Membrane module and method of manufacture

Abstract

The application provides a film assembly and a preparation method. The film assembly comprises a first substrate layer, a second substrate layer, a first adhesive layer and a second adhesive layer. The first adhesive layer and the second adhesive layer are arranged between the first substrate layer and the second substrate layer. The first adhesive layer and the second adhesive layer are arranged side by side along a direction parallel to the first substrate layer. The film assembly further comprises a first isolation layer arranged between the second adhesive layer and the second substrate layer. The second adhesive layer and the first adhesive layer are arranged on the substrate layer. The distance between the second adhesive layer and the first adhesive layer can be controlled during the forming process. The positioning and fitting of the second adhesive layer and the first adhesive layer to the display substrate can be synchronous. An additional process for fitting the second adhesive layer can not be required. The space for the second adhesive layer in the display substrate due to the fitting precision error factor can be further reduced.

Description

Technical Field

[0001] This application belongs to the field of membrane technology, and more specifically, relates to a membrane module and its preparation method. Background Technology

[0002] With the continuous updating and iteration of technology, display devices are gradually developing towards ultra-narrow bezel designs. Currently, the bending design of the bonding part of flexible organic light-emitting diode display devices has become the preferred choice for ultra-narrow bezels. However, due to the dense wiring and high reverse stress in the bending area of ​​the bonding part, cracks in the bending area are frequent, which seriously restricts the application of products.

[0003] In related technologies, some products spray an adhesive layer onto the surface of the bending area to increase the strength of the bending area and thus reduce the occurrence of cracks in this area. However, this method requires a large space to be reserved between the bending area of ​​the display substrate and the display area and chip bonding area to accommodate the protective adhesive layer, making it difficult to reduce the bezel size of the display device. Summary of the Invention

[0004] The purpose of this application is to provide a film assembly and a preparation method to solve the technical problem in the prior art that a large space needs to be reserved between the bending area of ​​the display substrate and the display area and the chip bonding area to accommodate the protective adhesive layer.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0006] In a first aspect, a membrane assembly is provided, including a first adhesive layer, a second adhesive layer, a first substrate layer and a second substrate layer, wherein the first adhesive layer and the second adhesive layer are disposed between the first substrate layer and the second substrate layer, and the first adhesive layer and the second adhesive layer are arranged side by side along a direction parallel to the first substrate layer.

[0007] The membrane assembly further includes a first insulating layer, and the first insulating layer is disposed between the second adhesive layer and the second substrate layer.

[0008] In some embodiments, the thickness of the first insulating layer is d1, the thickness of the second adhesive layer is d2, and d1≤0.2*d2.

[0009] In some embodiments, the orthographic projection of the first insulating layer in the thickness direction at least partially overlaps with the orthographic projection of the second adhesive layer in the thickness direction.

[0010] In some embodiments, the orthographic projection of the first insulating layer in the thickness direction overlaps with the orthographic projection of the second adhesive layer in the thickness direction.

[0011] In some embodiments, the film assembly further includes a polarizer disposed between the first adhesion layer and the second substrate layer.

[0012] In some embodiments, the orthographic projection of the first adhesive layer in the thickness direction lies within the orthographic projection of the second substrate layer in the thickness direction, and the edge of the second substrate layer protrudes from the edge of the first adhesive layer; and / or,

[0013] The orthographic projection of the second adhesive layer in the thickness direction lies within the orthographic projection of the second substrate layer in the thickness direction, and the edge of the second substrate layer protrudes from the edge of the second adhesive layer.

[0014] In some embodiments, the minimum distance by which the edge of the second substrate layer protrudes from the edge of the first adhesive layer is less than or equal to 0.2 mm; and / or,

[0015] The minimum distance by which the edge of the second substrate layer protrudes from the edge of the second adhesive layer is less than or equal to 0.2 mm.

[0016] In some embodiments, the first adhesive layer and the second adhesive layer are spaced apart along a direction parallel to the substrate layer.

[0017] In some embodiments, the spacing between the first adhesive layer and the second adhesive layer is d3, where 0.08mm ≤ d3 ≤ 0.17mm.

[0018] In some embodiments, the edges of the first adhesive layer and the second adhesive layer are connected along a direction parallel to the substrate layer.

[0019] Secondly, a method for preparing a membrane module is provided, comprising the following steps:

[0020] Provide a first substrate layer;

[0021] A first adhesive material layer and a process protection layer are sequentially formed on the first substrate layer;

[0022] A first through hole is formed on the first adhesive material layer to form the first adhesive layer, and a second through hole is formed on the process protection layer, wherein the first through hole and the second through hole are connected.

[0023] A second adhesive material layer is disposed within the first through hole, and a first insulating material layer is disposed on the side of the second adhesive material layer away from the first substrate layer. The second adhesive material layer is used to form a second adhesive layer; the first insulating layer is used to form a first insulating layer.

[0024] Remove the process protective layer;

[0025] A second substrate layer is covered on the first and second adhesive layers to form the membrane assembly.

[0026] In some embodiments, the second adhesive material layer is used to form a second adhesive layer; the step of using the first insulating material layer to form a first insulating layer includes:

[0027] At least a portion of the second adhesive material layer and the first barrier material layer facing the first adhesive material layer is removed to form a second adhesive layer and a first barrier layer spaced apart from the first adhesive material layer;

[0028] In some embodiments, the method further includes removing a portion of the first adhesive material layer toward the second adhesive layer and the first barrier layer to form the first adhesive layer spaced apart from the second adhesive layer and the first barrier layer.

[0029] In some embodiments, the step of sequentially forming a first adhesive material layer and a process protection layer on the first substrate layer includes:

[0030] The first adhesive material layer is formed on the first substrate layer, a polarizing material layer is formed on the side of the first adhesive material layer away from the first substrate layer, and the process protection layer is formed on the side of the polarizing material layer away from the first substrate layer.

[0031] It also includes: forming a third through hole on the polarizing material layer to form a polarizer, wherein the third through hole is connected to the first through hole and the second through hole.

[0032] In some embodiments, the second adhesive material layer is used to form a second adhesive layer; the step of using the first insulating material layer to form a first insulating layer includes:

[0033] At least a portion of the second adhesive material layer and the first insulating material layer facing the first adhesive material layer is removed to form a second adhesive layer and a first insulating layer spaced apart from the first adhesive material layer and the polarizing material layer;

[0034] In some embodiments, the method further includes: removing a portion of the first adhesive material layer facing the second adhesive layer and the first insulating layer, and removing a portion of the polarizing material layer facing the second adhesive layer and the first insulating layer, to form the first adhesive layer and the polarizer spaced apart from the second adhesive layer and the first insulating layer.

[0035] The beneficial effects of the film assembly provided in this application are as follows: The second adhesive layer is disposed on the substrate layer, meaning the second adhesive layer can be formed outside the bending area. This prevents damage to the bending area during the processing of the second adhesive layer, reduces the processing difficulty, improves the uniformity of the second adhesive layer thickness, and allows the size of the second adhesive layer to be close to the size of the bending area. This helps reduce the extra space required for the second adhesive layer on the display substrate due to its size, thus reducing the distance between the bending area and the display area and chip bonding area of ​​the display substrate. Since both the second and first adhesive layers are disposed on the substrate layer, the distance between the second and first adhesive layers can be controlled during the film assembly forming process. This facilitates the positioning and bonding of the first adhesive layer with the display area of ​​the display substrate. The second adhesive layer can be positioned and bonded to the bending area, meaning that the positioning and bonding of the second adhesive layer and the first adhesive layer to the display substrate can be simultaneous. This eliminates the need for additional bonding processes for the second adhesive layer, reduces assembly steps and difficulty in display devices, and further minimizes the extra space reserved for the second adhesive layer within the display substrate due to bonding accuracy errors. This reduces the distance between the bending area and the display area, facilitating narrow bezel designs in display devices. Furthermore, substrate layers are provided on both sides of the second and first adhesive layers. These two substrate layers can respectively shield and protect the sides of the second and first adhesive layers, reducing the risk of collision damage to the film assembly during transport and lowering the possibility of the second and first adhesive layers accidentally adhering to other components. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of a display substrate, a first adhesive layer, and a second adhesive layer in related technologies;

[0038] Figure 2 This is a schematic diagram showing the adhesion of the first and second adhesive layers of the film assembly provided in this application to the display substrate;

[0039] Figure 3 A schematic diagram of a membrane assembly provided in an embodiment of this application;

[0040] Figure 4 A schematic diagram of a membrane assembly provided in yet another embodiment of this application;

[0041] Figure 5 A schematic diagram of the second adhesion layer and the first isolation layer provided in the embodiments of this application;

[0042] Figure 6 A schematic diagram of a membrane assembly provided in yet another embodiment of this application;

[0043] Figure 7 A schematic diagram of a membrane assembly provided in yet another embodiment of this application;

[0044] Figure 8 A schematic diagram of a membrane assembly provided in yet another embodiment of this application;

[0045] Figure 9 A schematic diagram of a membrane assembly provided in yet another embodiment of this application;

[0046] Figure 10 A schematic diagram of a membrane assembly provided in yet another embodiment of this application;

[0047] Figure 11 A schematic diagram of a membrane assembly provided in yet another embodiment of this application;

[0048] Figure 12 A schematic diagram illustrating the steps of a method for preparing a membrane module according to an embodiment of this application;

[0049] Figure 13 A schematic diagram illustrating the steps of a method for preparing a membrane module according to another embodiment of this application;

[0050] Figure 14 A schematic diagram illustrating the steps of a method for preparing a membrane module according to another embodiment of this application;

[0051] Figure 15 A schematic diagram illustrating the steps of a method for preparing a membrane module according to another embodiment of this application;

[0052] Figure 16 A schematic diagram illustrating the steps of a method for preparing a membrane module according to another embodiment of this application;

[0053] Figure 17 A schematic diagram illustrating the steps of a method for preparing a membrane module according to another embodiment of this application;

[0054] Figure 18 A schematic diagram illustrating the steps of a method for preparing a membrane module according to another embodiment of this application;

[0055] Figure 19 A schematic diagram illustrating the steps of a method for preparing a membrane module according to another embodiment of this application;

[0056] Figure 20 A schematic diagram illustrating the steps of a method for preparing a membrane module according to another embodiment of this application;

[0057] Figure 21 A schematic diagram illustrating the steps of a method for preparing a membrane module according to another embodiment of this application;

[0058] Figure 22 This is a schematic diagram of the steps in a method for preparing a membrane module according to another embodiment of this application.

[0059] in, Figure 1 Chinese figure labels:

[0060] 100' Display substrate; 200' Display area; 300' Bending area; 400' Chip bonding area;

[0061] 1' Functional layer;

[0062] 2' Protective adhesive layer;

[0063] Figures 2 to 22 Chinese figure labels:

[0064] 100, Display substrate; 200, Display area; 300, Bending area; 400, Chip bonding area;

[0065] 1. First adhesive layer; 10. First adhesive material layer; 11. First through hole; 12. First groove; 13. Adhesive layer; 14. Polarizing layer;

[0066] 2. Second adhesive layer; 20. Second adhesive material layer;

[0067] 31. First substrate layer; 32. Second substrate layer;

[0068] 4. First insulating layer; 41. First insulating material layer;

[0069] 5. Polarizing film;

[0070] 6. Process protection layer; 61. Second through hole. Detailed Implementation

[0071] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0072] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0073] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0074] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0075] With continuous technological advancements, display devices are increasingly moving towards ultra-narrow bezel designs. Currently, the flex OLED pad bending design has become the preferred method for ultra-narrow bezels. Figure 1 This design includes a display substrate 100', which has a display area 200', a bending area 300', and a chip bonding area 400'. The surface of the display area 200' can be provided with functional layers 1' such as a polarizing layer and a bonding layer. The bending area 300' can be bent so that the assembled chip bonding area 400' can be located on the back side of the display area 200'. However, due to the dense wiring and high reverse bending stress in the bending area 300' of the bonding part, cracks in the bending area 300' are frequent, which seriously restricts the application of the product.

[0076] In related technologies, during the assembly of display devices, a protective adhesive layer 2' is applied to the surface of the bending area 300' to increase the strength of the bending area 300' and reduce the occurrence of cracks in this area. However, the application of the protective adhesive layer 2' increases the assembly difficulty and is not conducive to improving the assembly speed of the display device. Therefore, some display devices directly spray adhesive onto the surface of the bending area 300' to form a protective adhesive layer 2'. However, it is difficult to ensure the uniformity of the overall thickness of the sprayed protective adhesive layer 2', resulting in the edge area of ​​the protective adhesive layer 2 being thinner than the central area. Thus, the edge area of ​​the protective adhesive layer 2' cannot provide substantial protection. Therefore, the spraying range is usually set to be larger than the bending area 300', so that the entire bending area 300' can be covered by the effective protection area (central area) of the protective adhesive layer 2'. Although this method can effectively protect the bending area 300' of the bonding part, However, the edge width L1 of the protective adhesive layer 2' is usually not less than 0.35mm, which means that the effective protection area of ​​the protective adhesive layer 2' occupies about 85% of the actual size of the protective adhesive layer 2'. This makes the size of the protective adhesive layer 2' far exceed the size of the bending area 300', resulting in the protective adhesive layer 2' occupying too much space. A large space needs to be reserved between the bending area 300' and the display area 200' and the chip bonding area 400' to accommodate the edge of the protective adhesive layer 2', making it difficult to reduce the bezel of the display device.

[0077] Based on this, embodiments of this application provide a membrane module and a preparation method, wherein the membrane module includes a first substrate layer, a second substrate layer, a first adhesive layer and a second adhesive layer, wherein the first adhesive layer and the second adhesive layer are sandwiched between the first substrate layer and the second substrate layer, and the first adhesive layer and the second adhesive layer are arranged side by side along a direction parallel to the first substrate layer, and the membrane module further includes a first insulating layer, wherein the second adhesive layer and the second substrate layer are provided with the first insulating layer.

[0078] The second adhesive layer is disposed between the first and second substrate layers, meaning it can be formed outside the bending area. This prevents damage to the bending area during the processing of the second adhesive layer, reduces processing difficulty, improves thickness uniformity, and allows its size to closely match the bending area. This reduces the extra space required for the second adhesive layer on the display substrate, thus decreasing the distance between the bending area and the display area / chip bonding area. Since both the first and second adhesive layers are disposed between them, the distance between them can be controlled during film assembly. The first adhesive layer can be positioned and bonded to the display area of ​​the display substrate, completing the first bonding process. The positioning and bonding of the second adhesive layer with the bending area, that is, the positioning and bonding of the second adhesive layer and the first adhesive layer with the display substrate, can be synchronous. In this way, no additional process is needed to bond the second adhesive layer. In addition, it helps to reduce the assembly process and assembly difficulty of the display device, and can further reduce the extra space reserved for the second adhesive layer in the display substrate due to bonding accuracy error factors. That is, it reduces the distance between the bending area and the display area of ​​the display substrate, which helps to realize the narrow bezel design of the display device. Furthermore, a first substrate layer and a second substrate layer are provided on both sides of the second adhesive layer and the first adhesive layer. The first substrate layer and the second substrate layer can respectively shield and protect the two sides of the second adhesive layer and the first adhesive layer, reducing the impact damage to the film assembly during transportation, and reducing the possibility of the second adhesive layer and the first adhesive layer accidentally adhering to other components.

[0079] The second adhesive layer and the second substrate layer of the membrane module can have a certain degree of adhesion so that the second substrate layer can support the second adhesive layer. However, the adhesion between the second adhesive layer and the second substrate layer increases the difficulty of peeling them off. Therefore, a first barrier layer is provided between the second adhesive layer and the second substrate layer. The first barrier layer is attached to the second substrate layer but not adhesive. The edge of the second adhesive layer is not directly attached to the second substrate layer. The area where the second substrate layer and the first barrier layer are attached can serve as the peeling starting point for the second substrate layer, thereby reducing the difficulty of peeling off and making it easier to peel the second substrate layer off the second adhesive layer. This reduces the deformation caused by the second adhesive layer being stretched during the peeling process. In addition, the adhesion between the first barrier layer and the second adhesive layer is small, making the peeling process easier and allowing the first barrier layer to be easily peeled off the second adhesive layer.

[0080] By setting the second adhesive layer between the first substrate layer and the second substrate layer, the extra space reserved for the second adhesive layer in the display substrate due to bonding accuracy error can be further reduced, which means reducing the distance between the bending area and the display area of ​​the display substrate, thus helping to achieve a narrow bezel design for the display device. Setting the first isolation layer between the second adhesive layer and the second substrate layer makes it easier to peel the second substrate layer off the second adhesive layer, thereby reducing the deformation caused by the second adhesive layer being pulled during the peeling process, and making it easier to peel the first isolation layer off the second adhesive layer.

[0081] Reference Figures 2 to 4 This application first provides a membrane assembly, which includes a first substrate layer 31, a second substrate layer 32, a first adhesive layer 1, and a second adhesive layer 2. The first adhesive layer 1 and the second adhesive layer 2 are sandwiched between the first substrate layer 31 and the second substrate layer 32, and are arranged side-by-side along a direction parallel to the first substrate layer 31. (Refer to...) Figure 3 and Figure 4 The membrane assembly also includes a first insulating layer 4, and the first insulating layer 4 is disposed between the second adhesive layer 2 and the second substrate layer 32.

[0082] It should be noted that the first adhesive layer 1 can be used to adhere to the display area 200 of the display substrate 100 after being separated from the first substrate layer 31, and the second adhesive layer 2 can be used to adhere to the bending area 300 of the display substrate 100 after being separated from the first substrate layer 31.

[0083] It should be noted that when the film assembly exists independently, the first substrate layer 31 and the second substrate layer 32 can serve as supporting structures for the first adhesive layer 1 and the second adhesive layer 2. When the film assembly is applied to a display device, the first substrate layer 31 can be peeled off from the first adhesive layer 1 and the second adhesive layer 2 so that the first adhesive layer 1 and the second adhesive layer 2 can be bonded to the display substrate 100 with the same side facing them. After the first adhesive layer 1 is bonded to the display area 200 of the display substrate 100 and the second adhesive layer 2 is bonded to the bending area 300 of the display substrate 100, the second substrate layer 32 of the film assembly can be peeled off from the first adhesive layer 1 and the second adhesive layer 2. This ensures that the second substrate layer 32 will not interfere with other structures within the display device.

[0084] It should be noted that in some embodiments, the first adhesive layer 1 can be a functional layer that has a specific processing effect on light. For example, the first adhesive layer 1 can include a polarizer (POL). The polarizer can contain a micro-grid structure. When natural light passes through the polarizer, light perpendicular to the transmission axis of the polarizer will be absorbed and cannot pass through, thus leaving only light parallel to the transmission axis of the polarizer, forming a contrast between light and dark, and achieving the function of displaying the image. In other embodiments, the first adhesive layer 1 can also be a film layer that plays a connecting role. For example, the first adhesive layer 1 can be an adhesive layer. When the film assembly is applied to a display device, the two sides of the first adhesive layer 1 can be bonded to the display substrate 100 and the cover plate respectively. At this time, the first adhesive layer 1 can serve as a connecting structure between the display substrate 100 and the cover plate. The second adhesive layer 2 can be a protective adhesive layer that protects the bending area 300 of the display substrate 100.

[0085] It should be noted that when the film assembly is applied to a display device, in addition to the first substrate layer 31 and the second substrate layer 32 being peelable from the second adhesive layer 2, the first barrier layer 4 can also be peelable from the second adhesive layer 2. The first barrier layer 4 can be peeled from the second adhesive layer 2 before the bending area 300 of the display substrate 100 is bent, or after the bending area 300 is bent, or before the second adhesive layer 2 is cured, or after the second adhesive layer 2 is cured.

[0086] The film assembly provided in this application embodiment has a second adhesive layer 2 disposed between the first substrate layer 31 and the second substrate layer 32. This means the second adhesive layer 2 can be formed outside the bending area 300. Therefore, the bending area 300 is not damaged during the processing of the second adhesive layer 2, and the processing difficulty of the second adhesive layer 2 is reduced. This helps improve the uniformity of the thickness of the second adhesive layer 2 and allows the size of the second adhesive layer 2 to be close to the size of the bending area 300. This reduces the extra space required for the second adhesive layer 2 in the display substrate 100 due to its size, thus reducing the distance between the bending area 300 of the display substrate 100 and the display area 200 and the chip bonding area 400. Both the second adhesive layer 2 and the first adhesive layer 1 are disposed between the first substrate layer 31 and the second substrate layer 32. During the forming process of the film assembly, the distance between the second adhesive layer 2 and the first adhesive layer 1 can be controlled. This allows for the bonding of the first adhesive layer 1 to the display area 200 of the display substrate 100. The positioning and bonding process can be completed simultaneously with the positioning and bonding of the second adhesive layer 2 and the bending area 300. In other words, the positioning and bonding of the second adhesive layer 2 and the first adhesive layer 1 with the display substrate 100 can be synchronous. Thus, no additional process is required to bond the second adhesive layer 2. This also helps to reduce the assembly process and assembly difficulty of the display device, and can further reduce the extra space reserved for the second adhesive layer 2 in the display substrate 100 due to bonding accuracy error factors. That is, it reduces the distance between the bending area 300 and the display area 200 of the display substrate 100, which helps to realize the narrow bezel design of the display device. In addition, the first substrate layer 31 and the second substrate layer 32 are provided on both sides of the second adhesive layer 2 and the first adhesive layer 1. The first substrate layer 31 and the second substrate layer 32 can respectively shield and protect the two sides of the second adhesive layer 2 and the first adhesive layer 1, reducing the impact damage to the film assembly during transportation, and reducing the possibility of the second adhesive layer 2 and the first adhesive layer 1 accidentally adhering to other components.

[0087] It is understandable that the second adhesive layer 2 and the second substrate layer 32 of the membrane assembly can have a certain degree of adhesion so that the second substrate layer 32 can support the second adhesive layer 2. However, the adhesion between the second adhesive layer 2 and the second substrate layer 32 increases the difficulty of peeling them off. Therefore, a first insulating layer 4 is provided between the second adhesive layer 2 and the second substrate layer 32. The first insulating layer 4 is attached to the second substrate layer 32 but not adhesive. The edge of the second adhesive layer 2 is not directly attached to the second substrate layer 32. The area where the second substrate layer 32 is attached to the first insulating layer 4 can serve as the peeling starting point for the second substrate layer 32, thereby reducing the difficulty of peeling off and making it easier to peel the second substrate layer 32 off the second adhesive layer 2. This reduces the deformation caused by the second adhesive layer 2 being stretched during the peeling process. In addition, the adhesion between the first insulating layer 4 and the second adhesive layer 2 is small, making the peeling process easier and allowing the first insulating layer 4 to be easily peeled off from the second adhesive layer 2.

[0088] By setting the second adhesive layer 2 between the first substrate layer 31 and the second substrate layer 32, the extra space reserved for the second adhesive layer 2 in the display substrate 100 due to bonding accuracy error can be further reduced. That is, the distance between the bending area 300 and the display area 200 of the display substrate 100 is reduced, which helps to realize the narrow bezel design of the display device. The first isolation layer 4 is set between the second adhesive layer 2 and the second substrate layer 32, which can facilitate the peeling of the second substrate layer 32 from the second adhesive layer 2, thereby reducing the deformation caused by the second adhesive layer 2 being pulled during the peeling of the second substrate layer 32, and making it easy to peel the first isolation layer 4 off the second adhesive layer 2.

[0089] In some embodiments, the second adhesive layer 2 can be pre-cured by thermosetting adhesive, light-curing adhesive, or moisture-curing adhesive. Pre-curing refers to reducing the curing environment conditions or shortening the curing time, so that the formed second adhesive layer 2 has a certain shape and is flexible and viscous, thereby allowing the second adhesive layer 2 to adhere to the bending area 300 of the display substrate 100. When the bending area 300 is bent, the second adhesive layer 2 can produce corresponding bending deformation to adapt to the change in the shape of the bending area 300. In some embodiments, the adhesive can be one of thermosetting adhesive, light-curing adhesive, and moisture-curing adhesive. For example, when using thermosetting adhesive to form the second adhesive layer 2, the curing temperature of the thermosetting adhesive can be reduced or the curing time can be shortened to make the resulting second adhesive layer 2 have a certain degree of flexibility and viscousness. When using light-curing adhesive, the curing light intensity can be reduced or the curing time can be shortened. When using moisture-curing adhesive, the moisture concentration can be reduced or the curing time can be shortened. For example, thermosetting adhesives can be epoxy resins, polyester resins, vinyl esters, bismaleimides, thermosetting polyimides, cyanate esters, etc.; UV-curing adhesives can be acrylate adhesives, ultraviolet (UV) curing adhesives, etc.; moisture-curing adhesives can be cyanoacrylate adhesives, moisture-curing reactive polyurethane hot melt adhesives (PUR), etc.

[0090] In some embodiments, the second adhesive layer 2 can be cured after bending in the bending area 300 of the display substrate 100. This curing process can completely cure the second adhesive layer 2. When the second adhesive layer 2 is completely cured, the flexibility and stickiness of the second adhesive layer 2 will be reduced, thereby reducing the probability of the second adhesive layer 2 sticking to other components.

[0091] In this embodiment, the second adhesive layer 2 is pre-cured with UV adhesive. The UV adhesive can be a single polymer adhesive made of acrylic. The selection of UV adhesive can be referred to Table 1:

[0092] Table 1: Parameters for UV Adhesive Selection

[0093] project unit Specification Curing conditions <![CDATA[mj / cm 2 ]]> <![CDATA[>1000mj / cm 2 (High-pressure mercury lamp) Viscosity Cps ≥950Cps (25℃) Peel strength N / cm ≥4 Young's modulus <![CDATA[N / mm 2 ]]> ≤230 elongation ％ ≥240

[0094] In some embodiments, the second adhesive layer 2 is fully cured after bending in the bending area 300, and the first barrier layer 4 can be peeled off from the second adhesive layer 2 after bending in the bending area 300 and before the second adhesive layer 2 is fully cured. It is understood that after bending in the bending area 300, the second adhesive layer 2 will deform along with the bending in the bending area 300, and the edge of the second adhesive layer 2 may separate from the edge of the first barrier layer 4 due to its change in shape. At this time, peeling the first barrier layer 4 from the second adhesive layer 2 can reduce the difficulty of peeling and help reduce damage to the second adhesive layer 2 during the peeling process.

[0095] Reference Figures 5 to 7 In some embodiments, the orthographic projection of the first insulating layer 4 in the thickness direction at least partially overlaps with the orthographic projection of the second adhesive layer 2 in the thickness direction. When the orthographic projection of the first insulating layer 4 in the thickness direction partially overlaps with the orthographic projection of the second adhesive layer 2 in the thickness direction, the size of the first insulating layer 4 can be smaller than the size of the second adhesive layer 2. When the orthographic projection of the first insulating layer 4 in the thickness direction completely overlaps with the orthographic projection of the second adhesive layer 2 in the thickness direction, the size of the first insulating layer 4 can be the same as or slightly larger than the size of the second adhesive layer 2.

[0096] The orthographic projection of the first insulating layer 4 in the thickness direction overlaps at least partially with the orthographic projection of the second adhesive layer 2 in the thickness direction. At least a portion of the second adhesive layer 2 can be separated by the first insulating layer 4 so that this portion of the second adhesive layer 2 does not come into contact with the second substrate layer 32, thereby reducing the difficulty of peeling the second substrate layer 32 from the second adhesive layer 2.

[0097] In some embodiments, the orthographic projection of the first insulating layer 4 in the thickness direction overlaps with the orthographic projection of the second adhesive layer 2 in the thickness direction. That is, the first insulating layer 4 can be the same size as or slightly larger than the second adhesive layer 2, so that the second adhesive layer 2 can be completely unadhere to the second substrate layer 32.

[0098] When the first insulating layer 4 is the same size as or slightly larger than the second adhesive layer 2, the second substrate layer 32 of the film assembly can be peeled off from the second adhesive layer 2 and the first adhesive layer 1 before bending the bending region 300, or after bending the bending region 300. In some embodiments, the second substrate layer 32 is peeled off from the second adhesive layer 2 and the first adhesive layer 1 before bending the bending region 300. It is understood that, since the second adhesive layer 2 and the second substrate layer 32 of the film assembly are blocked by the first insulating layer 4, the second adhesive layer 2 will not directly adhere to this second substrate layer 32. When the bending region 300 of the display substrate 100 is bent... When the bending zone 300 is completed, the second adhesive layer 2 deforms. At this time, the first barrier layer 4 can separate from the second substrate layer 32, so that the second adhesive layer 2 will not be pulled and deformed by the second substrate layer 32. That is, when the second adhesive layer 2 is deformed, the relative position between the second adhesive layer 2 and the second substrate layer 32 can change accordingly, thereby reducing the pulling of the second substrate layer 32 on the second adhesive layer 2. When the bending zone 300 is completed, a part of the first barrier layer 4 can separate from the second substrate layer 32 and not adhere. At this time, peeling off the second substrate layer 32 can reduce the difficulty of peeling and reduce the damage to the second adhesive layer 2 and the first adhesive layer 1 during the peeling process of the second substrate layer 32.

[0099] In some embodiments, the first insulating layer 4 may be a polyimide (PI) layer, a polyethylene terephthalate (PET) layer, or the like.

[0100] In some embodiments, the membrane assembly may have only one first barrier layer 4, that is, the first barrier layer 4 may be disposed only on one side of the second adhesion layer 2, see reference. Figure 2 During the assembly of the display device, the first substrate layer 31 can be peeled off first. After the second adhesive layer 2 and the first adhesive layer 1 are glued to the display substrate 100, the area between the second substrate layer 32 and the first isolation layer 4 can be used as the peeling starting point for the second substrate layer 32.

[0101] In some embodiments, at least one of the first substrate layer 31 and the second substrate layer 32 may also be a release layer. That is, the first substrate layer 31 and the second substrate layer 32 may both be release layers, or one of them may be a release layer and the other may be a protective layer. For example, during the assembly of the display device, the first substrate layer 31, which is peeled off from the second adhesive layer 2 and the first adhesive layer 1 first, may be a release layer, and the second substrate layer 32, which is peeled off from the second adhesive layer 2 and the first adhesive layer 1 later, may be made of a material with higher hardness, thereby improving the protective strength of the second substrate layer 32 for the second adhesive layer 2 and the first adhesive layer 1. In some embodiments, the first substrate layer 31, which serves as a release layer, may be a polyimide (PI) layer, a polyethylene terephthalate (PET) layer, etc.

[0102] In other embodiments, the first substrate layer 31 and the second substrate layer 32 may both be made of materials with high hardness, so that the first substrate layer 31 and the second substrate layer 32 can both serve as protective structures for the second adhesive layer 2 and the first adhesive layer 1.

[0103] Reference Figure 5 In some embodiments, the thickness of the first insulating layer 4 is d1, and the thickness of the second adhesive layer 2 is d2, where d1 ≤ 0.2 * d2. It is understood that for objects of the same material, the smaller the thickness, the more difficult it is to bend. Setting the thickness of the first insulating layer 4 to no more than one-fifth of the thickness of the second adhesive layer 2 allows the first insulating layer 4 to have a certain degree of bending capability. This enables the first insulating layer 4 to bend to a certain extent during the peeling process between the first insulating layer 4 and the second adhesive layer 2, thereby facilitating the peeling operation.

[0104] In some embodiments, the thickness d2 of the second adhesion layer 2 is ≥ 50 μm. When the thickness d2 of the second adhesion layer 2 is 50 μm, the thickness d1 of the first insulating layer 4 may not be greater than 10 μm. For example, the thickness d1 of the first insulating layer 4 may be 8 μm, 8.2 μm, 8.4 μm, 8.6 μm, 8.8 μm, 9 μm, 9.2 μm, 9.4 μm, 9.6 μm, 9.8 μm, 10 μm, etc. In some embodiments, when the thickness d2 of the second adhesion layer 2 is 60 μm, the thickness of the first barrier layer 4 can be 10 μm to 12 μm. For example, the thickness d1 of the first barrier layer 4 can be 10 μm, 10.2 μm, 10.4 μm, 10.6 μm, 10.8 μm, 11 μm, 11.2 μm, 11.4 μm, 11.6 μm, 11.8 μm, or 12 μm.

[0105] In some embodiments, when the orthographic projection of the first insulating layer 4 in the thickness direction overlaps with the orthographic projection of the second adhesive layer 2 in the thickness direction, that is, when the size of the first insulating layer 4 is smaller than the size of the second adhesive layer 2, a recess can be provided on the side of the second adhesive layer 2 facing the second substrate layer 32, and the first insulating layer 4 can be disposed within the recess. In some embodiments, the thickness of the first insulating layer 4 can be equal to the depth of the recess, so that the surface of the first insulating layer 4 can abut against the second substrate layer 32. In other embodiments, the thickness of the first insulating layer 4 can be less than the depth of the recess, so that the surface of the first insulating layer 4 can be spaced from the second substrate layer 32, facilitating the peeling off of the second substrate layer 32. In still other embodiments, the thickness of the first insulating layer 4 can be greater than the depth of the recess, so that the first insulating layer 4 can abut against the second substrate layer 32, and the second adhesive layer 2 can be spaced from the second substrate layer 32, which also facilitates the peeling off of the second substrate layer 32.

[0106] Reference Figure 7 In some embodiments, the film assembly further includes a polarizer 5, which is disposed between the first adhesion layer 1 and the second substrate layer 32.

[0107] A polarizer 5 is an optical element that can convert natural light into polarized light. The working principle of a polarizer 5 is based on the selection and control of the polarization characteristics of light. It possesses a special molecular structure or optical properties that allow light vibrating in a specific direction to pass through, while absorbing or blocking light vibrating in other directions, thus making the transmitted light polarized. A polarizer 5 includes a linear polarizer and a circular polarizer. The linear polarizer allows linearly polarized light vibrating in a specific direction to pass through, while absorbing or greatly attenuating light vibrating perpendicular to that direction. The circular polarizer is constructed by adding a quarter-wave plate to a linear polarizer; it can convert linearly polarized light into circularly polarized light, or vice versa.

[0108] A polarizer 5 is disposed between the first adhesion layer 1 and the second substrate layer 32. The polarizer 5 can filter and regulate the light from the backlight, causing it to propagate in a specific direction, illuminating the liquid crystal molecules and forming a clear image. In addition, the polarizer 5 can also improve the contrast and color reproduction of the liquid crystal display, making the display effect more realistic and natural.

[0109] In some embodiments, the first adhesive layer 1 can be a single-layer structure, and the first adhesive layer 1 can be an adhesive layer 13. In this case, the material of the first adhesive layer 1 can be optically clear adhesive (OCA), optically clear resin (OCR), etc.

[0110] Reference Figure 8In some embodiments, the film assembly may not have a separate polarizer 5. In this case, the first adhesion layer 1 can be a multilayer structure, comprising a polarizing layer 14 and an adhesive layer 13 stacked together. The adhesive layer 13 may be a single layer located on one side of the polarizing layer 14, or it may be two layers located on opposite sides of the polarizing layer 14. In this way, the polarizing layer 14 can be directly adhered to the display area 200 of the display substrate 100 via the adhesive layer 13. When the first adhesion layer 1 is a multilayer structure, the thickness of the adhesive layer 13 included in the first adhesion layer 1 can be 0.1 mm.

[0111] In some embodiments, when the first adhesive layer 1 is a single-layer structure and the first adhesive layer 1 is a polarizing layer 14, the polarizing layer 14 itself may be adhesive so that the polarizing layer 14 can be bonded to the display area 200 of the display substrate 100.

[0112] Reference Figure 9 In some embodiments, the edge of the first adhesive layer 1 may be spaced apart from the edges of the first substrate layer 31 and the second substrate layer 32, and the edges of the first substrate layer 31 and the second substrate layer 32 protrude from the first adhesive layer 1. Thus, the edge of the second substrate layer 32 may protrude relative to the first adhesive layer 1. Therefore, when peeling off the first substrate layer 31 and the second substrate layer 32, the portion of the first substrate layer 31 and the second substrate layer 32 that protrudes from the first adhesive layer 1 can be used as the starting point for peeling. This can reduce the difficulty of peeling the first substrate layer 31 and the second substrate layer 32 from the first adhesive layer 1 and the second adhesive layer 2.

[0113] In some embodiments, the edge of the second adhesive layer 2 may be spaced apart from the edges of the first substrate layer 31 and the second substrate layer 32, and the edges of the first substrate layer 31 and the second substrate layer 32 protrude from the second adhesive layer 2. Thus, the edges of the first substrate layer 31 and the second substrate layer 32 may protrude relative to the second adhesive layer 2. Therefore, when peeling off the first substrate layer 31 and the second substrate layer 32, the portion of the first substrate layer 31 and the second substrate layer 32 that protrudes from the second adhesive layer 2 can be used as the starting point for peeling. This can reduce the difficulty of peeling the first substrate layer 31 and the second substrate layer 32 from the first adhesive layer 1 and the second adhesive layer 2.

[0114] In some embodiments, the minimum distance by which the edge of the second substrate layer 32 protrudes from the edge of the first adhesive layer is less than or equal to 0.2 mm.

[0115] It should be noted that, referring to Figure 10One side of the first adhesive layer is close to the second adhesive layer, and the other three sides of the first adhesive layer 1 are close to the edge of the second substrate layer 32. The distances between the three sides of the first adhesive layer and the edge of the second substrate layer 32 are W1, W2, and W3, respectively. The values ​​of W1, W2, and W3 can be equal or unequal. When the values ​​of W1, W2, and W3 are unequal, the minimum value among W1, W2, and W3 can be less than or equal to 0.2 mm.

[0116] For example, the minimum value among W1, W2, and W3 can be 0.05mm, 0.08mm, 0.09mm, 0.11mm, 0.13mm, 0.15mm, 0.17mm, 0.19mm, or 0.2mm.

[0117] Setting the minimum distance from the edge of the second substrate layer 32 to the edge of the first adhesive layer 1 to less than or equal to 0.2 mm can limit the size of the protrusion of the edge of the second substrate layer 32 from the edge of the first adhesive layer 1, thereby reducing the space occupied by the second substrate layer 32 and facilitating the transportation of the membrane assembly.

[0118] In some embodiments, the minimum distance by which the edge of the second substrate layer 32 protrudes from the edge of the second adhesive layer 2 is less than or equal to 0.2 mm.

[0119] It should be noted that, referring to Figure 10 One side of the second adhesive layer 2 is close to the first adhesive layer, and the other three sides of the second adhesive layer 2 are close to the edge of the second substrate layer 32. The distances between the three sides of the second adhesive layer 2 and the edge of the second substrate layer 32 are W4, W5, and W6, respectively. The values ​​of W4, W5, and W6 can be equal or unequal. When the values ​​of W4, W5, and W6 are unequal, the minimum value among W4, W5, and W6 can be less than or equal to 0.2 mm.

[0120] For example, the minimum value among W4, W5, and W6 can be 0.05mm, 0.08mm, 0.09mm, 0.11mm, 0.13mm, 0.15mm, 0.17mm, 0.19mm, or 0.2mm.

[0121] Setting the minimum distance from the edge of the second substrate layer 32 protruding from the edge of the second adhesive layer 2 to less than or equal to 0.2 mm can limit the size of the protrusion of the edge of the second substrate layer 32 from the edge of the second adhesive layer 2, thereby reducing the space occupied by the second substrate layer 32 and facilitating the transportation of the membrane assembly.

[0122] Reference Figures 7 to 9In some embodiments, the edges of the first adhesive layer 1 and the second adhesive layer 2 are spaced apart along a direction parallel to the first substrate layer 31. It is understood that after the bending area 300 of the display substrate 100 is bent, the bending radius on the outer side of the bending area 300 will be larger than the bending radius on the inner side. Thus, the distance between the bent area 300 and the display area 200 in the thickness direction may vary. By spaced apart the edges of the first adhesive layer 1 and the second adhesive layer 2, after the first adhesive layer 1 and the second adhesive layer 2 are adhered to the display substrate 100, they do not need to form contact. Therefore, even if the distance between the bent area 300 and the display area 200 in the thickness direction may vary after the bending area 300 is bent, the first adhesive layer 1 and the second adhesive layer 2 do not need to be pulled apart, thereby reducing the deformation caused by pulling between the first adhesive layer 1 and the second adhesive layer 2 and helping to improve the protective effect of the second adhesive layer 2 on the bending area 300 of the display substrate 100.

[0123] Reference Figure 11 In other embodiments, along the direction parallel to the first substrate layer 31, the edge of the first adhesive layer 1 can be connected to the edge of the second adhesive layer 2. By connecting the edges of the first adhesive layer 1 and the second adhesive layer 2, the positioning difficulty of the first adhesive layer 1 and the second adhesive layer 2 can be reduced, thereby reducing the manufacturing difficulty of the film assembly; in this case, the film assembly can be applied to display devices with a small bending amplitude in the bending area 300.

[0124] Reference Figure 9In this embodiment, the first adhesive layer 1 and the second adhesive layer 2 are spaced apart, and the distance between the first adhesive layer 1 and the second adhesive layer 2 is d3, 0.08mm≤d3≤0.17mm. By setting the distance between the first adhesive layer 1 and the second adhesive layer 2 to be not less than 0.08mm, the probability of accidental adhesion between the first adhesive layer 1 and the second adhesive layer 2 during the transfer of the film assembly can be reduced, and the difficulty of adhering the first adhesive layer 1 and the second adhesive layer 2 to the display substrate can be reduced, reducing the probability of adhesion between the first adhesive layer 1 and the second adhesive layer 2 during the bonding process. This ensures that after the first adhesive layer 1 and the second adhesive layer 2 are adhered to the display substrate 100, they do not form contact. Thus, even if the bending area 300 is bent, the bending area 30... The distance between the edge of the display area 200 and the edge of the display area 200 changes, and the first adhesive layer 1 and the second adhesive layer 2 can be separated without pulling, thereby reducing the deformation caused by pulling between the first adhesive layer 1 and the second adhesive layer 2. In addition, it can reduce the positioning difficulty when the first adhesive layer 1 and the second adhesive layer 2 are attached to the display substrate 100, which helps to improve assembly efficiency. Setting the interval between the first adhesive layer 1 and the second adhesive layer 2 to be no greater than 0.17mm can help the display substrate 100 to reduce the distance between the display area 200 and the bending area 300, thereby helping to design a narrow bezel for the display device.

[0125] In some embodiments, the spacing d3 between the first adhesive layer 1 and the second adhesive layer 2 can be 0.08mm, 0.09mm, 0.10mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm, 0.16mm, or 0.17mm.

[0126] In some embodiments, the size of the second adhesion layer 2 may be slightly larger than the size of the bending region 300, see reference. Figure 2 The size of the bending area 300 can be H1, and the size of the second adhesive layer 2 can be H2, where H2 > H1. This reduces the control precision of the film assembly during the bonding process with the display substrate 100.

[0127] In some embodiments, H2-H1 = ΔH, ΔH ≥ 0.15mm. For example, the value of ΔH can be 0.15mm, 0.151mm, 0.152mm, 0.153mm, etc.

[0128] In some embodiments, the material of the first adhesive layer 1 can be optically clear adhesive (OCA), optically clear resin (OCR), etc. The second adhesive layer 2 can be formed by adhesive curing or pre-curing. The adhesive can be a thermosetting adhesive, a light-curing adhesive, or a moisture-curing adhesive. When using a thermosetting adhesive, the curing temperature can be lowered or the curing time shortened for pre-curing. When using a light-curing adhesive, the curing light intensity can be lowered or the curing time shortened. When using a moisture-curing adhesive, the moisture concentration can be lowered or the curing time shortened. For example, thermosetting adhesives can be epoxy resins, polyester resins, vinyl esters, bismaleimides, thermosetting polyimides, cyanate esters, etc.; UV-curing adhesives can be acrylate adhesives, ultraviolet (UV) curing adhesives, etc.; moisture-curing adhesives can be cyanoacrylate adhesives, moisture-curing reactive polyurethane hot melt adhesives (PUR), etc.

[0129] Reference Figures 12 to 15 This application also provides a method for preparing a membrane module, comprising the following steps:

[0130] S100, providing a first substrate layer 31;

[0131] S200, a first adhesive material layer 10 and a process protection layer 6 are sequentially formed on the first substrate layer 31;

[0132] S300: A first through hole 11 is provided on the first adhesive material layer 10 to form the first adhesive layer 1, and a second through hole 61 is provided on the process protection layer 6, wherein the first through hole 11 and the second through hole 61 are connected.

[0133] S400, A second adhesive material layer 20 is provided in the first through hole 11, and a first insulating material layer 41 is provided on the side of the second adhesive material layer 20 away from the first substrate layer 31. The second adhesive material layer 20 is used to form the second adhesive layer 2; the first insulating material layer 41 is used to form the first insulating layer 4.

[0134] S500, removal process protective layer 6;

[0135] S600, cover the second substrate layer 32 on the first adhesive layer 1 and the second adhesive layer 2 to form a film assembly.

[0136] It should be noted that in some embodiments, the second adhesive material layer 20 can be formed by directly applying adhesive to the first substrate layer 31. For example, after applying adhesive to the first substrate layer 31, it can be pre-cured. Pre-curing refers to reducing the curing environmental conditions or shortening the curing time, so that the formed second adhesive material layer 20 has a certain shape and is flexible and viscous. In some embodiments, the adhesive can be a thermosetting adhesive, a light-curing adhesive, or a moisture-curing adhesive. When using a thermosetting adhesive, the curing temperature can be lowered or the curing time can be shortened for pre-curing. When using a light-curing adhesive, the curing light intensity can be lowered or the curing time can be shortened. When using a moisture-curing adhesive, the moisture concentration can be lowered or the curing time can be shortened. For example, thermosetting adhesives can be epoxy resins, polyester resins, vinyl esters, bismaleimides, thermosetting polyimides, cyanate esters, etc.; UV-curing adhesives can be acrylate adhesives, ultraviolet (UV) curing adhesives, etc.; moisture-curing adhesives can be cyanoacrylate adhesives, moisture-curing reactive polyurethane hot melt adhesives (PUR), etc.; in other embodiments, the adhesive can be pre-cured elsewhere to initially form the second adhesive material layer 20, and then the initially formed second adhesive material layer 20 can be transferred to the first substrate layer 31, thereby forming the second adhesive material layer 20 on the first substrate layer 31.

[0137] It should be noted that the first adhesive material layer 10 may include a portion forming the first adhesive layer 1 and a portion forming other than the first adhesive layer 1, wherein the portion forming other than the first adhesive layer 1 may be cut off during the preparation process.

[0138] It should be noted that the second adhesive material layer 20 may include a portion forming the second adhesive layer 2 and a portion other than forming the second adhesive layer 2, wherein the portion other than forming the second adhesive layer 2 may be cut off during the preparation process. In some embodiments, the second adhesive material layer 20 may be cut so that the formed second adhesive layer 2 can be separated from the first adhesive layer 1 at a distance; in other embodiments, the formed second adhesive layer 2 may be connected to the first adhesive layer 1.

[0139] It should be noted that the first insulating material layer 41 may include the portion forming the first insulating layer 4 and the portion not forming the first insulating layer 4, wherein the portion not forming the first insulating layer 4 may be cut off during the manufacturing process.

[0140] It should be noted that a cutting tool can be used to cut the process protective layer 6 and the first adhesive material layer 10 to create the second through hole 61 and the first through hole 11. The cutting tool can cut from the side of the process protective layer 6 away from the first adhesive material layer 10 and pass through the process protective layer 6 and the first adhesive material layer 10 in sequence. After removing the excess material, the second through hole 61 and the first through hole 11 can be created. In this way, the walls of the second through hole 61 and the first through hole 11 can be flush.

[0141] It should be noted that when the first through hole 11 is opened in the first adhesive material layer 10, the cutting depth of the cutting tool can be controlled to reduce the damage of the cutting tool to the first substrate layer 31, thereby reducing the probability of the first substrate layer 31 being cut by the cutting tool and thus reducing the risk of the substrate layer being cut off.

[0142] It should be noted that in some embodiments, the thickness of the second adhesive material layer 20 may not be greater than the thickness of the first adhesive material layer 10. In this way, the second adhesive material layer 20 may not enter the second through hole 61 of the process protection layer 6, and the second adhesive material layer 20 will not adhere to the process protection layer 6. This can reduce the difficulty of peeling off the process protection layer 6.

[0143] By forming a first adhesive material layer 10 and a second adhesive material layer 20 on the first substrate layer 31, the first adhesive material layer 10 is used to form the first adhesive layer, and the second adhesive material layer 20 is used to form the second adhesive layer. This allows the distance between the second adhesive layer 2 and the first adhesive layer 1 to be designed during the film assembly processing, ensuring that the distance between the first adhesive layer 1 and the second adhesive layer 2 of the formed film assembly is suitable for the corresponding display substrate 100. During the film assembly fabrication process, a process protection layer 6 is covered on the first adhesive material layer 10. The process protection layer 6 can protect the first adhesive material layer 10 from external contaminants. The material layer 10 forms a protective layer, thereby reducing damage to the first adhesive material layer 10 by the cutting tool during the cutting process. A second through hole 61 is opened in the process protection layer 6, and the second through hole 61 communicates with the first through hole 11, so that the second adhesive material layer 20 can be conveniently placed in the first through hole 11. After the process protection layer 6 is removed, a second substrate layer 32 is covered on the first adhesive layer 1 and the second adhesive layer 2. The first substrate layer 31 and the second substrate layer 32 can protect the first adhesive layer 1 and the second adhesive layer 2 from both sides, reducing the damage to the first adhesive layer 1 and the second adhesive layer 2 during the transfer of the membrane assembly.

[0144] In some embodiments, the membrane module preparation method provided in this application can be used to process the membrane module in any of the above embodiments. Thus, the first adhesion layer 1 of the membrane module manufactured by the membrane module preparation method provided in this application is the first adhesion layer 1 in any of the above embodiments, the second adhesion layer 2 of the membrane module manufactured by the membrane module preparation method provided in this application is the second adhesion layer 2 in any of the above embodiments, and the first substrate layer 31 and the second substrate layer 32 of the membrane module manufactured by the membrane module preparation method provided in this application can be the first substrate layer 31 and the second substrate layer 32 of the membrane module in any of the above embodiments.

[0145] In some embodiments, the second adhesive material layer 20 can be formed by directly applying adhesive to the first substrate layer 31, see reference. Figure 16 The first through-hole 11 and the substrate layer enclose to form a first groove 12. During the process of applying adhesive in the first groove 12, the hole wall of the first through-hole 11 acts as a dam, which can limit the flow range of the adhesive, so that the adhesive will not flow outside the first groove 12 during the application process. This helps to form a second adhesive material layer 20 with uniform thickness, thereby obtaining a second adhesive layer 2 with uniform thickness. In addition, the overall thickness of the second adhesive material layer 20 is uniform, which can reduce the proportion of the second adhesive material layer 20 that is cut off. This can reduce the amount of adhesive used during the molding of the second adhesive layer 2, and help to reduce the cost of the second adhesive layer 2. Cutting the first adhesive material layer 10 can remove the excess part of the first adhesive material layer 10, so that after the second adhesive layer 2 and the first adhesive layer 1 of the film assembly are bonded to the display substrate 100, the second adhesive layer 2 and the first adhesive layer 1 can be correspondingly bonded to the display area 200 and the bending area 300.

[0146] The second adhesive material layer 20 is formed by applying adhesive to the first substrate layer 31. The second adhesive material layer 20 is then cut and shaped to obtain the second adhesive layer 2. Thus, the second adhesive material layer 20 includes the second adhesive layer 2 and a portion located around the second adhesive layer 2. That is, the second adhesive layer 2 is part of the second adhesive material layer 20 before cutting, while the portion located around the second adhesive layer 2 is the part of the second adhesive material layer 20 that needs to be cut off. By cutting the second adhesive material layer 20, the outline of the layer can be shaped, thereby removing the excess part of the layer and obtaining the second adhesive layer 2 with uniform thickness and consistent performance in each area. Applying adhesive directly to the first substrate layer 31 means that the second adhesive layer 2 can be formed directly on the first substrate layer 31. This reduces the transfer of the second adhesive layer 2 during the processing of the membrane module and helps to improve the production efficiency of the membrane module.

[0147] In some embodiments, the thickness of the second adhesive material layer 20 can be less than the thickness of the first adhesive material layer 10, so that the first insulating layer 4 can be disposed in the first groove 12. That is, when the first insulating layer 4 covers the second adhesive material layer 20, the first insulating layer 4 will not extend into the second through hole 61. In this way, the risk of accidentally peeling off the first insulating layer 4 during the peeling process of the protective layer 6 can be reduced.

[0148] Reference Figure 17 In some embodiments, the second adhesive material layer 20 in S400 is used to form the second adhesive layer 2; the first insulating material layer 41 is used to form the first insulating layer 4, including the following steps:

[0149] At least the portion of the second adhesive material layer 20 and the first insulating material layer 41 facing the first adhesive material layer 10 is removed to form a second adhesive layer 2 and a first insulating layer 4 spaced apart from the first adhesive material layer 10.

[0150] Removing the portion of the second adhesive material layer 20 and the first insulating material layer 41 facing the first adhesive material layer 10 allows the formed second adhesive layer and the first insulating layer 4 to be spaced apart from the first adhesive layer 1. After the first adhesive layer 1 and the second adhesive layer 2 are adhered to the display substrate 100, they do not need to make contact. Thus, even if the distance between the bent area 300 and the display area 200 may be different at different points in the thickness direction after the bent area 300 is bent, the first adhesive layer 1 and the second adhesive layer 2 do not need to be pulled, thereby reducing the deformation caused by the pulling between the first adhesive layer 1 and the second adhesive layer 2 and helping to improve the protective effect of the second adhesive layer 2 on the bent area 300 of the display substrate 100.

[0151] Reference Figure 18 In some embodiments, the second adhesive material layer 20 in S400 is used to form the second adhesive layer 2; the step of the first insulating material layer 41 forming the first insulating layer 4 further includes:

[0152] The portion of the first adhesive material layer 10 facing the second adhesive layer 2 and the first barrier layer 4 is removed to form a first adhesive layer 1 spaced apart from the second adhesive layer 2 and the first barrier layer 4.

[0153] Removing the portion of the first adhesive material layer 10 facing the second adhesive layer 2 and the first insulating layer 4 can shape the edge of the first adhesive layer 1 and control the distance between the first adhesive layer 1 and the second adhesive layer 2 after molding. This allows the first adhesive layer 1 and the second adhesive layer 2 to adhere to the display substrate 100 without forming contact between them. Thus, even if the distance between the bent area 300 and the display area 200 may vary in the thickness direction after bending, the first adhesive layer 1 and the second adhesive layer 2 will not be pulled apart. This reduces the deformation caused by the pulling between the first adhesive layer 1 and the second adhesive layer 2, and helps to improve the protective effect of the second adhesive layer 2 on the bent area 300 of the display substrate 100.

[0154] Reference Figure 19 In some embodiments, the cutting blade for cutting the second adhesive material layer 20 and the first adhesive material layer 10 can be positioned at line a in the figure. This allows the cutting operation to remove excess portions from the edges of the second adhesive material layer 20 and the first adhesive material layer 10, and the first adhesive layer 1 and the second adhesive layer 2 of the resulting membrane assembly are connected. In other embodiments, the cutting blade can be positioned at lines a, b, and c in the figure. This allows the cutting operation to not only remove excess portions from the edges of the second adhesive material layer 20 and the first adhesive material layer 10, but also... The portion where the second adhesive material layer 20 and the first adhesive material layer 10 are adhered can also be removed, so that the first adhesive layer 1 and the second adhesive layer 2 are spaced apart; in some embodiments, the cutting tool can also be set on lines a, b, c and d in the figure, so that the cutting operation can not only remove the excess portion at the edge of the second adhesive material layer 20 and the first adhesive material layer 10, and remove the portion where the second adhesive material layer 20 and the first adhesive layer 10 are adhered, but also remove the excess portion on the side of the first adhesive material layer 10 away from the second adhesive material layer 20.

[0155] In some embodiments, the cutting accuracy can be controlled within ±0.05 mm, and the process capability index (CPK) can be 1.33.

[0156] Reference Figure 20 In some embodiments, S200 includes:

[0157] A first adhesive material layer 10 is formed on the first substrate layer 31, a polarizing material layer is formed on the side of the first adhesive material layer 10 away from the first substrate layer 31, and a process protection layer is formed on the side of the polarizing material layer away from the first substrate layer 31.

[0158] A third through hole is formed on the polarizing material layer to form a polarizer 5. The third through hole is connected to the first through hole and the second through hole.

[0159] A polarizing material layer is disposed on the first adhesive material layer 10. The polarizing material layer can form a polarizer 5. The polarizer 5 can filter and regulate the light from the backlight source, causing it to propagate in a specific direction, illuminating the liquid crystal molecules and forming a clear image. In addition, the polarizer 5 can also improve the contrast and color reproduction of the liquid crystal display, making the display effect more realistic and natural.

[0160] Reference Figure 21 In this embodiment, the second adhesive material layer 20 in S400 is used to form the second adhesive layer; the first insulating material layer 41 is used to form the first insulating layer, including the following steps:

[0161] At least the portion of the second adhesive material layer 20 and the first insulating material layer 41 facing the first adhesive material layer 10 is removed to form a second adhesive layer and a first insulating layer spaced apart from the first adhesive material layer 10 and the polarizing material layer.

[0162] Removing the portion of the second adhesive material layer 20 and the first insulating material layer 41 facing the first adhesive material layer 10 allows the formed second adhesive layer and the first insulating layer to be spaced apart from the first adhesive layer 1 and the polarizer 5. After the first adhesive layer 1 and the second adhesive layer 2 are adhered to the display substrate 100, the first adhesive layer 1 and the polarizer 5 do not need to make contact with the second adhesive layer 2. Thus, even if the distance between the bent area 300 and the display area 200 may be different at various points in the thickness direction after the bent area 300 is bent, the first adhesive layer 1 and the polarizer 5 do not need to be pulled with the second adhesive layer 2. This reduces the deformation caused by the pull between the first adhesive layer 1 and the polarizer 5 and the second adhesive layer 2, and helps to improve the protective effect of the second adhesive layer 2 on the bent area 300 of the display substrate 100.

[0163] Reference Figure 22 In this embodiment, the second adhesive material layer 20 in S400 is used to form the second adhesive layer 2; the step of the first insulating material layer 41 being used to form the first insulating layer 4 may further include:

[0164] The portion of the first adhesive material layer 10 facing the second adhesive layer 2 and the first insulating layer 4 is removed, and the portion of the polarizing material layer facing the second adhesive layer 2 and the first insulating layer 4 is removed, so as to form the first adhesive layer 1 and the polarizer 5, which are spaced apart from the second adhesive layer 2 and the first insulating layer 4.

[0165] Removing the portion of the first adhesive material layer 10 facing the second adhesive layer 2 and the first insulating layer 4, and removing the portion of the polarizing material layer facing the second adhesive layer 2 and the first insulating layer 4, can shape the edges of the first adhesive layer 2 and the polarizer 5. It also allows control over the distance between the formed first adhesive layer 1 and the polarizer 5 and the second adhesive layer 2, ensuring that after the first adhesive layer 1 and the second adhesive layer 2 are adhered to the display substrate 100, they do not form contact with each other. Thus, even if the distance between the bent area 300 and the display area 200 varies in the thickness direction after bending, the first adhesive layer 1 and the polarizer 5 do not pull against the second adhesive layer 2. This reduces deformation caused by pulling between the first adhesive layer 1 and the polarizer 5 and the second adhesive layer 2, improving the protective effect of the second adhesive layer 2 on the bent area 300 of the display substrate 100.

[0166] In some embodiments, the membrane module may be processed according to the following steps:

[0167] S10, Provide a first substrate layer 31;

[0168] S20, Form the first adhesive material layer 10 on the first substrate layer 31;

[0169] S30, covering process protective layer 6 opposite to the first adhesive material layer 10;

[0170] S40. A second through hole 61 is opened in the process protection layer 6, and a first through hole 11 is opened in the first adhesive material layer 10, so that the first through hole 11 and the substrate layer surround each other to form a first groove 12, and the second through hole 61 communicates with the first groove 12.

[0171] S50. Apply adhesive to the first groove 12 to form the second adhesive material layer 20;

[0172] S60, A first insulating layer 4 is provided on the second adhesive material layer 20;

[0173] S70. Cut the first insulating layer 4, the process protection layer 6, the second adhesive material layer 20 and the first adhesive material layer 10. After cutting the second adhesive material layer 20, the second adhesive layer 2 is formed, and after cutting the first adhesive material layer 10, the first adhesive layer 1 is formed.

[0174] S80, peeling process protective layer 6;

[0175] S90, cover the second substrate layer 32 on the second adhesive layer 2 and the first adhesive layer 1 to form a film assembly.

[0176] In some embodiments, after S80, the following may also be included:

[0177] The edges of the membrane module are trimmed.

[0178] By trimming the edges of the membrane module, it can be shaped so that its size can be adapted to the display device.

[0179] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A membrane module, characterized in that, It includes a first adhesive layer, a second adhesive layer, a first substrate layer, and a second substrate layer. The first adhesive layer and the second adhesive layer are disposed between the first substrate layer and the second substrate layer, and the first adhesive layer and the second adhesive layer are arranged side by side along a direction parallel to the first substrate layer. The membrane assembly further includes a first insulating layer, and the first insulating layer is disposed between the second adhesive layer and the second substrate layer, wherein the first insulating layer and the second substrate layer are non-adhesively bonded.

2. The membrane module as described in claim 1, characterized in that, The thickness of the first insulating layer is d1, and the thickness of the second adhesive layer is d2, where d1 ≤ 0.

2. d2.

3. The membrane module as described in claim 2, characterized in that, The orthographic projection of the first insulating layer in the thickness direction at least partially overlaps with the orthographic projection of the second adhesive layer in the thickness direction.

4. The membrane module as described in claim 2, characterized in that, The orthographic projection of the first insulating layer in the thickness direction overlaps with the orthographic projection of the second adhesive layer in the thickness direction.

5. The membrane module according to any one of claims 1-4, characterized in that, The film assembly further includes a polarizer, which is disposed between the first adhesion layer and the second substrate layer.

6. The membrane module according to any one of claims 1-4, characterized in that, The orthographic projection of the first adhesive layer in the thickness direction lies within the orthographic projection of the second substrate layer in the thickness direction, and the edge of the second substrate layer protrudes from the edge of the first adhesive layer; and / or, The orthographic projection of the second adhesive layer in the thickness direction lies within the orthographic projection of the second substrate layer in the thickness direction, and the edge of the second substrate layer protrudes from the edge of the second adhesive layer.

7. The membrane module as claimed in claim 6, characterized in that, The minimum distance by which the edge of the second substrate layer protrudes from the edge of the first adhesive layer is less than or equal to 0.2 mm; and / or, The minimum distance by which the edge of the second substrate layer protrudes from the edge of the second adhesive layer is less than or equal to 0.2 mm.

8. The membrane module according to any one of claims 1-4, characterized in that, The first adhesive layer and the second adhesive layer are spaced apart along a direction parallel to the first substrate layer.

9. The membrane module as claimed in claim 8, characterized in that, The distance between the first adhesive layer and the second adhesive layer is d3, where 0.08mm≤d3≤0.17mm.

10. The membrane module according to any one of claims 1-4, characterized in that, Along a direction parallel to the first substrate layer, the first adhesive layer and the second adhesive layer are connected.

11. A method for preparing a membrane module, characterized in that, Includes the following steps: Provide a first substrate layer; A first adhesive material layer and a process protection layer are sequentially formed on the first substrate layer; A first through hole is formed on the first adhesive material layer to form the first adhesive layer, and a second through hole is formed on the process protection layer, wherein the first through hole and the second through hole are connected. A second adhesive material layer is disposed within the first through hole, and a first insulating material layer is disposed on the side of the second adhesive material layer away from the first substrate layer. The second adhesive material layer is used to form the second adhesive layer; the first insulating material layer is used to form the first insulating layer. Remove the process protective layer; A second substrate layer is covered on the first and second adhesive layers to form the membrane assembly.

12. The preparation method according to claim 11, characterized in that, The second adhesive material layer is used to form the second adhesive layer; The steps for forming the first insulating layer using the first insulating material layer include: At least a portion of the second adhesive material layer and the first barrier material layer facing the first adhesive material layer is removed to form a second adhesive layer and a first barrier layer spaced apart from the first adhesive material layer.

13. The preparation method according to claim 12, characterized in that, Also includes: The portion of the first adhesive material layer facing the second adhesive layer and the first barrier layer is removed to form the first adhesive layer spaced apart from the second adhesive layer and the first barrier layer.

14. The preparation method according to claim 11, characterized in that, The step of sequentially forming a first adhesive material layer and a process protection layer on the first substrate layer includes: The first adhesive material layer is formed on the first substrate layer, a polarizing material layer is formed on the side of the first adhesive material layer away from the first substrate layer, and the process protection layer is formed on the side of the polarizing material layer away from the first substrate layer. It also includes: forming a third through hole on the polarizing material layer to form a polarizer, wherein the third through hole is connected to the first through hole and the second through hole.

15. The preparation method according to claim 14, characterized in that, The second adhesive material layer is used to form the second adhesive layer; The steps for forming the first insulating layer using the first insulating material layer include: At least a portion of the second adhesive material layer and the first insulating material layer facing the first adhesive material layer is removed to form a second adhesive layer and a first insulating layer spaced apart from the first adhesive material layer and the polarizing material layer.

16. The preparation method according to claim 15, characterized in that, Also includes: The portion of the first adhesive material layer facing the second adhesive layer and the first insulating layer is removed, and the portion of the polarizing material layer facing the second adhesive layer and the first insulating layer is removed, to form the first adhesive layer and the polarizer spaced apart from the second adhesive layer and the first insulating layer.

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