing electrode 400 and the trace 435 may include at least one selected from Mo, Mg, Ag, Ti, Cu, Al, and alloys thereof. For example, the conductive layer CML may include a three-layer structure, for example, Al / Ti / Al. The first insulating layer 43 may include an organic insulating material or / and an inorganic insulating material.

[0253] Fig. 27 is a schematic cross-sectional view of a display device according to an exemplary embodiment of the inventive concept.

[0254] Reference Fig. 27 , the input sensing portion 40' located on the package substrate 300A may include a sensing electrode 400 and a trace 435. The sensing electrode 400 and the trace 435 may be formed on the same layer and may include the same material. According to an exemplary embodiment, the sensing electrode 400 and the trace 435 may be arranged on the package substrate 300A. For example, the bottom surfaces of the sensing electrode 400 and the trace 435 may directly contact the top surface of the package substrate 300A.

[0255] Because of the above reference Fig.10 Compared to the input sensing portion 40 described as including two conductive layers, the input sensing portion 40 ′ includes a single conductive layer, so the input sensing portion 40 ′ may have a reduced thickness.

[0256] The optical function portion 50 may be arranged on the input sensing portion 40'. For example, the bottom surface of the optical function portion 50 may directly contact the top surface of the input sensing portion 40'. In an exemplary embodiment, the metal layer 450 may be arranged in the third area A3 by taking into account the alignment margin that can occur during the assembly of the optical function portion 50 including the second hole 50H and / or the field of view limitation that can occur when the component 20 is a camera. The second hole 50H of the optical function portion 50 may be formed to be larger than the eighth hole 450H of the metal layer 450, so that the optical function portion 50 covers a portion of the metal layer 450.

[0257] The metal layer 450 may also be formed in a process of forming the input sensing portion 40' (e.g., a process of forming the sensing electrode 400 and the trace 435). The metal layer 450 may be disposed on the same layer as the layer on which the sensing electrode 400 and the trace 435 are disposed, and may include the same material as that included in the sensing electrode 400 and the trace 435.

[0258] Other structural features are the same as above Fig.17 The descriptions are the same, so their redundant descriptions will be omitted.

[0259] exist Fig. 27 In the embodiment, the encapsulation substrate 300A is shown as an encapsulation member. However, in another exemplary embodiment, the encapsulation member may include a thin film encapsulation layer, which includes the above-mentioned Figure 4A At least one inorganic encapsulation layer and at least one organic encapsulation layer as described in the embodiments of the present invention.

[0260] The display device according to the exemplary embodiment of the inventive concept can protect the light emitting device from external light and can prevent the light emitting device from being damaged by electrostatic discharge. These effects are only examples, and the scope of the present disclosure is not limited thereto.

[0261] It should be understood that the exemplary embodiments described herein should be considered in a descriptive sense only and not for limiting purposes. The description of features or aspects within each exemplary embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more exemplary embodiments have been described with reference to the accompanying drawings, it will be understood by those of ordinary skill in the art that various changes in form and detail may be made therein without departing from the spirit and scope defined by the present disclosure.

Claims

1. A display device, wherein: The display device comprises: substrate; a buffer layer on the substrate; a plurality of thin film transistors, each of the plurality of thin film transistors including an active layer and a gate electrode overlapping a portion of the active layer on the buffer layer; a first region in which a plurality of pixels are arranged, the plurality of pixels including a plurality of light emitting diodes electrically connected to the plurality of thin film transistors, the plurality of light emitting diodes each including a lower electrode and a light emitting layer disposed between the lower electrode and the upper electrode; at least one insulating layer disposed between the buffer layer and the lower electrodes of the plurality of light emitting diodes arranged in the first region of the display device; An encapsulation layer, on the upper electrodes of the plurality of light emitting diodes; A touch sensor section, in the first area, the touch sensor section comprising: a plurality of touch sensor electrodes; and a plurality of connection lines, each connecting two adjacent touch sensor electrodes in the first area; A second region is disposed between two adjacent pixels in the first region, wherein the second region includes a transmission region; a third area, arranged between the first area and the second area; a metal layer, wherein in the third region, the metal layer has a first hole corresponding to the transmission region, the first hole having a first width; and An optical function part, on the metal layer, in: The at least one insulating layer has a second hole corresponding to the transmission area and having a second width smaller than the first width, The optical function portion has a third hole overlapping the first hole and the second hole, the third hole having a third width greater than the first width, and The metal layer is disposed in a same layer as one selected from among the plurality of touch sensor electrodes and the plurality of connection lines.

2. The display device according to claim 1, wherein: The buffer layer has holes corresponding to the transmission area.

3. The display device according to claim 1, wherein: The optical function portion includes at least one selected from a polarizer, a retarder, a destructive interference structure, and a combination of a color filter and a black matrix.

4. The display device according to claim 1, wherein: The optical function portion covers only a partial portion of the metal layer.

5. The display device according to claim 1, wherein: The metal layer includes at least one selected from molybdenum, magnesium, silver, titanium, copper, aluminum, and alloys of these materials.

6. The display device according to claim 1, wherein: An upper surface of the substrate and a lower surface of the encapsulation layer face each other with a gap therebetween.

7. The display device according to claim 1, wherein: The display device further includes: A window is on the optical functional part.

8. A display device, wherein: The display device comprises: substrate; a first region in which a plurality of pixels are arranged, the plurality of pixels including a plurality of light emitting diodes electrically connected to a plurality of thin film transistors, the plurality of light emitting diodes each including a lower electrode and a light emitting layer disposed between the lower electrode and an upper electrode; at least one insulating layer disposed between the substrate and the lower electrodes of the plurality of light emitting diodes arranged in the first region of the display device; A packaging portion, on the upper electrodes of the plurality of light emitting diodes; a touch sensor portion, wherein the touch sensor portion includes a plurality of touch sensor electrodes in the first region; A second region is disposed between two adjacent pixels in the first region, wherein the second region includes a transmission region; a third area, arranged between the first area and the second area; a metal layer disposed on the encapsulation part in the third region, the metal layer having a first hole corresponding to the transmission region, the first hole having a first width; and An optical function part, on the metal layer, in: The at least one insulating layer has a second hole corresponding to the transmission area and having a second width smaller than the first width, and The optical function portion has a third hole overlapping the first hole and the second hole, the third hole having a third width greater than the first width.

9. The display device according to claim 8, wherein: The touch sensor section further includes a plurality of connection lines, each of which connects two adjacent touch sensor electrodes in the first area, and The metal layer is arranged in the same layer as one selected from the plurality of touch sensor electrodes and the plurality of connection lines.

10. The display device according to claim 8, wherein: The optical function portion includes at least one selected from a polarizer, a retarder, a destructive interference structure, and a combination of a color filter and a black matrix.

11. The display device according to claim 10, wherein: The polarizer covers only a partial portion of the metal layer.

12. The display device according to claim 8, wherein: The metal layer includes at least one selected from molybdenum, magnesium, silver, titanium, copper, aluminum, and alloys of these materials.

13. An electronic device, wherein: The electronic device comprises: substrate; a first region in which a plurality of pixels are arranged, the plurality of pixels including a plurality of light emitting diodes electrically connected to a plurality of thin film transistors, the plurality of light emitting diodes each including a lower electrode and a light emitting layer disposed between the lower electrode and an upper electrode; at least one insulating layer disposed between the substrate and the lower electrodes of the plurality of light emitting diodes arranged in the first region of the electronic device; A packaging portion, on the upper electrodes of the plurality of light emitting diodes; A touch sensor section, in the first area, the touch sensor section comprising: a plurality of touch sensor electrodes; and a plurality of connection lines, each connecting two adjacent touch sensor electrodes in the first area; A second region is disposed between two adjacent pixels in the first region, wherein the second region includes a transmission region; a third area, arranged between the first area and the second area; a metal layer, disposed on the encapsulation part in the third region, the metal layer having a first hole corresponding to the transmission region, the first hole having a first width; an optical function portion on the metal layer; and A component disposed below the substrate, the component being arranged in the second region; in: The at least one insulating layer has a second hole corresponding to the transmission area and having a second width smaller than the first width, and The optical function portion has a third hole overlapping the first hole and the second hole, the third hole having a third width greater than the first width.

14. The electronic device according to claim 13, wherein: The metal layer is disposed in a same layer as one selected from among the plurality of touch sensor electrodes and the plurality of connection lines.

15. The electronic device according to claim 13, wherein: The electronic device further comprises: A buffer layer is provided between the substrate and the plurality of thin film transistors, wherein the buffer layer has holes corresponding to the transmission area.

16. The electronic device according to claim 13, wherein: The optical function portion includes at least one selected from a polarizer, a retarder, a destructive interference structure, and a combination of a color filter and a black matrix.

17. The electronic device according to claim 16, wherein: The polarizer covers only a partial portion of the metal layer.

18. The electronic device according to claim 13, wherein: The metal layer includes at least one selected from molybdenum, magnesium, silver, titanium, copper, aluminum, and alloys of these materials.

19. The electronic device according to claim 13, wherein: An upper surface of the substrate and a lower surface of the packaging part face each other with a gap therebetween.

20. The electronic device according to claim 13, wherein: The electronic device further comprises: A window is on the optical functional part.

21. The electronic device according to claim 13, wherein: The components include sensors or cameras.

22. A display device, wherein: The display device comprises: two pixels spaced apart from each other and a transmissive region between the two pixels; an input sensing portion on the two pixels and comprising a sensing electrode and a trace electrically connected to the sensing electrode; a metal layer on the two pixels, wherein the metal layer is disposed between the two pixels and surrounds the transmission area, the metal layer does not overlap with light emitting areas of the two pixels, the metal layer includes a first hole positioned in the transmission area, and the first hole has a first width; and An optical function portion is provided on the metal layer, the optical function portion comprising a second hole overlapping the first hole, the second hole having a second width greater than the first width. 23 . The display device according to claim 22 , wherein the optical function portion covers only a partial portion of the metal layer.

24. The display device according to claim 23, wherein: The optical function portion includes at least one selected from a polarizer, a retarder, a destructive interference structure, and a combination of a color filter and a black matrix.

25. The display device according to claim 22, wherein: The metal layer includes at least one selected from molybdenum, magnesium, silver, titanium, copper, aluminum, and alloys of these materials.

26. A display device, wherein: The display device comprises: two pixels spaced apart from each other and a first area between the two pixels; an input sensing portion on the two pixels and comprising a sensing electrode and a trace electrically connected to the sensing electrode; and A metal layer, on the two pixels, the metal layer including at least one selected from molybdenum, magnesium, silver, titanium, copper, aluminum and alloys of these materials, the metal layer being arranged between the two pixels and surrounding the first area, the metal layer including a first hole positioned in the first area.

27. The display device according to claim 26, wherein: The display device also includes an optically functional portion covering only a partial portion of the metal layer, wherein the optically functional portion includes at least one selected from a polarizer and a retarder and has a hole overlapping the first hole, and the hole of the optically functional portion has a width greater than a width of the first hole.

28. The display device according to claim 26, wherein: The display device further includes a substrate and an encapsulation part facing the substrate, and the two pixels are between the substrate and the encapsulation part, wherein the metal layer is disposed on the encapsulation part.

29. An electronic device, wherein: The electronic device comprises: a plurality of pixels, each comprising a light emitting diode; A first region is disposed between two adjacent pixels in the second region, wherein the first region includes a transmission region and a component disposed in the first region; a third area, arranged between the second area and the first area; A metal layer disposed in the third region, the metal layer having a first hole positioned in the transmission region, the first hole having a first width; A touch sensor unit is provided on the plurality of pixels in the second area, the touch sensor unit comprising: a plurality of touch sensor electrodes; and A plurality of connection lines, each connecting two adjacent touch sensor electrodes; and An optical function portion is disposed on the metal layer, the optical function portion includes a hole overlapping the first hole, the hole of the optical function portion has a width greater than the first width, wherein the metal layer includes a metal material that is the same as a metal material of the touch sensor portion.

30. The electronic device according to claim 29, wherein: The optical function portion covers only a partial portion of the metal layer, and the optical function portion includes at least one selected from a polarizer, a retarder, a destructive interference structure, and a combination of a color filter and a black matrix.

31. The electronic device according to claim 29, wherein: The components include sensors or cameras.

32. An electronic device, wherein: The electronic device comprises: a plurality of pixels arranged in the display area, the plurality of pixels including two adjacent pixels spaced apart from each other, and a transmission area disposed between the two adjacent pixels; an input sensing portion disposed on the plurality of pixels and including sensing electrodes, connection lines each connecting two adjacent sensing electrodes, and traces electrically connected to the sensing electrodes; and a metal layer, on the plurality of pixels, the metal layer being disposed between the display region and the transmission region in a plan view, the metal layer comprising a first hole positioned in the transmission region, the metal layer comprising a metal material that is the same as a metal material selected from one of the sensing electrodes, the connecting lines, and the traces.

33. The electronic device according to claim 32, wherein: The electronic device further comprises an optical function portion on the metal layer, wherein: The first hole has a first width, and The optical function portion includes a second hole overlapping the first hole, and the second hole has a second width greater than the first width.

34. The electronic device according to claim 32, wherein: The components include sensors or cameras.

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