Negative photoetching white solder resist ink

Abstract

The invention discloses negative photoetching white solder resist ink, which is prepared from the following components in parts by weight: solder resist raw stock, tripropylene glycol diacrylate, a photoinitiator, 2-(2-hydroxy-3, 5-bis (a, a-dimethyl benzyl) phenyl) benzotriazole, a curing accelerator, a defoaming agent, a flatting agent, a dispersing agent and an organic solvent, the solder mask raw stock is composed of 20-60 parts of alkali-soluble photosensitive resin, 20-50 parts of inorganic filler and 10-50 parts of organic solvent, the alkali-soluble photosensitive resin has a photosensitive group and an alkali-soluble group at the same time, and the alkali-soluble photosensitive resin is composed of alkali-soluble epoxy acrylic resin and alkali-soluble polyurethane acrylic resin according to the weight part ratio of 10: (2-5). The negative photoetching white solder resist ink has the advantages of good solder resistance, fast curing, high reflectivity, high resolution and the like, and is suitable for the field of LEDs.

Description

Technical Field

[0001] The invention relates to the technical field of solder resist ink, and in particular to a negative photolithography white solder resist ink. Background Art

[0002] Existing solder resist ink products usually use phenolic epoxy resin as the matrix, which is compounded with epoxy resin, UV monomer and other ingredients to form a solder resist ink composition, which is then hardened by ultraviolet light and then heated to obtain a coating. However, this type of product has been unable to meet the transmission requirements of electronic signals and has major defects. Although increasing the content of functional fillers with low dielectric constants can overcome the defects of dielectric properties, the resolution is low and there are great limitations in window opening accuracy, making it unsuitable for the field of high-end electronic products, and most existing solder resist inks are green. Summary of the invention

[0003] The invention aims to provide a negative photolithography white solder resist ink, which has the advantages of good solder resistance, fast curing, high reflectivity, high resolution and the like, and is suitable for the LED field.

[0004] To achieve the above object, the technical solution adopted by the present invention is: a negative photolithography white solder resist ink, composed of the following components in parts by weight: 20~70 parts of solder mask paste, 10-20 parts of tripropylene glycol diacrylate, Photoinitiator 5~15 parts, 0.5~1 part of 2-(2-hydroxy-3,5-bis(a,a-dimethylbenzyl)phenyl)benzotriazole, 0.5~1.5 parts of curing accelerator, Defoaming agent 0.5~1.5 parts, 0.5~1.5 parts of leveling agent, Dispersant 0.5~1.5 parts, 10-30 parts of organic solvent; The solder resist paste is composed of 20 to 60 parts of alkali-soluble photosensitive resin, 20 to 50 parts of inorganic filler, and 10 to 50 parts of organic solvent. The alkali-soluble photosensitive resin has both photosensitive groups and alkali-soluble groups. The alkali-soluble photosensitive resin is composed of alkali-soluble epoxy acrylic resin and alkali-soluble polyurethane acrylic resin in a ratio of 10:2 to 5 parts by weight.

[0005] The technical solution further improved in the above technical solution is as follows: 1. In the above scheme, the inorganic filler is one of silicon dioxide, talc, barium sulfate, glass powder, kaolin and wax powder.

[0006] 2. In the above scheme, the organic solvent is at least one of terpineol, dioctyl terpine, ethyl acetate, butyl acetate, diethylene glycol methyl ether acetate, and diethylene glycol ethyl ether acetate.

[0007] 3. In the above scheme, the photoinitiator is at least one of 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-(4-methylthiophenyl)-2-morpholine-1-propanone, phenyl bis(2,4,6-trimethylbenzoyl)phosphine oxide, and (2,4,6-trimethylbenzoyl)diphenylphosphine oxide.

[0008] 4. In the above scheme, the curing agent accelerator is at least one of imidazole type, polyamine type, organic urea type and hydrazide type.

[0009] 5. In the above scheme, the defoaming agent mainly includes: at least one of alcohol defoaming agent, phosphate defoaming agent, silicone defoaming agent, fluorine-containing defoaming agent and polyether defoaming agent.

[0010] 6. In the above scheme, the leveling agent mainly includes: one of alkylbenzene, polyether modified silicone oil, polyacrylic acid, and silicone.

[0011] 7. In the above scheme, the dispersant mainly includes at least one of acrylates, organic phosphoric acids, and polyethers.

[0012] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art: The negative photolithography white solder resist ink of the present invention is based on a solder resist paste composed of an alkali-soluble epoxy acrylic resin and an alkali-soluble polyurethane acrylic resin in a ratio of 10:2-5 parts by weight and tripropylene glycol diacrylate, so that the white solder resist ink has the advantages of good solder resistance, fast curing, high reflectivity, high resolution, etc., and is suitable for the LED field. DETAILED DESCRIPTION

[0013] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.

[0014] Embodiment 1: A negative photolithography white solder resist ink, comprising the following components in parts by weight: 60 parts of solder mask paste, Tripropylene glycol diacrylate (active diluent) 15 parts, 10 parts of photoinitiator, 0.8 parts of 2-(2-hydroxy-3,5-bis(a,a-dimethylbenzyl)phenyl)benzotriazole, 1 part of imidazole type curing accelerator, 1.2 parts of alcohol defoamer, 1 part of polyether modified silicone oil leveling agent, 0.6 parts of acrylic dispersant, 20 parts of organic solvent; The solder resist paste is composed of 40 parts of alkali-soluble photosensitive resin, 30 parts of inorganic filler, and 30 parts of organic solvent. The alkali-soluble photosensitive resin has both photosensitive groups and alkali-soluble groups. The alkali-soluble photosensitive resin is composed of alkali-soluble epoxy acrylic resin and alkali-soluble polyurethane acrylic resin in a ratio of 10:3 by weight.

[0015] The inorganic filler is a mixture of silicon dioxide and barium sulfate in a ratio of 1:2.

[0016] The above organic solvent is terpineol.

[0017] The photoinitiator is 1-hydroxycyclohexyl phenyl ketone and 2-methyl-1-(4-methylthiophenyl)-2-morpholine-1-propanone.

[0018] Embodiment 2: A negative photolithography white solder resist ink, comprising the following components in parts by weight: 60 parts of solder mask paste, Tripropylene glycol diacrylate (active diluent) 12 parts, 8 parts of photoinitiator, 2-(2-hydroxy-3,5-bis(a,a-dimethylbenzyl)phenyl)benzotriazole 1 part, 0.6 parts of imidazole type curing accelerator, 1 part of alcohol defoamer, Polyether modified silicone oil leveling 0.8 parts, 1.2 parts of acrylic dispersant, 25 parts of organic solvent; The solder resist paste is composed of 20 to 60 parts of alkali-soluble photosensitive resin, 20 to 50 parts of inorganic filler, and 10 to 50 parts of organic solvent. The alkali-soluble photosensitive resin has both photosensitive groups and alkali-soluble groups. The alkali-soluble photosensitive resin is composed of alkali-soluble epoxy acrylic resin and alkali-soluble polyurethane acrylic resin in a ratio of 10:2 to 5 parts by weight.

[0019] The inorganic filler is a mixture of talcum powder and barium sulfate in a weight ratio of 1:2.

[0020] The above organic solvent is ethyl acetate.

[0021] The photoinitiator is phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide.

[0022] The method for preparing the negative photolithography white solder resist ink of the embodiment comprises the following steps: Step 1: introduce alkali-soluble photosensitive resin, inorganic filler and organic solvent into a ball mill and mix them evenly, add zirconium beads, and ball mill for 8 hours to obtain solder resist slurry; Step 2: Mix and stir the solder resist paste, tripropylene glycol diacrylate, photoinitiator, 2-(2-hydroxy-3,5-bis(a,a-dimethylbenzyl)phenyl)benzotriazole, curing accelerator, defoamer, leveling agent, dispersant and organic solvent evenly, and grind them on a three-roll mill to obtain the liquid photo-imaging alkali-developable electronic solder resist ink of the present invention.

[0023] When the above-mentioned negative photolithography white solder resist ink is used, it is based on a solder resist paste composed of an alkali-soluble epoxy acrylic resin and an alkali-soluble polyurethane acrylic resin in a ratio of 10:2 to 5 parts by weight and tripropylene glycol diacrylate, so that the white solder resist ink has the advantages of good solder resistance, fast curing, high reflectivity, high resolution, etc., and is suitable for the LED field.

[0024] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A negative photolithography white solder resist ink, characterized in that: It is composed of the following components in parts by weight: 20~70 parts of solder mask paste, Tripropylene glycol diacrylate (active diluent) 10~20 parts, Photoinitiator 5~15 parts, 0.5~1 part of 2-(2-hydroxy-3,5-bis(a,a-dimethylbenzyl)phenyl)benzotriazole, 0.5~1.5 parts of curing accelerator, Defoaming agent 0.5~1.5 parts, 0.5~1.5 parts of leveling agent, Dispersant 0.5~1.5 parts, 10-30 parts of organic solvent; The solder resist paste is composed of 20 to 60 parts of alkali-soluble photosensitive resin, 20 to 50 parts of inorganic filler, and 10 to 50 parts of organic solvent. The alkali-soluble photosensitive resin has both photosensitive groups and alkali-soluble groups. The alkali-soluble photosensitive resin is composed of alkali-soluble epoxy acrylic resin and alkali-soluble polyurethane acrylic resin in a ratio of 10:2 to 5 parts by weight.

2. The negative photolithography white solder resist ink according to claim 1, characterized in that: The inorganic filler is one of silicon dioxide, talcum powder, barium sulfate, glass powder, kaolin and wax powder.

3. The negative photolithography white solder resist ink according to claim 1, characterized in that: The organic solvent is at least one of terpineol, dioctyl terpine, ethyl acetate, butyl acetate, diethylene glycol methyl ether acetate, and diethylene glycol ethyl ether acetate.

4. The negative photolithography white solder resist ink according to claim 1, characterized in that: The photoinitiator is at least one of 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-(4-methylthiophenyl)-2-morpholine-1-propanone, phenyl bis(2,4,6-trimethylbenzoyl)phosphine oxide, and (2,4,6-trimethylbenzoyl)diphenylphosphine oxide.

5. The negative photolithography white solder resist ink according to claim 1, characterized in that: The curing agent accelerator is at least one of imidazole type, polyamine type, organic urea type and hydrazide type.

6. The negative photolithography white solder resist ink according to claim 1, characterized in that: The defoaming agent mainly includes: at least one of alcohol defoaming agent, phosphate defoaming agent, silicone defoaming agent, fluorine-containing defoaming agent and polyether defoaming agent.

7. The negative photolithography white solder resist ink according to claim 1, characterized in that: The leveling agent mainly includes: one of alkylbenzene, polyether modified silicone oil, polyacrylic acid and organic silicon.

8. The negative photolithography white solder resist ink according to claim 1, characterized in that: The dispersant mainly includes at least one of acrylates, organic phosphoric acids and polyethers.