Display panel, preparation method thereof and display device
By setting a reflective structure on the side of the isolation structure of the display panel, the light output of the light emitting device is converged to the front view angle, which solves the problem of low light output efficiency of the front view angle of the existing display panel, and achieves higher light output efficiency and better display effect.
Patent Information
- Application Number
- CN202410873151.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-28
- Publication Date
- 2025-04-29
AI Technical Summary
The light output efficiency of the existing display panel is low in front view.
By providing a reflective structure on the side facing away from the substrate, the light exiting of the light emitting device is concentrated to the front viewing angle, and the forward light exit ratio of the display panel is increased.
Improves the light output efficiency of the front view angle of the display panel and enhances the display effect.
Smart Images

Figure CN119907426A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same, and a display device. Background Art
[0002] With the advancement of terminal display technology such as mobile phones, active-matrix organic light-emitting diode (AMOLED) displays have gradually become mainstream. People have also put forward requirements for AMOLED mobile phone displays such as flexibility, full screen, and ultra-narrow borders. Therefore, the borders of mobile phone display screens are required to be smaller and smaller, and the panel size is no longer limited by fine metal mask plates.
[0003] However, the light output efficiency of current display panels at normal viewing angles is relatively low. Summary of the invention
[0004] In view of this, the embodiments of the present application provide a display panel and a method for manufacturing the same, and a display device, which solve the problem of low light output efficiency of the display panel at a normal viewing angle in the prior art.
[0005] In a first aspect, the present application provides a display panel, including a substrate, an isolation structure, at least one light-emitting device and a reflective structure. The isolation structure is located on one side of the substrate, and the isolation structure encloses at least one isolation opening; the light-emitting device is at least partially located in the isolation opening; the reflective structure is located on the side of the isolation structure away from the substrate, and the reflective structure is used to converge the predetermined viewing angle light of the light-emitting device to a positive viewing angle, and the predetermined viewing angle is greater than or equal to 45° and less than 90°.
[0006] In combination with the first aspect, in some possible implementations, the orthographic projection of the reflective structure on the substrate is located within the orthographic projection range of the isolation structure on the substrate.
[0007] In combination with the first aspect, in some possible implementations, the reflective structure encloses a focusing opening, and the orthographic projection of the focusing opening on the substrate covers the orthographic projection of the isolation opening on the substrate; preferably, in the thickness direction of the substrate, the cross-sectional shape of the reflective structure is a trapezoid; preferably, in the thickness direction of the substrate, the cross-sectional shape of the side wall surface of the reflective structure is an arc; preferably, the angle between the cross-sectional shape of the side wall surface of the reflective structure and the plane where the substrate is located is greater than or equal to 45 degrees and less than or equal to 80 degrees.
[0008] In combination with the first aspect, in some possible implementations, the isolation structure includes a first part and a second part stacked together, the second part is located on the side of the first part facing the substrate, the orthographic projection of the second part on the substrate is located within the orthographic projection range of the first part on the substrate, and the orthographic projection of the reflective structure on the substrate is located within the orthographic projection range of the second part on the substrate.
[0009] In combination with the first aspect, in some possible implementations, the first portion includes a first plane sub-portion and at least one second plane sub-portion, and a first connecting sub-portion connecting the first plane sub-portion and the second plane sub-portion; the orthographic projection of the first plane sub-portion on the substrate surrounds the orthographic projection of the light-emitting device on the substrate, and the second plane sub-portion is located on the side of the first plane sub-portion facing the isolation opening; the distance between the first plane sub-portion and the substrate is smaller than the distance between the second plane sub-portion and the substrate; the orthographic projection of the reflective structure on the substrate is located within the range of the orthographic projection of the first plane sub-portion on the substrate.
[0010] In combination with the first aspect, in some possible implementations, the first connecting sub-portion, the reflective structure, and the first planar sub-portion located between the first connecting sub-portion and the reflective structure enclose a groove, and the orthographic projection of the groove on the substrate surrounds the orthographic projection of the light-emitting device on the substrate.
[0011] In combination with the first aspect, in some possible implementations, the distance between the surface of the reflective structure facing away from the substrate and the substrate is greater than the maximum distance between the surface of the isolation structure facing away from the substrate and the substrate.
[0012] In combination with the first aspect, in some possible implementations, the second part includes an electronic conductive part; preferably, the material of the second part is aluminum, copper or silver; preferably, the material of the first part is titanium or molybdenum.
[0013] In combination with the first aspect, in some possible implementations, the isolation structure also includes a third part, which is located on the side of the second part facing the substrate; the orthographic projection of the second part on the substrate is located within the range of the orthographic projection of the third part on the substrate; preferably, the material of the third part is molybdenum or titanium.
[0014] In combination with the first aspect, in some possible implementations, it also includes a pixel definition layer, which is located on the side of the isolation structure facing the substrate, the pixel definition layer encloses a pixel opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection range of the isolation opening on the substrate; preferably, the distance between the outer edge of the orthographic projection of the pixel definition layer on the substrate facing the orthographic projection of the light-emitting device on the substrate and the outer edge of the orthographic projection of the first part on the substrate facing the orthographic projection of the light-emitting device on the substrate is greater than or equal to 1 micron and less than or equal to 10 microns.
[0015] In combination with the first aspect, in some possible implementations, the light-emitting device includes a stacked first electrode and a second electrode, the first electrode being located on a side of the second electrode facing away from the substrate; preferably, the orthographic projection of the first connecting sub-portion on the substrate covers an edge area of the orthographic projection of the second electrode on the substrate; preferably, the first electrode and the second portion overlap; preferably, in a direction perpendicular to the substrate, the thickness of the second electrode is greater than or equal to 1000 angstroms and less than or equal to 3000 angstroms.
[0016] In combination with the first aspect, in some possible implementations, the reflective structure and the first portion are made of the same material; preferably, the reflective structure and the first portion are integrally formed.
[0017] In combination with the first aspect, in some possible implementations, in a direction perpendicular to the substrate, the sum of the thicknesses of the reflective structure and the first part is greater than the thickness of the second part; preferably, the sum of the thicknesses of the reflective structure and the first part is greater than or equal to 8000 angstroms and less than or equal to 10000 angstroms; preferably, the thickness of the second part is greater than or equal to 6000 angstroms and less than or equal to 8000 angstroms; preferably, the thickness of the first part is greater than or equal to 500 angstroms and less than or equal to 1500 angstroms; preferably, the distance between the outer edge of the orthographic projection of the first part on the substrate toward the orthographic projection of the light-emitting device on the substrate and the outer edge of the orthographic projection of the reflective structure on the substrate toward the orthographic projection of the light-emitting device on the substrate is greater than or equal to 1 micron and less than or equal to 3 microns.
[0018] In combination with the first aspect, in some possible implementations, it further includes a packaging part, which is located on the side of the light-emitting device away from the substrate; the edge of the packaging part is located on the side of the isolation structure away from the substrate; preferably, there are multiple packaging parts, there are multiple light-emitting devices, and the packaging parts and the light-emitting devices are arranged correspondingly; preferably, the display panel also includes an organic packaging layer, which is located on the side of the packaging part away from the substrate, and the orthographic projection of the organic packaging layer on the substrate covers the orthographic projection of the packaging part on the substrate; preferably, the display panel also includes an inorganic packaging layer, which is located on the side of the organic packaging layer away from the substrate, and the orthographic projection of the inorganic packaging layer on the substrate covers the orthographic projection of the organic packaging layer on the substrate.
[0019] The second aspect of the present application provides a method for preparing a display panel, comprising: sequentially preparing a second isolation material layer and a first isolation material layer on a substrate, the substrate comprising a second electrode; dry etching the first isolation material layer and the second isolation material layer and etching the first isolation material layer to form an isolation structure and a reflective structure, the isolation structure encloses an isolation opening, the orthographic projection of the isolation opening on the substrate and the orthographic projection of the second electrode on the substrate at least partially overlap; the reflective structure is located on the side of the isolation structure away from the substrate; preferably, patterning the first isolation material layer and the second isolation material layer and etching the first isolation material layer, comprising: patterning the first isolation material layer and the second isolation material layer to obtain a second portion, etching the first isolation material layer to obtain a first portion and the reflective structure; the first portion and the second portion enclose an isolation opening; the orthographic projection of the reflective structure on the substrate is located within the orthographic projection range of the first portion on the substrate; the orthographic projection of the second portion on the substrate is located within the orthographic projection range of the first portion on the substrate.
[0020] The third aspect of the present application provides a method for preparing a display panel, comprising: preparing an isolation structure on a substrate, the substrate comprising a second electrode, the isolation structure enclosing an isolation opening, the orthographic projection of the isolation opening on the substrate and the orthographic projection of the second electrode on the substrate at least partially overlapping; preparing a reflective structure on the side of the isolation structure facing away from the substrate.
[0021] The fourth aspect of the present application provides a method for preparing a display panel, comprising: sequentially preparing a second isolation material layer, a first isolation material layer and a reflective material layer on a substrate, the substrate comprising a second electrode; dry etching the reflective material layer to obtain a reflective structure; patterning the first isolation material layer and the second isolation material layer to obtain a first portion and a second portion and an isolation opening enclosed by the first portion and the second portion, the orthographic projection of the isolation opening on the substrate and the orthographic projection of the second electrode on the substrate at least partially overlapping; the orthographic projection of the second portion on the substrate is located within the range of the orthographic projection of the first portion on the substrate.
[0022] A fifth aspect of the present application provides a display device, comprising the above-mentioned display panel, or a display panel obtained according to the above-mentioned preparation method.
[0023] According to the display panel, preparation method thereof and display device provided by the embodiments of the present application, by arranging a reflective structure on the side of the isolation structure away from the substrate, the predetermined viewing angle light of the light-emitting device can be converged to the positive viewing angle, thereby increasing the positive light output ratio of the display panel and improving the positive viewing angle light output efficiency of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 A partial cross-sectional structural schematic diagram of a display panel provided in the first embodiment of the present application.
[0025] Figure 2 for Figure 1 A schematic diagram of a partial cross-sectional structure of a display panel is shown.
[0026] Figure 3 for Figure 2 A schematic diagram of a partial cross-sectional structure of a display panel is shown.
[0027] Figure 4a for Figure 2 A schematic cross-sectional structure diagram of a reflective structure of a display panel is shown.
[0028] Figure 4b for Figure 2 Another schematic cross-sectional structure diagram of the reflective structure of the display panel is shown.
[0029] Figure 5a for Figure 2 Another schematic diagram of the cross-sectional structure of a display panel is shown.
[0030] Figure 5b for Figure 2 Another schematic cross-sectional structure diagram of a display panel is shown.
[0031] Figure 6 A schematic diagram of the cross-sectional structure of a display panel provided in the second embodiment of the present application.
[0032] Figure 7 A flow chart of a method for manufacturing a display panel provided in the first embodiment of the present application.
[0033] Figure 8a-8e A schematic structural diagram of an intermediate product obtained during the execution of the preparation method provided in the first embodiment of the present application.
[0034] Fig. 9 A flow chart of a method for preparing a display panel provided in the second embodiment of the present application.
[0035] Figure 10a-Figure 10c A schematic structural diagram of an intermediate product obtained during the execution of the preparation method provided in the first embodiment of the present application.
[0036] Fig.11 A flow chart of a method for manufacturing a display panel provided in the third embodiment of the present application.
[0037] Figure 12a-12e A schematic structural diagram of an intermediate product obtained during the execution of the preparation method provided in the first embodiment of the present application.
[0038] Fig.13 A schematic diagram of the structure of a display device provided in one embodiment of the present application. DETAILED DESCRIPTION
[0039] As mentioned in the background technology, with the advancement of terminal display technology such as mobile phones, active-matrix organic light-emitting diode (AMOLED) display has gradually become mainstream. People have also put forward requirements such as flexibility, full screen, and ultra-narrow frame for AMOLED mobile phone displays. Therefore, the frame requirements for mobile phone display screens are getting smaller and smaller, and the panel size is no longer limited by the fine metal mask plate. However, the current display panel has a low light output efficiency at a positive viewing angle.
[0040] In view of this, according to the display panel, its preparation method and display device provided in the embodiments of the present application, by setting a reflective structure on the side of the isolation structure away from the substrate, the predetermined viewing angle light of the light-emitting device can be converged to the positive viewing angle, thereby increasing the positive light output ratio of the display panel and improving the positive viewing angle light output efficiency of the display panel.
[0041] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0042] In the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It is understood that when a structure is referred to as being "on or under" another structure, the structure may be directly on or under the other structure, or there may be intermediate structures. The same reference numerals always indicate the same structure. The structures mentioned herein include any of a film layer, an element, a device, a component, and an assembly.
[0043] When a structure is referred to as being “connected” to another structure, the structure may be directly connected to the other structure or indirectly connected to the other structure with one or more intervening structures interposed therebetween.
[0044] Figure 1 This is a schematic diagram of a partial cross-sectional structure of a display panel provided in the first embodiment of the present application. Figure 1 As shown, the display panel includes a substrate 11, an isolation structure 12, at least one light-emitting device 13 and a reflective structure 14, the isolation structure 12 is located on one side of the substrate 11, the isolation structure 12 encloses at least one isolation opening 125, the light-emitting device 13 is at least partially located in the isolation opening 125, the reflective structure 14 is located on the side of the isolation structure 12 away from the substrate 11, and the reflective structure 14 is used to converge the predetermined viewing angle light of the light-emitting device 13 to the positive viewing angle, wherein the predetermined viewing angle is greater than or equal to 45° and less than 90°, as shown in FIG. Figure 1 It is worth noting that the normal viewing angle refers to a viewing angle range in which the angle with the light emitting direction of the light emitting device 13 is less than or equal to 30°, that is, a viewing angle range in which the angle with the direction perpendicular to the display panel is less than or equal to 30°.
[0045] The substrate 11 may be a substrate substrate. In some embodiments, the substrate substrate may be a glass-based substrate. In some embodiments, the substrate substrate may include an organic resin material such as polyimide, epoxy resin, triazine, silicone resin or polyimide. In some other embodiments, the substrate substrate may include a ceramic material such as silicon nitride, aluminum nitride or aluminum oxide, or may include a metal or a metal compound.
[0046] The light-emitting device 13 may be an organic light-emitting diode (OLED), a micro light-emitting diode (Micro LED), a quantum dot light-emitting diode (QLED), etc. The light-emitting device 13 may be a light-emitting device of various colors, such as a red light-emitting device R, a green light-emitting device G, a blue light-emitting device B, etc.
[0047] The light emitting device 13 includes a first electrode 131 and a second electrode 132 stacked together, and at least one organic light emitting functional layer 133 located between the first electrode 131 and the second electrode 132. The second electrode 132 is located on the side of the first electrode 131 facing the substrate 11. The first electrode 131 may be a cathode, and the second electrode 132 may be an anode. The at least one organic light emitting functional layer 133 includes an emitting layer (EML), and may also include at least one of a hole injection layer (HIL), a hole transport layer (HTL), and an electron blocking layer (EBL) located between the anode and the emitting layer (EML), and at least one of an electron injection layer (EIL), an electron transport layer (ETL), and a hole blocking layer (HBL) located between the cathode and the emitting layer (EML).
[0048] In one embodiment, the at least one light emitting device 13 includes a plurality of light emitting devices, the plurality of light emitting devices including at least two of a red light emitting device, a green light emitting device, and a blue light emitting device.
[0049] The isolation structure 12 is used to isolate adjacent light-emitting devices 13, and specifically can isolate at least part of the organic light-emitting functional layer 133 and the first electrode 131 of the adjacent light-emitting device 13. In one embodiment, the isolation structure 12 includes a stacked first portion 121 and a second portion 122, the first portion 121 is located on the side of the second portion 122 away from the substrate 11, and the orthographic projection of the first portion 121 on the substrate 11 covers the orthographic projection of the second portion 122 on the substrate 11. Exemplarily, the second portion 122 can be designed as an independent film layer, that is, there is no physical interface inside the second portion 122, and each part is composed of the same material, for example, the material of the second portion 122 is aluminum, copper or silver. Alternatively, the second portion 122 can be designed to be composed of at least two film layers stacked. For example, the second portion 122 is formed by stacking two conductive film layers. The materials of the two conductive film layers can be molybdenum and aluminum, respectively, and the conductive film layer composed of molybdenum is located between the substrate 11 and the conductive film layer composed of aluminum. Exemplarily, the second portion 122 includes a conductive sub-portion, or the second portion 122 itself is a conductive structure. The second portion 122 overlaps the first electrode 131 of the light-emitting device 13, so that the first electrodes 131 of adjacent light-emitting devices 13 are electrically connected to each other, thereby realizing a full-surface cathode. The material of the first portion 121 can be an organic material or an inorganic material or a metal material, such as molybdenum or titanium. In the case where the first portion 121 is a metal material, the material of the first portion 121 can be titanium.
[0050] Figure 2 for Figure 1 The partial cross-sectional structure diagram of the display panel shown in FIG. Figure 3 for Figure 2 The partial cross-sectional structure diagram of the display panel is shown in FIG. Figure 2 and Figure 3 As shown, in one embodiment, since the orthographic projection of the isolation structure 12 on the substrate 11 and the orthographic projection of the second electrode 132 on the substrate 11 partially overlap, the isolation structure 12 will be uneven, forming a step structure. Specifically, the first portion 121 includes a first plane sub-portion 1211 and at least one second plane sub-portion 1212, and a first connecting sub-portion 1213 connected to the first plane sub-portion 1211 and the second plane sub-portion 1212. The orthographic projection of the first plane sub-portion 1211 on the substrate 11 surrounds the orthographic projection of the light-emitting device 13 on the substrate 11, and the second plane sub-portion 1212 is located on the side of the first plane sub-portion 1211 facing the isolation opening 125.
[0051] Furthermore, a distance L1 between the first plane sub-portion 1211 and the substrate 11 is smaller than a distance L2 between the second plane sub-portion 1212 and the substrate 11 .
[0052] In one embodiment, the orthographic projection of the first connecting sub-portion 1213 on the substrate 11 covers an edge region of the orthographic projection of the second electrode 132 on the substrate 11 .
[0053] In one embodiment, the second portion 122 includes a third planar sub-portion 1221 and at least one fourth planar sub-portion 1222, and a second connecting sub-portion 1223 connecting the third planar sub-portion 1221 and the fourth planar sub-portion 1222, the orthographic projection of the third planar sub-portion 1221 on the substrate 11 surrounds the orthographic projection of the light-emitting device 13 on the substrate 11, and the fourth planar sub-portion is located on the side of the third planar sub-portion 1221 facing the isolation opening 125.
[0054] Furthermore, a distance L3 between the third plane sub-portion 1221 and the substrate 11 is smaller than a distance L4 between the second plane sub-portion 1222 and the substrate 11 .
[0055] In one embodiment, the third planar sub-portion 1221 overlaps with the first planar sub-portion 1211 , and the fourth planar sub-portion 1222 overlaps with the second planar sub-portion 1212 .
[0056] In one embodiment, the second connecting sub-portion 1223 is parallel to the first connecting sub-portion 1213 .
[0057] In one embodiment, the orthographic projection of the second connecting sub-portion 1223 on the substrate 11 covers an edge region of the orthographic projection of the second electrode 132 on the substrate 11 .
[0058] In one embodiment, the isolation structure 12 further includes a third portion 123, which is located on the side of the first portion 121 facing the substrate 11, and the orthographic projection of the first portion 121 on the substrate 11 is located within the orthographic projection range of the third portion 123 on the substrate 11. The material of the third portion 123 is molybdenum or titanium. Exemplarily, the first portion 121 is a conductive film layer composed of aluminum, and the third portion 123 is a conductive film layer composed of molybdenum. In this case, the cross-section of the isolation structure 12 is I-shaped. Of course, in other embodiments, the third portion 123 is a conductive film layer composed of titanium.
[0059] In one embodiment, the third portion 123 includes a fifth planar sub-portion 1231 and at least one sixth planar sub-portion 1232, and a third connecting sub-portion 1233 connecting the fifth planar sub-portion 1231 and the sixth planar sub-portion 1232, the orthographic projection of the fifth planar sub-portion 1231 on the substrate 11 surrounds the orthographic projection of the light-emitting device 13 on the substrate 11, and the sixth planar sub-portion 1233 is located on the side of the fifth planar sub-portion 1231 facing the isolation opening 125.
[0060] Furthermore, a distance L5 between the fifth plane sub-portion 1231 and the substrate 11 is smaller than a distance L6 between the sixth plane sub-portion 1232 and the substrate 11 .
[0061] In one embodiment, the fifth planar sub-portion 1231 overlaps with the third planar sub-portion 1221 , and the sixth planar sub-portion 1232 overlaps with the fourth planar sub-portion 1222 .
[0062] In one embodiment, the third connecting sub-portion 1233 and the second connecting sub-portion 1223 are parallel.
[0063] In one embodiment, the orthographic projection of the third connecting sub-portion 1233 on the substrate 11 covers an edge region of the orthographic projection of the second electrode 132 on the substrate 11 .
[0064] In one embodiment, the display panel further includes a pixel definition layer 18, which is located on the side of the isolation structure 12 facing the substrate 11. The pixel definition layer 18 encloses a pixel opening 1801, and the orthographic projection of the pixel opening on the substrate 11 is located within the orthographic projection range of the isolation opening 125 on the substrate. At least a portion of the second electrode 132 is exposed by the pixel opening 1801. Exemplarily, the material of the pixel definition layer 18 includes an inorganic material.
[0065] Optionally, the pixel definition layer 18 may be made of a light-transmitting material so that the light of the light-emitting device 13 can better pass through the pixel definition layer. Optionally, the pixel definition layer 18 may be made of an opaque material so as to improve the light absorption of the pixel definition layer 18, reduce the reflectivity of the display panel, further reduce the optical crosstalk between adjacent light-emitting devices 13, and improve the display effect of the display panel.
[0066] In one embodiment, since the orthographic projection of the pixel definition layer 18 on the substrate 11 and the orthographic projection of the second electrode 132 on the substrate 11 partially overlap, the pixel definition layer 18 is uneven, forming a stepped structure. Specifically, the pixel definition layer 18 includes a seventh plane sub-portion 181 and at least one eighth plane sub-portion 182, and a fourth connecting sub-portion 183 connecting the seventh plane sub-portion 181 and the eighth plane sub-portion 182, the orthographic projection of the seventh connecting sub-portion 181 on the substrate 11 surrounds the orthographic projection of the light-emitting device 13 on the substrate 11, and the eighth plane sub-portion 182 is located on the side of the seventh connecting sub-portion 181 facing the pixel opening 1801.
[0067] Furthermore, a distance L7 between the seventh plane sub-portion 181 and the substrate 11 is smaller than a distance L8 between the eighth plane sub-portion 182 and the substrate 11 .
[0068] In one embodiment, the seventh planar sub-portion 181 and the first planar sub-portion 1211 overlap, and the eighth planar sub-portion 182 and the second planar sub-portion 1212 overlap.
[0069] In one embodiment, the fourth connecting sub-portion 183 and the first connecting sub-portion 1213 are parallel.
[0070] In one embodiment, the orthographic projection of the fourth connecting sub-portion 183 on the substrate 11 covers an edge region of the orthographic projection of the second electrode 132 on the substrate 11 .
[0071] In one embodiment, the distance L11 between the outer edge of the orthographic projection of the pixel definition layer 18 on the substrate 11 toward the orthographic projection of the light-emitting device 13 on the substrate 11 and the outer edge of the orthographic projection of the first portion 121 on the substrate 11 toward the orthographic projection of the light-emitting device 13 on the substrate 11 is greater than or equal to 1 micrometer and less than or equal to 10 micrometers. For example, the distance L11 between the outer edge of the orthographic projection of the pixel definition layer 18 on the substrate 11 toward the orthographic projection of the light-emitting device 13 on the substrate 11 and the outer edge of the orthographic projection of the first portion 121 on the substrate 11 toward the orthographic projection of the light-emitting device 13 on the substrate 11 can be 1 micrometer, 1.2 micrometers, 1.5 micrometers, 2 micrometers, 2.5 micrometers, 3.6 micrometers, 5 micrometers, 6.2 micrometers, 7.3 micrometers, 8.5 micrometers, 9.3 micrometers or 10 micrometers, etc.
[0072] Please refer again Figure 1 In one embodiment, the orthographic projection of the reflective structure 14 on the substrate 11 is located within the orthographic projection range of the isolation structure 12 on the substrate 11 , so as to prevent the reflective structure 14 from blocking the light emitted by the light emitting device 13 .
[0073] In one embodiment, the reflective structure 14 encloses a light-collecting opening 141 , and the orthographic projection of the light-collecting opening 141 on the substrate 11 covers the orthographic projection of the isolation opening 125 on the substrate 11 .
[0074] Figure 4a for Figure 2 The cross-sectional structure diagram of the reflective structure of the display panel shown in FIG. Figure 4a As shown, in one embodiment, in the thickness direction X of the substrate 11 , the cross-section of the side wall surface of the reflective structure 14 is in an arc shape.
[0075] In one embodiment, the angle a between the cross section of the side wall of the reflective structure 14 and the plane where the substrate 11 is located is greater than or equal to 45 degrees and less than or equal to 80 degrees, that is, the angle a between the tangent line of the cross section of the side wall of the reflective structure 14 and the plane where the substrate is located is greater than or equal to 45 degrees and less than or equal to 80 degrees. For example, the angle a between the tangent line of the cross section and the substrate 11 is 45 degrees, 48 degrees, 52.5 degrees, 55 degrees, 58 degrees, 60 degrees, 65 degrees, 67 degrees, 68 degrees, 70 degrees, 72 degrees, 74.5 degrees, 78 degrees or 80 degrees.
[0076] Figure 4b for Figure 2 Another cross-sectional structural diagram of the reflective structure of the display panel shown in FIG. Figure 4bAs shown, in one embodiment, in the thickness direction X of the substrate 11 , the cross-sectional shape of the reflective structure 14 is a trapezoid.
[0077] Further in one embodiment, the angle b between the side wall of the trapezoid and the plane where the substrate 11 is located is greater than or equal to 45 degrees and less than or equal to 80 degrees. For example, the angle b between the side wall of the trapezoid and the plane where the substrate 11 is located is 45 degrees, 60 degrees, 80 degrees, etc.
[0078] In one embodiment, in the thickness direction X of the substrate 11 , the cross-sectional shape of the light emitting structure 14 is a rectangle.
[0079] In one embodiment, the reflective structure 14 is annular, and the reflective structure 14 and the light emitting device 13 are arranged correspondingly, and the reflective structure 14 surrounds the light emitting device 13; for example, the reflective structure 14 and the light emitting device 13 correspond one to one.
[0080] In one embodiment, the orthographic projection of the reflective structure 14 on the substrate 11 is located within the orthographic projection range of the second portion 122 on the substrate 11 , thereby improving the supporting effect of the isolation structure 12 .
[0081] Figure 5a for Figure 2 Another schematic diagram of a cross-sectional structure of a display panel is shown in FIG. Figure 5b for Figure 2 Another cross-sectional structure diagram of a display panel is shown in FIG. Figure 5a and Figure 5b As shown, in one embodiment, the first connecting sub-portion 1213 , the reflective structure 14 , and the first planar sub-portion 1211 located between the first connecting sub-portion 1213 and the reflective structure 14 enclose a groove 101 , and the orthographic projection of the groove 101 on the substrate 11 surrounds the orthographic projection of the light-emitting device 13 on the substrate 11 .
[0082] In one embodiment, a distance L9 between a surface of the reflective structure 14 facing away from the substrate 11 and the substrate 11 is greater than a maximum distance between a surface of the isolation structure 12 facing away from the substrate 11 and the substrate 11. Specifically, a distance L9 between a surface of the reflective structure 14 facing away from the substrate 11 and the substrate 11 is greater than a distance L10 between a surface of the second planar sub-portion 1212 facing away from the substrate 11 and the substrate 11.
[0083] In one embodiment, the reflective structure 14 and the first portion 121 are made of the same material.
[0084] In one embodiment, the reflective structure 14 and the first portion 121 are integrally formed (eg, Figure 5b shown).
[0085] In one embodiment, the reflective structure 14 and the first portion 121 are separately formed (eg Figure 5a shown).
[0086] In one embodiment, in a direction X perpendicular to the substrate 11 , a sum T1 of the thicknesses of the reflective structure 14 and the first portion 121 is greater than a thickness T3 of the second portion 122 .
[0087] In one embodiment, in the direction X perpendicular to the substrate 11, the sum T1 of the thickness of the reflective structure 14 and the first portion 121 is greater than or equal to 8000 angstroms and less than or equal to 10000 angstroms. For example, in the direction X perpendicular to the substrate 11, the sum T1 of the thickness of the reflective structure 14 and the first portion 121 is 8000 angstroms, 8200 angstroms, 8450 angstroms, 8500 angstroms, 8800 angstroms, 9000 angstroms, 9100 angstroms, 9250 angstroms, 9500 angstroms, 9600 angstroms, 10000 angstroms, etc.
[0088] In one embodiment, the thickness T3 of the second portion 122 is greater than or equal to 6000 angstroms and less than or equal to 8000 angstroms. For example, the thickness T2 of the second portion 122 may be 6000 angstroms, 6100 angstroms, 6200 angstroms, 6400 angstroms, 6600 angstroms, 6850 angstroms, 7000 angstroms, 7250 angstroms, 7300 angstroms, 7500 angstroms, 7650 angstroms, 7800 angstroms, 8000 angstroms, etc.
[0089] In one embodiment, the thickness T2 of the first portion 121 is greater than or equal to 500 angstroms and less than or equal to 1500 angstroms. For example, the thickness T3 of the first portion 121 is 500 angstroms, 600 angstroms, 650 angstroms, 700 angstroms, 850 angstroms, 900 angstroms, 1000 angstroms, 1150 angstroms, 1200 angstroms, 1350 angstroms, 1400 angstroms, 1425 angstroms, 1500 angstroms, etc.
[0090] Preferably, the thickness T2 of the first portion 121 is 1500 angstroms.
[0091] In one embodiment, the thickness T4 of the second electrode 132 is greater than or equal to 1000 angstroms and less than or equal to 3000 angstroms. For example, the thickness T4 of the second electrode 132 may be 1000 angstroms, 1200 angstroms, 1275 angstroms, 1300 angstroms, 1420 angstroms, 1500 angstroms, 1600 angstroms, 1735 angstroms, 2000 angstroms, 2100 angstroms, 2225 angstroms, 2320 angstroms, 2460 angstroms, 2550 angstroms, 2600 angstroms, 2745 angstroms, 2860 angstroms, 3000 angstroms, etc.
[0092] In one embodiment, the distance L12 between the outer edge of the orthographic projection of the first portion 121 on the substrate 11 toward the orthographic projection of the light emitting device 13 on the substrate 11 and the outer edge of the orthographic projection of the reflective structure 14 on the substrate 11 toward the orthographic projection of the light emitting device 13 on the substrate 11 is greater than or equal to 1 micrometer and less than or equal to 3 micrometers. For example, the distance L12 between the outer edge of the orthographic projection of the first portion 121 on the substrate 11 toward the orthographic projection of the light emitting device 13 on the substrate 11 and the outer edge of the orthographic projection of the reflective structure 14 on the substrate 11 toward the orthographic projection of the light emitting device 13 on the substrate 11 can be 1 micrometer, 1.2 micrometers, 1.4 micrometers, 1.6 micrometers, 1.8 micrometers, 2 micrometers, 2.1 micrometers, 2.3 micrometers, 2.5 micrometers, 2.6 micrometers, 2.8 micrometers, 3 micrometers, etc. Please refer to the embodiment of the present invention again. Figure 1 In one embodiment, the display panel further includes an encapsulation portion 15, which is located on the side of the light-emitting device 13 away from the substrate 11. The orthographic projection of the encapsulation portion 15 on the substrate 11 covers the orthographic projection of the light-emitting device 13 on the substrate 11. Exemplarily, the material of the encapsulation portion 15 is an inorganic material, such as silicon oxide, silicon oxynitride or silicon nitride. The encapsulation portion 15 can be a single layer, a multi-layer, a composite layer, etc.
[0093] The edge of the packaging portion 15 is located on a side of the isolation structure 12 away from the substrate 11 . Specifically, the edge of the packaging portion 15 is located in the groove 101 .
[0094] In one embodiment, there are multiple packaging parts 15 and multiple light-emitting devices 13 , and the multiple packaging parts 15 and the multiple light-emitting devices 13 are correspondingly arranged, so that independent packaging of the light-emitting devices 13 can be achieved.
[0095] In one embodiment, the packaging portion 15 has a recess 151 on a side away from the substrate 11 , and an orthographic projection of the recess 151 on the substrate 11 at least partially overlaps with an orthographic projection of the isolation structure 12 on the substrate 11 .
[0096] Figure 6 FIG. 1 is a schematic diagram of a cross-sectional structure of a display panel provided in the second embodiment of the present application. Figure 6 As shown, in one embodiment, the display panel further includes an organic encapsulation layer 16, which is located on the side of the encapsulation portion 15 away from the substrate 11. The orthographic projection of the organic encapsulation layer 16 on the substrate 11 covers the orthographic projection of the encapsulation portion 15 on the substrate 11. Exemplarily, the material of the organic encapsulation layer 16 is a fiber material, a resin material, or a material for a laminated multilayer board, etc. The organic encapsulation layer 16 can be a single layer, a multilayer, a composite layer, etc.
[0097] In one embodiment, the organic encapsulation layer 16 fills the recess 151 , which improves the flatness of the film layer and can also improve the encapsulation effect of the display panel.
[0098] In one embodiment, the display panel further includes an inorganic encapsulation layer 17, which is located on the side of the organic encapsulation layer 16 away from the substrate 11, and the orthographic projection of the inorganic encapsulation layer 17 on the substrate 11 covers the orthographic projection of the organic encapsulation layer 16 on the substrate. Exemplarily, the material of the inorganic encapsulation layer 17 is silicon oxide, silicon oxynitride or silicon nitride, etc. The inorganic encapsulation layer 17 can be a single layer, a multi-layer, a composite layer, etc.
[0099] According to the display panel provided in the embodiment of the present application, by arranging a reflective structure on the side of the isolation structure away from the substrate, the predetermined viewing angle light of the light-emitting device can be converged to the positive viewing angle, thereby increasing the positive light output ratio of the display panel and improving the positive viewing angle light output efficiency of the display panel.
[0100] The embodiment of the present application also provides a method for preparing a display panel. Figure 7 This is a flow chart of a method for preparing a display panel provided in the first embodiment of the present application. The preparation method is used to prepare a display panel provided in any of the above embodiments. Figure 7 As shown, the preparation method comprises:
[0101] Step S710: sequentially preparing a second isolation material layer and a first isolation material layer on a substrate, wherein the substrate includes a second electrode.
[0102] In step S720, the first isolation material layer and the second isolation material layer are patterned and the first isolation material layer is etched to form an isolation structure and a reflective structure. The isolation structure encloses an isolation opening, and the orthographic projection of the isolation opening on the substrate and the orthographic projection of the second electrode on the substrate at least partially overlap; the orthographic projection of the reflective structure on the substrate is within the range of the orthographic projection of the isolation structure on the substrate.
[0103] Figure 8a-8e This is a schematic diagram of the structure of an intermediate product obtained during the execution of the preparation method provided in the first embodiment of the present application. The preparation method specifically includes:
[0104] According to step S710, refer to Figure 8a , a second isolation material layer 1202 and a first isolation material layer 1201 are sequentially prepared on a substrate 11 , and the substrate 11 includes a second electrode 132 .
[0105] According to step S720 , first, the first isolation material layer 1201 and the second isolation material layer 1202 are patterned to obtain the second portion 122 .
[0106] Specifically, see Figure 8b , the first isolation material layer 1201 and the second isolation material layer 1202 are dry-etched.
[0107] See also Figure 8c , wet-etching the second isolation material layer 1202 to obtain the second part 122.
[0108] Next, the first isolation material layer 1201 is etched to obtain the first portion 121 and the reflective structure 14 .
[0109] Specifically, see Figure 8d , the first isolation material layer 1201 is dry-etched to obtain the first portion 121 and the reflective structure 14, and the first portion 121 and the second portion 122 enclose an isolation opening 125. The reflective structure 14 is located on the side of the first portion 121 away from the substrate 11, the orthographic projection of the reflective structure 14 on the substrate 11 is located within the orthographic projection range of the first portion 121 on the substrate, the orthographic projection of the first portion 121 on the substrate 11 and the orthographic projection of the isolation opening 125 on the substrate 11 at least partially overlap, and the orthographic projection of the second portion 122 on the substrate 11 is located within the orthographic projection range of the first portion 121 on the substrate 11.
[0110] The present application does not limit the specific preparation order of step S720. For example, in one embodiment, the first isolation material layer 1201 and the second isolation material layer 1202 may be patterned to obtain the second portion 122, and then the first isolation material layer 1201 may be etched to obtain the first portion 121 and the reflective structure 14. For another example, in one embodiment, the first isolation material layer 1201 may be etched to obtain the first portion 121 and the reflective structure 14, and then the first isolation material layer and the second isolation material layer may be patterned to obtain the second portion 122.
[0111] In one embodiment, see Figure 8e The preparation method may also include: preparing a light-emitting layer and a first electrode layer on the side of the second electrode 132 facing away from the substrate 11, the light-emitting layer and the first electrode layer are disconnected at the isolation structure 12, and the light-emitting unit 1301 and the first electrode 131 are obtained respectively, and the first electrode 131 and the isolation structure 12 are overlapped to obtain a display panel.
[0112] The light-emitting layer and the first electrode layer can be formed by an evaporation process.
[0113] In one embodiment, the preparation method may further include: preparing an encapsulation portion 15 , an organic encapsulation layer 16 and an inorganic encapsulation layer 17 on a side of the first electrode 131 facing away from the substrate 11 .
[0114] Fig. 9 This is a flow chart of a method for manufacturing a display panel provided in the second embodiment of the present application. Fig. 9 As shown, the preparation method comprises:
[0115] Step S910 , preparing an isolation structure on a substrate, the substrate including a second electrode, the isolation structure enclosing an isolation opening, and an orthographic projection of the isolation opening on the substrate and an orthographic projection of the second electrode on the substrate at least partially overlap.
[0116] Step S920: preparing a reflective structure on the side of the isolation structure facing away from the substrate.
[0117] Figure 10a-Figure 10c This is a schematic diagram of the structure of an intermediate product obtained during the execution of the preparation method provided in the first embodiment of the present application. The preparation method specifically includes:
[0118] According to step S910, refer to Fig.10a , an isolation structure 12 is prepared on the substrate 11 , the isolation structure 12 encloses an isolation opening 125 , and the orthographic projection of the isolation opening 125 on the substrate 11 and the orthographic projection of the second electrode 132 on the substrate 11 at least partially overlap.
[0119] The isolation material layer is prepared by film forming process, and then the isolation material layer is patterned to obtain the isolation structure 12. For example, a groove can be formed on the isolation material layer by dry etching process, and then the sidewall of the groove can be further etched by wet etching process to form an undercut structure.
[0120] According to step S920, refer to Fig.10b , a reflective structure 14 is prepared on the side of the isolation structure 12 facing away from the substrate 11.
[0121] The reflective material layer is prepared by adopting a film-forming process, and the reflective material layer is patterned to form a reflective structure 14 .
[0122] In one embodiment, see Fig.10c The preparation method may also include: preparing a light-emitting layer and a first electrode layer on the side of the second electrode 13 facing away from the substrate 11, the light-emitting layer and the first electrode layer are disconnected at the isolation structure 12, and the light-emitting unit 1301 and the first electrode 131 are obtained respectively, and the first electrode 131 and the isolation structure 12 are overlapped to obtain a display panel.
[0123] The light-emitting layer and the first electrode layer can be formed by an evaporation process.
[0124] In one embodiment, the preparation method may further include: preparing an encapsulation portion 15 , an organic encapsulation layer 16 and an inorganic encapsulation layer 17 on a side of the first electrode 131 facing away from the substrate 11 .
[0125] Fig.11 This is a flow chart of a method for manufacturing a display panel provided in the third embodiment of the present application. Fig.11 As shown, the preparation method comprises:
[0126] Step S1110: sequentially preparing a second isolation material layer, a first isolation material layer and a reflective material layer on a substrate, wherein the substrate includes a second electrode.
[0127] Step S1120, dry etching the reflective material layer to obtain a reflective structure.
[0128] Step S1130, patterning the first isolation material layer and the second isolation material layer to obtain the first part and the second part and the isolation opening enclosed by the first part and the second part, the orthographic projection of the isolation opening on the substrate and the orthographic projection of the second electrode on the substrate at least partially overlap; the orthographic projection of the second part on the substrate is within the range of the orthographic projection of the first part on the substrate.
[0129] Figure 12a-12e This is a schematic diagram of the structure of an intermediate product obtained during the execution of the preparation method provided in the first embodiment of the present application. The preparation method specifically includes:
[0130] According to step S1110, refer to Fig.12a , a second isolation material layer 1202 , a first isolation material layer 1201 and a reflective material layer 140 are sequentially prepared on a substrate, and the substrate 11 includes a second electrode 132 .
[0131] According to step S1120, refer to Figure 12b , the reflective material layer 140 is dry-etched to obtain the reflective structure 14.
[0132] According to step S1130, refer to Fig.12c , the first isolation material layer 1201 and the second isolation material layer 1202 are dry-etched to obtain the first part 121.
[0133] See also Fig.12d , the second isolation material layer 1202 is wet-etched to obtain the second part 122, the first part 121 and the second part 122 together enclose an isolation opening 125, the orthographic projection of the isolation opening 125 on the substrate 11 and the orthographic projection of the second electrode 132 on the substrate 11 at least partially overlap, and the orthographic projection of the second part 122 on the substrate 11 is within the range of the orthographic projection of the first part 121 on the substrate 11.
[0134] In one embodiment, see Fig.12e The preparation method also includes: preparing a light-emitting layer and a first electrode layer on the side of the second electrode 13 facing away from the substrate 11, the light-emitting layer and the first electrode layer are disconnected at the isolation structure 12, and the light-emitting unit 1301 and the first electrode 131 are obtained respectively, and the first electrode 131 and the isolation structure 12 are overlapped to obtain a display panel.
[0135] The light-emitting layer and the first electrode layer can be formed by an evaporation process.
[0136] In one embodiment, the preparation method may further include: preparing an encapsulation portion 15 , an organic encapsulation layer 16 and an inorganic encapsulation layer 17 on a side of the first electrode 131 facing away from the substrate 11 .
[0137] Patent PCT / CN2023 / 134518, patent 202310759370.2, patent 202310740412.8, patent 202310707209.0, patent 202311499823.9, patent 202310692671.8, patent 202311091555.7 and patent 202311346196.5 record relevant technical solutions of the isolation structure, and their contents are incorporated into this application by reference for reference.
[0138] Fig.13 This is a schematic diagram of the structure of a display device provided in one embodiment of the present application. Fig.13 As shown, the display device is a product with an image display function. For example, the display device can be used to display static images, such as pictures or photos. The display device can also be used to display dynamic images, such as videos.
[0139] The display device can be a laptop computer, a mobile phone, a handheld or portable computer, a camera, a camcorder, a vehicle-mounted intelligent central control screen, a calculator, a smart watch, a GPS navigator, an electronic photo, an electronic billboard or sign, a projector, etc.
[0140] The display device includes the display panel 130 provided by any of the above embodiments. The display panel 130 may be an organic light emitting diode display substrate or a quantum dot electroluminescent display substrate.
[0141] In addition, the display device may also have functions such as taking photos, recording videos, fingerprint recognition, and face recognition. Accordingly, the display device also includes at least one functional module for realizing the above functions, such as an under-screen camera, an under-screen fingerprint recognition sensor, and the like.
[0142] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.
[0143] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.
Claims
1. A display panel, characterized in that: include: substrate; An isolation structure, located on one side of the substrate, the isolation structure encloses at least one isolation opening; at least one light emitting device, the light emitting device being at least partially located within the isolation opening; as well as A reflective structure is located on the side of the isolation structure away from the substrate, and the reflective structure is used to converge the light emitted from the light-emitting device at a predetermined viewing angle to a positive viewing angle, where the predetermined viewing angle is greater than or equal to 45° and less than 90°.
2. The display panel according to claim 1, characterized in that: The orthographic projection of the reflective structure on the substrate is located within the orthographic projection range of the isolation structure on the substrate.
3. The display panel according to claim 2, characterized in that: The reflective structure encloses a light-collecting opening, and the orthographic projection of the light-collecting opening on the substrate covers the orthographic projection of the isolation opening on the substrate; Preferably, in the thickness direction of the substrate, the cross-sectional shape of the reflective structure is a trapezoid; Preferably, in the thickness direction of the substrate, the cross-section of the side wall surface of the reflective structure is in an arc shape; Preferably, the angle between the cross section of the side wall surface of the reflective structure and the plane where the substrate is located is greater than or equal to 45 degrees and less than or equal to 80 degrees.
4. The display panel according to claim 2, characterized in that: The isolation structure includes a first part and a second part stacked together, the second part is located on the side of the first part facing the substrate, the orthographic projection of the second part on the substrate is located within the orthographic projection range of the first part on the substrate, and the orthographic projection of the reflective structure on the substrate is located within the orthographic projection range of the second part on the substrate.
5. The display panel according to claim 4, characterized in that: The first portion includes a first plane sub-portion and at least one second plane sub-portion, and a first connecting sub-portion connecting the first plane sub-portion and the second plane sub-portion; the orthographic projection of the first plane sub-portion on the substrate surrounds the orthographic projection of the light-emitting device on the substrate, and the second plane sub-portion is located on the side of the first plane sub-portion facing the isolation opening; The distance between the first plane sub-portion and the substrate is smaller than the distance between the second plane sub-portion and the substrate; the orthographic projection of the reflective structure on the substrate is located within the orthographic projection range of the first plane sub-portion on the substrate.
6. The display panel according to claim 5, characterized in that: The first connecting sub-portion, the reflective structure, and the first planar sub-portion located between the first connecting sub-portion and the reflective structure enclose a groove, and the orthographic projection of the groove on the substrate surrounds the orthographic projection of the light-emitting device on the substrate.
7. The display panel according to claim 1, characterized in that: The distance between a surface of the reflective structure facing away from the substrate and the substrate is greater than the maximum distance between a surface of the isolation structure facing away from the substrate and the substrate.
8. The display panel according to claim 4, characterized in that: The second portion includes a conductive electronic portion; Preferably, the material of the second part is aluminum, copper or silver; Preferably, the material of the first part is titanium or molybdenum.
9. The display panel according to claim 4, characterized in that: The isolation structure further includes a third portion, which is located on the side of the second portion facing the substrate; the orthographic projection of the second portion on the substrate is located within the orthographic projection range of the third portion on the substrate; Preferably, the material of the third part is molybdenum or titanium.
10. The display panel according to claim 4, characterized in that: It also includes a pixel definition layer, which is located on the side of the isolation structure facing the substrate, the pixel definition layer encloses a pixel opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection range of the isolation opening on the substrate; Preferably, the distance between the outer edge of the orthographic projection of the pixel definition layer on the substrate toward the orthographic projection of the light-emitting device on the substrate and the outer edge of the orthographic projection of the first part on the substrate toward the orthographic projection of the light-emitting device on the substrate is greater than or equal to 1 micron and less than or equal to 10 microns.
11. The display panel according to claim 5, characterized in that: The light emitting device comprises a first electrode and a second electrode stacked together, wherein the first electrode is located on a side of the second electrode away from the substrate; Preferably, the orthographic projection of the first connecting sub-portion on the substrate covers the edge area of the orthographic projection of the second electrode on the substrate; Preferably, the first electrode and the second portion are overlapped; Preferably, in a direction perpendicular to the substrate, a thickness of the second electrode is greater than or equal to 1000 angstroms and less than or equal to 3000 angstroms.
12. The display panel according to claim 4, characterized in that: The reflective structure and the first part are made of the same material; Preferably, the reflective structure and the first part are integrally formed.
13. The display panel according to claim 4, characterized in that: In a direction perpendicular to the substrate, the sum of the thickness of the reflective structure and the first portion is greater than the thickness of the second portion; Preferably, the sum of the thickness of the reflective structure and the first portion is greater than or equal to 8000 angstroms and less than or equal to 10000 angstroms; Preferably, the thickness of the second portion is greater than or equal to 6000 angstroms and less than or equal to 8000 angstroms; Preferably, the thickness of the first portion is greater than or equal to 500 angstroms and less than or equal to 1500 angstroms; Preferably, the distance between the outer edge of the orthographic projection of the first part on the substrate toward the orthographic projection of the light-emitting device on the substrate and the outer edge of the orthographic projection of the reflective structure on the substrate toward the orthographic projection of the light-emitting device on the substrate is greater than or equal to 1 micron and less than or equal to 3 microns.
14. The display panel according to claim 1, characterized in that: It also includes a packaging part, the packaging part is located on a side of the light-emitting device away from the substrate; the edge of the packaging part is located on a side of the isolation structure away from the substrate; Preferably, there are a plurality of packaging parts, a plurality of light-emitting devices, and the packaging parts and the light-emitting devices are arranged correspondingly; Preferably, the display panel further comprises an organic encapsulation layer, which is located on a side of the encapsulation portion away from the substrate, and the orthographic projection of the organic encapsulation layer on the substrate covers the orthographic projection of the encapsulation portion on the substrate; Preferably, the display panel further comprises an inorganic encapsulation layer located on a side of the organic encapsulation layer away from the substrate, and an orthographic projection of the inorganic encapsulation layer on the substrate covers an orthographic projection of the organic encapsulation layer on the substrate.
15. A method for preparing a display panel, characterized in that: include: sequentially preparing a second isolation material layer and a first isolation material layer on a substrate, wherein the substrate includes a second electrode; Patterning the first isolation material layer and the second isolation material layer and etching the first isolation material layer to form an isolation structure and a reflective structure, wherein the isolation structure encloses an isolation opening, and an orthographic projection of the isolation opening on the substrate and an orthographic projection of the second electrode on the substrate at least partially overlap; The reflective structure is located on a side of the isolation structure away from the substrate; Preferably, patterning the first isolation material layer and the second isolation material layer and etching the first isolation material layer includes: The first isolation material layer and the second isolation material layer are patterned to obtain the second part, and the first isolation material layer is etched to obtain the first part and the reflective structure; the first part and the second part enclose the isolation opening; the orthographic projection of the reflective structure on the substrate is located within the orthographic projection range of the first part on the substrate; the orthographic projection of the second part on the substrate is located within the orthographic projection range of the first part on the substrate.
16. A method for preparing a display panel, characterized in that: include: Preparing an isolation structure on a substrate, the substrate comprising a second electrode, the isolation structure enclosing an isolation opening, an orthographic projection of the isolation opening on the substrate and an orthographic projection of the second electrode on the substrate at least partially overlapping; A reflective structure is prepared on the side of the isolation structure facing away from the substrate.
17. A method for preparing a display panel, characterized in that: include: sequentially preparing a second insulating material layer, a first insulating material layer and a reflective material layer on a substrate, wherein the substrate includes a second electrode; Performing dry etching on the reflective material layer to obtain a reflective structure; Patterning the first isolation material layer and the second isolation material layer to obtain an isolation opening enclosed by the first portion and the second portion and the first portion and the second portion, wherein an orthographic projection of the isolation opening on the substrate at least partially overlaps an orthographic projection of the second electrode on the substrate; The orthographic projection of the second portion on the substrate is located within the orthographic projection range of the first portion on the substrate.
18. A display device, characterized in that: A display panel comprising any one of claims 1-14, or a display panel obtained by the preparation method according to any one of claims 15-17.
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