Pressure measurement assembly and pressure sensor

Abstract

The application discloses a pressure measuring assembly with good sealing performance and a pressure sensor comprising the electronic module assembly. The pressure measuring assembly comprises a substrate, an upper side surface of which is provided with a signal processing circuit; an upper cover, which comprises an upper cover main body and a first surrounding wall and a second surrounding wall formed by the upper cover main body extending downward and sealingly bonded to the upper side surface of the substrate at the lower end; a second cavity formed in the second surrounding wall is communicated to the upper side of the upper cover main body, and the second cavity is communicated to the lower side of the substrate through a through hole arranged on the substrate; a plurality of spring terminals electrically connected to the signal processing circuit at the lower end, the lower part of which is held in the first holding hole arranged on the upper cover main body, the lower end edge of the first holding hole extends downward to form a third surrounding wall, and the lower end of the third surrounding wall is sealingly bonded to the upper side surface of the substrate; and a pressure sensitive element; the third surrounding wall surrounds the inner cavity of the third surrounding wall at the periphery of the first cavity, and the inner cavity of the second surrounding wall is isolated from the first cavity.

Description

Technical Field

[0001] This application relates to the field of sensor technology, specifically to a pressure measurement component and a pressure sensor. Background Technology

[0002] In automotive ESC (Electronic Stability Control) systems, pressure sensors are used to measure the pressure of the braking medium. These sensors are typically mounted on hydraulic modules with limited installation space, thus requiring small dimensions, especially lateral dimensions. Since circuit boards are usually horizontally mounted, the area available for mounting electronic components is small, necessitating the use of multiple vertically arranged circuit boards or vertically mounted circuit boards. Regardless of the arrangement, the electrical connections between these components and terminals are generally inconvenient and costly. For example, when a circuit board is vertically mounted, its wire bonding plane with the pressure-sensitive element is perpendicular, which is extremely inconvenient from both an equipment and control perspective. Using multiple vertically arranged circuit boards further increases cost and manufacturing complexity due to the need for fixing and interconnecting these boards.

[0003] On the other hand, such pressure sensors typically use a metallic elastic diaphragm as the pressure deformer. A Wheatstone bridge composed of resistors such as thick-film resistors or silicon strain gauges is attached to the surface of this diaphragm, away from the medium being measured, to convert the strain of the diaphragm into an electrical signal. These thick-film resistors or silicon strain gauges need to be connected to the circuit board via leads. These leads and resistors are preferably protected by a gel cover. Therefore, a frame to accommodate the gel is usually fixed to the side of the circuit board away from the metallic elastic diaphragm.

[0004] On the other hand, these pressure sensors typically use a metal coil spring housed in an electrical connector as a terminal for connecting to external devices. However, the shape of this terminal makes it impossible to create a seal between the circuitry and the external environment. Moisture entering the sensor poses a risk of corroding the internal circuitry. Summary of the Invention

[0005] In view of the shortcomings of the prior art, this application provides a pressure measurement component to solve at least one of the above-mentioned defects.

[0006] To achieve the above objectives, this application provides the following technical solution: a pressure measuring component, comprising:

[0007] A substrate with its thickness direction arranged longitudinally in the vertical direction has a signal processing circuit disposed on its upper surface.

[0008] The top cover includes a top cover body and a first enclosure wall and a second enclosure wall extending downward from the top cover body and sealingly bonded to the upper surface of the substrate at their lower ends; the second enclosure wall surrounds the first enclosure wall and forms a first cavity between the second enclosure wall and the first enclosure wall for accommodating at least a portion of the electronic components of the signal processing circuit; the second cavity formed inside the second enclosure wall communicates with the upper side of the top cover body through a hole provided on the top cover body, and the second cavity communicates with the lower side of the substrate through a through hole provided on the substrate;

[0009] The lower end is electrically contacted to multiple spring terminals of the signal processing circuit, and its lower part is held in a first retaining hole that runs vertically through the upper cover body. The lower edge of the first retaining hole extends downward to form a third surrounding wall, and the lower end of the third surrounding wall is sealed and bonded to the upper surface of the substrate.

[0010] A pressure-sensitive element fixedly sealed at the upper end of the via is connected to an electrical contact portion that forms part of the signal processing circuit via a lead wire;

[0011] The third enclosure wall forms an inner cavity around the first cavity, and the inner cavity of the second enclosure wall is isolated from the first cavity.

[0012] Preferably, the sidewall of the radially outer end of the first retaining hole is provided with a notch that runs vertically through the hole and has a circumferential angle of less than half a circumference.

[0013] Preferably, the upper cover body has a stepped surface for bearing downward pressing force, and the upper cover body has an arc-shaped groove formed radially inside the first retaining hole, the bottom surface of the arc-shaped groove forming part of the upper cover body.

[0014] Preferably, the spring terminal includes an upper section and a lower section with their axes both vertically arranged, the upper section being located radially inside the lower section; the spring terminal also includes a transition section for integrally connecting the upper section and the lower section radially.

[0015] Preferably, the upper cover body has a support portion formed on it for supporting the upper section and / or the transition section upwards.

[0016] Preferably, a positioning part is formed on the upper cover body for positioning the upper section and / or the transition section on a horizontal plane.

[0017] Preferably, the lower end of the second enclosure wall elastically abuts against the substrate.

[0018] Preferably, the top cover further includes at least one thin-shell-shaped connecting portion whose radial inner and outer edges are connected one-to-one to the upper end of the second enclosure wall and the top cover body.

[0019] Preferably, the second cavity is filled with a gel injected through the orifice and covering the pressure-sensitive element and the lead wire.

[0020] This application also claims a pressure sensor comprising:

[0021] The housing has a pressure inlet channel and a second retaining hole for retaining the upper part of the spring terminal and pressing the upper part of the spring terminal downward;

[0022] The pressure measuring component described above is disposed inside the housing and its base plate is sealed to one inner end of the pressure inlet channel, the inner end of the pressure inlet channel being connected to the through hole.

[0023] The aforementioned pressure measurement assembly and pressure sensor, while connecting to external devices via spring terminals, possess high sealing performance, significantly reducing the risk of corrosion to electronic components. Furthermore, the aforementioned pressure sensor further enhances its functionality by incorporating two vertically arranged circuit-laying substrates. The lower substrate utilizes the space around the connecting flange, increasing the area for electronic component placement while saving internal housing space. Simultaneously, it allows for convenient electrical connection between the circuits on these two substrates via conductive helical springs. Attached Figure Description

[0024] Figure 1 A perspective view of the electronic module assembly of the first embodiment;

[0025] Figure 2 This is a longitudinal sectional view of the electronic module assembly of the first embodiment;

[0026] Figure 3 This is a bottom view of the top cover of the first embodiment;

[0027] Figure 4 This is an exploded view of the electronic module assembly of the first embodiment;

[0028] Figure 5 This is a longitudinal sectional view of the pressure sensor according to the first embodiment;

[0029] Figure 6 A longitudinal sectional view of the pressure sensor of a first variation of the first embodiment;

[0030] Figure 7 This is a longitudinal sectional view of the pressure sensor of a second variation of the first embodiment;

[0031] Figure 8 A perspective view of the electronic module assembly of the second embodiment;

[0032] Figure 9This is a longitudinal sectional view of the electronic module assembly of the second embodiment;

[0033] Figure 10 This is a bottom view of the top cover of the pressure sensor in the second embodiment;

[0034] Figure 11 This is a longitudinal sectional view of the electronic module assembly of the third embodiment;

[0035] Figure 12 This is a schematic diagram of the spring terminal in the third embodiment;

[0036] Figure 13 A longitudinal sectional view of the electronic module assembly of the first variation of the third embodiment;

[0037] Figure 14 This is a longitudinal sectional view of the pressure measurement assembly according to the fourth embodiment;

[0038] Figure 15 This is a perspective view of a portion of the structure of the pressure measurement assembly in the fourth embodiment;

[0039] Figure 16 This is a longitudinal sectional view of the pressure measurement assembly of the first variation of the fourth embodiment;

[0040] Figure 17 This is a longitudinal sectional view of the pressure sensor according to the fourth embodiment;

[0041] Figure 18 This is a longitudinal sectional view of the pressure sensor according to the fifth embodiment;

[0042] Explanation of reference numerals: 100, Pressure introduction channel; 111, Support plate; 11a, Groove; 11, Connecting flange; 1a, Stepped surface; 1b, Stepped surface; 1c, Flange; 1d, Upper surface; 1f, Lower surface; 1, Pressure interface; 200, Pressure sensing circuit; 201, Gap; 20, Metal elastic diaphragm; 21, Support wall; 22, Enlargement; 2, Pressure sensitive element; 311, Pressing edge; 31, Pressing part; 321, Anti-detachment part; 32, Fixing part; 33a, Relief hole; 33b, Holding hole; 33, Main body; 3, Support base; 400, Gel; 411, Electrical contact part; 412, Electrical contact part; 41a, Through hole; 41, Substrate; 42a, Relief hole; 42, Substrate; 431, Electronic component; 43, Signal processing circuit; 44, Electrical connector; 451, Electrical contact part; 45, Signal processing Circuit; 501, Waterproof and breathable membrane; 511, Extension; 51a, Retaining hole; 51, Top cover body; 52, Enclosure; 531, Connecting part; 53, Enclosure; 5a, Cavity; 5b, Cavity; 5c, Stepped surface; 5d, Hole; 5, Top cover; 61, Pressing edge; 6, Cylinder shell; 71, Support flange; 7a, Stepped surface; 7b, Retaining hole; 7, Electrical connector; 8, Spring terminal; 91, Sealing ring; 92, Seal 10. Circle; 30. Electronic module assembly; 413. Pressure measurement assembly; 432. Electrical contact; 511a. Conditioning chip; 51b. Notch; 51c. Positioning protrusion; 51d. Enclosure; 52a. Groove; 53a. Groove; 5e. Arc-shaped groove; 81a. First part; 81b. Second part; 81c. Transition part; 81. Upper section; 82a. Elastic part; 82. Lower section; 83. Transition section. Detailed Implementation

[0043] The technical solution of this application will now be clearly and completely described with reference to the accompanying drawings. The following embodiments are exemplary and are only used to explain this application, and should not be construed as limiting this application. In the following description, the same reference numerals are used to denote the same or equivalent elements, and repeated descriptions are omitted.

[0044] In the description of this application, it should be understood that the terms "upper," "lower," "inner," "outer," "left," and "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the equipment or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the prepositions "first," "second," and "third," etc., are only used for the purpose of distinguishing the modified objects, and should not be construed as indicating or implying relative importance.

[0045] Furthermore, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0046] It should also be further understood that the term "and / or" as used in this application specification and the corresponding claims refers to any combination of one or more of the listed items and all possible combinations.

[0047] Please refer to the following: Figures 1-4 In the first embodiment, the electronic module assembly 10 includes a substrate 41, a top cover 5, and a plurality of spring terminals 8. The first substrate 41 is longitudinally arranged in the vertical direction along its thickness, and a first signal processing circuit 43 is disposed on its upper surface. The top cover 5 includes a top cover body 51 and a surrounding wall 52 and a surrounding wall 53 extending downward from the top cover body 51 and sealed to the upper surface of the first substrate 41 at their lower ends. The surrounding wall 53 surrounds the outer side of the surrounding wall 52 and forms a cavity 5a between the surrounding wall 52 and the surrounding wall 52. The cavity 5b formed inside the surrounding wall 53 communicates with the upper side of the top cover body 51 through a hole 5d provided on the top cover body 51. The cavity 5b communicates with the lower side of the substrate 41 through a through hole 41a provided on the substrate 41. The top cover body 51 is provided with retaining holes 51a corresponding one-to-one with the aforementioned spring terminals 8 and extending vertically through them. The lower edge of the retaining hole 51a extends downward to form a surrounding wall 51d. The lower end of the enclosure 51d is sealed and bonded to the upper surface of the substrate 41.

[0048] The cavity 5a is used to house the electronic components of the signal processing circuit 43 that need to be protected, such as the conditioning chip 432 and electronic component 431. The cavity 5a can be filled with gel 400 to protect the pressure-sensitive element 2 and related leads, which will be described in detail below. The retaining hole 51a is used to retain the lower part of the corresponding spring terminal 8 inside it. The lower end of the spring terminal 8 is electrically contacted to the electrical contact portion 411 of the signal processing circuit 43 located at the bottom of the retaining hole 51a. The upper end of the spring terminal 8 is used to form an electrical connection with external devices, etc.

[0049] In this way, the electronic module assembly 10 can be conveniently connected to external devices via the spring terminal 8, while protecting the electronic components that need protection within the cavity 5a; in addition, the leads connecting the pressure-sensitive element and the substrate 41 can be protected by filling the inner cavity of the enclosure 53 with gel.

[0050] The bottoms of enclosures 52, 53, and 51d can correspondingly form a groove 52a, a groove 53a, and a groove 51b. When bonding the lower end face of the upper cover 5 to the upper surface of the substrate 41 with sealant, the upper cover 5 can be inverted first, and then sealant can be injected into the grooves 52a, 53a, and 51b. Then, the substrate 41 can be inverted and bonded to the upper cover 5. For example, the lower end face of enclosure 52 can be bonded to an annular region S1 on the upper surface of the substrate 41, the lower end face of enclosure 53 can be bonded to an annular region S2 on the upper surface of the substrate 41, and the lower end faces of multiple enclosures 51d can be bonded to an annular region S3 on the upper surface of the substrate 41. Thus, enclosure 51d can enclose an inner cavity within cavity 5a, and the inner cavity of enclosure 51d is isolated from other parts of cavity 5a. Preferably, all grooves 51b are laterally connected to groove 53a. For example, enclosure 53 and enclosure 51d may have at least one common section, which facilitates the injection of sealant.

[0051] Figure 5 The overall structure of the pressure sensor according to the first embodiment is shown. The pressure sensor includes a pressure measuring component and a housing. The housing may include a longitudinally extending metal cylindrical shell 6, a metal pressure interface 1 sealed to the lower end of the cylindrical shell 6, and an electrical connector 7 extending into the cylindrical shell 6 at its lower end. A pressure inlet channel 100 is provided on the pressure interface 1. The electrical connector 7 has a retaining hole 7b for retaining the upper part of the spring terminal 8 and pressing the upper part of the spring terminal 8 downward. Exemplarily, the spring terminal 8 may be a known stepped helical spring, for example, it may include an upper section 81 with a smaller outer diameter, a lower section 82 with a larger outer diameter, and a transition section 83 connecting the two. The upper section 81 and the lower section 82 are coaxially arranged. The upper section 81 and the surrounding wall 53 are preferably tightly wound to be given sufficient rigidity to facilitate insertion with external equipment (and pressed downward by the retaining hole 7b of the electrical connector 7), the retaining hole 7b may be a stepped hole and have a pressing surface that presses the transition section of the spring terminal 8 downward.

[0052] In addition to the electronic module assembly 10 described above, the pressure measurement assembly also includes a pressure-sensitive element 2 that is sealed inside one end of the pressure introduction channel 100 to generate a corresponding electrical signal in response to the pressure of the medium to be measured within the pressure introduction channel 100. The electronic module assembly 10 is used to process the aforementioned electrical signal. The pressure-sensitive element 2 may include a horizontally extending metal elastic diaphragm 20 with a pressure sensing circuit 200 disposed on its upper surface. The upper surface of the metal elastic diaphragm 20 abuts against the lower surface of the substrate 41 and a gap 201 is left between it and the lower surface of the substrate 41. The metal elastic diaphragm 20 is electrically connected to the electrical contact portion 413 of the signal processing circuit 43 located in the cavity 5b through multiple leads passing through the through-hole 41a. The cavity 5b is filled with a gel 400 covering the leads. The gel 400 partially overflows into the gap 201 to at least partially cover the pressure sensing circuit 200. The height of the gap 201 should be as small as possible, for example, 1.5 mm to 3 mm, while allowing for a predetermined upward deformation of the metal elastic diaphragm 20.

[0053] The pressure measuring assembly may further include a support base 3 for fixing the electronic module assembly 10 inside the housing. For example, the upper part of the shell 6 may be bent inward to form a pressing edge 61, which presses downward against an upward-facing stepped surface 7a formed on the electrical connector 7. A sealing ring 92 may be provided between the pressing edge 61 and the stepped surface 7a, and / or a sealant may be applied between the pressing edge 61 and the outer wall of the electrical connector 7. The lower edge of the electrical connector 7 may extend downward to form a support flange 71, which presses the support base 3 against the pressure port 1. A sealing ring 92 may be provided between the pressing edge 61 and the stepped surface 7a. Alternatively or additionally, the lower end of the support base 3 can be directly snapped or welded to the pressure port 1; more preferably, the support base 3 may include a longitudinally extending metal ring fixing part 32, the lower end of the fixing part 32 being sealed and welded to a ring stepped surface 1b formed on the pressure port 1. In this case, the upper part of the shell 6 may not be provided with a pressure edge, but is fixed to the electrical connector 7 by being molded inside the electrical connector 7.

[0054] The support base 3 may also include a ring of main body 33, the upper end of the fixing part 32 being sealably molded within the main body 33. The bottom edge of the substrate 41 may be directly bonded and fixed to the upper end face of the main body 33. Alternatively or additionally, the support base 3 may also include a ring of metal clamping part 31 with its lower end molded within the main body 33, the upper end of which may be bent inward to form a clamping edge 311, which may press the upper cover 5 downward to the upper end face of the main body 33. Preferably, a stepped surface 5c may be formed on the upper cover body 51 to withstand the downward clamping force of the clamping edge 311, and a sealing ring 91 may be provided between the clamping edge 311 and the stepped surface 5c. In some inferior embodiments, the lower part of the fixing part 32 can be divided into multiple parts in the circumferential direction. These parts can be snapped onto the sidewall of the flange part 1c formed by the upwardly protruding inner side of the stepped surface 1b. In this case, the fixing part 32 does not necessarily need to be made of metal and molded within the main body 33, but can instead be integrally connected to the main body 33 and made of plastic. In other embodiments, the clamping part 31 and the fixing part 32 do not necessarily need to be a complete circle, but can be divided into multiple parts arranged at intervals in the circumferential direction. When the fixing part 32 is divided into multiple parts arranged at intervals in the circumferential direction, the fixing part 32 can be snapped onto the outer wall of the flange part 1c formed by the corresponding upwardly protruding inner side of the stepped surface 1b.

[0055] The main body 33 is provided with a first clearance hole 33a that allows the pressure-sensitive element 2 to pass through vertically, so that the upper surface of the metal elastic diaphragm 20 can pass through the clearance hole 33a upward and approach one side surface of the substrate 41. The pressing part 31 and the fixing part 32 can be integrally connected.

[0056] In some other embodiments, the pressure sensor may further include a substrate 42 located directly below the substrate 41, with a signal processing circuit 45 disposed on the upper surface of the substrate 42. The signal processing circuit 45 is elastically electrically contacted via an electrical connector 44 to a first electrical contact portion 412 disposed on the lower surface of the substrate 41 and electrically connected to a first signal processing circuit 43, wherein the electrical contact portion 412 can form an electrical connection with the signal processing circuit 43 through metallized vias on both sides of the substrate 41. The substrate 42 is provided with a clearance hole 33a that allows the pressure-sensitive element 2 to pass through. The electrical connector 44 may be a conductive helical spring that is electrically contacted and compressed by the electrical contact portion 412 disposed on the lower surface of the substrate 41 and the electrical contact portion 451 disposed on the upper surface of the substrate 42, and the conductive helical spring can be held in a holding hole 33b disposed in the main body 33. The substrate 42 may be provided with a clearance hole 42a for accommodating the pressure-sensitive element 2, which can be bonded to the lower end face of the main body 33.

[0057] The edge of the metal elastic diaphragm 20 can extend downward to form a supporting wall 21. The supporting wall 21 can be sealed and welded to a connecting flange 11 formed by extending upward from the upper end surface 1d of the pressure interface 1 at one end of the pressure introduction channel 100. More preferably, the middle part of the connecting flange 11 expands outward to form a supporting disk 111. The lower end of the supporting wall 21 can support and be welded to the supporting disk 111. A groove 11a is formed between the supporting disk 111 and the upper end surface 1d of the pressure interface 1. The upper end of the supporting wall 21 can expand radially outward to form an enlarged portion 22 to increase the rigidity of the edge portion of the metal elastic diaphragm 20. At this time, the via 41a of the substrate 42 should be able to allow the support plate 111 to pass through. When the substrate 42 is installed, it can pass downward over the support plate 111 before the pressure sensitive element 2 is soldered to the connecting flange 11. When the via 41a can allow the support plate 111 and the pressure sensitive element 2 to pass vertically, the substrate 42 can also be assembled with the support base 3 downward over the support plate 111 and the enlarged portion 22 after the pressure sensitive element 2 is soldered to the connecting flange 11.

[0058] When the conditioning chip 432 is an unpackaged bare die, it can also be placed in the cavity 5b and electrically connected to the signal processing circuit 43 through additional leads. The conditioning chip 432 and its related leads can also be covered by gel 400 for protection.

[0059] The electronic module assembly 10 of this embodiment can isolate the electronic components requiring protection from the external environment in cavity 5a, and provides chemical and mechanical protection to the leads of the pressure-sensitive element 2 in cavity 5b using gel. When connected to an external device via spring terminal 8, only the electrical contact portion 411 is exposed to the external environment, thus providing excellent sealing. In addition, by providing two laterally extending substrates as the base of the circuit, the area available for mounting electronic components is ensured while maintaining a relatively low lateral dimension.

[0060] Please see Figure 6Compared to the first embodiment, in the pressure sensor shown in the first variation of the first embodiment, the fixing part 32 and the main body 33 can be integrally made of the same material. The fixing part 32 is divided into multiple circumferentially spaced parts, and the fixing part 32 is snapped onto the flange part 1c. The sealing ring 91 can be omitted, so that the pressing edge 311 can be pressed directly downward to the stepped surface 5c. The upper cover 5 also includes at least one ring of thin-shell-shaped connecting parts 531 whose radially inner and outer edges are respectively connected to the upper end of the enclosure wall 53 and the upper cover body 51. In this way, the enclosure wall 53 and the connecting parts 531 as a whole can have a relatively high longitudinal expansion and contraction deformation capacity, so that the lower end of the enclosure wall 53 elastically abuts against the upper surface of the substrate 41, so as to avoid excessive pressure and excessive deformation of the substrate 41 when the lower edge of the enclosure wall 53 abuts against the upper surface of the substrate 41. Furthermore, the clearance hole 42a not only allows the support plate 111 to pass longitudinally, but also allows the enlarged portion 22 to pass longitudinally, so that the edge portion of the upper surface of the substrate 42 can be pre-bonded to the lower surface of the main body 33 and then assembled together with the support base 3 onto the pressure interface 1.

[0061] Preferably, the inner radial edge and the outer radial edge of the connecting part 531 are at different vertical heights, and the lower edge of the connecting part 531 is connected to the upper cover body 51, and the upper edge of the connecting part 531 is connected to the upper end of the enclosure 53, thereby further improving the longitudinal expansion and contraction deformation capability of the enclosure 53 and the connecting part 531 as a whole.

[0062] Please see Figure 7 Compared to the first embodiment, in the pressure sensor shown in the second variation of the first embodiment, the upper edge of the retaining hole 51a protrudes upward to form an extension 511, thereby increasing the longitudinal height of the retaining hole 51a to better retain the spring terminal 8. In particular, when the height of the retaining hole 51a is sufficient, the spring terminal 8 can be inserted into the retaining hole 51a first, and the spring terminal 8 can be held in a vertical state by the retaining hole 51a. In addition, the clearance hole 42a not only allows the support plate 111 to pass longitudinally, but also allows the enlarged part 22 to pass longitudinally, so that the edge portion of the upper surface of the substrate 42 can be pre-fixed to the lower surface of the main body 33, and then assembled onto the pressure interface 1 together with the support base 3. Among them, the anti-detachment part 321 protruding radially inward can be formed on the fixing part 32 by means of indentation or the like, thereby pressing the substrate 42 to the lower end surface 1f of the main body 33 by the anti-detachment part 321. At this point, it is preferable to construct the anti-detachment portion 321 into multiple circumferentially spaced parts, so that when the substrate 42 is mounted to the main body portion 33, the anti-detachment portion 321 can easily undergo elastic deformation, causing the substrate 42 to move past the anti-detachment portion 321. In addition, the upper edge of the retaining hole 51a can protrude upward to form an extension portion 511, and a corresponding recess 7c for accommodating the extension portion 511 is formed in the electrical connector 7.

[0063] It is readily understood that the pressure-sensitive element 2 can also use an elastic diaphragm made of ceramic or other suitable materials instead of a metal elastic diaphragm. The upper surface of the elastic diaphragm is insulated with a thick-film resistor, a semiconductor strain gauge, or other type of piezoresistive pressure sensing circuit 200. Alternatively, other capacitive pressure-sensitive elements, such as ceramic capacitive pressure-sensitive elements, can be used. These elastic diaphragms can be sealed and fixed to one end of the pressure inlet channel 100 by pressure sealing or adhesive sealing. These pressure-sensitive elements preferably have a suitable area, similar to the aforementioned metal elastic diaphragm 20, to receive gel overflowing into the gap 201.

[0064] In some other embodiments, preferably, the lower surface of the substrate 42 can be bonded to the upper surface 1d, rather than being bonded or snapped to the lower surface of the main body 33.

[0065] Please see Figures 8-10 Compared to the electronic module assembly 10 of the first embodiment, in the second embodiment, the electronic module assembly 10 has a surrounding wall 51d that encloses the inner cavity of the surrounding wall 53 outside the cavity 5a, so that the inner cavity of the surrounding wall 53 is isolated from the cavity 5a, instead of the surrounding wall 51d enclosing its inner cavity inside the cavity 5a as in the first embodiment. Compared to the first embodiment, in this embodiment, the retaining hole 51a and the surrounding wall 51d are respectively disposed at the edge of the upper cover body 51. Moreover, the radially inner side of the surrounding wall 51d shares at least a portion with the surrounding wall 52, so the groove 51b can be omitted. The advantage of doing so is that it can reduce the complexity of adhesive application and the amount of sealant used.

[0066] More preferably, a notch 511a is provided on the side wall of the radially outer end of the retaining hole 51a, which is vertically continuous and has a circumferential angle of less than half a circumference. In this way, while retaining the lower part of the spring terminal 8, the usable area of ​​the substrate 41 can be relatively increased, and the complexity of the adhesive application and the amount of sealant used can be further reduced.

[0067] Please see Figures 11-12 Compared to the electronic module assembly 10 of the second embodiment, in the third embodiment, the spring terminal 8 may include an upper segment 81 and a lower segment 82, both with their axes vertically aligned. The upper segment 81 is located radially inside the lower segment 82. The spring terminal 8 also includes a transition segment 83 for integrally connecting the upper segment 81 and the lower segment 82 radially. The lower segment 82 includes at least a sparsely coiled elastic portion 82a, and the upper segment 81 may include a first portion 81a with a smaller outer diameter, a second portion 81b with a larger outer diameter located below the first portion 81a, and a transition portion 81c that connects the two. Preferably, the first portion 81a and the transition portion 81c are tightly coiled and have a certain rigidity, while the second portion 81b is sparsely coiled and has a certain elasticity.

[0068] During assembly, the upper part of the upper section 81 is held in the retaining hole 7b of the electrical connector 7, and at least a portion of the lower section 82 is held in the retaining hole 51a of the upper cover body 51. This arrangement allows the radially outer electrical contact 411 to have a radially inner insertion position when connected to an external device via several segments of spring terminals 8 with different radial positions, thus better meeting existing standards.

[0069] like Figure 13 As shown, in a variation, preferably, a support portion is formed on the upper cover body 51 for upward support of the upper section 81 and / or the transition section 83. More preferably, a positioning portion is formed on the upper cover body 51 for positioning the upper section 81 and / or the transition section 83 on a horizontal plane. The positioning portion may include a positioning groove formed at the top of the upper cover body 51 to surround the lower end of the upper section 81. The positioning portion includes a positioning protrusion 51c formed at the top of the upper cover body 51 to extend into the lower end of the upper section 81. In addition, in order to enable the stepped surface 5c to form a complete circle in the circumferential direction for better sealing with the pressure edge 311 through the sealing ring 91, an arcuate groove 5e is formed on the radially inner side of the retaining hole 51a in the upper cover body 51. The bottom surface of the arcuate groove 5e forms part of the upper cover body 51.

[0070] Please refer to the following: Figures 14-15 Compared to the first embodiment, in the fourth embodiment, the pressure-sensitive element 2 is a small pressure-sensitive element, such as a semiconductor pressure-sensitive element (e.g., a pressure chip) or a surface-mount pressure-sensitive element, or other pressure-sensitive elements suitable for mounting on the substrate 41. The electronic module assembly 10 and the pressure-sensitive element 2 can be collectively referred to as the pressure measurement assembly 30.

[0071] At this time, the lead connecting the pressure-sensitive element 2 and the electrical contact 413 on the upper surface of the substrate 41 is located entirely on the upper side of the substrate 41. Therefore, there is no need to provide a gap between the upper surface of the pressure-sensitive element 2 and the lower surface of the substrate 41 as in the first embodiment to allow for the deformation of the metal elastic diaphragm. At this time, the size of the via 41a mainly depends on the lateral dimension of the pressure-sensitive element 2, and the gel 400 is only filled in the cavity 5b and not in the via 41a. A signal conditioning module can also be integrated into the pressure chip. The substrate 41 can be a ceramic plate, so that it can serve as a substrate with suitable mechanical strength for mounting the pressure-sensitive element 2, or as a substrate for printed circuits.

[0072] Please see Figure 16The signal processing circuit described above, which is disposed on the substrate, can refer to a circuit directly printed on the surface of the substrate, or it can be indirectly disposed on the substrate. For example, a dielectric layer or intermediate substrate 414 can be disposed on the substrate, and then the circuit can be directly disposed on the dielectric layer or intermediate substrate. In addition, a waterproof and breathable membrane 501 can be adhered to the upper surface of the hole 5d. While preventing moisture from entering the cavity 5b, the hole 7b is kept connected to the environment through the gap between the electrical connector 7 and the upper cover 5. This allows the ambient reference pressure to be introduced onto the upper surface of the metal elastic diaphragm 20, thereby measuring the relative pressure of the pressure medium to be measured relative to the environment, i.e., the gauge pressure.

[0073] Please see Figure 17 The pressure sensor of the fourth embodiment includes a housing, which includes an electrical connector 7 and a pressure interface 1. The pressure interface 1 has a pressure inlet channel 100 for connecting to the interior of the housing. The pressure interface 1 may be made of metal, with its edge extending upward to form a cylindrical shell 6. The upper end of the cylindrical shell 6 is pressed downward against an upward stepped surface 7a formed on the electrical connector 7. The electrical connector 7 applies downward pressure to the stepped surface 5c of the upper cover 5, thereby pressing the substrate 41 downward. The lower surface of the substrate 41 is sealed to the through hole 41a through a sealing ring 94 in a sealing groove provided on the pressure interface 1.

[0074] Please see Figure 17 The pressure sensor of the fifth embodiment, based on the fourth embodiment, provides a downward clamping force to the upper cover 5 through a cylindrical shell 60 disposed inside the cylindrical shell 6. The lower end of the cylindrical shell 60 can be integrally connected to the pressure port 1, and the upper end of the cylindrical shell 60 can be bent inward to form a pressing edge 601 for tightening the stepped surface 5c downward.

[0075] In some other designs, the pressure port 1 may also be made of plastic, and the electrical connector 7 may be connected to the pressure port 1 by a snap-fit ​​connection to provide downward clamping force on the top cover 5.

[0076] Among them, the clearance hole 42a, the connecting flange 11, the support plate 111, the metal elastic diaphragm 20, and the clearance hole 33a can all be concentric circles in cross-sectional shape on the transverse plane.

[0077] The scope of this disclosure is not limited by the detailed description, but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents are to be included in this disclosure.

Claims

1. A pressure measuring component, characterized in that, include: A substrate (41) with its thickness direction arranged longitudinally in the vertical direction has a signal processing circuit (43) disposed on its upper surface; The top cover (5) includes a top cover body (51) and a first enclosure wall (52) and a second enclosure wall (53) extending downward from the top cover body (51) and sealingly bonded to the upper surface of the substrate (41) at the lower end; the second enclosure wall (53) surrounds the first enclosure wall (52) and forms a first cavity (5a) between the second enclosure wall (52) and the first enclosure wall (52) for accommodating at least a portion of the electronic components (431) of the signal processing circuit (43); the second cavity (5b) formed inside the second enclosure wall (53) is connected to the upper side of the top cover body (51) through a hole (5d) provided on the top cover body (51), and the second cavity (5b) is connected to the lower side of the substrate (41) through a through hole (41a) provided on the substrate (41); The lower end is electrically contacted to a plurality of spring terminals (8) of the signal processing circuit (43), and its lower part is held in a first retaining hole (51a) that is provided on the upper cover body (51) and extends downward to form a third enclosure (51d). The lower end edge of the first retaining hole (51a) extends downward to form a third enclosure (51d), and the lower end of the third enclosure (51d) is sealed and bonded to the upper surface of the substrate (41). and a pressure-sensitive element (2) fixedly sealed at the upper end of the through hole (41a), which is connected to an electrical contact (413) that constitutes part of the signal processing circuit (43) via a lead wire; The third enclosure wall (51d) surrounds the inner cavity of the first cavity (5a) and the inner cavity of the second enclosure wall (53) is isolated from the first cavity (5a).

2. The pressure measuring component according to claim 1, characterized in that, The first retaining hole (51a) has a notch (511a) on one side wall of the radial outer end that is vertically continuous and has a circumferential angle of less than half a circumference.

3. The pressure measuring component according to claim 2, characterized in that, The upper cover body (51) has a stepped surface (5c) for bearing downward pressing force, and the upper cover body (51) has an arc-shaped groove (5e) formed on the radially inner side of the first retaining hole (51a), the bottom surface of the arc-shaped groove (5e) forming part of the upper cover body (51).

4. The pressure measuring component according to claim 3, characterized in that, The spring terminal (8) includes an upper section (81) and a lower section (82) with their axes both vertically arranged. The upper section (81) is located radially inside the lower section (82). The spring terminal (8) also includes a transition section (83) for integrally connecting the upper section (81) and the lower section (82) in the radial direction.

5. The pressure measuring assembly according to claim 4, characterized in that, The upper cover body (51) has a support portion formed on it for supporting the upper section (81) and / or the transition section (83) upwards.

6. The pressure measuring assembly according to claim 5, characterized in that, The upper cover body (51) has a positioning part formed on it for positioning the upper section (81) and / or the transition section (83) on a horizontal plane.

7. The pressure measuring assembly according to claim 2, characterized in that, The lower end of the second enclosure (53) elastically abuts against the substrate (41).

8. The pressure measuring assembly according to claim 7, characterized in that, The top cover (5) also includes at least one thin-shell-shaped connecting part (531) that is connected to the upper end of the second enclosure wall (53) and the top cover body (51) in a one-to-one correspondence between the inner and outer sides of the radial side.

9. The pressure measuring assembly according to any one of claims 1 to 8, characterized in that, The second cavity (5b) is filled with gel (400) injected through the hole (5d) and covering the pressure-sensitive element (2) and the lead wire.

10. A pressure sensor, characterized in that, include: The housing has a pressure inlet channel (100) and a second retaining hole (7b) for retaining the upper part of the spring terminal (8) and pressing the upper part of the spring terminal (8) downward; And the pressure measuring component (30) as described in any one of claims 1 to 9, wherein the pressure measuring component (30) is disposed inside the housing and its base plate (41) is sealed to one inner end of the pressure introduction channel (100), the one inner end of the pressure introduction channel (100) communicating with the through hole (41a).

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