Substrate lifting module, substrate processing module and substrate processing system with substrate lifting module

Abstract

A substrate lift module, a substrate processing module including the same, and a substrate processing system. The lift module (200) includes: a substrate support (210) disposed in the internal space (S) and supporting the substrate (G); and a vertical drive unit (220) coupled to the substrate support (210) to drive vertical movement of the substrate support (210), wherein the vertical drive unit (220) includes a shaft (222) coupled to the substrate support (210) and extending outwardly through the chamber (21), and an anti-rotation member (228) coupled to the shaft (222) to prevent circumferential rotation of the shaft (222) about a longitudinal reference axis of the shaft (222).

Description

Technical Field

[0001] The invention relates to a substrate lifting module, a substrate processing module and a substrate processing system having the same. Background Art

[0002] Generally speaking, a semiconductor substrate processing apparatus for performing semiconductor manufacturing processes, etc., includes a plurality of process chambers for performing substrate processing processes, a load-lock chamber for generating an environment for substrates to enter the process chambers before the substrates are introduced into the corresponding process chambers, and a transfer chamber connecting the process chambers and the load-lock chambers and having a robot arm installed thereon, wherein the robot arm is configured to transfer the substrates in the load-lock chambers to the process chambers or to transfer the substrates in the process chambers to the load-lock chambers.

[0003] The process chamber usually performs substrate processing at high temperature and near-vacuum process pressure. Since it is difficult to transfer a substrate at atmospheric pressure to a process chamber at high temperature and process pressure, it is necessary to create an environment identical to the process chamber environment before the substrate is introduced into the process chamber, and this process is performed by a load lock chamber.

[0004] That is, the load lock chamber refers to a chamber that accommodates a substrate under substantially the same conditions as a process chamber environment or an external environment before the substrate is introduced into the process chamber from the outside or before the substrate is taken out of the process chamber.

[0005] A substrate processing chamber, such as a process chamber or a load lock chamber, may have an elevator module disposed therein, the elevator module being configured to lift or lower a substrate within the substrate processing chamber while supporting the substrate.

[0006] The substrate supported by the lifting module may be cooled by a heating plate or a cooling plate disposed in the load lock chamber while being lifted or lowered by the lifting module.

[0007] The lifting module needs to be designed not to have a rotational degree of freedom in the circumferential direction when the moving direction of lifting and lowering is set as the reference axis direction.

[0008] However, a typical lift module uses a large and complex structure to maintain axial alignment between components and restrict rotational freedom, resulting in an increased size and more complex design of the lift module. Summary of the invention

[0009] Technical issues

[0010] The object of the present invention is to provide a lifting module having a miniaturized and simple structure, capable of providing a lifting thrust while limiting the rotational freedom in the circumferential direction, as well as a substrate processing module and a substrate processing system having the lifting module.

[0011] Solution to the problem

[0012] According to one aspect of the present invention, a lifting module (200) is provided, which is arranged in a chamber (21) defining a sealed internal space (S) to lift or lower a substrate (G) introduced into the internal space (S) while supporting the substrate (G), and the chamber (21) is provided with at least one gate (T) for the substrate to enter and exit.

[0013] The lifting module (200) may include a substrate support (210) arranged in the internal space (S) and supporting the substrate (G), and an up-and-down driving unit (220) coupled to the substrate support (210) to drive the substrate support (210) to move up and down.

[0014] The up-and-down driving unit (220) may include a shaft (222) coupled to the substrate support (210) and extending outward through the chamber (21), and an anti-rotation component (228) coupled to the shaft (222) to prevent the shaft (222) from rotating circumferentially around a longitudinal reference axis of the shaft (222).

[0015] The substrate support (210) may include a moving plate (212) disposed in an inner space (S) and at least one substrate holder (214) coupled to the moving plate (212) to support a substrate (G).

[0016] The substrate holder (214) may include a plurality of substrate holders.

[0017] The substrate support (210) may include a first substrate holder (214a) and a second substrate holder (214b) spaced apart from each other in an up-and-down direction, each supporting a substrate (G).

[0018] The shaft (222) may be coupled to a central region of the moving plate (212).

[0019] The up-and-down driving unit (220) may further include a cylinder (224) accommodating a shaft (222) coupled to the chamber (21) and extending outward, and a piston (226) coupled to the shaft (222) and movably disposed within the cylinder (224).

[0020] An anti-rotation component (228) may be disposed between the shaft (222) and the cylinder (224).

[0021] The up and down driving unit (220) may include a pneumatic source (229) that transmits pneumatic pressure to a first space (V1) and a second space (V2) divided by a piston (226) in the cylinder (224) to allow the piston (226) to move linearly in the cylinder (224).

[0022] The anti-rotation component (228) may include a ball-spline member movably coupled to the outer peripheral surface of the shaft (222).

[0023] The lifting module (200) may further include a sealing block (230) disposed between the ball spline member (228) and the piston (226) to prevent leakage of pneumatic pressure.

[0024] The ball spline member (228) may be fixed in circumferential movement relative to a longitudinal reference axis of the shaft (222).

[0025] The lifting module (200) may further include a locking key member (K) fixed relative to the cylinder (224) and protruding toward a groove (228a) formed on an outer peripheral surface of the ball spline member (228) to lock the circumferential movement of the ball spline member (228).

[0026] According to another aspect of the present invention, there is provided a substrate processing module (20), comprising: a chamber (21), which defines a sealed internal space (S) and is provided with at least one gate (T) for the entry and exit of a substrate; and a lifting module (200) arranged in the chamber (21), for lifting or lowering a substrate (G) introduced into the internal space (S) while supporting the substrate (G).

[0027] The substrate processing module (20) may be a load lock module (20b).

[0028] The substrate processing module (20) may also include a gas injector (23) configured to inject an inert gas into the internal space (S); a gas exhaust unit (24) configured to exhaust gas from the internal space (S); a heat exchanger (27) for controlling the temperature of the substrate (G) introduced into the internal space (S); and a gate valve (25) for opening or closing the gate (T).

[0029] The chamber (21) may include a partition wall (21c) that divides the internal space (S) in the up-down direction to define a first internal space (S1) and a second internal space (S2).

[0030] The lifting module (200) may be disposed in each of the first internal space (S1) and the second internal space (S2).

[0031] The chamber (21) may include two pairs of gates (T), corresponding to the first internal space (S1) and the second internal space (S2), respectively.

[0032] According to a further aspect of the present invention, there is provided a substrate processing system, comprising: at least one process module (20a) configured to perform substrate processing on a substrate (G) under a preset process pressure; a loading lock module (20b) configured to transfer the substrate (G) between the process module (20a) and an external environment at atmospheric pressure; and a transfer module (30) configured to transfer the substrate (G) between the process module (20a) and the loading lock module (20b).

[0033] At least one of the process module (20a) and the load lock module (20b) may be provided with a lifting module (200).

[0034] Effects of the Invention

[0035] The lifting module, the substrate processing module and the substrate processing system having the same according to the present invention can realize a small and simple structure, which has sufficient lifting thrust and can constrain the rotational freedom in the circumferential direction.

[0036] Specifically, by adopting an anti-rotation structure in which the shaft moved upward or downward by the piston is integrally formed with the moving plate supported by the substrate, the lifting module according to the present invention does not require a separate structure for constraining the rotational freedom of the shaft or offsetting the circumferential rotation of the shaft, thereby achieving miniaturization and a simpler structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 is a plan view of a substrate processing system according to one embodiment of the present invention.

[0038] Figure 2 yes Figure 1 A side view of a substrate processing module of the substrate processing system is shown.

[0039] Figure 3a It is taken in the XZ direction Figure 2 A plan view of a lifting module provided in a substrate processing module, Figure 3b It is taken in the YZ direction Figure 2 A plan view of a lifting module provided in a substrate processing module, Figure 3c It is taken in the XY direction Figure 2 A plan view of a lifting module provided in a substrate processing module.

[0040] Figure 4a is along Figure 3c A cross-sectional view along line AA of FIG. 1 shows the substrate being moved upward by the lifting module.

[0041] Figure 4b is along Figure 3c A cross-sectional view along line AA of FIG. 1 shows the substrate being moved downward by the lifting module.

[0042] Figure 5 Yes Display Figure 4a Exploded perspective view of the shaft and piston of the lifting module.

[0043] Figure 6a is coupled to Figure 5 A perspective view of the seal block for the shaft.

[0044] Figure 6b is along Figure 6a Cross-sectional view of line BB.

[0045] Figure 6c It is taken in the XY direction Figure 6a A plan view of the sealing block.

[0046] Figure 7 yes Figure 6a A perspective view of the sealing block shown in FIG.

[0047] Figure 8 and Fig. 9 are views of typical lifting modules respectively arranged in substrate processing modules. DETAILED DESCRIPTION

[0048] Hereinafter, an elevating module according to the present invention, and a substrate processing module and a substrate processing system including the elevating module will be described with reference to the accompanying drawings.

[0049] First, refer to Figure 1 , a substrate processing system according to the present invention may include at least one substrate processing module (20) which performs substrate processing on a substrate (G) under a preset process pressure.

[0050] The substrate processing module (20) refers to a unit module in which substrate processing is performed on a substrate, and may have various configurations according to the type of substrate processing performed.

[0051] Here, substrate processing is not limited to a specific process, such as cleaning, polishing, transferring, heating, cooling, oxidation, photolithography, etching, deposition, etc.

[0052] In addition, the substrate (G) to be processed is a base material, which can be formed of various materials such as glass or a semiconductor, for example, silicon or gallium, and is not limited to a specific material or shape.

[0053] For example, the substrate (G) may broadly refer to a wafer (including a bare wafer) that is a semiconductor substrate for forming a semiconductor layer, such as an integrated circuit, and the like.

[0054] The substrate processing module (20) may include process modules 20a, each process module including at least one independent chamber (21) in which at least one process (deposition, etching, etc.) is performed, and a load lock module (20b) for transferring the substrate (G) between the outside under atmospheric pressure and the process module (20a).

[0055] The substrate processing system may further include a transfer module (30) for transferring the substrate (G) between the process module (20a) and the load lock module (20b).

[0056] Although the substrate processing system may be configured as a cluster type including a process module (20a) and a transfer module (30) commonly connected to the process module (20a), it should be understood that this structure is provided as an embodiment and the present invention is not limited thereto.

[0057] A gate valve may be arranged between the transfer module (30) and each independent chamber (21) and is operated to be opened or closed under the control of a controller (not shown).

[0058] Furthermore, the transfer module (30) may be provided with a substrate transfer robot (31) configured to transfer the substrate (G) from the load lock module (20b) to a predetermined position.

[0059] The process module (20a) refers to a module in which various processes are performed, such as an etching process or a deposition process using plasma reaction or chemical vapor deposition, and may include a pressure regulating valve for adjusting the vacuum pressure in the actual process after the process module (20a) is evacuated to a vacuum state by a vacuum pump (not shown) as a preparatory operation for the process.

[0060] Specifically, the process module (20a) may include a chamber (21) defining an enclosed processing space in which substrate processing is performed, a substrate support (not shown) supporting the substrate (G), a gas injector (not shown) injecting a processing gas, and a heating jacket (not shown) controlling the temperature of the process module (100).

[0061] On the other hand, the process module (20a) may include a plurality of independent chambers (21) to define a plurality of substrate processing spaces, in which substrate processing such as deposition, etching, etc. is performed.

[0062] A plurality of process modules 20a may be arranged side by side along a side of the transport module (30).

[0063] In this embodiment, the process module (20a) may include multiple independent chambers (21) to realize multiple substrate processing spaces, wherein a single chamber (21) has two separate substrate processing spaces. Alternatively, a single process module (20a) may be configured to process a single substrate (G).

[0064] The transfer module (30) is arranged between the load lock module (20b) and the process module (20a), and may have various configurations capable of transporting the substrate (G) to each substrate processing space of the process module (20a).

[0065] The transfer module (30) may include a chamber body formed with a plurality of gates through which the substrate (G) passes, and defines a space in which the substrate (G) is transferred between the load lock module (20b) and the process module (20a).

[0066] The transfer module (30) can transfer the substrate (G) transferred from the load lock module (20b) to the process module (20a) for substrate processing, or can transfer the substrate (G) transferred from the process module (20a) to the load lock module (20b) after the substrate processing is completed.

[0067] Specifically, the transfer module (30) may be provided with a substrate transfer robot (31), which takes out the substrate (G) from the load lock module (20b) to transfer the substrate (G) to a predetermined position, and takes out the substrate (G) from the process module (20a) to transfer the substrate (G) to the load lock module (20b).

[0068] The substrate transfer robot (31) is disposed on the transfer module (30) and may have various configurations, capable of transferring the substrate (G) between each process module 20a and the transfer module (30) through a plurality of gates.

[0069] The substrate transfer robot (31) transfers the substrate (G) transferred from the loading lock module (20b) to each independent chamber (21) through the gate, and transfers the substrate (G) transferred from each independent chamber (21) of the process module (20a) to the loading lock module (20b) through the gate.

[0070] The transfer module (30) can always be kept at a process pressure close to vacuum.

[0071] However, in order to minimize the flow of particles from the process module (20a) to the transfer module (30) or from the transfer module (30) to the process module (20a) during the transfer of the substrate (G), the internal pressure of the transfer module (30) can be maintained at a state relatively higher than the internal pressure of the process module (20a) (low vacuum).

[0072] The load lock module (20b) may be configured in a variety of ways, including configurations that allow the load lock module (20b) to be exposed to environmental conditions that approximate the environmental conditions within the transfer module (30) while preventing the environmental conditions within the transfer module (30) from being externally affected.

[0073] That is, the load lock module (20b) can change from a process pressure state close to vacuum to an atmospheric pressure state, or from an atmospheric pressure state to a process pressure state.

[0074] In addition, the load lock module (20b) may accommodate a substrate (G) sent from a loading unit (50) connected to an external location, such as a substrate storage container (not shown), under atmospheric pressure.

[0075] The load lock module (20b) may be coupled to the loading unit (50) on one side thereof and to the transfer module (30) on the other side thereof.

[0076] After a substrate (G) is transferred from a substrate storage container (FOUP) in a standby state through a loading unit (50), the interior of a load lock module (20b) is changed to a process pressure state close to vacuum like in a transfer module (30).

[0077] In addition, when the substrate (G) processed in the process module (20a) is transferred to the load lock module (20b) through the transfer module (30), the interior of the load lock module (20b) is changed to an atmospheric pressure state to allow the substrate (G) to be transferred to an external substrate storage container (FOUP) through the loading unit (50).

[0078] like Figure 1 As shown, the load lock module (20b) may be provided as a pair of load lock modules, arranged side by side on one side of the transfer module (30).

[0079] Specifically, each load lock module (20b) may include a chamber (21) defining a sealed inner space (S) and provided with at least one gate (T) for entry and exit of substrates.

[0080] The chamber (21) refers to a housing defining a sealed inner space (S) and provided with at least one gate (T) for substrate entry and exit, and may have various configurations.

[0081] For example, the chamber (21) may include at least one pair of gates (T) for entry and exit of the substrate, respectively, wherein the pair of gates (T) may be formed in a substrate conveying direction (D1) (substrate transfer direction) of the substrate (G).

[0082] The substrate transport direction (D1) may be defined as a direction parallel to the travel path of the substrate (G) entering and exiting the chamber (21).

[0083] For example, the gate (T) refers to an opening opened and closed by a gate valve (25) described below, and may include a first gate (T1) corresponding to the loading unit (50) and a second gate (T2) corresponding to the transfer module (300).

[0084] When the chamber (21) has a substantially hexahedral shape, at least one pair of gates (T) may be provided on a pair of opposite side walls of the chamber (21).

[0085] When the chamber (21) includes a plurality of independent substrate processing areas, a plurality of gates (T) may be formed corresponding to the substrate processing areas.

[0086] Although Figure 1 and Figure 2 An embodiment of the chamber (21) is shown, which is formed with two pairs of gates (T) spaced apart from each other in the up-and-down direction, but it should be understood that the present invention is not limited thereto.

[0087] The chamber (21) may be formed in various shapes, for example, in a rectangular (hexahedral) shape in a plan view.

[0088] The chamber (21) is configured to form a plurality of independent substrate processing regions or to process a plurality of substrates (G) in one substrate processing region.

[0089] The chamber (21) may include a chamber body (21a) opened at an upper side thereof and an upper cover (21b) coupled to an upper surface of the chamber body (21a) to define an internal space (S) therein.

[0090] The chamber body (21a) may be realized by a single integral member.

[0091] When the bottom surface of the chamber body (21a) is open, the chamber (21) may further include a lower cover (21d) coupled to the bottom surface of the chamber body (21a).

[0092] For example, the chamber body (21a) may include a partition wall (21c) that divides the internal space (S) to define a first internal space (S1) and a second internal space (S2) in the up-down direction.

[0093] The first internal space (S1) and the second internal space (S2) may correspond to independent substrate processing areas.

[0094] The chamber body (21a) may include two pairs of gates (T) corresponding to the first inner space (S1) and the second inner space (S2), respectively.

[0095] The load lock module (20b) may include a gas injector (23) configured to inject an inert gas into the internal space (S), a gas exhaust unit (24) configured to exhaust gas from the internal space (S), a heat exchanger (27) for controlling the temperature of a substrate (G) introduced into the internal space (S), and a gate valve (25) for opening or closing the gate (T).

[0096] The gas injector (23) may have various configurations capable of injecting the inert gas into the inner space (S).

[0097] The gas injector (23) may be disposed on the chamber body (21a), and may change the inner space (S) from a process pressure state to an atmospheric pressure state by injecting an inert gas into the inner space (S), and may also perform a cooling function to cool the substrate (G).

[0098] The inert gas may include a gas for exhausting / purging the inner space (S), for example, N 2 gas.

[0099] Although the inert gas is supplied in order to change the pressure / purify the internal space of the chamber (21), the inert gas is also used to cool the substrate (G) to a predetermined temperature to prevent thermal damage to the substrate (G) that may occur when the substrate (G) heated in the process module (20a) is discharged therefrom in a heated state.

[0100] For example, the gas injector (23) may include a valve block (23a) having a gas flow path, at least one gas valve (23b) disposed on the valve block (23a) to open or close the gas flow path, and a diffuser (not shown) connected to the gas flow path and through which the inert gas is injected into the internal space (S).

[0101] The gas flow path refers to a path for the inert gas to flow in the valve block (23a), and may form a single path or may be branched in various ways.

[0102] The gas valve (23b) refers to a shutoff valve provided on the valve block (23a) to open or close a gas flow path, and may have various configurations.

[0103] When the internal space (S) of the chamber (21) of the loading lock module (20b) is divided into a first internal space (S1) and a second internal space (S2), a plurality of gas valves (23b) can be provided corresponding to the first internal space (S1) and the second internal space (S2) so as to independently control the gas injection into the first internal space (S1) and the second internal space (S2).

[0104] The diffuser (not shown) may have various configurations capable of injecting the gas into the inner space (S), and may be in communication with the gas flow path to receive the inert gas and inject the inert gas into the inner space (S).

[0105] The gas exhaust unit (24) may have various configurations capable of exhausting gas from the internal space (S), and may exhaust gas from the internal space to change the internal space (S) from an atmospheric pressure state to a process pressure state.

[0106] The gas exhaust unit (24) may include a gas exhaust line (24a) coupled to the chamber (21) and a vacuum pump (24b) coupled to the gas exhaust line (24a).

[0107] When the substrate processing system includes a pair of load lock modules (20b) such as Figure 2 As shown, the gas exhaust unit (24) may include a common exhaust line for evacuating the load lock module (20b) using a single vacuum pump.

[0108] The heat exchanger (27) may have various configurations capable of performing temperature control (cooling or heating) on ​​the substrate (G) introduced into the internal space (S).

[0109] When the inner space (S) of the chamber (21) of the load lock module (20b) is divided into a first inner space (S1) and a second inner space (S2), the heat exchanger (27) may be disposed in the first inner space (S1) and the second inner space (S2), respectively.

[0110] For example, the heat exchanger (27) may include a heat exchange plate formed in a planar shape corresponding to the substrate (G), a heating medium channel embedded in the heat exchange plate to allow a heating medium supplied from the outside to flow therein, and a heating medium port for supplying and discharging the heating medium to the heating medium channel, but is not limited thereto.

[0111] As another example, the heat exchanger (27) may include a halogen lamp arranged toward the substrate (G).

[0112] Furthermore, the heat exchanger (27) may include both a heating plate for heating the substrate and a cooling plate for cooling the substrate.

[0113] The heat exchanger (27) may be coupled to the cover (21b, 21d) of the chamber (21). When the lifting module (200) described below is coupled to the cover (21b, 21d), the lifting module (200) and the heat exchanger (27) may be modularized and arranged through the cover (21b, 21d).

[0114] The gate valve (25) refers to a valve for opening or closing the gate (T), and may be formed integrally with the chamber (21) as a part of the load lock module (20b).

[0115] On the other hand, the substrate processing module (20) may include an elevating module (200) arranged in the chamber (21) for lifting or lowering the substrate (G) introduced into the internal space (S) while supporting the substrate (G).

[0116] The lifting module (200) may be arranged at any position within the substrate processing module (20), for example, in the process module (20a) and / or the load lock module (20b).

[0117] Hereinafter, the lifting module (200) according to the present invention will be described with reference to an embodiment in which the lifting module (200) is arranged in the load lock module (20b). However, it should be understood that the installation position of the lifting module (200) is not limited to the load lock module (20b), and the lifting module (200) can be arranged at any position in the substrate processing module (20) including the process module (20a).

[0118] The lifting module (200) is arranged in the chamber (21) and may have various configurations, and is capable of lifting or lowering a substrate (G) introduced into the internal space (S) while supporting the substrate (G).

[0119] A lifting module (200) is arranged in the chamber (21) and is configured to support a substrate (G) introduced into the internal space (S), when the chamber (21) includes a plurality of independent processing areas, such as Figure 2 As shown, a plurality of may be provided corresponding to a plurality of substrate processing regions.

[0120] That is, the lifting module (200) in the upper substrate processing area can be arranged on the upper cover (21b) of the chamber (21), and the lifting module (200) in the lower substrate processing area independent of the upper substrate processing area can be arranged on the lower cover (21d) of the chamber (21).

[0121] The lifting module (200) arranged on the lower cover (21b) may have the same or similar configuration as the lifting module (200) arranged on the upper cover (21b), and may be arranged in an upside-down configuration relative to the lifting module (200) arranged on the upper cover (21b).

[0122] In one embodiment, the lifting module (200) may include a substrate support (210) arranged in the internal space (S) to support the substrate (G) and an up-and-down driving unit (220) coupled to the substrate support (210) to drive the substrate support (210) to move up and down.

[0123] refer to Figures 2 to 4b The substrate support (210) may include a moving plate (212) disposed in the inner space (S) and at least one substrate holder (214) coupled to the moving plate (212) to support the substrate (G).

[0124] The moving plate (212) may have any shape as long as the moving plate is implemented as a plate member arranged in the internal space (S) so that the support member (214) described later can be arranged thereon. Figure 3c As shown, the moving plate may have a strip shape of constant width.

[0125] The substrate holder (214) refers to a supporting member coupled to the moving plate (212) to support the substrate (G), and may have various configurations and shapes.

[0126] The substrate holder (214) may include a pair of supporting members respectively coupled to opposite ends of the moving plate (212) in the longitudinal direction to support an edge of a lower surface of the substrate (G).

[0127] The pair of support members may extend toward the center of the substrate (G) to form a contact surface with an edge of a lower surface of the substrate (G) along an extending portion thereof.

[0128] A coupling member (216) extending in the up-down direction may be arranged between the substrate holder (214) and the moving plate (212) to couple the substrate holder (214) and the moving plate (212) and to form a gap between the substrate (G) and the moving plate (212) in the up-down direction.

[0129] The substrate holder (214) may be provided in plural. For example, the substrate holder (214) may include a first substrate holder (214a) and a second substrate holder (214b) spaced apart from each other in the up-down direction, each supporting the substrate (G).

[0130] Therefore, if Figure 2 As shown, the substrate support (210) is configured to support a plurality of substrates (G) spaced apart from each other in the up-and-down directions within a single substrate processing region.

[0131] The first substrate holder (214a) and the second substrate holder (214b) may have the same or similar configuration.

[0132] A coupling member (216) extending in the up-down direction may be further arranged between the first substrate holder (214a) and the second substrate holder (214b) to couple the first substrate holder (214a) and the second substrate holder (214b) to each other and to form a gap between the first substrate holder (214a) and the second substrate holder (214b) in the up-down direction.

[0133] The up-and-down driving unit (220) is coupled to the substrate support (210) to drive the up-and-down movement of the substrate support (210), and may have various configurations.

[0134] For example, the up-down drive unit (220) may include a shaft (222) coupled to the substrate support (210) and extending outward through the chamber (21), and an anti-rotation component (228) coupled to the shaft (222) to prevent circumferential rotation of the shaft (222) relative to a longitudinal reference axis of the shaft (222).

[0135] A shaft (222) is coupled to the substrate support (210) and extends outwardly through the chamber (21) and can have a variety of configurations.

[0136] The shaft (222) is coupled to one surface of the moving plate (212) of the substrate support (210) at one end thereof, and can extend in the longitudinal direction thereof to penetrate the cover (21b, 21d).

[0137] One end of the shaft (222) may be coupled to a central region of the moving plate (212), which may coincide with the center of the supported substrate (G).

[0138] The shaft (222) may be fixed to the moving plate (212) by a bolt member (B) and may have an integral design.

[0139] The shaft (222) can be driven in the up and down directions by various driving sources, including pneumatic pressure, hydraulic pressure, etc., but not limited thereto, and can have any structure for transmitting driving force as long as the shaft (222) can move up and down.

[0140] As an example, the up and down driving unit (220) may be cylindrical and may further include a cylinder (224) coupled to the chamber (21) and extending outward therefrom to accommodate the shaft (222), and a piston (226) coupled to the shaft (222) and movably arranged in the cylinder (224).

[0141] The cylinder (224) houses a shaft (222) coupled to the chamber (21) and extending outwardly therefrom, and may have a variety of configurations.

[0142] The lifting module (200) may include a coupling block (240) and a plurality of bolt members (B) for coupling the cylinder (224) to the cover (21b, 21d) outside the chamber (21).

[0143] The coupling block (240) is coupled to the cylinder (224) and may be coupled to the cover (21b, 21d) via a plurality of bolt members (B).

[0144] The cylinder (224) may have various shapes and structures as long as the cylinder (224) can accommodate the shaft (222) extending outward from the chamber (21) and can define a space allowing the shaft (222) to move up and down therein.

[0145] like Figure 4a and Figure 4b As shown, the cylinder (224) may include a cylinder body (224a) and a top cover (224b) covering an open upper surface of the cylinder body (224a).

[0146] refer to Figures 3a to 4b In order to seal the inner space (S) of the substrate processing module (20) when the shaft (222) moves up and down, a bellows (V) may be arranged between the coupling block (240) and the moving plate (212) to surround the shaft (222).

[0147] The piston (226) is coupled to the shaft (222) and is movably disposed within the cylinder (224), and may have a variety of configurations.

[0148] For example, refer to Figure 4a and Figure 5 The piston (226) may be fixed to the other end of the shaft (222) by a bolt member (B), or may be formed into a hollow ring shape and fixed to the shaft (222) so as to surround the outer peripheral surface of the shaft (222).

[0149] The piston (226) may be in close contact with the inner peripheral surface of the cylinder (224), and may be arranged to move up and down together with the shaft (222) in the cylinder (224).

[0150] At least one sealing member (O-ring) may be arranged along an outer peripheral surface of the piston (226) facing the cylinder (224).

[0151] An O-ring member (O) for sealing may be further provided on the lower surface of the piston (226).

[0152] The cylinder (224) may have a first space (V1) and a second space (V2), which are divided by the piston (226).

[0153] Here, the up-and-down driving unit (220) may include a pneumatic source (229) that transmits pneumatic pressure to the first space (V1) and the second space (V2) to force the piston (226) to move linearly within the cylinder (224).

[0154] To this end, the outer wall of the cylinder (224) may be formed with two pressure transmission holes, which are respectively connected to the first space (V1) and the second space (V2). The two pressure transmission holes may be connected to the pneumatic source (229) through transmission valves (223a, 223b).

[0155] Figure 4a It is shown that when the pneumatic pressure is transmitted to the first space (V1), the shaft (222) and the piston (226) move upward, Figure 4b It is shown that when pneumatic pressure is transmitted to the second space (V2), the shaft (222) and piston (226) move downward.

[0156] The up and down movement of the shaft (222) can be achieved by a pneumatic source (229) and pneumatic control.

[0157] Although Figures 3a to 4b A pneumatic source (229) is shown as the driving source, but it should be understood that the driving source of the lifting module (200) according to the present invention is not limited thereto.

[0158] Furthermore, the piston (226) may be coupled to the magnetic portion (227).

[0159] The magnetic part (227) may be stacked on the upper surface of the piston (226) and may be coupled to the piston (226) and the shaft (222) by a bolt member (B) to be coupled to the other end of the shaft (222). However, it should be understood that the coupling method of the magnetic part (227) is not limited thereto.

[0160] refer to Figures 4a to 5 The magnetic portion (227) may include a magnet member (227a) seated on the upper surface of the piston (226) and a magnet guide member (227b) that fixes the magnet member (227a) in place and to the piston (226).

[0161] An O-ring member (O) may be disposed on an upper surface of the magnet guide member (227b).

[0162] The anti-rotation component (228) is coupled to the cylinder shaft (222) to prevent circumferential rotation of the shaft (222) about a longitudinal reference axis of the shaft (222), and may have various configurations.

[0163] In one embodiment, an anti-rotation component (228) may be disposed between the shaft (222) and the cylinder (224).

[0164] Here, the longitudinal direction of the shaft (222) is parallel to the moving (lifting or lowering) direction of the shaft (222) and is consistent with the z-axis direction in the figure.

[0165] Here, circumferential rotation refers to rotation about the longitudinal reference axis (C) of the shaft (222).

[0166] The anti-rotation component (228) can be implemented by, for example, a spherical member movably coupled to the outer peripheral surface of the shaft (222), such as Figures 3a to 5 shown.

[0167] The ball spline member (228) may be disposed in the cylinder (224) and may be a cylindrical member having a through hole (H) formed at the center thereof, through which the shaft (222) passes in the up-down direction.

[0168] The ball spline member (228) may be fixed to the lower side of the cylinder (224) and may be restricted from moving in the up-down direction and the circumferential direction.

[0169] That is, the ball spline member (228) may be fixed in its circumferential movement relative to a longitudinal reference axis of the shaft (222).

[0170] Since the ball spline member (228) is fixed in position relative to the cylinder (224), the shaft (228) may be movably arranged with a longitudinal degree of freedom relative to the ball spline member (228).

[0171] To this end, the ball spline component (228) may be formed with a groove (228a) on its lateral outer peripheral surface, and the cylinder (224) may be provided with a locking key component (K) on its inner wall facing the groove (228a), so that the locking key component protrudes toward the groove (228a) and is placed in the groove (228a) to lock the circumferential movement of the ball spline component (228).

[0172] The locking key member (K) may be a set screw and may be fixed in position relative to the cylinder (224).

[0173] The groove (228a) may be implemented in the form of an elongated hole extending in the longitudinal direction of the ball spline member (228).

[0174] The ball spline member (228) may have a plurality of rotatably arranged protruding steel balls (not shown) on the inner peripheral surface of the through hole (H) and arranged longitudinally thereof. Since this structure of the ball spline member is a typical ball spline structure, the ball spline member will not be described in detail.

[0175] The shaft (222) may have grooves (222a) formed on its outer peripheral surface, which are formed at positions corresponding to the steel balls in the longitudinal direction to provide a rolling surface on which the steel balls of the ball spline member (228) can roll.

[0176] Since the steel balls protruding from the circumferential surface of the ball spline component (228) roll and move on the groove (222a) of the shaft (222) in a state of meshing with the shape of the groove (222a) of the shaft (222), the shaft (222) can move in the up and down directions relative to the ball spline component (228) while its circumferential rotation is constrained.

[0177] The lifting module (200) is configured to prevent pneumatic pressure leakage to prevent lifting thrust loss. To this end, the lifting module (200) may further include a sealing block (230) between the ball spline member (228) and the piston (226).

[0178] Therefore, the first space (V1) can be formed between the piston (226) and the sealing block (230), and the sealing block (230) can prevent the pneumatic pressure in the first space (V1) from leaking to the ball spline component (228), thereby preventing the loss of lifting thrust of the lifting module (200).

[0179] The sealing block (230) may include a cylindrical body (232) fixedly arranged in the cylinder (224) and having a through hole formed at the center thereof, through which the shaft (222) passes in the up-down direction, and a shaft seal (234) in close contact with the outer peripheral surface of the shaft (222).

[0180] The cylindrical body (232) is formed with a first groove (231a) on its outer peripheral surface, the first groove extending in its circumferential direction, so that the seal (O) is arranged on the first groove (231a) to closely contact the inner peripheral surface of the cylinder (224).

[0181] One surface of the cylinder (231) may be adjacent to an upper surface of the ball spline member (228), and the other surface of the cylinder (231) may face the first space (V1).

[0182] The cylinder (232) may be formed with a second groove (231b) on its inner circumferential surface, the second groove extending annularly in its circumferential direction, so that an annular shaft seal (234) is arranged on the second groove (231b) to closely contact the outer circumferential surface of the shaft (222).

[0183] The shaft seal (234) may be formed of a material suitable for sealing, such as synthetic rubber, for example, FKM (Viton TM ) formed seal.

[0184] like Figure 7 a and Figure 8 As shown, the shaft seal (234) can be arranged in the second groove (231b) on the inner circumferential surface of the cylinder (232) and protrude toward the shaft (222).

[0185] The shaft seal (234) may have a groove formed on a surface thereof facing the first space (V1) and recessed along its circumference, and may include an inner wall (234d) and an outer wall (234c) with the groove as a boundary, and a bottom surface (234b) connecting the inner wall (234d) and the outer wall (234c) as the bottom surface of the groove.

[0186] Thus, the shaft seal (234) may have a U-shaped cross-section.

[0187] The inner peripheral surface of the inner wall (234d) facing the shaft (222) may be formed with protrusions (234a) which engage with the grooves (222a) of the shaft (222) to closely contact the grooves (222a), thereby enabling the shaft seal (234) to closely contact the shaft (222) without leakage.

[0188] The outer peripheral surface of the outer wall (234c) facing the cylinder (232) may be gradually inclined from the bottom surface (234b) to approach and contact the cylinder (232).

[0189] refer to Figure 8 and Fig. 9A typical lifting module (400) arranged in a substrate processing module (40) is provided with a floating joint (450) to offset the eccentricity of the axial alignment of the shaft (422) and the moving plate (412), and is provided with a plurality of guide structures (460), such as Figure 8 As shown, using a separate ball bearing (462) and a linear shaft (464) arranged outside the substrate processing module (40), or as Fig. 9 As shown, a large LM guide rail (470) arranged in a cylinder is used to limit the circumferential rotational freedom, which makes the structure of the substrate processing module (40) complex and large.

[0190] refer to Figure 8 A floating joint (450) is arranged for axial alignment between the shaft (422) and the movable plate (412), and in order to limit the rotational freedom, the movable plate (412) is arranged outside the substrate processing module (40), and a plurality of separate linear guides (460) are further arranged between the movable plate (412) and the upper cover of the substrate processing module (40), thereby making the structure of the substrate processing module complex and increasing the height, overall size and weight.

[0191] refer to Fig. 9 A floating joint (450) is arranged between the moving plate (412) and the shaft (422) inside the cylinder (424) for axial alignment, and a large LM guide rail (470) is arranged between the floating joint 450 and the moving plate (412) to limit the rotational freedom, which makes the substrate processing module complex and increases the height, overall size and weight.

[0192] In contrast, the lifting module (200) having the above configuration provides a structure capable of limiting its circumferential rotational freedom using a ball spline (228), thereby providing a simple and minimized structure, and adopts a sealing block (230) suitable for the ball spline (288) to prevent thrust problems in lifting or lowering.

[0193] The lifting module (200) according to the present invention has the effect of preventing the shaft (222) from rotating, and at the same time reduces the height of the lifting module (200) through a simple structure, even if the lifting module (200) is not used. Figure 8 and Fig. 9 The floating joint (450) shown reduces the overall size of the lifting module by 40% or more compared to typical structures.

[0194] Although some embodiments have been described, it should be understood by those skilled in the art that these embodiments are given as illustrations only and the present invention is not limited thereto. Therefore, the scope of the present invention should be interpreted according to the appended claims, and all modifications or variations derived from the appended claims and their equivalents are covered.

Claims

1. A lifting module (200) arranged in a chamber (21), the chamber (21) defining a sealed internal space (S), for lifting or lowering a substrate (G) introduced into the internal space (S) while supporting the substrate (G), the chamber (21) being provided with at least one gate (T) for entering and exiting the substrate, The lifting module (200) comprises: a substrate support (210) arranged in the inner space (S) and supporting the substrate (G); and a vertical driving unit (220) coupled to the substrate support (210), the vertical driving unit (220) being used to drive the substrate support (210) to move up and down, The up-and-down driving unit (220) includes a shaft (222) coupled to the substrate support (210) and extending outward through the chamber (21), and an anti-rotation component (228) coupled to the shaft (222) for preventing the shaft (222) from rotating circumferentially around a longitudinal reference axis of the shaft (222).

2. The lifting module (200) according to claim 1, wherein the substrate support (210) includes a movable plate (212) arranged in the internal space (S) and at least one substrate holder (214) coupled to the movable plate (212), and the substrate holder (214) is used to support the substrate (G).

3. The lifting module (200) according to claim 2, wherein The substrate holder (214) comprises a plurality of substrate holders, and The substrate support (210) includes a first substrate holder (214a) and a second substrate holder (214b) which are spaced apart from each other in the up and down directions and each supports the substrate (G).

4. The lifting module (200) of claim 2, wherein the shaft (222) is coupled to a central region of the moving plate (212).

5. The lifting module (200) according to claim 1, wherein the up-and-down driving unit (220) further comprises: a cylinder (224) accommodating the shaft (222), wherein the shaft (222) is coupled to the chamber (21) and extends outward from the chamber (21); and a piston (226) coupled to the shaft (222) and movably disposed within the cylinder (224).

6. The lifting module (200) according to claim 5, wherein the anti-rotation component (228) is arranged between the shaft (222) and the cylinder (224).

7. The lifting module (200) according to claim 5, wherein the up and down driving unit (220) includes a pneumatic source (229) that delivers pneumatic pressure to a first space (V1) and a second space (V2) defined in the cylinder (224) and divided by the piston (226) to allow the piston (226) to move linearly in the cylinder (224).

8. The lifting module (200) according to claim 7, wherein the anti-rotation component (228) includes a ball spline member movably coupled to an outer peripheral surface of the shaft (222).

9. The lifting module (200) according to claim 8, further comprising: A sealing block (230) is arranged between the ball spline member (228) and the piston (226) to prevent leakage of the pneumatic pressure.

10. The lift module (200) of claim 8, wherein the ball spline member (228) is fixed in its circumferential movement relative to the longitudinal reference axis of the shaft (222).

11. The lifting module (200) according to claim 10, further comprising: A lock key member (K) is fixed relative to the cylinder (224) and protrudes toward a groove (228a) formed on an outer peripheral surface of the ball spline member (228) for locking the circumferential movement of the ball spline member (228).

12. A substrate processing module (20), comprising: a chamber (21) defining a sealed inner space (S) and provided with at least one gate (T) for entering and exiting a substrate; And a lifting module (200) as described in any one of claims 1 to 11, wherein the lifting module (200) is arranged in the chamber (21) and is used to raise or lower the substrate (G) introduced into the internal space (S) while supporting the substrate (G).

13. The substrate processing module (20) according to claim 12, wherein the substrate processing module (20) is a load lock module (20b), further comprising: A gas injector (23) configured to inject an inert gas into the internal space (S); a gas exhaust unit (24) configured to exhaust gas from the internal space (S); a heat exchanger (27) for controlling the temperature of the substrate (G) introduced into the internal space (S); and a gate valve (25) for opening or closing the gate (T).

14. The substrate processing module (20) according to claim 12, wherein The chamber (21) includes a partition wall (21c) that divides the internal space (S) to define a first internal space (S1) and a second internal space (S2) in a vertical direction, and The lifting module (200) is disposed in each of the first internal space (S1) and the second internal space (S2).

15. The substrate processing module (20) according to claim 14, wherein the chamber (21) comprises two pairs of gates (T), corresponding to the first internal space (S1) and the second internal space (S2), respectively.

16. A substrate processing system comprising: at least one process module (20a) configured to perform substrate processing on a substrate (G) under a preset process pressure; a load lock module (20b) configured to transfer the substrate (G) between the process module (20a) and the outside at atmospheric pressure; and a transfer module (30) configured to transfer the substrate (G) between the process module (20a) and the load lock module (20b), At least one of the process module (20a) and the load lock module (20b) is provided with a lifting module (200) according to any one of claims 1 to 11.

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