Test signal transmission device and test method of digital-analog hybrid microsystem

Abstract

The invention provides a test signal transmission device and a test method for a digital-analog hybrid microsystem, and the device comprises a test board which is used for carrying out the power supply and testing of the digital-analog hybrid microsystem; the test board is provided with a via hole matched with a solder ball for transmitting a high-frequency signal of the digital-analog hybrid microsystem; the connecting assembly comprises a conductive film, a plurality of radio frequency probes and a plurality of radio frequency interfaces; wherein the conductive film is attached to the surface, facing the digital-analog hybrid microsystem, of the test board; conductive pins matched with solder balls on the digital-analog hybrid microsystem in position are distributed on the conductive film and used for being connected with the corresponding solder balls in a matched mode, and the arrangement positions of the conductive pins on the conductive film are matched with the positions of the corresponding solder balls on the digital-analog hybrid microsystem; each radio frequency probe is inserted into the corresponding via hole and is connected with the conductive film; the radio frequency interfaces are distributed around the test board and are connected with the conductive film. The device provided by the invention can meet the test requirements of each device in the digital-analog hybrid microsystem, and is beneficial to improving the test efficiency.

Description

Technical Field

[0001] The present application belongs to the technical field of integrated circuit testing, and in particular, relates to a test signal transmission device and a test method for a digital-analog hybrid microsystem. Background Art

[0002] The digital-analog hybrid microsystem integrates multiple functional chips into a small package, thereby improving system performance, achieving miniaturization, high integration and low power consumption of the product. It is widely used in consumer electronics, communications, biomedicine, computers and other fields.

[0003] In the prior art, a single fixture with a probe is usually used to implement chip-level testing to confirm whether there are potential problems with the chip and ensure the quality of the chip before it leaves the factory. However, as the performance requirements for functions such as signal acquisition, signal processing, and data interaction of highly integrated digital-analog hybrid microsystems become increasingly complex and diverse, the number of chips, package integration, and number of pins in the digital-analog hybrid microsystem have increased significantly. The number of devices contained in the digital-analog hybrid microsystem is large, the types of signals involved are diverse, and the overall size is small. The test signal transmission device using a single fixture with a probe cannot meet the test requirements of all devices in the digital-analog hybrid microsystem. Using corresponding test signal transmission schemes for each device in the digital-analog hybrid microsystem will result in low test efficiency for the digital-analog hybrid microsystem.

[0004] Based on this, how to provide a test signal transmission device that can meet the test requirements of all devices in a digital-analog hybrid microsystem and has high test efficiency is an important issue that urgently needs to be solved. Summary of the invention

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present application is to provide a test signal transmission device for a digital-analog hybrid microsystem, which is used to solve the problems that the existing test signal transmission device cannot meet the testing requirements of high integration, high reliability and miniaturization of the digital-analog hybrid microsystem.

[0006] To achieve the above-mentioned and other related purposes, the present invention provides a test signal transmission device for a digital-analog hybrid microsystem, comprising: A test board is used to power and test the digital-analog hybrid microsystem; the test board is provided with a plurality of vias; the positions of the vias respectively match the positions of solder balls for transmitting high-frequency signals of the digital-analog hybrid microsystem; A connection component, comprising: a conductive film, a plurality of radio frequency probes and a plurality of radio frequency interfaces; wherein the conductive film is fitted on the surface of the test board facing the digital-analog hybrid microsystem; a plurality of conductive pins are distributed on the outer surface of the conductive film for matching the corresponding solder balls, and the layout position of each conductive pin on the conductive film matches the position of the corresponding solder ball on the digital-analog hybrid microsystem; one end of each radio frequency probe is respectively inserted into the corresponding via hole and connected to the conductive film, and the other end of each radio frequency probe is used to input or output a high-frequency test signal; each radio frequency interface is distributed around the test board, and one end is connected to the conductive film, and the other end is used to input or output a test signal.

[0007] In one embodiment of the present invention, the surface of the test board facing the digital-analog hybrid microsystem is coated with a first conductive layer for grounding the test board; the inner wall of the via is coated with a second conductive layer, the second conductive layer is connected to the first conductive layer, and the radio frequency probe is connected to the second conductive layer so that the grounding of the radio frequency probe is consistent with that of the test board.

[0008] In one embodiment of the present invention, the device further comprises: The pressing mechanism is used to press the digital-analog hybrid microsystem located on the conductive film so that each solder ball of the digital-analog hybrid microsystem is connected to the corresponding conductive pin on the conductive film.

[0009] In one embodiment of the present invention, the clamping mechanism comprises: a mounting cavity, a positioning clamping plate and a clamping member; wherein, The installation cavity is used to install and fix the test board; the radio frequency interface is arranged on the cavity wall of the installation cavity, and one end of the radio frequency interface passes through the cavity wall to connect to the conductive film on the test board; The positioning card board is located on the side of the test board facing the digital-analog hybrid microsystem; the positioning card board has a card board body and a positioning card slot; the card board body has a hollow positioning card slot body for clamping the positioning card slot; the length and width of the positioning card slot respectively match the length and width of the connection area of ​​the conductive film; the positioning card board is located above the test board, and the position of the positioning card slot matches the position of the connection area of ​​the conductive film; the connection area of ​​the conductive film is the area where the conductive film is connected to the digital-analog hybrid microsystem; The pressing member is used to press the digital-analog hybrid microsystem and the conductive film together, so that each solder ball of the digital-analog hybrid microsystem is connected to each conductive pin of the conductive film respectively.

[0010] In one embodiment of the present invention, a support portion is provided on the bottom plate of the installation cavity: the height of the support portion matches the height of the RF interface on the cavity wall.

[0011] In one embodiment of the present invention, the pressing member comprises: a pressing plate body, a movable pressing block and an adjusting component; wherein, The length and width of the pressing plate body are not less than the length and width of the digital-analog hybrid microsystem, respectively; the number of the movable pressing blocks is the same as the number of chips on the pressing surface of the digital-analog hybrid microsystem; the pressing plate body is provided with a plurality of placement grooves with one end closed and the other end open for placing the corresponding movable pressing blocks; the adjusting component is used to connect the movable pressing block with the pressing plate body and adjust the distance between the movable pressing block and the pressing plate body; Among them, the positions of each movable pressing block in the pressure plate body respectively match the positions of each chip on the pressing surface of the digital-analog hybrid microsystem; the pressing surface of the digital-analog hybrid microsystem is the surface of the digital-analog hybrid microsystem in contact with the clamping member.

[0012] In one embodiment of the present invention, the pressing member further includes: a shell; and the shell is elastically connected to the pressing plate body.

[0013] In one embodiment of the present invention, the first end of the shell is hinged to the positioning slot, and the second end of the shell is movably connected to the positioning slot; the first end of the shell and the second end of the shell are opposite ends of the shell.

[0014] In one embodiment of the present invention, an analog-to-digital converter is provided on the test board, and the clamping mechanism also includes: a temperature sensor; the temperature sensor is connected to the signal input end of the analog-to-digital converter, and the signal output end of the analog-to-digital converter is connected to the digital-analog hybrid microsystem; the temperature sensor is embedded in the clamping member, and is used to sense the temperature of the clamping member, and send the sensed temperature information to the analog-to-digital converter, so that the analog-to-digital converter converts the temperature information into digital temperature information, and sends the digital temperature information to the digital-analog hybrid microsystem.

[0015] Correspondingly, the present invention provides a test method for a digital-analog hybrid microsystem, using the test signal transmission device for the digital-analog hybrid microsystem as described above to test the digital-analog hybrid microsystem; wherein the test signal transmission device is connected to a test device and a host computer respectively, and the method comprises: Placing the digital-analog hybrid microsystem in the connection area of ​​the conductive film so that each solder ball of the digital-analog hybrid microsystem is connected to the corresponding conductive pin on the conductive film; The test equipment powers on the digital-analog hybrid microsystem through the test signal transmission device; the host computer controls the digital-analog hybrid microsystem to configure the device through the test signal transmission device to form a corresponding signal transceiver link; and the test equipment generates a test signal, and transmits the test signal to the digital-analog hybrid microsystem through the test signal transmission device; wherein the high-frequency test signal is transmitted through the conductive film, the radio frequency probe and the radio frequency interface; the non-high-frequency test signal is transmitted through the test board, the conductive film and the radio frequency interface; After receiving the test signal, the digital-analog hybrid microsystem utilizes the signal transceiver link inside the digital-analog hybrid microsystem SIP to transmit the test signal back to the test equipment through the test signal transmission device.

[0016] As described above, the test signal transmission device for a digital-analog hybrid microsystem provided by the present application has at least the following beneficial effects: The test board is provided with vias matching the solder balls for transmitting high-frequency signals of the digital-analog hybrid microsystem, and a connection component is provided to connect the test board, including a conductive film being attached to the test board, a radio frequency probe being inserted into each of the vias of the test board, and a radio frequency interface being provided with one end connected to the conductive film and the other end being used for inputting and outputting radio frequency signals, so as to form a radio frequency channel between the digital-analog hybrid microsystem and the external test equipment. The non-high-frequency test signal is transmitted to the digital-analog hybrid microsystem through the radio frequency interface, the test board and the conductive film, and the high-frequency test signal is transmitted to the digital-analog hybrid microsystem through the radio frequency probe and the conductive film, so as to realize independent transmission of high-frequency signals and non-high-frequency signals, improve signal isolation, and avoid the situation that when all signals are transmitted to the digital-analog hybrid microsystem through the test board, the performance requirements of the test board are high due to the large signal frequency span, which increases the design and material cost of the test board. The digital-analog hybrid microsystem can be connected to each test equipment through the test signal transmission device, which is convenient for various tests and helps to improve the test efficiency of the digital-analog hybrid microsystem. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Shown is a top view of a mixed digital-analog microsystem.

[0018] Figure 2 Shown is a side view of the digital-analog hybrid microsystem.

[0019] Figure 3 A bottom view of the digital-analog hybrid microsystem is shown.

[0020] Figure 4 A schematic diagram of the structure of a test signal transmission device of a digital-analog hybrid microsystem provided by the present application in one embodiment is shown.

[0021] Figure 5 A schematic structural diagram of a test board provided by the present application in one embodiment is shown.

[0022] Figure 6 A schematic structural diagram of another embodiment of a test signal transmission device for a digital-analog hybrid microsystem provided by the present application is shown.

[0023] Figure 7 A schematic structural diagram of a clamping mechanism provided in the present application in one embodiment is shown.

[0024] Figure 8 A schematic structural diagram of a clamping member provided in the present application in one embodiment is shown.

[0025] Fig. 9 A schematic structural diagram of a pressing member provided in the present application in another embodiment is shown.

[0026] Fig.10 A schematic structural diagram of a clamping mechanism provided in the present application in another embodiment is shown.

[0027] Fig.11 The figure shows a first test result diagram obtained by performing a first test on the digital-analog hybrid microsystem based on the test signal transmission device of the digital-analog hybrid microsystem.

[0028] Fig.12 The figure shows a second test result obtained by performing a second test on the digital-analog hybrid microsystem based on the test signal transmission device of the digital-analog hybrid microsystem.

[0029] Fig.13 A flow chart of a method for testing a digital-analog hybrid microsystem provided by the present application in one embodiment is shown.

[0030] Description of Reference Numerals S1~S3, steps; 1, test board; 11, via; 12, first conductive layer; 13, second conductive layer; 2, connecting component; 21, conductive film; 211, conductive pin; 22, RF probe; 23, RF interface; 3, clamping mechanism; 31, installation cavity; 311, support part; 32, positioning card board; 321, card board body; 322, positioning card slot; 33, clamping piece; 331, pressure plate body; 332, movable pressure block; 333, adjustment component; 34, temperature sensor; SIP, digital-analog hybrid microsystem; SoC1, main processing system-on-chip; SoC2, co-processing system-on-chip; FPGA, field programmable logic gate array device; RFC1~ RFC2, RF direct acquisition chip; TR_1~ TR_4, reconfigurable RF transceiver micromodule; FANOUT_1~FANOUT_2, lead fan-out micromodule; Bas, substrate; Bal, solder ball. DETAILED DESCRIPTION

[0031] The following describes the embodiments of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. The present application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0032] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application, and thus the drawings only show components related to the present application rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed at will, and the component layout may also be more complicated.

[0033] To facilitate the understanding of the technical solutions provided by the present application, the relevant terms in the present application are explained before the specific embodiments, as follows: RF Elastomeric Contact Film: A flexible material used in RF applications that provides physical flexibility while maintaining electrical performance.

[0034] FPGA: Field Programmable Gate Array device, using a gate array-based structure, each chip consists of two-dimensional logic blocks, and each logic block is connected by horizontal and vertical wiring channels.

[0035] The embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the features of the following embodiments and implementations can be combined with each other.

[0036] To facilitate understanding of the technical solution of the present application, the structure of the existing digital-analog hybrid microsystem is described below; please refer to Figure 1 , Figure 2 and Figure 3 , respectively showing a top view, a side view and a bottom view of the digital-analog hybrid microsystem in one embodiment; Figure 1 and Figure 2 As shown, the digital-analog hybrid microsystem includes: a multi-channel configurable radio frequency subsystem and a multi-functional reconfigurable processing subsystem; wherein, the multi-channel configurable radio frequency subsystem includes: a reconfigurable radio frequency transceiver micromodule (TR_1, TR_2, TR_3 and TR_4), two radio frequency direct acquisition chips (RFC1 and RFC2); the multi-functional reconfigurable processing subsystem includes: a main processing system-on-chip SoC1, a co-processing system-on-chip SoC2 and a field programmable logic gate array device FPGA (hereinafter referred to as "FPGA"); based on The board Bas is the boundary, and the digital-analog hybrid microsystem is divided into an upper structure and a lower structure; the upper structure includes: 1 main processing system-on-chip SoC1, 1 co-processing system-on-chip SoC2, 1 FPGA and 2 RF direct acquisition chips (RFC1 and RFC2); the lower structure includes 4 reconfigurable RF transceiver micromodules (TR_1, TR_2, TR_3 and TR_4) and 2 lead fan-out micromodules (FANOUT_1 and FANOUT_2) to fan out the pins of each chip in the upper structure; Figure 2 and Figure 3 As shown, the digital-analog hybrid microsystem adopts ball grid array packaging to realize interface extraction, the ball diameter is 200μm, the height and diameter of each solder ball are consistent, so as to ensure the flatness of the digital-analog hybrid microsystem; wherein, the multi-channel configurable RF subsystem includes: 4-receive 4-transmit reconfigurable RF transceiver channels and 4-way RF direct acquisition transceiver channels, which are respectively realized by 4 reconfigurable RF transceiver micromodules and 2 RF direct acquisition chips; the multi-functional reconfigurable processing subsystem is composed of three chips: the main processing system on chip SoC1, the co-processing system on chip SoC and the FPGA.

[0037] In the digital-analog hybrid microsystem, the multi-channel configurable RF subsystem and the multi-functional reconfigurable processing subsystem are interconnected through the FPGA; the sampling signals of ADC / DAC are transmitted through the JESD-204B interface, and the FPGA forms a configuration bus through interfaces such as SPI / GPIO to configure the multi-channel configurable RF subsystem; inside the multi-functional reconfigurable processing subsystem, the ADC / DAC sampling signals of communication and reconnaissance are processed inside the FPGA and then sent to the main processing system-on-chip SoC1 and the co-processing system-on-chip SoC through internal interface signals; the ADC signal of navigation is forwarded to the navigation baseband of the co-processing system-on-chip SoC through the FPGA for processing, and then positioning and speed are performed. Solution; The outside of the digital-analog hybrid microsystem includes an antenna, an external local oscillator, a sampling reference clock and an external reference clock interface; wherein the external local oscillator, the sampling reference clock and the external reference clock interface respectively provide the local oscillator signal for RF up and down conversion, the sampling reference clock signal and the working reference clock signal for the reconfigurable RF transceiver micromodule TR, the first RF direct acquisition chip RFC1, the second RF direct acquisition chip RFC2, the main processing system on chip SoC1 and the co-processing system on chip SoC2; the main processing system on chip SoC1 and the co-processing system on chip SoC lead out several SPI, GPIO, UART and other interfaces, as well as the JTAG interface signal of the internal processor; the main processing system on chip SoC1 leads out a DDR interface for running the operating system; It can be seen from the above that the digital-analog hybrid microsystem integrates functions such as RF transceiver, signal acquisition, digital-analog conversion, high-speed communication, signal processing and communication solution, involving many test items, and each test item has different requirements for signal quality, and the overall size of the digital-analog hybrid microsystem is small, generally less than or equal to 30mm×30mm×4mm; therefore, in order to test the performance of each device in the digital-analog hybrid microsystem, a test signal transmission device suitable for a small-sized digital-analog hybrid microsystem is needed, and can output a test signal whose signal quality meets the corresponding test requirements according to the test requirements corresponding to each test item.

[0038] In order to solve the technical problems existing in the above-mentioned prior art, the following embodiments of the present application provide a test signal transmission device for a digital-analog hybrid microsystem SIP, which is provided by opening vias on the test board that match the solder balls for transmitting high-frequency signals of the digital-analog hybrid microsystem, and setting a connecting component to connect the test board, including setting a conductive film on the test board, inserting a radio frequency probe in each of the vias on the test board, and setting a radio frequency interface with one end connected to the conductive film and the other end for inputting and outputting radio frequency signals, so as to form a radio frequency channel between the digital-analog hybrid microsystem and the external test equipment, and a non-high-frequency test signal passes through the radio frequency interface and the test equipment. The test board and the conductive film are transmitted to the digital-analog hybrid microsystem, and the high-frequency test signal is transmitted to the digital-analog hybrid microsystem through the radio frequency probe and the conductive film, thereby realizing independent transmission of high-frequency signals and non-high-frequency signals, improving signal isolation, and avoiding the situation where all signals are transmitted to the digital-analog hybrid microsystem through the test board, which increases the design and material costs of the test board due to the large signal frequency span and high performance requirements of the test board. The digital-analog hybrid microsystem can be connected to various test equipment through the test signal transmission device, which is convenient for performing various tests and helps to improve the test efficiency of the digital-analog hybrid microsystem.

[0039] See also Figure 4 , showing a structural schematic diagram of a test signal transmission device of a digital-analog hybrid microsystem provided by the present invention in one embodiment.

[0040] like Figure 4 As shown, in this embodiment, the test signal transmission device of the digital-analog hybrid microsystem provided by the present invention includes: The test board 1 is used to power and test the digital-analog hybrid microsystem SIP; the test board 1 is provided with a plurality of vias 11; the positions of the vias 11 respectively match the positions of the solder balls Bal for transmitting high-frequency signals of the digital-analog hybrid microsystem SIP; The connection component 2 comprises: a conductive film 21, a plurality of radio frequency probes 22 and a plurality of radio frequency interfaces (not shown); wherein the conductive film 21 is fitted on the surface of the test board 1 facing the digital-analog hybrid microsystem SIP, and is used to connect the test board 1 with the digital-analog hybrid microsystem SIP, so as to supply power and transmit signals to the digital-analog hybrid microsystem SIP; a plurality of conductive pins 211 are distributed on the outer surface of the conductive film 21, and are used to match the corresponding solder ball bal, and the layout position of each conductive pin 211 on the conductive film matches the position of the corresponding solder ball Bal on the digital-analog hybrid microsystem SIP; one end of each radio frequency probe 22 is respectively inserted into the corresponding via 11 and connected to the conductive film 21, and the other end of each radio frequency probe 22 is used to input or output high-frequency signals; each radio frequency interface is distributed around the test board 1, and one end is connected to the conductive film 21, and the other end is used to input or output signals; The clamping mechanism 3 is arranged on the surface of the digital-analog hybrid microsystem SIP away from the conductive film 21, and is used to press the digital-analog hybrid microsystem SIP located on the conductive film 21 after each solder ball Bal of the digital-analog hybrid microsystem SIP is aligned with the corresponding conductive pin 211 on the conductive film 21, so that each solder ball Bal of the digital-analog hybrid microsystem SIP is respectively connected to the corresponding conductive pin 211 on the conductive film 21.

[0041] Specifically, the test board 1 is connected to an external power supply, and the RF probe 22 and the RF interface are respectively connected to a test device; the digital-analog hybrid microsystem SIP is placed in the connection area of ​​the conductive film 21, so that each solder ball Bal of the digital-analog hybrid microsystem SIP is respectively connected to the corresponding conductive pin 211 on the conductive film 21; after the digital-analog hybrid microsystem SIP is connected to the conductive film 21, the external power supply is turned on, the digital-analog hybrid microsystem SIP is powered on through the test board 1, and the test device is controlled to output a test signal, wherein the high-frequency test signal is transmitted through the RF probe 22 is input into the conductive film 21, so that the digital-analog hybrid microsystem SIP receives the high-frequency test signal; the non-high-frequency test signal is input into the test board 1 through the radio frequency interface, and is transmitted to the digital-analog hybrid microsystem through the conductive film 21, so that the digital-analog hybrid microsystem SIP receives the non-high-frequency test signal; after receiving the test signal, the digital-analog hybrid microsystem SIP transmits the test signal back to the conductive film 21, and outputs the test signal through the radio frequency interface 23; the connection area of ​​the conductive film 21 is the area where the conductive film 21 is connected to the digital-analog hybrid microsystem SIP.

[0042] Optionally, the frequency of the high-frequency signal is greater than or equal to 10 GHz; the high-frequency signal includes: the high-frequency test signal.

[0043] Exemplarily, the high-frequency signal includes: a radio frequency local oscillator signal and / or a high-frequency radio frequency signal.

[0044] Optionally, the frequency of the non-high-frequency signal is less than 10 GHz; the non-high-frequency signal includes: the non-high-frequency test signal.

[0045] Exemplarily, the non-high-frequency signal includes: a low-frequency radio frequency signal and a control signal.

[0046] Optionally, the test board 1 includes: a PCB board.

[0047] Optionally, the test board 1 includes: a power supply module, a communication module, a test module and a storage module; wherein, The power supply module includes: a power interface and a voltage conversion unit; the power interface is used to connect the external power supply; the input end of the voltage conversion unit is connected to the power interface, and the output ends of the voltage conversion unit are respectively connected to the components of the digital-analog hybrid microsystem SIP, so as to convert the voltage of the external power supply and output the corresponding conversion voltage to the components of the digital-analog hybrid microsystem SIP; The communication module includes: an Internet port, a USB interface and / or an FMC connector; the Internet port is used to transmit digital signal data; the USB interface is used to transmit communication signals; the FMC connector connects the remaining pins of the main processing system on chip SoC1 and the FPGA, and is used to transmit spare data; the remaining pins are pins that are not used in the current test.

[0048] The test module includes: a debugging interface, a current detection chip, a clock chip and / or a balanced-unbalanced converter; the debugging interface is used to connect to a host computer so that the host computer can perform online debugging and / or program loading on the chip in the digital-analog hybrid microsystem SIP; the current detection chip is connected to the current path between the DC / DC unit and each device of the digital-analog hybrid microsystem SIP, and is used to obtain current data of each device in the digital-analog hybrid microsystem SIP; the clock chip is used to generate, maintain and distribute clock signals, provide stable clock signals for each device in the digital-analog hybrid microsystem SIP, and ensure the clock synchronization of each linked device in the digital-analog hybrid microsystem SIP; the balanced-unbalanced converter is used to achieve impedance matching of radio frequency signals and reduce common mode noise.

[0049] The storage module includes: a FLASH chip and a DDR chip; the FLASH chip is used to store configuration files of the FPGA, the main processing system on chip SoC1 and the co-processing system on chip SoC2 in the digital-analog hybrid microsystem SIP, so that when the FPGA, the main processing system on chip SoC1 and the co-processing system on chip SoC2 are powered on again after power failure, they can automatically load the corresponding configuration files and execute the program without downloading the configuration files through the external interface again; the DDR chip is used to store digital signals.

[0050] Exemplarily, the power interface includes: a female socket that matches a 4mm banana plug.

[0051] Exemplarily, the voltage conversion unit includes: a switching power supply chip.

[0052] Exemplarily, the debugging interface includes: a JTAG debugging interface.

[0053] Exemplarily, the current detection chip is an INA226 chip; and the clock chip is an HMC7043 chip.

[0054] Exemplarily, the FLASH chip includes: a W25Q128 chip, a W25Q256 chip or a MT25QL256 chip; the DDR chip is a MT41J512M4 chip.

[0055] Exemplarily, the test board 1 is provided with 16 vias 11 corresponding to the reconfigurable RF transceiver micromodule.

[0056] Optional, such as Figure 5 As shown, the surface of the test board 1 facing the digital-analog hybrid microsystem SIP is plated with a first conductive layer 12 for grounding the test board 1; the inner wall of the via 11 is plated with a second conductive layer 13, the second conductive layer 13 is connected to the first conductive layer 12, and the RF probe 22 is connected to the second conductive layer 13 so that the grounding of the RF probe 22 is consistent with that of the test board 1; wherein the end of the RF probe 22 inserted into the via contacts the conductive film 21.

[0057] It should be noted that, considering that in the measurement of high-frequency signals, the signal return path is crucial to maintaining signal quality, when the grounding of the RF probe is inconsistent with that of the test board, it is easy to cause a poor grounding loop, thereby causing noise, signal distortion or unstable measurement results. Therefore, the present application plates a conductive layer on the inner wall of the via hole of the test board, and connects the RF probe to the conductive layer of the via hole of the test board to keep the grounding of the RF probe consistent with that of the test board.

[0058] Exemplarily, the material of the first conductive layer 12 and / or the second conductive layer 13 includes: conductive metals such as copper and / or iron.

[0059] Optionally, conductive glue and / or a connector are used to connect the RF probe 22 and the first conductive layer 12 to form a good current loop between the test board 1 and the RF probe 22 to avoid local voltage differences and thereby reduce electromagnetic interference.

[0060] Optionally, the impedance of the RF probe 22 is the same as the impedance of the transmission cable of the RF signal, so as to improve the transmission power of the RF signal, reduce the reflection loss caused by the signal transmission in the digital-analog hybrid microsystem SIP, and reduce the signal distortion during the signal transmission process.

[0061] Exemplarily, the impedance of the radio frequency probe 22 is 50Ω.

[0062] Optionally, the conductive film 21 includes: a radio frequency elastic contact film.

[0063] Optionally, the radio frequency interface includes: a radio frequency coaxial connector.

[0064] Exemplarily, the radio frequency interface includes: an SMA connector.

[0065] Optional, such as Figure 6 As shown, the test signal transmission device also includes: a clamping mechanism 3; the clamping mechanism 3 is arranged on the surface of the digital-analog hybrid microsystem SIP away from the conductive film 21, and is used to press the digital-analog hybrid microsystem SIP located on the conductive film 21 after each solder ball Bal of the digital-analog hybrid microsystem SIP is aligned with the corresponding conductive pin 211 on the conductive film 21, so that each solder ball Bal of the digital-analog hybrid microsystem SIP is respectively connected to the corresponding conductive pin 211 on the conductive film 21.

[0066] In this embodiment, a clamping mechanism is provided in the test signal transmission device to press the digital-analog hybrid microsystem, thereby achieving rapid connection between the solder balls of the digital-analog hybrid microsystem and the conductive pins on the conductive film. This not only ensures the connection stability between the digital-analog hybrid microsystem and the conductive film, but also improves the connection convenience between the test signal transmission device and the digital-analog hybrid microsystem, thereby helping to improve the testing efficiency of the digital-analog hybrid microsystem.

[0067] Optional, such as Figure 7 As shown, the clamping mechanism 3 includes: a mounting cavity 31, a positioning clamping plate 32 and a clamping member 33; wherein, The installation cavity 31 is used to install and fix the test board 1; after installation, the test board 1 is fitted with a side of the conductive film 21 facing the digital-analog hybrid microsystem SIP; the radio frequency interface 23 is arranged on the cavity wall of the installation cavity 31, and one end of the radio frequency interface 23 passes through the cavity wall to connect to the conductive film on the test board 1.

[0068] The positioning card board 32 is located on the side of the test board 1 facing the digital-analog hybrid microsystem SIP; the positioning card board 32 has a card board body 321 and a positioning card slot 322; the card board body 321 has a hollow positioning slot body for clamping the positioning card slot 322 and fixing the positioning card slot 322 on the card board body 321; the length and width of the positioning card slot 322 respectively match the length and width of the connection area of ​​the conductive film 21; the positioning card board 32 is located above the test board 1, and the position of the positioning card slot 322 matches the position of the connection area of ​​the conductive film 21, so that the digital-analog hybrid microsystem SIP can be quickly positioned to the connection area of ​​the conductive film 21 by placing the digital-analog hybrid microsystem SIP in the positioning card slot 322; The length and width of the clamping member 33 are not less than the length and width of the digital-analog hybrid microsystem SIP, respectively, and are used to press the digital-analog hybrid microsystem SIP and the conductive film 21 so that each solder ball Bal of the digital-analog hybrid microsystem SIP is connected to each conductive pin 211 of the conductive film 21, respectively.

[0069] Optionally, the bottom plate of the mounting cavity 31 has a supporting portion 311 for supporting the test board 1; the height of the supporting portion 311 matches the height of the RF interface 23 on the cavity wall, so that the connection short of the RF interface 23 is located at the same or similar horizontal height as the conductive film 21, so as to facilitate the connection between the RF interface 23 and the conductive film 21.

[0070] Optionally, the support portion 311 is a boss protruding from the mounting base plate, the position of the boss matches the position of the connection area of ​​the conductive film 21 , and the length and width of the boss are not less than the length and width of the connection area of ​​the conductive film 21 , respectively.

[0071] In this embodiment, the boss is disposed on the bottom plate of the installation cavity to provide support force to the digital-analog hybrid microsystem after the digital-analog hybrid microsystem is pressed, so that the digital-analog hybrid microsystem is subjected to uniform force.

[0072] In one embodiment, if Figure 8 As shown, the pressing member 33 includes: a pressing plate body 331; the length and width of the pressing plate body 331 are not less than the length and width of the digital-analog hybrid microsystem SIP, respectively.

[0073] Optionally, the material of the pressing plate body 331 includes: a thermally conductive metal having a thermal conductivity greater than a preset thermal conductivity threshold.

[0074] Exemplarily, the preset thermal conductivity threshold is 30 W / (K·m).

[0075] Optionally, a thermal conductive silicone grease layer is provided on the surface of the pressure plate body 331 facing the digital-analog hybrid microsystem SIP to ensure complete contact between the digital-analog hybrid microsystem SIP and the pressure plate body 331, thereby ensuring that the digital-analog hybrid microsystem SIP is subjected to uniform force and preventing the digital-analog hybrid microsystem SIP from being damaged due to uneven force; the thermal conductivity of the thermal conductive silicone grease layer is greater than 4 W / (K·m).

[0076] Exemplarily, the thermally conductive metal includes copper and the like.

[0077] It should be noted that, considering the large number of devices included in the digital-analog hybrid microsystem SIP, when each device is running, it will generate huge power consumption, and the miniaturized volume limitation makes it difficult for the digital-analog hybrid microsystem SIP to dissipate heat itself, and a large amount of accumulated heat will be generated during the test process, affecting the test stability; therefore, in this application, a heat-conducting metal that is easy to conduct heat is used to make the pressure plate body, and by setting the pressure plate body to fit in contact with the surface of the digital-analog hybrid microsystem SIP, the surface heat of the digital-analog hybrid microsystem SIP is quickly conducted, thereby dissipating the internal accumulated heat of the digital-analog hybrid microsystem SIP.

[0078] In another embodiment, if Fig. 9 As shown, the pressing member 33 further includes: a plurality of movable pressing blocks 332 and a plurality of adjusting components 333; the number of the movable pressing blocks 332 is the same as the number of chips on the pressing surface of the digital-analog hybrid microsystem SIP; the pressing plate body 331 is provided with a plurality of placement grooves with one end closed and the other end open for placing the movable pressing blocks 332; the adjusting components 333 are used to connect the movable pressing blocks with the pressing plate body and adjust the distance between the movable pressing blocks 332 and the pressing plate body 331; Among them, the positions of each movable pressing block 332 in the pressure plate body 331 respectively match the positions of each chip on the pressing surface of the digital-analog hybrid microsystem SIP, and the sizes of each movable pressing block 332 respectively match the sizes of each chip on the pressing surface of the digital-analog hybrid microsystem SIP; the pressing surface of the digital-analog hybrid microsystem SIP is the surface where the digital-analog hybrid microsystem SIP contacts the clamping member 33.

[0079] Optionally, the material of the movable pressing block 332 includes: a thermally conductive metal having a thermal conductivity rate greater than the preset thermal conductivity threshold.

[0080] Optionally, the movable pressing block 332 has a screw hole, and the adjusting component 333 includes: a bolt and / or a screw; the internal thread of the screw hole matches the external thread of the bolt and / or the screw.

[0081] Optionally, the test module of the test board 1 further includes: an analog-to-digital converter; Fig.10 As shown, the clamping mechanism 3 also includes: a temperature sensor 34; the temperature sensor 34 is connected to the signal input end of the analog-to-digital converter, and the signal output end of the analog-to-digital converter is connected to the FPGA; the temperature sensor 34 is embedded in the pressure plate body 331 and / or the movable pressure block 332, and is used to sense the temperature of the pressure plate body 331 and / or the movable pressure block 332, and send the sensed analog temperature information to the analog-to-digital converter, so that the analog-to-digital converter converts the temperature information into digital temperature information, and sends the digital temperature information to the FPGA, so as to monitor the internal heat accumulation of the digital-analog hybrid microsystem SIP in real time, so as to avoid the digital-analog hybrid microsystem SIP from having excessive internal heat accumulation, resulting in unstable test results.

[0082] In this embodiment, by providing an independently floating movable pressure block, the height of each movable pressure block protruding from the pressure plate body is adjusted according to the actual height of each chip in the digital-analog hybrid microsystem SIP, so that the clamping member applies uniform pressure to the chips with different heights in the digital-analog hybrid microsystem SIP, and at the same time, the solder balls of the digital-analog hybrid microsystem SIP are respectively connected to the corresponding conductive pins 211 on the conductive film 21, thereby preventing some chips from being damaged due to excessive force. In addition, the clamping member can be applicable to the digital-analog hybrid microsystem SIP with chips of different heights, thereby improving the wide applicability of the test signal transmission device.

[0083] Optionally, the pressing member 33 further includes: a shell; the shell is elastically connected to the pressing plate body 331 to provide pressing force throughout the pressing process of the digital-analog hybrid microsystem SIP.

[0084] Exemplarily, the pressing plate body 331 is elastically connected to the housing via a spring.

[0085] Optionally, the first end of the shell is hinged to the positioning slot 322, and the second end of the shell is movably connected to the positioning slot 322, so that after the digital-analog hybrid microsystem SIP is placed in the positioning slot 322, the second end of the shell is connected to the positioning slot 322 by covering the shell and the positioning slot 322; the first end of the shell and the second end of the shell are opposite ends of the shell.

[0086] Exemplarily, the first end of the shell is hinged to the positioning slot body via a hinge, and the second end of the shell is movably connected to the positioning slot body via a buckle.

[0087] In this embodiment, by providing a hinged positioning slot at the first end of the shell and movably connecting the positioning slot to the second end of the shell, the digital-analog hybrid microsystem SIP can be quickly clamped while avoiding the tester manually pressing the clamping piece throughout the test process, thereby greatly improving the test efficiency and convenience of the digital-analog hybrid microsystem SIP.

[0088] See also Fig.11 and Fig.12 , respectively showing the first test result diagram and the second test result diagram obtained by performing the first test and the second test on the digital-analog hybrid microsystem SIP based on the test signal transmission device of the digital-analog hybrid microsystem SIP; wherein the signal input and output ends of the radio frequency probe 22 and the signal input and output ends of the radio frequency interface 23 are respectively connected to radio frequency cables, and the conductive pins of the conductive film 21, the radio frequency probe 22, and the link from the radio frequency cable to the radio frequency interface 23 are a complete signal input and output link; in the first test result diagram, the signal input and output ends of the radio frequency probe 22 serve as the signal input end, and the signal input and output ends of the radio frequency interface 23 serve as the signal output end; in the second test result diagram, the signal input and output ends of the radio frequency probe 22 serve as the signal output end, and the signal input and output ends of the radio frequency interface 23 serve as the signal input end; like Fig.11 As shown, the horizontal axis represents frequency in gigahertz (GHz), and the vertical axis represents signal amplitude attenuation in decibels (dB). Fig.11 There are 16 first test curves (RF1~RF16) in the first test, indicating that there are 16 signal links in the first test; Fig.12 As shown, the horizontal axis represents frequency in gigahertz (GHz), and the vertical axis represents signal amplitude attenuation in decibels (dB). Fig.12 There are 16 second test curves (RF1'~RF16') in the second test, indicating that there are 16 signal links in the second test; Fig.11 and Fig.12It can be seen that when the frequency of the test signal is in the range of 0~10 GHz, the signal amplitude attenuation corresponding to the first test curve and the second test curve is less than or equal to 1dB. As the frequency of the test signal increases, the signal amplitude attenuation corresponding to the first test curve and the second test curve increases. When the frequency of the test signal is in the range of 30~40 GHz, the signal amplitude attenuation corresponding to the first test curve and the second test curve is about 3dB. It can be seen that the test signal transmission device of the digital-analog hybrid microsystem SIP provided in the present application can efficiently transmit signals of different frequencies. During the signal transmission process, the signal amplitude attenuation of signals of different frequencies is small, and the maximum signal amplitude attenuation is only 3dB, which fully verifies the feasibility and reliability of the test signal transmission device of the digital-analog hybrid microsystem SIP provided in the present application.

[0089] A test signal transmission device for a digital-analog hybrid microsystem provided in the above embodiment is provided by opening vias on a test board that match solder balls for transmitting high-frequency signals of the digital-analog hybrid microsystem, and setting a connection component to connect the test board, including setting a conductive film on the test board, inserting a radio frequency probe in each of the vias on the test board, and setting a radio frequency interface with one end connected to the conductive film and the other end for inputting and outputting radio frequency signals, so as to form a radio frequency channel between the digital-analog hybrid microsystem and the external test equipment, and a non-high-frequency test signal is transmitted to the test board and the conductive film through the radio frequency interface. The digital-analog hybrid microsystem, the high-frequency test signal is transmitted to the digital-analog hybrid microsystem through the radio frequency probe and the conductive film, thereby realizing independent transmission of high-frequency signals and non-high-frequency signals, improving signal isolation, and avoiding the situation where all signals are transmitted to the digital-analog hybrid microsystem through the test board, which increases the design and material costs of the test board due to the large signal frequency span and high performance requirements of the test board. The digital-analog hybrid microsystem can be connected to various test equipment through the test signal transmission device, which is convenient for performing various tests and helps to improve the test efficiency of the digital-analog hybrid microsystem.

[0090] See also Fig.13 , showing a flow chart of a test method of a digital-analog hybrid microsystem provided by the present invention in one embodiment; like Fig.13 As shown, in this embodiment, the test method of the digital-analog hybrid microsystem provided by the present invention adopts the test signal transmission device of the digital-analog hybrid microsystem to test the digital-analog hybrid microsystem; wherein the test signal transmission device is connected to the test equipment and the host computer respectively; the host computer is connected to the test equipment, and the test method includes: Step S1, placing the digital-analog hybrid microsystem SIP in the connection area of ​​the conductive film 21, so that each solder ball Bal of the digital-analog hybrid microsystem SIP is respectively connected to the corresponding conductive pin 211 on the conductive film 21; Wherein, the test equipment includes: an external power supply, a signal source and a spectrum analyzer.

[0091] Specifically, the test board 1 is connected to the external power supply through an electrical cable, the RF probe 22 is connected to the signal source through an RF cable, and the RF interface 23 is connected to the spectrum analyzer through the RF cable; the digital-analog hybrid microsystem SIP is placed in the connection area of ​​the conductive film 21, and the clamping mechanism 3 is used to press the digital-analog hybrid microsystem SIP located on the conductive film 21, so that each solder ball Bal of the digital-analog hybrid microsystem SIP is respectively connected to the corresponding conductive pins 211 on the conductive film 21.

[0092] Step S2, the test equipment powers on the digital-analog hybrid microsystem through the test signal transmission device; the host computer controls the digital-analog hybrid microsystem to configure the device through the test signal transmission device to form a corresponding signal transceiver link; and the test equipment generates a test signal, and transmits the test signal to the digital-analog hybrid microsystem SIP through the test signal transmission device; wherein the high-frequency test signal is transmitted between the digital-analog hybrid microsystem SIP and the test equipment through the conductive film 21, the radio frequency probe 22 and the radio frequency interface 23; the non-high-frequency test signal is transmitted between the digital-analog hybrid microsystem SIP and the test equipment through the test board 1, the conductive film 21 and the radio frequency interface 23; Specifically, the external power supply supplies power to the test signal transmission device, so that the test signal transmission device powers on the digital-analog hybrid microsystem SIP through the conductive film; after the digital-analog hybrid microsystem SIP is powered on, the FPGA in the digital-analog hybrid microsystem SIP performs a firmware load; after the firmware loading is completed, the host computer generates a signal source control signal, a spectrum analyzer control signal, and a microsystem control signal based on the test item, and sends the signal source control signal and the spectrum analyzer control signal to the signal source and the spectrum analyzer, respectively, so that the signal source and the spectrum analyzer respectively perform the above-mentioned operations based on the corresponding control signals. The instrument configuration required for the test project is configured, and the signal source generates a corresponding test signal based on the signal source control signal; and the host computer sends the microsystem control signal to the digital-analog hybrid microsystem SIP through the test signal transmission device, so that the digital-analog hybrid microsystem SIP performs device configuration on the reconfigurable RF transceiver micromodule based on the microsystem control signal to form a corresponding signal transceiver link; the test signal is transmitted to the digital-analog hybrid microsystem SIP through the test signal transmission device, and the digital-analog hybrid microsystem SIP receives the test signal through the configured reconfigurable RF transceiver micromodule.

[0093] Step S3: After receiving the test signal, the digital-analog hybrid microsystem utilizes the signal transceiver link inside the digital-analog hybrid microsystem SIP to transmit the test signal back to the test equipment through the test signal transmission device.

[0094] Specifically, after receiving the test signal, the digital-analog hybrid microsystem SIP uses the signal transceiver link configured inside the digital-analog hybrid microsystem SIP to transmit the test signal back to the test device through the test signal transmission device; wherein the high-frequency test signal is transmitted through the conductive film 21, the radio frequency probe 22 and the radio frequency interface 23, and the non-high-frequency test signal is transmitted through the test board 1, the conductive film 21 and the radio frequency interface 23. Optionally, when the test signal transmission device includes a clamping mechanism, after placing the digital-analog hybrid microsystem SIP on the connection area of ​​the conductive film 21, the test method further includes: using the clamping mechanism 3 to press the digital-analog hybrid microsystem SIP located on the conductive film 21.

[0095] In this embodiment, a pressing method is adopted to quickly connect the digital-analog hybrid microsystem and the test signal transmission device using a pressing mechanism, which greatly improves the test efficiency of the digital-analog hybrid microsystem.

[0096] Optionally, when the test signal transmission device includes: a temperature sensor 34 and an analog-to-digital converter, after the digital-analog hybrid microsystem SIP is powered on, the test method further includes: The temperature sensor 34 is used to sense the temperature of the digital-analog hybrid microsystem SIP in real time, generate temperature information, and send the temperature information to the analog-to-digital converter; the analog-to-digital converter performs analog-to-digital conversion on the temperature information to obtain digital temperature information, and sends the digital temperature information to the FPGA; the FPGA transmits the digital temperature information to the host computer through the test signal transmission device, so as to monitor the temperature of the digital-analog hybrid microsystem SIP in real time during the test process.

[0097] Optionally, when the test signal transmission device includes a current detection chip, the test method further includes: using the test signal transmission device to perform an electrical performance test on the digital-analog hybrid microsystem SIP.

[0098] Optionally, the implementation method of the electrical performance test includes: using the current detection chip to obtain the current of each device in the digital-analog hybrid microsystem SIP, and detecting in real time whether the current of each device in the digital-analog hybrid microsystem SIP is normal.

[0099] Optionally, the testing method further includes: directly bringing out the pins of the main processing system-on-chip SoC1, the co-processing system-on-chip SoC2 and the FPGA of the digital-analog hybrid microsystem SIP to perform pin electrical performance testing on pins of different BANKs.

[0100] The present embodiment provides a testing method for a digital-analog hybrid microsystem, which connects the digital-analog hybrid microsystem with a test device and a host computer by adopting the test signal transmission device of the digital-analog hybrid microsystem, and utilizes the conductive film, the radio frequency probe and the radio frequency interface in the test signal transmission device to transmit a high-frequency test signal between the digital-analog hybrid microsystem and the test device; and utilizes the test board, the conductive film and the radio frequency interface in the test signal transmission device to transmit a non-high-frequency test signal between the digital-analog hybrid microsystem and the test device and / or the host computer. The testing method can realize independent transmission of high-frequency signals and non-high-frequency signals, improve signal isolation, reduce signal interference between test signals during the test process, and help improve the accuracy of testing the digital-analog hybrid microsystem.

[0101] The embodiment of the present application also provides a computer-readable storage medium. A person of ordinary skill in the art can understand that all or part of the steps in the method for implementing the above embodiment can be completed by instructing the processor through a program, and the program can be stored in a computer-readable storage medium, and the storage medium is a non-transitory medium, such as a random access memory, a read-only memory, a flash memory, a hard disk, a solid-state hard disk, a magnetic tape, a floppy disk, an optical disc, and any combination thereof. The above storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server or a data center that includes one or more available media integrated. The available medium can be a magnetic medium (for example, a floppy disk, a hard disk, a tape), an optical medium (for example, a digital video disc (DVD)), or a semiconductor medium (for example, a solid-state disk (SSD)), etc.

[0102] The embodiment of the present application may also provide a computer program product, which includes one or more computer instructions. When the computer instructions are loaded and executed on a computing device, the process or function described in the embodiment of the present application is generated in whole or in part. The computer instructions may be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions may be transmitted from one website, computer or data center to another website, computer or data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means.

[0103] When the computer program product is executed by a computer, the computer executes the method described in the above method embodiment. The computer program product may be a software installation package, and when the above method is required, the computer program product may be downloaded and executed on a computer.

[0104] The descriptions of the processes or structures corresponding to the above-mentioned figures have different emphases. For parts that are not described in detail in a certain process or structure, please refer to the relevant descriptions of other processes or structures.

[0105] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.

Claims

1. A test signal transmission device for a digital-analog hybrid microsystem, characterized in that: include: A test board, used for powering and testing the digital-analog hybrid microsystem; the test board is provided with a plurality of vias; The positions of the via holes are matched with the positions of the solder balls for transmitting high-frequency signals in the digital-analog hybrid microsystem; A connection component, comprising: a conductive film, a plurality of radio frequency probes and a plurality of radio frequency interfaces; wherein the conductive film is fitted on the surface of the test board facing the digital-analog hybrid microsystem; a plurality of conductive pins are distributed on the outer surface of the conductive film for matching the corresponding solder balls, and the layout position of each conductive pin on the conductive film matches the position of the corresponding solder ball on the digital-analog hybrid microsystem; one end of each radio frequency probe is respectively inserted into the corresponding via hole and connected to the conductive film, and the other end of each radio frequency probe is used to input or output a high-frequency test signal; each radio frequency interface is distributed around the test board, and one end is connected to the conductive film, and the other end is used to input or output a test signal.

2. The device according to claim 1, characterized in that The surface of the test board facing the digital-analog hybrid microsystem is coated with a first conductive layer for grounding the test board; the inner wall of the via is coated with a second conductive layer, the second conductive layer is connected to the first conductive layer, and the radio frequency probe is connected to the second conductive layer so that the grounding of the radio frequency probe and the test board are consistent.

3. The device according to claim 1, characterized in that The device also includes: The pressing mechanism is used to press the digital-analog hybrid microsystem located on the conductive film so that each solder ball of the digital-analog hybrid microsystem is connected to the corresponding conductive pin on the conductive film.

4. The device according to claim 3, characterized in that The clamping mechanism comprises: a mounting cavity, a positioning clamping plate and a clamping member; wherein, The installation cavity is used to install and fix the test board; the radio frequency interface is arranged on the cavity wall of the installation cavity, and one end of the radio frequency interface passes through the cavity wall to connect to the conductive film on the test board; The positioning card board is located on the side of the test board facing the digital-analog hybrid microsystem; the positioning card board has a card board body and a positioning card slot; the card board body has a hollow positioning card slot body for clamping the positioning card slot; the length and width of the positioning card slot respectively match the length and width of the connection area of ​​the conductive film; the positioning card board is located above the test board, and the position of the positioning card slot matches the position of the connection area of ​​the conductive film; the connection area of ​​the conductive film is the area where the conductive film is connected to the digital-analog hybrid microsystem; The pressing member is used to press the digital-analog hybrid microsystem and the conductive film together, so that each solder ball of the digital-analog hybrid microsystem is respectively aligned with each conductive pin of the conductive film.

5. The device according to claim 4, characterized in that A supporting portion is provided on the bottom plate of the installation cavity. The height of the supporting portion matches the height of the RF interface on the cavity wall.

6. The device according to claim 4, characterized in that The clamping member comprises: a clamping plate body, a movable clamping block and an adjusting component; wherein, The length and width of the pressing plate body are not less than the length and width of the digital-analog hybrid microsystem, respectively; the number of the movable pressing blocks is the same as the number of chips on the pressing surface of the digital-analog hybrid microsystem; the pressing plate body is provided with a plurality of placement grooves with one end closed and the other end open for placing the corresponding movable pressing blocks; the adjusting component is used to connect the movable pressing block with the pressing plate body and adjust the distance between the movable pressing block and the pressing plate body; Among them, the positions of each movable pressing block in the pressure plate body respectively match the positions of each chip on the pressing surface of the digital-analog hybrid microsystem; the pressing surface of the digital-analog hybrid microsystem is the surface of the digital-analog hybrid microsystem in contact with the clamping member.

7. The device according to claim 6, characterized in that The pressing member further comprises: a shell; the shell is elastically connected to the pressing plate body.

8. The device according to claim 7, characterized in that The first end of the shell is hinged to the positioning slot, and the second end of the shell is movably connected to the positioning slot; the first end of the shell and the second end of the shell are opposite ends of the shell.

9. The device according to claim 4, characterized in that An analog-to-digital converter is provided on the test board, and the clamping mechanism also includes: a temperature sensor; the temperature sensor is connected to the signal input end of the analog-to-digital converter, and the signal output end of the analog-to-digital converter is connected to the digital-analog hybrid microsystem; the temperature sensor is embedded in the clamping member, and is used to sense the temperature of the clamping member, and send the sensed temperature information to the analog-to-digital converter, so that the analog-to-digital converter converts the temperature information into digital temperature information, and sends the digital temperature information to the digital-analog hybrid microsystem.

10. A method for testing a digital-analog hybrid microsystem, characterized in that: The digital-analog hybrid microsystem is tested by using the test signal transmission device of the digital-analog hybrid microsystem as claimed in any one of claims 1 to 9; wherein the test signal transmission device is connected to the test equipment and the host computer respectively, and the method comprises: Placing the digital-analog hybrid microsystem in the connection area of ​​the conductive film so that each solder ball of the digital-analog hybrid microsystem is connected to the corresponding conductive pin on the conductive film; The test equipment powers on the digital-analog hybrid microsystem through the test signal transmission device; the host computer controls the digital-analog hybrid microsystem to configure the device through the test signal transmission device to form a corresponding signal transceiver link; and the test equipment generates a test signal, and transmits the test signal to the digital-analog hybrid microsystem through the test signal transmission device; wherein the high-frequency test signal is transmitted through the conductive film, the radio frequency probe and the radio frequency interface; the non-high-frequency test signal is transmitted through the test board, the conductive film and the radio frequency interface; After receiving the test signal, the digital-analog hybrid microsystem utilizes the signal transceiver link inside the digital-analog hybrid microsystem SIP to transmit the test signal back to the test equipment through the test signal transmission device.

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