Annealing method and annealing equipment

Abstract

The invention relates to the technical field of semiconductors, and provides an annealing method and annealing equipment, and the annealing method comprises the steps: transferring a substrate to a motion platform of the annealing equipment, and determining an initial circle center coordinate of the substrate; arranging a displacement sensor above the motion platform, wherein the displacement sensor is used for measuring the distance relative to the substrate on the motion platform; the motion platform and / or the displacement sensor move along the horizontal direction, at least three abrupt change positions of the substrate are identified through the distance, and the heights of at least three leveling positions are measured on the upper surface of the substrate on the inner side of the edge of the substrate; the centering deviation of the substrate is determined through the abrupt change position; and determining the leveling error of the substrate through the leveling position height. According to the configuration, camera image acquisition is not relied on in the alignment process, and focusing, leveling and secondary alignment functions are realized only by using the displacement sensor, so that the installation space of the sensor in the equipment can be saved, and the equipment cost is reduced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to an annealing method and annealing equipment. Background Art

[0002] Annealing is an important process in semiconductor manufacturing. Annealing not only helps optimize the microstructure and physical properties of materials, but also plays a decisive role in the overall performance and reliability of semiconductors. For example, annealing can repair lattice defects, promote the distribution of impurities, enhance material stability, and improve electrical properties.

[0003] The annealing process can be laser annealing, which uses a concentrated laser beam to locally heat the material to an extremely high temperature. A laser beam of a specific wavelength and power is focused by a lens and scanned on the target surface to perform local instantaneous heating. The time the target area is kept at a high temperature is adjusted as needed, and then the target area is quickly cooled to room temperature.

[0004] In the annealing process, the substrate is generally transferred to the annealing equipment by a robot. When the substrate posture accuracy requirement is not high, the substrate can be pre-aligned through the pre-alignment platform. When the substrate is transferred to the annealing equipment by the robot, there is no need to adjust the substrate accuracy for the second time. When the substrate posture accuracy requirement is high, a camera is usually set on the motion platform of the annealing equipment to measure the edge of the substrate and complete the alignment step again. Regardless of whether the second alignment step is performed, it is necessary to use a displacement sensor to measure several calibration points on the upper surface of the substrate for global leveling.

[0005] It can be seen that in the existing annealing process, a camera is required to complete the second alignment step, and a displacement sensor is required to complete the global leveling step, which requires the installation of at least two sensors. This not only increases the equipment installation space, complicates the measurement process, but also increases the equipment cost; and for transparent or translucent substrates, the camera's data acquisition effect is poor, resulting in large positioning errors.

[0006] Therefore, the present invention requires an annealing method and annealing equipment, which can complete the second alignment step and the global leveling step only through the detection of a displacement sensor, which not only simplifies the measurement process, reduces the equipment installation space, and saves costs, but also meets the alignment accuracy requirements of the substrate. It has a high alignment rate and high alignment accuracy, which is beneficial to improving the annealing efficiency and annealing quality. Summary of the invention

[0007] The invention provides an annealing method and an annealing device. The annealing method can complete the second alignment step and the global leveling step only through the detection of a displacement sensor, which not only simplifies the measurement process, reduces the equipment installation space, and saves costs, but also meets the alignment accuracy requirements of the substrate. It has a high alignment rate and high alignment accuracy, which is conducive to improving annealing efficiency and annealing quality.

[0008] In the present invention, the annealing method comprises:

[0009] Transferring the substrate to a moving platform of the annealing device and determining the initial center coordinates of the substrate;

[0010] A displacement sensor is arranged above the motion platform, and the displacement sensor is used to measure the distance relative to the substrate on the motion platform;

[0011] The motion platform and / or the displacement sensor moves horizontally, identifies at least three sudden change positions of the substrate through the distance, and measures at least three leveling position heights on the upper surface of the substrate inside the edge of the substrate;

[0012] The centering deviation of the substrate is determined by the sudden change position; and the leveling error of the substrate is determined by the leveling position height.

[0013] Optionally, it further includes compensating for centering deviation, wherein determining the centering deviation of the substrate by the mutation position and compensating for the centering deviation includes:

[0014] The actual center coordinates of the substrate are calculated through the mutation position, and the centering deviation is calculated based on the initial center coordinates and the actual center coordinates. If the centering deviation is less than the centering threshold, the centering deviation is compensated by horizontal movement of the motion platform and / or the laser annealing device.

[0015] Optionally, it also includes compensating for leveling errors, determining the leveling error of the substrate through the leveling position height, and compensating for the leveling error includes: calculating the plane where the upper surface of the substrate is located through the coordinates of each of the leveling position heights, and calculating the leveling error of the substrate based on the deviation between the plane and a reference plane; if the leveling error is greater than a leveling threshold, leveling the substrate through the motion platform.

[0016] Optionally, the number of the mutation positions and the leveling position heights are the same, and the mutation positions and the leveling position heights are grouped in pairs;

[0017] The projection of the line connecting the heights of one mutation position and another leveling position in each group on the upper surface of the motion platform forms a projection line, and the projection line extends along a radial direction based on the initial circle center coordinates.

[0018] Optionally, the motion platform moves radially and horizontally based on the initial circle center coordinates to detect the coordinates of the sudden change position and the height of the leveling position.

[0019] Optionally, there are three mutation position calibrations; and / or, there are three leveling position height calibrations.

[0020] Optionally, a horizontal distance between the height of the leveling position and the initial circle center is smaller than a radius of the substrate.

[0021] Optionally, the mutation positions are evenly distributed circumferentially with the initial circle center or the actual circle center as the center.

[0022] Optionally, the set direction is vertical to the upper surface of the motion platform.

[0023] The present invention also provides an annealing device, comprising: a motion platform, a displacement sensor and a laser annealing device;

[0024] The upper surface of the motion platform is used to carry the substrate;

[0025] The displacement sensor is used to measure the distance relative to the substrate on the motion platform, and to identify at least three sudden changes of the substrate through the distance and to measure at least three leveling position heights on the upper surface of the substrate inside the edge of the substrate;

[0026] The moving platform base and / or the laser annealing device can move based on the coordinates of the sudden change position and the height of the leveling position to adjust the center of the substrate and level the substrate;

[0027] The laser annealing device is used to anneal the substrate.

[0028] Optionally, it also includes a motion controller and a drive module,

[0029] The driving module is used to drive the motion platform to move;

[0030] The motion controller is in communication with the displacement sensor and the driving module;

[0031] The motion controller is used to receive the distance detected by the displacement sensor and calculate the centering deviation and leveling error;

[0032] The motion controller is used to control the action of the driving module based on the centering deviation and the leveling error to adjust the center of the substrate and level the substrate.

[0033] In summary, the annealing method includes:

[0034] The substrate is transferred to a moving platform of an annealing device, and the initial center coordinates of the substrate are determined; a displacement sensor is arranged above the moving platform, and the displacement sensor is used to measure the distance relative to the substrate on the moving platform; the moving platform and / or the displacement sensor moves horizontally, and at least three sudden change positions of the substrate are identified through the distance, and at least three leveling position heights are measured on the upper surface of the substrate inside the edge of the substrate; the centering deviation of the substrate is determined through the sudden change positions; and the leveling error of the substrate is determined through the leveling position heights.

[0035] With such configuration, the above-mentioned annealing equipment and annealing method do not rely on camera image acquisition during the alignment process, and only use displacement sensors to implement focusing and leveling, secondary alignment steps, and global leveling steps. On the one hand, it can eliminate the error of camera image acquisition, and on the other hand, it can save sensor installation space in the equipment and reduce equipment costs. At the same time, it meets the alignment accuracy requirements of the substrate. It has a high alignment rate and high alignment accuracy, which is conducive to improving annealing efficiency and annealing quality; it also simplifies the measurement process, improves productivity, and is also suitable for the alignment of transparent or translucent substrates.

[0036] In the present invention, each mutation position and each leveling position height are symmetrically distributed around the initial center of the circle or the actual center of the circle, which is conducive to accurately calculating the actual center of the circle, and is also conducive to accurately calculating the actual plane equation of the upper surface of the substrate, thereby accurately obtaining the leveling error and having a high alignment accuracy.

[0037] In the present invention, three mutation positions and three leveling position heights are calibrated, and two are grouped together. One mutation position and one leveling position height can be calibrated by one radial scan, and the calibration speed is fast and the efficiency is high.

[0038] In the present invention, the horizontal distance between the leveling position height and the initial circle center is smaller than the radius of the substrate, ensuring that the leveling position height falls inside the edge of the substrate, thereby eliminating the influence of burrs at the edge on substrate plane detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 It is a schematic diagram of the overall structure of the annealing equipment of the first embodiment of the present invention;

[0040] Figure 2 This is a schematic diagram of the control structure of the annealing equipment according to the first embodiment of the present invention;

[0041] Figure 3 A schematic diagram of a scanning trajectory of the first embodiment of the present invention;

[0042] Figure 4 A scanning curve diagram with the scanning direction as the horizontal coordinate and the vertical coordinate as the vertical coordinate when scanning the edge of the substrate according to the first embodiment of the present invention;

[0043] Figure 5 It is a schematic diagram of the overall structure of the annealing equipment of the second embodiment of the present invention;

[0044] Figure 6 The scanning trajectory of the second embodiment of the present invention is shown in FIG. Figure 1 ;

[0045] Figure 7 The scanning trajectory of the second embodiment of the present invention is shown in FIG. Figure 2 ;

[0046] Figure 8 The scanning trajectory of the second embodiment of the present invention is shown in FIG. Figure 3 ;

[0047] Fig. 9 This is a flow chart of data collection and processing of a linear array laser displacement sensor according to the third embodiment of the present invention.

[0048] The reference numerals are as follows:

[0049] 1-substrate; 2-moving platform; 3-displacement sensor; 4-frame; 5-base; 6-laser annealing device; 7-Y-axis motor; 8-Y-axis motor; 9-Z-axis motor. DETAILED DESCRIPTION

[0050] As used in the invention, the singular forms "one", "a", and "the" include plural objects, the term "or" is usually used to include the meaning of "and / or", the term "several" is usually used to include the meaning of "at least one", and the term "at least two" is usually used to include the meaning of "two or more". In addition, the terms "first", "second", and "third" are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", and "third" can explicitly or implicitly include one or at least two of the features. In addition, as used in the invention, "installed", "connected", "connected", and one element "set" to another element should be understood in a broad sense, usually only indicating that there is a connection, coupling, matching or transmission relationship between the two elements, and the connection, coupling, matching or transmission between the two elements can be direct or indirect through an intermediate element, and cannot be understood as indicating or implying the spatial position relationship between the two elements, that is, one element can be in any orientation such as inside, outside, above, below or on one side of another element, unless the content clearly indicates otherwise. For those skilled in the art, the specific meanings of the above terms in the invention can be understood according to specific circumstances. In addition, directional terms such as above, below, up, down, upward, downward, left, right, etc. are used with respect to the exemplary embodiments as they are shown in the figures, with the upward or upper direction toward the top of the corresponding figure, and the downward or lower direction toward the bottom of the corresponding figure.

[0051] Embodiment 1:

[0052] Please refer to Figure 1 As shown, this embodiment provides an annealing device, including: a motion platform 2, a displacement sensor 3, a frame 4, a base 5 and a laser annealing device 6;

[0053] The motion platform 2 is placed on the base 5, and the upper surface of the motion platform 2 is used to carry the substrate 1. The substrate 1 here is usually a wafer, but of course it can also be other semiconductor components that need to be annealed. This annealing equipment is mainly for circular substrates 1. The existing motion platform 2 usually has multiple degrees of freedom of X, Y, Z, RX, RY, RZ or includes several of them. For example, it can realize movement in the XY horizontal plane to drive the horizontal movement of the substrate 1, so that the displacement sensor 3 and the laser annealing device 6 can scan the substrate 1; the motion platform 2 can use an existing model, which will not be repeated here.

[0054] The displacement sensor 3 is used to measure the distance relative to the substrate 1 on the motion platform 2, and to identify at least a portion of the edge of the substrate 1 and measure at least three leveling position heights on the upper surface of the substrate 1 inside the edge of the substrate 1. The displacement sensor 3 can be a laser displacement sensor or other types of distance sensors that can meet the detection accuracy.

[0055] The motion platform 2 can move based on the coordinates of the edge and the leveling position height to adjust the center of the substrate 1 and level the substrate. When a portion of the edge of the substrate 1 is captured by the displacement sensor 3, the actual center coordinates of the substrate 1 can be calculated through the edge, and based on the centering error between the actual center coordinates and the initial center coordinates, the motion platform 2 can be moved to adjust the center of the substrate 1 to complete the centering of the substrate. In addition, the plane equation of the upper surface of the substrate 1 can be calculated based on the coordinates of the leveling position height, and the leveling error can be obtained by comparing it with the reference plane. The centering and leveling process is described in detail in the following annealing method.

[0056] The displacement sensor 3 and the laser annealing device 6 are both arranged on the frame 4, the frame 4 is arranged on the base, the displacement sensor 3 and the laser annealing device 6 are both located above the motion platform 2, and the displacement sensor 3 and the laser annealing device 6 are arranged so that their scanning range covers the entire substrate. The laser annealing device 6 is a laser, which can generate laser and irradiate the substrate with the laser spot to perform the annealing process. When the motion platform 2 drives the substrate to move horizontally, the displacement sensor 3 and the laser annealing device 6 can scan the substrate 1 respectively.

[0057] Please continue to refer to Figure 2 As shown, the annealing device also includes a motion controller and a drive module;

[0058] The driving module is used to drive the motion platform to move; the driving module may include a linear motor for driving the motion platform to move horizontally along the X-axis and the Y-axis and vertically along the Z-axis, and a rotary motor for driving the motion platform to rotate RX, RY, and RZ. The driving module can be integrated with the motion platform, which is a prior art and will not be described here.

[0059] The motion controller is in communication with the displacement sensor and the driving module;

[0060] The motion controller is used to receive the distance of the displacement sensor and calculate the centering deviation and leveling error;

[0061] The motion controller is used to control the action of the driving module based on the centering deviation and the leveling error to adjust the center of the substrate 1 and level the substrate.

[0062] In addition, please continue to refer to Figure 2As shown, the annealing equipment also includes a host, which has a user interface, and the user interface can input control instructions. The motion controller software can be installed in the host to control the collection and data processing of the motion data of the motion platform and the detection data of the displacement sensor by writing instructions. The motion platform transmits its motion data and the displacement sensor transmits the real-time detection data to the host through the motion controller, and processes the data through the built-in software, and sends control instructions to the motion controller to control the movement of the motion platform.

[0063] The host computer is connected to the motion controller via Ethernet, and the motion controller is connected to the drive module and the displacement sensor 3 via EtherCAT. The motion controller moves the motion platform through the drive module, and the motion controller synchronously collects the position of the motion platform and the sensor data and processes the data to complete the centering and leveling of the substrate.

[0064] The above annealing equipment is used to perform annealing of the substrate, and the specific steps of the annealing method are as follows:

[0065] After the substrate completes the pre-alignment step on the pre-alignment stage, the robot takes down the substrate and transfers it to the upper surface of the motion platform 2 to complete the loading. At this time, the substrate has passed the pre-alignment, so the substrate can obtain the initial center coordinates based on its pre-alignment. Since the pre-alignment may have errors, the initial center coordinates and the actual center of the substrate may have errors. Therefore, the following steps are required to correct the center;

[0066] Then, a displacement sensor is set above the motion platform, and the distance of the displacement sensor from the upper surface of the motion platform along the set direction is measured; the monitoring point can be pre-set and then the displacement sensor is installed on the displacement sensor, or the monitoring point can be naturally determined based on the installation position of the displacement sensor. The displacement sensor detects the distance along a fixed set direction, so as to detect the sudden change position of the distance. Since the center error and horizontal error of the substrate are small after it is placed on the motion platform, the actual posture of the substrate is close to horizontal. Therefore, when the substrate is placed on the upper surface of the motion platform, when the displacement sensor detects the edge of the substrate, a sudden change in distance will occur due to the change in thickness. In this embodiment, the set direction is vertical to the upper surface of the motion platform, so that the distance mutation is more obvious, which is convenient for data detection and calibration.

[0067] The motion platform moves horizontally, identifies at least a portion of the edge of the substrate through the distance, and calibrates three leveling position heights on the upper surface of the substrate inside the edge; in this embodiment, the edge is identified by fitting, specifically, when the motion platform moves horizontally, if the distance changes suddenly, it is calibrated as a sudden change position, and three different sudden change positions are calibrated to fit the edge.

[0068] Please refer to Figure 3 As shown, the substrate can know its initial center coordinates based on its pre-alignment, and then the approximate initial edge of the substrate can be known, and the initial alignment point A is set on its initial edge. For example, the position of the intersection with the initial edge when rotating 30° counterclockwise with the X direction can be used as the initial alignment point A. In this embodiment, it is preferred to make each of the mutation positions as uniformly distributed circumferentially as possible with the actual center of the circle as the center. Therefore, with alignment point A as the starting point, the position of the intersection with the initial edge at 120° clockwise and 120° counterclockwise is used as alignment point B and alignment point C. At this time, the positions of alignment point A, alignment point B and alignment point C are uniformly distributed circumferentially with the initial center of the circle as the center. Since the error between the initial center of the circle and the actual center of the circle is actually small, within the error range, the positions of alignment point A, alignment point B and alignment point C are also roughly uniformly distributed circumferentially with the actual center of the circle as the center.

[0069] Since the accuracy of the robot on the upper part during pre-alignment is less than ±1mm, the starting position of the motion platform is calibrated with position P1. Position P1 is a point where the displacement sensor 3 is perpendicular to the upper surface of the motion platform 2. Position P1 can be, for example, 2mm outside the initial edge of the substrate. Considering the error of the robot on the upper part, that is, the position P1 is 3mm outward along the radial direction of the alignment point A. Therefore, the initial position of the motion platform should make the displacement sensor 3 perpendicular to position P1. Similarly, position P2 corresponding to alignment point B and position P3 corresponding to alignment point C are determined in turn.

[0070] Please continue to refer to Figure 3 As shown, continue to determine position Q1, where position Q1 is, for example, 6 mm inward in the radial direction of position P1. Similarly, position Q2 corresponding to alignment point B and position Q3 corresponding to alignment point C are determined in sequence. The radial direction here is based on the initial center of the circle, that is, the projection line of the line connecting P1Q1 on the upper surface of the motion platform 2 extends along the radial direction.

[0071] Then, the motion platform 2 is operated to move so that the motion platform 2 and the substrate 1 move relative to the displacement sensor 3. The initial motion position is position P1, and then the motion platform 2 moves radially toward the initial center of the substrate, and moves from the outer side of the substrate P1 (x p1 ,y p1 , z p1 ) moves to Q1(x Q1 ,y Q1 , z Q1 ) position. During this movement, the displacement sensor 3 starts to collect distance, the movement displacement of the motion platform 2 and its movement direction is recorded as △X, the height value collected by the displacement sensor 3 is H, and the height change is △H. When the displacement sensor 3 passes the actual edge of the substrate during the scanning process from P1 to Q1, the height value collected by the displacement sensor 3 will suddenly change. Figure 3 and Figure 4 As shown, a height change threshold of △H / △X is set. When the actual value of △H / △X exceeds the set height change threshold, the position in the X and Y directions at this time is recorded, and then the coordinate value (x1, y1) of the first mutation position is obtained, that is, the edge position point of the substrate. It should be noted that since there may be errors between the initial center of the circle and the actual center of the circle, there may be errors between the first mutation position and the alignment point A, but the first mutation position is closer to the alignment point A. At the same time, the coordinates in the X and Y directions of the end point Q1 of the movement measured by the displacement sensor 3 and its height value H are recorded, that is, the coordinates Q1 (x Q1 ,y Q1 , z Q1 ).

[0072] Then, it moves from position Q1 to position P2 at a higher speed v. The calculation method of position P2 is the same as that of P1. Then, the coordinate value (x2, y2) of the second mutation point close to the alignment point B is obtained in the same way. At the same time, the position coordinate Q2 (x Q2 ,y Q2 , z Q2 ). Then move from Q2 to P3 at a higher speed v. The calculation method of P3 is the same as P1. Then obtain the coordinate value (x3, y3) of the third mutation point close to the alignment point C in the same way, and record the position coordinate Q3 (x Q3 ,y Q3 , z Q3 ).

[0073] The position coordinates of position Q1, position Q2, and position Q3 are obtained. The upper surface of the substrate is approximately regarded as a plane. By scanning Q1, Q2, and Q3 in the trajectory, the spatial coordinates of the three points can be obtained by taking the lowest point of the three points as the reference point. Q1 ,y Q1 ,z1),Q2(x Q2 ,y Q2 ,z2),Q3(x Q3 ,y Q3 ,z3) It can be concluded that the substrate plane equation is: Ax+By+Cz+D=0, where:

[0074] A=(y Q3 -y Q1 )(z3-z1)-(z2-z1)(y Q3 -y Q1 )

[0075] B=(x Q3 -x Q1 )(z2-z1)-(z3-z1)(x Q2 -x Q1 )

[0076] C=(x Q2 -x Q1 )(y2-y1)-(y2-z1)(x Q3 -x Q1 )

[0077] A leveling error is obtained according to the obtained substrate plane equation. If the leveling error is greater than a leveling threshold, the substrate is leveled by moving the motion platform, and the leveling error is re-detected until the leveling error is less than the leveling threshold.

[0078] In addition, the position coordinates of the first mutation position, the second mutation position, and the third mutation position are obtained, and a circle can be determined by three points. The actual center coordinate value is:

[0079]

[0080] The circle center deviation threshold is set to 1 mm. If the centering deviation between the initial circle center coordinates and the actual circle center coordinates is less than the centering threshold, the alignment step is completed.

[0081] The actual center coordinates of the substrate are calculated through the above three mutation positions, and the centering deviation is calculated based on the initial center coordinates and the actual center coordinates. When the centering deviation is greater than the centering threshold, the centering deviation is compensated by horizontal movement of the motion platform and / or the laser annealing device, and the actual center is re-detected and the centering deviation is calculated until the centering deviation is less than the centering threshold.

[0082] When the centering deviation is large and occurs multiple times during the centering process of different substrates, it means that the pre-alignment error may be large and the pre-alignment platform should be re-tested or calibrated.

[0083] If the centering deviation between the actual center coordinates of the substrate and the initial center coordinates in a single detection is less than the threshold, the iterative calibration is stopped. At this time, the total scanning time is calculated as:

[0084]

[0085] The total scan time for alignment is also shorter overall.

[0086] After completing the alignment step, the calculated actual center coordinates and surface data are sent to the host, and the host sends instructions to the motion controller to control the movement of the motion platform, and anneal the substrate through the laser annealing device.

[0087] The above-mentioned annealing equipment and annealing method do not rely on camera image acquisition during the alignment process, and only use displacement sensors to achieve focusing, leveling and secondary alignment functions. On the one hand, it can eliminate the error of camera image acquisition, and on the other hand, it can save sensor installation space in the equipment and reduce equipment costs. At the same time, it simplifies the measurement process and improves productivity. It is also suitable for the alignment of transparent or translucent substrates.

[0088] In this embodiment, the calculated heights of each mutation position and each leveling position are symmetrically distributed around the initial center of the circle or the actual center of the circle, which is conducive to accurately calculating the actual center of the circle, and is also conducive to accurately calculating the actual plane equation of the upper surface of the substrate, thereby accurately obtaining the leveling error and having a high alignment accuracy.

[0089] In this embodiment, three mutation positions and three leveling position heights are calibrated, and two are grouped together. One radial scan can calibrate one mutation position and one leveling position height, and the calibration speed is fast and efficient.

[0090] In this embodiment, the horizontal distance between the leveling position height and the initial circle center is smaller than the radius of the substrate, ensuring that the leveling position height falls inside the edge of the substrate, thereby eliminating the influence of burrs at the edge on substrate plane detection.

[0091] Embodiment 2

[0092] The difference between this embodiment and the first embodiment lies in the difference in the frame 4 and the difference in the scanning alignment method.

[0093] like Figure 5 As shown, in this embodiment, the displacement sensor 3 can be driven to move along the X direction, the Y direction and the Z direction by the Y direction motor 7 , the Y direction motor 8 and the Z direction motor 9 , thereby scanning the substrate 1 .

[0094] In this embodiment, four leveling position heights and four mutation positions are calibrated.

[0095] Please refer to Figure 6 As shown, the displacement sensor 3 can be driven to move along a trajectory parallel to the X direction by a vertical scanning alignment method to calibrate the mutation position A and the mutation position B, and then the displacement sensor 3 can be driven to move along a trajectory parallel to the Y direction to calibrate the mutation position C and the mutation position D.

[0096] Please refer to Figure 7 As shown, the displacement sensor 3 can be driven to move along two motion trajectories parallel to the X direction to calibrate the mutation position A, the mutation position B, the mutation position C and the mutation position D by a parallel scanning alignment method.

[0097] Please refer to Figure 7As shown, the displacement sensor 3 can be driven to move along two mutually intersecting horizontal tracks by a cross scanning alignment method. The two horizontal tracks are at a certain angle to the X direction and the Y direction, and the mutation positions A and B, the mutation position C and the mutation position D are calibrated.

[0098] The calibration of the leveling position height is similar to that in the first embodiment.

[0099] In other alternative embodiments, more leveling position heights and mutation positions may be provided, and the number of leveling position heights and mutation positions may be different.

[0100] Embodiment 3

[0101] The difference between this embodiment and the second embodiment lies in the difference in displacement sensors. The displacement sensors in the first and second embodiments use point-type laser displacement sensors; the displacement sensor in this embodiment uses a linear array or planar array laser displacement sensor.

[0102] Control the displacement sensor 3 to move and scan the substrate, and its scanning area E is as follows: Fig. 9 As shown, the scanning area E covers a portion of the edge of the substrate, and a distribution map of a portion of the substrate surface and the workpiece stage is obtained after scanning. During the scanning process, the displacement sensor 3 collects the height value H, and appropriate △H1 and △H2 can be set to identify the edge area of ​​the substrate. The detection method is similar to that of the first embodiment. Fig. 9 As shown, the center of the substrate can be calculated by fitting the equation of the circle using the least squares method according to the edge contour of the substrate. To test the surface shape of the upper surface of the substrate, the displacement sensor 3 needs to be scanned repeatedly so that the scanning area covers the substrate to obtain the plane equation of the upper surface of the substrate. The area array laser displacement sensor does not need to obtain the coordinate value of the high-precision motion platform in real time. When performing the centering process, it only needs to move the platform to a certain point to obtain a similar Fig. 9 The scanning area in can obtain the center of the substrate circle by the least square method. When testing the surface shape, the displacement sensor 3 needs to be moved to the inside of the substrate edge so that the test area covers the substrate. A number of points are calibrated inside the substrate edge to obtain the surface shape of the upper surface of the substrate.

[0103] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0104] The above description is only a description of the preferred embodiments of the invention, and is not intended to limit the scope of the invention. Any changes or modifications made by a person of ordinary skill in the art based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. An annealing method, characterized in that: include: Transferring the substrate to a moving platform of the annealing device and determining the initial center coordinates of the substrate; A displacement sensor is arranged above the motion platform, and the displacement sensor is used to measure the distance relative to the substrate on the motion platform; The motion platform and / or the displacement sensor moves horizontally, identifies at least three sudden change positions of the substrate through the distance, and measures at least three leveling position heights on the upper surface of the substrate inside the edge of the substrate; The centering deviation of the substrate is determined by the sudden change position; and the leveling error of the substrate is determined by the leveling position height.

2. The annealing method according to claim 1, characterized in that The method further includes compensating for centering deviation, wherein the centering deviation of the substrate is determined by the mutation position, and compensating for the centering deviation includes: The actual center coordinates of the substrate are calculated through the mutation position, and the centering deviation is calculated based on the initial center coordinates and the actual center coordinates. If the centering deviation is less than the centering threshold, the centering deviation is compensated by horizontal movement of the motion platform and / or the laser annealing device.

3. The annealing method according to claim 1, characterized in that The method also includes compensating for a leveling error, wherein the leveling error of the substrate is determined by the leveling position height, and compensating for the leveling error includes: calculating the plane where the upper surface of the substrate is located by the coordinates of each of the leveling position heights, and calculating the leveling error of the substrate based on the deviation between the plane and the reference plane; if the leveling error is greater than a leveling threshold, the substrate is leveled by the motion platform.

4. The annealing method according to claim 1, characterized in that The number of the mutation positions and the height of the leveling positions are the same, and the mutation positions and the height of the leveling positions are grouped in pairs; The projection of the line connecting the heights of one mutation position and another leveling position in each group on the upper surface of the motion platform forms a projection line, and the projection line extends along a radial direction based on the initial circle center coordinates.

5. The annealing method according to claim 4, characterized in that: The motion platform moves radially and horizontally based on the initial circle center coordinates to detect the coordinates of the sudden change position and the height of the leveling position.

6. The annealing method according to claim 1, characterized in that: There are three mutation position calibrations; and / or, there are three leveling position height calibrations.

7. The annealing method according to claim 1, characterized in that: The horizontal distance between the height of the leveling position and the initial circle center is smaller than the radius of the substrate.

8. The annealing method according to claim 1, characterized in that: The mutation positions are evenly distributed circumferentially with the initial circle center or the actual circle center as the center.

9. The annealing method according to claim 1, characterized in that: The set direction is the vertical direction of the upper surface of the motion platform.

10. An annealing device, characterized in that: include: Motion platform, displacement sensor and laser annealing device; The upper surface of the motion platform is used to carry the substrate; The displacement sensor is used to measure the distance relative to the substrate on the motion platform, and to identify at least three sudden changes of the substrate through the distance and to measure at least three leveling position heights on the upper surface of the substrate inside the edge of the substrate; The moving platform base and / or the laser annealing device can move based on the coordinates of the sudden change position and the height of the leveling position to adjust the center of the substrate and level the substrate; The laser annealing device is used to anneal the substrate.

11. The annealing device according to claim 10, characterized in that: It also includes motion controller and drive module. The driving module is used to drive the motion platform to move; The motion controller is in communication with the displacement sensor and the driving module; The motion controller is used to receive the distance detected by the displacement sensor and calculate the centering deviation and leveling error; The motion controller is used to control the action of the driving module based on the centering deviation and the leveling error to adjust the center of the substrate and level the substrate.

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