Aging equipment testing device, and testing method and testing system thereof

Abstract

The invention provides an aging equipment testing device, a testing method thereof and a testing system. The aging equipment testing device is used for detecting an IO interface of aging equipment. The aging equipment testing device comprises a plurality of IO testing modules, and each IO testing module comprises a calculation module and a sending module. The calculation module obtains a first test signal output by the aging equipment through the IO channel, and calculates the delay of obtaining the first test signal; and if the delay difference of the first test signal obtained by the plurality of calculation modules through the plurality of IO channels is greater than or equal to a preset delay difference, performing delay compensation on at least part of the IO channels. And the calculation module obtains a second test signal output by the aging equipment through the IO channel, and performs data comparison on the second test signal and a preset signal so as to confirm whether a downlink in the IO channel is qualified or not. And the sending module sends a third test signal to the aging equipment through the IO channel after delay compensation is carried out on at least part of the IO channel so as to confirm whether the uplink in the IO channel is qualified or not.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to an aging equipment testing device and a testing method and a testing system thereof. Background Art

[0002] As the scale of chips continues to expand, the modules integrated in the chips become more numerous and more complex. In order to ensure the delivery quality of chips, existing technologies use aging equipment with the function of screening out early failed chips to perform aging tests on chips. The principle of aging equipment is to simulate the long-term use of the chip to be tested, accelerate the aging of the chip by artificially creating high temperature, constant current, constant voltage and other environments, to screen good chips, and obtain data such as the life, safety, and ability to resist harsh environments of the chip to be tested.

[0003] After long-term use, the performance and reliability of the aging equipment will decline. For example, the delay consistency of multiple input / output (IO) channels connecting the aging equipment and the chip under test will decline, and the quality of the signal transmitted between the aging equipment and the chip under test through the IO channel will decline. Summary of the invention

[0004] In order to solve the above technical problems, the present application provides an aging equipment testing device and a testing method and a testing system thereof. The aging equipment testing device can be used to detect the IO interface of the aging equipment to avoid incorrect aging test results due to faults in the IO interface of the aging equipment when the aging equipment is used to perform an aging test on the chip to be tested.

[0005] In the first aspect, the present application provides an aging equipment testing device, the aging equipment testing device includes multiple IO test modules, and the IO test modules include a calculation module and a sending module. The calculation module is used to: obtain a first test signal output by the aging equipment through an IO channel, and calculate the delay of obtaining the first test signal; if the difference in delays of the first test signal obtained by multiple calculation modules through multiple IO channels is greater than or equal to the difference in preset delays, delay compensation is performed on at least part of the IO channels until the difference in delays is less than the difference in preset delays; wherein the IO channels correspond one-to-one to the calculation modules and the IO interfaces of the aging equipment, respectively.

[0006] By performing delay detection on the IO channels corresponding to all IO interfaces of the aging device and performing delay compensation on at least some of the IO channels, the problem of IO interface failure of the aging device can be solved. When the aging device is subsequently used to test the chip under test, it can be avoided that due to the failure of the IO interface of the aging device, the delay of the test signal received by the chip under test through different IO interfaces is greatly different, and even the IO interface of the chip under test is misjudged as a failure.

[0007] The calculation module is also used to: after at least part of the IO channels are delayed compensated, obtain a second test signal output by the aging device through the IO channel, and compare the second test signal with a preset signal to confirm whether the downlink in the IO channel is qualified. The sending module is used to: after at least part of the IO channels are delayed compensated, send a third test signal to the aging device through the IO channel to confirm whether the uplink in the IO channel is qualified.

[0008] The present application does not limit the specific voltage values ​​of the second test signal and the third test signal, which can cover all level standards that may be involved in the chip to be tested, so as to detect whether the downlink and uplink of the IO channel are qualified under different level standards, so as to avoid that under certain level standards, when the aging test is performed on the chip to be tested using the aging equipment, the signal quality transmitted through the IO channel of the aging equipment and the chip to be tested is reduced, and even the aging test result is wrong.

[0009] In some embodiments, the burn-in device testing apparatus may further include a memory, the memory being used to store the first detection result and report the first detection result to the main control module of the burn-in device, wherein the first detection result is used to indicate whether the downlink of the IO channel is qualified.

[0010] In some possible implementations, when the first test signal (e.g., 5V) output by the aging device does not match the first test signal (e.g., 3.3V) that the computing module can identify, the computing module cannot identify the first test signal (5V) output by the aging device and calculate the delay required to obtain the first test signal through multiple IO channels. Therefore, after the receiving module obtains the first test signal from the aging device, it should first convert the first test signal (5V) into a first test signal (3.3V) that the computing module can identify.

[0011] Based on this, the IO test module also includes a receiving module. The receiving module is used to: obtain the first test signal output by the aging device through the IO channel, convert the first test signal into a recognizable first test signal, and send the recognizable first test signal to the calculation module; wherein the recognizable first test signal can be recognized by the calculation module. The calculation module is used to: receive the recognizable first test signal, and calculate the delay difference between multiple calculation modules obtaining the recognizable first test signal through multiple IO channels.

[0012] Specifically, the receiving module includes a first level selection module, a comparison circuit, and a logic value receiving module. The first level selection module is electrically connected to the first input end of the comparison circuit, the second input end of the comparison circuit obtains the first test signal output by the aging device through the IO channel, the output end of the comparison circuit is electrically connected to the input end of the logic value receiving module, and the output end of the logic value receiving module is electrically connected to the calculation module.

[0013] The test principle is as follows: the aging device periodically inputs the first test signal to the comparison circuit through multiple IO channels. The aging device and the first level selection module agree in advance that when the downlink of the IO channel is correct, the first test signal should be 5V. The first level selection module inputs the reference voltage 5V to the comparison circuit. The aging device periodically inputs the first test signal 4.9V, 0V, 5V, 0V, 5.1V to the comparison circuit through multiple IO channels. Figure 6b As shown, the first test signals 4.9V, 0V, 5V, 0V, 5.1V are periodic square waves. The comparison circuit compares the reference voltage with the first test signal and inputs the comparison result to the logic value receiving module. If the first test signal is greater than or equal to the reference voltage, the comparison circuit outputs a digital signal 1; if the first test signal is less than the reference voltage, the comparison circuit outputs a digital signal 0. Therefore, based on the comparison results of the first test signals 4.9V, 0V, 5V, 0V, 5.1V and the reference voltage 5V, the output result of the comparison circuit is a digital signal 00101.

[0014] The function of the logic value receiving module is similar to that of the transfer interface, and the logic value receiving module can be matched with the comparison circuit and the delay measurement module respectively. That is, the logic value receiving module can not only identify the comparison result output by the comparison circuit, but also convert the comparison result into a first test signal that can be identified by the calculation module, and send the identified first test signal to the delay measurement module.

[0015] The delay measurement module receives the identifiable first test signal (digital signal 00101), calculates the delay required to obtain the identifiable first test signal, and sends the delay to the main control board of the aging device.

[0016] In some possible implementations, in addition to detecting whether the IO channel has a fault, it is also necessary to detect whether the power module of the aging device has a fault. The aging device test device also includes multiple power test modules and a control unit, the power test module includes a load pull module and a first detection module, and the load pull module includes a load. The control unit is used to: obtain multiple groups of first configuration values ​​from the aging device, and the first configuration value includes a working voltage value and a preset current value. The load pull module is used to: receive the working voltage provided by the power module of the aging device, and is in a working state; under the control of the control unit, adjust the current value on the load according to the preset current value; wherein the voltage value of the working voltage is the working voltage value in the multiple groups of first configuration values, and the current value is the preset current value in the multiple groups of first configuration values. The first detection module is used to: obtain the first voltage value at both ends of the load, and input the first voltage value to the control unit. The control unit is used to: calculate the preset voltage value at both ends of the load according to the preset current value and the preset resistance value of the load; compare the first voltage value with the preset voltage value to confirm whether the power module that provides the working voltage to the load pull module is qualified.

[0017] If the difference between the first voltage value and the preset voltage value is within the allowable range, it means that the power module is qualified; if the difference between the first voltage value and the preset voltage value is outside the allowable range, it means that the power module is unqualified. On this basis, the aging equipment testing device can also include a memory, which is used to store the second test result. The aging equipment can read the second test result from the memory and calibrate the power module according to the second test result. The second test result is used to characterize whether the power module that provides the working voltage to the load module is qualified.

[0018] In some possible implementations, the load module further includes a current control module; the load is a sampling resistor. The current control module and the sampling resistor are connected in series between the power module and the ground terminal of the aging device; the current control module is also electrically connected to the control unit, and under the control of the control unit, the current control module adjusts the current value on the load according to a preset current value.

[0019] For example, the load module also includes a current control module, and the load can be a sampling resistor. The current control module and the sampling resistor are connected in series between the power module and the ground terminal of the aging device; the current control module is also electrically connected to the control unit, and under the control of the control unit, the current control module adjusts the current value on the load according to the preset current value.

[0020] Since the current control module is connected in series with the sampling resistor, and the transistor and the sampling resistor are voltage-divided, the first voltage value at both ends of the sampling resistor is less than the working voltage value. The ideal preset voltage value at both ends of the sampling resistor can be calculated by the preset resistance value of the sampling resistor and the preset current value flowing through the sampling resistor. By changing the preset current value flowing through the sampling resistor and the working voltage value provided by the power module to the load module, it is determined whether the power module is qualified under certain preset current values ​​and / or working voltage values.

[0021] For example, the preset resistance value of the sampling resistor is 5Ω, the working voltage value of the working voltage provided by the power module to the load module is 5V, and the preset current value flowing through the sampling resistor and the current control module is 900mA, then the preset voltage value across the sampling resistor is 5Ω*900mA=4.5V, and the current control module divides 0.5V of the voltage. The first voltage value is compared with the preset voltage value of 4.5V to determine whether the power module providing the working voltage to the load module is qualified.

[0022] For another example, the preset resistance value of the sampling resistor is 5Ω, the working voltage provided by the power module to the load module is changed, the working voltage value of the working voltage is 6V, and the preset current value flowing through the sampling resistor and the current control module is still 900mA, then the preset voltage value across the sampling resistor is 5Ω*900mA=4.5V, and the current control module divides 1.5V of the voltage. The first voltage value is compared with the preset voltage value of 4.5V to determine whether the power module providing the working voltage for the load module is qualified.

[0023] For another example, the preset resistance value of the sampling resistor is 5Ω, the working voltage value of the working voltage provided by the power module to the load module is 5V, and the preset current value flowing through the sampling resistor and the current control module is still 800mA, then the preset voltage value across the sampling resistor is 5Ω*800mA=4V, and the current control module divides 1V of voltage. The first voltage value is compared with the preset voltage value of 4V to determine whether the power module providing the working voltage to the load module is qualified.

[0024] In some possible implementations, the aging equipment testing device also includes a temperature control module, which includes a thermistor, a heater, a heat sink, and a second detection module. The control unit is used to obtain multiple sets of second configuration values ​​from the aging equipment, and the second configuration values ​​include preset temperature values. The heater is used to simulate the temperature of the chip to be tested under the control of the control unit so that the temperature of the thermistor reaches the temperature of the chip to be tested. The heat sink is used to dissipate the heat of the thermistor according to the heat dissipation algorithm under the control of the control unit to reduce the temperature of the thermistor to below the preset temperature value. The second detection module is used to obtain a second voltage value across the thermistor and input the second voltage value into the control unit. The control unit is used to determine whether the heat dissipation algorithm is correct based on the second voltage value.

[0025] Under the control of the control unit, the heater simulates the temperature of the chip to be tested and heats the thermistor (the dotted arrow in the figure indicates that the heater heats the thermistor, and the heater and the thermistor are not connected) so that the heating temperature of the thermistor reaches the temperature of the chip to be tested. The heater can be used to simulate all temperature values ​​that may be involved in the chip to be tested.

[0026] While the heater heats the thermistor, the heat sink can also be used to cool the thermistor under the control of the control unit (the dashed arrow in the figure indicates that the heat sink dissipates heat from the thermistor, and the heat sink and the thermistor are not connected), so that the temperature on the thermistor is reduced to below the preset temperature value. The temperature dropped by the thermistor is the heat dissipation temperature, and the temperature on the thermistor is the difference between the heating temperature and the heat dissipation temperature of the thermistor.

[0027] While the heater heats the thermistor and the radiator dissipates heat from the thermistor, the second detection module can also obtain a second voltage value across the thermistor and input the second voltage value to the control unit. Those skilled in the art should know that when the temperature of the thermistor changes, the resistance value of the thermistor will also change. Therefore, the control unit can determine whether the heat dissipation algorithm is correct through the second voltage value across the thermistor.

[0028] On this basis, the control unit can also store a third detection result indicating whether the heat dissipation algorithm is correct in the memory, and the aging device can read the third detection result from the memory. If the heat dissipation algorithm is wrong, the aging device corrects the heat dissipation algorithm.

[0029] In a second aspect, the present application provides a test system, which includes a burn-in device and the burn-in device test device described in the first aspect; the burn-in device is electrically connected to the burn-in device test device through multiple interfaces. The burn-in device does not include a burn-in board, and the burn-in device test device is located at the original position of the burn-in board in the burn-in device.

[0030] The second aspect and any implementation of the second aspect correspond to the first aspect and any implementation of the first aspect respectively. The technical effects corresponding to the second aspect and any implementation of the second aspect can refer to the technical effects corresponding to the above-mentioned first aspect and any implementation of the first aspect, which will not be repeated here.

[0031] In some possible implementations, the aging device is used to: receive the delay difference of a first test signal obtained through multiple IO channels, if the delay difference is greater than or equal to a preset delay difference delay, obtain a delay compensation value based on the delay difference, and control a computing module of the aging device test device to compensate at least part of the IO channels.

[0032] In some possible implementations, when the memory of the aging device testing apparatus reports the first detection result, the second detection result, and the third detection result to the aging device, the aging device is further used to: correct the downlink in at least part of the IO channels according to the first detection result; correct the power module in the aging device that provides the working voltage for the load module of the aging device testing apparatus according to the second detection result; and correct the heat dissipation algorithm according to the third detection result.

[0033] In a third aspect, the present application provides a testing method for an aging equipment testing device, the aging equipment testing device includes an IO testing module, and the IO testing module includes a calculation module and a sending module. The testing method includes: using the calculation module to obtain a first test signal output by the aging equipment through an IO channel, and calculating the delay of obtaining the first test signal; if the difference in delays of multiple calculation modules obtaining the first test signal through multiple IO channels is greater than or equal to the difference in preset delays, then delay compensation is performed on at least part of the IO channels until the difference in delays is less than the difference in preset delays; wherein the IO channels correspond one-to-one to the IO interfaces of the aging equipment. Using the calculation module to obtain a second test signal output by the aging equipment through the IO channel, and performing a data comparison between the second test signal and the preset signal to confirm whether the downlink in the IO channel is qualified. Using the sending module to send a third test signal to the aging equipment through the IO channel to confirm whether the uplink in the IO channel is qualified.

[0034] In some possible implementations, the IO test module also includes a receiving module; before using the calculation module to obtain the first test signal output by the aging device through the IO channel, the test method also includes: using the receiving module to obtain the first test signal output by the aging device through the IO channel, converting the first test signal into a recognizable first test signal, and sending the recognizable first test signal to the calculation module; wherein the recognizable first test signal can be recognized by the calculation module. Using the calculation module to obtain the first test signal output by the aging device through the IO channel, and calculating the delay difference of multiple calculation modules obtaining the first test signal through multiple IO channels, includes: using the calculation module to receive the recognizable first test signal, and calculating the delay difference of multiple calculation modules obtaining the recognizable first test signal through multiple IO channels.

[0035] In some possible implementations, the receiving module includes a first level selection module, a comparison circuit, and a logic value receiving module. The first level selection module is electrically connected to a first input terminal of the comparison circuit, a second input terminal of the comparison circuit obtains a first test signal output by the aging device through an IO channel, an output terminal of the comparison circuit is electrically connected to an input terminal of the logic value receiving module, and an output terminal of the logic value receiving module is electrically connected to the calculation module.

[0036] In some possible implementations, the aging equipment test device also includes a power supply test module and a control unit, the power supply test module includes a load module and a first detection module, and the load module includes a load; the test method also includes: obtaining multiple groups of first configuration values ​​from the aging equipment through the control unit, the first configuration value includes a working voltage value and a preset current value. The load module is used to receive the working voltage provided by the power module of the aging equipment and is in a working state; under the control of the control unit, the load module is used to adjust the current value on the load according to the preset current value; wherein the voltage value of the working voltage is the working voltage value in the multiple groups of first configuration values, and the current value is the preset current value in the multiple groups of first configuration values. The first voltage value at both ends of the load is obtained through the first detection module, and the first voltage value is input into the control unit. The control unit is used to calculate the preset voltage value at both ends of the load according to the preset current value and the preset resistance value of the load; the first voltage value is compared with the preset voltage value to confirm whether the power module that provides the working voltage to the load module is qualified.

[0037] In some possible implementations, the aging equipment test device also includes a temperature control module, the temperature control module includes a thermistor, a heater, a heat sink, and a second detection module; the test method also includes: obtaining multiple sets of second configuration values ​​from the aging equipment through a control unit, the second configuration value includes a preset temperature value. Under the control of the control unit, the heater is used to simulate the temperature of the chip to be tested so that the temperature of the thermistor reaches the temperature of the chip to be tested. Under the control of the control unit, the heat sink is used to dissipate heat from the thermistor according to a heat dissipation algorithm to reduce the temperature of the thermistor to below the preset temperature value. The second voltage value at both ends of the thermistor is obtained through the second detection module, and the second voltage value is input into the control unit. The control unit is used to determine whether the heat dissipation algorithm is correct based on the second voltage value.

[0038] In some possible implementations, the aging equipment testing device also includes a memory. After the calculation module performs data comparison between the first test signal and the preset signal to confirm whether the downlink in at least part of the IO channels is qualified, the test method also includes: using the memory to store the first test result, and reporting the first test result to the aging equipment; wherein the first test result is used to characterize whether the downlink in multiple IO channels is qualified. After comparing the first voltage value with the preset voltage value to confirm whether the power module that provides the working voltage to the load module is qualified, the test method also includes: using the memory to store the second test result, and reporting the second test result to the aging equipment; wherein the second test result is used to characterize whether the power module that provides the working voltage to the load module is qualified. After using the control unit to determine whether the heat dissipation algorithm is correct according to the second voltage value, the test method also includes: using the memory to store the third test result, and reporting the third test result to the aging equipment.

[0039] The third aspect and any implementation of the third aspect correspond to the first aspect and any implementation of the first aspect, respectively. The technical effects corresponding to the third aspect and any implementation of the third aspect can refer to the technical effects corresponding to the first aspect and any implementation of the first aspect, which will not be repeated here.

[0040] In a fourth aspect, the present application provides an electronic device, comprising: a storage device and a processor, wherein the storage device is electrically connected to the processor. The storage device stores program instructions, and when the program instructions are executed by the processor, the electronic device executes the test method of the aging device test device described in the third aspect.

[0041] The fourth aspect and any implementation of the fourth aspect correspond to the first aspect and any implementation of the first aspect, respectively. The technical effects corresponding to the fourth aspect and any implementation of the fourth aspect can refer to the technical effects corresponding to the above-mentioned first aspect and any implementation of the first aspect, which will not be repeated here.

[0042] In a fifth aspect, the present application provides a computer-readable storage medium, comprising a computer program, which, when executed on an electronic device, enables the electronic device to execute the testing method of the aging device testing apparatus described in the third aspect.

[0043] The fifth aspect and any implementation of the fifth aspect correspond to the first aspect and any implementation of the first aspect, respectively. The technical effects corresponding to the fifth aspect and any implementation of the fifth aspect can refer to the technical effects corresponding to the first aspect and any implementation of the first aspect, which will not be repeated here.

[0044] In a sixth aspect, the present application provides a computer program product. When the computer program product is run on a computer, the computer executes the testing method of the aging equipment testing apparatus as described in the third aspect.

[0045] The sixth aspect and any implementation of the sixth aspect correspond to the first aspect and any implementation of the first aspect, respectively. The technical effects corresponding to the sixth aspect and any implementation of the sixth aspect can refer to the technical effects corresponding to the first aspect and any implementation of the first aspect, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 It is the structural diagram of the aging equipment;

[0047] Figure 2a An interaction diagram of the aging device and the IO test module provided in the embodiment of the present application;

[0048] Figure 2b A timing diagram of an aging device and a computing module provided in an embodiment of the present application;

[0049] Figure 3 An interaction diagram between an aging device and a computing module provided in an embodiment of the present application;

[0050] Figure 4 A timing diagram of an aging device and a computing module provided in an embodiment of the present application;

[0051] Figure 5 An interaction diagram of the aging device and the IO test module provided in the embodiment of the present application;

[0052] Figure 6a An interaction diagram of the aging device and the IO test module provided in the embodiment of the present application;

[0053] Figure 6b A waveform diagram of a first test signal provided in an embodiment of the present application;

[0054] Figure 7 An interaction diagram of the aging device and the IO test module provided in the embodiment of the present application;

[0055] Figure 8 An interaction diagram of the aging device and the IO test module provided in the embodiment of the present application;

[0056] Fig. 9 An interaction diagram of the aging device and the IO test module provided in the embodiment of the present application;

[0057] Fig.10 An interaction diagram of the aging device and the power supply test module provided in the embodiment of the present application;

[0058] Fig.11 An interaction diagram of the aging device and the power supply test module provided in the embodiment of the present application;

[0059] Fig.12 A circuit connection diagram of the loading module and the first detection module provided in an embodiment of the present application;

[0060] Fig.13 An interaction diagram of the aging device and the temperature control test module provided in the embodiment of the present application;

[0061] Fig.14 A schematic diagram of a test flow of a burn-in equipment test device provided in an embodiment of the present application;

[0062] Fig.15 A schematic block diagram of a device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0063] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0064] The term "and / or" in this article is merely a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone.

[0065] The terms "first" and "second" in the description and claims of the embodiments of the present application are used to distinguish different objects rather than to describe a specific order of objects. For example, a first target object and a second target object are used to distinguish different target objects rather than to describe a specific order of target objects.

[0066] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0067] In the description of the embodiments of the present application, unless otherwise specified, the meaning of "multiple" refers to two or more than two. For example, multiple processing units refer to two or more processing units; multiple systems refer to two or more systems.

[0068] The present application provides a test system, which may include an aging device. The aging device is based on simulating the long-term use of the chip to be tested, accelerating the aging of the chip by artificially creating a high temperature, constant current, constant voltage and other environments, so as to screen good chips and obtain data such as the life, safety, and ability to resist harsh environments of the chip to be tested. Figure 1 As shown, the aging equipment includes a power board, a temperature control board, a main control board, a duct control board and an aging board, etc. The power board includes multiple power modules.

[0069] During the aging test, the chip to be tested can be installed on the aging equipment through the aging board, and the aging equipment is electrically connected to the aging board through multiple interfaces (or multiple channels, which can include IO channels) to create a high temperature, constant current, constant voltage and other environments for the chip to be tested through the aging board. Among them, the temperature control board and the air duct control board are mainly used to control the temperature of the chip to be tested on the aging board, providing heating and cooling functions for the chip to be tested; the main control board is used to provide the chip to be tested with multi-channel test data waveforms and chip to be tested signal acquisition functions.

[0070] It should be understood that the IO interface in the aging device is actually present in the aging device, and the IO channel is a virtual channel connecting the IO interface of the aging device and the IO interface of the aging board (or the IO interface of the test module below).

[0071] Each step of the entire aging test process is very important. If a problem occurs in a certain step during actual operation, it will cause the chip (the chip is of the same specification as the chip to be tested in the aging test) to fail during mass production, resulting in a decrease in chip yield or even direct damage to a large number of chips, which seriously wastes manpower and material resources. In addition, the time cost of aging testing is high, and it is often unacceptable to re-perform aging testing due to a failure of the aging equipment.

[0072] After the aging equipment is used for a long time, the performance and reliability of the aging equipment will decrease. For example, the consistency of the delay of multiple IO channels connecting the aging equipment and the chip to be tested decreases, and the quality of the signal transmitted through the IO channel between the aging equipment and the chip to be tested decreases. Delay refers to: the time required for the signal to travel from the transmitting end to the receiving end. In the embodiment of the present application, delay refers to: the time required for the signal to be transmitted from the aging equipment to the chip to be tested (or the receiving module and computing module below) through the IO channel. The consistency of the delay of multiple IO channels decreases, that is, the consistency of the time required for the signal to be transmitted from the aging equipment to the chip to be tested through multiple IO channels decreases.

[0073] If multiple IO channels connecting the burn-in device and the chip under test fail, it may be that the IO interface of the burn-in device is faulty. Therefore, each IO interface in the burn-in device needs to be tested.

[0074] For example, the aging equipment sends test signals to the chip under test through multiple IO channels and the aging board, but the delay of the chip under test receiving the test signals through different IO channels varies greatly. This is because the delay consistency of multiple IO channels connecting the aging equipment and the chip under test has decreased.

[0075] For another example, the aging device sends a test signal to the chip under test through multiple IO channels and the aging board, but the signal received by the chip under test is different from the test signal sent by the aging device. This is because the downlink of the IO channel fails, resulting in a decrease in the quality of the signal transmitted between the aging device and the chip under test. In the embodiment of the present application, downlink means: the aging device sends a signal to the chip under test (or the aging device test device below).

[0076] For another example, the chip under test sends a test signal to the aging device through multiple IO channels and the aging board, but the signal received by the aging device is different from the test signal sent by the chip under test. This is because the uplink of the IO channel fails, resulting in a decrease in the quality of the signal transmitted between the aging device and the chip under test. In the embodiment of the present application, uplink means: the chip under test (or the aging device test device below) sends a signal to the aging device.

[0077] However, currently there are no technologies or products for self-checking aging equipment, so there may be situations where the aging test is inaccurate due to the lack of functionality of the aging equipment.

[0078] Based on this, the test system of the embodiment of the present application includes not only the burn-in device but also the burn-in device testing device. Before using the burn-in device to test the chip to be tested, the burn-in device testing device can be used to test the burn-in device to detect the possible errors of the burn-in device. In this way, the error of the burn-in device can be corrected first, and then the burn-in device can be used to test the chip to be tested.

[0079] Since the testing of the aging equipment using the aging equipment testing device and the testing of the chip to be tested using the aging equipment do not occur simultaneously, in the process of testing the aging equipment using the aging equipment testing device, there is no need to use a aging board to connect the aging equipment and the chip to be tested. Therefore, when testing the aging equipment using the aging equipment testing device, the aging equipment may not include the aging board, so that the aging equipment testing device replaces the aging board and is installed at the location of the aging board, and the multiple IO channels electrically connected to the aging equipment testing device and the aging equipment are the same as the multiple IO channels connected to the aging board and the aging equipment, so as to detect whether all IO interfaces of the aging equipment are qualified.

[0080] In this way, the aging equipment test device can be used to detect the degradation of delay consistency between multiple IO channels of the aging equipment and the chip under test due to IO channel failure; and the degradation of signal quality transmitted through the IO channel between the aging equipment and the chip under test due to IO channel downlink and / or uplink failure.

[0081] The following describes in detail the working process of the aging equipment testing device for testing the aging equipment in conjunction with the accompanying drawings.

[0082] like Figure 2a As shown, the aging equipment testing device includes an IO testing module 10 , and the IO testing module 10 includes a calculating module 12 and a sending module 13 .

[0083] like Figure 2b As shown, the calculation module 12 is used to: obtain the first test signal output by the aging device through the IO channel, and calculate the delay of obtaining the first test signal; if the difference in delays of multiple calculation modules 12 obtaining the first test signal through multiple IO channels is greater than or equal to the preset delay difference, delay compensation is performed on at least part of the IO channels until the delay difference is less than the preset delay difference; wherein the IO channels correspond one-to-one to the IO interfaces of the aging device and the calculation modules 12, respectively, and any calculation module 12 can obtain the first test signal output by the aging device through one IO channel.

[0084] The multiple IO channels correspond one-to-one to the multiple IO interfaces of the aging device, which means that in the embodiment of the present application, the calculation module 12 obtains the first test signal through each IO interface in the aging device to detect each IO interface in the aging device.

[0085] In some possible implementations, the embodiments of the present application do not limit the specific preset delay difference, and the preset delay difference can be set according to actual needs. For example, the preset delay difference is 5 nanoseconds (ns), 10ns, etc.

[0086] For example, Figure 3 As shown, assuming that the preset delay difference is 5ns, and the number of IO channels is 10 (IO channel 1 to IO channel 10). The aging device sends the first test signal to the calculation module 12 through the 10 IO channels respectively, and each calculation module 12 calculates that the delay used to obtain the first test signal through the corresponding IO channel is 50ns, 48ns, 49ns, 51ns, 45ns, 48ns, 46ns, 48ns, 47ns, and 48ns respectively.

[0087] Then, the 10 computing modules 12 feed back the delays calculated by themselves to the main control board of the aging device. The main control board of the aging device subtracts the delays used by the 10 computing modules 12 to obtain the first test signal through the 10 IO channels, and calculates the delay difference of the 10 computing modules 12 to obtain the first test signal through the 10 IO channels.

[0088] Among them, the delay used by the computing module 12 to obtain the first test signal through IO channel 1 is 50ns, and the delay difference with the delay of 44ns used by the computing module 12 to obtain the first test signal through IO channel 5 is 50ns-45ns=5ns; the delay used by the computing module 12 to obtain the first test signal through IO channel 4 is 51ns, and the delay difference with the delay of 45ns used by the computing module 12 to obtain the first test signal through IO channel 5 is 51ns-45ns=6ns; the delay used by the computing module 12 to obtain the first test signal through IO channel 4 is 51ns, and the delay difference with the delay of 46ns used by the computing module 12 to obtain the first test signal through IO channel 7 is 51ns-46ns=5ns.

[0089] That is, the delay consistency of the first test signal obtained by the computing module 12 through IO channel 1 and IO channel 5 is poor, the delay consistency of the first test signal obtained by the computing module 12 through IO channel 4 and IO channel 5 is poor, and the delay consistency of the first test signal obtained by the computing module 12 through IO channel 4 and IO channel 7 is poor.

[0090] Further, as shown in FIG2 , the main control board of the aging device calculates a delay compensation value according to the delay difference, and sends the delay compensation value to the calculation module 12. The calculation module 12 performs delay compensation on at least some of the IO channels among the IO channel 1, IO channel 4, IO channel 5, and IO channel 7 according to the delay compensation value, so that the delay difference of the first test signal obtained by the calculation module 12 through the above 10 IO channels is less than 5ns.

[0091] In other possible implementations, such as Figure 4 As shown, the main control board of the aging device calculates the delay compensation value according to the delay difference, and uses the delay compensation value to perform delay compensation on at least some of the IO channels among the above-mentioned IO channel 1, IO channel 4, IO channel 5, and IO channel 7, so that the delay difference of the first test signal obtained by the calculation module 12 through the above-mentioned 10 IO channels is less than 5ns.

[0092] As mentioned above, the IO channel is a virtual channel connecting the IO interface of the aging device and the IO interface of the computing module 12. Therefore, it can also be understood that: the delay consistency of the first test signal transmitted by the IO interface 1 and IO interface 5 of the aging device is poor, the delay consistency of the first test signal transmitted by the IO interface 4 and IO interface 5 of the aging device is poor, and the delay consistency of the first test signal transmitted by the IO interface 4 and IO interface 7 of the aging device is poor. In addition, delay compensation is performed on at least some of the IO interfaces among the IO interface 1, IO interface 4, IO interface 5, and IO interface 7 of the aging device, so that the delay difference of the computing module 12 obtaining the first test signal through the above 10 IO channels is less than 5ns.

[0093] The problem of IO interface failure of the aging device can be solved by performing delay compensation on at least some of the IO interfaces among IO interface 1, IO interface 4, IO interface 5, and IO interface 7. When the aging device is subsequently used to test the chip to be tested, it can be avoided that the delay difference of the test signal received by the chip to be tested through different IO interfaces is too large due to the failure of the IO interface of the aging device, and even the erroneous judgment that the IO interface of the chip to be tested is faulty.

[0094] In some embodiments, when the first test signal (e.g., 5V) output by the aging device does not match the first test signal (e.g., 3.3V) that can be recognized by the calculation module 12, the calculation module 12 cannot recognize the first test signal (5V) output by the aging device and calculate the delay required to obtain the first test signal through multiple IO channels. Therefore, after the receiving module 11 obtains the first test signal from the aging device, it should first convert the first test signal (5V) into the first test signal (3.3V) that can be recognized by the calculation module.

[0095] Based on this, Figure 5 As shown, the IO test module 10 also includes a receiving module 11. The receiving module is used to: obtain the first test signal output by the aging device through the IO channel, convert the first test signal into a recognizable first test signal, and send the recognizable first test signal to the calculation module. The recognizable first test signal can be recognized by the calculation module. The calculation module 12 no longer directly obtains the first test signal from the aging device, but obtains the recognizable first test signal from the receiving module 11, and calculates the delay difference between multiple calculation modules 12 obtaining the recognizable first test signal through multiple IO channels.

[0096] Specifically, Figure 6a As shown, the receiving module 11 includes a first level selection module 111, a comparison circuit 112, and a logic value receiving module 113. The first level selection module 111 is electrically connected to a first input terminal of the comparison circuit 112, the aging device is electrically connected to a second input terminal of the comparison circuit 112, and the output terminal of the comparison circuit 112 is electrically connected to the input terminal of the logic value receiving module 113. The calculation module 12 includes a delay measurement module 121, and the output terminal of the logic value receiving module 113 is electrically connected to the input terminal of the delay measurement module 121.

[0097] The test principle is as follows: the aging device periodically inputs the first test signal to the comparison circuit 112 through multiple IO channels. The aging device and the first level selection module 111 agree in advance that when the downlink of the IO channel is correct, the first test signal should be 5V. The first level selection module 111 inputs the reference voltage 5V to the comparison circuit 12, and the aging device periodically inputs the first test signal 4.9V, 0V, 5V, 0V, 5.1V to the comparison circuit 112 through multiple IO channels. Figure 6b As shown, the first test signals 4.9V, 0V, 5V, 0V, 5.1V are periodic square waves. The comparison circuit 12 compares the reference voltage with the first test signal and inputs the comparison result to the logic value receiving module 113. If the first test signal is greater than or equal to the reference voltage, the comparison circuit outputs a digital signal 1; if the first test signal is less than the reference voltage, the comparison circuit outputs a digital signal 0. Therefore, based on the comparison results of the first test signals 4.9V, 0V, 5V, 0V, 5.1V and the reference voltage 5V, the output result of the comparison circuit 112 is a digital signal 00101.

[0098] The function of the logic value receiving module 113 is similar to that of a transfer interface, and the logic value receiving module 113 can be matched with the comparison circuit 112 and the delay measurement module 121. That is, the logic value receiving module 113 can not only identify the comparison result output by the comparison circuit 112, but also convert the comparison result into a first test signal that can be identified by the calculation module 12, and send the identified first test signal to the delay measurement module 121.

[0099] Here, although the logic value receiving module 113 converts the comparison result into a first test signal recognizable by the calculation module 12, in terms of expression, the comparison result received by the delay measurement module 121 is still a digital signal 00101. In this process, the logic value receiving module 113 can serve as a medium between the comparison circuit 112 and the delay measurement module 121 to transmit the comparison result (digital signal 00101).

[0100] The delay measurement module 121 receives the identifiable first test signal (digital signal 00101), calculates the delay required to obtain the identifiable first test signal, and sends the delay to the main control board of the aging device.

[0101] like Figure 2a As shown, after the computing module 12 performs delay compensation on at least part of the IO channels, the computing module 12 is also used to obtain a second test signal output by the aging device through multiple IO channels, and send the second test signal to the computing module 12. The computing module 12 compares the second test signal with a preset signal to confirm whether the downlink in the multiple IO channels is qualified.

[0102] Specifically, Figure 7 As shown, the calculation module 12 includes not only the delay measurement module 121 but also the data comparison module 122 , and the output end of the logic value receiving module 113 is also electrically connected to the data comparison module 122 .

[0103] Still taking the example that the second test signal is the same as the first test signal, which are all 4.9V, 0V, 5V, 0V, 5.1V, the output result of the comparison circuit 112 is still the digital signal 00101, and the data comparison module 122 receives the output result (digital signal 00101) sent by the comparison circuit 112. In addition, the data comparison module 122 knows in advance that when the downlink of the IO channel is correct, the periodic first test signal should be 5V, 0V, 5V, 0V, 5V, and the first preset signal corresponding to 5V, 0V, 5V, 0V, 5V should be the digital signal 10101.

[0104] Furthermore, the data comparison module 122 compares the output result (digital signal 00101) with the first preset signal (digital signal 10101). As long as the digital signal 00101 is different from the digital signal 10101, it is confirmed that the downlink of the IO channel corresponding to the calculation module 12 is unqualified.

[0105] The above describes by way of example the situation where the output result is different from the ideal output result. In other possible implementations, if the data comparison module 122 compares the output result with the first preset signal and the two are the same, then it is confirmed that the downlink link of the IO channel corresponding to the calculation module 12 is qualified.

[0106] In addition, the embodiment of the present application does not limit the specific voltage value of the second test signal, which can cover all level standards that may be involved in the chip to be tested, so as to detect whether the downlink of the IO channel is qualified under different level standards.

[0107] In some embodiments, the burn-in device testing apparatus may further include a memory, the memory being used to store the first detection result and report the first detection result to the main control module of the burn-in device, wherein the first detection result is used to indicate whether the downlink of the IO channel is qualified.

[0108] The above describes the use of the IO test module 10 to detect whether the downlink of the IO channel is qualified. Figure 8 As shown, the IO test module 10 may further include a sending module 13. After the calculation module 12 performs delay compensation on at least part of the IO channels, the sending module 13 is used to send a third test signal to the aging device through the IO channel to confirm whether the uplink in the IO channel is qualified.

[0109] After the sending module 13 sends the third test signal to the aging device through the IO channel, the aging device can compare the third test signal with the second preset signal, and determine whether the uplink of the IO channel is qualified based on the comparison result of the two. If the uplink of the IO channel is unqualified, the aging device corrects the uplink of the IO channel. The comparison method of the third test signal and the second preset signal can be the same as the comparison method of the second test signal and the first preset signal, which will not be repeated here.

[0110] The foregoing article mentioned the situation where the first test signal (e.g., 5V) output by the aging device does not match the first test signal (e.g., 3.3V) that the calculation module 12 can recognize. In some possible implementations, the sending module 13 is also the same as the calculation module 12 and can only recognize a specific third test signal (e.g., 3.3V). In this case, the sending module 13 can only send a third test signal of 3.3V to the aging device through the IO channel.

[0111] In order to cover all the level standards that the chip under test may involve, it is necessary to detect whether the uplink of the IO channel is qualified under any level standard, such as Fig. 9 As shown, the sending module 13 further includes a second level selection module 131 , a driving module 132 , and a logic value sending module 133 .

[0112] Taking the example that the sending module 13 can identify the third test signal of 3.3V, the second level selection module 131 and the aging device agree in advance that when the uplink of the IO channel is correct, the third test signal sent by the sending module 13 to the aging device is 5V, so as to test whether the uplink of the IO channel is qualified when the 5V level is transmitted using the IO channel. The driving circuit 132 receives the third test signal 3.3V sent by the logic value sending module 133 and the reference voltage 5V sent by the second level selection module 131, converts the third test signal of 3.3V into a voltage of 5V, and sends the converted voltage to the aging device through the IO channel.

[0113] In some embodiments, in addition to detecting whether the IO channel is faulty, it is also necessary to detect whether the power module of the aging device is faulty. Fig.10 As shown, the aging equipment test device also includes multiple power supply test modules 21 and a control unit 22. There can be multiple power supply modules in the aging equipment, and the power supply modules correspond to the power supply test modules 21 one by one. Any power supply module is used to power the power supply test module 21, so as to detect whether the corresponding power supply test module 21 has a fault through the power supply test module 21.

[0114] The main control board of the aging device broadcasts to the power module of the aging device and the control unit 22 of the aging device testing device that the power module needs to supply the working voltage value of the power test module 21. The main control board of the aging device also sends the preset current value on the load module 211 to the control unit 22 of the aging device testing device.

[0115] The control unit 22 obtains multiple groups of first configuration values ​​from the aging device, and the first configuration values ​​include the above-mentioned working voltage value and preset current value. Among them, the working voltage values ​​in the multiple groups of first configuration values ​​can cover all working voltage values ​​that may be involved in the chip to be tested, and the preset current values ​​in the multiple groups of first configuration values ​​can cover all current values ​​that may be involved in the chip to be tested. The following takes any power detection module 21 detecting the power module corresponding to it as an example to describe the working principle of the power detection module 21.

[0116] like Fig.11 and Fig.12 As shown, the power supply test module includes a load module 211 and a first detection module 212, and the load module 211 includes a load 2111. The load module 211 receives the working voltage provided by the power module of the aging device and is in a working state. In order to test all working voltage values ​​that may be involved in the chip to be tested, the power module can provide different working voltage values ​​for the load module 211. Under the control of the control unit 22, the load module 211 adjusts the current value on the load 2111 according to the preset current value to test the current value that may be involved in the chip to be tested.

[0117] The first detection module 212 obtains a first voltage value across the load 2111, and inputs the first voltage value to the control unit 22. The control unit 22 calculates a preset voltage value across the load 2111 according to a preset current value and a preset resistance value of the load 2111, and compares the first voltage value with the preset voltage value to confirm whether the power module providing the working voltage to the load module 211 is qualified.

[0118] Specifically, if the difference between the first voltage value and the preset voltage value is within the allowable range, it means that the power module is qualified; if the difference between the first voltage value and the preset voltage value is outside the allowable range, it means that the power module is unqualified. On this basis, the aging equipment testing device can also include a memory 30, and the memory 30 is used to store the second test result. The aging equipment can read the second test result from the memory 30 and calibrate the power module according to the second test result. The second test result is used to characterize whether the power module that provides the working voltage to the load module 211 is qualified.

[0119] For example, Fig.12As shown, the load module 211 also includes a current control module 2112, and the load 2111 can be a sampling resistor. The current control module 2112 and the sampling resistor are connected in series between the power module and the ground terminal of the aging device; the current control module 2112 is also electrically connected to the control unit 22. Under the control of the control unit 22, the current control module 2112 adjusts the current value on the load according to the preset current value.

[0120] Since the current control module 2112 is connected in series with the sampling resistor, the transistor and the sampling resistor are voltage-divided, and the first voltage value at both ends of the sampling resistor is less than the working voltage value. The ideal preset voltage value at both ends of the sampling resistor can be calculated by the preset resistance value of the sampling resistor and the preset current value flowing through the sampling resistor. By changing the preset current value flowing through the sampling resistor and the working voltage value provided by the power module to the load module 211, it is determined whether the power module is qualified under certain preset current values ​​and / or working voltage values.

[0121] For example, the preset resistance value of the sampling resistor is 5Ω, the working voltage value of the working voltage provided by the power module to the load module 211 is 5V, and the preset current value flowing through the sampling resistor and the current control module 2112 is 900mA, then the preset voltage value across the sampling resistor is 5Ω*900mA=4.5V, and the current control module 2112 divides 0.5V of the voltage. The first voltage value is compared with the preset voltage value 4.5V to determine whether the power module providing the working voltage to the load module is qualified.

[0122] For another example, the preset resistance value of the sampling resistor is 5Ω, the working voltage provided by the power module to the load module 211 is changed, the working voltage value of the working voltage is 6V, and the preset current value flowing through the sampling resistor and the current control module 2112 is still 900mA, then the preset voltage value across the sampling resistor is 5Ω*900mA=4.5V, and the current control module 2112 divides 1.5V of the voltage. The first voltage value is compared with the preset voltage value of 4.5V to determine whether the power module providing the working voltage for the load module is qualified.

[0123] For another example, the preset resistance value of the sampling resistor is 5Ω, the working voltage value of the working voltage provided by the power module to the load module 211 is 5V, and the preset current value flowing through the sampling resistor and the current control module 2112 is still 800mA, then the preset voltage value across the sampling resistor is 5Ω*800mA=4V, and the current control module 2112 divides 1V of voltage. The first voltage value is compared with the preset voltage value 4V to determine whether the power module providing the working voltage to the load module is qualified.

[0124] In some embodiments, in addition to detecting whether the IO channel and the power module are faulty, it is also necessary to detect whether the temperature control algorithm of the aging device is faulty. Fig.13 As shown, the aging equipment testing device further includes a temperature control module 40 , and the temperature control module 40 includes a thermistor 41 , a heater 42 , a heat sink 43 , and a second detection module 44 .

[0125] The control unit 22 obtains multiple sets of second configuration values ​​from the aging device, and the second configuration values ​​include preset temperature values. The embodiment of the present application does not limit the specific temperature value of the preset temperature value, and the specific temperature value can be set according to actual needs.

[0126] Under the control of the control unit, the heater 42 simulates the temperature of the chip to be tested and heats the thermistor 41 (the dotted arrow in the figure indicates that the heater heats the thermistor, and the heater and the thermistor are not connected), so that the heating temperature of the thermistor 41 reaches the temperature of the chip to be tested. The heater 42 can be used to simulate all temperature values ​​that may be involved in the chip to be tested.

[0127] In some possible implementations, in order to make the heating temperature of the thermistor 41 accurately reach the temperature of the chip to be tested, the heater 42 may be disposed close to the thermistor 41 .

[0128] In some possible implementations, the power of the heater 42 may be changed by changing the magnitude of the current of the heater 42 , thereby providing different heating temperatures for the thermistor 41 using the heater 41 .

[0129] While the heater 42 heats the thermistor 41, the heat sink 43 can also be used to cool the thermistor 41 under the control of the control unit 22 (the dashed arrow in the figure indicates that the heat sink dissipates heat from the thermistor, and the heat sink and the thermistor are not connected), so that the temperature of the thermistor 41 is reduced to below the preset temperature value. The temperature of the thermistor 41 is the heat dissipation temperature, and the temperature of the thermistor 41 is the difference between the heating temperature and the heat dissipation temperature of the thermistor 41.

[0130] In some possible implementations, in order to effectively dissipate heat from the thermistor 41 , the heat sink 43 may be disposed close to the thermistor 41 .

[0131] In some possible implementations, the heat sink 43 may be a fan, and the control unit 22 may control the speed of the fan according to a heat dissipation algorithm, thereby utilizing the fan to dissipate heat for the thermistor 41 to varying degrees.

[0132] While the heater 42 heats the thermistor 41 and the heat sink 43 dissipates heat from the thermistor 41, the second detection module 44 can also obtain a second voltage value across the thermistor 41 and input the second voltage value to the control unit 22. Those skilled in the art should know that when the temperature of the thermistor 41 changes, the resistance value of the thermistor 41 will also change. Therefore, the control unit 22 can determine whether the heat dissipation algorithm is correct through the second voltage value across the thermistor 41.

[0133] It should be understood that the heat dissipation algorithm used by the control unit 22 to control the radiator 43 is the same as the heat dissipation algorithm used by the temperature control board in the aging device. If the heat dissipation algorithm used by the control unit 22 to control the radiator 43 is incorrect, then the heat dissipation algorithm used by the temperature control board in the aging device is incorrect; if the heat dissipation algorithm used by the control unit 22 to control the radiator 43 is correct, then the heat dissipation algorithm used by the temperature control board in the aging device is correct.

[0134] On this basis, the control unit 22 can also store the third detection result indicating whether the heat dissipation algorithm is correct in the memory 30, and the aging device can read the third detection result from the memory 30. If the heat dissipation algorithm is wrong, the aging device corrects the heat dissipation algorithm.

[0135] At this point, the IO interface, power module, and heat dissipation algorithm of the aging device are tested using the aging device testing device, so that all possible problems of the aging device can be detected.

[0136] In another embodiment, the present application also provides a testing method for an aging equipment testing device, wherein the aging equipment testing device includes an IO testing module, and the IO testing module includes a calculation module 12 and a sending module 13. Fig.14 As shown, the test method can be implemented by the following steps:

[0137] S110, using the calculation module 12 to obtain the first test signal output by the aging device through the IO channel, and calculate the delay of obtaining the first test signal; if the difference in delays of multiple calculation modules 12 obtaining the first test signal through multiple IO channels is greater than or equal to the preset delay difference, delay compensation is performed on at least part of the IO channels until the delay difference is less than the preset delay difference; wherein the IO channels all correspond one-to-one to the IO interfaces of the aging device.

[0138] In some possible implementations, the embodiments of the present application do not limit the specific preset delay difference, and the preset delay difference can be set according to actual needs. For example, the preset delay difference is 5 nanoseconds (ns), 10ns, etc.

[0139] For example, Figure 3As shown, assuming that the preset delay difference is 5ns, and the number of IO channels is 10 (IO channel 1 to IO channel 10). The aging device sends the first test signal to the calculation module 12 through the 10 IO channels respectively, and each calculation module 12 calculates that the delay used to obtain the first test signal through the corresponding IO channel is 50ns, 48ns, 49ns, 51ns, 45ns, 48ns, 46ns, 48ns, 47ns, and 48ns respectively.

[0140] Then, the 10 computing modules 12 feed back the delays calculated by themselves to the main control board of the aging device. The main control board of the aging device subtracts the delays used by the 10 computing modules 12 to obtain the first test signal through the 10 IO channels, and calculates the delay difference of the 10 computing modules 12 to obtain the first test signal through the 10 IO channels.

[0141] Among them, the delay used by the computing module 12 to obtain the first test signal through IO channel 1 is 50ns, and the delay difference with the delay of 44ns used by the computing module 12 to obtain the first test signal through IO channel 5 is 50ns-45ns=5ns; the delay used by the computing module 12 to obtain the first test signal through IO channel 4 is 51ns, and the delay difference with the delay of 45ns used by the computing module 12 to obtain the first test signal through IO channel 5 is 51ns-45ns=6ns; the delay used by the computing module 12 to obtain the first test signal through IO channel 4 is 51ns, and the delay difference with the delay of 46ns used by the computing module 12 to obtain the first test signal through IO channel 7 is 51ns-46ns=5ns.

[0142] That is, the delay consistency of the first test signal obtained by the computing module 12 through IO channel 1 and IO channel 5 is poor, the delay consistency of the first test signal obtained by the computing module 12 through IO channel 4 and IO channel 5 is poor, and the delay consistency of the first test signal obtained by the computing module 12 through IO channel 4 and IO channel 7 is poor.

[0143] Further, as shown in FIG2 , the main control board of the aging device calculates a delay compensation value according to the delay difference, and sends the delay compensation value to the calculation module 12. The calculation module 12 performs delay compensation on at least some of the IO channels among the IO channel 1, IO channel 4, IO channel 5, and IO channel 7 according to the delay compensation value, so that the delay difference of the first test signal obtained by the calculation module 12 through the above 10 IO channels is less than 5ns.

[0144] In other possible implementations, such as Figure 4As shown, the main control board of the aging device calculates the delay compensation value according to the delay difference, and uses the delay compensation value to perform delay compensation on at least some of the IO channels among the above-mentioned IO channel 1, IO channel 4, IO channel 5, and IO channel 7, so that the delay difference of the first test signal obtained by the calculation module 12 through the above-mentioned 10 IO channels is less than 5ns.

[0145] As mentioned above, the IO channel is a virtual channel connecting the IO interface of the aging device and the IO interface of the computing module 12. Therefore, it can also be understood that: the delay consistency of the first test signal transmitted by the IO interface 1 and IO interface 5 of the aging device is poor, the delay consistency of the first test signal transmitted by the IO interface 4 and IO interface 5 of the aging device is poor, and the delay consistency of the first test signal transmitted by the IO interface 4 and IO interface 7 of the aging device is poor. In addition, delay compensation is performed on at least some of the IO interfaces among the IO interface 1, IO interface 4, IO interface 5, and IO interface 7 of the aging device, so that the delay difference of the computing module 12 obtaining the first test signal through the above 10 IO channels is less than 5ns.

[0146] The problem of IO interface failure of the aging device can be solved by performing delay compensation on at least some of the IO interfaces among IO interface 1, IO interface 4, IO interface 5, and IO interface 7. When the aging device is subsequently used to test the chip to be tested, it can be avoided that the delay of the test signal received by the chip to be tested through different IO interfaces is greatly different due to the failure of the IO interface of the aging device, and even the erroneous judgment that the IO interface of the chip to be tested is faulty.

[0147] In some embodiments, when the first test signal (e.g., 5V) output by the aging device does not match the first test signal (e.g., 3.3V) that can be recognized by the calculation module 12, the calculation module 12 cannot recognize the first test signal (5V) output by the aging device and calculate the delay required to obtain the first test signal through multiple IO channels. Therefore, after the receiving module 11 obtains the first test signal from the aging device, it should first convert the first test signal (5V) into the first test signal (3.3V) that can be recognized by the calculation module.

[0148] Based on this, Figure 5As shown, the IO test module 10 also includes a receiving module 11. The receiving module is used to: obtain the first test signal output by the aging device through the IO channel, convert the first test signal into a recognizable first test signal, and send the recognizable first test signal to the calculation module. The recognizable first test signal can be recognized by the calculation module. The calculation module 12 no longer directly obtains the first test signal from the aging device, but obtains the recognizable first test signal from the receiving module 11, and calculates the delay difference between multiple calculation modules 12 obtaining the recognizable first test signal through multiple IO channels.

[0149] Specifically, Figure 6a As shown, the receiving module 11 includes a first level selection module 111, a comparison circuit 112, and a logic value receiving module 113. The first level selection module 111 is electrically connected to a first input terminal of the comparison circuit 112, the aging device is electrically connected to a second input terminal of the comparison circuit 112, and the output terminal of the comparison circuit 112 is electrically connected to the input terminal of the logic value receiving module 113. The calculation module 12 includes a delay measurement module 121, and the output terminal of the logic value receiving module 113 is electrically connected to the input terminal of the delay measurement module 121.

[0150] The test principle is as follows: the aging device periodically inputs the first test signal to the comparison circuit 112 through multiple IO channels. The aging device and the first level selection module 111 agree in advance that when the downlink of the IO channel is correct, the first test signal should be 5V. The first level selection module 111 inputs the reference voltage 5V to the comparison circuit 12, and the aging device periodically inputs the first test signal 4.9V, 0V, 5V, 0V, 5.1V to the comparison circuit 112 through multiple IO channels. Figure 6b As shown, the first test signals 4.9V, 0V, 5V, 0V, 5.1V are periodic square waves. The comparison circuit 12 compares the reference voltage with the first test signal and inputs the comparison result to the logic value receiving module 113. If the first test signal is greater than or equal to the reference voltage, the comparison circuit outputs a digital signal 1; if the first test signal is less than the reference voltage, the comparison circuit outputs a digital signal 0. Therefore, based on the comparison results of the first test signals 4.9V, 0V, 5V, 0V, 5.1V and the reference voltage 5V, the output result of the comparison circuit 112 is a digital signal 00101.

[0151] The function of the logic value receiving module 113 is similar to that of a transfer interface, and the logic value receiving module 113 can be matched with the comparison circuit 112 and the delay measurement module 121. That is, the logic value receiving module 113 can not only identify the comparison result output by the comparison circuit 112, but also convert the comparison result into a first test signal that can be identified by the calculation module 12, and send the identified first test signal to the delay measurement module 121.

[0152] Here, although the logic value receiving module 113 converts the comparison result into a first test signal recognizable by the calculation module 12, in terms of expression, the comparison result received by the delay measurement module 121 is still a digital signal 00101. In this process, the logic value receiving module 113 can serve as a medium between the comparison circuit 112 and the delay measurement module 121 to transmit the comparison result (digital signal 00101).

[0153] The delay measurement module 121 receives the identifiable first test signal (digital signal 00101), calculates the delay required to obtain the identifiable first test signal, and sends the delay to the main control board of the aging device.

[0154] S120, using the calculation module 12 to obtain a second test signal output by the aging device through the IO channel, and performing data comparison between the second test signal and a preset signal to confirm whether the downlink in the IO channel is qualified.

[0155] like Figure 2a As shown, after the computing module 12 performs delay compensation on at least part of the IO channels, the computing module 12 is also used to obtain a second test signal output by the aging device through multiple IO channels, and send the second test signal to the computing module 12. The computing module 12 compares the second test signal with a preset signal to confirm whether the downlink in the multiple IO channels is qualified.

[0156] Specifically, Figure 7 As shown, the calculation module 12 includes not only the delay measurement module 121 but also the data comparison module 122 , and the output end of the logic value receiving module 113 is also electrically connected to the data comparison module 122 .

[0157] Still taking the example that the second test signal is the same as the first test signal, which are all 4.9V, 0V, 5V, 0V, 5.1V, the output result of the comparison circuit 112 is still the digital signal 00101, and the data comparison module 122 receives the output result (digital signal 00101) sent by the comparison circuit 112. In addition, the data comparison module 122 knows in advance that when the downlink of the IO channel is correct, the periodic first test signal should be 5V, 0V, 5V, 0V, 5V, and the first preset signal corresponding to 5V, 0V, 5V, 0V, 5V should be the digital signal 10101.

[0158] Furthermore, the data comparison module 122 compares the output result (digital signal 00101) with the first preset signal (digital signal 10101). As long as the digital signal 00101 is different from the digital signal 10101, it is confirmed that the downlink of the IO channel corresponding to the calculation module 12 is unqualified.

[0159] The above describes by way of example the situation where the output result is different from the ideal output result. In other possible implementations, if the data comparison module 122 compares the output result with the first preset signal and the two are the same, then it is confirmed that the downlink link of the IO channel corresponding to the calculation module 12 is qualified.

[0160] In addition, the embodiment of the present application does not limit the specific voltage value of the second test signal, which can cover all level standards that may be involved in the chip to be tested, so as to detect whether the downlink of the IO channel is qualified under different level standards.

[0161] S130: Use the sending module 13 to send a third test signal to the aging device through the IO channel to confirm whether the uplink in the IO channel is qualified.

[0162] The above describes the use of the IO test module 10 to detect whether the downlink of the IO channel is qualified. Figure 8 As shown, the IO test module 10 may further include a sending module 13. After the calculation module 12 performs delay compensation on at least part of the IO channels, the sending module 13 is used to send a third test signal to the aging device through the IO channel to confirm whether the uplink in the IO channel is qualified.

[0163] After the sending module 13 sends the third test signal to the aging device through the IO channel, the aging device can compare the third test signal with the second preset signal. The comparison method of the third test signal with the second preset signal can be the same as the comparison method of the second test signal with the first preset signal, which will not be repeated here.

[0164] The foregoing article mentioned the situation where the first test signal (e.g., 5V) output by the aging device does not match the first test signal (e.g., 3.3V) that the calculation module 12 can recognize. In some possible implementations, the sending module 13 is also the same as the calculation module 12 and can only recognize a specific third test signal (e.g., 3.3V). In this case, the sending module 13 can only send a third test signal of 3.3V to the aging device through the IO channel.

[0165] In order to cover all the level standards that the chip under test may involve, it is necessary to detect whether the uplink of the IO channel is qualified under any level standard, such as Fig. 9 As shown, the sending module 13 further includes a second level selection module 131 , a driving module 132 , and a logic value sending module 133 .

[0166] Taking the example that the sending module 13 can identify the third test signal of 3.3V, the second level selection module 131 and the aging device agree in advance that when the uplink of the IO channel is correct, the third test signal sent by the sending module 13 to the aging device is 5V, so as to test whether the uplink of the IO channel is qualified when the 5V level is transmitted using the IO channel. The driving circuit 132 receives the third test signal 3.3V sent by the logic value sending module 133 and the reference voltage 5V sent by the second level selection module 131, converts the third test signal of 3.3V into a voltage of 5V, and sends the converted voltage to the aging device through the IO channel.

[0167] In some embodiments, in addition to detecting whether the IO channel is faulty, it is also necessary to detect whether the power module of the aging device is faulty. Fig.10 As shown, the aging equipment test device also includes multiple power supply test modules 21 and a control unit 22. There can be multiple power supply modules in the aging equipment, and the power supply modules correspond to the power supply test modules 21 one by one. Any power supply module is used to power the power supply test module 21, so as to detect whether the corresponding power supply test module 21 has a fault through the power supply test module 21.

[0168] The main control board of the aging device broadcasts to the power module of the aging device and the control unit 22 of the aging device testing device that the power module needs to supply the working voltage value of the power test module 21. The main control board of the aging device also sends the preset current value on the load module 211 to the control unit 22 of the aging device testing device.

[0169] The control unit 22 obtains multiple groups of first configuration values ​​from the aging device, and the first configuration values ​​include the above-mentioned working voltage value and preset current value. Among them, the working voltage values ​​in the multiple groups of first configuration values ​​can cover all working voltage values ​​that may be involved in the chip to be tested, and the preset current values ​​in the multiple groups of first configuration values ​​can cover all current values ​​that may be involved in the chip to be tested. The following takes any power detection module 21 detecting the power module corresponding to it as an example to describe the working principle of the power detection module 21.

[0170] like Fig.11 and Fig.12 As shown, the power supply test module includes a load module 211 and a first detection module 212, and the load module 211 includes a load 2111. The load module 211 receives the working voltage provided by the power module of the aging device and is in a working state. In order to test all working voltage values ​​that may be involved in the chip to be tested, the power module can provide different working voltage values ​​for the load module 211. Under the control of the control unit 22, the load module 211 adjusts the current value on the load 2111 according to the preset current value to test the current value that may be involved in the chip to be tested.

[0171] The first detection module 212 obtains a first voltage value across the load 2111, and inputs the first voltage value to the control unit 22. The control unit 22 calculates the preset voltage value across the load 2111 according to the preset current value and the preset resistance value of the load 2111, and compares the first voltage value with the preset voltage value to confirm whether the power module that provides the working voltage to the load module 211 is qualified. Specifically, if the difference between the first voltage value and the preset voltage value is within the allowable range, it means that the power module is qualified; if the difference between the first voltage value and the preset voltage value is outside the allowable range, it means that the power module is unqualified.

[0172] The aging equipment testing device may further include a memory 30, which is used to store a second test result. The aging equipment may read the second test result from the memory 30 and calibrate the power module according to the second test result. The second test result is used to indicate whether the power module that provides the working voltage to the load module 211 is qualified.

[0173] For example, Fig.12 As shown, the load module 211 also includes a current control module 2112, and the load 2111 can be a sampling resistor. The current control module 2112 and the sampling resistor are connected in series between the power module and the ground terminal of the aging device; the current control module 2112 is also electrically connected to the control unit 22. Under the control of the control unit 22, the current control module 2112 adjusts the current value on the load according to the preset current value.

[0174] Since the current control module 2112 is connected in series with the sampling resistor, the transistor and the sampling resistor are voltage-divided, and the first voltage value at both ends of the sampling resistor is less than the working voltage value. The ideal preset voltage value at both ends of the sampling resistor can be calculated by the preset resistance value of the sampling resistor and the preset current value flowing through the sampling resistor. By changing the preset current value flowing through the sampling resistor and the working voltage value provided by the power module to the load module 211, it is determined whether the power module is qualified under certain preset current values ​​and / or working voltage values.

[0175] For example, the preset resistance value of the sampling resistor is 5Ω, the working voltage value of the working voltage provided by the power module to the load module 211 is 5V, and the preset current value flowing through the sampling resistor and the current control module 2112 is 900mA, then the preset voltage value across the sampling resistor is 5Ω*900mA=4.5V, and the current control module 2112 divides 0.5V of the voltage. The first voltage value is compared with the preset voltage value 4.5V to determine whether the power module providing the working voltage to the load module is qualified.

[0176] For another example, the preset resistance value of the sampling resistor is 5Ω, the working voltage provided by the power module to the load module 211 is changed, the working voltage value of the working voltage is 6V, and the preset current value flowing through the sampling resistor and the current control module 2112 is still 900mA, then the preset voltage value across the sampling resistor is 5Ω*900mA=4.5V, and the current control module 2112 divides 1.5V of the voltage. The first voltage value is compared with the preset voltage value of 4.5V to determine whether the power module providing the working voltage for the load module is qualified.

[0177] For another example, the preset resistance value of the sampling resistor is 5Ω, the working voltage value of the working voltage provided by the power module to the load module 211 is 5V, and the preset current value flowing through the sampling resistor and the current control module 2112 is still 800mA, then the preset voltage value across the sampling resistor is 5Ω*800mA=4V, and the current control module 2112 divides 1V of voltage. The first voltage value is compared with the preset voltage value 4V to determine whether the power module providing the working voltage to the load module is qualified.

[0178] In some embodiments, in addition to detecting whether the IO channel and the power module are faulty, it is also necessary to detect whether the temperature control algorithm of the aging device is faulty. Fig.13 As shown, the aging equipment testing device further includes a temperature control module 40 , and the temperature control module 40 includes a thermistor 41 , a heater 42 , a heat sink 43 , and a second detection module 44 .

[0179] The control unit 22 obtains multiple sets of second configuration values ​​from the aging device, and the second configuration values ​​include preset temperature values. The embodiment of the present application does not limit the specific temperature value of the preset temperature value, and the specific temperature value can be set according to actual needs.

[0180] Under the control of the control unit, the heater 42 simulates the temperature of the chip to be tested and heats the thermistor 41 (the dotted arrow in the figure indicates that the heater heats the thermistor, and the heater and the thermistor are not connected), so that the heating temperature of the thermistor 41 reaches the temperature of the chip to be tested. The heater 42 can be used to simulate all temperature values ​​that may be involved in the chip to be tested.

[0181] In some possible implementations, in order to make the heating temperature of the thermistor 41 accurately reach the temperature of the chip to be tested, the heater 42 may be disposed close to the thermistor 41 .

[0182] In some possible implementations, the power of the heater 42 may be changed by changing the magnitude of the current of the heater 42 , thereby providing different heating temperatures for the thermistor 41 using the heater 41 .

[0183] While the heater 42 heats the thermistor 41, the heat sink 43 can also be used to cool the thermistor 41 under the control of the control unit 22 (the dashed arrow in the figure indicates that the heat sink dissipates heat from the thermistor, and the heat sink and the thermistor are not connected), so that the temperature of the thermistor 41 is reduced to below the preset temperature value. The temperature of the thermistor 41 is the heat dissipation temperature, and the temperature of the thermistor 41 is the difference between the heating temperature and the heat dissipation temperature of the thermistor 41.

[0184] In some possible implementations, in order to effectively dissipate heat from the thermistor 41 , the heat sink 43 may be disposed close to the thermistor 41 .

[0185] In some possible implementations, the heat sink 43 may be a fan, and the control unit 22 may control the speed of the fan according to a heat dissipation algorithm, thereby utilizing the fan to dissipate heat for the thermistor 41 to varying degrees.

[0186] While the heater 42 heats the thermistor 41 and the heat sink 43 dissipates heat from the thermistor 41, the second detection module 44 can also obtain a second voltage value across the thermistor 41 and input the second voltage value to the control unit 22. Those skilled in the art should know that when the temperature of the thermistor 41 changes, the resistance value of the thermistor 41 will also change. Therefore, the control unit 22 can determine whether the heat dissipation algorithm is correct through the second voltage value across the thermistor 41.

[0187] It should be understood that the heat dissipation algorithm used by the control unit 22 to control the radiator 43 is the same as the heat dissipation algorithm used by the temperature control board in the aging device. If the heat dissipation algorithm used by the control unit 22 to control the radiator 43 is incorrect, then the heat dissipation algorithm used by the temperature control board in the aging device is incorrect; if the heat dissipation algorithm used by the control unit 22 to control the radiator 43 is correct, then the heat dissipation algorithm used by the temperature control board in the aging device is correct.

[0188] On this basis, the control unit 22 can also store the third detection result indicating whether the heat dissipation algorithm is correct in the memory 30, and the aging device can read the third detection result from the memory 30. If the heat dissipation algorithm is wrong, the aging device corrects the heat dissipation algorithm.

[0189] In addition, it should be noted that the embodiment of the present application does not limit the order of step S120 and step S130. Step S120 may be executed first, and then step S130; or, step S130 may be executed first, and then step S120; or, step S120 and step S130 may be executed simultaneously.

[0190] It is understandable that, in order to realize the above functions, the electronic device includes hardware and / or software modules corresponding to the execution of each function. In combination with the algorithm steps of each example described in the embodiments disclosed herein, the present application can be implemented in the form of hardware or a combination of hardware and computer software. Whether a function is executed in the form of hardware or computer software driving hardware depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application in combination with the embodiments, but such implementation should not be considered to be beyond the scope of the present application.

[0191] In one example, Fig.15 A schematic block diagram of an apparatus 300 according to an embodiment of the present application is shown. The apparatus 300 may include: a processor 301 and a transceiver / transceiver pin 302 , and optionally, a storage device 303 .

[0192] The components of the device 300 are coupled together via a bus 304, wherein the bus 304 includes a power bus, a control bus, and a status signal bus in addition to a data bus. However, for the sake of clarity, all buses are referred to as bus 304 in the figure.

[0193] Optionally, the storage device 303 may be used for the instructions in the aforementioned method embodiment. The processor 301 may be used to execute the instructions in the storage device 303, and control the receiving pin to receive a signal, and control the sending pin to send a signal.

[0194] The apparatus 300 may be the electronic device or a chip of the electronic device in the above method embodiment.

[0195] Among them, all relevant contents of each step involved in the above method embodiment can be referred to the functional description of the corresponding functional module, and will not be repeated here.

[0196] This embodiment also provides a computer storage medium, in which computer instructions are stored. When the computer instructions are executed on an electronic device, the electronic device executes the above-mentioned related method steps to implement the test method of the aging device test device in the above-mentioned embodiment.

[0197] This embodiment further provides a computer program product. When the computer program product is run on a computer, the computer is enabled to execute the above-mentioned related steps to implement the testing method of the aging equipment testing device in the above-mentioned embodiment.

[0198] In addition, an embodiment of the present application also provides a device, which can specifically be a chip, a component or a module, and the device may include a connected processor and a memory 303; wherein the memory 303 is used to store computer execution instructions, and when the device is running, the processor can execute the computer execution instructions stored in the memory 303, so that the chip executes the test method of the aging equipment test device in the above-mentioned method embodiments.

[0199] Among them, the electronic device, computer storage medium, computer program product or chip provided in this embodiment is used to execute the corresponding method provided above. Therefore, the beneficial effects that can be achieved can refer to the beneficial effects in the corresponding method provided above and will not be repeated here.

[0200] Through the description of the above implementation methods, technical personnel in the relevant field can understand that for the convenience and simplicity of description, only the division of the above-mentioned functional modules is used as an example. In actual applications, the above-mentioned functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above.

[0201] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of modules or units is only a logical function division, and there may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another device, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0202] The units described as separate components may or may not be physically separated, and the components shown as units may be one physical unit or multiple physical units, that is, they may be located in one place or distributed in multiple different places. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0203] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0204] Any content of each embodiment of the present application, as well as any content of the same embodiment, can be freely combined. Any combination of the above content is within the scope of the present application.

[0205] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a readable storage medium. Based on this understanding, the technical solution of the embodiment of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, which is stored in a storage medium, including several instructions to enable a device (which can be a single-chip microcomputer, chip, etc.) or a processor (processor) to perform all or part of the steps of the various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read only memory (ROM), random access memory (RAM), disk or optical disk and other media that can store program code.

[0206] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A aging equipment testing device, characterized in that: It includes multiple IO test modules, each of which includes a calculation module and a sending module; The calculation module is used to: obtain a first test signal output by the aging device through an IO channel, and calculate the delay of obtaining the first test signal; if the difference in delays of multiple calculation modules obtaining the first test signal through multiple IO channels is greater than or equal to a preset delay difference, delay compensation is performed on at least part of the IO channels until the delay difference is less than the preset delay difference; wherein the IO channels correspond one-to-one to the IO interfaces of the calculation modules and the aging device respectively; The calculation module is further used to: after delay compensation is performed on at least part of the IO channels, obtain a second test signal output by the aging device through the IO channels, and perform data comparison between the second test signal and a preset signal to confirm whether the downlink in the IO channels is qualified; The sending module is used to send a third test signal to the aging device through the IO channel after at least part of the IO channel performs delay compensation, so as to confirm whether the uplink in the IO channel is qualified.

2. The aging equipment testing device according to claim 1, characterized in that: The IO test module also includes a receiving module; The receiving module is used to: obtain the first test signal output by the aging device through the IO channel, convert the first test signal into a recognizable first test signal, and send the recognizable first test signal to the calculation module; wherein the recognizable first test signal can be recognized by the calculation module; The calculation module is used to receive the identifiable first test signal and calculate the difference in delays of multiple calculation modules in acquiring the identifiable first test signal through multiple IO channels.

3. The aging equipment testing device according to claim 2, characterized in that: The receiving module includes a first level selection module, a comparison circuit, and a logic value receiving module; The first level selection module is electrically connected to the first input end of the comparison circuit, the second input end of the comparison circuit obtains the first test signal output by the aging device through the IO channel, the output end of the comparison circuit is electrically connected to the input end of the logic value receiving module, and the output end of the logic value receiving module is electrically connected to the calculation module.

4. The aging equipment testing device according to any one of claims 1 to 3, characterized in that: The aging equipment testing device further includes a plurality of power supply testing modules and a control unit, wherein the power supply testing module includes a load pulling module and a first detection module, and the load pulling module includes a load; The control unit is used to: obtain multiple groups of first configuration values ​​from the aging device, where the first configuration values ​​include an operating voltage value and a preset current value; The load-pulling module is used to: receive the working voltage provided by the power module of the aging equipment and be in a working state; under the control of the control unit, adjust the current value on the load according to the preset current value; wherein the voltage value of the working voltage is the working voltage value in the multiple groups of first configuration values, and the current value is the preset current value in the multiple groups of first configuration values; The first detection module is used to: obtain a first voltage value across the load, and input the first voltage value into the control unit; The control unit is used to: calculate a preset voltage value across the load based on the preset current value and the preset resistance value of the load; compare the first voltage value with the preset voltage value to confirm whether the power supply module that provides the working voltage to the load module is qualified.

5. The aging equipment testing device according to claim 3, characterized in that: The load-pulling module further includes a current control module; the load is a sampling resistor; The current control module and the sampling resistor are connected in series between the power module and the ground terminal of the aging device; the current control module is also electrically connected to the control unit, and under the control of the control unit, the current control module adjusts the current value on the load according to the preset current value.

6. The aging equipment testing device according to claim 4 or 5, characterized in that: The aging equipment testing device also includes a temperature control module, which includes a thermistor, a heater, a radiator, and a second detection module; The control unit is used to: obtain multiple groups of second configuration values ​​from the aging device, where the second configuration values ​​include preset temperature values; The heater is used to: under the control of the control unit, simulate the temperature of the chip to be tested so that the temperature of the thermistor reaches the temperature of the chip to be tested; The radiator is used to: under the control of the control unit, dissipate heat for the thermistor according to a heat dissipation algorithm, so as to reduce the temperature of the thermistor to below the preset temperature value; The second detection module is used to: obtain a second voltage value across the thermistor and input the second voltage value into the control unit; The control unit is used to determine whether the heat dissipation algorithm is correct according to the second voltage value.

7. The aging equipment testing device according to claim 6, characterized in that: The aging equipment testing device also includes a memory; The memory is used to store a first test result, a second test result, and a third test result; wherein the first test result is used to indicate whether the downlink in the plurality of IO channels is qualified, the second test result is used to indicate whether the power module providing the working voltage to the load module is qualified, and the third test result is used to indicate whether the heat dissipation algorithm is correct; The memory is further used to report the first detection result, the second detection result, and the third detection result to the aging device.

8. A testing system, characterized in that: It comprises an aging device and an aging device testing device according to any one of claims 1 to 7; the aging device is electrically connected to the aging device testing device through a plurality of interfaces; The aging equipment does not include a aging board, and the aging equipment testing device is located at the original position of the aging board in the aging equipment.

9. The test system according to claim 8, characterized in that: The aging device is used to: receive the delay difference of the first test signal obtained through the multiple IO channels, and if the delay difference is greater than or equal to the preset delay difference delay, obtain a delay compensation value according to the delay difference, and control the calculation module of the aging device test device to compensate at least part of the IO channels.

10. The test system according to claim 8 or 9, characterized in that: In the case where the memory of the burn-in device test device reports the first detection result, the second detection result, and the third detection result to the burn-in device, the burn-in device is further used to: correct the downlink in at least part of the IO channels according to the first detection result; and correct the power supply module in the burn-in device that provides the working voltage for the load module of the burn-in device test device according to the second detection result; The heat dissipation algorithm is corrected according to the third detection result.

11. A testing method for an aging equipment testing device, characterized in that: The aging equipment testing device includes an IO testing module, and the IO testing module includes a calculation module and a sending module; the testing method includes: The calculation module is used to obtain a first test signal output by the aging device through an IO channel, and a delay of obtaining the first test signal is calculated; if the difference in delays of obtaining the first test signal through multiple calculation modules through multiple IO channels is greater than or equal to a preset delay difference, delay compensation is performed on at least part of the IO channels until the delay difference is less than the preset delay difference; wherein the IO channels correspond one-to-one to the IO interfaces of the aging device; Using the calculation module to obtain a second test signal output by the aging device through the IO channel, and performing data comparison between the second test signal and a preset signal to confirm whether the downlink in the IO channel is qualified; The sending module is used to send a third test signal to the aging device through the IO channel to confirm whether the uplink in the IO channel is qualified.

12. The testing method of the aging equipment testing device according to claim 11, characterized in that: The IO test module further includes a receiving module; before using the calculation module to obtain the first test signal output by the aging device through the IO channel, the test method further includes: Using the receiving module to obtain the first test signal output by the aging device through the IO channel, converting the first test signal into a recognizable first test signal, and sending the recognizable first test signal to the calculation module; wherein the recognizable first test signal can be recognized by the calculation module; The method of using the calculation module to obtain the first test signal output by the aging device through the IO channel, and calculating the delay difference between multiple calculation modules obtaining the first test signal through multiple IO channels, includes: The calculation module is used to receive the identifiable first test signal, and the delay difference between multiple calculation modules obtaining the identifiable first test signal through multiple IO channels is calculated.

13. The testing method according to claim 12, characterized in that: The receiving module includes a first level selection module, a comparison circuit, and a logic value receiving module; The first level selection module is electrically connected to the first input end of the comparison circuit, the second input end of the comparison circuit obtains the first test signal output by the aging device through the IO channel, the output end of the comparison circuit is electrically connected to the input end of the logic value receiving module, and the output end of the logic value receiving module is electrically connected to the calculation module.

14. The testing method of the aging equipment testing device according to claim 13, characterized in that: The aging equipment testing device further includes a power supply testing module and a control unit, wherein the power supply testing module includes a load pulling module and a first detection module, and the load pulling module includes a load; the testing method further includes: Acquire multiple groups of first configuration values ​​from the aging device through the control unit, wherein the first configuration values ​​include an operating voltage value and a preset current value; The load module is used to receive the working voltage provided by the power module of the aging equipment, and is in a working state; under the control of the control unit, the load module is used to adjust the current value on the load according to the preset current value; wherein the voltage value of the working voltage is the working voltage value in the multiple groups of first configuration values, and the current value is the preset current value in the multiple groups of first configuration values; Acquire a first voltage value at both ends of the load through the first detection module, and input the first voltage value into the control unit; The control unit is used to calculate a preset voltage value across the load based on the preset current value and the preset resistance value of the load; the first voltage value is compared with the preset voltage value to confirm whether the power supply module that provides the working voltage to the load module is qualified.

15. The testing method of the aging equipment testing device according to claim 14, characterized in that: The aging equipment testing device also includes a temperature control module, which includes a thermistor, a heater, a radiator, and a second detection module; The test method also includes: Acquire multiple groups of second configuration values ​​from the aging device through the control unit, wherein the second configuration values ​​include preset temperature values; Under the control of the control unit, the heater is used to simulate the temperature of the chip to be tested, so that the temperature of the thermistor reaches the temperature of the chip to be tested; Under the control of the control unit, the heat sink is used to dissipate heat from the thermistor according to a heat dissipation algorithm, so as to reduce the temperature of the thermistor to below the preset temperature value; Acquire a second voltage value across the thermistor through the second detection module, and input the second voltage value into the control unit; The control unit is used to determine whether the heat dissipation algorithm is correct according to the second voltage value.

16. The testing method of the aging equipment testing device according to claim 15, characterized in that: The aging equipment testing device also includes a memory; After the calculation module performs a data comparison between the first test signal and the preset signal to confirm whether the downlinks in at least some of the IO channels are qualified, the test method further includes: using the memory to store the first test result, and reporting the first test result to the aging device; wherein the first test result is used to indicate whether the downlinks in the multiple IO channels are qualified; After comparing the first voltage value with the preset voltage value to confirm whether the power module providing the working voltage to the load module is qualified, the testing method further includes: using the memory to store a second test result, and reporting the second test result to the aging device; wherein the second test result is used to characterize whether the power module providing the working voltage to the load module is qualified; After using the control unit to determine whether the heat dissipation algorithm is correct according to the second voltage value, the testing method further includes: using the memory to store a third detection result, and reporting the third detection result to the aging device.

17. An electronic device, characterized in that: include: A storage device and a processor, wherein the storage device is electrically connected to the processor; The storage device stores program instructions, and when the program instructions are executed by the processor, the electronic device executes the testing method of the aging equipment testing device according to any one of claims 11 to 16.

18. A computer-readable storage medium comprising a computer program, characterized in that: When the computer program is executed on an electronic device, the electronic device executes the testing method of the aging equipment testing apparatus according to any one of claims 11 to 16.

19. A computer program product, characterized in that When the computer program product is run on a computer, the computer is enabled to execute the testing method of the aging equipment testing device according to any one of claims 11 to 16.

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