A semiconductor test package sealing detection device

By using liquid suction and air pressure balance in the detection mechanism in the negative pressure box, the problem of inaccurate detection of small gaps in the packaging bags in the prior art is solved, and efficient and accurate seal detection of packaging bags is achieved.

CN119915441BActive Publication Date: 2025-07-08SUZHOU OUYIMU SEMICON EQUIP TECH CO LTD
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Patent Information

Application Number
CN202510362374.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-03-26
Publication Date
2025-07-08
Estimated Expiration
2045-03-26

AI Technical Summary

Technical Problem

In the prior art, the tiny gaps in the packaging bag cannot be accurately detected, resulting in errors in the detection results and it is impossible to determine whether the product packaging is damaged.

Method used

The detection mechanism in the negative pressure box is adopted to detect the damage of the packaging through the sliding cross plate and liquid storage assembly by using the suction of liquid and the balance of gas under the negative pressure state, and combined with air pressure recovery and liquid recycling, the sealing detection of the packaging is achieved.

Benefits of technology

It can accurately detect tiny damage to the packaging, improve the accuracy and efficiency of inspection, and achieve efficient sealing detection of packaging bags.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention relates to the field of packaging bag sealing detection, and discloses a semiconductor test packaging sealing detection device, which includes a negative pressure box and a detection mechanism arranged in the negative pressure box. The detection mechanism includes a sliding cross plate arranged in the negative pressure box, a liquid storage assembly is arranged above the sliding cross plate, and a telescopic electric cylinder is arranged above the sliding cross plate. By placing the packages in the placement grooves respectively, the air pump extracts the air in the negative pressure box through the connecting pipeline. If there is no breakage in the packaging of the semiconductor product, there will be a malfunction in the packaging. When there is a breakage in the packaging of the semiconductor product, the packaging without breakage bulges more than the damaged one, and even there may be no bulging situation. When the valve between the liquid storage shell and the liquid storage tank is opened and the liquid enters the placement groove and the liquid storage tank, since the pressure outside the packaging is lower than the internal pressure, if the packaging is damaged, the liquid will be sucked into the interior of the packaging, and there will be a phenomenon of bubbles because the external low pressure tries to balance the higher internal pressure.
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Description

Technical Field

[0001] The present invention relates to the technical field of packaging bag sealing detection, and specifically relates to a semiconductor test package sealing detection device. Background Art

[0002] In the patent application with the publication number CN222144420U, it includes a detection box. A hinge is fixedly arranged on the front side of the detection box. A box cover is hingedly arranged on the surface of the detection box through the hinge. An auxiliary support assembly is arranged at the bottom of the box cover. An installation frame is lapped on the top of the box cover. The installation frame is connected to the box cover through bolts. An installation plate is fixedly arranged inside the installation frame. Through the settings of the box cover, the installation frame, the installation plate, the lower fixed magnet, the upper fixed magnet, the movable plate and the vacuum pumping assembly, it is convenient to detect the sealing performance of multiple packaging bags at the same time, avoiding the reduction of the packaging bag detection speed caused by detecting the sealing performance of only one packaging bag at a time, thus accelerating the detection speed of the packaging bags. And by clamping the side edges of the packaging bag with the lower fixed magnet and the upper fixed magnet, it avoids the detection result error caused by the obstruction on the surface of the packaging bag.

[0003] In the above-mentioned patent, if there are tiny gaps in the packaging, there will still be a situation where it cannot be detected, and it is impossible to accurately detect whether there are damages in the product packaging. Summary of the Invention

[0004] The purpose of the present invention is to provide a semiconductor test package sealing detection device to solve the problems put forward in the above background art.

[0005] To solve the above technical problems, the technical solution of the present invention is: a semiconductor test package sealing detection device, including a negative pressure box and a detection mechanism arranged inside the negative pressure box. The detection mechanism includes a sliding cross plate arranged inside the negative pressure box. A liquid storage assembly is arranged above the sliding cross plate. A telescopic electric cylinder for driving the sliding cross plate to move up and down inside the negative pressure box is arranged above the sliding cross plate.

[0006] The liquid storage assembly includes six liquid storage shells fixedly arranged above the sliding cross plate. A connecting cross pipe is fixedly arranged between every two adjacent liquid storage shells. A connecting hose is fixedly arranged on the outside of one of the connecting cross pipes. Air holes are opened above the plurality of liquid storage shells.

[0007] Above the sliding cross plate, a plurality of exhaust pipes are fixedly arranged. Two sliding circular grooves are formed on the sliding cross plate. Two vertical rods are slidably connected inside the sliding circular grooves. The lower ends of the vertical rods are fixedly connected to the lower part inside the negative pressure box. A plurality of liquid storage grooves are formed below the sliding cross plate. The position of each liquid storage groove corresponds to the position of the liquid storage shell. A rubber pad is fixedly arranged outside the liquid storage groove. One side inside the liquid storage groove is fixedly connected with a fixed shell. An intercepting wire is arranged on one side of the fixed shell. One end of the intercepting wire is fixedly connected to the side of the liquid storage groove far from the fixed shell inside the liquid storage groove;

[0008] A plurality of placement grooves are formed in the lower part inside the negative pressure box. The positions of the placement grooves correspond to the positions of the liquid storage grooves.

[0009] Preferably, a wire winding rod and a sensor are arranged inside the fixed shell. One end of the intercepting wire is fixedly arranged on the wire winding rod inside the fixed shell. A torsion spring is arranged between the wire winding rod and the fixed shell.

[0010] Preferably, the liquid storage shell is communicated with the liquid storage groove. A water stop valve is arranged at the communication part between the liquid storage shell and the liquid storage groove. The exhaust pipe is communicated with the inside of the liquid storage groove.

[0011] Preferably, a rotating door is rotatably arranged on one side of the negative pressure box. A plurality of legs are fixedly connected below the negative pressure box. An air pump is fixedly arranged on one side above the negative pressure box. A reflux assembly is arranged on one side of the negative pressure box.

[0012] Preferably, an observation glass is fixedly arranged on the rotating door. A connecting pipe is fixedly arranged on one side of the air pump. The other end of the connecting pipe is fixedly connected to the negative pressure box. The connecting pipe is connected to the inside of the negative pressure box in a penetrating manner.

[0013] Preferably, the reflux assembly includes a water pump fixedly connected to one side of the negative pressure box. A connecting elbow is fixedly connected to one side of the water pump. The other end of the connecting elbow is fixedly connected above the negative pressure box. The connecting elbow penetrates the negative pressure box and is communicated with a connecting hose. Another connecting vertical pipe is fixedly connected to the other side of the water pump. A valve is arranged inside the connecting vertical pipe. One end of the connecting vertical pipe is fixedly connected to a U-shaped pipe. A plurality of connecting short pipes are arranged on the U-shaped pipe. The U-shaped pipe is fixedly connected to the negative pressure box through a plurality of connecting short pipes. The U-shaped pipe is located directly below the negative pressure box.

[0014] Preferably, a liquid discharge groove is formed in the lower part inside the placement groove. A convex block is fixedly arranged outside the liquid discharge groove. The liquid discharge groove is connected to the U-shaped pipe in a penetrating manner through a connecting short pipe.

[0015] Preferably, a pressure gauge for detecting the air pressure inside the negative pressure box is further arranged above the negative pressure box. A pressure relief assembly for pressure relief is arranged on the negative pressure box. A threaded groove is arranged on the negative pressure box.

[0016] Preferably, the pressure relief component includes a threaded rod threadedly connected to the threaded groove on the negative pressure box. The upper end of the threaded rod is fixedly connected with a handle. An air vent groove is opened inside the threaded rod, and air vent holes are opened on the outer side of the threaded rod. The air vent holes are connected to the air vent groove in a through manner.

[0017] Compared with the prior art, the technical solution of the present invention has the following advantages:

[0018] (1) A placement groove and a sliding cross plate are provided in the negative pressure box. By placing the packages in the placement groove respectively, the telescopic electric cylinder drives the sliding cross plate to move downward, so that the packages are located in the placement groove and the liquid storage tank. At this time, the intercepting line is located above the packages. Close the rotating door, and the air pump extracts the air in the negative pressure box through the connecting pipe, making the negative pressure box in a negative pressure state. If the package of the semiconductor product is not damaged, the package will malfunction. When the package of the semiconductor product is damaged, the package without damage bulges more than the damaged one, or even does not bulge. The valve between the liquid storage shell and the liquid storage tank is opened, and the liquid enters the placement groove and the liquid storage tank. Since the pressure outside the package is lower than the internal pressure, if the package is damaged, the liquid will be sucked into the package, and bubbles will appear because the external low pressure tries to balance the higher internal pressure.

[0019] (2) Rotate the handle to drive the threaded rod to rise. After the air vent holes are exposed from the threaded groove on the negative pressure box, the air flow enters the air vent groove through the air vent holes, and the air pressure in the negative pressure box returns to normal. The air pressure in the placement groove and the liquid storage tank also returns to normal, and the packages will slowly return to their original state. The packages without damage will not show any abnormality. For the packages with minor damage, at this time, because the external pressure is higher than the internal pressure of the package, the air flow will backflow, bringing in some liquid. After detection, observing whether there is liquid in the package can determine whether the package is damaged, and even minor damage can be detected. After the detection is completed, the valve is opened, and the water pump extracts the liquid in the placement groove and the liquid storage tank through the connecting vertical pipe and the U-shaped pipe, so that the liquid enters the connecting hose through the connecting elbow pipe, and then is injected into the connecting cross pipe from the connecting hose, and the connecting cross pipe injects the replenishing liquid into multiple liquid storage shells to achieve the recycling of the liquid. Description of the Drawings

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 It is a schematic diagram of the structure of the negative pressure box of the present invention;

[0022] Figure 3 It is a schematic diagram of the structure of the pressure gauge of the present invention;

[0023] Figure 4 It is a schematic diagram of the structure of the reflux component of the present invention;

[0024] Figure 5 Schematic diagram of the planar structure of the reflux component of the present invention;

[0025] Figure 6 Schematic diagram of the structure of the placement groove of the present invention;

[0026] Figure 7 Schematic diagram of the pressure relief component structure of the present invention;

[0027] Figure 8 Schematic diagram of the structure of the detection mechanism of the present invention;

[0028] Figure 9 Schematic diagram of the structure of the liquid storage component of the present invention;

[0029] Figure 10 Schematic diagram of the structure of the sliding cross plate of the present invention;

[0030] Figure 11 Schematic diagram of the flipping structure of the sliding cross plate of the present invention.

[0031] In the figure: 1, negative pressure box; 11, rotating door; 111, observation glass; 12, support leg; 13, air pump; 131, connecting pipe; 14, reflux component; 141, water pump; 142, connecting elbow; 143, connecting vertical pipe; 144, U-shaped pipe; 145, valve; 15, pressure gauge; 16, pressure relief component; 161, threaded rod; 162, handle; 163, ventilation groove; 164, ventilation hole; 17, placement groove; 171, liquid discharge groove; 172, convex block; 2, detection mechanism; 21, sliding cross plate; 211, exhaust pipe; 212, sliding circular groove; 213, vertical rod; 214, rubber pad; 215, liquid storage tank; 216, fixed shell; 217, interception line; 22, liquid storage component; 221, liquid storage shell; 222, connecting cross pipe; 223, connecting hose; 224, air hole; 23, telescopic electric cylinder. Detailed implementation manners

[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present disclosure without creative efforts shall fall within the scope of protection of the present disclosure.

[0033] Unless otherwise defined, technical terms or scientific terms used in this disclosure shall have the ordinary meanings as understood by those of ordinary skill in the field to which this disclosure pertains. The words such as "including" or "comprising" used in this disclosure mean that the elements or objects appearing before this word cover the elements or objects listed after this word and their equivalents, without excluding other elements or objects. The words such as "connected" or "coupled" are not limited to physical or mechanical connections, and may also include electrical connections, whether direct or indirect. The terms such as "upper", "lower", "left", and "right" are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0034] As Figures 1 to 11 shown, a semiconductor test package sealing detection device provided by the present invention includes a negative pressure box 1 and a detection mechanism 2 disposed inside the negative pressure box 1. The detection mechanism 2 includes a sliding cross plate 21 disposed inside the negative pressure box 1. Above the sliding cross plate 21, a liquid storage assembly 22 is provided. Above the sliding cross plate 21, a telescopic electric cylinder 23 is provided for moving the sliding cross plate 21 up and down inside the negative pressure box 1. The sliding cross plate 21 is entirely made of transparent acrylic plate material;

[0035] The liquid storage assembly 22 includes six liquid storage shells 221 fixedly provided above the sliding cross plate 21. The liquid storage shells 221 are filled with a liquid, which can be pure water or insulating coolant, etc. Between every two adjacent liquid storage shells 221, a connecting cross tube 222 is fixedly provided. Outside one of the connecting cross tubes 222, a connecting hose 223 is fixedly provided. Above the plurality of liquid storage shells 221, air holes 224 are provided;

[0036] Above the sliding cross plate 21, a plurality of exhaust pipes 211 are fixedly provided. The exhaust pipes 211 are used to discharge the gas below the sliding cross plate 21, so that the pressure above the sliding cross plate 21 is the same as the pressure below. On the sliding cross plate 21, two sliding circular grooves 212 are provided. Inside the sliding circular grooves 212, two vertical rods 213 are slidably connected. The lower ends of the vertical rods 213 are fixedly connected to the lower part inside the negative pressure box 1. Below the sliding cross plate 21, a plurality of liquid storage grooves 215 are provided, and the position of each liquid storage groove 215 corresponds to the position of the liquid storage shell 221. Outside the liquid storage grooves 215, rubber pads 214 are fixedly provided. Inside one side of the liquid storage grooves 215, a fixed shell 216 is fixedly connected. On one side of the fixed shell 216, an intercepting line 217 is provided. One end of the intercepting line 217 is fixedly connected to the side of the liquid storage groove 215 away from the fixed shell 216;

[0037] Below the negative pressure box 1, a plurality of placement grooves 17 are provided inside, and the positions of the placement grooves 17 correspond to the positions of the liquid storage grooves 215.

[0038] Inside the fixed housing 216, a winding rod and a sensor are provided. The sensor is used to detect the number of turns of the winding rod and upload it to the terminal. One end of the intercepting wire 217 is fixedly arranged on the winding rod inside the fixed housing 216, and a torsion spring is arranged between the winding rod and the fixed housing 216.

[0039] The liquid storage housing 221 is communicated with the liquid storage tank 215. A water stop valve is arranged at the communication part between the liquid storage housing 221 and the liquid storage tank 215. The exhaust pipe 211 is communicated with the inside of the liquid storage tank 215.

[0040] On one side of the negative pressure box 1, a rotating door 11 is rotatably arranged. A plurality of legs 12 are fixedly connected below the negative pressure box 1. On one side above the negative pressure box 1, an air pump 13 is fixedly arranged. On one side of the negative pressure box 1, a reflux assembly 14 is arranged.

[0041] An observation glass 111 is fixedly arranged on the rotating door 11. Observation glasses 111 are fixedly arranged on the other side of the negative pressure box 1. On one side of the air pump 13, a connecting pipe 131 is fixedly arranged. The other end of the connecting pipe 131 is fixedly connected with the negative pressure box 1, and the connecting pipe 131 is connected to the inside of the negative pressure box 1 in a penetrating manner.

[0042] The reflux assembly 14 includes a water pump 141 fixedly connected to one side of the negative pressure box 1. On one side of the water pump 141, a connecting elbow 142 is fixedly connected. The other end of the connecting elbow 142 is fixedly connected above the negative pressure box 1. The connecting elbow 142 penetrates the negative pressure box 1 and is communicated with a connecting hose 223. On the other side of the water pump 141, a connecting vertical pipe 143 is fixedly connected. A valve 145 is arranged inside the connecting vertical pipe 143. One end of the connecting vertical pipe 143 is fixedly connected with a U-shaped pipe 144. A plurality of connecting short pipes are arranged on the U-shaped pipe 144. The U-shaped pipe 144 is fixedly connected to the negative pressure box 1 through a plurality of connecting short pipes, and the U-shaped pipe 144 is located directly below the negative pressure box 1.

[0043] Below the inside of the placement groove 17, a liquid discharge groove 171 is opened. An external convex block 172 is fixedly arranged on the outside of the liquid discharge groove 171. The liquid discharge groove 171 is connected to the U-shaped pipe 144 in a penetrating manner through a connecting short pipe.

[0044] Above the negative pressure box 1, a pressure gauge 15 for detecting the air pressure inside the negative pressure box 1 is further arranged. A pressure relief assembly 16 for pressure relief is arranged on the negative pressure box 1. A threaded groove is arranged on the negative pressure box 1, and the threaded groove penetrates the negative pressure box 1.

[0045] The pressure relief assembly 16 includes a threaded rod 161 threadedly connected to the threaded groove on the negative pressure box 1. The upper end of the threaded rod 161 is fixedly connected with a handle 162. An air vent groove 163 is opened inside the threaded rod 161. An air vent hole 164 is opened on the outside of the threaded rod 161, and the air vent hole 164 is communicated with the air vent groove 163.

[0046] Working principle of the present invention: When detecting the packaged semiconductor products, the packages are respectively placed in the placing grooves 17. At this time, the output end of the telescopic electric cylinder 23 moves downward, and the output end of the telescopic electric cylinder 23 drives the sliding cross plate 21 to move downward. The sliding cross plate 21 drives the liquid storage tank 215 to contact the lower part inside the negative pressure box 1, so that the package is located in the placing groove 17 and the liquid storage tank 215. At this time, the intercepting line 217 is located above the package. The rotating door 11 is closed, and the air pump 13 starts to work. The air in the negative pressure box 1 is extracted through the connecting pipe 131, so that the inside of the negative pressure box 1 is in a negative pressure state. The pressure gauge 15 is observed. When the negative pressure is appropriate, the air pump 13 is stopped;

[0047] When the air pump 13 extracts the air in the negative pressure box 1, the air in the placing groove 17 and the liquid storage tank 215 is discharged from the exhaust pipe 211, so that the inside of the liquid storage tank 215 and the placing groove 17 is also in a negative pressure state. If the package of the semiconductor product is not damaged, there will be a malfunction in the package. When the package of the semiconductor product is damaged, the package will not bulge as much as the undamaged package, or even will not bulge. The valve between the liquid storage shell 221 and the liquid storage tank 215 is opened, and the liquid in the liquid storage shell 221 flows into the inside of the liquid storage tank 215, and the liquid does not fill the placing groove 17 and the liquid storage tank 215 completely, and there is still part of the package leaking. When the liquid enters the placing groove 17 and the liquid storage tank 215, due to the pressure outside the package being lower than the pressure inside, and the package is damaged, the liquid will be sucked into the inside of the package, and there will be a phenomenon of bubbles. The bubbles can be observed through the observation glass 111 and the sliding cross plate 21. Because the external low pressure tries to balance the higher pressure inside, then the handle 162 is rotated, so that the handle 162 drives the threaded rod 161 to rise. After the ventilation hole 164 is exposed from the threaded groove on the negative pressure box 1, the air flow enters the ventilation groove 163 through the ventilation hole 164, and then enters the inside of the negative pressure box 1. At this time, the air pressure in the negative pressure box 1 returns to normal, and the air pressure in the placing groove 17 and the liquid storage tank 215 also returns to normal. The package will slowly return to its original state. The undamaged package will not be abnormal. For the package with a small damage, at this time, because the external pressure is higher than the pressure inside the package, the air flow will backflow and bring in some liquid. After the detection, by observing whether there is liquid in the package, it can be known whether the package is damaged. Even a small damage can be detected;

[0048] After the detection is completed, the valve 145 is opened, and the water pump 141 extracts the liquid in the placing groove 17 and the liquid storage tank 215 through the connecting vertical pipe 143 and the U-shaped pipe 144, so that the liquid enters the connecting hose 223 from the connecting elbow 142, and then is injected into the connecting cross pipe 222 from the connecting hose 223, and the liquid is injected into the multiple liquid storage shells 221 from the connecting cross pipe 222 for liquid replenishment.

[0049] The above embodiments are only exemplary embodiments of the present invention and are not used to limit the present invention. The protection scope of the present invention is defined by the claims. Those skilled in the art can make various modifications or equivalent replacements to the present invention within the essence and protection scope of the present invention, and such modifications or equivalent replacements should also be regarded as falling within the protection scope of the present invention.

Claims

1. A semiconductor test package sealing detection device, comprising a negative pressure box (1) and a detection mechanism (2) arranged inside the negative pressure box (1), characterized in that: The detection mechanism (2) includes a sliding cross plate (21) arranged inside the negative pressure box (1). Above the sliding cross plate (21), there is a liquid storage component (22), and above the sliding cross plate (21), there is a telescopic electric cylinder (23) for moving the sliding cross plate (21) up and down inside the negative pressure box (1). The liquid storage component (22) includes six liquid storage shells (221) fixedly arranged above the sliding cross plate (21). A connecting cross pipe (222) is fixedly arranged between every two adjacent liquid storage shells (221). A connecting hose (223) is fixedly arranged on the outside of one of the connecting cross pipes (222). A plurality of air holes (224) are opened above the liquid storage shells (221). A plurality of exhaust pipes (211) are fixedly arranged above the sliding cross plate (21). Two sliding circular grooves (212) are opened on the sliding cross plate (21). Two vertical rods (213) are slidably connected inside the sliding circular grooves (212). The lower ends of the vertical rods (213) are fixedly connected to the lower part inside the negative pressure box (1). A plurality of liquid storage grooves (215) are opened below the sliding cross plate (21). The position of each liquid storage groove (215) corresponds to the position of the liquid storage shell (221). A rubber pad (214) is fixedly arranged on the outside of the liquid storage groove (215). One side inside the liquid storage groove (215) is fixedly connected to a fixed shell (216). A blocking wire (217) is arranged on one side of the fixed shell (216). One end of the blocking wire (217) is fixedly connected to the side inside the liquid storage groove (215) far from the fixed shell (216). A plurality of placement grooves (17) are opened below the inside of the negative pressure box (1). The positions of the placement grooves (17) correspond to the positions of the liquid storage grooves (215).

2. The semiconductor test package sealing detection device according to claim 1, characterized in that: A wire winding rod and a sensor are arranged inside the fixed shell (216). One end of the blocking wire (217) is fixedly arranged on the wire winding rod inside the fixed shell (216). A torsion spring is arranged between the wire winding rod and the fixed shell (216).

3. The semiconductor test package sealing detection device according to claim 2, wherein: The liquid storage shell (221) is communicated with the liquid storage groove (215). A water stop valve is arranged at the communication part between the liquid storage shell (221) and the liquid storage groove (215). The exhaust pipe (211) is communicated with the inside of the liquid storage groove (215).

4. A semiconductor test package sealing detection device according to claim 3, characterized in that: A rotating door (11) is rotatably arranged on one side of the negative pressure box (1). A plurality of legs (12) are fixedly connected below the negative pressure box (1). An air pump (13) is fixedly arranged on one side above the negative pressure box (1). A reflux component (14) is arranged on one side of the negative pressure box (1).

5. The semiconductor test package sealing detection device according to claim 4, wherein: An observation glass (111) is fixedly arranged on the rotating door (11). A connecting pipe (131) is fixedly arranged on one side of the air pump (13). The other end of the connecting pipe (131) is fixedly connected to the negative pressure box (1). The connecting pipe (131) is connected to the inside of the negative pressure box (1) in a penetrating manner.

6. The semiconductor test package sealing detection device according to claim 5, characterized in that: The reflux assembly (14) includes a water pump (141) fixedly connected to one side of the negative pressure tank (1). One side of the water pump (141) is fixedly connected with a connecting elbow pipe (142). The other end of the connecting elbow pipe (142) is fixedly connected above the negative pressure tank (1). The connecting elbow pipe (142) penetrates through the negative pressure tank (1) and is communicated with a connecting hose (223). The other side of the water pump (141) is fixedly connected with a connecting vertical pipe (143). A valve (145) is arranged inside the connecting vertical pipe (143). One end of the connecting vertical pipe (143) is fixedly connected with a U-shaped pipe (144). A plurality of connecting short pipes are arranged on the U-shaped pipe (144). The U-shaped pipe (144) is fixedly connected with the negative pressure tank (1) through a plurality of connecting short pipes. The U-shaped pipe (144) is located directly below the negative pressure tank (1).

7. A semiconductor test package sealing detection device according to claim 1, characterized in that: A liquid discharge groove (171) is formed in the lower part inside the placement groove (17). A convex block (172) is fixedly arranged on the outside of the liquid discharge groove (171). The liquid discharge groove (171) is connected to the U-shaped pipe (144) through a connecting short pipe in a penetrating manner.

8. A semiconductor test package sealing detection device according to claim 7, characterized in that: A pressure gauge (15) for detecting the air pressure inside the negative pressure tank (1) is further arranged above the negative pressure tank (1). A pressure relief assembly (16) for relieving pressure is arranged on the negative pressure tank (1). Threaded grooves are arranged on the negative pressure tank (1).

9. The semiconductor test package sealing detection device according to claim 8, characterized in that: The pressure relief assembly (16) includes a threaded rod (161) threadedly connected to the threaded groove on the negative pressure tank (1). A handle (162) is fixedly connected to the upper end of the threaded rod (161). A ventilation groove (163) is formed inside the threaded rod (161). Ventilation holes (164) are formed on the outside of the threaded rod (161). The ventilation holes (164) are communicated with the ventilation groove (163).

Citation Information

Patent Citations

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    CN222144420U

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