Display panel bending method, display module and electronic equipment

Abstract

The invention provides a display panel bending method, a display module and electronic equipment. The bending method comprises the steps that before the display panel is bent, a delayed curing layer is prepared on the surface of a to-be-bent part; performing curing condition stimulation on the delayed curing layer; and before the delayed curing layer is cured, the to-be-bent part is bent, and a bent part is obtained. According to the embodiment of the invention, the delayed curing layer is prepared on the surface of the to-be-bent part of the display panel, so that the delayed curing layer can be bent before being cured, and larger bending stress is avoided; the storage modulus can be greatly improved after the delayed curing layer is completely cured, the impact and extrusion resisting effect can be achieved, meanwhile, the bending form of the bending part can be further fixed, and the influence of bending stress extension of the dynamic bending part of the main screen on the bending part is reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel bending method, a display module and an electronic device. Background Art

[0002] As people's requirements for terminals increase, the use of front and back double-sided screens in terminals has become a new trend. In double-sided screen technology, the main screen is generally larger and foldable, while the secondary screen is smaller and its display surface is on the side away from the user. In order to reduce the number of components in the whole machine and reserve a larger battery space, the secondary screen is usually extended from the main screen. The circuit between the main and secondary screens connects the two screens, and the main and secondary screens are installed and fixed on both sides of the whole machine by bending the circuit area.

[0003] However, in the prior art, there are still some problems with the solution of extending a secondary screen on the main screen. Summary of the invention

[0004] The embodiments of the present application provide a display panel bending method, a display module and an electronic device, so as to improve the problems existing in the existing display modules.

[0005] In a first aspect, a display module is provided, comprising: a display panel, comprising a first display portion, a second display portion, and a bending portion located between the first display portion and the second display portion; and a delayed curing layer located on a surface of the bending portion.

[0006] In combination with the first aspect, in certain implementations of the first aspect, the delayed solidification layer is obtained by subjecting the display panel to a solidification condition stimulation treatment before the display panel is bent to obtain the bent portion, and solidifying after the bent portion is obtained.

[0007] In combination with the first aspect, in certain implementations of the first aspect, the delayed curing layer is on the same side as the non-display side of the display panel.

[0008] In combination with the first aspect, the storage modulus of the delayed solidification layer is greater than or equal to 2 MPa.

[0009] In combination with the first aspect, in certain implementations of the first aspect, the delayed curing layer includes an ultraviolet light delayed curing glue.

[0010] In combination with the first aspect, in certain implementations of the first aspect, the curing conditioned stimulus treatment is ultraviolet irradiation treatment.

[0011] In a second aspect, a display panel bending method is provided, wherein the display panel includes a first display portion, a second display portion, and a portion to be bent located between the first display portion and the second display portion; the bending method includes:

[0012] Before the display panel is bent, a delayed curing layer is prepared on the surface of the portion to be bent;

[0013] Applying curing conditioned stimulation to the delayed curing layer;

[0014] Before the delayed solidification layer is completely solidified, the portion to be bent is bent to obtain the bent portion.

[0015] In conjunction with the second aspect, in certain implementations of the second aspect, preparing a delayed solidification layer on the surface of the portion to be bent includes:

[0016] A UV light delayed curing adhesive is attached to the surface of the portion to be bent.

[0017] In conjunction with the second aspect, in certain implementations of the second aspect, performing curing condition stimulation on the delayed curing layer includes:

[0018] The UV delayed curing adhesive is exposed to ultraviolet light.

[0019] In combination with the second aspect, in certain implementations of the second aspect, before the delayed solidification layer is completely solidified, the portion to be bent is bent to obtain the bent portion, comprising:

[0020] Within one minute after being stimulated by the curing condition, the portion to be bent is bent, and after being left to stand and cure, a bent portion is obtained.

[0021] In combination with the second aspect, in certain implementations of the second aspect, the storage modulus of the delayed solidification layer after curing is greater than or equal to 2 MPa.

[0022] In combination with the second aspect, in certain implementations of the second aspect, before being stimulated by the curing conditions, the storage modulus of the delayed curing layer is less than or equal to 200 KPa.

[0023] In combination with the second aspect, in certain implementations of the second aspect, the portion to be bent includes a first surface and a second surface arranged opposite to each other, the first surface is located on the display side of the display panel, and the second surface is located on the non-display side of the display panel; preparing a delayed solidification layer on the surface of the portion to be bent includes preparing a delayed solidification layer on the second surface of the portion to be bent.

[0024] In a third aspect, an electronic device is provided, comprising any one of the display modules described above.

[0025] The present application provides a display panel bending method, a display module and an electronic device. The bending method comprises: before the display panel is bent, preparing a delayed solidification layer on the surface of the portion to be bent; subjecting the delayed solidification layer to a curing condition stimulation; before the delayed solidification layer is cured, bending the portion to be bent to obtain the bent portion.

[0026] In the embodiment of the present application, a delayed curing layer is prepared on the surface of the portion to be bent of the display panel, so that bending can be performed before the delayed curing layer is cured, thereby avoiding the generation of large bending stress; and the storage modulus of the delayed curing layer will be greatly improved after it is completely cured, which can play an effect of resisting impact and extrusion, and at the same time help to further fix the bending shape of the bending portion, and reduce the influence of the extension of the bending stress of the dynamic bending portion of the main screen on the bending portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0028] Figure 1 FIG. 1 is a top view of a display panel in an embodiment of the present application.

[0029] Figure 2 FIG. 4 is a process flow chart of a display panel bending method in one embodiment of the present application.

[0030] Figure 3 It is a side view of a display module in yet another embodiment of the present application.

[0031] Figure 4a It is a side view of a display module in yet another embodiment of the present application.

[0032] Figure 4b for Figure 4a FIG. 1 is a top view of the display module in a direction from the second display portion 200 to the first display portion 100. FIG.

[0033] Figure 4c for Figure 4a The middle display module is a top view of the display module in a direction from the first display portion 100 to the second display portion 200.

[0034] Figure 5a It is a side view of a display module in yet another embodiment of the present application.

[0035] Figure 5b for Figure 5a The display module is shown in a top view.

[0036] Figure 6 It is a side view of a display module in yet another embodiment of the present application. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating examples of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application. The features and exemplary embodiments of various aspects of the present application will be described in detail below.

[0038] As described in the background technology, there are still some problems with the double-sided screen solution with the secondary screen extending from the main screen. Specifically, in the double-sided screen solution with the secondary screen extending from the main screen, the bending area between the main and secondary screens is relatively fragile and needs to be covered with a material with a certain storage modulus to resist extrusion and impact. However, the bending performance of traditional buffer materials is poor and a large bending stress will be generated after bending. The stress extension will affect the installation and fixation of the secondary screen and the bending of the main screen during use, thereby affecting the stability and service life of the display module.

[0039] In view of this, the present application provides a display panel bending method, a display module and an electronic device, so as to improve the problem of poor stability of the bending portion of the display module in the existing dual-screen technology.

[0040] Figure 1 FIG. 1 is a top view of a display panel in an embodiment of the present application. Figure 1 As shown, the display panel 10 includes a first display portion 100 and a second display portion 200 , and a to-be-bent portion 300 located between the first display portion 100 and the second display portion 200 .

[0041] Figure 2 1 is a process flow chart of a display panel bending method in an embodiment of the present application, and the specific steps are described as follows.

[0042] S110: before the display panel is bent, a delayed curing layer is prepared on the surface of the portion to be bent.

[0043] S120: performing curing conditional stimulation on the delayed curing layer.

[0044] S130: before the delayed solidification layer is completely solidified, the portion to be bent is bent to obtain the bent portion.

[0045] In this embodiment, a delayed curing layer is prepared on the surface of the portion to be bent of the display panel, so that bending can be performed before the delayed curing layer is cured, thereby avoiding the generation of large bending stress; and the storage modulus of the delayed curing layer will be greatly improved after it is completely cured, which can play a role in resisting impact and extrusion, and at the same time help to further fix the bending shape of the bending portion, thereby improving the stability and service life of the display module.

[0046] The embodiments of the present application utilize the characteristics of delayed curing glue. For example, delayed curing glue usually does not cure immediately, but needs to be stimulated by corresponding external conditions before it starts to cure. In addition, the curing rate of delayed curing glue is usually slower than that of fast curing glue, which means that users can have more time to adjust or handle the bonded objects before the glue starts to cure. For example, in this embodiment, since the delayed curing glue cures slowly after the delayed curing layer is stimulated by the curing conditions, the bending portion still has good bending performance. It can be seen that after the delayed curing layer is stimulated by the curing conditions, before the delayed curing layer is completely cured, the bending portion is bent to obtain the bending portion, which can avoid the generation of large bending stress after bending.

[0047] In step 110, before the display panel is bent, a delayed solidification layer is prepared on the surface of the portion to be bent. The specific position of the delayed solidification layer is as follows: Figure 3 As shown, Figure 3 FIG. 1 is a side view of a display module in another embodiment of the present application. Figure 3 As shown, the display module includes a display panel 10 and a delayed curing layer 20. The display panel 10 includes a first display portion 100 and a second display portion 200, and a portion to be bent 300 located between the first display portion 100 and the second display portion 200, and the delayed curing layer 20 is located on the surface of the portion to be bent 300.

[0048] In one embodiment, a delayed curing layer 20 is prepared on the surface of the portion to be bent 300 , including attaching an ultraviolet light delayed curing adhesive on the surface of the portion to be bent 300 .

[0049] In one embodiment, the UV delayed curing glue uses ultraviolet rays to trigger the curing process, and unlike ordinary UV curing glue, the UV delayed curing glue does not cure quickly immediately after being exposed to ultraviolet rays, but has a certain induction period, that is, the time to delay the curing reaction. This delayed curing characteristic gives the UV delayed curing glue some unique advantages in application. First, it provides users with a longer operating time, allowing necessary adjustments and alignment after bonding two parts. Secondly, due to the characteristics of delayed curing, UV delayed curing glue can better adapt to some application scenarios that require gradual curing, such as laminated composite materials, multi-layer coatings, etc. In addition, it also has the advantage of being able to be precisely controlled. By adjusting the parameters of ultraviolet rays, users can accurately control the degree of curing of the glue to meet specific bonding requirements.

[0050] In this embodiment, since the delayed curing glue cures slowly after the delayed curing layer is irradiated with ultraviolet light, the bending portion still has good bending performance. It can be seen that after the delayed curing layer is irradiated with ultraviolet light, before the delayed curing layer is completely cured, the bending portion is bent to obtain the bending portion, which can avoid generating large bending stress after bending.

[0051] In one embodiment, the components of the UV delayed curing adhesive include but are not limited to liquid acrylic resin, modified acrylic resin and solid acrylic resin filler. Among them, acrylate is the main component of the UV curing adhesive, and its structure contains double bonds, which can undergo free radical polymerization. The UV delayed curing adhesive also includes a photoinitiator and a diluent. The photoinitiator can absorb ultraviolet rays and convert them into chemical energy, promoting free radical polymerization of the double bonds in the acrylate. The diluent is a component added to control the viscosity, volatility and other properties of the UV delayed curing adhesive, which can affect the fluidity of the glue and the thickness of the film and other properties.

[0052] In one embodiment, the delayed curing layer 20 may also include types other than ultraviolet light delayed curing adhesive, such as infrared delayed curing adhesive, moisture delayed curing adhesive, anaerobic delayed curing adhesive, and the like.

[0053] In one embodiment, the delayed curing layer 20 includes an infrared delayed curing glue. The infrared delayed curing glue will not start the curing process until it is exposed to infrared radiation. This glue is flowable in the initial state, allowing the user to apply and adjust between the parts that need to be bonded. When exposed to infrared radiation, the colloid will begin to react chemically, causing it to gradually cure and enhance the bonding strength. The main application of this glue is in scenarios where the bonding time needs to be precisely controlled and adjusted. By controlling the exposure time and intensity of the infrared light, the user can accurately control the curing speed and degree of the glue. This is very important in certain process processes, such as the assembly of electronic components, the maintenance of medical equipment, or the bonding in artistic creation. In addition, infrared delayed curing glue has some other advantages, such as reducing environmental pollution. Compared with traditional wet curing glue, infrared delayed curing glue does not require additional chemicals during the curing process, reducing environmental pollution.

[0054] In one embodiment, the delayed curing layer 20 includes a moisture delayed curing glue. Moisture delayed curing glue is a special adhesive that starts the curing process after contacting moisture. Such adhesives are usually used in applications where adjustability needs to be maintained for a long time because they have a certain "latency" or delayed curing characteristics before contacting moisture. The main feature of moisture delayed curing glue is that they remain stable in a dry environment and do not cure quickly. However, when these adhesives are exposed to moisture, they will start a chemical reaction and gradually cure. This curing process is usually slower than traditional UV curing or thermal curing, thus providing users with a longer working time. Due to this characteristic of moisture delayed curing glue, they are widely used in many fields. For example, they can be used for structural bonding in industrial fields such as automobiles, aviation, and ships, because these fields need to maintain the adjustability of components for a long time so that they can be accurately positioned and fixed during the installation process.

[0055] In one embodiment, the delayed curing layer 20 includes an anaerobic delayed curing adhesive. An anaerobic delayed curing adhesive is a special adhesive that starts the curing process in an oxygen-free environment. This adhesive is usually used in bonding situations where oxygen interference needs to be prevented because it can only be effectively cured in the absence of oxygen. The main feature of anaerobic delayed curing adhesives is that they remain stable in the presence of oxygen and do not cure quickly. However, when these adhesives are applied to an anaerobic environment or oxygen is excluded, they begin a chemical reaction and gradually cure. This curing process is usually slower than traditional wet curing or heat curing, providing users with a longer working time. Anaerobic delayed curing adhesives are used in many fields, especially in sealing and bonding situations where oxygen interference needs to be prevented. For example, they are often used in industrial applications such as thread locking, pipe connections, flange sealing, etc. to ensure reliable bonding and sealing effects under anaerobic conditions.

[0056] In step 120 , the delayed curing layer 20 attached to the surface of the portion to be bent 300 is subjected to curing condition stimulation.

[0057] In one embodiment, the curing condition stimulation of the delayed curing layer 20 includes: irradiating the ultraviolet light delayed curing adhesive with ultraviolet light, such as Figure 3 As shown, the height, time and light intensity of ultraviolet irradiation all have a corresponding influence on the curing rate of the delayed curing layer 20. The curing time and curing degree have a corresponding influence. In actual production, it is necessary to select appropriate ultraviolet irradiation process parameters according to actual conditions.

[0058] In one embodiment, the portion to be bent 300 includes a first surface A and a second surface B that are arranged opposite to each other, the first surface A is located on the display side of the display panel, and the second surface B is located on the non-display side of the display panel. Preparing the delayed solidification layer 20 on the surface of the portion to be bent 300 includes preparing the delayed solidification layer 20 on the second surface B of the portion to be bent 300.

[0059] In this embodiment, a delayed curing layer 20 is prepared on the surface of the side of the bending portion 300 that is on the same side as the non-display side B of the display panel. The characteristics of the delayed curing glue can be used to achieve curing condition stimulation such as energy light irradiation before bending, thereby avoiding the situation where the curing condition stimulation cannot be performed after the bending portion 300 is bent.

[0060] In one embodiment, before being stimulated by the curing conditions, the storage modulus of the delayed curing layer is less than or equal to 200Kpa, such as 180Kpa, 150Kpa, etc. Among them, the storage modulus, also known as the elastic modulus, describes the ability of the material to store energy when subjected to periodic stress, which reflects the elasticity and stiffness of the material. The bending performance refers to the performance of the material when subjected to bending force, including bending strength, bending toughness, etc. The storage modulus is an important indicator of the bending performance of the material. In this embodiment, the size of the storage modulus of the delayed curing layer characterizes the bending performance of the delayed curing layer. When the storage modulus is small, the delayed curing layer has good bending performance.

[0061] In step S130 , before the delayed solidification layer 20 is completely solidified, the portion to be bent 300 is bent to obtain a bent portion 400 .

[0062] In this embodiment, according to the characteristics of the delayed curing adhesive, before the delayed curing layer 20 is completely cured, its storage modulus is smaller than that in the completely cured state, so that the portion to be bent 300 can still have good bending performance and can avoid generating large bending stress after bending. It should be noted that the "completely cured state" refers to the state where the curing process of the delayed curing layer 20 is completed and its storage modulus no longer changes.

[0063] In one embodiment, before the delayed solidification layer is completely solidified, the portion to be bent is bent to obtain the bent portion, comprising:

[0064] Within one minute after being stimulated by the curing condition, the portion to be bent is bent, and after being left to stand and cure, a bent portion is obtained.

[0065] The time interval between the bending action and the curing condition stimulus is set in this way because, although the delayed curing adhesive cures slowly after being stimulated by the curing condition, it will complete the full curing within a certain period of time. The specific curing time is related to the composition of the delayed curing adhesive and the external curing conditions. The relationship between the storage modulus and time of the delayed curing adhesive usually shows a gradually increasing trend. The storage modulus describes the ability of a material to resist deformation when subjected to force. For adhesives, the storage modulus reflects its strength and stiffness after curing. In the curing process of the delayed curing adhesive, the adhesive is in a relatively soft, uncured state in the initial stage, and the storage modulus is relatively low. As the curing time increases, the chemical reaction inside the adhesive gradually proceeds, and the molecular chains gradually cross-link and strengthen, resulting in a gradual increase in the storage modulus of the adhesive.

[0066] Therefore, according to the operating experience and equipment conditions of conventional production processes, this embodiment stipulates that the bending portion 300 is bent within one minute after being stimulated by the solidification conditions, which can ensure that the bending portion 300 has better bending performance before the bending action is performed.

[0067] In one embodiment, after complete curing, the storage modulus of the delayed curing layer is greater than or equal to 2Mpa, such as 2.2Mpa, 2.5Mpa, and the like. The storage modulus of the delayed curing layer after complete curing is significantly increased relative to that before the start of curing. In general, there is a certain relationship between the storage modulus of a material and its bending performance. Materials with high storage modulus usually have higher bending strength and stiffness, which means that they are less likely to deform or damage when subjected to bending forces. Therefore, such materials perform better in applications that need to withstand repeated bending or continuous bending stress. Therefore, the delayed curing layer 20 has a larger storage modulus after complete curing, which can resist impact and extrusion; at the same time, it helps to further fix the bending shape of the bending portion, thereby improving the stability and service life of the display module.

[0068] The present application also provides a display module, such as Figure 4a , Figure 4b and Figure 4c shown. Figure 4a This is a side view of a display module in another embodiment of the present application. Figure 4b for Figure 4a The top view of the display module in the direction from the second display unit 200 to the first display unit 100, Figure 4c for Figure 4a The middle display module is a top view of the display module in a direction from the first display portion 100 to the second display portion 200.

[0069] like Figure 4a , Figure 4b and Figure 4cAs shown, the display module includes a display panel 10 and a delayed curing layer 20. The display panel 10 includes a first display portion 100 and a second display portion 200, and a bending portion 400 located between the first display portion 100 and the second display portion 200. The delayed curing layer 20 is located on the surface of the bending portion 400.

[0070] In one embodiment, the storage modulus of the delayed solidification layer 20 is greater than or equal to 2 Mpa. In this embodiment, the storage modulus of the delayed solidification layer 20 is relatively large, which can resist impact and extrusion, and at the same time help to further fix the bending shape of the bending portion 400, thereby improving the stability and service life of the display module.

[0071] In one embodiment, the delayed curing layer 20 is obtained by subjecting the display panel 10 to a curing condition stimulation treatment before the bent portion 400 is obtained by being bent, and then being cured after the bent portion 400 is obtained.

[0072] In one embodiment, the delayed curing layer 20 is on the same side as the non-display side of the display panel 10. This embodiment utilizes the characteristics of the delayed curing adhesive to implement curing condition stimulation treatment on the delayed curing layer before bending, thereby reducing the process difficulty.

[0073] In one embodiment, the first display portion 100 is a sub-screen of the display panel 10, and the second display portion 200 is a main screen of the display panel 10. Once the bending portion 400 is formed, the bending shape does not need to be changed, that is, the bending portion 400 is a fixed bending area and does not need to be deformed during user use. In this embodiment, the storage modulus of the delayed solidification layer 20 is large, which can play an effect of resisting impact and extrusion, and also helps to further fix the bending shape of the bending portion 400.

[0074] It can be understood that the first display unit 100 is a sub-screen of the display panel 10, the second display unit 200 is a main screen of the display panel 10, the bending portion 400 is used to connect the first display unit 100 and the second display unit 200, the first display unit 100 and the second display unit 200 are located on opposite sides, and illustratively, the first display unit 100 as a sub-screen has a display area smaller than the display area of ​​the second display unit 200. In actual use, the second display unit 200 can be folded, and after folding, the second display unit 200 does not display, and only the first display unit 100 is used for display; when the second display unit 200 needs to be displayed, the folded state of the second display unit 200 is canceled, and the full screen of the second display unit 200 can be used for display, and at this time, the first display unit 100 can be displayed or not. It should be noted that when folded, the bending area of ​​the second display unit 200 belongs to the display area.

[0075] It is understandable that after the second display portion 200 is folded, the first display portion 100 can be used to display time, weather, temperature, etc., or can be used to display message reminders, etc., which will not be elaborated herein.

[0076] In one embodiment, the first display unit 100 and the second display unit 200 of the display module are controlled by one driving circuit, which can simplify the circuit design and reduce the cost. In this case, the display content and operation of the main screen and the auxiliary screen are uniformly managed and controlled by this driving circuit.

[0077] Figure 5a This is a side view of a display module in another embodiment of the present application. Figure 5b for Figure 5a The top view of the display module is shown in FIG. Figure 5a As shown, Figure 4a In comparison, the display module in this embodiment also includes a dynamic bending portion 500, which is a part of the second display portion 200. During the use of the user, it needs to be bent and stretched repeatedly. During the repeated actions of the dynamic bending portion 500, a certain stress will be generated, which will have a certain pulling effect on the bending portion 400. The delayed solidification layer 20 in this embodiment has a large storage modulus. In addition to resisting impact and extrusion and fixing the bending shape of the bending portion 400, it can also reduce the influence of the bending stress extension generated by the dynamic bending portion 500 on the bending portion 400, thereby further improving the stability and service life of the display module.

[0078] In one embodiment, the delayed curing layer 20 includes an ultraviolet light delayed curing adhesive.

[0079] In one embodiment, the curing conditioning stimulus is ultraviolet irradiation treatment.

[0080] In one embodiment, the delayed curing layer 20 includes infrared delayed curing adhesive, moisture delayed curing adhesive, anaerobic delayed curing adhesive, and the like.

[0081] In one embodiment, the curing condition stimulus includes infrared irradiation, moisture treatment, or an anaerobic environment with low oxygen concentration.

[0082] In one embodiment, the display module further includes some other module film layers, such as Figure 6 shown. Figure 6 FIG. 1 is a side view of a display module in another embodiment of the present application. Figure 6As shown, the display module also includes a polarizer 30, an optical glue 40 and a cover plate 50 which are sequentially stacked on the display side surfaces of the first display unit 100 and the second display unit 200. Among them, the polarizer 30 can reduce the reflection and scattering of light and improve the clarity of the picture. The cover plate 50 is the outermost structure of the display module, usually made of glass or plastic, and its function is to protect the components inside the module from the influence of the external environment. The optical glue 40 is located between the polarizer 30 and the cover plate 50, and plays the role of bonding and fixing two adjacent film layers, which can ensure the close fit of the two film layers and avoid the generation of air or bubbles. Here, the optical glue 40 is a fast-curing glue, which is different from the composition and function of the delayed curing layer 20.

[0083] The present application also provides an electronic device, comprising any of the display modules described above.

[0084] In one embodiment, the electronic device may be a double-sided screen mobile phone, an e-reader, a tablet computer, etc. Double-sided screen technology is to connect two screens, realize information sharing and collaborative operation and other functions through data transmission and interactive operation, and the two screens can realize interactive communication.

[0085] It should be noted that in the drawings of the present application document, the sizes of layers and regions may be exaggerated for clarity of illustration. It is also understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it is understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it may be the only layer between the two layers or two elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0086] In addition, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0087] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0088] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A display module, characterized in that: include: The display panel comprises a first display portion and a second display portion, and a bending portion located between the first display portion and the second display portion; as well as The delayed solidification layer is located on the surface of the bending portion.

2. The display module according to claim 1, characterized in that: The delayed solidification layer is obtained by subjecting the display panel to a solidification condition stimulation treatment before the display panel is bent to obtain the bent portion, and solidifying after the bent portion is obtained; Preferably, the delayed curing layer is on the same side as the non-display side of the display panel; Preferably, the storage modulus of the delayed solidification layer is greater than or equal to 2 MPa.

3. The display module according to claim 2, characterized in that: The delayed curing layer includes an ultraviolet light delayed curing glue; Preferably, the curing condition stimulation treatment is ultraviolet irradiation treatment.

4. A display panel bending method, characterized in that: The display panel includes a first display portion and a second display portion, and a portion to be bent between the first display portion and the second display portion; the bending method includes: Before the display panel is bent, a delayed curing layer is prepared on the surface of the portion to be bent; Performing curing conditional stimulation on the delayed curing layer; Before the delayed solidification layer is completely solidified, the portion to be bent is bent to obtain a bent portion.

5. The display panel bending method according to claim 4, characterized in that: The method of preparing a delayed solidification layer on the surface of the portion to be bent comprises: Adhere ultraviolet light delayed curing glue on the surface of the portion to be bent; Preferably, the curing condition stimulation of the delayed curing layer comprises: The ultraviolet light delayed curing adhesive is irradiated with ultraviolet light.

6. The display panel bending method according to claim 4, characterized in that: The step of bending the portion to be bent before the delayed solidification layer is completely solidified to obtain the bent portion comprises: Within one minute after being stimulated by the curing conditions, the portion to be bent is bent, and then left to stand and cure to obtain a bent portion.

7. The display panel bending method according to claim 6, characterized in that: After curing, the storage modulus of the delayed curing layer is greater than or equal to 2 MPa.

8. The display panel bending method according to claim 4, characterized in that: Before being stimulated by the curing conditions, the storage modulus of the delayed curing layer is less than or equal to 200 KPa.

9. The display panel bending method according to claim 4, characterized in that: The to-be-bent portion comprises a first surface and a second surface which are arranged opposite to each other, wherein the first surface is located at a display side of the display panel, and the second surface is located at a non-display side of the display panel; The method of preparing a delayed solidification layer on the surface of the portion to be bent comprises: The delayed solidification layer is prepared on the second surface of the portion to be bent.

10. An electronic device, characterized in that: A display module comprising any one of claims 1 to 3.

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