Aliphatic polyamide composition and corresponding mobile electronic device component

Abstract

Described herein are aliphatic polyamide compositions comprising an aliphatic polyamide, glass fibers, and optionally one or more additives. It has been surprisingly found that aliphatic polyamide compositions containing specially selected glass fibers have similar dielectric properties as well as significantly improved mechanical properties relative to corresponding aliphatic polyamide compositions containing low dielectric glass fibers. Aliphatic polyamide compositions may advantageously be included in mobile electronic device components due, at least in part, to high dielectric properties (low permittivity) and significantly improved mechanical properties.

Description

[0001] This application is a divisional application of the invention patent application with the application date of April 9, 2018, application number 201880019479.X, and invention name “Aliphatic polyamide composition and corresponding mobile electronic device components”.

[0002] CROSS-REFERENCE TO RELATED APPLICATIONS

[0003] This application claims priority to U.S. Provisional Patent Application No. 62 / 483733, filed on April 10, 2017, and European Patent Application No. 17175633.1, filed on June 13, 2017, the entire contents of each of which are incorporated herein by reference for all purposes. Technical Field

[0004] The present invention relates to aliphatic polyamide compositions providing high dielectric properties and high mechanical properties. The present invention further relates to mobile electronic device components comprising the aliphatic polyamide composition. Background Art

[0005] Polymer compositions are widely used in mobile electronic device components due to their reduced weight and high mechanical properties. In particular, aliphatic polyamide polymer compositions containing glass fibers are particularly suitable for mobile electronic device applications. Because such compositions can have appropriate mechanical strength, reduced weight and more design options, they are attractive as metal replacements in mobile electronic device components. Summary of the invention

[0006] Aliphatic polyamide compositions comprising aliphatic polyamide, glass fibers, and optionally one or more additives are described herein. Surprisingly, it has been found that aliphatic polyamide compositions containing specially selected glass fibers have similar dielectric properties and significantly improved mechanical properties relative to corresponding aliphatic polyamide compositions containing low dielectric glass fibers. Due at least in part to high dielectric properties (low dielectric constant) and significantly improved mechanical properties, aliphatic polyamide compositions can be advantageously included in mobile electronic device components. The unique mechanical properties and dielectric properties of the aliphatic polyamide compositions described herein can be advantageously included in mobile electronic device components.

[0007] The dielectric constant of a polymer composition is important for determining the suitability of a material in an application environment where radio communications are present. For example, in a mobile electronic device, the dielectric constant of the materials forming the various components and housings may significantly reduce the radio signals (e.g., 1 MHz, 2.4 GHz, and 5.0 GHz frequencies) transmitted and received by the mobile electronic device through one or more antennas. The dielectric constant of a material represents, in part, the ability of the material to interact with electromagnetic radiation and, accordingly, to destroy electromagnetic signals (e.g., radio signals) passing through the material. Therefore, the lower the dielectric constant of a material at a given frequency, the less the material destroys electromagnetic signals at that frequency.

[0008] Traditionally, the aliphatic polyamide composition in the application environment of wishing low wireless signal loss comprises low dielectric glass fiber.Usually, standard glass fiber is included in aliphatic polyamide composition to increase the mechanical property of aliphatic polyamide composition, otherwise it will be unsuitable for application environment, including but not limited to mobile electronic device.However, although standard modulus glass fiber has relatively high tensile modulus (E is from 70GPa to 80GPa) and therefore gives excellent mechanical properties of aliphatic polyamide composition, dielectric constant is also relatively high (ε (1MHz) is from 6.0 to 7.0), therefore gives relatively high dielectric constant of polyamide composition.As used herein, E is tensile modulus and ε (ω) is the dielectric constant under frequency ω.Therefore, gained polyamide composition absorbs a large amount of energy from radio signal.The conventional method for solving the problem of poor dielectric property in glass-filled polyamide composition comprises that low dielectric constant glass fiber (ε (1MHz) is from 4.5 to 5.0) is included in composition. However, while such solutions improve the dielectric properties, the mechanical properties of the polymer composition suffer significantly, at least in part due to the relatively low tensile modulus (E is from 60 GPa to 65 GPa) of the low dielectric glass fibers.

[0009] Applicants have surprisingly found that aliphatic polyamide compositions comprising glass fibers having a dielectric constant of from 5.2 to 5.4 and a tensile modulus of from 75 GPa to 100 GPa at 1 MHz ("selected glass fibers") have dielectric properties substantially similar to the dielectric properties of corresponding aliphatic polyamide compositions comprising low dielectric glass fibers and mechanical properties greater than corresponding aliphatic polyamide compositions comprising low dielectric glass fibers or standard modulus glass fibers at the same time. For clarity, the difference between aliphatic polyamide compositions comprising selected glass fibers and corresponding aliphatic polyamide compositions comprising low dielectric glass fibers is that the corresponding aliphatic polyamide compositions comprise low dielectric glass fibers in place of the selected glass fibers. Similarly, the difference between aliphatic polyamide compositions comprising selected glass fibers and corresponding aliphatic polyamide compositions comprising standard modulus glass fibers is that the corresponding aliphatic polyamide compositions comprise standard modulus glass fibers in place of the selected glass fibers. Furthermore, the aliphatic polyamide composition comprising the selected glass fiber has dielectric properties substantially similar to the dielectric properties of the corresponding aliphatic polyamide composition when the difference in ε(1 MHz) between the aliphatic polyamide composition and the corresponding aliphatic composition is no more than 4%, no more than 3.5%, no more than 3%, no more than or less than 1% relative to the corresponding aliphatic composition.

[0010] In addition, because the aliphatic polyamide composition comprising the selected glass fibers has significantly improved mechanical properties relative to a corresponding aliphatic polyamide composition having low dielectric glass fibers, the aliphatic polyamide composition can contain less of the selected glass fibers relative to a corresponding aliphatic polyamide composition comprising a higher concentration of low dielectric glass fibers and still have significantly improved mechanical properties as well as improved dielectric properties (lower ε(1 MHz)). In addition, the reduced amount of the selected glass fibers can provide significant cost savings, especially when the aliphatic polyamide composition is produced on a commercial or industrial scale.

[0011] Aliphatic polyamide

[0012] The aliphatic polyamide composition comprises an aliphatic polyamide polymer. As used herein, the aliphatic polyamide polymer has at least 50 mol % of a repeating unit (R) relative to the total moles of repeating units in the aliphatic polyamide. PA In some embodiments, the aliphatic polyamide has at least 60 mol%, at least 70 mol%, at least 80 mol%, at least 90 mol%, at least 95 mol%, at least 99 mol%, or at least 99.9 mol% of the repeating units (R PA ). Repeating unit (R PA ) is represented by the following formula -[-Ma-Mb-]-:

[0013]

[0014] Where R 1 and R 2 is independently selected at each occurrence from the group consisting of alkyl, alkenyl, alkynyl, aryl, ether, thioether, carboxylic acid, ester, amide, imide, alkali metal or alkaline earth metal sulfonate, alkyl sulfonate, alkali metal or alkaline earth metal phosphonate, alkyl phosphonate, amine and quaternary ammonium; i and j are independently selected at each occurrence from 0 to 2 integers; n is an integer from 4 to 12, from 4 to 10 or from 6 to 10; and m is an integer from 6 to 18, or from 6 to 14 or from 6 to 12. For clarity, in formula (1), each -(CR 1 i )- and each-(CR 2 j )- have 2-i and 2-j hydrogen atoms bonded thereto, respectively. For example, in one embodiment, if for n units -(CR 1 i )-one of which i=1, then-(CR 1 i ) n By -(CHR 1 )-(CR 1 i ) n-1 - indicates. Similar symbols are used with other chemical structures herein. In addition, as used herein, a dotted bond (----) indicates a bond to a repeating unit (R PA ) is a bond to an atom of another repeating unit that is the same or different. In some embodiments, each i is zero, each j is zero, or each i and each j are zero. Additionally or alternatively, n can be 6 and m can be 10 or n can be 10 and m can be 10. In some embodiments, the aliphatic polyamide is polyamide 6,10 ("PA6,10") or polyamide 10,10 ("PA10,10").

[0015] The aliphatic polyamide polymer may have an intrinsic viscosity of from 0.7 deciliters per gram ("dL / g") to 1.4 dL / g.

[0016] Polyamide composition

[0017] The aliphatic polyamide composition comprises an aliphatic polyamide polymer, glass fibers and, optionally, one or more additives. It has been unexpectedly discovered that the polyamide composition comprising selected glass fibers has substantially similar dielectric properties and simultaneously improved mechanical properties relative to a corresponding aliphatic polymer composition comprising low dielectric constant glass fibers.

[0018] In some embodiments, the aliphatic polyamide composition comprises a variety of different aliphatic polyamide polymers, wherein each aliphatic polyamide polymer has the characteristics as described above. In some embodiments, each polymer in the aliphatic polyamide composition is an aliphatic polyamide polymer. Whether the aliphatic polyamide composition comprises one or more aliphatic polyamides, in some embodiments, the total concentration of the aliphatic polyamide polymer in the aliphatic polyamide composition is from 40wt.% to 70wt.%, 50wt.% to 60wt.%, or 55wt.% to 65wt.% relative to the gross weight of the aliphatic polyamide composition.

[0019] In certain embodiments, aliphatic polyamide composition does not contain aromatic polymer and alicyclic polymer.As used herein, aromatic polymer contains at least 5mol%, at least 10mol%, at least 15mol% or at least 20mol% of the repeating unit with aromatic part relative to the total number of repeating units in the polymer.Similarly, as used herein, alicyclic polymer contains at least 10mol%, at least 15mol% or at least 20mol% of the repeating unit with alicyclic part relative to the total number of repeating units in the polymer.Usually, due to the conjugated electronic structure in the repeating unit aromatic polymer, the polymer has the dielectric properties (higher dielectric constant) of reduction relative to aliphatic polyamide polymer.About alicyclic polyamide, usually such material is amorphous, and accordingly, relative to the aliphatic polyamide represented by Formula 1, resulting in lower mechanical properties. An aliphatic polyamide composition free of aromatic and alicyclic polymers refers to an aliphatic polyamide composition containing aromatic polymers and alicyclic polymers in a total concentration of less than 15 wt.%, less than 10 wt.%, less than 5 wt.%, less than 2 wt.%, less than 1 wt.% or less than 0.5 wt.%, relative to the total weight of the aliphatic polyamide composition.

[0020] The aliphatic polyamide composition contains the glass fiber with the tensile modulus of at least 75GPa, at least 80GPa or at least 85GPa. In addition, the glass fiber has the tensile modulus of no more than 100GPa or no more than 95GPa. In addition, the aliphatic polyamide composition contains the glass fiber with the dielectric constant of 5.1 to 5.5 or from 5.2 to 5.4 under the frequency from 1MHz to 10GHz or under the frequency of 1MHz, 2.4MHz or 5GHz. The tensile modulus of glass fiber can be measured according to ASTM D2343. The dielectric constant of glass fiber can be measured according to ASTM D150 (1.0MHz) and ASTM D2520 (2.4GHz).

[0021] The concentration of the glass fiber in the aliphatic polymer composition is at least 30wt.%, at least 35wt.%, or at least 40wt.% relative to the total weight of the aliphatic polymer composition. In addition, the concentration of the glass fiber in the aliphatic polymer composition is no more than 60wt.%, no more than 55wt.%, no more than 50wt.%, or no more than 45wt.% relative to the total weight of the aliphatic polymer composition. In some embodiments, the glass fiber is a round glass fiber. The round glass fiber has a round cross section. Typically, the average diameter of the glass fiber is from 3 microns ("μm") to 30μm or from 5μm to 12μm.

[0022] The aliphatic polyamide composition optionally comprises one or more additives. The one or more additives include UV absorbers; mineral fillers, including but not limited to talc, mica, wollastonite and kaolin; light stabilizers and heat stabilizers; antioxidants; lubricants; processing aids; plasticizers; flow modifiers; flame retardants; pigments, dyes and colorants, including but not limited to TiO2, carbon black, zinc sulfide, barium sulfate, zinc oxide and iron oxide; antistatic agents; extenders; and metal deactivators. When present in the aliphatic polymer composition, the total concentration of one or more additives is less than 10wt.%, less than 5wt.% or less than 2wt.% relative to the total weight of the aliphatic polyamide composition. In some embodiments, the total concentration of the pigment, dye or colorant is from 0.5wt.% or from 1wt.% to 5wt.%.

[0023] Aliphatic polyamide composition can have the dielectric constant less than 4.0, less than 3.9, less than 3.8, less than 3.75, less than 3.7 or less than 3.6 at 1MHz.Additionally or alternatively, aliphatic polyamide composition can have the dielectric constant less than 3.8, less than 3.75, less than 3.7, less than 3.65, less than 3.6, less than 3.55, less than 3.5 or less than 3.45 at 2.4GHz.Additionally or alternatively, aliphatic polyamide composition can have the tensile modulus of at least 10GPa, at least 11GPa, at least 12GPa, at least 13GPa, at least 14GPa, at least 15GPa, at least 16GPa, at least 17GPa, at least 18GPa, at least 19GPa or at least 20GPa.The dielectric constant and tensile modulus of aliphatic polyamide composition can be measured as described in the examples.

[0024] Mobile electronic device components

[0025] The aliphatic polyamide compositions described herein can advantageously be included in mobile electronic device components. As used herein, "mobile electronic device" refers to an electronic device intended to be conveniently transported and used in different locations. Mobile electronic devices can include, but are not limited to, mobile phones, personal digital assistants ("PDAs"), notebook computers, tablet computers, wearable computing devices (e.g., smart watches, smart glasses, etc.), cameras, portable audio players, portable radios, global positioning system receivers, and portable game consoles.

[0026] The mobile electronic device of interest herein contains at least one radio antenna configured to transmit or receive radio signals. For transmitting radio signals, the mobile electronic device converts data into radio signals and transmits the radio signals through the antenna. For receiving radio signals, the mobile electronic device receives the radio signals through the antenna and decodes the radio signals into data. In one embodiment, the radio antenna is a WiFi antenna. In some embodiments, the WiFi antenna transmits or receives radio signals with a frequency of 2.4 GHz or 5.0 GHz. In other embodiments, the radio antenna may be a radio frequency identification ("RFID") antenna, including but not limited to a near field communication ("NFC") antenna. In some embodiments, the RFID antenna transmits or receives radio signals with a frequency of from 125 kHz to 134 kHz, 13.56 MHz, or from 856 MHz to 960 MHz.

[0027] In some embodiments, at least a portion of the mobile electronic device may be exposed to the external environment of the mobile electronic device (e.g., at least a portion of the component is in contact with the environment external to the mobile electronic device). For example, at least a portion of the device component may form at least a portion of an external housing of the mobile electronic device. In some such embodiments, the device component may be all or part of a "frame" surrounding the periphery of the mobile electronic device, a beam in the form of a grid, or a combination thereof. As another example, at least a portion of the device component may form at least a portion of an input device. In some such embodiments, a button of the electronic device may include a device component. In some embodiments, the device component may be completely enclosed by the electronic device (e.g., the device component is not visible from a point of view external to the mobile electronic device).

[0028] In some embodiments, the mobile electronic device component is an antenna housing. In some such embodiments, at least a portion of the radio antenna is arranged on the aliphatic polyamide composition. Additionally or alternatively, at least a portion of the radio antenna can be offset from the aliphatic polyamide composition by no more than 50cm, no more than 30cm, no more than 15cm, no more than 10cm, no more than 5cm, no more than 1cm, no more than 10mm, no more than 5mm, no more than 1mm or no more than 0.5mm. In some embodiments, the device component can be a mounting component with a mounting hole or other fastening devices, and the other fastening devices include but are not limited to a snap-fit ​​connector between itself and another component of the mobile electronic device, and the other component includes but is not limited to a circuit board, a microphone, a speaker, a display, a battery, a cover, a housing, an electrical or electronic connector, a hinge, a radio antenna, a switch or a switch pad (switchpad). In some embodiments, the mobile electronic device can be at least a portion of an input device.

[0029] The device components of the mobile electronic device can be manufactured using methods well known in the art. For example, the mobile electronic device components can be manufactured by methods including but not limited to injection molding, blow molding or extrusion molding. In some embodiments, the polyamide composition can be formed into pellets (e.g., having a substantially cylindrical body between the two ends) by methods known in the art (including but not limited to injection molding). In some such embodiments, the mobile electronic device components can be manufactured from pellets.

[0030] In some embodiments, the mobile electronic device components can be coated with metal by methods well known in the art, including but not limited to vacuum deposition (including various methods of heating the metal to be deposited), chemical plating, electroplating, chemical vapor deposition, metal sputtering, and electron beam deposition. Although metals can adhere well to device components without any special treatment, in some embodiments, methods well known in the art can be used to improve adhesion. Such methods include but are not limited to: abrasion to roughen the surface of the synthetic resin, adding adhesion promoters, chemical etching, surface functionalization by exposure to plasma and / or radiation (such as laser or UV radiation), or any combination of these. In addition, in some embodiments, the metal coating method may include at least one step in which the mobile electronic device component is immersed in an acid bath. More than one metal or metal alloy can be plated onto the device component containing the polyamide composition. For example, one metal or alloy can be plated directly onto the synthetic resin surface due to its good adhesion, and another metal or alloy can be plated on top of the previous coating because it has higher strength and / or rigidity. Useful coating metals and alloys include but are not limited to copper, nickel, iron-nickel, cobalt, cobalt-nickel, and chromium, as well as combinations of these in different layers. In some embodiments, the surface of the mobile electronic device component can be completely or partially coated with metal. In some embodiments, more than about 50% or about 100% of the surface area of ​​the device component can be metal-coated. The thickness and / or amount of the metal layer, and / or the composition of the metal layer can vary in different areas of the device component. The metal can be applied in a pattern to effectively improve one or more properties in certain sections of the mobile electronic device component.

[0031] Should the disclosure of any patents, patent applications, and publications incorporated by reference into this application conflict with the description of this application to the extent that it renders a term unclear, this description shall take precedence.

[0032] Examples

[0033] These examples demonstrate the dielectric and mechanical properties of glass-filled polyamide compositions.

[0034] In order to prove the dielectric properties and mechanical properties, 13 samples were formed. Samples 6, 11 and 13 are counterexamples. In order to form each sample, PA6, 10 was mixed with short chopped round glass fibers using twin screw extrusion. Some samples also included 5wt.% zinc sulfide as a colorant. The properties of the glass fibers used are shown in Table 1. Glass fibers I-III are selected glass fibers, glass fibers IV are low dielectric glass fibers and glass fibers V are standard glass fibers. The tensile modulus of glass fibers is measured according to ASTM D2343. The dielectric constant of glass fibers is measured according to ASTM D150 (1.0MHz) and ASTM D2520 (2.4Ghz).

[0035] Table 1

[0036] Fiberglass ("GF") Type ε(1MHz) E(GPa) I 5.3 86 II 5.3 86 III 5.3 87 IV 4.5 60 V 6.0-7.0 70-80

[0037] By measuring the dielectric properties of ε (1.0MHz) or ε (2.4GHz) test samples respectively according to ASTM D150 and ASTM D2520. The measurement of ε (1.0MHz) is carried out on an injection molded disc with a size of 2 inches in diameter times 1 / 8 inch thickness. The measurement of ε (2.4GHz) is carried out on an injection molded plate with a size of 2 inches times 3 inches times 1 / 8 inch. The mechanical properties of the sample are tested as follows. Tensile modulus, tensile strength, and tensile elongation are tested according to ISO 527-2 using 1mm / min test speed and injection molded ISO tensile bars. Impact strength is measured using notched Izod and unnotched Izod impact tests using injection molded ISO tensile bars according to ISO 180.

[0038] The sample parameters and the results of the dielectric and mechanical properties tests for each sample are shown in Tables 2 and 3 below (Samples 6, 11 and 13 represent counterexamples). In Tables 2 and 3, the dissipation factor reflects the energy irreversibly lost at a given radio frequency.

[0039] Table 2

[0040]

[0041] Table 3

[0042]

[0043] Referring to Table 3, the sample containing GF II has substantially similar dielectric properties to the sample containing GF IV, and significantly improved mechanical properties relative to both the samples containing GF IV and GF V. In addition, the sample containing GF II maintains substantially similar dielectric properties to the sample containing GF IV, but has improved tensile modulus, tensile strength, tensile elongation, and impact properties relative to the sample containing GF V. For example, the difference between the dielectric constants of Sample 12 and Sample 11 at 1 GHz is 0.0447 W / cm2 relative to Sample 11 (100*(ε 12 (1MHz)-ε 11 (1MHz)) / ε 11 (1 MHz)) is 1.4%. In addition, the relative difference between the dielectric constants of sample 12 and sample 13 at 1 GHz is relative to that of sample 13 (100*(ε 12 (1MHz)-ε 13 (1MHz)) / ε 13 (1MHz)) is -8.8%, demonstrating significantly improved (lower dielectric constant) dielectric performance. As used herein, ε s (ω) is the dielectric constant of sample S at frequency ω. Regarding mechanical properties, the relative increase in tensile modulus of sample 12 (GF II) is 27% and 11% relative to sample 11 (GF IV) and sample 13 (GF V), respectively. Similarly, the relative increase in tensile strength of sample 12 is 17% and 24% relative to sample 11 and sample 13, respectively.

[0044] Referring to Table 2, samples containing GF I to III have significantly improved mechanical properties relative to samples containing GF IV, while having substantially similar or improved dielectric properties. For example, the relative increase in tensile modulus of samples 3 to 5 (GF I to III) relative to sample 6 (GF IV) is from 4.0% to 9.5%. Similarly, the relative increase in tensile strength of samples 3 to 5 relative to sample 6 is from 7.8% to 18%. In addition, relative to sample 6, the relative difference in dielectric constant at 1 MHz between samples 3 to 5 and sample 6 is from -1.4% to 3%, wherein sample 5 has improved dielectric properties. Similarly, relative to sample 6, the relative difference in dielectric constant at 2.4 GHz between samples 3 to 5 and sample 6 is from 0.29% to 4.4%.

Claims

1. An aliphatic polyamide composition comprising: Aliphatic polyamide polymers and From about 30 wt.% to about 60 wt.% of glass fibers relative to the total weight of the polyamide composition, The glass fiber includes: a dielectric constant at 1 MHz of from 5.1 to 5.5, preferably from 5.2 to 5.4, and Tensile modulus from 75 GPa to 100 GPa.

2. The aliphatic polyamide composition according to claim 1, comprising from 35 wt.% to 45 wt.%, preferably 40 wt.% to 45 wt.% of the glass fibers.

3. The aliphatic polyamide composition according to claim 1 or claim 2, wherein: The glass fiber has a tensile modulus of from 80 GPa to 95 GPa, preferably from 85 GPa to 95 GPa.

4. The aliphatic polyamide composition according to any one of claims 1 to 3, wherein The aliphatic polymer composition has a dielectric constant at 1 MHz of less than 4.0, preferably less than 3.9, more preferably less than 3.8, more preferably less than 3.75, more preferably less than 3.7, and most preferably less than 3.

6.

5. The aliphatic polyamide composition according to any one of claims 1 to 4, wherein The aliphatic polymer composition has a dielectric constant at 2.4 GHz of less than 3.8, preferably less than 3.75, more preferably less than 3.7, more preferably less than 3.65, more preferably less than 3.6, more preferably less than 3.55, more preferably less than 3.5, and most preferably less than 3.

45.

6. The aliphatic polyamide composition according to any one of claims 1 to 5, wherein The aliphatic polyamide composition has a tensile modulus of at least 10 GPa, preferably at least 11 GPa, most preferably at least 13 GPa.

7. The aliphatic polyamide composition according to any one of claims 1 to 6, further comprising from 0.5 wt.% to 5 wt.% of a pigment, dye or colorant selected from the group consisting of: TiO2, carbon black, zinc sulfide, barium sulfate, zinc oxide, iron oxide, and any combination of one or more thereof.

8. The aliphatic polyamide composition of any one of claims 1 to 7, comprising from 40 wt.% to 70 wt.%, preferably 50 wt.% to 60 wt.%, most preferably 55 wt.% to 65 wt.% of the aliphatic polyamide.

9. The aliphatic polyamide composition according to any one of claims 1 to 8, wherein Each polymer in the aliphatic polyamide composition is a different aliphatic polyamide polymer.

10. The aliphatic polyamide composition according to any one of claims 1 to 9, wherein The aliphatic polyamide composition is free of aromatic polymers and free of cycloaliphatic polymers.

11. The aliphatic polyamide composition according to any one of claims 1 to 10, wherein The aliphatic polyamide composition has an intrinsic viscosity of 0.7 dL / g to 1.4 dL / g.

12. A mobile electronic device component comprising a radio antenna and the aliphatic polyamide composition according to any one of claims 1 to 11.

13. The mobile electronic device component of claim 12, wherein: The radio antenna is a WiFi antenna or an RFID antenna.

14. A mobile electronic device component as claimed in claim 12 or 13, wherein: The mobile electronic device component is an antenna housing.

15. The mobile electronic device according to any one of claims 12 to 13, wherein: The mobile electronic device is selected from the group consisting of a mobile phone, a personal digital assistant, a laptop computer, a tablet computer, a wearable computing device, a camera, a portable audio player, a portable radio, a global positioning system receiver, and a portable game console.

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