Power module mounting assembly and charger thereof
By designing power module installation components in the vehicle-mounted charger, using the combination of positioning base and shrapnel, efficient installation of transistors is achieved, solving the problems of complex installation steps and low efficiency in the prior art, and improving assembly efficiency.
Patent Information
- Application Number
- CN202510072767.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-16
- Publication Date
- 2025-05-06
AI Technical Summary
In the prior art, the installation steps of transistors in vehicle-mounted chargers are complicated and cumbersome, making it difficult to achieve automated installation, resulting in low assembly efficiency.
A power module installation component is proposed, including a shrapnel, a positioning base, a circuit board, a power element and a heat dissipation base. By locating base, a distance of the power element is defined, one-time plug-in welding is realized, and abuts with the grooves of the heat dissipation base through the abutment part of the shrapnel, to complete the initial abutment and heat dissipation of the power element.
It greatly shortens the transistor pin adjustment time, reduces the installation steps, realizes automatic installation, and improves the overall assembly efficiency.
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Figure CN119947023A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of vehicle-mounted charging equipment, and in particular to a power module mounting assembly and a charger thereof. Background Art
[0002] Transistors are widely used in various fields because of their multiple functions such as detection, rectification, amplification, switching, voltage regulation, and signal modulation. In the field of power conversion (such as on-board chargers), transistors are core components, and their installation method will affect the overall quality and assembly efficiency of the equipment in which they are installed.
[0003] The on-board charger usually includes a box with a cover. After opening the cover, a heat sink, a mounting structure and an internal structure are provided in the box. The mounting structure is used to fix the circuit board, and the internal structure is used to fix the parts related to the installation of the transistor. In addition, due to the fragility of electronic components, the pins of the transistor are generally not directly plugged into the circuit board. At present, metal shrapnel and plastic shell are usually used when installing transistors. The specific installation steps are as follows: first, the plastic shell is attached to the side of the transistor, and then the metal shrapnel is attached to the plastic shell. Then, a plurality of assemblies composed of transistors, plastic shells and metal shrapnel are placed in the corresponding positions in the box, and then the metal shrapnel is pre-fixed on the internal structure of the box with screws, so that the transistor and the heat dissipation surface of the heat sink are pre-attached, and then the pins of the transistor are adjusted by adding an auxiliary positioning fixture to facilitate the plug-in and fit of the pins of multiple transistors with the circuit board, and then the screws are tightened, and finally the transistor is soldered to the circuit board. During the actual installation process, it was found that one screw was required to fix each transistor, and the assembly needed to be fixed in the box in advance. At the same time, an external auxiliary positioning fixture was required to adjust the transistor pins to facilitate the next step of soldering the transistor on the circuit board. This made the installation steps complicated and cumbersome, and could only be installed manually. It was difficult to achieve automated installation, which reduced the overall assembly efficiency. Summary of the invention
[0004] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a power module mounting assembly and a charger thereof to solve the problem of low transistor assembly efficiency in the prior art.
[0005] In a first aspect, the present application provides a power module mounting assembly, including a spring, a positioning base, a circuit board, a power element and a heat dissipation base.
[0006] The positioning base is made of insulating material, and the power element is positioned and installed on the positioning base and then welded on the circuit board;
[0007] The spring sheet comprises a connecting portion and an abutting portion connected to each other, and the spring sheet is welded on the circuit board;
[0008] The heat dissipation base is provided with a groove for accommodating a power element, a positioning base and a spring piece assembled on a circuit board. One side of the groove is provided to fit the heat dissipation surface of the power element, and the other side of the groove abuts against the abutment portion of the spring piece.
[0009] Based on the power module installation assembly of the above embodiment, multiple power components can be installed through the positioning base, and the distance between the power components can be limited when the installation is completed, so that the pins of the power components can be matched with the circuit board at one time, and then by connecting the spring clip to the circuit board, the spring clip can be pressed while the circuit board is installed, thereby completing the pressing of the spring clip on the positioning base, and then the power component is pressed against the heat dissipation surface of the heat dissipation base.
[0010] In one or more embodiments of the above-mentioned power module mounting assembly, the abutting portion and the power element are separated by a positioning base.
[0011] Furthermore, based on the above-mentioned power module mounting assembly, the power element and the spring are separated by a positioning base to further avoid the risk of insufficient electrical clearance and creepage distance.
[0012] In one or more embodiments of the above-mentioned power module mounting assembly, the connecting portion of the spring sheet includes a substrate and at least one insertion strip provided on the substrate, the insertion strip is inserted into the mounting hole of the circuit board and then welded, and the abutment portion extends from the substrate on the opposite side of the insertion strip.
[0013] In one or more embodiments of the above-mentioned power module mounting assembly, the abutting portion includes at least two curved surface structures, at least one of all the curved surface structures abuts against the positioning base, and at least one abuts against a side surface of the groove.
[0014] In one or more embodiments of the above-mentioned power module mounting assembly, the abutting portion is provided in plurality.
[0015] In one or more embodiments of the above-mentioned power module mounting assembly, the positioning base includes a base and a positioning structure for positioning the power element, and the positioning structure includes a positioning column and a positioning plate.
[0016] In one or more embodiments of the above-mentioned power module mounting assembly, the positioning plate includes a main board for abutting against the abutting portion and a side board extending from the main board and perpendicular to the main board, and the positioning column is perpendicular to the main board.
[0017] In one or more embodiments of the above-mentioned power module mounting assembly, the spring sheet is made of a bending-resistant elastic material.
[0018] In a second aspect, the present application also provides a charger, comprising the power module mounting assembly as described above, and also comprising a housing; the heat dissipation base is integrally formed with the housing or is thermally connected to the housing.
[0019] One or more of the above embodiments of the present application have at least one or more of the following beneficial effects:
[0020] When installing power components such as transistors, firstly, a certain number of power components are positioned and installed on the positioning base so that the distance between each power component is limited, so that the pins of all power components can be inserted into the corresponding welding holes of the circuit board at one time, which greatly shortens the pin adjustment time. Then, the power components are soldered to the circuit board, and the springs are soldered to the circuit board. Then, the power components, the positioning base and the springs installed on the circuit board are installed in the groove of the heat dissipation base, so that all the power components are fitted with one side of the groove to dissipate heat for the power components. At the same time, the abutting part of the springs is abutted with the other side of the groove, so that the springs initially abut the power components against the heat dissipation surface of the groove. Then, the circuit board is fixed in the box, and at the same time, the abutting part is pressed and deformed by the force of fixing the circuit board, so that the abutting part is pressed against the positioning base and one side of the groove respectively, and finally, all the power components are pressed against and fitted to the heat dissipation surface of the heat dissipation base, thereby greatly reducing the installation steps, and there is no need to adjust the position of the power components with the help of external tools, and finally the assembly efficiency is improved.
[0021] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The disclosure of the present application will become more easily understood with reference to the accompanying drawings. It is easy for those skilled in the art to understand that these drawings are only for illustrative purposes and are not intended to limit the scope of protection of the present application. In addition, similar numbers in the drawings are used to represent similar components, among which:
[0023] Figure 1 It is a structural schematic diagram for showing a partial power module installation assembly provided in an embodiment of the present application;
[0024] Figure 2 It is a structural schematic diagram for displaying a spring provided in an embodiment of the present application;
[0025] Figure 3 It is a structural schematic diagram for displaying a positioning base provided in an embodiment of the present application;
[0026] Figure 4It is a schematic diagram provided in an embodiment of the present application for demonstrating the coordination between a circuit board and a power component;
[0027] Figure 5 yes Figure 4 The enlarged view of point A in the middle;
[0028] Figure 6 It is a structural schematic diagram for showing a part of a charger provided in an embodiment of the present application;
[0029] Figure 7 It is a cross-sectional view for showing a part of a charger provided in an embodiment of the present application;
[0030] Figure 8 It is a cross-sectional view provided in an embodiment of the present application for demonstrating the matching relationship of a power module mounting assembly.
[0031] Description of reference numerals:
[0032] 1. Spring piece; 11. Connecting part; 111. Base plate; 112. Insert strip; 12. Abutting part; 121. Curved structure; 122. Intermediate structure; 2. Positioning base; 21. Positioning structure; 211. Main board; 212. Side plate; 213. Limiting groove; 214. Positioning column; 22. Base; 221. Support plate; 222. Partition plate; 223. Reinforcement rib; 3. Circuit board; 31. First welding hole; 32. Second welding hole; 4. Power element; 5. Box; 6. Heat dissipation base; 61. Groove; 611. Guide structure. DETAILED DESCRIPTION
[0033] Some embodiments of the present application are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present application and are not intended to limit the protection scope of the present application.
[0034] As described in the background technology, currently when installing a transistor in the box of a vehicle charger, one screw is required for each transistor to be fixed, and the assembly needs to be fixed in the box in advance. At the same time, an external auxiliary positioning fixture is required to adjust the transistor pins to facilitate the next step of soldering the transistor on the circuit board, resulting in complex and cumbersome installation steps. Manual installation is the only option, and automated installation is difficult to achieve, which reduces the overall assembly efficiency.
[0035] Therefore, the present application creatively proposes a power module mounting assembly and a charger thereof, wherein the power module mounting assembly includes a spring piece, a positioning base, a circuit board, a power element and a heat dissipation base, and the charger includes a power module mounting assembly and a housing; when installing a power element such as a transistor, firstly, a certain number of power elements are positioned and mounted on the positioning base, so that the distance between each power element is limited, so that the pins of all subsequent power elements can be inserted into the corresponding welding holes of the circuit board at one time, greatly shortening the pin adjustment time, and then the power element is soldered to the circuit board, and the spring piece is soldered to the circuit board, and then the power element, the positioning base and the spring piece mounted on the circuit board are assembled and fixed to the circuit board. The sheet is installed in the groove of the heat dissipation base, so that all the power components are fitted with one side of the groove to dissipate the heat of the power components, and at the same time, the abutting part of the spring sheet is abutted with the other side of the groove, so that the spring sheet initially abuts the power component on the heat dissipation surface of the groove, and then the circuit board is fixed in the box, and at the same time, the force of fixing the circuit board is used to apply pressure to the abutting part and deform the abutting part, so that the abutting part is respectively pressed against the positioning base and one side of the groove, and finally all the power components are pressed against the heat dissipation surface of the heat dissipation base, thereby greatly reducing the installation steps and there is no need to adjust the position of the power components with the help of external tools, and finally the assembly efficiency is improved.
[0036] The present application will be described in detail below through specific embodiments.
[0037] Example 1
[0038] Reference Figures 1 to 5 As shown, an embodiment of the present application provides a power module mounting assembly, which includes a spring clip 1, a positioning base 2, a circuit board 3, a power element 4 and a heat dissipation base 6. The positioning base 2 is made of an insulating material. After the power element 4 is positioned and mounted on the positioning base 2, it is welded to the circuit board 3; the spring clip 1 includes a connecting portion 11 and an abutting portion 12 connected to each other, and the spring clip 1 is welded to the circuit board 3; the heat dissipation base 6 is provided with a groove 61 for accommodating the power element 4, the positioning base 2 and the spring clip 1 assembled and mounted on the circuit board 3, one side of the groove 61 is provided to fit the heat dissipation surface of the power element 4, and the other side of the groove 61 abuts against the abutting portion 12 of the spring clip 1.
[0039] In some examples, in order to increase the service life of the spring 1 and ensure the reliability of the installation of the power element 4, the spring 1 is generally made of a bending-resistant elastic material, and the bending-resistant elastic material includes metal or rubber or metal rubber. In this embodiment, the spring 1 is made of metal.
[0040] In some examples, the insulating material includes plastic and rubber. In this embodiment, the positioning base 2 is made of plastic to avoid the risk of insufficient electrical clearance and creepage distance.
[0041] It is understandable that in some examples, in order to improve the integrity of the spring piece 1 during deformation, the connecting portion 11 and the abutting portion 12 are integrally formed. Of course, in other examples with lower requirements, the connecting portion 11 and the abutting portion 12 can also be connected by welding, plugging, etc.
[0042] In this embodiment, the power module mounting assembly is applied to the transistor mounting in the charger; it can be understood that it can also be applied to other devices with similar structures.
[0043] Specifically, when installing the power element 4, firstly, a certain number of power elements 4 are positioned and installed on the positioning base 2, so that the distance between each power element 4 is limited, so that the pins of all the power elements 4 can be inserted into the corresponding welding holes of the circuit board 3 at one time, which greatly shortens the pin adjustment time, and then the power element 4 is welded to the circuit board 3, and the spring piece 1 is welded to the circuit board 3, and then the power element 4, the positioning base 2 and the spring piece 1 assembled on the circuit board 3 are installed in the groove 61 of the heat dissipation base 6, so that all the power elements 4 are in contact with one side of the groove 61, so that the power element 4 can be adjusted. Heat is dissipated, and at the same time, the abutting portion 12 of the spring sheet 1 abuts against the other side of the groove 61, so that the spring sheet 1 initially abuts the power element 4 against the heat dissipation surface of the groove 61, and then the circuit board 3 is fixed in the box body 5, and at the same time, the abutting portion 12 is pressed and deformed by using the force of fixing the circuit board 3, so that the abutting portion 12 is respectively pressed against the positioning base and one side of the groove 61, and finally all the power elements 4 are pressed against the heat dissipation surface of the heat dissipation base 6, thereby greatly reducing the installation steps, and there is no need to adjust the position of the power element 4 with the help of external tools, and finally the assembly efficiency is improved.
[0044] It should be noted that after the connecting portion 11 is connected to the circuit board 3, the initial distance between the abutting portion 12 and the positioning base 2 can be adjusted as needed, and the initial distance can be gradually increased from zero. Generally, in order to ensure the pressing effect, the abutting portion 12 and the positioning base 2 are usually set in close proximity.
[0045] In addition, after deformation, the abutting portion 12 is pressed against the bottom surface of the groove 61 of the heat dissipation base 6 in order to increase the force points of the abutting portion 12 so that the abutting portion 12 can be fully deformed, thereby allowing the power element 4 to be fully pressed against the heat dissipation base 6.
[0046] In some examples, the connection method between the connection part 11 and the circuit board 3 includes welding, threaded connection, clamping, plugging, etc. In this embodiment, in order to improve the overall connection strength between the spring piece 1 and the circuit board 3, so that the spring piece 1 can be fully pressed while fixing the circuit board 3, the spring piece 1 is plugged with the circuit board 3 through the connection part 11 and then welded. In addition, because welding is mostly used when fixing most components such as the power element 4, the connection part 11 can be welded to the circuit board 3 when welding the power element 4, thereby further improving the connection efficiency between the connection part 11 and the circuit board 3.
[0047] In some examples, the abutting portion 12 is separated from the power element 4 by the positioning base 2 to fully avoid the risk of insufficient electrical clearance and creepage distance and ensure the working stability of the power element 4 .
[0048] Further, in some examples, reference Figure 2 As shown, the connection portion 11 of the spring piece 1 includes a base plate 111 and at least one insertion strip 112 disposed on the base plate 111. The insertion strip 112 is inserted into the mounting hole of the circuit board 3 and then soldered. The abutment portion 12 extends from the base plate 111 on the opposite side of the insertion strip 112. By providing the insertion strip 112, the overlap between the connection portion 11 and the circuit board 3 can be reduced, thereby shortening the soldering time and soldering materials.
[0049] In some examples, reference Figure 2 and Figure 4 As shown, the connection portion 11 includes at least two inserting strips 112 spaced apart along the length direction of the substrate 111 , so that the connection strength between the connection portion 11 and the circuit board 3 can be improved while taking into account the welding time.
[0050] In some examples, reference Figure 2 As shown, the abutting portion 12 includes at least two curved surface structures 121, at least one of which abuts against the positioning base 2, and at least one abuts against one side of the groove 61. By setting the curved surface structure 121, when the abutting portion 12 is deformed, the deformation force can be more fully applied to the positioning base 2 and one side of the groove 61, so as to effectively press the power element 4 against the heat dissipation surface of the heat dissipation base 6. It can be understood that the abutting portion 12 can also include three or four, or more than four curved surface structures 121, but generally speaking, the more curved surface structures 121 there are, the more complicated its manufacturing will be, and there will also be a problem that it is more difficult for the abutting portion 12 to stably and effectively press the positioning base 2.
[0051] In addition, the surface of the curved surface structure 121 may be regular or irregular wavy, or any other regular or irregular shape with undulating changes. In some examples, the abutting portion 12 includes an intermediate structure 122 and two curved surface structures 121, and the two curved surface structures 121 are connected by the intermediate structure 122. In this embodiment, the two curved surface structures 121 are both V-shaped structures, and the protruding parts of the V-shaped structures are respectively configured to abut against the positioning base 2 and one side of the groove 61;
[0052] The intermediate structure 122 is in a straight line structure to facilitate the transmission of deformation force.
[0053] In some examples, the abutting portion 12 is made of a complete plate-like structure by bending sheet metal, thereby ensuring the deformation effect of the abutting portion 12 to fully abut the power component 4 on the heat dissipation base 6. Of course, the intermediate structure 122 and the curved surface structure 121 in the abutting portion 12 can also be made by other methods such as welding.
[0054] In some examples, a plurality of abutting portions 12 are provided. In this embodiment, all abutting portions 12 are connected to the connecting portion 11 and are spaced apart along a preset direction to abut against the power components 4 in a one-to-one correspondence.
[0055] In this embodiment, the preset direction is parallel to the length direction of the substrate 111 .
[0056] It can be understood that when one abutment portion 12 is used to press all the power elements 4, the portion of the abutment portion 12 in contact with the positioning base 2 must be larger than the sum of the contact areas between the positioning base 2 and the power elements 4; when there are two, three or more abutment portions 12, the area of one abutment portion 12 can be less than or equal to the contact area between the positioning base 2 and one power element 4, thereby saving material of the abutment portion 12, and furthermore, a smaller force can be used to fully deform the abutment portion 12 so as to fully press the power element 4 against the heat dissipation surface of the heat dissipation base 6.
[0057] In some examples, reference Figure 3 As shown, the positioning base 2 includes a base 22 and a positioning structure 21 for positioning the power element 4 , and the positioning structure 21 includes a positioning column 214 and a positioning plate.
[0058] In this embodiment, the positioning structures 21 are spaced apart along the length direction of the base 22. By setting the base 22, the positioning base 2 as a whole can be stably placed in the groove 61 to ensure the stable deformation of the abutting portion 12; wherein the length direction of the base 22 is parallel to the length direction of the substrate 111, so that after the power components 4 are installed on the positioning structures 21, the abutting portion 12 can press all the power components 4 through the positioning base 2.
[0059] Furthermore, the positioning structures 21 are evenly spaced along the length of the base 22, so that the power components 4 can be evenly spaced along the length of the base 22, thereby facilitating the corresponding insertion of the pins of the power components 4 into the circuit board 3, greatly shortening the pin adjustment time of the power components 4.
[0060] In some examples, the positioning plate includes a main plate 211 for abutting against the abutting portion 12 and a side plate 212 extending from the main plate 211 and perpendicular to the main plate 211 , and the positioning column 214 is perpendicular to the main plate 211 .
[0061] A limiting groove 213 is defined between the main board 211 and the corresponding side board 212 , and the power element 4 is located in the limiting groove 213 after being installed on the positioning structure 21 .
[0062] In this embodiment, in order to ensure stable installation of the power element 4 , the matching relationship between the power element 4 and the limiting groove 213 can be set to be an interference fit.
[0063] In addition, the positioning column 214 can also be used to quickly position the power element 4, thereby reducing the time for adjusting the position of the power element 4 and improving installation efficiency. In this embodiment, the cross section of the positioning column 214 is cross-shaped to facilitate the installation of transistors.
[0064] In some examples, the base 22 includes a support plate 221 and a partition plate 222 disposed on the top of the support plate 221. In this embodiment, the main board 211 is disposed on the top of the partition plate 222, and the main board 211 and the partition plate 222 are integrally formed. The power element 4 can be further isolated by the cooperation between the partition plate 222 and the main board 211 to avoid the risk of insufficient electrical clearance and creepage distance.
[0065] In this embodiment, in order to improve the stability of the positioning base 2, at least two reinforcing ribs 223 are provided at intervals along the length direction of the support plate 221, and the reinforcing ribs 223 are respectively connected to the bottom plate and the support plate 221.
[0066] Example 2
[0067] Corresponding to the above embodiment 1, refer to Figures 6 to 8 As shown, an embodiment of the present application further provides a charger, which includes the power module mounting assembly and a box body 5 as described above; the heat dissipation base 6 is integrally formed with the box body 5 or thermally connected to the box body 5.
[0068] In some examples, a mounting hole, a first welding hole 31 and at least six second welding holes 32 are provided on the circuit board 3, the mounting hole is configured to be penetrated by a threaded member to be threadedly connected to the mounting structure in the box 5, the first welding hole 31 is configured to be plug-fitted with the connecting portion 11, and the second welding hole 32 is configured to be plug-fitted with the pin of the power element 4.
[0069] It should be noted that generally, a power element 4 has at least three pins, so at least three second welding holes 32 need to be provided on the circuit board 3. In this embodiment, a power element 4 has four pins, and four second welding holes 32 are provided on the circuit board 3 accordingly.
[0070] It is understandable that, in order to facilitate welding, holes are usually opened along a certain linear direction. In this embodiment, the first welding holes 31 and the second welding holes 32 are distributed along a direction parallel to the length direction of the circuit board 3. The length direction of the circuit board 3 is parallel to the length direction of the heat dissipation base 6.
[0071] In addition, in order to facilitate adjustment of the position of the circuit board 3, the mounting hole is generally a through hole without thread.
[0072] In this embodiment, the mounting structure includes a mounting post having an internal thread.
[0073] In some examples, the heat dissipation base 6 and the housing 5 are integrally formed to enhance the connection stability between the heat dissipation base 6 and the housing 5 and facilitate heat dissipation.
[0074] In some examples, a guide structure 611 is provided on one side of the groove 61 , and the guide structure 611 is configured to guide the abutment portion 12 into the groove 61 , thereby shortening the time for the power element 4 , the positioning base 2 and the spring 1 to enter the groove 61 .
[0075] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.
[0076] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0077] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.
Claims
1. A power module mounting assembly, characterized in that: It comprises a spring (1), a positioning base (2), a circuit board (3), a power element (4) and a heat dissipation base (6), The positioning base (2) is made of insulating material, and the power element (4) is positioned and mounted on the positioning base (2) and then welded to the circuit board (3); The spring sheet (1) comprises a connecting portion (11) and an abutting portion (12) which are connected to each other, and the spring sheet (1) is welded on a circuit board (3); The heat dissipation base (6) is provided with a groove (61) for accommodating a power element (4), a positioning base (2) and a spring (1) assembled and mounted on a circuit board (3); one side of the groove (61) is arranged to fit a heat dissipation surface of the power element (4), and the other side of the groove (61) abuts against an abutment portion (12) of the spring (1).
2. The power module mounting assembly according to claim 1, characterized in that: The abutting portion (12) and the power element (4) are separated by a positioning base (2).
3. The power module mounting assembly according to claim 2, characterized in that: The connecting portion (11) of the spring sheet (1) comprises a base plate (111) and at least one insertion strip (112) provided on the base plate (111); the insertion strip (112) is inserted into a mounting hole of a circuit board (3) and then welded; and the abutment portion (12) extends from the base plate (111) on the opposite side of the insertion strip (112).
4. The power module mounting assembly according to claim 1, characterized in that: The abutment portion (12) comprises at least two curved surface structures (121), at least one of all the curved surface structures (121) abuts against the positioning base (2), and at least one abuts against a side surface of the groove (61).
5. The power module mounting assembly according to claim 4, characterized in that: The abutting portion (12) is provided in plurality.
6. The power module mounting assembly according to claim 1, characterized in that: The positioning base (2) comprises a base (22) and a positioning structure (21) for positioning a power element (4); the positioning structure (21) comprises a positioning column (214) and a positioning plate.
7. The power module mounting assembly according to claim 6, characterized in that: The positioning plate comprises a main plate (211) for abutting against the abutting portion (12) and a side plate (212) extending from the main plate (211) and perpendicular to the main plate (211), and the positioning column (214) is perpendicular to the main plate (211).
8. The power module mounting assembly according to any one of claims 1 to 7, characterized in that: The spring sheet (1) is made of a bending-resistant elastic material.
9. A charger, comprising the power module mounting assembly according to any one of claims 1 to 8, characterized in that: The charger also includes a box body (5); the heat dissipation base (6) is integrally formed with the box body (5) or is heat-conductively connected to the box body (5).