Outer lead leg separating jig for semiconductor TO type metal cylindrical shell packaging product and use method of outer lead leg separating jig

Abstract

The invention discloses an outer lead leg separating jig for a semiconductor TO type metal cylindrical shell packaging product and a using method of the outer lead leg separating jig, and belongs to the technical field of semiconductor packaging. The jig comprises a circular-truncated-cone-shaped leg separating head, a plurality of leg separating grooves are formed along the slope face of the leg separating head, the outer lead of the semiconductor TO type metal cylindrical shell packaging product is separated along the leg separating grooves, and inlets and outlets of the leg separating grooves are formed in the upper top face and the lower bottom face of the leg separating head respectively; inlets of the leg separating grooves are matched with the arrangement positions of outer leads of the semiconductor TO type metal cylindrical shell packaged product, the outer leads of the semiconductor TO type metal cylindrical shell packaged product are arranged in a circumferential array mode, and outlets of the leg separating grooves are matched with the arrangement positions of jacks of the double-row in-line socket. The tool has the advantages of being good in consistency, high in efficiency, convenient and fast to operate and the like, the peripheral array outer lead legs of the TO type metal cylindrical shell packaged product can be divided (shaped) into the dual-in-line mode, and reliability screening testing can be conveniently carried out on the TO type metal cylindrical shell packaged product.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor packaging, and in particular relates to an external lead leg separation jig for a semiconductor TO-type metal cylindrical shell packaging product and a use method thereof. Background Art

[0002] The TO-type metal cylindrical shell package (Transistor Outline package) is a common semiconductor device packaging form. The outer leads of the TO-type metal cylindrical shell package are arranged in a circular array. The reliability screening test socket of the packaged product adopts a dual-in-line plug-in form. In order to ensure that the product can smoothly undergo reliability screening tests, the packaged product needs to go through a key process, that is, manually splitting (shaping) the outer leads into a form that meets the dual-in-line plug-in requirements. This step is designed to enable the pins of the product to accurately correspond to the two rows of jacks of the socket, so that the product can be firmly locked on the dual-in-line plug-in socket, so as to carry out subsequent reliability screening tests and ensure the accuracy and effectiveness of the test results.

[0003] The reliability screening test socket of the packaged product adopts the dual in-line plug-in form. However, the existing TO-type metal cylindrical shell external lead splitting (shaping) process mainly relies on manual completion. This method has the problems of poor shaping consistency and slow operation speed, and it is difficult to ensure the precise consistency of the external lead spacing after splitting (shaping), resulting in the situation that the external leads cannot be accurately inserted into the test socket in the subsequent screening process, affecting the test efficiency and accuracy.

[0004] Therefore, it is urgent to improve the leg splitting (shaping) process of the outer leads to improve the consistency and speed of the shaping and ensure the accuracy of the outer lead spacing, thereby ensuring the smooth progress of the reliability screening test. Summary of the invention

[0005] In order to overcome the shortcomings of the above-mentioned prior art, the purpose of the present invention is to provide a semiconductor TO-type metal cylindrical shell packaging product external lead leg splitting (shaping) fixture and a method of using the same, the fixture has the characteristics of good consistency, high efficiency, and convenient operation. It can split (shape) the circular array external leads of the TO-type metal cylindrical shell packaging product into a dual-in-line form, which is convenient for reliability screening and testing of the TO-type metal cylindrical shell packaging product.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] The present invention provides a semiconductor TO-type metal cylindrical shell packaging product external lead leg separation jig, comprising a truncated cone-shaped leg separation head, a plurality of leg separation grooves are opened along the slope of the leg separation head, and the semiconductor TO-type metal cylindrical shell packaging product external lead is separated along the leg separation grooves, and the inlet and outlet of the leg separation groove are respectively arranged on the upper top surface and the lower bottom surface of the leg separation head;

[0008] The inlet of the leg groove matches the arrangement position of the external leads of the semiconductor TO-type metal cylindrical shell packaging product, and the external leads of the semiconductor TO-type metal cylindrical shell packaging product are arranged in a circular array. The outlet of the leg groove matches the arrangement position of the dual-in-line socket jack.

[0009] In one embodiment, the number of the leg-branching grooves is the same as the number of external leads of the semiconductor TO-type metal cylindrical shell package product, ensuring that each external lead can have a corresponding leg-branching groove for shaping, avoiding omission or repeated shaping. If the number of leg-branching grooves is less than the number of external leads, some external leads cannot be shaped; if the number of leg-branching grooves is more than the number of external leads, it will cause a waste of resources. Therefore, the same number is the best choice.

[0010] In one embodiment, the number of external leads of the semiconductor TO-type metal cylindrical shell package product is at least 2, which is applicable to most semiconductor TO-type package products, thereby improving the versatility of the fixture. Most semiconductor TO-type package products have multiple external leads, and the fixture is designed to be applicable to products with at least 2 external leads, which can cover a wider range of products.

[0011] In one embodiment, the diameter of the upper top surface of the split leg head is smaller than the diameter of the circle where the outer leads of the semiconductor TO-type metal cylindrical shell package product are located, so that the jig can be inserted between the outer leads to start the shaping process. If the diameter of the upper top surface is too large, the jig cannot be smoothly inserted between the outer leads.

[0012] In one embodiment, the diameter of the bottom surface of the split leg head is larger than the farthest distance between the dual in-line socket holes to be inserted into the external leads of the semiconductor TO-type metal cylindrical shell packaging product, ensuring that the spacing between the external leads after shaping is large enough to be successfully inserted into the dual in-line socket.

[0013] In one embodiment, the entrance of the leg-branching slot is chamfered to facilitate the smooth insertion of the external lead into the leg-branching slot and reduce the resistance during insertion. The chamfering design can guide the external lead into the leg-branching slot smoothly, avoiding damage to the external lead or increased insertion difficulty due to the sharp entrance edge.

[0014] In one embodiment, the plurality of leg-bracket grooves are divided into two rows and are symmetrically arranged along the central axis of the leg-bracket head, which meets the arrangement requirements of the dual-row in-line socket. The symmetrically arranged leg-bracket grooves can make the shaped external leads evenly distributed on both sides, which meets the arrangement of the sockets of the dual-row in-line socket.

[0015] In one embodiment, the split leg head is connected to a hand-held rod, which is a long cylindrical rod, so that the operator can hold the jig for operation, thereby improving the convenience and stability of the operation. The long cylindrical rod hand-held rod can provide sufficient holding space, so that the operator can hold the jig stably for operation.

[0016] In one embodiment, the leg groove is an inclined U-shaped opening groove, which facilitates the smooth deformation of the outer lead during the tightening process to achieve the purpose of shaping. The inclined U-shaped opening groove can cause the outer lead to be subjected to gradually increasing pressure during the tightening process, thereby smoothly deforming and achieving the effect of shaping.

[0017] The present invention also provides a method for using a semiconductor TO-type metal cylindrical shell packaging product outer lead leg separation fixture, comprising the following steps:

[0018] The outer lead of the semiconductor TO-type metal cylindrical shell package product is inserted through the entrance of the leg groove opened on the leg head, and the outer lead of the semiconductor TO-type metal cylindrical shell package product is pushed along the leg groove and then pulled out in the opposite direction. The above method of use is simple and convenient to operate, and can quickly complete the shaping process of the outer lead. This method of use makes full use of the design features of the fixture, and the shaping of the outer lead can be completed through the simple steps of insertion, pushing and pulling, which improves the operating efficiency and convenience.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] The present invention provides a semiconductor TO-type metal cylindrical shell package product external lead leg splitting (shaping) jig, the main function of the jig is to split the external leads of the semiconductor TO-type metal cylindrical shell package product, so that the external leads are transformed from a circular array arrangement to a form matching the dual-row in-line socket jack arrangement (dual-row in-line form), and the jig has the advantages of good consistency, high efficiency, and convenient operation. The existing manual leg splitting method has poor shaping consistency due to the uncertainty of human operation. The leg splitting jig in the present invention is designed with a truncated cone-shaped leg splitting head, and a plurality of leg splitting grooves are provided on the slope. The shape and size of the leg splitting groove can ensure that each external lead is shaped into a consistent shape and spacing when passing through the leg splitting groove. Therefore, the use of the leg splitting jig of the present invention can greatly improve the consistency of the external lead shaping, so that the shaped external leads are more uniform and neat. The manual leg splitting method requires shaping the external leads one by one, and the operation speed is slow. The leg-splitting jig of the present invention can shape multiple external leads at one time. It is only necessary to place the semiconductor TO-type metal cylindrical shell packaged product on the jig, and then gently press it down to complete the leg-splitting operation. The above-mentioned batch processing method greatly improves the operation speed and improves production efficiency. The manual leg-splitting method is difficult to ensure the accuracy of the external lead spacing, because it is difficult to control the position and spacing of each external lead by manual operation. The leg-splitting groove outlet in the leg-splitting jig of the present invention matches the arrangement position of the dual-in-line socket jacks, which means that the spacing of the external leads after shaping will be consistent with the spacing of the socket jacks. Therefore, the use of the leg-splitting jig of the present invention can ensure the accuracy of the external lead spacing, so that the shaped external leads can be smoothly inserted into the test socket, thereby improving the accuracy and reliability of the test. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of a semiconductor TO-8 type metal cylindrical shell packaging product according to an embodiment of the present invention.

[0022] Figure 2 It is an overall schematic diagram of a leg-split fixture for a semiconductor TO-8 type metal cylindrical shell packaging product according to an embodiment of the present invention.

[0023] Figure 3 It is a schematic diagram of a leg splitting fixture for semiconductor TO-8 type metal cylindrical shell packaging product according to an embodiment of the present invention.

[0024] Figure 4 This is a schematic diagram of the top surface of a leg-split head of a leg-split fixture for semiconductor TO-8 type metal cylindrical shell packaging product according to an embodiment of the present invention.

[0025] Figure 5 It is a schematic diagram of the bottom surface of the leg head of a leg-split fixture for semiconductor TO-8 type metal cylindrical shell packaging product according to an embodiment of the present invention.

[0026] Figure 6It is a schematic diagram of the arrangement of the leg grooves of the leg fixture for semiconductor TO-8 type metal cylindrical shell packaging according to an embodiment of the present invention.

[0027] Figure 7 It is a schematic diagram of the leg separation process of a leg separation fixture for semiconductor TO-8 type metal cylindrical shell package according to an embodiment of the present invention.

[0028] Figure 8 It is a schematic diagram of the leg-splitting effect of a leg-splitting fixture for semiconductor TO-8 type metal cylindrical shell packaging according to an embodiment of the present invention.

[0029] Fig. 9 It is a front view of a leg-split head of a leg-split fixture for semiconductor TO-8 type metal cylindrical housing packaging according to an embodiment of the present invention.

[0030] Fig.10 A side view of a leg-split head of a leg-split fixture for packaging a semiconductor TO-8 type metal cylindrical housing according to an embodiment of the present invention.

[0031] Fig.11 It is a schematic diagram of the matching of the leg grooves of the leg-breaking fixture for semiconductor TO-8 type metal cylindrical shell packaging and the arrangement positions of the dual in-line socket holes, and the arrangement positions of the external leads of the semiconductor TO type metal cylindrical shell packaging product according to an embodiment of the present invention.

[0032] Fig.12 The middle figure (a) and the figure (b) are top-view dimension diagrams of the leg-branch head and the leg-branch groove of the leg-branch fixture for semiconductor TO-8 type metal cylindrical shell package according to an embodiment of the present invention.

[0033] Fig.13 It is a schematic diagram of the chamfering of the leg head of the leg fixture for semiconductor TO-8 type metal cylindrical shell packaging according to an embodiment of the present invention.

[0034] Fig.14 It is a schematic diagram of the processing of the leg head of the leg fixture for semiconductor TO-8 type metal cylindrical shell packaging according to one embodiment of the present invention.

[0035] In the figure: 1-handle rod; 2-leg head; 3-leg groove; 4-chamfer; 5-TO-8 type metal cylindrical shell packaging product external lead. DETAILED DESCRIPTION

[0036] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0037] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0038] The present invention is further described in detail below in conjunction with the accompanying drawings:

[0039] See also Figure 2 The present invention provides a semiconductor TO-type metal cylindrical shell package product external lead branching jig and a method of using the same. The semiconductor TO-type metal cylindrical shell package product external lead branching jig includes a branching head 2, which is truncated, and a plurality of branching grooves 3 are provided along the slope of the branching head 2. The semiconductor TO-type metal cylindrical shell package product external lead is branched along the branching grooves 3. In one embodiment, the semiconductor TO-type metal cylindrical shell package product external lead is as follows Figure 1 The external leads of the TO-8 type metal cylindrical shell package product are shown in Figure 5.

[0040] See also Figure 2 In the leg-split fixture shown, the leg-split head 2 is connected to a hand-held rod 1, which is a long cylindrical rod. More preferably, the diameter of the hand-held rod 1 is greater than or equal to the diameter of the leg-split head 2.

[0041] See also Figure 3 , Figure 4 and Figure 5 , Figure 6 , Fig. 9 , Fig.10 , Fig.11 The leg splitting fixture shown in the figure has a leg splitting head 2 as the main structural part of the fixture, and a plurality of leg splitting grooves 3 are provided on its slope. The leg splitting grooves 3 are designed with specific inlet and outlet positions, wherein the inlet is arranged on the upper top surface of the leg splitting head 2, matching the arrangement position of the external leads of the semiconductor TO-type metal cylindrical shell package product, and the external leads are arranged in a circular array. The outlet of the leg splitting groove 3 is arranged on the lower bottom surface of the leg splitting head 2, matching the arrangement position of the dual in-line socket jack. Fig.13 A chamfer 4 is provided at the entrance of the leg groove 3.

[0042] Referring to the branching head 2 shown in the above figure, the diameter of the upper top surface of the branching head 2 is smaller than the diameter of the circle where the external leads of the semiconductor TO-type metal cylindrical shell packaging product are located, and the diameter of the lower bottom surface of the branching head 2 is greater than the maximum distance between the dual-in-line socket holes into which the external leads of the semiconductor TO-type metal cylindrical shell packaging product are to be inserted.

[0043] See also Figure 4 and Figure 5 A plurality of leg-dividing grooves 3 are provided on the leg-dividing head 2 . The leg-dividing grooves 3 are divided into two rows, and the two rows of leg-dividing grooves 3 are symmetrically arranged along the central axis of the leg-dividing head 2 .

[0044] See also Figure 6 and Fig.11 The entrances of several of the leg grooves 3 correspond to multiple external lead positions of semiconductor TO-type metal cylindrical shell packaging products arranged in a circular array; the exits of several of the leg grooves 3 correspond to multiple socket positions of the dual-in-line socket.

[0045] Further preferably, the leg groove 3 is an inclined U-shaped opening groove.

[0046] When the outer leads of the semiconductor TO-type metal cylindrical shell packaging product are moved along the leg-dividing groove 3, the leg-dividing operation of the outer leads can be realized.

[0047] The present invention also provides a method for using the outer lead leg separation fixture for semiconductor TO-type metal cylindrical shell packaging products, as follows: Figure 7 The outer lead of the semiconductor TO-type metal cylindrical shell packaging product is inserted into the entrance of the leg-dividing groove 3 opened on the leg-dividing head 2, and the outer lead of the semiconductor TO-type metal cylindrical shell packaging product is pushed along the leg-dividing groove 3 and then pulled out in the opposite direction.

[0048] The effect of leg splitting after plastic surgery using the above method is as follows Figure 8 shown.

[0049] In a specific implementation process, the number of the leg grooves 3 is the same as the number of external leads of the semiconductor TO-type metal cylindrical shell packaging product. The number of external leads of the semiconductor TO-type metal cylindrical shell packaging product is at least 2.

[0050] Example

[0051] In this embodiment, a leg splitting jig and a method for using the outer lead 5 of a semiconductor TO-8 type metal cylindrical shell packaging product are provided to solve the technical problems that the leg splitting (shaping) of the outer lead 5 of the existing TO-8 type metal cylindrical shell packaging product is poor in consistency, slow in speed, the outer lead spacing after leg splitting (shaping) cannot be guaranteed, and the test socket cannot be inserted in the screening stage.

[0052] The above-mentioned semiconductor TO-8 type metal cylindrical shell package product external lead 5-leg fixture comprises a hand-held rod 1 and a leg-dividing head 2. The hand-held rod 1 is a cylindrical pen with a length of 100 mm and a diameter of 15 mm, which is convenient for hand-holding in the user; the leg-dividing head 2 is a truncated cone with a height of 10 mm, an upper top surface diameter of 8 mm, and a lower bottom surface diameter of 13 mm, and see Fig.14 The side surface (slope surface) of the truncated cone is processed with a leg groove 3 that passes through the upper and lower bottom surfaces of the truncated cone and matches the external lead 5 of the TO-8 metal cylindrical shell packaging product (the number of the leg grooves 3 is determined according to the number of external leads of the TO-8 metal cylindrical shell), and the upper bottom surface of the leg head 2 is processed with an entrance of the leg groove 3 that matches the arrangement position of the external lead 5 of the circumferential array of the TO-8 metal cylindrical shell, and the entrance of the leg groove 3 on the upper top surface is processed with a chamfer 4 with a depth of 0.6mm and an angle of 60°, which is convenient for inserting the external lead 5 of the TO-8 metal cylindrical shell packaging product; the lower bottom surface of the leg head 2 is processed with an exit that matches the arrangement position of the locking dual-row in-line socket, so that the external lead 5 of the TO-8 metal cylindrical shell packaging product can be smoothly inserted into the dual-row in-line socket after the external lead 5 of the TO-8 metal cylindrical shell packaging product is split, thereby realizing the reliability screening test of the product.

[0053] The method of using the above-mentioned semiconductor TO-8 type metal cylindrical shell packaging product external lead 5-leg fixture is as follows:

[0054] By holding the TO-8 type metal cylindrical shell package product external lead leg separation jig, the TO-8 type metal cylindrical shell package product external lead 5 is inserted into the entrance of the leg separation groove 3 on the bottom surface of the leg separation head 2, and the external lead is pushed along the leg separation groove 3 and then pulled out in the opposite direction, so as to achieve the purpose of leg separation of the TO-8 type metal cylindrical shell package product external lead 5.

[0055] By adopting the above technical solution, the fixture provided in this embodiment can realize the splitting (shaping) of the circular array distributed external leads of the TO-8 type metal cylindrical shell into a dual-in-line form. The product after the legs are split by the fixture has the advantages of good leg consistency, high production efficiency, and convenient operation.

[0056] Example

[0057] This embodiment provides a TO-8 type semiconductor metal cylindrical shell packaging product outer lead leg separation fixture and use method, such as Figure 2 As shown, the leg-split jig mainly includes a hand-held rod 1 and a leg-split head 2.

[0058] like Figure 3 As shown, the leg header 2 is designed with a leg groove 3 that matches the external lead 5 of the TO-8 type metal cylindrical shell packaging product, and the entrance of the leg groove 3 on the top surface of the leg header 2 is processed with a chamfer 4 for inserting the external lead 5 of the TO-8 type metal cylindrical shell packaging product.

[0059] like Figure 4 As shown, the top surface of the leg header 2 is processed with an entrance of a leg slot 3 that matches the arrangement position of the outer leads in a circular array of a TO-8 type metal cylindrical housing.

[0060] like Figure 5 As shown, the lower bottom surface of the leg head 2 is processed with a leg slot 3 outlet that matches the arrangement position of the locking dual-row in-line socket jacks.

[0061] like Figure 6 and Fig.14 As shown, according to the arrangement of the leg splitting groove 3 entrance on the top surface of the leg splitting head 2 and the leg splitting groove 3 exit on the bottom surface, along Figure 6 The entrance of the upper leg groove 3 and the exit of the lower leg groove 3 are connected by a virtual straight line as a slotting path for U-shaped opening groove processing, so that the processing and manufacturing of the leg groove 3 can be realized, and the outer lead 5 of the TO-8 type metal cylindrical shell packaging product can be smoothly inserted into the dual-row in-line socket after the legs are separated, and the outer lead legs of the TO-8 type metal cylindrical shell packaging product are separated into dual-row in-line, so that the outer lead of the TO-8 type metal cylindrical shell can be smoothly inserted into the dual-row in-line socket after the legs are separated, and the reliability screening test of the product is realized.

[0062] like Figure 7 and Figure 8 As shown, by holding the TO-8 metal cylindrical shell package product external lead leg separation fixture, insert the TO-8 metal cylindrical shell package product external lead 5 into the upper top surface leg separation groove 3 entrance, push the external lead along the leg separation groove 3 and then pull it out in the opposite direction, so as to achieve the purpose of leg separation of the TO-8 metal cylindrical shell package product external lead 5. It meets the requirements of reliability screening test in dual in-line test socket.

[0063] See also Fig.12 The two rows of jacks between the dual in-line test sockets are symmetrically arranged, the distance between the two rows of jacks is 7mm, and the distance between two adjacent jacks in one row is 2.5mm.

[0064] The external leads 5 of the TO-8 metal cylindrical shell package product are arranged in a circular array, the diameter of which is 4.5mm, and the angle of adjacent lead distribution is 45° (the solid points on the dotted line of the circular array in Figure (b) of Figure 12 are schematic diagrams of the external lead arrangement). The spacing between adjacent test holes of the dual-row in-line test socket is 2.5mm, and the spacing between the two sides of the dual-row in-line is 3.5mm (the intersection of the right rectangular connection line in Figure (a) of Figure 12 is the dual-row in-line test hole). Connect the solid points of the circular array with the intersection of the rectangular connection lines, that is, the 8 external leads need to reach the leg-split position and angle respectively, as shown in Figure 14. The interconnected dotted lines in the 3D diagram can be used as 5-axis machining guide lines. A U-shaped groove (leg-split groove 3) with a radius of 0.3mm can be machined along the guide line to achieve the production of leg-split groove 3.

[0065] See also Fig.12 In the middle figure (a), 8 leg-dividing grooves 3 are provided on the leg-dividing head 2. The chamfer 4 at the entrance of the leg-dividing groove 3 has a depth of 0.6 mm and an angle of 60°.

[0066] The diameter of the circumferential array of the external leads 5 of the TO-8 type metal cylindrical shell package product is only 4.5mm, which is relatively small in size, and the 8 circumferential array external leads need to be separated in 8 different directions to be inserted into the dual-row in-line test socket for reliability screening test. The angles and distances of the 8 external leads are different, and the design of the leg splitting fixture is relatively difficult. In this embodiment, the leg splitting groove 3 entrance is processed on the upper bottom surface of the leg splitting head 2 to match the arrangement position of the external leads 5 of the TO-8 type metal cylindrical shell package product, and the leg splitting groove 3 outlet is processed on the lower bottom surface of the leg splitting head 2 to match the arrangement position of the locking dual-row in-line socket jack, and the U-shaped opening groove is processed along the virtual straight line connecting the leg splitting groove 3 entrance on the upper top surface and the leg splitting groove 3 outlet on the lower bottom surface, so as to realize the processing and manufacturing of the leg splitting groove 3, and the 8 external leads can be separated to the specified positions that meet the test of the dual-row in-line test socket, thereby achieving the purpose of leg splitting.

[0067] The invention provides a semiconductor TO-type metal cylindrical shell package product external lead leg separation jig with the advantages of good leg separation consistency, high production efficiency and convenient operation. Leg separation by the jig can achieve one-time molding, and the product can meet the requirements of reliability screening test on a dual in-line test socket after leg separation.

[0068] The above contents are only for explaining the technical idea of ​​the present invention and cannot be used to limit the protection scope of the present invention. Any changes made on the basis of the technical solution in accordance with the technical idea proposed by the present invention shall fall within the protection scope of the claims of the present invention.

Claims

1. A fixture for separating the outer leads of semiconductor TO-type metal cylindrical shell packaging products, characterized in that: It comprises a truncated cone-shaped leg-branching head (2), a plurality of leg-branching grooves (3) are provided along the slope of the leg-branching head (2), the outer leads of a semiconductor TO-type metal cylindrical shell packaging product are branched along the leg-branching grooves (3), and the inlet and outlet of the leg-branching grooves (3) are respectively arranged on the upper top surface and the lower bottom surface of the leg-branching head (2); The inlet of the leg-branching groove (3) matches the arrangement position of the external leads of the semiconductor TO-type metal cylindrical shell packaging product, the external leads of the semiconductor TO-type metal cylindrical shell packaging product are arranged in a circular array, and the outlet of the leg-branching groove (3) matches the arrangement position of the dual in-line socket jacks.

2. The outer lead leg separation fixture of semiconductor TO-type metal cylindrical shell packaging product according to claim 1 is characterized in that: The number of the leg-branching grooves (3) is the same as the number of external leads of a semiconductor TO-type metal cylindrical shell packaging product.

3. The outer lead leg separation fixture of semiconductor TO-type metal cylindrical shell packaging product according to claim 1 is characterized in that: The semiconductor TO-type metal cylindrical shell packaging product has at least two external leads.

4. The outer lead leg separation jig for semiconductor TO-type metal cylindrical shell packaging products according to claim 1 is characterized in that: The diameter of the upper top surface of the split leg head (2) is smaller than the diameter of the circle where the outer lead of the semiconductor TO-type metal cylindrical shell packaging product is located.

5. The outer lead leg separation jig for semiconductor TO-type metal cylindrical shell packaging products according to claim 1, characterized in that: The diameter of the lower bottom surface of the leg head (2) is greater than the maximum distance between the dual in-line socket holes to be inserted into the external leads of the semiconductor TO-type metal cylindrical shell packaging product.

6. The outer lead leg separation jig for semiconductor TO-type metal cylindrical shell packaging products according to claim 1, characterized in that: A chamfer (4) is provided at the entrance of the leg-dividing groove (3).

7. The outer lead leg separation jig for semiconductor TO-type metal cylindrical shell packaging products according to claim 1, characterized in that: The plurality of leg-dividing grooves (3) are divided into two rows and are symmetrically arranged along the central axis of the leg-dividing head (2).

8. The outer lead leg separation jig for semiconductor TO-type metal cylindrical shell packaging products according to claim 1, characterized in that: The split-leg head (2) is connected to a hand-held rod (1), and the hand-held rod (1) is a long cylindrical rod.

9. The outer lead leg separation jig for semiconductor TO-type metal cylindrical shell packaging products according to claim 1, characterized in that: The leg-branching groove (3) is an inclined U-shaped opening groove.

10. A method for using the outer lead leg separation jig of a semiconductor TO-type metal cylindrical shell packaging product according to any one of claims 1 to 9, characterized in that: The following steps are involved: The outer lead of the semiconductor TO-type metal cylindrical shell package product is inserted through the entrance of the leg splitting groove (3) provided on the leg splitting head (2), and the outer lead of the semiconductor TO-type metal cylindrical shell package product is pulled out in the reverse direction after being pushed along the leg splitting groove (3).

Images