Laser module and preparation method thereof

Abstract

The invention discloses a laser module and a preparation method thereof, and the laser module comprises at least one optical unit, an injection molding packaging housing, and a laser packaging body. The injection molding packaging shell forms a packaging cavity, and a first opening and a second opening are formed in the two ends of the packaging cavity respectively. The at least one optical unit is located between the first opening and the second opening; the laser packaging body is arranged on one side of the first opening, and the laser packaging body comprises a packaging part; wherein at least part of the packaging part is located in the packaging cavity, according to the laser module and the preparation method thereof provided by the invention, the assembly difficulty of the laser module is reduced, the production efficiency of a product is improved, the use of metal materials can be effectively reduced, and the production cost is reduced.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of packaging technology, and in particular to a laser module and a method for preparing the same. Background Art

[0002] Laser modules are used in many existing industries. Depending on the application requirements, laser module tubes have a variety of packaging parts.

[0003] Currently, laser modules are mainly packaged in a multi-part shell. The assembly process requires multiple adjustments to the relative position of the laser and the front-end optical unit. The production process is complex in structure, which is not conducive to automated production and affects the production efficiency of the product. Summary of the invention

[0004] The present invention provides a laser module and a preparation method thereof, which can reduce the difficulty of assembling the laser module, improve the production efficiency of the product, effectively reduce the use of metal materials, and reduce production costs.

[0005] In a first aspect, an embodiment of the present invention provides a schematic diagram of the structure of a laser module, including: at least one optical unit, an injection-molded packaging shell, and a laser package;

[0006] The injection-molded packaging shell forms a packaging cavity, and two ends of the packaging cavity are respectively provided with a first opening and a second opening; the at least one optical unit is located between the first opening and the second opening;

[0007] The laser package is disposed at one side of the first opening, and the laser package comprises a packaging portion; wherein at least a portion of the packaging portion is located in the packaging cavity.

[0008] Optionally, the at least one optical unit and the injection-molded packaging shell are an integral structure or a separate structure.

[0009] Optionally, the injection-molded packaging shell includes a first shell portion and a second shell portion, and the first shell portion and the second shell portion are combined to form the packaging cavity.

[0010] Optionally, the packaging portion is a transparent structure, and a surface of the packaging portion close to the second opening has a collimating optical curved surface.

[0011] Optionally, a limiting structure is provided on an inner wall of the packaging cavity, and the limiting structure is used to limit the position of the packaging part in the packaging cavity.

[0012] Optionally, the limiting structure includes a limiting surface, which is arranged on the inner wall of the packaging cavity, and the side wall of the packaging part is provided with a matching surface adapted to the limiting surface, and when the packaging part is located in the packaging cavity, the matching surface is in contact with the limiting surface.

[0013] In a second aspect, an embodiment of the present invention provides a method for preparing a laser module, comprising:

[0014] An injection-molded packaging shell and at least one optical unit are provided, wherein the injection-molded packaging shell forms a packaging cavity, and two ends of the packaging cavity are respectively provided with a first opening and a second opening; and at least one optical unit is provided between the first opening and the second opening;

[0015] A laser package is provided and fixed on one side of the first opening. The laser package comprises a packaging portion, wherein at least a portion of the packaging portion is located in the packaging cavity.

[0016] Optionally, an injection molded packaging housing and at least one optical unit are provided, including:

[0017] The at least one optical unit and the injection-molded packaging shell are formed by injection molding, wherein the at least one optical unit and the injection-molded packaging shell are an integrated structure.

[0018] Optionally, the injection-molded packaging shell includes a first shell portion and a second shell portion, and the first shell portion and the second shell portion are combined to form the packaging cavity;

[0019] An injection molded packaging housing and at least one optical unit are provided, comprising:

[0020] A first housing portion, a second housing portion and at least one optical unit are respectively formed by injection molding, wherein the at least one optical unit and the first housing portion are an integral structure;

[0021] After providing the laser package, including:

[0022] The second shell part is buckled correspondingly and the assembly is completed by welding.

[0023] Optionally, the injection-molded packaging shell includes a first shell portion and a second shell portion, and the first shell portion and the second shell portion are combined to form the packaging cavity;

[0024] An injection molded packaging housing and at least one optical unit are provided, comprising:

[0025] A first housing portion, a second housing portion and at least one optical unit are respectively formed by injection molding, wherein the at least one optical unit and the first housing portion are separate structures;

[0026] After providing the laser package, including:

[0027] The second shell part is buckled correspondingly and the assembly is completed by welding.

[0028] Optionally, a limiting structure is further provided on the inner wall of the packaging cavity, and the limiting structure limits the position of the packaging part in the packaging cavity;

[0029] The limiting structure includes a limiting surface, which is arranged on the inner wall of the packaging cavity. The side wall of the packaging part is provided with a matching surface adapted to the limiting surface. When the packaging part is located in the packaging cavity, the matching surface is in contact with the limiting surface.

[0030] Optionally, a laser package is provided, comprising: the packaging portion is a transparent structure, and a surface of the packaging portion close to the second opening has a collimating optical curved surface.

[0031] The laser module provided by the embodiment of the present invention uses an injection-molded packaging shell to provide a packaging cavity, and a first opening and a second opening are respectively arranged at two ends of the packaging cavity; at least one optical unit is located between the first opening and the second opening; the laser package is arranged on one side of the first opening, so that during the assembly process of the laser module, the laser package can be fixed to the injection-molded packaging shell by inserting the packaging part of the laser package into the first opening side of the injection-molded packaging shell, and the packaging position of the laser package can be quickly located by using the size of the packaging part or all of the packaging part inserted into the packaging cavity as a positioning reference, thereby reducing the difficulty of assembling the laser module, facilitating automated production, and improving the production efficiency of the product, and the use of the injection-molded packaging shell can effectively reduce the use of metal materials and reduce production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1-Figure 4 It is a structural schematic diagram of a laser module of the related technology;

[0033] Figure 5 A schematic diagram of the structure of a laser module provided by an embodiment of the present invention;

[0034] Figure 6 A schematic diagram of the structure of a laser module provided by an embodiment of the present invention;

[0035] Figure 7-10 A schematic diagram of the structure of a laser package provided by an embodiment of the present invention;

[0036] Fig.11 A schematic structural diagram of an injection-molded packaging shell provided by an embodiment of the present invention;

[0037] Fig.12A schematic structural diagram of an injection-molded packaging shell provided by an embodiment of the present invention;

[0038] Fig.13 A schematic structural diagram of an injection-molded packaging shell provided by an embodiment of the present invention;

[0039] Fig.14 A schematic diagram of the assembly structure of a laser package provided by an embodiment of the present invention;

[0040] Fig.15 A schematic diagram of the assembly structure of another laser package provided by an embodiment of the present invention;

[0041] Fig.16 A schematic diagram of the assembly structure of a laser package provided by an embodiment of the present invention;

[0042] Fig.17 A schematic diagram of the structure of a laser package provided by an embodiment of the present invention;

[0043] Figure 18-Figure 20 A schematic diagram of the cross-sectional structure of an injection-molded packaging shell provided by an embodiment of the present invention;

[0044] Fig.21 A schematic structural diagram of another injection-molded packaging shell provided by an embodiment of the present invention;

[0045] Fig. 22 A schematic structural diagram of another laser package 130 provided in an embodiment of the present invention;

[0046] Fig.23 A schematic diagram of a process for preparing a laser module provided by an embodiment of the present invention;

[0047] Fig.24 A schematic flow chart of another method for preparing a laser module provided in an embodiment of the present invention;

[0048] Fig.25 A schematic flow chart of another method for preparing a laser module provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0049] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0050] The existing collimated laser or line laser modules are mainly packaged in copper sleeves. Figure 1-Figure 4 The structure diagram of the laser module of the related art is shown in FIG. 1 , wherein the copper sleeve comprises a first inner copper tube, a second inner copper tube and an outer copper tube. Figure 1 , assemble the first inner copper tube 110 and the collimating lens 120; see Figure 2 , and then assemble the laser package 130 to the first inner copper tube 110; see Figure 3 , the copper tube 140 and the output mirror 150 in the second part are assembled; see Figure 4 , assemble the first inner copper tube 110, the second inner copper tube 140 and the outer copper tube 160. The assembly process requires multiple adjustments of the relative positions of the laser, the front collimator 120 and the output mirror 150 to achieve the pre-designed effect of the light spot, and the multi-step assembly process makes the assembly process complicated, which is not conducive to automated production and affects the production efficiency of the product.

[0051] In view of this, Figure 5 A schematic diagram of the structure of a laser module provided by an embodiment of the present invention, Figure 6 A schematic diagram of the structure of a laser module provided by an embodiment of the present invention, see Figure 5 and Figure 6 , comprising: at least one optical unit 210, an injection-molded packaging shell 220 and a laser package 130;

[0052] The injection-molded packaging shell 220 forms a packaging cavity, and a first opening and a second opening are respectively provided at two ends of the packaging cavity; at least one optical unit 210 is located between the first opening and the second opening;

[0053] The laser package 130 is disposed at one side of the first opening, and the laser package 130 includes a packaging portion 131 ; wherein at least a portion of the packaging portion 131 is located in the packaging cavity.

[0054] Specifically, the injection molded packaging shell 220 can be made of injection molding material and prepared by an injection molding process, wherein the injection molded packaging shell 220 can be an integral injection molding structure, and the injection molded packaging shell 220 constitutes a packaging cavity. The injection molded packaging shell 220 can also be set as a split injection molding structure of multiple components according to production requirements, and the packaging cavity is formed by combination. The length dimension of the injection molded packaging shell 220, as well as the length and inner diameter of the packaging cavity, can be determined according to the specific laser module packaging requirements, and no specific restrictions are made here.

[0055] The packaging cavity is a storage space for each device in the laser module. A first opening and a second opening are respectively provided at both ends of the packaging cavity. Exemplarily, the first opening can be used as an input port for the laser light, and the second opening can be used as an output port for the laser light. In some other embodiments, the second opening can be used as an input port for the laser light, and the first opening can be used as an output port for the laser light. In the embodiment of the present invention, taking the first opening as the input port for the laser light and the second opening as the output port for the laser light as an example, at least one optical unit 210 is provided between the second opening and the first opening. At least one optical unit 210 is used for output spot shaping of the laser module. For example, at least one optical unit 210 may include a collimator 120. After the laser light is input and passes through the collimator 120, a collimated laser can be output. See. Figure 5 At least one optical unit 210 may further include a collimator 120 and a wave mirror 121. The laser light input is collimated by the collimator 120 and then shaped by the wave mirror 121 to output a linear laser. In some other embodiments, see Figure 6 According to the needs of the laser output of the laser module, at least one optical unit 210 may also include other types of optical curved surfaces. In some other embodiments, at least one optical unit 210 may be integrally injection molded with the injection molded packaging shell 220, and the injection molded packaging shell 220, as a packaging sleeve, may be directly plugged into the laser package 130 to complete the assembly. Exemplarily, at least one optical unit 210 may also be a separate structure from the injection molded packaging shell 220, and at least one optical unit 210 may be disposed on one side of the second opening for assembly and fixation.

[0056] The laser package 130 is a packaging structure of the laser. The laser package 130 includes a light emitting unit (not shown in the figure) and a packaging part 131. The packaging part 131 is arranged on one side of the light emitting unit. For example, Figure 7-10 A schematic diagram of the structure of a laser package provided by an embodiment of the present invention, see Figure 7 The laser package 130 may be a ceramic SMD package structure, and a package portion 131 is provided on one side of the light emitting unit by a molding process. For example, the surface of the package portion 131 away from the light emitting unit may be provided as an optical curved surface, so as to adapt to different optical solutions. Figure 8 and Fig. 9 The laser package 130 may be a pin-type lamp bead package structure, and the molding structure of the lamp bead may serve as the package portion 131. For example, the surface of the package portion 131 may be made into a flat head, a spherical head, or a non-spherical head to adapt to different optical solutions. Fig.10The laser package 130 can be a metal frame packaging structure, and a packaging part 131 is set on one side of the laser through a molding process. For example, the surface of the packaging part 131 away from the light-emitting unit can be set as an optical curved surface, so that different optical schemes can be adapted. Among them, the packaging part 131 can be a transparent material, so as not to affect the laser emission intensity of the laser light-emitting unit. During the assembly process of the laser module, it is only necessary to insert the packaging part 131 of the laser package 130 into the first opening side of the injection molding packaging shell 220, and then fix the laser package 130 to the injection molding packaging shell 220 by UV lamp glue and UV lamp curing. At the same time, the packaging part 131 is used as a positioning reference. For example, according to the size of the packaging part 131 entering the packaging cavity, part or all of the packaging part 131 is inserted into the packaging cavity, so that the packaging position of the laser package 130 can be located. In order to improve the position stability of the packaging part 131 and the packaging cavity, the diameter width of the packaging part 131 and the diameter width of the packaging cavity can be adapted to avoid a large gap during insertion, which affects the stability of the positional relationship between the two.

[0057] The laser module provided by the embodiment of the present invention uses an injection-molded packaging shell 220 to provide a packaging cavity, and a first opening and a second opening are respectively arranged at both ends of the packaging cavity; at least one optical unit 210 is located between the first opening and the second opening; the laser package 130 is arranged on one side of the first opening, so during the assembly process of the laser module, the laser package 130 can be fixed to the injection-molded packaging shell 220 by inserting the packaging part 131 of the laser package 130 into the first opening side of the injection-molded packaging shell 220, and the packaging position of the laser package 130 can be quickly located by using the size of the packaging part 131 partially or completely inserted into the packaging cavity as a positioning reference, thereby reducing the assembly difficulty of the laser module, facilitating automated production, and improving the production efficiency of the product, and the use of the injection-molded packaging shell 220 can effectively reduce the use of metal materials and reduce production costs.

[0058] Based on the above embodiment, optionally, at least one optical unit 210 and the injection-molded packaging shell 220 are an integrated structure.

[0059] Specifically, the optical unit 210 and the injection-molded packaging shell 220 can be integrally formed by an injection molding process. That is, according to the design position of at least one optical unit 210 in the laser module, the optical unit 210 is formed at a corresponding position. According to the requirements of the laser module for the output laser spot, at least one optical unit 210 may include one or more of a free optical surface, a wave mirror 121, and a collimating lens 120. Fig.11 A schematic diagram of the structure of an injection molded packaging shell provided by an embodiment of the present invention, see Fig.11The optical unit 210 and the injection molded packaging shell 220 are an integrated structure. Figure 7-10 During the assembly process of the laser module, it is only necessary to insert the packaging part 131 of the laser package 130 into the first opening side of the injection molded packaging shell 220, and then fix the laser package 130 to the injection molded packaging shell 220 by adding ultraviolet lamp glue and ultraviolet lamp curing. In order to further improve the light spot effect, the light-emitting unit can be lit during the assembly process, and the required light spot effect can be formed by adjusting the relationship between the laser package 130 and the optical unit 210. Finally, the welding wire is connected to form the required laser module structure. It should be noted that since the optical unit 210 and the injection molded packaging shell 220 are an integrated structure, the optical unit 210 and the injection molded packaging shell 220 should use a light-transmitting injection molding material, such as polycarbonate (PC), acrylic plastic (PMMA) or cycloolefin copolymer (COC) material, so as not to affect the output characteristics of the optical unit 210.

[0060] Optional, Fig.12 A schematic diagram of the structure of an injection molded packaging shell provided by an embodiment of the present invention, see Fig.12 The optical unit 210 and the injection-molded packaging shell 220 can also be a split structure, that is, the injection-molded packaging shell 220 forms a sleeve structure. According to the design position of at least one optical unit 210 in the laser module, the optical unit 210 is assembled into the packaging cavity, and the packaging part 131 of the laser package 130 is inserted into the first opening side of the injection-molded packaging shell 220. Then, the laser package 130 and the injection-molded packaging shell 220 can be fixed by ultraviolet lamp glue and ultraviolet lamp curing. It should be noted that when the optical unit 210 and the injection-molded packaging shell 220 are split structures, the injection-molded packaging shell 220 can use translucent injection molding materials and non-translucent injection molding materials as needed, such as polycarbonate (PC), acrylic plastic (PMMA), cycloolefin copolymer (COC), polyethylene (PE), polyoxymethylene resin (POM), nylon (PA), polypropylene (PP), polystyrene (PS), thermoplastic elastomer (TPE), thermoplastic polyurethane (TPU) or acrylonitrile-butadiene-styrene copolymer (ABS) engineering plastics.

[0061] Optional, Fig.13 A schematic diagram of the structure of an injection molded packaging shell provided by an embodiment of the present invention, see Fig.13 The injection-molded packaging shell 220 includes a first shell portion 221 and a second shell portion 222 , and the first shell portion 221 and the second shell portion 222 are combined to form a packaging cavity.

[0062] Specifically, the injection-molded packaging shell 220 can also be set as a split injection-molded structure of multiple parts according to production requirements. For example, the injection-molded packaging shell 220 can be made into two parts. The injection-molded packaging shell 220 is made in half to obtain a first shell part 221 and a second shell part 222. The first shell part 221 and the second shell part 222 have recessed parts. After the first shell part 221 and the second shell part 222 are combined, the recessed parts can be combined into a packaging cavity. Fig.14 A schematic diagram of the assembly structure of a laser package provided by an embodiment of the present invention, see Fig.14 In the assembly process of the laser module, the first shell part 221 or the second shell part 222 can be selected as the base. Taking the first shell part 221 as the base, for example, the optical unit 210 is placed in the recessed part of the first shell part 221, wherein a corresponding limiting structure, such as a protrusion or a groove, can be provided on the inner wall of the recessed part of the first shell part 221, which can limit the placement position of the optical unit 210, or the placement position of the optical unit 210 can be positioned by a fixture. In the embodiment of the present invention, illustratively, the optical unit 210 can include a wave mirror 121 and a collimator mirror 120, which are placed in sequence, and finally the laser package 130 is placed in the first shell part 221, and finally the first shell part 221 is buckled, and each part is ultrasonically welded by ultrasonic welding, thereby reducing the difficulty of assembling the laser module.

[0063] Fig.15 A schematic diagram of an assembly structure of another laser package provided by an embodiment of the present invention, Fig.16 A schematic diagram of the assembly structure of a laser package provided by an embodiment of the present invention, see Fig.15 and Fig.16 The laser package 130 can be a ceramic chip packaging structure. The first shell part 221, the second shell part 222 and the optical unit 210 are assembled to form an optical component 310. Finally, the optical component 310 and the ceramic chip laser package 130 are mounted together by high-precision mounting equipment, and the assembly is completed by bonding with ultraviolet glue, which also reduces the difficulty of assembling the laser module.

[0064] Based on the above embodiments, see Figure 7 , Fig. 9 and Fig.10 The packaging part 131 may be a transparent structure, and the surface of the packaging part 131 near the second opening has a collimating optical curved surface. Therefore, the optical unit 210 can be reduced in the injection molding packaging shell 220, and the packaging part 131 can be used to achieve the collimating effect. Figure 5At least one optical unit 210 can be integrally injection molded with the injection molded packaging shell 220. The injection molded packaging shell 220, as a packaging sleeve, can be directly plugged into the laser package 130 to complete the assembly. The laser module can achieve collimation and output of the desired spot shape, reducing the difficulty of assembling the laser module.

[0065] Fig.17 A schematic diagram of the structure of a laser package provided by an embodiment of the present invention, see Fig.17 The injection-molded packaging shell 220 includes a first shell portion 221 and a second shell portion 222. During the assembly process of the laser module, the first shell portion 221 or the second shell portion 222 can be selected as the base. Taking the first shell portion 221 as the base as an example, the optical unit 210 can be an integrated structure with the first shell portion 221. The laser package 130 is placed in the first shell portion 221. The surface of the packaging portion 131 close to the second opening has a collimating optical surface. Finally, the first shell portion 221 is buckled, and the parts are welded by ultrasonic welding. The laser module can achieve collimation and the output of the required spot shape, which reduces the difficulty of assembling the laser module.

[0066] Based on the above embodiments, combined with Fig.14 When the optical unit 210 and the injection-molded packaging shell 220 are separate structures, the inner wall of the packaging cavity can be provided with a corresponding limiting structure, such as a protrusion or a groove, to limit the placement position of the optical unit 210. Fig.12 For the sleeve-shaped injection-molded packaging shell 220, if the optical unit 210 and the injection-molded packaging shell 220 are split structures, the inner diameter of the packaging cavity can be set to gradually decrease, and the aperture of the second opening can be larger than the aperture of the first opening. By processing the optical unit 210 into different diameters, when the optical unit 210 is placed, the optical unit 210 can be correspondingly stuck to the corresponding position of the same diameter of the packaging cavity.

[0067] The inner wall of the packaging cavity may also be provided with a limiting structure for the packaging part 131, such as a protrusion, a groove or a plane, which may limit the size of the packaging part 131 entering the packaging cavity. Optionally, the limiting structure includes a limiting surface, the limiting surface is provided on the inner wall of the packaging cavity, and the side wall of the packaging part 131 is provided with a matching surface adapted to the limiting surface, and when the packaging part 131 is located in the packaging cavity, the matching surface is in contact with the limiting surface.

[0068] Specifically, a limiting surface is provided on the inner wall of the packaging cavity. Figure 18-Figure 20 The schematic diagram of the cross-sectional structure of an injection-molded package shell provided by an embodiment of the present invention is as follows: the limiting surface can be a flat surface with flat edges, an arc surface, or a combination of multiple surfaces. Fig.21 Take this as an example to illustrate: Fig.21A schematic diagram of another injection-molded packaging shell provided by an embodiment of the present invention is shown in FIG. Fig.21 The packaging cavity in the injection-molded packaging shell 220 is provided with a limiting surface 410 at the second opening, and the limiting surface 410 is a plane with flat edges. Fig. 22 A schematic diagram of the structure of another laser package 130 provided in an embodiment of the present invention is shown in FIG. Fig. 22 , a matching surface 420 is provided on the side wall of the laser package 130. When the laser package 130 is plugged in or placed, the matching surface 420 is in contact with the limiting surface 410 in conjunction with the base of the laser package 130. When the position of the laser package 130 is inaccurate and the matching surface 420 does not match the limiting surface 410, the laser package 130 cannot enter the package cavity, so that the position of the laser package 130 can be limited by the limiting surface 410. Therefore, the module can be manufactured in a way that does not require online dimming during the assembly process, and a better spot effect can be obtained, thereby improving the assembly efficiency. It should be noted that if the optical unit 210 and the injection molded package shell 220 are an integrated structure, the limiting surface 410 cannot affect the effective area of ​​the optical unit 210. When the laser package 130 has a collimated optical surface, the matching surface 420 cannot affect the optical properties of the collimated optical surface of the package.

[0069] Fig.23 A schematic diagram of a process for preparing a laser module according to an embodiment of the present invention is shown in FIG. Fig.23 ,include:

[0070] S110, providing an injection-molded packaging shell 220 and at least one optical unit 210, wherein the injection-molded packaging shell 220 constitutes a packaging cavity, and a first opening and a second opening are respectively disposed at two ends of the packaging cavity; and the at least one optical unit 210 is disposed between the first opening and the second opening;

[0071] Specifically, the injection molded packaging shell 220 can be made of injection molding material and prepared by an injection molding process, wherein the injection molded packaging shell 220 can be an integral injection molding structure, and the injection molded packaging shell 220 constitutes a packaging cavity. The injection molded packaging shell 220 can also be set as a split injection molding structure of multiple components according to production requirements, and the packaging cavity is formed by combination. The length dimension of the injection molded packaging shell 220, as well as the length and inner diameter of the packaging cavity, can be determined according to the specific laser module packaging requirements, and no specific restrictions are made here.

[0072] The packaging cavity is a accommodating space for each device in the laser module. The first opening and the second opening are respectively provided at both ends of the packaging cavity. For example, the first opening can be used as the input port of the laser light, and the second opening can be used as the output port of the laser light. In some other embodiments, the second opening can be used as the input port of the laser light, and the first opening can be used as the output port of the laser light. In the embodiment of the present invention, taking the first opening as the input port of the laser light and the second opening as the output port of the laser light as an example, at least one optical unit 210 is arranged between the second opening and the first opening, and at least one optical unit 210 is used for shaping the output spot of the laser module. For example, at least one optical unit 210 may include a collimator 120, and after the laser light is input, it can output a collimated laser after passing through the collimator 120. At least one optical unit 210 may also include a collimator 120 and a wave mirror 121. After the laser light is input, it is collimated by the collimator 120 and then shaped by the wave mirror 121 to output a linear laser. In some other embodiments, according to the requirements of the laser output of the laser module, the at least one optical unit 210 may also include other types of optical curved surfaces. Exemplarily, the at least one optical unit 210 may be integrally injection molded with the injection molded packaging shell 220. Exemplarily, the at least one optical unit 210 may also be a separate structure from the injection molded packaging shell 220, and the at least one optical unit 210 may be disposed on one side of the second opening for assembly and fixation.

[0073] S120, providing a laser package 130, fixing the laser package 130 on one side of the first opening, wherein the laser package 130 includes a packaging portion 131; wherein at least a portion of the packaging portion 131 is located in the packaging cavity.

[0074] Specifically, the laser package 130 is arranged on one side of the first opening. The laser package 130 is a packaging structure of the laser, and the laser package 130 includes a light-emitting unit and a packaging part 131, and the packaging part 131 is arranged on one side of the light-emitting unit, wherein the packaging part 131 is a transparent material, so as not to affect the laser emission intensity of the laser light-emitting unit. During the assembly process of the laser module, it is only necessary to insert the packaging part 131 of the laser package 130 into one side of the first opening of the injection-molded packaging shell 220, and then fix the laser package 130 to the injection-molded packaging shell 220 by means of ultraviolet lamp glue and ultraviolet lamp curing. At the same time, the packaging part 131 is used as a positioning reference. For example, according to the size of the packaging part 131 entering the packaging cavity, part or all of the packaging part 131 is inserted into the packaging cavity, so that the packaging position of the laser package 130 can be located. In order to improve the position stability of the packaging part 131 and the packaging cavity, the diameter width of the packaging part 131 and the diameter width of the packaging cavity can be adapted to avoid gaps during insertion, which affects the stability of the positional relationship between the two.

[0075] The preparation method of the laser module provided by the embodiment of the present invention uses an injection-molded packaging shell 220 to provide a packaging cavity, and a first opening and a second opening are respectively set at both ends of the packaging cavity; at least one optical unit 210 is located between the first opening and the second opening; the laser package 130 is set on one side of the first opening, so during the assembly process of the laser module, the laser package 130 can be fixed to the injection-molded packaging shell 220 by inserting the packaging part 131 of the laser package 130 into the first opening side of the injection-molded packaging shell 220, and the size of the packaging part 131 partially or completely inserted into the packaging cavity is used as a positioning reference, so that the packaging position of the laser package 130 can be quickly located, which reduces the difficulty of assembling the laser module, is conducive to automated production, and improves the production efficiency of the product. In addition, the use of the injection-molded packaging shell 220 can effectively reduce the use of metal materials and reduce production costs.

[0076] Optionally, an injection molded packaging housing 220 and at least one optical unit 210 are provided, including:

[0077] At least one optical unit 210 and an injection-molded encapsulation shell 220 are formed by injection molding, wherein the at least one optical unit 210 and the injection-molded encapsulation shell 220 are an integrated structure.

[0078] Specifically, the optical unit 210 and the injection molded packaging shell 220 can be integrally formed by an injection molding process. That is, according to the design position of at least one optical unit 210 in the laser module, the optical unit 210 is molded at a corresponding position. According to the requirements of the laser module for the outgoing laser spot, at least one optical unit 210 may include one or more of a free optical surface, a wave mirror 121 and a collimating mirror 120. During the assembly process of the laser module, it is only necessary to insert the packaging part 131 of the laser package 130 into the first opening side of the injection molded packaging shell 220, and then fix the laser package 130 to the injection molded packaging shell 220 by curing with ultraviolet lamp glue and ultraviolet lamp. To further improve the spot effect, the light-emitting unit can be lit during the assembly process, and the desired spot effect can be formed by adjusting the relationship between the laser package 130 and the optical unit 210. Finally, the welding wire is connected to form the required laser module structure. It should be noted that, since the optical unit 210 and the injection-molded packaging shell 220 are an integrated structure, the optical unit 210 and the injection-molded packaging shell 220 should use a light-transmitting injection molding material, such as polycarbonate (PC), acrylic plastic (PMMA) or cycloolefin copolymer (COC) material, so as not to affect the optical properties of the optical unit 210.

[0079] Optionally, the optical unit 210 and the injection molded packaging shell 220 can also be a split structure, that is, the injection molded packaging shell 220 forms a sleeve structure, and the optical unit 210 is assembled into the packaging cavity according to the design position of at least one optical unit 210 in the laser module, and the packaging part 131 of the laser package 130 is inserted into the first opening side of the injection molded packaging shell 220, and then the laser package 130 and the injection molded packaging shell 220 are fixed by ultraviolet lamp glue and ultraviolet lamp curing. It should be noted that when the optical unit 210 and the injection-molded packaging shell 220 are split structures, the injection-molded packaging shell 220 can use translucent injection molding materials and non-translucent injection molding materials as needed, such as polycarbonate (PC), acrylic plastic (PMMA), cycloolefin copolymer (COC), polyethylene (PE), polyoxymethylene resin (POM), nylon (PA), polypropylene (PP), polystyrene (PS), thermoplastic elastomer (TPE), thermoplastic polyurethane (TPU) or acrylonitrile-butadiene-styrene copolymer (ABS) engineering plastics.

[0080] Fig.24 A schematic diagram of a process for preparing a laser module according to an embodiment of the present invention is shown in FIG. Fig.24 ,include:

[0081] S210, respectively injecting and forming a first housing portion 221, a second housing portion 222 and at least one optical unit 210, wherein the at least one optical unit 210 and the first housing portion 221 are an integral structure, and the first housing portion 221 and the second housing portion 222 can be combined to form a packaging cavity, and a first opening and a second opening are respectively provided at two ends of the packaging cavity; and the at least one optical unit 210 is provided between the first opening and the second opening;

[0082] Specifically, the injection molded packaging shell 220 can be made into two parts. The injection molded packaging shell 220 is made in half to obtain a first shell part 221 and a second shell part 222. The first shell part 221 and the second shell part 222 have recessed parts. After the first shell part 221 and the second shell part 222 are combined, the recessed parts can be combined into a packaging cavity.

[0083] S220, providing a laser package 130, fixing the laser package 130 on one side of the first opening, wherein the laser package 130 comprises a packaging portion 131; wherein at least a portion of the packaging portion 131 is located in the packaging cavity.

[0084] Specific, combined Fig.15During the assembly process of the laser module, the first shell part 221 or the second shell part 222 can be selected as the base. Taking the first shell part 221 as the base as an example, the optical unit 210 can be an integrated structure with the first shell part 221, and the laser package 130 can be placed in the first shell part 221.

[0085] S230, correspondingly buckle the second shell part 222 and complete the assembly by welding.

[0086] Fig.25 A schematic diagram of a process for preparing a laser module according to an embodiment of the present invention is shown in FIG. Fig.25 ,include:

[0087] S310, respectively injecting and forming a first housing portion 221, a second housing portion 222 and at least one optical unit 210, wherein the at least one optical unit 210 and the first housing portion 221 are separate structures, and the first housing portion 221 and the second housing portion 222 can be combined to form a packaging cavity, and a first opening and a second opening are respectively provided at two ends of the packaging cavity; and the at least one optical unit 210 is provided between the first opening and the second opening;

[0088] Specifically, the injection molded packaging shell 220 can be made into two parts, and the injection molded packaging shell 220 is made in half to obtain a first shell part 221 and a second shell part 222. The first shell part 221 and the second shell part 222 have a recessed portion. After the first shell part 221 and the second shell part 222 are combined, the recessed portion can be combined into a packaging cavity. The injection molded packaging shell 220 forms a sleeve structure, and the optical unit 210 is assembled into the packaging cavity according to the design position of at least one optical unit 210 in the laser module.

[0089] S320, providing a laser package 130, fixing the laser package 130 on one side of the first opening, wherein the laser package 130 includes a packaging portion 131; wherein at least a portion of the packaging portion 131 is located in the packaging cavity.

[0090] Specifically, the optical unit 210 is placed in the recessed portion of the first shell part 221, wherein a corresponding limiting structure, such as a protrusion or a groove, may be provided on the inner wall of the recessed portion of the first shell part 221, which may limit the placement position of the optical unit 210, or the placement position of the optical unit 210 may be positioned by a fixture. In the embodiment of the present invention, illustratively, the optical unit 210 may include a wave mirror 121 and a collimator mirror 120, which are placed in sequence, and finally the laser package 130 is placed in the first shell part 221, and finally the first shell part 221 is buckled, and the various parts are welded by ultrasonic welding, thereby reducing the difficulty of assembling the laser module.

[0091] S330, correspondingly buckle the second shell part 222 and complete the assembly by welding.

[0092] Based on the above embodiment, optionally, a limiting structure is further provided on the inner wall of the packaging cavity, and the limiting structure limits the position of the packaging portion 131 in the packaging cavity;

[0093] The limiting structure includes a limiting surface 410, which is arranged on the inner wall of the packaging cavity. The side wall of the packaging part 131 is provided with a matching surface 420 adapted to the limiting surface 410. When the packaging part 131 is located in the packaging cavity, the matching surface 420 is in contact with the limiting surface 410.

[0094] Specifically, a limiting surface 410 is provided on the inner wall of the packaging cavity, Figure 16-Figure 20 , the limiting surface 410 can be a flat-edged plane, an arc-shaped surface or a combination of multiple surfaces. The packaging cavity in the injection-molded packaging shell 220 is provided with a limiting surface 410 at the second opening, and the limiting surface 410 is a flat-edged plane. A matching surface 420 is provided on the side wall of the laser package 130. When the laser package 130 is plugged or placed, the matching surface 420 is in contact with the limiting surface 410 in conjunction with the base of the laser package 130. When the position of the laser package 130 is inaccurate, the matching surface 420 does not match the limiting surface 410, and the laser package 130 cannot enter the packaging cavity, so that the position of the laser package 130 can be limited by the limiting surface 410. Therefore, the module can be made in a way that does not require online dimming during the assembly process, and a better spot effect can be obtained, thereby improving the assembly efficiency. It should be noted that if the optical unit 210 and the injection-molded packaging shell 220 are a one-day structure, the limiting surface 410 cannot affect the effective area of ​​the optical unit 210. When the package has a collimating optical curved surface, the matching surface 420 cannot affect the optical properties of the collimating optical curved surface of the package.

[0095] Optionally, a laser package 130 is provided, including: a packaging portion 131 having a transparent structure, and a surface of the packaging portion 131 close to the second opening having a collimating optical curved surface. Therefore, the arrangement of the optical unit 210 can be reduced accordingly in the injection-molded packaging shell 220, and the collimation effect can be achieved by using the packaging portion 131. At least one optical unit 210 can be integrally injection-molded with the injection-molded packaging shell 220. The injection-molded packaging shell 220 serves as a packaging sleeve and can be directly plugged into the laser package 130 to complete the assembly. The laser module can achieve collimation and output of the desired spot shape, reducing the difficulty of assembling the laser module.

[0096] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A laser module, characterized in that: include: at least one optical unit, an injection molded packaging housing, and a laser package; The injection-molded packaging shell forms a packaging cavity, and two ends of the packaging cavity are respectively provided with a first opening and a second opening; The at least one optical unit is located between the first opening and the second opening; The laser package is disposed at one side of the first opening, and the laser package comprises a packaging portion; wherein at least a portion of the packaging portion is located in the packaging cavity.

2. The laser module according to claim 1, characterized in that: The at least one optical unit and the injection-molded packaging shell are an integral structure or a separate structure.

3. The laser module according to any one of claim 2, characterized in that: The injection-molded packaging shell includes a first shell portion and a second shell portion, and the first shell portion and the second shell portion are combined to form the packaging cavity.

4. The laser module according to claim 2, characterized in that: The packaging part is a transparent structure, and a surface of the packaging part close to the second opening has a collimating optical curved surface.

5. The laser module according to any one of claims 1 to 4, characterized in that: The inner wall of the packaging cavity is provided with a limiting structure, and the limiting structure is used to limit the position of the packaging part in the packaging cavity.

6. The laser module according to claim 5, characterized in that: The limiting structure includes a limiting surface, which is arranged on the inner wall of the packaging cavity. The side wall of the packaging part is provided with a matching surface adapted to the limiting surface. When the packaging part is located in the packaging cavity, the matching surface is in contact with the limiting surface.

7. A method for preparing a laser module, characterized in that: include: An injection-molded packaging shell and at least one optical unit are provided, wherein the injection-molded packaging shell forms a packaging cavity, and two ends of the packaging cavity are respectively provided with a first opening and a second opening; at least one optical unit is disposed between the first opening and the second opening; A laser package is provided and fixed on one side of the first opening. The laser package comprises a packaging portion, wherein at least a portion of the packaging portion is located in the packaging cavity.

8. The method for preparing a laser module according to claim 7, characterized in that: An injection molded packaging housing and at least one optical unit are provided, comprising: The at least one optical unit and the injection-molded packaging shell are formed by injection molding, wherein the at least one optical unit and the injection-molded packaging shell are an integrated structure.

9. The method for preparing a laser module according to claim 7, characterized in that: The injection-molded packaging shell comprises a first shell portion and a second shell portion, wherein the first shell portion and the second shell portion are combined to form the packaging cavity; An injection molded packaging housing and at least one optical unit are provided, comprising: A first housing portion, a second housing portion and at least one optical unit are respectively formed by injection molding, wherein the at least one optical unit and the first housing portion are an integral structure; After providing the laser package, including: The second shell part is buckled correspondingly and the assembly is completed by welding.

10. The method for preparing a laser module according to claim 7, characterized in that: The injection-molded packaging shell comprises a first shell portion and a second shell portion, wherein the first shell portion and the second shell portion are combined to form the packaging cavity; An injection molded packaging housing and at least one optical unit are provided, comprising: A first housing portion, a second housing portion and at least one optical unit are respectively formed by injection molding, wherein the at least one optical unit and the first housing portion are separate structures; After providing the laser package, including: The second shell part is buckled correspondingly and the assembly is completed by welding.

11. The method for preparing a laser module according to any one of claims 7 to 10, characterized in that: The inner wall of the packaging cavity is also provided with a limiting structure, and the limiting structure limits the position of the packaging part in the packaging cavity; The limiting structure includes a limiting surface, which is arranged on the inner wall of the packaging cavity. The side wall of the packaging part is provided with a matching surface adapted to the limiting surface. When the packaging part is located in the packaging cavity, the matching surface is in contact with the limiting surface.

12. The method for preparing a laser module according to any one of claims 7 to 10, characterized in that: A laser package is provided, comprising: the package part is a transparent structure, and the surface of the package part close to the second opening has a collimating optical curved surface.

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