Display module, preparation method thereof and display device

Abstract

The present disclosure provides a display module, a preparation method thereof and a display device. The display module comprises a display panel, a backlight module and a COF. The display panel comprises a first substrate, a liquid crystal layer and a second substrate. The first substrate is provided with a fan-out line on the side facing the second substrate in a fan-out area. The second substrate and the liquid crystal layer do not overlap with the fan-out area in the first plane. The backlight module is arranged on the side of the second substrate away from the first substrate. The backlight module comprises a first bottom surface opposite to the second substrate and a first side surface between the second substrate and the first bottom surface. The included angle between the first side surface and the first bottom surface is obtuse. The COF comprises a first area, a second area and a third area. The first area is arranged on the side of the fan-out line facing the second substrate and connected with the fan-out line. The third area is arranged on the side of the first bottom surface away from the display panel. The second area is in contact with the first side surface.

Description

Technical Field

[0001] This disclosure relates to the field of display technology. More specifically, it relates to a display module, a method for manufacturing the same, and a display device. Background Technology

[0002] Currently, the mainstream packaging technologies for display panels include three types: Chip On Glass (COG), Chip On Flex or Chip On Film (COF), and Chip On Pi (COP). These packaging technologies play a key role in reducing the bezel size of display panels. Among them, COP packaging contributes the most to bezel reduction, followed by COF packaging, and finally COG packaging.

[0003] However, the above-mentioned packaging methods still have problems such as light leakage in the bending area and the inability to further reduce the size of the frame. Summary of the Invention

[0004] The purpose of this disclosure is to provide a display module and its manufacturing method, as well as a display device, to solve the technical problems of light leakage in the bending area of ​​the display module and the inability to further reduce the size of the bezel in the related art.

[0005] To achieve the above objectives, the present disclosure adopts the following technical solution:

[0006] This disclosure provides a display module having a display area and a fan-out area located on one side of the display area, the display module comprising:

[0007] The display panel includes a first substrate, a liquid crystal layer, and a second substrate stacked sequentially. A fan-out line is provided in the fan-out area on the side of the first substrate facing the second substrate. The orthographic projections of the second substrate and the liquid crystal layer in a first plane do not overlap with the orthographic projections of the fan-out area in the first plane. The first plane is a plane parallel to the display panel.

[0008] A backlight module is disposed on the side of the second substrate away from the first substrate. The backlight module includes a first bottom surface disposed opposite to the second substrate and a first side surface located between the second substrate and the first bottom surface. The angle between the first side surface and the first bottom surface is an obtuse angle.

[0009] A flip-chip film, comprising a first region, a second region, and a third region, wherein the first region is disposed on the side of the fan-out line facing the second substrate and connected to the fan-out line, the third region is disposed on the side of the first bottom surface away from the display panel, the second region overlaps and contacts the first side surface, and one end of the second region is connected to the end of the first region near the display area, and the other end extends to the side of the first bottom surface away from the display panel and is connected to the third region.

[0010] Optionally, the display area includes a first edge and a second edge opposite to each other in a first direction, the fan-out area is disposed on the side of the first edge away from the display area, the fan-out area includes a plurality of sub-fan-out areas spaced apart along a second direction, the fan-out line is disposed in the sub-fan-out area on the side of the first substrate facing the second substrate, the display module includes a plurality of flip-chip films, one flip-chip film corresponds to one sub-fan-out area, and the second direction is perpendicular to the first direction.

[0011] Optionally, the orthographic projection of the first side surface in the first plane overlaps with the first region in the second direction, and the first region is the distribution area of ​​the orthographic projection of the sub-fan-out area in the first plane in the second direction.

[0012] Optionally, the backlight module further includes a second side surface located between the second substrate and the first bottom surface, the second side surface being perpendicular to the first bottom surface, and the orthographic projection of the second side surface in the first plane not overlapping the first region in the second direction.

[0013] Optionally, both the first side and the second side include a first end that is closer to the display panel and a second end that is farther away from the display panel. The first end of the second side is flush with the boundary line of the fan-out area away from the display area in a first direction. The distance between the first end of the first side and the display area in the first direction is less than the distance between the first end of the second side and the display area in the first direction. The third direction is perpendicular to the first direction and the second direction.

[0014] Optionally, the backlight module includes a back plate and a frame. The back plate includes a bottom plate and a first side plate disposed on the edge of the bottom plate. The bottom plate is disposed opposite to the second substrate. The first side plate is disposed between the second substrate and the bottom plate. The included angle between the bottom plate and the first side plate is an obtuse angle. The second substrate, the first side plate, and the bottom plate form an accommodating space. The frame includes a first frame portion disposed between the first side plate and the second substrate. The first frame portion and the surfaces of the first side plate away from the accommodating space form the first side surface. The surface of the bottom plate away from the second substrate forms the first bottom surface.

[0015] Optionally, the back plate further includes a second side plate disposed on the edge of the bottom plate, the second side plate being perpendicular to the bottom plate, and the frame further includes a second frame portion disposed on the side of the second side plate away from the accommodating space and a third frame portion disposed between the second side plate and the second substrate, the surfaces of the second frame portion and the third frame portion away from the accommodating space forming the second side surface.

[0016] Optionally, the display module further includes a printed circuit board disposed on the side of the first bottom surface away from the display panel, and the printed circuit board is bonded to the third region.

[0017] Optionally, the printed circuit board includes a first printed circuit board, a second printed circuit board, and a main control circuit board. The first printed circuit board is bonded to a third region of a plurality of flip-chip films on one side of the center line of the second direction, and the second printed circuit board is bonded to a third region of a plurality of flip-chip films on the other side of the center line of the second direction. The main control circuit board is connected to the first printed circuit board and the second printed circuit board via a flexible flat cable.

[0018] Optionally, the display module further includes a driver chip, and the third region includes a chip area, in which the driver chip is integrated.

[0019] Optionally, the display module further includes a first polarizer and a second polarizer, wherein the first polarizer is disposed on the side of the first substrate away from the second substrate, and the second polarizer is disposed between the second substrate and the backlight module.

[0020] A second aspect of this disclosure provides a method for manufacturing a display module, the display module having a display area and a fan-out area located on one side of the display area, the method for manufacturing the display module comprising the following steps:

[0021] A display panel is provided, the display panel comprising a first substrate, a liquid crystal layer and a second substrate stacked in sequence, a fan-out line being provided in the fan-out area on the side of the first substrate facing the second substrate, the orthographic projection of the second substrate and the liquid crystal layer in a first plane not overlapping the orthographic projection of the fan-out area in the first plane, the first plane being a plane parallel to the display panel.

[0022] The display panel and the backlight module are assembled. The backlight module is disposed on the side of the second substrate away from the first substrate. The backlight module includes a first bottom surface disposed opposite to the second substrate and a first side surface located between the second substrate and the first bottom surface. The angle between the first side surface and the first bottom surface is an obtuse angle.

[0023] The display panel and the printed circuit board are bonded using a flip-chip film. The flip-chip film includes a first region, a second region, and a third region. The first region is located on the side of the fan-out line facing the second substrate and is connected to the fan-out line. The third region is located on the side of the first bottom surface away from the display panel. The second region overlaps and contacts the first side surface, and one end of the second region is connected to the end of the first region near the display area, while the other end extends to the side of the first bottom surface away from the display panel and is connected to the third region. The printed circuit board is located on the side of the first bottom surface away from the display panel and is bonded to the third region.

[0024] A third aspect of this disclosure provides a display device including a display panel as described above.

[0025] The beneficial effects of this disclosure are as follows:

[0026] The display module of this disclosure has a fan-out line on a first substrate away from the backlight module. The area where the second substrate is located does not overlap with the area where the fan-out line is located so that the fan-out line is exposed. The backlight module includes a first bottom surface and a first side surface. The first side surface is located at the edge of the first bottom surface and forms an obtuse angle with the first bottom surface. After the flip-chip film is connected to the fan-out line, it can directly extend to the first bottom surface through the first side surface without bending. On the one hand, the bend area can be reduced by omitting the bend area, and on the other hand, the risk of light leakage caused by bending can be avoided. Attached Figure Description

[0027] The specific embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0028] Figure 1 A comparative diagram of the structures of three packaging technologies in related technologies;

[0029] Figure 2 for Figure 1Schematic diagram of the planar structure of three packaging technologies;

[0030] Figure 3 This is a planar comparison diagram of the display module and the COF packaging structure provided in the embodiments of this disclosure;

[0031] Figure 4 A schematic diagram comparing the display module and COF packaging structure in the thickness direction provided in the embodiments of this disclosure;

[0032] Figure 5 This is a planar schematic diagram of the display module and COF packaging structure provided in the embodiments of this disclosure;

[0033] Figure 6 This is a schematic diagram of a planar structure of a display module according to an embodiment of the present disclosure;

[0034] Figure 7 for Figure 6 A plan view of the backlight module of the central display module;

[0035] Figure 8 This is a schematic diagram of another embodiment of the module at the first position P1;

[0036] Figure 9 A flowchart illustrating the method for preparing a display module according to an embodiment of this disclosure. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0038] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0039] Please refer to Figure 1 and Figure 2 , Figure 1 This is a schematic diagram comparing the structures of three packaging technologies in related technologies. Figure 2 for Figure 1 Schematic diagrams of the planar structures of the three packaging technologies, as shown below. Figures 1 to 2 As shown, a display module typically includes a color filter substrate (CF) and a TFT array substrate arranged opposite each other. In COG packaging technology, the driver IC (DIC) is directly bonded to the glass backplane. That is, both the driver IC and the fan-out wiring of the display panel are integrated on the glass backplane, and the fan-out wiring is generally concentrated within a 4mm width of the bottom bezel. Due to the large volume occupied by the driver IC and the fan-out wiring, the bottom bezel is relatively wide. Compared with COG packaging technology, COF packaging technology improves by integrating the driver IC onto a flexible thin-film substrate using flip-chip technology. The flexible thin-film substrate with the integrated driver IC can also be called a flip-chip film. Therefore, the driver IC can be directly placed at the bottom of the display module, saving 1.5mm of bezel size compared to COG packaging technology. Figure 1 and Figure 2 The W1 thickness is 1.5mm. COP packaging technology is a packaging technique that bonds the driver chip to a polyimide (PI) substrate. It utilizes the flexible nature of flexible screens, allowing the bezels to be reduced to a near-borderless effect. Figure 1 and Figure 2W2 indicates that COP packaging technology reduces the bezel width compared to COF packaging technology. Since only flexible OLED screens can be bent, while LCD screens cannot, COP packaging technology is unsuitable for LCD screens and suffers from drawbacks such as high cost and low yield. Furthermore, all three packaging processes require bending to connect the printed circuit board (PCB) to the driver chip, and the bending area occupies a certain bezel width, hindering the achievement of narrow bezels and introducing a risk of light leakage.

[0040] To address the aforementioned technical problems, this disclosure provides a display module, its fabrication method, and a display device. Please refer to... Figures 3 to 5 , Figure 3 This is a planar comparison diagram of the display module and the COF packaging structure provided in the embodiments of this disclosure. Figure 4 This is a schematic diagram comparing the display module and COF packaging structure provided in the embodiments of this disclosure in the thickness direction. Figure 5 This is a cross-sectional view of the lower border of the COF packaging structure in the D-D' direction in the display module and related technologies of this disclosure embodiment, as shown below. Figures 3 to 5 As shown, the display module has a display area (Active Area, abbreviated as AA) and a fan-out area BB located on one side of the display area AA. The display module includes a display panel 10, a backlight module 20, a flip-chip film 30, and a driver chip 40.

[0041] The display area AA includes multiple sub-pixels arranged in an array. For example, the sub-pixels are arranged in an array along the horizontal direction X and the vertical direction Y. In addition, the display area AA also includes multiple gate lines extending along the horizontal direction X and spaced apart along the vertical direction Y, and multiple data lines extending along the vertical direction Y and spaced apart along the horizontal direction X. The gate lines provide line scan signals to the sub-pixels, and the data lines provide data signals to the sub-pixels. Each sub-pixel is displayed under the control of the line scan signals and data signals. The signal traces in the display panel 10, such as data lines, ground lines, and test lines, need to be bound to the driver chip 40. Therefore, a fan-out line 110a needs to be set in the fan-out area BB. One end of the fan-out line 110a is connected to the signal traces in the display panel 10, and the other end is connected to the driver chip 40, thereby distributing the signals from the driver chip 40 to each sub-pixel.

[0042] The display module also includes a border area surrounding the display area AA. For example, the border area includes a left border area and a right border area located on opposite sides of the display area AA in the horizontal direction X, and a top border area and a bottom border area located on opposite sides of the display area AA in the vertical direction Y. The fan-out area BB is disposed within one of the border areas. In this embodiment, the fan-out area BB is disposed within the bottom border area as an example.

[0043] Specifically, such as Figure 4 As shown, the display panel 10 includes a first substrate 110, a liquid crystal layer (not shown in the figure), and a second substrate 120 stacked in sequence. A fan-out line 110a is provided in the fan-out area BB on the side of the first substrate 110 facing the second substrate 120. The orthographic projection of the second substrate 120 and the liquid crystal layer in the first plane does not overlap with the orthographic projection of the fan-out area BB in the first plane. The first plane is a plane parallel to the display panel 10.

[0044] Please refer to Figure 5 , Figure 5 In this embodiment, the first position P1 indicates the position where the flip-chip film 30 is provided, and the second position P2 indicates the position where the flip-chip film 30 is not provided. The view at the first position P1 in this embodiment is shown below. Figure 3 The image shows a cross-sectional view of the display module along the D-D' direction at the location where the flip-chip film 30 is disposed, and the view at the second position P2 in this embodiment of the present disclosure. Figure 3 The image shows a cross-sectional view of the module along the D-D' direction at the location where the flip-chip film 30 is not installed.

[0045] like Figure 5 As shown, the backlight module 20 is disposed on the side of the second substrate 120 away from the first substrate 110. The backlight module 20 includes a first bottom surface 20a disposed opposite to the second substrate 120 and a first side surface 20b located between the second substrate 120 and the first bottom surface 20a. The included angle α between the first side surface 20b and the first bottom surface 20a is an obtuse angle.

[0046] The flip-chip film 30 includes a first region 310, a second region 320, and a third region 330. The first region 310 is disposed on the side of the fan-out line 110a facing the second substrate 120 and connected to the fan-out line 110a. The third region 330 is disposed on the side of the first bottom surface 20a away from the display panel 10. The second region 320 overlaps and contacts the first side surface 20b, and one end of the second region 320 is connected to the end of the first region 310 near the display area AA, and the other end extends to the side of the first bottom surface 20a away from the display panel 10 and is connected to the third region 330.

[0047] The flip-chip film 30 includes a flexible thin-film substrate, an integrated circuit chip, metal wires, and a protective layer. The flexible thin-film substrate is usually made of flexible materials such as polyimide (PI), which has good heat resistance and mechanical strength. The integrated circuit chip is directly mounted on the flexible thin-film substrate through flip-chip technology to achieve high-density connection. The metal wires (usually copper) on the flexible thin-film substrate are used to transmit signals and data. The protective layer covers the metal wires and integrated circuit chip to prevent damage to the circuit from the external environment.

[0048] In this embodiment of the disclosure, the third region 330 further includes a chip region, and the driving chip 40 is integrated in the chip region. That is, the integrated circuit chip on the flip-chip film 30 is the driving chip 40, and the driving chip 40 is disposed in the third region 330 of the flip-chip film 30. That is, the driving chip 40 is located on the side of the backlight module 20 away from the display panel 10, which can reduce the size of the lower bezel of the display module.

[0049] The COF packaging in the various figures of this disclosure refers to the packaging structure in the related art. Compared with the COF packaging structure of the related art, the main improvements of the display module of this disclosure mainly include the following aspects:

[0050] (1) The first substrate 110 is an array substrate, and the second substrate 120 is a color filter substrate. The second substrate 120 is slightly smaller than the first substrate 110 at the fan-out region BB. Specifically, at the bottom edge, the boundary line of the second substrate 120 is recessed relative to the boundary line of the first substrate 110 to expose the fan-out line 110a on the first substrate 110. That is, the orthographic projection of the second substrate 120 in the first plane does not overlap with the orthographic projection of the fan-out line 110a in the first plane, so that the flip-chip film 30 can be directly connected to the fan-out line 110a on the first substrate 110. In addition, the liquid crystal layer is usually only distributed in the display area AA, so the liquid crystal layer in the fan-out region BB will not block the fan-out line 110a.

[0051] (2) A clearance space is provided at the position of the fan-out line 110a in the backlight module 20, so that after the flip-chip film 30 is connected to the fan-out line 110a, it can extend directly to the clearance space through the recessed side of the second substrate 120, and extend to the back of the backlight module 20 (that is, the side away from the display panel 10) in the clearance space, and then connect with the printed circuit board disposed on the back of the backlight module 20. At this time, the flip-chip film 30 does not need to be bent, and the space occupied by the bending area can be omitted, thereby reducing the bezel size of the display module. At the same time, since the bending area is eliminated, the flip-chip film 30 does not need to be bent, so the width of the fan-out line 110a (that is, the length in the vertical direction Y) can also be appropriately reduced, further reducing the bezel size of the display module.

[0052] Optionally, the clearance space can be a recess provided on the backlight module 20. For example, such as... Figure 5 As shown, in this embodiment of the present disclosure, the backlight module 20 includes a first bottom surface 20a disposed opposite to the second substrate 120 and a first side surface 20b disposed between the second substrate 120 and the first bottom surface 20a. The first side surface 20b is an inclined surface. Specifically, the included angle α between the first side surface 20b and the first bottom surface 20a is an obtuse angle. At this time, the extension line of the first side surface 20b and the first bottom surface 20a forms an acute angle. The space formed between the extension line of the first side surface 20b and the first bottom surface 20a can be understood as the recessed portion of the backlight module 20, that is, the clearance space as described above.

[0053] The angle α between the first side surface 20b and the first bottom surface 20a is designed to be obtuse, providing a smooth, gradually changing slope. This slope is manifested in the following way: in the first direction Y, the closer to the display area AA, the smaller the vertical distance between the first side surface 20b and the first bottom surface 20a; conversely, the farther away from the display area AA, the smaller the vertical distance between the first side surface 20b and the first bottom surface 20a. During the bonding process between the flip-chip film 30 and the printed circuit board on the back of the backlight module 20, the flip-chip film 30 can smoothly extend from the fan-out line 110a along this slope (i.e., the first side surface 20b) to the back of the backlight module 20. Conversely, if the first side surface 20b is too steep or uneven, the flip-chip film 30 may not adhere smoothly, easily causing poor connection and affecting connection reliability.

[0054] It is understood that in the backlight module of this disclosure, the angle between the first side 20b and the second surface 20a is used to form a clearance space for the flip-chip film 30 to pass through. In specific implementation, various shapes or patterns of cutouts or grooves can be set on the backlight module 20 to form the above-mentioned clearance space. This disclosure does not limit it.

[0055] (3) The flip-chip film 30 includes a first region 310, a second region 320 and a third region 330 connected in sequence. The first region 310 and the third region 330 are parallel to the first plane, and the second region 320 is parallel to the first side 20a. The first region 310 is located at the fan-out line 110a and connected to the fan-out line 110a. The second region 320 is laid flat on the first side 20b. One end of the second region 320 is connected to the first region 310. Specifically, the second region 320 is connected to the end of the first region 310 near the display area AA. The other end of the second region 320 extends to the back of the backlight module 20 and is connected to the third region 330. In this way, the flip-chip film 30 can be directly extended to the back of the backlight module 20 without bending. It is understood that the flip-chip film 30 in this embodiment includes a first region 310, a second region 320 and a third region 330. This division is for ease of description. In specific implementation, the flip-chip film 30 can also be an integral structure, that is, the first region 310, the second region 320 and the third region 330 are integrally formed.

[0056] Compared with related technologies, the display module of this disclosure has a fan-out line on a first substrate away from the backlight module. The area where the second substrate is located does not overlap with the area where the fan-out line is located to expose the fan-out line. The backlight module includes a first bottom surface and a first side surface. The first side surface is located at the edge of the first bottom surface and forms an obtuse angle with the first bottom surface. After the flip-chip film is connected to the fan-out line, it can directly extend to the first bottom surface through the first side surface without bending. On the one hand, the bend area can be reduced by omitting the bend area, and on the other hand, the risk of light leakage caused by bending can be avoided.

[0057] In one possible implementation, such as Figures 6 to 7 As shown, Figure 6 To show a schematic diagram of the planar structure of one embodiment of the module, Figure 7 for Figure 6 A planar schematic diagram of a backlight module shows that the display area AA includes a first edge and a second edge opposite to each other in a first direction, the fan-out area BB is disposed on the side of the first edge away from the display area AA, the fan-out area BB includes a plurality of sub-fan-out areas spaced apart along a second direction, the fan-out line is disposed in the sub-fan-out area on the side of the first substrate 110 facing the second substrate 120, the display module includes a plurality of flip-chip films 30, one flip-chip film 30 corresponds to one sub-fan-out area, and the second direction is perpendicular to the first direction.

[0058] Optionally, the first direction is the vertical direction Y, and the second direction is the horizontal direction X. When the display panel is large in the horizontal direction X, multiple signal traces can be fanned out in different areas. In this case, the fan-out area BB includes multiple sub-fan-out areas spaced apart along the second direction X, and each sub-fan-out area is provided with a fan-out line. Correspondingly, the display module needs to include multiple flip-chip films 30, and each flip-chip film 30 is used to connect the fan-out line in its corresponding sub-fan-out area to the driver chip.

[0059] When the display module includes multiple flip-chip films 30, the display module includes multiple driver chips 40. The third region 330 of each flip-chip film 30 includes a chip region, and one or more driver chips 40 are disposed in the chip region.

[0060] In one possible implementation, the display module further includes a printed circuit board 50 disposed on the side of the first bottom surface 20a away from the display panel 10, and the printed circuit board 50 is bonded to the third region 330.

[0061] Optional, such as Figure 6 As shown, the printed circuit board 50 includes a first printed circuit board 510, a second printed circuit board 520, and a main control circuit board 530. The first printed circuit board 510 is bonded to the third region 330 of a plurality of flip-chip films 30 on one side of the second direction center line L1. The second printed circuit board 520 is bonded to the third region 330 of a plurality of flip-chip films 30 on the other side of the second direction center line L1. The main control circuit board 530 is connected to the first printed circuit board 510 and the second printed circuit board 520 through a flexible flat cable (FFC).

[0062] Here, the second direction centerline L1 represents the centerline in the second direction X. That is, the second direction centerline L1 divides the display module into two regions in the second direction X, and the first printed circuit board 510 and the second printed circuit board 520 provide control signals to the sub-pixels in the two regions respectively. The first printed circuit board 510 or the second printed circuit board 520 is bonded to the third region 330 of the flip-chip film 30, which can also be understood as the first printed circuit board 510 or the second printed circuit board 520 being connected to the driver chip 40 within the third region 330.

[0063] The first printed circuit board 510 can also be referred to as PCB-L, the second printed circuit board 520 can also be referred to as PCB-R, and the main control circuit board 530 can also be referred to as a timing controller (TCON board). The first printed circuit board 510 is used to connect with the driver chip 40 corresponding to the sub-pixels of the left half of the display area, the second printed circuit board 520 is used to connect with the driver chip 40 corresponding to the sub-pixels of the right half of the display area, and the main control circuit board 530 is used to convert the image signal Vin from the graphics card or processor into a timing signal that the display module can recognize, thereby controlling the brightness and color of each sub-pixel.

[0064] For example, such as Figure 6 As shown, the fan-out region BB includes 12 sub-fan-out regions, each corresponding to a flip-chip thin film 30. Figure 6 The CF&BLU side specifically refers to the schematic diagram of the second substrate 120 and the backlight module 20 side, which is... Figure 6 As can be seen, in the COF packaging structure of related technologies, the flip-chip film is bent from one side of the array substrate to the backlight side. In the display module of the present disclosure embodiment, the driver chip 40 and the printed circuit board 50 are disposed on the back side of the backlight module 20, and the backlight module 20 is provided with a clearance space. The flip-chip film 30 is extended directly from the first substrate 110 to the back side of the backlight module 20 through the clearance space without bending.

[0065] Optionally, the orthographic projection of the first side 20b in the first plane overlaps with the first region in the second direction X, and the first region is the distribution area of ​​the orthographic projection of the sub-fan-out area in the first plane in the second direction X.

[0066] When the display module includes multiple flip-chip films 30, in this embodiment of the present disclosure, the backlight module 20 is also segmented along the second direction X at the lower frame position. Specifically, the side of the backlight module 20 where the flip-chip film 30 is disposed (i.e., the area where the sub-fan-out area is located) is the first side 20b. The area where the flip-chip film 30 is located can also be represented by the distribution area of ​​the sub-fan-out area in the second direction by the orthogonal projection of the sub-fan-out area on the first plane.

[0067] Optional, such as Figure 5 As shown, the backlight module 20 also includes a second side surface 20c located between the second substrate 120 and the first bottom surface 20a. The second side surface 20c is perpendicular to the first bottom surface 20a, and the orthographic projection of the second side surface 20a in the first plane does not overlap with the first region in the second direction Y.

[0068] In this embodiment, the backlight module 20 adopts a segmented design in the second direction X. Specifically, the area where the flip-chip film 30 is provided (i.e., the area where the sub-fan-out area is located) is the first side surface 20b, and the area where the flip-chip film 30 is not provided (i.e., the area outside the flip-chip film 30 in the second direction X) is the second side surface 20c. In the area where the flip-chip film 30 is not provided, since there is no need to provide clearance space for the flip-chip film 30, the backlight module 20 can adopt a conventional design in this area, that is, the second side surface 20c is perpendicular to the first bottom surface 20a. At this time, the backlight module 20 has a better support effect.

[0069] For example, such as Figure 7 As shown, Figure 7 In the diagram, P1 indicates the position where the flip-chip film 30 is installed, and P2 indicates the position where the flip-chip film 30 is not installed. Figure 7 As can be seen, at the location where the flip-chip film 30 is provided, the backlight module 20 forms an inwardly recessed clearance space for the flip-chip film 30 to pass through, while at the location where the flip-chip film 30 is not provided, the backlight module 20 adopts a conventional design.

[0070] Optional, such as Figure 5 Therefore, both the first side 20b and the second side 20c include a first end approaching the display panel 10 and a second end away from the display panel 10 in a third direction. The first end of the second side 20c is flush with the boundary line of the fan-out area BB away from the display area AA in the first direction Y. The distance between the first end of the first side 20b and the display area in the first direction Y is less than the distance between the first end of the second side 20c and the display area AA in the first direction Y. The third direction is perpendicular to the first direction Y and the second direction X. Here, the third direction is the thickness direction Z of the display module.

[0071] Specifically, the two ends of the first side 20b and the second side 20c in the third direction Z are respectively referred to as the first end and the second end. The first end of the first side 20b is in a recessed state compared with the first end of the second side 20c. Here, the recess means that it is closer to the display area AA, that is, the distance between it and the display area AA in the first direction Y is smaller. The first end of the second side 20c can also be understood as the boundary line of the lower border area away from the display area AA.

[0072] Compared with the display modules in related technologies, the embodiments of this disclosure eliminate the bending area in the lower bezel, so the size of the lower bezel area can be reduced. At this time, the boundary line of the lower bezel can be moved inward as a whole (that is, moved in the direction closer to the display area AA in the second direction Y).

[0073] The bottom bezel boundary line can also be understood as the position of the orthographic projection of the first end of the second side 20c in the backlight module 20 onto the first plane. Therefore, when the bottom bezel size is reduced, the second side 20c is moved inward compared to the prior art. Figure 5 As shown, the inward shift distance is denoted as d1.

[0074] In one possible implementation, such as Figure 5 As shown, the backlight module 20 includes a back cover (BC) 210 and a model frame (MF) 220. The back cover 210 includes a base plate 2110 and a first side plate 2120 disposed on the edge of the base plate 2110. The base plate 2110 is disposed opposite to the second substrate 120. The first side plate 2120 is disposed between the second substrate 120 and the base plate 2110. The included angle between the base plate 2110 and the first side plate 2120 is an obtuse angle. The second substrate 120, the first side plate 2120 and the base plate 2110 form an accommodating space. The model frame 220 includes a first model frame portion 2210 disposed between the first side plate 2120 and the second substrate 120. The surfaces of the first model frame portion 2210 and the first side plate 2120 away from the accommodating space form the first side surface 20b. The surface of the base plate 2110 away from the second substrate 120 forms the first bottom surface 20a.

[0075] In this embodiment, in the area where the flip-chip film 30 is disposed, the backplate 210 of the backlight module 20 includes a first side plate 2120. The first side plate 2120 and the bottom plate 2110 are inclined, specifically, the included angle between the first side plate 2120 and the bottom plate 2110 is an obtuse angle. Meanwhile, the frame 220 includes a first frame portion 2210 disposed in the third direction Z between the second substrate 120 and the first side plate 2120. The outer surface of the first frame portion 2210, i.e., the side surface away from the display area AA, is also inclined, and the included angle between it and the bottom plate 2110 is also an obtuse angle. The first side plate 2120 and the side surface of the first frame portion 2210 away from the display area AA (i.e., the surface away from the accommodating space) together form the aforementioned first side surface 20b.

[0076] It is understood that in the backlight module of this embodiment, the obtuse angle between the first side plate 2120 and the bottom plate 2110 forms a clearance space for the flip-chip film 30 to pass through. In specific implementations, various shapes or patterns of cutouts or grooves can be provided on the backlight module 20 to form the aforementioned clearance space. For example, please refer to... Figure 8 , Figure 8 To show a structural schematic diagram of another embodiment of the module at the first position P1, Figure 8In the embodiment shown, the back plate 210 further includes a second bottom plate 2140 parallel to the bottom plate 2110. The distance between the second bottom plate 2140 and the display panel 10 is greater than the distance between the bottom plate 2110 and the display panel 10. The included angle between the first side plate 2120 and the second bottom plate 2140 is an obtuse angle.

[0077] Optionally, the back plate 210 further includes a second side plate 2130 disposed on the edge of the bottom plate 2110, the second side plate 2130 being perpendicular to the bottom plate 2110. The frame 220 further includes a second frame portion 2220 disposed on the side of the second side plate 2130 away from the accommodating space and a third frame portion 2230 disposed between the second side plate 2130 and the second substrate 120. The surfaces of the second frame portion 2220 and the third frame portion 2230 away from the accommodating space form the second side surface 20c. In this case, the bottom plate 2110, the first side plate 2120, the second side plate 2130, and the second substrate 120 together form an accommodating space.

[0078] In this embodiment of the disclosure, in the area where the flip-chip film 30 is not provided, the back plate 210 in the backlight module 20 includes a second side plate 2120. The second side plate 2120 is perpendicular to the bottom plate 2110, that is, in a vertical state. At this time, the surfaces of the second frame portion 2220 and the third frame portion 2230 away from the accommodating space form the second side surface 20c.

[0079] Optional, such as Figure 5 As shown, in addition to the backplate 210 and the frame 220, the backlight module 20 may also include optical film 230, reflective sheet 240, and light guide plate (LGP) 250 disposed within the aforementioned accommodating space. The reflective sheet 240, light guide plate 250, and optical film 230 are sequentially stacked along a direction away from the base plate 2110. Furthermore, the backlight module 20 may also include foam disposed between the first frame portion 2210 and the second substrate 120, and foam disposed between the third frame portion 2230 and the second substrate 120.

[0080] In one possible implementation, the display module further includes a first polarizer and a second polarizer. The first polarizer is disposed on the side of the first substrate 110 away from the second substrate 120, and the second polarizer is disposed between the second substrate 120 and the backlight module 20. It is understood that, in order to allow the flip-chip film 30 to extend directly from the fan-out line 110 to the back surface of the backlight module 20, the size of the second polarizer can be the same as or slightly smaller than the size of the second substrate 120. In a specific implementation, the orthographic projection of the second substrate 120 in the first plane needs to cover the orthographic projection of the second polarizer in the first plane.

[0081] Based on the same inventive concept, a second aspect of this disclosure provides a method for manufacturing a display module, the display module having a display area and a fan-out area located on one side of the display area, such as... Figure 9 As shown, the method for manufacturing the display module includes the following steps:

[0082] Step S101: Provide a display panel, the display panel including a first substrate, a liquid crystal layer and a second substrate stacked in sequence, a fan-out line is provided in the fan-out area on the side of the first substrate facing the second substrate, the orthographic projection of the second substrate and the liquid crystal layer in a first plane does not overlap with the orthographic projection of the fan-out area in the first plane, the first plane is a plane parallel to the display panel.

[0083] Step S102: Assemble the display panel and the backlight module. The backlight module is disposed on the side of the second substrate away from the first substrate. The backlight module includes a first bottom surface disposed opposite to the second substrate and a first side surface located between the second substrate and the first bottom surface. The angle between the first side surface and the first bottom surface is an obtuse angle.

[0084] Step S103: The display panel and the printed circuit board are bonded using a flip-chip film. The flip-chip film includes a first region, a second region, and a third region. The first region is located on the side of the fan-out line facing the second substrate and is connected to the fan-out line. The third region is located on the side of the first bottom surface away from the display panel. The second region overlaps and contacts the first side surface, and one end of the second region is connected to the end of the first region near the display area, while the other end extends to the side of the first bottom surface away from the display panel and is connected to the third region. The printed circuit board is located on the side of the first bottom surface away from the display panel and is bonded to the third region.

[0085] Optionally, the display module may further include a first polarizer and a second polarizer. The first polarizer is disposed on the side of the first substrate away from the second substrate, and the second polarizer is disposed between the second substrate and the backlight module.

[0086] In related technologies, when using the COF packaging structure, the packaging process is as follows: first, a polarizer is attached to the display panel, then the OLB (COF & PCB Bonding) process is performed, which is to use a flip-chip film to bond the display panel and the printed circuit board, and finally the Ass'y process is performed, which is to assemble the backlight module.

[0087] The display module of this disclosure has a clearance space formed on the backlight module for the flip-chip film to pass through. Therefore, its packaging process can be as follows: first, attach the first polarizer and the second polarizer to the display panel, then perform the Ass'y process, that is, assemble the display panel and the backlight module, and finally perform the OLB process, that is, finally use the flip-chip film to bond the display panel and the printed circuit board.

[0088] Based on the same inventive concept, a third aspect of this disclosure provides a display device, including the display panel described above. Exemplarily, the display device can be any product or component with display functionality, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator; this embodiment does not limit this to any particular type.

[0089] Obviously, the above embodiments of this disclosure are merely examples for clearly illustrating this disclosure, and are not intended to limit the implementation of this disclosure. For those skilled in the art, other variations or modifications can be made based on the above description. It is impossible to exhaustively list all implementation methods here. Any obvious variations or modifications derived from the technical solutions of this disclosure are still within the protection scope of this disclosure.

Claims

1. A display module, characterized in that, The display module has a display area and a fan-out area located on one side of the display area, and the display module includes: The display panel includes a first substrate, a liquid crystal layer, and a second substrate stacked sequentially. A fan-out line is provided in the fan-out area on the side of the first substrate facing the second substrate. The orthographic projections of the second substrate and the liquid crystal layer in a first plane do not overlap with the orthographic projections of the fan-out area in the first plane. The first plane is a plane parallel to the display panel. A backlight module is disposed on the side of the second substrate away from the first substrate. The backlight module includes a first bottom surface disposed opposite to the second substrate and a first side surface located between the second substrate and the first bottom surface. The angle between the first side surface and the first bottom surface is an obtuse angle. A flip-chip film, comprising a first region, a second region, and a third region, wherein the first region is disposed on the side of the fan-out line facing the second substrate and connected to the fan-out line, the third region is disposed on the side of the first bottom surface away from the display panel, the second region overlaps and contacts the first side surface, and one end of the second region is connected to the end of the first region near the display area, and the other end extends to the side of the first bottom surface away from the display panel and is connected to the third region; The orthographic projection of the first side surface in the first plane overlaps with the first region in the second direction, and the first region is the distribution area of ​​the orthographic projection of the fan-out area in the first plane in the second direction; The backlight module further includes a second side surface located between the second substrate and the first bottom surface. The second side surface is perpendicular to the first bottom surface, and the orthographic projection of the second side surface in the first plane does not overlap with the first region in the second direction. In the second direction, the backlight module has a first side surface in the area where a flip-chip film is provided, and a second side surface in the area where no flip-chip film is provided.

2. The display module according to claim 1, characterized in that, The display area includes a first edge and a second edge opposite to each other in a first direction. The fan-out area is disposed on the side of the first edge away from the display area. The fan-out area includes a plurality of sub-fan-out areas spaced apart along a second direction. The fan-out line is disposed in the sub-fan-out area on the side of the first substrate facing the second substrate. The display module includes a plurality of flip-chip films, one flip-chip film corresponding to one sub-fan-out area. The second direction is perpendicular to the first direction.

3. The display module according to claim 2, characterized in that, Both the first side and the second side include a first end that is close to the display panel and a second end that is far away from the display panel. The first end of the second side is flush with the boundary line of the fan-out area away from the display area in a first direction. The distance between the first end of the first side and the display area in the first direction is less than the distance between the first end of the second side and the display area in the first direction. The third direction is perpendicular to the first direction and the second direction.

4. The display module according to claim 2, characterized in that, The backlight module includes a back plate and a frame. The back plate includes a bottom plate and a first side plate disposed on the edge of the bottom plate. The bottom plate is disposed opposite to the second substrate. The first side plate is disposed between the second substrate and the bottom plate. The included angle between the bottom plate and the first side plate is an obtuse angle. The second substrate, the first side plate, and the bottom plate form an accommodating space. The frame includes a first frame portion disposed between the first side plate and the second substrate. The first frame portion and the surface of the first side plate away from the accommodating space form the first side surface. The surface of the bottom plate away from the second substrate forms the first bottom surface.

5. The display module according to claim 4, characterized in that, The back plate further includes a second side plate disposed on the edge of the base plate, the second side plate being perpendicular to the base plate. The frame further includes a second frame portion disposed on the side of the second side plate away from the accommodating space and a third frame portion disposed between the second side plate and the second substrate. The surfaces of the second frame portion and the third frame portion away from the accommodating space form the second side surface.

6. The display module according to claim 2, characterized in that, The display module also includes a printed circuit board, which is disposed on the side of the first bottom surface away from the display panel, and the printed circuit board is bonded to the third region.

7. The display module according to claim 6, characterized in that, The printed circuit board includes a first printed circuit board, a second printed circuit board, and a main control circuit board. The first printed circuit board is bonded to a third region of a plurality of flip-chip films on one side of the center line of the second direction, and the second printed circuit board is bonded to a third region of a plurality of flip-chip films on the other side of the center line of the second direction. The main control circuit board is connected to the first printed circuit board and the second printed circuit board via a flexible flat cable.

8. The display module according to claim 1, characterized in that, The display module also includes a driver chip, and the third region includes a chip area, in which the driver chip is integrated.

9. The display module according to claim 1, characterized in that, The display module further includes a first polarizer and a second polarizer. The first polarizer is disposed on the side of the first substrate away from the second substrate, and the second polarizer is disposed between the second substrate and the backlight module.

10. A method for manufacturing a display module, characterized in that, The display module has a display area and a fan-out area located on one side of the display area. The method for manufacturing the display module includes the following steps: A display panel is provided, the display panel comprising a first substrate, a liquid crystal layer and a second substrate stacked in sequence, a fan-out line being provided in the fan-out area on the side of the first substrate facing the second substrate, the orthographic projection of the second substrate and the liquid crystal layer in a first plane not overlapping the orthographic projection of the fan-out area in the first plane, the first plane being a plane parallel to the display panel. The display panel and the backlight module are assembled. The backlight module is disposed on the side of the second substrate away from the first substrate. The backlight module includes a first bottom surface disposed opposite to the second substrate and a first side surface located between the second substrate and the first bottom surface. The angle between the first side surface and the first bottom surface is an obtuse angle. The display panel and the printed circuit board are bonded using a flip-chip film. The flip-chip film includes a first region, a second region, and a third region. The first region is located on the side of the fan-out line facing the second substrate and is connected to the fan-out line. The third region is located on the side of the first bottom surface away from the display panel. The second region overlaps and contacts the first side surface, and one end of the second region is connected to the end of the first region near the display area, while the other end extends to the side of the first bottom surface away from the display panel and is connected to the third region. The printed circuit board is located on the side of the first bottom surface away from the display panel and is bonded to the third region. The orthographic projection of the first side surface in the first plane overlaps with the first region in the second direction, and the first region is the distribution area of ​​the orthographic projection of the fan-out area in the first plane in the second direction; The backlight module further includes a second side surface located between the second substrate and the first bottom surface. The second side surface is perpendicular to the first bottom surface, and the orthographic projection of the second side surface in the first plane does not overlap with the first region in the second direction. In the second direction, the backlight module has a first side surface in the area where a flip-chip film is provided, and a second side surface in the area where no flip-chip film is provided.

11. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 9.

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