TPU modified epoxy resin hot melt adhesive and preparation method thereof
Through the preparation method of TPU modified epoxy resin, the problem of long curing time and inconvenient operation of epoxy resin adhesive is solved, and the convenient process and high-performance bonding effect of hot melt adhesive are achieved.
Patent Information
- Application Number
- CN202510053860.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-14
- Publication Date
- 2025-05-02
AI Technical Summary
Commonly used epoxy resin adhesives have a long curing time and are viscous in liquids, which limits their application convenience and performance in the field of hot melt adhesives.
TPU modified epoxy resin is used to prepare TPU modified epoxy resin hot melt adhesive particles by mixing solid epoxy resin, TPU elastomer, tackifying resin and antioxidant in a specific proportion, and fully mixing in a high-speed mixer, and extruding, water-cooling, pulling strips and pelletizing through a twin-screw granulator.
It improves the process convenience of epoxy resin in the field of hot melt adhesives, improves the brittleness of hot melt adhesives, and improves its body strength and bonding ability.
Abstract
Description
Technical Field
[0001] The invention relates to a hot melt adhesive, in particular to a TPU modified epoxy resin hot melt adhesive and a preparation method thereof. Background Art
[0002] Epoxy resin has excellent physical and mechanical properties, electrical insulation properties and bonding properties. Commonly used epoxy resin is usually in a viscous liquid state, so it can be made into coatings, composite materials, casting materials, adhesives, molding materials and injection molding materials, and is widely used as a structural adhesive material.
[0003] As a structural adhesive, epoxy resin has poor adhesion to non-polar plastics such as polyolefins, but has excellent adhesion to various metal materials such as aluminum, iron, copper; non-metallic materials such as glass, wood, concrete, etc.; and thermosetting plastics such as phenolic, amino, unsaturated polyester, etc., so it is known as a universal adhesive.
[0004] However, the above-mentioned epoxy adhesives often require a long curing time, and the viscosity of the liquid makes certain process operations very inconvenient, which limits their use in the field of hot melt adhesives.
[0005] Therefore, it is urgent to propose a TPU modified epoxy resin hot melt adhesive and a preparation method to solve the above technical problems. Summary of the invention
[0006] The purpose of the present invention is to solve the problems of long curing time and inconvenient operation of viscous liquid formed by conventional technologies. A brief summary of the present invention is given below to provide a basic understanding of certain aspects of the present invention. It should be understood that this summary is not an exhaustive summary of the present invention. It is not intended to determine the key or important parts of the present invention, nor is it intended to limit the scope of the present invention.
[0007] The technical solution of the present invention:
[0008] A TPU modified epoxy resin hot melt adhesive, wherein the TPU modified epoxy resin hot melt adhesive is composed of solid epoxy resin, TPU elastomer, tackifying resin and antioxidant;
[0009] The mass fraction of the epoxy resin is 45-60 parts, the mass fraction of the TPU elastomer is 20-25 parts, the mass fraction of the tackifying resin is 20-30 parts, and the mass fraction of the antioxidant is 0.1-0.3 parts.
[0010] Preferably, the product model of the solid epoxy resin is one or more of E20, E12 and E10.
[0011] Preferably, the TPU elastomer product model is one or more of TPU3055D, TPU9380A, TPUS90A, TPU72D, TPU909U, and TPUAS120H.
[0012] Preferably, the tackifying resin is one or more of rosin resin, rosin glycerol ester, rosin pentaerythritol ester, terpene phenolic resin, phenolic epoxy resin, and phenolic modified rosin resin.
[0013] Preferably, the antioxidant is one or more of β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate 1076, 2,6-di-tert-butyl-p-cresol, tris[2,4-di-tert-butylphenyl]phosphite 168, and 1,3,5-tris(4-tert-butyl-3-hydroxy-2,6-dimethylbenzyl)-1,3,5-triazine-2,4,6-(1H,3H,5H)-trione 1790.
[0014] A method for preparing a TPU modified epoxy resin hot melt adhesive comprises the following steps:
[0015] Step 1: Place solid epoxy resin, TPU elastomer, tackifying resin and antioxidant in a high-speed mixer and mix them thoroughly at high speed;
[0016] Step 2: After mixing evenly, place it in a twin-screw granulator for extrusion, and obtain TPU modified epoxy resin hot melt adhesive particles through water cooling, strip drawing and pelletizing.
[0017] The present invention has the following beneficial effects:
[0018] The present invention utilizes TPU modified epoxy resin to improve the process convenience of epoxy resin application in the field of hot melt adhesives;
[0019] The present invention utilizes the high toughness of the TPU material to improve the brittleness of the epoxy hot melt adhesive, thereby increasing the bulk strength of the hot melt adhesive. DETAILED DESCRIPTION
[0020] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention is described below by specific embodiments. However, it should be understood that these descriptions are only exemplary and are not intended to limit the scope of the present invention. In addition, in the following description, the description of well-known structures and technologies is omitted to avoid unnecessary confusion of the concept of the present invention.
[0021] Specific implementation method 1: A TPU modified epoxy resin hot melt adhesive in this implementation method, wherein the TPU modified epoxy resin hot melt adhesive is composed of solid epoxy resin, TPU elastomer, tackifying resin, and antioxidant;
[0022] The mass fraction of the epoxy resin is 45 to 60 parts, the mass fraction of the TPU elastomer is 20 to 25 parts, the mass fraction of the tackifying resin is 20 to 30 parts, and the mass fraction of the antioxidant is 0.1 to 0.3 parts. This TPU modified epoxy resin hot melt adhesive combines the hardness of the epoxy resin with the elasticity of TPU, has excellent mechanical properties and bonding ability, and is an adhesive material with comprehensive performance and wide application.
[0023] Specific implementation method 2: In this implementation method, a TPU modified epoxy resin hot melt adhesive is used, and the product model of the solid epoxy resin is one or more of E20, E12, and E10.
[0024] The epoxy value of E20 is 0.20 mol / 100 g, the epoxy value of E12 is 0.12 mol / 100 g, and the epoxy value of E10 is 0.10 mol / 100 g.
[0025] E20 epoxy resin: provides high mechanical strength and heat resistance, making the hot melt adhesive have high strength and rigidity;
[0026] E12 epoxy resin: Fast curing and moderate mechanical properties;
[0027] E10 epoxy resin: Its low viscosity and fast curing characteristics can provide excellent initial adhesion in fast production lines;
[0028] By adjusting the ratio of different models, these properties can be balanced to meet specific application needs.
[0029] Specific implementation method three: This implementation method is a TPU modified epoxy resin hot melt adhesive, and the TPU elastomer product model is one or more of TPU3055D, TPU9380A, TPUS90A, TPU72D, TPU909U, and TPUAS120H.
[0030] In the formulation of TPU modified epoxy resin hot melt adhesive, selecting different types of TPU elastomers can significantly change the performance characteristics of the hot melt adhesive, such as flexibility, strength, transparency, wear resistance and chemical resistance; through reasonable proportioning and selection, the physical properties and processing characteristics of the hot melt adhesive can be optimized according to specific application requirements, achieving more efficient and precise production and application.
[0031] Specific implementation method 4: In this implementation method, a TPU modified epoxy resin hot melt adhesive is used, wherein the tackifying resin is one or more of rosin resin, rosin glycerol ester, rosin pentaerythritol ester, terpene phenolic resin, phenolic epoxy resin, and phenolic modified rosin resin.
[0032] The type of tackifying resin directly affects the adhesion, fluidity, thermal stability and chemical resistance of the hot melt adhesive. By rationally selecting different types of tackifying resins, the performance of the hot melt adhesive can be optimized for different application needs to meet specific industrial application requirements.
[0033] Specific embodiment five: A TPU modified epoxy resin hot melt adhesive in this embodiment, the antioxidant is one or more of β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate 1076, 2,6-di-tert-butyl-p-cresol, tris[2.4-di-tert-butylphenyl] phosphite 168, and 1,3,5-tris(4-tert-butyl-3-hydroxy-2,6-dimethylbenzyl)-1,3,5-triazine-2,4,6-(1H,3H,5H)-trione 1790. According to the specific application requirements of the hot melt adhesive, one or more antioxidants can be selected for use in combination to optimize the antioxidant properties of the product and ensure its stability and durability in long-term use.
[0034] Specific implementation method 6: A method for preparing a TPU modified epoxy resin hot melt adhesive in this implementation method comprises the following steps:
[0035] Step 1: Place solid epoxy resin, TPU elastomer, tackifying resin and antioxidant in a high-speed mixer and mix them thoroughly at high speed;
[0036] Step 2: After mixing evenly, place it in a twin-screw granulator for extrusion, and obtain TPU modified epoxy resin hot melt adhesive particles through water cooling, strip drawing and pelletizing.
[0037] During the mixing process, a high shear mixer can be used with a mixing temperature range of 120°C to 180°C and a mixing time of 15 to 30 minutes to improve the mixing efficiency, ensure good dispersion of TPU and epoxy resin, and reduce the inhomogeneity of the materials in the formula;
[0038] The water cooling temperature is generally maintained between 20°C and 40°C to ensure rapid and uniform cooling of the pellets and avoid possible quality problems;
[0039] The thickness of the rubber strip after drawing is generally between 1 mm and 5 mm, and the width is generally between 10 mm and 50 mm. In actual production, the control of thickness and width needs to be adjusted according to the specific material characteristics, production process and pelletizing requirements to ensure that the rubber strip is uniform and stable, and can smoothly enter the subsequent pelletizing and processing steps;
[0040] There are two cutting methods: hot cutting and cold cutting, and the general cutting range is 1-10 mm;
[0041] Example 1
[0042] A method for preparing a TPU modified epoxy resin hot melt adhesive, characterized in that it comprises the following steps:
[0043] Step 1: Weigh 60 parts of solid epoxy resin E20, 10 parts of TPU3055D, 10 parts of TPUAS120H, 10 parts of rosin glycerol ester, 10 parts of phenolic epoxy resin and 0.3 parts of β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate 1076 respectively and place them in a high-speed mixer and mix them thoroughly;
[0044] Step 2: After mixing evenly, place it in a twin-screw granulator for extrusion, and obtain TPU modified epoxy resin hot melt adhesive particles through water cooling, strip drawing and pelletizing.
[0045] Example 2
[0046] A method for preparing a TPU modified epoxy resin hot melt adhesive, characterized in that it comprises the following steps:
[0047] Step 1: Weigh 25 parts of solid epoxy resin E20, 35 parts of solid epoxy resin E12, 10 parts of TPU9380A, 5 parts of TPU909U, 12 parts of rosin glycerol ester, 13 parts of phenolic epoxy resin, 0.1 parts of β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate 1076 and 0.2 parts of 2,6-di-tert-butyl-p-cresol in a high-speed mixer and mix them thoroughly at high speed;
[0048] Step 2: After mixing evenly, place it in a twin-screw granulator for extrusion, and obtain TPU modified epoxy resin hot melt adhesive particles through water cooling, strip drawing and pelletizing.
[0049] Example 3
[0050] A method for preparing a TPU modified epoxy resin hot melt adhesive, characterized in that it comprises the following steps:
[0051] Step 1: Weigh 10 parts of solid epoxy resin E12, 43 parts of solid epoxy resin E10, 5 parts of TPUS90A, 8 parts of TPU72D, 12 parts of rosin resin, 14 parts of terpene phenolic resin, 13 parts of phenolic epoxy resin, 0.2 parts of tris[2.4-di-tert-butylphenyl]phosphite 168 and 0.1 parts of 1,3,5-tris(4-tert-butyl-3-hydroxy-2,6-dimethylbenzyl)-1,3,5-triazine-2,4,6-(1H,3H,5H)-trione 1790 respectively and place them in a high-speed mixer and mix them thoroughly;
[0052] Step 2: After mixing evenly, place it in a twin-screw granulator for extrusion, and obtain TPU modified epoxy resin hot melt adhesive particles through water cooling, strip drawing and pelletizing.
[0053] Example 4
[0054] A method for preparing a TPU modified epoxy resin hot melt adhesive, characterized in that it comprises the following steps:
[0055] Step 1: Weigh 5 parts of solid epoxy resin E20, 22 parts of solid epoxy resin E12, 26 parts of solid epoxy E10, 8 parts of TPU9380A, 7 parts of TPUS90A, 10 parts of TPUAS120H, 6 parts of rosin resin, 6 parts of rosin pentaerythritol ester, 10 parts of phenolic epoxy resin, 0.2 parts of tris[2.4-di-tert-butylphenyl]phosphite 168 and 0.1 parts of 1,3,5-tris(4-tert-butyl-3-hydroxy-2,6-dimethylbenzyl)-1,3,5-triazine-2,4,6-(1H,3H,5H)-trione 1790 respectively and place them in a high-speed mixer and mix them thoroughly;
[0056] Step 2: After mixing evenly, place it in a twin-screw granulator for extrusion, and obtain TPU modified epoxy resin hot melt adhesive particles through water cooling, strip drawing and pelletizing.
[0057] Example 5
[0058] A method for preparing a TPU modified epoxy resin hot melt adhesive, characterized in that it comprises the following steps:
[0059] Step 1: Weigh 45 parts of solid epoxy resin E12, 25 parts of TPU72D, 15 parts of rosin resin, 15 parts of phenolic epoxy resin, 0.15 parts of tris[2.4-di-tert-butylphenyl]phosphite 168 and 0.15 parts of β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate 1076 respectively and place them in a high-speed mixer and mix them thoroughly;
[0060] Step 2: After mixing evenly, place it in a twin-screw granulator for extrusion, and obtain TPU modified epoxy resin hot melt adhesive particles through water cooling, strip drawing and pelletizing.
[0061] Example 6
[0062] A method for preparing a TPU modified epoxy resin hot melt adhesive, characterized in that it comprises the following steps:
[0063] Step 1: Weigh 16 parts of solid epoxy resin E20, 22 parts of solid epoxy resin E12, 12 parts of solid epoxy E10, 16 parts of TPU72D, 14 parts of TPUS90A, 6 parts of rosin resin, 6 parts of rosin pentaerythritol ester, 8 parts of phenolic epoxy resin, 0.1 part of tris[2.4-di-tert-butylphenyl]phosphite 168, 0.1 part of 1,3,5-tris(4-tert-butyl-3-hydroxy-2,6-dimethylbenzyl)-1,3,5-triazine-2,4,6-(1H,3H,5H)-trione 1790 and 0.1 part of 2,6-di-tert-butyl-p-cresol respectively, and place them in a high-speed mixer and mix them thoroughly;
[0064] Step 2: After mixing evenly, place it in a twin-screw granulator for extrusion, and obtain TPU modified epoxy resin hot melt adhesive particles through water cooling, strip drawing and pelletizing.
[0065] It should be noted that in the above embodiments, as long as the technical solutions are not contradictory, they can be arranged and combined, and those skilled in the art can exhaust all possibilities based on the mathematical knowledge of arrangement and combination. Therefore, the present invention will no longer describe the technical solutions after arrangement and combination one by one, but it should be understood that the technical solutions after arrangement and combination have been disclosed by the present invention.
[0066] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims
1. A TPU modified epoxy resin hot melt adhesive, characterized in that: The TPU modified epoxy resin hot melt adhesive is composed of solid epoxy resin, TPU elastomer, tackifying resin and antioxidant; The mass fraction of the epoxy resin is 45-60 parts, the mass fraction of the TPU elastomer is 20-25 parts, the mass fraction of the tackifying resin is 20-30 parts, and the mass fraction of the antioxidant is 0.1-0.3 parts.
2. A TPU modified epoxy resin hot melt adhesive according to claim 1, characterized in that: The product model of the solid epoxy resin is one or more of E20, E12 and E10.
3. A TPU modified epoxy resin hot melt adhesive according to claim 1, characterized in that: The TPU elastomer product model is one or more of TPU3055D, TPU9380A, TPUS90A, TPU72D, TPU909U, and TPUAS120H.
4. A TPU modified epoxy resin hot melt adhesive according to claim 1, characterized in that: The tackifying resin is one or more of rosin resin, rosin glycerol ester, rosin pentaerythritol ester, terpene phenolic resin, phenolic epoxy resin, and phenolic modified rosin resin.
5. The TPU modified epoxy resin hot melt adhesive according to claim 1, characterized in that: The antioxidant is one or more of β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate 1076, 2,6-di-tert-butyl-p-cresol, tris[2,4-di-tert-butylphenyl]phosphite 168, and 1,3,5-tris(4-tert-butyl-3-hydroxy-2,6-dimethylbenzyl)-1,3,5-triazine-2,4,6-(1H,3H,5H)-trione 1790.
6. A method for preparing a TPU modified epoxy resin hot melt adhesive, characterized in that: The steps include: Step 1: Place solid epoxy resin, TPU elastomer, tackifying resin and antioxidant in a high-speed mixer and mix them thoroughly at high speed; Step 2: After mixing evenly, place it in a twin-screw granulator for extrusion, and obtain TPU modified epoxy resin hot melt adhesive particles through water cooling, strip drawing and pelletizing.