Automatic glue adding device

Abstract

The invention relates to the technical field of LED packaging, and discloses an automatic glue adding device which comprises a base plate, a glue adding assembly and a pump machine are movably installed on the base plate through an installation support, four sets of sliding frames arranged in a lifting mode are rotatably installed on the glue adding assembly, and suction heads are installed through the sliding frames. The suction head is connected with the air inlet end of the pump machine through a pipeline; four groups of sliding frames (with suction heads) are integrated through the rotary drum, continuous rotation switching is realized under the driving of the servo motor, and the suction heads are automatically lifted through the guide wheels in the rotating process to complete crystal taking, glue adding, transferring and cleaning operations in cooperation with the design of the antiparallelogram cross section of the lifting guide plate, so that the single cycle time is shortened by%, and the production efficiency is improved. And the efficiency bottleneck caused by frequent transposition of the traditional single-suction-head equipment is thoroughly solved.

Description

Technical Field

[0001] The invention relates to the technical field of LED packaging, in particular to an automatic glue adding device. Background Art

[0002] In the LED chip packaging process, the glue sticking device is a key device to achieve reliable connection between the chip and the substrate. The current mainstream glue sticking technology mainly adopts the combination of high-precision visual positioning system and motion control platform, and the glue is accurately distributed to the specified position of the substrate through the glue dispensing valve, and then the chip is picked up and placed by the placement head.

[0003] Since a large number of LED chips need to be transferred during each packaging process and glue is dispensed for each packaging point, the traditional glue-applying device is equipped with a robotic arm. However, the robotic arm has a complex structure, and glue dispensing, attachment and cleaning need to be performed in sequence during the transfer process. The multiple strokes lead to low efficiency. Summary of the invention

[0004] The purpose of the present invention is to provide an automatic glue dispensing device, aiming to solve the problem that the existing LED chip glue dispensing device has a complex structure and multiple strokes resulting in a single efficiency.

[0005] The present invention is implemented as follows: an automatic glue adding device comprises a base plate, a glue adding component and a pump are movably mounted on the base plate through a mounting bracket, four sets of lifting sliding frames are rotatably mounted on the glue adding component, and a suction head is mounted through the sliding frame, and the suction head is connected to the air inlet end of the pump through a pipeline; The substrate is also provided with a first loading and conveying rack and a second loading and conveying rack, respectively. The first loading and conveying rack conveys a carrier, and the second loading and conveying rack conveys a wafer disc. The substrate is located on the first loading and conveying rack and the second loading and conveying rack is also provided with a glue supplying platform, and glue trays and cleaning trays are respectively provided at both ends of the glue supplying platform. A liquid pump is also installed on the glue supplying platform to supply liquid to the glue tray and the cleaning tray respectively.

[0006] Preferably, the mounting bracket comprises a lifting and telescopic machine, a lifting and telescopic part of the lifting and telescopic machine is installed with a lifting tray, and a horizontal telescopic machine is installed on one side of the lifting tray; The telescopic part of the horizontal telescopic machine is equipped with a horizontal support arm, the glue adding component is installed at the end of the horizontal support arm, and a servo motor for driving the glue adding component to rotate is also installed on the horizontal support arm.

[0007] Preferably, the glue adding assembly comprises a support rod, an external bearing of the support rod is connected to a rotating drum, and a switching drum is arranged outside the rotating drum.

[0008] Preferably, side grooves are evenly distributed around the switching cylinder, a guide rod is installed inside the side groove, and a first return spring is sleeved outside the guide rod; The sliding frame is provided with a guide block, the sliding frame is sleeved on the outer side of the guide rod through the guide block, and the bottom end of the first return spring is in contact with the top of the guide block.

[0009] Preferably, limit blocks are evenly distributed on the surrounding surfaces of the switching cylinder, and longitudinal guide grooves corresponding to the limit blocks are opened on the surface of the sliding frame.

[0010] Preferably, a guide wheel is installed at the bottom of the sliding frame, and four lifting guide plates are evenly distributed on the outer side of the bottom of the support rod. The cross-section of the lifting guide plate is an equilateral trapezoid, and the sliding frame slides above the lifting guide plate through the guide wheel.

[0011] Preferably, a telescopic arm is telescopically mounted on the end of the sliding frame, a crystal fixing arm is mounted on the end of the telescopic arm, and the suction head is fixed by the crystal fixing arm.

[0012] Preferably, a sleeve rod is provided on the surface of the sliding frame, and a second return spring and a telescopic rod are respectively provided inside the sleeve rod, and the end of the telescopic rod passes through and extends to the outside of the end of the sleeve rod, and the end of the telescopic rod is connected to the telescopic arm.

[0013] Preferably, the lower end of the support rod is further provided with an end plate, a telescopic adjustment motor is installed inside the end plate, the output shaft of the telescopic adjustment motor is connected with a lead screw, and the external thread of the lead screw is connected with a connecting block; A pressing plate is installed on the top of the connecting block, and an extrusion block corresponding to the pressing plate is installed on the bottom of the telescopic arm. Both the pressing plate and the extrusion block are arranged in a U shape.

[0014] The invention discloses an automatic glue adding device with the following beneficial effects: the invention integrates four sets of sliding frames (with suction heads) through a rotating drum, realizes continuous rotation switching under the drive of a servo motor, and cooperates with the equilateral trapezoidal cross-section design of the lifting and placing guide plate. The suction head is automatically raised and lowered by the guide wheel during the rotation process to complete the operations of crystal retrieval, glue adding, transfer and cleaning. The single cycle time is shortened by %, and the efficiency bottleneck caused by frequent position changes of traditional single suction head equipment is completely solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of an automatic glue adding device provided by an embodiment of the present invention; Figure 2 It is a partial structural schematic diagram of an automatic glue adding device provided by an embodiment of the present invention; Figure 3 Schematic diagram of a glue adding component of an automatic glue adding device provided by an embodiment of the present invention; Figure 4 An automatic glue adding device provided by the embodiment of the present invention Figure 3 Schematic diagram of the structure viewed from above; Figure 5 An automatic glue adding device provided by the embodiment of the present invention Figure 4 Schematic diagram of the AA section structure along the arrow direction; Figure 6 An automatic glue adding device provided by the embodiment of the present invention Figure 5 Schematic diagram of the partial cross-section structure at point B in the middle.

[0016] Marking Description: 1. Base plate; 2. Mounting bracket; 3. Glue adding assembly; 4. Suction head; 5. First loading and conveying rack; 6. Second loading and conveying rack; 7. Glue supply station; 8. Pump; 21. Lifting and telescopic machine; 22. Lifting tray; 23. Horizontal telescopic machine; 24. Horizontal support arm; 31. Rotating drum; 32. Support rod; 33. Switching drum; 34. Sliding frame; 321, lifting guide plate; 322, servo motor; 323, end plate; 324, telescopic adjustment motor; 325, lead screw; 326, connecting block; 327, pressure plate; 331, side groove; 332, guide rod; 333, first return spring; 341, guide block; 342, extrusion block; 343, telescopic arm; 344, crystal fixing arm; 345, limit block; 346, guide wheel; 347, sleeve rod; 348, second return spring; 349, telescopic rod; 51. Carrier; 61. Wafer disc; 71. Glue disc; 72. Cleaning disc; 73. Liquid pump. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0018] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on the present invention. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0019] The implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0020] In this embodiment: Reference Figure 1-2 As shown, a preferred embodiment of the present invention is provided.

[0021] The automatic glue adding device of this embodiment includes a base plate 1, on which a glue adding component 3 and a pump 8 are movably installed through a mounting bracket 2, and four sets of lifting sliding frames 34 are rotatably installed on the glue adding component 3, and a suction head 4 is installed through the sliding frame 34, and the suction head 4 is connected to the air inlet end of the pump 8 through a pipeline; The substrate 1 is also provided with a first loading and conveying rack 5 and a second loading and conveying rack 6, respectively. The first loading and conveying rack 5 conveys a carrier 51, and the second loading and conveying rack 6 conveys a wafer disk 61. The substrate 1 is located between the first loading and conveying rack 5 and the second loading and conveying rack 6, and a glue supplying platform 7 is also provided. A glue tray 71 and a cleaning tray 72 are respectively provided at both ends of the glue supplying platform 7. A liquid pump 73 for supplying liquid to the glue tray 71 and the cleaning tray 72 is also installed on the glue supplying platform 7.

[0022] The mounting bracket 2 includes a lifting telescopic machine 21, a lifting tray 22 is installed on the telescopic part of the lifting telescopic machine 21, a horizontal telescopic machine 23 is installed on one side of the lifting tray 22, a horizontal support arm 24 is installed on the telescopic part of the horizontal telescopic machine 23, the glue applying component 3 is installed at the end of the horizontal support arm 24, and a servo motor 322 for driving the glue applying component 3 to rotate is also installed on the horizontal support arm 24. Through the coordinated control of the lifting and telescopic machine 21, the horizontal telescopic machine 23 and the servo motor 322, the glue applying component 3 can achieve lifting and lowering, horizontal position adjustment and rotation switching of the suction head 4.

[0023] For further information, see Attachment Figure 3-4As shown, the glue adding component 3 includes a support rod 32, which is fixedly connected to the end of the horizontal support arm 24, the outer bearing of the support rod 32 is connected to the rotating cylinder 31, and the outer side of the rotating cylinder 31 is provided with a switching cylinder 33, and the switching cylinder 33 is evenly distributed with side grooves 331 around, and a guide rod 332 is installed inside the side groove 331, and the outer side of the guide rod 332 is sleeved with a first return spring 333, and a guide block 341 is provided on the sliding frame 34, and the sliding frame 34 is sleeved on the outer side of the guide rod 332 through the guide block 341, and the bottom end of the first return spring 333 conflicts with the top of the guide block 341. Under normal circumstances, under the action of the first return spring 333, the guide block 341 will drive the sliding frame 34 to be placed at the bottom of the side groove 331, and the bottom of the sliding frame 34 is installed with a guide wheel 3 46. ​​Four lifting guide plates 321 are evenly distributed on the outer side of the bottom of the support rod 32. The cross-section of the lifting guide plate 321 is an equilateral trapezoid. The sliding frame 34 slides above the lifting guide plate 321 through the guide wheel 346. When the servo motor 322 drives the rotating drum 31 to drive the four suction heads 4 to rotate, the sliding frame 34 will move on the four lifting guide plates 321 through the guide wheel 346, so that the guide block 341 moves up and down in the side groove 331. During the rising process, the guide wheel 346 presses the first reset spring 333. After the suction head 4 leaves the lifting guide plate 321, the first reset spring 333 pushes the guide block 341 to reset, thereby driving the suction head 4 to rise and fall, so that when the suction head 4 passes through the carrier 51, the wafer disk 61, the glue disk 71 and the cleaning disk 72, it can extend into them to perform crystal retrieval, glue addition, transfer and cleaning operations.

[0024] The switching cylinder 33 is evenly distributed with limit blocks 345 on its four sides, and the sliding frame 34 is provided with longitudinal guide grooves corresponding to the limit blocks 345 on its surface, so as to improve the stability of the suction head 4 during the lifting and lowering process.

[0025] In the attached Figure 5-6In the embodiment, a telescopic arm 343 is telescopically installed at the end of the sliding frame 34, a crystal fixing arm 344 is installed at the end of the telescopic arm 343, the suction head 4 is fixed by the crystal fixing arm 344, a sleeve rod 347 is provided on the surface of the sliding frame 34, a second return spring 348 and a telescopic rod 349 are respectively provided inside the sleeve rod 347, the end of the telescopic rod 349 passes through and extends to the outside of the end of the sleeve rod 347, and the end of the telescopic rod 349 is connected to the telescopic arm 343, an end plate 323 is further provided at the lower end of the support rod 32, a telescopic adjustment motor 324 is installed inside the end plate 323, the output shaft of the telescopic adjustment motor 324 is connected to a lead screw 325, the external thread of the lead screw 325 is connected to a connecting block 326, the connecting A pressure plate 327 is installed on the top of the connecting block 326, and an extrusion block 342 corresponding to the pressure plate 327 is installed on the bottom of the telescopic arm 343. The pressure plate 327 and the extrusion block 342 are both U-shaped. The telescopic adjustment motor 324 drives the screw 325 to drive the pressure plate 327 to move horizontally. When the suction head 4 rotates to the position of the pressure plate 327, the pressure plate 327 contacts the extrusion block 342, forcing the telescopic arm 343 to shrink into the sliding frame 34, and at the same time compressing the second reset spring 348. The reset of the second reset spring 348 is used to change the position of the suction head 4 when transferring the wafer. Compared with the traditional robotic arm transferring wafers, there is no need to adjust the movement of the robotic arm itself, which reduces the complexity of the robotic arm joint movement, thereby improving the stability and accuracy of wafer transfer.

[0026] The present invention integrates four sets of sliding frames 34 (with suction heads 4) through the rotating drum 31, realizes continuous rotation switching under the drive of the servo motor 322, and cooperates with the equilateral trapezoidal cross-section design of the lifting and placing guide plate 321. The suction head 4 is automatically raised and lowered by the guide wheel 346 during the rotation process to complete the crystal retrieval, glue addition, transfer and cleaning operations. The single cycle time is shortened by 40%, which completely solves the efficiency bottleneck caused by frequent position changes of traditional single suction head equipment.

[0027] The elastic lifting mechanism composed of the guide rod 332 and the first return spring 333, combined with the limit block 345 of the switching cylinder 33 and the longitudinal guide groove of the sliding frame 34, ensures that the lifting stroke accuracy of the suction head 4 reaches ±0.02mm, which is 60% lower than the vibration amplitude of the traditional cylinder drive method, and is particularly suitable for micro wafer operations with a thickness of ≤0.1mm.

[0028] The telescopic adjustment motor 324 drives the lead screw 325 to drive the pressure plate 327 to move horizontally. Through the contact between the U-shaped extrusion block 342 and the telescopic arm 343, the suction head 4 is forced to automatically shrink and reset (compress the second reset spring 348) when transferring the wafer. There is no need for complex robotic arm joint control, the adjustment response time is shortened to 0.3s, and the positioning repeatability accuracy is improved to ±0.01mm, which significantly reduces the equipment complexity and maintenance costs.

[0029] The spacing between the suction heads 4 can be adjusted through the horizontal telescopic machine 23 and the lifting telescopic machine 21 to adapt to the wafer disc 61 and the carrier 51 of 50-200mm size. The changeover time is compressed from 30 minutes of traditional equipment to 5 minutes, supporting multi-specification mixed-line production and increasing equipment utilization by 35%.

[0030] Compared with the prior art, the present invention achieves high efficiency and reliability of gluing and cleaning operations during wafer processing through precise control, automated operation, multi-functional integration and stable transmission mechanism, thereby significantly improving work efficiency and product quality.

[0031] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An automatic glue adding device, characterized in that: It comprises a base plate, on which a glue-adding component and a pump are movably mounted via a mounting bracket, on which four sets of lifting sliding frames are rotatably mounted, and a suction head is mounted via the sliding frame, and the suction head is connected to the air inlet end of the pump via a pipeline; The substrate is also provided with a first loading and conveying rack and a second loading and conveying rack, respectively. The first loading and conveying rack conveys a carrier, and the second loading and conveying rack conveys a wafer disc. The substrate is located on the first loading and conveying rack and the second loading and conveying rack is also provided with a glue supplying platform, and glue trays and cleaning trays are respectively provided at both ends of the glue supplying platform. A liquid pump is also installed on the glue supplying platform to supply liquid to the glue tray and the cleaning tray respectively.

2. An automatic glue adding device as claimed in claim 1, characterized in that: The mounting bracket includes a lifting and telescopic machine, a lifting tray is installed on the telescopic part of the lifting and telescopic machine, and a horizontal telescopic machine is installed on one side of the lifting tray; The telescopic part of the horizontal telescopic machine is equipped with a horizontal support arm, the glue adding component is installed at the end of the horizontal support arm, and a servo motor for driving the glue adding component to rotate is also installed on the horizontal support arm.

3. The automatic glue adding device according to claim 1, characterized in that: The glue adding assembly comprises a support rod, an external bearing of the support rod is connected with a rotating drum, and a switching drum is arranged outside the rotating drum.

4. An automatic glue adding device as claimed in claim 3, characterized in that: Side grooves are evenly distributed around the switching cylinder, a guide rod is installed inside the side groove, and a first return spring is sleeved outside the guide rod; The sliding frame is provided with a guide block, the sliding frame is sleeved on the outer side of the guide rod through the guide block, and the bottom end of the first return spring is in contact with the top of the guide block.

5. An automatic glue adding device as claimed in claim 4, characterized in that: Limit blocks are evenly distributed on the surrounding surfaces of the switching cylinder, and longitudinal guide grooves corresponding to the limit blocks are opened on the surface of the sliding frame.

6. The automatic glue adding device according to claim 3, characterized in that: A guide wheel is installed at the bottom of the sliding frame, and four lifting guide plates are evenly distributed on the outer side of the bottom of the support rod. The cross-section of the lifting guide plate is an equilateral trapezoidal arrangement, and the sliding frame slides above the lifting guide plate through the guide wheel.

7. An automatic glue adding device as claimed in claim 6, characterized in that: A telescopic arm is telescopically mounted at the end of the sliding frame, a crystal fixing arm is mounted at the end of the telescopic arm, and the suction head is fixed by the crystal fixing arm.

8. An automatic glue adding device as claimed in claim 7, characterized in that: A sleeve rod is arranged on the surface of the sliding frame, a second return spring and a telescopic rod are arranged inside the sleeve rod respectively, the end of the telescopic rod penetrates and extends to the outside of the end of the sleeve rod, and the end of the telescopic rod is connected to the telescopic arm.

9. The automatic glue adding device according to claim 7, characterized in that: The lower end of the support rod is also provided with an end plate, a telescopic adjustment motor is installed inside the end plate, the output shaft of the telescopic adjustment motor is connected with a lead screw, and the external thread of the lead screw is connected with a connecting block; A pressing plate is installed on the top of the connecting block, and an extrusion block corresponding to the pressing plate is installed on the bottom of the telescopic arm. Both the pressing plate and the extrusion block are arranged in a U shape.

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