Notebook computer

Abstract

The invention provides a notebook computer. The notebook computer comprises a first shell, a first sub-circuit board, an input module, a second shell, a mainboard and a bridging circuit board, the first sub-circuit board is arranged on the first shell. The input module is arranged on the first shell and electrically connected with the first sub-circuit board. The mainboard is arranged on the second shell. The first shell and the second shell are assembled together, so that the first sub-circuit board, the bridge circuit board and the mainboard are partially overlapped together, and the first sub-circuit board is electrically connected with the mainboard through the bridge circuit board.

Description

Technical Field

[0001] The invention relates to a notebook computer. Background Art

[0002] ESG is an abbreviation of three English words, namely, environment, social responsibility and corporate governance. The UN Global Compact first proposed the concept of ESG in 2004 and it is regarded as an indicator for evaluating the operation of a company. ESG is an indicator for measuring the sustainable development of a company, which is the carbon reduction and sustainable development goals required by international and domestic governments. In the past, companies only needed to pay attention to financial data. However, if the financial statements were beautiful, but the operations violated human rights, discharged wastewater, infringed on consumer rights, and endangered the living environment of the earth's creatures, it would violate the international goal of promoting the sustainability of the earth, prompting institutional investors to reduce investment and cooperation in such companies, and even affect the company's reputation. Today, companies that attach importance to the concept of ESG not only have transparent financial statements, but also have stable and low-risk operating models, and their long-term performance will be relatively stable. For the above reasons, for the electronic manufacturing industry, whether the products it manufactures meet the above conditions has become one of the evaluation conditions for the products.

[0003] Taking laptop computers as an example, the evaluation content lies in the amount of energy consumed in the manufacturing process of the product and whether the product is repairable (recyclable). In order to achieve the above goals, the component design and assembly configuration of the laptop computer require corresponding new technologies and measures.

[0004] In terms of assembly and configuration, the existing assembly process of laptop computers includes the positioning and snapping of tenons or hooks, welding of components or electronic components, screw locking and fixing, docking of related electrical transmission components (connectors, cables or wires, FPC)... etc. In addition to the high complexity of the process, the related accessories and consumables often do not meet the aforementioned sustainability conditions. Especially for subsequent maintenance and disassembly, it is easy for the operator to be unable to easily disassemble and assemble the components because the components are stacked, which may block the related ports or connectors. At the same time, the electrical connection relationship between the components must also be considered. Since the electrical transmission components between the existing electronic components are complicated, during the assembly of the components, the operator must not only perform the wiring operation, but also worry about the occurrence of connector misconnection and other incidents. In addition, after the assembly is completed, there is also the need to worry about the components vibrating, falling, etc., causing separation or the electrical transmission components to fall off.

[0005] Based on the above, it is difficult to meet the aforementioned sustainable goals based on the configuration and connection relationship of existing electronic components in notebook computers. Summary of the invention

[0006] The present invention is directed to a notebook computer, which uses a stacked structure of a combined circuit board to complete electrical connection in an intuitive assembly process.

[0007] According to an embodiment of the present invention, a laptop computer includes a first housing, a first sub-circuit board, an input module, a second housing, a main board, and a bridge circuit board. The first sub-circuit board is disposed in the first housing. The input module is disposed in the first housing and electrically connected to the first sub-circuit board. The main board is disposed in the second housing. The first housing and the second housing are assembled together so that the first sub-circuit board, the bridge circuit board, and the main board are partially stacked together, and the first sub-circuit board is electrically connected to the main board via the bridge circuit board.

[0008] Based on the above, the configuration of the components of the system host of the notebook computer, especially the assembly configuration of the circuit board, is matched with the assembly method of the first shell and the second shell of the system host, and a stacking assembly is adopted to effectively simplify the assembly process, wherein the first shell and the keyboard, touchpad and first sub-circuit board assembled thereon are regarded as a group of semi-finished products, and the second shell and the mainboard and second sub-circuit board configured thereon are regarded as another group of semi-finished products. When the above semi-finished products are completed, they can be connected between the above two groups of semi-finished products through a bridge circuit board, so as to complete the electrical connection relationship of multiple circuit boards while assembling the structure, without the need to carry out wire management and connector plugging operations on wires or cables as in the above prior art.

[0009] At the same time, because the aforementioned structural assembly adopts stacking assembly, the user does not need to worry about whether to reserve the space required for the connector and the wire (or cable) to be plugged in. In other words, the laptop computer of the present invention can be assembled one by one in an intuitive way because of the stacking assembly components, so it can effectively simplify the assembly process and save time and assembly cost, thereby reducing the process and cost required for subsequent maintenance.

[0010] This is equivalent to providing a simplified disassembly and assembly process, making the laptop computer repairable and recyclable, thereby facilitating the achievement of the aforementioned sustainable conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a schematic diagram of a notebook computer according to an embodiment of the present invention;

[0012] Figure 2 yes Figure 1 Schematic diagram of some components of a laptop computer;

[0013] FIG. 3A to FIG. 3C Shown separately Figure 2 A partial enlarged view of some components;

[0014] Figure 4A Shown from another perspective Figure 2Some components of

[0015] Figure 4B Show Figure 4A An enlarged schematic diagram of a bridge circuit board;

[0016] Figure 5 Shown from another perspective Figure 2 some components of . DETAILED DESCRIPTION

[0017] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0018] Figure 1 is a schematic diagram of a laptop computer according to an embodiment of the present invention. Cartesian coordinates XYZ are also provided to facilitate component description. Figure 1 In this embodiment, the notebook computer 100 includes a body and an input module 130, wherein the body is a host of the notebook computer 100, which includes a first housing 110 and a second housing 120, and the input module 130 includes a keyboard 131 and a touch pad 132, which are respectively disposed on the first housing 110. Only the differences between the notebook computer 100 and the prior art will be described below, and the same parts as the prior art will not be described again.

[0019] Figure 2 yes Figure 1 This is a schematic diagram of some components of a laptop computer. The screen of the laptop computer 100 is omitted to facilitate identification of other components. FIG. 3A to FIG. 3C Shown separately Figure 2 A partial enlarged view of some components. Figure 4A Shown from another perspective Figure 2 some components of . Figure 4B Show Figure 4A Please refer to the enlarged diagram of the bridge circuit board. Figure 2 and Figure 4A In this embodiment, the notebook computer 100 further includes a first sub-circuit board 144, a main board 141, and a bridge circuit board 142. The first sub-circuit board 144 is disposed in the first housing 110. The input module 130 is disposed in the first housing 110 and electrically connected to the first sub-circuit board 144. The main board 141 is disposed in the second housing 120. The first housing 110 and the second housing 120 are assembled together so that the first sub-circuit board 144, the bridge circuit board 142, and the main board 141 are partially overlapped, and the first sub-circuit board 144 is electrically connected to the main board 141 via the bridge circuit board 142.

[0020] Furthermore, the laptop computer 100 also includes a second sub-circuit board 143 and at least one connector (a plurality of connectors 170 are shown here as examples, including a USB connector, an audio source connector or a card reader module, which are all packaged or soldered on the second sub-circuit board 143 to electrically connect the circuits on the board). The second sub-circuit board 143 is disposed on the second shell 120, and the connector 170 is disposed on the second sub-circuit board 143. When the first shell 110 and the second shell 120 are assembled together, the second sub-circuit board 143 is partially overlapped on the bridge circuit board 142, and the connector 170 is electrically connected to the motherboard 141 via the second sub-circuit board 143 and the bridge circuit board 142.

[0021] In detail, Figure 4A As shown, the first sub-circuit board 144 is disposed on the bottom surface of the first housing 110 to face the second housing 120 (equivalent to the negative Z-axis direction). The keyboard 131 and the touch pad 132 disposed in the first housing 110 are connected to the electrical connectors 144a and 144b of the first sub-circuit board 144 through electrical transmission members 131a and 132a, such as wires, FPCs (flexible printed circuits) or flat cables. Figure 2 , Figure 3C and Figure 4A The notebook computer 100 further includes a pogo pin connector 153, which is disposed on the third protrusion 142c of the bridge circuit board 142, and the aforementioned first sub-circuit board 144 also has a plurality of conductive pads 144c. Therefore, when the first sub-circuit board 144 is assembled to the second shell 120 along with the first shell 110, the first sub-circuit board 144 is overlapped on the third protrusion 142c and docked with the pogo pin connector 153 through the conductive pads 144c, so that the input module 130 can be electrically connected to the bridge circuit board 142 through the first sub-circuit board 144 and the pogo pin connector 153 (and the conductive pads 144c).

[0022] Furthermore, please refer to Figure 3A , Figure 3C and Figure 4A (or Figure 4B), the bridge circuit board 142 also has a protrusion 142a and a conductive array 2 142d located on the protrusion 142a, the main board 141 has a conductive array 3 141a located on the side edge, and the notebook computer 100 also includes a first interlayer connector 151 (such as PC Beam), which is electrically connected between the bridge circuit board 142 and the main board 141. Further, the first interlayer connector 151 is composed of a board body 151a and two conductive arrays 151b, wherein the two conductive arrays 151b are respectively arranged on two opposite surfaces of the board body 151a. Accordingly, when the first shell 110 and the second shell 120 are assembled, the protrusion 142a of the bridge circuit board 142 will also be overlapped on the main board 141 (such as Figure 2 As shown in FIG. 1 , the two conductive arrays 1 151b of the first interlayer connector 151 are respectively connected to the conductive arrays 2 142d and the conductive arrays 3 141a, so that the bridge circuit board 142 is electrically connected to the mainboard 141 through the first interlayer connector 151. In this way, following the electrical connection feature of the input module 130 being electrically connected to the bridge circuit board 142, the input module 130 can be smoothly electrically connected to the mainboard 141.

[0023] In this embodiment, the two conductive arrays 151b (see Figure 3C and Figure 4A ) are elastic piece arrays, and the conductive array 2 142d (seen in Figure 4A and Figure 4B ) and conductive array three 141a (see Figure 2 and Figure 3A ) are pad arrays.

[0024] On the other hand, please refer to Figure 3B , Figure 3C and Figure 4A The notebook computer 100 of this embodiment further includes a second mezzanine connector 152 (eg, PC Beam), which is electrically connected between the second sub-circuit board 143 and the bridge circuit board 142. Figure 3C and Figure 4A As shown, the second mezzanine connector 152 includes a second board body 152a and two conductive arrays 152b, and the two conductive arrays 152b are respectively disposed on two opposite surfaces of the second board body 152a and are electrically connected to each other. Correspondingly, the bridge circuit board 142 also has a second protrusion 142b, and the second protrusion 142b has a conductive array 142e, as shown in FIG. Figure 4B As shown, the second sub-circuit board 143 has a conductive array six 143a, and when the first shell 110 is assembled to the second shell 120, the two conductive arrays four 152b are respectively connected to the conductive array five 142e and the conductive array six 143a.

[0025] like Figure 3C and Figure 4A As shown, the two conductive arrays 152b are respectively spring arrays, and as shown in FIG. Figure 3B and Figure 4B As shown, the conductive array 5 142e and the conductive array 6 143a are pad arrays. Figure 2 As shown in FIG. 1 , the connector 170 can be electrically connected to the bridge circuit board 142 through the second sub-circuit board 143 and the second interlayer connector 152. At the same time, because the bridge circuit board 142 and the main board 141 are electrically connected to each other through the first interlayer connector 151, the connector 170 and the second sub-circuit board 143 can be electrically connected to the main board 141 through the bridge circuit board 142.

[0026] Please refer to Figure 2 Through the corresponding connection relationship between the first sub-circuit board 144, the second sub-circuit board 143, the bridge circuit board 142 and the main board 141, the input module 130 and the connector 170 can be smoothly electrically connected to the main board 141. In particular, from the corresponding relationship of the above components, it can be found that the notebook computer 100 of this embodiment can be assembled in an intuitive manner due to the stacking relationship of the above components, that is, the components can be assembled by stacking to achieve the effects of structural assembly and electrical connection at the same time.

[0027] First, if Figure 4A As shown, the first sub-circuit board 144 is disposed at the bottom of the first housing 110, and thus the keyboard 131 and the touch panel 132 can be assembled and the electrical transmission components 131a and 132a can be plugged into the electrical connectors 144a and 144b to complete the assembly of the semi-finished product shown. Figure 2 As shown, the main board 141 and the second sub-circuit board 143 are first assembled on the second housing 120. Then, the semi-finished product consisting of the first mezzanine connector 151, the second mezzanine connector 152, the bridge circuit board 142, the first housing 110 and related components can be stacked on the second housing 120 one by one, so that different parts of the bridge circuit board 142 (protrusion 1 142a, protrusion 2 142b and protrusion 3 142c) are connected to the main board 141, the second sub-circuit board 143 and the first sub-circuit board 144 respectively.

[0028] Figure 5 Shown from another perspective Figure 2 Please refer to Figure 5As described above, the assembly relationship among the main board 141, the bridge circuit board 142, the second sub-circuit board 143 and the first sub-circuit board 144 is such that the bridge circuit board 142 after assembly is substantially located between the first sub-circuit board 144 and the main board 141 along the Z-axis, and between the first sub-circuit board 144 and the second sub-circuit board 143. The circuit boards in the system host are connected to each other in accordance with the different modules.

[0029] Please refer to Figure 2 , Figure 3C and Figure 4A (or Figure 5 ), in order to facilitate the bridging of the above-mentioned components, the bridging circuit board 142 of the present embodiment further has a pair of bosses 142f, which are located on opposite sides of the spring pin connector 153, and the first sub-circuit board 144 further has a pair of guide grooves 144d, so that the bosses 142f move into the guide grooves 144d along the Y-axis to produce a locking effect along the Z-axis, so as to facilitate the connection between the spring pin connector 153 and the conductive pad 144c and avoid falling off.

[0030] Furthermore, please refer to Figure 3C and Figure 4A And compare Figure 3A , Figure 3B or Figure 4B In this embodiment, the first mezzanine connector 151 further includes positioning posts 151c, located on two opposite surfaces of the first board body 151a, and used to be positioned between the first protrusion 142a of the bridge circuit board 142 and the main board 141, and the second mezzanine connector 152 further includes positioning posts 152c, located on two opposite surfaces of the second board body 152a, and used to be positioned between the second protrusion 142b and the second sub-circuit board 143. Figure 2 As shown, the notebook computer 100 further includes a plurality of locking accessories C1 - C4 (such as screws) to lock the bridge circuit board 142 , the main board 141 and the second sub-circuit board 143 together after the aforementioned positioning is completed.

[0031] It should also be mentioned that, by comparing the first mezzanine connector 151 and the second mezzanine connector 152 of this embodiment, it can be found that the number of constituent units of the conductive array 1 151b is greater than (more than) the number of constituent units of the conductive array 4 152b. The reason is that the bridge circuit board 142 is responsible for connecting the electrical signals of the keyboard 131, the touch panel 132 and the connector 170 to the main board 141. Therefore, the signal transmission amount that the first mezzanine connector 151 is responsible for is actually the sum of the signal transmission amounts of the spring pin connector 153 and the second mezzanine connector 152.

[0032] In addition, since the connector 170 is still involved in high-speed signal transmission, while the keyboard 131 and the touch pad 132 are not, the connector 170 performs high-speed signal transmission with the mainboard 141 through the second sub-circuit board 143, the second mezzanine connector 152, the bridge circuit board 142 and the first mezzanine connector 151. In other words, in order to maintain the ability of the connector 170 to perform high-speed signal transmission, the first mezzanine connector 151 and the second mezzanine connector 152 of this embodiment cannot be replaced by the spring pin connector 153.

[0033] In summary, in the above embodiments of the present invention, the configuration of the components of the system host of the notebook computer, especially the assembly configuration of the circuit board, is matched with the assembly method of the first shell and the second shell of the system host, and a stacking assembly is adopted to effectively simplify the assembly process, wherein the first shell and the keyboard, touchpad and first sub-circuit board assembled thereon are regarded as a group of semi-finished products, and the second shell and the mainboard and second sub-circuit board configured thereon are regarded as another group of semi-finished products. When the above semi-finished products are completed, they can be connected between the above two groups of semi-finished products through a bridge circuit board, so as to complete the electrical connection relationship of multiple circuit boards while assembling the structure, without the need to carry out wire management and connector plugging operations on wires or cables as in the above prior art.

[0034] At the same time, because the aforementioned structural assembly adopts stacking assembly, the user does not need to worry about whether to reserve the space required for the connector and the wire (or cable) to be plugged in. In other words, the laptop computer of the present invention can be combined one by one in an intuitive assembly method due to the stacking assembly components, so it can effectively simplify the assembly process and save time and assembly cost, and thus affect the process and cost required for subsequent maintenance. This is equivalent to providing a simplified disassembly and assembly process, so that the laptop computer has a repairable and regenerative nature, which is conducive to achieving the aforementioned sustainable conditions.

[0035] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A notebook computer, characterized in that: include: a first shell; A first sub-circuit board is arranged in the first housing An input module, disposed in the first housing and electrically connected to the first sub-circuit board; a second shell; A mainboard, disposed in the second housing; as well as A bridge circuit board, wherein the first shell and the second shell are assembled together so that the first sub-circuit board, the bridge circuit board and the main board are partially stacked together, and the first sub-circuit board is electrically connected to the main board via the bridge circuit board.

2. The notebook computer according to claim 1, characterized in that: It also includes a first interlayer connector electrically connected between the bridge circuit board and the main board.

3. The notebook computer according to claim 1, characterized in that: It also includes a second sub-circuit board and at least one connector, the second sub-circuit board is arranged in the second shell, and the connector is arranged on the second sub-circuit board. When the first shell and the second shell are assembled together, the second sub-circuit board is partially overlapped on the bridge circuit board, and the connector is electrically connected to the main board via the second sub-circuit board and the bridge circuit board.

4. The notebook computer according to claim 3, characterized in that: It also includes a second interlayer connector electrically connected between the second sub-circuit board and the bridge circuit board.

5. The notebook computer according to claim 4, characterized in that: The bridge circuit board is in a convex shape and has a convex portion one, a convex portion two and a convex portion three. The convex portion one is partially overlapped on the main board and is electrically connected to the main board through a first interlayer connector. The convex portion two is partially overlapped on the second sub-circuit board and is electrically connected to the second sub-circuit board through the second interlayer connector. The first sub-circuit board is overlapped on the convex portion three and is electrically connected to the bridge circuit board through a spring pin connector.

6. The notebook computer according to claim 5, characterized in that: The first mezzanine connector includes a board body 1 and two conductive arrays 1, the two conductive arrays 1 are respectively arranged on two opposite surfaces of the board body 1 and are electrically connected to each other, the protrusion 1 has a conductive array 2, the main board has a conductive array 3, and the two conductive arrays 1 are respectively connected to the conductive array 2 and the conductive array 3.

7. The notebook computer according to claim 6, characterized in that: The two conductive arrays 1 are spring arrays, and the conductive array 2 and the conductive array 3 are pad arrays.

8. The notebook computer according to claim 5, characterized in that: The first mezzanine connector has a conductive array, the second mezzanine connector has another conductive array, and the number of constituent units of the conductive array is greater than the number of constituent units of the another conductive array.

9. The notebook computer according to claim 5, characterized in that: The at least one connector performs high-speed signal transmission with the mainboard through the second sub-circuit board, the second mezzanine connector, the bridge circuit board and the first mezzanine connector.

10. The notebook computer according to claim 5, characterized in that: The second mezzanine connector includes a board body 2 and two conductive arrays 4, the two conductive arrays 4 are respectively arranged on two opposite surfaces of the board body 2 and are electrically connected to each other, the protrusion 2 has a conductive array 5, the second sub-circuit board has a conductive array 6, and the two conductive arrays 4 are respectively connected to the conductive array 5 and the conductive array 6.

11. The notebook computer according to claim 10, characterized in that: The two conductive arrays four are spring arrays, and the conductive array five and the conductive array six are pad arrays.

12. The notebook computer according to claim 1, characterized in that: A spring pin connector is also included, which is electrically connected between the first sub-circuit board and the bridge circuit board.

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