Processing technology of panel module and panel module

Abstract

The invention relates to a processing technology of a panel module and the panel module. The processing technology of the panel module comprises the following steps: acquiring a panel and a protection assembly; the protection assemblies are stacked on the panel, and the peripheral edges of the protection assemblies are flush with the peripheral edges of the panel; bonding glue is poured on the peripheral sides of the panel and the protection assembly, and the bonding glue is cured through a light source. Through the arrangement, the distance between the peripheral side of the protection assembly and the frame can be increased, so that the bonding width of the bonding glue is increased, the strength between the panel module and the frame is improved, the reliability of the whole machine is improved, and the market competitiveness is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of screen panel production, and in particular to a processing technology for a panel module and a panel module. Background Art

[0002] At present, in order to reduce the size of the border of electronic devices, a screen glue filling technology has been proposed, that is, glue is dispensed around the screen, and a narrow border design is achieved by reducing the glue dispensing area of ​​the large screen surface and the thickness gap between the large screen surface and the border. The colloid curing method after dispensing is usually light curing, which also causes the light source to irradiate the GOA (Gate on Array, array substrate row drive) unit of the display panel, which increases the probability of abnormality of the GOA unit, and the screen is prone to abnormal display, increasing the defective rate and increasing manufacturing costs. Summary of the invention

[0003] The present disclosure provides a processing technology for a panel module and a panel module to solve the deficiencies in the related art.

[0004] According to a first aspect of an embodiment of the present disclosure, a processing technology for a panel module is provided, including:

[0005] Obtain panels and protective components;

[0006] Stacking the protection assembly on the panel, and making the edges around the protection assembly and the edges around the panel flush with each other;

[0007] The adhesive is poured around the panel and the protective component, and the adhesive is cured by using a light source.

[0008] Optionally, the acquisition panel and protection component include:

[0009] Obtain the panel and the protective assembly of equal areas.

[0010] Optionally, the acquiring of the panel and the protective assembly having equal areas comprises:

[0011] Through one or more cutting processes, the panel and the protective component with equal areas are obtained.

[0012] Optionally, the acquisition panel and protection component include:

[0013] Acquire the panel and the protective assembly with unequal areas;

[0014] The step of stacking the protective assembly on the panel and making the edges of the protective assembly flush with the edges of the panel comprises:

[0015] The panel and the protection component are cut so that the edges around the protection component and the edges around the panel are flush with each other.

[0016] Optionally, also include:

[0017] Get copper foil;

[0018] The copper foil is stacked on a side of the protection component facing away from the panel, and the copper foil is retracted relative to the surrounding of the protection component;

[0019] The step of pouring the adhesive on the periphery of the panel and the protective component comprises:

[0020] The adhesive is poured around the panel, the protection component and the copper foil.

[0021] Optionally, also include:

[0022] Get the front glass cover;

[0023] The front glass cover is stacked on a side of the panel away from the protective assembly, and the periphery of the front glass cover is protruded relative to the periphery of the panel;

[0024] The step of pouring the adhesive on the periphery of the panel and the protective component comprises:

[0025] The adhesive is poured on the panel, the protective assembly and the side where the front glass cover is connected to the panel.

[0026] According to a second aspect of an embodiment of the present disclosure, a panel module is provided, comprising: a panel, a protective component and an adhesive; the protective component is arranged on one side of the panel, and the four edges of the protective component are flush with the four edges of the panel; the adhesive surrounds the panel and the circumference of the protective component and is respectively bonded to the panel and the protective component.

[0027] Optionally, it also includes copper foil; the copper foil is arranged on the protective component, and the area of ​​the copper foil is smaller than the area of ​​the protective component; the adhesive covers part of the copper foil.

[0028] Optionally, the protective component includes a mesh adhesive layer, a foam layer and a protective layer; the foam layer is located between the mesh adhesive layer and the protective layer; the mesh adhesive layer is connected to the panel, and the copper foil is arranged on the protective layer.

[0029] Optionally, the panel includes a panel body and a substrate; the substrate is located between the panel body and the grid adhesive layer, and an area of ​​the substrate is equal to an area of ​​the panel body.

[0030] Optionally, it also includes a front glass cover plate; the front glass cover plate is arranged on the side of the panel away from the protective component, and the four sides of the front glass cover plate are protruding relative to the four sides of the panel; the adhesive is arranged on the side where the front glass cover plate is connected to the panel.

[0031] It can be seen from the above embodiments that the processing technology of the panel module disclosed in the present invention stacks the protective component on the panel and makes the edges of the protective component and the edges of the panel flush. On the one hand, the protective component completely blocks the panel, thereby reducing the probability of the GOA unit on the panel being damaged by light source irradiation and improving the yield. On the other hand, the protective component is not protruding from the panel, which can provide more glue dispensing space for the adhesive, thereby increasing the bonding width of the adhesive and improving the strength between the panel module and the frame.

[0032] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the specification and, together with the description, serve to explain the principles of the specification.

[0034] Figure 1 The figure is a flow chart of a processing technology of a panel module according to an exemplary embodiment.

[0035] Figure 2 is a schematic diagram of a panel module according to an exemplary embodiment.

[0036] Figure 3 It is a schematic diagram of a panel module before secondary laser cutting according to an exemplary embodiment.

[0037] Figure 4 is another schematic diagram of a panel module before secondary laser cutting according to an exemplary embodiment.

[0038] Figure 5 The figure is a schematic diagram of a panel module before pouring adhesive according to an exemplary embodiment.

[0039] Figure 6 is another flow chart of a processing technology of a panel module according to an exemplary embodiment. DETAILED DESCRIPTION

[0040] Here, the technical solutions in the embodiments (or "implementations") of the present disclosure will be described clearly and completely in conjunction with the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0041] If there are terms involving directional indications or positional relationships in the embodiments of the present disclosure (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings); if the specific posture changes, the directional indication or positional relationship will also change accordingly. In addition, the terms "first", "second", etc. involved in the embodiments of the present disclosure are only used for the purpose of convenience of description and cannot be understood as indicating or implying relative importance.

[0042] like Figure 1 and Figure 2 As shown, the processing technology of the panel module disclosed in the present invention includes the following steps:

[0043] In step 101, a panel 1 and a protective component 2 are obtained.

[0044] In some embodiments, obtaining the panel 1 and the protective component 2 includes: obtaining a panel 1 and a protective component 2 of equal area. In this embodiment, a panel 1 and a protective component 2 of equal area can be obtained through a single laser cutting process, so that the edges of the protective component 2 and the edges of the panel 1 are arranged flush, thereby reducing the laser cutting steps and shortening the overall processing time of the processing technology. The panel 1 and the protective component 2 of equal area in this embodiment are panels 1 and protective components 2 that do not need to be cut and processed again, can actually be used directly, and can be assembled in a qualified manner.

[0045] In some other embodiments, obtaining the panel 1 and the protective component 2 includes: obtaining the panel 1 and the protective component 2 of unequal areas. Stacking the protective component 2 on the panel 1 and making the edges of the protective component 2 flush with the edges of the panel 1 includes: cutting the panel 1 and the protective component 2 so that the edges of the protective component 2 flush with the edges of the panel 1.

[0046] In this embodiment, a laser cutting process is first performed to obtain the panel 1 and the protective component 2. After the protective component 2 is stacked on the panel 1, a secondary laser cutting process is performed to make the edges of the protective component 2 and the edges of the panel 1 flush. Further, after the laser cutting process, the area of ​​the protective component 2 is larger than the area of ​​the panel 1, and the protective component 2 covers the panel 1.

[0047] With such a configuration, when the protective assembly 2 is stacked on the panel 1, it is not necessary to consider whether the edges of the protective assembly 2 and the panel 1 are flush, and it is sufficient to make the protective assembly 2 completely cover the panel 1, thereby improving the installation efficiency. Moreover, after the protective assembly 2 is stacked on the panel 1, the edges of the protective assembly 2 and the edges of the panel 1 will be more flush through laser cutting.

[0048] Of course, in this embodiment, after the first laser cutting process, the area of ​​the panel 1 may be larger than the area of ​​the protective component 2, but the area of ​​the protective component 2 is not less than the area of ​​the panel 1 after the second laser cutting process. In this way, during the second laser cutting, the panel 1 and the protective component 2 are cut, or only the panel 1 needs to be cut.

[0049] Indeed, if Figure 3 As shown, in this embodiment, after one laser cutting process, the area of ​​the panel 1 can also be the same as the area of ​​the protective component 2. In this way, there is no need to program the laser device multiple times, and the panel 1 and the protective component 2 can be cut and processed under the same program of the laser device.

[0050] like Figure 4 As shown, during the secondary laser cutting, in order to ensure the accuracy of the laser cutting, a cutting line can be preset on the protective component 2 (refer to Figure 4 The dotted line shown in FIG. 2 is used to make the laser cut along the cutting line. The second laser cutting is only an exemplary description. Of course, in order to make the edges of the protective component 2 and the edges of the panel 1 flush, three laser cuttings, four laser cuttings, etc. are also possible.

[0051] In some other embodiments, obtaining the panel 1 and the protective component 2 includes: obtaining the panel 1 and the protective component 2 through a primary cutting process. If the areas of the obtained panel 1 and the protective component 2 are not equal, a secondary cutting process is performed to obtain the panel 1 and the protective component 2 of equal areas. Specifically, the secondary cutting process is an improvement on the primary cutting process, and after the panel 1 and the protective component 2 are subjected to the secondary cutting process, the protective component 2 is stacked on the panel 1. Both the primary cutting process and the secondary cutting process are laser cutting processes. In this embodiment, the secondary laser cutting is only an exemplary description. Of course, in order to obtain the panel 1 and the protective component 2 of equal areas, three laser cuttings, four laser cuttings, etc. are all possible.

[0052] In step 102 , the protection component 2 is stacked on the panel 1 , and the edges of the protection component 2 are flush with the edges of the panel 1 .

[0053] In step 103 , adhesive 3 is poured around the panel 1 and the protective component 2 , and the adhesive 3 is cured using a light source.

[0054] The edges of the protective component 2 and the edges of the panel 1 are arranged flush, so that the protective component 2 can cover the panel 1, and when the light source cures the adhesive 3, the protective component 2 can block the light source to prevent the GOA unit on the panel 1 from being damaged by the light source, thereby improving the yield of the panel module and reducing the manufacturing cost. At the same time, the distance between the peripheral side of the protective component 2 and the frame (not shown) can also be increased to increase the bonding width of the adhesive 3, improve the strength between the panel module and the frame, and thus improve the reliability of the whole machine and improve market competitiveness.

[0055] In the present disclosure, in order to improve the flatness of the edges of the panel 1 and the protective component 2, the panel 1 and the protective component 2 can be obtained by a laser cutting process. The type of light source is compatible with the type of adhesive 3, and the adhesive 3 is cured by a UV light source.

[0056] like Figure 5 and Figure 6 As shown, in some embodiments, the processing technology of the panel module may include the following steps:

[0057] In step 601, the panel 1 and the protective component 2 are obtained.

[0058] In this embodiment, the specific implementation method can refer to step 101 in the aforementioned embodiment, which will not be described in detail here.

[0059] In step 602 , the protection component 2 is stacked on the panel 1 , and the edges of the protection component 2 are flush with the edges of the panel 1 .

[0060] In this embodiment, the specific implementation method can refer to step 102 in the aforementioned embodiment, which will not be described in detail here.

[0061] In step 603 , a copper foil 4 is obtained and stacked on a side of the protection component 2 facing away from the panel 1 , and the copper foil 4 is retracted relative to the surroundings of the protection component 2 .

[0062] Specifically, the area of ​​the copper foil 4 is smaller than the area of ​​the protection component 2 to avoid interference between the copper foil 4 and other components, and the adhesive 3 covers the copper foil 4 .

[0063] In step 604 , the front glass cover plate 5 is obtained and stacked on a side of the panel 1 facing away from the protective assembly 2 , with the four sides of the front glass cover plate 5 protruding relative to the four sides of the panel 1 .

[0064] In step 605, adhesive 3 is poured on the panel 1, the protective component 2, the peripheral side of the copper foil 4, and the side where the front glass cover 5 is connected to the panel 1, and the adhesive 3 is cured by using a light source.

[0065] Specifically, the area of ​​the front glass cover plate 5 is larger than that of the panel 1. The adhesive 3 surrounds the panel 1, the protective component 2 and the copper foil 4, and is also bonded to the side where the front glass cover plate 5 is connected to the panel 1. After the front glass cover plate 5 is stacked on the panel 1, the laser performs secondary laser cutting along the cutting line on the protective component 2.

[0066] Based on the technical solution disclosed in this disclosure, Figure 2 As shown, a panel module is also provided, which includes a panel 1, a protective component 2, an adhesive 3, a copper foil 4 and a front glass cover 5. The protective component 2 is arranged on one side of the panel 1, the copper foil 4 is arranged on the side of the protective component 2 away from the panel 1, and the front glass cover 5 is arranged on the side of the panel 1 away from the protective component 2.

[0067] The surrounding edges of the protective component 2 are flush with the surrounding edges of the panel 1 to increase the distance between the surrounding sides of the protective component 2 and the frame, thereby increasing the bonding width of the adhesive 3 and improving the strength between the panel module and the frame, thereby improving the reliability of the entire machine and improving market competitiveness.

[0068] In some embodiments, the panel 1 includes a panel body 11 and a substrate 12. The substrate 12 is located between the panel body 11 and the protective assembly 2, and the area of ​​the substrate 12 is equal to the area of ​​the panel body 11, so that the substrate 12 can support and protect the panel body 11 to prevent damage to the panel body 11. The substrate 12 can be a flexible substrate, a glass substrate, or an array substrate.

[0069] The protective component 2 is used to protect the panel 1 to prevent the copper foil 4 or other hard components from damaging the panel 1. The protective component 2 includes a mesh adhesive layer 21, a foam layer 22, and a protective layer 23. The foam layer 22 is located between the mesh adhesive layer 21 and the protective layer 23. The mesh adhesive layer 21 is connected to the panel 1, and specifically, the mesh adhesive layer 21 is located between the substrate 12 and the foam layer 22.

[0070] The adhesive 3 surrounds the panel 1 and the protective component 2 and is bonded to the panel 1 and the protective component 2 respectively. The adhesive 3 extends to the copper foil 4 and covers a portion of the copper foil 4. At the same time, the adhesive 3 is also bonded to the side where the front glass cover 5 is connected to the panel 1 to increase the overall strength of the panel module.

[0071] The copper foil 4 is disposed on the protective layer 23, and the area of ​​the copper foil 4 is smaller than the area of ​​the protective component 2 to avoid interference between the copper foil 4 and other components. The panel module includes an adhesive layer 6, and the front glass cover plate 5 is connected to the panel body 11 through the adhesive layer 6. The periphery of the front glass cover plate 5 is protruding relative to the periphery of the panel 1.

[0072] It should be noted that the technical solutions or technical features described in the above embodiments can be combined or supplemented with each other without causing conflicts. The scope of protection of this disclosure is not limited to the precise structures described in the above embodiments and shown in the drawings; any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of this disclosure shall be included in the scope of protection of this disclosure.

Claims

1. A processing technology for a panel module, characterized in that: include: Obtaining a panel (1) and a protective component (2); The protective component (2) is stacked on the panel (1), and the edges of the protective component (2) are arranged flush with the edges of the panel (1); Adhesive glue (3) is poured around the panel (1) and the protective component (2), and the adhesive glue (3) is cured using a light source.

2. The processing technology of the panel module according to claim 1, characterized in that: The acquisition panel (1) and the protection component (2) include: Obtain the panel (1) and the protective component (2) of equal area.

3. The processing technology of the panel module according to claim 2, characterized in that: The panel (1) and the protection component (2) having equal acquisition areas include: Through one or more cutting processes, the panel (1) and the protective component (2) of equal area are obtained.

4. The processing technology of the panel module according to claim 1, characterized in that: The acquisition panel (1) and the protection component (2) include: Obtaining the panel (1) and the protective component (2) of unequal areas; The step of stacking the protective component (2) on the panel (1) and making the edges of the protective component (2) and the edges of the panel (1) flush with each other comprises: The panel (1) and the protective component (2) are cut so that the four edges of the protective component (2) and the four edges of the panel (1) are arranged flush.

5. The processing technology of the panel module according to claim 1, characterized in that: Also includes: Obtain copper foil (4); The copper foil (4) is stacked on a side of the protective component (2) facing away from the panel (1), and the copper foil (4) is retracted relative to the surrounding of the protective component (2); The step of pouring the adhesive (3) around the panel (1) and the protective component (2) comprises: The adhesive (3) is poured around the panel (1), the protective component (2) and the copper foil (4).

6. The processing technology of the panel module according to claim 1, characterized in that: Also includes: Obtain the front glass cover (5); The front glass cover plate (5) is stacked on a side of the panel (1) facing away from the protective assembly (2), and the periphery of the front glass cover plate (5) is arranged to protrude relative to the periphery of the panel (1); The step of pouring the adhesive (3) around the panel (1) and the protective component (2) comprises: The adhesive (3) is poured on the side where the panel (1), the protective assembly (2) and the front glass cover (5) are connected to the panel (1).

7. A panel module, characterized in that: include: A panel (1), a protective component (2) and an adhesive (3); the protective component (2) is arranged on one side of the panel (1), and the edges of the protective component (2) are arranged flush with the edges of the panel (1); the adhesive (3) surrounds the circumference of the panel (1) and the protective component (2) and is bonded to the panel (1) and the protective component (2) respectively.

8. The panel module according to claim 7, characterized in that: It also comprises a copper foil (4); the copper foil (4) is arranged on the protection component (2), and the area of ​​the copper foil (4) is smaller than the area of ​​the protection component (2); the adhesive (3) covers part of the copper foil (4).

9. The panel module according to claim 8, characterized in that: The protective component (2) comprises a mesh adhesive layer (21), a foam layer (22) and a protective layer (23); the foam layer (22) is located between the mesh adhesive layer (21) and the protective layer (23); the mesh adhesive layer (21) is connected to the panel (1), and the copper foil (4) is arranged on the protective layer (23).

10. The panel module according to claim 9, characterized in that: The panel (1) comprises a panel body (11) and a substrate (12); the substrate (12) is located between the panel body (11) and the grid adhesive layer (21), and the area of ​​the substrate (12) is equal to the area of ​​the panel body (11).

11. The panel module according to claim 7, characterized in that: It also comprises a front glass cover plate (5); the front glass cover plate (5) is arranged on a side of the panel (1) facing away from the protective component (2), and the four sides of the front glass cover plate (5) are protruding relative to the four sides of the panel (1); the adhesive (3) is adhered to the side of the front glass cover plate (5) connected to the panel (1).

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