Ultra-wideband dual-frequency combiner

Abstract

The invention relates to the technical field of communication equipment, in particular to an ultra-wideband dual-frequency combiner. The device comprises an outer shell, a cover plate and a connector, the outer shell is of a rectangular frame structure and is internally sealed, and only an opening is formed in the top. A cavity convenient for mounting equipment is formed in the outer shell; the cover plate is matched with the opening of the outer shell for sealing; equipment arranged in the cavity is protected; two sides of the outer shell are respectively an input end and an output end; the input end is provided with at least two connectors which are used for being connected with signal sources of different frequency bands; and the output end is provided with a connector for outputting the combined signal. The combiner adopts a high-low pass design scheme, a low-pass filter is an elliptic function filter with a transmission zero point, and a high-pass filter is of a filter structure with distributed parameters and is widely applied to the field of system terminal broadband communication; the design structure on capacitor C coupling compensation is simple and compact, supporting is firm, production and assembly are convenient, the technical requirements for high power, high isolation and low intermodulation of the combiner are met, and the current market requirement can be completely met.

Description

Technical Field

[0001] The present invention relates to the technical field of communication equipment, and in particular to an ultra-wideband dual-frequency combiner. Background Art

[0002] 5G communication is a communication technology that is currently under comprehensive construction. There is a large demand for combiners. In order to reduce construction costs, wideband combiners with various frequency combinations are available on the market.

[0003] At present, the existing technical solutions on the market mainly include coaxial bandpass combining solution and high-lowpass combining solution. The coaxial bandpass solution adopts a combination of bandpass filters of different frequencies to achieve combining requirements, but its disadvantage is that the coverage frequency band is not wide. The high-lowpass combiner adopts a combination of lowpass and highpass to achieve combining requirements of frequency bands with different bandwidths. The existing high-lowpass combiners: the highpass uses a single-section capacitor copper sheet upper and lower structure coupling in the processing of capacitor C coupling compensation, and the grounded resonant LC copper sheet is not on the same horizontal plane, resulting in a narrow frequency band of the product, great production difficulty, unstable performance, and not conducive to mass production. Summary of the invention

[0004] The purpose of the present invention is to propose an ultra-wideband dual-frequency combiner in view of the problems existing in the background technology; the combiner is a high-low pass design scheme, the low-pass filter is an elliptic function filter with a transmission zero point, and the high-pass filter is a distributed parameter filter structure, which is widely used in the field of system terminal broadband communication; the design structure of the capacitor C coupling compensation of the present invention is simple and compact, with reliable support, convenient production and assembly, meeting the high-power, high-isolation, and low intermodulation technical requirements of the combiner, and can fully meet the current market demand.

[0005] The technical solution of the present invention is an ultra-wideband dual-frequency combiner, comprising an outer shell, a cover plate, and a connector;

[0006] The outer shell is a rectangular frame structure, and its internal sealing is only provided with an opening at the top; a cavity is formed in the outer shell for easy installation of equipment; the cover plate cooperates with the opening of the outer shell to seal, and protects the equipment installed in the cavity;

[0007] The two sides of the outer shell are respectively an input end and an output end; the input end is provided with at least two connectors for connecting with signal sources of different frequency bands; the output end is provided with a connector for outputting the combined signal.

[0008] Preferably, the cover plate and the outer shell are sealed to form an IP67 grade protection structure.

[0009] Preferably, a first filter and a second filter are arranged in the cavity;

[0010] The first filter is a low-pass filter; the low-pass filter consists of nine stages, and the first stage of the low-pass filter uses a high-impedance structure to equivalently implement an inductor; an elliptic function filter with four transmission zeros is set;

[0011] The second filter is a high-pass filter; the high-pass filter consists of nine stages and has no transmission zero.

[0012] Preferably, the low-pass filter covers the frequency band of 617-960 MHz;

[0013] The first stage of the low-pass filter adopts high impedance equivalent inductance; the second stage is connected in parallel with capacitors; the third stage is connected in series with inductors, and the series inductors and parallel capacitors are alternately arranged in sequence; the ninth stage series inductor is connected to the 50-ohm inner conductor to the output terminal connector.

[0014] Preferably, the low-pass filter is made of a 1 mm thick copper sheet processed and silver-plated;

[0015] A high impedance structure is formed by using a silver-plated copper sheet with a width of 1.5 mm and a thickness of 1 mm to achieve equivalent inductance;

[0016] A silver-plated copper sheet with a width of 18 mm, a thickness of 1 mm, and a ground clearance of 0.5 mm is used to form a low-impedance structure to achieve equivalent capacitance.

[0017] Preferably, the high-pass filter covers the frequency band of 1350-4200 MHz; the high-pass filter is formed by two 1 mm thick silver-plated copper sheets that completely overlap each other up and down to form a distributed parameter capacitor; a low dielectric constant high-frequency microwave plate is arranged between the copper sheets; and the two capacitors are connected in series and are equivalent to one capacitor.

[0018] Preferably, the inductor in the high-pass filter is composed of a silver-plated copper sheet with a thickness of 1 mm and a width of 2 mm; the grounding inductor is fixed by a silver-plated copper screw.

[0019] Preferably, the equivalent capacitance and the equivalent inductance in the high-pass filter are located at the same level.

[0020] Preferably, the equivalent capacitance structure in the high-pass filter comprises a first copper sheet, a second copper sheet and a third copper sheet; the first copper sheet and the third copper sheet are respectively the first equivalent capacitance and the second equivalent capacitance;

[0021] The first copper sheet and the third copper sheet are both "T"-shaped copper sheets, and a plurality of positioning holes are arranged thereon;

[0022] The second copper sheet is a strip copper sheet, and is provided with positioning holes that match the first copper sheet and the third copper sheet;

[0023] The second copper sheet connects the first copper sheet and the third copper sheet together, and a PTFE layer is arranged between the copper sheets; the preferred model used is: Shengyi SCGA500 GF255 (dielectric constant is 2.55 and loss tangent value is 0.0014) PTFE layer;

[0024] The first copper sheet, the second copper sheet and the third copper sheet are all silver-plated copper sheets with a thickness of 1 mm.

[0025] Preferably, the series capacitors in the low-pass filter and the high-pass filter are both fixed in the cavity by fasteners.

[0026] Compared with the prior art, the present invention has the following beneficial technical effects:

[0027] 1. The capacitor implementation method of the high-pass filter in the present invention is that two capacitors are connected in series to be equivalent to one capacitor, and the capacitor size is enlarged, which is convenient for fixing with dielectric screws, and the grounding inductance is in a horizontal plane; the overall structure is convenient for setting the debugging screw, compensating for the performance deterioration caused by material processing deviation, and making the combiner easier to mass produce;

[0028] 2. In the present invention, an impedance matching compensation structure of a high impedance line is provided between the two-stage capacitors, so that the performance of the entire high-pass filter is better;

[0029] 3. In the present invention, the common position of the high-low pass circuit is also provided with an impedance matching compensation structure of a high impedance line (such as Figure 7 ), add a high impedance line in the middle of the first stage capacitor of the high pass for impedance matching compensation, and make the high and low pass matching frequency band range wider and the combined effect smaller through matching; make the high and low pass matching frequency band range wider and the combined effect of the two paths smaller. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the overall structure of the combiner simulation in an embodiment of the present invention;

[0031] Figure 2 A single capacitor coupling circuit and a double capacitor coupling circuit in an embodiment of the present invention;

[0032] Figure 3 A structural diagram of a single capacitor coupling circuit of a high-pass filter in an embodiment of the present invention;

[0033] Figure 4 A structural diagram of a dual-capacitor coupling circuit of a high-pass filter in an embodiment of the present invention;

[0034] Figure 5 Schematic diagram of the overall structure of the combiner in an embodiment of the present invention;

[0035] Figure 6 A schematic diagram of the structure of a low-pass filter in an embodiment of the present invention;

[0036] Figure 7 1 is a diagram showing the location of the high-low-pass combined common terminal in an embodiment of the present invention.

[0037] Figure numerals: 1. outer shell; 2. connector; 3. cavity; 4. fastener; 11. first copper sheet; 12. second copper sheet; 13. third copper sheet; 14. PTFE layer. DETAILED DESCRIPTION

[0038] Example 1

[0039] like Figure 5 As shown, the present invention proposes an ultra-wideband dual-frequency combiner, which is an outdoor type and specifically includes an outer shell 1, a cover plate, and a connector 2;

[0040] The outer shell 1 is a rectangular frame structure, which is sealed inside and has only an opening at the top. A cavity 3 for installing equipment is formed inside the outer shell 1. The cover plate 2 cooperates with the opening of the outer shell 1 to seal the equipment arranged inside the cavity 3. The cover plate 2 and the outer shell 1 are sealed to form an IP67 protection structure.

[0041] The two sides of the outer shell 1 are respectively an input end and an output end; at least two connectors 2 are provided at the input end for connecting to signal sources of different frequency bands; and a connector is provided at the output end for outputting the combined signal.

[0042] In this embodiment, if Figure 4 The first filter and the second filter are arranged in the cavity 3 shown;

[0043] The first filter is a low-pass filter; Figure 6 As shown, the low-pass filter consists of nine stages. The first stage of the low-pass filter uses a high-impedance structure to equivalently realize the inductor; an elliptic function filter with four transmission zeros is set; the low-pass filter covers a frequency band of 617-960MHz; the first stage of the low-pass filter uses a high-impedance equivalent to realize the inductor; the second stage is a parallel capacitor; the third stage is a series inductor, and the series inductor and the parallel capacitor are alternately set in sequence, and the ninth stage series inductor connects the 50-ohm inner conductor to the output terminal connector 3; the low-pass filter is made of a 1mm thick copper sheet processed and silver-plated;

[0044] A high impedance structure is formed by using a silver-plated copper sheet with a width of 1.5 mm and a thickness of 1 mm to achieve equivalent inductance;

[0045] A silver-plated copper sheet with a width of 18 mm, a thickness of 1 mm, and a ground clearance of 0.5 mm is used to form a low-impedance structure to achieve equivalent capacitance.

[0046] In this embodiment, the second filter is a high-pass filter; the high-pass filter consists of nine stages with no transmission zero point, wherein the first stage adopts capacitor coupling and the second stage is connected to ground in parallel with the inductor; the third stage is connected to capacitor coupling in series, the capacitor and the inductor are connected in series in turn and alternately combined, and the ninth stage is connected to capacitor coupling in series with the 50 ohm inner conductor and output to the connector; the first stage adopts capacitor coupling and the second stage is connected to ground in parallel with the inductor; the third stage is connected to capacitor coupling in series, the capacitor and the inductor are connected in series in turn and alternately combined, and the ninth stage is connected to capacitor coupling in series with the 50 ohm inner conductor and output to the connector.

[0047] The high-pass filter covers the frequency band of 1350-4200MHz; the high-pass filter is composed of two 1mm thick silver-plated copper sheets that completely overlap each other to form a distributed parameter capacitor; a low dielectric constant high-frequency microwave plate is set between the copper sheets; the two capacitors are connected in series to be equivalent to one capacitor, and the inductor in the high-pass filter is composed of a silver-plated copper sheet with a thickness of 1mm and a width of 2mm; the grounding inductor is fixed by a silver-plated copper screw.

[0048] In a high-pass filter, the equivalent capacitance and equivalent inductance are at the same level.

[0049] Example 2

[0050] The present invention proposes an ultra-wideband dual-frequency combiner; Figure 3 The figure shows a common single equivalent capacitor coupling structure of a high-pass filter in a combiner, which includes copper sheets 1 and 2. However, due to the coupling of the upper and lower structures of a single-section capacitor copper sheet, the grounded resonant LC copper sheet is not on the same horizontal plane, resulting in a narrow frequency band of the product, great production difficulty, unstable performance, and not conducive to mass production.

[0051] like Figure 4 As shown, in this embodiment, two capacitors are connected in series to realize one capacitor, which can reduce the material precision, and at the same time, the inductor connected to the ground in parallel can be placed at a plane height, which is convenient for installation and debugging. Specifically, the equivalent capacitor structure in the high-pass filter includes a first copper sheet 11, a second copper sheet 12 and a third copper sheet 13; the first copper sheet 11 and the third copper sheet 13 are respectively the first equivalent capacitor and the second equivalent capacitor;

[0052] The first copper sheet 11 and the third copper sheet 13 are both T-shaped copper sheets, and a plurality of positioning holes are provided thereon;

[0053] The second copper sheet 12 is a strip-shaped copper sheet, and is provided with positioning holes that match the first copper sheet 11 and the third copper sheet 13;

[0054] The second copper sheet 12 connects the first copper sheet 11 and the third copper sheet 13 together, and a PTFE layer 14 is arranged between the copper sheets;

[0055] The first copper sheet 11 , the second copper sheet 12 and the third copper sheet 13 are all silver-plated copper sheets with a thickness of 1 mm.

[0056] The series capacitors in the low-pass filter and the high-pass filter are both fixed in the cavity 3 by fasteners 4 .

[0057] In this embodiment, all capacitors are at one height, and all inductors are also at one height. The overall structure is convenient for setting the debugging screw, compensating for the performance deterioration caused by material processing deviations, and making the combiner easier to mass-produce. An impedance matching compensation structure of a high-impedance line is set between the two-stage capacitors to make the performance of the entire high-pass filter better. An impedance matching compensation structure of a high-impedance line is also set at the common position of the high- and low-pass combiner to make the high- and low-pass matching frequency band range wider. The series capacitors of the overall high-pass filter are fixed by dielectric screws, and the grounding inductors are fixed by silver-plated copper screws. The overall structure is firm and stable, with low insertion loss, good intermodulation, and stable performance.

[0058] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited thereto, and various changes can be made within the knowledge scope of technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. An ultra-wideband dual-frequency combiner, characterized in that: It comprises an outer shell (1), a cover plate, and a connector (2); The outer shell (1) is a rectangular frame structure, the interior of which is sealed, with only an opening at the top. A cavity (3) is formed inside the outer shell (1) for facilitating installation of equipment. The cover plate (2) cooperates with the opening of the outer shell (1) to seal, thereby protecting the equipment arranged inside the cavity (3). The two sides of the outer shell (1) are respectively an input end and an output end; At least two connectors (2) are arranged at the input end for connecting to signal sources of different frequency bands; and one connector is arranged at the output end for outputting the combined signal.

2. The ultra-wideband dual-frequency combiner according to claim 1, characterized in that: The cover plate (2) and the outer shell (1) are sealed to form an IP67 grade protection structure.

3. The ultra-wideband dual-frequency combiner according to claim 1, characterized in that: A first filter and a second filter are arranged in the cavity (3); The first filter is a low-pass filter; the low-pass filter consists of nine stages, and the first stage of the low-pass filter uses a high-impedance structure to equivalently implement an inductor; an elliptic function filter with four transmission zeros is set; The second filter is a high pass filter; The high-pass filter consists of nine stages with no transmission zero.

4. The ultra-wideband dual-frequency combiner according to claim 3, characterized in that: The low-pass filter covers the frequency band of 617-960MHz; The first stage of the low-pass filter adopts a high impedance equivalent inductor; the second stage is a parallel capacitor; the third stage is a series inductor, and the series inductors and parallel capacitors are alternately arranged in sequence; the ninth stage series inductor is connected to a 50-ohm inner conductor to an output terminal connector (3).

5. The ultra-wideband dual-frequency combiner according to claim 4, characterized in that: The low-pass filter is made of 1mm thick copper sheet processed and silver-plated; A silver-plated copper sheet with a width of 1.5 mm and a thickness of 1 mm is used to form a high impedance structure to achieve equivalent inductance; A silver-plated copper sheet with a width of 18 mm, a thickness of 1 mm, and a ground clearance of 0.5 mm is used to form a low-impedance structure to achieve equivalent capacitance.

6. The ultra-wideband dual-frequency combiner according to claim 3, characterized in that: The high-pass filter covers the frequency band of 1350-4200MHz; the high-pass filter is formed by two 1mm thick silver-plated copper sheets that completely overlap each other up and down to form a distributed parameter capacitor; a low dielectric constant high-frequency microwave plate is set between the copper sheets; the two capacitors are connected in series and are equivalent to one capacitor.

7. The ultra-wideband dual-frequency combiner according to claim 6, characterized in that: The inductor in the high-pass filter is made of silver-plated copper sheets with a thickness of 1mm and a width of 2mm; the grounding inductor is fixed by silver-plated copper screws.

8. An ultra-wideband dual-frequency combiner according to claim 6 or 7, characterized in that: In a high-pass filter, the equivalent capacitance and equivalent inductance are at the same level.

9. The ultra-wideband dual-frequency combiner according to claim 6, characterized in that: The equivalent capacitance structure in the high-pass filter comprises a first copper sheet (11), a second copper sheet (12) and a third copper sheet (13); the first copper sheet (11) and the third copper sheet (13) are respectively a first equivalent capacitance and a second equivalent capacitance; The first copper sheet (11) and the third copper sheet (13) are both "T"-shaped copper sheets, and are provided with a plurality of positioning holes; The second copper sheet (12) is a strip-shaped copper sheet, and is provided with positioning holes that match the first copper sheet (11) and the third copper sheet (13); The second copper sheet (12) connects the first copper sheet (11) and the third copper sheet (13) together, and a PTFE layer (14) is arranged between the copper sheets; The first copper sheet (11), the second copper sheet (12) and the third copper sheet (13) are all silver-plated copper sheets with a thickness of 1 mm.

10. An ultra-wideband dual-frequency combiner according to claim 4 or 6, characterized in that: The series capacitors in the low-pass filter and the high-pass filter are both fixed in the cavity (3) by means of fasteners (4).

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