Electronic device including flexible printed circuit board

Abstract

An electronic device including a flexible printed circuit board is disclosed. The electronic device may include a display including a first area and a second area; a first housing supporting the first region; a second housing supporting the second region; the hinge structure is used for connecting the first shell and the second shell, so that the first shell and the second shell can be folded along a folding shaft, and a folding angle formed by the first shell and the second shell relative to the folding shaft is adjusted; and a flexible printed circuit board extending along the extension direction.

Description

Technical Field

[0001] The present disclosure relates to a flexible printed circuit board (FPCB) and an electronic device including the same. Background Art

[0002] In recent years, electronic devices have evolved from devices with a single rectangular shape to devices with various design shapes and functions to meet the purchasing needs of consumers. For example, such electronic devices may include foldable electronic devices that can change size according to the use state (e.g., can change from a folded state to an unfolded state). In such foldable electronic devices, a flexible printed circuit board (FPCB) (which can flexibly change shape) can be used to electrically connect various components within the device. Summary of the invention

[0003] Solutions to the problem

[0004] According to one embodiment, an electronic device includes: a display including a first area and a second area; a first housing supporting the first area; a second housing supporting the second area; a hinge structure foldably connecting the first housing to the second housing based on a folding axis and adjusting a folding angle formed by the first housing and the second housing relative to the folding axis; and a flexible printed circuit board extending in an extension direction. In one embodiment, the flexible printed circuit board includes: a driving area that spans the folding axis and is at least partially bent in response to a change in the folding angle; a first fixed area that extends from the driving area to a first space formed by the first housing; and a second fixed area that extends from the driving area to a second space formed by the second housing. In one embodiment, the flexible printed circuit board includes: a first substrate layer including a first substrate surface and a second substrate surface opposite to the first substrate surface; a first metal layer arranged on the second substrate surface and forming a plurality of signal lines extending in the extension direction; and a first covering layer arranged to cover the first metal layer in the direction of the second substrate surface. In one embodiment, the thickness of the first covering layer in the driving area is different from the thickness of the first covering layer in the first fixing area and the second fixing area.

[0005] According to one embodiment, a flexible printed circuit board (FPCB) arranged in an electronic device includes: a first substrate layer, which includes a first substrate surface and a second substrate surface opposite to the first substrate surface; a first metal layer, which is arranged on the second substrate surface and forms a plurality of signal lines arranged in an extension direction; a first covering layer, which is arranged to cover the first metal layer along the direction of the second substrate surface; a second substrate layer, which is arranged in the direction of the first substrate surface; a second metal layer, which is arranged on the second substrate layer opposite to the first substrate layer; and a second covering layer, which is arranged on the second substrate layer to cover the second metal layer. In one embodiment, the flexible printed circuit board includes: a driving area, a first fixed area, and a second fixed area based on the extension direction, wherein the first fixed area and the second fixed area are arranged in opposite directions relative to the driving area. In one embodiment, the thickness of the first covering layer in the driving area is different from the thickness of the first covering layer in the first fixed area and the second fixed area.

[0006] According to one embodiment, an electronic device includes: a display including a first area and a second area; a first housing that forms a first space on a rear surface of the first area; a second housing that forms a second space on a rear surface of the second area; a hinge structure that includes a hinge housing that connects the first housing to the second housing based on a folding axis and adjusts a folding angle formed by the first housing and the second housing; and a flexible printed circuit board that spans the folding axis and extends from the first space to the second space in an extension direction. In one embodiment, the flexible printed circuit board includes: a driving area that is at least partially arranged in the hinge housing and at least partially bends in response to a change in the folding angle; a first fixed area that extends from the driving area to the first space; and a second fixed area that extends from the driving area to the second space. In one embodiment, a flexible printed circuit board includes: a first substrate layer including a first substrate surface and a second substrate surface opposite to the first substrate surface; a first metal layer arranged on the second substrate surface and forming a plurality of signal lines arranged in an extending direction; a first covering layer arranged to cover the first metal layer in a direction along the second substrate surface; a second substrate layer arranged in a direction of the first substrate surface; a second metal layer arranged on the second substrate layer opposite to the first substrate layer; and a second covering layer arranged on the second substrate layer to cover the second metal layer. In one embodiment, the thickness of the first covering layer in the driving region is greater than the thickness of the first covering layer in the first fixed region or the second fixed region. In one embodiment, the spacing between the plurality of signal lines in the driving region is greater than the spacing between the plurality of signal lines in the first fixed region or the spacing between the plurality of signal lines in the second fixed region. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1is a block diagram of an electronic device in a network environment according to one embodiment.

[0008] Figure 2a is a diagram of an electronic device in a first state according to one embodiment.

[0009] Figure 2b is a diagram of an electronic device in a second state according to one embodiment.

[0010] Figure 2c is an exploded perspective view of an electronic device according to an embodiment.

[0011] Figure 3a is a view of an electronic device in a first state in which a flexible printed circuit board is arranged with a display omitted according to one embodiment.

[0012] Figure 3b is a cross-sectional view of a flexible printed circuit board of an electronic device in a first state according to an embodiment.

[0013] Figure 3c is a cross-sectional view of a flexible printed circuit board of an electronic device in a second state according to an embodiment.

[0014] Figure 4a is a perspective view of a flexible printed circuit board according to one embodiment.

[0015] Figure 4b It is along Figure 4a A cross-sectional view of the flexible printed circuit board taken along line AA.

[0016] Figure 5a is a cross-sectional view of a flexible printed circuit board according to an embodiment.

[0017] Figure 5b is a diagram of an example of a plurality of signal lines according to an embodiment.

[0018] Figure 6a is a cross-sectional view of a flexible printed circuit board according to an embodiment.

[0019] Figure 6b is a diagram of an example of a plurality of signal lines according to an embodiment. DETAILED DESCRIPTION

[0020] Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings. When describing the embodiments with reference to the accompanying drawings, the same reference numerals represent the same elements, and repeated descriptions thereof will be omitted.

[0021] Figure 1 is a block diagram showing an electronic device in a network environment according to an embodiment. Figure 1, an electronic device (101) in a network environment (100) can communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) can communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), a sound output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a tactile module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a user identification module (196), or an antenna module (197). In some embodiments, at least one of the above components (e.g., the connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added to the electronic device (101). In some embodiments, some of the above components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into a single component (e.g., the display module (160)).

[0022] The processor (120) can run, for example, software (e.g., program (140)) to control at least one other component (e.g., hardware component or software component) of the electronic device (101) connected to the processor (120), and can perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor (120) can store commands or data received from another component (e.g., sensor module (176) or communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store the result data in a non-volatile memory (134). According to one embodiment, the processor (120) can include a main processor (121) (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor (123) (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor (121) in operation. For example, when the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be adapted to consume less power than the main processor (121), or may be adapted to be dedicated to a specific function. The auxiliary processor (123) may be implemented as a separate part from the main processor (121), or as a part of the main processor (121).

[0023] When the main processor (121) is in an inactive (e.g., sleep) state, the auxiliary processor (123) (rather than the main processor (121)) can control at least some of the functions or states related to at least one of the components of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)), or when the main processor (121) is in an active state (e.g., running an application), the auxiliary processor (123) can control at least some of the functions or states related to at least one of the components of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) together with the main processor (121). According to one embodiment, the auxiliary processor (123) (e.g., ISP or CP) can be implemented as part of another component (e.g., camera module (180) or communication module (190)) that is functionally related to the auxiliary processor (123). According to an embodiment, the auxiliary processor (123) (e.g., NPU) may include a hardware structure dedicated to artificial intelligence (AI) model processing. The AI ​​model may be generated by machine learning. For example, such learning may be performed by an electronic device (101) that executes artificial intelligence or via a separate server (e.g., server (108)). The learning algorithm may include, but is not limited to, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The AI ​​model may include multiple artificial neural network layers. The artificial neural network may include, for example, a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the AI ​​model may include a software structure in addition to the hardware structure.

[0024] The memory (130) may store various data used by at least one component of the electronic device (101), such as the processor (120) or the sensor module (176). The various data may include, for example, software (e.g., the program (140)) and input data or output data for commands related thereto. The memory (130) may include a volatile memory (132) or a non-volatile memory (134).

[0025] The program ( 140 ) may be stored as software in the memory ( 130 ), and may include, for example, an operating system ( 142 ), middleware ( 144 ), or an application ( 146 ).

[0026] The input module (150) can receive commands or data from outside the electronic device (101) (e.g., a user) to be used by other components of the electronic device (101) (e.g., the processor (120)). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0027] The sound output module (155) can output sound signals to the outside of the electronic device (101). The sound output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented as a separate part from the speaker, or as a part of the speaker.

[0028] The display module (160) can visually provide information to the outside of the electronic device (101) (e.g., a user). The display module (160) may include, for example, a control circuit for controlling a display, a holographic device, or a projector, and a control circuit system for controlling a corresponding one of the display, the holographic device, and the projector. According to one embodiment, the display module (160) may include a touch sensor adapted to sense a touch, or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0029] The audio module (170) can convert sound into an electrical signal, or vice versa. According to one embodiment, the audio module (170) can obtain sound via the input module (150), or output sound via the sound output module (155) or an external electronic device (e.g., an electronic device (102) such as a speaker or earphone) directly or wirelessly connected to the electronic device (101).

[0030] The sensor module (176) can detect an operating state (e.g., power or temperature) of the electronic device (101) or an environmental state (e.g., a user's state) outside the electronic device (101), and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0031] The interface (177) may support one or more specific protocols to be used to connect the electronic device (101) directly (e.g., wired) or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0032] The connection end (178) may include a connector, and the electronic device (101) can be physically connected to an external electronic device (e.g., the electronic device (102)) via the connector. According to one embodiment, the connection end (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0033] The haptic module (179) may convert the electrical signal into a mechanical stimulus (e.g., vibration or motion) or an electrical stimulus that can be recognized by the user via his sense of touch or kinesthetic sense. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0034] The camera module (180) may capture still images or moving images. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, ISPs, or flashes.

[0035] The power management module (188) can manage power supply to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as at least part of a power management integrated circuit (PMIC), for example.

[0036] The battery (189) can power at least one component of the electronic device (101). According to one embodiment, the battery (189) can include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0037] The communication module (190) can support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and perform communication via the established communication channel. The communication module (190) may include one or more communication processors capable of operating independently from the processor (120) (e.g., AP) and supporting direct (e.g., wired) communication or wireless communication. According to an example embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components (e.g., multiple chips) separated from each other. The wireless communication module (192) can identify and authenticate the electronic device (101) in a communication network (e.g., the first network (198) or the second network (199)) using user information (e.g., International Mobile Subscriber Identity (IMSI)) stored in the SIM 196.

[0038] The wireless communication module (192) can support 5G networks following 4G networks and next generation communication technologies, such as new radio (NR) access technologies. NR access technologies can support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable low latency communications (URLLC). The wireless communication module (192) can support high frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module (192) can support various technologies for ensuring performance on high frequency bands, such as, for example, beamforming, massive multiple input multiple output (massive MIMO), full dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module (192) can support various requirements specified in an electronic device (101), an external electronic device (e.g., an electronic device (104)), or a network system (e.g., a second network (199)). According to an embodiment, the wireless communication module (192) may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane latency for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0039] The antenna module (197) can transmit or receive a signal or power to or from the outside of the electronic device (101) (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiation element including a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, for example, at least one antenna suitable for a communication scheme used in a communication network (e.g., a first network (198) or a second network (199)) can be selected from the plurality of antennas by the communication module (190). A signal or power can be transmitted or received between the communication module (190) and the external electronic device via the selected at least one antenna. According to one embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiation element can be additionally formed as a part of the antenna module (197).

[0040] According to one embodiment, the antenna module (197) may form a millimeter wave antenna module. According to an example embodiment, the millimeter wave antenna module may include a PCB, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the PCB, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the PCB, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0041] At least some of the above components can be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0042] According to an example embodiment, a command or data may be sent or received between the electronic device (101) and the external electronic device (104) via a server (108) connected to the second network (199). Each of the external electronic devices (102) or (104) may be a device of the same type as the electronic device (101), or a device of a different type from the electronic device (101). According to one embodiment, all or some operations to be executed on the electronic device (101) may be executed in one or more of the external electronic device (102), the external electronic device (104), or the server (108). For example, if the electronic device (101) needs to automatically execute a function or service or needs to execute a function or service in response to a request from a user or another device, the electronic device (101) may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device (101) may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the requested function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as at least a partial reply to the request with or without further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology may be used. The electronic device (101) may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to an example embodiment, the external electronic device (104) or the server (108) may be included in the second network (199). The electronic device (101) may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or healthcare) based on 5G communication technology or IoT-related technologies.

[0043] The electronic device according to the embodiment may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance device. According to an exemplary embodiment of the present disclosure, the electronic device is not limited to the above-mentioned electronic devices.

[0044] It should be understood that the technical features set forth herein are not intended to be limited to specific embodiments according to various exemplary embodiments of the present disclosure and the terms used therein, but include various changes, equivalents or alternative forms for corresponding exemplary embodiments. In conjunction with the description of the accompanying drawings, the same reference numerals may be used for identical or related parts. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases of "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "A, B or C" may include any one or all possible combinations of the items listed together with the corresponding phrases in the multiple phrases. Terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the component from other components, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being "coupled to" or "coupled to" or "connected to" another element (e.g., the second element), "connected to" or "connected to" another element (e.g., the second element), with or without the terms "operably" or "communicatively", it means that the element may be directly (e.g., wired) coupled to the other element, wirelessly coupled to the other element, or coupled to the other element via a third element.

[0045] As used in connection with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to one embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0046] The various embodiments described herein may be implemented as software (e.g., program (140)) including one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) that can be read by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. In this document, the term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0047] According to one embodiment, the method according to the embodiment of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store TM ) The computer program product may be published (e.g., downloaded or uploaded) online, or the computer program product may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a manufacturer's server, an application store's server, or a memory of a forwarding server).

[0048] According to an embodiment, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities, and some entities in the multiple entities may be detachably arranged in different components. According to an embodiment, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to an embodiment, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. According to an embodiment, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

[0049] exist Figure 2a In the following figures, a spatial coordinate system defined by mutually orthogonal X-axis, Y-axis and Z-axis is shown. The X-axis may represent the width direction of the electronic device, the Y-axis may represent the length direction of the electronic device, and the Z-axis may represent the height (or thickness) direction of the electronic device.

[0050] Figure 2a is a diagram of an electronic device in a first state (eg, an unfolded or open state) according to one embodiment, Figure 2b is a diagram of an electronic device in a second state (eg, a folded or closed state) according to one embodiment, Figure 2c is an exploded perspective view of an electronic device according to an embodiment.

[0051] refer to Figure 2a to Figure 2c In one embodiment, the electronic device (201) (e.g., Figure 1 The electronic device (101) may include a pair of housings (210, 220) and a display (250) arranged in a space formed by the pair of housings (210, 220) (for example, Figure 1 In one embodiment, a surface of the electronic device (201) on which the display (250) is arranged (or a surface of the display (250) visible from the outside) can be defined as the front surface of the electronic device (201), and a surface opposite to the front surface can be defined as the rear surface of the electronic device (201). A surface surrounding a space between the front surface and the rear surface can be defined as a side surface of the electronic device (201).

[0052] In one embodiment, an electronic device (e.g., Figure 1The electronic device (101) may include a first housing (210), a second housing (220), a first back cover (215), a second back cover (225), a hinge structure (230), a display (250), a printed circuit board (270), and a flexible printed circuit board (290). In one embodiment, the electronic device (201) may not be limited to Figure 2a and Figure 2b The shapes and combination relationships shown in the figure can have different structural component combination relationships.

[0053] In one embodiment, the first shell (210) and the second shell (220) may be arranged on both sides of the folding axis (A) and may be substantially symmetrical about the folding axis (A). In one embodiment, the angle or distance formed by the first shell (210) and the second shell (220) may vary according to the state of the electronic device (201). For example, depending on whether the electronic device (201) is in a state such as Figure 2a The first state (eg, the expanded state) shown in FIG. Figure 2b In the second state shown (for example, the folded state), or in an intermediate state between the first state and the second state, the distance or angle formed by the first shell (210) and the second shell (220) to each other (or between the first shell (210) and the second shell (220)) can change.

[0054] In one embodiment, the first housing (210) may include: a first surface facing the front of the electronic device (201), a second surface opposite to the first surface, and a first side portion covering at least a portion of the space between the first surface and the second surface. The second housing (220) may include: a third surface facing the front of the electronic device (201), a fourth surface opposite to the third surface, and a second side portion covering at least a portion of the space between the third surface and the fourth surface. When the electronic device (201) is in a state such as Figure 2b In the folded position shown, the first surface and the third surface may face each other.

[0055] In one embodiment, the first housing (210) and the second housing (220) may form a recess, the front surface of which is open to accommodate the display (250). In one embodiment, at least a portion of the first housing (210) and the second housing (220) may be formed of a metal material or a non-metal material having appropriate rigidity to support the display (250). In one embodiment, at least a portion of the first housing (210) and the second housing (220) formed of a metal material may provide a ground plane for the electronic device (201) and may be electrically connected to a ground line formed on a printed circuit board (270) disposed inside the electronic device (201).

[0056] In one embodiment, the electronic device (201) may include at least one component for performing various functions, wherein the component is exposed on the front surface of the electronic device (201) through at least one opening formed in the front surface of the foldable electronic device (201). For example, the component may include at least one of a front camera module, a receiver, a proximity sensor, an illumination sensor, an iris recognition sensor, an ultrasonic sensor, or an indicator.

[0057] In one embodiment, the first back cover (215) and the second back cover (225) may be arranged on the rear surface of the electronic device (201). For example, the first back cover (215) may be arranged on the second surface of the first housing (210), and the second back cover (225) may be arranged on the fourth surface of the second housing (220). At least a portion of the edge of the first back cover (215) may be covered by the first housing (210), and at least a portion of the edge of the second back cover (225) may be covered by the second housing (220).

[0058] In one embodiment, the first rear cover (215) and the second rear cover (225) may have a substantially symmetrical shape based on the folding axis (A). In one embodiment, the first rear cover (215) and the second rear cover (225) may have different shapes. In one embodiment, the first housing (210) and the first rear cover (215) may be integrally formed, and the second housing (220) and the second rear cover (225) may be integrally formed.

[0059] In an example embodiment, the first housing (210), the second housing (220), the first back cover (215), and the second back cover (225) may be connected to each other through a structure that provides a structure for arranging various components (e.g., PCB, Figure 1 Antenna module (197), Figure 1 A sensor module (176) or Figure 1 In an example embodiment, at least one component may be visibly exposed on the rear surface of the electronic device (201). For example, at least a portion of the sub-display may be visibly exposed through the first rear region 216 of the first rear cover (215). In one embodiment, at least one component may be visibly exposed through the second rear region 226 of the second rear cover (225). In this case, the component may include a proximity sensor, a rear camera module, and / or a flash.

[0060] In one embodiment, the display (250) may be arranged in a space formed by the foldable housing 201. For example, the display (250) may be arranged in a recess formed by a pair of housings (210, 220). The display (250) may be arranged to constitute a majority of the front surface of the electronic device (201). The front surface of the electronic device (201) may include an area for accommodating the display (250), a partial area (e.g., an edge area) of the first housing (210) adjacent to the display (250), and a partial area (e.g., an edge area) of the second housing (220). The rear surface of the electronic device (201) may include a first rear cover (215), a partial area (e.g., an edge area) of the first housing (210) adjacent to the first rear cover (215), a second rear cover (225), and a partial area (e.g., an edge area) of the second housing (220) adjacent to the second rear cover (225). In one embodiment, at least a partial area of ​​the display (250) may be deformed into a flat surface or a curved surface.

[0061] In one embodiment, at least a portion of the display (250) can be deformed. In one embodiment, the display (250) can include: a folding area (250c) arranged along the folding axis (A), a folding area (250c) arranged on the first side (e.g., Figure 2a The first area (250a) is arranged on the left side of the folding area (250c), and the second area (for example, Figure 2a In one embodiment, the first area (250a) may be supported by the first housing (210), and the second area (250b) may be supported by the second housing (220). However, the area division of the display (250) shown is exemplary, and the display (250) may be divided into a plurality of areas according to the structure or function of the display (250). For example, Figure 2a As shown, the display (250) can be divided into multiple regions based on the folding area 203 extending parallel to the folding axis (A). In another example, the display (250) can be divided into multiple regions based on another folding axis (e.g., a folding axis parallel to the width direction of the electronic device).

[0062] According to one embodiment, the display (250) may be coupled to or disposed adjacent to a touch panel in which a touch sensing circuit and a pressure sensor configured to measure touch intensity (or pressure) are disposed. For example, as an example of a touch panel, the display (250) may be coupled to or disposed adjacent to a touch panel for detecting an electromagnetic resonance (EMR) type stylus.

[0063] According to one embodiment, the first region (250a) and the second region (250b) may generally have a symmetrical shape based on the folding region (250c). In one embodiment, a notch that is at least partially cut to expose the sensor may be formed in at least one of the first region (250a) and the second region (250b). For example, the first region (250a) and the second region (250b) may include portions having mutually symmetrical shapes and portions having mutually asymmetrical shapes.

[0064] In one embodiment, the hinge structure (230) may be arranged between the first housing (210) and the second housing (220), and may include a hinge cover (265) covering the space between the first housing (210) and the second housing (220). Figure 2a In the first state shown, the hinge cover (265) can be shielded by the first shell (210) and the second shell (220) without being exposed to the outside, and when the electronic device (201) is in the state shown Figure 2b In the second state shown, the hinge cover (265) can be visibly exposed to the outside between the first shell (210) and the second shell (220).

[0065] When the electronic device (201) is in the process of forming Figure 2a The first state and Figure 2b When the hinge cover (265) is in an intermediate state between the angle of the first housing (210) and the second housing (220), at least a portion of the hinge cover (265) may be exposed to the outside between the first housing (210) and the second housing (220). In this case, the area of ​​the hinge cover (265) exposed to the outside may be smaller than the exposed area of ​​the hinge cover (265) in the second state (e.g., folded state) of the electronic device (201). In one embodiment, the hinge cover (265) may include a curved shape.

[0066] In one embodiment, when the electronic device (201) is in a first state (eg, Figure 2a In one embodiment, when the electronic device (201) is in the unfolded state, as the first shell (210) is rotated to a second angle (e.g., about 360 degrees) relative to the second shell (220), the second surface and the fourth surface can be folded in the opposite direction to face each other as the first shell (210) and the second shell (220) are rotated to a second angle (e.g., about 360 degrees) relative to the second shell (220).

[0067] In one embodiment, when the electronic device (201) is in the second state (eg, Figure 2b In the folded state (folded state), the first housing (210) and the second housing (220) may face each other. In this case, a narrow angle (e.g., 0 to 10 degrees) may be formed between the first area (250a) and the second area (250b) of the display (250) and they may face each other. In this case, at least a portion of the folded area (250c) of the display (250) may be deformed into a curved surface.

[0068] In one embodiment, when the electronic device (201) is in an intermediate state between the first state and the second state (e.g., an intermediate open state), the first housing (210) and the second housing (220) may be arranged to form a predetermined angle. The angle formed by the surface of the first region (250a) and the surface of the second region (250b) of the display (250) may be greater than the angle in the second state (e.g., a folded state) and smaller than the angle in the first state (e.g., a fully open state). At least a portion of the folded region (250c) may include a curved surface, in which case the curvature may be smaller than the curvature in the second state (e.g., a folded state).

[0069] In one embodiment, the display (250) may include a display panel (251) (e.g., a flexible display panel) and at least one plate (252) or layer arranged on a rear surface of the display panel (251).

[0070] In one embodiment, the display panel (251) may include a flexible display substrate, a plurality of display elements coupled to the display substrate to form pixels, one or more wires coupled to the display substrate and electrically connected to other display elements, and a thin film encapsulation layer configured to prevent external oxygen and moisture from flowing in. The display panel (251) may include a touch panel, or the display panel (251) and the touch panel may be integrally formed.

[0071] The display substrate may be formed of a flexible material (e.g., a plastic material such as polyimide (PI)), but the material of the display substrate is not limited thereto and may include other flexible materials. A plurality of display elements may be arranged on the display substrate and form some pixels. For example, a plurality of display elements may be arranged in a matrix form on the display substrate to form pixels of the display panel (251). In this case, the plurality of display elements may include a fluorescent material or an organic fluorescent material that can express a color. For example, the display element may include an organic light emitting diode (OLED). The wire may include one or more gate signal lines or one or more data signal lines. For example, the wire may include a plurality of gate signal lines and a plurality of data signal lines, and the plurality of gate signal lines and the plurality of data signal lines may be arranged in a matrix form. In this case, a plurality of display elements may be arranged near the point where the plurality of lines intersect, and may be electrically connected to each line. A thin film encapsulation layer may cover the display substrate, the plurality of display elements, and the wire, thereby preventing the inflow of external oxygen and moisture. In one embodiment, the thin film encapsulation layer may be formed by alternately stacking one or more organic film layers with one or more inorganic film layers.

[0072] In one embodiment, the touch panel may be formed integrally with the display panel (251), or attached to the display panel (251). For example, the touch panel may be formed by patterning an aluminum metal grid sensor on a thin film encapsulation layer of the display panel (251).

[0073] In one embodiment, a polarizing film may be stacked between the display panel (251) and the touch panel. The polarizing film may improve the visibility of the display (250). The polarizing film may change the phase of light passing through the display (250). For example, the polarizing film may convert linear polarized light into circular polarized light, or convert circular polarized light into linear polarized light, thereby preventing reflection of light incident on the display panel (251).

[0074] The window layer can be formed by a transparent plastic film with high flexibility and high hardness. For example, the window layer can be formed by a PI or polyethylene terephthalate (PET) film. In one embodiment, the window layer can be formed as a multilayer including multiple plastic films.

[0075] In one embodiment, the plate (252) can support the rear surface of the display panel (251), thereby improving the impact resistance of the display panel (251). In one embodiment, the plate (252) can be divided into a plurality of regions to respectively support the rear surface of the first region (250a) and the rear surface of the second region (250b) of the display panel (251). In this case, the respective regions of the plate (252) can be individually attached to the rear surface of the first region (250a) and the rear surface of the second region (250b) of the display (250), so as not to contact each other along the folding axis (A). According to this structure, the plate (252) does not interfere with the folding operation of the display (250) along the folding axis (A).

[0076] In one embodiment, the plate (252) may be formed of a conductive material (e.g., copper or an alloy material including copper). In this case, the plate 251 may serve as a heat transfer path for transferring heat generated by internal components (e.g., AP) of the electronic device (201) to the display panel (251) while improving the impact resistance of the display (250).

[0077] The hinge structure (230) may include a first support plate (231), a second support plate (232), a hinge housing (234) between the first support plate (231) and the second support plate (232), and a flexible printed circuit board (290) arranged to span the first support plate (231) and the second support plate (232). In one embodiment, the flexible printed circuit board (290) may be an FPCB.

[0078] In one embodiment, the first support plate (231) may be disposed behind the first region (250a) of the display (250), and the second support plate (232) may be disposed behind the second region (250b) of the display (250). In one embodiment, the first support plate (231) may be connected to a first side (e.g., Figure 2c -X direction), the second support plate (232) can be connected to the second side of the hinge housing (234) (for example, Figure 2c The first support plate (231) can be inserted into the first space (210a) inside the first shell (210), and the second support plate (232) can be inserted into the second space (220a) inside the second shell (220), so that the first shell (210) and the second shell (220) can be connected to the hinge structure (230).

[0079] In one embodiment, the first housing (210) may include a first rotation support surface (214), and the second housing (220) may include a second rotation support surface 224 corresponding to the first rotation support surface (214). The first rotation support surface (214) and the second rotation support surface 224 may include curved surfaces corresponding to the curved surfaces included in the hinge cover (265).

[0080] In one embodiment, when the electronic device (201) is in the unfolded state (eg, Figure 2a The first rotation support surface (214) and the second rotation support surface (224) may cover the hinge cover (265) so that the hinge cover (265) may not be exposed through the rear surface of the electronic device (201) or may be exposed to a minimum extent. Meanwhile, when the electronic device (201) is in a folded state (e.g., Figure 2b The electronic device (201)), the first rotation support surface (214) and the second rotation support surface 224 can be rotated along the curved surface included in the hinge cover (265), so that the hinge cover (265) can be exposed to the maximum extent through the rear surface of the electronic device (201).

[0081] In one embodiment, the printed circuit board (270) may include a first printed circuit board (271) arranged on the side of the first support plate (231) and a second printed circuit board (272) arranged on the side of the second support plate (232). The first printed circuit board (271) and the second printed circuit board (272) may be arranged inside a space formed by the hinge structure (230), the first housing (210), the second housing (220), the first back cover (215) and the second back cover (225). For example, the first printed circuit board (271) may be arranged in the first space (210a) inside the first housing (210), and the second printed circuit board (272) may be arranged in the second space (220a) inside the second housing (220). In this case, the first printed circuit board (271) may be arranged between the first support plate (231) and the rear surface of the first housing (210), and the second printed circuit board (272) may be arranged between the second support plate (232) and the rear surface of the second housing (220). Components for implementing various functions of the electronic device (201) may be mounted on the first printed circuit board (271) and the second printed circuit board (272).

[0082] In one embodiment, the flexible printed circuit board (290) can connect components arranged inside the first shell (210) and the second shell (220). For example, the flexible printed circuit board (290) can connect a first electronic or electrical component arranged inside the first shell (210) (e.g., inside the first space) and a second electronic or electrical component arranged inside the second shell (220) (e.g., inside the second space). In an example, the flexible printed circuit board (290) can connect a first flexible printed circuit board 271 (e.g., arranged in the first space (210a) inside the first shell (210)) to a second flexible printed circuit board 272 (e.g., arranged in the second space 220a inside the second shell 210). In some examples, the flexible printed circuit board (290) can be connected to the hinge structure 230. At least a portion of the flexible printed circuit board (290) may be arranged in a space formed by the hinge housing (234), and both ends of the flexible printed circuit board (290) may extend to the first space (210a) and the second space (220b) by respectively penetrating the first support plate (231) and the second support plate (232). In one embodiment, the flexible printed circuit board (290) may be arranged in a direction perpendicular to the folding axis (A) of the electronic device (201) (e.g., Figure 2c in the X-axis direction).

[0083] Figure 3a is a view of an electronic device in a first state (eg, unfolded state) in which a flexible printed circuit board is arranged with a display omitted according to one embodiment, Figure 3b is a cross-sectional view of a flexible printed circuit board of an electronic device in a first state according to an embodiment, Figure 3c is a cross-sectional view of a flexible printed circuit board of an electronic device in a second state (eg, a folded state) according to an embodiment.

[0084] refer to Figure 3a to Figure 3c In one embodiment, the electronic device (301) (e.g., Figure 1 An electronic device (101) and Figure 2a The electronic device (201) may include a display (350), a first housing (310), a second housing (320), a hinge structure (340) and a flexible printed circuit board (390).

[0085] In one embodiment, the display (350) may include a first region (350a) and a second region (350b), wherein the display (350) may be folded (or bent) based on a folding axis. That is, the display (350) may be folded or bent along the folding axis so that the first region (350a) and the second region (350b) form regions of the display (350) located on both sides of the folding axis. Figure 3bIn the first state (eg, unfolded state) shown, the first region (350a) and the second region (350b) of the display (350) may form substantially the same plane. Figure 3c In the second state (eg, folded state) shown, the first region (350a) and the second region (350b) of the display (350) may face each other.

[0086] In one embodiment, the first housing (310) and the second housing (320) may be rotatably connected to a hinge structure (340) located on a folding axis. In one embodiment, the first housing (310) may form a first space (310a) on a rear surface of the first region (350a), and the second housing (320) may form a second space (320a) on a rear surface of the second region (350b).

[0087] In one embodiment, the hinge structure (340) can rotatably connect the first housing (310) to the second housing (320). In one embodiment, the hinge structure (340) can include a hinge housing (334), a first support plate (331) and a second support plate (332). In one embodiment, a hinge space (334a) can be formed in the hinge housing (334).

[0088] In one embodiment, the first support plate (331) and the second support plate (332) may be rotatably connected to the hinge housing (334) based on the folding axis. For example, the first support plate (331) may connect the first housing (310) to the hinge housing (334), and the second support plate (332) may connect the second housing (320) to the hinge housing (334). In one embodiment, at least a portion of the first support plate (331) may be arranged in the first space (310a), and at least a portion of the second support plate (332) may be arranged in the second space (320a). In one embodiment, at least one first opening (331a) penetrating the surface of the first support plate (331) may be formed in the first support plate (331), and at least one second opening (332a) penetrating the surface of the second support plate (332) may be formed in the second support plate (332).

[0089] In one embodiment, the flexible printed circuit board (390) can electrically connect the components arranged in the first space (310a) and the second space (320a), for example, by connecting the first printed circuit board (e.g., Figure 2c The first printed circuit board (271) is electrically connected to the second printed circuit board (e.g., Figure 2cIn one embodiment, the flexible printed circuit board (390) can extend from the first space (310a) to the second space (320a) in an extension direction (e.g., an X-axis direction, in the direction of the longitudinal length of the flexible printed circuit board, along its extension length, i.e., the direction in which the flexible printed circuit board extends in a direction perpendicular to the folding axis) while spanning (e.g., extending across) the folding axis. In one embodiment, at least a portion of the flexible printed circuit board (390) can be arranged in a hinge space (334a) formed by the hinge housing (334). Both ends of the flexible printed circuit board (390) can extend to the first space (310a) and the second space (320a) through the first opening (331a) and the second opening (332a), respectively.

[0090] In one embodiment, the flexible printed circuit board (390) can be divided into a plurality of regions based on the extension direction (e.g., the X-axis direction, the longitudinal length of the FPCB). For example, the flexible printed circuit board (390) can include a driving region (e.g., Figure 4a a driving region (391)), a first fixed region (eg, Figure 4a The first fixed area (392A) of Figure 4a The second fixed area (392B)).

[0091] In one embodiment, at least a portion of the driving region (391) of the flexible printed circuit board (390) can be arranged in the hinge housing (334), and both ends of the driving region (391) can extend to the first support plate (331) and the second support plate (332), respectively. In the example, the driving region (391) of the flexible printed circuit board (390) refers to a region that can be repeatedly driven (e.g., externally driven or bent, subjected to force) at a certain angle when the foldable device is in an open (or unfolded) state and a closed (or folded) state. In the example, the driving region (391) can also be referred to as a bending region, a flexible region, or a deformable region. That is, in one embodiment, at least a portion of the driving region (391) can be bent in response to a change in the folding angle of the electronic device (301) (e.g., such as a change driven by a user). In one embodiment, the driving region (391) may include a central portion (3911), a first curved portion (3912a) and a second curved portion (3912b), wherein the first curved portion (3912a) and the second curved portion (3912b) are respectively connected to both ends of the central portion (3911).

[0092] In one embodiment, the central portion (3911) may be arranged in the hinge space (334a). In one embodiment, the first curved portion (3912a) may extend from the central portion (3911) to the first support plate (331). The second curved portion (3912b) may extend from the central portion (3911) to the second support plate (332). For example, the first curved portion (3912a) may extend from the hinge space (334a) to the surface of the first support plate (331), and the second curved portion (3912b) may extend from the hinge space (334a) to the surface of the second support plate (332). In one embodiment, the first curved portion (3912a) and the second curved portion (3912b) may be partially bent in response to a change in the folding angle of the electronic device (301). For example, in response to a change in the folded state of the electronic device (301), the first bending portion (3912a) and the second bending portion (3912b) may be bent and the shape of the driving region (391) of the flexible printed circuit board (390) may be changed.

[0093] In one embodiment, the first fixing region (392A) may extend from the driving region (391) to the first space (310a), and the second fixing region (392B) may extend from the driving region (391) to the second space (320a). In one embodiment, at least a portion of the first fixing region (392A) may be fixed to the first shell (310), and at least a portion of the second fixing region (392B) may be fixed to the second shell (320). In one embodiment, the first fixing region (392A) may include a portion extending in a direction opposite to the central portion (3911) (e.g., Figure 3b The second fixing region (392B) may include a first extension portion (3921) extending from the first bent portion (3912a) in a direction opposite to the central portion (3911) (e.g., Figure 3b A second extending portion (3922) extends from the second bent portion (3912b) in the +X direction (in the +X direction).

[0094] In one embodiment, at least a portion of the first extension portion (3921) can be fixed to the first shell (310). For example, the end of the first extension portion (3921) connected to the first bent portion (3912a) can be fixed to the first support plate (331). The first extension portion (3921) can pass through the first opening (331a) and can extend from the surface of the first support plate (331) to the inside of the first space (310a). The end of the first extension portion (3921) extending to the inside of the first space (310a) can be fixed in the first space (310a). For example, the end of the first extension portion (3921) extending to the inside of the first space (310a) can be connected to a component arranged in the first space (310a), for example, a first printed circuit board (e.g., Figure 2c The first printed circuit board (271) of the second extension portion (3922) can be fixed to the second shell (320). In one embodiment, at least a portion of the second extension portion (3922) can be fixed to the second shell (320). For example, the end of the second extension portion (3922) connected to the second bent portion (3912b) can be fixed to the second support plate (332). The second extension portion (3922) can pass through the second opening (332a) and can extend from the surface of the second support plate (332) to the inside of the second space (320a). The end of the second extension portion (3922) extending to the inside of the second space (320a) can be fixed in the second space (320a). For example, the end of the second extension portion (3922) extending to the inside of the second space (320a) can be connected to a component arranged in the second space (320a), for example, a second printed circuit board (e.g., Figure 2c A second printed circuit board (272)).

[0095] In one embodiment, the flexible printed circuit board (390) may be fixed to the first support plate (331) and the second support plate (332). In one embodiment, the flexible printed circuit board (390) may include a first fastening member (3931) fixed to the first support plate (331) and a second fastening member (3932) fixed to the second support plate (332). For example, Figure 3b In the first state shown, the first fastening member (3931) can fix a portion of the flexible printed circuit board (390) to the surface of the first support plate (331) facing the display (350), and the second fastening member (3932) can fix a portion of the flexible printed circuit board (390) to the surface of the second support plate (332) facing the display (350). In one embodiment, the fastening member (393) can be connected to the surface of the first support plate (331) or the second support plate (332) by a connecting member (e.g., a screw and a fastening member). In one embodiment, based on the state (or direction) in which the display (350) is viewed (e.g., along Figure 3b In one embodiment, the first fastening member (3931) may overlap with the drive region (391) and the first fixed region (392A) when the display (350) is viewed from above (e.g., when viewed from below, or in the -Z direction). That is, in the example, when the display (350) is viewed from above (e.g., when viewed from below, or in the -Z direction), the first fastening member (3931) may overlap with the drive region (391) and the first fixed region (392A). For example, the first fastening member (3931) may overlap with the first curved portion (3912a) and the first extending portion (3921). In one embodiment, based on the state in which the display (350) is viewed (e.g., along the -Z direction), the first fastening member (3931) may overlap with the drive region (391) and the first fixed region (392A). Figure 3b In the state of being observed in the -Z direction of the display (350), the second fastening member (3932) may overlap with the driving region (391) and the second fixing region (392B). That is, in one example, when the display (350) is observed from above (e.g., when observed downward, or in the -Z direction), the second fastening member (3932) may overlap with the driving region (391) and the second fixing region (392B). For example, the second fastening member 3932 may overlap with the second curved portion 3912b and the second extending portion 3922.

[0096] In one embodiment, as the shape and position of the drive region (391) relative to the hinge housing (334) changes in response to the change in the folding angle, the overall shape of the flexible printed circuit board (390) can change in response to the shape of the electronic device (301). For example, when the electronic device (301) changes from a first state (e.g., Figure 3b ) changes to a second state (e.g., Figure 3cIn the folded state of the electronic device (301), the position of the driving region (391) relative to the hinge housing (334) (e.g., the position in the Z-axis direction) can change, while the first curved portion (3912a) and the second curved portion (3912b) are bent, and the shape of the driving region (391) changes in response to the change in the folding angle of the electronic device (301). In this case, since the first fixed region (392A) and the second fixed region (392B) are partially fixed to the first housing (310) and the second housing (320), respectively, the first fixed region (392A) and the second fixed region (392B) of the flexible printed circuit board 392 can maintain a constant shape (e.g., can maintain or substantially maintain a current shape) in the electronic device (301). For example, compared with the driving region (391), the first fixed region (392A) and the second fixed region (392B) can maintain a relatively constant shape. In one embodiment, in response to the change in the folding angle of the electronic device (301), a relatively large stress can be concentrated on the driving region (391) compared with the fixed region. That is, since the fixed regions (392A and 392B) of the flexible printed circuit board (390) can be at least partially fixed to the corresponding housing, the shape (or position) of these regions of the flexible printed circuit board (390) remains substantially constant (for example, experiencing very little bending when the folding angle of the electronic device (301) changes), and these regions are subject to reduced stress compared to the driving region (391) (for example, the first curved portion (3912a) and the second curved portion (3912b)) that deforms or bends in response to changes in the folding angle.

[0097] Figure 4a is a perspective view of a flexible printed circuit board according to an embodiment, Figure 4b It is along Figure 4a A cross-sectional view of the flexible printed circuit board taken along line AA.

[0098] refer to Figure 4a and Figure 4b , a flexible printed circuit board (390) in one embodiment (e.g., Figure 2c The flexible printed circuit board (290) may include a driving area (391), a first fixing area (392A), and a second fixing area (392B) divided along an extension direction (e.g., an X-axis direction, along the longitudinal length of the flexible printed circuit board, that is, along the direction in which the flexible printed circuit board extends). In one embodiment, the first fixing area (392A) and the second fixing area (392B) may be connected to the driving area (391) relative to each other (e.g., the fixing areas of the flexible printed circuit board (390) may be formed on both sides of the driving area (391)). For example, based on Figure 4a, the first fixing region (392A) can be connected to the left side (e.g., -X axis direction) of the driving region (391), and the second fixing region (392B) can be connected to the right side (e.g., +X axis direction) of the driving region (391). In one embodiment, the first fastening member (3931) can be arranged at the connection portion between the driving region (391) and the first fixing region (392A), and the second fastening member (3932) can be arranged at the connection portion between the driving region (391) and the second fixing region (392B).

[0099] In one embodiment, the driving region (391) may include: a hinge housing (eg, Figure 3b A central portion (3911) in the hinge housing (334) of the present invention, a first bent portion (3912a) extending from the central portion (3911) to the first fastening member (3931) and at least partially bent, and a second bent portion (3912b) extending from the central portion (3911) to the second fastening member (3932) and at least partially bent.

[0100] In one embodiment, the first fixing region (392A) may include a first extension portion (3921) extending from the first fastening member (3931) in a direction opposite to the central portion (3911). The second fixing region (392B) may include a second extension portion (3922) extending from the second fastening member (3932) in a direction opposite to the central portion (3911). In one embodiment, at least a portion of the first extension portion (3921) may be fixed to the first housing (e.g., Figure 3b The first housing (310) of FIG. 1 ), and at least a portion of the second extension portion (3922) may be fixed to the second housing (e.g., Figure 3b In one embodiment, the second housing (320) is used to connect to a first component (e.g., Figure 2c The first connector 398a of the first printed circuit board (271) can be arranged on the first extension portion (3921). For connecting to the second component (e.g., Figure 2c The second connector 398b of the second printed circuit board (272) can be arranged on the second extension portion (3922).

[0101] In one embodiment, the flexible printed circuit board (390) may include a multilayer structure. That is, the flexible printed circuit board (390) may be formed of multiple layers (or multiple layer portions). In one embodiment, based on the cross-sectional view, the flexible printed circuit board (390) may include (or be formed of) a first layer portion (494), a second layer portion (495), and a connecting layer (496) connecting the first layer portion (494) to the second layer portion (495). In one embodiment, as Figure 4b As shown, the flexible printed circuit board (390) can be arranged (or positioned) inside the electronic device so that the first layer portion (494) faces the hinge housing and the second layer portion (495) faces the rear surface of the display.

[0102] In one embodiment, the first layer portion (494) may include (eg, may be formed from) a first base layer (4944), a first metal layer (4943), a first adhesive layer (4942), and a first cover layer (4941).

[0103] In one embodiment, the first substrate layer (4944) may include (or be formed of) a PI material. In one embodiment, the first substrate layer (4944) may include a first substrate surface and a second substrate surface opposite to the first substrate surface. In one embodiment, based on the state in which the flexible printed circuit board (390) is arranged (or positioned) inside the electronic device, such as Figure 4b As shown, the first substrate surface may face the rear surface of the display (eg, +Z axis direction), and the second substrate surface may face the hinge housing (eg, -Z axis direction).

[0104] In one embodiment, the first metal layer (4943) may be arranged on the first substrate surface of the first substrate layer (4944). The first metal layer (4943) may be formed of a conductive material (e.g., copper (Cu)). In one embodiment, the first metal layer (4943) may be formed on a plurality of signal lines (e.g., signal lines 20, 21, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, 101, 102, 113, 114, 115, 116, 117, 118, 119, 119, 120, 121, 122, 123, 124, 125, 126, 127, 130, 131, 132, 1 Figure 5b Signal lines (5946)). For example, a pattern of multiple signal lines for transmitting signals can be formed on the first metal layer (4943) by a process such as etching. The multiple signal lines can be formed to pass through the driving area (391) and extend from the first fixed area (392A) to the second fixed area (392B) (and send signals from the first fixed area (392A) to the second fixed area (392B)). In one embodiment, the signal lines formed in the first metal layer (4943) can be formed as substantially straight lines in the extension direction to perform high-speed signal transmission.

[0105] In one embodiment, the first covering layer (4941) can be stacked along the direction of the second substrate surface to cover the first metal layer (4943), for example, a plurality of signal lines. By covering the surface of the first metal layer (4943), the first covering layer (4941) can prevent damage to the plurality of signal lines formed on the first metal layer (4943). The first covering layer (4941) can be formed of a dielectric material. For example, the first covering layer (4941) can be formed of PET. In one embodiment, the first covering layer (4941) can have different thicknesses depending on the area of ​​the flexible printed circuit board (390). A description thereof will be provided later.

[0106] In one embodiment, the first adhesive layer (4942) may be disposed or positioned between the first metal layer (4943) and the first cover layer (4941). In one embodiment, the first adhesive layer (4942) may connect the first metal layer (4943) to the first cover layer (4941) to fill the empty space of the first metal layer (4943), and the surface of the first metal layer (4943) is etched to form a pattern of the signal line.

[0107] In one embodiment, the second layer portion (495) may be stacked on the first layer portion (494) along the first substrate surface direction of the first substrate layer (4944). In one embodiment, the second layer portion (495) may include a second substrate layer (4954), a second metal layer (4953), a second adhesive layer (4952) and a second covering layer (4951).

[0108] In one embodiment, the second substrate layer (4954) may be stacked on the first substrate layer (4944) opposite to the first metal layer (4943). For example, the second substrate layer (4954) may be stacked in the direction of the first substrate surface of the first substrate layer (4944). In one embodiment, the first substrate layer (4944) may include a PI material.

[0109] In one embodiment, the second metal layer (4953) may be arranged on the surface of the second base layer (4954) opposite to the first base layer (4944). The second metal layer (4953) may be formed of a conductive material (e.g., copper (Cu)). In one embodiment, the second metal layer (4953) may form a signal line extending from the first fixed area (392A) to the second fixed area (392B). In one embodiment, the second cover layer (4951) may be arranged on the second base layer (4954) to cover the second metal layer (4953). The second cover layer (4951) may be formed of a dielectric material (e.g., PET). In one embodiment, the second cover layer (4951) may be formed integrally to be continuous in the first fixed area (392A), the driving area (391), and the second fixed area (392B). In one embodiment, the second adhesive layer (4952) may be between the second metal layer (4953) and the second cover layer (4951). In one embodiment, the second adhesive layer (4952) may connect the second metal layer (4953) to the second covering layer (4951) to fill the empty space of the second metal layer (4953), and the surface of the second metal layer (4953) is etched to form a pattern of the signal line.

[0110] In one embodiment, the connecting layer (496) may be disposed between the first layer portion (494) and the second layer portion (495). In one embodiment, the connecting layer (496) may be formed of, for example, a polypropylene (PP) material.

[0111] In one embodiment, when the flexible printed circuit board (390) is formed to have a double-layer structure including a first layer portion (494) and a second layer portion (495), compared with a flexible printed circuit board structure having a greater number of layers, for example, the thickness of the flexible printed circuit board (390) can be reduced, and an electronic device (e.g., Figure 3a The thickness of the electronic device (301) can also be reduced. That is, according to the example, the double-layer structure can reduce the thickness of the electronic device.

[0112] Figure 5a is a cross-sectional view of a flexible printed circuit board according to an embodiment, Figure 5b is a diagram of an example of a plurality of signal lines according to an embodiment.

[0113] refer to Figure 5a and Figure 5b , the flexible printed circuit board (590) in the embodiment (e.g., Figure 2c Flexible printed circuit board (290) and Figure 4aThe flexible printed circuit board (390) may include a driving region (591), a first fixed region (592A) and a second fixed region (592B). The flexible printed circuit board (590) may be formed so that the thickness of the driving region (591) is different from at least one of the thickness of the first fixed region (592A) and the thickness of the second fixed region (592B). For example, the thickness of the driving region (591) may be greater than the thickness of the first fixed region (592A) and the thickness of the second fixed region (592B).

[0114] In one embodiment, the flexible printed circuit board (590) may include a first layer portion (594), a second layer portion (595), and a connection layer (596) connecting the first layer portion (594) to the second layer portion (595). In an embodiment, the first layer portion (594) includes a first base layer (5944), a first metal layer (5943), a first adhesive layer (5942), and a first covering layer (5941). The second layer portion (595) includes a second base layer (5954), a second metal layer (5953), a second adhesive layer (5952), and a second covering layer (5951). In one embodiment, the thickness of the first layer portion (594) in the driving area (591) may be different from the thickness of the first layer portion (594) in the first fixed area (592A) and the thickness of the first layer portion (594) in the second fixed area (592B).

[0115] In one embodiment, the first covering layer (5941) may include: a first covering portion (5941a) arranged in the driving region (591) and having a first thickness (t1), a second covering portion (5941b) arranged in the first fixing region (592A) and having a second thickness (t2) different from the first thickness (t1), and a third covering portion (5941c) arranged in the second fixing region (592B) and having a third thickness (t3) different from the first thickness (t1). In one embodiment, the first covering portion (5941a), the second covering portion (5941b), and the third covering portion (5941c) may be formed separately. For example, the first covering portion (5941a), the second covering portion (5941b), and the third covering portion (5941c) may be formed separately and arranged on the first base layer (5944) to cover the first metal layer (5943). In one embodiment, based on the extension direction (e.g., the X-axis direction), the first fastening member 5931 can be arranged on the boundary of the first covering portion (5941a) and the second covering portion (5941b), and the second fastening member 5932 can be arranged on the boundary of the first covering portion (5941a) and the third covering portion (5941c).

[0116] In one embodiment, the first thickness (t1) of the first covering portion (5941a) may be greater than the second thickness (t2) of the second covering portion (5941b) and the third thickness (t3) of the third covering portion (5941c). For example, the first thickness (t1) may be approximately twice the second thickness (t2) or the third thickness (t3). In one embodiment, the second thickness (t2) of the second covering portion (5941b) may be substantially the same as the third thickness (t3) of the third covering portion (5941c). In one example, the first thickness (t1) may be greater than the second thickness (t2) and the third thickness (t3), wherein the second thickness (t2) and the third thickness (t3) are substantially the same. In one embodiment, when the first thickness (t1) of the first covering portion (5941a) is greater than the second thickness (t2) of the second covering portion (5941b) and the third thickness (t3) of the third covering portion (5941c), the durability of the driving region (591) that changes its shape in response to a change in the folding angle can be improved compared to the fixed region (e.g., the first fixed region (592A) or the second fixed region (592B)). Since the first fixed region (592A) or the second fixed region (592B) maintains a substantially constant shape regardless of how the folding angle changes, the flexible printed circuit board (590) can be placed in the first housing (e.g., the first thickness (t1)) by reducing the thickness (e.g., the second thickness (t2) and the third thickness (t3)) of the first fixed region (592A) or the second fixed region (592B). Figure 3b a first housing (310)) and a second housing (eg, Figure 3b The space occupied by the second shell (320) can be reduced.

[0117] In one embodiment, a plurality of signal lines (5946) formed by the first metal layer (5943) can form a wiring pattern in a substantially straight line shape along an extension direction (e.g., an X-axis direction) on the first base layer (5944) to transmit high-speed signals. In one embodiment, a plurality of signal lines (5946) can be arranged to extend in the extension direction and form intervals between each other (e.g., intervals, distances, or spacings between each of the plurality of signal lines (5946)). In one embodiment, the intervals between the plurality of signal lines (5946) can be different depending on the region of the flexible printed circuit board (590). For example, the plurality of signal lines (5946) can be arranged to form a first interval (d1) between each other in the driving region (591). That is, the distance or spacing between the signal lines in the driving region (591) (the signal lines in the plurality of signal lines (5946) formed in the driving region (591)) can be the interval (or spacing) d1. The plurality of signal lines (5946) may be arranged to form a second interval (d2) different from the first interval (d1) between each other in the first fixed area (592A). That is, the distance or spacing between the signal lines in the first fixed area (592A) (the signal lines in the plurality of signal lines (5946) formed in the first fixed area (592A)) may be an interval (or spacing) d2. The plurality of signal lines (5946) may be arranged to form a third interval (d3) different from the first interval (d1) between each other in the second fixed area (592B). In one embodiment, the second interval (d2) between the plurality of signal lines (5946) in the first fixed area (592A) may be smaller than the first interval (d1) between the plurality of signal lines (5946) in the driving area (591). In one embodiment, the third interval (d3) between the plurality of signal lines (5946) in the second fixed region (592B) may be smaller than the first interval (d1) between the plurality of signal lines (5946) in the driving region (591). In one embodiment, the second interval (d2) may be substantially the same as the third interval (d3). In an example, the second interval (d2) and the third interval (d3) may be substantially the same and smaller than the first interval (d1). In one embodiment, the first interval (d1) between the plurality of signal lines (5946) in the driving region (591) may be approximately 1.2 times the second interval (d2) between the plurality of signal lines (5946) in the first fixed region (592A) and the third interval (d3) between the plurality of signal lines (5946) in the second fixed region (592B).

[0118] In one embodiment, the flexible printed circuit board (590) can adjust the impedance difference between the driving area (591), the first fixed area (592A) and the second fixed area (592B) within a set range through the thickness difference of each area of ​​the first covering layer (5941) and the spacing difference between the plurality of signal lines (5946) formed by the first metal layer (5943). In other words, through the thickness difference of the first covering layer (5941) and / or the spacing difference between the plurality of signal lines (5946) formed by the first metal layer (5943), the flexible printed circuit board (590) can make the impedance of the entire area basically matched. In one embodiment, the impedance value generated by each area of ​​the flexible printed circuit board (590) can increase as the thickness of the first covering layer (5941) formed by the dielectric material increases. In one embodiment, as the spacing between the plurality of signal lines (5946) formed by the first metal layer (5943) decreases, the impedance value generated in each area of ​​the flexible printed circuit board (590) can increase. In one embodiment, by forming the first thickness (t1) of the first covering portion 5951a in the driving area (591) to be greater than the second thickness (t2) of the second covering portion 5951b in the first fixed area (592A) and the third thickness (t3) of the third covering portion 5951c in the second fixed area (592B), and forming the first spacing (d1) between the multiple signal lines (5946) in the driving area (591) to be greater than the second spacing (d2) between the multiple signal lines (5946) in the first fixed area (592A) and the third spacing (d3) between the multiple signal lines (5946) in the second fixed area (592B), the flexible printed circuit board (590) can provide impedance matching for the entire area.

[0119] In another example, the thickness of the first cover layer in the driving area may be less than the thickness in the first fixed area and the second fixed area. The thickness of the first cover layer (5941) in the driving area (591) may be between 10 μm and 15 μm. In one embodiment, the thickness of the first cover layer (5941) in the driving area (591) may be between 12 μm and 13 μm. In one embodiment, the thickness of the first cover layer (5941) in the driving area (591) may be about 12.5 μm. In one embodiment, the thickness of the first cover layer (5941) in the first fixed area (592A) and the second fixed area (592B) may be between 20 μm and 30 μm. In one embodiment, the thickness of the first cover layer (5941) in the first fixed area (592A) and the second fixed area (592B) may be between 24 μm and 26 μm. In one embodiment, the thickness of the first cover layer (5941) in the first fixed area (592A) and the second fixed area (592B) may be about 25 μm. Figure 6a and Figure 6b An example is shown in which the thickness of the first covering layer (5941) in the first fixing region (592A) and the second fixing region (592B) is greater than the thickness of the driving region (591).

[0120] In an example, the plurality of signal lines (5946) formed by the first metal layer (5943) may be arranged to form a spacing between 45 μm and 55 μm between each other in the driving region (591) (e.g., spacing (d1)). Preferably, the plurality of signal lines (5946) formed by the first metal layer (5943) may be arranged to form a spacing between 49 μm and 51 μm between each other in the driving region (591). More preferably, the plurality of signal lines (5946) formed by the first metal layer (5943) may be arranged to form a spacing of approximately 50 μm between each other in the driving region (591). In one embodiment, the plurality of signal lines (5946) formed by the first metal layer (5943) may be arranged to form a spacing between 54 μm and 66 μm between the first fixed region (592A) and the second fixed region (592B) (e.g., spacings (d2) and d3, respectively). Preferably, the plurality of signal lines (5946) formed by the first metal layer (5943) can be arranged to form a spacing between 59 μm and 61 μm between the first fixed area (592A) and the second fixed area (592B). More preferably, the plurality of signal lines (5946) formed by the first metal layer (5943) can be arranged to form a spacing of about 60 μm between the first fixed area (592A) and the second fixed area (592B). Figure 6a and Figure 6b An example is shown in which the plurality of signal lines are arranged to form a second interval and a third interval in the first region and the second region, respectively, which are larger than a first interval formed between each other in the driving region.

[0121] Table 1 shown below may represent an example of adjusting the thickness of the first cover layer (5941) and the intervals between the plurality of signal lines (5946) formed by the first metal layer (5943) to match the impedance of each region of the flexible printed circuit board (590). However, the numerical values ​​shown below are only examples of impedance matching and are not limited thereto.

[0122] [Table 1]

[0123]

[0124] In one embodiment, the impedance value of the flexible printed circuit board (590) can increase as the thickness of the first covering layer (5941) formed of a dielectric material increases, and can decrease as the spacing between signal lines increases. In one embodiment, the flexible printed circuit board (590) can maintain the impedance values ​​of the driving area (591) and the fixed area within a set range by forming the spacing between the signal lines in the driving area (591) to be larger than the spacing between the signal lines in the fixed area, and at the same time improve the durability of the driving area (591) compared to the fixed area by increasing the thickness of the first covering layer (5941) in the driving area (591) compared to the fixed area.

[0125] For example, the thickness of the first covering layer (5941) in the driving region (591) may be about 25 μm, and the thickness in the fixed region may be about 12.5 μm. At the same time, the plurality of signal lines formed on the first metal layer (5943) may be spaced about 60 μm apart from each other in the driving region (591), and may be spaced about 50 μm apart from each other in the fixed region. In this case, as a result of measuring the impedance values ​​of the driving region (591) and the fixed region, since the impedance value of the driving region (591) is about 87 ohms, the impedance value of the fixed region is about 85 ohms, and the impedance difference between the regions is about 2%, it can be confirmed that a high impedance matching performance is achieved.

[0126] However, the values ​​shown in the above table are arbitrarily determined to describe the impedance matching effect achieved by adjusting the thickness of the first covering layer (5941) and the spacing between the signal lines, and the thickness difference of the first covering layer (5941) and the spacing difference between the signal lines applied to the various embodiments are not limited to the values ​​shown in Table 1. In other words, it will be generally understood that the impedance matching effect can be performed by adjusting the thickness (or difference) of the first covering layer (5941) between the driving area and the fixed area of ​​the flexible printed circuit board (590), and / or adjusting the spacing (or difference) between the signal lines in the driving area and the fixed area of ​​the flexible printed circuit board, without being limited to the described values.

[0127] Figure 6a is a cross-sectional view of a flexible printed circuit board according to an embodiment, Figure 6b is a diagram of an example of a plurality of signal lines according to an embodiment.

[0128] refer to Figure 6a and Figure 6b , the flexible printed circuit board (690) in the embodiment (e.g., Figure 2c Flexible printed circuit board (290), Figure 3aThe flexible printed circuit board (390) of FIG. 4 or the flexible printed circuit board 490 of FIG. 4 may include a driving region (691), a first fixed region (692A), and a second fixed region (692B). In one embodiment, the thickness of the driving region (691) of the flexible printed circuit board (690) may be smaller than at least one of the thickness of the first fixed region (692A) and the thickness of the second fixed region (692B).

[0129] In one embodiment, the flexible printed circuit board (690) may include: a first layer portion (694) including a first base layer (6944), a first metal layer (6943), a first adhesive layer (6942), and a first cover layer (6941); a second layer portion (695) including a second base layer (6954), a second metal layer (6953), a second adhesive layer (6952), and a second cover layer (6951); and a connection layer (696) connecting the first layer portion (694) to the second layer portion (695). In one embodiment, the thickness of the driving region (691) of the first layer portion (694) may be smaller than the thickness of the first fixed region (692A) and the thickness of the second fixed region (692B).

[0130] In one embodiment, the first covering layer (6941) may include: a first covering portion (6941a) arranged in the driving region (691) and having a first thickness (t1), a second covering portion (6941b) arranged in the first fixing region (692A) and having a second thickness (t2) greater than the first thickness (t1), and a third covering portion (6941c) arranged in the second fixing region (692B) and having a third thickness (t3) greater than the first thickness (t1). In one embodiment, the first thickness (t1) of the first covering portion (6941a) may be less than the second thickness (t2) of the second covering portion (6941b) and the third thickness (t3) of the third covering portion (6941c). For example, the second thickness (t2) and the third thickness (t3) may be approximately twice the first thickness (t1). In one embodiment, when the second thickness (t2) of the second covering portion (6941b) and the third thickness (t3) of the third covering portion (6941c) are greater than the first thickness (t1) of the first covering portion (6941a), the durability of the first fixing region (692A) and the durability of the second fixing region (692B) can be improved compared to the durability of the driving region (691). In this case, when the first fixing region (692A) and the second fixing region (692B) are respectively fixed to the first housing (e.g., Figure 3b a first housing (310)) and a second housing (eg, Figure 3bWhen the second shell (320) is fixed to the first fixing area (692A) and the second fixing area (692B), damage to the first fixing area (692A) and the second fixing area (692B) can be reduced.

[0131] In one embodiment, the first covering portion (6941a), the second covering portion (6941b) and the third covering portion (6941c) may be formed separately. In one embodiment, based on the extension direction (e.g., X-axis direction), the first fastening member 6931 may be arranged on the boundary of the first covering portion (6941a) and the second covering portion (6941b), and the second fastening member 6932 may be arranged on the boundary of the first covering portion (6941a) and the third covering portion (6941c).

[0132] In one embodiment, the plurality of signal lines (6946) formed by the first metal layer (6943) can form a wiring pattern in a substantially straight line shape in an extension direction (e.g., an X-axis direction) to transmit high-speed signals. In one embodiment, the plurality of signal lines (6946) can be arranged to extend in the extension direction and to form intervals therebetween.

[0133] In one embodiment, the intervals between the plurality of signal lines (6946) may be substantially the same or different depending on the region of the flexible printed circuit board (e.g., in the driving region (691), the first fixed region (692A), and the second fixed region (692B)). For example, the plurality of signal lines (6946) may be arranged to form a first interval (d1) between each other in the driving region (691). The plurality of signal lines (6946) may be arranged to form a second interval (d2) between each other in the first fixed region (692A), the second interval (d2) being substantially the same as or different from the first interval (d1). The plurality of signal lines (6946) may be arranged to form a third interval (d3) between each other in the second fixed region (692B), the third interval (d3) being substantially the same as the first interval (d1), or the third interval (d3) being greater than the first interval (d1). In one embodiment, the second interval (d2) may be substantially the same as the third interval (d3). In one embodiment, the second interval (d2) and the third interval (d3) between the plurality of signal lines (6946) in the fixed region may be approximately 1.2 times the first interval (d1) between the plurality of signal lines (6946) in the driving region.

[0134] In one embodiment, when the intervals between multiple signal lines (6946) in each of the driving area (691), the first fixed area (692A) and the second fixed area (692B) of the flexible printed circuit board (690) are substantially the same, the first covering layer (6941) and the first adhesive layer (6942) of the flexible printed circuit board (690) can be formed to have different thicknesses in each of the driving area (691), the first fixed area (692A) and the second fixed area (692B) to achieve impedance matching in each of the driving area (691), the first fixed area (692A) and the second fixed area (692B) of the flexible printed circuit board (690). In one embodiment, because the first covering layer (6941) and the first adhesive layer (6942) include dielectric materials, the first covering layer (6941) and the first adhesive layer (6942) can have complementary thickness differences according to each of the driving area (691), the first fixed area (692A) and the second fixed area (692B) of the flexible printed circuit board (690), so that the impedance difference of the flexible printed circuit board (690) can be within a set range. For example, when the thickness (t1) of the first covering layer (6941) in the driving area (691) is greater than the thickness (t2) in the first fixed area (692A) and the thickness (t3) in the second fixed area (692B), the thickness of the first adhesive layer (6942) in the driving area (691) can be less than the thickness of the first adhesive layer (6942) in the first fixed area (692A) or the second fixed area (692B), thereby offsetting the impedance difference of each of the driving area (691), the first fixed area (692A) and the second fixed area (692B) caused by the thickness difference of the first covering layer (6941). For example, when a plurality of signal lines (6946) formed on a flexible printed circuit board (690) have a predetermined pattern spacing, the impedance difference between the driving area (691), the first fixed area (692A) and the second fixed area (692B) of the flexible printed circuit board (690) can be reduced by the thickness difference between the driving area (691), the first fixed area (692A) and the second fixed area (692B) of the first adhesive layer (6942) and the first covering layer (6941).

[0135] According to one embodiment, the electronic device (101; 201; 301) may include: a display (250; 350) including a first area (250a; 350a) and a second area (250b; 350b); a first shell (210; 310) supporting the first area (250a; 350a); a second shell (220; 320) supporting the second area (250b; 350b); a hinge structure (340) foldably connecting the first shell (210; 310) to the second shell (220; 320) based on a folding axis (A) and adjusting a folding angle formed by the first shell (210; 310) and the second shell (220; 320) relative to the folding axis (A); and a flexible printed circuit board (290; 390; 590; 690) extending in an extending direction. In one embodiment, the flexible printed circuit board (290; 390; 590; 690) may include: a drive region (391; 591; 691) that spans a folding axis (A) and at least partially bends in response to a change in a folding angle; a first fixed region (392A; 592A; 692A) that extends from the drive region (391; 591; 691) to a first space (210a; 310a) formed by a first shell (210; 310); and a second fixed region (392B; 592B; 692B) that extends from the drive region (391; 591; 691) to a second space (220a; 320a) formed by a second shell (220; 320). In one embodiment, a flexible printed circuit board (290; 390; 590; 690) may include: a first substrate layer (4944; 5944; 6944), which includes a first substrate surface and a second substrate surface opposite to the first substrate surface; a first metal layer (4943; 5943; 6943), which is arranged on the second substrate surface and forms a plurality of signal lines (4946) extending in an extension direction; and a first covering layer (4941; 5941; 6941), which is arranged to cover the first metal layer (4943; 5943; 6943) along the direction of the second substrate surface. In one embodiment, the thickness (t1) of the first covering layer (4941; 5941; 6941) in the driving area (391; 591; 691) may be different from the thickness (t2) of the first covering layer (4941) in the first fixed area (392A; 592A; 692A) and the thickness (t3) of the first covering layer (4941) in the second fixed area (392B; 592B; 692B).

[0136] In one embodiment, the first covering layer (4941; 5941; 6941) may include: a first covering portion (4941a; 5941a; 6941a) arranged in the driving area (491; 591; 691) and having a first thickness (t1); a second covering portion (4941b; 5941b; 6941b) arranged in the first fixed area (492A; 592A: 692A) and having a second thickness (t2) different from the first thickness (t2); and a third covering portion (4941c; 5941c; 6941c) arranged in the second fixed area (492B; 592B; 692B) and having a third thickness (t3) different from the first thickness (t1).

[0137] In one embodiment, the first covering portion (4941a; 5941a; 6941a), the second covering portion (4941b; 5941b; 6941b), and the third covering portion (4941c; 5941c; 6941c) can be formed separately. In this case, each covering portion with different thicknesses can be manufactured separately and arranged on the first substrate layer.

[0138] In one embodiment, the plurality of signal lines (5946; 6946) may be arranged to extend in the extension direction and to form intervals between the signal lines. In one embodiment, the interval (d1) between the plurality of signal lines (5946; 6946) in the driving region (491; 591; 691) may be different from the interval (d2) between the plurality of signal lines (5946; 6946) in the first fixed region (492A; 592A; 692A) and the interval (d3) between the plurality of signal lines (5946; 6946) in the second fixed region (492B; 592B; 692B). In this case, impedance difference may occur depending on the interval difference between the signal lines in each region of the flexible printed circuit board.

[0139] In one embodiment, the first thickness (t1) may be greater than the second thickness (t2) and the third thickness (t3). In this case, an impedance difference may occur depending on the thickness of the first cover layer formed of the dielectric material.

[0140] In one embodiment, the plurality of signal lines (5946) may be arranged to form a first interval (d1) between each other in the driving region (591). In one embodiment, the plurality of signal lines (5946) may be arranged to form a second interval (d2) between each other in the first fixed region (592A) that is smaller than the first interval (d1). In one embodiment, the plurality of signal lines (5946) may be arranged to form a third interval (d3) between each other in the second fixed region (592B) that is smaller than the first interval (d1).

[0141] In one embodiment, the thickness of the first covering layer (5941) in the driving region (591) may be 10 μm to 15 μm. In one embodiment, the thickness of the first covering layer (5941) in the first fixed region (592A) and the second fixed region (592B) may be 20 μm to 30 μm. In one embodiment, the plurality of signal lines (5946) may be arranged to form a spacing of 45 μm to 55 μm between each other in the driving region (591). In one embodiment, the plurality of signal lines (5946) may be arranged to form a spacing of 54 μm to 66 μm between each other in the first fixed region (592A) and the second fixed region (592B).

[0142] In one embodiment, the first thickness ( t1 ) may be smaller than the second thickness ( t2 ) and the third thickness ( t3 ).

[0143] In one embodiment, the plurality of signal lines (6946) may be arranged to form a first interval (d1) between each other in the driving region (691). In one embodiment, the plurality of signal lines (6946) may be arranged to form a second interval (d2) between each other in the first fixed region (692A) that is larger than the first interval (d1). In one embodiment, the plurality of signal lines (6946) may be arranged to form a third interval (d3) between each other in the second fixed region (692B) that is smaller than the first interval (d1).

[0144] In one embodiment, the thickness of the first cover layer (6941) in the driving region 601 may be 20 μm to 30 μm. In one embodiment, the thickness of the first cover layer (6941) in the first fixed region (692A) and the second fixed region (692B) may be 10 μm to 15 μm. In one embodiment, the plurality of signal lines (6946) may be arranged to form a spacing of 55 μm to 65 μm between each other.

[0145] In one embodiment, the hinge structure (340) may further include: a first support plate (331) connecting the first housing (310) to the hinge housing (346); and a second support plate (332) connecting the second housing (320) to the hinge housing (346). In one embodiment, the flexible printed circuit board (290; 390; 590; 690) may further include: a first fastening member (3931; 5931; 6931) fixed to the first support plate (331); and a second fastening member (3932; 5932; 6932) fixed to the second support plate (332).

[0146] In one embodiment, based on the state in which the display (350) is observed, the first fastening member (3931; 5931; 6931) can overlap with the drive region (391; 591; 691) and the first fixed region (392A; 592A; 692A). In one embodiment, the second fastening member (3932; 5932; 6932) can overlap with the drive region (391; 591; 691) and the second fixed region (392B; 592B; 692B).

[0147] In one embodiment, based on the extension direction, the driving area (391; 591; 691) may include: a central portion (3911; 5911; 6911) arranged in the hinge housing (334); a first bent portion (3912a; 5912a; 6912a) extending from the central portion (3911; 5911; 6911) to a first fastening member (3931; 5931; 6931) and at least partially bent; and a second bent portion (3912b; 5912b; 6912b) extending from the central portion (3911; 5911; 6911) to a second fastening member (3932; 5932; 6932) and at least partially bent. In one embodiment, the first fixing area (392A; 592A; 692A) may include a first extension portion (3921; 5921; 6921), which extends from the first fastening member (3931; 5931; 6931) in a direction opposite to the central portion (3911; 5911; 6911) and is at least partially fixed to the first shell (210; 310). In one embodiment, the second fixing area (392B; 592B; 692B) may include a second extension portion (3922; 5922; 6922), which extends from the second fastening member (3932; 5932; 6932) in a direction opposite to the central portion (3911; 5911; 6911) and is at least partially fixed to the second shell (220; 320).

[0148] In one embodiment, the flexible printed circuit board (390; 590; 690) may further include: a second base layer (4954; 5954; 6954) arranged on the first base layer (4944; 5944; 6944) opposite to the first metal layer (4943; 5943; 6943); a second metal layer (4953; 5953; 6953) arranged on the second base layer (4954; 5954; 6954) opposite to the first base layer (4944; 5944; 6944); and a second covering layer (4951; 5951; 6951) arranged on the second base layer (4954; 5954; 6954) to cover the second metal layer (4953; 5953; 6953).

[0149] In one embodiment, the flexible printed circuit board (390; 590; 690) may be arranged such that the first substrate surface faces the rear surface of the display (250; 350).

[0150] According to one embodiment, a flexible printed circuit board (FPCB) (290; 390; 590; 690) arranged in an electronic device (201; 301), the flexible printed circuit board (FPCB) (290; 390; 590; 690) may include: a first substrate layer (4944; 5944; 6944) including a first substrate surface and a second substrate surface opposite to the first substrate surface; a first metal layer (4943; 5943; 6943) arranged on the second substrate surface and forming a plurality of signal lines (5946; 6946) arranged in an extending direction; a first cover layer (4941; 5941; 6941) , which is arranged to cover the first metal layer (4943; 5943; 6943) along the direction of the second substrate surface; a second substrate layer (4954; 5954; 6954), which is arranged in the direction of the first substrate surface; a second metal layer (4953; 5953; 6953), which is arranged on the second substrate layer (4954; 5954; 6954) opposite to the first substrate layer (4944; 5944; 6944); and a second covering layer (4951; 5951; 6951), which is arranged on the second substrate layer (4954; 5954; 6954) to cover the second metal layer (4953; 5953; 6953). In one embodiment, the flexible printed circuit board (290; 390; 590; 690) may include, based on the extension direction, a driving region (391; 591; 691), a first fixed region (392A; 592A; 692A), and a second fixed region (392B; 592B; 692B), wherein the first fixed region (392A; 592A; 692A) and the second fixed region (392B; 592B; 692B) are arranged in opposite directions relative to the driving region (391; 591; 691). In one embodiment, the thickness (t1) of the first covering layer (4941; 5941; 6941) in the driving area (391; 591; 691) may be different from the thickness (t2) of the first covering layer (4941; 5941; 6941) in the first fixed area (392A; 592A; 692A) and the thickness (t3) of the first covering layer (4941; 5941; 6941) in the second fixed area (392B; 592B; 692B).

[0151] In one embodiment, the first covering layer (5941) may include: a first covering portion (5941a) arranged in the driving area (591) and having a first thickness (t1); a second covering portion (5941b) arranged in the first fixed area (592A) and having a second thickness (t2) less than the first thickness (t1); and a third covering portion (5941c) arranged in the second fixed area (592B) and having a third thickness (t3) less than the first thickness (t1).

[0152] In one embodiment, the plurality of signal lines (5946; 6946) may extend in the extension direction and form intervals between the signal lines (5946; 6946). In one embodiment, the intervals (d1) between the plurality of signal lines (5946; 6946) in the driving region (591; 691) may be different from the intervals (d3) between the plurality of signal lines (5946; 6946) in the first fixed region (592A; 691A) and the second fixed region (592B; 692B).

[0153] In one embodiment, the plurality of signal lines (5946) may be arranged to form a first interval (d1) between each other in the driving region (591). In one embodiment, the plurality of signal lines (5946) may be arranged to form a second interval (d2) between each other in the first fixed region (592A) that is smaller than the first interval (d1). In one embodiment, the plurality of signal lines (5946) may be arranged to form a third interval (d3) between each other in the second fixed region (592B) that is smaller than the first interval (d1).

[0154] According to one embodiment, the electronic device (201; 301) may include: a display (250; 350) including a first area (250a; 350a) and a second area (250b; 350b); a first shell (210; 310) forming a first space (210a; 310a) on a rear surface of the first area (250a; 350a); a second shell (220; 320) forming a second space (220a; 320a) on a rear surface of the second area (250b; 350b); ); a hinge structure (340) comprising a hinge housing (334) that connects the first housing (210; 310) to the second housing (220; 320) based on a folding axis (A) and adjusts a folding angle formed by the first housing (210; 310) and the second housing (220; 320); and a flexible printed circuit board (290; 390; 590) that spans the folding axis (A) and extends from the first space (210a; 310a) to the second space (220a; 320a) in an extending direction. In one embodiment, the flexible printed circuit board (290; 390; 590) may include: a driving area (391; 591) that is at least partially arranged in the hinge housing (334) and is at least partially bent in response to a change in the folding angle; a first fixed area (392A; 592A) that extends from the driving area (391; 591) to the first space (210a; 310a); and a second fixed area (392B; 592B) that extends from the driving area (391; 591) to the second space (220a; 320a). In one embodiment, the flexible printed circuit board (290; 390; 590) may include: a first substrate layer (4944; 5944) including a first substrate surface and a second substrate surface opposite to the first substrate surface; a first metal layer (4943; 5943) arranged on the second substrate surface and forming a plurality of signal lines (5946) arranged in an extending direction; a first covering layer (4941; 5941) arranged to cover the first substrate surface in a direction along the second substrate surface; A metal layer (4943; 5943); a second substrate layer (4954; 5954) arranged in the direction of the first substrate surface; a second metal layer (4953; 5953) arranged on the second substrate layer (4954; 5954) opposite to the first substrate layer (4944; 5944); and a second covering layer (4951; 5951) arranged on the second substrate layer (4954; 5954) to cover the second metal layer (4953; 5953). In one embodiment, the thickness (t1) of the first covering layer (4911; 5911) in the driving area (391; 591) may be greater than the thickness (t2) of the first covering layer (4911; 5911) in the first fixed area (392A; 592A) or the second fixed area (392B; 592B).In one embodiment, the spacing (d1) between the multiple signal lines (5946) in the driving area (391; 591) can be greater than the spacing (d2) between the multiple signal lines (5946) in the first fixed area (392A; 592A) or the spacing (d3) between the multiple signal lines (5946) in the second fixed area (392B; 592B).

[0155] Unless described as incompatible or mutually exclusive, all examples, embodiments and features listed in this disclosure may be combined in any suitable manner. In addition, unless described as essential, features of various examples and embodiments may be omitted.

[0156] With reference to any of the above examples or embodiments, it will be understood that the term driving region of the flexible printed circuit board refers to a region that can be repeatedly driven (e.g., undergoing external drive or bending, being subjected to force) at a certain angle when the foldable device is in an open (or unfolded state) and a closed (or folded state). In the examples, the driving region may also be referred to as a bending region, a flexible region, or a deformable region. With reference to any of the above examples or embodiments, the extension direction may refer to the X-axis direction of the flexible printed circuit board, the direction of the longitudinal length of the flexible printed circuit board, that is, the direction in which the flexible printed circuit board extends in a direction perpendicular to the folding axis.

[0157] Further examples according to the present application are set forth in the following numbered paragraphs:

[0158] Paragraph 1: An electronic device comprising:

[0159] a display comprising a first region and a second region;

[0160] a first housing supporting the first region;

[0161] a second housing supporting a second region;

[0162] a hinge structure that foldably connects the first housing to the second housing based on a folding axis and adjusts a folding angle formed by the first housing and the second housing with respect to the folding axis; and

[0163] a flexible printed circuit board extending in an extending direction,

[0164] Among them, flexible printed circuit boards include:

[0165] an actuation region that spans the fold axis and at least partially flexes in response to changes in the fold angle;

[0166] a first fixing region extending from the driving region to a first space formed by the first housing; and

[0167] a second fixing region extending from the driving region to a second space formed by the second housing,

[0168] Among them, flexible printed circuit boards include:

[0169] A first substrate layer comprising a first substrate surface and a second substrate surface opposite to the first substrate surface;

[0170] A first metal layer is arranged on the second substrate surface and forms a plurality of signal lines extending in an extending direction; and

[0171] a first covering layer arranged to cover the first metal layer along a direction of a surface of the second substrate,

[0172] The thickness of the first cover layer in the driving region is different from the thickness of the first cover layer in the first fixing region and the second fixing region.

[0173] Segment 2:

[0174] The electronic device according to paragraph 1, wherein the first cover layer comprises:

[0175] a first covering portion disposed in the drive region and having a first thickness;

[0176] a second covering portion disposed in the first fixing region and having a second thickness different from the first thickness; and

[0177] A third covering portion is arranged in the second fixing area and has a third thickness different from the first thickness.

[0178] Segment 3:

[0179] The electronic device according to any one of Paragraphs 1 and 2, wherein the first cover portion, the second cover portion, and the third cover portion are formed separately.

[0180] Segment 4:

[0181] The electronic device according to any one of Paragraphs 1 to 3, wherein the plurality of signal lines are arranged to extend in the extending direction and such that spaces are formed between the lines, and

[0182] An interval between the plurality of signal lines in the driving region is different from an interval between the plurality of signal lines in the first fixing region or an interval between the plurality of signal lines in the second fixing region.

[0183] Segment 5:

[0184] An electronic device according to any one of paragraphs 1 to 4, wherein the first thickness is greater than the second thickness and the third thickness.

[0185] Paragraph 6:

[0186] An electronic device according to any one of paragraph 5, wherein the plurality of signal lines are arranged as:

[0187] forming a first gap between each other in the driving region,

[0188] forming a second interval smaller than the first interval between each other in the first fixing region, and

[0189] A third interval smaller than the first interval is formed between each other in the second fixing region.

[0190] Paragraph 7:

[0191] The electronic device according to any one of Paragraphs 5 to 6, wherein the first cover layer has a thickness of 20 μm to 30 μm in the driving region, and a thickness of 10 μm to 15 μm in the first fixing region and the second fixing region.

[0192] Paragraph 8:

[0193] An electronic device according to any one of paragraphs 5 to 7, wherein the plurality of signal lines form:

[0194] The spacing between the signal lines in the drive region is about 60 μm, and

[0195] The interval between the signal lines in the first fixing area and the second fixing area is about 50 μm.

[0196] Segment 9:

[0197] An electronic device according to any one of Paragraphs 1 to 4, wherein the first thickness is smaller than the second thickness and the third thickness.

[0198] Paragraph 10:

[0199] An electronic device according to any one of paragraph 9, wherein the plurality of signal lines are arranged as:

[0200] forming a first gap between each other in the driving region,

[0201] forming a second interval greater than the first interval between each other in the first fixing region, and

[0202] A third interval greater than the first interval is formed between each other in the second fixing region.

[0203] Paragraph 11:

[0204] The electronic device according to any one of Paragraphs 9 to 10, wherein the first cover layer has a thickness of 10 μm to 15 μm in the driving region and a thickness of 20 μm to 30 μm in the first fixing region and the second fixing region, and

[0205] Multiple signal lines are arranged as follows:

[0206] A spacing of 45 μm to 55 μm is formed between each other in the driving region, and

[0207] The first fixing region and the second fixing region are spaced apart from each other by a distance of 54 μm to 66 μm.

[0208] Paragraph 12:

[0209] The electronic device according to any one of paragraphs 1 to 11, wherein the hinge structure further comprises:

[0210] a first support plate connecting the first housing to the hinge housing; and

[0211] a second support plate connecting the second housing to the hinge housing,

[0212] Among them, the flexible printed circuit board also includes:

[0213] a first fastening member fixed to the first support plate; and

[0214] A second fastening member is fixed to the second support plate.

[0215] Paragraph 13:

[0216] The electronic device according to any one of Paragraphs 1 to 12, wherein the first fastening member overlaps the driving area and the first fixing area based on a state in which the display is observed, and

[0217] The second fastening member overlaps the drive region and the second fixing region.

[0218] Paragraph 14:

[0219] The electronic device according to any one of paragraphs 1 to 13, wherein, based on the extension direction, the driving area includes:

[0220] a central portion disposed in the hinge housing;

[0221] a first curved portion extending from the central portion to the first fastening member and at least partially curved; and

[0222] a second curved portion extending from the central portion to the second fastening member and at least partially curved,

[0223] wherein the first fixing region includes a first extension portion extending from the first fastening member in a direction opposite to the central portion and at least partially fixed to the first housing,

[0224] Wherein, the second fixing region includes a second extending portion extending from the second fastening member in a direction opposite to the central portion and at least partially fixed to the second housing.

[0225] Paragraph 15:

[0226] An electronic device according to any one of paragraphs 1 to 14, wherein the flexible printed circuit board further comprises:

[0227] a second substrate layer disposed on the first substrate layer opposite to the first metal layer;

[0228] a second metal layer disposed on the second substrate layer opposite to the first substrate layer; and

[0229] The second covering layer is arranged on the second base layer to cover the second metal layer.

[0230] Paragraph 16:

[0231] The electronic device according to any one of Paragraphs 1 to 15, wherein the flexible printed circuit board is arranged so that the first substrate surface faces the rear surface of the display.

[0232] Paragraph 17:

[0233] A flexible printed circuit board (FPCB) arranged in an electronic device, the flexible printed circuit board comprising:

[0234] A first substrate layer comprising a first substrate surface and a second substrate surface opposite to the first substrate surface;

[0235] A first metal layer, which is arranged on the surface of the second substrate and forms a plurality of signal lines arranged in an extending direction;

[0236] a first covering layer arranged to cover the first metal layer along a direction of a surface of the second substrate;

[0237] a second substrate layer arranged in the direction of the first substrate surface;

[0238] a second metal layer disposed on the second substrate layer opposite to the first substrate layer; and

[0239] a second covering layer disposed on the second base layer to cover the second metal layer,

[0240] The flexible printed circuit board includes, based on the extension direction, a driving area, a first fixing area, and a second fixing area, wherein the first fixing area and the second fixing area are arranged in opposite directions relative to the driving area.

[0241] The thickness of the first cover layer in the driving region is different from the thickness of the first cover layer in the first fixing region and the second fixing region.

[0242] Paragraph 18:

[0243] The flexible printed circuit board according to paragraph 17, wherein the first cover layer comprises:

[0244] a first covering portion disposed in the drive region and having a first thickness;

[0245] a second covering portion disposed in the first fixing region and having a second thickness less than the first thickness; and

[0246] A third covering portion is arranged in the second fixing area and has a third thickness that is smaller than the first thickness.

[0247] Paragraph 19:

[0248] The flexible printed circuit board according to any one of paragraphs 17 and 18, wherein the plurality of signal lines extend in the extending direction with spaces formed between the lines, and

[0249] The intervals between the plurality of signal lines in the driving region are different from the intervals between the plurality of signal lines in the first fixing region and the intervals between the plurality of signal lines in the second fixing region.

[0250] Paragraph 20:

[0251] The flexible printed circuit board according to any one of paragraphs 17 to 19, wherein the plurality of signal lines are arranged as follows:

[0252] forming a first gap between each other in the driving region,

[0253] forming a second interval smaller than the first interval between each other in the first fixing region, and

[0254] A third interval smaller than the first interval is formed between each other in the second fixing region.

[0255] Paragraph 21:

[0256] An electronic device comprising:

[0257] a display comprising a first region and a second region;

[0258] a first housing forming a first space on a rear surface of the first region;

[0259] a second housing forming a second space on a rear surface of the second region;

[0260] a hinge structure including a hinge housing, connecting a first housing to a second housing based on a folding axis, and adjusting a folding angle formed by the first housing and the second housing; and

[0261] a flexible printed circuit board which spans the folding axis and extends from the first space to the second space in the extending direction,

[0262] Among them, flexible printed circuit boards include:

[0263] an actuation region disposed at least partially in the hinge housing and at least partially flexing in response to a change in the folding angle;

[0264] a first fixing region extending from the driving region to the first space;

[0265] a second fixing region extending from the driving region to the second space;

[0266] A first substrate layer comprising a first substrate surface and a second substrate surface opposite to the first substrate surface;

[0267] A first metal layer, which is arranged on the surface of the second substrate and forms a plurality of signal lines arranged in an extending direction;

[0268] a first covering layer arranged to cover the first metal layer along a direction of a surface of the second substrate;

[0269] a second substrate layer arranged in the direction of the first substrate surface;

[0270] a second metal layer disposed on the second substrate layer opposite to the first substrate layer; and

[0271] a second covering layer disposed on the second base layer to cover the second metal layer,

[0272] The thickness of the first covering layer in the driving region is greater than the thickness of the first covering layer in the first fixing region or the second fixing region.

[0273] The intervals between the plurality of signal lines in the driving region are larger than the intervals between the plurality of signal lines in the first fixed region or the intervals between the plurality of signal lines in the second fixed region.

[0274] Paragraph 22:

[0275] A flexible printed circuit board (FPCB) comprises:

[0276] A first substrate layer comprising a first substrate surface and a second substrate surface opposite to the first substrate surface;

[0277] a first metal layer disposed on the second substrate surface and forming a plurality of signal lines arranged in an extending direction along a longitudinal length of the flexible printed circuit board; and

[0278] a first covering layer arranged to cover the first metal layer along a direction of a surface of the second substrate;

[0279] The flexible printed circuit board includes, based on the extension direction, a driving region, a first fixing region, and a second fixing region, wherein the first fixing region and the second fixing region are arranged on opposite sides of the driving region.

[0280] The thickness of the first cover layer in the driving region is different from the thickness of the first cover layer in the first fixing region and the second fixing region.

[0281] Paragraph 23:

[0282] The flexible printed circuit board according to paragraph 22, wherein a plurality of signal lines are formed so as to be arranged to extend in the extending direction, wherein a space is formed between each of the plurality of signal lines, and

[0283] The intervals between the plurality of signal lines in the driving region are different from the intervals between the plurality of signal lines in the first fixed region and the intervals between the plurality of signal lines in the second fixed region.

[0284] Paragraph 24:

[0285] The flexible printed circuit board according to paragraph 22 or 23, wherein the first cover layer comprises:

[0286] a first covering portion disposed in the drive region and having a first thickness;

[0287] a second covering portion disposed in the first fixing region and having a second thickness different from the first thickness; and

[0288] A third covering portion is arranged in the second fixing area and has a third thickness different from the first thickness.

[0289] Paragraph 25:

[0290] The flexible printed circuit board according to paragraph 24, wherein the first cover portion, the second cover portion, and the third cover portion are formed separately.

[0291] Paragraph 26:

[0292] The flexible printed circuit board according to paragraph 24 or 25, wherein the first thickness is greater than the second thickness and the third thickness.

[0293] Paragraph 27:

[0294] The flexible printed circuit board according to any one of paragraphs 24 to 26, wherein the plurality of signal lines are arranged as follows:

[0295] forming a first gap between each other in the driving region,

[0296] forming a second interval smaller than the first interval between each other in the first fixing region, and

[0297] A third interval smaller than the first interval is formed between each other in the second fixing region.

[0298] Paragraph 28:

[0299] The flexible printed circuit board according to any one of Paragraphs 24 to 27, wherein the first cover layer has a thickness of 20 μm to 30 μm in the driving region, and a thickness of 10 μm to 15 μm in the first fixing region and the second fixing region.

[0300] Paragraph 29:

[0301] The flexible printed circuit board according to any one of paragraphs 24 to 28, wherein the plurality of signal lines form:

[0302] The spacing between the signal lines in the drive area is about 60 μm.

[0303] The interval between the signal lines in the first fixing area and the second fixing area is about 50 μm.

[0304] Segment 30:

[0305] The flexible printed circuit board according to any one of paragraphs 24 to 25, wherein the first thickness is smaller than the second thickness and the third thickness; and

[0306] Among them, multiple signal lines are arranged as follows:

[0307] forming a first gap between each other in the driving region,

[0308] forming a second interval greater than the first interval between each other in the first fixing region, and

[0309] A third interval greater than the first interval is formed between each other in the second fixing region.

[0310] Paragraph 31:

[0311] The flexible printed circuit board according to any one of paragraph 30, wherein the first cover layer has a thickness of 10 μm to 15 μm in the driving region and a thickness of 20 μm to 30 μm in the first fixing region and the second fixing region, and

[0312] Multiple signal lines are arranged as follows:

[0313] A spacing of 45 μm to 55 μm is formed between each other in the driving region, and

[0314] The first fixing region and the second fixing region are spaced apart from each other by a distance of 54 μm to 66 μm.

[0315] Paragraph 32:

[0316] The flexible printed circuit board according to any one of paragraphs 22 to 31, wherein the flexible printed circuit board further comprises:

[0317] a second substrate layer disposed on the first substrate layer opposite to the first metal layer;

[0318] a second metal layer disposed on the second substrate layer opposite to the first substrate layer; and

[0319] The second covering layer is arranged on the second base layer to cover the second metal layer.

[0320] Paragraph 33:

[0321] An electronic device comprising:

[0322] a display comprising a first region and a second region;

[0323] a first housing supporting the first region;

[0324] a second housing supporting a second region;

[0325] a hinge structure arranged to connect the first housing to the second housing based on a folding axis and to adjust a folding angle formed by the first housing and the second housing with respect to the folding axis; and

[0326] The flexible printed circuit board according to any one of paragraphs 22 to 32 extends across the folding axis in the extension direction to extend from a first space formed in the first shell to a second space formed in the second shell, wherein

[0327] an actuation region of the flexible printed circuit board straddling the fold axis and arranged to at least partially flex in response to a change in the fold angle;

[0328] The first fixing area extends from the driving area to the first space; and

[0329] The second fixing area extends from the driving area to the second space.

[0330] Paragraph 34:

[0331] The electronic device according to paragraph 33, wherein the hinge structure includes a hinge housing connecting the first housing to the second housing based on a folding axis, wherein the hinge structure further includes:

[0332] a first support plate connecting the first housing to the hinge housing; and

[0333] a second support plate connecting the second housing to the hinge housing,

[0334] Among them, the flexible printed circuit board also includes:

[0335] a first fastening member fixed to the first support plate; and

[0336] A second fastening member is fixed to the second support plate.

[0337] Paragraph 35:

[0338] The electronic device according to paragraph 34, wherein the first fastening member overlaps the driving area and the first fixing area when the display is viewed from above, and

[0339] The second fastening member overlaps the drive region and the second fixing region.

[0340] Paragraph 36:

[0341] The electronic device according to any one of paragraphs 34 to 35, wherein, based on the extension direction, the driving area includes:

[0342] a central portion disposed in the hinge housing;

[0343] a first bent portion extending from the central portion to the first fastening member and at least partially bent; and

[0344] a second curved portion extending from the central portion to the second fastening member and at least partially curved,

[0345] wherein the first fixing region includes a first extension portion extending from the first fastening member in a direction opposite to the central portion and at least partially fixed to the first housing,

[0346] Wherein, the second fixing region includes a second extending portion extending from the second fastening member in a direction opposite to the central portion and at least partially fixed to the second housing.

Claims

1. An electronic device (101; 201; 301), the electronic device (101; 201; 301) comprising: A display (250; 350) comprising a first area (250a; 350a) and a second area (250b; 350b); a first shell (210; 310), the first shell supporting the first area (250a; 350a); a second shell (220; 320), the second shell supporting the second area (250b; 350b); a hinge structure (340) that foldably connects the first shell (210; 310) to the second shell (220; 320) based on a folding axis (A) and adjusts a folding angle formed by the first shell (210; 310) and the second shell (220; 320) relative to the folding axis (A); as well as A flexible printed circuit board (290; 390; 590; 690), the flexible printed circuit board extending in an extension direction, The flexible printed circuit board (290; 390; 590; 690) comprises: a driving region (391; 591; 691) which spans the folding axis and is at least partially bent in response to a change in the folding angle; a first fixing region (392A; 592A; 692A) which extends from the driving region (391; 591; 691) to a first space (210a; 310a) formed by the first shell (210; 310); and a second fixing region (392B; 592B; 692B) which extends from the driving region (391; 591; 691) to a second space (220a; 320a) formed by the second shell (220; 320), The flexible printed circuit board (290; 390; 590; 690) comprises: a first substrate layer (4944; 5944; 6944), the first substrate layer comprising a first substrate surface and a second substrate surface opposite to the first substrate surface; a first metal layer (4943; 5943; 6943), the first metal layer being arranged on the second substrate surface and forming a plurality of signal lines (4946) extending in the extending direction; and a first covering layer (4941; 5941; 6941), the first covering layer being arranged to cover the first metal layer (4943; 5943; 6943) along the direction of the second substrate surface, wherein the thickness (t1) of the first covering layer (4941; 5941; 6941) in the driving area (391; 591; 691) is different from the thickness (t2) of the first covering layer (4941) in the first fixed area (392A; 592A; 692A) and the thickness (t3) of the first covering layer (4941) in the second fixed area (392B; 592B; 692B).

2. The electronic device according to claim 1, wherein: The first covering layer (4941; 5941; 6941) comprises: a first covering portion (4941a; 5941; 6941a) arranged in the driving region (491; 591; 691) and having a first thickness (t1); a second covering portion (4941b; 5941b; 6941b) arranged in the first fixing region (492A; 592A; 692A) and having a second thickness (t2) different from the first thickness (t1); and A third covering portion (4941c; 5941c; 6941c) is arranged in the second fixing area (492B; 592B; 692B) and has a third thickness (t3) different from the first thickness (t1).

3. The electronic device according to any one of claims 1 and 2, wherein: The first covering portion (4941a; 5941; 6941a), the second covering portion (4941b; 5941b; 6941b) and the third covering portion (4941c; 5941c; 6941c) are formed separately.

4. The electronic device according to any one of claims 1 to 3, wherein: The plurality of signal lines (5846; 6946) are arranged to extend in the extending direction and to form spaces between the plurality of signal lines (5846; 6946), and The spacing (d1) between the multiple signal lines (5946; 6946) in the driving area (491; 591; 691) is different from the spacing (d2) between the multiple signal lines (5946; 6946) in the first fixed area (492A; 592A; 692A) and the spacing (d3) between the multiple signal lines (5946; 6946) in the second fixed area (492B; 592B; 692B).

5. The electronic device according to any one of claims 1 to 4, wherein: The first thickness (t1) is greater than the second thickness (t2) and the third thickness (t3).

6. The electronic device according to claim 5, wherein: The plurality of signal lines (5946) are arranged as follows: A first interval (d1) is formed between each other in the driving area (591), are arranged to form a second interval (d2) smaller than the first interval (d1) between each other in the first fixing area (592A), and A third interval (d3) smaller than the first interval (d1) is formed between each other in the second fixing area (592B).

7. The electronic device according to any one of claims 5 to 6, wherein: The first cover layer (5941) has a thickness of 20 μm to 30 μm in the driving region (591), and a thickness of 10 μm to 15 μm in the first fixing region (592A) and the second fixing region (592B), and Wherein, the plurality of signal lines (5946) form: A spacing of about 60 μm between signal lines in the drive region (591), and There is a spacing of about 50 μm between each signal line in the first fixing area (592A) and the second fixing area (592B).

8. The electronic device according to any one of claims 1 to 4, wherein: The first thickness (t1) is smaller than the second thickness (t2) and the third thickness (t3).

9. The electronic device according to claim 8, wherein: The plurality of signal lines (6946) are arranged as follows: A first interval (d1) is formed between each other in the driving area (691), A second interval (d2) greater than the first interval (d1) is formed between the first fixing area (692A), and A third interval (d3) greater than the first interval (d1) is formed between each other in the second fixing area (692B).

10. The electronic device according to any one of claims 1 to 9, wherein: The first cover layer (6941) has a thickness of 10 μm to 15 μm in the driving region (691), and a thickness of 20 μm to 30 μm in the first fixing region (692A) and the second fixing region (692B), The plurality of signal lines (6946) are arranged as follows: A spacing of 45 μm to 55 μm is formed between each other in the driving region, and A space of 55 μm to 65 μm is formed between the first fixing region and the second fixing region.

11. The electronic device according to any one of claims 1 to 10, wherein: The hinge structure (340) further includes: a first support plate (331) connecting the first housing (310) to a hinge housing (346); and a second support plate (332) connecting the second housing (320) to the hinge housing (346), Wherein, the flexible printed circuit board (290; 390; 590; 690) further includes: a first fastening member (3931; 5931; 6931), the first fastening member is fixed to the first support plate (331); and a second fastening member (3932; 5932; 6932), the second fastening member is fixed to the second support plate (332).

12. The electronic device according to any one of claims 1 to 11, wherein: When the display (350) is viewed from above, the first fastening member (3931; 5931; 6931) is aligned with the driving region (391; 591; 691) and the first fixing region (392A; 592A; 692A) overlap, and The second fastening member (3932; 5932; 6932) overlaps the driving region (391; 591; 691) and the second fixing region (392B; 592B; 692B).

13. The electronic device according to any one of claims 1 to 12, wherein: Based on the extension direction, the driving area (391; 591; 691) include: a central portion (3911; 5911; 6911), the central portion being arranged in the hinge housing (334); a first curved portion (3912a; 5912a; 6912a) extending from the central portion (3911; 5911; 6911) to the first fastening member (3931; 5931; 6931) and at least partially curved; and a second curved portion (3912b; 5912b; 6912b) which extends from the central portion (3911; 5911; 6911) to the second fastening member (3932; 5932; 6932) and is at least partially curved, wherein the first fixing area (392A; 592A; 692A) comprises a first extension portion (3921; 5921; 6921) extending from the first fastening member (3931; 5931; 6931) in a direction opposite to the central portion (3911; 5911; 6911) and at least partially fixed to the first housing (210; 310), wherein the second fixing area (392B; 592B; 692B) includes a second extension portion (3922; 5922; 6922), which extends from the second fastening member (3932; 5932; 6932) in a direction opposite to the central portion (3911; 5911; 6911) and is at least partially fixed to the second shell (220; 320).

14. The electronic device according to any one of claims 1 to 13, wherein: The flexible printed circuit board (390; 590; 690) further includes: a second substrate layer (4954; 5954; 6954), the second substrate layer being arranged on the first substrate layer (4944; 5944; 6944) opposite to the first metal layer (4943; 5943; 6943); a second metal layer (4953; 5953; 6953) disposed on the second substrate layer (4954; 5954; 6954) opposite to the first substrate layer (4944; 5944; 6944); and A second covering layer (4951; 5951; 6951) is arranged on the second base layer (4954; 5954; 6954) to cover the second metal layer (4953; 5953; 6953).

15. The electronic device according to any one of claims 1 to 14, wherein: The flexible printed circuit board (390; 590; 690) is arranged so that the first substrate surface faces the rear surface of the display (250; 350).

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