Display panel and display device

Abstract

The invention relates to a display panel and a display device. The display panel comprises a substrate; the pixel limiting layer is arranged on one side of the substrate, and the pixel limiting layer comprises a plurality of pixel openings which are arranged at intervals; the pixel units and the photoelectric detector units are respectively arranged in the pixel openings; the first optical structure is arranged on the side, away from the substrate, of the pixel limiting layer, and the orthographic projection of the first optical structure on the substrate is located between the orthographic projections of the two adjacent pixel units on the substrate. According to the display panel, the first optical structure is arranged on one side of the pixel limiting layer of the display panel, so that the light sent by the specified pixel unit can be stably reflected by a finger and then received by the organic photoelectric detector unit, and the interference of the light emitted by the non-specified pixel unit on the green light receiving process of the organic photoelectric detector unit is avoided; and the signal-to-noise ratio in the fingerprint identification process of the display panel is greatly improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] With the development of display technology, more and more display devices use fingerprint recognition to achieve user privacy protection. At present, organic light-emitting diode (OLED) devices have a series of advantages such as all-solid-state structure, high brightness, full viewing angle, fast response speed, and flexible display. It has become a highly competitive and promising next-generation display technology. By integrating organic photodetectors (OPDs) into OLED panels, the fingerprint recognition area can be expanded to the entire panel, and the recognition area can be customized according to user needs to achieve fingerprint recognition.

[0003] In OLED panels, since green light accounts for about 70% of the light intensity, the use of reflected green light as a light source to achieve fingerprint recognition has a relatively high signal-to-noise ratio. Although selective absorption of green light can be achieved by regulating the active layer donor and acceptor components in the OPD device, the active layer in the OPD device will more or less absorb blue and red light. In addition, the light emitted by the OLED pixel may also be captured directly by the OPD device without passing through the fingerprint recognition position, resulting in a lower signal-to-noise ratio. Summary of the invention

[0004] Based on this, it is necessary to provide a relatively simple process to address the above technical problems, which can effectively reduce production costs, improve signal-to-noise ratio and improve the luminous efficiency of OLED devices.

[0005] In a first aspect, the present application provides a display panel, comprising:

[0006] substrate;

[0007] A pixel defining layer is disposed on one side of the substrate, and the pixel defining layer includes a plurality of pixel openings disposed at intervals;

[0008] A pixel unit and a photodetector unit are respectively arranged in the pixel opening;

[0009] The first optical structure is arranged on a side of the pixel defining layer away from the substrate, and the orthographic projection of the first optical structure on the substrate is located between the orthographic projections of two adjacent pixel units on the substrate.

[0010] In one embodiment, the display panel further includes:

[0011] A second optical structure is arranged on a side of the pixel defining layer away from the substrate, at least a portion of the second optical structure is arranged on the same layer as the first optical structure, and a refractive index of the second optical structure is greater than a refractive index of the first optical structure;

[0012] Optionally, the orthographic projection of the second optical structure on the substrate covers the orthographic projection of the pixel unit on the substrate;

[0013] Optionally, the second optical structure is a continuously arranged layer structure, and the first optical structure is arranged on a side of the second optical structure close to the substrate.

[0014] In one embodiment, the first optical structure includes a first component;

[0015] The orthographic projection of the first component on the substrate covers the orthographic projection of the pixel definition layer adjacent to the R pixel unit and the B pixel unit on the substrate, wherein the refractive index of the first component is less than or equal to a first refractive index threshold;

[0016] Optionally, the first component is a protruding structure;

[0017] Optionally, the cross-sectional shape of the first component includes a semicircle and a trapezoid.

[0018] In one embodiment, the first optical structure includes a second component;

[0019] The orthographic projection of the second component on the substrate covers the orthographic projection of the pixel definition layer between the pixel unit and the photodetector unit on the substrate, wherein the refractive index of the second component is less than or equal to a first refractive index threshold;

[0020] Optionally, the second component is a protruding structure;

[0021] Optionally, the second component is a plurality of protruding structures arranged side by side;

[0022] Optionally, the cross-sectional shape of the second component includes a semicircle and a trapezoid;

[0023] Optionally, the second component is in contact with the pixel defining layer.

[0024] In one of the embodiments, the pixel defining layer is provided with a pit, and the refractive index of the filling material in the pit is less than or equal to the first refractive index threshold;

[0025] Optionally, the pit is located between the G pixel unit and the organic photodetector unit;

[0026] Optionally, the pit is an inverted trapezoidal pit;

[0027] Optionally, the height of the pit is less than or equal to the height of the pixel defining layer;

[0028] Optionally, the filling material in the pit is a low-fold organic glue or a reflective metal material;

[0029] Optionally, the constituent material of the second component is the same as the filling material.

[0030] In one embodiment, the display panel further includes:

[0031] A thin film encapsulation layer is disposed on a side of the pixel defining layer away from the substrate;

[0032] The second optical structure and at least a portion of the first optical structure are arranged on a side of the thin film encapsulation layer away from the pixel defining layer.

[0033] In one of the embodiments, the display panel further comprises:

[0034] The second optical structure and at least a portion of the first optical structure are arranged on a side of the pixel defining layer away from the substrate;

[0035] The thin film encapsulation layer is arranged on a side of the second optical structure away from the pixel defining layer.

[0036] In one of the embodiments, the low refractive index light processing component includes a third component;

[0037] The orthographic projection of the third component on the substrate covers the orthographic projection of the pixel defining layer between the organic photodetector unit and the B pixel unit on the substrate, wherein the refractive index of the third component is less than or equal to the first refractive index threshold;

[0038] Optionally, the third component is a protruding structure;

[0039] Optionally, the cross-sectional shape of the third component includes semicircular and trapezoidal.

[0040] In one embodiment, the thin film encapsulation layer includes a first inorganic protective layer, a first organic protective layer, and a second inorganic protective layer;

[0041] Optionally, the first inorganic protective layer and the second inorganic protective layer are prepared by chemical vapor deposition or atomic layer deposition technology;

[0042] Optionally, the material of the first inorganic protective layer includes SiON, wherein the thickness of the first inorganic protective layer is 0.8-1 μm;

[0043] Optionally, the material of the second inorganic protective layer includes SiN, and the thickness of the second inorganic protective layer is 0.8-1 μm;

[0044] Optionally, the material of the organic protective layer includes acrylic polymer, and the thickness of the organic protective layer is 8-10 μm.

[0045] In a second aspect, the present application further provides a display device, comprising the display panel as described in the first aspect.

[0046] In summary, the present application proposes a display panel and a display device, comprising: a substrate; a pixel defining layer, arranged on one side of the substrate, the pixel defining layer comprising a plurality of pixel openings arranged at intervals; pixel units and photodetector units, respectively arranged in the pixel openings; a first optical structure, arranged on the side of the pixel defining layer away from the substrate, the orthographic projection of the first optical structure on the substrate being located between the orthographic projections of two adjacent pixel units on the substrate. The present application arranges the first optical structure on one side of the pixel defining layer of the display panel, so that the light sent by the designated pixel unit can be stably reflected by the finger and then received by the organic photodetector unit, thereby avoiding the light emitted by the non-designated pixel unit interfering with the process of the organic photodetector unit receiving green light, thereby greatly improving the signal-to-noise ratio of the fingerprint recognition process of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 is a schematic diagram of the structure of a display panel in one embodiment;

[0048] Figure 2 It is a structural schematic diagram of a display panel in another embodiment;

[0049] Figure 3 is a schematic structural diagram of a display panel in which only the first component is provided in an embodiment;

[0050] Figure 4 It is a structural schematic diagram of a display panel in which a first component, a second component and a third component are simultaneously provided in one embodiment;

[0051] Figure 5 It is a structural schematic diagram of a display panel in which a second optical structure is firstly provided and then a TFE encapsulation layer is provided in one embodiment;

[0052] Figure 6 It is a structural schematic diagram of a display panel in yet another embodiment;

[0053] Figure 7 FIG. 1 is a schematic diagram of the structure of a display panel provided with pits in an embodiment.

[0054] Summary of reference numerals:

[0055] Substrate-110; pixel defining layer-120; R pixel unit-121; G pixel unit-122; organic photodetector unit-123; B pixel unit-124; first isolation layer-130; second isolation layer-140; glass cover-150;

[0056] First component - 161; second component - 162; third component - 163; pit - 164. DETAILED DESCRIPTION

[0057] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0058] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing the embodiments in this embodiment and are not intended to limit this application.

[0059] It is understood that the terms "first", "second", etc. used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element. For example, without departing from the scope of this application, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor. Both the first resistor and the second resistor are resistors, but they are not the same resistor.

[0060] It can be understood that the “connection” in the following embodiments should be understood as “electrical connection”, “communication connection”, etc. if the connected circuits, modules, units, etc. have electrical signals or data transmission between each other.

[0061] It can be understood that “at least one” means one or more, “plurality” means two or more, and “at least a portion of an element” means a part or all of an element.

[0062] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" and the like specify the presence of stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. At the same time, the term "and / or" used in this specification includes any and all combinations of the relevant listed items.

[0063] As described in the above background technology section, OLED devices and organic photodetector (OPD) devices can share some common layers, such as flexible substrates, electrodes, encapsulation layers, and optical layers, and OLED devices and OPD devices can share the same preparation process. For example, the flexible substrate includes a plastic or glass film, the electrode includes a metal electrode or a transparent conductive oxide, the encapsulation layer includes a TFE film encapsulation layer, and the preparation process includes an evaporation process, etc. In actual applications, OLED devices and OPD devices can be integrated simultaneously in the same display panel, and the OLED device is used to complete the conversion of electrical signals to optical signals, and the OPD device is used to complete the conversion of optical signals to electrical signals.

[0064] The display panel in this embodiment includes an OLED device and an OPD device. During use, the fingerprint recognition control, touch screen control and other control processes of the display panel realize command interaction through contact with the screen. It is necessary to make the green light emitted by the OLED device be received by the OPD device after being reflected by the finger, so as to improve the signal-to-noise ratio of fingerprint recognition.

[0065] In this embodiment, the OLED device may also be referred to as an organic electric laser display, an organic light-emitting semiconductor, or an organic light-emitting device. Under the action of an electric field, the carrier injection and recombination of the organic semiconductor material and the light-emitting material of the OLED device generate visible light. In this embodiment, the visible light emitted by the OLED device includes red light, green light, and blue light.

[0066] The OPD device is a device that uses the photoelectric effect of organic semiconductor materials to achieve photoelectric conversion. The working principle is to absorb photon energy and convert photon energy into electron energy, thereby generating a current signal. In this embodiment, the green light emitted by the OLED is absorbed by the OPD device to perform screen interactions such as fingerprint recognition. It should be noted that the OPD device can limit the wavelength of the absorbed light to ensure that the OPD device receives light of the corresponding color.

[0067] The signal-to-noise ratio, also known as the signal-to-interference plus noise ratio (SINR), refers to the ratio of the strength of the received useful signal to the strength of the received interference signal (noise and interference). In this embodiment, the OPD device needs to receive the green light emitted by the OLED device and reflected by the fingerprint. Whether it is the green light directly emitted by the OLED device or other light emitted by the OLED device, it may interfere with the green light reflected by the fingerprint, resulting in a decrease in the signal-to-noise ratio of the light received by the OPD device.

[0068] In display panels manufactured using existing processes, a light shielding layer is usually set on the opposite side of the substrate of the display panel and on the display module section to block the noise light signals and interference light signals that affect the fingerprint recognition of the OPD device. However, the light shielding layer will absorb the effective light signal in the OLED device and reduce the light output efficiency of the OLED device. It is also necessary to precisely control the height of the light shielding layer and the pixel defining layer of the substrate to achieve a balance between the light display effect and the light shielding effect. This has a very complicated process flow and is difficult to process.

[0069] This embodiment provides a display panel that does not require adding a mask to the substrate array segment and does not require considering the compatibility issues between the light shielding layer and the array process and materials. It effectively improves the signal-to-noise ratio of the OPD unit fingerprint recognition process while reducing the process difficulty of the display panel.

[0070] like Figure 1 As shown, this embodiment provides a display panel, which at least includes a substrate 110 , a pixel defining layer 120 , a first isolation layer 130 , a second isolation layer 140 and a glass cover 150 .

[0071] In this embodiment, the pixel defining layer 120 is disposed on one side of the substrate 110, the first isolation layer 130 is disposed on the other side of the pixel defining layer 120, the second isolation layer 140 is disposed on the side of the first isolation layer 130 away from the pixel defining layer 120, and the glass cover 150 is disposed on the side of the second isolation layer 140 away from the first isolation layer 130. The pixel defining layer 120 includes a plurality of pixel openings arranged at intervals, and the pixel units and the photodetector units are respectively disposed in the pixel openings, such as Figure 1 As shown, an R pixel unit 121 , a G pixel unit 122 , an organic photodetector unit 123 and a B pixel unit 124 are disposed in the pixel opening of the pixel defining layer 120 .

[0072] In a specific embodiment, the R pixel unit 121, the G pixel unit 122, the organic photodetector unit 123 and the B pixel unit 124 can be arranged at intervals on one side of the substrate 110 in a fixed arrangement order, and a pixel defining layer 120 is arranged between each pixel unit and the organic photodetector unit 123 to fix each pixel unit and the OPD pixel unit and ensure that each pixel unit and the OPD pixel unit remain aligned.

[0073] In this embodiment, the substrate 110 may be a thin film transistor (TFT) backplane, or other types of substrates, such as a glass substrate. The specific material used for the substrate 110 is not limited here and can be replaced according to the needs of the actual application scenario.

[0074] On one side of the substrate 110, the corresponding OLED devices and OPD devices are arranged at intervals in this embodiment, wherein the OLED device includes an R pixel unit 121, a G pixel unit 122 and a B pixel unit 124, and the OPD device includes an organic photodetector unit 123. The interval distance of the interval setting can be determined according to the needs of the actual application scenario, and it should be noted that the interval distance can be a length of micrometer level.

[0075] The R pixel unit 121, the G pixel unit 122, and the B pixel unit 124 all include corresponding EL light emitting layers (Electroluminesence), and the EL light emitting layers can convert electrical energy into light energy to emit light signals of corresponding colors. Among them, the R pixel unit 121 is used to emit a red light signal, the G pixel unit 122 is used to emit a green light signal, and the B pixel unit 124 is used to emit a red light signal.

[0076] The organic photodetector unit 123 includes a corresponding light absorbing active layer, which can absorb light energy and convert energy. In this embodiment, the light absorbing active layer of the organic photodetector selectively absorbs green light signals to improve the signal-to-noise ratio of fingerprint recognition. This embodiment does not limit the specific value of the wavelength of the green light signal, which can be determined according to the needs of the actual application scenario.

[0077] In this embodiment, a corresponding pixel definition layer 120 (Pixel Definition Layer, PDL for short) is provided between each pixel unit and the organic photodetector unit 123. In a specific embodiment, the constituent material of the PDL layer may be an inorganic material, which is formed into a film by plasma enhanced chemical vapor deposition, and then the PDL layer is formed by a series of processes such as photoresist coating, exposure, development, curing, dry etching and wet stripping. The PDL layer is used to define and limit the shape and size of the pixel unit to ensure that each pixel unit can work normally. In a specific embodiment, the PDL layer is used to achieve precise alignment and positioning of the pixel unit, ensure isolation between the pixel units, and prevent crosstalk.

[0078] In this embodiment, the first isolation layer 130 corresponds to the encapsulation layer, and the second isolation layer 140 corresponds to the protective film layer. In the specific implementation process, the encapsulation order of the first isolation layer 130 and the second isolation layer 140 can be replaced with each other, that is, the first isolation layer 130 can be arranged above the second isolation layer 140, and the second isolation layer 140 can also be arranged above the first isolation layer 130. The specific encapsulation process and component materials of the first isolation layer 130 and the second isolation layer 140 can be determined based on the requirements for the signal-to-noise ratio in the actual application scenario and the specific shape and size of each pixel unit.

[0079] In one embodiment, the encapsulation layer corresponding to the first isolation layer 130 in this embodiment may be a thin film encapsulation (Thin Film Encapsulation, referred to as TFE) layer. In some embodiments, the TFE layer includes a first inorganic protective layer, a first organic protective layer, and a second inorganic protective layer. The first inorganic protective layer, the first organic protective layer, and the second inorganic protective layer are arranged in sequence, and the first organic protective layer is located between the first inorganic protective layer and the second inorganic protective layer. This embodiment adopts a three-layer structure encapsulation process to realize the setting of the TFE layer.

[0080] In a specific embodiment, the first inorganic protective layer and the second inorganic protective layer can be prepared by chemical vapor deposition or atomic layer deposition technology. Optionally, the material of the first inorganic protective layer includes SiON, wherein the thickness of the first inorganic protective layer is 0.8-1μm. Optionally, the material of the organic protective layer includes an acrylic polymer, and the thickness of the organic protective layer is 8-10μm. Optionally, the material of the second inorganic protective layer includes SiN, and the thickness of the second inorganic protective layer is 0.8-1μm. In this embodiment, the first inorganic protective layer and the second inorganic protective layer are both made of a very thin thickness, and in this embodiment, the second inorganic protective layer is made of a material including SiN material, and the first inorganic protective layer and the second inorganic protective layer have a higher refractive index for the light signal emitted by the OLED device. The light signal emitted by the OLED device will be offset at a certain angle, that is, refraction will occur.

[0081] In this embodiment, the first inorganic protective layer in the TFE layer is disposed above the first organic protective layer, and the second inorganic protective layer is disposed below the first organic protective layer.

[0082] In one embodiment, the protective film layer corresponding to the second isolation layer 140 in this embodiment can be made of a component material with a high refractive index. In this embodiment, the packaging process can be deposited by open mask evaporation. The specific packaging process of the protective film layer in this embodiment can be determined according to the specific type of the component material with a high refractive index. Preferably, the component material of the protective film layer in this embodiment can be an organic material with a high refractive index. In this embodiment, an organic material with a high refractive index, such as a polyimide resin with high polarity, or a high refractive index organic small molecule material with a light extraction effect, such as N, N'-di(1-naphthyl)-N, N'-diphenyl-1, 1'-biphenyl-4-4'-diamine (NPB) and the like.

[0083] In a specific embodiment, the second isolation layer 140 in this embodiment serves as a protective film layer, and can also be used to protect the TFE layer from being affected by environmental foreign matter and laser cutting, and play a role in supporting the flexible panel. In this example, the second isolation layer 140 is made of a component material with a high refractive index, which can facilitate the adjustment of the angle of the optical signal, so that the interference optical signal and the noise optical signal deviate from the path of the OPD unit to capture the effective optical signal, so that the effective optical signal can effectively contact the finger fingerprint on the screen, and diffusely reflect through the finger fingerprint to collect the finger fingerprint information.

[0084] In addition, this embodiment also arranges a low-refractive index light processing component at the corresponding position in the display panel. Without adding a light shielding layer in the display panel, the illumination path of various light signals emitted by the OLED device is adjusted through the low-refractive index light processing component to improve the signal-to-noise ratio of OPD unit fingerprint recognition.

[0085] In one embodiment, a display panel is provided, comprising:

[0086] substrate 110;

[0087] The pixel defining layer 120 is disposed on one side of the substrate 110. The pixel defining layer 120 includes a plurality of pixel openings disposed at intervals; pixel units and photodetector units are disposed in the pixel openings, respectively;

[0088] The first optical structure is arranged on a side of the pixel defining layer away from the substrate, and the orthographic projection of the first optical structure on the substrate is located between the orthographic projections of two adjacent pixel units on the substrate.

[0089] In this embodiment, the R pixel unit 121, the G pixel unit 122, the organic photodetector unit 123 and the B pixel unit 124 are all disposed in the pixel opening of the pixel defining layer 120. The first optical structure may be the first optical structure in the aforementioned embodiment.

[0090] In a specific embodiment, since the green light emitted by the G pixel unit 122 and the green light reflected by the fingerprint are received by the OPD unit for fingerprint recognition, the large-angle light emitted by the adjacent R pixel unit 121 or B pixel unit 124 will also be reflected by the fingerprint and finally received by the OPD unit, resulting in a lower signal-to-noise ratio of fingerprint recognition. At the same time, the green light emitted by the G pixel unit 122 is not reflected by the finger and the green light emitted by the G pixel unit 122 with a large angle deviation is directly received by the OPD unit, which will also reduce the signal-to-noise ratio of the fingerprint recognition process.

[0091] In this embodiment, a first optical structure is arranged in the display panel, and the first optical structure can process the light signal according to a lower refractive index to realize reflection of the light signal and change the irradiation angle of the light signal so that the light signal is irradiated to a designated area. At some special angles, such as when the light is irradiated vertically onto the plane of the first optical structure, the first optical structure can directly reflect the light. The constituent material of the first optical structure in this embodiment can be an organic polymer material, a low-refractive inorganic material or a metal reflective material. For example, the constituent material of the first optical structure can be an organic polymer coating with a refractive index of 1.3-1.5, or a reflective metal material capable of achieving mirror reflection, or an inorganic material such as silicon oxide (SiO).

[0092] In this embodiment, the first optical structure is arranged on the side of the pixel defining layer 120 away from the substrate 110. Since the light emitted by the R pixel unit 121, the G pixel unit 122 and the B pixel unit 124 is sent at an angle of 0°-180° in the direction away from the substrate 110, the first optical structure can be arranged on the path of the light emitted by the R pixel unit 121, the G pixel unit 122 and the B pixel unit 124 to adjust the direction of each type of light, so as to isolate the infrared and blue light from the receiving surface of the OPD unit, direct the green light emitted by the G pixel unit 122 to the direction of the fingerprint of the finger, and direct the green light reflected by the fingerprint to the receiving surface of the OPD unit. The receiving surface of the OPD unit is the side that receives the optical signal, that is, the side of the OPD unit away from the substrate 110.

[0093] In this embodiment, the setting position of the first optical structure can be between the orthographic projections of two adjacent pixel units on the substrate, or between the orthographic projections of the pixel unit and the OPD unit on the substrate, that is, it is located above the pixel defining layer 120 between two adjacent pixel units, or between the pixel unit and the OPD unit, so as to ensure that the light of each pixel unit can be normally emitted toward one side of the glass cover, and at the same time, the light emitted by each pixel unit at a large angle can be directed to the designated area for emission.

[0094] For example, if Figure 1 As shown, when the first optical structure is not configured, the large-angle red light signal emitted by the R pixel unit 121 will be reflected along with the fingerprint of the finger, and the reflected red light signal will be sent to the receiving surface of the OPD unit. This part of the red light signal will interfere with the fingerprint recognition process as noise for the OPD unit to perform fingerprint recognition, thereby improving the signal-to-noise ratio.

[0095] like Figure 2As shown, when the first optical structure is configured, the large-angle red light signal emitted by the R pixel unit 121 will be changed in illumination direction by the first optical structure, and the large-angle red light signal will be reflected in a direction that does not pass through the finger fingerprint. The first optical structure configured in this embodiment can not only isolate the red light signal from interfering with the fingerprint recognition of the OPD unit, but also improve the display effect of the display panel to a certain extent.

[0096] In this embodiment, the structure of the first optical structure may be a convex structure or a convex structure arranged side by side, and the cross-sectional shape of the first optical structure may be a semicircle or a trapezoid. It should be noted that the specific shape of the first optical structure may be customized according to the needs of the actual application scenario. The first optical structures are all micrometer-level graphic structures, wherein the graphic structure is a light processing structure made by a specific shaping process based on a low refractive index component material. In this embodiment, the width of the first optical structure should be less than the width of the pixel opening of the corresponding pixel defining layer 120. Among them, the width of the pixel opening of the pixel defining layer 120 is less than or equal to the spacing distance between adjacent pixel units or OPD units in the pixel defining layer 120. It should be noted that the taper angle of the first optical structure in this embodiment can be determined according to the specific shape of the first optical structure in the actual application scenario, and the taper angle should be able to maintain the stability of the first optical structure while ensuring that the reflection angle of the corresponding light can achieve the effect of reducing the signal-to-noise ratio of the fingerprint recognition process of the OPD unit.

[0097] In summary, this embodiment provides a display panel, which effectively realizes the path guidance processing of the light signal emitted by the OLED device by setting a corresponding first optical structure on the side of the pixel defining layer 120 away from the substrate 110, so that the green light is reflected by the fingerprint of the finger pressed on the glass cover 150, and is accurately absorbed by the OPD unit, and the red light and blue light emitted by the R pixel unit 121 and the B pixel unit 124 are isolated from the influence of the fingerprint recognition of the OPD unit, which greatly improves the accuracy of the fingerprint recognition of the OPD unit and reduces the signal-to-noise ratio of the fingerprint recognition of the OPD unit.

[0098] In one embodiment, Figure 2 , Figure 3 and Figure 4 As shown, the first optical structure includes a first component 161, a second component 162 and a third component 163.

[0099] In this embodiment, the orthographic projection of the first component 161 on the substrate 110 covers the orthographic projection of the pixel defining layer 120 adjacent to the R pixel unit 121 and the B pixel unit 124 on the substrate 110 , wherein the refractive index of the first component 161 is less than or equal to the first refractive index threshold.

[0100] The orthographic projection of the second component 162 on the substrate 110 covers the orthographic projection of the pixel defining layer 120 between the pixel unit and the photodetector unit on the substrate 110 , wherein the refractive index of the second component 162 is less than or equal to the first refractive index threshold.

[0101] The orthographic projection of the third component 163 on the substrate 110 covers the orthographic projection of the pixel defining layer 120 between the organic photodetector unit 123 and the B pixel unit 124 on the substrate 110 , wherein the refractive index of the third component 163 is less than or equal to the first refractive index threshold.

[0102] In a specific application scenario, only the first component 161 may be provided in the display panel, such as Figure 3 The first component 161 and the second component 162 may also be provided in the display panel at the same time, as shown in FIG. Figure 2 The first component 161, the second component 162 and the third component 163 may also be provided in the display panel at the same time, as shown in FIG. Figure 4 The number, type and location of the first optical structure of the display panel can be determined according to the needs of the actual application scenario.

[0103] In this embodiment, the first component 161 is mainly used to adjust the illumination direction of the large-angle light signal of the R pixel unit 121 and the B pixel unit 124 toward the finger direction, so as to adjust the illumination direction of the large-angle light signal to be vertically oriented toward the glass cover plate 150, including the red light signal of the R pixel unit 121 toward the finger direction and the blue light signal of the B pixel unit 124 toward the finger direction. And for the red light signal of the R pixel unit 121 partially deviating from the vertical angle direction and the blue light signal of the B pixel unit 124 partially deviating from the vertical angle direction, the first component 161 can also adjust the illumination direction to be vertically oriented toward the glass cover plate 150. Optionally, the first component 161 is a convex structure. Optionally, the cross-sectional shape of the first component 161 can be semicircular or trapezoidal.

[0104] The second component 162 is mainly used to adjust the illumination direction of the large-angle green light signal emitted by the G pixel unit 122 to prevent the large-angle green light signal emitted by the G pixel unit 122 from interfering with the OPD unit capturing the green light signal reflected by the finger fingerprint. In a specific embodiment, the second component 162 can also be used to prevent part of the green light signal from directly entering the OPD unit and interfering with the fingerprint recognition process of the OPD unit. Optionally, the second component 162 can be a raised structure or a plurality of raised interfaces arranged side by side. Optionally, the cross-sectional shape of the second component 162 can be semicircular or trapezoidal. Optionally, the second component 162 contacts the pixel defining layer.

[0105] The third component 163 is mainly used to adjust the irradiation direction of the blue light signal sent by the B pixel unit 124 adjacent to the OPD unit, which interferes with the green light signal reflected by the OPD unit to capture the fingerprint of the finger. The irradiation angle of the blue light signal intercepted by the third component 163 is greater than the irradiation angle of the blue light signal intercepted by the first component 161. The first component 161 and the third component 163 arranged above the pixel defining layer 120 on both sides adjacent to the B pixel unit 124 cooperate with each other to intercept the blue light signal emitted by the B pixel unit 124 between the direction toward the OPD unit and the direction toward the fingerprint of the finger to the greatest extent, so as to ensure that the fingerprint recognition process of the OPD unit is not interfered by the blue light signal emitted by the adjacent B pixel unit 124. Optionally, the third component 163 is a convex structure. Optionally, the cross-sectional shape of the third component 163 can be semicircular or trapezoidal.

[0106] In one embodiment, the display panel further comprises:

[0107] The second optical structure is disposed on the side of the pixel defining layer 120 away from the substrate 110 . At least part of the second optical structure is disposed on the same layer as the first optical structure. The refractive index of the second optical structure is greater than that of the first optical structure.

[0108] Optionally, the orthographic projection of the second optical structure on the substrate 110 covers the orthographic projection of the pixel unit on the substrate 110 .

[0109] Optionally, the second optical structure is a continuously arranged layer structure, and the first optical structure is arranged on a side of the second optical structure close to the substrate 110. In this embodiment, the second optical structure may be a filling layer, and the first optical structure is arranged in the filling layer, close to a side of the substrate 110.

[0110] In a specific embodiment, the second optical structure in this embodiment is the protective film layer corresponding to the second isolation layer 140 in the aforementioned embodiment. The second optical structure can be made of a high-refractive organic material by an open mask evaporation process, such as a high-polarity polyimide resin, or a high-refractive index organic small molecule material with a light extraction effect, such as N, N'-di(1-naphthyl)-N, N'-diphenyl-1, 1'-biphenyl-4-4'-diamine (NPB), etc.

[0111] In this embodiment, the refractive index of the second optical structure is greater than or equal to the second refractive index threshold. The second refractive index threshold is greater than the first refractive index threshold. It should be noted that the first refractive index threshold and the second refractive index threshold can be determined according to the actual types of high-refractive index materials and low-refractive index materials, and the first refractive index threshold and the second refractive index threshold can be defined and configured according to the needs of actual application scenarios.

[0112] In this embodiment, the large-angle light signals emitted by the R pixel unit 121 and the B pixel unit 124 will first pass through the high-refractive-index organic coating of the second optical structure before being emitted to the contact surface of the first component 161, and then irradiate the low-refractive-index contact surface coating of the first component 161. At this time, based on Snell's refraction law, the large-angle light signals will be totally reflected at the contact surface of the first component 161. This embodiment effectively adjusts the large-angle light signals emitted by the R pixel unit 121 and the B pixel unit 124 by setting the low-refractive-index first component 161 and the second optical structure, avoids the interference of the large-angle light signals emitted by the R pixel unit 121 and the B pixel unit 124 on the process of the OPD unit capturing the green light signal reflected by the fingerprint, and effectively improves the signal-to-noise ratio of the OPD unit for fingerprint recognition.

[0113] In some more detailed embodiments, Figure 2 As shown, when the first component 161 and the second component 162 are configured in the display panel at the same time, and the pattern structures of the first component 161 and the second component 162 are both elliptical, the specific parameters of the elliptical patterns corresponding to the first component 161 and the second component 162 are set according to the following scheme.

[0114] In this embodiment, the pattern width of the elliptical pattern is set to 15-20 microns, so that the overall pattern width of the first component 161 and the second component 162 is less than the spacing distance of the pixel defining layer 120. The pattern height of the elliptical pattern is set to 1.5-1.7 microns to ensure that the overall pattern of the first component 161 can adjust the large-angle light signal emitted by the R pixel unit 121 or the B pixel unit 124 in a sufficient angle range, and to ensure that the overall pattern of the second component 162 can isolate most of the green light signals directly irradiated by the G pixel unit 122 to the OPD unit. The material of the constituent material of the elliptical pattern is an organic polymer layer with a low refractive index, such as a polymer layer composed of materials such as polymethyl methacrylate (PMMA) and polyethylene terephthalate (PET). In this embodiment, the elliptical pattern is made of materials such as PMMA or PET, and the refractive index of the constituent material can be controlled to be 1.3-1.5, which can ensure the total reflection effect of the light to adjust the irradiation direction of the light signal.

[0115] The taper angle of the elliptical pattern in this embodiment can be set to 20°-30° to ensure that the first component 161 reflects the optical signals of most angles of the R pixel unit 121 and the B pixel unit 124, and the second component 162 reflects the optical signals of most angles of the G pixel unit 122, thereby ensuring the noise ratio of the OPD unit for fingerprint recognition. A high-refractive organic material is filled above the corresponding first component 161 to form a second optical structure, and the thickness of the second optical structure is 2-2.5 microns.

[0116] In this embodiment, a low-refractive-index first component 161 is arranged on the side of the TFE encapsulation layer away from the pixel defining layer 120, and a second optical structure is configured to cover the first component 161. The low-refractive-index organic material and the high-refractive-index organic material are matched. When the light signals of the R pixel unit 121 and the B pixel unit 124 with corresponding angles pass through, they will first enter the coating of the second optical structure, and then pass through the coating interface of the first component 161. Based on Snell's refraction law, the light signal will be totally reflected at the coating interface of the first component 161, that is, at the junction of the low-refractive-index material and the high-refractive-index material, thereby changing the irradiation direction of the light signal, effectively avoiding the interference of the large-angle light signals emitted by the R pixel unit 121 and the B pixel unit 124 on the green light signal reflected by the fingerprint obtained by the OPD unit, thereby improving the signal-to-noise ratio of the fingerprint recognition process.

[0117] Since the outer layer structure of the TFE encapsulation layer in this embodiment is an inorganic material of 0.8-1 micron, such as silicon nitride (SiN), the inorganic protective layer of the TFE encapsulation layer also has a high refractive index. Therefore, the large-angle light signal emitted by the G pixel unit 122 will pass through the inorganic protective layer with a high refractive index before being emitted to the contact surface of the second component 162, and then irradiate the low refractive index contact surface coating of the second component 162. At this time, based on Snell's refraction law, the large-angle light signal will be totally reflected at the contact surface of the second component 162. In this embodiment, by setting the second component 162 with a low refractive index, on the one hand, it can isolate part of the green light signal directly emitted to the OPD unit, and on the other hand, it can make part of the large-angle green light signal be reflected in the direction of the finger fingerprint, so as to increase the capture amount of the green light signal reflected by the finger fingerprint by the OPD unit, and adjust the irradiation direction of the green light signal that would not be irradiated to the direction of the finger fingerprint to the direction of the finger fingerprint, which can further improve the extraction efficiency of the large-angle green light signal and reduce the light efficiency loss caused by the light shielding layer.

[0118] In one embodiment, Figure 2 , Figure 3 , Figure 4 , Figure 6 and Figure 7 As shown, the display panel also includes:

[0119] A thin film encapsulation layer, disposed on a side of the pixel defining layer 120 away from the substrate 110;

[0120] The second optical structure and at least a portion of the first optical structure are arranged on a side of the thin film encapsulation layer away from the pixel defining layer.

[0121] In this embodiment, the first component 161 is disposed at a first position above the pixel defining layer 120 adjacent to the R pixel unit 121 or the B pixel unit 124 on the side of the thin film encapsulation layer away from the pixel defining layer 120. In this embodiment, the first position is a position spaced a preset distance from the pixel defining layer 120, and the preset distance is the thickness of the thin film encapsulation layer.

[0122] In a specific embodiment, when manufacturing a display panel, the encapsulation process of the thin film encapsulation layer can be completed first, and then the first component 161 is arranged on the side of the thin film encapsulation layer away from the pixel defining layer 120. After the first component 161 is arranged, the second optical structure is arranged. In this embodiment, the TFE encapsulation layer is arranged first, and then the second optical structure is arranged, so that the first component 161 and the second component 162 can be arranged in layers to block noise light signals and interference light signals in a wider angle range.

[0123] In a more detailed embodiment, Figure 3 As shown, the display panel provided in this embodiment can only be provided with the first component 161, and the patterned structure of the first component 161 is set to be a trapezoid, and the bottom surface of the trapezoid is in contact with the TFE encapsulation layer. The specific parameters of the first component 161 in this embodiment are set according to the following scheme.

[0124] In this embodiment, the trapezoidal pattern structure is composed of an inorganic material with a low refractive index, such as silicon oxide SiO. After the trapezoidal structure is made by a yellow light process, the trapezoidal structure is set on the TFE by an etching process. After the trapezoidal structure is set, the evaporation of the second optical structure is completed. In this embodiment, the first component 161 is formed by an inorganic material, which can form a greater bonding force with the first inorganic protective layer above the TFE encapsulation layer to maintain the stability of the first component 161.

[0125] The width of the trapezoidal pattern structure in this embodiment can be set to 15-20 μm, which is smaller than the spacing distance of the corresponding pixel defining layer 120. The height of the trapezoidal pattern structure can be set to 2-3 μm to ensure that the irradiation direction of the light signal of the R pixel unit 121 and the B pixel unit 124 is adjusted in a large angle range. The demolding angle of the trapezoidal pattern structure is 50°-60° to ensure the stability of the trapezoidal structure.

[0126] In this embodiment, by providing the first component 161 of low-refractive-index inorganic material, the adhesion between the first component 161 and the TFE packaging layer can be effectively enhanced, thereby avoiding the risk of peeling at the interface between the organic material and the inorganic material.

[0127] It should be noted that the yellow light process in this embodiment refers to a technology that uses yellow light of a specific wavelength (such as I line 365 nanometers, H line 405 nanometers, G line 436 nanometers, etc.) to process materials. The structure formed by the yellow light process can effectively transmit optical signals, reduce light energy loss, and maintain stable colors, thereby ensuring the display effect of the display panel and improving the signal-to-noise ratio of the OPD unit fingerprint recognition.

[0128] In a more detailed embodiment, Figure 4 As shown, the display panel provided in this embodiment includes a first component 161, a second component 162 and a third component 163, wherein the first component 161 adopts an elliptical pattern structure, and the second component 162 and the third component 163 both adopt a side-by-side convex structure. Figure 2 The elliptical pattern structure shown is not described in detail here. The side-by-side convex structure used by the second component 162 and the third component 163 is made of an organic material with a low refractive index. In this embodiment, the specific parameters of the side-by-side convex structure corresponding to the second component 162 and the third component 163 are set according to the following scheme.

[0129] The barrier structure corresponds to three spaced trapezoidal structures, wherein each trapezoidal structure has a width of 5 microns, a spacing of 3-4 microns, and a demolding angle of 70°-80°. In actual application, the barrier structure may include 2-3 trapezoidal structures. The total width of the barrier structure is less than the width of the corresponding pixel defining layer 120.

[0130] By providing a barrier structure with a large demolding angle, this embodiment can not only effectively block the large-angle lateral light signals of the G pixel unit 122 and the B pixel unit 124 to reduce the impact on the OPD unit capturing the fingerprint reflected green light signal, but also effectively isolate the organic common layer to eliminate the electrical crosstalk effect between the OPD unit and the OLED device. In actual application, when the OPD device is integrated with the OLED device, it is easy to generate an electrical crosstalk effect between the common layers. By providing a side-by-side protrusion structure with a large demolding angle, this embodiment can effectively isolate the current disturbance between the common layers, thereby reducing the electrical crosstalk effect between the common layers.

[0131] In one embodiment, the display panel further comprises a thin film encapsulation layer;

[0132] A thin film encapsulation layer, disposed on a side of the second optical structure away from the pixel defining layer 120;

[0133] The second optical structure and at least a portion of the first optical structure are disposed on a side of the pixel defining layer facing away from the substrate 110 .

[0134] In this embodiment, the first component 161 is disposed between the side of the pixel defining layer 120 facing away from the substrate 110 and the thin film encapsulation layer, at a second position above the pixel defining layer 120 adjacent to the R pixel unit 121 or the B pixel unit 124. In this embodiment, the second position is a position directly in contact with the pixel defining layer 120.

[0135] In this embodiment, Figure 5 For example, when manufacturing a display panel, the first component 161 may be set up first, and the second optical structure may be evaporated, and then the TFE encapsulation may be completed on the side of the second optical structure away from the pixel defining layer 120. In this embodiment, the second optical structure is set up first, and then the TFE encapsulation layer is set up, and the first component 161 and the second component 162 may be set up on the side of the pixel defining layer 120 away from the substrate 110, that is, the first component 161 and the second component 162 are directly set up in the array section of the display panel, and the evaporation of the second optical structure is completed directly in the evaporation section, further reducing the process flow of the display panel.

[0136] In this embodiment, if Figure 5 As shown, the first component 161 is directly disposed at an upper position in contact with the pixel defining layer 120. In this embodiment, the pixel defining layer 120 may be composed of an inorganic material, such as SiO, or an organic material, such as an organic polyimide material. The shape corresponding to the pattern structure of the first component 161 may be an ellipse or a trapezoid, wherein the bottom surface of the trapezoid is in contact with the pixel defining layer 120. The pattern structure of the second component 162 may be any one of a side-by-side convex structure, an elliptical structure, or a trapezoidal structure.

[0137] like Figure 5 As shown, in a more detailed embodiment, the pattern structure corresponding to the first component 161 is a trapezoidal structure, and the pattern structure corresponding to the second component 162 is a side-by-side convex structure. The constituent materials corresponding to the first component 161 and the second component 162 in this embodiment can be organic materials or inorganic materials. The material of the pixel defining layer 120 in this embodiment can be inorganic materials or organic polyimide materials. It should be noted that the material of the pixel defining layer 120 and the constituent materials of the first component 161 and the second component 162 can be consistent to improve the adhesion between the first component 161 and the second component 162 and the PDL layer and prevent peeling problems.

[0138] After the OLED device and the OPD device are set, in this embodiment, a second optical structure can be deposited by an open mask evaporation process. The material of the second optical structure is NPB organic material. At this time, the thickness of the second optical structure can be 2-3 microns.

[0139] In this embodiment, the first component 161 is directly arranged on the side of the pixel defining layer 120 adjacent to the R pixel unit 121 and the B pixel unit 124 away from the substrate 110, and a layer of high refractive index organic material is evaporated, which can further effectively block the influence of the light signal emitted by the R pixel unit 121 and the B pixel unit 124 at a larger angle on the green light signal reflected by the OPD to capture the fingerprint. In this embodiment, the patterned structure of the first component 161 and the second component 162 can be directly formed in the array section, and the high refractive index organic material can be directly formed in the evaporation section, which can effectively reduce the process complexity of the display template.

[0140] In a more detailed embodiment, Figure 6 As shown, the display panel provided in this embodiment includes a first component 161, a second component 162 and a third component 163, wherein the first component 161 adopts a trapezoidal structure, the second component 162 adopts a side-by-side convex structure, and the third component 163 adopts an elliptical structure. The specific parameters of each patterned structure can be configured with reference to the corresponding structure in the aforementioned embodiment, and will not be described one by one here.

[0141] In this embodiment, the constituent materials of the first component 161 and the constituent materials of the PDL layer are both inorganic materials, such as SiO, SiN, etc., and the second component 162 adopts an inorganic side-by-side protrusion structure.

[0142] The display template provided in this embodiment, the first component 161 and the second component 162 can be made of inorganic materials and arranged on the surface of the coating which is also an inorganic material, can be more stably arranged at the target position above the corresponding pixel defining layer 120, and can effectively avoid the peeling problem of the surface of the organic material and the inorganic material, and the first component 161 is a trapezoidal structure, and the second component 162 is a side-by-side convex structure, which can process noise light signals and interference light signals in a larger angle range, and prevent the light signals emitted by the R pixel unit 121 and the B pixel unit 124 from affecting the capture of the target green light signal by the OPD unit. And the side-by-side convex structure can reduce the electrical crosstalk effect of the common layer to a certain extent. In this embodiment, an elliptical third component 163 is also arranged between the OPD unit and the B pixel unit 124, which can completely block the influence of the blue light signal emitted by the B pixel unit 124 on the OPD unit, and can effectively prevent the light shielding layer from absorbing the effective light signal, while improving the display effect of the display panel, greatly improving the signal-to-noise ratio of the OPD unit for fingerprint recognition.

[0143] In one embodiment, Figure 7 As shown, the pixel defining layer 120 is provided with a pit 164, and the refractive index of the filling material in the pit 164 is less than or equal to the first refractive index threshold.

[0144] Optionally, the pit 164 is located between the G pixel unit 122 and the organic photodetector unit 123 .

[0145] Optionally, the pit may be an inverted trapezoidal pit. The height of the pit is less than or equal to the height of the pixel defining layer. The filling material in the pit is a low-fold organic glue or a reflective metal material.

[0146] In this embodiment, a pit 164 of an inverted trapezoidal structure is made based on the yellow light process, and the pit 164 is set in the PDL layer between the G pixel and the OPD pixel. The height of the pit 164 is consistent with the thickness of the PDL layer to ensure that the plane of the PDL layer remains flat after the pit 164 is filled with a low refractive index material. In this embodiment, the width of the pit 164 is set to 8-10μm, which is less than the spacing distance of the PDL layer. The demolding angle is set to 70°-80° to ensure the stability of the pit 164 of the inverted trapezoidal structure. Low-refractive organic glue or reflective metal material is filled in the pit 164, and reflective metal materials such as molybdenum (Mo), silver (Ag), titanium (Ti), aluminum (Al), etc., to achieve the reflection of the lateral green light signal sent by the G pixel unit 122, prevent the lateral green light signal sent by the G pixel unit 122 from directly irradiating the OPD unit, and reduce the signal-to-noise ratio of the fingerprint recognition process of the OPD unit. After the pit 164 is filled, a side-by-side protrusion structure is arranged above the PDL layer where the pit 164 is located. The side-by-side protrusion structure adopts the same material as the filling material, that is, the constituent material of the second component 162 is the same as the filling material of the pit 164 .

[0147] In this embodiment, Figure 7 The specific composition parameters and functions of the first component 161, the second component 162 and the third component 163 can all be referred to the specific implementation of the first optical structure of the corresponding graphic structure in the aforementioned embodiment, and will not be repeated here.

[0148] In this embodiment, a pit 164 with an inverted trapezoidal structure is formed in the PDL layer between the G pixel unit 122 and the OPD unit through a yellow light process, and the pit 164 is filled with a reflective metal material or a low-refractive organic glue, and a side-by-side raised structure of the same material is arranged on the top. This can block the lateral green light signal and the large-angle light signal emitted by the G pixel unit 122 to the greatest extent, thereby improving the signal-to-noise ratio of the OPD unit fingerprint recognition.

[0149] In summary, the present embodiment provides a display panel, which can greatly reduce the interference light signal and noise light signal when the OPD unit performs fingerprint recognition through the arrangement of the first component 161, the second component 162, the third component 163 and the pit 164, so that the green light signal emitted by the G pixel unit 122 is concentrated and reflected by the fingerprint of the finger, and is accurately captured by the OPD unit, thereby realizing high-precision fingerprint recognition. In addition, the display panel provided by the present embodiment does not require a complicated process flow, and through the combination of the first optical structure and the second optical structure, the direction of the light signal is effectively guided, which reduces the production cost and material cost consumed in the display panel manufacturing process, and reduces the difficulty of the display panel manufacturing process.

[0150] In a more detailed embodiment, the display panel provided in this embodiment has a screen structure including a TFT substrate 110, an R pixel unit 121, a G pixel unit 122, an OPD unit and a B pixel unit 124 arranged in an array on the substrate 110, and a pixel defining layer 120 is arranged between each pixel unit and the OPD unit on the same side of the substrate 110 to achieve a fixed spacing and a flush setting between each pixel unit and the OPD unit. On the side of the pixel defining layer 120 away from the substrate 110, between the OPD pixel unit and the G pixel unit 122, a second component 162 composed of a low refractive index material is arranged. On the side of the pixel defining layer 120 away from the substrate 110, between the OPD pixel unit and the B pixel unit 124, a third component 163 composed of a low refractive index material is arranged. In the middle area of ​​the pixel defining layer 120 between the OPD pixel unit and the G pixel unit 122, an inverted trapezoidal pit 164 structure is also made by a yellow light process, and a low refractive index material is filled in the pit 164 structure.

[0151] After the pit 164, the second component 162, and the third component 163 are set, TFE packaging is performed on the side of the pixel defining layer 120 away from the substrate 110 to obtain a corresponding thin film protective layer, wherein the thin film protective layer adopts a three-layer structure, namely, a first inorganic protective layer using SiON with a thickness of 0.8-1 micron, an organic protective layer using an acrylic polymer with a thickness of 8-10 microns, and a second inorganic protective layer using SiN with a thickness of 0.8-1 micron. On the side of the thin film protective layer away from the pixel defining layer 120, above the pixel defining layer 120 on both sides of the R pixel unit 121 and the B pixel unit 124, a first component 161 composed of a low refractive index material is set to reflect the large-angle light signals emitted by the R pixel unit 121 and the B pixel unit 124, so that the light signals are emitted toward the glass cover 150, which will not affect the capture of the green light signal reflected by the fingerprint by the OPD unit. After the first component 161 is set, a high refractive index material is filled on the side of the thin film protection layer away from the pixel defining layer 120, and deposited by open mask evaporation to obtain a high refractive index protection film layer. Finally, a glass cover plate 150 is set on the side of the high refractive index protection film layer away from the thin film protection layer to obtain the display panel in this embodiment.

[0152] In addition, this embodiment further provides a display device, including the display panel in the above embodiment.

[0153] The display device in this embodiment can be any electronic device with a screen structure and capable of fingerprint recognition, such as a computer device, a tablet computer, a mobile terminal, an Internet of Things device, and a smart wearable device. This embodiment does not limit the specific type of the display device.

[0154] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0155] In the description of this specification, the description with reference to the terms "some embodiments", "other embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic description of the above terms does not necessarily refer to the same embodiment or example.

[0156] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0157] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: include: substrate; A pixel defining layer is disposed on one side of the substrate, and the pixel defining layer includes a plurality of pixel openings disposed at intervals; A pixel unit and a photodetector unit are respectively arranged in the pixel opening; The first optical structure is arranged on a side of the pixel defining layer away from the substrate, and the orthographic projection of the first optical structure on the substrate is located between the orthographic projections of two adjacent pixel units on the substrate.

2. The display panel according to claim 1, characterized in that: The display panel further includes: A second optical structure is arranged on a side of the pixel defining layer away from the substrate, at least a portion of the second optical structure is arranged on the same layer as the first optical structure, and a refractive index of the second optical structure is greater than a refractive index of the first optical structure; Preferably, the orthographic projection of the second optical structure on the substrate covers the orthographic projection of the pixel unit on the substrate; Preferably, the second optical structure is a continuously arranged layer structure, and the first optical structure is arranged on a side of the second optical structure close to the substrate.

3. The display panel according to claim 1, characterized in that: The first optical structure includes a first component; The orthographic projection of the first component on the substrate covers the orthographic projection of the pixel definition layer adjacent to the R pixel unit and the B pixel unit on the substrate, wherein the refractive index of the first component is less than or equal to a first refractive index threshold; Preferably, the first component is a raised structure; Preferably, the cross-sectional shape of the first component includes semicircular and trapezoidal.

4. The display panel according to claim 1, characterized in that: The first optical structure includes a second component; The orthographic projection of the second component on the substrate covers the orthographic projection of the pixel definition layer between the pixel unit and the photodetector unit on the substrate, wherein the refractive index of the second component is less than or equal to a first refractive index threshold; Preferably, the second component is a raised structure; Preferably, the second component is a plurality of protruding structures arranged side by side; Preferably, the cross-sectional shape of the second component includes a semicircle and a trapezoid; Preferably, the second component is in contact with the pixel defining layer.

5. The display panel according to claim 4, characterized in that: The pixel defining layer is provided with a pit, and the refractive index of the filling material in the pit is less than or equal to the first refractive index threshold; Preferably, the pit is located between the G pixel unit and the organic photodetector unit; Preferably, the pit is an inverted trapezoidal pit; Preferably, the height of the pit is less than or equal to the height of the pixel defining layer; Preferably, the filling material in the pit is low-fold organic glue or reflective metal material; Preferably, the constituent material of the second component is the same as the filling material.

6. The display panel according to claim 2, characterized in that: The display panel further includes: A thin film encapsulation layer is disposed on a side of the pixel defining layer away from the substrate; The second optical structure and at least a portion of the first optical structure are arranged on a side of the thin film encapsulation layer away from the pixel defining layer.

7. The display panel according to claim 2, characterized in that: The display panel further includes: The second optical structure and at least a portion of the first optical structure are arranged on a side of the pixel defining layer away from the substrate; The thin film encapsulation layer is arranged on a side of the second optical structure away from the pixel defining layer.

8. The display panel according to claim 1, characterized in that: The first optical structure includes a third component; The orthographic projection of the third component on the substrate covers the orthographic projection of the pixel defining layer between the organic photodetector unit and the B pixel unit on the substrate, wherein the refractive index of the third component is less than or equal to the first refractive index threshold; Preferably, the third component is a protruding structure; Preferably, the cross-sectional shape of the third component includes semicircular and trapezoidal.

9. The display panel according to claim 5 or 6, characterized in that: The thin film encapsulation layer includes a first inorganic protective layer, a first organic protective layer, and a second inorganic protective layer; Preferably, the first inorganic protective layer and the second inorganic protective layer are prepared by chemical vapor deposition or atomic layer deposition technology; Preferably, the material of the first inorganic protective layer includes SiON, wherein the thickness of the first inorganic protective layer is 0.8-1 μm; Preferably, the material of the second inorganic protective layer includes SiN, and the thickness of the second inorganic protective layer is 0.8-1 μm; Preferably, the material of the organic protective layer includes acrylic polymer, and the thickness of the organic protective layer is 8-10 μm.

10. A display device, characterized in that: Comprising the display panel as described in any one of claims 1-9.

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