High-temperature aging monitoring method, device and system

Abstract

The invention provides a high-temperature aging monitoring method, device, equipment and system, and the method comprises the steps: configuring the output voltage of a power module based on the input voltage of a to-be-tested product after the information of the to-be-tested product is obtained, and obtaining the operation data of the to-be-tested product in a high-temperature aging test process in real time, and performing fault early warning analysis on the to-be-tested product based on the operation data, outputting early warning information based on a fault early warning analysis result, generating a test report based on the operation data when detecting that the high-temperature aging test of the to-be-tested product is finished, and at the moment, sending the test report to the to-be-tested product. The change condition of the operation data of the to-be-tested product in the high-temperature aging test process can be judged based on the test report, so that the to-be-tested product can be evaluated more accurately.

Description

Technical Field

[0001] The present invention relates to the technical field of equipment monitoring, and in particular to a high-temperature aging monitoring method, device, equipment and system. Background Art

[0002] High temperature aging test is an important process in product production testing, that is, the product is continuously operated for 72 hours in an environment of 50±2℃. During the high temperature aging test, the product needs to be powered, load simulated and communicated, that is, the product output information is collected and monitored in real time when the product is powered on and equipped with load.

[0003] After the high temperature aging test is completed, it is necessary to evaluate the performance of the product after the test. This evaluation method is difficult to detect the changes in the product's operating data during the high temperature aging test, and thus it is impossible to make a reasonable evaluation of the product. Summary of the invention

[0004] In view of this, the embodiments of the present invention provide a high temperature aging monitoring method, device, equipment and system to obtain the operating data of the product to be tested during the high temperature aging test, thereby providing more accurate evaluation data for the evaluation of the product to be tested.

[0005] To achieve the above objectives, the embodiments of the present invention provide the following technical solutions:

[0006] A high temperature aging monitoring method, comprising:

[0007] Acquire product information of the product to be tested, wherein the product information at least includes input voltage configuration, product code, and product type of the product to be tested;

[0008] Generate a voltage control instruction based on the input voltage configuration of the product to be tested, the voltage control instruction is used to control a power supply module to output a voltage signal matching the input voltage configuration of the product to be tested, the power supply module being the power supply of the product to be tested;

[0009] Real-time acquisition of operating data of the product under test during the high-temperature aging test;

[0010] Performing a fault warning analysis on the product to be tested based on the operating data, and outputting warning information based on the fault warning analysis result;

[0011] When it is detected that the high temperature aging test of the product to be tested is finished, a test report is generated based on the operation data.

[0012] Optionally, in the above-mentioned high temperature aging monitoring method, performing a fault early warning analysis on the product to be tested based on the operating data includes:

[0013] Acquiring target analysis data from the operation data;

[0014] Constructing an actual operation curve of the target analysis data based on the target analysis data acquired at different times;

[0015] Obtaining a standard operating curve of the target analysis data;

[0016] Based on the comparison result between the actual operation curve and the standard operation curve, it is determined whether to output warning information matching the target operation data.

[0017] Optionally, in the above-mentioned high temperature aging monitoring method, before obtaining the operation data of the product to be tested in real time during the high temperature aging test, the method further includes:

[0018] Acquire high temperature aging process configuration information, wherein the high temperature aging process configuration information at least includes: high temperature aging test duration, test cycle configuration, and simulated load configuration;

[0019] After obtaining the product information, the high temperature aging monitoring method is also used to:

[0020] Generate a control instruction for controlling the power module to be turned on and off based on the high temperature aging test duration and the test cycle configuration;

[0021] A load control instruction for controlling the load size is generated based on the load module configuration, and the load module provides a corresponding load to the product under test based on the load control instruction.

[0022] Optionally, in the above-mentioned high temperature aging monitoring method, the high temperature aging process configuration information also includes an ambient temperature configuration;

[0023] The high temperature aging monitoring method is also used to control the ambient temperature in the high temperature box where the product to be tested is located based on the ambient temperature configuration.

[0024] Optionally, in the above-mentioned high temperature aging monitoring method, the high temperature aging process configuration is configured with N high temperature aging process configuration strategies to be executed, wherein N is a positive integer not less than 1, and each high temperature aging process configuration strategy to be executed is configured with high temperature aging test duration, test cycle configuration, simulated load configuration and ambient temperature configuration;

[0025] Before obtaining the operating data of the product under test during the high-temperature aging test in real time, the high-temperature aging monitoring method further includes:

[0026] The N to-be-executed high-temperature aging process configuration strategies are traversed in sequence, and the traversed to-be-executed high-temperature aging process configuration strategies are used as the high-temperature aging process configuration strategies that need to be currently executed.

[0027] Optionally, in the above-mentioned high temperature aging monitoring method, obtaining high temperature aging process configuration information includes:

[0028] Acquiring high temperature aging process configuration information from the product information of the product to be tested;

[0029] Or, obtain high temperature aging configuration information that matches the product code and product type in the product information.

[0030] Optionally, in the above-mentioned high temperature aging monitoring method, after performing fault warning analysis on the product to be tested based on the operation data, the method further includes:

[0031] Based on the analysis result of the fault warning analysis, determining whether the product to be tested has a target fault;

[0032] When a target fault occurs, a control instruction for controlling the power module to power off is generated, and fault information is sent to the target terminal.

[0033] A high temperature aging monitoring device, comprising:

[0034] A parameter acquisition unit, used to obtain product information of the product to be tested, wherein the product information at least includes an input voltage configuration, a product code, and a product type of the product to be tested;

[0035] A control unit, configured to generate a voltage control instruction based on an input voltage configuration of the product to be tested, wherein the voltage control instruction is used to control a power supply module to output a voltage signal matching the input voltage configuration of the product to be tested, and the power supply module is a power supply for the product to be tested;

[0036] An operation data acquisition unit is used to obtain the operation data of the product to be tested during the high temperature aging test in real time;

[0037] An early warning unit, configured to perform a fault early warning analysis on the product to be tested based on the operation data, and output early warning information based on the fault early warning analysis result;

[0038] The report generating unit is used to generate a test report based on the operation data when it is detected that the high temperature aging test of the product to be tested is completed.

[0039] A high temperature aging monitoring device, comprising: a memory and a processor;

[0040] The memory is used to store programs;

[0041] The processor is used to execute the program to implement each step of any of the above-mentioned high-temperature aging monitoring methods.

[0042] A high temperature aging monitoring system, comprising:

[0043] The above-mentioned high temperature aging monitoring equipment;

[0044] A power module and a load module connected to the high temperature aging monitoring device.

[0045] Based on the above technical scheme, the above scheme provided by the embodiment of the present invention, after obtaining the product information of the product to be tested, configures the output voltage of the power module based on the input voltage of the product to be tested, and obtains the operating data of the product to be tested during the high-temperature aging test in real time, performs fault warning analysis on the product to be tested based on the operating data, and outputs warning information based on the fault warning analysis result, and generates a test report based on the operating data when it is detected that the high-temperature aging test of the product to be tested is completed. At this time, the changes in the operating data of the product to be tested during the high-temperature aging test can be judged based on the test report, so that the product to be tested can be evaluated more accurately. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0047] Figure 1 A schematic diagram of the process of the high temperature aging monitoring method disclosed in the embodiment of the present application;

[0048] Figure 2 This is a schematic diagram of the structure of the high temperature aging monitoring device disclosed in the embodiment of the present application;

[0049] Figure 3 This is a schematic diagram of the structure of the high temperature aging monitoring device disclosed in the embodiment of the present application;

[0050] Figure 4 This is a schematic diagram of the structure of the high temperature aging monitoring system disclosed in the embodiment of the present application;

[0051] Figure 5 A schematic structural diagram of a high temperature aging monitoring system disclosed in another embodiment of the present application;

[0052] Figure 6 This is a schematic diagram of the communication interface distribution method of the communication module disclosed in the embodiment of the present application. DETAILED DESCRIPTION

[0053] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0054] The present application discloses a high-temperature aging monitoring method, which collects and analyzes the operating data of the tested product in real time and generates a test report during the automated testing of the high-temperature aging process, so as to facilitate the test personnel to understand the operating conditions of the tested product in real time during the high-temperature aging test process.

[0055] See also Figure 1 The high temperature aging monitoring method disclosed in the embodiment of the present application may include:

[0056] Step S101: Acquire product information of the product to be tested, wherein the product information at least includes input voltage configuration, product code, and product type of the product to be tested.

[0057] The product to be tested refers to the product that needs to undergo high temperature aging test. The product information can be obtained by user input or read through the target interface of the product to be tested. In addition to the above-mentioned input voltage configuration, product code, and product type, other items can also be added or deleted as needed.

[0058] Step S102: generating a voltage control instruction based on the input voltage configuration of the product to be tested.

[0059] Different types of products to be tested have different required input currents and current sizes. Therefore, in this step, after obtaining the product information, a voltage control instruction is generated based on the input voltage configuration in the product information, and the voltage control instruction is sent to the power module. When the power module obtains the voltage control instruction, it adjusts the output of the power module based on the voltage control instruction, so that the output voltage of the power module matches the input voltage configuration of the product to be tested, so that the product to be tested is in a stable and standard input voltage environment during the test process.

[0060] Step S103: acquiring the operating data of the product to be tested during the high temperature aging test in real time.

[0061] When the output voltage configuration of the power module is completed, the power module is used to power the product to be tested, and the product to be tested is subjected to a high temperature aging test. The product to be tested is operated with load during the high temperature aging test. At this time, the real-time operation data of the product to be tested can be obtained through a pre-configured interface or through a wireless network. These operation data may include a plurality of pre-configured target state parameters, for example, the current operating state of the CPU, the current operating temperature of the CPU, the state of each communication port, the output signal collection amount, etc. The present application may select the specific contents of the operation data as required. More specifically, during the high temperature aging test of the product to be tested, the type of operation data required to be obtained for different types of products to be tested may be different. Therefore, in this solution, the specific contents of the operation data may be obtained by user input, or may be loaded into the product information and obtained by parsing the product information. Of course, it may also be obtained by looking up the table in the local corresponding list based on the product number and product type. At this time, the mapping relationship between the product to be tested and the specific type of operation data to be collected needs to be pre-stored in the list.

[0062] Step S104: performing a fault warning analysis on the product to be tested based on the operating data, and outputting warning information based on the fault warning analysis result.

[0063] In this step, after the operation data is acquired, target analysis data in the operation data may be extracted, fault warning analysis may be performed based on the target analysis data, and whether warning information needs to be output may be determined based on the warning analysis result.

[0064] The early warning information can prompt the staff to intervene in the high-temperature aging test process to prevent irreversible damage to the product to be tested. In this regard, in this solution, a pre-configured early warning algorithm can be used to perform fault early warning analysis on the product to be tested based on the acquired operating data. In the fault early warning analysis process, by analyzing the operating data output by the product to be tested, it is calculated whether the target analysis data of the product to be tested has an abnormal trend. Specifically, a linear regression algorithm can be used in the fault early warning analysis. At this time, it is necessary to establish a standard operating curve of the target analysis data under the normal operating state of the product to be tested. The process of establishing the standard operating curve of the target analysis data is as follows:

[0065] The independent variable x of the product to be tested is obtained, and the product output parameter is the dependent variable y. The dependent variable y is the target analysis data to be monitored in this application. The determination equation is:

[0066] y=β0+β1x (1)

[0067] β0 and β1 are the relationship coefficients of the two parameters, and the values ​​of β0 and β1 can be obtained through testing. When the product to be tested is operating normally, multiple sets of independent variables x and dependent variables y are collected, x i ,y i (i=1,2,……n) values ​​are taken as sample observation values, where i represents the i-th one, and the values ​​of β0 and β1 are obtained by the least squares method. The calculation formula is as follows:

[0068]

[0069]

[0070]

[0071] Where Q is the residual sum of squares parameter.

[0072] The values ​​of β0 and β1 can be calculated by combining formulas 2, 3, and 4. Substituting the values ​​of β0 and β1 into formula (1) can obtain the relationship between the x and y parameters and the corresponding curve trend.

[0073] Then, the safety threshold of y can be marked based on the relationship between the x and y parameters and the corresponding curve trend. Then, during the testing process of the product to be tested, the target analysis data y0 in the operating data is collected in real time, and the actual operating curve is constructed based on the target analysis data y0 obtained at different times. The standard operating curve of the target analysis data y established in the previous text is obtained, and the distribution curve of y0 is fit to the standard operating curve corresponding to y calculated and obtained by the previous method. If the distribution trend of the actual operating curve is abnormal compared with the trend of the standard operating curve, or the y0 value exceeds the pre-marked safety threshold, the early warning algorithm will output early warning information corresponding to the target analysis data y.

[0074] Step S105: when it is detected that the high temperature aging test of the product to be tested is finished, a test report is generated based on the operation data.

[0075] During the high-temperature aging test of the product to be tested, the operating data of the product to be tested is obtained in real time, and a test report is constructed based on the operating data. The test report may include product information, high-temperature aging test conclusions, and operating data of key time nodes during the test process.

[0076] Furthermore, the test report may also include maintenance suggestions. By extracting key data from the operating data of the product under test during the high-temperature aging test, the changing trend of each key data of the product under test during the test process is obtained, and then according to the numerical range and distribution of the key data, corresponding maintenance suggestions are generated. The maintenance suggestions can be captured based on the numerical range and distribution of the key data as judgment conditions, so that a maintenance plan for the product under test can be obtained.

[0077] It can be seen from the above scheme that the high-temperature aging monitoring method provided by the present application, after obtaining the product information of the product to be tested, configures the output voltage of the power module based on the input voltage of the product to be tested, and obtains the operating data of the product to be tested during the high-temperature aging test in real time, performs fault warning analysis on the product to be tested based on the operating data, and outputs warning information based on the fault warning analysis results, and when it is detected that the high-temperature aging test of the product to be tested is completed, generates a test report based on the operating data. At this time, the changes in the operating data of the product to be tested during the high-temperature aging test can be judged based on the test report, so that the product to be tested can be evaluated more accurately.

[0078] In the technical solution disclosed in this embodiment, different types of products to be tested have different test conditions during the high-temperature aging test. In order to facilitate the automatic configuration of the high-temperature test environment, thereby freeing up more human resources and improving test efficiency, in this solution, before obtaining the operating data of the product to be tested during the high-temperature aging test in real time, high-temperature aging process configuration information can also be obtained. The high-temperature aging process configuration information can be obtained from the product information of the product to be tested, or, based on the mapping relationship between the product code and product type in the product information and the high-temperature aging configuration information, the high-temperature aging configuration information that matches it is directly determined based on the product code and product type in the product information.

[0079] The high temperature aging process configuration information at least includes: high temperature aging test duration, test cycle configuration, and simulated load configuration, wherein the high temperature aging test duration is the duration of the entire high temperature aging test process, and the test cycle configuration refers to the number of cycles of the high temperature aging test. Each high temperature aging test is a cycle. In the actual test process, the test cycle configuration can be set to N, which indicates that the product to be tested needs to cycle N high temperature aging tests, and the duration of each high temperature aging test is the high temperature aging test duration. The simulated load configuration refers to the configuration information of the load module, and the load module is used to simulate the load of the product to be tested. The load provided by the load module box to the product to be tested can be configured through the simulated load configuration, so that the product to be tested is subjected to a high temperature aging test under the same load environment. The above-mentioned high temperature aging monitoring method, after obtaining the high temperature aging test duration, is also used to generate a control instruction for controlling the power module to be turned on and off based on the high temperature aging test duration and the test cycle configuration, and by controlling the power module to be turned on and off, the duration of the high temperature aging test of the product to be tested is the high temperature aging test duration. After obtaining the test cycle configuration, the high temperature aging monitoring method is also used to configure the number of cycles of the high temperature aging test of the product under test based on the specific value of the test cycle configuration. After obtaining the load module configuration, the high temperature aging monitoring method is also used to configure the load value of the load module based on the specific value of the load module configuration. At this time, the load module provides the corresponding load to the product under test based on the load control instruction. The simulation module can switch the external load value according to the load control instruction to ensure that the product under test is in normal operation. In addition, the simulation module can also switch the external serial communication type according to the product information, such as RS232, RS485 and RS422, so that the load module can communicate reliably with the product under test.

[0080] In addition, considering that different products to be tested may have different corresponding ambient temperatures during the high-temperature aging test, in the above scheme, the high-temperature aging process configuration information may also include the ambient temperature configuration. After obtaining the ambient temperature configuration, the method parses the ambient temperature configuration to obtain the required ambient temperature, and then controls the ambient temperature in the high-temperature box where the product to be tested is located based on the ambient temperature configuration. In this process, the ambient temperature corresponding to the ambient temperature configuration can be obtained, and a temperature control instruction matching the ambient temperature is generated, and the temperature control instruction is sent to the high-temperature box, so that the high-temperature box provides a suitable high-temperature test environment for the product to be tested.

[0081] In this embodiment, in order to better understand the performance of the product to be tested, this solution can also dynamically configure the test environment of the high-temperature aging process. At this time, the above-mentioned high-temperature aging process configuration can be configured with N high-temperature aging process configuration strategies to be executed. These high-temperature aging process configuration strategies are arranged in sequence, and N is a positive integer not less than 1. Each high-temperature aging process configuration strategy to be executed is configured with a high-temperature aging test duration, a test cycle configuration, a simulated load configuration, and an ambient temperature configuration. Before the real-time acquisition of the operating data of the high-temperature aging test process of the product to be tested, the N high-temperature aging process configuration strategies to be executed are traversed in sequence, and the traversed high-temperature aging process configuration strategy to be executed is used as the high-temperature aging process configuration strategy currently required to be executed. The power module, load module and high-temperature box are controlled based on the high-temperature aging test duration, test cycle configuration, simulated load configuration and ambient temperature configuration in the high-temperature aging process configuration strategy.

[0082] In the technical solution disclosed in this embodiment, when the early warning analysis results indicate that the product to be tested is abnormal, this solution can also send the abnormal information of the product to be tested to the terminal device of the tester through the wireless communication module, so that even if the tester is not at the test site, the current status of the product to be tested can be obtained in time and measures can be taken. Specifically, in the above method, after performing a fault early warning analysis on the product to be tested based on the operating data, it also includes: judging whether the product to be tested has a target fault based on the analysis results of the fault early warning analysis; when a target fault occurs, generating a control instruction for controlling the power module to cut off power, and sending fault information to the target terminal. Here, the target fault refers to a fault that requires user intervention, such as a fault that can cause irreversible damage to the product to be tested.

[0083] This embodiment discloses a high temperature aging monitoring device. For the specific working contents of each unit in the device, please refer to the contents of the above method embodiment.

[0084] The high temperature aging monitoring device provided by an embodiment of the present invention is described below. The high temperature aging monitoring device described below and the high temperature aging monitoring method described above can be referred to each other.

[0085] For details, see Figure 2 The high temperature aging monitoring device disclosed in the embodiment of the present application may include:

[0086] The parameter acquisition unit 10 corresponds to step S101 in the above method and is used to obtain product information of the product to be tested, wherein the product information at least includes input voltage configuration, product code, and product type of the product to be tested;

[0087] A control unit 20, which corresponds to step S102 in the above method, is used to generate a voltage control instruction based on the input voltage configuration of the product to be tested, and the voltage control instruction is used to control the power module to output a voltage signal matching the input voltage configuration of the product to be tested, and the power module is the power supply of the product to be tested;

[0088] An operation data acquisition unit 30, which corresponds to step S103 in the above method, and is used to obtain the operation data of the product under test during the high temperature aging test in real time;

[0089] The early warning unit 40 corresponds to step S104 in the above method, and is used to perform a fault early warning analysis on the product to be tested based on the operation data, and output early warning information based on the fault early warning analysis result;

[0090] The report generating unit 50 corresponds to step S105 in the above method, and is used to generate a test report based on the operation data when it is detected that the high temperature aging test of the product to be tested is finished.

[0091] The specific working process of the parameter acquisition unit 10, the control unit 20, the operation data acquisition unit 30, the early warning unit 40 and the report generation unit 50 can be found in the above method embodiment, which will not be described again here.

[0092] Corresponding to the above method, the present application discloses a high temperature aging monitoring device. Figure 3 For the hardware structure diagram of the high temperature aging monitoring device provided by the embodiment of the present invention, see Figure 3 As shown, it may include: at least one processor 100, at least one communication interface 200, at least one memory 300 and at least one communication bus 400;

[0093] In the embodiment of the present invention, the number of the processor 100, the communication interface 200, the memory 300, and the communication bus 400 is at least one, and the processor 100, the communication interface 200, and the memory 300 communicate with each other through the communication bus 400; obviously, Figure 3 The communication connections shown for the processor 100, the communication interface 200, the memory 300, and the communication bus 400 are merely optional;

[0094] Optionally, the communication interface 200 may be an interface of a communication module, such as an interface of a GSM module;

[0095] The processor 100 may be a central processing unit (CPU), or an application specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of the present invention.

[0096] The memory 300 may include a high-speed RAM memory, and may also include a non-volatile memory (non-volatile memory), such as at least one disk memory.

[0097] The processor 100 is specifically used to execute each step of the high temperature aging monitoring method disclosed in any one of the above embodiments of the present application. For example, the processor 100 is used to execute:

[0098] Acquire product information of the product to be tested, wherein the product information at least includes input voltage configuration, product code, and product type of the product to be tested;

[0099] Generate a voltage control instruction based on the input voltage configuration of the product to be tested, the voltage control instruction is used to control a power supply module to output a voltage signal matching the input voltage configuration of the product to be tested, the power supply module being the power supply of the product to be tested;

[0100] Real-time acquisition of operating data of the product under test during the high-temperature aging test;

[0101] Performing a fault warning analysis on the product to be tested based on the operating data, and outputting warning information based on the fault warning analysis result;

[0102] When it is detected that the high temperature aging test of the product to be tested is finished, a test report is generated based on the operation data.

[0103] Corresponding to the above-mentioned equipment, the present application also discloses a high temperature aging monitoring system, see Figure 4 The system may include: a high temperature aging monitoring device 11; a power module 12 and a load module 13 connected to the high temperature aging monitoring device. The specific functions and effects of the high temperature aging monitoring device 11; the power module 12 and the load module 13 connected to the high temperature aging monitoring device can be found in the above description.

[0104] Further, in order to achieve reliable communication between the load module 13 and the high temperature aging monitoring device 11, see Figure 5In the high-temperature aging monitoring system disclosed in the embodiment of the present application, a communication module 14 can also be configured. The communication module connects the load module 13 and the high-temperature aging monitoring device 11, and can realize the communication between the load module 13 and the high-temperature aging monitoring device 11. It is a serial port switching device that can realize one-to-many serial port communication. The device end mainly uses serial port communication and allows access to various serial port communication protocols. The control end uses CAN communication to ensure the stability and integrity of information transmitted by multiple devices, and realizes the conversion between serial port communication and CAN communication. The serial port communication protocol on the device end supports multiple types. The high-temperature aging monitoring device 11 realizes status monitoring of multiple devices through the data read by the control end. The structure of the communication module 14 can be seen in Figure 6 As shown, in Figure 6 The main com port is connected to the high temperature aging monitoring device 11, and the slave com port is connected to the load module. At this time, multiple high temperature aging monitoring devices 11 can be used to perform high temperature aging monitoring on multiple products to be tested at the same time.

[0105] As can be seen from the above scheme, the high temperature aging monitoring scheme disclosed in the embodiment of the present application has the following advantages:

[0106] Since there are many types of products to be tested, and the load values ​​and external communication protocols of the output terminals of the products to be tested are relatively rich, the system proposes a load module, which can match the corresponding output terminal load value and external communication protocol type according to the product type;

[0107] Since there are many products in a high-temperature aging test, multiple communication interfaces are required. In order to save the interface resources of the high-temperature aging monitoring equipment, this scheme also proposes a communication module design scheme. The communication module includes a many-to-one interface design and a serial communication to CAN communication protocol conversion design, which enables the high-temperature aging monitoring equipment control end to monitor multiple serial communication devices and supports two-way communication.

[0108] Since the product is in a high temperature box during the high temperature aging test, the testers cannot observe and test it at close range. Therefore, the system is used to realize the automated testing of the high temperature aging process, collect and analyze the product output data in real time and generate a test report.

[0109] During the high-temperature aging test, the product to be tested needs to run in a high-temperature environment for a long time, which may cause irreversible damage to the product. Therefore, an early warning scheme is added to the system. The expected operating status of the product is obtained through real-time analysis and statistics of the operating data output by the product. For any abnormal operating status of the product predicted, the system will send an early warning message to the tester's terminal device so that timely measures can be taken to avoid product damage.

[0110] For the convenience of description, the above system is described as being divided into various modules according to their functions. Of course, when implementing the present invention, the functions of each module can be implemented in the same or multiple software and / or hardware.

[0111] Each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can refer to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system or system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can refer to the partial description of the method embodiment. The system and system embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without creative work.

[0112] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0113] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be implemented directly using hardware, a software module executed by a processor, or a combination of the two. The software module may be placed in a random access memory (RAM), a memory, a read-only memory (ROM), an electrically programmable ROM, an electrically erasable programmable ROM, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.

[0114] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0115] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A high temperature aging monitoring method, characterized in that: include: Acquire product information of the product to be tested, wherein the product information at least includes input voltage configuration, product code, and product type of the product to be tested; Generate a voltage control instruction based on the input voltage configuration of the product to be tested, the voltage control instruction is used to control a power supply module to output a voltage signal matching the input voltage configuration of the product to be tested, the power supply module being the power supply of the product to be tested; Real-time acquisition of operating data of the product under test during the high-temperature aging test; Performing a fault warning analysis on the product to be tested based on the operating data, and outputting warning information based on the fault warning analysis result; When it is detected that the high temperature aging test of the product to be tested is finished, a test report is generated based on the operation data.

2. The high temperature aging monitoring method according to claim 1, characterized in that: Performing fault early warning analysis on the product to be tested based on the operating data includes: Acquiring target analysis data from the operation data; Constructing an actual operation curve of the target analysis data based on the target analysis data acquired at different times; Obtaining a standard operating curve of the target analysis data; Based on the comparison result between the actual operation curve and the standard operation curve, it is determined whether to output warning information matching the target operation data.

3. The high temperature aging monitoring method according to claim 1, characterized in that: Before obtaining the operating data of the product under test in real time during the high temperature aging test, the method further includes: Acquire high temperature aging process configuration information, wherein the high temperature aging process configuration information at least includes: high temperature aging test duration, test cycle configuration, and simulated load configuration; After obtaining the product information, the high temperature aging monitoring method is also used to: Generate a control instruction for controlling the power module to be turned on and off based on the high temperature aging test duration and the test cycle configuration; A load control instruction for controlling the load size is generated based on the load module configuration, and the load module provides a corresponding load to the product under test based on the load control instruction.

4. The high temperature aging monitoring method according to claim 3, characterized in that: The high temperature aging process configuration information also includes ambient temperature configuration; The high temperature aging monitoring method is also used to control the ambient temperature in the high temperature box where the product to be tested is located based on the ambient temperature configuration.

5. The high temperature aging monitoring method according to claim 4, characterized in that: The high temperature aging process configuration is configured with N high temperature aging process configuration strategies to be executed, where N is a positive integer not less than 1, and each high temperature aging process configuration strategy to be executed is configured with high temperature aging test duration, test cycle configuration, simulated load configuration and ambient temperature configuration; Before obtaining the operating data of the product under test during the high-temperature aging test in real time, the high-temperature aging monitoring method further includes: The N to-be-executed high-temperature aging process configuration strategies are traversed in sequence, and the traversed to-be-executed high-temperature aging process configuration strategies are used as the high-temperature aging process configuration strategies that need to be currently executed.

6. The high temperature aging monitoring method according to any one of claims 3, 4 or 5, characterized in that: Get high temperature aging process configuration information, including: Acquiring high temperature aging process configuration information from the product information of the product to be tested; Or, obtain high temperature aging configuration information that matches the product code and product type in the product information.

7. The high temperature aging monitoring method according to claim 1, characterized in that: After performing fault early warning analysis on the product to be tested based on the operation data, the method further includes: Based on the analysis result of the fault warning analysis, determining whether the product to be tested has a target fault; When a target fault occurs, a control instruction for controlling the power module to power off is generated, and fault information is sent to the target terminal.

8. A high temperature aging monitoring device, characterized in that: include: A parameter acquisition unit, used to obtain product information of the product to be tested, wherein the product information at least includes an input voltage configuration, a product code, and a product type of the product to be tested; A control unit, configured to generate a voltage control instruction based on an input voltage configuration of the product to be tested, wherein the voltage control instruction is used to control a power supply module to output a voltage signal matching the input voltage configuration of the product to be tested, and the power supply module is a power supply for the product to be tested; An operation data acquisition unit is used to obtain the operation data of the product to be tested during the high temperature aging test in real time; An early warning unit, configured to perform a fault early warning analysis on the product to be tested based on the operation data, and output early warning information based on the fault early warning analysis result; The report generating unit is used to generate a test report based on the operation data when it is detected that the high temperature aging test of the product to be tested is completed.

9. A high temperature aging monitoring device, characterized in that: include: Memory and processor; The memory is used to store programs; The processor is used to execute the program to implement each step of the high temperature aging monitoring method as described in any one of claims 1 to 7.

10. A high temperature aging monitoring system, characterized in that: include: The high temperature aging monitoring device according to claim 9; A power module and a load module connected to the high temperature aging monitoring device.

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