Cooling system of heterointegration semiconductor packaging structure

Abstract

The invention discloses a cooling system of a heterogeneous integrated semiconductor packaging structure. The heterogeneous integrated semiconductor packaging structure is configured on a circuit substrate. The cooling system may include a cooling member, and the cooling member may be disposed on the hetero-integrated semiconductor package structure and uses a cooling fluid to dissipate heat from the hetero-integrated semiconductor package structure.

Description

Technical Field

[0001] The present invention relates to a cooling system, and in particular to a cooling system configured to cool a chip with multiple heat sources in a packaging structure. Background Art

[0002] With the advent of the high-computing era of artificial intelligence (AI), the demand for high-performance computing (HPC) and high-frequency and high-speed transmission is increasing day by day, and heterogeneous integrated packaging structures and silicon photonics packaging structures are gradually coming to the fore.

[0003] However, as the demand for computing power and transmission speed grows exponentially, the power consumption of servers continues to increase, which also drives the upgrade of heat dissipation technology. The heat dissipation capacity of air cooling is no longer sufficient, so direct liquid cooling technology has come to the fore. Existing liquid cooling technologies include: immersion, cold plate, microchannel, and jet impact.

[0004] On the other hand, although liquid cooling technology has strong heat dissipation capabilities and related technologies have been developed very early, it has not been introduced into mass production on a large scale. The main reason is that the heat dissipation capabilities of air cooling technology can only cope with the thermal power consumption of existing computing systems. In addition, liquid cooling technology still has the risk of potential leakage, and leakage can cause electronic component failures. Therefore, related manufacturers are relatively conservative and cautious when introducing liquid cooling technology. Summary of the invention

[0005] In view of this, an embodiment of the present invention provides a cooling system for a heterogeneously integrated semiconductor packaging structure, which utilizes a cooling fluid to dissipate heat from the semiconductor packaging structure. In addition to improving the defects of the prior art, it can further meet the heat dissipation requirements faced by high computing power and high-speed transmission.

[0006] An embodiment of the present invention provides a cooling system for a heterogeneous integrated semiconductor package structure. The heterogeneous integrated semiconductor package structure is disposed on a circuit substrate. The cooling system may include a cooling component disposed on the heterogeneous integrated semiconductor package structure.

[0007] In some embodiments, the cooling system may further include a thermally conductive fastener and a heat sink. The heat sink may be disposed on a side of the circuit substrate opposite to the heterogeneous integrated semiconductor package structure. The thermally conductive fastener may be used to couple the cooling component and the heat sink.

[0008] In some embodiments, the cooling system may further include a reinforcement plate, which may be disposed on the circuit substrate; and the thermally conductive fastener may be used to couple the cooling component, the reinforcement plate, and the heat dissipation plate.

[0009] In some embodiments, the cooling system may further include a reinforcing bracket, and the reinforcing bracket may be disposed on the circuit substrate and contact the cooling component.

[0010] In some embodiments, the cooling member may include a vapor chamber.

[0011] In some embodiments, the cooling system may further include a cooling fluid driving module; the reinforcing bracket may include a cooling fluid passage, which may be connected to the cooling fluid driving module; and the cooling fluid driving module is suitable for supplying a cooling fluid to the cooling fluid passage.

[0012] In some embodiments, the cooling system may also include a flow path component, which may be configured on a side of the circuit substrate relative to the heterogeneously integrated semiconductor packaging structure; the flow path component may be coupled to the cooling component; and the flow path component may include multiple fluid channels; the cooling component may include an internal chamber; and the fluid channels may be connected to the internal chamber.

[0013] In some embodiments, the cooling system may further include a plurality of oxygen-free copper seals, which may be disposed at the coupling point between the flow path component and the cooling component.

[0014] In some embodiments, the heterogeneous integrated semiconductor package structure may include a first heat generating portion and a second heat generating portion, and the heat dissipation design power of the first heat generating portion is greater than the heat dissipation design power of the second heat generating portion; and the cooling member may include a plurality of fluid supply holes corresponding to the heterogeneous integrated semiconductor package structure. The cooling fluid flow rate of the fluid supply holes sprayed to the first heat generating portion may be greater than the cooling fluid flow rate of the fluid sprayed to the second heat generating portion.

[0015] In some embodiments, the cooling member may further include a main fluid chamber, a fluid supply chamber, a fluid recovery chamber, and a plurality of fluid recovery holes; the fluid supply holes may be connected to the main fluid chamber and the fluid supply chamber; the fluid recovery holes may be connected to the main fluid chamber and the fluid recovery chamber. The arrangement density of the fluid supply holes corresponding to the first heating portion is higher than the arrangement density of the fluid supply holes corresponding to the second heating portion.

[0016] In some embodiments, the cooling system may further include a fluid supply module; the heterogeneous integrated semiconductor package structure may include a first heat generating portion and a second heat generating portion, and the heat dissipation design power of the first heat generating portion is greater than the heat dissipation design power of the second heat generating portion. The cooling component may include a first fluid chamber and a second fluid chamber; the first fluid chamber may correspond to the first heat generating portion, and the second fluid chamber may correspond to the second heat generating portion; and the fluid supply module is adapted to supply cooling fluid to the first fluid chamber and the second fluid chamber. The flow rate of the cooling fluid supplied to the first fluid chamber by the fluid supply module is greater than the flow rate of the cooling fluid supplied to the second fluid chamber.

[0017] In some embodiments, the fluid supply module may include a fluid supply pump, a fluid distribution valve, a first inlet pipe, and a second inlet pipe; the two ends of the first inlet pipe may be connected to the fluid distribution valve and the first fluid chamber respectively, and the two ends of the second inlet pipe may be connected to the fluid distribution valve and the second fluid chamber respectively. The fluid supply pump is suitable for supplying cooling fluid to the fluid distribution valve, and the fluid distribution valve can make the flow rate of the cooling fluid supplied to the first inlet pipe greater than the flow rate of the cooling fluid supplied to the second inlet pipe.

[0018] In some embodiments, the fluid supply module may include a first fluid supply pump and a second fluid supply pump; the first fluid supply pump is suitable for supplying cooling fluid to the first fluid chamber, and the second fluid supply pump is suitable for supplying cooling fluid to the second fluid chamber. The flow rate of the cooling fluid supplied by the first fluid supply pump to the first fluid chamber is greater than the flow rate of the cooling fluid supplied by the second fluid supply pump to the second fluid chamber.

[0019] In some embodiments, the fluid supply module may include a fluid supply pump, a first inlet pipe, and a second inlet pipe; two ends of the first inlet pipe may be connected to the fluid supply pump and the first fluid chamber, respectively, and two ends of the second inlet pipe may be connected to the fluid supply pump and the second fluid chamber, respectively. The fluid supply pump is suitable for supplying cooling fluid to the first fluid chamber and the second fluid chamber respectively through the first inlet pipe and the second inlet pipe; wherein the diameter of the first inlet pipe is larger than the diameter of the second inlet pipe.

[0020] In some embodiments, the fluid supply module may include a fluid supply pump, a first inlet pipe, and a second inlet pipe; the two ends of the first inlet pipe may be connected to the fluid supply pump and an inlet hole of the first fluid chamber, respectively, and the two ends of the second inlet pipe may be connected to the fluid supply pump and an inlet hole of the second fluid chamber, respectively. The fluid supply pump is suitable for supplying cooling fluid to the first fluid chamber and the second fluid chamber through the first inlet pipe and the second inlet pipe, respectively. The aperture of the inlet hole of the first fluid chamber may be larger than the aperture of the inlet hole of the second fluid chamber.

[0021] In some embodiments, the cooling system may further include a fluid supply module and a fluid recovery module; the cooling component includes a cooling chamber and a recovery chamber, and the cooling chamber and the recovery chamber may be in communication with each other. The fluid supply module may be connected to the cooling chamber and is suitable for supplying cooling fluid thereto; the fluid recovery module may be connected to the recovery chamber, and the fluid recovery module may include a gas recovery pump, which is suitable for pumping evaporated cooling fluid into the recovery chamber.

[0022] In some embodiments, the cooling system may further include a fluid storage unit, a fluid supply pipeline, a fluid recovery pipeline, a first fluid pump, and a second fluid pump; the cooling member may include a hollow chamber; the fluid storage unit may store cooling fluid; and the two ends of the fluid supply pipeline and the fluid recovery pipeline may be connected to the hollow chamber of the fluid storage unit and the cooling member, respectively. The first fluid pump may be arranged in the fluid supply pipeline; the second fluid pump may be arranged in the fluid recovery pipeline. The cooling fluid is supplied to the cooling member through the fluid supply pipeline by the first fluid pump, or the cooling fluid is supplied to the cooling member through the fluid recovery pipeline by the second fluid pump.

[0023] In some embodiments, the cooling system may further include a controller, a sensor, and a fluid driving unit; the fluid driving unit is adapted to supply cooling fluid to the cooling member; the controller may be disposed on the circuit substrate, and the controller may be electrically connected to the sensor and the fluid driving unit. The controller is adapted to control the fluid driving unit to supply cooling fluid to the cooling member according to the sensing result of the sensor.

[0024] In some embodiments, the cooling component may include multiple first fluid channels and multiple second fluid channels; the first fluid channels and the second fluid channels may be arranged in the cooling component in a staggered manner in a substantially parallel manner, and the flow direction of a cooling fluid in adjacent first fluid channels and second fluid channels may be opposite to each other.

[0025] In some embodiments, the cooling component may include a flow channel, and the inner wall surface of the flow channel may be covered with a diamond-like film.

[0026] Based on the above, the cooling system proposed in the present invention can greatly improve the heat dissipation capability of the semiconductor packaging structure to meet the heat dissipation requirements faced by high computing power and high-speed transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1A A cross-sectional schematic diagram of a first embodiment of a cooling system of the present invention;

[0028] Figure 1B is a cross-sectional schematic diagram of a second embodiment of a cooling system of the present invention;

[0029] Figure 2 is a cross-sectional schematic diagram of a third embodiment of a cooling system of the present invention;

[0030] Figure 3 is a cross-sectional schematic diagram of a fourth embodiment of a cooling system of the present invention;

[0031] Figure 4 is a cross-sectional schematic diagram of a fifth embodiment of a cooling system of the present invention;

[0032] Figure 5A is a cross-sectional schematic diagram of a sixth embodiment of a cooling system of the present invention;

[0033] Figure 5B is a cross-sectional schematic diagram of a seventh embodiment of a cooling system of the present invention;

[0034] Figure 5C is a cross-sectional schematic diagram of an eighth embodiment of a cooling system of the present invention;

[0035] Figure 5D is a cross-sectional schematic diagram of a ninth embodiment of a cooling system of the present invention;

[0036] Fig. 6A It is a three-dimensional schematic diagram of a cooling system according to a tenth embodiment of the present invention;

[0037] Figure 6B is a cross-sectional schematic diagram of a tenth embodiment of a cooling system of the present invention;

[0038] Figure 7 It is a three-dimensional schematic diagram of the eleventh embodiment of the cooling system of the present invention;

[0039] Figure 8 is a system architecture diagram of a twelfth embodiment of a cooling system of the present invention;

[0040] Fig.9A A cross-sectional view of a cooling member in a thirteenth embodiment of a cooling system of the present invention;

[0041] Fig. 9B A cross-sectional view of a cooling member in a fourteenth embodiment of a cooling system of the present invention;

[0042] Fig.10 It is a cross-sectional schematic diagram of the coating manufacturing process in the 15th embodiment of the cooling system of the present invention.

[0043] Explanation of symbols

[0044] 2: Cooling components

[0045] 3: Strengthen the bracket

[0046] 4: Cooling fluid drive module

[0047] 5:Flow path components

[0048] 6:Tightening spring

[0049] 7: Barb

[0050] 8: Fluid supply module

[0051] 11: Controller

[0052] 12: Sensor

[0053] 13: Fluid drive unit

[0054] 14: Coolant distribution device

[0055] 15: Remote Device

[0056] 20:Inner chamber

[0057] 21: Opening

[0058] 22: Fluid supply hole

[0059] 23: Main fluid chamber

[0060] 24: Fluid supply chamber

[0061] 25: Fluid recovery chamber

[0062] 26: Fluid recovery hole

[0063] 27: Cooling chamber

[0064] 28: Recovery Chamber

[0065] 29: Runner

[0066] 31: Thermally conductive fasteners

[0067] 32: Heat sink

[0068] 33: Reinforcement plate

[0069] 34: Opening

[0070] 41: Cooling fluid passage

[0071] 51: Fluid channel

[0072] 52: protrusion

[0073] 53: First pointed sealing unit

[0074] 54: Second pointed sealing unit

[0075] 55: Oxygen-free copper seal

[0076] 60: Fluid storage unit

[0077] 61: Fluid supply module

[0078] 62: Fluid recovery module

[0079] 63: Fluid supply pipeline

[0080] 64: Fluid recovery pipeline

[0081] 70: Locking screw

[0082] 71: Fluid storage unit

[0083] 72: Fluid supply pipeline

[0084] 73: Fluid recovery pipeline

[0085] 74: First fluid pump

[0086] 75: Second fluid pump

[0087] 81: Fluid supply pump

[0088] 82: Fluid distribution valve

[0089] 83: First inlet pipe

[0090] 84: Second inlet pipe

[0091] 85: First fluid supply pump

[0092] 86: Second fluid supply pump

[0093] 87: First outlet pipe

[0094] 88: Second outlet pipe

[0095] 90: Diamond-like film

[0096] 91: Fluid inlet

[0097] 92: Fluid outlet

[0098] 93: Precursor gas supply device

[0099] 94: Negative pressure generating device

[0100] 95: Power supply device

[0101] 131: Driving circuit

[0102] 132: Pump

[0103] 201:Piercing

[0104] 270:Through hole

[0105] 610: Liquid supply pump

[0106] 620: Gas recovery pump

[0107] 831:Entrance hole

[0108] 841:Entrance hole

[0109] B: Circuit board

[0110] B1: Through hole

[0111] B2:Through hole

[0112] C1: First fluid chamber

[0113] C2: Second fluid chamber

[0114] CH1: First fluid channel

[0115] CH2: Second fluid channel

[0116] CS1: First spiral channel

[0117] CS2: Second spiral channel

[0118] I: Heterogeneous integrated semiconductor packaging structure

[0119] Ia: First heating part

[0120] Ib: Second heating part

[0121] S: Chip holder

[0122] Pi1: First entrance

[0123] Pi2: Second entry

[0124] Po1: First exit

[0125] Po2: Second exit DETAILED DESCRIPTION

[0126] Various embodiments are presented below for detailed description, and the embodiments are only used as examples and do not limit the scope of the invention. In addition, some elements are omitted in the drawings in the embodiments to clearly show the technical features of the invention. Furthermore, the same reference numerals will be used to represent the same or similar elements in all drawings, and the drawings of the invention are only for schematic illustration, which may not be drawn to scale, and all details may not be fully presented in the drawings.

[0127] The following description will take a heterogeneous integrated semiconductor package structure as an example of a cooled component, but the present invention is not limited thereto. Other similar semiconductor package components, such as silicon photonics package components or other advanced package components, may also be applicable to the present invention.

[0128] Please read first Figure 1A, which shows a cross-sectional schematic diagram of the first embodiment of the cooling system of the present invention. As shown in the figure, the heterogeneous integrated semiconductor package structure I is disposed on a circuit substrate B; and the cooling system includes a cooling component 2, a heat conductive fastener 31 and a heat sink 32. The cooling component 2 is disposed on the heterogeneous integrated semiconductor package structure I.

[0129] In some embodiments, the cooling member 2 may be a liquid cooling plate or an air cooling plate filled with a cooling fluid, or a vapor chamber, or other cooling plates with heat conduction or heat dissipation functions. It should be noted that the cooling fluid may be a refrigerant, pure water, ethylene glycol, propylene glycol, or a combination thereof; if the cooling fluid has non-conductive properties, deionized water, electronic fluoride liquid, or other electronic engineering fluid may be used. However, the cooling fluid is not limited to liquids, and may also be a cryogenic gas, such as nitrogen, carbon dioxide, helium, or hydrogen.

[0130] The heat conductive fastener 31 can be made of a metal material with a better thermal conductivity, such as copper; and a clamping spring 6 is sleeved on one end of the heat conductive fastener 31, and a barb 7 is provided on the other end. The heat sink 32 is arranged on the side of the circuit substrate B relative to the heterogeneous integrated semiconductor package structure I, and in this embodiment is located on the back side of the circuit substrate B. Moreover, the heat sink 32 can also be made of a metal material with a better thermal conductivity, such as copper, to assist in heat dissipation. In some embodiments, in order to prevent the heat sink 32 from causing a short circuit in the circuit or electronic components on the circuit substrate B, an insulating pad (not shown) can be additionally provided between the circuit substrate B and the heat sink 32.

[0131] also, Figure 1A A reinforcing plate 33 is also shown, which is arranged on the same side of the circuit substrate B as the heterogeneous integrated semiconductor package structure I. In some embodiments, the reinforcing plate 33 can be a commonly used reinforcing plate (stiffener) or other metal component for reinforcing the strength of the circuit substrate B. The material of the reinforcing plate 33 can also be a metal material with a better thermal conductivity to assist in heat dissipation. Among them, the cooling component 2 includes a plurality of through holes 201, preferably four through holes 201, which can be arranged at the four corners of the cooling component 2; the circuit substrate B includes a plurality of through holes B1, and the reinforcing plate 33 also includes a plurality of openings 34; the number and position of the through holes B1 and the openings 34 can correspond to the through holes 201 of the cooling component 2.

[0132] In addition, the number of the thermally conductive fasteners 31 is also consistent with the number of the through holes 201 of the cooling member 2; and each thermally conductive fastener 31 passes through the through hole 201 of the cooling member 2, the opening 34 of the reinforcing plate 33 and the through hole B1 of the circuit substrate B, and the barbs 7 are fixed to the lower surface of the heat dissipation plate 32. The clamping spring 6 is sandwiched between the thermally conductive fastener 31 and the cooling member 2, and applies an appropriate clamping force to the cooling member 2 to ensure that the lower surface of the cooling member 2 is completely attached to the upper surface of the heterogeneous integrated semiconductor package structure I.

[0133] Based on the above, the heat conductive fastener 31 of this embodiment adopts a barb design, which is convenient for assembly and disassembly; and the clamping force applied to the cooling member 2 can be adjusted by replacing the clamping spring 6, so the clamping force can be flexibly adjusted. In addition, the heat conductive fastener 31 has excellent thermal conductivity, which can conduct the heat of the cooling member 2 to the reinforcement plate 33 and the heat dissipation plate 32, and the reinforcement plate 33 and the heat dissipation plate 32 can assist in heat dissipation, thereby improving the heat dissipation efficiency.

[0134] See also Figure 1B , which shows a cross-sectional schematic diagram of the second embodiment of the cooling system of the present invention. The main difference between the second embodiment and the previous embodiment is that a chip socket S is provided on the circuit substrate B, and in this case, the chip socket S replaces the reinforcing plate 33 in the previous embodiment. In this embodiment, similarly, the heat conductive fastener 31 passes through the cooling member 2, the chip socket S, the circuit substrate B and the heat sink 32, and the barb 7 of the heat conductive fastener 31 is fixed to the lower surface of the heat sink 32.

[0135] See also Figure 2 , Figure 2 A cross-sectional schematic diagram showing the third embodiment of the cooling system of the present invention. In this embodiment, the cooling component 2 is a vapor chamber, which contacts the reinforcing bracket 3; the vapor chamber has excellent thermal conductivity, which can make the semiconductor package structure with a very concentrated heat density quickly diffuse the heat to the surroundings to avoid overheating of the semiconductor package structure. In some embodiments, the reinforcing bracket 3 can be a commonly used reinforcing plate (stiffener) or other metal component used to reinforce the strength of the circuit substrate B. The material of the reinforcing bracket 3 can also be a metal material with a better thermal conductivity, such as copper.

[0136] also, Figure 2A cooling fluid driving module 4 is also shown, which may include a pump and a fluid delivery pipe. A cooling fluid passage 41 is provided in the strengthening bracket 3, which is connected to the cooling fluid driving module 4; the cooling fluid driving module 4 is suitable for supplying cooling fluid to the cooling fluid passage 41. Accordingly, this embodiment makes full use of the strengthening bracket 3, and digs a cooling fluid passage 41 in the strengthening bracket 3, and then combines the cooling fluid driving module 4, and through the heat transfer characteristics of the temperature equalizing plate, the heat is directed to the surrounding strengthening bracket 3, and then taken away by the cooling fluid, while achieving the advantages of rapid heat dissipation and space saving.

[0137] In some embodiments, the cooling fluid driving module 4 may further include a liquid storage tank (not shown) and a heat exchanger (not shown). The liquid storage tank may store an appropriate amount of cooling fluid to ensure that the cooling fluid driving module 4 can continuously supply cooling fluid to the strengthening bracket 3; and the heat exchanger may be a fin-type heat exchanger with a fan, which may further dissipate heat from the circulating cooling fluid. In other embodiments, the heat exchanger may also be a chiller, which may further regulate the temperature of the cooling fluid to a lower temperature.

[0138] See also Figure 3 , which shows a cross-sectional schematic diagram of a fourth embodiment of the cooling system of the present invention; in the embodiment shown in the figure, the cooling system includes a cooling component 2 and a flow path component 5, the cooling component 2 is disposed on the heterogeneous integrated semiconductor package structure I, and the flow path component 5 is disposed on a side of the circuit substrate B relative to the heterogeneous integrated semiconductor package structure I, that is, the back side of the circuit substrate B. In some embodiments, the cooling component 2 can be a cooling plate including an internal chamber 20 and a plurality of openings 21, and the flow path component 5 can be a guide back plate including a plurality of fluid channels 51 and a plurality of protrusions 52.

[0139] The circuit substrate B includes a plurality of through holes B2, and the protrusions 52 of the flow path member 5 pass through the through holes B2 and are connected to the cooling member 2. In some embodiments, the connection between the cooling member 2 and the flow path member 5 can be achieved by screwing, such as Figure 3 As shown. To further illustrate, the locking screws 70 can be used to pass through the cooling member 2 and the circuit substrate B and be locked on the flow path member 5. In addition, the fluid channels 51 of the flow path member 5 extend to the protrusions 52 respectively and communicate with the internal chamber 20 of the cooling member 2 through the openings 21.

[0140] In other embodiments, the protrusions 52 of the flow path member 5 are not limited to passing through the through holes B2 on the circuit substrate B and joining to the cooling member 2, that is, when the through holes B2 are not provided on the circuit substrate B, the protrusions 52 can be joined to the cooling member 2 along the side edge of the circuit substrate B (not shown in the figure). In other words, in other embodiments, the joining position between the cooling member 2 and the flow path member 5 can be adjusted according to actual needs, such as the side edge of the circuit substrate B or other appropriate positions.

[0141] In addition, in some embodiments, an oxygen-free copper seal 55 may be configured at each coupling point between the flow path component 5 and the cooling component 2; the reason for using oxygen-free copper as a seal is that copper is soft, tough, ductile, and more importantly, has a long service life. On the other hand, each protrusion 52 includes a first pointed sealing unit 53, which can be set according to the shape of the oxygen-free copper seal 55, such as a ring structure. Similarly, the cooling component 2 may include a plurality of second pointed sealing units 54, which respectively surround the openings 21, and the position, size and shape of the second pointed sealing units 54 may be consistent with the first pointed sealing units 53. Accordingly, the first pointed sealing units 53 and the second pointed sealing units 54 respectively penetrate into the opposite sides of the oxygen-free copper seals 55, so that the protrusions 52 are engaged with the cooling component 2 and form a seal.

[0142] Accordingly, in some embodiments of the present invention, the cooling fluid can be provided to the cooling member 2 through the fluid channels 51 of the flow path member 5, further realizing the forced circulation of the cooling fluid. On the other hand, in this embodiment, the flow path is arranged below the circuit substrate B, which can not only save a lot of space, but also simplify the arrangement of related components on the circuit substrate B, which is conducive to the disassembly or maintenance of the electronic components on the circuit substrate B. Moreover, when assembling the cooling member 2, the connection of the fluid flow path is also completed at the same time, which makes it easy to realize fully automated assembly.

[0143] See also Figure 4 , which shows a cross-sectional schematic diagram of the fifth embodiment of the cooling system of the present invention. As shown in the figure, the heterogeneous integrated semiconductor package structure I includes a first heating part Ia and a second heating part Ib, which can be a small chip (chiplet) respectively. In this embodiment, the thermal design power (Thermal Design Power, TDP) of the first heating part Ia is preset to be greater than the thermal design power of the second heating part Ib; that is, during the operation of the two small chips (chiplets), the temperature of the first heating part Ia will be higher than the temperature of the second heating part Ib. In this case, the temperature distribution of the entire packaging structure will be uneven, especially there will be a problem of thermal crosstalk (Thermal Crosstalk), which affects the reliability of the semiconductor packaging structure.

[0144] Another example Figure 4 As shown in , the cooling member 2 may include a plurality of fluid supply holes 22 inside, which correspond to the first heating part Ia and the second heating part Ib respectively. However, in some embodiments, in order to solve the problem of uneven temperature of the semiconductor packaging structure, a jet impingement technology may be used, and further implemented by means of the cooling fluid flow rate of the fluid supply holes 22 to the first heating part Ia being greater than the cooling fluid flow rate of the second heating part Ib. Among them, a cooling fluid supplied with a large flow rate can take away more heat than a cooling fluid supplied with a small flow rate, thereby significantly reducing the temperature of the first heating part Ia, and maintaining the temperatures of the first heating part Ia and the second heating part Ib as consistent as possible.

[0145] As a specific embodiment, as shown in the figure, the cooling member 2 includes a main fluid chamber 23, a fluid supply chamber 24, a fluid recovery chamber 25, a plurality of fluid supply holes 22, and a plurality of fluid recovery holes 26. The fluid supply holes 22 are connected to the main fluid chamber 23 and the fluid supply chamber 24; the fluid recovery holes 26 are connected to the main fluid chamber 23 and the fluid recovery chamber 25. The arrangement density of the fluid supply holes 22 corresponding to the first heating portion 1a is higher than the arrangement density of the fluid supply holes 22 corresponding to the second heating portion 1b.

[0146] In other words, compared with the second heating part Ib, the first heating part Ia with a higher heat dissipation design power can be configured with more and denser jet impact jet holes (fluid supply holes 22) to improve the heat dissipation efficiency. The specific configuration of the fluid supply holes 22 can be determined by the heat flux (Heat Flux, HF), and the relationship between the heat flux is as follows: Heat Flux (Heat Flux, HF) = Thermal Design Power (Thermal Design Power, TDP) / Surface area of ​​the heating part.

[0147] For example, the heat flux (HF1) of the first heating part Ia = the heat dissipation design power (TDP1) of the first heating part Ia / the surface area of ​​the upper surface of the first heating part Ia; similarly, the heat flux (HF2) of the second heating part Ib = the heat dissipation design power (TDP2) of the second heating part Ib / the surface area of ​​the upper surface of the second heating part Ib. When the heat flux (HF1) of the first heating part Ia is greater than the heat flux (HF2) of the second heating part Ib, the configuration density (ρ1) of the fluid supply holes Ps corresponding to the first heating part Ia is greater than the configuration density (ρ2) of the fluid supply holes Ps corresponding to the second heating part Ib.

[0148] In other embodiments using a closed cooling plate, thermal control can also be performed for multiple chiplets with different thermal design powers. Figure 5A , which shows a cross-sectional schematic diagram of a sixth embodiment of the cooling system of the present invention; the cooling system shown in the figure further includes a fluid supply module 8. The heterogeneous integrated semiconductor package structure I also includes a first heat generating portion Ia and a second heat generating portion Ib, and the heat dissipation design power of the first heat generating portion Ia is greater than the heat dissipation design power of the second heat generating portion Ib.

[0149] Moreover, the cooling member 2 includes a first fluid chamber C1 and a second fluid chamber C2; the first fluid chamber C1 corresponds to the first heating portion Ia, and the second fluid chamber C2 corresponds to the second heating portion Ib. However, in some embodiments, the first heating portion Ia and the second heating portion Ib can be thermally controlled by the flow rate of the cooling fluid in each of the first fluid chamber C1 and the second fluid chamber C2. That is, this can be achieved by controlling the flow rate of the cooling fluid supplied to the first fluid chamber C1 by the fluid supply module 8 to be greater than the flow rate of the cooling fluid supplied to the second fluid chamber C2.

[0150] exist Figure 5A In the embodiment of the present invention, the fluid supply module 8 includes a fluid supply pump 81, a fluid distribution valve 82, a first inlet pipe 83, a second inlet pipe 84, a first outlet pipe 87 and a second outlet pipe 88. The two ends of the first inlet pipe 83 are respectively connected to the fluid distribution valve 82 and the first fluid chamber C1, and the two ends of the second inlet pipe 84 are respectively connected to the fluid distribution valve 82 and the second fluid chamber C2. One end of the first outlet pipe 87 is connected to the first fluid chamber C1, and the other end is connected to a fluid storage tank (not shown in the figure); similarly, one end of the second outlet pipe 88 is connected to the second fluid chamber C2, and the other end is connected to a fluid storage tank (not shown in the figure). The fluid distribution valve 82 can be a proportional flow control valve, which is a device that controls the flow of fluid (liquid and gas) through electronic signals.

[0151] The specific operation of this embodiment is described as follows: the fluid supply pump 81 supplies cooling fluid to the fluid distribution valve 82, and the fluid distribution valve 82 then divides the cooling fluid into the first fluid chamber C1 and the second fluid chamber C2 according to a predetermined ratio; and the cooling fluid after heat exchange in the first fluid chamber C1 and the second fluid chamber C2 can flow out through the first outlet pipe 87 and the second outlet pipe 88 respectively. However, in this embodiment, because the heat dissipation design power of the first heating part Ia is greater than the heat dissipation design power of the second heating part Ib, the fluid distribution valve 82 divides the cooling fluid in a ratio such that the flow rate of the cooling fluid supplied to the first inlet pipe 83 is greater than the flow rate of the cooling fluid supplied to the second inlet pipe 84.

[0152] See also Figure 5B , which shows a cross-sectional schematic diagram of the seventh embodiment of the cooling system of the present invention; the main difference between this embodiment and the previous embodiment is that the fluid supply pump 81 and the fluid distribution valve 82 in the previous embodiment are replaced by a first fluid supply pump 85 and a second fluid supply pump 86; wherein the first fluid supply pump 85 is dedicated to supplying cooling fluid to the first fluid chamber C1, and the second fluid supply pump 86 is dedicated to supplying cooling fluid to the second fluid chamber C2. Similarly, the flow rate of the cooling fluid supplied to the first fluid chamber C1 by the first fluid supply pump 85 is greater than the flow rate of the cooling fluid supplied to the second fluid chamber C2 by the second fluid supply pump 86. In some embodiments, the first fluid supply pump 85 and the second fluid supply pump 86 can be configured as pumps with different volumetric flow rates or pumps with switchable supply flow rates.

[0153] See also Figure 5C , which shows a cross-sectional schematic diagram of the eighth embodiment of the cooling system of the present invention; the main difference between this embodiment and the aforementioned embodiments is that the first inlet pipe 83 and the second inlet pipe 84 of this embodiment have different diameters, and the flow rate of the cooling fluid entering the first fluid chamber C1 and the second fluid chamber C2 is controlled by the different diameters of the inlet pipes.

[0154] Further explanation, such as Figure 5C As shown in the figure, the fluid supply module 8 includes a fluid supply pump 81, a first inlet pipe 83, a second inlet pipe 84, a first outlet pipe 87 and a second outlet pipe 88. The two ends of the first inlet pipe 83 are respectively connected to the fluid supply pump 81 and the first fluid chamber C1, and the two ends of the second inlet pipe 84 are respectively connected to the fluid supply pump 81 and the second fluid chamber C2. One end of the first outlet pipe 87 is connected to the first fluid chamber C1, and the other end is connected to a fluid storage tank (not shown in the figure); similarly, one end of the second outlet pipe 88 is connected to the second fluid chamber C2, and the other end is connected to a fluid storage tank (not shown in the figure).

[0155] Therefore, the fluid supply pump 81 can supply cooling fluid to the first fluid chamber C1 and the second fluid chamber C2 through the first inlet pipe 83 and the second inlet pipe 84 respectively; and the cooling fluid in the first fluid chamber C1 and the second fluid chamber C2 can also flow out through the first outlet pipe 87 and the second outlet pipe 88. However, in this embodiment, the diameters of the first inlet pipe 83 and the first outlet pipe 87 are larger than the diameters of the second inlet pipe 84 and the second outlet pipe 88. Accordingly, the flow rate of the cooling fluid flowing into the first fluid chamber C1 will be greater than the flow rate of the cooling fluid flowing into the second fluid chamber C2.

[0156] See also Figure 5D, which shows a cross-sectional schematic diagram of the ninth embodiment of the cooling system of the present invention; the main difference between this embodiment and the aforementioned embodiments is that the aperture of the inlet hole 831 of the first fluid chamber C1 of this embodiment is different from the aperture of the inlet hole 841 of the second fluid chamber C2, and the flow rate of the cooling fluid entering the first fluid chamber C1 and the second fluid chamber C2 is controlled by these different apertures.

[0157] To further illustrate, the fluid supply module 8 includes a fluid supply pump 81, a first inlet pipe 83, a second inlet pipe 84, a first outlet pipe 87, and a second outlet pipe 88. The two ends of the first inlet pipe 83 are respectively connected to the fluid supply pump 81 and the first fluid chamber C1, and the two ends of the second inlet pipe 84 are respectively connected to the fluid supply pump 81 and the second fluid chamber C2. One end of the first outlet pipe 87 is connected to the first fluid chamber C1, and the other end is connected to a fluid storage tank (not shown in the figure); similarly, one end of the second outlet pipe 88 is connected to the second fluid chamber C2, and the other end is connected to a fluid storage tank (not shown in the figure).

[0158] Therefore, the fluid supply pump 81 can supply cooling fluid to the first fluid chamber C1 and the second fluid chamber C2 through the first inlet pipe 83 and the second inlet pipe 84 respectively; and the cooling fluid in the first fluid chamber C1 and the second fluid chamber C2 can also flow out through the first outlet pipe 87 and the second outlet pipe 88. However, in this embodiment, the aperture of the inlet hole 831 of the first fluid chamber C1 is larger than the aperture of the inlet hole 841 of the second fluid chamber C2. Accordingly, the flow rate of the cooling fluid flowing into the first fluid chamber C1 will be greater than the flow rate of the cooling fluid flowing into the second fluid chamber C2.

[0159] According to the above, in FIG. 5A to FIG. 5D In the embodiment shown, the cooling member 2 can configure a fluid chamber for each heat generating part on the heterogeneous integrated semiconductor package structure 1, and the cooling system can provide cooling fluid with different flow rates to each fluid chamber, and the flow rate is set according to the heat dissipation design power of each heat generating part. A high heat dissipation design power means that the heat generating part will generate a higher temperature, so a larger flow rate of cooling fluid can be supplied to the fluid chamber corresponding to the heat generating part, thereby maintaining the temperature of the heterogeneous integrated semiconductor package structure 1 as consistent as possible to avoid the occurrence of thermal crosstalk.

[0160] Please also see Fig. 6A and Figure 6B , Fig. 6A A three-dimensional schematic diagram showing a tenth embodiment of the cooling system of the present invention, Figure 6B A cross-sectional schematic diagram showing a tenth embodiment of the cooling system of the present invention. Fig. 6A and Figure 6B2 shows a fluid storage unit 60, a fluid supply module 61 and a fluid recovery module 62. The fluid storage unit 60 stores cooling fluid; the fluid supply module 61 includes a liquid supply pump 610 and a fluid supply pipeline 63; the fluid recovery module 62 includes a gas recovery pump 620 and a fluid recovery pipeline 64; and the two ends of the fluid supply pipeline 63 and the fluid recovery pipeline 64 are respectively connected to the fluid storage unit 60 and the cooling component 2.

[0161] In addition, the liquid supply pump 610 is disposed in the fluid supply pipeline 63; the gas recovery pump 620 is disposed in the fluid recovery pipeline 64; wherein the cooling system supplies cooling fluid to the cooling component 2 through the liquid supply pump 610 and the fluid supply pipeline 63, and draws the evaporated cooling fluid from the cooling component 2 through the gas recovery pump 620 and the fluid recovery pipeline 64. Figure 6B As shown, the cooling component 2 includes a cooling chamber 27 and a recovery chamber 28 , which are connected to each other via a through hole 270 .

[0162] Based on the above configuration, when facing the demand of high performance computing (HPC), the temperature of the heterogeneous integrated semiconductor package structure I may rise to a temperature sufficient to evaporate the cooling fluid, resulting in the coexistence of gas phase and liquid phase cooling fluid, such as a two-phase immersion cooling solution. At this time, after the liquid cooling fluid in the cooling chamber 27 is heated and evaporated, the gaseous cooling fluid will flow into the recovery chamber 28 through the through hole 270. However, the gas recovery pump 620 of this embodiment can draw the gaseous cooling fluid from the recovery chamber 28.

[0163] In general, in this embodiment, the cooling fluid can be continuously supplied to the cooling member 2 through the liquid supply pump 610 and the fluid supply pipeline 63; and the evaporated cooling fluid can be extracted from the cooling member 2 through the gas recovery pump 620 and the fluid recovery pipeline 64. In this way, the forced circulation of the two-phase cooling fluid can be achieved to maintain an excellent heat-relieving effect. In addition, in other embodiments, a condenser or other heat exchanger (not shown) can be additionally configured on the fluid recovery pipeline 64, and a fin-type heat exchanger with a fan can be provided, which can further dissipate the heat of the gaseous cooling fluid in the circulation and condense it into a liquid cooling fluid.

[0164] On the other hand, after the cooling member 2 has been in operation for a long time, the flow channel or hole in the cooling member 2 may become narrower and narrower, or even completely blocked in serious cases, due to various factors such as the failure to clean the shavings after processing the cooling member 2, the precipitation of impurities in the cooling member 2, the impurities in the cooling fluid itself, or the breeding of microorganisms in the microchannel or cooling fluid. This will affect the heat dissipation effect of the cooling member 2, causing the semiconductor package structure being cooled to overheat or even fail and burn.

[0165] In order to solve the above problem, an embodiment is provided below. Figure 7 , which shows a three-dimensional schematic diagram of the cooling system of the present invention according to the eleventh embodiment; Figure 7 The embodiment shown includes a cooling member 2, a fluid storage unit 71, a fluid supply pipeline 72, a fluid recovery pipeline 73, a first fluid pump 74, and a second fluid pump 75. Furthermore, the fluid storage unit 71 stores cooling fluid; the two ends of the fluid supply pipeline 72 are respectively connected to the fluid storage unit 71 and the cooling member 2; the two ends of the fluid recovery pipeline 73 are respectively connected to the fluid storage unit 71 and the cooling member 2. The first fluid pump 74 is disposed on the fluid supply pipeline 72; the second fluid pump 75 is disposed on the fluid recovery pipeline 73. The cooling system can supply cooling fluid to the cooling member 2 through the fluid supply pipeline 72 through the first fluid pump 74, or supply cooling fluid to the cooling member 2 through the fluid recovery pipeline 73 through the second fluid pump 75.

[0166] Specifically, when the system is operating normally, the second fluid pump 75 is stopped, and the first fluid pump 74 supplies cooling fluid to the cooling component 2 through the fluid supply pipe 72, and the cooling fluid also forms a forced circulation to perform heat dissipation, and the cooling fluid returns to the fluid storage unit 71 through the fluid recovery pipe 73. On the other hand, when there is a need to flush the inside of the cooling component 2, such as flushing the internal flow channel or internal holes, the first fluid pump 74 can be stopped and the second fluid pump 75 can be driven to operate; that is, the cooling fluid is supplied to the cooling component 2 through the fluid recovery pipe 73 through the second fluid pump 75, and returns to the fluid storage unit 71 through the fluid supply pipe 72.

[0167] Accordingly, the second fluid pump 37 will generate a backwash in the opposite direction of the cooling fluid in normal operation, which can effectively flush out foreign matter or impurities in the cooling component 2 or in the pipeline. In other embodiments, a filter material can also be arranged in the fluid supply pipeline 72 or the fluid recovery pipeline 73 to filter out the flushed foreign matter or impurities.

[0168] In addition, in other embodiments, the first fluid pump 74 and the second fluid pump 75 may also be bidirectional pumps, which provide switching of flow directions. In other words, during normal operation, the first fluid pump 74 and the second fluid pump 75 are both started and run, and the directions of driving fluid flow are the same, for example Figure 7 When there is a need to flush the interior of the cooling member 2, the first fluid pump 74 and the second fluid pump 75 are also started, but after the flow direction is switched, the two drive the cooling fluid to flow in the opposite direction, for example Figure 7 In addition, in the embodiment using a bidirectional pump, only one bidirectional pump may be configured.

[0169] Most of the existing liquid cooling system operation monitoring adopts a separate approach. It and the computing system of the cooled object (such as a server) are independent systems, and there is no information exchange between them. In other words, the liquid temperature sensing, flow monitoring and distribution, cooling fluid pressure drop sensing, and real-time regulation of the fluid-driven pump of the liquid cooling system are all operated by the cooling system alone, and there is no real-time communication with the server system. Therefore, once an abnormal situation occurs in the server system, the cooling system cannot perceive it in the first time, nor can it respond in time. Similarly, once an abnormal situation occurs in the cooling system, the server system cannot perceive it in the first time, nor can it respond in time.

[0170] In addition, the existing liquid cooling system and the computing system of the cooled object (such as a server) are independent of each other. Since the related sensors in the existing cooling system cannot be integrated into the computing system, the sensor wiring is complicated and messy, causing maintenance problems and high costs.

[0171] In order to solve the above problems, Figure 8 The illustrated embodiment provides a solution; Figure 8 The system architecture diagram of the twelfth embodiment of the cooling system of the present invention is shown. The cooling system of this embodiment also includes a controller 11, a plurality of sensors 12, a fluid drive unit 13, and a cooling liquid distribution unit (CDU) 14. The controller 11 can be a microprocessor, a system on a chip (SOC), a microcontroller, a field programmable gate array (FPGA) or an application specific integrated circuit (ASIC) on a server mainboard, or other controllers or processors on the mainboard; as a specific embodiment, a baseboard management controller (BMC) can be used.

[0172] In some embodiments, the sensor 12 may include but is not limited to leakage sensors, flow meters, fluid pressure drop sensors, and fluid temperature sensors, etc., for monitoring the state of the cooling fluid. In some embodiments, the fluid drive unit 13 is suitable for supplying a cooling fluid to the cooling member 2; and the fluid drive unit 13 may include a drive circuit 131 and a pump 132, and the drive circuit 131 is used to control the start, shut down, and operation state of the pump 132.

[0173] Furthermore, the coolant distribution device 14 is responsible for evenly distributing the coolant to the entire system, including but not limited to the fluid storage tank, radiator, heat exchanger, and filter. Figure 8 As shown, the controller 11 is electrically connected to the sensors 12 and the fluid driving unit 13 ; that is, the controller 11 can control the fluid driving unit 13 to supply cooling fluid to the cooling component 2 according to the sensing results of the sensors 12 .

[0174] For example, when the sensor 12 detects an abnormality, such as a cooling fluid leak, the controller 11 can not only control the fluid drive unit 13 to stop supplying the cooling fluid, but also synchronously control the server system to perform necessary protection measures, such as shutting down. On the other hand, if the server system is abnormal, such as when the processor temperature is too high, the controller 11 can also control the fluid drive unit 13 to increase the cooling fluid supply flow or reduce the temperature of the cooling fluid; for example, when the server system is shut down, the controller 11 can also autonomously control the entire cooling system to stop operating.

[0175] In simpler terms, the controller 11 on the motherboard can coordinate the operation between the cooling system and the server system, so as to monitor the temperature, flow rate, pressure, and leakage of the board in real time, and can timely control the temperature, flow rate, and pressure of the cooling fluid in response to the sensing results, so as to maintain the system in the best performance state and avoid serious system failure. In addition, the controller 11 on the motherboard can also control the cooling system to perform corresponding operations according to the operating state of the server system, such as starting the operation, shutting down the operation, increasing the flow rate of the cooling fluid, increasing the temperature of the cooling fluid, reducing the flow rate of the cooling fluid, or reducing the temperature of the cooling fluid.

[0176] In addition, since each sensor 12 is arranged on the same circuit board as the server electronic device, the sensor wiring cost and sensor wiring complexity can be reduced. Furthermore, the cooling system of this embodiment can further realize remote control, for example, the controller 11 and the coolant distribution device 14 are connected to a remote device 15; and the entire cooling system and server system can be remotely managed and remotely monitored through the remote device 15. When an abnormal condition occurs in the cooling system or the server system, the controller 11 will immediately notify the remote device 15 and take immediate measures.

[0177] Please also see Fig.9A and Fig. 9B , Fig.9A A cross-sectional view showing a cooling member in a thirteenth embodiment of a cooling system of the present invention, Fig. 9B A cross-sectional view showing the cooling component in the 14th embodiment of the cooling system of the present invention. Existing liquid cooling systems use a cooling plate to cool electronic components, and a flow channel is provided inside the cooling plate to increase the contact area between the coolant and the cooling plate, thereby improving the cooling efficiency. However, existing flow channel designs usually adopt a parallel flow channel configuration, and the coolant in adjacent flow channels flows in the same direction. Although this flow channel design increases the heat dissipation efficiency, it often causes the temperature distribution of the semiconductor packaging structure to be uneven; for example, the temperature of the area near the water inlet is lower, while the temperature of the area near the water outlet is higher. In order to solve the above problems, in Fig.9A and Fig. 9B In the illustrated embodiment, a novel flow path design is provided for the cooling member 2 , which can not only significantly improve the heat exchange efficiency but also make the temperature distribution of the cooling member 2 uniform.

[0178] Please read first Fig.9A The cooling member 2 includes a first inlet Pi1, a first outlet Po1, a second inlet Pi2, a second outlet Po2, a plurality of first fluid channels CH1, and a plurality of second fluid channels CH2; the first inlet Pi and the first outlet Po1 are respectively arranged on the corresponding sides of the cooling member 2, the second inlet Pi2 and the first outlet Po1 are arranged on the same side of the cooling member 2, and the second outlet Po2 and the first inlet Pi1 are arranged on the same side of the cooling member 2. Moreover, the two ends of the first fluid channels CH1 are respectively connected to the first inlet Pi1 and the first outlet Po1, and the two ends of the second fluid channels CH2 are respectively connected to the second inlet Pi2 and the second outlet Po2. In addition, the first fluid channels CH1 and the second fluid channels CH2 are arranged in the cooling member 2 in a staggered manner in a substantially parallel manner.

[0179] Based on the above structure, the flow directions of the cooling fluid in the adjacent first fluid channels CH1 and the second fluid channels CH2 can be reversed. Since the temperature of the cooling fluid at the first inlet Pi1 and the second inlet Pi2 is relatively low, and the cooling fluid continuously exchanges heat with the cooling member 2 body as it flows along the flow channel, the temperature of the cooling fluid reaches the highest at the first outlet Po1 and the second outlet Po2, but the first inlet Pi1 and the second inlet Pi2 are correspondingly configured there, and the fluid temperature there is relatively low. Therefore, through the configuration of the above embodiment, the temperature at various locations in the cooling member 2 can be made roughly consistent, so that the uniformity of the surface temperature distribution of the semiconductor packaging structure is improved.

[0180] In addition, Fig. 9B In the embodiment shown, the cooling member 2 includes a first inlet Pi1, a first outlet Po1, a second inlet Pi2, a second outlet Po2, a first spiral channel CS1 and a second spiral channel CS2. The first inlet Pi1 and the first outlet Po1 are respectively located at the two ends of the first spiral channel CS1; the second inlet Pi2 and the second outlet Po2 are respectively located at the two ends of the second spiral channel CS2; the first inlet Pi1 and the second outlet Po2 are arranged at the approximate center of the cooling member 2, and the first outlet Po1 and the second inlet Pi2 are arranged at the four circumferential side ends adjacent to the cooling member 2, and the two are far away from each other. Furthermore, the second spiral channel CS2 spirally surrounds the first spiral channel CS1 between the various circular channels of the first spiral channel CS1, and the flow directions of the cooling fluids in the adjacent first spiral channel CS1 and the second spiral channel CS2 are opposite to each other.

[0181] Accordingly, in some embodiments, the cooling member 2 is not limited to a parallel flow channel configuration, and may also adopt a spiral flow channel configuration, which can also achieve a fairly uniform temperature distribution effect. In addition, in other embodiments, the flow channel design may also adopt other geometric shapes, and the inlet and outlet of the cooling fluid are not limited to two, and more inlets and outlets will achieve better heat dissipation efficiency.

[0182] See also Fig.10, which shows a cross-sectional schematic diagram of the coating manufacturing process in the 15th embodiment of the cooling system of the present invention. Most of the existing liquid cooling plates (cooling components 2) are made of copper because of the high thermal conductivity of copper. However, the flow channels in the existing copper liquid cooling plates are generally made by mechanical processing methods such as die casting, scraping, and milling machine cutting. The surface roughness is large, the friction coefficient is also high, and the pressure drop formed when the cooling fluid flows through is large. In order to overcome this problem, the prior art will increase the fluid pressure, for example, by high-speed operation of the pump, but this will not only increase the power consumption cost, but also increase the risk of cooling fluid leakage. On the other hand, copper is easy to oxidize, so it is common to use an electroplating manufacturing process to add a nickel plating layer on the surface of the flow channel to prevent copper oxidation. However, the thermal conductivity of nickel (97.5W / mK) is much lower than that of copper (398W / mK), which reduces the efficiency of the liquid cooling plate (cooling component 2).

[0183] To solve the above problems, Fig.10 The embodiment shown provides a new coating method for the cooling fluid flow channel in the cooling member 2. The coating has a high thermal conductivity (about 400 to 1000 W / mK), even higher than the copper cooling member 2, so it will not affect the heat exchange effect and the heat dissipation effect. Moreover, the coating can greatly reduce the roughness of the flow channel surface and can effectively suppress the pressure drop of the cooling fluid. In addition, because the density of the coating on the flow channel surface is high, it can inhibit the growth of microorganisms and is not easy to attach foreign matter, so the probability of blockage is reduced and the service life is greatly increased.

[0184] The following describes the hardware configuration and related steps required for the coating process in the fifteenth embodiment. Fig.10 .like Fig.10 As shown, the cooling member 2 includes an internal flow channel 29, a fluid inlet 91 and a fluid outlet 92, and the two ends of the internal flow channel 29 are respectively connected to the fluid inlet 91 and the fluid outlet 92. Furthermore, the fluid inlet 91 is connected to a precursor gas supply device 93; the fluid outlet 92 is connected to a negative pressure generating device 94; the cooling member 2 is electrically connected to a power supply device 95, the negative pole of which is connected to the cooling member 2, and the positive pole is grounded.

[0185] In some embodiments, the cooling member 2 is first evacuated by the negative pressure generating device 94; then, the precursor gas supply device 93 supplies the precursor gas into the cooling member 2 and controls the flow rate of the precursor gas to maintain the vacuum degree in the cooling member 2 at 10 -1 ~10 -4The precursor gas may include but is not limited to alkanes, alkynes, silanes, TEOS (tetraethoxysilane tetraethoxysilane), etc. Next, the power supply device 95 is started, and plasma is generated on the inner wall surface of the flow channel 29 of the cooling member 2, thereby depositing a diamond-like film 90.

[0186] The following provides the manufacturing process parameters of an embodiment. The power supply device 95 supplies a pulsed DC with a voltage between 350 volts and 1000 volts, a pulse duration between 5 μs and 35 μs, and a pulse rate of 21 KHz. In addition, the flow rate supplied by the precursor gas supply device 93 can be between 2 sccm and 7 sccm.

[0187] In other embodiments, before the precursor gas enters the flow channel 29 of the cooling member 2, argon gas (Ar) may be introduced first, and a plasma cleaning step may be performed first to remove organic contamination on the surface of the flow channel 29. In addition, after the plasma cleaning step, before the precursor gas enters the flow channel 29 of the cooling member 2, a silane gas may be introduced first to pre-coat a layer of amorphous silicon film to increase the adhesion of the subsequent diamond-like film 90.

[0188] In general, the diamond-like film 90 in the above-mentioned embodiment has at least the following advantages: the diamond-like film 90 is quite dense, has a smooth surface, and has a low friction coefficient, and can effectively suppress pressure drop; the diamond-like film 90 has a high thermal conductivity and can improve cooling efficiency; the diamond-like film 90 has a high hardness, and if nanoparticles are added to the cooling fluid, such as using nanofluid cooling technology, it can resist the high-speed collision of the nanoparticles and reduce the wear of the inner wall; the diamond-like film 90 is corrosion-resistant, and the surface roughness is smaller than the size of bacteria, thereby avoiding the attachment or growth of microorganisms; the diamond-like film 90 is formed by vacuum vapor deposition, and there is no problem of waste liquid discharge and treatment, which has environmental benefits.

[0189] Although the present invention is disclosed in conjunction with the above embodiments, they are not intended to limit the present invention. Any ordinary technician in the technical field may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be based on the definition of the attached claims.

Claims

1. A cooling system for a heterogeneous integrated semiconductor package structure, wherein the heterogeneous integrated semiconductor package structure is disposed on a circuit substrate; the cooling system comprises a cooling component, which is disposed on the heterogeneous integrated semiconductor package structure.

2. The cooling system as described in claim 1 further comprises a thermally conductive fastener and a heat sink, wherein the heat sink is disposed on a side of the circuit substrate opposite to the heterogeneous integrated semiconductor package structure; and the thermally conductive fastener is used to couple the cooling component and the heat sink.

3. The cooling system as claimed in claim 2, further comprising a reinforcing plate disposed on the circuit substrate; the thermally conductive fastener is used to couple the cooling component, the reinforcing plate and the heat dissipation plate. 4 . The cooling system as claimed in claim 1 , further comprising a reinforcing bracket, wherein the reinforcing bracket is disposed on the circuit substrate and contacts the cooling component.

5. The cooling system according to claim 4, wherein: The cooling member includes a temperature evaporator.

6. The cooling system as described in claim 5 further comprises a cooling fluid driving module; the reinforcing bracket comprises a cooling fluid passage which is connected to the cooling fluid driving module; the cooling fluid driving module is suitable for supplying cooling fluid to the cooling fluid passage.

7. The cooling system as described in claim 1 also includes a flow path component, which is configured on a side of the circuit substrate relative to the heterogeneous integrated semiconductor packaging structure; the flow path component is coupled to the cooling component; the flow path component includes a plurality of fluid channels; the cooling component includes an internal chamber; and the fluid channels are connected to the internal chamber. 8 . The cooling system as claimed in claim 7 , further comprising a plurality of oxygen-free copper seals disposed at a coupling location between the flow path component and the cooling component.

9. The cooling system of claim 1, wherein: The heterogeneous integrated semiconductor packaging structure includes a first heat generating portion and a second heat generating portion, wherein the heat dissipation design power of the first heat generating portion is greater than the heat dissipation design power of the second heat generating portion; the cooling component includes a plurality of fluid supply holes corresponding to the heterogeneous integrated semiconductor packaging structure; wherein the cooling fluid flow rate of the spray flow to the first heat generating portion through the fluid supply holes is greater than the cooling fluid flow rate of the spray flow to the second heat generating portion.

10. The cooling system of claim 9, wherein: The cooling component also includes a main fluid chamber, a fluid supply chamber, a fluid recovery chamber and a plurality of fluid recovery holes; the fluid supply holes are connected to the main fluid chamber and the fluid supply chamber; the fluid recovery holes are connected to the main fluid chamber and the fluid recovery chamber; wherein the configuration density of the fluid supply holes corresponding to the first heating part is higher than the configuration density of the fluid supply holes corresponding to the second heating part.

11. The cooling system as claimed in claim 1 further comprises a fluid supply module; the heterogeneous integrated semiconductor package structure comprises a first heat generating portion and a second heat generating portion, the heat dissipation design power of the first heat generating portion is greater than the heat dissipation design power of the second heat generating portion; the cooling component comprises a first fluid chamber and a second fluid chamber; the first fluid chamber corresponds to the first heat generating portion, and the second fluid chamber corresponds to the second heat generating portion; the fluid supply module is suitable for supplying cooling fluid to the first fluid chamber and the second fluid chamber; wherein, The flow rate of the cooling fluid supplied by the fluid supply module to the first fluid chamber is greater than the flow rate of the cooling fluid supplied to the second fluid chamber.

12. The cooling system of claim 11, wherein: The fluid supply module includes a fluid supply pump, a fluid distribution valve, a first inlet pipe and a second inlet pipe; the two ends of the first inlet pipe are respectively connected to the fluid distribution valve and the first fluid chamber, and the two ends of the second inlet pipe are respectively connected to the fluid distribution valve and the second fluid chamber; the fluid supply pump is suitable for supplying the cooling fluid to the fluid distribution valve, and the fluid distribution valve makes the flow rate of the cooling fluid supplied to the first inlet pipe greater than the flow rate of the cooling fluid supplied to the second inlet pipe.

13. The cooling system of claim 11, wherein: The fluid supply module includes a first fluid supply pump and a second fluid supply pump; the first fluid supply pump is suitable for supplying the cooling fluid to the first fluid chamber, and the second fluid supply pump is suitable for supplying the cooling fluid to the second fluid chamber; wherein the flow rate of the cooling fluid supplied to the first fluid chamber by the first fluid supply pump is greater than the flow rate of the cooling fluid supplied to the second fluid chamber by the second fluid supply pump.

14. The cooling system of claim 11, wherein: The fluid supply module includes a fluid supply pump, a first inlet pipe and a second inlet pipe; the two ends of the first inlet pipe are respectively connected to the fluid supply pump and the first fluid chamber, and the two ends of the second inlet pipe are respectively connected to the fluid supply pump and the second fluid chamber; the fluid supply pump is suitable for supplying the cooling fluid to the first fluid chamber and the second fluid chamber respectively through the first inlet pipe and the second inlet pipe; wherein the diameter of the first inlet pipe is larger than the diameter of the second inlet pipe.

15. The cooling system of claim 11, wherein: The fluid supply module includes a fluid supply pump, a first inlet pipe and a second inlet pipe; the two ends of the first inlet pipe are respectively connected to the fluid supply pump and the inlet hole of the first fluid chamber, and the two ends of the second inlet pipe are respectively connected to the fluid supply pump and the inlet hole of the second fluid chamber; the fluid supply pump is suitable for supplying the cooling fluid to the first fluid chamber and the second fluid chamber respectively through the first inlet pipe and the second inlet pipe; wherein the aperture of the inlet hole of the first fluid chamber is larger than the aperture of the inlet hole of the second fluid chamber.

16. The cooling system as described in claim 1 also includes a fluid supply module and a fluid recovery module; the cooling component includes a cooling chamber and a recovery chamber, and the cooling chamber and the recovery chamber are connected to each other; the fluid supply module is connected to the cooling chamber and is suitable for supplying cooling fluid thereto; the fluid recovery module is connected to the recovery chamber, and the fluid recovery module includes a gas recovery pump, which is suitable for sucking the evaporated cooling fluid into the recovery chamber.

17. The cooling system as claimed in claim 1, further comprising a fluid storage unit, a fluid supply pipeline, a fluid recovery pipeline, a first fluid pump and a second fluid pump; the cooling component comprises a hollow chamber; the fluid storage unit stores cooling fluid; two ends of the fluid supply pipeline and the fluid recovery pipeline are respectively connected to the fluid storage unit and the hollow chamber of the cooling component; the first fluid pump is arranged in the fluid supply pipeline; the second fluid pump is arranged in the fluid recovery pipeline; wherein, The cooling fluid is supplied to the cooling member through the fluid supply pipe by the first fluid pump, or the cooling fluid is supplied to the cooling member through the fluid recovery pipe by the second fluid pump.

18. The cooling system as described in claim 1 further includes a controller, a sensor and a fluid driving unit; the fluid driving unit is suitable for supplying cooling fluid to the cooling component; the controller is arranged on the circuit substrate, and the controller is electrically connected to the sensor and the fluid driving unit; the controller is suitable for controlling the fluid driving unit to supply the cooling fluid to the cooling component according to the sensing result of the sensor.

19. The cooling system of claim 1, wherein: The cooling component includes a plurality of first fluid channels and a plurality of second fluid channels; the first fluid channels and the second fluid channels are arranged in the cooling component in a staggered manner in a substantially parallel manner, and the flow directions of the cooling fluids in the adjacent first fluid channels and the second fluid channels are opposite to each other.

20. The cooling system of claim 1, wherein: The cooling component comprises a flow channel, and the inner wall surface of the flow channel is covered with a diamond-like film.

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