Photovoltaic adhesive film and preparation method thereof
By adding organic salt additives to the basic formula of photovoltaic films, the problems of film shrinkage and appearance requirements are solved, and the production speed and shrinkage are improved under conventional conditions, while improving the PID resistance of photovoltaic modules.
Patent Information
- Application Number
- CN202411986378.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-05-06
AI Technical Summary
In the photovoltaic industry, the shrinkage rate and appearance of the adhesive film are strictly required. The existing technology reduces the shrinkage rate by increasing the power of the tempering lamp, but this can easily lead to yellowing of the adhesive film, poor appearance, and the production speed cannot be improved under conventional processing conditions.
By adding organic salt additives composed of organic cations and organic anions to the base formula, the flow rate and anti-PID performance of the adhesive film are significantly improved, and the shrinkage rate is reduced.
It achieves improved production speed, reduced shrinkage under conventional processing conditions, while maintaining a good appearance, and the power attenuation of photovoltaic modules after PID testing is lower, which is better than packaging films without organic salts.
Smart Images

Figure BDA0005222677440000161 
Figure BDA0005222677440000171
Abstract
Description
Technical Field
[0001] The embodiments of the present invention generally relate to the technical field of photovoltaic encapsulation adhesive films, and more particularly to a photovoltaic adhesive film and a preparation method thereof. Background Art
[0002] In recent years, the photovoltaic industry has experienced rapid development, which has led to increased pressure from overcapacity and intensified competition on the supply side. As a result, the entire photovoltaic production chain from top to bottom needs to increase high-end production capacity and gradually eliminate low-end production capacity.
[0003] In the face of this new round of cyclical lows in the photovoltaic industry, cost reduction and efficiency improvement are driving the entire photovoltaic industry. Similarly, for the film industry, increasing production speed can reduce manufacturing costs. However, the film used in photovoltaic modules has strict requirements on shrinkage and appearance. The industry mainly reduces the shrinkage of the film by increasing the power of the tempering lamp, but increasing the power of the tempering lamp often causes the film to turn yellow and have a poor appearance.
[0004] Therefore, in this field, it is desired to develop an encapsulation film that does not require increasing the power of the tempering lamp and can increase the production speed under conventional processing conditions, and the shrinkage rate and appearance can meet the requirements of the photovoltaic industry. Summary of the invention
[0005] In order to solve the above problems, the present invention provides a photovoltaic film with high line speed and anti-PID. The high line speed film is made by adding organic cations and organic anions to the basic formula to form an organic salt additive. The addition of the organic salt additive significantly improves the flow rate of the film and reduces the shrinkage rate during the resin extrusion film forming process. After the high line speed film with added organic salt is packaged with a photovoltaic cell into a photovoltaic module, a PID test is performed. After PID192 aging, the power of the photovoltaic module decays by 1.5%, which is better than the power attenuation of 4% of the packaging film without adding organic salt.
[0006] According to an embodiment of the present invention, a photovoltaic adhesive film and a preparation method thereof are provided.
[0007] In the first aspect of the present invention, a photovoltaic adhesive film is provided, wherein the raw materials include the following components in weight percentage: base resin: 100 parts; organic salt: 0.1-1 parts; initiator: 0-2 parts; auxiliary cross-linking agent: 0-2 parts; coupling agent: 0.1-2 parts; wherein the base resin is TPO, POE or EVA.
[0008] Furthermore, if the base resin is TPO, the amount of the initiator is 0, and the amount of the auxiliary cross-linking agent is 0.
[0009] Furthermore, if the base resin is POE or EVA, the initiator is selected from the peroxide initiator: at least one of tert-butyl peroxide 2-ethylhexyl carbonate, tert-amyl peroxide 2-ethylhexyl carbonate, 2,5-dimethyl-2,5-bis(tert-butyl peroxide)hexane, tert-butyl peroxide-3,5,5-trimethylhexanoate, di(4-methylbenzoyl)peroxide, dibenzoyl peroxide, 1,1-di-tert-butyl peroxide cyclohexane, tert-butyl peroxide-2-ethylhexyl carbonate, n-butyl-4,4-di(tert-butyl peroxide)valerate, diisopropylbenzene peroxide, α,α′-bis(tert-butyl peroxide)-1,3-diisopropylbenzene and 1,1-bis(tert-butyl peroxy)-3,3,5-trimethylcyclohexane.
[0010] Furthermore, if the base resin is POE or EVA, the auxiliary cross-linking agent is at least one of triallyl isocyanurate, triallyl cyanurate and acrylic auxiliary cross-linking agent.
[0011] Furthermore, the melting point of the organic salt is in the range of 70-150 degrees, and the organic salt is composed of organic cations and organic anions.
[0012] Furthermore, the organic cation is at least one of 1-alkyl-3-methylimidazolium cation, 1-alkylpyridinium cation, dialkylimidazolium cation, alkylpyridinium cation, alkylammonium cation, and alkylphosphine cation; the organic anion can be at least one of dicyanamide anion, trifluoromethanesulfonate anion, alkyl sulfonate anion, alkyl phosphate anion, etc.
[0013] Furthermore, the coupling agent is at least one of a liquid coupling agent and a graft coupling agent masterbatch.
[0014] Furthermore, the liquid coupling agent is at least one of a vinyl silane coupling agent, a chloroalkyl silane coupling agent, an aminoalkyl silane coupling agent, an epoxyalkyl silane coupling agent, a methacryloxyalkyl silane coupling agent, a sulfur-containing hydrocarbon silane coupling agent, a pseudohalogen silane coupling agent or a quaternary aminoalkyl silane coupling agent.
[0015] Furthermore, the graft coupling agent masterbatch is obtained by twin-screw granulation grafting of at least one of vinyl silane coupling agent, chloroalkyl silane coupling agent, aminoalkyl silane coupling agent, epoxyalkyl silane coupling agent, methacryloxyalkyl silane coupling agent, sulfur-containing hydrocarbon silane coupling agent, pseudo-halogen silane coupling agent or quaternary aminoalkyl silane coupling agent with a resin matrix, and the grafted material is 1%-5%.
[0016] In a second aspect of the present invention, a method for preparing the above-mentioned photovoltaic adhesive film is provided, the preparation method comprising:
[0017] The base resin is heated and stirred in a stirring kettle;
[0018] Add organic salt, initiator, co-crosslinking agent and coupling agent into a stirring kettle in proportion, and allow the base resin to absorb or mix with the coupling agent to form a mixture;
[0019] The mixture is added into an extruder, melted and plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line-speed and PID-resistant photovoltaic adhesive film.
[0020] The meanings of the above mentioned English abbreviations:
[0021] TPO: Thermoplastic Polyolefin
[0022] POE: Ethylene-alpha olefin copolymer
[0023] EVA: Ethylene-vinyl acetate copolymer
[0024] PID: Potential Induced Degradation
[0025] The invention provides a photovoltaic adhesive film with high line speed and anti-PID. The high line speed adhesive film is prepared by adding organic cations and organic anions to a basic formula to form an organic salt additive. The addition of the organic salt additive significantly improves the flow rate of the adhesive film and reduces the shrinkage rate during the resin extrusion film forming process. After the high line speed adhesive film with added organic salt is packaged with a photovoltaic cell into a photovoltaic module, a PID test is performed. After PID192 is aged, the power of the photovoltaic module is attenuated by 1.5%, which is better than the power attenuation of 4% of the encapsulation adhesive film without adding organic salt.
[0026] It should be understood that the contents described in the summary of the invention are not intended to limit the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. DETAILED DESCRIPTION
[0027] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0028] According to an embodiment of the present invention, a photovoltaic adhesive film and a preparation method thereof are proposed, and a photovoltaic adhesive film with high line speed and anti-PID is provided. The high line speed adhesive film is prepared by adding organic cations and organic anions to a basic formula to form an organic salt additive. The addition of the organic salt additive significantly improves the flow rate of the adhesive film and reduces the shrinkage rate during the resin extrusion film forming process. After the high line speed adhesive film with added organic salt is packaged with a photovoltaic cell into a photovoltaic module, a PID test is performed. After PID192 aging, the power of the photovoltaic module decays by 1.5%, which is better than the power attenuation of 4% of the encapsulated adhesive film without adding organic salt.
[0029] The principle and spirit of the present invention are explained in detail below with reference to several representative embodiments of the present invention.
[0030] Embodiment 1:
[0031] 100 parts of the matrix resin TPO were heated and stirred in a stirring kettle at a heating temperature of 30 degrees Celsius.
[0032] Add 0.1 part of organic salt and 0.1 part of coupling agent into the stirring kettle and allow the base resin to absorb, wherein the organic salt uses 1-alkyl-3-methylimidazolium cation and dicyanamide anion, and the coupling agent uses vinyl silane coupling agent. Stir for 40 minutes.
[0033] The mixture is added into an extruder, the temperature of the feeding zone of the extruder is set at 70 degrees Celsius, the temperature of the melting zone is set at 125 degrees Celsius, the temperature of the die head is set at 105 degrees Celsius, and it is melted and plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line speed and PID-resistant photovoltaic film.
[0034] Embodiment 2:
[0035] 100 parts of the matrix resin TPO were heated and stirred in a stirring kettle at a heating temperature of 30 degrees Celsius.
[0036] 1 part of organic salt and 2 parts of coupling agent are added into a stirring kettle and allowed to be absorbed by the base resin, wherein the organic salt uses 1-alkyl-3-methylimidazolium cation and dicyanamide anion, and the coupling agent uses a vinyl silane coupling agent.
[0037] The mixture is added into an extruder, the temperature of the feeding zone of the extruder is set at 70 degrees Celsius, the temperature of the melting zone is set at 125 degrees Celsius, the temperature of the die head is set at 105 degrees Celsius, and it is melted and plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line speed and PID-resistant photovoltaic film.
[0038] Embodiment 3:
[0039] 100 parts of the matrix resin TPO were heated and stirred in a stirring kettle at a heating temperature of 30 degrees Celsius.
[0040] 0.5 parts of organic salt and 1 part of coupling agent are added into a stirring kettle and allowed to be absorbed by the base resin, wherein the organic salt uses 1-alkyl-3-methylimidazolium cation and dicyanamide anion, and the coupling agent uses a vinyl silane coupling agent.
[0041] The mixture is added into an extruder, the temperature of the feeding zone of the extruder is set at 70 degrees Celsius, the temperature of the melting zone is set at 125 degrees Celsius, the temperature of the die head is set at 105 degrees Celsius, and it is melted and plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line speed and PID-resistant photovoltaic film.
[0042] Embodiment 4:
[0043] 100 parts of the matrix resin TPO were heated and stirred in a stirring kettle at a heating temperature of 30 degrees Celsius.
[0044] 0.1 part of organic salt and 0.1 part of coupling agent are added into a stirring kettle and allowed to be absorbed by the base resin. The organic salt includes 1-alkyl-3-methylimidazolium cation, 1-alkylpyridinium cation and dicyanamide anion, and the coupling agent includes a vinyl silane coupling agent.
[0045] The mixture is added into an extruder, the temperature of the feeding zone of the extruder is set at 70 degrees Celsius, the temperature of the melting zone is set at 125 degrees Celsius, the temperature of the die head is set at 105 degrees Celsius, and it is melted and plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line speed and PID-resistant photovoltaic film.
[0046] Embodiment 5:
[0047] 100 parts of the matrix resin TPO were heated and stirred in a stirring kettle at a heating temperature of 30 degrees Celsius.
[0048] 0.1 part of organic salt and 0.1 part of coupling agent are added into a stirring kettle and allowed to be absorbed by the base resin. The organic salt includes 1-alkyl-3-methylimidazolium cation, 1-alkylpyridinium cation, dicyanamide anion and trifluoromethanesulfonate anion. The coupling agent includes a vinyl silane coupling agent.
[0049] The mixture is added into an extruder, the temperature of the feeding zone of the extruder is set at 70 degrees Celsius, the temperature of the melting zone is set at 125 degrees Celsius, the temperature of the die head is set at 105 degrees Celsius, and it is melted and plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line speed and PID-resistant photovoltaic film.
[0050] Embodiment 6:
[0051] 100 parts of the matrix resin TPO were heated and stirred in a stirring kettle at a heating temperature of 30 degrees Celsius.
[0052] Add 0.1 part of organic salt and 0.1 part of coupling agent into a stirring kettle and allow the base resin to absorb, wherein the organic salt uses 1-alkyl-3-methylimidazolium cation, 1-alkylpyridinium cation and dicyanamide anion, trifluoromethanesulfonate anion, and the coupling agent uses a mixture of vinyl silane coupling agent and graft coupling agent masterbatch, wherein the graft coupling agent masterbatch is obtained by twin-screw granulation grafting of vinyl silane coupling agent and resin base, and the grafted material is 1%.
[0053] The mixture is added into an extruder, the temperature of the feeding zone of the extruder is set at 70 degrees Celsius, the temperature of the melting zone is set at 125 degrees Celsius, the temperature of the die head is set at 105 degrees Celsius, and it is melted and plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line speed and PID-resistant photovoltaic film.
[0054] Embodiment 7:
[0055] 100 parts of the matrix resin TPO were heated and stirred in a stirring kettle at a heating temperature of 30 degrees Celsius.
[0056] 0.1 part of organic salt and 0.1 part of coupling agent are added into a stirring kettle and allowed to be absorbed by the matrix resin, wherein the organic salt uses 1-alkyl-3-methylimidazolium cation, 1-alkylpyridinium cation and dicyanamide anion, trifluoromethanesulfonate anion, and the coupling agent uses a mixture of vinyl silane coupling agent and graft coupling agent masterbatch, wherein the graft coupling agent masterbatch is obtained by twin-screw granulation grafting of vinyl silane coupling agent and resin matrix, and the grafted material is 5%.
[0057] The mixture is added into an extruder, the temperature of the feeding zone of the extruder is set at 70 degrees Celsius, the temperature of the melting zone is set at 125 degrees Celsius, the temperature of the die head is set at 105 degrees Celsius, and it is melted and plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line speed and PID-resistant photovoltaic film.
[0058] Embodiment 8:
[0059] 100 parts of the matrix resin TPO were heated and stirred in a stirring kettle at a heating temperature of 30 degrees Celsius.
[0060] 0.1 part of organic salt and 0.1 part of coupling agent are added into a stirring kettle and allowed to be absorbed by the matrix resin, wherein the organic salt uses 1-alkyl-3-methylimidazolium cation, 1-alkylpyridinium cation and dicyanamide anion, trifluoromethanesulfonate anion, and the coupling agent uses a mixture of vinyl silane coupling agent and graft coupling agent masterbatch, wherein the graft coupling agent masterbatch is obtained by twin-screw granulation grafting of vinyl silane coupling agent and resin matrix, and the grafted material is 2.5%.
[0061] The mixture is added into an extruder, the temperature of the feeding zone of the extruder is set at 70 degrees Celsius, the temperature of the melting zone is set at 125 degrees Celsius, the temperature of the die head is set at 105 degrees Celsius, and it is melted and plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line speed and PID-resistant photovoltaic film.
[0062] Embodiment 9:
[0063] 100 parts of the matrix resin TPO were heated and stirred in a stirring kettle at a heating temperature of 30 degrees Celsius.
[0064] 0.1 part of organic salt and 0.1 part of coupling agent are added into a stirring kettle and allowed to be absorbed by the base resin, wherein the organic salt uses 1-alkyl-3-methylimidazolium cation, 1-alkylpyridinium cation and dicyanamide anion, trifluoromethanesulfonate anion, and the coupling agent uses a mixture of vinyl silane coupling agent and graft coupling agent masterbatch, wherein the graft coupling agent masterbatch is obtained by twin-screw granulation grafting of vinyl silane coupling agent, chloroalkyl silane coupling agent and resin base, and the grafted material is 1%.
[0065] The mixture is added into an extruder, the temperature of the feeding zone of the extruder is set at 70 degrees Celsius, the temperature of the melting zone is set at 125 degrees Celsius, the temperature of the die head is set at 105 degrees Celsius, and it is melted and plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line speed and PID-resistant photovoltaic film.
[0066] Embodiment 10:
[0067] 100 parts of the matrix resin TPO were heated and stirred in a stirring kettle at a heating temperature of 30 degrees Celsius.
[0068] 0.1 part of organic salt and 0.1 part of coupling agent are added into a stirring kettle and allowed to be absorbed by the base resin, wherein the organic salt uses 1-alkyl-3-methylimidazolium cation, 1-alkylpyridinium cation and dicyanamide anion, trifluoromethanesulfonate anion, and the coupling agent uses a mixture of vinyl silane coupling agent and graft coupling agent masterbatch, wherein the graft coupling agent masterbatch is obtained by twin-screw granulation grafting of vinyl silane coupling agent, chloroalkyl silane coupling agent, aminoalkyl silane coupling agent and resin base, and the grafted material is 1%.
[0069] The mixture is added into an extruder, the temperature of the feeding zone of the extruder is set at 70 degrees Celsius, the temperature of the melting zone is set at 125 degrees Celsius, the temperature of the die head is set at 105 degrees Celsius, and it is melted and plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line speed and PID-resistant photovoltaic film.
[0070] Embodiment 11:
[0071] 100 parts of the matrix resin TPO were heated and stirred in a stirring kettle at a heating temperature of 30 degrees Celsius.
[0072] 0.1 part of organic salt and 0.1 part of coupling agent are added into a stirring kettle and allowed to be absorbed by the base resin, wherein the organic salt uses 1-alkyl-3-methylimidazolium cation, 1-alkylpyridinium cation and dicyanamide anion, trifluoromethanesulfonate anion, and the coupling agent uses a mixture of vinyl silane coupling agent and graft coupling agent masterbatch, wherein the graft coupling agent masterbatch is obtained by twin-screw granulation grafting of vinyl silane coupling agent, chloroalkyl silane coupling agent, aminoalkyl silane coupling agent, quaternary aminoalkyl silane coupling agent and resin base, and the grafted material is 1%.
[0073] The mixture is added into an extruder, the temperature of the feeding zone of the extruder is set at 70 degrees Celsius, the temperature of the melting zone is set at 125 degrees Celsius, the temperature of the die head is set at 105 degrees Celsius, and it is melted and plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line speed and PID-resistant photovoltaic film.
[0074] Embodiment 12:
[0075] 100 parts of the matrix resin TPO were heated and stirred in a stirring kettle at a heating temperature of 30 degrees Celsius.
[0076] 0.1 part of organic salt and 0.1 part of coupling agent are added into a stirring kettle and allowed to be absorbed by the base resin. The organic salt includes 1-alkyl-3-methylimidazolium cation, 1-alkylpyridinium cation, dialkylimidazolium cation, dicyanamide anion and trifluoromethanesulfonate anion. The coupling agent includes a vinyl silane coupling agent.
[0077] The mixture is added into an extruder, the temperature of the feeding zone of the extruder is set at 70 degrees Celsius, the temperature of the melting zone is set at 125 degrees Celsius, the temperature of the die head is set at 105 degrees Celsius, and it is melted and plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line speed and PID-resistant photovoltaic film.
[0078] Embodiment 13:
[0079] 100 parts of the matrix resin TPO were heated and stirred in a stirring kettle at a heating temperature of 30 degrees Celsius.
[0080] 0.1 part of organic salt and 0.1 part of coupling agent are added into a stirring kettle and allowed to be absorbed by the base resin. The organic salt includes 1-alkyl-3-methylimidazolium cation, 1-alkylpyridinium cation, dialkylimidazolium cation and dicyanamide anion, trifluoromethanesulfonate anion, and alkylsulfonate anion. The coupling agent includes a vinyl silane coupling agent.
[0081] The mixture is added into an extruder, the temperature of the feeding zone of the extruder is set at 70 degrees Celsius, the temperature of the melting zone is set at 125 degrees Celsius, the temperature of the die head is set at 105 degrees Celsius, and it is melted and plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line speed and PID-resistant photovoltaic film.
[0082] Embodiment 14:
[0083] 100 parts of the matrix resin POE were heated and stirred in a stirring kettle at a heating temperature of 25 degrees Celsius.
[0084] Add 0.1 part of organic salt, 0.1 part of initiator, 0.1 part of auxiliary cross-linking agent and 0.1 part of coupling agent into a stirring kettle and allow the base resin to absorb. The organic salt uses 1-alkyl-3-methylimidazolium cation and dicyanamide anion, the initiator uses tert-butyl peroxide 2-ethylhexyl carbonate, the auxiliary cross-linking agent uses triallyl isocyanurate, and the coupling agent uses a vinyl silane coupling agent.
[0085] The mixture is added into an extruder, the temperature of the feeding zone of the extruder is set at 60 degrees Celsius, the temperature of the melting zone is set at 85 degrees Celsius, the temperature of the die head is set at 95 degrees Celsius, and it is melted and plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line speed and PID-resistant photovoltaic film.
[0086] Embodiment 15:
[0087] 100 parts of the matrix resin POE were heated and stirred in a stirring kettle at a heating temperature of 25 degrees Celsius.
[0088] Add 1 part of organic salt, 2 parts of initiator, 2 parts of auxiliary cross-linking agent and 2 parts of coupling agent into a stirring kettle and allow the base resin to absorb. The organic salt uses 1-alkyl-3-methylimidazolium cation and dicyanamide anion, the initiator uses tert-butyl peroxide 2-ethylhexyl carbonate, the auxiliary cross-linking agent uses triallyl isocyanurate, and the coupling agent uses a vinyl silane coupling agent.
[0089] The mixture is added into an extruder, the temperature of the feeding zone of the extruder is set at 60 degrees Celsius, the temperature of the melting zone is set at 85 degrees Celsius, the temperature of the die head is set at 95 degrees Celsius, and it is melted and plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line speed and PID-resistant photovoltaic film.
[0090] Embodiment 16:
[0091] 100 parts of the matrix resin POE were heated and stirred in a stirring kettle at a heating temperature of 25 degrees Celsius.
[0092] Add 0.5 parts of organic salt, 1 part of initiator, 1 part of auxiliary cross-linking agent and 1 part of coupling agent into a stirring kettle and allow the base resin to absorb. The organic salt uses 1-alkyl-3-methylimidazolium cation and dicyanamide anion, the initiator uses tert-butyl peroxide 2-ethylhexyl carbonate, the auxiliary cross-linking agent uses triallyl isocyanurate, and the coupling agent uses a vinyl silane coupling agent.
[0093] The mixture is added into an extruder, the temperature of the feeding zone of the extruder is set at 60 degrees Celsius, the temperature of the melting zone is set at 85 degrees Celsius, the temperature of the die head is set at 95 degrees Celsius, and it is melted and plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line speed and PID-resistant photovoltaic film.
[0094] Embodiment 17:
[0095] 100 parts of the matrix resin EVA were heated and stirred in a stirring kettle at a heating temperature of 25 degrees Celsius.
[0096] Add 0.1 part of organic salt, 0.1 part of initiator, 0.1 part of auxiliary cross-linking agent and 0.1 part of coupling agent into a stirring kettle and allow the base resin to absorb. The organic salt uses 1-alkyl-3-methylimidazolium cation and dicyanamide anion, the initiator uses tert-butyl peroxide 2-ethylhexyl carbonate, the auxiliary cross-linking agent uses triallyl isocyanurate, and the coupling agent uses a vinyl silane coupling agent.
[0097] The mixture is added into an extruder, the temperature of the extruder feeding zone is set at 60 degrees Celsius, the temperature of the melting zone is set at 75 degrees Celsius, the temperature of the die head is set at 92 degrees Celsius, and it is melt-plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line speed and PID-resistant photovoltaic film.
[0098] Embodiment 18:
[0099] 100 parts of the matrix resin EVA were heated and stirred in a stirring kettle at a heating temperature of 25 degrees Celsius.
[0100] Add 1 part of organic salt, 2 parts of initiator, 2 parts of auxiliary cross-linking agent and 2 parts of coupling agent into a stirring kettle and allow the base resin to absorb. The organic salt uses 1-alkyl-3-methylimidazolium cation and dicyanamide anion, the initiator uses tert-butyl peroxide 2-ethylhexyl carbonate, the auxiliary cross-linking agent uses triallyl isocyanurate, and the coupling agent uses a vinyl silane coupling agent.
[0101] The mixture is added into an extruder, the temperature of the extruder feeding zone is set at 60 degrees Celsius, the temperature of the melting zone is set at 75 degrees Celsius, the temperature of the die head is set at 92 degrees Celsius, and it is melt-plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line speed and PID-resistant photovoltaic film.
[0102] Embodiment 19:
[0103] 100 parts of the matrix resin EVA were heated and stirred in a stirring kettle at a heating temperature of 25 degrees Celsius.
[0104] Add 0.5 parts of organic salt, 1 part of initiator, 1 part of auxiliary cross-linking agent and 1 part of coupling agent into a stirring kettle and allow the base resin to absorb. The organic salt uses 1-alkyl-3-methylimidazolium cation and dicyanamide anion, the initiator uses tert-butyl peroxide 2-ethylhexyl carbonate, the auxiliary cross-linking agent uses triallyl isocyanurate, and the coupling agent uses a vinyl silane coupling agent.
[0105] The mixture is added into an extruder, the temperature of the extruder feeding zone is set at 60 degrees Celsius, the temperature of the melting zone is set at 75 degrees Celsius, the temperature of the die head is set at 92 degrees Celsius, and it is melt-plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line speed and PID-resistant photovoltaic film.
[0106] Embodiment 20:
[0107] 100 parts of the matrix resin POE were heated and stirred in a stirring kettle at a heating temperature of 25 degrees Celsius.
[0108] 1 part of organic salt, 2 parts of initiator, 2 parts of auxiliary cross-linking agent and 2 parts of coupling agent are added into a stirring kettle and allowed to be absorbed by the base resin. The organic salt uses 1-alkyl-3-methylimidazolium cation, alkylphosphine cation and dicyanamide anion, the initiator uses tert-butyl peroxide 2-ethylhexyl carbonate, the auxiliary cross-linking agent uses triallyl isocyanurate, and the coupling agent uses a vinyl silane coupling agent.
[0109] The mixture is added into an extruder, the temperature of the feeding zone of the extruder is set at 60 degrees Celsius, the temperature of the melting zone is set at 85 degrees Celsius, the temperature of the die head is set at 95 degrees Celsius, and it is melted and plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line speed and PID-resistant photovoltaic film.
[0110] Embodiment 21:
[0111] 100 parts of the matrix resin POE were heated and stirred in a stirring kettle at a heating temperature of 25 degrees Celsius.
[0112] 1 part of organic salt, 2 parts of initiator, 2 parts of auxiliary cross-linking agent and 2 parts of coupling agent are added into a stirring kettle and allowed to be absorbed by the base resin. The organic salts include 1-alkyl-3-methylimidazolium cations, alkylphosphine cations, dicyanamide anions and alkyl phosphate anions. The initiator is tert-butyl peroxide 2-ethylhexyl carbonate. The auxiliary cross-linking agent is triallyl isocyanurate. The coupling agent is a vinyl silane coupling agent.
[0113] The mixture is added into an extruder, the temperature of the feeding zone of the extruder is set at 60 degrees Celsius, the temperature of the melting zone is set at 85 degrees Celsius, the temperature of the die head is set at 95 degrees Celsius, and it is melted and plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line speed and PID-resistant photovoltaic film.
[0114] Embodiment 22:
[0115] 100 parts of the matrix resin POE were heated and stirred in a stirring kettle at a heating temperature of 25 degrees Celsius.
[0116] 1 part of organic salt, 2 parts of initiator, 2 parts of auxiliary cross-linking agent and 2 parts of coupling agent are added into a stirring kettle and allowed to be absorbed by the base resin. The organic salts include 1-alkyl-3-methylimidazolium cations, alkylphosphonium cations, dicyanamide anions and alkyl phosphate anions. The initiators include tert-butyl peroxide 2-ethylhexyl carbonate and tert-butyl peroxide 3,5,5-trimethylhexanoate. The auxiliary cross-linking agent is triallyl isocyanurate. The coupling agent is a vinyl silane coupling agent.
[0117] The mixture is added into an extruder, the temperature of the feeding zone of the extruder is set at 60 degrees Celsius, the temperature of the melting zone is set at 85 degrees Celsius, the temperature of the die head is set at 95 degrees Celsius, and it is melted and plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line speed and PID-resistant photovoltaic film.
[0118] Embodiment 23:
[0119] 100 parts of the matrix resin POE were heated and stirred in a stirring kettle at a heating temperature of 25 degrees Celsius.
[0120] 1 part of organic salt, 2 parts of initiator, 2 parts of auxiliary cross-linking agent and 2 parts of coupling agent are added into a stirring kettle and allowed to be absorbed by the base resin. The organic salts include 1-alkyl-3-methylimidazolium cations, alkylphosphonium cations, dicyanamide anions and alkyl phosphate anions. The initiators include tert-butyl peroxide 2-ethylhexyl carbonate and tert-butyl peroxide 3,5,5-trimethylhexanoate. The auxiliary cross-linking agents include triallyl isocyanurate and triallyl cyanurate. The coupling agent includes a vinyl silane coupling agent.
[0121] The mixture is added into an extruder, the temperature of the feeding zone of the extruder is set at 60 degrees Celsius, the temperature of the melting zone is set at 85 degrees Celsius, the temperature of the die head is set at 95 degrees Celsius, and it is melted and plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line speed and PID-resistant photovoltaic film.
[0122] Embodiment 24:
[0123] 100 parts of the matrix resin POE were heated and stirred in a stirring kettle at a heating temperature of 25 degrees Celsius.
[0124] 1 part of organic salt, 2 parts of initiator, 2 parts of auxiliary cross-linking agent and 2 parts of coupling agent are added into a stirring kettle and allowed to be absorbed by the base resin, wherein the organic salt uses 1-alkyl-3-methylimidazolium cation, alkylphosphonium cation and dicyanamide anion, alkyl phosphate anion, the initiator uses tert-butyl peroxide 2-ethylhexyl carbonate and tert-butyl peroxide 3,5,5-trimethylhexanoate, the auxiliary cross-linking agent uses triallyl isocyanurate and triallyl cyanurate, and the coupling agent uses a mixture of vinyl silane coupling agent and graft coupling agent masterbatch, wherein the graft coupling agent masterbatch is obtained by twin-screw granulation grafting of amino hydrocarbon-based silane coupling agent and sulfur-containing hydrocarbon-based silane coupling agent with the resin base, and the grafted material is 1%.
[0125] The mixture is added into an extruder, the temperature of the feeding zone of the extruder is set at 60 degrees Celsius, the temperature of the melting zone is set at 85 degrees Celsius, the temperature of the die head is set at 95 degrees Celsius, and it is melted and plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line speed and PID-resistant photovoltaic film.
[0126] Embodiment 25:
[0127] 100 parts of the matrix resin POE were heated and stirred in a stirring kettle at a heating temperature of 25 degrees Celsius.
[0128] 1 part of organic salt, 2 parts of initiator, 2 parts of auxiliary cross-linking agent and 2 parts of coupling agent are added into a stirring kettle and allowed to be absorbed by the base resin, wherein the organic salt uses 1-alkyl-3-methylimidazolium cation, alkylphosphonium cation and dicyanamide anion, alkyl phosphate anion, the initiator uses tert-butyl peroxide 2-ethylhexyl carbonate and tert-butyl peroxide 3,5,5-trimethylhexanoate, the auxiliary cross-linking agent uses triallyl isocyanurate and triallyl cyanurate, and the coupling agent uses a mixture of vinyl silane coupling agent and graft coupling agent masterbatch, wherein the graft coupling agent masterbatch is obtained by twin-screw granulation grafting of amino hydrocarbon-based silane coupling agent and resin base, and the grafted material is 1%.
[0129] The mixture is added into an extruder, the temperature of the feeding zone of the extruder is set at 60 degrees Celsius, the temperature of the melting zone is set at 85 degrees Celsius, the temperature of the die head is set at 95 degrees Celsius, and it is melted and plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line speed and PID-resistant photovoltaic film.
[0130] Comparative Example 1:
[0131] 100 parts of the matrix resin POE were heated and stirred in a stirring kettle at a heating temperature of 25 degrees Celsius.
[0132] Add 2 parts of initiator, 2 parts of auxiliary cross-linking agent and 2 parts of coupling agent into a stirring kettle and allow the base resin to absorb. The initiator uses tert-butyl peroxide 2-ethylhexyl carbonate and tert-butyl peroxide 3,5,5-trimethylhexanoate, the auxiliary cross-linking agent uses triallyl isocyanurate and triallyl cyanurate, and the coupling agent uses a mixture of vinyl silane coupling agent and graft coupling agent masterbatch, wherein the graft coupling agent masterbatch is obtained by twin-screw granulation grafting of amino hydrocarbon-based silane coupling agent and resin base, and the grafted material is 1%.
[0133] The mixture was added into an extruder, the temperature of the feeding zone of the extruder was set at 60 degrees Celsius, the temperature of the melting zone was set at 85 degrees Celsius, the temperature of the die head was set at 95 degrees Celsius, it was melted and plasticized and extruded through the extruder, and embossed into a film on a three-roll calender to obtain a comparative photovoltaic film.
[0134] With the same extrusion parameters and a film shrinkage ratio of 2.5, the line speed of the film produced using the high line speed and anti-PID photovoltaic film formula can reach 12 m / min, which is better than the line speed of 9 m / min produced by the formula in Comparative Example 1. When conducting the PID test, it was found that after PID192 aging, the power of the photovoltaic module using the high line speed and anti-PID photovoltaic film was attenuated by 1.5%, which is better than the power attenuation of the encapsulation film produced in Comparative Example 1 by 4%, as shown in Table 1.
[0135] Table 1
[0136]
[0137]
[0138] The present invention uses the above-mentioned embodiments to illustrate the photovoltaic adhesive film and the preparation method thereof, but the present invention is not limited to the above-mentioned embodiments, that is, it does not mean that the present invention must rely on the above-mentioned embodiments to be implemented. Those skilled in the art should understand that any improvement of the present invention, equivalent replacement of various raw materials of the product of the present invention, addition of auxiliary components, selection of specific methods, etc., all fall within the protection scope and disclosure scope of the present invention.
Claims
1. A photovoltaic film, characterized in that: The raw materials include the following components in weight percentage: base resin: 100 parts; organic salt: 0.1-1 parts; initiator: 0-2 parts; auxiliary cross-linking agent: 0-2 parts; coupling agent: 0.1-2 parts; wherein the base resin is TPO, POE or EVA.
2. A photovoltaic adhesive film according to claim 1, characterized in that: If the base resin is TPO, the amount of the initiator is 0, and the amount of the auxiliary cross-linking agent is 0.
3. The photovoltaic adhesive film according to claim 1, characterized in that: If the base resin is POE or EVA, the initiator is selected from the peroxide initiator: at least one of tert-butyl peroxy-2-ethylhexyl carbonate, tert-amyl peroxy-2-ethylhexyl carbonate, 2,5-dimethyl-2,5-bis(tert-butyl peroxide)hexane, tert-butyl peroxy-3,5,5-trimethylhexanoate, di(4-methylbenzoyl)peroxide, dibenzoyl peroxide, 1,1-di-tert-butyl peroxycyclohexane, tert-butyl peroxy-2-ethylhexyl carbonate, n-butyl-4,4-di(tert-butyl peroxy)valerate, diisopropylbenzene peroxide, α,α′-bis(tert-butyl peroxy)-1,3-diisopropylbenzene and 1,1-bis(tert-butyl peroxy)-3,3,5-trimethylcyclohexane.
4. The photovoltaic adhesive film according to claim 1, characterized in that: If the base resin is POE or EVA, the auxiliary cross-linking agent is at least one of triallyl isocyanurate, triallyl cyanurate and acrylic auxiliary cross-linking agent.
5. The photovoltaic adhesive film according to claim 1, characterized in that: The melting point of the organic salt is in the range of 70-150 degrees, and the organic salt is composed of organic cations and organic anions.
6. The photovoltaic adhesive film according to claim 5, characterized in that: The organic cation is at least one of 1-alkyl-3-methylimidazolium cation, 1-alkylpyridinium cation, dialkylimidazolium cation, alkylpyridinium cation, alkylammonium cation, and alkylphosphine cation; the organic anion can be at least one of dicyanamide anion, trifluoromethanesulfonate anion, alkyl sulfonate anion, alkyl phosphate anion, etc.
7. The photovoltaic adhesive film according to claim 1, characterized in that: The coupling agent is at least one of a liquid coupling agent and a graft coupling agent masterbatch.
8. The photovoltaic adhesive film according to claim 7, characterized in that: The liquid coupling agent is at least one of vinyl silane coupling agent, chloroalkyl silane coupling agent, aminoalkyl silane coupling agent, epoxyalkyl silane coupling agent, methacryloxyalkyl silane coupling agent, sulfur-containing hydrocarbon silane coupling agent, pseudohalogen silane coupling agent or quaternary aminoalkyl silane coupling agent.
9. The photovoltaic adhesive film according to claim 7, characterized in that: The graft coupling agent masterbatch is obtained by twin-screw granulation grafting of at least one of vinyl silane coupling agent, chloroalkyl silane coupling agent, aminoalkyl silane coupling agent, epoxyalkyl silane coupling agent, methacryloxyalkyl silane coupling agent, sulfur-containing hydrocarbon silane coupling agent, pseudohalogen silane coupling agent or quaternary aminoalkyl silane coupling agent with a resin matrix, and the grafting rate is 1%-5%.
10. A method for preparing a photovoltaic adhesive film according to any one of claims 1 to 9, characterized in that: The preparation method comprises: The base resin is heated and stirred in a stirring kettle; Add organic salt, initiator, co-crosslinking agent and coupling agent into a stirring kettle in proportion, and allow the base resin to absorb or mix with the coupling agent to form a mixture; The mixture is added into an extruder, melted and plasticized and extruded by the extruder, and embossed into a film on a three-roll calender to obtain the high-line-speed and PID-resistant photovoltaic adhesive film.