A semiconductor heating plate quality detection device and detection method

Abstract

The present invention belongs to the technical field of quality inspection of heating plates, and particularly relates to a quality inspection device and inspection method for semiconductor heating plates, including: a device housing, which is divided into a first chamber and a second chamber by a partition inside the device housing. A placement mechanism for placing a semiconductor heating plate is arranged in the first chamber, a heating mechanism is arranged above the placement mechanism, and a cooling mechanism is arranged in the second chamber; Doors one and two are respectively arranged corresponding to the outer ends of the first chamber and the second chamber, and a control panel is installed on door one; By controlling the control panel to output different currents to the semiconductor heating plate, different powers are generated by the semiconductor heating plate, and the service life of the semiconductor heating plate under different powers is detected. By controlling the magnitude of the current input to the semiconductor heating plate through the control panel, the actual service life that can be used normally under the actual power generated at this current can be detected.

Description

Technical Field

[0001] The present invention belongs to the technical field of heating plate quality inspection, and particularly relates to a semiconductor heating plate quality inspection device and inspection method. Background Art

[0002] The manufacturing materials of semiconductor heating plates need to have high temperature resistance, high thermal conductivity and wear resistance. Due to their special use environment, the selection of materials is very crucial, and they need to have a high service life and a stable heating state to meet the production needs of products with high process requirements.

[0003] For example, an electric heating tube withstand voltage detection device provided by Chinese Patent Application CN108196156A includes: a swing frame for placing the electric heating tube, the swing frame is inclined from one end to the other end, the electric heating tube is placed into the swing frame from the higher end and falls out along the lower end of the swing frame; a withstand voltage detection mechanism is arranged on both sides of the lower end of the swing frame, including a cylinder and a conductive head connected to the cylinder, the conductive head is connected to an external detection circuit, when the electric heating tube passes through the withstand voltage detection mechanism, the conductive head is driven by the cylinder to approach the swing frame and contact both ends of the electric heating tube, and the external detection circuit tests the electrical conductivity and withstand voltage performance of the electric heating tube through the conductive head, and determines whether the measured electric heating tube is qualified accordingly.

[0004] In the prior art recorded in Chinese patents, only the electrical conductivity and withstand voltage performance of the product to be tested can be tested, and many products with service lives that do not reach the expected value will not have problems when tested for electrical conductivity and withstand voltage performance, and it is difficult to detect the life limit of the product. Summary of the Invention

[0005] The purpose of the present invention is to provide a semiconductor heating plate quality inspection device and inspection method, which controls the magnitude of the current input to the semiconductor heating plate through a control panel, so that the actual service life that can be normally used under the actual power generated by this current can be detected, thereby detecting the quality of the product, and by changing the magnitude of the current output to the semiconductor heating plate, the actual service life that the product can use under different powers can be detected, which is convenient for measuring the relationship between the product life and power.

[0006] The technical solutions adopted by the present invention are specifically as follows:

[0007] A semiconductor heating plate quality detection device and detection method, comprising: a device housing, which is partitioned into a first chamber and a second chamber by a partition inside the device housing. A placement mechanism for placing a semiconductor heating plate is arranged in the first chamber, a heating mechanism is arranged above the placement mechanism, and a cooling mechanism is arranged in the second chamber; Doors one and two are respectively arranged corresponding to the outer ends of the first chamber and the second chamber, and a control panel is installed on door one; The placement mechanism includes a placement table that is movably arranged in the first chamber, and the semiconductor heating plate is placed on the placement table; The heating mechanism includes a liquid storage tank, the cooling mechanism includes a cooling tank, and the liquid storage tank and the cooling tank are connected through an evaporation pipe; The semiconductor heating plate and the control panel are electrically connected through a wire; The control panel is used to control the output of different currents to the semiconductor heating plate, so that the semiconductor heating plate generates different powers, and the service life of the semiconductor heating plate under different powers is detected.

[0008] In a preferred solution, a heat dissipation port is opened on the device housing corresponding to the second chamber, and an observation window and a buzzer are also arranged on door one.

[0009] In a preferred solution, the lower end of the placement table is connected to a first electric telescopic rod, and guide rods one are inserted through both sides of the placement table. The placement table moves back and forth along the guide rods one for adjustment. A plurality of clamping components are arranged inside the placement table. The clamping component includes a chute, a slider is arranged in the chute, a sliding rod is inserted through the slider, an electric telescopic rod two is connected below the slider, and a clamping claw for clamping the semiconductor heating plate is installed at the upper end of the slider.

[0010] In a preferred solution, the telescopic length of the second electric telescopic rod corresponding to each clamping component is independently controlled through the control panel.

[0011] In a preferred solution, a liquid level sensor, a temperature sensor and a liquid inlet are respectively arranged at the top of the liquid storage tank. An electromagnetic valve one is installed on the liquid inlet, and a return pipe is connected to the liquid inlet.

[0012] In a preferred solution, an adjusting rod is connected to the upper end of the liquid storage tank, guide rods two are arranged on both sides of the adjusting rod, the lower ends of the guide rods two are connected to the liquid storage tank, and the upper ends of the guide rods two are inserted through the device housing.

[0013] In a preferred solution, one side of the cooling tank is connected to the water inlet of the pump body through a connecting pipe one, and the other end of the return pipe is connected to the water outlet of the pump body.

[0014] In a preferred solution, heat dissipation fins are arranged on the side edge of the cooling tank, and air forms convection in the second chamber through the heat dissipation port.

[0015] In a preferred embodiment, a connecting pipe 2 is further connected to the bottom of the cooling box, and a liquid injection port and a liquid discharge port are respectively provided at the far end of the connecting pipe 2, and a solenoid valve 2 and a solenoid valve 3 are respectively provided on the liquid injection port and the liquid discharge port.

[0016] The present invention also provides a semiconductor heating plate quality detection method, which is applied to the semiconductor heating plate quality detection device mentioned above, and comprises the following steps:

[0017] S1. Place the semiconductor heating plate to be tested on the placement mechanism and send it into the device housing through the placement mechanism so that the semiconductor heating plate is directly below the heating mechanism;

[0018] S2, manipulating the liquid storage tank in the heating mechanism to move downward and contact with the semiconductor heating plate, and injecting liquid into the liquid storage tank;

[0019] S3, using the control panel to control the current flowing into the semiconductor heating disk, so that the semiconductor heating disk is powered on at the required test power, and the life of normal operation at the power is detected;

[0020] S4. The heat generated by the semiconductor heating plate in normal operation heats the liquid in the heating mechanism. The liquid in the heating mechanism absorbs heat and evaporates, and enters the cooling mechanism through the evaporation pipe to be cooled, thereby maintaining the pressure in the heating mechanism.

[0021] The technical effects achieved by the present invention are:

[0022] The present invention cleverly places the semiconductor heating disk inside the device housing, and precisely controls the current intensity input to the semiconductor heating disk through the control panel, thereby achieving detailed detection of the product's service life under actual power under different current conditions. This design can not only effectively evaluate the quality of the product, but also comprehensively examine the actual service life of the product under various power states by adjusting the size of the output current, thereby scientifically revealing the inherent relationship between product life and power, providing solid data support for subsequent optimization;

[0023] Furthermore, the present invention innovatively constructs a circulation system that is complemented by a heating mechanism and a cooling mechanism. When the semiconductor heating disk is powered on for performance testing, the liquid in the heating mechanism is continuously heated; at the same time, the cooling mechanism is responsible for rapidly cooling the evaporated liquid and guiding it to flow back to the heating mechanism to continue participating in the heating process. This cycle is repeated, which not only ensures that the heating mechanism can withstand the high temperature from the semiconductor heating disk for a long time without the dry pot phenomenon, but also effectively avoids the problem of dry burning of the semiconductor heating disk caused by overheating, thereby significantly extending the overall service life of the equipment;

[0024] In addition, the present invention also specially sets up a set of efficient and convenient placement mechanisms, so that the semiconductor heating plate can be easily and accurately positioned at the specified position inside the device housing. With the help of multiple sets of carefully designed clamping components, it is not only ensured that the semiconductor heating plate is always in the center area of the placement mechanism, but also ensured that the position of the liquid storage tank in the heating mechanism is exactly corresponding to the bottom after installation. In this way, the two can form the most intimate contact state, greatly increase the heat conduction area, promote the maximization of heat transfer efficiency, and further improve the working efficiency and stability of the entire system. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0026] Figure 2 It is a half-section structure schematic diagram of the present invention;

[0027] Figure 3 It is a schematic diagram of the enlarged structure of the placement mechanism of the present invention when viewed from above;

[0028] Figure 4 It is a half-sectioned enlarged structural schematic diagram of the placement mechanism of the present invention;

[0029] Figure 5 It is a schematic diagram of the structure of the placement mechanism and the semiconductor heating plate of the present invention in a disassembled state;

[0030] Figure 6 It is an enlarged structural schematic diagram of the heating mechanism of the present invention;

[0031] Figure 7 It is a half-sectioned enlarged structural schematic diagram of a liquid storage tank in the heating mechanism of the present invention;

[0032] Figure 8 It is a front enlarged structural schematic diagram of the cooling mechanism of the present invention;

[0033] Figure 9 It is a schematic diagram of the enlarged structure of the back side of the cooling mechanism of the present invention;

[0034] Figure 10 It is a connection relationship diagram between the control panel of the present invention and various components.

[0035] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0036] 1. Device housing; 11. Partition; 12. Chamber 1; 13. Chamber 2; 14. Door 1; 15. Door 2; 16. Heat dissipation port; 17. Observation window;

[0037] 2. Placement mechanism; 21. Placement table; 22. First electric telescopic rod; 23. First guide rod; 24. Chute; 25. Slide block; 26. Slide rod; 27. Second electric telescopic rod; 28. Clamping jaw;

[0038] 3. Heating mechanism; 31. Liquid storage tank; 32. Liquid level sensor; 33. Temperature sensor; 34. Liquid inlet; 35. First solenoid valve; 36. Evaporation tube; 37. Return pipe; 38. Adjusting rod; 39. Second guide rod;

[0039] 4. Cooling mechanism; 41. Cooling box; 42. First connecting pipe; 43. Pump body; 44. Heat sink; 45. Second connecting pipe; 46. Liquid injection port; 47. Drain port; 48. Second solenoid valve; 49. Third solenoid valve;

[0040] 5. Semiconductor heating plate; 6. Control panel; 7. Buzzer. Detailed implementation manners

[0041] To make the above objects, features and advantages of the present invention more obvious and understandable, the following will describe the detailed implementation manners of the present invention with reference to the accompanying drawings of the specification.

[0042] In the following description, many specific details are set forth to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0043] Secondly, the so-called "one embodiment" or "embodiment" herein refers to a specific feature, structure or characteristic that can be included in at least one implementation manner of the present invention. The "in a preferred implementation manner" that appears in different places in this specification does not all refer to the same embodiment, nor is it a separate or selectively exclusive embodiment from other embodiments.

[0044] Furthermore, the present invention is described in detail with reference to the schematic diagrams. When describing the embodiments of the present invention in detail, for the convenience of explanation, the cross-sectional views showing the device structures will be enlarged locally out of the general proportion, and the schematic diagrams are only examples and should not limit the scope of protection of the present invention herein. In addition, in actual production, the three-dimensional spatial dimensions of length, width and depth should be included.

[0045] Please refer to Figure 1 and Figure 2As shown in the figure, the present invention provides a semiconductor heating plate quality detection device and a detection method, including: a device housing 1, which is divided into a first chamber 12 and a second chamber 13 by a partition 11 inside the device housing 1. A placement mechanism 2 for placing a semiconductor heating plate 5 is arranged in the first chamber 12. A heating mechanism 3 is arranged above the placement mechanism 2. A cooling mechanism 4 is arranged in the second chamber 13. Doors 14 and 15 are respectively arranged corresponding to the outer ends of the first chamber 12 and the second chamber 13. A control panel 6 is installed on the door 14. The placement mechanism 2 includes a placement table 21 movably arranged in the first chamber 12, and the semiconductor heating plate 5 is placed on the placement table 21. The heating mechanism 3 includes a liquid storage tank 31, and the cooling mechanism 4 includes a cooling tank 41. The liquid storage tank 31 and the cooling tank 41 are connected through an evaporation tube 36. The semiconductor heating plate 5 and the control panel 6 are electrically connected through a wire. By using the control panel 6 to control different currents output to the semiconductor heating plate 5, different powers are generated by the semiconductor heating plate 5, and the service life of the semiconductor heating plate 5 at different powers is detected.

[0046] In this embodiment, when detecting the quality of the semiconductor heating plate 5, first, the semiconductor heating plate 5 to be detected is placed on the placement mechanism 2 and sent into the device housing 1 through the placement mechanism 2, so that the semiconductor heating plate 5 is directly below the heating mechanism 3. Then, the liquid storage tank 31 in the heating mechanism 3 is moved down to contact the semiconductor heating plate 5, and liquid is injected into the liquid storage tank 31. Next, by using the control panel 6 to control the current flowing into the semiconductor heating plate 5, the semiconductor heating plate 5 is powered on and works at the required test power, and the service life of normal operation at this power is detected. The heat generated by the semiconductor heating plate 5 during normal operation heats the liquid in the heating mechanism 3. The liquid in the heating mechanism 3 absorbs heat and evaporates, and enters the cooling mechanism 4 through the evaporation tube 36 for cooling, so as to maintain the pressure in the heating mechanism 3.

[0047] In the present invention, the semiconductor heating plate 5 is placed in the device housing 1, and the magnitude of the current input to the semiconductor heating plate 5 is controlled by the control panel 6. Thus, the actual service life that can be normally used under the actual power generated at this current can be detected, so as to detect the quality of the product. Moreover, by changing the magnitude of the current output to the semiconductor heating plate 5, the actual service life that the product can use at different powers can be detected, which is convenient for measuring the relationship between the product life and the power.

[0048] In addition, when controlling the magnitude of the current input to the semiconductor heating plate 5 through the control panel 6, the magnitude of the input current can be a fixed value, which can be the maximum current or the minimum current that the semiconductor heating plate 5 can withstand, or a certain value within a range for detection. The magnitude of the input current can also be a variable value, and the magnitude of the current can change from large to small or from small to large, so as to make the test of the semiconductor heating plate 5 more comprehensive.

[0049] Among them, the control panel 6 includes an arithmetic unit for information processing, a timing unit for timing the normal operation of the semiconductor heating plate 5, which can judge the service life of the semiconductor heating plate 5, and a voltage control unit for stepping down or stepping up the mains power supply, which is convenient for converting the mains voltage into a voltage value that the semiconductor heating plate 5 can normally use, and other device units that meet the normal operation of the equipment, constituting a control device that can detect the semiconductor heating plate 5.

[0050] A heat dissipation port 16 is provided on the device housing 1 corresponding to the second chamber 13, and an observation window 17 and a buzzer 7 are further provided on the first door 14;

[0051] In this embodiment, through the observation window 17 on the first door 14, the working conditions of the devices inside the device housing 1 can be observed from the outside, and the buzzer 7 mainly plays an alarm role. When detecting the semiconductor heating plate 5, when the semiconductor heating plate 5 reaches its maximum service life, there may be faults such as open circuits inside it, and the buzzer 7 can emit an alarm sound to remind the staff to perform operations such as detection;

[0052] The device housing 1, the first door 14 and the second door 15 are used to form a closed space, so that the semiconductor heating plate 5 is detected in the closed space, which can ensure the safety of the test. In addition, the internal space of the device housing 1 is divided into a first chamber 12 and a second chamber 13 by the partition 11, so that the heating mechanism 3 and the cooling mechanism 4 are not interfered with each other during operation.

[0053] Please refer to Figure 3 and Figure 4 As shown, an electric telescopic rod 22 is connected to the lower end of the placement table 21. Guide rods 23 are inserted through both sides of the placement table 21. The placement table 21 moves back and forth along the guide rods 23 for adjustment. A plurality of clamping assemblies are arranged inside the placement table 21. The clamping assembly includes a chute 24. A slider 25 is arranged in the chute 24. A slide rod 26 is inserted through the slider 25. An electric telescopic rod 27 is connected to the lower side of the slider 25. A clamping claw 28 for clamping the semiconductor heating plate 5 is installed at the upper end of the slider 25;

[0054] In this embodiment, by controlling the extension or retraction of the first electric telescopic rod 22 through the control panel 6, the placement table 21 can be driven to extend or retract in the first chamber 12 of the device housing 1. When the first electric telescopic rod 22 extends, the placement table 21 can be driven to extend from the first chamber 12, facilitating the staff to pick up and place the semiconductor heating plate 5 on the placement table 21. Additionally, when the placement table 21 moves, it slides along the first guide rod 23 to ensure the stability of the movement of the placement table 21;

[0055] After the semiconductor heating plate 5 is placed on the placement table 21, it can be clamped and positioned by multiple groups of clamping components. When clamping the semiconductor heating plate 5, the second electric telescopic rod 27 drives the slider 25 to move along the slide rod 26 in the chute 24 towards the side close to the semiconductor heating plate 5, thereby driving the clamping claws 28 to clamp the semiconductor heating plate 5.

[0056] The extension and retraction lengths of the second electric telescopic rod 27 corresponding to each group of clamping components are individually controlled through the control panel 6;

[0057] In this embodiment, the extension and retraction lengths of the second electric telescopic rod 27 corresponding to each group of clamping components are individually controlled through the control panel 6 to ensure that the distance between the clamping claws 28 of each group of clamping components and the semiconductor heating plate 5 is flexible. According to the different sizes and shapes of the semiconductor heating plates 5, the positions of each clamping claw 28 can be different, and each can play a role in clamping the semiconductor heating plate 5. Moreover, according to the different shapes of each semiconductor heating plate 5, when the clamping claws 28 approach the semiconductor heating plate 5, they can play a role in pushing the semiconductor heating plate 5, so that when the clamping claws 28 move into place, the semiconductor heating plate 5 can also be in the central position, facilitating the maximum contact area between the semiconductor heating plate 5 and the liquid storage tank 31 after entering the first chamber 12;

[0058] The placement mechanism 2 can facilitate the placement of the semiconductor heating plate 5 into the device housing 1. And through the pushing of multiple groups of clamping components, the semiconductor heating plate 5 can be in the central position of the placement mechanism 2. When inside the device housing 1, the semiconductor heating plate 5 is directly below the heating mechanism 3, enabling the semiconductor heating plate 5 and the liquid storage tank 31 of the heating mechanism 3 to make full contact with each other, maximizing the heat conduction area between the two.

[0059] Please refer to Figure 6 and Figure 7As shown, the top of the liquid storage tank 31 is also provided with a liquid level sensor 32, a temperature sensor 33 and a liquid inlet 34, a solenoid valve 1 35 is installed on the liquid inlet 34, and a reflux pipe 37 is connected to the liquid inlet 34; the upper end of the liquid storage tank 31 is connected to an adjusting rod 38, and two guide rods 39 are provided on both sides of the adjusting rod 38, the lower end of the guide rod 39 is connected to the liquid storage tank 31, and the upper end of the guide rod 39 is connected to the device housing 1;

[0060] In this embodiment, after the semiconductor heating disk 5 is put into the device housing 1, the liquid storage tank 31 can be driven to move downward and contact the semiconductor heating disk 5 by extending the adjusting rod 38. When the semiconductor heating disk 5 is powered on, the heat generated will heat the liquid in the liquid storage tank 31, and the liquid in the liquid storage tank 31 will enter the cooling tank 41 along the evaporation pipe 36 for cooling after being heated and vaporized. When the liquid storage tank 31 is heated, the liquid level in the liquid storage tank 31 is constantly monitored by the liquid level sensor 32, so that the liquid level in the liquid storage tank 31 is maintained at a suitable scale, and the temperature in the liquid storage tank 31 can be detected by the temperature sensor 33 to avoid temperature abnormalities.

[0061] The up and down movement of the liquid storage tank 31 is driven by the control panel 6 controlling the extension and retraction of the adjusting rod 38. After the semiconductor heating disk 5 is sent into the device housing 1, the liquid storage tank 31 is driven to move down and contact with the semiconductor heating disk 5 by extending the adjusting rod 38. After the semiconductor heating disk 5 is detected and needs to be moved out of the device housing 1, the liquid storage tank 31 is first driven to move up and disengage from the semiconductor heating disk 5 by retracting the adjusting rod 38 to prevent the equipment from being scratched when the semiconductor heating disk 5 moves. In addition, when the liquid storage tank 31 moves up and down, it will drive the guide rod 2 39 to extend and retract up and down in the device housing 1, and the guide rod 2 39 is used to improve the stability of the liquid storage tank 31 when it moves up and down.

[0062] See also Figure 8 and Figure 9 As shown, one side of the cooling box 41 is connected to the water inlet of the pump body 43 by means of a connecting pipe 1 42, and the other end of the return pipe 37 is connected to the water outlet of the pump body 43. A heat sink 44 is provided on the side edge of the cooling box 41, and air forms convection in the chamber 2 13 through the heat dissipation port 16;

[0063] In this embodiment, the liquid in the liquid storage tank 31 is heated and evaporated, enters the cooling tank 41 through the evaporation pipe 36 for cooling. The liquid in the liquid storage tank 31 will gradually decrease. If no liquid is replenished into the liquid storage tank 31, the dry pot will occur in the liquid storage tank 31 after long-term liquid evaporation, affecting the normal operation of the equipment. Therefore, when the liquid level sensor 32 monitors that the liquid storage tank 31 reaches the lowest scale, it will send a signal to the control panel 6, start the pump body 43 to work through the control panel 6, and open the first electromagnetic valve 35, so that the pump body 43 is communicated with the liquid storage tank 31 through the liquid inlet 34. The liquid in the cooling tank 41 is pumped out through the connecting pipe 42 by the pump body 43 and injected into the liquid storage tank 31 through the return pipe 37 to achieve the purpose of replenishing the liquid in the liquid storage tank 31;

[0064] In the present invention, a heating mechanism 3 and a cooling mechanism 4 form a circulation system. When the semiconductor heating plate 5 is energized for detection, the liquid in the heating mechanism 3 can be continuously heated. Then, the cooling mechanism 4 cools the evaporated liquid and can return it to the heating mechanism 3 for circulating heating, so as to ensure that the heating mechanism 3 can be heated by the semiconductor heating plate 5 for a long time without dry pot phenomenon, avoiding dry burning of the semiconductor heating plate 5 and affecting its normal service life;

[0065] In addition, heat dissipation fins 44 are arranged on the outer side of the cooling tank 41 to increase the contact area with the air, thereby enhancing the heat dissipation effect of the cooling tank 41, so that the liquid entering the cooling tank 41 along the evaporation pipe 36 can be quickly and completely liquefied. The setting of the heat dissipation port 16 enables the outside air to form a convection with the air in the chamber two 13, and uses the flow of air to more quickly reduce the temperature of the cooling tank 41.

[0066] A connecting pipe two 45 is also connected to the lower part of the cooling tank 41. The distal ends of the connecting pipe two 45 are respectively provided with a liquid injection port 46 and a liquid discharge port 47. An electromagnetic valve two 48 and an electromagnetic valve three 49 are respectively arranged on the liquid injection port 46 and the liquid discharge port 47;

[0067] In this embodiment, the liquid injection port 46 and the liquid discharge port 47 provided on the connecting pipe two 45 can be used to replenish or discharge the liquid in the cooling tank 41, so as to ensure the normal state of the liquid flow in the heating mechanism 3 and the cooling mechanism 4. When it is necessary to open which port of the liquid injection port 46 and the liquid discharge port 47, it can be controlled to open or close through the control panel 6.

[0068] The working principle of the present invention is as follows: when conducting quality inspection on the semiconductor heating plate 5, first place the semiconductor heating plate 5 to be inspected on the placement mechanism 2 and send it into the device housing 1 through the placement mechanism 2, so that the semiconductor heating plate 5 is directly below the heating mechanism 3; then control the liquid storage tank 31 in the heating mechanism 3 to move downward and contact the semiconductor heating plate 5, and inject liquid into the liquid storage tank 31; then control the current flowing into the semiconductor heating plate 5 by using the control panel 6 to make the semiconductor heating plate 5 work under the power required for testing, and detect the service life of normal operation at this power; the heat generated during the normal operation of the semiconductor heating plate 5 heats the liquid in the heating mechanism 3, and the liquid in the heating mechanism 3 absorbs heat and evaporates, and enters the cooling mechanism 4 through the evaporation pipe 36 for cooling, so as to maintain the pressure in the heating mechanism 3.

[0069] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art of this technology, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention. The structures, devices and operation methods not specifically described and explained in the present invention, unless otherwise specified and limited, are implemented according to the conventional means in the art.

Claims

1. A semiconductor heating plate quality inspection device, characterized in that: Comprising: A device housing (1), within which a partition (11) divides it into a first chamber (12) and a second chamber (13). Inside the first chamber (12), there is a placement mechanism (2) for placing a semiconductor heating plate (5). Above the placement mechanism (2), there is a heat-receiving mechanism (3). Inside the second chamber (13), there is a cooling mechanism (4); On the outer sides of the first chamber (12) and the second chamber (13), there are respectively a first door (14) and a second door (15) provided. On the first door (14), a control panel (6) is installed; The placement mechanism (2) includes a placement table (21) movably arranged inside the first chamber (12), and the semiconductor heating plate (5) is placed on the placement table (21); The heat-receiving mechanism (3) includes a liquid storage tank (31), and the cooling mechanism (4) includes a cooling tank (41). The liquid storage tank (31) and the cooling tank (41) are connected through an evaporation pipe (36) and a return pipe (37); The semiconductor heating plate (5) and the control panel (6) are electrically connected through wires; The control panel (6) is used to control the output of different currents to the semiconductor heating plate (5), so that the semiconductor heating plate (5) generates different powers, and the service life of the semiconductor heating plate (5) under different powers is detected.

2. The quality inspection device for a semiconductor heating plate according to claim 1, wherein: On the device housing (1), corresponding to the second chamber (13), there is a heat dissipation opening (16). On the first door (14), there are also an observation window (17) and a buzzer (7) provided.

3. A semiconductor heating plate quality detection device according to claim 1, characterized in that: The lower end of the placement table (21) is connected to a first electric telescopic rod (22). On both sides of the placement table (21), there are first guide rods (23) passing through. The placement table (21) moves forward and backward along the first guide rods (23) for adjustment. Inside the placement table (21), there are multiple groups of clamping components. The clamping component includes a chute (24), inside which there is a slider (25). Inside the slider (25), there is a slide rod (26) passing through. The lower part of the slider (25) is connected to a second electric telescopic rod (27). The upper end of the slider (25) is equipped with a clamping claw (28) for clamping the semiconductor heating plate (5).

4. The semiconductor heating plate quality detection device according to claim 3, wherein: The telescopic lengths of the second electric telescopic rods (27) corresponding to each group of clamping components are individually controlled through the control panel (6).

5. A semiconductor heating plate quality detection device according to claim 1, characterized in that: At the top of the liquid storage tank (31), there are respectively a liquid level sensor (32), a temperature sensor (33), and a liquid inlet (34). On the liquid inlet (34), there is a first solenoid valve (35) installed, and the liquid inlet (34) is connected to the return pipe (37).

6. A semiconductor heating plate quality detection device according to claim 1, characterized in that: The upper end of the liquid storage tank (31) is connected to an adjusting rod (38). On both sides of the adjusting rod (38), there are second guide rods (39). The lower ends of the second guide rods (39) are connected to the liquid storage tank (31), and the upper ends of the second guide rods (39) pass through the device housing (1).

7. A semiconductor heating plate quality inspection device according to claim 5, characterized in that: One side of the cooling box (41) is connected to the water inlet of the pump body (43) by a first connecting pipe (42), and the other end of the return pipe (37) is connected to the water outlet of the pump body (43).

8. A semiconductor heating plate quality detection device according to claim 2, characterized in that: Heat sinks (44) are arranged on the side edges of the cooling box (41), and air forms convection in the second chamber (13) through the heat dissipation openings (16).

9. A semiconductor heating plate quality inspection device according to claim 1, characterized in that: A second connecting pipe (45) is further connected below the cooling box (41). Liquid injection ports (46) and liquid discharge ports (47) are respectively arranged at the distal ends of the second connecting pipe (45). Electromagnetic valves II (48) and electromagnetic valves III (49) are respectively arranged on the liquid injection ports (46) and the liquid discharge ports (47).

10. A method for detecting the quality of a semiconductor heating plate, which is applied to the semiconductor heating plate quality detection device according to any one of claims 1 to 9, and is characterized in that: S1. Place the semiconductor heating plate (5) to be detected on the placement mechanism (2), and send it into the device housing (1) through the placement mechanism (2) so that the semiconductor heating plate (5) is directly below the heating mechanism (3). S2. Control the liquid storage tank (31) in the heating mechanism (3) to move downward and contact the semiconductor heating plate (5), and inject liquid into the liquid storage tank (31). S3. Use the control panel (6) to control the current flowing into the semiconductor heating plate (5) so that the semiconductor heating plate (5) conducts electricity and works at the required test power, and detect the service life of normal operation at this power. S4. The heat generated during the normal operation of the semiconductor heating plate (5) heats the liquid in the heating mechanism (3). The liquid in the heating mechanism (3) absorbs heat and evaporates, enters the cooling mechanism (4) through the evaporation pipe (36) for cooling, so as to maintain the pressure in the heating mechanism (3).

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