Important commodity circulation traceability management system and method

Abstract

The invention discloses an important commodity circulation traceability management system and method, and relates to the field of data analysis, and the main scheme is as follows: calculating a quality index Z according to a chip and screen matching index ZA, an assembly quality retention index ZB, a transportation quality index ZC and an after-sales and material quality index ZD; and the product quality grade is judged according to the quality index Z and the quality grade threshold set, and a circulation management method is determined, so that the problems that the accuracy of evaluating the product quality is reduced and the pertinence of formulating a circulation strategy is influenced due to relatively single collected data are solved, and the qualification rate grade of the product is judged according to the product qualification rate Y and the qualification rate grade threshold set. The traceability management method is determined according to the qualified rate grade of the product, decision support can be provided for enterprises, and the problem that the accuracy of selection of the traceability method is reduced due to lack of specific quantitative standards is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of data analysis, and in particular to an important commodity circulation traceability management system and method. Background Art

[0002] In the field of smart electronic products, such as mobile phones, laptops, and tablets, traceability management of information such as product assembly, production, and sales channels can effectively ensure product quality, and conduct targeted recalls and processing when product quality problems occur.

[0003] The traditional method of circulation traceability management of smart products is to collect information on key parts of smartphones, such as quality inspection results of core components such as chips, screens, and cameras, evaluate product quality based on the information on key parts, and determine the circulation traceability management method.

[0004] The existing technology still has the following shortcomings: the collected data is relatively single, which leads to reduced accuracy in assessing product quality and affects the targeted formulation of circulation strategies. At the same time, there is a lack of specific quantitative standards, which leads to reduced accuracy in the selection of traceability methods. Summary of the invention

[0005] 1. Technical issues to be resolved In view of the deficiencies in the prior art, the present invention provides a method for tracing the circulation of an important commodity, calculates a quality index Z according to a chip and screen matching index ZA, an assembly quality retention index ZB, a transportation quality index ZC and an after-sales and material quality index ZD, judges the product quality grade according to the quality index Z and a quality grade threshold set, and determines a circulation management method according to the judgment result, thereby solving the problem that the accuracy of evaluating product quality is reduced due to the relatively single collected data and that the pertinence of formulating circulation strategies is affected, and the qualified rate grade of the product is judged and the traceability management method is determined according to the product qualified rate Y and the qualified rate grade threshold set, thereby solving the problem that the accuracy of selecting a tracing method is reduced due to the lack of specific quantitative standards.

[0006] (II) Technical solution To achieve the above objectives, the present invention is implemented through the following technical solutions: A method for tracing the circulation of important commodities, comprising the following steps: Step 1: Collect product chip data, screen data, assembly data, function data, transportation data, material data and after-sales data; Step 2: Calculate the chip quality index WA based on the chip data, and calculate the chip and screen matching index ZA based on the chip quality index WA and the screen data; calculate the assembly process index WB based on the assembly data, calculate the assembly quality index WC based on the assembly process index WB and the function data, and calculate the assembly quality retention index ZB based on the assembly quality index WC and the transportation data; calculate the transportation quality index ZC based on the transportation data; calculate the material risk index WE based on the material data, and calculate the after-sales and material quality index ZD based on the after-sales data and the material risk index WE; calculate the quality index Z based on the chip and screen matching index ZA, the assembly quality retention index ZB, the transportation quality index ZC, and the after-sales and material quality index ZD; preset a set of quality grade thresholds; judge the product quality grade based on the quality index Z and the quality grade threshold set; determine the circulation management method based on the judgment result; Step 3: According to the method of steps 1-2, determine whether the quality of all products is qualified; count the number of qualified products Y1 and the number of unqualified products Y2; calculate the product qualification rate Y based on the number of qualified products Y1 and the number of unqualified products Y2; preset the qualification rate level threshold set; determine the product qualification rate level based on the product qualification rate Y and the qualification rate level threshold set, and determine the traceability management method based on the product qualification rate level.

[0007] In the preferred embodiment of the above-mentioned important commodity circulation traceability management method: the method for calculating the chip and screen matching index ZA is: Chip data includes running speed score AA, operation change rate AB a , the number of qualified chips in the batch AC, the total number of tested chips in the batch AD and the number of pixels processed by the chip per second AE; The chip quality index WA is calculated based on the chip data, and the formula is: Among them, AB a is the chip's operational change rate at the ath temperature value, a is the serial number corresponding to different temperature values, and its value is [1, b]; b is the total number of different temperature values, and its value is a positive integer; Screen data includes screen response time BA and screen pixel number BB; The chip and screen matching index ZA is calculated based on the chip quality index WA and screen data, and the formula is: Among them, ɑ1 is the weight coefficient of the chip and screen speed matching index, and its value is 0.3~0.7; ɑ2 is the weight coefficient of the chip and screen computing power matching index, and its value is 0.3~0.7; and ɑ1+ɑ2=1.

[0008] In the preferred embodiment of the above-mentioned important commodity circulation traceability management method: the method for calculating the assembly quality index WC is: Assembly data includes the number of standard processes that the product batch meets (CA), the total number of assembly processes (CB), and the working hours of the assembly personnel (CC). d , the number of defective products assembled by assemblers CD d Total number of products assembled by assemblers CE d ; The assembly process indicator WB is calculated based on the assembly data, and the formula is: Among them, CC d is the working time of the dth assembler, d is the serial number corresponding to different assemblers, and its value is [1, f]; f is the total number of assemblers, and its value is a positive integer; CD d The number of defective products assembled by the dth assembler; CE d The total number of products assembled by the dth assembler; min(CD d / CE d ) is the minimum value of the assembly defect rate among all assemblers; Functional data includes the number of functional test qualified items DA and the total number of functional test items DB; The assembly quality index WC is calculated based on the assembly process index WB and functional data, and the formula is: .

[0009] In the preferred embodiment of the important commodity circulation traceability management method mentioned above: the method for calculating the assembly quality retention index ZB is: The transportation data includes the number of products with assembly structure damage EA and the total number of transported products EB after transportation of the product batch; The assembly quality retention index ZB is calculated based on the assembly quality index WC and transportation data, and the formula is: .

[0010] In the preferred embodiment of the above-mentioned important commodity circulation traceability management method, the method for calculating the transportation quality index ZC is: The transport data also includes the transport temperature FA of the product batch h , Transportation humidity FB h , Maximum vibration intensity FC h And the product can withstand the maximum vibration intensity FD; The transport quality indicator ZC is calculated based on transport data according to the following formula: Among them, FA h is the transport temperature during the hth transport, h is the number of different transports, and its value is [1, i]; i is the total number of transports, and its value is a positive integer; FB h is the transport humidity during the hth transport; FC h is the maximum vibration intensity during the hth transport.

[0011] In the preferred embodiment of the above-mentioned important commodity circulation traceability management method, the method for calculating the material risk index WE is: Material data include supplier change rate score HA, qualified supply material quantity HB, total supply material quantity HC, on-time delivery number HD and total delivery number HE; The material risk index WE is calculated based on the material data according to the formula: .

[0012] In the preferred embodiment of the above-mentioned important commodity circulation traceability management method: the method for calculating the after-sales and material quality index ZD is: After-sales data includes the number of after-sales repairs per unit time, GA, the number of products with recurrent faults, GB, and the total sales volume, GC; The after-sales and material quality index ZD is calculated based on the after-sales data and the material risk index WE, and the formula is: .

[0013] In the preferred embodiment of the above-mentioned important commodity circulation traceability management method: the method for determining the product quality grade is: The quality index Z is calculated based on the chip and screen matching index ZA, the assembly quality retention index ZB, the transportation quality index ZC and the after-sales and material quality index ZD. The formula is: Among them, β1 is the weight coefficient of the chip and screen matching index ZA, which is 0.2-0.4; β2 is the weight coefficient of the assembly quality retention index ZB, which is 0.2-0.3; β3 is the weight coefficient of the transportation quality index ZC, which is 0.2-0.3; β4 is the weight coefficient of the after-sales and material quality index ZD, which is 0.3-0.4; and β1+β2+β3+β4=1; The quality level threshold set includes a high quality level threshold ZG and a low quality level threshold ZD; The product quality level is determined based on the quality indicator Z and the quality level threshold set. The standards are: When it is a high quality grade, select circulation management method 1; When the quality level is medium, choose circulation management method 2; When the quality level is low, select circulation management method three.

[0014] In the preferred embodiment of the above-mentioned important commodity circulation traceability management method: the method for judging the product qualification rate level is: The product qualification rate Y is calculated based on the number of qualified products Y1 and the number of unqualified products Y2, and the formula is: The pass rate level threshold set includes a high pass rate level threshold XG and a low pass rate level threshold XD; The product qualification rate Y and the qualification rate level threshold set are used to determine the product qualification rate level. The standards are as follows: When the pass rate is high, select traceability management method 1; When the pass rate is medium, select traceability management method 2; When the pass rate is low, select traceability management method three.

[0015] The present invention also discloses an important commodity circulation traceability management system, including: Data collection module, used to collect product chip data, screen data, assembly data, function data, transportation data, material data and after-sales data; The indicator calculation module can calculate the chip quality indicator WA based on the chip data, and calculate the chip and screen matching indicator ZA according to the chip quality indicator WA and the screen data; calculate the assembly process indicator WB based on the assembly data, calculate the assembly quality indicator WC according to the assembly process indicator WB and the function data, and calculate the assembly quality retention index ZB according to the assembly quality indicator WC and the transportation data; calculate the transportation quality indicator ZC based on the transportation data; calculate the material risk indicator WE based on the material data, and calculate the after-sales and material quality indicator ZD according to the after-sales data and the material risk indicator WE; calculate the quality indicator Z according to the chip and screen matching indicator ZA, the assembly quality retention indicator ZB, the transportation quality indicator ZC and the after-sales and material quality indicator ZD; preset a set of quality grade thresholds; judge the product quality grade according to the quality indicator Z and the quality grade threshold set; determine the circulation management method according to the judgment result; The judgment module is used to judge whether the quality of all products is qualified according to the methods of the data acquisition module and the indicator calculation module; count the number of qualified products Y1 and the number of unqualified products Y2; calculate the product qualification rate Y based on the number of qualified products Y1 and the number of unqualified products Y2; preset the qualification rate level threshold set; judge the product qualification rate level based on the product qualification rate Y and the qualification rate level threshold set, and determine the traceability management method based on the product qualification rate level.

[0016] (III) Beneficial effects The present invention provides a method for tracing the circulation of important commodities, which has the following beneficial effects: (1) By collecting the product's chip data, screen data, assembly data, function data, transportation data, material data, and after-sales data, it can provide multi-dimensional data for evaluating product quality and improve the accuracy of the evaluation.

[0017] (2) The chip and screen matching index ZA is calculated based on chip data and screen data, which can measure the degree of adaptation between chip processing power and screen display performance, and help to discover potential compatibility problems. The assembly quality retention index ZB is calculated based on assembly data, functional data and transportation data, which can realize the whole process monitoring of product quality from production assembly to transportation process, and accurately locate the link where quality problems occur. The transportation quality index ZC is calculated based on transportation data, which can quantitatively evaluate key factors such as transportation temperature, transportation humidity, and maximum vibration intensity during transportation, and monitor the quality status of each batch of product transportation in real time, so as to optimize the transportation route and transportation method. The after-sales and material quality index ZD is calculated based on material data and after-sales data, which can systematically understand the performance of product quality throughout the life cycle and discover potential quality risks. The quality index Z is calculated based on the chip and screen matching index ZA, the assembly quality retention index ZB, the transportation quality index ZC and the after-sales and material quality index ZD. The product quality grade is judged based on the quality index Z and the quality grade threshold set, and the circulation management method is determined based on the judgment result. This solves the problem that the collected data is relatively single, resulting in a decrease in the accuracy of product quality assessment and affecting the targeted formulation of circulation strategies.

[0018] (3) The product qualification level is determined based on the product qualification rate Y and the qualification level threshold set. The traceability management method is determined based on the product qualification level. This can provide decision support for enterprises and solve the problem of lack of specific quantitative standards, which leads to reduced accuracy in the selection of traceability methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the working steps of an important commodity circulation traceability management method of the present invention; Figure 2 A schematic diagram of the steps for calculating the assembly quality retention index ZB in an important commodity circulation traceability management method of the present invention; Figure 3 This is a schematic diagram of the structure of an important commodity circulation traceability management system of the present invention. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] See also Figure 1-Figure 2 The present invention provides a method for tracing the circulation of important commodities, comprising the following steps: Step 1: Collect the product’s chip data, screen data, assembly data, function data, transportation data, material data, and after-sales data.

[0022] Combined with the content of step 1: By collecting the product's chip data, screen data, assembly data, functional data, transportation data, material data and after-sales data, it is possible to provide multi-dimensional data for evaluating product quality and improve evaluation accuracy.

[0023] Step 2: Calculate the chip quality index WA based on the chip data, and calculate the chip and screen matching index ZA according to the chip quality index WA and the screen data; calculate the assembly process index WB based on the assembly data, calculate the assembly quality index WC according to the assembly process index WB and the functional data, and calculate the assembly quality retention index ZB according to the assembly quality index WC and the transportation data; calculate the transportation quality index ZC based on the transportation data; calculate the material risk index WE based on the material data, and calculate the after-sales and material quality index ZD according to the after-sales data and the material risk index WE; calculate the quality index Z according to the chip and screen matching index ZA, the assembly quality retention index ZB, the transportation quality index ZC and the after-sales and material quality index ZD; preset a set of quality grade threshold values; judge the product quality grade according to the quality index Z and the quality grade threshold value set; determine the circulation management method according to the judgment result.

[0024] Step 2 includes the following steps: Step 201: The method for calculating the chip and screen matching index ZA is: Chip data includes running speed score AA, operation change rate AB a , the number of qualified chips in the batch AC, the total number of tested chips in the batch AD and the number of pixels AE processed by the chip per second.

[0025] It should be noted that the running speed score AA is an indicator used to evaluate the speed of the chip, reflecting the efficiency of the chip task execution. It is measured by existing chip performance testing software such as AnTuTu and Geekbench. These software will evaluate the running speed of the chip through a series of preset test items such as CPU single-core and multi-core performance tests and GPU graphics processing capability tests, and give a quantitative score, which is used as the running speed score AA. Operational change rate AB a It is used to measure the stability of the chip's computing performance under different temperature conditions. The determination method is: place the chip in a constant temperature box with precise temperature control, set different temperature values, and use existing professional testing equipment such as logic analyzers to perform computing tests on the chip after each temperature stabilizes, and obtain the chip's computing performance index RA at the ath temperature. a And the computing performance index RA at 25°C, the unit of the computing performance index is Hz, according to the formula (|RA a -RA| / RA) to calculate the operation change rate AB a . The number AC of qualified chips in the batch refers to the number of chips that meet the quality standards after quality inspection in a complete chip production batch. The total number AD of tested chips in the batch refers to the total number of chips used for quality inspection after the production of the batch, including qualified and unqualified chips. The number AC of qualified chips in the batch and the total number AD of tested chips in the batch are used to measure the quality level of the chip production batch, which can be obtained by referring to the production batch report or quality inspection record provided by the chip manufacturer. The number AE of pixels processed per second by the chip is used to measure the graphics processing capability of the chip. It is obtained by using existing graphics performance testing software such as 3DMark to simulate different game screens, video playback, etc., and using the built-in monitoring tools in the software to obtain the number of pixels processed per second by the chip in these scenarios, and calculating the average number of pixels processed per second in different scenarios as the number AE of pixels processed per second by the chip.

[0026] The chip quality index WA is calculated based on the chip data, and the formula is: Among them, AB a is the operation change rate of the chip at the ath temperature value, a is the serial number corresponding to different temperature values, and its value is [1, b]; b is the total number of different temperature values, and its value is a positive integer.

[0027] It should be noted that this formula takes into account the chip's comprehensive performance in terms of operating speed stability, quality pass rate, and pixel processing to obtain the chip quality index WA. The higher the chip quality index WA, the better the product quality.

[0028] The screen data includes the screen response time BA and the screen pixel number BB.

[0029] It should be noted that the screen response time screen data includes the screen response time BA and the screen pixel number BB, which refers to the time required for the screen to receive the display signal and the pixel actually completes the color change, and can be obtained by referring to the product specification manual. The screen pixel number BB refers to the total number of pixels contained in the horizontal and vertical directions of the screen, which reflects the resolution of the screen. The acquisition method is: obtain the pixels contained in the horizontal and vertical directions of the screen by referring to the product specification manual, and calculate the product of the pixels contained in the horizontal direction of the screen and the pixels contained in the vertical direction of the screen as the screen pixel number BB.

[0030] The chip and screen matching index ZA is calculated based on the chip quality index WA and screen data, and the formula is: Among them, ɑ1 is the weight coefficient of the chip and screen speed matching index, which takes a value of 0.3 to 0.7, and is determined according to the importance of the chip quality index WA to the chip and screen matching index ZA; ɑ2 is the weight coefficient of the chip and screen computing power matching index, which takes a value of 0.3 to 0.7, and is determined according to the importance of the chip and screen computing power matching index to the chip and screen matching index ZA; and ɑ1+ɑ2=1.

[0031] It should be noted that this formula obtains the chip and screen matching index ZA by comprehensively considering the matching capabilities of the chip and screen in terms of speed and screen computing power.

[0032] Step 202: The method for calculating the assembly quality index WC is: Assembly data includes the number of standard processes that the product batch meets (CA), the total number of assembly processes (CB), and the working hours of the assembly personnel (CC). d , the number of defective products assembled by assemblers CD d Total number of products assembled by assemblers CE d .

[0033] It should be noted that the number of standard processes CA that the product batch meets refers to the number of processes that the product has completed according to the pre-set standard operating procedures in a specific production batch. It reflects the degree to which the processes are completed according to the correct standards during the assembly process of the batch of products. The method of obtaining it is: set up quality inspection points on the production line, and conduct process inspections on the products that pass through. The inspectors use checklists or electronic recording equipment to record whether the product has completed this process and whether it meets the standards when completing this process. The processes that have been completed and meet the standards for all products in the batch are counted and summarized to obtain the number of standard processes CA that the product batch meets. The total number of assembly processes CB refers to the sum of all assembly processes required to produce the product. The method of obtaining it is: the company's engineering department will develop a process flow chart for product assembly and list each assembly step in detail. The total number of assembly processes CB is obtained by counting the number of process nodes in the process flow chart. Assembler working hours CC d It refers to the length of time that employees actually spend working during the production process. The method of obtaining it is as follows: obtain the employees' daily working hours and off-duty times by checking the attendance punch-in records, calculate the difference between the employees' daily off-duty time and working time, and summarize them to obtain the assembly personnel's working hours CC d . Number of defective products assembled by assemblers CD d It refers to the number of products that a certain assembler has assembled within a certain period of time and are judged to be substandard after quality inspection. It is used to evaluate the work quality of the assembler. The method of obtaining it is as follows: after the product is assembled, a quality inspection will be carried out to record the inspection results of each product. The number of unqualified products assembled by the employee will be screened out based on the inspection results, and the number of defective products assembled by the assembler will be used as the number of defective products assembled by the assembler CD d . Total number of products assembled by assemblers CE d It indicates the total number of products assembled by an assembler within a certain period of time. The method of obtaining it is as follows: after the product completes the last process or passes the quality inspection, the production management system will count the product into the total production volume of the assembler. The total number of products assembled by the assembler can be obtained by checking the production management system records. d .

[0034] The assembly process indicator WB is calculated based on the assembly data, and the formula is: Among them, CC d is the working time of the dth assembler, d is the serial number corresponding to different assemblers, and its value is [1, f]; f is the total number of assemblers, and its value is a positive integer; CD d The number of defective products assembled by the dth assembler; CE d The total number of products assembled by the dth assembler; min(CD d / CE d ) is the minimum value of the assembly defect rate among all assemblers.

[0035] It should be noted that this formula comprehensively considers the standardization of the process and the assembly quality of the employees to obtain the assembly process index WB. The higher the standardization of the process and the assembly quality of the employees, the higher the assembly process index WB.

[0036] The functional data includes the number of functional test qualified items DA and the total number of functional test items DB.

[0037] It should be noted that the number of functional test qualified items DA refers to the number of items that meet the expected functional standards among all test items, and the total number of functional test items DB refers to the sum of all test items set to comprehensively evaluate the functions of electronic products. The method of obtaining the number of functional test qualified items DA and the total number of functional test items DB is: obtain the test plan and test case documents. The test plan and test case documents are test description documents formulated by the manufacturer based on the product to test whether the product is qualified. They contain the specific content, test steps, expected results and judgment criteria of each functional test item. By counting the number of functional test item items in the test case document, the number of functional test qualified items DA can be obtained. In the actual testing process, each item is tested according to the test case. When the actual test result of a project meets the qualified standard specified in the test case, it is counted as a qualified item. After the test is completed, the number of qualified items is counted as the number of functional test qualified items DB.

[0038] The assembly quality index WC is calculated based on the assembly process index WB and functional data, and the formula is: It should be noted that this formula obtains the assembly quality index WC by comprehensively considering the assembly process index WB and the functional test pass rate. The higher the assembly process index WB and the functional test pass rate, the higher the assembly quality index WC.

[0039] Step 203: The method for calculating the assembly quality retention index ZB is: The transportation data includes the number EA of products with assembly structure damage after transportation and the total number EB of products transported.

[0040] It should be noted that the number of products with damaged assembly structure EA refers to the specific number of products in a specific transport batch of electronic products that have damaged assembly structure due to various transportation factors such as vibration, collision, extrusion, temperature and humidity changes after transportation. Assembly structure damage includes screen damage, shell damage, frame damage, etc. The total number of transported products EB refers to the total number of electronic products transported in the same transport batch. The method for obtaining the number of products with damaged assembly structure EA and the total number of transported products EB is as follows: before the products are loaded and transported, the total number of transported products is counted and the value is used as the total number of transported products EB. At the same time, each product is inspected for appearance and function, and the number of products without assembly structure damage EBA is recorded. After the products arrive at the destination, all products in the transport batch are inspected again to check whether the products have assembly structure damage and record the number of products without assembly structure damage EBB. The difference between EBA and EBB is calculated as the number of products with damaged assembly structure EA.

[0041] The assembly quality retention index ZB is calculated based on the assembly quality index WC and transportation data, and the formula is: It should be noted that this formula obtains the assembly quality retention index ZB by comprehensively considering the assembly quality index WC and the impact of the transportation process on the assembly quality.

[0042] Step 204: The method for calculating the transport quality index ZC is: The transport data also includes the transport temperature FA of the product batch h , Transportation humidity FB h , Maximum vibration intensity FC h And the product can withstand the maximum vibration intensity FD.

[0043] It should be noted that the transport temperature FA h It refers to the temperature of the internal environment of trucks, airplanes, ships and other transportation vehicles during the transportation of electronic products, in degrees Celsius, and the transportation humidity FB h Refers to the air humidity inside the environment of trucks, airplanes, ships and other transportation tools during the transportation of electronic products. The unit is %, and the transportation temperature is FA. h and transport humidity FB h The acquisition method is: place a temperature and humidity recorder in the transport vehicle, which can automatically record the temperature and humidity changes over a period of time and store the data. After the transportation is completed, read the data, obtain the temperature and humidity data at different time points during the transportation process, and calculate their average values ​​respectively as the transportation temperature FA h and transport humidity FB h . Maximum vibration intensity FC hIt refers to the most severe vibration experienced by the product during transportation. The method of obtaining it is as follows: install a vibration sensor in the transport vehicle. The vibration sensor can record the change of vibration intensity during transportation and store the maximum value. Read the data after transportation. By connecting the vibration sensor to read the data, the maximum vibration intensity FC is obtained. h The maximum vibration intensity that a product can withstand (FD) refers to the maximum vibration intensity that an electronic product can withstand without structural damage or performance degradation. It can be obtained by referring to the product manual or technical specification.

[0044] The transport quality indicator ZC is calculated based on transport data according to the following formula: Among them, FA h is the transport temperature during the hth transport, h is the number of different transports, and its value is [1, i]; i is the total number of transports, and its value is a positive integer; FB h is the transport humidity during the hth transport; FC h is the maximum vibration intensity during the hth transport.

[0045] It should be noted that this formula obtains the transportation quality index ZC by comprehensively considering the deviation between the actual temperature and actual humidity during product transportation and the suitable transportation temperature and suitable transportation humidity, as well as the deviation between the actual vibration intensity during transportation and the maximum vibration intensity that the product can withstand.

[0046] Step 205: The method for calculating the material risk index WE is: Material data include supplier change rate score HA, qualified supply material quantity HB, total supply material quantity HC, on-time delivery number HD and total delivery number HE.

[0047] It should be noted that the supplier change rate score HA is used to measure the stability of the supplier. The determination method is: count the number of product specification changes and production process adjustments of the supplier within one year. When the number of product specification changes is 0, the specification change score is 1 point; when the number of product specification changes is 1 to 2 times, the specification change score is 3 points; when the number of product specification changes exceeds 2 times, the specification change score is 5 points; when the number of production process adjustments is 0, the process change score is 1 point; when the number of production process adjustments is 1 to 2 times, the process change score is 3 points; when the number of production process adjustments exceeds 2 times, the process change score is 5 points; calculate the sum of the specification change score and the process change score as the change score; count the change score of each supplier and calculate its average value as the supplier change rate score HA. The qualified supply material quantity HB refers to the number of materials provided by the supplier that are determined to meet the quality standards after the enterprise's quality inspection. The total supply material quantity HC refers to the total number of materials provided by the supplier. The method of obtaining the qualified supply material quantity HB and the total supply material quantity HC is as follows: in the raw material receiving link of the enterprise, a quality inspection process is set up to inspect each batch of supply materials and generate an inspection report. The inspection report will record information such as the material name, material quantity, and inspection results. The number of materials with qualified inspection results in all inspection reports is counted as the qualified supply material quantity HB, and the material quantities in all inspection reports are summarized as the total supply material quantity HC. The number of on-time deliveries HD refers to the actual number of times the supplier delivers materials according to the time agreed in the contract. The total number of deliveries HE refers to the total number of deliveries made by the supplier, including on-time delivery and delayed delivery. The number of on-time deliveries HD and the total number of deliveries HE are obtained by checking the records of the procurement management software or warehouse management system. The management software or warehouse management system will record the supplier name, delivery date, delivery order number, cargo name, delivery quantity and other information, count all delivery records in the system as the total number of deliveries HE, compare the delivery date in each delivery record with the agreed delivery date on the purchase order, if the delivery date is earlier than or equal to the agreed delivery date on the purchase order, the delivery is judged to be on-time delivery, and all on-time delivery records are counted as the number of on-time deliveries HD.

[0048] The material risk index WE is calculated based on the material data according to the formula: It should be noted that the operating principle of this formula is: HB / HC is used to evaluate the quality of supplied materials, and HD / HC is used to evaluate the on-time delivery of suppliers. This formula obtains the material risk indicator WE by comprehensively considering the stability of suppliers, the quality rate of supplied materials and the on-time delivery rate.

[0049] Step 206: The method for calculating the after-sales and material quality index ZD is: After-sales data includes the number of after-sales repairs of products per unit time GA, the number of products with recurrent faults GB and the total sales quantity GC.

[0050] It should be noted that the number of after-sales repairs of products per unit time GA refers to the number of products that are returned to the after-sales repair department for repair due to failures or other quality problems within a month, a quarter or a year. It reflects the frequency of problems in the after-sales stage of the product and can intuitively reflect the stability and reliability of product quality. The method of obtaining it is: check the maintenance record system, which will record the product serial number, failure phenomenon, maintenance content and maintenance time of the product, and count the after-sales repair data of the repair time per unit time and summarize them as the number of after-sales repairs of products per unit time GA. The number of recurrent fault products GB refers to the number of products that have been returned to the after-sales repair department for repair again due to failures or other quality problems among the products that have been repaired. The method of obtaining it is: check the maintenance record system, count the after-sales repair data of the repair time per unit time, and filter out the number of product serial numbers that appear twice or more in the after-sales repair data as the number of recurrent fault products GB. The total sales quantity GC refers to the total sales volume of products in the same unit time, which is obtained by checking the sales record system.

[0051] The after-sales and material quality index ZD is calculated based on the after-sales data and the material risk index WE, and the formula is: It should be noted that the operating principle of this formula is: GA / GC is used to measure the after-sales failure rate of the product, and GB / GA is used to measure the failure recurrence rate of the product. This formula comprehensively considers the after-sales failure rate, failure recurrence rate and material risk of the product to obtain the after-sales and material quality index ZD.

[0052] Step 207: The method for determining the product quality level is: The quality index Z is calculated based on the chip and screen matching index ZA, the assembly quality retention index ZB, the transportation quality index ZC and the after-sales and material quality index ZD. The formula is: Among them, β1 is the weight coefficient of the chip and screen matching index ZA, which takes a value of 0.2~0.4, and is determined according to the importance of the chip and screen matching index ZA to the quality index Z; β2 is the weight coefficient of the assembly quality retention index ZB, which takes a value of 0.2~0.3, and is determined according to the importance of the assembly quality retention index ZB to the quality index Z; β3 is the weight coefficient of the transportation quality index ZC, which takes a value of 0.2~0.3, and is determined according to the importance of the transportation quality index ZC to the quality index Z; β4 is the weight coefficient of the after-sales and material quality index ZD, which takes a value of 0.3~0.4, and is determined according to the importance of the after-sales and material quality index ZD to the quality index Z; and β1+β2+β3+β4=1.

[0053] It should be noted that the formula obtains a linear combination of various indicators through a weighted formula, and further maps the quality indicator Z to between 0 and 1 by nonlinearly changing the linear combination through an exponential function, where e is the base of the natural logarithm in the exponential function.

[0054] The quality level threshold set includes a high quality level threshold ZG and a low quality level threshold ZD; The product quality level is determined based on the quality indicator Z and the quality level threshold set. The standards are: It should be noted that the method for determining the high quality level threshold ZG and the low quality level threshold ZD is: collect historical data of different electronic products and calculate the quality indicators of different electronic products according to the above method, screen out the higher 50% data and calculate their average and standard deviation, calculate the value of the average plus twice the standard deviation as the reference value of the high quality level threshold ZG, and calculate the value of the average minus twice the standard deviation as the reference value of the low quality level threshold ZD.

[0055] When it is a high quality grade, choose circulation management method 1, specifically: arrange more efficient circulation channels, such as choosing logistics partners with short transportation time and good transportation conditions, equipping with more advanced shockproof and moisture-proof packaging to ensure that products can reach the sales terminal quickly and safely, and at the same time give priority to allocating these products to retailers with good brand image and high sales service quality, such as large brand stores or high-end electronic product chains.

[0056] When the quality level is medium, choose circulation management method 2, which is: limit the circulation scope of unqualified products, use these products mainly in discount stores, second-hand markets or as promotional gifts, etc. At the same time, increase protective measures during transportation to prevent further deterioration of quality.

[0057] When the quality level is low, select circulation management method three, specifically: suspend the sale of low-quality products and recall the low-quality products that have been sold.

[0058] Combined with the contents of step 201 to step 207: The chip and screen matching index ZA is calculated based on chip data and screen data, which can measure the degree of adaptation between chip processing power and screen display performance, and help to discover potential compatibility problems. The assembly quality retention index ZB is calculated based on assembly data, functional data and transportation data, which can realize the whole process monitoring of product quality from production assembly to transportation process, and accurately locate the link where quality problems occur. The transportation quality index ZC is calculated based on transportation data, which can quantitatively evaluate key factors such as transportation temperature, transportation humidity, and maximum vibration intensity during transportation, and monitor the quality status of each batch of product transportation in real time, so as to optimize the transportation route and transportation method. The after-sales and material quality index ZD is calculated based on material data and after-sales data, which can systematically understand the performance of product quality throughout the life cycle and discover potential quality risks. The quality index Z is calculated based on the chip and screen matching index ZA, the assembly quality retention index ZB, the transportation quality index ZC and the after-sales and material quality index ZD. The product quality grade is judged according to the quality index Z and the quality grade threshold set, and the circulation management method is determined according to the judgment result, which solves the problem that the collected data is relatively single, resulting in a decrease in the accuracy of product quality assessment and affecting the pertinence of the formulation of circulation strategies.

[0059] Step 3: According to the method of step 1-step 2, determine whether the quality of all products is qualified; count the number of qualified products Y1 and the number of unqualified products Y2; calculate the product qualification rate Y based on the number of qualified products Y1 and the number of unqualified products Y2; preset the qualification rate level threshold set; determine the product qualification rate level based on the product qualification rate Y and the qualification rate level threshold set, and determine the traceability management method based on the product qualification rate level.

[0060] Step 3 includes the following steps: Step 301: The method for determining the product qualification rate level is: The product qualification rate Y is calculated based on the number of qualified products Y1 and the number of unqualified products Y2, and the formula is: It should be noted that this formula obtains the product qualification rate Y by calculating the ratio of the number of qualified products Y1 to the total products.

[0061] The pass rate level threshold set includes a high pass rate level threshold XG and a low pass rate level threshold XD.

[0062] It should be noted that the method for determining the high pass rate level threshold XG and the low pass rate level threshold XD is as follows: collect historical data of products of different brands and calculate their product pass rates, screen out 20% of data with higher pass rates and calculate their average value as the reference value of the high pass rate level threshold XG. Screen out 50% of data with higher pass rates and calculate their average value as the reference value of the low pass rate level threshold XD.

[0063] The product qualification rate Y and the qualification rate level threshold set are used to determine the product qualification rate level. The standards are as follows: When the pass rate level is high, choose traceability management method one, specifically: in terms of production records, a more concise recording method can be used, focusing on recording information on key processes and important components, and designing special traceability labels for high-quality products, such as high-end QR code labels or laser anti-counterfeiting labels with anti-counterfeiting functions. Consumers can obtain detailed product information by scanning or querying these labels, including the source of high-quality raw materials, advanced production process introductions, strict quality inspection links, etc., to show consumers the high quality of the products and enhance the added value and brand image of the products.

[0064] When the pass rate is medium, select traceability management method 2, specifically: focus on the production links that are likely to cause quality fluctuations and make detailed records, such as operators, operation time, parameters of quality inspection equipment, quality inspection results, etc., so that when quality problems occur, they can be quickly traced back to specific links.

[0065] When the pass rate is low, choose traceability management method three, specifically: conduct strict traceability records throughout the entire process, starting from the purchase of raw materials, and record in detail the supplier, purchase time, quality inspection report and other information of each component. In the production process, record the detailed operation of each process, including equipment parameters, operators, operation time, and the results and treatment measures of each quality inspection. Through complete traceability records, analyze the specific reasons for the low product quality level and make corrections.

[0066] Combined with the content of step 301: The qualified rate level of the product is judged according to the product qualified rate Y and the qualified rate level threshold set. The traceability management method is determined according to the qualified rate level of the product. This can provide decision support for the enterprise and solve the problem of lack of specific quantitative standards, which leads to reduced accuracy in the selection of traceability methods.

[0067] See also Figure 3 On the other hand, the present invention also discloses an important commodity circulation traceability management system, which is used to implement the above-mentioned important commodity circulation traceability management method, including: Data collection module, used to collect product chip data, screen data, assembly data, function data, transportation data, material data and after-sales data; The indicator calculation module can calculate the chip quality indicator WA based on the chip data, and calculate the chip and screen matching indicator ZA according to the chip quality indicator WA and the screen data; calculate the assembly process indicator WB based on the assembly data, calculate the assembly quality indicator WC according to the assembly process indicator WB and the function data, and calculate the assembly quality retention index ZB according to the assembly quality indicator WC and the transportation data; calculate the transportation quality indicator ZC based on the transportation data; calculate the material risk indicator WE based on the material data, and calculate the after-sales and material quality indicator ZD according to the after-sales data and the material risk indicator WE; calculate the quality indicator Z according to the chip and screen matching indicator ZA, the assembly quality retention indicator ZB, the transportation quality indicator ZC and the after-sales and material quality indicator ZD; preset a set of quality grade thresholds; judge the product quality grade according to the quality indicator Z and the quality grade threshold set; determine the circulation management method according to the judgment result; The judgment module is used to judge whether the quality of all products is qualified according to the methods of the data acquisition module and the indicator calculation module; count the number of qualified products Y1 and the number of unqualified products Y2; calculate the product qualification rate Y based on the number of qualified products Y1 and the number of unqualified products Y2; preset the qualification rate level threshold set; judge the product qualification rate level based on the product qualification rate Y and the qualification rate level threshold set, and determine the traceability management method based on the product qualification rate level.

[0068] The above embodiments may be implemented in whole or in part by software, hardware, firmware or any other combination thereof. When implemented using software, the above embodiments may be implemented in whole or in part in the form of a computer program product. A person of ordinary skill in the art may appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein may be implemented in electronic hardware or in combination with computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution.

[0069] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0070] The above description is only a specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application.

Claims

1. A method for tracing the origin of important commodity circulation, characterized by: include: Step 1: Collect product chip data, screen data, assembly data, function data, transportation data, material data and after-sales data; Step 2: Calculate the chip quality index WA based on the chip data, and calculate the chip and screen matching index ZA based on the chip quality index WA and the screen data; calculate the assembly process index WB based on the assembly data, calculate the assembly quality index WC based on the assembly process index WB and the functional data, and calculate the assembly quality retention index ZB based on the assembly quality index WC and the transportation data; Calculate the transportation quality index ZC based on the transportation data; calculate the material risk index WE based on the material data, and calculate the after-sales and material quality index ZD based on the after-sales data and the material risk index WE; calculate the quality index Z based on the chip and screen matching index ZA, the assembly quality retention index ZB, the transportation quality index ZC and the after-sales and material quality index ZD; preset the quality grade threshold set; judge the product quality grade based on the quality index Z and the quality grade threshold set; determine the circulation management method based on the judgment result; Step 3: According to the method of step 1-step 2, determine whether the quality of all products is qualified; count the number of qualified products Y1 and the number of unqualified products Y2; calculate the product qualification rate Y based on the number of qualified products Y1 and the number of unqualified products Y2; preset the qualification rate level threshold set; determine the product qualification rate level based on the product qualification rate Y and the qualification rate level threshold set, and determine the traceability management method based on the product qualification rate level.

2. According to claim 1, a method for tracing the source of important commodity circulation is characterized by: The method for calculating the chip and screen matching index ZA is: Chip data includes running speed score AA, operation change rate AB a , the number of qualified chips in the batch AC, the total number of tested chips in the batch AD and the number of pixels processed by the chip per second AE; The chip quality index WA is calculated based on the chip data, and the formula is: Among them, AB a is the chip's operational change rate at the ath temperature value, a is the serial number corresponding to different temperature values, and its value is [1, b]; b is the total number of different temperature values, and its value is a positive integer; Screen data includes screen response time BA and screen pixel number BB; The chip and screen matching index ZA is calculated based on the chip quality index WA and screen data, and the formula is: Among them, ɑ1 is the weight coefficient of the chip and screen speed matching index, and its value is 0.3~0.7; ɑ2 is the weight coefficient of the chip and screen computing power matching index, and its value is 0.3~0.7; and ɑ1+ɑ2=1.

3. The important commodity circulation traceability management method according to claim 2 is characterized by: The method for calculating the assembly quality index WC is: Assembly data includes the number of standard processes that the product batch meets (CA), the total number of assembly processes (CB), and the working hours of the assembly personnel (CC). d , the number of defective products assembled by assemblers CD d Total number of products assembled by assemblers CE d ; The assembly process indicator WB is calculated based on the assembly data, and the formula is: Among them, CC d is the working time of the dth assembler, d is the serial number corresponding to different assemblers, and its value is [1, f]; f is the total number of assemblers, and its value is a positive integer; CD d The number of defective products assembled by the dth assembler; CE d The total number of products assembled by the dth assembler; min(CD d / CE d ) is the minimum value of the assembly defect rate among all assemblers; Functional data includes the number of functional test qualified items DA and the total number of functional test items DB; The assembly quality index WC is calculated based on the assembly process index WB and functional data, and the formula is: 。 4. The important commodity circulation traceability management method according to claim 3 is characterized by: The method for calculating the assembly quality retention index ZB is: The transportation data includes the number of products with assembly structure damage EA and the total number of transported products EB after transportation of the product batch; The assembly quality retention index ZB is calculated based on the assembly quality index WC and transportation data, and the formula is: 。 5. The important commodity circulation traceability management method according to claim 4 is characterized by: The method for calculating the transport quality index ZC is: The transport data also includes the transport temperature FA of the product batch h , Transportation humidity FB h , Maximum vibration intensity FC h And the product can withstand the maximum vibration intensity FD; The transport quality indicator ZC is calculated based on transport data according to the following formula: Among them, FA h is the transport temperature during the hth transport, h is the number of different transports, and its value is [1, i]; i is the total number of transports, and its value is a positive integer; FB h is the transport humidity during the hth transport; FC h is the maximum vibration intensity during the hth transport.

6. The important commodity circulation traceability management method according to claim 5 is characterized by: The method for calculating the material risk index WE is: Material data include supplier change rate score HA, qualified supply material quantity HB, total supply material quantity HC, on-time delivery number HD and total delivery number HE; The material risk indicator WE is calculated based on the material data according to the formula: 。 7. The important commodity circulation traceability management method according to claim 6 is characterized by: The method for calculating the after-sales and material quality index ZD is: After-sales data includes the number of after-sales repairs per unit time, GA, the number of products with recurrent faults, GB, and the total sales volume, GC; The after-sales and material quality index ZD is calculated based on the after-sales data and the material risk index WE, and the formula is: 。 8. The important commodity circulation traceability management method according to claim 7 is characterized by: The method for judging product quality level is: The quality index Z is calculated based on the chip and screen matching index ZA, the assembly quality retention index ZB, the transportation quality index ZC and the after-sales and material quality index ZD. The formula is: Among them, β1 is the weight coefficient of the chip and screen matching index ZA, which is 0.2-0.4; β2 is the weight coefficient of the assembly quality retention index ZB, which is 0.2-0.3; β3 is the weight coefficient of the transportation quality index ZC, which is 0.2-0.3; β4 is the weight coefficient of the after-sales and material quality index ZD, which is 0.3-0.4; and β1+β2+β3+β4=1; The quality level threshold set includes a high quality level threshold ZG and a low quality level threshold ZD; The product quality level is determined based on the quality indicator Z and the quality level threshold set. The standards are: When it is a high quality grade, select circulation management method 1; When the quality level is medium, choose circulation management method 2; When the quality level is low, select circulation management method three.

9. The important commodity circulation traceability management method according to claim 8 is characterized by: The method for judging the product qualification rate level is: The product qualification rate Y is calculated based on the number of qualified products Y1 and the number of unqualified products Y2, and the formula is: The pass rate level threshold set includes a high pass rate level threshold XG and a low pass rate level threshold XD; The product qualification rate Y and the qualification rate level threshold set are used to determine the product qualification rate level. The standards are as follows: When the pass rate is high, select traceability management method 1; When the pass rate is medium, select traceability management method 2; When the pass rate is low, select traceability management method three.

10. An important commodity circulation traceability management system, characterized by: include: Data collection module, used to collect product chip data, screen data, assembly data, function data, transportation data, material data and after-sales data; An index calculation module, which can calculate the chip quality index WA based on the chip data, and calculate the chip and screen matching index ZA based on the chip quality index WA and the screen data; Calculate the assembly process index WB based on the assembly data, calculate the assembly quality index WC based on the assembly process index WB and the functional data, and calculate the assembly quality retention index ZB based on the assembly quality index WC and the transportation data; Calculate the transportation quality index ZC based on the transportation data; calculate the material risk index WE based on the material data, and calculate the after-sales and material quality index ZD based on the after-sales data and the material risk index WE; calculate the quality index Z based on the chip and screen matching index ZA, the assembly quality retention index ZB, the transportation quality index ZC and the after-sales and material quality index ZD; preset the quality grade threshold set; judge the product quality grade based on the quality index Z and the quality grade threshold set; determine the circulation management method based on the judgment result; The judgment module is used to judge whether the quality of all products is qualified according to the methods of the data acquisition module and the indicator calculation module; count the number of qualified products Y1 and the number of unqualified products Y2; calculate the product qualification rate Y based on the number of qualified products Y1 and the number of unqualified products Y2; preset the qualification rate level threshold set; judge the product qualification rate level based on the product qualification rate Y and the qualification rate level threshold set, and determine the traceability management method based on the product qualification rate level.

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