A silicone thermoset polyamide elastomer containing a boron-boron structure and a method for preparing the same

Abstract

The application discloses a kind of organic silicon thermosetting polyamide elastomer containing boron structure and a preparation method thereof, belong to high polymer material preparation technical field.The organic silicon thermosetting polyamide elastomer containing boron structure of the application, small molecular weight polyamide prepolymer is obtained by pre-polymerization using nylon salt and acidification, then mixed with small molecular weight polyboron siloxane under the action of catalyst under high temperature vacuum copolymerization, and is formed by chemical crosslinking.The organic silicon with boron structure is introduced in the application, and the polyamide segment forms chemical net crosslinking, realizes the change of polyamide elastomer from thermoplastic elastomer to thermosetting elastomer, thereby significantly improve the mechanical strength and high temperature resistance of the material, while maintaining good elongation at break;The polyamide and polyboron siloxane ratio of the organic silicon thermosetting polyamide elastomer containing boron structure is regulated in the application, a series of products with different performance range are obtained, so as to meet the different requirements of users on products.

Description

Technical Field

[0001] This invention belongs to the field of polymer material preparation technology, specifically relating to a boron-containing organosilicon thermosetting polyamide elastomer and its preparation method. Background Technology

[0002] Polyamide elastomers are a type of block copolymer with polyamide as the hard segment and polyether or polyester as the soft segment. As a thermoplastic elastomer, it combines the properties of rubber and thermoplastic plastics. It can be plasticized and molded at high temperatures and exhibits the high elasticity of rubber-like materials at room temperature, possessing excellent toughness, chemical resistance, and abrasion resistance. Therefore, it has been widely welcomed in many fields, such as the electronics industry, sporting goods, and biomedical materials.

[0003] The first successful development and commercialization of polyamide elastomers can be traced back to 1979, achieved by the German company Hüls (later renamed Diamide, now part of the Lanxess Group). Currently, major international producers include the French company Arkema Chemicals. Elastomers and those launched by the German company Evonik E-series polyamide elastomers. In China, major manufacturers include Cangzhou Xuyang Technology Co., Ltd., Zhejiang Xinyuan Technology Co., Ltd., and Baling Petrochemical, but compared to international standards, my country's overall industrialization level in this field still lags behind, and most products needed in the market remain highly dependent on imports.

[0004] As research into the thermoplastic elastic properties of polyamide elastomers deepens, their limitations in strength and high-temperature resistance become apparent. Despite their numerous advantages, they are difficult to use in high-strength or high-temperature environments. In contrast, thermosetting elastomers typically possess higher mechanical strength and elasticity, capable of withstanding greater external forces and deformations while exhibiting excellent resilience. This characteristic makes thermosetting elastomers outstanding in applications requiring high loads and frequent deformation. Furthermore, thermosetting elastomers have better high-temperature resistance and higher decomposition temperatures, allowing them to maintain stable properties at high temperatures without significant physical and chemical changes due to temperature increases.

[0005] Therefore, how to transform polyamide elastomers into thermosetting elastomers to improve their mechanical strength and high-temperature resistance is a problem that needs to be solved.

[0006] In recent years, boron-containing polysiloxanes have attracted much attention from the academic community due to their unique viscoelastic properties. These materials exhibit remarkable non-Newtonian fluid behavior, displaying solid-like characteristics at high strain rates and liquid-like characteristics at low strain rates. Their excellent mechanical properties make them a high-quality component for improving the mechanical properties of plastics. For example, incorporating polyborosiloxanes into EVA materials can effectively enhance the tear strength and damping properties of the material (Li Hui. Study on Dynamic Mechanical Properties of Polyborosiloxane-Modified Natural Rubber and Thermoplastic Elastomers [D]. Xi'an University of Technology, 2020.). Newly developed polyboronsiloxanes have a more stable cross-linked network structure compared to polyborosiloxanes, resulting in a more superior effect on improving plastic properties. For example, using polyboronsiloxanes to modify EVA materials significantly improves tear strength (Wu Jinrong. A Polyboronsiloxane-Modified Plastic and Its Preparation Method: 202111567254.8 [P]. 2024-05-28.). In addition, boron-containing polysiloxanes, due to their high thermal stability, have been used in various industries as heat-resistant adhesives, flame retardants, and heat-resistant coatings. They can also be added to plastics as an excellent high-temperature resistant component for modification (Wu Yanjin, Wu Mingjun, Li Meijiang. Research progress on preparation and application of polyborosiloxanes [J]. Polymer Bulletin, 2012, (02): 94-98.).

[0007] Polyborosiloxanes are multifunctional polymers rich in hydroxyl functional groups in their crosslinked network structure. Theoretically, this polymer has the potential to crosslink with polyamides through chemical reactions, thereby constructing a more complex network structure. This process aims to facilitate the transformation of polyamide elastomers from thermoplastic to thermosetting elastomers, significantly improving their mechanical strength properties and resistance to high-temperature environments. Summary of the Invention

[0008] To address the current shortcomings in the mechanical strength and high-temperature resistance of polyamide elastomers, this invention provides a boron-containing organosilicon thermosetting polyamide elastomer and its preparation method.

[0009] To achieve the above objectives, the present invention employs the following technical solutions:

[0010] A thermosetting polyamide elastomer containing a boron-containing organosilicon structure is obtained by prepolymerizing nylon salt to obtain a low molecular weight polyamide prepolymer, acidifying it, mixing it with a low molecular weight polyboron siloxane, and then copolymerizing it under high temperature and vacuum for a certain time in the presence of a catalyst, and then curing it to form a chemical crosslink.

[0011] Furthermore, the nylon salt is obtained by reacting and mixing dicarboxylic acids (especially dicarboxylic acids having 4 to 20 carbon atoms, preferably dicarboxylic acids having 6 to 18 carbon atoms) and aliphatic or aromatic diamines (especially aliphatic or aromatic diamines having 2 to 20 carbon atoms, preferably aliphatic or aromatic diamines having 6 to 14 carbon atoms) in deionized water in an equimolar ratio and then crystallizing the mixture.

[0012] Furthermore, the structural formula of the nylon salt is: + H3N(diamine)NH3 +- OOC (dicarboxylic acid)COO - .

[0013] Preferably, the dicarboxylic acid is any one of the following: cyclohexyl-1,4-dicarboxylic acid, succinic acid, glutaric acid, adipic acid, heptanoic acid, octanoic acid, azelaic acid, sebacic acid, dodecanoic acid, octadecanoic acid, terephthalic acid, and isophthalic acid.

[0014] Preferably, the aliphatic or aromatic diamine is any one of the following: 1,6-hexanediamine, 1,10-decanediamine, 1,12-diaminododecane, 4,4'-diaminodiphenylmethane, 3,3'-dimethyl-4,4'-diaminodiphenylmethane, 2,2-bis(4-aminophenyl)propane, isophorone diamine, and 2,6-bis(aminomethyl)pyridine.

[0015] Preferably, the dicarboxylic acid is sebacic acid, the aliphatic or aromatic diamine is sebacic diamine, and the nylon salt is nylon 1010 salt.

[0016] Furthermore, the preparation method of the low molecular weight polyamide prepolymer is as follows: add dicarboxylic acid and aliphatic or aromatic diamine in an equal molar ratio to a polymerization reactor, randomly add an appropriate amount of deionized water and 0.5% antioxidant, after the material is completely dissolved, add a small amount of acidifier for acidification, seal the reactor and replace the air in the reactor with high-purity nitrogen, repeat 3 to 5 times, start the heating device, when the temperature reaches 150°C, start the stirrer at a rate of 150 r / min, and maintain this temperature for constant temperature reaction for 30 min to ensure that the material is fully melted and mixed evenly;

[0017] Subsequently, the temperature of the reaction system was raised to 200°C and maintained at this temperature for another 2 hours.

[0018] Then, the pressure inside the reactor is gradually reduced by adjusting the valves until it reaches atmospheric pressure.

[0019] Finally, the reaction product is taken out from the bottom outlet of the reactor, and after cooling, crushing and drying, a low molecular weight polyamide prepolymer is obtained.

[0020] The amount of deionized water added is 30% to 45% of the total mass of dicarboxylic acid and aliphatic or aromatic diamine, preferably 40% of the mass of dicarboxylic acid and diamine.

[0021] The antioxidant is one of antioxidant 1010, antioxidant 1076, antioxidant 1098, antioxidant 168, antioxidant 626, antioxidant 264, antioxidant 2246, antioxidant 3000, and antioxidant 3300. Preferably, the antioxidant is antioxidant 1098.

[0022] The acidifying agent is one of the following dicarboxylic acids: oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, octanoic acid, azelaic acid, sebacic acid, undecanoic acid, dodecanoic acid, octadecanoic acid, etc. Preferably, the acidifying agent is sebacic acid.

[0023] Furthermore, the preparation method of the low molecular weight polyborosiloxane is as follows: hydroxyl-terminated polydimethylsiloxane and tetrahydroxydiborane are dissolved in an appropriate amount of anhydrous methanol solvent at a mass ratio of 200:1, stirred separately at 35°C for 15 min, and then mixed and stirred for 1 h. The anhydrous methanol solvent is removed by rotary evaporator at 55°C and -0.1 MPa to obtain the low molecular weight polyborosiloxane.

[0024] A method for preparing a boron-containing organosilicon thermosetting polyamide elastomer involves mixing a certain mass ratio of polyamide prepolymer with polyboron siloxane and an appropriate amount of catalyst at a certain temperature, pouring the mixture into a stainless steel mold, placing it in a vacuum oven and maintaining a negative pressure of -0.1 MPa, and heating it at a constant temperature to cure, thereby obtaining the boron-containing organosilicon thermosetting polyamide elastomer.

[0025] Furthermore, the mass ratio of the polyamide prepolymer to the polyboron siloxane is 1 to 4:1, preferably 2:1.

[0026] Furthermore, the catalyst is one or a combination of two of the following: hypophosphoric acid, potassium acetate, dibutyltin dilaurate, and tetrabutyl titanate; the amount of catalyst added is 0.1% to 2% of the total mass of the polyamide prepolymer and polyborosiloxane, preferably, the amount of catalyst added is 0.5% to 0.8% of the material added.

[0027] Furthermore, the mixing temperature of the polyamide prepolymer and the polyboron siloxane is 160℃~210℃; the copolymerization temperature of the polyamide prepolymer and the polyboron siloxane is adopted by a gradient heating method, preferably, the reaction is carried out at 210℃-230℃ for 1-3h, and then at 250℃-270℃ for 3-5h.

[0028] Compared with the prior art, the present invention has the following advantages:

[0029] (1) By introducing organosilicon with a boron structure, the polyamide segments form a chemical network crosslink, realizing the transformation of polyamide elastomer from thermoplastic elastomer to thermosetting elastomer, thereby significantly improving the mechanical strength and high temperature resistance of the material, while maintaining good elongation at break.

[0030] (2) The ratio of polyamide to polyboron siloxane in the organosilicon thermosetting polyamide elastomer containing boron structure in this invention has a wide adjustable range. By adjusting the ratio of the two, a series of products with different performance ranges can be obtained, thereby meeting the different requirements of users for products. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram illustrating the principle of synthesizing polyamide prepolymers according to the present invention.

[0033] Figure 2 This is a schematic diagram illustrating the principle of synthesizing organosilicon thermosetting polyamide elastomers containing a boron-bin structure according to the present invention. Detailed Implementation

[0034] To gain a deeper understanding of this invention, we will provide a comprehensive and detailed description. However, this invention has various implementations and is not limited to the specific examples listed herein. These examples are presented to enhance a full understanding of the disclosure of this invention.

[0035] Unless otherwise specified, all materials and reagents used in the following embodiments are commercially available.

[0036] For specific technical details or conditions not explicitly stated in the embodiments, refer to the techniques or conditions described in existing literature in this field, or follow the relevant product manuals.

[0037] Example 1

[0038] A method for preparing organosilicon thermosetting polyamide elastomers containing boron structures

[0039] (1) Add 1461g adipic acid, 1162g hexamethylenediamine, 1049g deionized water, and 13.1g antioxidant 1098 to the polymerization reactor. After the materials are completely dissolved, add 10g adipic acid for acidification. Seal the reactor and replace the air in the reactor with high-purity nitrogen. Repeat this process 3-5 times. Start the heating device. When the temperature reaches 150℃, start the stirrer at a rate of 150r / min and maintain this temperature for 30 minutes to ensure that the materials are fully melted and mixed evenly. Then, raise the temperature of the reaction system to 200℃ and maintain this temperature for 2 hours. After that, gradually reduce the pressure in the reactor by adjusting the valve until it reaches atmospheric pressure. Finally, take out the reaction product from the bottom outlet of the reactor. After cooling, crushing and drying, a low molecular weight polyamide 66 prepolymer is obtained.

[0040] (2) Dissolve 1000g of hydroxyl-terminated polydimethylsiloxane in 500mL of anhydrous methanol solvent, and dissolve 5g of tetrahydroxydiborane in 50mL of anhydrous methanol solvent. Stir each at 35℃ for 15min and then mix and stir for 1h. Remove the anhydrous methanol solvent by rotary evaporator at 55℃ and -0.1MPa to obtain low molecular weight polydiboranesiloxane.

[0041] (3) Mix 2000g of polyamide 66 prepolymer, 1000g of polyboron siloxane and 15g of hypophosphoric acid and stir thoroughly at 200℃. Pour into a stainless steel mold and place in a vacuum oven with a negative pressure of -0.1MPa. React at 230℃ for 2.5h and then heat to 270℃ for 4h to obtain a boron-containing organosilicon thermosetting polyamide 66 elastomer with a polyamide to polyboron siloxane content ratio of 2:1.

[0042] Example 2

[0043] A method for preparing a boron-containing organosilicon thermosetting polyamide elastomer, the steps are the same as in Example 1, except that: (3) 1800g of polyamide 66 prepolymer, 600g of polyboron siloxane and 12g of hypophosphoric acid are mixed and stirred thoroughly at 200°C, poured into a stainless steel mold, placed in a vacuum oven and kept under negative pressure of -0.1MPa, reacted at 230°C for 2.5h, and then heated to 270°C for 4h to obtain a boron-containing organosilicon thermosetting polyamide 66 elastomer with a polyamide to polyboron siloxane content ratio of 3:1.

[0044] Example 3

[0045] A method for preparing a boron-containing organosilicon thermosetting polyamide elastomer, the steps are the same as in Example 1, except that: (3) 2000g of polyamide 66 prepolymer, 500g of polyboron siloxane and 12.5g of hypophosphoric acid are mixed and stirred thoroughly at 200°C, poured into a stainless steel mold, placed in a vacuum oven and kept under negative pressure of -0.1MPa, reacted at 230°C for 2.5h, and then heated to 270°C for 4h to obtain a boron-containing organosilicon thermosetting polyamide 66 elastomer with a polyamide to polyboron siloxane content ratio of 4:1.

[0046] Example 4

[0047] A method for preparing a boron-containing organosilicon thermosetting polyamide elastomer: (1) 1348g sebacic acid, 1149g decanediamine, 1124g deionized water, and 12.5g antioxidant 1098 are added to a polymerization reactor. After the materials are completely dissolved, 10g sebacic acid is added for acidification. The reactor is sealed and the air inside the reactor is replaced with high-purity nitrogen. This process is repeated 3-5 times. The heating device is started. When the temperature reaches 150°C, the stirrer is started and stirred at a rate of 150r / min. The temperature is maintained at this temperature for 30 minutes to ensure that the materials are fully melted and mixed evenly. Then, the temperature of the reaction system is raised to 200°C and maintained at this temperature for 2 hours. After that, the pressure inside the reactor is gradually reduced by adjusting the valve until it reaches atmospheric pressure. Finally, the reaction product is taken out from the bottom outlet of the reactor. After cooling, crushing and drying, a low molecular weight polyamide 1010 prepolymer is obtained.

[0048] (2) Dissolve 1000g of hydroxyl-terminated polydimethylsiloxane in 500mL of anhydrous methanol solvent, and dissolve 5g of tetrahydroxydiborane in 50mL of anhydrous methanol solvent. Stir each at 35℃ for 15min and then mix and stir for 1h. Remove the anhydrous methanol solvent by rotary evaporator at 55℃ and -0.1MPa to obtain low molecular weight polydiboranesiloxane.

[0049] (3) Mix 2000g of polyamide 1010 prepolymer, 1000g of polyboron siloxane and 15g of hypophosphoric acid and stir thoroughly at 200℃. Pour into a stainless steel mold and place in a vacuum oven with a negative pressure of -0.1MPa. React at 220℃ for 2.5h and then raise the temperature to 260℃ for 4h to obtain a boron-containing organosilicon thermosetting polyamide 1010 elastomer with a polyamide to polyboron siloxane content ratio of 2:1.

[0050] Comparative Example 1

[0051] (1) Add 1461g adipic acid, 1162g hexamethylenediamine, 1049g deionized water, and 13.1g antioxidant 1098 to the polymerization reactor. After the materials are completely dissolved, add 10g adipic acid for acidification. Seal the reactor and replace the air in the reactor with high-purity nitrogen. Repeat this process 3-5 times. Start the heating device. When the temperature reaches 150℃, start the stirrer at a rate of 150r / min and maintain this temperature for 30 minutes to ensure that the materials are fully melted and mixed evenly. Then, raise the temperature of the reaction system to 200℃ and maintain this temperature for 2 hours. After that, gradually reduce the pressure in the reactor by adjusting the valve until it reaches atmospheric pressure. Finally, take out the reaction product from the bottom outlet of the reactor. After cooling, crushing and drying, a low molecular weight polyamide 66 prepolymer is obtained.

[0052] (2) Mix 2000g of polyamide 66 prepolymer, 1000g of hydroxyl-terminated polydimethylsiloxane and 15g of hypophosphoric acid and stir thoroughly at 200℃. Pour into a stainless steel mold and place in a vacuum oven with a negative pressure of -0.1MPa. React at 230℃ for 2.5h and then raise the temperature to 270℃ for 4h to obtain a silicone thermoplastic polyamide 66 elastomer with a polyamide to hydroxyl-terminated polydimethylsiloxane content ratio of 2:1.

[0053] Comparative Example 2

[0054] (1) Add 1348g sebacic acid, 1149g decanediamine, 1124g deionized water, and 12.5g antioxidant 1098 to the polymerization reactor. After the materials are completely dissolved, add 10g sebacic acid for acidification. Seal the reactor and replace the air in the reactor with high-purity nitrogen. Repeat this process 3-5 times. Start the heating device. When the temperature reaches 150℃, start the stirrer at a rate of 150r / min and maintain this temperature for 30 minutes to ensure that the materials are fully melted and mixed evenly. Then, raise the temperature of the reaction system to 200℃ and maintain this temperature for 2 hours. After that, gradually reduce the pressure in the reactor by adjusting the valve until it reaches atmospheric pressure. Finally, take out the reaction product from the bottom outlet of the reactor. After cooling, crushing and drying, a low molecular weight polyamide 1010 prepolymer is obtained.

[0055] (2) Mix 2000g of polyamide 1010 prepolymer, 1000g of hydroxyl-terminated polydimethylsiloxane and 15g of hypophosphoric acid and stir thoroughly at 200℃. Pour into a stainless steel mold and place in a vacuum oven with a negative pressure of -0.1MPa. React at 220℃ for 2.5h and then raise the temperature to 260℃ for 4h to obtain a silicone thermoplastic polyamide 1010 elastomer with a polyamide to hydroxyl-terminated polydimethylsiloxane content ratio of 2:1.

[0056] Mechanical property testing:

[0057] The mechanical properties (tensile strength and elongation at break) of the polyamide elastomer materials of Examples 1-4 and Comparative Examples 1-2 were tested according to GB / T1040.2-2022 standard "Determination of tensile properties of plastics - Part 2: Test conditions for molded and extruded plastics". The total length l3 was 170 mm, the length of the narrow parallel portion l1 was 80.0 ± 2 mm, the radius r was 24 ± 1 mm, the distance of the wide parallel portion l2 was 109.3 ± 3.2 mm, the end width b2 was 20.0 ± 0.2 mm, the width of the narrow portion b1 was 10.0 ± 0.2 mm, the preferred thickness h was 4.0 ± 0.2 mm, the gauge length L0 was 75.0 ± 0.5 mm, and the initial distance between the fixtures L was 115 ± 1 mm. The samples were obtained from the polyamide elastomer materials cured in a specific stainless steel mold, with 5 samples per group, and the average value was taken.

[0058] Thermal performance testing:

[0059] The 5% weight loss temperature of the polyamide elastomer materials in Examples 1-4 and Comparative Examples 1-2 was determined by thermogravimetric analysis and used as the basis for evaluating the high-temperature resistance of the materials.

[0060] The mechanical and thermal properties of the polyamide elastomer materials of Examples 1-4 and Comparative Examples 1-2, as well as foreign polyamide elastomer material samples with polyether as the soft segment, are shown in Table 1:

[0061] Table 1. Performance test results of different polyamide elastomer materials

[0062]

[0063] The mechanical and thermal properties test results of the above embodiments and comparative examples show that: compared with the chain polyamide elastomer with hydroxyl-terminated polydimethylsiloxane as the soft segment, the introduction of boron-containing organosilicon into the polyamide makes the polyamide segments form a chemical network crosslink, and transforms it from a thermoplastic elastomer to a thermosetting elastomer, which can significantly improve its tensile strength and high temperature resistance, while still having a good elongation at break.

[0064] Compared to traditional thermoplastic polyamide elastomer materials with polyether as the soft segment, the tensile strength is slightly improved, the elongation at break is slightly lower but still good, and the high temperature resistance is significantly enhanced.

[0065] Contents not described in detail in this specification are prior art known to those skilled in the art. Although illustrative specific embodiments of the invention have been described above to facilitate understanding by those skilled in the art, it should be understood that the invention is not limited to the scope of the specific embodiments. Various modifications are readily apparent to those skilled in the art as long as they fall within the spirit and scope of the invention as defined and determined by the appended claims, and all inventions utilizing the concept of this invention are protected.

Claims

1. A thermosetting organosilicon polyamide elastomer containing a boron-bin structure, characterized in that: A low molecular weight polyamide prepolymer was obtained by prepolymerization with nylon salt and acidified. Then, it was mixed with a low molecular weight polyboron siloxane and copolymerized under high temperature and vacuum for a certain time in the presence of a catalyst. The prepolymer was then cured to form a chemical crosslink.

2. The organosilicon thermosetting polyamide elastomer containing a boron structure according to claim 1, characterized in that: The nylon salt is obtained by reacting and mixing dicarboxylic acid and aliphatic or aromatic diamine in deionized water in an equimolar ratio and then crystallizing. The structural formula of the nylon salt is: ； R1 represents a residue of a dicarboxylic acid, which is any one of the following: cyclohexyl-1,4-dicarboxylic acid, succinic acid, glutaric acid, adipic acid, heptaic acid, octanoic acid, azelaic acid, sebacic acid, dodecanoic acid, octadecanoic acid, terephthalic acid, isophthalic acid; R2 represents a residue of an aliphatic or aromatic diamine, which is any one of the following: 1,6-hexanediamine, 1,10-decanediamine, 1,12-diaminododecane, 4,4'-diaminodiphenylmethane, 3,3'-dimethyl-4,4'-diaminodiphenylmethane, 2,2-bis(4-aminophenyl)propane, and 2,6-bis(aminomethyl)pyridine.

3. The organosilicon thermosetting polyamide elastomer containing a boron-containing structure according to claim 1, characterized in that: The preparation method of the low molecular weight polyamide prepolymer is as follows: dicarboxylic acid and aliphatic or aromatic diamine are added to a polymerization reactor in an equimolar ratio, and then an appropriate amount of deionized water and 0.5% antioxidant are added. The 0.5% antioxidant is 0.5% of the total mass of dicarboxylic acid and aliphatic or aromatic diamine. After the materials are completely dissolved, a small amount of acidifying agent is added for acidification. Under sealed conditions, the air is replaced with high-purity nitrogen. When the temperature reaches 150°C, the mixture is stirred at a rate of 150 r / min and kept at this temperature for 30 min. Then, the temperature of the reaction system is raised to 200°C and kept at this temperature for 2 h. After that, the pressure in the reactor is gradually reduced until it reaches atmospheric pressure. Finally, the reaction product is taken out, cooled, crushed and dried to obtain the low molecular weight polyamide prepolymer.

4. The organosilicon thermosetting polyamide elastomer containing a boron-containing structure according to claim 3, characterized in that: The amount of deionized water added is 30% to 45% of the total mass of dicarboxylic acid and aliphatic or aromatic diamine; the antioxidant is one of antioxidant 1010, antioxidant 1076, antioxidant 1098, antioxidant 168, antioxidant 626, antioxidant 264, and antioxidant 2246; the acidifying agent is one of oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, octanoic acid, azelaic acid, sebacic acid, undecanoic acid, dodecanoic acid, and octadecanoic acid.

5. The organosilicon thermosetting polyamide elastomer containing a boron structure according to claim 1, characterized in that: The method for preparing the low molecular weight polyborosiloxane is as follows: hydroxyl-terminated polydimethylsiloxane and tetrahydroxydiborane are dissolved in an appropriate amount of anhydrous methanol solvent at a mass ratio of 200:

1. The solutions are stirred separately at 35°C for 15 min and then mixed and stirred for 1 h. The anhydrous methanol solvent is removed by rotary evaporation at 55°C and -0.1 MPa to obtain the low molecular weight polyborosiloxane.

6. A method for preparing a boron-containing organosilicon thermosetting polyamide elastomer, characterized in that: A certain mass ratio of polyamide prepolymer, polyboron siloxane, and an appropriate amount of catalyst are thoroughly mixed at a certain temperature, poured into a stainless steel mold, placed in a vacuum oven with a negative pressure of -0.1 MPa, and heated to a constant temperature for curing to obtain a boron-containing organosilicon thermosetting polyamide elastomer.

7. The method for preparing a boron-containing organosilicon thermosetting polyamide elastomer according to claim 6, characterized in that: The mass ratio of the polyamide prepolymer to the polyborosiloxane is 1~4:

1.

8. The method for preparing a boron-containing organosilicon thermosetting polyamide elastomer according to claim 6, characterized in that: The catalyst is one or a combination of two of the following: hypophosphoric acid, potassium acetate, dibutyltin dilaurate, and tetrabutyl titanate; the amount of catalyst added is 0.1% to 2% of the total mass of the polyamide prepolymer and polyboron siloxane.

9. The method for preparing a boron-containing organosilicon thermosetting polyamide elastomer according to claim 6, characterized in that: The polyamide prepolymer and polyboron siloxane are mixed at a temperature of 160℃~210℃; the polyamide prepolymer and polyboron siloxane are copolymerized at a gradient temperature, reacting at 210℃~230℃ for 1~3 hours, and then at 250℃-270℃ for 3~5 hours.

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