Optical module

Abstract

The invention provides an optical module, which comprises a circuit board, an MCU and a digital signal processor, and is characterized in that the circuit board comprises a top layer, a bottom layer and an inner layer, a golden finger and a signal wire connected with the golden finger are formed on the top layer, and a signal transmission line is arranged on the inner layer; a register is arranged in the MCU, the MCU modifies the value of the register according to the type of an electric signal transmitted by the golden finger, and the digital signal processor switches an electric signal processing mode according to the value of the register; the digital signal processor comprises a first electrical interface for transmitting a first electrical signal and a second electrical interface for transmitting a second electrical signal, the signal wire is directly connected with the first electrical interface, the signal wire is connected with the signal transmission line and the second electrical interface through a via hole, and the transmission rates of the first electrical signal and the second electrical signal are different. The digital signal processor has a working mode for processing different types of electric signals, and different electric signals are transmitted through the signal wires on the circuit board, so that the optical module is compatible with different electric signals.

Description

Technical Field

[0001] The present disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the development and progress of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for converting optical and electrical signals and are one of the key components in optical communication equipment.

[0003] At present, optical modules mainly use non-return-to-zero (NRZ) signals for electrical signal transmission. With the development of optical communication technology, the transmission rate of optical modules is constantly increasing. In order to meet the needs of high transmission rate, four-level pulse amplitude modulation (4Pulse Amplitude Modulation, PAM4) signals are beginning to be used for signal transmission.

[0004] However, when the optical module transmits electrical signals, NRZ signals and PAM4 signals cannot be transmitted compatibly. When the host computer transmits electrical signals of different code types, different optical modules need to be used, which increases the number of optical modules used and makes the switching operation of different electrical signals complicated. It is not suitable for the development trend of high signal transmission rate. Summary of the invention

[0005] The embodiments of the present disclosure provide an optical module to solve the problem that the optical module cannot be compatible with different electrical signals.

[0006] In a first aspect, the present disclosure provides an optical module, comprising:

[0007] A circuit board, one end of which is provided with a gold finger, the circuit board comprising:

[0008] A top layer, located on the top surface of the circuit board, the gold finger is arranged on the top layer, a signal trace is formed on the top layer, the signal trace is connected to the gold finger, the signal trace is used to transmit a first electrical signal or a second electrical signal, and the transmission rate of the first electrical signal is different from the transmission rate of the second electrical signal;

[0009] A bottom layer, located on the bottom surface of the circuit board;

[0010] An inner layer, located between the top layer and the bottom layer, on which a signal transmission line is arranged, and the signal transmission line is connected to the signal routing line through a via hole;

[0011] MCU, installed on the top layer, wherein a register is provided in the MCU, and the MCU is used to modify the value of the register according to the type of the electrical signal transmitted by the gold finger;

[0012] A digital signal processor is installed on the top layer, the digital signal processor is connected to the MCU control, the digital signal processor includes at least two electrical signal processing modes, and the digital processor is used to switch the electrical signal processing mode according to the value of the register in the MCU; the digital signal processor includes a first electrical interface and a second electrical interface, the signal routing is directly connected to the first electrical interface, the signal routing is connected to the signal transmission line and the second electrical interface through the via, the first electrical interface is used to transmit the first electrical signal, and the second electrical interface is used to transmit the second electrical signal.

[0013] In a second aspect, the present disclosure provides an optical module, including:

[0014] A circuit board, the circuit board comprising:

[0015] A top layer, located on the top surface of the circuit board, a first gold finger is arranged on the top layer, a first signal line is formed on the top layer, the first signal line is connected to the first gold finger, and the first signal line is used to transmit a first electrical signal or a second electrical signal;

[0016] A bottom layer, located on the bottom surface of the circuit board, a second gold finger is arranged on the bottom layer, a second signal line is formed on the bottom layer, the second signal line is connected to the second gold finger, a via is formed between the bottom layer and the top layer, and the second signal line is used to transmit a second electrical signal or a first electrical signal;

[0017] MCU, installed on the top layer, wherein a register is provided in the MCU, and the MCU is used to modify the value of the register according to the type of the electrical signal transmitted by the gold finger;

[0018] A digital signal processor is installed on the top layer, the digital signal processor is connected to the MCU control, the digital signal processor includes at least two electrical signal processing modes, and the digital processor is used to switch the electrical signal processing mode according to the value of the register in the MCU; the digital signal processor includes a first electrical interface and a second electrical interface, the first signal line is directly connected to the first electrical interface, the second signal line is connected to the second electrical interface through the via, the first electrical interface is used to transmit the first electrical signal, the second electrical interface is used to transmit the second electrical signal, and the transmission rate of the first electrical signal is different from the transmission rate of the second electrical signal.

[0019] It can be seen from the above embodiments that the optical module provided in the embodiments of the present disclosure includes a circuit board, an MCU and a digital signal processor. The circuit board includes a top layer, a bottom layer and an inner layer. The top layer is located on the top surface of the circuit board. A gold finger and a signal trace are arranged on the top layer. One end of the signal trace is connected to the gold finger, and the other end of the signal trace is connected to the digital signal processor. The signal trace is used to transmit a first electrical signal or a second electrical signal. The transmission rate of the first electrical signal is different from the transmission rate of the second electrical signal. That is, the first electrical signal or the second electrical signal from the host computer is transmitted to the signal trace via the gold finger, and the signal trace transmits the first electrical signal or the second electrical signal to the digital signal processor; the bottom layer is located The bottom surface of the circuit board, the inner layer is located between the top layer and the bottom layer, and a signal transmission line is arranged on the inner layer. One end of the signal transmission line is connected to the signal routing line through a via hole, and the other end of the signal transmission line is connected to the digital signal processor through a via hole. In this way, the signal routing line transmits the second electrical signal or the first electrical signal to the digital signal processor through the hole and the signal transmission line, so that the digital signal processor can receive the first electrical signal or the second electrical signal; the MCU is installed on the top layer, and a register is set in the MCU. The MCU modifies the value of the register according to the type of electrical signal transmitted by the gold finger, so as to identify the type of electrical signal transmitted by the gold finger according to the value of the register; the digital signal processor is installed At the top level, the digital signal processor is connected to the MCU control, and the digital signal processor includes at least two electrical signal processing modes. The digital signal processor switches the electrical signal processing mode according to the value of the register in the MCU. For example, according to the value of the register in the MCU, it is obtained that the host computer transmits a first electrical signal, and the digital signal processor switches to the corresponding electrical signal processing mode so that the digital signal processor processes the first electrical signal; according to the value of the register in the MCU, it is obtained that the host computer transmits a second electrical signal, and the digital signal processor switches to the corresponding electrical signal processing mode so that the digital signal processor processes the second electrical signal; in order to enable the digital signal processor to receive The first electrical signal and the second electrical signal, the digital signal processor includes a first electrical interface and a second electrical interface, the signal routing is directly connected to the first electrical interface, the first electrical interface is used to transmit the first electrical signal, so that the first electrical signal is directly transmitted to the digital signal processor via the signal routing, and the digital signal processor processes the first electrical signal according to the corresponding electrical signal processing mode; the signal routing is connected to the signal transmission line through the hole and the second electrical interface, the second electrical interface is used to transmit the second electrical signal, so that the second electrical signal is transmitted to the digital signal processor via the signal routing, the via and the signal transmission line, and the digital signal processor processes the second electrical signal according to the corresponding electrical signal processing mode.

[0020] In this way, the optical module provided by the present invention has a digital signal processor with a working mode for processing different types of electrical signals. Different types of electrical signals are transmitted to the digital signal processor through signal routing on the circuit board, so that the optical module can be compatible with the input of different types of electrical signals, which can reduce the number of optical modules inserted into the host computer. The compatible optical module can enhance the competitiveness of the product. In terms of user use, the input method of the electrical signal can be freely switched according to the user's usage conditions, which can improve convenience. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not intended to limit the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0022] Figure 1 A partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0023] Figure 2 A partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0024] Figure 3 A structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0025] Figure 4 An exploded view of an optical module provided according to some embodiments of the present disclosure;

[0026] Figure 5 A partial structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0027] Figure 6 A schematic diagram of a signal principle of an optical module provided according to some embodiments of the present disclosure;

[0028] Figure 7 A block diagram of switching different electrical signal modes in an optical module provided according to some embodiments of the present disclosure;

[0029] Figure 8 A schematic diagram of signal routing between a gold finger and a digital signal processor in an optical module provided according to some embodiments of the present disclosure;

[0030] Fig. 9 A top wiring of a circuit board in an optical module provided according to some embodiments of the present disclosure Figure 1 ;

[0031] Fig.10 An inner layer wiring diagram of a circuit board in an optical module provided according to some embodiments of the present disclosure;

[0032] Fig.11 A top view of the wiring of a circuit board in an optical module provided according to some embodiments of the present disclosure;

[0033] Fig.12 A top view of a local wiring of a circuit board in an optical module provided according to some embodiments of the present disclosure;

[0034] Fig.13 A top wiring of a circuit board in an optical module provided according to some embodiments of the present disclosure Figure 2 ;

[0035] Fig.14 A bottom layer routing diagram of a circuit board in an optical module provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0036] Some embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. However, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0037] Unless the context requires otherwise, throughout the specification and claims, the term "comprising" is to be interpreted as having an open, inclusive meaning, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" implies open and inclusive language, which does not exclude devices that are suitable for or configured to perform additional tasks or steps; descriptions such as "parallel", "perpendicular", "same", "consistent", and "flush" are not limited to absolute mathematical theoretical relationships, but also include an acceptable error range generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0038] In optical communication technology, in order to establish information transmission between information processing devices, it is necessary to load information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When optical signals are transmitted in information transmission equipment, the loss of optical power can be reduced, so high-speed, long-distance, and low-cost information transmission can be achieved. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment usually includes optical network terminals (Optical Network Unit, ONU), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment usually includes optical fibers and optical waveguides.

[0039] The optical module can realize the mutual conversion between optical signals and electrical signals between information processing equipment and information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first optical signal from the optical fiber is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, and all information processing devices do not need to be directly connected to the optical module. Here, the information processing device directly connected to the optical module is called the upper computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be called an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be called an electrical port.

[0040] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0041] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.

[0042] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 are detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the working state of the optical module 200.

[0043] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

[0044] The host computer 100 also includes an external electrical interface, which can be connected to an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104, and the network cable interface 104 is configured to access the network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, the third electrical signal sent by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, and the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101. For example, the first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to the optical module 200, and the optical module 200 converts the first optical signal into a first electrical signal, and the optical module 200 transmits the first electrical signal to the host computer 100, and the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that the optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between the optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information can change.

[0045] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0046] Figure 2 1 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2 As shown, the host computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0047] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 establishes a bidirectional electrical signal connection with the host computer 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101.

[0048] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, Figure 4 FIG. 1 is an exploded view of an optical module provided according to some embodiments of the present disclosure. Figure 3 and Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, a light emitting component 400 and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0049] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.

[0050] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0051] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0052] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3 Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold finger 301 of the circuit board 300 extends from the electrical port and is inserted into the electrical connector of the host computer 100; the opening 205 is an optical port, which is configured to access the external optical fiber 101, so that the optical fiber 101 connects the optical emitting component 400 and the optical receiving component 500 in the optical module 200.

[0053] The assembly method of combining the upper shell 201 and the lower shell 202 is adopted, which facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the above shell, and the upper shell 201 and the lower shell 202 can encapsulate and protect the above components. In addition, when assembling the circuit board 300, the light emitting component 400 and the light receiving component 500, etc., it is convenient to deploy the positioning components, heat dissipation components and electromagnetic shielding components of these components, which is conducive to the automated production.

[0054] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0055] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0056] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the fixation of the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0057] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, transistors, metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET). The chip may include a microcontroller unit (Microcontroller Unit, MCU), a laser driver chip, a transimpedance amplifier (Transimpedance Amplifier, TIA), a limiting amplifier (Limiting Amplifier, LA), a clock and data recovery chip (Clock and Data Recovery, CDR), a power management chip, and a digital signal processing (Digital Signal Processing, DSP) chip.

[0058] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0059] The circuit board 300 also includes a gold finger 301 formed on the end surface thereof. The gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be provided on only one side of the circuit board 300 (e.g. Figure 4The upper surface shown in the figure) can also be set on the upper and lower surfaces of the circuit board 300 to provide more pins, so as to adapt to occasions where the number of pins is large. The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0060] At least one of the light emitting component 400 or the light receiving component 500 is located on a side of the circuit board 300 away from the gold finger 301 .

[0061] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0062] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 may be directly disposed on the circuit board 300. For example, at least one of the light emitting component 400 or the light receiving component 500 may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0063] Figure 5 FIG. 1 is a partial structural diagram of an optical module provided according to some embodiments of the present disclosure. Figure 5 As shown, MCU302 and DSP chip 303 are installed on circuit board 300. DSP chip 303 and MCU302 are respectively connected to gold finger 301 through signal lines. The electrical signal output by host computer 100 is transmitted to DSP chip 303 through gold finger 301. DSP chip 303 transmits electrical signal to laser chip in light emitting component 400 through signal line, so that laser chip generates optical signal, thereby realizing light emission.

[0064] The optical signal transmitted by the external optical fiber is converted into an electrical signal by the optical receiving component 500, and the electrical signal is transmitted to the DSP chip 303 via the signal line. After the DSP chip 303 processes the electrical signal, it is transmitted to the gold finger 301 via the signal line. The gold finger 301 transmits the electrical signal to the host computer 100, thereby realizing the reception of light.

[0065] In some embodiments, optical communication equipment mainly uses NRZ code type for electrical signal transmission, that is, uses binary signals composed of two levels of 0 and 1 for signal transmission. However, with the advent of the era of big data and cloud computing, higher requirements are placed on the signal transmission rate of optical communication equipment. The use of binary NRZ code type composed of two levels of 0 and 1 gradually fails to meet the current demand for high signal transmission rate due to the limitations of electrical signal modulation and transmission rate. In order to meet the current demand for signal transmission rate, PAM4 signals are beginning to be used for signal transmission.

[0066] Compared with NRZ signals, PAM4 code has 4 digital amplitude levels (such as 0, 1, 2, and 3). At the same baud rate, the bit rate can reach twice that of NRZ code, greatly improving the transmission rate.

[0067] Taking a 50G optical module as an example, when the host computer 100 transmits electrical signals to the optical module, three methods can be used: 2×25GNRZ, 1×50G PAM4, and 1×50G NRZ. Since 1×50G NRZ has higher bandwidth rate requirements for the circuit board 300, 2×25G NRZ or 1×50G PAM4 are currently preferred.

[0068] In some embodiments, according to the transmission rate requirement of the optical module, such as 50Gbs, the electrical signal transmitted between the host computer 100 and the gold finger 301 can be a 2×25G NRZ electrical signal or a 1×50G PAM4 electrical signal. When the optical module 200 receives the electrical signal transmitted by the host computer 100, the DSP chip 303 can only receive one electrical signal, such as a 2×25G NRZ electrical signal or a 1×50GPAM4 electrical signal, but cannot receive a 2×25G NRZ electrical signal and a 1×50G PAM4 electrical signal, that is, the compatibility of the NRZ electrical signal and the PAM4 electrical signal cannot be achieved. This increases the number of optical modules connected to the host computer 100. In terms of user use, when the host computer 100 switches the output telecommunications number type, it is necessary to switch the inserted optical module, which increases the inconvenience of use and is not suitable for the development trend of high signal transmission rate.

[0069] In order to achieve compatibility of optical modules with NRZ electrical signals and PAM4 electrical signals, the present disclosure provides an optical module, in which a DSP chip has an NRZ electrical signal processing mode and a PAM4 electrical signal processing mode. The DSP chip transmits NRZ electrical signals or PAM4 electrical signals via signal traces on a circuit board. The MCU controls the DSP chip to switch the electrical signal processing mode according to the type of electrical signal transmitted by the gold finger, so that the optical module can realize the input of NRZ electrical signals and PAM4 electrical signals, thereby reducing the number of optical modules and providing convenience for user use. The input of NRZ electrical signals and PAM4 electrical signals can be freely switched according to the user's usage conditions.

[0070] Figure 6 The following is a schematic diagram of a signal principle of an optical module provided according to some embodiments of the present disclosure. Figure 7 FIG. 1 is a block diagram of switching different electrical signal modes in an optical module according to some embodiments of the present disclosure. Figure 6 and Figure 7 As shown, in order to realize the compatible input of the optical module to the NRZ electrical signal and the PAM4 electrical signal, a register is set in the MCU302, and the MCU302 modifies the value of the register according to the type of electrical signal transmitted by the golden finger 301. For example, when the electrical signal transmitted by the golden finger 301 is an NRZ electrical signal, the MCU302 modifies the value of the register to 0, and then the MCU302 sends an NRZ mode instruction to the DSP chip 303 according to the value of the register, so that the DSP chip 303 switches to the NRZ electrical signal processing mode. In this way, the DSP chip 303 processes the received NRZ electrical signal, and the processed NRZ electrical signal is transmitted to the optical emitting component 400, so that the optical emitting component 400 generates an optical signal.

[0071] When the electrical signal transmitted by the gold finger 301 is a PAM4 electrical signal, the MCU 302 modifies the value of the register to 1, and then the MCU 302 sends a PAM4 mode instruction to the DSP chip 303 according to the value of the register, so that the DSP chip 303 switches to the PAM4 electrical signal processing mode. In this way, the DSP chip 303 processes the received PAM4 electrical signal, and the processed PAM4 electrical signal is transmitted to the optical emitting component 400, so that the optical emitting component 400 generates an optical signal.

[0072] In some embodiments, in order to enable the DSP chip 303 to receive NRZ electrical signals and PAM4 electrical signals, the DSP chip 303 has a first electrical interface and a second electrical interface, and the gold finger 301 is connected to the first electrical interface or the second electrical interface through a signal trace arranged on the circuit board 300 to transmit the NRZ electrical signal or the PAM4 electrical signal to the DSP chip 303.

[0073] In some embodiments, the DSP chip 303 is generally installed on the circuit board 300 through a ball grid array (BGA) package, that is, BGA solder balls are soldered on the bottom surface of the DSP chip 303, the BGA solder balls can be connected to the electrical interface of the DSP chip 303 through signal lines, and the BGA solder balls are soldered to the surface of the circuit board 300, so that the electrical signals transmitted by the circuit board 300 are transmitted to the DSP chip 303 via the BGA solder balls.

[0074] Figure 8 The following is a schematic diagram of signal routing between a gold finger and a digital signal processor in an optical module according to some embodiments of the present disclosure. Figure 8 As shown, the circuit board 300 is a multi-layer board structure. The circuit board 300 generally includes a top layer 310, a bottom layer 340 and an inner layer. The top layer 310 is located on the top surface of the circuit board 300, and the gold finger 301 is located on the top layer 310; the bottom layer 340 is located on the bottom surface of the circuit board 300, and the inner layer is located between the top layer 310 and the bottom layer 340. The inner layer can be a single inner layer or at least two inner layers.

[0075] For example, the inner layer may include a first inner layer 320 and a second inner layer 330, the first inner layer 320 is located between the top layer 310 and the bottom layer 340, the second inner layer 330 is located between the first inner layer 320 and the bottom layer 340, the first inner layer 320 is a reference layer or a dielectric layer or a ground layer, and the second inner layer 330 is a signal layer.

[0076] When the gold finger 301 transmits an electrical signal to the DSP chip 303 through the signal routing on the circuit board 300, the signal routing can be arranged on the top layer 310 of the circuit board 300, one end of the signal routing is connected to the gold finger 301, and the other end of the signal routing is connected to the electrical interface of the DSP chip 303, so as to transmit the NRZ electrical signal or the PAM4 electrical signal to the DSP chip 303 through the signal routing.

[0077] If the electrical interface of the DSP chip 303 is located at the edge of the DSP chip 303, the signal routing can be directly extended to the edge of the DSP chip 303, and the connection between the DSP chip 303 and the signal routing can be achieved through the BGA solder balls; if the electrical interface of the DSP chip 303 is located on the inner side of the DSP chip 303, it is not convenient to lay out the signal routing under the DSP chip 303, and the signal connection between the DSP chip 303 and the circuit board 300 can be achieved through vias.

[0078] For example, a first via and a second via are formed between the top layer 310 and the second inner layer 330, the first via is located on the outside of the DSP chip 303, the second via is located below the electrical interface of the DSP chip 303, a signal line is arranged on the second inner layer 330, one end of the first via is connected to the signal routing on the top layer 310, the other end of the first via is connected to one end of the signal line, the other end of the signal line is connected to the second via, and the second via is connected to the electrical interface of the DSP chip 303. In this way, the signal connection between the DSP chip 303 and the gold finger 301 is realized through the signal routing on the top layer 310, the first via, the signal line on the second inner layer 330, and the second via.

[0079] Fig. 9 A top wiring of a circuit board in an optical module provided according to some embodiments of the present disclosure Figure 1 , Fig.10 The following is an inner layer wiring diagram of a circuit board in an optical module according to some embodiments of the present disclosure. Fig. 9 and Fig.10 As shown, since the DSP chip 303 can receive the NRZ electrical signal and the PAM4 electrical signal transmitted by the gold finger 301, in order to realize the connection between the gold finger 301 and the first electrical interface and the second electrical interface of the DSP chip 303, a signal routing line can be formed on the top layer 310, one end of the signal routing line is connected to the gold finger 301, and the other end of the signal routing line is directly connected to the first electrical interface, so that the first electrical signal transmitted by the gold finger 301 is transmitted to the DSP chip 303 via the signal routing line on the top layer 310, and the first electrical signal can be a 2×25G NRZ NRZ electrical signal.

[0080] Since the NRZ electrical signal transmitted by the gold finger 301 is a 2×25G NRZ electrical signal, in order to transmit the 2×25G NRZ electrical signal to the DSP chip 303 through the signal routing, the first electrical interface of the DSP chip 303 includes a first electrical channel 3031 and a second electrical channel 3033, and the signal routing on the top layer 310 includes a first signal routing 307 and a second signal routing 308, one end of the first signal routing 307 is connected to the gold finger 301, and the other end of the first signal routing 307 extends to the edge of the DSP chip 303, and the first signal routing 307 is connected to the first electrical channel 3031 to transmit the 1×25G NRZ electrical signal to the DSP chip 303 through the first signal routing 307.

[0081] One end of the second signal trace 308 is connected to the gold finger 301 , and the other end of the second signal trace 308 extends to the edge of the DSP chip 303 . The second signal trace 308 is connected to the second electrical channel 3033 to transmit the 1×25G NRZ electrical signal to the DSP chip 303 through the second signal trace 308 .

[0082] In some embodiments, the first signal trace 307 and the second signal trace 308 may be arranged side by side on the top layer 310, and the first electrical channel 3031 and the second electrical channel 3033 may be arranged side by side at the edge of the DSP chip 303, so as to directly transmit the 2×25G NRZ electrical signal to the DSP chip 303 through the first signal trace 307 and the second signal trace 308. After the DSP chip 303 receives the 2×25G NRZ electrical signal through the first electrical channel 3031 and the second electrical channel 3033, the DSP chip 303 processes the 2×25G NRZ electrical signal using the NRZ electrical signal processing mode, and the processed 2×25G NRZ electrical signal is transmitted to the optical emitting component 400, so that the optical emitting component 400 generates an optical signal.

[0083] In some embodiments, there may be noise in the 2×25G NRZ electrical signal transmitted by the gold finger 301. In order to filter out the noise, a first capacitor 304 and a second capacitor 306 are further formed on the top layer 310. The first signal line 307 passes through the first capacitor 304 and is connected to the first electrical channel 3031. In this way, the 1×25G NRZ electrical signal transmitted by the gold finger 301 is filtered by the first capacitor 304 and then transmitted to the DSP chip 303 through the first signal line 307.

[0084] The second signal line 308 passes through the second capacitor 306 and is connected to the second electrical channel 3033. In this way, the 1×25G NRZ electrical signal transmitted by the gold finger 301 is filtered by the second capacitor 306 and then transmitted to the DSP chip 303 through the second signal line 308. In this way, the 2×25G NRZ electrical signal is transmitted to the DSP chip 303 through the first signal line 307 and the second signal line 308.

[0085] In some embodiments, a third signal routing may also be formed on the top layer 310. The third signal routing may be arranged side by side with the first signal routing 307 and the second signal routing 308. Both ends of the third signal routing are connected to the gold finger 301 and the DSP chip 303. The third signal routing is used to transmit a second electrical signal, which may be a 1×50G PAM4 electrical signal.

[0086] The second electrical interface 3032 may be located at the edge of the DSP chip 303. At this time, the third signal line is connected to the second electrical interface 3032. The 1×50G PAM4 electrical signal transmitted by the gold finger 301 is transmitted to the DSP chip 303 via the third signal line. After the DSP chip 303 receives the 1×50G PAM4 electrical signal through the second electrical interface 3032, the DSP chip 303 processes the 1×50G PAM4 electrical signal using the PAM4 electrical signal processing mode. The processed 1×50G PAM4 electrical signal is transmitted to the optical emitting component 400, so that the optical emitting component 400 generates an optical signal.

[0087] In some embodiments, the second electrical interface 3032 may also be located on the inner side of the DSP chip 303. In this case, a signal transmission line is arranged on an inner layer, a first via is formed between the top layer 310 and the inner layer, a third signal line extends from the gold finger 301 to the first via, and the third signal line is connected to one end of the signal transmission line through the first via. The 1×50G PAM4 electrical signal transmitted by the gold finger 301 is transmitted to the signal transmission line of the inner layer through the third signal line and the first via.

[0088] A second via is formed between the second electrical interface 3032 of the DSP chip 303 and the inner layer where the signal transmission line is located. The signal transmission line on the inner layer is connected to the second electrical interface 3032 through the second via, and the 1×50G PAM4 electrical signal transmitted by the signal transmission line is transmitted to the DSP chip 303 through the second via. After the DSP chip 303 receives the 1×50G PAM4 electrical signal through the second electrical interface 3032, the DSP chip 303 processes the 1×50G PAM4 electrical signal using the PAM4 electrical signal processing mode, and the processed 1×50G PAM4 electrical signal is transmitted to the optical emitting component 400, so that the optical emitting component 400 generates an optical signal.

[0089] In order to filter out the noise in the 1×50G PAM4 electrical signal transmitted by the gold finger 301, a third capacitor 305 is also formed on the top layer 310, and the third signal line passes through the third capacitor 305 and is connected to the first via. In this way, the 1×50GPAM4 electrical signal transmitted by the gold finger 301 is filtered by the third capacitor 305 and then transmitted to the DSP chip 303 through the first via, the signal transmission line and the second via.

[0090] In some embodiments, reference Fig.10 The inner layer includes a second inner layer 330, a first via 3301 is formed between the second inner layer 330 and the top layer 310, the first via 3301 is located on the outside of the DSP chip 303, a signal transmission line 3302 is arranged on the second inner layer 330, a second via 3303 is formed between the second inner layer 330 and the second electrical interface 3032 of the DSP chip 303, one end of the signal transmission line 3302 is connected to the first via 3301, and the other end of the signal transmission line 3302 is connected to the second via 3303.

[0091] In this way, the 1×50G PAM4 electrical signal transmitted by the third signal routing is filtered by the third capacitor 305, and the filtered 1×50GPAM4 electrical signal is transmitted to the signal transmission line 3302 through the first via 3301, and the 1×50GPAM4 electrical signal transmitted by the signal transmission line 3302 is transmitted to the second electrical interface 3032 of the DSP chip 303 through the second via 3303, so as to transmit the 1×50G PAM4 electrical signal to the DSP chip 303.

[0092] In some embodiments, in order to reduce the loss of electrical signals caused by signal routing, the first signal routing 307, the second signal routing 308 and the third signal routing are located on the top layer 310. However, setting the first signal routing 307, the second signal routing 308 and the third signal routing on the top layer 310 will occupy most of the area of ​​the top layer 310, which is not conducive to the arrangement of other devices on the top layer 310.

[0093] In order to reduce the area occupied by the signal routing, the first signal routing 307 and the third signal routing, or the second signal routing 308 and the third signal routing can be set to the same signal routing. For example, the first signal routing 307 and the third signal routing are the same signal routing, and branches are formed at one end of the first signal routing 307 close to the DSP chip 303, one branch passes through the first capacitor 304 and is connected to the first electrical interface of the DSP chip 303, so that the branch is used to transmit the first electrical signal; the other branch passes through the third capacitor 305 and is connected to the second electrical interface of the DSP chip 303, so that the branch is used to transmit the second electrical signal.

[0094] Fig.11 A top view of the wiring of a circuit board in an optical module provided according to some embodiments of the present disclosure, Fig.12 FIG. 1 is a top view of a local wiring of a circuit board in an optical module provided according to some embodiments of the present disclosure. Fig.11 and Fig.12 As shown, the end of the first signal routing 307 close to the DSP chip 303 includes a first branch routing and a second branch routing, the first branch routing passes through the first capacitor 304 and is connected to the first electrical interface of the DSP chip 303, and the first branch routing is used to transmit a first electrical signal; the second branch routing passes through the third capacitor 305 and is connected to the second electrical interface of the DSP chip 303, and the second branch routing is used to transmit a second electrical signal. In this way, the first electrical signal and the second electrical signal can be transmitted through the first signal routing, the first electrical signal is an NRZ electrical signal, and the second electrical signal is a PAM4 electrical signal.

[0095] When the host computer 100 transmits an NRZ electrical signal to the gold finger 301, the first signal routing 307 transmits a 1×25G NRZ electrical signal, and the 1×25G NRZ electrical signal passes through the third capacitor 305 and the first capacitor 304 in sequence for filtering. The filtered 1×25G NRZ electrical signal is transmitted along the first branch routing to the first electrical channel 3031 of the DSP chip 303, and the 1×25G NRZ electrical signal transmitted by the second signal routing 308 passes through the second capacitor 306, and the 1×25G NRZ electrical signal is transmitted to the second electrical channel 3033 of the DSP chip 303 after being filtered by the second capacitor 306, thereby transmitting the 2×25G NRZ electrical signal to the DSP chip 303 through the first signal routing 307 and the second signal routing 308.

[0096] When the host computer 100 transmits a PAM4 electrical signal to the gold finger 301, the first signal routing 307 transmits a 1×50G PAM4 electrical signal, the 1×50G PAM4 electrical signal passes through the third capacitor 305 for filtering, the filtered 1×50G PAM4 electrical signal is transmitted along the second branch routing, the 1×50G PAM4 electrical signal transmitted by the second branch routing passes through the first via 3301 and is transmitted to the signal transmission line 3302, the 1×50G PAM4 electrical signal is transmitted to the second electrical interface 3032 of the DSP chip 303 through the signal transmission line 3302 and the second via 3303, thereby transmitting the 1×50G PAM4 electrical signal to the DSP chip 303 through the first signal routing 307.

[0097] In some embodiments, the second branch line at one end of the first signal line 307 can also transmit a 1×25G NRZ electrical signal, and the end of the second signal line 308 close to the DSP chip 303 passes through a via and an inner layer signal transmission line to be connected to the second electrical channel 3033; the first branch line at one end of the first signal line 307 can also transmit a 1×50G PAM4 electrical signal.

[0098] Since the first electrical signal is a 2×25G NRZ electrical signal and the second electrical signal is a 1×50G PAM4 electrical signal, the transmission rate of the first electrical signal is lower than the transmission rate of the second electrical signal. In order to reduce the loss, the first electrical signal is transmitted to the DSP chip 303 along the first branch line of the first signal line 307 and the second signal line 308, so as to transmit the 2×25G NRZ electrical signal to the DSP chip 303; the second electrical signal is transmitted to the DSP chip 303 along the second branch line of the first signal line 307, so as to transmit the 1×50G PAM4 electrical signal to the DSP chip 303.

[0099] In some embodiments, when a 1×25G NRZ electrical signal or a 1×50G PAM4 electrical signal is transmitted through the first signal line 307, in order to allow the NRZ electrical signal to be input into the DSP chip 303 through the first electrical interface and the PAM4 electrical signal to be input into the DSP chip 303 through the second electrical interface 3032, the DSP chip 303 may control the on and off of the first electrical interface and the second electrical interface 3032 according to the value of the register in the MCU 302.

[0100] When the host computer 100 outputs an NRZ electrical signal, the MCU302 modifies the value of the register to a first value, such as 0, and then the MCU302 sends an NRZ mode instruction to the DSP chip 303. After the DSP chip 303 receives the NRZ mode instruction, the DSP chip 303 controls the first electrical interface to be connected and the second electrical interface 3032 to be disconnected. At the same time, the DSP chip 303 switches the working mode to the NRZ electrical signal processing mode. In this way, the 1×25G NRZ electrical signal transmitted by the first signal routing 307 passes through the third capacitor 305 and the first capacitor 304 and is transmitted along the first branch routing to the first electrical channel 3031, and the 1×25G NRZ electrical signal is input to the DSP chip 303 through the first electrical channel 3031.

[0101] In some embodiments, the 1×25G NRZ electrical signal transmitted by the first signal routing 307 can pass through the third capacitor 305, the first via 3301, the signal transmission line 3302 and the second via 3303 and be transmitted along the second branch routing to the second electrical interface 3032. Since the second electrical interface 3032 is disconnected, the 1×25G NRZ electrical signal cannot be input into the DSP chip 303 through the second electrical interface 3032.

[0102] At the same time, the 1×25G NRZ electrical signal transmitted by the second signal wiring 308 is transmitted to the second electrical channel 3033 through the second capacitor 306, and the 1×25G NRZ electrical signal is input to the DSP chip 303 through the second electrical channel 3033. After the 2×25G NRZ electrical signal is input to the DSP chip 303, the DSP chip 303 processes the 2×25G NRZ electrical signal through the NRZ electrical signal processing mode, and the processed electrical signal is transmitted to the optical emitting component 400, so that the optical emitting component 400 generates an optical signal.

[0103] When the host computer 100 outputs a PAM4 electrical signal, the MCU 302 modifies the value of the register to a second value, such as 1, and then the MCU 302 sends a PAM4 mode instruction to the DSP chip 303. After the DSP chip 303 receives the PAM4 mode instruction, the DSP chip 303 controls the first electrical interface to be disconnected and the second electrical interface 3032 to be connected. At the same time, the DSP chip 303 switches the working mode to the PAM4 electrical signal processing mode. In this way, the 1×50G PAM4 electrical signal transmitted by the first signal routing 307 passes through the third capacitor 305, the first via 3301, the signal transmission line 3302 and the second via 3303 and is transmitted along the second branch routing to the second electrical interface 3032, and the 1×50GPAM4 electrical signal is input to the DSP chip 303 via the second electrical interface 3032.

[0104] After the 1×50G PAM4 electrical signal is input to the DSP chip 303, the DSP chip 303 processes the 1×50G PAM4 electrical signal through the PAM4 electrical signal processing mode, and the processed electrical signal is transmitted to the optical emitting component 400, so that the optical emitting component 400 generates an optical signal.

[0105] In some embodiments, the 1×50G PAM4 electrical signal transmitted by the first signal routing 307 can be transmitted to the first electrical channel 3031 along the first branch routing through the third capacitor 305 and the first capacitor 304 in sequence. Since the first electrical channel 3031 is disconnected, the 1×50G PAM4 electrical signal cannot be input into the DSP chip 303 through the first electrical channel 3031.

[0106] In some embodiments, the first electrical interface and the second electrical interface 3032 of the DSP chip 303 may also be in an open state at all times, the first electrical interface is set to transmit only NRZ electrical signals, and the second electrical interface 3032 is set to transmit only PAM4 electrical signals. When the host computer outputs an NRZ electrical signal, the MCU302 modifies the value of the register to 0, and the MCU302 sends an NRZ mode instruction to the DSP chip 303, and the DSP chip 303 switches the working mode to the NRZ electrical signal processing mode.

[0107] The 1×25G NRZ electrical signal transmitted by the first signal routing 307 passes through the third capacitor 305 and the first capacitor 304 and is transmitted along the first branch routing to the first electrical channel 3031, and the 1×25G NRZ electrical signal is input to the DSP chip 303 through the first electrical channel 3031; the 1×25G NRZ electrical signal transmitted by the first signal routing 307 also passes through the third capacitor 305, the first via 3301, the signal transmission line 3302 and the second via 3303 and is transmitted along the second branch routing to the second electrical interface 3032. Since the second electrical interface 3032 only transmits PAM4 electrical signals, the 1×25G NRZ electrical signal cannot be input to the DSP chip 303 through the second electrical interface 3032.

[0108] When the host computer outputs a PAM4 electrical signal, MCU302 modifies the value of the register to 1, and MCU302 sends a PAM4 mode instruction to DSP chip 303. After DSP chip 303 receives the PAM4 mode instruction, DSP chip 303 switches the working mode to the PAM4 electrical signal processing mode.

[0109] The 1×50G PAM4 electrical signal transmitted by the first signal routing 307 passes through the third capacitor 305 , the first via 3301 , the signal transmission line 3302 and the second via 3303 and is transmitted to the second electrical interface 3032 along the second branch routing. The 1×50G PAM4 electrical signal is input to the DSP chip 303 via the second electrical interface 3032 .

[0110] The 1×50G PAM4 electrical signal transmitted by the first signal routing 307 will also pass through the third capacitor 305 and the first capacitor 304 and be transmitted to the first electrical channel 3031 along the first branch routing. Since the first electrical interface only transmits NRZ electrical signals, the 1×50G PAM4 electrical signal cannot be input to the DSP chip 303 through the first electrical channel 3031.

[0111] In some embodiments, signal lines that transmit NRZ electrical signals and PAM4 electrical signals may also be arranged on other layers of the circuit board 300 . For example, signal lines that transmit NRZ electrical signals are arranged on the top layer 310 , and signal lines that transmit PAM4 electrical signals are arranged on the bottom layer 340 .

[0112] Fig.13 A top wiring of a circuit board in an optical module provided according to some embodiments of the present disclosure Figure 2 , Fig.14 The bottom wiring diagram of a circuit board in an optical module provided according to some embodiments of the present disclosure is shown in FIG. Fig.13 and Fig.14 As shown, a first gold finger 301 and a first signal line are provided on the top layer 310 of the circuit board 300. The first signal line includes a first signal routing line 307 and a second signal routing line 308. The first signal routing line 307 and the second signal routing line 308 are respectively connected to the first gold finger 301. The first signal routing line 307 and the second signal routing line 308 extend from the first gold finger 301 to the first electrical interface of the DSP chip 303. The first signal routing line 307 is directly connected to the first electrical channel 3031. The first signal routing line 307 is used to transmit a 1×25G NRZ electrical signal; the second signal routing line 308 is directly connected to the second electrical channel 3033. The second signal routing line 308 is used to transmit a 1×25GNRZ electrical signal. In this way, the 2×25GNRZ electrical signal output by the host computer 100 is transmitted to the DSP chip 303 through the first signal routing line 307 and the second signal routing line 308.

[0113] After the DSP chip 303 receives the 2×25G NRZ electrical signal transmitted by the first signal line 307 and the second signal line 308, the DSP chip 303 processes the 2×25G NRZ electrical signal through the NRZ electrical signal processing mode, and transmits the processed electrical signal to the optical emitting component 400, so that the optical emitting component 400 generates an optical signal.

[0114] Reference Fig.14A second gold finger 311 and a second signal line 309 are provided on the bottom layer 340 of the circuit board 300, and a via 3401 is provided between the bottom layer 340 and the top layer 310. One end of the second signal line 309 is connected to the second gold finger 311, and the other end of the second signal line 309 is connected to one end of the via 3401, and the other end of the via 3401 is connected to the second electrical interface 3032. In this way, when the host computer 100 outputs a PAM4 electrical signal, the second gold finger 311 transmits the 1×50G PAM4 electrical signal to the second electrical interface 3032 via the second signal line 309 and the via 3401, so as to input the 1×50G PAM4 electrical signal to the DSP chip 303 through the second electrical interface 3032.

[0115] In some embodiments, signal routing for transmitting NRZ electrical signals may also be arranged on the bottom layer 340, and signal routing for transmitting PAM4 electrical signals may also be arranged on the top layer 310. As long as the NRZ electrical signals or PAM4 electrical signals transmitted by the host computer 100 can be transmitted to the DSP chip 303, the DSP chip 303 processes the NRZ electrical signals or PAM4 electrical signals according to the corresponding electrical signal processing mode, so that the optical module can be compatible with the input NRZ electrical signals and PAM4 electrical signals.

[0116] The optical module provided by the present invention has a DSP chip with an NRZ electrical signal processing mode and a PAM4 electrical signal processing mode. The NRZ electrical signal or the PAM4 electrical signal is transmitted to the DSP chip through the signal routing on the circuit board. The DSP chip processes the received NRZ electrical signal through the NRZ electrical signal processing mode, or the DSP chip processes the received PAM4 electrical signal through the PAM4 electrical signal, so that the optical module is compatible with the input of NRZ electrical signals and PAM4 electrical signals, reducing the number of optical modules inserted into the host computer. The compatible optical module can enhance the competitiveness of the product. In terms of user use, the input mode of the NRZ electrical signal and the PAM4 electrical signal can be freely switched according to the user's use conditions, thereby improving convenience.

[0117] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module, characterized in that: include: A circuit board, one end of which is provided with a gold finger, the circuit board comprising: A top layer, located on the top surface of the circuit board, the gold finger is arranged on the top layer, a signal trace is formed on the top layer, the signal trace is connected to the gold finger, the signal trace is used to transmit a first electrical signal or a second electrical signal, and the transmission rate of the first electrical signal is different from the transmission rate of the second electrical signal; A bottom layer, located on the bottom surface of the circuit board; An inner layer, located between the top layer and the bottom layer, on which a signal transmission line is arranged, and the signal transmission line is connected to the signal routing line through a via hole; MCU, installed on the top layer, wherein a register is provided in the MCU, and the MCU is used to modify the value of the register according to the type of the electrical signal transmitted by the gold finger; A digital signal processor is installed on the top layer, the digital signal processor is connected to the MCU control, the digital signal processor includes at least two electrical signal processing modes, and the digital processor is used to switch the electrical signal processing mode according to the value of the register in the MCU; the digital signal processor includes a first electrical interface and a second electrical interface, the signal routing is directly connected to the first electrical interface, the signal routing is connected to the signal transmission line and the second electrical interface via the via, the first electrical interface is used to transmit the first electrical signal, and the second electrical interface is used to transmit the second electrical signal.

2. The optical module according to claim 1, characterized in that: The signal routing includes a first signal routing and a second signal routing, the first signal routing and the second signal routing are arranged side by side; the first signal routing includes a first branch routing and a second branch routing at one end close to the digital signal processor, the second branch routing is connected to the signal transmission line through the via, and the second branch routing is used to transmit the second electrical signal; The first electrical interface includes a first electrical channel and a second electrical channel, the first branch routing is directly connected to the first electrical channel, the second signal routing is directly connected to the second electrical channel, the first branch routing and the second signal routing are used to transmit a first electrical signal, and a transmission rate of the first electrical signal is lower than a transmission rate of the second electrical signal.

3. The optical module according to claim 2, characterized in that: A first capacitor and a third capacitor are also formed on the top layer, the first capacitor is connected to the first branch routing, the third capacitor is connected to the second branch routing, the first branch routing passes through the third capacitor and is connected to the first electrical channel, and the second branch routing passes through the third capacitor and is connected to the via and the signal transmission line.

4. The optical module according to claim 1, characterized in that: The signal routing includes a first signal routing, a second signal routing and a third signal routing, the first signal routing, the second signal routing and the third signal routing are arranged side by side, and the third signal routing is connected to the signal transmission line and the second electrical interface through the via hole; The first electrical interface includes a first channel and a second electrical channel, the first signal line is directly connected to the first electrical channel, and the second signal line is directly connected to the second electrical channel.

5. The optical module according to claim 1, characterized in that: The digital signal processor controls the connection and disconnection of the first electrical interface and the second electrical interface according to the value of the register in the MCU.

6. The optical module according to claim 5, characterized in that: When the value of the register in the MCU is a first value, controlling the first electrical interface to be connected and the second electrical interface to be disconnected; When the value of the register in the MCU is the second value, the first electrical interface is controlled to be disconnected and the second electrical interface is controlled to be connected.

7. The optical module according to claim 1, characterized in that: The first electrical interface is located at an edge of the digital signal processor, and the second electrical interface is located inside the digital signal processor.

8. The optical module according to claim 1, characterized in that: The first electrical signal is an NRZ electrical signal, and the second electrical signal is a PAM4 electrical signal.

9. An optical module, characterized in that: include: A circuit board, the circuit board comprising: A top layer, located on the top surface of the circuit board, a first gold finger is arranged on the top layer, a first signal line is formed on the top layer, the first signal line is connected to the first gold finger, and the first signal line is used to transmit a first electrical signal or a second electrical signal; A bottom layer, located on the bottom surface of the circuit board, a second gold finger is arranged on the bottom layer, a second signal line is formed on the bottom layer, the second signal line is connected to the second gold finger, a via is formed between the bottom layer and the top layer, and the second signal line is used to transmit a second electrical signal or a first electrical signal; MCU, installed on the top layer, wherein a register is provided in the MCU, and the MCU is used to modify the value of the register according to the type of the electrical signal transmitted by the gold finger; A digital signal processor is installed on the top layer, the digital signal processor is connected to the MCU control, the digital signal processor includes at least two electrical signal processing modes, and the digital processor is used to switch the electrical signal processing mode according to the value of the register in the MCU; the digital signal processor includes a first electrical interface and a second electrical interface, the first signal line is directly connected to the first electrical interface, the second signal line is connected to the second electrical interface through the via, the first electrical interface is used to transmit the first electrical signal, the second electrical interface is used to transmit the second electrical signal, and the transmission rate of the first electrical signal is different from the transmission rate of the second electrical signal.

10. The optical module according to claim 9, characterized in that: The first electrical interface and the second electrical interface are always in an open state.

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