Stereo camera and electronic device

Abstract

The embodiment of the invention discloses a stereo camera and electronic equipment, and relates to the technical field of vision, the stereo camera is high in heat dissipation efficiency, and the problem that the temperature rise is large in the working process of the stereo camera can be solved. The stereo camera comprises a first shell, a middle frame body, a second shell, a first PCB assembly and a second PCB assembly. The middle frame body is arranged between the first shell and the second shell; a first cavity is defined by the first shell and the part, close to the first shell, of the middle frame body; a second cavity is defined by the second shell and the part, close to the second shell, of the middle frame body; the middle frame body comprises a first heat conduction part; the second shell comprises a second heat conduction part. The first PCB assembly is located in the first cavity; the first PCB assembly comprises a light source; the first heat conduction part is used for conducting heat generated by the first PCB assembly to the middle frame body. The second PCB assembly is located in the second cavity; the second PCB assembly comprises a processor; the second heat conduction part is used for conducting heat generated by the second PCB assembly to the second shell.

Description

Technical Field

[0001] The present disclosure relates to the field of visual technology, and in particular to a stereo camera and an electronic device. Background Art

[0002] Stereo cameras are an important part of realizing visual functions in related industries. In related technologies, the power consumption of stereo cameras is relatively high, which causes a large temperature rise during the operation of the stereo cameras, affecting product performance and reducing product working stability and service life. Summary of the invention

[0003] Some embodiments of the present disclosure provide a stereoscopic camera and an electronic device. The stereoscopic camera has high heat dissipation efficiency and can solve the problem of large temperature rise during the operation of the stereoscopic camera.

[0004] To achieve the above objectives, some embodiments of the present disclosure provide the following technical solutions:

[0005] Some embodiments of the present disclosure provide a stereo camera. The stereo camera includes a first shell, a middle frame, a second shell, a first PCB assembly, and a second PCB assembly. The first shell, the middle frame, and the second shell are connected; the middle frame is arranged between the first shell and the second shell; the first shell and the part of the middle frame close to the first shell are enclosed to form a first chamber; the second shell and the part of the middle frame close to the second shell are enclosed to form a second chamber; the middle frame includes a first heat conducting part; and the second shell includes a second heat conducting part. The first PCB assembly is located in the first chamber; the first PCB assembly includes a light source; the first heat conducting part is used to conduct the heat generated by the first PCB assembly to the middle frame. The second PCB assembly is located in the second chamber; the second PCB assembly includes a processor; and the second heat conducting part is used to conduct the heat generated by the second PCB assembly to the second shell.

[0006] In the stereoscopic camera provided by some embodiments of the present disclosure, the first heat conducting part conducts the heat generated by the first PCB assembly to the middle frame, and the second heat conducting part conducts the heat generated by the second PCB assembly to the second shell. The heat generated by the first PCB assembly and the heat generated by the second PCB assembly can be respectively conducted to the part of the middle frame close to the first shell, and the second shell. In this way, the middle frame and the second shell can be used to jointly dissipate heat to improve the heat dissipation efficiency and avoid heat concentration, so as to solve the problem of large temperature rise during the operation of the stereoscopic camera, and improve the working stability and service life of the stereoscopic camera.

[0007] Optionally, the middle frame further includes a third heat conducting portion; the third heat conducting portion and the first heat conducting portion are spaced apart; the third heat conducting portion is closer to the second housing than the first heat conducting portion. The stereo camera further includes a third PCB assembly. The third PCB assembly is located in the second chamber; the third heat conducting portion is used to conduct heat generated by the third PCB assembly to the middle frame.

[0008] Optionally, the third PCB assembly is located on a side of the second PCB assembly away from the second housing; the third PCB assembly is at least used to access logic signals and power signals.

[0009] Optionally, the stereo camera further includes a first elastic thermally conductive pad. The first elastic thermally conductive pad is located between the third PCB assembly and the third thermally conductive portion and is in contact with the third thermally conductive portion.

[0010] Optionally, the first PCB assembly further includes a first main body plate. The first main body plate has a first surface and a second surface that are arranged opposite to each other, and the second surface is closer to the second shell body than the first surface; the light source is arranged on the first surface of the first main body plate. The stereo camera further includes a second elastic thermal pad. The second elastic thermal pad is located between the second surface of the first main body plate and the first heat conducting portion, and is directly opposite to the light source.

[0011] Optionally, the stereo camera further includes a third elastic thermal pad and a shielding cover. The third elastic thermal pad is located on a side of the second elastic thermal pad away from the first main body plate and contacts the first heat conducting portion. The shielding cover is disposed between the second elastic thermal pad and the third elastic thermal pad; the shielding cover protrudes in a direction away from the third elastic thermal pad.

[0012] Optionally, the first PCB assembly further includes a first thermal conductive coating and a second thermal conductive coating. The first thermal conductive coating is disposed on the first surface of the first main body plate and avoids the light source; the first thermal conductive coating is in contact with the first housing. The second thermal conductive coating is located between the first main body plate and the second elastic thermal conductive pad.

[0013] Optionally, the stereo camera further includes a fourth elastic thermally conductive pad, which is located between the second PCB assembly and the second thermally conductive portion and contacts the second thermally conductive portion.

[0014] Optionally, the first PCB component includes a plurality of light sources, which are arranged at intervals; and / or the third PCB component includes a functional module, which are arranged at intervals.

[0015] Optionally, the middle frame includes an outer frame portion and a partition portion. The partition portion is fixed to the inner wall of the outer frame portion; and the partition portion includes a first heat conducting portion and a third heat conducting portion.

[0016] Optionally, the partition portion further includes a first groove portion, and the first groove portion is recessed in a direction close to the second housing. The stereo camera further includes a TOF lens assembly and a first thermally conductive gel block. The TOF lens assembly includes a TOF lens module and a first sensor assembly, and the first sensor assembly is closer to the second housing than the TOF lens module. The TOF lens module runs through the first housing and the first PCB assembly; the first sensor assembly is located between the TOF lens module and the first groove portion, and is enclosed with the first groove portion to form a first filling cavity.

[0017] The first thermally conductive gel block is disposed in the first filling cavity and contacts the first sensing component.

[0018] Optionally, the middle frame further includes a second groove portion, and the second groove portion is recessed in a direction close to the second shell. The stereo camera further includes a color lens assembly and a second thermal conductive gel block. The color lens assembly includes a color lens module and a second sensor assembly, and the second sensor assembly is closer to the second shell than the color lens module; the color lens module runs through the first shell and the first PCB assembly; the second sensor assembly is located between the color lens module and the second groove portion, and encloses the second groove portion to form a second filling cavity.

[0019] The second thermally conductive gel block is disposed in the second filling cavity and contacts the second sensing component.

[0020] Optionally, the outer frame includes a first outer frame and a second outer frame connected to each other, and the first outer frame is closer to the first housing than the second outer frame. The stereo camera further includes at least one air duct disposed on the outer peripheral side of the first outer frame.

[0021] Optionally, the stereo camera further comprises a plurality of fins arranged at intervals, some of which are fixed to the wall of the first shell away from the middle frame, some are fixed to the wall of the second shell away from the middle frame, and some are fixed to the side surface of the second outer frame.

[0022] Optionally, the stereo camera further includes a plurality of grooves formed on the outer peripheral surface of the first shell.

[0023] In a second aspect, an electronic device is provided. The electronic device comprises a controller and a stereo camera provided by the above technical solution. The controller is coupled to the stereo camera.

[0024] The beneficial effects that can be achieved by the electronic device provided by some embodiments of the present disclosure are the same as the beneficial effects that can be achieved by the stereo camera provided by the above technical solution, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The drawings described herein are used to provide a further understanding of the embodiments of the present disclosure and constitute a part of the embodiments of the present disclosure. The illustrative embodiments of the present disclosure and their descriptions are used to explain the present disclosure and do not constitute an improper limitation on the present disclosure. In the drawings:

[0026] Figure 1 A structural diagram of a stereo camera provided for some embodiments of the present disclosure;

[0027] Figure 2 A structural diagram of a stereo camera provided for still further embodiments of the present disclosure;

[0028] Figure 3 A PCB architecture diagram of a stereo camera provided for some embodiments of the present disclosure;

[0029] Figure 4 A structural diagram of a stereo camera provided for still further embodiments of the present disclosure;

[0030] Figure 5 A cross-sectional view of a stereo camera provided for some embodiments of the present disclosure;

[0031] Figure 6 A structural diagram of a first housing provided for some embodiments of the present disclosure;

[0032] Figure 7 A structural diagram of a first housing provided for still further embodiments of the present disclosure;

[0033] Figure 8 A structural diagram of a middle frame provided for some embodiments of the present disclosure;

[0034] Fig. 9 A structural diagram of a middle frame provided for some other embodiments of the present disclosure;

[0035] Fig.10 A structural diagram of a second housing provided for some embodiments of the present disclosure;

[0036] Fig.11 A structural diagram of an electronic device provided for some embodiments of the present disclosure.

[0037] Reference numerals:

[0038] 1000-stereo camera;

[0039] 110 - first shell, 111 - first opening, 110a - inner surface of the first shell, 110b - wall surface of the first shell away from the middle frame;

[0040] 120-middle frame, 121-first heat conducting part, 122-third heat conducting part, 123-outer frame, 1231-first outer frame, 12311-main body, 12312-connecting column, 1232-second outer frame, 1232a-side surface of the second outer frame, 124-partition plate;

[0041] 130 - second housing, 131 - second heat conducting portion;

[0042] 101 - first bolt, 102 - second opening, 103 - indicator light board, 104 - transparent light guide column, 105 - sealing ring, 108 - second mounting hole, 109 - first mounting hole;

[0043] K1-first chamber, K2-second chamber, X-first direction, Q-seal ring installation groove, K3-first filling chamber, K4-second filling chamber;

[0044] 210 - first PCB assembly, 211 - first main body board, 211a - first surface of the first main body board, 211b - second surface of the first main body board, 212 - light source, 213 - first thermal conductive coating layer, 214 - second thermal conductive coating layer;

[0045] 220-a second PCB assembly, 221-a second main board, 222-a processor, 223-a transceiver module, 222A-a system on a chip (SOC), 222B-an embedded multimedia card (EMMC), 222C-a double data rate (DDR) synchronous dynamic random access memory;

[0046] 230 - third PCB assembly, 231 - third main board, 232 - functional module, 232A - field programmable gate array (FPGA) module, 232B - first DCDC module, 232C - second DCDC module;

[0047] 201-first aviation joint, 202-second aviation joint, 203-first mounting screw;

[0048] 310 - first elastic thermal conductive pad, 320 - second elastic thermal conductive pad, 330 - third elastic thermal conductive pad, 340 - fourth elastic thermal conductive pad, 350 - first thermal conductive gel block;

[0049] 410-shielding cover;

[0050] 510-TOF lens assembly, 511-TOF lens module, 512-first sensor assembly;

[0051] 520-color lens assembly, 521-color lens module, 522-second sensor assembly;

[0052] 501-second mounting screw, 502-third mounting screw, 503-third opening, 504-fourth opening;

[0053] 610-air duct, 620-fin, 621-first annular fin, 630-groove, 640-annular groove;

[0054] 2000-Electronic equipment, 2100-Controller. DETAILED DESCRIPTION

[0055] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0056] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as an open, inclusive meaning, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics described may be included in any one or more embodiments or examples in any appropriate manner.

[0057] In the description of the embodiments of the present disclosure, unless otherwise specified, “plurality” means two or more.

[0058] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism may be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity may also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality may be, for example, the difference between the two equalities is less than or equal to 5% of either one.

[0059] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features.

[0060] In the description of the embodiments of the present disclosure, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0061] It should be noted that, in the drawings of the present disclosure, for example, 1 / 2 indicates that structure 1 and structure 2 can refer to the structure. Figure 3 222A / 222 in the figure indicates that both the processor 222 and the system on chip 222A can be represented by this structure. Other similar reference numerals appearing in the drawings also follow the above description.

[0062] With the rapid development of the robotics industry and the artificial intelligence Internet of Things (AIOT) industry, the requirements for the intelligence of related products are getting higher and higher. As a core component for realizing vision and intelligent perception, the market demand for stereo cameras is growing rapidly. According to the different ways of realizing visual functions, stereo cameras can be divided into at least binocular stereo cameras, structured light stereo cameras and time-of-flight (TOF) stereo cameras, and the application scenarios of the three stereo cameras are different.

[0063] Among them, in small-volume, medium-precision, medium-to-long-distance visual scenes such as robots, logistics, warehousing, or pan-AIOT, TOF stereo cameras have the advantages of small size, wide dynamic range, less burden on back-end processing modules, and low cost. In related technologies, TOF stereo cameras used in industries such as logistics or warehousing are called industrial-grade TOF stereo cameras.

[0064] In some embodiments, the TOF stereo camera includes a light source driving board (eg, a laser driving board) and a TOF lens assembly. The light source is disposed on the light source driving board.

[0065] Based on the above settings, the working principle of the TOF stereo camera can be as follows: the TOF stereo camera sends a beam of light to the target object, the beam of light is reflected by the target object to produce reflected light, the reflected light is received by the TOF lens assembly, and the flight time (TOF) of the light is measured to obtain the time it takes for the light to travel from the TOF stereo camera to the target object and then return to the TOF stereo camera, thereby determining the distance of the target object.

[0066] In some embodiments, the TOF stereo camera further includes a core board. The core board includes one or more processors, and / or a transceiver module. The transceiver module is used to send signals to the controller and receive signals sent by the controller.

[0067] In some implementations, the power consumption of a stereo camera (for example, an industrial-grade TOF stereo camera) is relatively high, which causes a relatively high temperature rise during the operation of the stereo camera. As an electronic product, a relatively high temperature rise of a stereo camera will affect product performance and reduce product operating stability and service life.

[0068] For example, the power consumption of a TOF stereo camera of selected specifications was measured. The total power consumption of the TOF stereo camera is 11.1W, which causes a large temperature rise in the TOF stereo camera. Among them, the two parts with the highest power consumption are the light source driver board and the core board. The power consumption of the light source in the light source driver board is 4W, accounting for 36.0% of the total power consumption; the total power consumption of the three processors and the transceiver module in the core board is 3.8W, accounting for 34.2% of the total power consumption; this shows that in the TOF stereo camera, the light source driver board and the core board are the two parts with the largest temperature rise.

[0069] Based on this, some embodiments of the present disclosure provide a stereo camera 1000. Figure 1 and Figure 2 The stereo camera 1000 includes a first housing 110, a middle frame 120, and a second housing 130. The first housing 110, the middle frame 120, and the second housing 130 are connected; the middle frame 120 is disposed between the first housing 110 and the second housing 130; the first housing 110 and the middle frame 120 close to the first housing 110 enclose a first chamber K1; the second housing 130 and the middle frame 120 close to the second housing 130 enclose a second chamber K2; the middle frame 120 includes a first heat conducting portion 121 (refer to Fig. 9 ); The second shell 130 includes a second heat conducting portion 131.

[0070] Combination Figure 3 , refer to Figure 2 and Figure 4 , the stereo camera 1000 includes a first PCB assembly 210 and a second PCB assembly 220. The first PCB assembly 210 is located in the first chamber K1; the first PCB assembly 210 includes a light source 212; the first heat conducting portion 121 is used to conduct the heat generated by the first PCB assembly 210 to the middle frame 120. The second PCB assembly 220 is located in the second chamber K2; the second PCB assembly 220 includes a processor 222; the second heat conducting portion 131 is used to conduct the heat generated by the second PCB assembly 220 to the second housing 130.

[0071] For example, refer to Figure 1 , the first housing 110 , the middle frame 120 , and the second housing 130 are sequentially connected along the first direction X. By configuring the stereo camera 1000 to include the first housing 110 , the middle frame 120 , and the second housing 130 , the number of structural components included in the housing of the stereo camera 1000 can be reduced, thereby reducing the assembly complexity of the stereo camera 1000 .

[0072] For example, the first housing 110 and the middle frame 120, and / or the middle frame 120 and the second housing 130 can be fixedly connected by bolts or buckles. Figure 2 The first housing 110, the middle frame 120 and the second housing 130 can be fixedly connected by using four first bolts 101 (for example, hexagonal studs) distributed at the four corners. In this way, the installation position of the first bolts 101 can be optimized and the connection stability can be improved.

[0073] In some examples, reference Figure 2 In order to increase the connection stability between the first housing 110 and the middle frame 120, and between the middle frame 120 and the second housing 130, the stereo camera 1000 further includes a sealing ring installation groove Q (see Figure 6 ) of the sealing ring 105, the number of the sealing ring 105 may be two, one sealing ring 105 is located between the first shell 110 and the middle frame 120, and the other sealing ring 105 is located between the middle frame 120 and the second shell 130.

[0074] In some examples, the first chamber K1 and the second chamber K2 are two chambers that are independent of each other and not connected; in other examples, Figure 2 , refer to Figure 8 The first chamber K1 is connected to the second chamber K2 through the second opening 102 , so that the weight of the middle frame 120 can be reduced to a certain extent, making the weight of the stereo camera 1000 lighter.

[0075] For example, in order to make the light source 212 (see Figure 4 ) can emit light, refer to Figure 7 The first shell 110 includes one or more first openings 111 , and light emitted by one or more light sources 212 can pass through the first openings 111 and be emitted.

[0076] For example, in combination Figure 3 , refer to Figure 2The second PCB assembly 220 includes a second main body board 221, and one or more processors 222 are mounted on the second main body board 221. In some examples, the second PCB assembly 220 also includes a transceiver module 223 (e.g., a transceiver module PHY (Physical)) mounted on the second main body board 221. It should be understood that the second PCB assembly 220 includes the processor 222, so that at least part of the second PCB assembly 220 can form a core board.

[0077] For example, refer to Figure 3 The processor 222 is at least configured to: process the signal collected by the stereo camera 1000 into a visual image. For example, when the stereo camera 1000 is a TOF stereo camera, the processor 222 is at least configured to: receive a signal from a TOF lens assembly and process the signal into a visual image.

[0078] For example, refer to Figure 3 The processor 222 may include at least one of the following processors 222: a system on chip (SOC) 222A, an embedded multimedia card (EMMC) 222B, and a double data rate (DDR) synchronous dynamic random access memory 222C.

[0079] In some examples, reference Fig.10 The second heat conducting portion 131 is protruding relative to the inner surface of the second shell 130 . In this case, the second heat conducting portion 131 may also be referred to as a second heat conducting boss.

[0080] Here, the number of the second heat conducting parts 131 included in the second housing 130 is not limited. For example, the second housing 130 may include a plurality of second heat conducting parts 131, and the plurality of second heat conducting parts 131 are correspondingly (for example, one-to-one) arranged on the plurality of processors 222 (see Figure 3 ) side. For example, in some cases, the position of the processor 222 and the like on the second main body board 221 is determined according to the logic circuit of the operating platform of the stereo camera 1000 itself, and the variable space is small. Therefore, in combination with Figure 2 and Figure 3 , refer to Fig.10 The second housing 130 may include a second heat-conducting portion 131 , and the orthographic projections of the plurality of processors 222 and possible transceiver modules 223 along the first direction X and on the second housing 130 are covered by the second heat-conducting portion 131 .

[0081] Similarly, refer to Fig. 9The number of the first heat conducting parts 121 included in the middle frame 120 is not limited. In some examples, the middle frame 120 includes one first heat conducting part 121. In some other examples, the middle frame 120 includes a plurality of first heat conducting parts 121.

[0082] Understandably, combined Fig. 9 , refer to Figure 2 In the case where the first heat-conducting portion 121 conducts the heat generated by the first PCB assembly 210 to the middle frame 120, and the second heat-conducting portion 131 conducts the heat generated by the second PCB assembly 220 to the second shell 130, the heat generated by the first PCB assembly 210 and the heat generated by the second PCB assembly 220 can be respectively conducted to a portion of the middle frame 120 close to the first shell 110 and the second shell 130. In this way, the middle frame 120 and the second shell 130 can be used to jointly dissipate heat to improve the heat dissipation efficiency and avoid heat concentration, so as to solve the problem of large temperature rise during the operation of the stereo camera 1000 and improve the working stability and service life of the stereo camera 1000.

[0083] In some examples, reference Figure 2 The stereo camera 1000 includes an indicator light board 103 disposed in the second cavity K2, and the indicator light board 103 is at least used to indicate the working state of the stereo camera 1000. In this case, the stereo camera 1000 may further include a transparent light guide column 104 penetrating the side of the second housing 130, so that the light emitted by the indicator light on the indicator light board 103 can pass through the transparent light guide column 104 and be emitted.

[0084] The above-mentioned indicator board 103 consumes low power during operation. In some examples, the power consumption of the indicator board 103 of the TOF stereo camera of the above-mentioned selected specifications is measured, and the power consumption of the indicator lights on the indicator board 103 is 0.2W, so that the power consumption of the indicator board 103 accounts for 1.8% of the total power consumption, indicating that the indicator board 103 is the part with the smallest temperature rise in the TOF stereo camera. For example, the indicator board 103 can be cooled by natural heat dissipation.

[0085] In some examples, reference Figure 4 The first PCB assembly 210 includes a first main body board 211, and the light source 212 is mounted on the first main body board 211. It should be understood that the first PCB assembly 210 includes the light source 212 so that at least part of the first PCB assembly 210 can form a light source driving board.

[0086] Exemplarily, the light source 212 may be a laser, such as a vertical cavity surface emitting laser (VCSEL, also referred to as a vertical cavity surface emitting laser).

[0087] Here, the number of the light sources 212 included in the first PCB assembly 210 is not limited.

[0088] In some examples, the first PCB assembly 210 includes a light source 212 .

[0089] Figure 3 FIG. 1 is a PCB architecture diagram of a stereo camera 1000 in some embodiments of the present disclosure.

[0090] In some examples, reference Figure 3 The first PCB assembly 210 includes a plurality of light sources 212 , and the plurality of light sources 212 are arranged at intervals.

[0091] By configuring in this way, the plurality of light sources 212 can be dispersedly arranged, that is, the heat source on the first PCB assembly 210 can be dispersedly arranged, thus avoiding heat concentration and reducing the temperature rise of the first PCB assembly 210.

[0092] Combination Figure 3 , refer to Fig. 9 In the case where the first PCB assembly 210 includes a plurality of light sources 212, the middle frame 120 may include a plurality of first heat conducting portions 121. Among the plurality of first heat conducting portions 121, some first heat conducting portions 121 are used to conduct heat generated by some light sources 212 to the middle frame 120, and some other first heat conducting portions 121 are used to conduct heat generated by other light sources 212 to the middle frame 120.

[0093] For example, combined with Figure 3 , refer to Fig. 9 The first PCB assembly 210 includes four light sources 212 arranged at intervals, and the middle frame 120 may include two first heat conducting parts 121. One first heat conducting part 121 is used to conduct the heat generated by the two light sources 212 to the middle frame 120, and the other first heat conducting part 121 is used to conduct the heat generated by the other two light sources 212 to the middle frame 120.

[0094] In some embodiments, reference Figure 2 The stereo camera 1000 further includes a third PCB assembly 230, which is used to connect at least logic signals and power signals. For example, the third PCB assembly 230 can be used to supply power to the first PCB assembly 210 and the second PCB assembly 220, and input and output logic signals.

[0095] For example, refer to Figure 2 The stereo camera 1000 further includes a first aviation connector 201 and a second aviation connector 202. One of the first aviation connector 201 and the second aviation connector 202 can be used to connect a control signal to the third PCB assembly 230, and the other can be used to connect a power signal to the third PCB assembly 230.

[0096] Exemplarily, the third PCB assembly 230 is electrically connected to at least a portion of the first PCB assembly 210 , and is electrically connected to at least a portion of the second PCB assembly 220 .

[0097] In some examples, combined Figure 3 , refer to Figure 2 The third PCB assembly 230 includes a third main board 231 and a functional module 232 mounted on the third main board 231 .

[0098] For example, refer to Figure 3 , the functional module 232 may include at least one of the following functional modules 232: a field programmable gate array (FPGA) module 232A and a DC-to-DC converter (DCDC) module. Moreover, the number of the FPGA module and the DCDC module may be one or more. For example, referring to Figure 3 The DCDC modules on the third PCB assembly 230 include a first DCDC module 232B and a second DCDC module 232C.

[0099] The above functional modules 232 will generate certain power consumption during operation. In some examples, the power consumption of the third PCB assembly 230 of the TOF stereo camera of the above selected specifications is measured, and the power consumption of the three functional modules 232 on the third PCB assembly 230 is 0.1W, 0.4W and 0.6W respectively, totaling 1.1W, so that the power consumption of the third PCB assembly 230 accounts for 9.9% of the total power consumption, indicating that the third PCB assembly 230 is the part with the largest temperature rise in the TOF stereo camera.

[0100] In some examples, the heat of the third PCB assembly 230 is conducted to other parts of the second housing 130 except the second heat conducting portion 131 , and at this time, the heat generated by the second PCB assembly 220 and the third PCB assembly 230 is relatively concentrated.

[0101] In some embodiments, in combination Figure 2 , refer to Figure 8 and Fig. 9The middle frame 120 further includes a third heat conducting portion 122; the third heat conducting portion 122 and the first heat conducting portion 121 are spaced apart; the third heat conducting portion 122 is closer to the second housing 130 than the first heat conducting portion 121. The third PCB assembly 230 is located in the second chamber K2; the third heat conducting portion 122 is used to conduct the heat generated by the third PCB assembly 230 to the middle frame 120.

[0102] In some examples, combined Figure 3 and Figure 8 , refer to Figure 2 The function module 232 of the third PCB assembly 230 is mounted on the surface of the third main body board 231 close to the first housing 110. In this way, heat conduction between the function module 232 and the third heat conducting part 122 is facilitated.

[0103] Here, refer to Figure 8 The number of the third heat conducting parts 122 included in the middle frame 120 is not limited. In some examples, the middle frame 120 includes one third heat conducting part 122. In some other examples, the middle frame 120 includes a plurality of third heat conducting parts 122.

[0104] When the third heat-conducting portion 122 conducts the heat generated by the third PCB assembly 230 to the middle frame 120, the heat generated by the third PCB assembly 230 can be conducted to the portion of the middle frame 120 close to the second shell 130. In this way, the heat generated by the first PCB assembly 210, the second PCB assembly 220, and the third PCB assembly 230 can be respectively conducted to the portion of the middle frame 120 close to the first shell 110, the second shell 130, and the portion of the middle frame 120 close to the second shell 130. In this way, the heat dissipation efficiency can be improved, and heat concentration can be avoided, so that the temperature rise during the operation of the stereo camera 1000 is reduced.

[0105] In some embodiments, reference Figure 3 , multiple functional modules 232 are arranged at intervals.

[0106] By configuring in this way, the plurality of functional modules 232 can be dispersedly arranged, that is, the heat source on the third PCB assembly 230 can be dispersedly arranged, thus avoiding heat concentration and reducing the temperature rise of the third PCB assembly 230.

[0107] Combination Figure 3 , refer to Figure 8In the case where the third PCB assembly 230 includes a plurality of functional modules 232, the middle frame 120 may include a plurality of third heat conducting parts 122. Among the plurality of third heat conducting parts 122, some third heat conducting parts 122 are used to conduct heat generated by some functional modules 232 to the middle frame 120, and some other third heat conducting parts 122 are used to conduct heat generated by other functional modules 232 to the middle frame 120.

[0108] For example, combined with Figure 3 , refer to Figure 8 , the third PCB assembly 230 includes an FPGA module 232A, a first DCDC module 232B, and a second DCDC module 232C that are spaced apart, and the power consumption of the FPGA module 232A is less than that of the DCDC module. At this time, the middle frame 120 may include two third heat conducting parts 122. One third heat conducting part 122 is used to conduct the heat generated by the first DCDC module 232B to the middle frame 120, and the other third heat conducting part 122 is used to conduct the heat generated by the second DCDC module 232C to the middle frame 120.

[0109] In the related art, it is usually expected that the end face of the stereo camera 1000 facing the target object (which can be understood as the front face of the stereo camera 1000 in the installed state) has a smaller appearance size. Figure 2 The second main body board 221 of the second PCB assembly 220 and the third main body board 231 of the third PCB assembly 230 are the same main board, that is, the second PCB assembly 220 and the third PCB assembly 230 are integrated on one main board, and the second PCB assembly 220 and the third PCB assembly 230 are arranged side by side, so that the cross-sectional dimension of the stereo camera 1000 perpendicular to the first direction X is larger, thereby making the external appearance dimension of the end face of the stereo camera 1000 facing the target object larger.

[0110] In some embodiments, reference Figure 2 The third PCB assembly 230 is located on a side of the second PCB assembly 220 away from the second housing 130 .

[0111] Through the above arrangement, on the one hand, the cross-sectional dimension of the stereo camera 1000 perpendicular to the first direction X can be made smaller, which is beneficial to the compression of the end face dimension of the stereo camera 1000 facing the target object, and the miniaturization design of the stereo camera 1000 can be realized, so that the overall structure of the stereo camera 1000 is small and compact. In some examples, the overall dimension of the stereo camera 1000 can reach 80 mm×75 mm×65 mm; on the other hand, referring to Figure 2, the second PCB assembly 220 can be closer to the second heat conducting portion 131 in the second housing 130, and the third PCB assembly 230 can be closer to the third heat conducting portion 122 in the middle frame 120 (see Figure 8 ), the spatial position of the above-mentioned structural parts can be optimized.

[0112] It should be noted that, combined with Figure 2 , refer to Figure 8 and Fig. 9 The embodiment of the present disclosure does not limit the arrangement of the first heat conducting part 121 and / or the third heat conducting part 122 , as long as the heat generated by the first PCB assembly 210 or the third PCB assembly 230 can be conducted to the middle frame 120 .

[0113] In some embodiments, reference Figure 8 and Fig. 9 The middle frame 120 includes an outer frame portion 123 and a partition portion 124 . The partition portion 124 is fixed to the inner wall of the outer frame portion 123 ; the partition portion 124 includes a first heat conducting portion 121 and a third heat conducting portion 122 .

[0114] For example, when the middle frame 120 includes a partition portion 124 , the second opening 102 may be formed in the partition portion 124 .

[0115] Exemplarily, the first heat conducting portion 121 is protruding relative to a portion of the partition portion 124 adjacent to the first heat conducting portion 121 . In this case, the first heat conducting portion 121 may also be referred to as a first heat conducting boss.

[0116] Exemplarily, the third heat conducting portion 122 is protruding relative to a portion of the partition portion 124 adjacent to the third heat conducting portion 122 . In this case, the third heat conducting portion 122 may also be referred to as a third heat conducting boss.

[0117] Through the above arrangement, the first heat conducting part 121 and the third heat conducting part 122 can be formed in one piece, which simplifies the structure of the middle frame 120 and the process of forming the first heat conducting part 121 and the third heat conducting part 122 .

[0118] Below, refer to Figure 2 , the heat conduction manner of the first PCB assembly 210, the second PCB assembly 220 and the third PCB assembly 230 will be exemplarily introduced.

[0119] In some examples, the third PCB assembly 230 (see Figure 2 ) and the third heat conducting portion 122 (refer to Figure 8) achieves heat conduction by direct contact. At this time, in order to increase the contact effect between the third PCB assembly 230 and the third heat conducting portion 122, the third PCB assembly 230 and the middle frame 120 (see Figure 2 ) has relatively high installation accuracy requirements.

[0120] In some embodiments, in combination Figure 8 , refer to Figure 5 , the stereo camera 1000 further includes a first elastic thermal pad 310 . The first elastic thermal pad 310 is located between the third PCB assembly 230 and the third thermal conductive portion 122 , and contacts the third thermal conductive portion 122 .

[0121] Exemplarily, the material of the first elastic thermally conductive pad 310 may be a high-performance gap-filling thermally conductive material.

[0122] It should be understood that the number of the first elastic thermal pad 310 can be one or more. Figure 8 ) is more than one (for example, two), the first elastic thermal pad 310 (refer to Figure 5 ) can be multiple, and the multiple first elastic thermal conductive pads 310 can be fitted with the multiple third thermal conductive parts 122 in a one-to-one correspondence.

[0123] Through the above settings, combined with Figure 8 , refer to Figure 5 , one surface of the first elastic thermal pad 310 can be connected to the third PCB component 230 (for example, to the functional module 232, see Figure 3 ) and the other surface can be in contact with the third heat conducting part 122, so as to achieve indirect contact between the third PCB assembly 230 and the third heat conducting part 122. Moreover, the material of the first elastic heat conducting pad 310 has a certain elasticity, which can improve the tightness of the first elastic heat conducting pad 310 and the third PCB assembly 230, and between the first elastic heat conducting pad 310 and the third heat conducting part 122, and avoid the gap between the mutually adjacent surfaces of the third PCB assembly 230 and the third heat conducting part 122 to affect the heat conduction effect, so as to improve the heat conduction effect between the third PCB assembly 230 and the third heat conducting part 122.

[0124] In some embodiments, reference Figure 5 The first main body plate 211 has a first surface 211a and a second surface 211b that are oppositely disposed, and the second surface 211b is closer to the second housing 130 than the first surface 211a; Figure 5 , refer to Figure 4 The light source 212 is disposed on the first surface 211 a of the first main body plate 211 .

[0125] With the above settings, refer to Figure 4 , the light emitted by the light source 212 can be emitted toward the first housing 110 and pass through the first opening 111 (see Figure 7 ) and shoot out.

[0126] It should be understood that Figure 5 and Fig. 9 , refer to Figure 4 The surface of the light source 212 close to the second shell 130 is in contact with the first main body plate 211 , so that the surface of the light source 212 close to the second shell 130 cannot contact with the first heat conducting part 121 .

[0127] Therefore, in some examples, the combination Figure 4 ,refer to Figure 5 and Fig. 9 , the second surface 211b of the first main body plate 211 is in contact with the first heat conducting portion 121, so that the heat generated by the light source 212 can be conducted to the first heat conducting portion 121 through the first main body plate 211. At this time, in order to increase the contact effect between the first PCB assembly 210 and the first heat conducting portion 121, the installation accuracy requirement for the first PCB assembly 210 and the middle frame 120 is relatively high.

[0128] In some embodiments, reference Figure 4 and Figure 5 The stereo camera 1000 further includes a second elastic thermal pad 320 . The second elastic thermal pad 320 is located between the second surface 211 b of the first main body plate 211 and the first heat conducting portion 121 , and is directly opposite to the light source 212 .

[0129] Exemplarily, the material of the second elastic thermally conductive pad 320 may be a high-performance gap-filling thermally conductive material.

[0130] It should be understood that the number of the second elastic thermal pad 320 can be one or more. Figure 4 When there are multiple (for example, two) first heat conducting parts 121 , there may be multiple second elastic heat conducting pads 320 , and the multiple second elastic heat conducting pads 320 may be opposite to the multiple first heat conducting parts 121 in one-to-one correspondence.

[0131] With the above settings, refer to Figure 4 and Figure 5, the heat generated by the light source 212 can at least be conducted to the first heat conducting part 121 through the first main body plate 211 and the second elastic thermal pad 320. Moreover, the second elastic thermal pad 320 is directly opposite to the light source 212, so that the conduction distance of the heat generated by the light source 212 can be relatively short, which can improve the heat conduction effect. In addition, the material of the second elastic thermal pad 320 has a certain elasticity, which can improve the fit tightness between the second elastic thermal pad 320 and the first PCB assembly 210, so that the heat conduction effect between the second elastic thermal pad 320 and the first PCB assembly 210 is improved.

[0132] In some examples, combined Figure 4 , the second elastic thermal pad 320 is in direct contact with the first thermal conductive part 121. At this time, the second elastic thermal pad 320 and the first thermal conductive part 121 are closely attached.

[0133] In some implementations, stereo cameras have a problem of high external electromagnetic radiation, which poses a certain risk to the safety of the stereo cameras. In some cases, the hardware of the stereo cameras is even modified to reduce the external electromagnetic radiation of the stereo cameras, which is not conducive to product development. Among them, the light source (such as a laser) is a component in the stereo camera that generates relatively large electromagnetic radiation.

[0134] To this end, in some embodiments, reference Figure 4 The stereo camera 1000 further includes a third elastic thermal pad 330 and a shielding cover 410. The third elastic thermal pad 330 is located on a side of the second elastic thermal pad 320 away from the first main body plate 211 and contacts the first heat conducting portion 121. The shielding cover 410 is disposed between the second elastic thermal pad 320 and the third elastic thermal pad 330; the shielding cover 410 protrudes in a direction away from the third elastic thermal pad 330.

[0135] Exemplarily, the material of the third elastic thermally conductive pad 330 may be a high-performance gap-filling thermally conductive material.

[0136] It should be understood that Figure 4 , the number of the third elastic thermal pad 330 can be one or more. Similarly, the number of the shielding cover 410 can be one or more. For example, when the number of the second elastic thermal pad 320 is multiple (for example, two), the number of the third elastic thermal pad 330 and the number of the shielding cover 410 can both be multiple. Multiple shielding covers 410 can be fitted with multiple second elastic thermal pads 320 in a one-to-one correspondence, and multiple third elastic thermal pads 330 can be fitted with multiple shielding covers 410 in a one-to-one correspondence.

[0137] Exemplarily, the material of the shielding cover 410 is a material with good thermal conductivity and shielding performance, such as nickel silver.

[0138] Reference Figure 4 , by the stereo camera 1000 further including the shielding cover 410, the shielding cover 410 can be used to reduce the external electromagnetic radiation of the light source 212, thereby reducing the external electromagnetic radiation of the stereo camera 1000. Moreover, when the shielding cover 410 is disposed between the second elastic thermal pad 320 and the third elastic thermal pad 330, the shielding cover 410 is directly opposite to the light source 212, which can enhance the effect of the shielding cover 410 in reducing the external electromagnetic radiation of the light source 212.

[0139] In addition, through the above arrangement, the heat generated by the light source 212 can be conducted to the first heat-conducting part 121 at least through the first main body plate 211, the second elastic heat-conducting pad 320, the shielding cover 410, and the third elastic heat-conducting pad 330 which are arranged in sequence. Moreover, the material of the second elastic heat-conducting pad 320 and the material of the third elastic heat-conducting pad 330 both have a certain elasticity, so that the second elastic heat-conducting pad 320 and the shielding cover 410, the shielding cover 410 and the third elastic heat-conducting pad 330, and the third elastic heat-conducting pad 330 and the first heat-conducting part 121 can all be closely attached, so that the heat conduction effect between the first PCB assembly 210 and the first heat-conducting part 121 is improved.

[0140] In some examples, combined Figure 4 , the second elastic thermal conductive pad 320 is in direct contact with the first main body plate 211 .

[0141] In some embodiments, in combination Figure 5 , refer to Figure 4 The first PCB assembly 210 further includes a first thermal conductive coating 213 . The first thermal conductive coating 213 is disposed on the first surface 211 a of the first main body plate 211 and is disposed away from the light source 212 ; the first thermal conductive coating 213 is in contact with the first housing 110 .

[0142] Exemplarily, the material of the first thermal conductive coating layer 213 includes copper.

[0143] For example, in combination Figure 6 , refer to Figure 2 and Figure 4 The first main body plate 211 is fixed to the first housing 110 by a plurality of first mounting screws 203 (for example, six) installed in the first mounting holes 109. In this way, the first main body plate 211 can be locked to the first housing 110 to enhance the connection stability between the first main body plate 211 and the first housing 110, and improve the fit tightness between the first thermal conductive coating 213 and the first housing 110, so that the effect of the first thermal conductive coating 213 in improving heat conduction is improved.

[0144] Combination Figure 5 , refer to Figure 4The first thermal conductive coating 213 is disposed on the first surface 211a of the first main body plate 211, and the first thermal conductive coating 213 is connected to the first shell 110 (for example, to the inner surface 110a of the first shell 110, see Figure 6 ), part of the heat conducted from the light source 212 to the first main body plate 211 can be conducted to the first housing 110 via the first thermal conductive coating 213. In this way, the middle frame 120 and the first housing 110 can be used to jointly dissipate heat, thereby improving the heat dissipation efficiency of the first PCB assembly 210. Moreover, the first thermal conductive coating 213 has the advantage of good thermal conductivity, which can improve the heat conduction efficiency between the first main body plate 211 and the first housing 110. In addition, the first thermal conductive coating 213 has the advantages of easy coating and thin thickness, which can take into account both the convenience of assembly and the high efficiency of heat dissipation.

[0145] In some embodiments, reference Figure 4 The first PCB assembly 210 further includes a second thermal conductive coating layer 214 . The second thermal conductive coating layer 214 is located between the first main body plate 211 and the second elastic thermal conductive pad 320 .

[0146] It should be understood that the number of the second thermally conductive coating layer 214 can be one or multiple arranged at intervals. For example, when the number of the second elastic thermally conductive pads 320 is multiple (for example, two), the number of the second thermally conductive coating layer 214 can be multiple arranged at intervals, and the multiple second thermally conductive coating layers 214 can be attached to the multiple second elastic thermally conductive pads 320 in a one-to-one correspondence.

[0147] Exemplarily, the material of the second thermal conductive coating layer 214 includes copper.

[0148] When the second thermally conductive coating 214 is located between the first main body plate 211 and the second elastic thermally conductive pad 320 , the second thermally conductive coating 214 can improve the heat conduction efficiency of the first main body plate 211 and the second elastic thermally conductive pad 320 , thereby improving the heat dissipation efficiency of the first PCB assembly 210 .

[0149] In some examples, combined Figure 2 The second PCB assembly 220 and the second heat conducting part 131 achieve heat conduction by direct contact. At this time, in order to increase the contact effect between the second PCB assembly 220 and the second heat conducting part 131, the installation accuracy of the second PCB assembly 220 and the second housing 130 is relatively high.

[0150] In some embodiments, reference Figure 2 , the stereo camera 1000 further includes a fourth elastic thermal pad 340 . The fourth elastic thermal pad 340 is located between the second PCB assembly 220 and the second thermal conductive portion 131 , and contacts the second thermal conductive portion 131 .

[0151] Exemplarily, the material of the fourth elastic thermally conductive pad 340 may be a high-performance gap-filling thermally conductive material.

[0152] It should be understood that the number of the fourth elastic thermal pad 340 can be one or more. Figure 2 When the number of the second heat conducting part 131 is one, the number of the fourth elastic heat conducting pad 340 can be one, and the fourth elastic heat conducting pad 340 can be attached to the second heat conducting part 131 .

[0153] For example, in combination Figure 3 , refer to Figure 2 The processor 222 and / or the transceiver module 223 included in the second PCB assembly 220 are installed on the surface of the second main body board 221 away from the first shell 110. At this time, the fourth elastic thermal pad 340 can be fitted with the processor 222 and / or the transceiver module 223. In this way, the heat conduction distance can be reduced and the heat conduction effect can be improved.

[0154] With the above settings, refer to Figure 2 , similar to the above part, the fourth elastic thermal pad 340 can be used to achieve indirect contact between the second PCB assembly 220 and the second heat conducting part 131, and the fitting tightness between the fourth elastic thermal pad 340 and the second PCB assembly 220, and between the fourth elastic thermal pad 340 and the second heat conducting part 131 can be improved, avoiding the existence of a gap between the mutually adjacent surfaces of the second PCB assembly 220 and the second heat conducting part 131 to affect the heat conduction effect, thereby improving the heat conduction effect between the second PCB assembly 220 and the second heat conducting part 131.

[0155] As described above, the stereo camera 1000 can realize the visual function by receiving the light reflected by the target object. Hereinafter, the lens assembly for receiving the light reflected by the target object in the stereo camera 1000 will be described exemplarily.

[0156] In some embodiments, in combination Figure 3 , refer to Figure 2 The stereo camera 1000 further includes a TOF lens assembly 510, which includes a TOF lens module 511 and a first sensor assembly 512. The first sensor assembly 512 is closer to the second housing 130 than the TOF lens module 511. The TOF lens module 511 penetrates the first housing 110 and the first PCB assembly 210.

[0157] For example, the TOF lens module 511 is connected to the partition plate 124 (see Figure 8 )fixed.

[0158] For example, refer to Figure 7 The first shell 110 is provided with a third opening 503 for forming a window of the TOF lens assembly 510 .

[0159] Exemplarily, the first sensor assembly 512 includes a first image sensor and a first sensor mounting plate, and the first sensor mounting plate is closer to the TOF lens module 511 than the first image sensor.

[0160] The TOF lens assembly 510 generates a certain amount of power consumption during operation. In some examples, the power consumption of the TOF lens assembly 510 of the TOF stereo camera of the selected specifications is measured, and the power consumption of the TOF lens assembly 510 is 1.5W, accounting for 13.5% of the total power consumption, indicating that the TOF lens assembly 510 is the part with the largest temperature rise in the TOF stereo camera. Among them, the first sensor assembly 512 (for example, including the first image sensor) is the part with the largest power consumption in the TOF lens assembly 510.

[0161] In some embodiments, in combination Figure 3 , refer to Figure 5 , the partition part 124 further includes a first groove part (not shown in the figure), and the first groove part is recessed in a direction close to the second housing 130. The stereo camera 1000 further includes a first thermally conductive gel block 350. The first sensor component 512 is located between the TOF lens module 511 and the first groove part, and is surrounded by the first groove part to form a first filling cavity K3. The first thermally conductive gel block 350 is disposed in the first filling cavity K3 and contacts the first sensor component 512.

[0162] It should be understood that the material of the first thermally conductive gel block 350 includes thermally conductive gel, so that the first thermally conductive gel block 350 has a relatively soft texture and can absorb stress generated in the surrounding environment.

[0163] Exemplarily, the material of the first thermally conductive gel block 350 may be a paste-like semi-fluid thermally conductive material.

[0164] It is understandable that the first sensor component 512 (eg, including the first image sensor) is relatively sensitive to stress and strain, and when the first sensor component 512 is subjected to stress or strain, the imaging effect of the stereo camera 1000 may be affected. Figure 3 , refer to Figure 5In the embodiment of the present disclosure, the stereo camera 1000 further includes a first thermally conductive gel block 350. First, the first thermally conductive gel block 350 can be used to conduct the heat generated by the first sensor component 512 to the first groove portion, and then to the middle frame 120. Second, compared with other thermally conductive structures (such as thermally conductive pads), the first thermally conductive gel block 350 has a softer texture. In this way, the influence of surrounding stress or strain on the first sensor component 512 can be reduced while ensuring the thermal conductivity of the first thermally conductive gel block 350. In this way, the imaging effect of the stereo camera 1000 can be improved.

[0165] In some embodiments, in combination Figure 3 , refer to Figure 2 The stereo camera 1000 further includes a color lens assembly (e.g., an RGB lens assembly) 520, and the color lens assembly 520 includes a color lens module 521 and a second sensor assembly 522. The second sensor assembly 522 is closer to the second housing 130 than the color lens module 521. The color lens module 521 penetrates the first housing 110 and the first PCB assembly 210.

[0166] For example, in combination Figure 8 , refer to Figure 2 The color lens module 521 is fixed to the partition portion 124 by a third mounting screw 502 .

[0167] For example, refer to Figure 7 The first shell 110 is provided with a fourth opening 504 for forming a window for the color lens assembly 520 .

[0168] For example, in combination Figure 3 , refer to Figure 2 The second sensor assembly 522 includes a second image sensor and a second sensor mounting plate, and the second sensor mounting plate is closer to the color lens module 521 than the second image sensor.

[0169] The color lens assembly 520 generates a certain amount of power consumption during operation. In some examples, the power consumption of the color lens assembly 520 of the TOF stereo camera of the above selected specifications is measured, and the power consumption of the color lens assembly 520 is 0.5W, accounting for 4.5% of the total power consumption, indicating that the color lens assembly 520 is the part with the largest temperature rise in the TOF stereo camera. Among them, the second sensor assembly 522 (for example, including the second image sensor) is the part with the largest power consumption in the color lens assembly 520.

[0170] In some embodiments, in combination Figure 2 and Figure 3 , refer to Fig. 9, the partition part 124 further includes a second groove part (not shown in the figure), and the second groove part is recessed in a direction close to the second housing 130. The stereo camera 1000 further includes a second thermally conductive gel block (not shown in the figure). The second sensor component 522 is located between the color lens module 521 and the second groove part, and is surrounded by the second groove part to form a second filling cavity K4. The second thermally conductive gel block is arranged in the second filling cavity K4 and contacts the second sensor component 522.

[0171] Similar to the previous part, the material of the second thermally conductive gel block includes thermally conductive gel, so that the second thermally conductive gel block has the characteristics of being softer in texture and can absorb the stress generated in the surrounding environment.

[0172] Exemplarily, the material of the second thermally conductive gel block may be a paste-like semi-fluid thermally conductive material.

[0173] Similar to the previous part, combined with Figure 3 , refer to Figure 2 , when the second sensor component 522 (for example, including the second image sensor) is subjected to stress or strain, the imaging effect of the stereo camera 1000 may be affected. In the embodiment of the disclosure, the stereo camera 1000 further includes a second thermally conductive gel block, so that the heat generated by the second sensor component 522 can be transferred to the second groove portion, and then to the middle frame 120, and the influence of the surrounding stress or strain on the second sensor component 522 can be reduced on the basis of ensuring the heat conduction function of the second thermally conductive gel block, so that the imaging effect of the stereo camera 1000 is improved.

[0174] Above, refer to Figure 2 , the way in which the structure with high power consumption in the stereo camera 1000 conducts heat to the first housing 110, the middle frame 120 or the second housing 130 is exemplarily described. In the following, the way in which the heat conducted to the first housing 110, the middle frame 120 or the second housing 130 is dissipated to the outside is exemplified.

[0175] In some embodiments, in combination Figure 2 , refer to Figure 8 The outer frame 123 includes a first outer frame 1231 and a second outer frame 1232 connected to each other. The first outer frame 1231 is closer to the first housing 110 than the second outer frame 1232. The stereo camera 1000 further includes at least one air duct 610 disposed on the outer periphery of the first outer frame 1231.

[0176] Here, the form and number of the air duct 610 are not limited.

[0177] For example, refer to Figure 5The first outer frame portion 1231 includes a main body portion 12311 and four connecting columns 12312 fixedly connected to the four corners of the main body portion 12311. The connecting columns 12312 can be used to install the first bolt 101 (see Figure 2 ). By such an arrangement, the space between the main body 12311 and the rectangular frame enclosed by the four connecting columns 12312 can form an annular air duct 610, and the annular air duct 610 can be connected to the outside through the gaps between the connecting columns 12312, thereby enhancing the air circulation effect.

[0178] In some examples, combined Figure 2 , refer to Figure 4 and Figure 5 The first thermally conductive gel block 350 , the second thermally conductive gel block, and the second elastic thermally conductive pad 320 are located in the space enclosed by the main body 12311 , so that the heat generated by the first PCB assembly 210 , the TOF lens assembly 510 , and the color lens assembly 520 can be dissipated through the air duct 610 .

[0179] Exemplarily, the number of the air duct 610 may be one; and again exemplary, referring to Figure 5 The number of the air ducts 610 (for example, annular air ducts 610 ) can be multiple (for example, three).

[0180] Understandably, referring to Figure 5 On the one hand, by providing at least one air duct 610 on the outer peripheral side of the first outer frame portion 1231, the air in the air duct 610 can exchange heat with the external air, so that the heat dissipation efficiency of the stereo camera 1000 can be improved. On the other hand, through the above-mentioned configuration, the setting position of the air duct 610 can avoid the first chamber K1, that is, avoid the second PCB assembly 220 with a larger size, so that the setting of the air duct 610 will not increase the external size of the stereo camera 1000, which is conducive to reducing the external size of the stereo camera 1000; on the third hand, combined with Figure 2 , refer to Figure 4 and Figure 5 When the first thermally conductive gel block 350, the second thermally conductive gel block, and the second elastic thermally conductive pad 320 are located in the space enclosed by the main body 12311, the heat generated by the first PCB assembly 210, the TOF lens assembly 510, and the color lens assembly 520, which are more concentrated and have higher power consumption, can be conducted to the main body 12311 and dissipated from the air duct 610, so that the setting position of the air duct 610 is more in line with the heat dissipation requirements.

[0181] In some embodiments, reference Figure 1The stereo camera 1000 further includes a plurality of fins 620 arranged at intervals. A portion of the plurality of fins 620 is fixed to the wall surface 110b of the first housing 110 away from the middle frame 120, another portion is fixed to the wall surface of the second housing 130 away from the middle frame 120, and another portion is fixed to the side surface 1232a of the second outer frame portion 1232.

[0182] For example, refer to Figure 1 In the case where the stereo camera 1000 includes a first aviation joint 201 and a second aviation joint 202, the first aviation joint 201 and the second aviation joint 202 penetrate the second shell 130. At this time, the fin 620 fixed to the wall of the second shell 130 away from the middle frame 120 avoids the first aviation joint 201 and the second aviation joint 202.

[0183] In some examples, reference Figure 2 According to parameters such as the field of view (FOV) and through the lens (TTL) of different lenses, the openings in the first housing 110 for installing the TOF lens assembly 510 and the color lens assembly 520 are optimized, and the installation space in the middle frame 120 for installing the TOF lens assembly 510 and the color lens assembly 520 is designed to be compatible, thereby realizing the system development of the stereo camera 1000 (for example, an industrial-grade TOF camera), so that the three models of cameras with a small field of view, a medium field of view, and a large field of view can reuse the first housing 110, the middle frame 120, the second housing 130, the first PCB assembly 210, the second PCB assembly 220, and the third PCB assembly 230, thereby reducing the number of structural parts, enhancing the structural compatibility of the housing with the product system, reducing the structural development cost of the stereo camera 1000, and improving the assembly production efficiency of the production line, thereby greatly reducing the structural parts development cost and the material management cost.

[0184] For example, refer to Figure 4 and Figure 7 The fin 620 fixed to the wall surface 110b of the first housing 110 away from the middle frame 120 includes a first annular fin 621 provided at the edge of the wall surface 110b of the first housing 110 away from the middle frame 120. By such an arrangement, an annular air passage can be formed by using the first annular fin 621, and the heat dissipation efficiency at the first housing 110 can be improved.

[0185] For example, in combination Figure 4 , refer to Figure 7In the case where the plurality of fins 620 include a first annular fin 621, an annular groove 640 located on the inner side of the first annular fin 621 can be provided on the wall surface 110b of the first shell 110 away from the middle frame 120. In this way, the air flow rate of the annular air channel can be further increased, so that the heat dissipation efficiency at the first shell 110 can be further improved.

[0186] For example, refer to Figure 1 , compared with the dimensions of the multiple fins 620 fixed to the wall 110b of the first shell 110 away from the middle frame 120 along the extension direction thereof, and the dimensions of the multiple fins 620 on the side 1232a of the second outer frame portion 1232 along the extension direction thereof, the dimensions of the multiple fins 620 fixed to the wall of the second shell 130 away from the middle frame 120 along the first direction X are larger. And / or, compared with the number of the multiple fins 620 fixed to the wall 110b of the first shell 110 away from the middle frame 120, and the number of the multiple fins 620 on the side 1232a of the second outer frame portion 1232, the number of the multiple fins 620 fixed to the wall of the second shell 130 away from the middle frame 120 is greater. With such a configuration, on the first hand, the heat dissipation efficiency of the second shell 130 can be improved; on the second hand, combined with Figure 2 , refer to Figure 1 As mentioned above, the size of the stereo camera 1000 along the first direction X can be relatively large. This arrangement can make full use of the space of the stereo camera 1000 along the first direction X to set the fins 620; thirdly, the arrangement of the fins 620 can match the high power consumption and high heat dissipation requirements of the second PCB assembly 220.

[0187] Reference Figure 1 , by the stereo camera 1000 further including a plurality of fins 620 arranged at intervals, the heat conducted to the first housing 110, the second outer frame portion 1232, and the second housing 130 can be further conducted to the fins 620 and dissipated through the fins 620, so that the heat dissipation efficiency of the stereo camera 1000 can be improved. Moreover, the wall surface 110b of the first housing 110 away from the middle frame 120, the wall surface of the second housing 130 away from the middle frame 120, and the side surface 1232a of the second outer frame portion 1232 have the advantage of a large structural surface area, so that more fins 620 can be provided, further improving the heat dissipation efficiency.

[0188] In addition, refer to Figure 1 and Figure 2When the fourth elastic thermal pad 340 is located in the second cavity K2 and a plurality of fins 620 are provided on the side 1232a of the second outer frame portion 1232, the heat generated by the third PCB assembly 230 with relatively low power consumption can be conducted to the second outer frame portion 1232 and the plurality of fins 620. In this way, the setting position of the fins 620 on the middle frame body 120 can be more matched with the heat dissipation requirements.

[0189] In some embodiments, reference Figure 4 and Figure 7 The stereo camera 1000 further includes a plurality of grooves 630 formed on the outer peripheral surface of the first shell 110 .

[0190] Exemplarily, the number of the grooves 630 is eight, and the eight grooves 630 are evenly distributed on the outer circumferential surface of the first shell 110 .

[0191] Through the above arrangement, the structural surface area of ​​the first shell 110 can be made larger, and the heat dissipation area of ​​the first shell 110 can be made larger, so that the heat dissipation efficiency of the first shell 110 can be improved.

[0192] Reference Fig.11 Some embodiments of the present disclosure further provide an electronic device 2000. The electronic device 2000 includes a controller 2100 and a stereo camera 1000 provided by the above technical solution. The controller 2100 is coupled to the stereo camera 1000.

[0193] The beneficial effects that can be achieved by the electronic device 2000 provided in some embodiments of the present disclosure are the same as the beneficial effects that can be achieved by the stereo camera 1000 provided by the above technical solution, and will not be repeated here.

[0194] In some examples, the electronic device 2000 may be a logistics robot, etc., so that the stereo camera 1000 can be applied to small-volume, medium-precision, medium- and long-distance visual scenes such as robots, logistics, warehousing, or pan-AIOT.

[0195] Here, there is no limitation on the installation form of the stereo camera 1000 on the electronic device 2000. Figure 4 A second mounting hole 108 is formed on the outer peripheral surface of the middle frame 120 , and the stereo camera 1000 can be connected to other parts of the electronic device 2000 (such as a mounting bracket) by bolts installed in the second mounting hole 108 .

[0196] Exemplarily, the controller 2100 can be connected to at least the third PCB assembly 210 (see Figure 2 ) coupling.

[0197] Reference Fig.11When the controller 2100 is coupled to the stereo camera 1000, the controller 2100 can input a driving signal to the stereo camera 1000 and collect visual information generated by the stereo camera 1000. Of course, the controller 2100 can also implement other functions, which will not be given as examples here.

[0198] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A stereo camera, characterized in that: include: A first shell, a middle frame and a second shell connected to each other; The middle frame is arranged between the first shell and the second shell; the first shell and the part of the middle frame close to the first shell are enclosed to form a first chamber; the second shell and the part of the middle frame close to the second shell are enclosed to form a second chamber; the middle frame includes a first heat conducting part; the second shell includes a second heat conducting part; A first PCB assembly is located in the first cavity; the first PCB assembly includes a light source; the first heat conducting portion is used to conduct heat generated by the first PCB assembly to the middle frame; as well as, The second PCB assembly is located in the second cavity; the second PCB assembly includes a processor; and the second heat conducting portion is used for conducting heat generated by the second PCB assembly to the second shell.

2. The stereo camera according to claim 1, characterized in that: The middle frame further includes a third heat-conducting portion; the third heat-conducting portion and the first heat-conducting portion are spaced apart; the third heat-conducting portion is closer to the second housing than the first heat-conducting portion; The stereo camera also includes: The third PCB assembly is located in the second cavity; the third heat conducting portion is used to conduct heat generated by the third PCB assembly to the middle frame.

3. The stereo camera according to claim 2, characterized in that: The third PCB assembly is located on a side of the second PCB assembly away from the second housing; the third PCB assembly is at least used for accessing logic signals and power signals.

4. The stereo camera according to claim 2, characterized in that: The stereo camera also includes: The first elastic thermally conductive pad is located between the third PCB assembly and the third thermally conductive portion and is in contact with the third thermally conductive portion.

5. The stereo camera according to claim 1, characterized in that: The first PCB assembly further includes a first main body plate; the first main body plate has a first surface and a second surface arranged opposite to each other, and the second surface is closer to the second housing than the first surface; The light source is disposed on the first surface of the first main body plate; The stereo camera also includes: The second elastic thermally conductive pad is located between the second surface of the first main body plate and the first thermally conductive portion and is directly opposite to the light source.

6. The stereo camera according to claim 5, characterized in that: The stereo camera also includes: a third elastic thermally conductive pad, located on a side of the second elastic thermally conductive pad away from the first main body plate and in contact with the first heat conducting portion; and The shielding cover is arranged between the second elastic thermal conductive pad and the third elastic thermal conductive pad; the shielding cover protrudes in a direction away from the third elastic thermal conductive pad.

7. The stereo camera according to claim 5, characterized in that: The first PCB assembly further comprises: A first thermal conductive coating is disposed on the first surface of the first main body plate and avoids the light source; the first thermal conductive coating is in contact with the first shell; and, The second thermal conductive coating is located between the first main body plate and the second elastic thermal conductive pad.

8. The stereo camera according to claim 1, characterized in that: The stereo camera also includes: The fourth elastic thermally conductive pad is located between the second PCB assembly and the second thermally conductive portion and contacts the second thermally conductive portion.

9. The stereo camera according to claim 2, characterized in that: The first PCB assembly includes a plurality of light sources, and the plurality of light sources are arranged at intervals; and / or, The third PCB assembly includes a plurality of functional modules, and the plurality of functional modules are arranged at intervals.

10. The stereo camera according to any one of claims 2 to 9, characterized in that: The middle frame comprises: an outer frame; and The partition part is fixed to the inner wall of the outer frame part; the partition part includes the first heat conducting part and the third heat conducting part.

11. The stereo camera according to claim 10, characterized in that: The partition portion further includes a first groove portion, the first groove portion being recessed in a direction close to the second shell body; The stereo camera also includes: A TOF lens assembly, comprising a TOF lens module and a first sensor assembly; the first sensor assembly is closer to the second housing than the TOF lens module; the TOF lens module passes through the first housing and the first PCB assembly; the first sensor assembly is located between the TOF lens module and the first groove portion, and is enclosed with the first groove portion to form a first filling cavity; and, The first thermally conductive gel block is disposed in the first filling cavity and contacts the first sensing component.

12. The stereo camera according to claim 10, characterized in that: The middle frame further includes a second groove portion, and the second groove portion is recessed in a direction close to the second shell body; The stereo camera also includes: A color lens assembly, comprising a color lens module and a second sensor assembly; the second sensor assembly is closer to the second housing than the color lens module; the color lens module passes through the first housing and the first PCB assembly; the second sensor assembly is located between the color lens module and the second groove portion, and is enclosed with the second groove portion to form a second filling cavity; and, The second thermally conductive gel block is disposed in the second filling cavity and contacts the second sensing component.

13. The stereo camera according to claim 10, characterized in that: The outer frame portion includes a first outer frame portion and a second outer frame portion connected to each other, wherein the first outer frame portion is closer to the first shell than the second outer frame portion; The stereo camera further includes: at least one air duct disposed on the outer peripheral side of the first outer frame portion.

14. The stereo camera according to claim 13, characterized in that: The stereo camera also includes: A plurality of fins are arranged at intervals; a portion of the plurality of fins is fixed to a wall surface of the first shell away from the middle frame, another portion is fixed to a wall surface of the second shell away from the middle frame, and another portion is fixed to a side surface of the second outer frame.

15. The stereo camera according to any one of claims 1 to 9, characterized in that: The stereo camera also includes: A plurality of grooves are formed on the outer peripheral surface of the first shell.

16. An electronic device, characterized in that: include: The stereo camera as claimed in any one of claims 1 to 15; as well as, A controller is coupled to the stereo camera.

Images