A process for the preparation of a tensile resistant organic resin

Abstract

The application belongs to the technical field of resin materials, and particularly relates to a preparation method of a tensile organic resin. The preparation method of the organic resin comprises the following steps: mixing epoxy resin, composite polyol, metal-organic framework material with a three-dimensional network structure and a curing agent, heating and curing to obtain the organic resin; the composite polyol comprises at least one of pentaerythritol, trimethylolpropane, p-hydroxybenzyl alcohol and p-hydroxyphenethyl alcohol. The organic resin takes epoxy resin as a main component, takes composite polyol as an auxiliary component, is modified by the metal-organic framework material with the three-dimensional network structure, is added with the curing agent, makes the epoxy resin and the composite polyol have a cross-linking and curing reaction, forms a stable three-dimensional space network structure together with the metal-organic framework material with the three-dimensional network structure, and thus the tensile strength of the organic resin is significantly improved, and the organic resin has good wear resistance.

Description

Technical Field

[0001] This invention belongs to the field of resin materials technology, and specifically relates to a method for preparing a tensile-resistant organic resin. Background Technology

[0002] Epoxy resin is a thermosetting resin with good corrosion resistance and insulation properties, making it widely used. However, its tensile strength and abrasion resistance are not ideal, which significantly reduces the service life of epoxy resin products.

[0003] Therefore, there is an urgent need to provide a method for preparing a tensile-strength organic resin. Furthermore, the organic resin also has good wear resistance, which is beneficial for the application of the organic resin. Summary of the Invention

[0004] The present invention aims to at least solve one of the technical problems existing in the prior art. The present invention provides a method for preparing a tensile-strength organic resin. The organic resin prepared by the method of the present invention has good tensile strength, for example, a tensile strength of not less than 94 MPa, and furthermore, the organic resin also has good wear resistance.

[0005] To address the above problems, the present invention provides the following technical solution:

[0006] A method for preparing a tensile-resistant organic resin includes the following steps:

[0007] Epoxy resin, composite polyol, metal-organic framework material with a three-dimensional network structure, and curing agent are mixed and cured by heating to obtain the organic resin.

[0008] The composite polyol includes pentaerythritol, trimethylolpropane, and at least one of p-hydroxybenzyl alcohol or p-hydroxyphenylethanol.

[0009] Preferably, the composite polyol comprises, by weight, 5-20 parts pentaerythritol, 3-10 parts trimethylolpropane, and 1-8 parts p-hydroxybenzyl alcohol and / or p-hydroxyphenylethanol; more preferably, the composite polyol comprises, by weight, 5-15 parts pentaerythritol, 3-8 parts trimethylolpropane, and 1-7 parts p-hydroxybenzyl alcohol and / or p-hydroxyphenylethanol.

[0010] Preferably, the epoxy resin is selected from at least one of bisphenol A type epoxy resin and bisphenol F type epoxy resin.

[0011] Preferably, the metal-organic framework material with a three-dimensional network structure is a three-dimensional network structure comprising cobalt ions, 4,4'-bis(4-pyridyl)biphenyl ligands, oxalic acid ligands, and phosphotungstic acid anions. The molecular formula of the metal-organic framework material with a three-dimensional network structure is C3. 210 H 156 N 18 O 92 P2W 18 Co9.

[0012] Preferably, the curing agent comprises isocyanate and imidazole.

[0013] Preferably, the isocyanate is selected from at least one of hexamethylene diisocyanate, toluene diisocyanate, and diisohexylmethane diisocyanate.

[0014] Preferably, the imidazole is selected from at least one of 2-methylimidazole and 1-benzyl-2-methylimidazole.

[0015] Preferably, in the curing agent, the weight ratio of isocyanate to imidazole is 1:(1-10), more preferably 1:(2-8).

[0016] Preferably, the weight ratio of the epoxy resin, composite polyol, metal-organic framework material with a three-dimensional network structure, and curing agent is 70:(5-20):(0.5-3.5):(15-30); more preferably, the weight ratio of the epoxy resin, composite polyol, metal-organic framework material with a three-dimensional network structure, and curing agent is 70:(8-15):(1.5-2.5):(20-25).

[0017] Preferably, polydimethylsiloxane is added before mixing. This acts as an antifoaming agent, reducing air bubbles in the prepared organic resin and improving its tensile strength and wear resistance.

[0018] Preferably, the curing temperature is 70-100℃ for 1-3 hours, followed by 140-150℃ for 1-3 hours.

[0019] Preferably, nano-tungsten disulfide is added before mixing.

[0020] Preferably, the weight ratio of the metal-organic framework material with a three-dimensional network structure to nano-tungsten disulfide is 1:(0.1-0.5). Adding a small amount of nano-tungsten disulfide to the epoxy resin and composite polyol system, and ensuring uniform dispersion of the nano-tungsten disulfide in the metal-organic framework material with a three-dimensional network structure, is beneficial for improving the wear resistance of the organic resin.

[0021] Preferably, after the mixing is completed, the resulting mixture is poured into a mold and then cured. This yields an organic resin with a specific shape, which can be directly used as a component in equipment.

[0022] A tensile-resistant organic resin is prepared by the above-described preparation method.

[0023] An apparatus comprising the aforementioned organic resin.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] The organic resin of this invention uses epoxy resin as the main component and a complex polyol (this invention selects specific polyols, forming a complex polyol through dendritic pentaerythritol, trimethylolpropane, and p-hydroxybenzyl alcohol or p-hydroxyphenylethanol containing aromatic benzene rings; the complex polyol undergoes cross-linking and curing with isocyanate to form a rich cross-linked network structure) as an auxiliary component. Under the modification of a metal-organic framework material with a three-dimensional network structure, the addition of a curing agent causes the epoxy resin and the complex polyol to undergo a cross-linking and curing reaction, forming a stable three-dimensional spatial network structure together with the metal-organic framework material with a three-dimensional network structure, thereby significantly improving the tensile strength of the organic resin and also giving the organic resin good wear resistance. Detailed Implementation

[0026] To enable those skilled in the art to more clearly understand the technical solutions described in this invention, the following embodiments are provided for illustration. It should be noted that the following embodiments do not constitute a limitation on the scope of protection claimed by this invention.

[0027] Unless otherwise specified, the raw materials, reagents or devices used in the following examples are available from conventional commercial sources or can be obtained by existing known methods.

[0028] The metal-organic framework material with a three-dimensional network structure used in the following examples was prepared in Example 1 of CN117964909A.

[0029] Example 1

[0030] A method for preparing a tensile-resistant organic resin includes the following steps:

[0031] Epoxy resin (bisphenol A type epoxy resin), composite polyol, metal-organic framework material with three-dimensional network structure, curing agent, and polydimethylsiloxane are mixed at a stirring rate of 800 rpm for 40 minutes. After mixing, the resulting mixture is poured into a mold and heated for curing. The curing temperature is 80℃ for 2 hours, followed by 150℃ for 2 hours. After cooling to room temperature, organic resin is obtained.

[0032] The complex polyol, by weight, consists of the following components: 10 parts pentaerythritol, 5 parts trimethylolpropane, and 4 parts p-hydroxybenzyl alcohol.

[0033] The weight ratio of epoxy resin, composite polyol, metal-organic framework material with three-dimensional network structure, and curing agent is 70:15:1:20.

[0034] The weight ratio of epoxy resin to polydimethylsiloxane is 70:1;

[0035] The curing agent is composed of toluene diisocyanate and 1-benzyl-2-methylimidazole in a weight ratio of 1:5.

[0036] Example 2

[0037] A method for preparing a tensile-resistant organic resin includes the following steps:

[0038] Epoxy resin (bisphenol A type epoxy resin), composite polyol, metal-organic framework material with three-dimensional network structure, curing agent, and polydimethylsiloxane are mixed at a stirring rate of 800 rpm for 40 minutes. After mixing, the resulting mixture is poured into a mold and heated for curing. The curing temperature is 80℃ for 2 hours and then 145℃ for 3 hours. After cooling to room temperature, organic resin is obtained.

[0039] The complex polyol, by weight, consists of the following components: 12 parts pentaerythritol, 6 parts trimethylolpropane, and 5 parts p-hydroxyphenylethanol.

[0040] The weight ratio of epoxy resin, composite polyol, metal-organic framework material with three-dimensional network structure, and curing agent is 70:10:1.5:23.

[0041] The weight ratio of epoxy resin to polydimethylsiloxane is 70:1;

[0042] The curing agent is composed of hexamethylene diisocyanate and 1-benzyl-2-methylimidazole in a weight ratio of 1:3.

[0043] Example 3

[0044] A method for preparing a tensile-resistant organic resin includes the following steps:

[0045] Epoxy resin (bisphenol A type epoxy resin), composite polyol, metal-organic framework material with three-dimensional network structure, curing agent, nano-tungsten disulfide, and polydimethylsiloxane were mixed at a stirring rate of 800 rpm for 40 minutes. After mixing, the resulting mixture was poured into a mold and heated for curing. The curing temperature was 80℃ for 2 hours, followed by 150℃ for 2 hours. The mixture was then cooled to room temperature to obtain organic resin.

[0046] The complex polyol, by weight, consists of the following components: 10 parts pentaerythritol, 5 parts trimethylolpropane, and 4 parts p-hydroxybenzyl alcohol.

[0047] The weight ratio of epoxy resin, composite polyol, metal-organic framework material with three-dimensional network structure, and curing agent is 70:15:1:20.

[0048] The weight ratio of epoxy resin to polydimethylsiloxane is 70:1;

[0049] The weight ratio of the metal-organic framework material with a three-dimensional network structure to nano-tungsten disulfide is 1:0.1;

[0050] The curing agent is composed of toluene diisocyanate and 1-benzyl-2-methylimidazole in a weight ratio of 1:5.

[0051] Comparative Example 1

[0052] Compared with Example 1, the only difference in Comparative Example 1 is that an equal amount of trimethylolpropane was used instead of pentaerythritol in Example 1, while the other raw material composition and preparation process were the same as in Example 1.

[0053] Comparative Example 2

[0054] Compared with Example 1, the only difference in Comparative Example 2 is that an equal amount of trimethylolpropane is used instead of p-hydroxybenzyl alcohol in Example 1, while the other raw material composition and preparation process are the same as in Example 1.

[0055] Comparative Example 3

[0056] Compared with Example 1, the only difference in Comparative Example 3 is that the metal-organic framework-derived nickel silicate prepared in Example 2 of CN113929105A is used instead of the metal-organic framework material with a three-dimensional network structure in Example 1. The other raw material composition and preparation process are the same as in Example 1.

[0057] Product effectiveness test

[0058] The organic resins prepared in the above examples and comparative examples were used as samples, and their tensile strength and wear resistance were tested according to the following methods. The results are shown in Table 1, where the data are the average values ​​of three tests.

[0059] Uniaxial tensile properties were tested according to GB / T1040-2006. The specimen was a 1BA dumbbell type, and the test rate was 2 mm / min until the specimen broke.

[0060] The sliding dry friction performance was tested according to GB / T3960-2016. The sample dimensions were 30 mm long, 6 mm wide, and 70 mm high. Before testing, the sample was conditioned for 20 hours at a specified room temperature (23±5)℃ and relative humidity (50±5)%. The test was then conducted under the same temperature and humidity conditions. During the test, the sample remained stationary. The test ring (material 45) was used. # The steel sample was rotated at 200 rpm for 2 hours under a load of 196 N. The mass wear amount m = m1 - m2, where m1 is the mass of the sample before wear and m2 is the mass of the sample after wear. The smaller the m, the better the wear resistance.

[0061] Table 1

[0062]

[0063] As can be seen from Table 1, the organic resin prepared in the embodiments of the present invention has significantly improved tensile strength and wear resistance compared with the comparative example.

[0064] As can be seen from Examples 1 and Comparative Examples 1-3, the composite polyol of the present invention exhibits selectivity in its composition. This is mainly achieved by forming a composite polyol from dendritic pentaerythritol, trimethylolpropane, and p-hydroxybenzyl alcohol or p-hydroxyphenylethanol containing aromatic benzene rings. The composite polyol undergoes cross-linking and curing with isocyanate, thereby forming a rich cross-linked network structure. Combined with other components, this improves the tensile strength and wear resistance of the final organic resin. The present invention also exhibits selectivity in the type of organic framework material. The metal-organic framework material with a three-dimensional network structure used in the present invention provides a solid and stable structural basis for the cross-linking and curing reaction between epoxy resin, composite polyol, and curing agent due to its specific three-dimensional network structure, resulting in an organic resin with good tensile strength and good wear resistance.

[0065] The above description outlines the basic principles, main features, and advantages of this invention. Those skilled in the art should understand that the scope of protection of this invention is not limited to the above embodiments. Various changes and modifications can be made to this invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the invention as claimed.

Claims

1. A method for preparing an organic resin, characterized in that, Includes the following steps: Epoxy resin, composite polyol, metal-organic framework material with a three-dimensional network structure, and curing agent are mixed and cured by heating to obtain the organic resin. The composite polyol, by weight, includes 5-20 parts pentaerythritol, 3-10 parts trimethylolpropane, and 1-8 parts p-hydroxybenzyl alcohol and / or p-hydroxyphenylethanol. The metal-organic framework material with a three-dimensional network structure is a three-dimensional network structure comprising cobalt ions and 4,4'-bis(4-pyridyl)biphenyl ligands, oxalic acid ligands and phosphotungstate anions.

2. The preparation method according to claim 1, characterized in that, The epoxy resin is selected from at least one of bisphenol A type epoxy resin and bisphenol F type epoxy resin.

3. The preparation method according to claim 1, characterized in that, The curing agent includes isocyanate and imidazole.

4. The preparation method according to claim 3, characterized in that, The isocyanate is selected from at least one of hexamethylene diisocyanate, toluene diisocyanate, and diisohexylmethane diisocyanate; the imidazole is selected from at least one of 2-methylimidazolium and 1-benzyl-2-methylimidazolium; in the curing agent, the weight ratio of isocyanate to imidazole is 1:(1-10).

5. The preparation method according to any one of claims 1-4, characterized in that, The weight ratio of the epoxy resin, composite polyol, metal-organic framework material with a three-dimensional network structure, and curing agent is 70:(5-20):(0.5-3.5):(15-30).

6. The preparation method according to any one of claims 1-4, characterized in that, Before mixing, polydimethylsiloxane is added; and / or the curing temperature is 70-100°C for 1-3 hours, followed by 140-150°C for 1-3 hours.

7. An organic resin, characterized in that, It is prepared by the preparation method according to any one of claims 1-6.

8. A device, characterized in that, The organic resin prepared by the preparation method according to any one of claims 1-6 or the organic resin according to claim 7.

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