Preparation method of high-stability perovskite quantum dot adhesive film

Abstract

According to the preparation method of the high-stability perovskite quantum dot adhesive film provided by the invention, the alkyl trimethyl ammonium halide is added into the perovskite light conversion adhesive film as a short-chain ligand, so that the stability of perovskite quantum dots and the photoluminescence quantum yield are effectively improved. Comprising the following steps: preparing alkyl trimethyl ammonium halide into a solution; mixing the perovskite quantum dot solution, the blank colloidal particles and the alkyl trimethyl ammonium halide solution according to a specific proportion, and performing melt extrusion and granulation to obtain perovskite quantum dot colloidal particles; and uniformly mixing the perovskite quantum dot colloidal particles with a coupling agent, a main cross-linking agent, an auxiliary cross-linking agent, a light stabilizer and an antioxidant, and carrying out melt extrusion and film casting to prepare the perovskite light conversion adhesive film. The prepared adhesive film has excellent ultraviolet light and near ultraviolet light conversion capability, prolongs the service life of a photovoltaic device, remarkably improves the photoelectric conversion efficiency, is simple and efficient in process, is suitable for industrial production of photovoltaic module packaging, and has a wide application prospect.

Description

Technical Field

[0001] The present invention relates to the field of new energy photovoltaic technology, and in particular to a method for preparing a high-stability perovskite quantum dot adhesive film. Background Art

[0002] Perovskite materials have attracted extensive attention in the photovoltaic field due to their excellent physical and chemical properties. In particular, all-inorganic perovskite materials (such as CsPbX 3 , X=Cl, Br, I) exhibits good light absorption ability, and can efficiently absorb ultraviolet and near-ultraviolet light with low utilization rate in silicon-based solar cells, and convert it into visible light for photovoltaic cells. This feature breaks through the limitation of theoretical conversion efficiency of crystalline silicon cells, effectively improving the utilization rate of light energy and photoelectric conversion efficiency. Therefore, perovskite quantum dots are widely regarded as ideal light conversion materials in photovoltaic films, and have important research and application value.

[0003] At present, the mainstream photovoltaic films are represented by EVA and POE. Among them, EVA film has a low water vapor barrier capacity, and the water vapor permeability of POE film is only 12.5% ​​of that of EVA film. However, for the stability of perovskite quantum dots, water vapor permeability is still an important challenge. 3 In the preparation of perovskite quantum dots, the traditional oleic acid / oleylamine (C18) ligand can play a stabilizing role in the short term, but it is easy to fall off, causing the surface of perovskite quantum dots to be exposed to water and oxygen environment, causing the lattice to gradually decompose, and then causing the irreversible optical performance of quantum dots to decay. This instability seriously limits the practical application of perovskite quantum dots in photovoltaic adhesive films, and it is urgent to develop new methods to enhance the long-term stability of quantum dots and improve their light conversion function. Summary of the invention

[0004] According to the technical problems raised above, a method for preparing a high-stability perovskite quantum dot adhesive film is provided. The present invention utilizes the repair, passivation and protection effects of alkyl trimethylamine halide (C4-16) on perovskite quantum dots, aiming to improve the stability and light conversion efficiency of perovskite quantum dots, extend the service life of photovoltaic devices, and enhance the overall performance of photovoltaic modules. The photoluminescence quantum yield of the photovoltaic module made of the perovskite light conversion adhesive film prepared by the method of the present invention remains 95% of the original photovoltaic module after irradiation for 1000 hours in a high temperature and high humidity test environment.

[0005] The technical means adopted by the present invention are as follows:

[0006] A method for preparing a high-stability perovskite quantum dot film comprises the following steps:

[0007] S1, preparing alkyl trimethyl ammonium halide solution;

[0008] S2. Preparing perovskite quantum dot colloid particles: mixing a perovskite quantum dot solution, blank colloid particles and an alkyl trimethylamine halide solution in a mass ratio of (2-8): (20-50): (1-3), and performing melt extrusion and granulation to obtain perovskite quantum dot colloid particles;

[0009] S3. Preparation of adhesive film: weigh 80-110 parts of perovskite quantum dot particles, 0.2-2 parts of coupling agent, 0.5-2 parts of main cross-linking agent, 0.3-2 parts of auxiliary cross-linking agent, 0.04-0.2 parts of light stabilizer and 0.04-0.2 parts of antioxidant by weight, mix well and melt extrude, form a film by casting method, and obtain perovskite light conversion adhesive film.

[0010] Furthermore, in step S1, the alkyl trimethyl ammonium halide is a compound having an alkyl carbon chain with 4-16 carbon atoms, including one or more of butyl trimethyl ammonium halide, hexyl trimethyl ammonium halide, octyl trimethyl ammonium halide, dodecyl trimethyl ammonium halide, tetradecyl trimethyl ammonium halide or hexadecyl trimethyl ammonium halide.

[0011] Furthermore, the halogen in the alkyltrimethylamine halide is one of Cl, Br or I.

[0012] Furthermore, the alkyltrimethylammonium halide solution is a uniform solution prepared by dissolving the aforementioned compound in an organic solvent, and the concentration is 15-25%; the organic solvent is one or two of methanol, ethanol, isopropanol or toluene.

[0013] Furthermore, in step S2, the blank colloid particles are one or both of POE and EVA colloid particles.

[0014] Furthermore, in step S2, the perovskite quantum dot solution is CsPbX 3 (X=Cl, Br, I) is dissolved in n-hexane to form a uniform solution with a concentration of 10-30%.

[0015] Furthermore, the mixing conditions in step S2 are: temperature 70-120°C, time 0.2-2h; the melt extrusion conditions are: temperature 80-180°C, time 0.2-2h, rotation speed 20-80rpm; the granulation temperature is 80-180°C; the casting film forming process temperature in step S3 is 80-160°C, and the film thickness is 0.2-0.5mm.

[0016] Furthermore, in step S3, the coupling agent includes one or more of a vinyl silane coupling agent, an epoxy silane coupling agent, an alkyl silane coupling agent, an amino silane coupling agent, an isocyanate silane coupling agent, a sulfur-containing silane coupling agent or a piperazine silane coupling agent.

[0017] Further, in step S3, the main cross-linking agent includes one or more of 2-ethylhexyl carbonate peroxide, triallyl cyanurate, 2,5-dimethyl-2,5-di-tert-butyl peroxide hexane, hydroxyethyl methacrylate, diisopropylbenzene peroxide, di-tert-butyl peroxide, dibenzoyl peroxide and 1,1-di-tert-butyl peroxide-3,3,5-trimethylcyclohexane; the auxiliary cross-linking agent includes one or more of triallyl isocyanurate, trimethylolpropane trimethacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate and N,N'-1,3-phenylene bismaleimide.

[0018] Further, in step S3, the light stabilizer includes one or more of bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate, poly(4-hydroxy-2,2,6,6-tetramethyl-1-piperidinylethanol) succinate, bis(1,2,2,6,6-pentamethylpiperidinol) sebacate and poly[[6-[(1,1,3,3-tetramethylbutyl)amino]-1,3,5-triazine-2,4-diyl][(2,2,6,6-tetramethyl-4-piperidinyl)imino]-1,6-hexanediyl[(2,2,6,6-tetramethyl-4-piperidinyl)imino]]; the antioxidant includes one or more of aromatic amine antioxidants, hindered phenol antioxidants and phosphite antioxidants.

[0019] Compared with the prior art, the present invention has the following advantages:

[0020] 1. The present invention introduces alkyl trimethyl ammonium halide (C4-16) as a short-chain ligand in the perovskite light-converting adhesive film to replace the traditional long-chain ligand C18. The unique quaternary ammonium salt structure of alkyl trimethyl ammonium halide can form a stable coordination bond with the halogen ions on the surface of the perovskite quantum dots, and construct a dense protective layer on the surface of the quantum dots. This protective layer effectively reduces the number of surface defects of the quantum dots and inhibits the occurrence of non-radiative recombination, thereby improving the photoluminescence quantum yield (PLQY) of the quantum dots.

[0021] 2. The short-chain ligand structure of the alkyl trimethyl ammonium halide introduced in the present invention has good hydrophobicity, which effectively prevents the diffusion and penetration of water molecules. Compared with the defect of the long-chain ligand C18 that is easy to fall off, the protective layer formed by the short-chain ligand is more stable and not easily destroyed by the external environment (such as moisture and oxygen). The environmental stability of quantum dots under high humidity and strong light conditions is significantly improved, and the optical performance degradation of quantum dots is reduced.

[0022] 3. The perovskite light-conversion film prepared by the present invention can efficiently absorb ultraviolet light and near-ultraviolet light, and convert it into visible light for use by photovoltaic modules, thereby improving the photoelectric conversion efficiency of photovoltaic modules. In addition, the film also has the bonding and protection functions of traditional packaging films, providing mechanical strength and structural stability for the modules, further ensuring the long-term operation of the photovoltaic system.

[0023] In summary, the present invention successfully solves the problems of poor stability of perovskite quantum dots and shedding of long-chain ligands by introducing alkyl trimethyl ammonium halides into the perovskite light-converting adhesive film. The passivation, protection and hydrophobic effect of the short-chain ligands significantly improve the photoluminescence efficiency and moisture resistance of the perovskite quantum dots. The close combination and protection of the short-chain ligands and the perovskite quantum dots delay the aging of the quantum dots due to environmental erosion in photovoltaic applications, extend the service life of the light-converting adhesive film, and optimize the overall performance of the photovoltaic device. The present invention has a simple process and significant effect.

[0024] Based on the above reasons, the present invention can be widely promoted in the fields of photovoltaic technology development and application of high-efficiency packaging materials. DETAILED DESCRIPTION

[0025] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0026] The present invention provides a method for preparing a high-stability perovskite quantum dot adhesive film, comprising the following steps:

[0027] S1. Prepare an alkyl trimethyl ammonium halide solution; wherein the alkyl trimethyl ammonium halide is a compound having an alkyl carbon chain with 4-16 carbon atoms, including one or more of butyl trimethyl ammonium halide, hexyl trimethyl ammonium halide, octyl trimethyl ammonium halide, dodecyl trimethyl ammonium halide, tetradecyl trimethyl ammonium halide or hexadecyl trimethyl ammonium halide; the halogen in the alkyl trimethyl ammonium halide is one of Cl, Br or I; the alkyl trimethyl ammonium halide solution is a uniform solution prepared by dissolving the aforementioned compound in an organic solvent, and the concentration is 15-25%; the organic solvent is one or two of methanol, ethanol, isopropanol or toluene.

[0028] S2. Preparation of perovskite quantum dot colloid particles: mixing a perovskite quantum dot solution, blank colloid particles and an alkyl trimethylamine halide solution in a mass ratio of (2-8): (20-50): (1-3), and obtaining perovskite quantum dot colloid particles by melt extrusion and granulation; the blank colloid particles are one or two of POE and EVA colloid particles; the perovskite quantum dot solution is CsPbX 3 (X=Cl, Br, I) is dissolved in n-hexane to form a uniform solution with a concentration of 10-30%. Preferably, the mixing conditions are 70-120°C and 0.2-2h; the melt extrusion conditions are 80-180°C, 0.2-2h and 20-80rpm; the granulation temperature is 80-180°C.

[0029] S3, prepare adhesive film: weigh 80-110 parts of perovskite quantum dot particles, 0.2-2 parts of coupling agent, 0.5-2 parts of main cross-linking agent, 0.3-2 parts of auxiliary cross-linking agent, 0.04-0.2 parts of light stabilizer and 0.04-0.2 parts of antioxidant by weight, mix them evenly, melt extrude them, and form them into films by casting method to obtain perovskite light conversion adhesive film. The film forming process temperature of the casting method is 80-160℃, and the film thickness is 0.2-0.5mm.

[0030] The coupling agent includes one or more of a vinyl silane coupling agent, an epoxy silane coupling agent, an alkyl silane coupling agent, an amino silane coupling agent, an isocyanate silane coupling agent, a sulfur-containing silane coupling agent or a piperazine silane coupling agent.

[0031] The main cross-linking agent includes one or more of 2-ethylhexyl peroxide tert-butyl carbonate, triallyl cyanurate, 2,5-dimethyl-2,5-di-tert-butyl peroxide hexane, hydroxyethyl methacrylate, diisopropylbenzene peroxide, di-tert-butyl peroxide, dibenzoyl peroxide and 1,1-di-tert-butyl peroxide-3,3,5-trimethylcyclohexane.

[0032] The auxiliary cross-linking agent includes one or more of triallyl isocyanurate, trimethylolpropane trimethacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate and N,N'-1,3-phenylene bismaleimide.

[0033] The light stabilizer includes one or more of bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate, poly(4-hydroxy-2,2,6,6-tetramethyl-1-piperidinylethanol) succinate, bis(1,2,2,6,6-pentamethylpiperidinol) sebacate and poly[[6-[(1,1,3,3-tetramethylbutyl)amino]-1,3,5-triazine-2,4-diyl][(2,2,6,6-tetramethyl-4-piperidinyl)imino]-1,6-hexanediyl[(2,2,6,6-tetramethyl-4-piperidinyl)imino]].

[0034] The antioxidant includes one or more of aromatic amine antioxidants, hindered phenol antioxidants and phosphite antioxidants.

[0035] Example 1

[0036] The present invention provides a method for preparing a high-stability perovskite quantum dot adhesive film, comprising the following steps:

[0037] S1. Prepare a butyl trimethyl ammonium chloride solution by dissolving butyl trimethyl ammonium chloride in methanol to obtain a solution with a concentration of 20%.

[0038] S2, Perovskite quantum dot colloid: 20% CsPbCl 3 40 g of perovskite quantum dot solution, 300 g of EVA colloid and 7 g of butyltrimethylammonium chloride solution were mixed at 100° C. for 1.5 h, melt-extruded at 105° C. and 55 rpm for 1 h, and then granulated at 80° C. to obtain perovskite quantum dot colloid;

[0039] S3. Preparation of adhesive film: weigh 100g of perovskite quantum dot colloid, 1g of vinyl triacyloxysilane, 1g of 1,1-di-tert-butyl peroxide-3,3,5-trimethylcyclohexane, 1g of triallyl isocyanurate, 0.1g of bis(2,2,6,6-tetramethyl-4-piperidinyl)sebacate and 0.1g of tri[2.4-di-tert-butylphenyl]phosphite; mix them evenly, melt extrude them, and form them into films by a casting method. The temperature in the casting method is 90°C to obtain a perovskite light-converting adhesive film.

[0040] Example 2

[0041] S1. Prepare a hexyltrimethylammonium bromide solution by dissolving hexyltrimethylammonium bromide in ethanol to obtain a solution with a concentration of 18%.

[0042] S2, Perovskite quantum dot colloid: 15% CsPbBr 345 g of perovskite quantum dot solution, 280 g of EVA colloid and 8 g of hexyltrimethylammonium bromide solution were mixed at 120° C. for 1.2 h, melt-extruded at 100° C. and 50 rpm for 1.1 h, and then granulated at 100° C. to obtain perovskite quantum dot colloid;

[0043] S3. Preparation of adhesive film: weigh 110 g of perovskite quantum dot colloid, 0.8 g of γ-aminopropyltriethoxysilane, 1.2 g of tert-butyl peroxide 2-ethylhexyl carbonate, 1.2 g of trimethylolpropane trimethacrylate, 0.08 g of poly(4-hydroxy-2,2,6,6-tetramethyl-1-piperidineethanol) succinate and 0.06 g of 2,6-di-tert-butyl-p-cresol; mix them evenly, melt extrude them, and form them into films by a casting method. The temperature in the casting method is 100°C to obtain a perovskite light-converting adhesive film.

[0044] Example 3

[0045] S1. Prepare octyltrimethylammonium iodide solution. Dissolve octyltrimethylammonium iodide in toluene to obtain a solution with a concentration of 16%.

[0046] S2, Perovskite quantum dot colloid: 18% CsPbI 3 42g of perovskite quantum dot solution, 285g of EVA colloid and 15g of octyltrimethylammonium iodide solution were mixed at 105°C for 1.0h, melt-extruded at 80°C and 70rpm for 0.8h, and then granulated at 80°C to obtain perovskite quantum dot colloid;

[0047] S3. Preparation of adhesive film: weigh 80g of perovskite quantum dot colloid, 1.8g of γ-(methacryloyloxy)propyltrimethoxysilane, 1.5g of dibenzoyl peroxide, 1.5g of trimethylolpropane triacrylate, 0.04g of bis(1,2,2,6,6-pentamethylpiperidinol)sebacate and 0.15g of pentaerythritol tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate; mix them evenly, melt extrude them, and form them into films by a casting method. The temperature in the casting method is 120°C to obtain a perovskite light-converting adhesive film.

[0048] Example 4

[0049] S1. Prepare a dodecyltrimethylammonium iodide solution by dissolving dodecyltrimethylammonium iodide in isopropanol to obtain a solution with a concentration of 22%.

[0050] S2, Perovskite quantum dot colloid: 25% CsPbI 335 g of perovskite quantum dot solution, 350 g of EVA colloid and 21 g of dodecyltrimethylammonium iodide solution were mixed at 85° C. for 0.5 h, melt-extruded at 150° C. and 40 rpm for 1.3 h, and then granulated at 120° C. to obtain perovskite quantum dot colloid;

[0051] S3. Preparation of adhesive film: weigh 89 g of perovskite quantum dot colloid, 0.2 g of N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane, 2 g of di-tert-butyl peroxide, 2 g of pentaerythritol triacrylate, 0.08 g of poly[[6-[(1,1,3,3-tetramethylbutyl)amino]-1,3,5-triazine-2,4-diyl][(2,2,6,6-tetramethyl-4-piperidinyl)imino]-1,6-hexanediyl[(2,2,6,6-tetramethyl-4-piperidinyl)imino]] and 0.8 g of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate; mix well, melt extrude, and form a film by a casting method. The temperature in the casting method film forming process is 130°C to obtain a perovskite light-converting adhesive film.

[0052] Example 5

[0053] S1. Prepare a tetradecyltrimethylammonium bromide solution by dissolving tetradecyltrimethylammonium bromide in toluene to obtain a solution with a concentration of 15%.

[0054] S2, Perovskite quantum dot colloid: 28% CsPbBr 3 48g of perovskite quantum dot solution, 300g of EVA colloid and 12g of tetradecyltrimethylammonium bromide solution were mixed at 95°C for 0.7h, melt-extruded at 145°C and 80rpm for 1.1h, and then granulated at 110°C to obtain perovskite quantum dot colloid;

[0055] S3. Preparation of adhesive film: weigh 95g of perovskite quantum dot colloid, 2g of γ-(2,3-epoxypropyloxy)propyltrimethoxysilane, 0.5g of 2,5-dimethyl-2,5-di-tert-butylperoxyhexane, 0.5g of N,N'-1,3-phenylenebismaleimide, 0.15g of bis(2,2,6,6-tetramethyl-4-piperidinyl)sebacate and 0.2g of 2,6-di-tert-butyl-4-methylphenol; mix them evenly, melt extrude them, and form them into films by a casting method. The temperature in the casting method is 150°C to obtain a perovskite light-converting adhesive film.

[0056] Example 6

[0057] S1. Prepare a hexadecyltrimethylammonium chloride solution by dissolving hexadecyltrimethylammonium chloride in methanol to obtain a solution concentration of 25%.

[0058] S2, Perovskite quantum dot colloid: 22% CsPbCl 3 53g of perovskite quantum dot solution, 265g of EVA colloid and 11g of hexadecyltrimethylammonium chloride solution were mixed at 115°C for 1.4h, melt-extruded at a temperature of 135°C and a rotation speed of 65rpm for 1.4h, and then granulated at 115°C to obtain perovskite quantum dot colloid;

[0059] S3. Preparation of adhesive film: weigh 105g of perovskite quantum dot colloid, 1.5g of γ-mercaptopropyltrimethoxysilane, 0.8g of hydroxyethyl methacrylate, 0.8g of triallyl isocyanurate, 0.2g of poly(4-hydroxy-2,2,6,6-tetramethyl-1-piperidinylethanol) succinate and 0.18g of bis(2,4-di-tert-butylphenyl)pentaerythritol diphosphite; mix them evenly, melt extrude them, and form them into films by a casting method. The temperature in the casting method is 80°C to obtain a perovskite light-converting adhesive film.

[0060] Comparative Example 1

[0061] This comparative example is the same as Example 1, except that no butyltrimethylammonium chloride solution is added in step S2.

[0062] Comparative Example 2

[0063] This comparative example is the same as Example 2, except that the hexyltrimethylammonium bromide solution is not added in step S2.

[0064] Comparative Example 3

[0065] This comparative example is the same as Example 3, except that no octyltrimethylammonium iodide solution is added in step S2.

[0066] Comparative Example 4

[0067] This comparative example is the same as Example 4, except that no dodecyltrimethylammonium iodide solution is added in step S2.

[0068] Comparative Example 5

[0069] This comparative example is the same as Example 5, except that the tetradecyltrimethylammonium bromide solution is not added in step S2.

[0070] Comparative Example 6

[0071] This comparative example is the same as Example 6, except that the hexadecyltrimethylammonium chloride solution is not added in step S2.

[0072] The stability test of Examples 1-6 and Comparative Examples 1-6 was performed, and the specific method was as follows:

[0073] After photovoltaic glass, perovskite light-converting adhesive film, and photovoltaic glass are stacked in order on the photovoltaic glass, they are placed in a vacuum laminator, evacuated for 10 minutes, heated to 145°C, and laminated at a pressure of 25 MPa to obtain a light-converting adhesive film assembly.

[0074] The perovskite light-converting adhesive films prepared in each embodiment and comparative example were respectively used as intermediate light-converting adhesive film layers, and laminated according to the above method to obtain adhesive film assemblies. The photoluminescence quantum yield PLQY (%) of each laminated assembly was measured under a high temperature and high humidity test environment (temperature of 85°C and humidity of 85%) for different irradiation times, as shown in Table 1 below.

[0075] Table 1 PLQY (%) test results of the perovskite light conversion films prepared in each embodiment and comparative example after being placed for different time periods

[0076]

[0077]

[0078] It can be seen from Table 1 that the length of the alkyl chain in the compound alkyltrimethylammonium halide will affect the PLQY of the perovskite. Specifically, the longer the alkyl chain, the higher the PLQY first increases and then decreases, indicating that the number of carbon atoms in the carbon chain of the alkyltrimethylammonium halide has a greater influence on the PLQY.

[0079] Among them, the PLQY of the film assembly with dodecyltrimethylol iodide is the highest, indicating that the compound plays the best role in repairing, passivating and protecting perovskite quantum dots. The tetradecyltrimethylammonium bromide and hexadecyltrimethylammonium chloride added in Examples 5 and 6 have long carbon chains and are easily detached like oleic acid / oleylamine in the process of repairing quantum dots, which play a limited role in passivating and protecting quantum dots.

[0080] Under high temperature and high humidity conditions, each embodiment performs very stably, and can still maintain a PLQY of more than 95% of the initial value after 1000 hours of environmental testing.

[0081] In comparison, the PLQY of each comparative example is lower than that of each embodiment, indicating that the alkyl trimethylamine halide added in each embodiment has an effective repair and passivation effect on the perovskite quantum dots, which can effectively improve the luminescence quantum yield and stability of the perovskite quantum dots. Under high temperature and high humidity conditions, the stability of the components of each comparative example is poor, and the PLQY after 1000h has a large attenuation, which is lower than 80% of the initial value.

[0082] The above embodiments are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the above embodiments, a person of ordinary skill in the art should understand that any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for preparing a high-stability perovskite quantum dot film, characterized in that: The following steps are involved: S1, preparing alkyl trimethyl ammonium halide solution; S2. Preparing perovskite quantum dot colloid particles: mixing a perovskite quantum dot solution, blank colloid particles and an alkyl trimethylamine halide solution in a mass ratio of (2-8): (20-50): (1-3), and performing melt extrusion and granulation to obtain perovskite quantum dot colloid particles; S3. Preparation of adhesive film: weigh 80-110 parts of perovskite quantum dot particles, 0.2-2 parts of coupling agent, 0.5-2 parts of main cross-linking agent, 0.3-2 parts of auxiliary cross-linking agent, 0.04-0.2 parts of light stabilizer and 0.04-0.2 parts of antioxidant by weight, mix well and melt extrude, form a film by casting method, and obtain perovskite light conversion adhesive film.

2. The method for preparing a high-stability perovskite quantum dot adhesive film according to claim 1, characterized in that: In step S1, the alkyl trimethyl ammonium halide is a compound having an alkyl carbon chain with 4-16 carbon atoms, including one or more of butyl trimethyl ammonium halide, hexyl trimethyl ammonium halide, octyl trimethyl ammonium halide, dodecyl trimethyl ammonium halide, tetradecyl trimethyl ammonium halide or hexadecyl trimethyl ammonium halide.

3. The method for preparing a high-stability perovskite quantum dot adhesive film according to claim 2, characterized in that: The halogen in the alkyl trimethylamine halide is one of Cl, Br or I.

4. The method for preparing a high-stability perovskite quantum dot adhesive film according to claim 3, characterized in that: The alkyl trimethyl ammonium halide solution is a uniform solution prepared by dissolving the aforementioned compound in an organic solvent, and the concentration is 15-25%; the organic solvent is one or two of methanol, ethanol, isopropanol or toluene.

5. The method for preparing a high-stability perovskite quantum dot film according to claim 1, characterized in that: In step S2, the blank colloid particles are one or both of POE and EVA colloid particles.

6. The method for preparing a high-stability perovskite quantum dot film according to claim 1, characterized in that: In step S2, the perovskite quantum dot solution is a uniform solution formed by dissolving CsPbX3 (X=Cl, Br, I) in n-hexane, and the concentration is 10-30%.

7. The method for preparing a high-stability perovskite quantum dot film according to claim 1, characterized in that: The mixing conditions in step S2 are: temperature 70-120°C, time 0.2-2h; the melt extrusion conditions are: temperature 80-180°C, time 0.2-2h, rotation speed 20-80rpm; the granulation temperature is 80-180°C; the casting film forming process temperature in step S3 is 80-160°C, and the film thickness is 0.2-0.5mm.

8. The method for preparing a high-stability perovskite quantum dot adhesive film according to claim 1, characterized in that: In step S3, the coupling agent includes one or more of a vinyl silane coupling agent, an epoxy silane coupling agent, an alkyl silane coupling agent, an amino silane coupling agent, an isocyanate silane coupling agent, a sulfur-containing silane coupling agent or a piperazine silane coupling agent.

9. The method for preparing a high-stability perovskite quantum dot adhesive film according to claim 1, characterized in that: In step S3, the main cross-linking agent includes one or more of 2-ethylhexyl carbonate peroxide, triallyl cyanurate, 2,5-dimethyl-2,5-di-tert-butyl peroxide hexane, hydroxyethyl methacrylate, diisopropylbenzene peroxide, di-tert-butyl peroxide, dibenzoyl peroxide and 1,1-di-tert-butyl peroxide-3,3,5-trimethylcyclohexane; the auxiliary cross-linking agent includes one or more of triallyl isocyanurate, trimethylolpropane trimethacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate and N,N'-1,3-phenylene bismaleimide.

10. The method for preparing a high-stability perovskite quantum dot adhesive film according to claim 1, characterized in that: In step S3, the light stabilizer includes one or more of bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate, poly(4-hydroxy-2,2,6,6-tetramethyl-1-piperidinylethanol) succinate, bis(1,2,2,6,6-pentamethylpiperidinol) sebacate and poly[[6-[(1,1,3,3-tetramethylbutyl)amino]-1,3,5-triazine-2,4-diyl][(2,2,6,6-tetramethyl-4-piperidinyl)imino]-1,6-hexanediyl[(2,2,6,6-tetramethyl-4-piperidinyl)imino]]; the antioxidant includes one or more of aromatic amine antioxidants, hindered phenol antioxidants and phosphite antioxidants.

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