Heat dissipation device and electronic equipment assembly

Abstract

The invention provides a heat dissipation device and an electronic equipment assembly. The heat dissipation device comprises a shell and a heat dissipation fan, the heat dissipation fan is arranged in the shell, an air inlet and an air outlet are formed in the shell, and the heat dissipation fan circulates air inside and outside the shell through the air inlet and the air outlet; the air inlet is covered with a cooling plate, the cooling plate is provided with a cooling material layer and a plurality of air inlet holes formed in a penetrating mode, and when air flows through the air inlet holes, the air can be cooled by the cooling material layer. According to the heat dissipation device provided by the embodiment of the invention, the structure of the cooling plate is arranged at the air inlet of the shell, the cooling plate is provided with the cooling material layer and the multiple air inlet holes formed in the penetrating mode, when air flows through the air inlet holes, the air can be cooled by the cooling material layer, then the refrigerating capacity of the heat dissipation device is improved, and the comfort experience of a user can be enhanced.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation accessories for electronic equipment, and in particular to a heat dissipation device and an electronic equipment component. Background Art

[0002] With the increasing diversity of mobile phone usage, many users wear cooling back clips to solve the problem of mobile phone heating due to the growing demand for heat dissipation caused by mobile phone games, live broadcasts, etc. However, the cooling effect of cooling back clips in conventional technical solutions is poor and cannot meet the increasingly high heat dissipation requirements. Summary of the invention

[0003] A first aspect of an embodiment of the present application provides a heat dissipation device, which includes a shell and a heat dissipation fan, wherein the heat dissipation fan is arranged in the shell, and the shell is provided with an air inlet and an air outlet, and the heat dissipation fan circulates the air inside and outside the shell through the air inlet and the air outlet; the air inlet upper cover is provided with a cooling plate, and the cooling plate is provided with a cooling material layer and a plurality of air inlet holes arranged therethrough, and the air can be cooled by the cooling material layer when flowing through the air inlet holes.

[0004] In a second aspect, an embodiment of the present application provides an electronic device assembly, which includes an electronic device and the heat dissipation device described in the above embodiment, wherein a housing of the heat dissipation device is connected to the electronic device, and the heat dissipation device is used to dissipate heat from the electronic device.

[0005] The heat dissipation device provided in the embodiment of the present application has a cooling plate structure arranged at the air inlet of the shell. The cooling plate is provided with a cooling material layer and a plurality of air inlet holes arranged therethrough. When the air flows through the air inlet holes, it can be cooled by the cooling material layer, thereby improving the cooling capacity of the heat dissipation device, which is beneficial to enhancing the user's comfort experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0007] Figure 1 It is a schematic diagram of the overall structure of an embodiment of an electronic device assembly of the present application;

[0008] Figure 2 yes Figure 1 A schematic cross-sectional view of the electronic device assembly along line AA in the embodiment;

[0009] Figure 3It is a structural schematic diagram of an embodiment of a cooling plate of the present application;

[0010] Figure 4 yes Figure 3 A schematic cross-sectional view of the cooling plate along line BB in the embodiment;

[0011] Figure 5 is a schematic diagram of the cross-sectional structure of another embodiment of the cooling plate of the present application;

[0012] Figure 6 is a structural schematic diagram of another embodiment of the heat dissipation device of the present application;

[0013] Figure 7 is a structural schematic diagram of another embodiment of the heat dissipation device of the present application;

[0014] Figure 8 It is a schematic diagram of the structural composition block diagram of an embodiment of the electronic device of the present application. DETAILED DESCRIPTION

[0015] The present application is further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only used to illustrate the present application, but are not intended to limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application rather than all embodiments, and all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0016] The terms "first", "second", and "third" in the embodiments of the present application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", and "third" can expressly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of the present application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. The terms "including" and "having" in the embodiments of the present application and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or components inherent to these processes, methods, products, or devices.

[0017] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0018] As used herein, "electronic devices" (or simply "terminals") include, but are not limited to, devices configured to receive / send communication signals via a wireline connection (e.g., via a public switched telephone network (PSTN), a digital subscriber line (DSL), a digital cable, a direct cable connection, and / or another data connection / network) and / or via a wireless interface (e.g., for a cellular network, a wireless local area network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and / or another communication terminal). Communication terminals configured to communicate via a wireless interface may be referred to as "wireless communication terminals", "wireless terminals" or "mobile terminals". Examples of mobile terminals include, but are not limited to, satellite or cellular phones; personal communication system (PCS) terminals that may combine cellular radiotelephones with data processing, fax, and data communication capabilities; PDAs that may include radiotelephones, pagers, Internet / intranet access, web browsers, organizers, calendars, and / or global positioning system (GPS) receivers; and conventional laptop and / or palmtop receivers or other electronic devices that include radiotelephone transceivers. A mobile phone is an electronic device equipped with a cellular communication module.

[0019] Please also read Figure 1 and Figure 2 , Figure 1 is a schematic diagram of the overall structure of an embodiment of an electronic device assembly of the present application, Figure 2 yes Figure 1 Schematic diagram of the cross-sectional structure of the electronic device assembly along the AA line in the embodiment; it should be noted that the electronic device in the present application may include a mobile phone, a tablet computer, a laptop computer, a wearable device, etc. The electronic device assembly includes a heat dissipation device 100 and an electronic device 200, the heat dissipation device 100 is connected to the electronic device 200, and the heat dissipation device 100 is used to dissipate heat from the electronic device 200.

[0020] Specifically, the heat dissipation device 100 includes a housing 110, a heat dissipation fan 120, and a heat sink 130. Optionally, the housing 110 in this embodiment is provided with a housing cavity 1101, and the housing cavity 1101 is used to accommodate components such as the heat dissipation fan 120 and the heat sink 130; on the other hand, the housing 110 is also provided with a mounting groove 1102, and the mounting groove 1102 is used to cooperate with the electronic device 200. In addition, in some other embodiments, the heat dissipation device 100 may also be a structure without the mounting groove 1102, and the coupling connection with the electronic device 200 is achieved, for example, by means of magnetism or the like.

[0021] The housing 110 is provided with an air inlet 111 and an air outlet 112, and the cooling fan 120 circulates the air inside and outside the housing 110 through the air inlet 111 and the air outlet 112, thereby achieving air cooling of the radiator 130. The positions of the air inlet 111 and the air outlet 112 are not limited to the positions shown in the figure.

[0022] The air inlet 111 is covered with a cooling plate 140. Figure 3 and Figure 4 , Figure 3 is a schematic structural diagram of an embodiment of a cooling plate of the present application, Figure 4 yes Figure 3 The schematic diagram of the cross-sectional structure of the cooling plate along the BB line in the embodiment, wherein the cooling plate 140 in the embodiment includes a substrate 141 and a cooling material layer 142, the cooling material layer 142 is embedded in the substrate 141, and a plurality of air inlet holes 1401 are provided through the cooling plate 140, the cooling material layer 142 is connected with the air inlet holes 1401 through the air holes 1402, and when the air flows through the air inlet holes 1401, it contacts the cooling material layer 142, and is then cooled by the cooling material layer 142. The opening rate of the air inlet holes 1401 on the substrate 141 is 20%-80%, which can ensure both ventilation capacity and heat dissipation efficiency.

[0023] Optionally, the substrate 141 may be made of a material with a certain strength, such as metal, alloy, plastic, composite material, etc. The cooling material layer 142 may be made of a hydrogel or a hydrogel composite material, such as a composite material of hydrogel and graphite. In some embodiments, the cooling material layer 142 may be a hydrogel composite material with a MOFs structure.

[0024] Among them, MOFs structure is the abbreviation of Metal Organic Framework (English name Metal organic Framework). It is a type of crystalline porous material with a periodic network structure formed by the self-assembly of inorganic metal centers (metal ions or metal clusters) and bridging organic ligands. MOFs is an organic-inorganic hybrid material, also known as a coordination polymer, which is different from inorganic porous materials and general organic complexes. It has the rigidity of inorganic materials and the flexibility of organic materials. The cooling material layer 142 in this embodiment can be a hydrogel or a hydrogel composite material doped or infiltrated into the MOFs structure to form a material layer structure with excellent heat dissipation performance.

[0025] Phase change heat transfer principle based on hydrogel: Hydrogel is a kind of extremely hydrophilic three-dimensional network structure polymer. The existence of the cross-linked network causes the hydrogel to swell a large amount of water, and the water content can exceed 90%. When the electronic product is working, the hydrogel absorbs heat, and the internal water evaporates into water vapor and diffuses into the air, taking away a large amount of heat at the same time. The latent heat of vaporization of water is as high as ~2400J / g, that is, every 1g of water evaporated can take away 2400J of heat, which is 10 times that of commercial phase change heat storage film. Water evaporation takes away heat and cools down; when the heat dissipation device is not working, it spontaneously absorbs water from the air. Therefore, as long as the above materials that can repeatedly absorb and lose water are met, they can be used, and they will not be listed here one by one.

[0026] Please continue reading Figure 3 and Figure 4 In this embodiment, the substrate 141 (on one or both sides) may be provided with a plurality of vents 1402 connected to the cooling material layer 142. The vents 1402 have the same function as the vents 1402 on the inner wall of the air inlet 1401, which is to allow air to contact the cooling material layer 142, thereby increasing the heat dissipation effect. Figure 5 , Figure 5 It is a schematic diagram of the cross-sectional structure of another embodiment of the cooling plate of the present application, wherein the cooling material layer 142 in this embodiment can be leaked from the substrate 141 on the opposite side surfaces of the substrate 141, thereby increasing the contact area between the cooling material layer 142 and the external air.

[0027] The technical solution of this embodiment utilizes the high water content of hydrogel to construct a phase change convection cooling inlet screen of heat dissipation layer / hydrogel layer / breathable layer, achieves ultra-high heat dissipation performance through phase change convection of water swollen in the hydrogel, and designs an enhanced heat dissipation device for the cooling screen.

[0028] The heat transfer path when the heat dissipation device is working is: when the heat dissipation fan 120 rotates, the interior of the heat dissipation device accommodating chamber 1101 is in a negative pressure state, and the external air enters the accommodating chamber 1101 through the air inlet 111. The air fully exchanges heat with the radiator 130 under the traction of the rotation of the heat dissipation fan 120, and the hot air after heat exchange flows out through the air outlet 112.

[0029] Since the air inlet 111 is provided with a cooling plate 140 having a cooling material layer 142, when air of a certain temperature and wind speed flows through the cooling material layer 142, the cooling material layer 142 absorbs heat and the temperature rises, the saturated vapor pressure rises, the water evaporates, and diffuses into the atmosphere through the breathable layer, while taking away a large amount of heat, thereby achieving the purpose of lowering the air temperature. When the heat dissipation device is not working, the water vapor partial pressure in the atmosphere is greater than the saturated vapor pressure of the hydrogel, and the water vapor is absorbed by the hydrogel through the breathable layer.

[0030] The function of the air inlet 1401 is to provide a channel for water vapor in the hydrogel / air. When the electronic device generates heat, the hydrogel is heated, the water evaporates, and overflows from the air inlet 1401 and the air vent 1402; when the heat dissipation device is on standby, the water vapor in the air is adsorbed into the hydrogel through the air vent. Therefore, the area of ​​the air vent determines the resistance of the water vapor passing through, which in turn affects the heat dissipation and water absorption function of the hydrogel. The shape of the air vent can be a circular array, a strip array, etc., as long as it can meet the structural strength.

[0031] The heat dissipation device provided in the embodiment of the present application has a cooling plate structure arranged at the air inlet of the shell. The cooling plate is provided with a cooling material layer and a plurality of air inlet holes arranged therethrough. When the air flows through the air inlet holes, it can be cooled by the cooling material layer, thereby improving the cooling capacity of the heat dissipation device, which is beneficial to enhancing the user's comfort experience.

[0032] See also Figure 6 , Figure 6 1 is a schematic structural diagram of another embodiment of the heat dissipation device of the present application. The heat dissipation device 100 in this embodiment may also include a housing 110 , a heat dissipation fan 120 and a radiator 130 .

[0033] The housing 110 is provided with an air inlet 111 and an air outlet 112 , and the heat dissipation fan 120 circulates the air inside and outside the housing 110 through the air inlet 111 and the air outlet 112 , thereby achieving air heat dissipation for the radiator 130 .

[0034] Different from the previous embodiment, the cooling plate 140 in this embodiment can be embedded in the air outlet 112, or the cooling plate 140 (the substrate) is made into an integral structure with the outer shell 110. For the detailed structural features of the cooling plate 140, please refer to the relevant description of the previous embodiment, which will not be repeated here.

[0035] See also Figure 7 , Figure 7 1 is a schematic diagram of the structure of another embodiment of the heat dissipation device of the present application. The heat dissipation device 100 in this embodiment includes a housing 110, a heat dissipation fan 120, a radiator 130, a cooling plate 140, a semiconductor refrigerator 150, a liquid cooling film 160 and a thermal conductive protective sheet 170. The semiconductor refrigerator 150 and the heat dissipation fan 120 are respectively arranged in contact with the radiator 130, and the liquid cooling film 160 is attached to the side of the semiconductor refrigerator 150 away from the radiator 130. The liquid cooling film 160 can be attached to the electronic device through the thermal conductive protective sheet 170.

[0036] Among them, the semiconductor refrigerator 150 (English name: Thermo Electric Cooler, abbreviated as TEC) is made by using the Peltier effect of semiconductor materials. The so-called Peltier effect refers to the phenomenon that when a direct current passes through a couple composed of two semiconductor materials, one end absorbs heat and the other end releases heat. Heavily doped N-type and P-type bismuth telluride are mainly used as semiconductor materials for TEC. The bismuth telluride elements are electrically connected in series and generate heat in parallel. TEC includes some P-type and N-type pairs (groups), which are connected together through electrodes and sandwiched between two ceramic electrodes; when current flows through TEC, the heat generated by the current will be transferred from one side of TEC to the other side, generating a "hot" side and a "cold" side on the TEC. This is the heating and cooling principle of TEC.

[0037] When direct current passes through a thermocouple composed of P-type and N-type semiconductor materials, one end will absorb heat and the other end will release heat, that is, the cold end and the hot end of the TEC. In order to ensure the cooling effect of the TEC, the heat of the hot end needs to be dissipated in time, otherwise the heat of the hot end of the TEC will be transferred to the cold end in large quantities, causing the TEC to fail.

[0038] The heat dissipation device dissipates heat in time at the hot end of the TEC by matching the radiator and the cooling fan to ensure the cooling capacity of the cold end of the TEC. The heat at the hot end of the TEC is first transferred to the radiator, and then the fan accelerates the flow of air to achieve active air cooling of the radiator.

[0039] The heat exchanged between the radiator and the air is:

[0040] Q=h*A*Δt

[0041] Δt=T 散热器 -T 空气

[0042] Q is the heat exchange between the radiator and the air; h is the convection heat transfer coefficient of the air, the unit is W / (m 2 .K), the value of which depends on the speed of the fan; A is the heat exchange area between the radiator and the air, that is, the outer surface area of ​​the radiator, the unit is m2 , Δt is the temperature difference between the radiator and the air, in K;

[0043] It can be obtained from the formula that lowering the air temperature can increase the temperature difference between the radiator and the air, that is, increase the heat exchange, thereby reducing the cold loss of the TEC cold end, greatly improving its cooling effect, and enhancing the user's comfort experience.

[0044] Especially when using the heat dissipation device in summer, the air temperature is high, which will affect the cooling effect of the heat dissipation back clip. The solution in the embodiment of the present application can cool the temperature of the air at the air inlet by designing a cooling plate structure at the air inlet, thereby improving the heat dissipation effect.

[0045] The liquid cooling diaphragm 160 has a flow channel formed inside, and the flow channel is filled with a liquid heat dissipation medium, and the liquid heat dissipation medium can flow and circulate under the drive of the piezoelectric micro pump, thereby achieving the purpose of heat conduction. The detailed structure of the liquid cooling diaphragm 160 is within the scope of understanding of those skilled in the art and will not be repeated here.

[0046] The material of the thermal conductive protective sheet 170 can be thermal conductive particles doped in silica gel, or the thermal conductive protective sheet 170 can be made of other thermal conductive materials, which can have the function of heat conduction on one hand, and prevent the electronic equipment from being scratched on the other hand, and play a role in protecting the liquid cooling membrane 160. The thickness of the thermal conductive protective sheet 170 is 0.05-0.2mm, and the thermal conductivity is 0.2-100W / mK.

[0047] The heat dissipation device in the embodiment of the present application can greatly improve the heat dissipation efficiency of the heat dissipation device by providing structures such as a semiconductor refrigerator and a liquid cooling diaphragm.

[0048] The heat dissipation device in the application embodiment utilizes the high water content of heat dissipation material layers such as hydrogel to construct a phase change convection cooling inlet screen of heat dissipation layer / hydrogel layer / breathable layer, and designs an enhanced heat dissipation device (back clip) solution for cooling screen. The phase change convection of water swollen in the hydrogel achieves ultra-high heat dissipation performance to reduce the inlet air temperature, thereby increasing the heat exchange between the radiator and the air, reducing the cold loss at the cold end of the TEC, and improving the cooling capacity, which is conducive to enhancing the user's comfort experience.

[0049] See also Figure 8 , Figure 8It is a schematic diagram of the structural composition block diagram of an embodiment of an electronic device of the present application. The electronic device can be a mobile phone, a tablet computer, a laptop computer, a wearable device, etc. The diagram of this embodiment takes a mobile phone as an example. The structure of the electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940, a sensor 950, an audio circuit 960, a wifi module 970, a processor 980, and a power supply 990. Among them, the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960, and the wifi module 970 are respectively connected to the processor 980; the power supply 990 is used to provide power to the entire electronic device.

[0050] Specifically, the RF circuit 910 is used to receive and send signals; the memory 920 is used to store data instruction information; the input unit 930 is used to input information, which may specifically include a touch panel 931 and other input devices 932 such as operation buttons; the display unit 940 may include a display panel 941, etc.; the sensor 950 includes an infrared sensor, a laser sensor, etc., for detecting user approach signals, distance signals, etc.; the speaker 961 and the microphone (or microphone) 962 are connected to the processor 980 through the audio circuit 960 for receiving and sending sound signals; the wifi module 970 is used to receive and transmit wifi signals, and the processor 980 is used to process data information of the electronic device. Regarding the specific structural features of the electronic device, within the scope of understanding of those skilled in the art, no detailed introduction will be given here.

[0051] The above descriptions are only some embodiments of the present application, and do not limit the protection scope of the present application. Any equivalent device or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A heat dissipation device, characterized in that: The heat dissipation device includes a shell and a heat dissipation fan, the heat dissipation fan is arranged in the shell, the shell is provided with an air inlet and an air outlet, the heat dissipation fan circulates the air inside and outside the shell through the air inlet and the air outlet; the air inlet upper cover is provided with a cooling plate, the cooling plate is provided with a cooling material layer and a plurality of air inlet holes arranged through it, and the air can be cooled by the cooling material layer when flowing through the air inlet holes.

2. The heat dissipation device according to claim 1, characterized in that: The material of the cooling material layer includes hydrogel or hydrogel composite material.

3. The heat dissipation device according to claim 2, characterized in that: The structure of the cooling material layer is a hydrogel composite material with a MOFs structure.

4. The heat dissipation device according to claim 2, characterized in that: The material of the cooling material layer is a composite material of hydrogel and graphite.

5. The heat dissipation device according to claim 1, characterized in that: The cooling plate comprises a substrate, and the temperature-reducing material layer is embedded in the substrate and communicated with an air inlet hole on the substrate.

6. The heat dissipation device according to claim 5, characterized in that: The substrate is provided with a plurality of vent holes communicating with the cooling material layer.

7. The heat dissipation device according to claim 5, characterized in that: The opening rate of the air inlet holes on the substrate is 20%-80%.

8. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device further comprises a semiconductor refrigerator and a radiator, and the semiconductor refrigerator and the heat dissipation fan are respectively arranged in contact with the radiator.

9. The heat dissipation device according to claim 8, characterized in that: The heat dissipation device further comprises a liquid cooling membrane, and the liquid cooling membrane is attached to a side of the semiconductor refrigerator away from the heat sink.

10. An electronic device component, characterized in that: The electronic device assembly comprises an electronic device and the heat dissipation device according to any one of claims 1 to 9, wherein a housing of the heat dissipation device is connected to the electronic device, and the heat dissipation device is used to dissipate heat from the electronic device.

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