Display panel, preparation method of display panel and display device

Abstract

The embodiment of the invention provides a display panel, a preparation method of the display panel and a display device. The display panel comprises a substrate; the isolation structure is arranged on one side of the substrate, an isolation opening is defined by the isolation structure, the isolation structure comprises an insulating material, and the isolation structure is provided with a side wall face facing the isolation opening; the light-emitting layer comprises a light-emitting part located at the isolation opening, and at least part of the light-emitting part is in contact connection with the side wall surface. The yield of the light-emitting part can be improved, and the processing performance of the display panel can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a method for preparing a display panel, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the process performance of current OLED display products needs to be improved. Summary of the invention

[0004] The embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device, aiming to improve the process performance of the display panel.

[0005] An embodiment of the first aspect of the present application provides a display panel, which includes: a substrate; an isolation structure, which is arranged on one side of the substrate and encloses an isolation opening, the isolation structure includes an insulating material, and the isolation structure has a side wall surface facing the isolation opening; a light-emitting layer, including a light-emitting portion located in the isolation opening, at least a portion of the light-emitting portion is in contact with the side wall surface.

[0006] According to an implementation of the first aspect of the present application, the thickness of the light-emitting portion is less than or equal to the thickness of the isolation structure.

[0007] According to any of the aforementioned embodiments of the first aspect of the present application, it also includes: a sacrificial portion located on the side of the light-emitting portion away from the substrate.

[0008] According to any of the aforementioned embodiments of the first aspect of the present application, the sacrificial portion exposes at least a portion of the light-emitting portion.

[0009] According to any of the aforementioned embodiments of the first aspect of the present application, the sacrificial portion is in contact with the side wall surface.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, the sacrificial portion includes two or more sacrificial sub-layers that are stacked.

[0011] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the sacrificial part includes at least one of oxide, nitride, metal, and organic material.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the multiple sacrificial sublayers include a first sacrificial sublayer and a second sacrificial sublayer stacked in a direction away from the substrate, the material of the first sacrificial sublayer includes at least one of oxide, nitride, and metal, and the material of the second sacrificial sublayer includes an organic material.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the second sacrificial sublayer includes a fluorine-containing organic material.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, it also includes: a flat portion located on the side of the isolation structure and the sacrificial portion facing away from the substrate.

[0015] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the isolation structure on the substrate is located within the orthographic projection of the flat portion on the substrate.

[0016] According to any of the aforementioned embodiments of the first aspect of the present application, the edge of the orthographic projection of the flat portion on the substrate is located within the orthographic projection of the sacrificial portion on the substrate.

[0017] According to any of the aforementioned embodiments of the first aspect of the present application, the cross-section of the flat portion gradually decreases in a direction away from the substrate.

[0018] According to any of the aforementioned embodiments of the first aspect of the present application, the flat portion includes a first top surface facing away from the substrate and a first side surface connected to the peripheral side of the first top surface and extending toward the substrate, and the first side surface is inclined in a direction away from the isolation opening in a direction away from the substrate.

[0019] According to any of the aforementioned embodiments of the first aspect of the present application, the light-emitting layer further includes a first carrier functional layer covering the flat portion and the light-emitting portion.

[0020] According to any of the aforementioned embodiments of the first aspect of the present application, a second electrode layer is disposed on a side of the first carrier functional layer facing away from the substrate.

[0021] According to any of the aforementioned embodiments of the first aspect of the present application, the first carrier functional layer includes at least one of a hole blocking layer, an electron transport layer and an electron injection layer.

[0022] According to any of the aforementioned embodiments of the first aspect of the present application, the side of the isolation structure facing away from the substrate further includes a redundant portion.

[0023] According to any of the aforementioned embodiments of the first aspect of the present application, the redundant portion is arranged around the isolation opening.

[0024] According to any of the aforementioned embodiments of the first aspect of the present application, the redundant part includes more than two redundant sublayers, and the material of one of the more than two redundant sublayers is the same as the material of the light-emitting part, and the material of the other is the same as the material of the sacrificial part.

[0025] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure has a second top surface facing away from the substrate, the light-emitting portion has a third top surface facing away from the substrate, and the third top surface is on the side of the second top surface facing the substrate.

[0026] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure includes a second bottom surface facing the substrate, and the orthographic projection of the second bottom surface on the substrate is located within the orthographic projection of the second top surface on the substrate.

[0027] According to any of the aforementioned embodiments of the first aspect of the present application, the cross section of the isolation structure gradually increases in a direction away from the substrate, and the side wall surface is inclined in a direction close to the isolation opening.

[0028] Alternatively, the isolation structure includes a first sublayer and a second sublayer located on the side of the first sublayer facing away from the substrate, the second top surface is located on the side of the second sublayer facing away from the substrate, the second bottom surface is located on the side of the first sublayer facing the substrate, and the orthographic projection of the first sublayer on the substrate is located within the orthographic projection of the second sublayer on the substrate.

[0029] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure further includes a third sublayer, and the third sublayer is located on a side of the first sublayer facing the substrate.

[0030] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the first sub-layer on the substrate is located within the orthographic projection of the third sub-layer on the substrate.

[0031] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the isolation structure includes inorganic material and / or organic material.

[0032] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the isolation structure includes an inorganic material, the isolation structure includes two or more isolation sublayers stacked together, and the materials of at least two adjacent isolation sublayers are different.

[0033] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the isolation structure includes at least one of silicon oxide and silicon nitride.

[0034] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the isolation structure includes an organic material, and the isolation structure is integrally formed.

[0035] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure includes organic materials and inorganic materials, the isolation structure includes a first isolation sublayer and a second isolation sublayer stacked in a direction away from the substrate, the material of the first isolation sublayer includes organic material, and the material of the second isolation sublayer includes inorganic material.

[0036] According to any of the aforementioned embodiments of the first aspect of the present application, it also includes a pixel definition layer, which is arranged on one side of the substrate, and the pixel definition layer includes a pixel defining portion and a pixel opening opened in the pixel defining portion, and the isolation structure is arranged on the side of the pixel defining portion away from the substrate, and the pixel opening and the isolation opening are connected, and at least part of the light-emitting portion is located at the pixel opening.

[0037] According to any of the aforementioned embodiments of the first aspect of the present application, at least a portion of the light-emitting portion extends from the pixel opening to a side of the pixel defining portion that is away from the substrate.

[0038] According to any of the aforementioned embodiments of the first aspect of the present application, the light-emitting portion includes a first partition and a second partition, the first partition is located at the pixel opening, the second partition is located on the side of the pixel defining portion away from the substrate, and the second partition is in contact with the side wall surface.

[0039] According to any of the aforementioned embodiments of the first aspect of the present application, the thickness of the second partition is less than or equal to the thickness of the isolation structure.

[0040] According to any of the aforementioned embodiments of the first aspect of the present application, it also includes a first electrode, which is arranged between the substrate and the isolation structure.

[0041] The embodiment of the second aspect of the present application further provides a method for preparing a display panel, including:

[0042] A first conductive material layer is provided on the substrate, and the first conductive material layer is patterned to form a plurality of first electrodes distributed at intervals;

[0043] A second insulating material layer is disposed on a side of the first electrode facing away from the substrate, and the second insulating material layer is patterned to form an isolation structure with an isolation opening, wherein the isolation structure has a side wall surface facing the isolation opening;

[0044] A light-emitting material layer is arranged on the side of the isolation structure and the first electrode facing away from the substrate, and the light-emitting material layer is patterned to form a light-emitting portion located in the isolation opening, and at least part of the light-emitting portion is in contact with the side wall surface.

[0045] According to an implementation of the second aspect of the present application, a light-emitting material layer is provided on a side of the isolation structure and the first electrode facing away from the substrate, and the light-emitting material layer is patterned to form a light-emitting portion located in the isolation opening, and at least part of the light-emitting portion is contacted and connected with the side wall surface, the step includes:

[0046] A light emitting material layer and a sacrificial material layer are sequentially arranged on the side of the isolation structure and the first electrode away from the substrate, and the light emitting material layer and the sacrificial material layer are patterned to form a light emitting portion and a sacrificial preparation portion located in the isolation opening.

[0047] According to any of the aforementioned embodiments of the second aspect of the present application, a light-emitting material layer and a sacrificial material layer are sequentially provided on the side of the isolation structure and the first electrode facing away from the substrate, and after the step of patterning the light-emitting material layer and the sacrificial material layer to form a light-emitting portion and a sacrificial preparatory portion located in the isolation opening, the step further includes:

[0048] A third insulating material layer is disposed on a side of the light-emitting portion and the isolation structure facing away from the substrate;

[0049] The third insulating material layer is patterned to form a flat portion, where the flat portion is located on a side of the isolation structure and the sacrificial preparation portion facing away from the substrate.

[0050] According to any of the aforementioned embodiments of the second aspect of the present application, the orthographic projection of the isolation structure on the substrate is located within the orthographic projection of the flat portion on the substrate.

[0051] According to any of the aforementioned embodiments of the second aspect of the present application, after the step of patterning the third insulating material layer to form a flat portion, wherein the flat portion is located on a side of the isolation structure and the sacrificial preparation portion away from the substrate, the step further includes:

[0052] The sacrificial preparation portion is patterned to form a sacrificial portion, wherein the sacrificial portion is located at a side of the light emitting portion away from the substrate and exposes at least a portion of the light emitting portion.

[0053] According to any of the aforementioned embodiments of the second aspect of the present application, it also includes: preparing a first carrier functional layer and a second electrode layer on the side of the sacrificial portion, the flat portion and the light-emitting portion facing away from the substrate.

[0054] According to any of the aforementioned embodiments of the second aspect of the present application, the isolation opening includes a first isolation opening, a second isolation opening, and a third isolation opening, and a light-emitting material layer and a sacrificial material layer are sequentially arranged on a side of the isolation structure and the first electrode away from the substrate, and the steps of patterning the light-emitting material layer and the sacrificial material layer to form a light-emitting portion and a sacrificial preparatory portion located in the isolation opening include:

[0055] A first light emitting material layer and a first sacrificial material layer are sequentially arranged on a side of the isolation structure and the first electrode facing away from the substrate;

[0056] The first light emitting material layer and the first sacrificial material layer are patterned to form a first light emitting portion and a first sacrificial preparation portion located in the first isolation opening.

[0057] According to any of the aforementioned embodiments of the second aspect of the present application, in the step of patterning the first light-emitting material layer and the first sacrificial material layer to form a first light-emitting portion and a first sacrificial preparation portion located in the first isolation opening, a first redundant portion is also formed on the side of the isolation structure away from the substrate.

[0058] According to any of the aforementioned embodiments of the second aspect of the present application, after the step of patterning the first light-emitting material layer and the first sacrificial material layer to form the first light-emitting portion and the first sacrificial preparation portion located in the first isolation opening, the step further includes:

[0059] A second light emitting material layer and a second sacrificial material layer are sequentially arranged on a side of the isolation structure and the first electrode facing away from the substrate;

[0060] The second light emitting material layer and the second sacrificial material layer are patterned to form a second light emitting portion and a second sacrificial preparation portion located in the second isolation opening.

[0061] According to any of the aforementioned embodiments of the second aspect of the present application, in the step of patterning the second light-emitting material layer and the second sacrificial material layer to form a second light-emitting portion and a second sacrificial preparation portion located in the second isolation opening, a second redundant portion is also formed on the side of the isolation structure away from the substrate.

[0062] According to any of the aforementioned embodiments of the second aspect of the present application, the second redundant portion and the first redundant portion are spaced apart from each other on a side of the isolation structure facing away from the substrate.

[0063] According to any of the aforementioned embodiments of the second aspect of the present application, after the step of patterning the second light-emitting material layer and the second sacrificial material layer to form the second light-emitting portion and the second sacrificial preparation portion located in the second isolation opening, the step further includes:

[0064] A third light emitting material layer and a third sacrificial material layer are sequentially disposed on a side of the isolation structure and the first electrode facing away from the substrate;

[0065] The third light emitting material layer and the third sacrificial material layer are patterned to form a third light emitting portion and a third sacrificial preparatory portion located in the third isolation opening.

[0066] According to any of the aforementioned embodiments of the second aspect of the present application, in the step of patterning the third light-emitting material layer and the third sacrificial material layer to form a third light-emitting portion and a third sacrificial preparation portion located in the third isolation opening, a third redundant portion is also formed on the side of the isolation structure away from the substrate.

[0067] According to any of the aforementioned embodiments of the second aspect of the present application, the third redundant portion and the first redundant portion are spaced apart on a side of the isolation structure away from the substrate; or, the third redundant portion and the second redundant portion are spaced apart on a side of the isolation structure away from the substrate.

[0068] According to any of the aforementioned embodiments of the second aspect of the present application, a second insulating material layer is provided on a side of the first electrode facing away from the substrate, and the second insulating material layer is patterned to form an isolation structure having an isolation opening, wherein the isolation structure has a sidewall surface facing the isolation opening, before the step further includes:

[0069] A first insulating material layer is disposed on a side of the first electrode facing away from the substrate, and the first insulating material layer is patterned to form a pixel defining portion having a pixel opening, wherein a portion of the first electrode is exposed through the pixel opening;

[0070] A second insulating material layer is arranged on the side of the first electrode facing away from the substrate, and the second insulating material layer is patterned to form an isolation structure with an isolation opening, wherein the isolation structure has a side wall surface facing the isolation opening, and the step includes: a second insulating material layer is arranged on the side of the pixel defining portion facing away from the substrate, and the isolation opening and the pixel opening are connected.

[0071] According to any of the aforementioned embodiments of the second aspect of the present application, at least a portion of the light-emitting portion extends from the pixel opening to a side of the pixel defining portion that is away from the substrate.

[0072] An embodiment of the third aspect of the present application provides a display device, comprising a display panel provided by any of the embodiments of the first aspect, or a display panel prepared by any of the embodiments of the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0073] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features.

[0074] Figure 1 is a structural schematic diagram of a display panel provided in an embodiment of the present application;

[0075] Figure 2 In one example Figure 1 Sectional view at AA in the middle;

[0076] Figure 3 In another example Figure 1 Sectional view at AA in the middle;

[0077] Figure 4 In another example Figure 1 Sectional view at AA in the middle;

[0078] Figure 5 yes Figure 4 A schematic diagram of a local enlarged structure;

[0079] Figure 6 In another example Figure 1 Sectional view at AA in the middle;

[0080] Figure 7 It is a schematic flow chart of a method for preparing a display panel provided in an embodiment of the present application;

[0081] Figure 8is a schematic flow chart of a method for preparing a display panel provided in another embodiment of the present application;

[0082] Figures 9 to 14 It is a schematic diagram of the process structure of a method for preparing a display panel provided in an embodiment of the present application;

[0083] Fig.15 is a schematic flow chart of a method for preparing a display panel provided in another embodiment of the present application;

[0084] Figures 16 to 18 is a schematic diagram of a process structure of a method for preparing a display panel provided in another embodiment of the present application;

[0085] Fig.19 It is a schematic flow chart of a method for preparing a display panel provided in another embodiment of the present application.

[0086] Description of reference numerals:

[0087] 100, substrate; 110, first electrode;

[0088] 200, isolation structure; 210, isolation opening; 211, first isolation opening; 212, second isolation opening; 213, third isolation opening; 220, side wall surface; 230, second top surface; 240, second bottom surface; 201, first sublayer; 202, second sublayer; 203, third sublayer;

[0089] 300, pixel definition layer; 310, pixel definition portion; 320, pixel opening; 321, first pixel opening; 322, second pixel opening; 323, third pixel opening;

[0090] 400, light-emitting layer; 410, light-emitting portion; 411, first subarea; 412, second subarea; 413, third top surface; 414, second carrier functional layer; 415, light-emitting structure; 401, first light-emitting portion; 402, second light-emitting portion; 403, third light-emitting portion;

[0091] 500, Sacrifice Department; 510, Sacrifice Preparation Department;

[0092] 600, flat portion; 610, first top surface; 620, first side surface;

[0093] 710, first carrier functional layer; 720, second electrode layer;

[0094] 800, redundant part; 810, first redundant part; 820, second redundant part; 830, third redundant part;

[0095] 900, encapsulation layer; 910, first encapsulation layer; 920, second encapsulation layer; 930, third encapsulation layer;

[0096] X, first direction; Y, second direction; Z, thickness direction. DETAILED DESCRIPTION

[0097] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating examples of the present application. In the accompanying drawings and the following description, at least some of the known structures and technologies are not shown to avoid unnecessary ambiguity in the present application; and, for clarity, the size of some structures may be exaggerated. In addition, the features, structures or characteristics described below may be combined in one or more embodiments in any suitable manner.

[0098] In the description of the present application, it should be noted that, unless otherwise specified, "multiple" means more than two; the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating directions or positional relationships, are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0099] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of the embodiments of the present application. In the description of the present application, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0100] In the related art, when the sub-pixels of a display panel are prepared using etching processes such as photolithography, during the etching process, materials such as photoresist usually cover the top surface of the light-emitting material, and the sides of the light-emitting material are exposed. This causes the etching solution to damage the sub-pixels from the sides, affecting the yield of the sub-pixels.

[0101] In order to solve the above technical problems, this application is proposed. Figures 1 to 19 The manufacturing method of the display panel, the display panel and the display device according to the embodiments of the present application are described in detail.

[0102] Please also read Figure 1 and Figure 2 , Figure 1 is a schematic diagram of the structure of a display panel provided by an embodiment of the first aspect of the present application, Figure 2 In one example Figure 1 Cross-sectional view at AA in the middle.

[0103] like Figure 1 and Figure 2 As shown, an embodiment of the first aspect of the present application provides a display panel, which includes: a substrate 100; an isolation structure 200, which is arranged on one side of the substrate 100 and encloses an isolation opening 210, the isolation structure 200 includes an insulating material, and the isolation structure 200 has a side wall surface 220 facing the isolation opening 210; a light-emitting layer 400, including a light-emitting portion 410, at least a portion of the light-emitting portion 410 is in contact with the side wall surface 220.

[0104] In the display panel provided in the embodiment of the present application, the display panel includes a substrate 100, an isolation structure 200 and a light-emitting layer 400. The isolation structure 200 encloses and forms an isolation opening 210, so that the light emitted by the light-emitting portion 410 can be emitted from the isolation opening 210, thereby improving the influence of the isolation structure 200 on the light emission of the light-emitting portion 410. In addition, at least part of the light-emitting portion 410 is in contact with and connected to the side wall surface 220, so that the side wall surface 220 can provide protection to the light-emitting portion 410. When the light-emitting portion 410 is prepared by an etching process, the problem that the side of the light-emitting portion 410 is affected by etching can be improved, and the yield of the light-emitting portion 410 can be improved, thereby improving the performance of the display panel.

[0105] There are many ways to set the substrate 100. The substrate 100 may include a substrate and a first conductive layer, a second conductive layer, and a third conductive layer that are arranged on one side of the substrate and are stacked. An insulating layer is provided between adjacent conductive layers. Optionally, a drive device layer is provided on the substrate, and a pixel drive circuit is provided in the drive device layer. The pixel drive circuit includes a transistor and a storage capacitor. The transistor includes a semiconductor, a gate, a source and a drain. The storage capacitor includes a first plate and a second plate. As an example, the gate and the first plate can be located in the first conductive layer, the second plate can be located in the second conductive layer, and the source and drain can be located in the third conductive layer.

[0106] Optionally, a first electrode 110 is disposed on the substrate 100 , and a plurality of first electrodes 110 are spaced apart on the substrate 100 , and each first electrode 110 is exposed by each isolation opening 210 , so that the first electrode 110 can be in contact with and connected to the light-emitting portion 410 in the isolation opening 210 .

[0107] Optionally, the display panel further includes a pixel definition layer 300, which is disposed on one side of the substrate 100 and includes a pixel definition portion 310 and a pixel opening 320 opened in the pixel definition portion 310. The isolation structure 200 may be disposed on a side of the pixel definition portion 310 away from the substrate 100.

[0108] Optionally, the isolation opening 210 is connected to the pixel opening 320 , and at least part of the light emitting portion 410 extends from the pixel opening 320 to the side of the pixel defining portion 310 away from the substrate 100 and contacts and connects with the side wall surface 220 , so that the side wall surface 220 can provide protection for the light emitting portion 410 .

[0109] Optional, such as Figure 3 As shown, the display panel may not include the pixel definition layer 300, and the first electrode 110 and the isolation structure 200 are arranged at intervals on the substrate 100. It can be understood that the isolation structure 200 can be reused as a pixel defining portion.

[0110] The material of the pixel definition layer 300 may include an organic material or an inorganic material. For example, the material of the pixel definition layer 300 includes an organic insulating material, so that the pixel definition layer 300 has a suitable thickness.

[0111] Optionally, the pixel opening 320 includes a first pixel opening 321, a second pixel opening 322, and a third pixel opening 323, the light-emitting portion 410 includes a first light-emitting portion 401, a second light-emitting portion 402, and a third light-emitting portion 403, the first light-emitting portion 401 can be located at the first pixel opening 321, the second light-emitting portion 402 can be located at the second pixel opening 322, and the third light-emitting portion 403 can be located at the third pixel opening 323, and the light-emitting colors of the first light-emitting portion 401, the second light-emitting portion 402, and the third light-emitting portion 403 can be different to achieve color display of the display panel. Optionally, the first pixel opening 321, the second pixel opening 322, and the third pixel opening 323 are arrayed along the first direction X and the second direction Y.

[0112] In some optional embodiments, the light-emitting portion 410 includes a first partition 411 and a second partition 412 , the first partition 411 is located at the pixel opening 320 , the second partition 412 is located at the side of the pixel defining portion 310 away from the substrate 100 , and the second partition 412 is in contact with the side wall surface 220 .

[0113] In these optional embodiments, the light-emitting portion 410 is divided into two areas, namely, a first partition 411 and a second partition 412. The first partition 411 is located at the pixel opening 320 to contact and connect with the first electrode 110, so that the first electrode 110 can drive the first partition 411 to emit light. The second partition 412 extends to the side of the pixel defining portion 310 away from the substrate 100, which can expand the distribution area of ​​the light-emitting portion 410 to improve the problem that the light-emitting portion 410 is difficult to completely cover the pixel opening 320 due to process errors. The second partition 412 is in contact with the side wall surface 220, so that the side wall surface 220 can provide protection for the second partition 412.

[0114] Optionally, the thickness of the light-emitting portion 410 is less than or equal to the thickness of the isolation structure 200, for example, the thickness of the second partition 412 is less than or equal to the thickness of the isolation structure 200. The thickness of the light-emitting portion 410 refers to the extension dimension of the light-emitting portion 410 along the thickness direction Z of the display panel, the thickness of the second partition 412 refers to the extension dimension of the second partition 412 along the thickness direction Z of the display panel, and the thickness of the isolation structure 200 is the extension dimension of the isolation structure 200 along the thickness direction Z. When the thickness of the isolation structure 200 is greater than or equal to the thickness of the second partition 412, the side of the second partition 412 can be completely covered by the side wall surface 220, and the isolation structure 200 can provide more complete protection for the light-emitting portion 410. At the same time, the thickness of the light-emitting portion 410 is less than or equal to the thickness of the isolation structure 200, which is conducive to the light-emitting layer 400 being separated by the isolation structure 200 to form the light-emitting portion 410.

[0115] In some optional embodiments, the display panel further includes a sacrificial portion 500, which is located on the side of the light-emitting portion 410 facing away from the substrate 100, for example, the sacrificial portion 500 is located on the side of the second partition 412 facing away from the substrate 100. When the light-emitting portion 410 is prepared by an etching process, a sacrificial material layer can be covered on the light-emitting portion 410, and then a material such as a photoresist is further covered on the sacrificial material layer to improve the effect of direct contact between the photoresist material and the light-emitting material on the light-emitting material. The light-emitting portion 410 is formed by patterning the sacrificial material layer and the light-emitting material layer, and part of the sacrificial material falls on the second partition 412 to form the sacrificial portion 500. The sacrificial portion 500 can also provide protection for the second partition 412.

[0116] Optionally, the sacrificial portion 500 is disposed around the pixel opening 320 , and the sacrificial portion 500 may be in a closed ring shape.

[0117] Optionally, the sacrificial portion 500 is located at one side of the second partition 412. The sacrificial portion 500 exposes at least a portion of the light emitting portion 410, which can improve the influence of the sacrificial portion 500 on the light emitting effect of the light emitting portion 410.

[0118] Optionally, the sacrificial portion 500 and the side wall surface 220 may be in contact and connected to increase the area covered by the side wall surface 220 , so that the side wall surface 220 can provide more complete protection for the light-emitting portion 410 .

[0119] Optionally, the total thickness of the sacrificial portion 500 and the light emitting portion 410 is less than or equal to the thickness of the isolation structure 200 , so that the side surfaces of the sacrificial portion 500 and the light emitting portion 410 can be completely protected by the side wall surface 220 .

[0120] The sacrificial part 500 may be integrally provided, or the sacrificial part 500 may include two or more sacrificial sub-layers stacked in a thickness direction.

[0121] Optionally, the material of the sacrificial part 500 includes at least one of oxide, nitride, metal, and organic material. For example, the plurality of sacrificial sublayers include a first sacrificial sublayer and a second sacrificial sublayer stacked in a direction away from the substrate, the material of the first sacrificial sublayer includes at least one of oxide, nitride, and metal, and the material of the second sacrificial sublayer includes an organic material. Optionally, the material of the second sacrificial layer includes a fluorine-containing organic material.

[0122] Optionally, an isolation opening 210 is provided on the isolation structure 200, and the sacrificial portion 500 can be located on a side of the isolation structure 200 facing the isolation opening 210 and arranged around the pixel opening 320. The annular sacrificial portion 500 can better provide protection for the light-emitting portion 410, thereby improving the yield problem caused by the light-emitting portion 410 contacting the photoresist at different positions on the circumference.

[0123] In some optional embodiments, the display panel further includes a flat portion 600, which is located on the side of the isolation structure 200 and the sacrificial portion 500 away from the substrate 100. The flat portion 600 can provide a flatter surface. When the second electrode layer 720 is subsequently prepared, the second electrode layer 720 is prevented from being cut off by the isolation structure 200, so that the second electrode layer 720 is continuously arranged on the surface of the flat portion 600, which can improve the yield of the second electrode layer 720.

[0124] Optionally, the orthographic projection of the isolation structure 200 on the substrate 100 is located within the orthographic projection of the flat portion 600 on the substrate 100. The distribution area of ​​the flat portion 600 is larger than the area of ​​the isolation structure 200, so that the flat portion 600 can cover the isolation structure 200 and the sacrificial portion 500 located on the side of the isolation structure 200 facing the isolation opening 210.

[0125] In some optional embodiments, the orthographic edge of the flat portion 600 on the substrate 100 is located within the orthographic projection of the sacrificial portion 500 on the substrate 100. The edge of the flat portion 600 is retracted relative to the edge of the sacrificial portion 500 in a direction away from the isolation opening 210, so as to improve the adverse effect of the flat portion 600 extending out of the sacrificial portion 500 on the light emission of the light emitting portion 410.

[0126] Optionally, the cross-section of the flat portion 600 gradually decreases in a direction away from the substrate 100. For example, the flat portion 600 includes a first top surface 610 facing away from the substrate 100 and a first side surface 620 connected to the periphery of the first top surface 610 and extending toward the substrate 100. In the direction away from the substrate 100, the first side surface 620 is inclined in a direction away from the isolation opening 210.

[0127] In these optional embodiments, the first side surface 620 is tilted relative to the thickness direction so that the second electrode layer 720 can fall on the first side surface 620 and the second electrode layer 720 can be continuously distributed on the flat portion 600, thereby improving the yield of the second electrode layer 720.

[0128] There are many ways to set the light-emitting portion 410. For example, the light-emitting portion 410 includes a second carrier functional layer 414 and a light-emitting structure 415. The second carrier functional layer 414 is located on the side of the light-emitting structure 415 facing the first electrode 110. The second carrier functional layer 414 includes at least one of a hole transport layer, a hole injection layer, and an electron blocking layer. Optionally, the second carrier functional layer 414 may also include at least one of an electron transport layer, an electron injection layer, and a hole blocking layer. It should be noted that the second carrier functional layer 414 is not specifically limited, and it can be matched with the first electrode 110. Exemplarily, when the first electrode 110 is an anode, the second carrier functional layer 414 includes at least one of a hole transport layer, a hole injection layer, and an electron blocking layer; when the first electrode 110 is a cathode, the second carrier functional layer 414 may also include at least one of an electron transport layer, an electron injection layer, and a hole blocking layer.

[0129] In some optional embodiments, the light-emitting layer 400 further includes a first carrier functional layer 710 covering the flat portion 600 and the light-emitting portion 410. That is, the first carrier functional layer 710 is a common layer, and the first carrier functional layer 710 is arranged to cover the light-emitting portion 410 and the flat portion 600 on the entire surface. The second electrode layer 720 may be located on the side of the first carrier functional layer 710 away from the substrate 100, and the second electrode layer 720 is arranged to cover the first carrier functional layer 710 on the entire surface. Both the first carrier functional layer 710 and the second electrode layer 720 may be a common layer.

[0130] Optionally, it should be noted that the first carrier functional layer 710 is not specifically limited, and can be matched with the second electrode layer 720. Exemplarily, when the second electrode layer 720 is an anode, the first carrier functional layer 710 includes at least one of a hole transport layer, a hole injection layer, and an electron blocking layer; when the second electrode layer 720 is a cathode, the first carrier functional layer 710 may also include at least one of an electron transport layer, an electron injection layer, and a hole blocking layer.

[0131] Optionally, an encapsulation layer 900 is disposed on the second electrode layer 720, and the encapsulation layer 900 is used to provide encapsulation protection for the light-emitting portion 410. The encapsulation layer 900, for example, includes a first encapsulation layer 910, a second encapsulation layer 920, and a third encapsulation layer 930, the first encapsulation layer 910 and the third encapsulation layer 930 may be inorganic encapsulation layers, and the second encapsulation layer 920 may be an organic encapsulation layer.

[0132] In some optional embodiments, such as Figure 4 and Figure 5 As shown, the display panel further includes a redundant portion 800, and the redundant portion 800 is located on the side of the isolation structure 200 away from the substrate 100. During the preparation process of the light-emitting portion 410, part of the light-emitting material or sacrificial material falls on the isolation structure 200, and this part is not completely removed to form the redundant portion 800. For example, when the light-emitting material layer and the sacrificial layer are patterned using a photoresist, the edge of the photoresist portion falls on the isolation structure 200, and the photoresist covers part of the light-emitting material or sacrificial material located on the isolation structure 200, thereby causing part of the light-emitting material layer and the sacrificial layer on the isolation structure 200 to be not completely removed to form the redundant portion 800.

[0133] Optionally, the redundant portion 800 is disposed around the isolation opening 210. For example, the redundant portion 800 surrounds the sacrificial portion 500 in a ring shape.

[0134] Optionally, the sacrificial portion 500 and the redundant portion 800 are disconnected at the edge of the isolation structure 200 .

[0135] Optionally, the redundant portion 800 and the second partition 412 are disconnected, and the redundant portion 800 and the second partition 412 are discontinuous, so that the second partition 412 can contact the side wall surface 220 , so that the side wall surface 220 can provide protection for the second partition 412 .

[0136] Optionally, a redundant portion 800 is disposed on the circumference of each isolation opening 210 .

[0137] Optionally, the redundant part 800 includes more than two redundant sub-layers, and the material of one of the more than two redundant sub-layers is the same as the material of the light-emitting part 410, and the material of the other is the same as the material of the sacrificial part 500. As described above, when preparing the light-emitting part 410 and the sacrificial part 500, the distribution range of the photoresist will be appropriately expanded so that the photoresist covers the light-emitting material layer and the sacrificial layer on the isolation structure 200, thereby forming the redundant part 800. Therefore, the material of the sub-layer of the redundant part 800 is the same as the material of the second partition 412 of the light-emitting part 410 and the material of the sacrificial part 500.

[0138] The composition, preparation and other contents of the isolation structure 200 are further described in patents PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202410008807.3, and 202311017132.0 for reference.

[0139] In some optional embodiments, the isolation structure 200 has a second top surface 230 facing away from the substrate 100, and the light-emitting portion 410 has a third top surface 413 facing away from the substrate 100, and the third top surface 413 is on the side of the second top surface 230 facing the substrate 100. That is, the second top surface 230 is protruded relative to the third top surface 413 in a direction away from the substrate 100, so that the light-emitting materials of the light-emitting portion 410 and the redundant portion 800 are disconnected, and at the same time, the side of the light-emitting portion 410 can be completely covered by the isolation structure 200, thereby improving the protection performance of the isolation structure 200.

[0140] Optionally, the isolation structure 200 includes a second bottom surface 240 facing the substrate 100, and the orthographic projection of the second bottom surface 240 on the substrate 100 is located within the orthographic projection of the second top surface 230 on the substrate 100, that is, the size of the second bottom surface 240 is less than or equal to the size of the second top surface 230, so that a concave is easily formed under the second top surface 230, and the luminescent material is easily broken at the edge of the isolation structure 200.

[0141] Optional, such as Figures 2 to 5 As shown, the isolation structure 200 is integrally formed, and the cross section of the isolation structure 200 gradually increases in the direction away from the substrate 100, and the side wall surface 220 is inclined in the direction close to the isolation opening 210. In these embodiments, the isolation structure 200 is in an inverted trapezoidal shape, and the side wall surface 220 of the isolation structure 200 is easily concave, which facilitates the light-emitting material to break at the edge of the isolation structure 200.

[0142] In some other optional embodiments, such as Figure 6As shown, the isolation structure 200 includes a first sublayer 201 and a second sublayer 202 located on the side of the first sublayer 201 facing away from the substrate 100, the second top surface 230 is located on the side of the second sublayer 202 facing away from the substrate 100, the second bottom surface 240 is located on the side of the first sublayer 201 facing the substrate 100, and the orthographic projection of the first sublayer 201 on the substrate 100 is located within the orthographic projection of the second sublayer 202 on the substrate 100.

[0143] In these optional embodiments, the isolation structure 200 is divided into a first sublayer 201 and a second sublayer 202 . The size of the first sublayer 201 is smaller than that of the second sublayer 202 , so that a concave can be formed under the second sublayer 202 , facilitating the breaking of the luminescent material at the edge of the second sublayer 202 .

[0144] Optionally, the isolation structure 200 may further include a third sublayer 203, which is located on the side of the first sublayer 201 facing the substrate 100, and the third sublayer 203 may be arranged to protrude toward the isolation opening 210 relative to the first sublayer 201. For example, the orthographic projection of the first sublayer 201 on the substrate 100 is located within the orthographic projection of the third sublayer 203 on the substrate 100. When the first sublayer 201 is side-engraved so that the size of the first sublayer 201 is smaller than that of the second sublayer 202, due to the presence of the third sublayer 203, the third sublayer 203 may provide protection to the film layer on the side of the substrate 100, thereby improving the impact of the first sublayer 201 on the film layer on the side of the substrate 100 when the side is engraved. Optionally, the material of the isolation structure 200 includes an insulating material, for example, the material of the isolation structure 200 includes an inorganic material and / or an organic material, so that the isolation structure 200 has good insulation performance, and when the light-emitting portion 410 and the side wall surface 220 of the isolation structure 200 are in contact and connected, the problem of carriers in the light-emitting portion 410 crosstalking with each other through the isolation structure 200 can be improved. For example, when the target light-emitting portion 410 is lit and the carriers move in the lit target light-emitting portion 410, the display problems such as color cast and crosstalk caused by the carriers moving to the nearby light-emitting portion 410 and causing other light-emitting portions 410 to be lit can be improved.

[0145] Optionally, the isolation structure 200 includes an inorganic material, and the isolation structure 200 includes two or more isolation sublayers stacked, and at least two adjacent isolation sublayers are made of different materials. By providing isolation sublayers of different materials, the isolation sublayers can be etched at different rates, so that the orthographic projection of the second bottom surface 240 on the substrate 100 is located within the orthographic projection of the second top surface 230 on the substrate 100, so that the cross-section of the isolation structure 200 can be T-shaped, which facilitates the breakage of the light-emitting material at the edge of the isolation structure 200. The two or more isolation sublayers may include the first sublayer 201 and the second sublayer 202 mentioned above.

[0146] Optionally, when the isolation structure 200 includes an inorganic material, the material of the isolation structure 200 may include at least one of silicon oxide and silicon nitride, for example, the material of one of the two or more isolation sublayers is silicon oxide, and the material of the other one is silicon nitride.

[0147] Optionally, the material of the isolation structure 200 may also include an organic material. In this case, the isolation structure 200 may be an integrally formed arrangement. Please refer to the above. In the direction away from the substrate 100, the cross section of the isolation structure 200 gradually increases. The isolation structure 200 is in an inverted trapezoidal shape, which can simplify the shape of the isolation structure 200. In this case, the isolation structure 200 may be prepared by isomorphic negative photoresist.

[0148] Optionally, the isolation structure 200 may also include both organic materials and inorganic materials. The isolation structure 200 includes a first isolation sublayer and a second isolation sublayer stacked in a direction away from the substrate 100. The material of the first isolation sublayer includes an organic material, and the material of the second isolation sublayer includes an inorganic material. The first isolation sublayer may be the first sublayer 201 described above, and the second isolation sublayer may be the second sublayer 202 described above. The upper isolation sublayer is an inorganic material, and the lower isolation sublayer is an organic material, so that the lower isolation sublayer is easier to deform, making it easier to make the size of the first sublayer 201 smaller than the size of the second sublayer 202, thereby facilitating the breakage of the light-emitting material at the edge of the isolation structure 200.

[0149] like Figure 7 As shown, the embodiment of the second aspect of the present application provides a method for preparing a display panel, and the display panel can be the display panel of any of the embodiments of the first aspect above, please refer to Figures 1 to 7 , a method for preparing a display panel includes:

[0150] Step S01: Fig. 9 As shown, a first conductive material layer is disposed on a substrate 100 , and the first conductive material layer is patterned to form a plurality of first electrodes 110 distributed at intervals.

[0151] Step S03: Fig.11 As shown, a second insulating material layer is disposed on the side of the first electrode 110 away from the substrate 100 , and the second insulating material layer is patterned to form an isolation structure 200 with an isolation opening 210 . The isolation structure 200 has a sidewall surface 220 facing the isolation opening 210 .

[0152] Step S04: Fig.12 As shown, a light-emitting material layer is disposed on the side of the isolation structure 200 and the first electrode 110 facing away from the substrate 100 , and the light-emitting material layer is patterned to form a light-emitting portion 410 located in the isolation opening 210 , and at least part of the light-emitting portion 410 is in contact with the side wall surface 220 .

[0153] Optional, such as Figure 8 As shown, before step S03, the following steps are also included:

[0154] Step S02: Fig.10 As shown, a first insulating material layer is disposed on the side of the first electrode 110 facing away from the substrate 100, and the first insulating material layer is patterned to form a pixel defining portion 310 having a pixel opening 320, and a portion of the first electrode 110 is exposed by the pixel opening 320. The pixel opening 320 can be used to accommodate a portion of the light emitting portion 410, and by providing the pixel defining portion 310, the problem of easy crosstalk between light emitting portions 410 can be improved.

[0155] Optionally, in step S03, a second insulating material layer is disposed on the side of the pixel defining portion 310 facing away from the substrate 100, and the isolation opening 210 is connected to the pixel opening 320, so that the light emitted from the light emitting portion 410 located at the pixel opening 320 can be emitted through the isolation opening 210. Optionally, in step S04, at least a portion of the light emitting portion 410 extends from the pixel opening 320 to the side of the pixel defining portion 310 facing away from the substrate 100 and is in contact with and connected to the side wall surface 220.

[0156] In the preparation method provided in the embodiment of the present application, firstly, the first electrode 110 is prepared by step S01, and after step S01, the pixel definition layer 300 is prepared by step S02, and the first electrode 110 can be exposed by the pixel opening 320, so that the first electrode 110 can drive the light-emitting portion 410 to emit light. Before preparing the light-emitting portion 410, the isolation structure 200 is prepared by step S03. When the light-emitting portion 410 is prepared in step S04, when the light-emitting material layer falls on the isolation structure 200, it can be broken to form the light-emitting portion 410 located at the isolation opening 210, and the side of the light-emitting portion 410 can be in contact with the side wall surface 220. When the light-emitting portion 410 is prepared by etching and other processes in the subsequent process, the etching solution can be improved to corrode and damage the light-emitting portion 410 from the side, thereby improving the yield of the light-emitting portion 410 and improving the performance of the display panel.

[0157] Optional, such as Fig.13 As shown, step S04 may also include: sequentially arranging a light-emitting material layer and a sacrificial material layer on the side of the isolation structure 200 and the first electrode 110 away from the substrate 100, and patterning the light-emitting material layer and the sacrificial material layer to form a light-emitting portion 410 and a sacrificial preparation portion 510 located in the isolation opening 210. Optionally, at least part of the light-emitting portion 410 extends to the side of the pixel defining portion 310 away from the substrate 100 and is in contact with and connected to the side wall surface 220. The sacrificial preparation portion 510 can provide protection for the light-emitting portion 410. Optionally, the sacrificial preparation portion 510 can be in contact with and connected to the side wall surface 220.

[0158] Optional, such as Fig.14 As shown, in step S04 , a redundant portion 800 located on a side of the isolation structure 200 away from the substrate 100 may also be formed.

[0159] Optional, such as Fig.15 As shown, after step S04, the following steps are also included:

[0160] Step S05 : disposing a third insulating material layer on the side of the light emitting portion 410 and the isolation structure 200 facing away from the substrate 100 .

[0161] Step S06: Fig.16 As shown, the third insulating material layer is patterned to form a flat portion 600 , and the flat portion 600 is located on a side of the isolation structure 200 and the sacrificial preparation portion 510 facing away from the substrate 100 .

[0162] In these optional embodiments, after step S04, a flat portion 600 is formed through steps S05 and S06. When the second electrode layer 720 is subsequently prepared, the second electrode layer 720 can fall on the side of the flat portion 600 away from the substrate 100, thereby improving the continuity and yield of the second electrode layer 720.

[0163] As in the embodiment of the first aspect, the orthographic projection of the isolation structure 200 on the substrate 100 may be located within the orthographic projection of the flat portion 600 on the substrate 100 , so that the flat portion 600 can cover a portion of the sacrificial preparation portion 510 .

[0164] Optionally, after step S06, the following steps may also be included:

[0165] Step S07: Fig.17 As shown, the sacrificial preparation portion 510 is patterned to form a sacrificial portion 500 . The sacrificial portion 500 is located on a side of the light emitting portion 410 away from the substrate 100 and exposes at least a portion of the light emitting portion 410 .

[0166] In these optional embodiments, the sacrificial preparation portion 510 is further patterned to form a sacrificial portion 500 surrounding the pixel opening 320, so that the light-emitting portion 410 can be exposed from the space enclosed by the sacrificial portion 500, thereby facilitating electrical connection between the light-emitting portion 410 and the subsequently prepared second electrode layer 720.

[0167] Optionally, after step S07, the following steps are further included:

[0168] Step S08: Fig.18As shown, a first carrier functional layer 710 and a second electrode layer 720 are prepared on the sacrificial portion 500, the flat portion 600 and the side of the light emitting portion 410 away from the substrate 100. The first carrier functional layer 710 can be in contact with the light emitting portion 410, and the second electrode layer 720 can drive the light emitting portion 410 to emit light.

[0169] Optionally, when the pixel opening 320 includes a first pixel opening 321, a second pixel opening 322, and a third pixel opening 323, the isolation opening 210 includes a first isolation opening 211, a second isolation opening 212, and a third isolation opening 213, and the light-emitting portion 410 includes a first light-emitting portion 401, a second light-emitting portion 402, and a third light-emitting portion 403, as Fig.19 As shown, step S04 may include:

[0170] Step S041 : sequentially disposing a first light emitting material layer and a first sacrificial material layer on the side of the isolation structure 200 and the first electrode 110 facing away from the substrate 100 .

[0171] Step S042 : patterning the first light-emitting material layer and the first sacrificial material layer to form a first light-emitting portion 401 and a first sacrificial preparation portion 510 located in the first isolation opening 211 .

[0172] Optionally, at least part of the first light emitting portion 401 and the first sacrificial preparation portion 510 is also located in the first pixel opening 321 .

[0173] In the embodiment of the present application, the first light-emitting portion 401 and the first sacrificial preparation portion 510 are prepared in the same process step, and multiple first light-emitting portions 401 with the same color are prepared in the same process step, which can improve the mutual crosstalk between light-emitting portions 410 of different colors.

[0174] Optionally, in step S042 , a first redundant portion 810 is formed on the side of the isolation structure 200 away from the substrate 100 . A portion of the first redundant portion 810 has the same material as the first light-emitting portion 401 , and another portion of the first redundant portion 810 has the same material as the first sacrificial preparation portion 510 .

[0175] Optionally, in step S042, a process of etching using photoresist as a mask can be selected so that the photoresist covers a portion of the first light-emitting material layer and the first sacrificial material layer, the portion not covered by the photoresist is removed, and the portion covered by the photoresist forms the first light-emitting portion 401 and the first sacrificial preparation portion 510.

[0176] Optionally, after step S042, the following steps may also be included:

[0177] Step S043 : sequentially disposing a second light emitting material layer and a second sacrificial material layer on the side of the isolation structure 200 and the first electrode 110 facing away from the substrate 100 .

[0178] Step S044 : patterning the second light emitting material layer and the second sacrificial material layer to form a second light emitting portion 402 and a second sacrificial preparation portion 510 located in the second isolation opening 212 .

[0179] Optionally, at least a portion of the second light emitting portion 402 and the second sacrificial preparation portion 510 is located in the second pixel opening 322 .

[0180] Optionally, in step S044, a second redundant portion 820 is further formed on the side of the isolation structure 200 away from the substrate 100. Optionally, the second redundant portion 820 can be spaced apart from the first redundant portion 810 on the side of the isolation structure 200 away from the substrate 100.

[0181] Optionally, after step S044, the following steps are further included:

[0182] Step S045 : sequentially disposing a third light emitting material layer and a third sacrificial material layer on the side of the isolation structure 200 and the first electrode 110 facing away from the substrate 100 .

[0183] Step S046 : patterning the third light emitting material layer and the third sacrificial material layer to form a third light emitting portion 403 and a third sacrificial preparation portion 510 located in the third isolation opening 213 .

[0184] Optionally, at least a portion of the third light emitting portion 403 and the third sacrificial preparation portion 510 is located in the third pixel opening 323 .

[0185] In the embodiment of the present application, different light-emitting parts 410 are prepared and formed in different process steps, which can improve the problem of crosstalk between different light-emitting parts 410.

[0186] Optionally, in step S046, a third redundant portion 830 is further formed on the side of the isolation structure 200 away from the substrate 100. Optionally, the third redundant portion 830 and the first redundant portion 810 are spaced apart on the side of the isolation structure 200 away from the substrate 100; or, the third redundant portion 830 and the second redundant portion 820 are spaced apart on the side of the isolation structure 200 away from the substrate 100.

[0187] An embodiment of the third aspect of the present application further provides a display device, which includes a display panel provided by any of the embodiments of the first aspect or a display panel prepared by any of the embodiments of the second aspect.

[0188] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present application. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized in that: include: substrate; An isolation structure, disposed on one side of the substrate and enclosing an isolation opening, the isolation structure comprising an insulating material and having a side wall surface facing the isolation opening; The light-emitting layer comprises a light-emitting portion located in the isolation opening, and at least a part of the light-emitting portion is in contact with and connected to the side wall surface.

2. The display panel according to claim 1, characterized in that: The thickness of the light emitting portion is less than or equal to the thickness of the isolation structure.

3. The display panel according to claim 2, characterized in that: Also includes: a sacrificial portion, located on a side of the light-emitting portion away from the substrate; Preferably, the sacrificial portion exposes at least a portion of the light-emitting portion; Preferably, the sacrificial portion is in contact with the side wall surface; Preferably, the sacrificial portion includes two or more sacrificial sub-layers stacked together; Preferably, the material of the sacrificial part includes at least one of oxide, nitride, metal, and organic material; Preferably, the plurality of sacrificial sublayers include a first sacrificial sublayer and a second sacrificial sublayer stacked in a direction away from the substrate, the material of the first sacrificial sublayer includes at least one of oxide, nitride and metal, and the material of the second sacrificial sublayer includes an organic material; Preferably, the material of the second sacrificial sublayer includes a fluorine-containing organic material.

4. The display panel according to claim 3, characterized in that: Also includes: a flat portion, located on a side of the isolation structure and the sacrificial portion away from the substrate; Preferably, the orthographic projection of the isolation structure on the substrate is located within the orthographic projection of the flat portion on the substrate.

5. The display panel according to claim 4, characterized in that: The flat portion is located within the orthographic projection of the sacrificial portion on the substrate at the orthographic projection edge of the substrate; Preferably, the cross section of the flat portion gradually decreases in a direction away from the substrate; Preferably, the flat portion includes a first top surface facing away from the substrate and a first side surface connected to a peripheral side of the first top surface and extending toward the substrate, and the first side surface is inclined in a direction away from the isolation opening in a direction away from the substrate.

6. The display panel according to claim 4, characterized in that: The light-emitting layer further includes a first carrier functional layer covering the flat portion and the light-emitting portion; Preferably, a second electrode layer is provided on a side of the first carrier functional layer facing away from the substrate; Preferably, the first carrier functional layer includes at least one of a hole blocking layer, an electron transport layer and an electron injection layer.

7. The display panel according to claim 3, characterized in that: The isolation structure further comprises a redundant portion on a side facing away from the substrate; Preferably, the redundant portion is arranged around the isolation opening; Preferably, the redundant part includes more than two redundant sub-layers, and the material of one of the more than two redundant sub-layers is the same as the material of the light-emitting part, and the material of the other is the same as the material of the sacrificial part.

8. The display panel according to claim 1, characterized in that: The isolation structure has a second top surface facing away from the substrate, the light emitting portion has a third top surface facing away from the substrate, and the third top surface is on a side of the second top surface facing the substrate; Preferably, the isolation structure comprises a second bottom surface facing the substrate, and the orthographic projection of the second bottom surface on the substrate is located within the orthographic projection of the second top surface on the substrate; Preferably, the cross section of the isolation structure gradually increases in a direction away from the substrate, and the side wall surface is inclined in a direction close to the isolation opening. Alternatively, the isolation structure includes a first sublayer and a second sublayer located on a side of the first sublayer facing away from the substrate, the second top surface is located on a side of the second sublayer facing away from the substrate, the second bottom surface is located on a side of the first sublayer facing the substrate, and an orthographic projection of the first sublayer on the substrate is located within an orthographic projection of the second sublayer on the substrate; Preferably, the isolation structure further comprises a third sublayer, and the third sublayer is located on a side of the first sublayer facing the substrate; Preferably, the orthographic projection of the first sub-layer on the substrate is located within the orthographic projection of the third sub-layer on the substrate.

9. The display panel according to claim 1, characterized in that: The material of the isolation structure includes inorganic material and / or organic material; Preferably, the material of the isolation structure includes an inorganic material, the isolation structure includes two or more isolation sub-layers stacked together, and at least two adjacent isolation sub-layers are made of different materials; Preferably, the material of the isolation structure includes at least one of silicon oxide and silicon nitride; Preferably, the material of the isolation structure includes organic material, and the isolation structure is integrally formed; Preferably, the isolation structure includes organic materials and inorganic materials, and the isolation structure includes a first isolation sublayer and a second isolation sublayer stacked in a direction away from the substrate, the material of the first isolation sublayer includes organic materials, and the material of the second isolation sublayer includes inorganic materials.

10. The display panel according to any one of claims 1 to 9, characterized in that: The device further comprises a pixel definition layer, the pixel definition layer being arranged on one side of the substrate, the pixel definition layer comprising a pixel definition portion and a pixel opening opened in the pixel definition portion, the isolation structure being arranged on a side of the pixel definition portion away from the substrate, the pixel opening being connected to the isolation opening, and at least a part of the light emitting portion being located in the pixel opening; Preferably, at least part of the light emitting portion extends from the pixel opening to a side of the pixel defining portion away from the substrate; Preferably, the light emitting portion includes a first partition and a second partition, the first partition is located at the pixel opening, the second partition is located at a side of the pixel defining portion away from the substrate, and the second partition is in contact with the side wall surface; Preferably, the thickness of the second partition is less than or equal to the thickness of the isolation structure; Preferably, it further comprises a first electrode, wherein the first electrode is arranged between the substrate and the isolation structure.

11. A method for preparing a display panel, characterized in that: include: A first conductive material layer is provided on the substrate, and the first conductive material layer is patterned to form a plurality of first electrodes distributed at intervals; A second insulating material layer is provided on a side of the first electrode away from the substrate, and the second insulating material layer is patterned to form an isolation structure with an isolation opening, wherein the isolation structure has a side wall surface facing the isolation opening; A light-emitting material layer is disposed on a side of the isolation structure and the first electrode away from the substrate, and the light-emitting material layer is patterned to form a light-emitting portion located in the isolation opening, and at least part of the light-emitting portion is in contact with the side wall surface.

12. The preparation method according to claim 11, characterized in that: The step of providing a light-emitting material layer on a side of the isolation structure and the first electrode away from the substrate, patterning the light-emitting material layer to form a light-emitting portion located in the isolation opening, and at least part of the light-emitting portion being in contact with the side wall surface comprises: A light-emitting material layer and a sacrificial material layer are sequentially arranged on the side of the isolation structure and the first electrode away from the substrate, and the light-emitting material layer and the sacrificial material layer are patterned to form a light-emitting portion and a sacrificial preparation portion located in the isolation opening.

13. The preparation method according to claim 12, characterized in that: After the step of sequentially disposing a light-emitting material layer and a sacrificial material layer on a side of the isolation structure and the first electrode away from the substrate, and patterning the light-emitting material layer and the sacrificial material layer to form a light-emitting portion and a sacrificial preparation portion located in the isolation opening, the method further includes: Disposing a third insulating material layer on a side of the light emitting portion and the isolation structure away from the substrate; Performing patterning on the third insulating material layer to form a flat portion, wherein the flat portion is located on a side of the isolation structure and the sacrificial preparation portion away from the substrate; Preferably, the orthographic projection of the isolation structure on the substrate is located within the orthographic projection of the flat portion on the substrate.

14. The preparation method according to claim 13, characterized in that: After the step of patterning the third insulating material layer to form a flat portion, wherein the flat portion is located on a side of the isolation structure and the sacrificial preparation portion away from the substrate, the method further includes: The sacrificial preparation portion is patterned to form a sacrificial portion, wherein the sacrificial portion is located at a side of the light emitting portion away from the substrate and exposes at least a portion of the light emitting portion.

15. The preparation method according to claim 14, characterized in that: Also includes: A first carrier function layer and a second electrode layer are formed on the side of the sacrificial portion, the flat portion, and the light-emitting portion facing away from the substrate.

16. The preparation method according to claim 12, characterized in that: The isolation opening includes a first isolation opening, a second isolation opening, and a third isolation opening. The steps of sequentially arranging a light-emitting material layer and a sacrificial material layer on a side of the isolation structure and the first electrode away from the substrate, and patterning the light-emitting material layer and the sacrificial material layer to form a light-emitting portion and a sacrificial preparation portion located in the isolation opening include: sequentially disposing a first light emitting material layer and a first sacrificial material layer on a side of the isolation structure and the first electrode facing away from the substrate; Performing patterning on the first light-emitting material layer and the first sacrificial material layer to form a first light-emitting portion and a first sacrificial preparation portion located in the first isolation opening; Preferably, in the step of patterning the first light-emitting material layer and the first sacrificial material layer to form the first light-emitting portion and the first sacrificial preparation portion located in the first isolation opening, a first redundant portion located on a side of the isolation structure away from the substrate is also formed; Preferably, after the step of patterning the first light-emitting material layer and the first sacrificial material layer to form the first light-emitting portion and the first sacrificial preparation portion located in the first isolation opening, the method further includes: sequentially disposing a second light emitting material layer and a second sacrificial material layer on a side of the isolation structure and the first electrode away from the substrate; Performing patterning on the second light-emitting material layer and the second sacrificial material layer to form a second light-emitting portion and a second sacrificial preparation portion located in the second isolation opening; Preferably, in the step of patterning the second light-emitting material layer and the second sacrificial material layer to form the second light-emitting portion and the second sacrificial preparatory portion located at the second isolation opening, a second redundant portion located at a side of the isolation structure away from the substrate is also formed; Preferably, the second redundant portion and the first redundant portion are spaced apart on a side of the isolation structure away from the substrate; Preferably, after the step of patterning the second light-emitting material layer and the second sacrificial material layer to form the second light-emitting portion and the second sacrificial preparation portion located at the second isolation opening, the method further comprises: sequentially disposing a third light emitting material layer and a third sacrificial material layer on a side of the isolation structure and the first electrode away from the substrate; Performing patterning on the third light-emitting material layer and the third sacrificial material layer to form a third light-emitting portion and a third sacrificial preparation portion located in the third isolation opening; Preferably, in the step of patterning the third light-emitting material layer and the third sacrificial material layer to form a third light-emitting portion and a third sacrificial preparatory portion located in the third isolation opening, a third redundant portion located on a side of the isolation structure away from the substrate is also formed; Preferably, the third redundant portion and the first redundant portion are spaced apart on a side of the isolation structure away from the substrate; or, the third redundant portion and the second redundant portion are spaced apart on a side of the isolation structure away from the substrate.

17. The preparation method according to claim 11, characterized in that: Before the step of providing a second insulating material layer on a side of the first electrode away from the substrate, patterning the second insulating material layer to form an isolation structure with an isolation opening, wherein the isolation structure has a sidewall surface facing the isolation opening, the step further includes: A first insulating material layer is provided on a side of the first electrode facing away from the substrate, and the first insulating material layer is patterned to form a pixel defining portion having a pixel opening, wherein a portion of the first electrode is exposed through the pixel opening; The step of providing a second insulating material layer on a side of the first electrode away from the substrate, patterning the second insulating material layer to form an isolation structure having an isolation opening, wherein the isolation structure has a sidewall surface facing the isolation opening, comprises providing the second insulating material layer on a side of the pixel defining portion away from the substrate, and the isolation opening is connected to the pixel opening; Preferably, at least a portion of the light-emitting portion extends from the pixel opening to a side of the pixel defining portion facing away from the substrate.

18. A display device, characterized in that: A display panel comprising any one of claims 1 to 10, or a display panel prepared by the preparation method according to any one of claims 11 to 17.

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