Circuit board heat dissipation device

Abstract

The embodiment of the invention provides a circuit board heat dissipation device which comprises an installation box, an installation assembly, a heat conduction assembly and a collection assembly, the collection box is fixedly installed at the top of the installation box, the installation assembly is located in the installation box, the heat conduction assembly is located below the installation assembly, and the collection assembly comprises an exhaust structure and a detection structure. The exhaust structure comprises a fixing plate, a micro push rod, a push plate, a sliding ring, a sliding groove, an auxiliary column, an arc-shaped groove, a hinge rod and a triangular plate, the fixing plate and the micro push rod are fixedly connected to the top of the collecting box, the sliding ring is arranged in the fixing plate, the push plate is fixedly connected to the outer wall of the sliding ring, and the free end of the micro push rod is connected with the push plate. And the detection structure comprises an alarm. The circuit board can be installed, so that the installation of the circuit board is more convenient, the installation of the circuit board prevents the displacement of circuit board elements caused by vibration or impact, and the stable work of the circuit board elements is ensured.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board heat dissipation, and in particular to a circuit board heat dissipation device. Background Art

[0002] Document CN112911903A discloses a circuit board heat dissipation device, comprising a heat sink and a fan, wherein the fan is mounted on the upper side of the heat sink, a circuit board is plugged into the middle of the heat sink, heat conducting plates are arranged on the upper and lower sides of the circuit board, a track is arranged on the side of the heat conducting plate away from the circuit board, the track is rotatably connected to two rollers, the front upper roller is connected to a motor, the motor is connected to the front lower roller through a belt, a heat sink 1 is arrayed on the track in the front and rear directions, a heat sink 2 is arranged on the side of the track away from the heat conducting plate, the present invention accelerates heat conduction in the circuit board area and heat transfer efficiency by rotating the track, utilizing the movement of the heat sink 1 and heat transfer between solids, and at the same time, refrigeration is performed by a semiconductor refrigeration device to force the heat sink 1 to cool down, and the countercurrent between the track and the liquid is utilized to accelerate heat transfer, so that heat transfer is more uniform and local overheating is avoided.

[0003] After exploration and analysis, the patent has the following shortcomings when actually used:

[0004] When the device is in use, it mainly uses a semiconductor refrigeration device for cooling, forcing the heat sink to cool down, and utilizing the countercurrent of the track and the liquid to accelerate heat transfer, making the heat transfer more uniform. Local overheating of the wall occurs, and this device lacks a monitoring device when in use. When the circuit board is in use, short circuits and electrical failures caused by excessive temperature may occur. Due to the effect of heat dissipation, short circuits of the circuit board are easily ignored, making it difficult to ensure that the electrical components operate in the best condition, thereby reducing the overall performance of the circuit board.

[0005] In summary, the present application now proposes a circuit board heat dissipation device to solve the above-mentioned problems. Summary of the invention

[0006] The purpose of the present invention is to solve the problem of short circuit and electrical failure caused by excessive temperature of the circuit board when it is in use. Due to the effect of heat dissipation, it is easy to ignore the short circuit of the circuit board, making it difficult to ensure that the electrical components operate in the best condition and avoid reducing the overall performance of the circuit board.

[0007] An embodiment of the present invention provides a circuit board heat dissipation device, the device comprising: a mounting box, a mounting component, a heat conduction component and a collection component;

[0008] A collecting box is fixedly installed on the top of the installation box, the installation component is located in the installation box, and the heat conduction component is located below the installation component;

[0009] The collecting assembly includes an exhaust structure and a detection structure, the exhaust structure includes a fixed plate, a micro push rod, a push plate, a sliding ring, a slide groove, an auxiliary column, an arc groove, a hinged rod and a triangular plate, the top of the collecting box is fixedly connected with the fixed plate and the micro push rod, the sliding ring is arranged inside the fixed plate, the outer wall of the sliding ring is fixedly connected with the push plate, the free end of the micro push rod is connected to the push plate, and the detection structure includes an alarm.

[0010] In some embodiments, slide plates are fixedly connected to the inner walls on both sides of the installation box, and the arrangement facilitates sliding of the installation assembly.

[0011] In some embodiments, the mounting assembly includes a placement plate, a mounting seat, a sliding rod, a semicircular plate, a rebounder and a clamping plate, the placement plate being slidably mounted on the slide plate, a placement groove being provided on the placement plate, two groups of mounting seats being fixedly connected to the top of the placement plate and being arranged opposite to each other, the sliding rod being slidably mounted on the mounting seat, one end of the sliding rod being fixedly connected to the clamping plate, the other end of the sliding rod being fixedly connected to the semicircular plate, one side of the semicircular plate being fixedly connected to the rebounder, one end of the rebounder being connected to the mounting seat, and the circuit board can be installed by coordinated use of the placement plate, the mounting seat, the sliding rod, the semicircular plate, the rebounder and the clamping plate, so that the installation of the circuit board can be carried out, making the installation of the circuit board more convenient, and the installation of the circuit board can prevent the displacement of circuit board components caused by vibration or impact, thereby ensuring its stable operation, and further, it is convenient for technicians to disassemble and replace when necessary, reducing the difficulty of maintenance.

[0012] In some embodiments, the heat conducting component includes a heat conducting plate, a heat sink, heat dissipating blades and a heat conducting column. The bottom of the slide plate is fixedly connected to the heat conducting plate, the inner bottom of the mounting box is fixedly connected to the heat sink, both sides of the heat sink are respectively fixedly connected to heat dissipating blades, and one side of the heat dissipating blade is fixedly connected to the heat conducting column. By using the heat conducting plate, the heat sink, the heat dissipating blades and the heat conducting column in coordination, the heat at the bottom of the circuit board can be conducted. By having good contact with the bottom of the circuit board, the heat generated at the bottom can be quickly absorbed and conducted away to prevent heat accumulation inside the circuit board. By conducting heat to the bottom, the temperature of the bottom of the circuit board can be reduced. The heat dissipation device can slow down thermal fatigue caused by temperature cycles, reduce component aging speed, and delay service life.

[0013] In some embodiments, an alarm is fixedly connected to the inner top of the collection box, and its arrangement facilitates monitoring of the hot air gathered in the collection box.

[0014] In some embodiments, an auxiliary column is fixedly connected to the fixed plate, an arc groove is provided on the sliding ring, the auxiliary column is slidably installed on the arc groove, the hinge rod is hingedly installed on the top of the sliding ring, and a plurality of groups of triangular plates are hingedly installed on the top of the fixed plate in a ring array, the top of the triangular plate is hingedly installed on one end of the hinge rod, a sliding groove is provided on the outer wall of the fixed plate, and the push plate is slidably installed on the sliding groove. Through the coordinated use of the fixed plate, the micro push rod, the push plate, the sliding ring, the sliding groove, the auxiliary column, the arc groove, the hinge rod, the triangular plate and the alarm, the heat in the installation box can be monitored for accumulation to prevent the occurrence of short circuit in the circuit board. By monitoring and managing the heat accumulated on the circuit board, short circuit and electrical failure caused by overheating can be effectively reduced to ensure the safe operation of the equipment. The heat in the installation box can be managed and the effective management of heat accumulation can reduce the operating temperature of the circuit board and ensure that the electrical components operate in the best state, thereby improving the overall performance.

[0015] In some embodiments, a circular hole is provided on the top of the collection box, and a circular hole is also provided on the fixing plate. The triangular plate is located above the circular hole. The provision of the circular hole facilitates the transportation of hot air in the installation box.

[0016] In some embodiments, an exhaust fan is disposed on the top of the installation box, which is convenient for exhausting the heat of the installation box.

[0017] In some embodiments, a connection top box is fixedly connected to the top of the fixed plate, which is arranged to facilitate exhaust protection, and the exhaust fan is located inside the collection box.

[0018] In some embodiments, a connecting pipe is fixedly connected to the top of the connecting top box, a cooling device is fixedly connected to the rear side of the collecting box, an air outlet pipe is fixedly connected to the bottom of the cooling device, and one end of the air outlet pipe is connected to the rear side of the mounting box. The arrangement facilitates cooling of the circuit board.

[0019] The beneficial effects of the above embodiments include:

[0020] The circuit board heat dissipation device can install the circuit board through the coordinated use of the placement plate, the mounting seat, the slide bar, the semicircular plate, the rebounder and the clamping plate, so that the installation of the circuit board is more convenient. The installation of the circuit board can prevent the displacement of the circuit board components due to vibration or impact, thereby ensuring its stable operation. Furthermore, it is convenient for technicians to disassemble and replace when necessary, thereby reducing the difficulty of maintenance. The heat at the bottom of the circuit board can be conducted through the coordinated use of the heat conduction plate, the heat dissipation plate, the heat dissipation blades and the heat conduction column. Through good contact with the bottom of the circuit board, the heat generated at the bottom can be quickly absorbed and conducted away, thereby preventing heat from accumulating inside the circuit board. By conducting heat to the bottom of the circuit board, the heat can be reduced. The temperature at the bottom of the low circuit board, the heat dissipation device can slow down the thermal fatigue caused by temperature cycling, reduce the aging rate of components and extend their service life. Through the coordinated use of fixed plates, micro push rods, push plates, sliding rings, slide grooves, auxiliary columns, arc grooves, hinged rods, triangular plates and alarms, the heat in the installation box can be monitored for aggregation to prevent short circuits in the circuit boards. By monitoring and managing the heat accumulated on the circuit boards, short circuits and electrical failures caused by overheating can be effectively reduced to ensure the safe operation of the equipment. The heat in the installation box can be managed. Effective management of heat accumulation can reduce the operating temperature of the circuit board and ensure that the electrical components operate in the best condition, thereby improving the overall performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings illustrate generally, by way of example and not limitation, various embodiments discussed herein.

[0022] Figure 1 A three-dimensional diagram of the internal structure of the fixing ring of the present invention;

[0023] Figure 2 A three-dimensional diagram of the internal structure of the fixing ring of the present invention;

[0024] Figure 3 For the present invention Figure 2 A magnified view of part A;

[0025] Figure 4 It is a partially unfolded stereoscopic view of the installation box of the present invention;

[0026] Figure 5 is a three-dimensional diagram of the exhaust fan of the present invention;

[0027] Figure 6 It is an unfolded stereoscopic view of the heat conducting plate of the present invention;

[0028] Figure 7 A top view of the present invention;

[0029] Figure 8 For the present invention Figure 7 AA section view.

[0030] Explanation of symbols:

[0031] 1-installation box; 2-exhaust fan; 3-placement plate; 4-slide plate; 5-mounting seat; 6-slide rod; 7-semicircular plate; 8-rebounder; 9-clamp; 10-heat conduction plate; 11-heat dissipation plate; 12-heat dissipation blades; 13-heat conduction column; 14-collection box; 15-fixing plate; 16-connecting top box; 17-micro push rod; 18-push plate; 19-sliding ring; 20-slide groove; 21-auxiliary column; 22-arc groove; 23-hinge rod; 24-triangle plate; 25-connecting pipe; 26-cooling equipment; 27-exhaust pipe; 28-alarm. DETAILED DESCRIPTION

[0032] In order to enable a more detailed understanding of the features and technical contents of the embodiments of the present application, the implementation of the embodiments of the present application is described in detail below in conjunction with the accompanying drawings. The attached drawings are for reference only and are not used to limit the embodiments of the present application.

[0033] In the embodiments of the present application, it should be noted that, unless otherwise specified and limited, the term "connection" should be understood in a broad sense. For example, it can be an electrical connection or a connection between two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0034] It should be noted that the terms "first\second\third" involved in the embodiments of the present application are only used to distinguish similar objects, and do not represent a specific order for the objects. It is understandable that the specific order or sequence of "first\second\third" can be interchanged where permitted. It should be understood that the objects distinguished by "first\second\third" can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0035] See also Figure 1-8The present invention provides a technical solution: a circuit board heat dissipation device, comprising an installation box 1, an installation component, a heat conducting component and a collecting component. The collecting box 14 is fixedly installed on the top of the installation box 1, and the inner walls on both sides of the installation box 1 are respectively fixedly connected with slide plates 4, which are arranged to facilitate the sliding work of the installation component. The installation component is located in the installation box 1, and the installation component comprises a placement plate 3, a mounting seat 5, a slide bar 6, a semicircular plate 7, a rebounder 8 and a clamping plate 9. The placement plate 3 is slidably installed on the slide plate 4, and a placement groove is provided on the placement plate 3. Two groups of mounting seats 5 are fixedly connected on the top of the placement plate 3 and are arranged oppositely. The sliding rod 6 is slidably installed on the mounting seat 5, one end of the sliding rod 6 is fixedly connected with the clamping plate 9, and the other end of the sliding rod 6 is fixedly connected with the semicircular plate 7, and one side of the semicircular plate 7 is fixedly connected with the rebounder 8, and one end of the rebounder 8 is connected to the mounting seat 5. When in use, the staff manually holds the handle, and then pulls the handle outward, and the handle drives the placement plate 3 to slide outward. At this time, the placement plate 3 slides on the slide plate 4 When the circuit board is placed in the placement groove, the two sides of the circuit board will squeeze the clamping plate 9, and the clamping plate 9 is squeezed to drive the sliding rod 6 to slide on the mounting seat 5. When the mounting seat 5 slides, the mounting seat 5 drives the semicircular plate 7 to move, and the semicircular plate 7 drives the rebounder 8 to shrink. As the rebounder 8 shrinks continuously, the distance between the two sets of clamping plates 9 is expanded until the circuit board is completely placed in the placement groove, and the clamping plate 9 is driven by the contraction of the rebounder 8 to fix the circuit board. Through the coordinated use of the placement plate 3, the mounting seat 5, the sliding rod 6, the semicircular plate 7, the rebounder 8 and the clamping plate 9, the circuit board can be installed, making the installation of the circuit board more convenient, and the installation of the circuit board can prevent the displacement of the circuit board components caused by vibration or impact, and ensure its stable operation. Further, it is convenient for technicians to disassemble and replace when necessary, reducing the difficulty of maintenance.

[0036] The heat conduction component is located below the mounting component, and the heat conduction component includes a heat conduction plate 10, a heat sink 11, heat dissipation blades 12 and a heat conduction column 13. The bottom of the slide plate 4 is fixedly connected with the heat conduction plate 10, the inner bottom of the mounting box 1 is fixedly connected with the heat sink 11, the two sides of the heat sink 11 are respectively fixedly connected with heat dissipation blades 12, and one side of the heat dissipation blade 12 is fixedly connected with the heat conduction column 13. The circuit board generates heat when in use, and the heat is dissipated in the mounting box 1 at this time. The heat at the bottom of the circuit board absorbs part of the heat through the heat conduction plate 10 and is transferred to the heat conduction column 13. The heat conduction column 13 The heat on the circuit board is dissipated through the heat dissipation plate 11 and the heat dissipation blades 12, so as to reduce the heat accumulation at the bottom of the circuit board. The heat conduction plate 10, the heat dissipation plate 11, the heat dissipation blades 12 and the heat conduction column 13 can be used in combination to conduct the heat at the bottom of the circuit board. The good contact with the bottom of the circuit board can quickly absorb and conduct the heat generated at the bottom to prevent the heat from accumulating inside the circuit board. The temperature of the bottom of the circuit board can be reduced by conducting heat to the bottom. The heat dissipation device can reduce the thermal fatigue caused by temperature cycle, reduce the aging speed of components and extend their service life.

[0037] The collecting assembly includes an exhaust structure including an exhaust structure and a detection structure. The exhaust structure includes a fixed plate 15, a micro push rod 17, a push plate 18, a sliding ring 19, a slide groove 20, an auxiliary column 21, an arc groove 22, a hinged rod 23 and a triangular plate 24. The top of the collecting box 14 is fixedly connected with the fixed plate 15 and the micro push rod 17. The interior of the fixed plate 15 is provided with a sliding ring 19. The outer wall of the sliding ring 19 is fixedly connected with the push plate 18. The free end of the micro push rod 17 is connected to the push plate 18. The fixed plate 15 is fixedly connected with an auxiliary column 21. The sliding ring 19 is provided with an arc groove 22. The auxiliary column 21 is slidably installed on the arc groove 22, the top hinge of the sliding ring 19 is installed with a hinge rod 23, the top hinge of the fixed plate 15 is installed with multiple sets of triangular plates 24 distributed in a ring array, the top of the triangular plate 24 is hinged to one end of the hinge rod 23, the outer wall of the fixed plate 15 is provided with a slide groove 20, and the push plate 18 is slidably installed on the slide groove 20. Most of the heat in the installation box 1 is discharged to the collection box 14 through the exhaust fan 2 and gathered in the collection box 14. At this time, the heat is monitored by the alarm 28 to prevent the heat from being too high and short-circuiting and burning. After the detection is completed, The micro push rod 17 is controlled to start, and the free end of the micro push rod 17 drives the push plate 18 to move on the slide groove 20, so that the push plate 18 drives the sliding ring 19 to rotate. At this time, the auxiliary column 21 slides on the arc groove 22 to assist the rotation of the sliding ring 19. Then the hinged rod 23 drives the triangular plate 24 to move, so that the triangular plate 24 opens. The fixed plate 15, the micro push rod 17, the push plate 18, the sliding ring 19, the slide groove 20, the auxiliary column 21, the arc groove 22, the hinged rod 23, the triangular plate 24 and the alarm 28 are used in combination. The hot air in the installation box 1 is gathered and monitored to prevent short circuits in the circuit board. By monitoring and managing the heat accumulated on the circuit board, short circuits and electrical failures caused by overheating can be effectively reduced to ensure the safe operation of the equipment. The hot air in the installation box 1 is managed. Effective management of hot air accumulation can reduce the operating temperature of the circuit board and ensure that the electrical components operate in the best condition, thereby improving the overall performance. The detection structure includes an alarm 28. The alarm 28 is fixedly connected to the inner top of the collection box 14. Its arrangement is convenient for monitoring the hot air gathered in the collection box 14.

[0038] Furthermore, an exhaust fan 2 is provided on the top of the installation box 1, and its arrangement is convenient for exhausting the heat of the installation box 1. A circular hole is opened on the top of the collecting box 14, and a circular hole is also opened on the fixing plate 15. The triangular plate 24 is located above the circular hole. The arrangement of the circular hole is convenient for conveying the hot air in the installation box 1. The top of the fixing plate 15 is fixedly connected with a connecting top box 16, and its arrangement is convenient for protecting the exhaust. The exhaust fan 2 is located inside the collecting box 14, and the top of the connecting top box 16 is fixedly connected with a connecting pipe 25. The rear side of the collecting box 14 is fixedly connected with a cooling device 26, and the bottom of the cooling device 26 is fixedly connected with an air outlet pipe 27. One end of the air outlet pipe 27 is connected to the rear side of the installation box 1, and its arrangement is convenient for cooling the circuit board. The heat in the collecting box 14 is transferred to the cooling device 26 through the connecting pipe 25 for cooling. After cooling, it is converted into cold air and transmitted to the installation box 1 through the air outlet pipe 27 for cooling.

[0039] Working principle: when in use, the staff manually holds the handle and then pulls the handle outward, and the handle drives the placement plate 3 to slide outward. At this time, the placement plate 3 slides on the slide plate 4. As the placement plate 3 continues to slide outward, the circuit board placement groove is exposed, and then the circuit board is placed in the placement groove on the placement plate 3. When the circuit board is placed, the two sides of the circuit board will squeeze the clamping plate 9, and the clamping plate 9 is squeezed and drives the slide bar 6 to slide on the mounting seat 5. When the mounting seat 5 slides, the mounting seat 5 drives the semicircular plate 7 to move, and the semicircular plate 7 drives the rebounder 8 to shrink. As the rebounder 8 continues to shrink, the distance between the two sets of clamping plates 9 is expanded until the circuit board is completely placed in the groove. The clamping plate 9 is fixed to the circuit board through the contraction of the rebounder 8. The circuit board will generate heat when in use. At this time, the heat is dissipated in the mounting box 1. The heat at the bottom of the circuit board is absorbed by the heat conducting plate 10 and transferred to On the heat-conducting column 13, the heat on the heat-conducting column 13 is dissipated through the heat sink 11 and the heat dissipation blades 12, reducing the situation where heat accumulates at the bottom of the circuit board. At this time, most of the heat in the installation box 1 is discharged to the collection box 14 through the exhaust fan 2 and accumulated in the collection box 14. At this time, the heat is monitored by the alarm 28 to prevent short circuit and combustion caused by excessive heat. After the detection is completed, the micro push rod 17 is controlled to start, and the free end of the micro push rod 17 drives the push plate 18 to move on the slide groove 20, so that the push plate 18 drives the sliding ring 19 to move. At this time, the auxiliary column 21 slides on the arc groove 22 to assist the sliding ring 19. Then the hinged rod 23 drives the triangular plate 24 to move, so that the triangular plate 24 is opened, so that the heat in the collection box 14 is transferred to the cooling device 26 through the connecting pipe 25 for cooling. After cooling, it is converted into cold air and transmitted to the installation box 1 through the outlet pipe 27 for cooling.

[0040] The circuit board heat dissipation device can install the circuit board through the coordinated use of the placement plate, the mounting seat, the slide bar, the semicircular plate, the rebounder and the clamping plate, so that the installation of the circuit board is more convenient. The installation of the circuit board can prevent the displacement of the circuit board components due to vibration or impact, thereby ensuring its stable operation. Furthermore, it is convenient for technicians to disassemble and replace when necessary, thereby reducing the difficulty of maintenance. The heat at the bottom of the circuit board can be conducted through the coordinated use of the heat conduction plate, the heat dissipation plate, the heat dissipation blades and the heat conduction column. Through good contact with the bottom of the circuit board, the heat generated at the bottom can be quickly absorbed and conducted away, thereby preventing heat from accumulating inside the circuit board. By conducting heat to the bottom of the circuit board, the heat can be reduced. The temperature at the bottom of the low circuit board, the heat dissipation device can slow down the thermal fatigue caused by temperature cycling, reduce the aging rate of components and extend their service life. Through the coordinated use of fixed plates, micro push rods, push plates, sliding rings, slide grooves, auxiliary columns, arc grooves, hinged rods, triangular plates and alarms, the heat in the installation box can be monitored for aggregation to prevent short circuits in the circuit boards. By monitoring and managing the heat accumulated on the circuit boards, short circuits and electrical failures caused by overheating can be effectively reduced to ensure the safe operation of the equipment. The heat in the installation box can be managed. Effective management of heat accumulation can reduce the operating temperature of the circuit board and ensure that the electrical components operate in the best condition, thereby improving the overall performance.

[0041] The technical solutions described in the embodiments of the present application can be combined arbitrarily without conflict.

[0042] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A circuit board heat dissipation device, characterized in that: The device comprises: a mounting box, a mounting assembly, a heat conducting assembly and a collecting assembly; A collecting box is fixedly installed on the top of the installation box, the installation component is located in the installation box, and the heat conduction component is located below the installation component; The collecting assembly includes an exhaust structure and a detection structure, the exhaust structure includes a fixed plate, a micro push rod, a push plate, a sliding ring, a slide groove, an auxiliary column, an arc groove, a hinged rod and a triangular plate, the top of the collecting box is fixedly connected with the fixed plate and the micro push rod, the sliding ring is arranged inside the fixed plate, the outer wall of the sliding ring is fixedly connected with the push plate, the free end of the micro push rod is connected to the push plate, and the detection structure includes an alarm.

2. The circuit board heat dissipation device according to claim 1, characterized in that: The inner walls on both sides of the installation box are respectively fixedly connected with slide plates, which are arranged to facilitate sliding work of the installation component.

3. The circuit board heat dissipation device according to claim 2, characterized in that: The mounting assembly comprises a placing plate, a mounting seat, a sliding rod, a semicircular plate, a rebounder and a clamping plate, the placing plate is slidably mounted on the sliding plate, the placing plate is provided with a placing groove, the top of the placing plate is fixedly connected to two groups of the mounting seats which are arranged opposite to each other, the sliding rod is slidably mounted on the mounting seat, one end of the sliding rod is fixedly connected to the clamping plate, the other end of the sliding rod is fixedly connected to the semicircular plate, one side of the semicircular plate is fixedly connected to the rebounder, and one end of the rebounder is connected to the mounting seat. Through the coordinated use of the placing plate, the mounting seat, the sliding rod, the semicircular plate, the rebounder and the clamping plate, the circuit board can be installed, making the installation of the circuit board more convenient, and the installation of the circuit board can prevent the displacement of circuit board components caused by vibration or impact, thereby ensuring its stable operation. Furthermore, it is convenient for technicians to disassemble and replace it when necessary, reducing the difficulty of maintenance.

4. The circuit board heat dissipation device according to claim 3, characterized in that: The heat conduction component includes a heat conduction plate, a heat sink, heat dissipation blades and a heat conduction column. The bottom of the slide plate is fixedly connected to the heat conduction plate, the inner bottom of the installation box is fixedly connected to the heat sink, both sides of the heat sink are respectively fixedly connected to heat dissipation blades, and one side of the heat dissipation blade is fixedly connected to the heat conduction column. Through the coordinated use of the heat conduction plate, the heat sink, the heat dissipation blades and the heat conduction column, the heat at the bottom of the circuit board can be heat-conducted. Through good contact with the bottom of the circuit board, the heat generated at the bottom can be quickly absorbed and conducted away to prevent heat accumulation inside the circuit board. By conducting heat to the bottom, the temperature of the bottom of the circuit board is reduced. The heat dissipation device can slow down thermal fatigue caused by temperature cycles, reduce component aging speed, and delay service life.

5. The circuit board heat dissipation device according to claim 1, characterized in that: An alarm is fixedly connected to the inner top of the collection box, and its arrangement facilitates monitoring of the hot air gathered in the collection box.

6. The circuit board heat dissipation device according to claim 1, characterized in that: The cam is fixedly connected to the fixing plate, the sliding ring is provided with an arc groove, the auxiliary column is slidably installed on the arc groove, the top of the sliding ring is hingedly installed with the hinge rod, the top of the fixing plate is hingedly installed with multiple groups of triangular plates distributed in a ring array, the top of the triangular plate is hingedly installed with one end of the hinge rod, the outer wall of the fixing plate is provided with a slide groove, and the push plate is slidably installed on the slide groove. Through the coordinated use of the fixing plate, the micro push rod, the push plate, the sliding ring, the slide groove, the auxiliary column, the arc groove, the hinge rod, the triangular plate and the alarm, the heat in the installation box can be monitored for gathering to prevent the occurrence of short circuit in the circuit board. By monitoring and managing the heat accumulated on the circuit board, short circuit and electrical faults caused by overheating can be effectively reduced to ensure the safe operation of the equipment. The heat in the installation box can be managed and the effective management of heat accumulation can reduce the working temperature of the circuit board and ensure that the electrical components operate in the best state, thereby improving the overall performance.

7. The circuit board heat dissipation device according to claim 1, characterized in that: A circular hole is provided on the top of the collecting box, and the fixing plate is also provided with the circular hole. The triangular plate is located above the circular hole. The arrangement of the circular hole facilitates the conveying of hot air in the installation box.

8. The circuit board heat dissipation device according to claim 1, characterized in that: An exhaust fan is arranged on the top of the installation box, and the exhaust fan is arranged to facilitate exhausting the heat of the installation box.

9. The circuit board heat dissipation device according to claim 8, characterized in that: The top of the fixed plate is fixedly connected with a connecting top box, which is arranged to facilitate the protection of exhaust gas, and the exhaust fan is located inside the collecting box.

10. The circuit board heat dissipation device according to claim 8, characterized in that: The top of the connecting top box is fixedly connected with a connecting pipe, the rear side of the collecting box is fixedly connected with a cooling device, the bottom of the cooling device is fixedly connected with an air outlet pipe, one end of the air outlet pipe is connected to the rear side of the mounting box, and its arrangement facilitates cooling of the circuit board.

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