High-efficiency circuit board film removing liquid and preparation method and film removing method thereof

Abstract

The invention discloses an efficient circuit board film removing liquid and a preparation method and a film removing method thereof.The efficient circuit board film removing liquid can be composed of organic alkali, inorganic alkali, a copper protecting agent, a penetrating agent, a defoaming agent and pure water A. After all the components are evenly mixed, the prepared film removing liquid and pure water B can be mixed and diluted according to the mass ratio of 1: 5-1: 10, and then the film removing liquid can be prepared. And after dilution, heating to 50 DEG C, and then carrying out film removal operation on the circuit board. The film removing liquid provided by the invention is simple in component, convenient to prepare, low in cost, relatively stable after being prepared, high in film removing speed, thorough in film removing, capable of effectively solving the film clamping phenomenon of a precise circuit, free of reaction with copper and tin on a circuit board, free of influence on the circuit quality and long in maintenance period.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board film stripping liquid, and more specifically to a high-efficiency circuit board film stripping liquid and a preparation method and a film stripping method thereof. Background Art

[0002] With the rapid development of the circuit board industry and the increasing level of automation of mechanical equipment, the circuit design and manufacturing of circuit boards are becoming more and more precise. In the process of circuit board manufacturing, the circuit board needs to be de-filmed. For high-precision circuit boards and carrier boards, the line width and line spacing are relatively narrow. Traditional inorganic alkalis mainly rely on sodium hydroxide or potassium hydroxide and other ingredients for de-filming, but the efficiency of inorganic alkali de-filming liquid is low, the de-filming is not thorough, and the film is easily sandwiched. In addition, the inorganic alkali de-filming liquid will burn the circuit board and react with the copper and tin on the surface of the board, affecting the line quality. The de-filming efficiency of organic alkali de-filming liquid is better than that of inorganic alkali de-filming liquid, but the composition of general organic alkali de-filming liquid is complex, and the preparation process is cumbersome, resulting in high cost. Summary of the invention

[0003] The purpose of the present invention is to overcome the above-mentioned defects in the prior art and to provide a high-efficiency circuit board film removing liquid having simple ingredients, a relatively stable solution after preparation, a fast film removing speed, which can effectively solve the film clamping phenomenon of precision circuits, does not react with copper and tin on the circuit board, has a long maintenance period, and a preparation method and a film removing method thereof.

[0004] To achieve the above object, the first aspect of the present invention provides a high-efficiency circuit board film removal solution, which is composed of the following components in percentage by mass:

[0005] Organic base 30% to 60%;

[0006]

[0007] Preferably, the organic base can be set to be one of ethanolamine, diethanolamine, triethanolamine, ethylenediamine or a combination thereof.

[0008] Preferably, the inorganic base can be set to be one of sodium hydroxide and potassium hydroxide or a combination thereof.

[0009] Preferably, the copper protecting agent can be set to one of methylbenzotriazole, 1-phenylbenzotriazole, 1-hydroxymethylbenzotriazole, 1-aminobenzotriazole, 1-benzotriazole carboxylic acid methyl ester, methyltetrazole, benzimidazole, benzotriazole, benzotriazole, catechol, methylcatechol, hydroxytoluic acid or a combination thereof.

[0010] Preferably, the penetrant can be set to be one of ethylene glycol methyl ether, ethylene glycol ethyl ether, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether, polyethylene glycol, or a combination thereof.

[0011] Preferably, the defoaming agent can be polypropylene glycol.

[0012] The second aspect of the present invention provides a method for preparing a high-efficiency circuit board film removing solution according to the above technical solution, comprising the following steps:

[0013] The organic base, the inorganic base, the copper protecting agent, the penetrant, the defoaming agent and the pure water A are uniformly mixed to prepare the high-efficiency circuit board film removing liquid.

[0014] The third aspect of the present invention provides a method for removing a film using the high-efficiency circuit board removing liquid described in the above technical solution, comprising the following steps:

[0015] The film removal liquid and pure water B are mixed and diluted in a mass ratio of 1:5 to 1:10, and then the diluted mixed solution is heated to 50°C, and finally the circuit board is immersed in the mixed solution for film removal.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The film removal solution provided by the present invention has simple ingredients, is easy to prepare, and has low cost. The prepared solution is relatively stable, has a fast film removal speed, and is completely film removed. It can effectively solve the film clamping phenomenon of precision circuits, does not react with copper and tin on the circuit board, does not affect the circuit quality, and has a long maintenance period. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 This is a schematic diagram of a precision circuit board before film removal;

[0020] Figure 2 A schematic diagram of the film removal effect of a precision circuit board after using the film removal solution of the present invention;

[0021] Figure 3 This is a schematic diagram of the film removal effect of a precision circuit board after using a conventional inorganic alkaline film removal solution;

[0022] Figure 4 This is a schematic diagram of the film removal effect of precision circuit boards using conventional organic alkaline film removal liquid. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be described clearly and completely below. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] [Example 1]

[0025] Prepare 100Kg of high-efficiency circuit board film removal liquid, the components and contents are as follows:

[0026]

[0027] The above components are mixed evenly to prepare a high-efficiency circuit board film stripping liquid. When in use, the film stripping liquid and pure water B are mixed and diluted in a mass ratio of 1:5. After dilution, the film stripping operation is performed after heating to 50°C.

[0028] [Example 2]

[0029] Prepare 100Kg of high-efficiency circuit board film removal liquid, the components and contents are as follows:

[0030]

[0031] The above components are mixed evenly to prepare a high-efficiency circuit board film stripping liquid. When in use, the film stripping liquid and pure water B are mixed and diluted in a mass ratio of 1:5. After dilution, the film stripping operation is performed after heating to 50°C.

[0032] [Example 3]

[0033] Prepare 100Kg of high-efficiency circuit board film removal liquid, the components and contents are as follows:

[0034]

[0035] The above components are mixed evenly to prepare a high-efficiency circuit board film stripping liquid. When in use, the film stripping liquid and pure water B are mixed and diluted in a ratio of 1:5 by mass. After dilution, the film stripping operation is performed after heating to 50°C.

[0036] [Example 4]

[0037] Prepare 100Kg of high-efficiency circuit board film removal liquid, the components and contents are as follows:

[0038]

[0039] The above components are mixed evenly to prepare a high-efficiency circuit board film stripping liquid. When in use, the film stripping liquid and pure water B are mixed and diluted in a ratio of 1:10 by mass. After dilution, the film stripping operation is performed after heating to 50°C.

[0040] [Comparative Example 1]

[0041] Prepare 100 kg of conventional inorganic film removal liquid, the components and contents are as follows:

[0042] 3.5Kg of inorganic film removal liquid from a certain manufacturer;

[0043] Pure water B 96.5Kg;

[0044] Mix the above components evenly, heat to 50°C and then perform the film removal operation.

[0045] [Comparative Example 2]

[0046] Prepare 100 kg of conventional organic film removal solution, the components and contents are as follows:

[0047] 10Kg of organic film removal liquid from a certain manufacturer;

[0048] Pure water B 90Kg;

[0049] Mix the above components evenly, heat to 50°C and then perform the film removal operation.

[0050] The film removal temperature of the film removal solution prepared in Examples 1-4 and Comparative Examples 1-2 was set to 50°C. The circuit board used for film removal was a precision circuit board of the same model from a certain manufacturer, and the dry film thickness was 35 μm. The circuit boards of the same size were immersed in the film removal solution prepared in Examples 1-4 and Comparative Examples 1-2, and the time for the dry film to be completely peeled off was recorded with a stopwatch. After the film removal was completed, the film removal effect of each circuit board was observed with a microscope (see Figures 1 to 4 ), the experimental results are shown in Table 1:

[0051] formula Defilming time / s Defilming Film Copper and tin surface appearance Example 1 35 Remove membrane completely No film Smooth and flat Example 2 27 Remove membrane completely No film Smooth and flat Example 3 32 Remove membrane completely No film Smooth and flat Example 4 25 Remove membrane completely No film Smooth and flat Comparative Example 1 70 Incomplete membrane removal Severe dissection Uneven color change Comparative Example 2 55 Incomplete membrane removal A small amount of film Discoloration

[0052] The experimental results show that the film removal speed of Examples 1-4 is fast and efficient. For precision circuits, there is no film clamping phenomenon, and it does not react with the copper surface and the tin surface, and can effectively protect the circuit board; while the conventional inorganic film removal liquid of Comparative Example 1 has low film removal efficiency, poor film removal effect, serious film clamping, and reacts with the copper surface; compared with the conventional organic film removal liquid of Comparative Example 2, the film removal liquid of the present invention has higher film removal efficiency and can effectively solve the film clamping problem when removing the film from the precision circuit.

[0053] The above embodiments are preferred implementation modes of the present invention, but the implementation modes of the present invention are not limited to the above embodiments. Any other changes, modifications, substitutions, combinations, and simplifications that do not deviate from the spirit and principles of the present invention should be equivalent replacement methods and are included in the protection scope of the present invention.

Claims

1. A high-efficiency circuit board film removal liquid, characterized in that: It is composed of the following ingredients in percentage by mass:

2. The high-efficiency circuit board film removing liquid according to claim 1, characterized in that: The organic base is one of ethanolamine, diethanolamine, triethanolamine, ethylenediamine or a combination thereof.

3. The high-efficiency circuit board film removing liquid according to claim 1, characterized in that: The inorganic base is one of sodium hydroxide and potassium hydroxide or a combination thereof.

4. The high-efficiency circuit board film removing liquid according to claim 1, characterized in that: The copper protecting agent is one of methylbenzotriazole, 1-phenylbenzotriazole, 1-hydroxymethylbenzotriazole, 1-aminobenzotriazole, 1-benzotriazole carboxylic acid methyl ester, methyltetrazole, benzimidazole, benzotriazole, benzotriazole, catechol, methylcatechol, hydroxytoluic acid or a combination thereof.

5. The high-efficiency circuit board film removing liquid according to claim 1, characterized in that: The penetrant is one of ethylene glycol methyl ether, ethylene glycol ethyl ether, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether, polyethylene glycol, or a combination thereof.

6. The high-efficiency circuit board film removing liquid according to claim 1, characterized in that: The defoaming agent is polypropylene glycol.

7. A method for preparing a high-efficiency circuit board stripping solution according to any one of claims 1 to 6, characterized in that: The following steps are involved: The organic base, the inorganic base, the copper protecting agent, the penetrant, the defoaming agent and the pure water A are uniformly mixed to prepare the high-efficiency circuit board film removing liquid.

8. A method for removing film from a circuit board using the high-efficiency circuit board removing solution as claimed in any one of claims 1 to 6, characterized in that: The following steps are involved: The film removal liquid and pure water B are mixed and diluted in a mass ratio of 1:5 to 1:10, and then the diluted mixed solution is heated to 50°C, and finally the circuit board is immersed in the mixed solution for film removal.

Images