Methods for manufacturing display panels, display panels and display devices

Abstract

This application provides a method for fabricating a display panel, a display panel, and a display device. The method for fabricating the display panel includes: fabricating an isolation structure on a substrate, the isolation structure enclosing a first isolation opening, a second isolation opening, and a third isolation opening; depositing a first fabrication material layer on the side of the isolation structure facing away from the substrate, with a portion of the first fabrication material layer falling into the first isolation opening to form a first light-emitting unit and a first encapsulation portion; removing the first fabrication material layer in the area where the second isolation opening is located to expose the second isolation opening, while retaining the first fabrication material layer in the area where the third isolation opening is located; and depositing a second fabrication material layer on the side of the isolation structure facing away from the substrate, with a portion of the second fabrication material layer falling into the second isolation opening to form a second light-emitting unit and a second encapsulation portion. This application embodiment can significantly improve the shape of the wall surface of the isolation structure facing the third isolation opening, thereby enhancing the process performance of the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a method for manufacturing a display panel, a display panel, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display devices.

[0003] However, the current manufacturing process of OLED display products needs improvement. Summary of the Invention

[0004] This application provides a method for manufacturing a display panel, a display panel, and a display device, aiming to improve the process performance of the display panel.

[0005] An embodiment of the first aspect of this application provides a method for manufacturing a display panel, comprising:

[0006] An isolation structure is fabricated on a substrate, and the isolation structure encloses a first isolation opening, a second isolation opening, and a third isolation opening;

[0007] A first fabrication material layer is provided on the side of the isolation structure away from the substrate, and a portion of the first fabrication material layer falls into the first isolation opening to form a first light-emitting unit and a first encapsulation part;

[0008] Remove the first preparation material layer in the area where the second isolation opening is located to expose the second isolation opening, while retaining the first preparation material layer in the area where the third isolation opening is located;

[0009] A second fabrication material layer is provided on the side of the isolation structure away from the substrate, and a portion of the second fabrication material layer falls into the second isolation opening to form a second light-emitting unit and a second encapsulation part.

[0010] According to the first aspect of this application, after the step of providing a second fabrication material layer on the side of the isolation structure away from the substrate, and having a portion of the second fabrication material layer fall into the second isolation opening to form the second light-emitting unit and the second encapsulation portion, the method further includes:

[0011] Remove the first preparation material layer in the area where the first isolation opening is located, and remove the first preparation material layer and the second preparation material layer in the area where the third isolation opening is located, so that the third isolation opening is exposed;

[0012] A third fabrication material layer is provided on the side of the isolation structure away from the substrate, and part of the third fabrication material layer falls into the third isolation opening to form a third light-emitting unit and a third encapsulation part.

[0013] In any of the foregoing embodiments of the first aspect of this application, in the step of removing the first preparation material layer in the region where the first isolation opening is located, and removing the first preparation material layer and the second preparation material layer in the region where the third isolation opening is located, so as to expose the third isolation opening: the third isolation opening and a portion of the isolation structure surrounding the third isolation opening are exposed.

[0014] According to any of the foregoing embodiments of the first aspect of this application, the first packaging portion and the second packaging portion are disposed at a distance from the substrate on the side of the isolation structure.

[0015] According to any of the foregoing embodiments of the first aspect of this application, the step of removing the first prefabricated material layer in the region where the first isolation opening is located, and removing the first prefabricated material layer and the second prefabricated material layer in the region where the third isolation opening is located, so as to expose the third isolation opening, includes:

[0016] Remove the second fabrication material layer in the area where the third isolation opening is located, so that the first fabrication material layer in the area where the third isolation opening is located is exposed;

[0017] Remove the second fabrication material layer in the region where the first isolation opening is located and the first fabrication material layer in the region where the third isolation opening is located, so that the third isolation opening is exposed.

[0018] According to any of the foregoing embodiments of the first aspect of this application, in the step of removing the second fabrication material layer in the region where the third isolation opening is located to expose the first fabrication material layer in the region where the third isolation opening is located: the second fabrication material layer in the region where the third isolation opening is located is removed so that a portion of the second fabrication material layer in the region where the second isolation opening is located overlaps with the first fabrication material layer in the region where the third isolation opening is located on the side of the isolation structure away from the substrate to form an overlapping portion, thereby exposing the first fabrication material layer in the region where the third isolation opening is located.

[0019] In the step of removing the second preparation material layer in the region where the first isolation opening is located and the first preparation material layer in the region where the third isolation opening is located to expose the third isolation opening, the overlapping portion is also removed.

[0020] According to any of the foregoing embodiments of the first aspect of this application, after the step of providing a second fabrication material layer on the side of the isolation structure away from the substrate, and having a portion of the second fabrication material layer fall into the second isolation opening to form the second light-emitting unit and the second encapsulation portion, the method further includes:

[0021] A photoresist material layer is covered on the side of the second fabrication material layer away from the substrate, and the photoresist material layer is patterned to form a first photoresist layer and a first photolithographic opening formed in the first photoresist layer. The first photolithographic opening is located within the orthogonal projection of the substrate in the third isolation opening.

[0022] According to any of the foregoing embodiments of the first aspect of this application, the step of removing the first prefabricated material layer in the region where the first isolation opening is located, and removing the first prefabricated material layer and the second prefabricated material layer in the region where the third isolation opening is located, so as to expose the third isolation opening, includes:

[0023] Remove the second fabrication material layer in the areas where the first isolation opening and the third isolation opening are located, so that the first fabrication material layer of the third isolation opening is exposed;

[0024] Remove the first layer of fabrication material in the area where the third isolation opening is located to expose the third isolation opening.

[0025] According to any of the foregoing embodiments of the first aspect of this application, after the step of providing a third fabrication material layer on the side of the isolation structure away from the substrate, and having a portion of the third fabrication material layer fall into the third isolation opening to form the third light-emitting unit and the third encapsulation portion, the method further includes:

[0026] Remove the third preparation material layer in the areas where the first and second isolation openings are located.

[0027] According to any of the foregoing embodiments of the first aspect of this application, the third packaging portion and the first packaging portion are spaced apart on the side of the isolation structure away from the substrate, and / or the third packaging portion and the second packaging portion are spaced apart on the side of the isolation structure away from the substrate.

[0028] According to any of the foregoing embodiments of the first aspect of this application, the step of removing the third fabrication material layer in the region where the first isolation opening and the second isolation opening are located includes: removing the third fabrication material layer in the first isolation opening, the side of the isolation structure surrounding the first isolation opening away from the substrate, the second isolation opening, the side of the isolation structure surrounding the second isolation opening away from the substrate, and part of the side of the isolation structure surrounding the third isolation opening away from the substrate.

[0029] According to any of the foregoing embodiments of the first aspect of this application, in the step of removing the first fabrication material layer in the region where the second isolation opening is located to expose the second isolation opening, and retaining the first fabrication material layer in the region where the third isolation opening is located:

[0030] The first fabrication material layer on the side of the isolation structure facing away from the substrate is removed from the second isolation opening, so that the second isolation opening and the isolation structure surrounding the second isolation opening are exposed, and the third isolation opening and the isolation structure surrounding the third isolation opening are covered by the first fabrication material layer.

[0031] According to any of the foregoing embodiments of the first aspect of this application, the step of fabricating an isolation structure on a substrate, wherein the isolation structure surrounds and forms a first isolation opening, a second isolation opening, and a third isolation opening, includes:

[0032] A first insulating material layer is disposed on one side of the substrate;

[0033] An isolation structure is prepared on the side of the first insulating material layer away from the substrate, and the isolation structure encloses and forms a first isolation opening, a second isolation opening, and a third isolation opening;

[0034] The first insulating material layer exposed by the first isolation opening is patterned to form a first pixel opening, the first insulating material layer exposed by the second isolation opening is patterned to form a second pixel opening, and the first insulating material layer exposed by the third isolation opening is patterned to form a third pixel opening.

[0035] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure includes a first sublayer and a second sublayer stacked in a direction away from the substrate, wherein the orthographic projection of the first sublayer onto the substrate is located within the orthographic projection of the second sublayer onto the substrate.

[0036] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure further includes a third sub-layer, which is located on the side of the first sub-layer facing the substrate, and the orthographic projection of the first sub-layer onto the substrate is located within the orthographic projection of the third sub-layer onto the substrate.

[0037] According to any of the foregoing embodiments of the first aspect of this application, the first fabrication material layer includes a first light-emitting material layer, a first conductive material layer and a first encapsulation material layer stacked in a direction away from the substrate. The first fabrication material layer is disposed on the side of the isolation structure away from the substrate. In the step of partially falling into the first isolation opening to form the first light-emitting unit and the first encapsulation portion, the first light-emitting unit, the first sub-electrode and the first encapsulation portion are formed stacked in a direction away from the substrate.

[0038] And / or, the second fabrication material layer includes a second light-emitting material layer, a second conductive material layer and a second encapsulation material layer stacked in a direction away from the substrate, the second fabrication material layer being disposed on the side of the isolation structure away from the substrate, and a portion of the second fabrication material layer falling into the second isolation opening to form the second light-emitting unit and the second encapsulation portion, thereby forming the second light-emitting unit, the second sub-electrode and the second encapsulation portion stacked in a direction away from the substrate.

[0039] The second aspect of this application also provides a display panel, which is prepared by the preparation method provided in any of the first aspects of the above-described embodiments.

[0040] An embodiment of the second aspect of this application also provides a display panel, comprising: a substrate; an isolation structure disposed on one side of the substrate and forming an isolation opening, the isolation opening including a first isolation opening, a second isolation opening and a third isolation opening; a light-emitting layer including a first light-emitting unit located in the first isolation opening, a second light-emitting unit located in the second isolation opening and a third light-emitting unit located in the third isolation opening; wherein, the isolation structure includes a first sub-layer and a second sub-layer stacked in a direction away from the substrate, the second sub-layer protruding relative to the first sub-layer toward the isolation opening, and the length of the second sub-layer protruding relative to the first sub-layer toward the first isolation opening being a first length, the length of the second sub-layer protruding relative to the first sub-layer toward the second isolation opening being a second length, the length of the second sub-layer protruding relative to the first sub-layer toward the third isolation opening being a third length, and the absolute value of the difference between the second length and the third length being less than or equal to 0.1 μm.

[0041] According to an embodiment of the second aspect of this application, the first length is less than the second length, and / or the first length is less than the third length.

[0042] According to any of the foregoing embodiments of the second aspect of this application, the first length is less than the second length, and the absolute value of the difference between the first length and the second length is 0.05 μm to 0.15 μm;

[0043] And / or, the first length is less than the third length, and the absolute value of the difference between the first length and the third length is 0.05μm to 0.15μm.

[0044] According to any of the foregoing embodiments of the second aspect of this application, the first length is less than the second length, and the second length is less than or equal to the third length, and the absolute value of the difference between the first length and the second length is greater than the absolute value of the difference between the second length and the third length.

[0045] Alternatively, the first length is less than the third length, and the third length is less than or equal to the second length, and the absolute value of the difference between the first length and the third length is greater than the absolute value of the difference between the second length and the third length.

[0046] According to any of the foregoing embodiments of the second aspect of this application, the second length and the third length are equal.

[0047] According to any of the foregoing embodiments of the second aspect of this application, the material of the isolation structure includes a conductive material;

[0048] The display panel also includes a second electrode located on the side of each light-emitting unit away from the substrate, and the second electrode is electrically connected to the isolation structure.

[0049] According to any of the foregoing embodiments of the second aspect of this application, the material of the first sublayer includes a conductive material, and the second electrode is electrically connected to the first sublayer.

[0050] According to any of the foregoing embodiments of the second aspect of this application, the material of the second sublayer includes a conductive material.

[0051] According to any of the foregoing embodiments of the second aspect of this application, the isolation structure further includes a third sublayer located on the side of the first sublayer facing the substrate.

[0052] According to any of the foregoing embodiments of the second aspect of this application, the material of the third sublayer includes a conductive material, and the second electrode and the third sublayer are electrically connected.

[0053] According to any of the foregoing embodiments of the second aspect of this application, it further includes: a pixel definition layer, the pixel definition layer being disposed on one side of the substrate and including a pixel defining portion and a pixel opening, the pixel opening and the isolation opening being connected.

[0054] According to any of the foregoing embodiments of the second aspect of this application, the isolation structure is located on the side of the pixel limiting portion away from the substrate, or the pixel limiting portion has a clearance opening and the isolation structure is located in the clearance opening.

[0055] An embodiment of the third aspect of this application also provides a display device, including the display panel provided in any of the second aspect embodiments described above.

[0056] In the fabrication method provided in this application embodiment, an isolation structure is first fabricated on a substrate. The isolation structure encloses a first isolation opening, a second isolation opening, and a third isolation opening. Different isolation openings can accommodate different light-emitting units, which can improve the crosstalk problem between different light-emitting units. Then, a first fabrication material layer is deposited on the substrate with the isolation structure. The first fabrication material layer falls into the first, second, and third isolation openings, and also falls on the side of the isolation structure away from the substrate. The first fabrication material layer falling into the first isolation opening forms a first light-emitting unit. Next, the first fabrication material layer in the area where the second isolation opening is located is removed, while the first fabrication material layer in the area where the third isolation opening is located is retained. In this step, the first fabrication material layer in the area where the third isolation opening is located is not removed. Finally, a second fabrication material layer is deposited, so that a second light-emitting unit is formed in the second isolation opening. In this embodiment of the application, when the first preparation material layer is removed to expose the second isolation opening, the first preparation material layer in the area where the second isolation opening is located is removed, but the first preparation material layer in the area where the third isolation opening is located is not removed. This can improve the shape of the wall surface of the isolation structure facing the third isolation opening when the preparation material layer in the third isolation opening is removed multiple times, thereby improving the process performance of the display panel. Attached Figure Description

[0057] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, wherein the same or similar reference numerals denote the same or similar features.

[0058] Figure 1 This is a schematic diagram of a method for manufacturing a display panel according to an embodiment of this application;

[0059] Figures 2 to 5 This is a schematic diagram of the manufacturing process of a display panel provided in an embodiment of this application;

[0060] Figure 6 This is a schematic flowchart of a method for manufacturing a display panel according to another embodiment of this application;

[0061] Figures 7 to 9 This is a schematic diagram of the manufacturing process of a display panel according to another embodiment of this application;

[0062] Figure 10 This is a schematic flowchart of a method for manufacturing a display panel according to another embodiment of this application;

[0063] Figures 11 to 13 This is a schematic diagram of the manufacturing process of a display panel according to another embodiment of this application;

[0064] Figure 14 This is a schematic flowchart of a method for manufacturing a display panel according to another embodiment of this application;

[0065] Figure 15 and Figure 16 This is a schematic diagram of the manufacturing process of a display panel according to another embodiment of this application;

[0066] Figure 17 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application;

[0067] Figure 18 yes Figure 17 Sectional view at point BB.

[0068] Explanation of reference numerals in the attached figures:

[0069] 100. Substrate;

[0070] 200, First electrode layer; 210, First electrode;

[0071] 300, Pixel definition layer; 310, Pixel limiting part; 320, Pixel opening; 321, First pixel opening; 322, Second pixel opening; 323, Third pixel opening; 330, Light-emitting unit; 331, First light-emitting unit; 332, Second light-emitting unit; 333, Third light-emitting unit;

[0072] 400. Isolation structure; 410. Isolation opening; 411. First isolation opening; 412. Second isolation opening; 413. Third isolation opening; 420. Side wall surface; 401. First sublayer; 402. Second sublayer; 403. Third sublayer;

[0073] 500, Second electrode; 510, First sub-electrode; 520, Second sub-electrode; 530, Third sub-electrode;

[0074] 600, Packaging section; 610, First packaging section; 620, Second packaging section; 630, Third packaging section;

[0075] 700, second encapsulation layer; 800, third encapsulation layer;

[0076] 11. First light-emitting material layer; 21. First conductive material layer; 31. First encapsulation material layer;

[0077] 12. Second light-emitting material layer; 22. Second conductive material layer; 32. Second encapsulation material layer;

[0078] 13. Third luminescent material layer; 23. Third conductive material layer; 33. Third encapsulation material layer;

[0079] 40. First photoresist layer; 41. First photolithographic opening;

[0080] 50. Second photoresist layer; 51. Second photolithographic opening;

[0081] 60. Overlapping parts. Detailed Implementation

[0082] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples. In the accompanying drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessarily obscuring the application; and, for clarity, the dimensions of some structures may be exaggerated. Furthermore, the features, structures, or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0083] In the description of this application, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," etc., indicating orientation or positional relationships are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0084] The directional terms appearing in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of the embodiments of this application. It should also be noted in the description of this application that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0085] To better understand this application, the following will be combined with... Figures 1 to 18 The present application provides a detailed description of the manufacturing method of the display panel, the display panel itself, and the display device.

[0086] like Figure 1 As shown, an embodiment of the first aspect of this application provides a method for manufacturing a display panel, comprising:

[0087] Step S01: As Figure 2 As shown, an isolation structure 400 is fabricated on a substrate 100, and the isolation structure 400 encloses and forms a first isolation opening 411, a second isolation opening 412 and a third isolation opening 413.

[0088] Step S02: As Figure 3 As shown, a first fabrication material layer is provided on the side of the isolation structure 400 away from the substrate 100, and a portion of the first fabrication material layer falls into the first isolation opening 411 to form the first light-emitting unit 331 and the first encapsulation part 610.

[0089] Step S03: As Figure 4 As shown, the first preparation material layer in the area where the second isolation opening 412 is located is removed to expose the second isolation opening 412, while the first preparation material layer in the area where the third isolation opening 413 is located is retained.

[0090] Step S04: As Figure 5As shown, a second fabrication material layer is provided on the side of the isolation structure 400 away from the substrate 100, and a portion of the second fabrication material layer falls into the second isolation opening 412 to form the second light-emitting unit 332 and the second encapsulation part 620.

[0091] In the fabrication method provided in this application embodiment, firstly, an isolation structure 400 is fabricated on a substrate 100 in step S01. The isolation structure 400 encloses a first isolation opening 411, a second isolation opening 412, and a third isolation opening 413. Different isolation openings 410 can be used to accommodate different light-emitting units 330, which can improve the crosstalk problem between different light-emitting units 330. In step S02, a first fabrication material layer is disposed on the substrate 100 with the isolation structure 400. The first fabrication material layer falls into the first isolation opening 411, the second isolation opening 412, and the third isolation opening 413, and also falls on the side of the isolation structure 400 away from the substrate 100. The first fabrication material layer falling into the first isolation opening 411 forms the first light-emitting unit 331. In step S03, the first fabrication material layer in the area where the second isolation opening 412 is located is removed, while the first fabrication material layer in the area where the third isolation opening 413 is located is retained. In step S03, the first fabrication material layer in the area where the third isolation opening 413 is located is not removed. In step S04, the second fabrication material layer is continued to be formed, so that the second light-emitting unit 332 is formed within the second isolation opening 412. In this embodiment, removing the first fabrication material layer in the area where the second isolation opening 412 is located in step S02, without removing the first fabrication material layer in the area where the third isolation opening 413 is located, can mitigate the significant impact on the shape of the wall surface of the isolation structure 400 facing the third isolation opening 413 when the fabrication material layer within the third isolation opening 413 is removed multiple times, thereby improving the process performance of the display panel.

[0092] Patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN2024 / 099072 describe relevant technical solutions for isolation structures and encapsulation layers, the contents of which are incorporated herein by reference. The substrate 100 can be disposed in various ways, and may include a substrate and a first conductive layer, a second conductive layer, and a third conductive layer disposed on one side of the substrate and stacked thereon. An insulating layer is disposed between adjacent conductive layers. Optionally, a driving device layer is disposed on the substrate, and a pixel driving circuit is disposed within the driving device layer. The pixel driving circuit includes a transistor and a storage capacitor. The transistor includes a semiconductor, a gate, a source, and a drain. The storage capacitor includes a first electrode and a second electrode. As an example, the gate and the first electrode can be located in the first conductive layer, the second electrode can be located in the second conductive layer, and the source and drain can be located in the third conductive layer.

[0093] Optionally, prior to step S01, a first electrode layer 200 may be prepared on the substrate 100. The first electrode layer 200 includes first electrodes 210 spaced apart. In step S01, each first electrode 210 is exposed through each first isolation opening 411, so that the first electrode 210 can contact and connect with the light-emitting unit 330 located in each isolation opening 410.

[0094] In some alternative embodiments, such as Figure 6 As shown, after step S04, the following is also included:

[0095] Step S05: As Figure 7 As shown, the first preparation material layer in the area where the first isolation opening 411 is located is removed, and the first preparation material layer and the second preparation material layer in the area where the third isolation opening 413 is located are removed, so that the third isolation opening 413 is exposed.

[0096] Step S06: As Figure 8 As shown, a third fabrication material layer is provided on the side of the isolation structure 400 away from the substrate 100, and part of the third fabrication material layer falls into the third isolation opening 413 to form the third light-emitting unit 333 and the third encapsulation part 630.

[0097] The isolation structure 400 has a sidewall surface 420 facing the third isolation opening 413. In related technologies, the first fabrication material layer outside the area where the first isolation opening 411 is located is typically removed in step S03, that is, the first fabrication material layer in the areas where the second isolation opening 412 and the third isolation opening 413 are located is removed in step S03. After step S04, the second fabrication material layer in the area where the third isolation is located is removed. In related technologies, the material layer inside the third isolation opening 413 is removed at least twice, exposing the third isolation opening 413. This results in the sidewall surface 420 being repeatedly patterned, for example, the sidewall is repeatedly etched, which affects the shape of the sidewall surface 420. During the subsequent fabrication of the third light-emitting unit 333, this will affect the fabrication and shaping of the third light-emitting unit 333, and may also affect the overlap between the second electrode 500 and the isolation structure 400 inside the third isolation opening 413.

[0098] In this embodiment of the application, the first fabrication material layer in the area where the third isolation opening 413 is located is not removed in step S03, and when the second fabrication material layer in the third isolation opening 413 is removed in step S05, the sidewall 420 is not yet exposed. Finally, the fabrication material layer in the area where the third isolation opening 413 is located is removed, so that the sidewall 420 is etched at most once, which can improve the yield of the sidewall 420 and thus improve the process performance of the display panel.

[0099] Optionally, in step S05, the third isolation opening 413 and a portion of the isolation structure 400 surrounding the third isolation opening 413 are exposed. This results in a larger removal range, which can improve the removal of impurities within the third isolation opening 413 and mitigate incomplete material removal within the third isolation opening 413 due to process errors.

[0100] Optionally, after step S05, the first encapsulation portion 610 and the second encapsulation portion 620 are spaced apart on the side of the isolation structure 400 away from the substrate 100. That is, after the first fabrication material layer in the area where the second isolation opening 412 is located and the second fabrication material layer in the area where the first isolation opening 411 is located are removed, part of the isolation structure 400 located between the first encapsulation portion 610 and the second encapsulation portion 620 will be exposed to ensure complete removal.

[0101] In some optional embodiments, the method further includes the following after step S06:

[0102] Step S07: As Figure 9 As shown, the third fabrication material layer is removed from the areas where the first isolation opening 411 and the second isolation opening 412 are located. This ensures that the first light-emitting unit 331 and the second light-emitting unit 332 are not covered by the third fabrication material layer.

[0103] Optionally, a second encapsulation layer 700 and a third encapsulation layer 800 may be further constructed after step S07. Optionally, the material of the encapsulation portion 600 may include inorganic materials, the material of the second encapsulation layer 700 may include organic materials, and the material of the third encapsulation layer 800 may include inorganic materials.

[0104] Optionally, in step S07, the third fabrication material layer can be removed from the first isolation opening 411, the side of the isolation structure 400 surrounding the first isolation opening 411 facing away from the substrate 100, the second isolation opening 412, the side of the isolation structure 400 surrounding the second isolation opening 412 facing away from the substrate 100, and part of the side of the isolation structure 400 surrounding the third isolation opening 413 facing away from the substrate 100. That is, not only the third fabrication material layer in the first isolation opening 411 and the second isolation opening 412 can be removed, but also part of the third fabrication material layer on the isolation structure 400.

[0105] After step S07, the first encapsulation portion 610 and the second encapsulation portion 620 are exposed. When the first isolation opening 411 and the third isolation opening 413 are adjacent, the adjacent first encapsulation portion 610 and the third encapsulation portion 630 are spaced apart on the side of the isolation structure 400 away from the substrate 100. When the second isolation opening 412 and the third isolation opening 413 are adjacent, the adjacent second encapsulation portion 620 and the third encapsulation portion 630 are spaced apart on the side of the isolation structure 400 away from the substrate 100.

[0106] Optionally, the display panel further includes a third light-emitting unit 333 and a third encapsulation portion 630 located in the third isolation opening 413. Optionally, the first isolation opening 411, the second isolation opening 412, and the third isolation opening 413 are collectively referred to as isolation opening 410, which includes the first isolation opening 411, the second isolation opening 412, and the third isolation opening 413. The first light-emitting unit 331, the second light-emitting unit 332, and the third light-emitting unit 333 are collectively referred to as light-emitting unit 330, which includes the first light-emitting unit 331, the second light-emitting unit 332, and the third light-emitting unit 333. Each light-emitting unit 330 is located in its respective isolation opening 410. Optionally, the first encapsulation portion 610, the second encapsulation portion 620, and the third encapsulation portion 630 are collectively referred to as encapsulation portion 600, which includes the first encapsulation portion 610, the second encapsulation portion 620, and the third encapsulation portion 630.

[0107] There are multiple ways to set step S05. In some optional embodiments, such as... Figure 10 As shown, step S05 includes:

[0108] Step S051: As Figure 11 and Figure 12As shown, the second preparation material layer in the area where the third isolation opening 413 is located is removed so that the first preparation material layer in the area where the third isolation opening 413 is located is exposed.

[0109] Step S052: As Figure 13 As shown, the second fabrication material layer in the area where the first isolation opening 411 is located and the first fabrication material layer in the area where the third isolation opening 413 is located are removed to expose the third isolation opening 413.

[0110] In this embodiment, step S051 first removes the second fabrication material layer within the third isolation opening 413, exposing the first fabrication material layer, and the sidewall 420 is covered by the first fabrication material layer. In step S052, the second fabrication material layer in the area where the first isolation opening 411 is located and the first fabrication material layer in the area where the third isolation opening 413 is located are removed, exposing the third isolation opening 413, and also exposing the first light-emitting unit 331 and the first encapsulation portion 610.

[0111] Optional, such as Figure 12 As shown, after removing the second fabrication material layer in the area where the third isolation opening 413 is located in step S051, not only will the first fabrication material layer in the area where the third isolation opening 413 is located be exposed, but also the second fabrication material layer in the area where the second isolation opening 412 is located, which is adjacent to the third isolation opening 413, and the first fabrication material layer in the area where the third isolation opening 413 is located will overlap on the side of the isolation structure 400 away from the substrate 100 to form an overlapping portion 60.

[0112] Optionally, the overlapping portion 60 includes a partially stacked second fabrication material layer and a first fabrication material layer. The second fabrication material layer may include at least one of a light-emitting material layer for fabricating the second light-emitting unit 332, a conductive material layer for fabricating the second sub-electrode 520, and an encapsulation material layer for fabricating the second encapsulation portion 620. Similarly, the first fabrication material layer may include at least one of a light-emitting material layer for fabricating the first light-emitting unit 331, a conductive material layer for fabricating the first sub-electrode 510, and an encapsulation material layer for fabricating the first encapsulation portion 610. The overlapping portion 60 may include at least one of the stacked light-emitting material layers for fabricating the second light-emitting unit 332, the conductive material layer for fabricating the second sub-electrode 520, the encapsulation material layer for fabricating the second encapsulation portion 620, the light-emitting material layer for fabricating the first light-emitting unit 331, the conductive material layer for fabricating the first sub-electrode 510, and the encapsulation material layer for fabricating the first encapsulation portion 610.

[0113] Optionally, when the second fabrication material layer in the area where the third isolation opening 413 is located is removed by wet etching in step S051, the etching solution may enter between the first fabrication material layer and the second fabrication material layer and remove the light-emitting material layer used to fabricate the second light-emitting unit 332 and the conductive material layer used to fabricate the second sub-electrode 520. At this time, the overlapping portion 60 may include the encapsulation material layer used to fabricate the second encapsulation portion 620, the light-emitting material layer used to fabricate the first light-emitting unit 331, the conductive material layer used to fabricate the first sub-electrode 510, and the encapsulation material layer used to fabricate the first encapsulation portion 610.

[0114] Optionally, when the second fabrication material layer in the region where the third isolation opening 413 is located is removed in step S051 using a dry etching process, the first fabrication material layer and the second fabrication material layer will not be affected. The overlapping portion 60 may include a light-emitting material layer for fabricating the second light-emitting unit 332, a conductive material layer for fabricating the second sub-electrode 520, a packaging material layer for fabricating the second packaging portion 620, a light-emitting material layer for fabricating the first light-emitting unit 331, a conductive material layer for fabricating the first sub-electrode 510, and a packaging material layer for fabricating the first packaging portion 610.

[0115] For example, such as Figure 11 As shown, after step S04, a photoresist material layer is covered on the side of the second fabrication material layer away from the substrate 100. The photoresist material layer is patterned to form a first photoresist layer 40 and a first photolithographic opening 41 formed on the first photoresist layer 40. The orthographic projection of the first photolithographic opening 41 on the substrate 100 is located within the orthographic projection of the third isolation opening 413 on the substrate 100, such that the size of the first photolithographic opening 41 is less than or equal to the size of the third isolation opening 413. The second fabrication material layer on the isolation structure 400 surrounding the third isolation opening 413 is covered by the first photoresist layer 40.

[0116] After the first photoresist layer 40 is applied, in step S051, after the second fabrication material layer in the region where the third isolation opening 413 is located is removed through the first photolithographic opening 41, a portion of the first and second fabrication material layers remain on the isolation structure 400 surrounding the third isolation opening 413, and these portions of the first and second fabrication material layers are stacked to form an overlapping portion 60. This overlapping portion 60 can provide protection to the isolation structure 400. In step S052, when the second fabrication material layer in the region where the first isolation opening 411 is located and the first fabrication material layer in the region where the third isolation opening 413 is located are removed, due to the presence of the overlapping portion 60, the first fabrication material layer located within the third isolation opening 413 can continue to cover the isolation structure 400 and the sidewall 420.

[0117] After step S051, as Figure 13As shown, a second photoresist material layer can be provided, and the second photoresist material layer can be patterned to form a second photoresist layer 50. A second photolithographic opening 51 is formed on the second photoresist layer 50, and a first isolation opening 411 and a third isolation opening 413 are exposed through the second photolithographic opening 51. In step S052, the second fabrication material layer in the region where the first isolation opening 411 is located and the first fabrication material layer in the region where the third isolation opening 413 is located can be removed through the second photolithographic opening 51.

[0118] In some other alternative embodiments, such as Figure 14 As shown, step S05 may further include:

[0119] Step S051': As Figure 15 As shown, the second fabrication material layer in the area where the first isolation opening 411 and the third isolation opening 413 are located is removed so that the first fabrication material layer of the third isolation opening 413 is exposed.

[0120] Step S052': As Figure 16 As shown, the first fabrication material layer in the area where the third isolation opening 413 is located is removed to expose the third isolation opening 413.

[0121] In these alternative embodiments, the second fabrication material layer in the areas where the first isolation opening 411 and the third isolation opening 413 are located can be removed first in step S051'. Then, in step S052', the first fabrication material layer in the area where the third isolation opening 413 is located is removed to expose the third isolation opening 413.

[0122] Before step S051', a photoresist material layer can be formed on the second fabrication material layer, and the photoresist material layer can be patterned to form photolithographic openings. In step S051', the second fabrication material layer in the region where the first isolation opening 411 and the third isolation opening 413 are located is removed using the photolithographic openings. Similarly, a photoresist layer with photolithographic openings can also be formed before step S052', and the first fabrication material layer in the region where the third isolation opening 413 is located is removed using the photolithographic openings.

[0123] In some optional embodiments, in step S03, the first fabrication material layer of the isolation structure 400 disposed within and partially surrounding the second isolation opening 412 on the side away from the substrate 100 is removed, so that the second isolation opening 412 and the isolation structure 400 partially surrounding the second isolation opening 412 are exposed, and the third isolation opening 413 and the isolation structure 400 partially surrounding the third isolation opening 413 are covered by the first fabrication material layer.

[0124] In these alternative embodiments, when removing the first preparation material layer within the second isolation opening 412, a portion of the first preparation material layer on the isolation structure 400 surrounding the second isolation structure 400 is also removed, which can expand the removal range and improve the impurity residue within the second isolation opening 412.

[0125] Optional, such as Figure 17 As shown, step S01 may include:

[0126] Step S011: A first insulating material layer is formed on one side of the substrate 100.

[0127] Step S012: An isolation structure 400 is prepared on the side of the first insulating material layer facing away from the substrate 100. The isolation structure 400 encloses and forms a first isolation opening 411, a second isolation opening 412, and a third isolation opening 413. That is, the isolation structure 400 encloses and forms an isolation opening 410.

[0128] Step S013: The first insulating material layer exposed through the first isolation opening 411 is patterned to form a first pixel opening 321; the first insulating material layer exposed through the second isolation opening 412 is patterned to form a second pixel opening 322; and the first insulating material layer exposed through the third isolation opening 413 is patterned to form a third pixel opening 323. That is, the first insulating material layer exposed through each isolation opening 410 is patterned to form each pixel opening 320.

[0129] The first pixel opening 321, the second pixel opening 322, and the third pixel opening 323 are collectively referred to as pixel opening 320, which includes the first pixel opening 321, the second pixel opening 322, and the third pixel opening 323. In step S013, a pixel defining portion 310 is formed from the first insulating material, and the pixel opening 320 is formed in the pixel defining portion 310. The pixel opening 320 and the pixel defining portion 310 form a pixel defining layer 300.

[0130] When the display panel includes the first electrode 210, in step S013, each first electrode 210 is exposed through each pixel opening 320. During the subsequent fabrication of the light-emitting unit 330, each light-emitting unit 330 falls into the pixel opening 320 and contacts and connects with each first electrode 210.

[0131] There are various ways to configure the isolation structure 400. For example, the isolation structure 400 includes a first sub-layer 401 and a second sub-layer 402 stacked in a direction away from the substrate 100. The orthographic projection of the first sub-layer 401 onto the substrate 100 lies within the orthographic projection of the second sub-layer 402 onto the substrate 100. This allows the size of the first sub-layer 401 to be smaller than the size of the second sub-layer 402, and the second sub-layer 402 to be recessed. When the first and second fabrication material layers are subsequently placed on the isolation structure 400, the first fabrication material layer can break at the edge of the isolation structure 400, thereby forming an independently configured first light-emitting unit 331. Similarly, the second fabrication material layer can also break at the edge of the second sub-layer 402 to form an independently configured second light-emitting unit 332.

[0132] Optionally, the isolation structure 400 further includes a third sub-layer 403, which is located on the side of the first sub-layer 401 facing the substrate 100. The orthographic projection of the first sub-layer 401 onto the substrate 100 lies within the orthographic projection of the third sub-layer 403 onto the substrate 100. When the first sub-layer 401 is side-etched, the third sub-layer 403 can protect the film layer on the substrate 100 side.

[0133] Optionally, the display panel includes a second electrode 500 located on the side of each light-emitting unit 330 facing away from the substrate 100, and a package portion 600 located on the side of the second electrode 500 facing away from the substrate 100. The second electrode 500 may include a first sub-electrode 510 located in the first isolation opening 411, a second sub-electrode 520 located in the second isolation opening 412, and a third sub-electrode 530 located in the third isolation opening 413. The second electrode 500 and the first electrode 210 work together to drive the light-emitting unit 330 to emit light.

[0134] There are various ways to set the first fabrication material layer. Optionally, the first fabrication material layer includes a first light-emitting material layer 11, a first conductive material layer 21 and a first encapsulation material layer 31 stacked in the direction away from the substrate 100. In step S02, a first light-emitting unit 331, a first sub-electrode 510 and a first encapsulation portion 610 stacked in the direction away from the substrate 100 are formed.

[0135] Optionally, the second fabrication material layer includes a second light-emitting material layer 12, a second conductive material layer 22, and a second encapsulation material layer 32 stacked in a direction away from the substrate 100. In step S04, a second light-emitting unit 332, a second sub-electrode 520, and a second encapsulation portion 620 stacked in a direction away from the substrate 100 are formed.

[0136] Optionally, the third fabrication material layer includes a third light-emitting material layer 13, a third conductive material layer 23, and a third encapsulation material layer 33 stacked in a direction away from the substrate 100. In step S04, a third light-emitting unit 333, a third sub-electrode 530, and a third encapsulation portion 630 stacked in a direction away from the substrate 100 are formed.

[0137] like Figure 17 and Figure 18 As shown, a second aspect of this application also provides a display panel, which is manufactured by the manufacturing method of any of the first aspects described above.

[0138] In the display panel prepared by any of the first aspect embodiments described above, the shape of the sidewall 420 of the isolation structure 400 facing the third isolation opening 413 is more in line with expectations, which can improve the yield of the third light-emitting unit 333 and the third sub-electrode 530 and improve the process performance of the display panel.

[0139] Optionally, as described above, the display panel includes a substrate 100, an isolation structure 400, and a light-emitting unit 330. The arrangement of the isolation structure 400 and the light-emitting unit 330 is as described above and will not be repeated here. Optionally, the display panel may also include a pixel definition layer 300.

[0140] Optionally, first electrodes 210 are provided on the substrate 100 at intervals.

[0141] Optionally, the pixel definition layer 300 is disposed on the side of the first electrode layer 200 away from the substrate 100. The pixel definition layer 300 includes a pixel limiting portion 310 and a first pixel opening 321, a second pixel opening 322 and a third pixel opening 323 formed in the pixel limiting portion 310. The first electrode 210 is exposed through the first pixel opening 321, the second pixel opening 322 and the third pixel opening 323.

[0142] Optionally, the isolation structure 400 is located on the side of the pixel defining portion 310 facing away from the substrate 100. The isolation structure 400 encloses and forms a first isolation opening 411, a second isolation opening 412, and a third isolation opening 413. The first isolation opening 411 communicates with the first pixel opening 321, the second isolation opening 412 communicates with the second pixel opening 322, and the third isolation opening 413 communicates with the third pixel opening 323. The isolation structure 400 includes the first sub-layer 401 and the second sub-layer 402 described above.

[0143] Optionally, a first light-emitting unit 331 is disposed within the first pixel opening 321. A first sub-electrode 510 is disposed on the side of the first light-emitting unit 331 facing away from the substrate 100. The first sub-electrode 510 extends to the side of the pixel defining portion 310 facing away from the substrate 100 and overlaps with the first sub-layer 401. A first encapsulation portion 610 is disposed on the side of the first sub-electrode 510 facing away from the substrate 100, and a portion of the first encapsulation portion 610 extends to the side of the isolation structure 400 facing away from the substrate 100. Optionally, a gap exists between the surfaces of the first encapsulation portion 610 and the isolation structure 400 facing away from the substrate 100.

[0144] Optionally, a second light-emitting unit 332 is disposed within the second pixel opening 322. A second sub-electrode 520 is disposed on the side of the second light-emitting unit 332 facing away from the substrate 100. The second sub-electrode 520 extends to the side of the pixel limiting portion 310 facing away from the substrate 100 and overlaps with the first sub-layer 401. A second encapsulation portion 620 is disposed on the side of the second sub-electrode 520 facing away from the substrate 100. A portion of the second encapsulation portion 620 extends to the side of the isolation structure 400 facing away from the substrate 100, and the second encapsulation portion 620 is spaced apart from the first encapsulation portion 610 on the side of the isolation structure 400 facing away from the substrate 100. Optionally, a gap exists between the surfaces of the second encapsulation portion 620 and the side of the isolation structure 400 facing away from the substrate 100.

[0145] Optionally, a third light-emitting unit 333 is disposed within the third pixel opening 323. A third sub-electrode 530 is disposed on the side of the third light-emitting unit 333 facing away from the substrate 100. The third sub-electrode 530 extends to the side of the pixel limiting portion 310 facing away from the substrate 100 and overlaps with the first sub-layer 401. A third encapsulation portion 630 is disposed on the side of the third sub-electrode 530 facing away from the substrate 100. A portion of the third encapsulation portion 630 extends to the side of the isolation structure 400 facing away from the substrate 100, and the third encapsulation portion 630 is spaced apart from the first encapsulation portion 610 and / or the second encapsulation portion 620 on the side of the isolation structure 400 facing away from the substrate 100. Optionally, a gap exists between the surface of the third encapsulation portion 630 and the surface of the isolation structure 400 facing away from the substrate 100.

[0146] Optionally, the display panel further includes a second encapsulation layer 700 and a third encapsulation layer 800, wherein the second encapsulation layer 700 covers the isolation structure 400, the first encapsulation portion 610, the second encapsulation portion 620, and the third encapsulation portion 630. The third encapsulation layer 800 covers the second encapsulation layer 700.

[0147] like Figure 17 and Figure 18As shown, a second aspect embodiment of this application also provides a display panel, which can be fabricated by the fabrication method of any of the first aspects embodiments described above. The display panel includes: a substrate 100; an isolation structure 400 disposed on one side of the substrate 100 and forming an isolation opening 410, the isolation opening 410 including a first isolation opening 411, a second isolation opening 412, and a third isolation opening 413; a light-emitting layer including a first light-emitting unit 331 located in the first isolation opening 411, a second light-emitting unit 332 located in the second isolation opening 412, and a third light-emitting unit 333 located in the third isolation opening 413; wherein the isolation structure 400 includes a first sub-layer 401 and a second sub-layer 402 stacked in a direction away from the substrate 100. The second sublayer 402 protrudes relative to the first sublayer 401 toward the isolation opening 410. The length of this protrusion is a first length SA1, a second length SA2, and a third length SA3. The absolute value of the difference between the second length SA2 and the third length SA3 is less than or equal to 0.1 μm. Optionally, the absolute value of the difference between the second length SA2 and the third length SA3 can be 0.1 μm, 0.09 μm, 0.085 μm, 0.07 μm, 0.05 μm, or smaller.

[0148] In the display panel provided in this application embodiment, referring to the above-described fabrication method, the first light-emitting unit 331 can be fabricated first, followed by the second light-emitting unit 332 and the third light-emitting unit 333. The sidewall 420 of the isolation structure 400 facing the third isolation opening 413 and the sidewall facing the second isolation opening 412 are etched at most once, making the second length SA2 and the third length SA3 close, that is, the absolute value of the difference between the second length SA2 and the third length SA3 is less than or equal to 0.1 μm. This makes the shape of the sidewall 420 of the isolation structure 400 facing the third isolation opening 413 more consistent with expectations, which can improve the yield of the third light-emitting unit 333 and the third sub-electrode 530, and improve the process performance of the display panel.

[0149] Optionally, the first length SA1 is less than the second length SA2, and / or the first length SA1 is less than the third length SA3.

[0150] In this embodiment of the application, before fabricating the first light-emitting unit 331, the side wall surface of the isolation structure 400 facing the first isolation opening 411 is not etched. Therefore, the inner wall surface of the first sub-layer 401 facing the first isolation opening 411 is not damaged. However, the surfaces of the first sub-layer 401 facing the second isolation opening 412 and the third isolation opening 413 are etched once. Therefore, the first length SA1 is small, while the second length SA2 and the third length SA3 are large.

[0151] Optionally, the first length SA1 is shorter than the second length SA2, and the absolute value of the difference between the first length SA1 and the second length SA2 is 0.05μm to 0.15μm. For example, the absolute value of the difference between the first length SA1 and the second length SA2 is 0.05μm, 0.06μm, 0.08μm, 0.09μm, 0.095μm, 0.10μm, 0.106μm, 0.12μm / 0.14μm, or 0.15μm, in order to improve the display effect of the display panel due to the excessively long absolute value of the difference between the first length SA1 and the second length SA2.

[0152] And / or, the first length SA1 is less than the third length SA3, and the absolute value of the difference between the first length SA1 and the third length SA3 is 0.05μm to 0.15μm. For example, the absolute values ​​of the difference between the first length SA1 and the third length SA3 are 0.05μm, 0.06μm, 0.08μm, 0.09μm, 0.095μm, 0.10μm, 0.106μm, 0.12μm / 0.14μm, and 0.15μm, to improve the display effect of the display panel due to the excessively long absolute value of the difference between the first length SA1 and the third length SA3.

[0153] Optionally, the second length SA2 may be slightly larger than the third length SA3, and the second length SA2 may also be slightly smaller than the third length SA3. When the first length SA1 is smaller than the second length SA2, and the second length SA2 is less than or equal to the third length SA3, the absolute value of the difference between the first length SA1 and the second length SA2 is greater than the absolute value of the difference between the second length SA2 and the third length SA3. Alternatively, when the first length SA1 is smaller than the third length SA3, and the third length SA3 is less than or equal to the second length SA2, the absolute value of the difference between the first length SA1 and the third length SA3 is greater than the absolute value of the difference between the second length SA2 and the third length SA3. Since the surfaces of the isolation structure 400 facing the second isolation opening 412 and the third isolation opening 413 are etched at most once, the second length SA2 and the third length SA3 are close. However, the side of the isolation structure 400 facing the first isolation opening 411 is not etched, so the first length SA1 is significantly smaller than the second length SA2 and the third length SA3.

[0154] Optionally, the second length SA2 and the third length SA3 are equal. This makes the dimensions of the isolation structures 400 at different positions more similar, and the isolation effect of the isolation structures 400 on different light-emitting materials is similar, so as to further improve the manufacturing yield and display uniformity of the display panel.

[0155] Optionally, the display panel may also include the first electrode layer 200, pixel definition layer 300, second electrode 500, encapsulation part 600, second encapsulation layer 700 and third encapsulation layer 800 as described above. The arrangement of the first electrode layer 200, pixel definition layer 300, isolation structure 400, second electrode 500, encapsulation part 600, second encapsulation layer 700 and third encapsulation layer 800 is as described above and will not be repeated here.

[0156] For example, optionally, the display panel includes a second electrode 500 located on the side of each light-emitting unit 330 facing away from the substrate 100. The second electrode 500 may include a first sub-electrode 510 located in the first isolation opening 411, a second sub-electrode 520 located in the second isolation opening 412, and a third sub-electrode 530 located in the third isolation opening 413. The second electrode 500 and the first electrode 210 work together to drive the light-emitting unit 330 to emit light.

[0157] Optionally, the material of the isolation structure 400 includes a conductive material, and the second electrode 500 and the isolation structure 400 are electrically connected, so that multiple second electrodes 500 can be interconnected as surface electrodes through the isolation structure 400.

[0158] Optionally, the material of the first sublayer 401 may include a conductive material, and the second electrode 500 is electrically connected to the first sublayer 401. Optionally, the second sublayer 402 may include a conductive material to increase the distribution area of ​​the conductive material and reduce the voltage drop of the second electrode 500.

[0159] Optionally, the isolation structure 400 may also include the aforementioned third sublayer 403, which may include a conductive material. The second electrode 500 and the third sublayer 403 are electrically connected to further reduce the voltage drop of the second electrode 500 at different locations.

[0160] As described above, the display panel also includes a pixel definition layer 300. The isolation structure 400 can be located on the side of the pixel defining portion 310 facing away from the substrate 100 to simplify the structure of the pixel definition layer 300 and simplify the manufacturing of the display panel. Alternatively, the pixel defining portion 310 may have a clearance opening, and the isolation structure 400 may be located in the clearance opening to reduce the thickness of the display panel.

[0161] An embodiment of the third aspect of this application also provides a display device, including the display panel of any of the second aspect embodiments described above. Since the display device provided by the third aspect embodiment includes the display panel of any of the second aspect embodiments described above, the display device provided by the third aspect embodiment has the beneficial effects of the display panel of any of the second aspect embodiments described above, which will not be elaborated further here.

[0162] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0163] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A method for manufacturing a display panel, characterized in that, include: An isolation structure is fabricated on a substrate, and the isolation structure encloses a first isolation opening, a second isolation opening, and a third isolation opening; A first fabrication material layer is provided on the side of the isolation structure away from the substrate, and a portion of the first fabrication material layer falls into the first isolation opening to form a first light-emitting unit and a first encapsulation part; Remove the first preparation material layer in the area where the second isolation opening is located to expose the second isolation opening, while retaining the first preparation material layer in the area where the third isolation opening is located; A second fabrication material layer is provided on the side of the isolation structure away from the substrate, and a portion of the second fabrication material layer falls into the second isolation opening to form a second light-emitting unit and a second encapsulation part.

2. The preparation method according to claim 1, characterized in that, After the step of providing a second fabrication material layer on the side of the isolation structure opposite to the substrate, and having a portion of the second fabrication material layer fall into the second isolation opening to form the second light-emitting unit and the second encapsulation portion, the method further includes: Remove the second preparation material layer in the area where the first isolation opening is located, and remove the first preparation material layer and the second preparation material layer in the area where the third isolation opening is located, so that the third isolation opening is exposed; A third fabrication material layer is provided on the side of the isolation structure away from the substrate, and a portion of the third fabrication material layer falls into the third isolation opening to form a third light-emitting unit and a third encapsulation part.

3. The preparation method according to claim 2, characterized in that, In the step of removing the second fabrication material layer in the area where the first isolation opening is located, and removing the first fabrication material layer and the second fabrication material layer in the area where the third isolation opening is located, so as to expose the third isolation opening: the third isolation opening and the portion of the isolation structure surrounding the third isolation opening are exposed.

4. The preparation method according to claim 2, characterized in that, The first encapsulation portion and the second encapsulation portion are spaced apart on the side of the isolation structure away from the substrate.

5. The preparation method according to claim 2, characterized in that, The step of removing the first fabrication material layer in the region where the first isolation opening is located, and removing the first fabrication material layer and the second fabrication material layer in the region where the third isolation opening is located, to expose the third isolation opening, includes: Remove the second preparation material layer in the area where the third isolation opening is located, so that the first preparation material layer in the area where the third isolation opening is located is exposed; Remove the second fabrication material layer in the area where the first isolation opening is located and the first fabrication material layer in the area where the third isolation opening is located, so that the third isolation opening is exposed.

6. The preparation method according to claim 5, characterized in that, In the step of removing the second fabrication material layer in the area where the third isolation opening is located to expose the first fabrication material layer in the area where the third isolation opening is located: the second fabrication material layer in the area where the third isolation opening is located is removed so that a portion of the second fabrication material layer in the area where the second isolation opening is located overlaps with the first fabrication material layer in the area where the third isolation opening is located on the side of the isolation structure away from the substrate to form an overlapping portion, and the first fabrication material layer in the area where the third isolation opening is located is exposed. In the step of removing the second preparation material layer in the region where the first isolation opening is located and the first preparation material layer in the region where the third isolation opening is located, so as to expose the third isolation opening, the overlapping portion is also removed.

7. The preparation method according to claim 6, characterized in that, After the step of providing a second fabrication material layer on the side of the isolation structure opposite to the substrate, and having a portion of the second fabrication material layer fall into the second isolation opening to form the second light-emitting unit and the second encapsulation portion, the method further includes: A photoresist material layer is covered on the side of the second fabrication material layer away from the substrate, and the photoresist material layer is patterned to form a first photoresist layer and a first photolithographic opening formed in the first photoresist layer. The first photolithographic opening is located within the orthogonal projection of the third isolation opening on the substrate.

8. The preparation method according to claim 2, characterized in that, The step of removing the first fabrication material layer in the region where the first isolation opening is located, and removing the first fabrication material layer and the second fabrication material layer in the region where the third isolation opening is located, to expose the third isolation opening, includes: Remove the second fabrication material layer in the areas where the first isolation opening and the third isolation opening are located, so that the first fabrication material layer of the third isolation opening is exposed; Remove the first preparation material layer in the area where the third isolation opening is located to expose the third isolation opening.

9. The preparation method according to claim 2, characterized in that, After the step of forming a third light-emitting unit and a third encapsulation portion by depositing a third fabrication material layer on the side of the isolation structure opposite to the substrate, and partially depositing the third fabrication material layer into the third isolation opening, the method further includes: Remove the third preparation material layer from the areas where the first isolation opening and the second isolation opening are located.

10. The preparation method according to claim 9, characterized in that, The third encapsulation portion and the first encapsulation portion are spaced apart on the side of the isolation structure away from the substrate, and / or the third encapsulation portion and the second encapsulation portion are spaced apart on the side of the isolation structure away from the substrate.

11. The preparation method according to claim 9, characterized in that, In the step of removing the third fabrication material layer in the areas where the first isolation opening and the second isolation opening are located: removing the third fabrication material layer in the first isolation opening, the side of the isolation structure surrounding the first isolation opening away from the substrate, the second isolation opening, the side of the isolation structure surrounding the second isolation opening away from the substrate, and part of the side of the isolation structure surrounding the third isolation opening away from the substrate.

12. The preparation method according to claim 1, characterized in that, In the step of removing the first fabrication material layer in the region where the second isolation opening is located, to expose the second isolation opening, and retaining the first fabrication material layer in the region where the third isolation opening is located: The first fabrication material layer on the side of the isolation structure facing away from the substrate is removed from the second isolation opening and partially surrounding the second isolation opening, so that the second isolation opening and the isolation structure partially surrounding the second isolation opening are exposed, and the third isolation opening and the isolation structure partially surrounding the third isolation opening are covered by the first fabrication material layer.

13. The preparation method according to claim 1, characterized in that, The steps of fabricating an isolation structure on a substrate, wherein the isolation structure encloses and forms a first isolation opening, a second isolation opening, and a third isolation opening, include: A first insulating material layer is disposed on one side of the substrate; An isolation structure is prepared on the side of the first insulating material layer away from the substrate, and the isolation structure encloses to form a first isolation opening, a second isolation opening and a third isolation opening; The first insulating material layer exposed by the first isolation opening is patterned to form a first pixel opening, the first insulating material layer exposed by the second isolation opening is patterned to form a second pixel opening, and the first insulating material layer exposed by the third isolation opening is patterned to form a third pixel opening.

14. The preparation method according to claim 13, characterized in that, The isolation structure includes a first sublayer and a second sublayer stacked in a direction away from the substrate, wherein the orthographic projection of the first sublayer onto the substrate is located within the orthographic projection of the second sublayer onto the substrate.

15. The preparation method according to claim 14, characterized in that, The isolation structure further includes a third sub-layer located on the side of the first sub-layer facing the substrate, wherein the orthographic projection of the first sub-layer onto the substrate lies within the orthographic projection of the third sub-layer onto the substrate.

16. The preparation method according to claim 1, characterized in that, The first fabrication material layer includes a first light-emitting material layer, a first conductive material layer, and a first encapsulation material layer stacked in a direction away from the substrate. The first fabrication material layer is disposed on the side of the isolation structure away from the substrate. In the step of partially falling into the first isolation opening to form the first light-emitting unit and the first encapsulation portion, the first light-emitting unit, the first sub-electrode, and the first encapsulation portion are stacked in a direction away from the substrate. And / or, the second fabrication material layer includes a second light-emitting material layer, a second conductive material layer and a second encapsulation material layer stacked in a direction away from the substrate, the second fabrication material layer being disposed on the side of the isolation structure away from the substrate, and a portion of the second fabrication material layer falling into the second isolation opening to form the second light-emitting unit and the second encapsulation portion, thereby forming the second light-emitting unit, the second sub-electrode and the second encapsulation portion stacked in a direction away from the substrate.

17. A display panel, characterized in that, The display panel is prepared by the method described in any one of claims 1-16.

18. A display panel, characterized in that, include: substrate; An isolation structure is disposed on one side of the substrate and surrounds an isolation opening, the isolation opening including a first isolation opening, a second isolation opening and a third isolation opening; The light-emitting unit includes a first light-emitting unit located in the first isolation opening, a second light-emitting unit located in the second isolation opening, and a third light-emitting unit located in the third isolation opening; The isolation structure includes a first sub-layer and a second sub-layer stacked in a direction away from the substrate. The second sub-layer protrudes relative to the first sub-layer toward the isolation opening. The length of the second sub-layer protruding relative to the first sub-layer toward the first isolation opening is a first length. The length of the second sub-layer protruding relative to the first sub-layer toward the second isolation opening is a second length. The length of the second sub-layer protruding relative to the first sub-layer toward the third isolation opening is a third length. The absolute value of the difference between the second length and the third length is less than or equal to 0.1 μm.

19. The display panel according to claim 18, characterized in that, The first length is less than the second length, and / or the first length is less than the third length.

20. The display panel according to claim 19, characterized in that, The first length is less than the second length, and the absolute value of the difference between the first length and the second length is 0.05μm~0.15μm; And / or, the first length is less than the third length, and the absolute value of the difference between the first length and the third length is 0.05μm~0.15μm.

21. The display panel according to claim 19, characterized in that, The first length is less than the second length, and the second length is less than or equal to the third length, and the absolute value of the difference between the first length and the second length is greater than the absolute value of the difference between the second length and the third length; Alternatively, the first length is less than the third length, and the third length is less than or equal to the second length, and the absolute value of the difference between the first length and the third length is greater than the absolute value of the difference between the second length and the third length.

22. The display panel according to claim 18, characterized in that, The second length and the third length are equal.

23. The display panel according to claim 18, characterized in that, The material of the isolation structure includes a conductive material; The display panel also includes a second electrode located on the side of each light-emitting unit away from the substrate, and the second electrode is electrically connected to the isolation structure.

24. The display panel according to claim 23, characterized in that, The first sublayer is made of a conductive material, and the second electrode is electrically connected to the first sublayer.

25. The display panel according to claim 23, characterized in that, The material of the second sublayer includes a conductive material.

26. The display panel according to claim 23, characterized in that, The isolation structure also includes a third sublayer located on the side of the first sublayer facing the substrate.

27. The display panel according to claim 26, characterized in that, The material of the third sublayer includes a conductive material, and the second electrode and the third sublayer are electrically connected.

28. The display panel according to claim 18, characterized in that, Also includes: A pixel definition layer is disposed on one side of the substrate and includes a pixel defining portion and a pixel opening, wherein the pixel opening and the isolation opening are in communication.

29. The display panel according to claim 28, characterized in that, The isolation structure is located on the side of the pixel defining portion away from the substrate, or the pixel defining portion has a clearance opening, and the isolation structure is located in the clearance opening.

30. A display device, characterized in that, The display panel includes the display panel prepared by the preparation method according to any one of claims 1-16, or the display panel according to any one of claims 17-29.

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