High-voltage solid-state soft starting device based on modular heat dissipation structure

Abstract

The invention discloses a high-voltage solid-state soft starting device based on a modular heat dissipation structure, and relates to the technical field of high-voltage solid-state soft starting devices, the high-voltage solid-state soft starting device comprises a case and a heat dissipation assembly, mounting grooves are symmetrically formed in the two sides of the case, and the heat dissipation assembly is arranged in the mounting grooves; and the heat dissipation assembly comprises a base, a circulation hole, a heat dissipation sheet, a cavity, a heat dissipation fan, a limiting block, a reset spring, a pressing plate and a limiting groove, the base is arranged in the mounting groove, and the circulation hole is formed in the surface of the base. When the device is used, the heat dissipation structure can be disassembled and assembled according to needs through the modularized heat dissipation structure, the heat dissipation efficiency of the device is guaranteed, unstable operation caused by too high temperature in the device is avoided, circulation of cooling liquid at the installation position is not affected when the heat dissipation structure is not installed, and the cooling liquid is not affected when the heat dissipation structure is installed. The heat dissipation structure can be stably fixed, and the installation position can be shielded when the heat dissipation structure is not installed, so that the situation that dust enters and is difficult to clean is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of high-voltage solid-state soft-starting devices, in particular to a high-voltage solid-state soft-starting device based on a modular heat dissipation structure. Background Art

[0002] High-voltage solid-state soft start devices use technical means such as voltage reduction or frequency conversion to achieve smooth starting of motors and mechanical loads and reduce starting current. Conventional high-voltage solid-state soft start devices use semi-controlled devices, thyristors, and AC-AC voltage regulation. Their output can adjust the voltage but not the frequency. When the motor starts, the starting output torque is small and the starting current is large, which is suitable for medium and light loads.

[0003] When the existing high-voltage solid-state soft start device is in use, the heat dissipation structure installed thereon is not easy to disassemble and install, and when in use, the operating power of the heat dissipation structure can only be adjusted according to the temperature when the device is running. After the operating power of the heat dissipation structure reaches the maximum, the heat dissipation efficiency cannot be improved.

[0004] Therefore, in view of this, the existing structure and deficiencies are studied and improved, and a high-voltage solid-state soft starting device based on a modular heat dissipation structure is proposed. Summary of the invention

[0005] The object of the present invention is to provide a high voltage solid-state soft starting device based on a modular heat dissipation structure to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a high-voltage solid-state soft-start device based on a modular heat dissipation structure, comprising a chassis and a heat dissipation component, the chassis is symmetrically provided with mounting grooves on both sides, the heat dissipation component is arranged in the mounting grooves, the heat dissipation component comprises a base, a circulation hole, a heat sink, a cavity, a heat dissipation fan, a limit block, a reset spring, a pressure plate and a limit groove, a base is arranged in the mounting groove, and a circulation hole is arranged on the surface of the base, a heat sink is connected to the surface of the base, and a cavity is arranged between the heat sinks, a heat dissipation fan is connected in the cavity, a limit block is symmetrically arranged on one side of the heat sink, and a reset spring is connected to the inner side of the limit block, the other end of the reset spring is connected to the pressure plate, and the limit grooves are symmetrically arranged on both sides of the pressure plate.

[0007] Furthermore, the heat sinks are evenly spaced on the base, and the width of the heat sinks in the middle of the base is greater than the heat sinks on both sides of the base. The pressure plate is elastically connected to the limit block through a return spring, and the pressure plate is slidably connected to the limit block through a limit groove.

[0008] Furthermore, a transfer chamber is provided on one side of the chassis, and cooling pipes are provided on both sides of the transfer chamber, a cabinet door is provided on the front side of the chassis, the cooling pipes are equidistantly distributed about the transfer chamber, and the flow holes are connected to the cooling pipes.

[0009] Furthermore, a liquid storage chamber is provided on the other side of the chassis, and a circulation pump is connected to one side of the liquid storage chamber. A diverter groove is provided on the rear side of the chassis, and a heat absorption pipe is provided on one side of the diverter groove. The heat absorption pipe is connected to the transfer chamber, and the circulation pump is connected to the diverter groove through a pipeline. The heat absorption pipes are equidistantly distributed about the diverter groove.

[0010] Furthermore, a connecting component is provided in the installation groove, and the connecting component includes a sleeve, a connecting spring, a chassis and a heat absorption block. The sleeve is connected in the installation groove, and the connecting spring is connected to the outside of the sleeve. One side of the connecting spring is connected to the chassis, and the chassis is connected to the heat absorption block in the middle of one side of the connecting spring.

[0011] Furthermore, the connecting component also includes a through groove, a slide groove, a valve groove and a sealing groove. A through groove is provided in the middle of the chassis, and slide grooves are symmetrically provided at the four corners of the chassis. A valve groove is provided in the middle of the through groove, and sealing grooves are provided on both sides of the through groove.

[0012] Furthermore, the connecting assembly also includes a movable spring, a bottom plate, a sealing plate and a valve plate. The movable spring is connected to the inner side of the sleeve, and the other end of the movable spring is connected to the bottom plate. The sealing plates are symmetrically connected to both sides of the bottom plate, and the valve plate is connected to the middle of the bottom plate.

[0013] Furthermore, the chassis is elastically connected to the mounting groove through a connecting spring, and the chassis is slidably connected to the chassis through the mounting groove, the through groove is connected to the cooling pipe, and the valve plate and the sealing plate are respectively connected to the through groove through the valve groove and the sealing groove, the bottom plate is elastically connected to the chassis through a movable spring, and the chassis is slidably connected to the sleeve through the sliding groove.

[0014] Furthermore, fixing grooves are symmetrically provided on both sides of the installation groove, and fixing springs are symmetrically connected in the fixing grooves. The other end of the fixing spring is connected to a fixing plate, and a slope is provided on the surface of the fixing plate.

[0015] Furthermore, the fixing plates are tightly fitted together, and the fixing plates are elastically connected to the fixing grooves via fixing springs, the fixing plates are slidably connected to the mounting grooves via the fixing grooves, and the fixing plates are snap-fitted and linked to the base via heat sinks.

[0016] The present invention provides a high-voltage solid-state soft-start device based on a modular heat dissipation structure, which has the following beneficial effects: when in use, the heat dissipation structure can be disassembled and assembled as needed through the modular heat dissipation structure, so as to ensure the heat dissipation efficiency of the device and avoid unstable operation due to excessive temperature in the device; and when the heat dissipation structure is not installed, the circulation of coolant at the installation location will not be affected; when the heat dissipation structure is installed, the heat dissipation structure can be firmly fixed; and when it is not installed, the installation location can also be shielded to prevent dust from entering and being difficult to clean.

[0017] 1. When the present invention is in use, the heat dissipation component can be conveniently installed as needed. During installation, the base can be automatically fixed by simply inserting it into the installation groove. After the fixing is completed, the circulation hole can be connected to the cooling pipe to keep the coolant flowing smoothly. During the operation of the device, the circulation pump draws the coolant in the liquid storage chamber and sends it into the diversion groove. The coolant can flow from the heat absorption pipe into the transfer chamber, and in the process of flowing, the heat transferred to the rear side of the chassis is absorbed by the heat absorption pipe. After the coolant enters the transfer chamber, it can flow back from the cooling pipe to the liquid storage chamber. In the reflux process, the heat sink can pass through the base to cool the coolant flowing through the circulation hole. The heat in the liquid is absorbed, and the operation of the cooling fan can blow away the heat, accelerate the heat dissipation of the heat sink, and ensure the heat absorption efficiency of the heat sink. When the temperature in the chassis is too high, in addition to increasing the operating power of the cooling fan, you can also continue to install new cooling components in other vacant installation slots to improve the overall cooling efficiency and avoid the cooling fan failing to dissipate heat in time after the power reaches the highest, which causes the temperature in the chassis to be too high and cause the device to malfunction. In summary, when in use, through the modular cooling structure, the cooling structure can be disassembled and assembled as needed to ensure the cooling efficiency of the device and avoid unstable operation due to excessive temperature in the device.

[0018] 2. In the present invention, when the heat dissipation component is not installed, the coolant can flow in the cooling pipe through the through groove. When the heat dissipation component is installed, as the base slides in, the base first presses the bottom plate to slide in the installation groove and compresses the moving spring, so that the bottom plate and the chassis are tightly fitted. At this time, the valve plate and the sealing plate are respectively engaged with the through groove through the valve groove and the sealing groove to close the through groove to prevent the coolant from leaking when the chassis moves. After the bottom plate and the chassis are fitted, the base can press the chassis to slide in the installation groove through the bottom plate and compress the connecting spring. The sleeve can limit the chassis through the sliding groove to prevent the chassis from deviating when moving. After the heat dissipation component is installed, the chassis stops moving, and the heat absorbing block is tightly attached to On the inner wall of the installation groove, the heat in the chassis is absorbed through the side wall of the chassis and transferred to the base through the chassis and the bottom plate, and finally dissipated to the outside, further improving the overall heat dissipation efficiency. When the heat dissipation component is removed, the chassis and the bottom plate can also rebound to their original positions under the action of the connecting spring and the reset spring, thereby ensuring the normal circulation of the coolant and avoiding coolant leakage. The sleeve can limit the chassis to prevent the chassis from rebounding too much and causing the through groove to be unable to accurately dock with the cooling pipe. In summary, when the heat dissipation component is not installed, it will not affect the circulation of the coolant at the installation site. When the heat dissipation component is installed and after the installation is completed, it can not only avoid the leakage of the coolant, but also accelerate the dissipation of heat in the chassis.

[0019] 3. In the present invention, when the heat dissipation component is not installed, the fixing plate can seal the installation groove to prevent dust from entering the installation groove and being difficult to clean. When the heat dissipation component is installed, as the base is pushed in, the base can be pressed into the fixing groove through the inclined surface of the fixing plate and the fixing spring is compressed. When the flow hole is connected with the cooling pipe, the fixing plate can rebound under the action of the fixing spring, and the rebound force of the connecting spring and the movable spring is transmitted to the base through the chassis and the bottom plate. With the restriction of the base by the fixing plate through the heat sink, the base can be firmly fixed in the installation groove, and the heat on the heat sinks on both sides of the base can be transmitted to the pressing plate through the fixing plate, and dissipated to the outside with the operation of the heat dissipation fan. When the heat dissipation component is disassembled, it only needs to press the pressing plate to apply force to the fixing plate through the pressing plate, so as to press it into the fixing groove. In addition to the restriction of the fixed plate on the base, the base can be popped out of the installation slot under the action of the rebound force of the connecting spring and the movable spring, thereby completing the disassembly of the heat dissipation component. After the base is removed from the installation slot, the fixed plate rebounds and resets under the action of the fixed spring, and the installation slot is closed again, while the bottom plate is blocked to prevent the bottom plate from rebounding too much and causing the coolant to flow out of the through slot from the sealing slot and the valve slot to cause leakage. After the base is disassembled, the pressure plate can rebound to its original position under the action of the reset spring to avoid obstruction of the next installation, and the limit block can limit the pressure plate through the limit slot to prevent the pressure plate from deflecting when moving. In summary, when installing the heat dissipation component, the heat dissipation component can be automatically fixed firmly, and when not installed, the installation slot can also be covered to prevent dust from entering the installation slot and making it difficult to clean. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall cross-sectional three-dimensional structure of a high-voltage solid-state soft-start device based on a modular heat dissipation structure of the present invention;

[0021] Figure 2 It is a schematic diagram of a cross-sectional three-dimensional exploded structure of a heat dissipation component of a high-voltage solid-state soft starter device based on a modular heat dissipation structure of the present invention;

[0022] Figure 3 It is a schematic diagram of the overall three-dimensional structure of a high-voltage solid-state soft-start device based on a modular heat dissipation structure of the present invention;

[0023] Figure 4 It is a schematic diagram of a three-dimensional exploded structure of a chassis of a high-voltage solid-state soft-start device based on a modular heat dissipation structure of the present invention;

[0024] Figure 5 It is a schematic diagram of a sectional three-dimensional exploded structure of a connection assembly of a high-voltage solid-state soft starter device based on a modular heat dissipation structure of the present invention;

[0025] Figure 6The present invention is a schematic diagram of a cross-sectional three-dimensional structure of a connection component after the heat dissipation component of a high-voltage solid-state soft start device based on a modular heat dissipation structure is installed.

[0026] In the figure: 1. chassis; 2. mounting slot; 3. heat dissipation component; 301. base; 302. circulation hole; 303. heat sink; 304. cavity; 305. cooling fan; 306. limit block; 307. reset spring; 308. pressure plate; 309. limit slot; 4. transfer chamber; 5. cooling pipe; 6. cabinet door; 7. liquid storage chamber; 8. circulation pump; 9. diversion slot; 10. heat absorption pipe; 11. connecting component; 1101. sleeve; 1102. connecting spring; 1103. chassis; 1104. heat absorption block; 1105. through slot; 1106. slide slot; 1107. valve slot; 1108. sealing slot; 1109. moving spring; 1110. bottom plate; 1111. sealing plate; 1112. valve plate; 12. fixing slot; 13. fixing spring; 14. fixing plate. DETAILED DESCRIPTION

[0027] See also Figures 1 to 6 The present invention provides a technical solution: a high-voltage solid-state soft start device based on a modular heat dissipation structure, comprising a chassis 1 and a heat dissipation component 3, the chassis 1 is symmetrically provided with mounting grooves 2 on both sides, the heat dissipation component 3 is arranged in the mounting groove 2, the heat dissipation component 3 comprises a base 301, a circulation hole 302, a heat sink 303, a cavity 304, a heat dissipation fan 305, a limit block 306, a reset spring 307, a pressure plate 308 and a limit groove 309, a base 301 is arranged in the mounting groove 2, and the circulation hole 302 is arranged on the surface of the base 301, the heat sink 303 is connected to the surface of the base 301, and the cavity 304 is arranged between the heat sinks 303, the heat dissipation fan 305 is connected in the cavity 304, a limit block 306 is symmetrically arranged on one side of the heat sink 303, and a reset spring 307 is connected to the inner side of the limit block 306, the other end of the reset spring 307 is connected to the pressure plate 308, and the limit grooves 309 are symmetrically arranged on both sides of the pressure plate 308.

[0028] See also Figures 1 to 4, the heat sinks 303 are equidistantly distributed on the base 301, and the width of the heat sink 303 in the middle of the base 301 is greater than the heat sink 303 on both sides of the base 301, the pressure plate 308 is elastically connected to the limit block 306 through the return spring 307, and the pressure plate 308 is slidably connected to the limit block 306 through the limit groove 309, a transfer chamber 4 is provided on one side of the chassis 1, and cooling pipes 5 are provided on both sides of the transfer chamber 4, a cabinet door 6 is provided on the front side of the chassis 1, the cooling pipes 5 are equidistantly distributed about the transfer chamber 4, and the flow hole 302 is connected to the cooling pipe 5, a liquid storage chamber 7 is provided on the other side of the chassis 1, and a circulation pump 8 is connected to one side of the liquid storage chamber 7, and a bypass is provided on the rear side of the chassis 1 The shunt slot 9 is provided with a heat absorbing pipe 10 on one side thereof, the heat absorbing pipe 10 is communicated with the transfer chamber 4, the circulating pump 8 is communicated with the shunt slot 9 through a pipeline, the heat absorbing pipe 10 is equidistantly distributed about the shunt slot 9, the fixing slots 12 are symmetrically provided on both sides of the mounting slot 2, and the fixing slots 12 are symmetrically connected with fixing springs 13, the other end of the fixing spring 13 is connected with a fixing plate 14, and the surface of the fixing plate 14 is provided with an inclined surface, the fixing plates 14 are tightly fitted, and the fixing plates 14 are elastically connected with the fixing slots 12 through the fixing springs 13, the fixing plates 14 are slidably connected with the mounting slot 2 through the fixing slots 12, and the fixing plates 14 are clamped and linked with the base 301 through the heat sink 303;

[0029] The specific operation is as follows. When in use, the heat dissipation component 3 can be conveniently installed as needed. During installation, the base 301 only needs to be inserted into the installation groove 2 to automatically fix it. After the fixing is completed, the flow hole 302 can be connected to the cooling pipe 5 to keep the flow of the coolant unobstructed. During the operation of the device, the circulation pump 8 draws the coolant in the liquid storage chamber 7 and sends it into the diverter groove 9. The coolant can flow from the heat absorption pipe 10 into the transfer chamber 4, and in the process of flowing, the heat transferred to the rear side of the chassis 1 is absorbed by the heat absorption pipe 10. After the coolant enters the transfer chamber 4, it can flow back from the cooling pipe 5 to the liquid storage chamber 7. During the reflux process, the heat sink 303 can absorb the heat in the coolant flowing through the flow hole 302 through the base 301. Absorb, and at the same time, the operation of the heat dissipation fan 305 can blow away the heat, accelerate the heat dissipation of the heat sink 303, and ensure the heat absorption efficiency of the heat sink 303. When the temperature in the chassis 1 is too high, in addition to increasing the operating power of the heat dissipation fan 305, you can also continue to install new heat dissipation components 3 in other vacant installation slots 2, so as to improve the overall heat dissipation efficiency, and avoid the heat dissipation fan 305 still unable to dissipate heat in time after the power reaches the highest, thereby causing the temperature in the chassis 1 to be too high and causing the device to malfunction. In summary, when in use, through the modular heat dissipation structure, the heat dissipation structure can be disassembled and assembled as needed to ensure the heat dissipation efficiency of the device and avoid unstable operation due to excessive temperature in the device. When the heat dissipation component 3 is not installed, the fixing plate 14 can be installed in the installation slot 2 The installation slot 2 is sealed to prevent dust from entering and being difficult to clean. When installing the heat dissipation component 3, as the base 301 is pushed in, the base 301 can be pressed into the fixing slot 12 through the inclined surface of the fixing plate 14 and the fixing spring 13 is compressed. When the flow hole 302 is connected with the cooling pipe 5, the fixing plate 14 can rebound under the action of the fixing spring 13, and the rebound force of the connecting spring 1102 and the movable spring 1109 is transmitted to the base 301 through the chassis 1103 and the bottom plate 1110. With the restriction of the base 301 by the fixing plate 14 through the heat sink 303, the base 301 can be firmly fixed in the installation slot 2, and the heat on the heat sinks 303 on both sides of the base 301 can be transmitted to the pressing plate 308 through the fixing plate 14, and along with the heat dissipation fan 30 5 is dissipated to the outside. When disassembling the heat dissipation component 3, it is only necessary to press the pressure plate 308, and the pressure plate 308 can be used to apply force to the fixing plate 14, so as to press it into the fixing groove 12, and release the restriction of the fixing plate 14 on the base 301. The base 301 can be ejected from the mounting groove 2 under the action of the rebound force of the connecting spring 1102 and the movable spring 1109, thereby completing the disassembly of the heat dissipation component 3. After the base 301 is removed from the mounting groove 2, the fixing plate 14 rebounds and resets under the action of the fixing spring 13, and the mounting groove 2 is closed again, and the bottom plate 1110 is blocked at the same time, so as to prevent the bottom plate 1110 from rebounding too much, causing the coolant to flow out of the through groove 1105 from the sealing groove 1108 and the valve groove 1107 to cause leakage. After the base 301 is disassembled,The pressing plate 308 can rebound to its original position under the action of the return spring 307 to avoid obstructing the next installation, and the limiting block 306 can limit the pressing plate 308 through the limiting groove 309 to prevent the pressing plate 308 from deflecting when moving. In summary, when the heat dissipation component 3 is installed, the heat dissipation component 3 can be automatically fixed firmly, and when it is not installed, the installation groove 2 can also be shielded to prevent dust from entering the installation groove 2 and making it difficult to clean.

[0030] See also Figure 1 and Figure 5 to Figure 6 , a connecting component 11 is arranged in the installation groove 2, and the connecting component 11 includes a sleeve 1101, a connecting spring 1102, a chassis 1103 and a heat absorbing block 1104. The sleeve 1101 is connected in the installation groove 2, and the outer side of the sleeve 1101 is connected to the connecting spring 1102, one side of the connecting spring 1102 is connected to the chassis 1103, and the chassis 1103 is connected to the heat absorbing block 1104 in the middle of one side of the connecting spring 1102. The connecting component 11 also includes a through groove 1105, a slide groove 1106, a valve groove 1107 and a sealing groove 1108. A through groove 1105 is arranged in the middle of the chassis 1103, and slide grooves 1106 are symmetrically opened at the four corners of the chassis 1103, a valve groove 1107 is opened in the middle of the through groove 1105, and sealing grooves 1108 are opened on both sides of the through groove 1105. The connecting component 11 also includes a movable spring 1 109, bottom plate 1110, sealing plate 1111 and valve plate 1112, a movable spring 1109 is connected to the inner side of sleeve 1101, and the other end of movable spring 1109 is connected to bottom plate 1110, sealing plates 1111 are symmetrically connected to both sides of bottom plate 1110, and valve plate 1112 is connected to the middle of bottom plate 1110, chassis 1103 is elastically connected to mounting groove 2 through connecting spring 1102, and chassis 1103 is slidably connected to chassis 1 through mounting groove 2, through groove 1105 is communicated with cooling pipe 5, and valve plate 1112 and sealing plate 1111 are respectively connected to through groove 1105 through valve groove 1107 and sealing groove 1108, bottom plate 1110 is elastically connected to chassis 1103 through movable spring 1109, and chassis 1103 is slidably connected to sleeve 1101 through sliding groove 1106;

[0031] The specific operation is as follows: when the heat dissipation component 3 is not installed, the coolant can flow in the cooling pipe 5 through the through groove 1105. When the heat dissipation component 3 is installed, as the base 301 slides in, the base 301 first presses the bottom plate 1110 to slide in the installation groove 2 and compresses the moving spring 1109, so that the bottom plate 1110 and the chassis 1103 are closely fitted. At this time, the valve plate 1112 and the sealing plate 1111 are respectively connected to the through groove 1107 and the sealing groove 1108. The slot 1105 is engaged to close the through slot 1105 to prevent the coolant from leaking when the chassis 1103 moves. After the bottom plate 1110 and the chassis 1103 are attached, the base 301 can press the chassis 1103 to slide in the installation slot 2 through the bottom plate 1110 and compress the connecting spring 1102. The sleeve 1101 can restrict the chassis 1103 through the slide slot 1106 to prevent the chassis 1103 from deviating when moving. After the installation is completed, the chassis 1103 stops moving, and the heat absorbing block 1104 is tightly attached to the inner wall of the installation groove 2, absorbing the heat in the chassis 1 through the side wall of the chassis 1 and transferring it to the base 301 through the chassis 1103 and the bottom plate 1110, and finally dissipating it to the outside, further improving the overall heat dissipation efficiency. When the heat dissipation component 3 is removed, the chassis 1103 and the bottom plate 1110 can also rebound to their original positions under the action of the connecting spring 1102 and the reset spring 307, thereby ensuring the normal circulation of the coolant and avoiding leakage of the coolant. The sleeve 1101 can limit the chassis 1103 to avoid excessive rebound of the chassis 1103, which will cause the through groove 1105 to be unable to accurately dock with the cooling pipe 5. In summary, when the heat dissipation component 3 is not installed, it will not affect the circulation of the coolant at the installation location. When the heat dissipation component 3 is installed and after the installation is completed, not only can the leakage of the coolant be avoided, but also the heat dissipation in the chassis 1 can be accelerated.

[0032] In summary, in this high-voltage solid-state soft-start device based on a modular heat dissipation structure, when the heat dissipation component 3 is not installed, the fixing plate 14 can seal the installation slot 2 to prevent dust from entering the installation slot 2 and being difficult to clean. The coolant can flow through the through slot 1105 in the cooling pipe 5. During the operation of the device, the circulating pump 8 draws the coolant in the liquid storage chamber 7 and sends it into the diversion slot 9. The coolant can then flow from the heat absorption pipe 10 into the transfer chamber 4, and during the flow process, the heat transferred to the rear side of the chassis 1 is absorbed through the heat absorption pipe 10. After the coolant enters the transfer chamber 4, it can flow back from the cooling pipe 5 to the liquid storage chamber 7. During the reflux process, the heat sink 303 can absorb the heat in the coolant flowing through the flow hole 302 through the base 301. At the same time, the operation of the cooling fan 305 can blow away the heat, accelerate the heat dissipation of the heat sink 303, and ensure the heat absorption efficiency of the heat sink 303. When the temperature in the chassis 1 is too high, in addition to increasing the operating power of the cooling fan 305, new cooling components 3 can also be installed in other vacant installation slots 2 to improve the overall heat dissipation efficiency and avoid the heat dissipation fan 305 still unable to dissipate heat in time after the power reaches the highest, thereby causing the temperature in the chassis 1 to be too high and causing the device to malfunction. During installation, you only need to insert the base 301 into the installation slot 2 to automatically fix it. After the fixation is completed, the flow hole 302 can be connected to the cooling pipe 5 to keep the coolant flowing smoothly. During the installation process, as the base 301 is pushed in, the base 301 can be pressed into the fixing groove 12 through the inclined surface of the fixing plate 14 and the fixing spring 13 is compressed. At the same time, the base 301 first presses the bottom plate 1110 to slide in the installation groove 2 and compresses the moving spring 1109, so that the bottom plate 1110 and the chassis 1103 are closely fitted. At this time, the valve plate 1112 and the sealing plate 1111 are respectively engaged with the through groove 1105 through the valve groove 1107 and the sealing groove 1108 to close the through groove 1105 to prevent the coolant from leaking when the chassis 1103 moves. After the bottom plate 1110 and the chassis 1103 are fitted, the base 301 can press the chassis 1103 to slide in the installation groove 2 through the bottom plate 1110 and compress the connecting spring 1102. The sleeve 1101 can pass through the slide groove 1106 to the chassis 11 03 is used to limit the movement of the chassis 1103 to prevent the chassis 1103 from deflecting when moving. When the flow hole 302 is connected to the cooling pipe 5, the fixing plate 14 can rebound under the action of the fixing spring 13, and the rebound force of the connecting spring 1102 and the moving spring 1109 is transmitted to the base 301 through the chassis 1103 and the bottom plate 1110. With the restriction of the base 301 by the heat sink 303 by the fixing plate 14, the base 301 can be firmly fixed in the installation groove 2, and the heat on the heat sinks 303 on both sides of the base 301 can be transferred to the pressure plate 308 through the fixing plate 14, and dissipated to the outside with the operation of the heat dissipation fan 305. After the heat dissipation component 3 is installed, the chassis 1103 stops moving, and the heat absorption block 1104 is tightly attached to the inner wall of the installation groove 2.The heat in the chassis 1 is absorbed by the side wall of the chassis 1 and transferred to the base 301 through the chassis 1103 and the bottom plate 1110, and finally dissipated to the outside, thereby further improving the overall heat dissipation efficiency. When disassembling the heat dissipation component 3, it is only necessary to press the pressure plate 308, and the fixing plate 14 can be forced through the pressure plate 308 to press it into the fixing groove 12, thereby releasing the restriction of the fixing plate 14 on the base 301. The chassis 1103 and the bottom plate 1110 can rebound to their original positions under the action of the connecting spring 1102 and the return spring 307, thereby ensuring the normal circulation of the coolant and avoiding the leakage of the coolant, and the sleeve 1101 can restrict the chassis 1103 to avoid excessive rebound of the chassis 1103, which causes the through groove 1105 to be unable to accurately dock with the cooling pipe 5, and The base 301 can also be ejected from the installation slot 2 under the action of the rebound force of the connecting spring 1102 and the moving spring 1109, thereby completing the disassembly of the heat dissipation component 3. After the base 301 is removed from the installation slot 2, the fixing plate 14 rebounds and resets under the action of the fixing spring 13, and the installation slot 2 is closed again, and the bottom plate 1110 is blocked at the same time to prevent the bottom plate 1110 from rebounding too much, causing the coolant to flow out of the through slot 1105 from the sealing slot 1108 and the valve slot 1107 and cause leakage. After the base 301 is disassembled, the pressing plate 308 can rebound to its original position under the action of the reset spring 307 to avoid hindering the next installation, and the limit block 306 can limit the pressing plate 308 through the limit slot 309 to prevent the pressing plate 308 from deflecting when moving.

[0033] The embodiments of the present invention are given for the purpose of illustration and description, and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. A high voltage solid-state soft start device based on a modular heat dissipation structure, characterized in that: The invention comprises a chassis (1) and a heat dissipation component (3), wherein the chassis (1) is symmetrically provided with mounting grooves (2), the heat dissipation component (3) is arranged in the mounting grooves (2), the heat dissipation component (3) comprises a base (301), a circulation hole (302), a heat sink (303), a cavity (304), a heat dissipation fan (305), a stop block (306), a return spring (307), a pressure plate (308) and a stop groove (309), the mounting groove (2) is provided with a base (301), and the surface of the base (301) A circulation hole (302) is provided, a heat sink (303) is connected to the surface of the base (301), a cavity (304) is provided between the heat sinks (303), a heat dissipation fan (305) is connected in the cavity (304), a limiting block (306) is symmetrically provided on one side of the heat sink (303), a return spring (307) is connected inside the limiting block (306), the other end of the return spring (307) is connected to a pressure plate (308), and limiting grooves (309) are symmetrically provided on both sides of the pressure plate (308).

2. A high voltage solid-state soft start device based on a modular heat dissipation structure according to claim 1, characterized in that: The heat sinks (303) are evenly spaced on the base (301), and the heat sinks (303) in the middle of the base (301) are wider than the heat sinks (303) on both sides of the base (301); the pressure plate (308) is elastically connected to the limit block (306) via a return spring (307), and the pressure plate (308) is slidably connected to the limit block (306) via a limit groove (309).

3. The high voltage solid-state soft start device based on modular heat dissipation structure according to claim 1, characterized in that: A transfer chamber (4) is provided on one side of the chassis (1), and cooling pipes (5) are provided on both sides of the transfer chamber (4); a cabinet door (6) is provided on the front side of the chassis (1); the cooling pipes (5) are equidistantly distributed with respect to the transfer chamber (4), and the flow holes (302) are connected to the cooling pipes (5).

4. The high-voltage solid-state soft-start device based on a modular heat dissipation structure according to claim 3, characterized in that: A liquid storage chamber (7) is provided on the other side of the chassis (1), and a circulation pump (8) is connected to one side of the liquid storage chamber (7). A diversion groove (9) is provided on the rear side of the chassis (1), and a heat absorption pipe (10) is provided on one side of the diversion groove (9). The heat absorption pipe (10) is connected to the transfer chamber (4). The circulation pump (8) is connected to the diversion groove (9) through a pipeline. The heat absorption pipe (10) is equidistantly distributed with respect to the diversion groove (9).

5. The high voltage solid-state soft start device based on modular heat dissipation structure according to claim 3, characterized in that: A connecting component (11) is arranged in the installation groove (2), and the connecting component (11) comprises a sleeve (1101), a connecting spring (1102), a chassis (1103) and a heat absorbing block (1104); the sleeve (1101) is connected in the installation groove (2), and the outer side of the sleeve (1101) is connected to the connecting spring (1102); one side of the connecting spring (1102) is connected to the chassis (1103), and the chassis (1103) is connected to the heat absorbing block (1104) in the middle of one side of the connecting spring (1102).

6. A high voltage solid-state soft start device based on a modular heat dissipation structure according to claim 5, characterized in that: The connecting assembly (11) further comprises a through groove (1105), a slide groove (1106), a valve groove (1107) and a sealing groove (1108); a through groove (1105) is arranged in the middle of the chassis (1103), and slide grooves (1106) are symmetrically provided at four corners of the chassis (1103); a valve groove (1107) is provided in the middle of the through groove (1105), and sealing grooves (1108) are provided on both sides of the through groove (1105).

7. A high voltage solid-state soft start device based on a modular heat dissipation structure according to claim 6, characterized in that: The connecting assembly (11) also includes a movable spring (1109), a bottom plate (1110), a sealing plate (1111) and a valve plate (1112); the movable spring (1109) is connected to the inner side of the sleeve (1101), and the other end of the movable spring (1109) is connected to the bottom plate (1110); the sealing plates (1111) are symmetrically connected to both sides of the bottom plate (1110), and the valve plate (1112) is connected to the middle of the bottom plate (1110).

8. The high voltage solid-state soft start device based on modular heat dissipation structure according to claim 7, characterized in that: The chassis (1103) is elastically connected to the mounting groove (2) via a connecting spring (1102), and the chassis (1103) is slidably connected to the chassis (1) via the mounting groove (2), the through groove (1105) is connected to the cooling pipe (5), and the valve plate (1112) and the sealing plate (1111) are respectively connected to the through groove (1105) via a valve groove (1107) and a sealing groove (1108), the bottom plate (1110) is elastically connected to the chassis (1103) via a movable spring (1109), and the chassis (1103) is slidably connected to the sleeve (1101) via a sliding groove (1106).

9. The high voltage solid-state soft start device based on modular heat dissipation structure according to claim 1, characterized in that: The mounting groove (2) is symmetrically provided with fixing grooves (12), and fixing springs (13) are symmetrically connected in the fixing grooves (12). The other end of the fixing spring (13) is connected to a fixing plate (14), and a surface of the fixing plate (14) is provided with an inclined surface.

10. A high voltage solid-state soft start device based on a modular heat dissipation structure according to claim 9, characterized in that: The fixing plates (14) are tightly fitted together, and the fixing plates (14) are elastically connected to the fixing grooves (12) via fixing springs (13), the fixing plates (14) are slidably connected to the mounting grooves (2) via the fixing grooves (12), and the fixing plates (14) are snap-fitted and linked to the base (301) via the heat sink (303).

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