Display panel, display device and video wall display device

Abstract

A display panel, a display device, and a splicing display device are disclosed. The display panel includes a first substrate, a plurality of first electrodes, a plurality of connecting leads, a connecting layer, a second substrate, and a plurality of second electrodes disposed on the side of the second substrate away from the first substrate. The first substrate includes a first surface and a second surface opposite to each other, and a plurality of side surfaces connecting the first surface and the second surface, at least one side surface being a selected side surface. The first surface includes a display area and a peripheral area located on at least one side of the display area, the peripheral area being closer to the selected side surface than the display area. The plurality of first electrodes are disposed in the peripheral area. The second substrate is disposed on the second surface. The connecting layer adheres to the first substrate and the second substrate; the orthographic projection of the connecting layer on the second surface falls within the orthographic projection range of the second substrate on the second surface. The connecting leads extend from the first surface through the selected side surface to the second surface, one end of the connecting lead being connected to a first electrode and the other end being connected to a second electrode.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display panel, display device, and splicing display device. Background Technology

[0002] The use of micro light-emitting diodes (LEDs) or mini light-emitting diodes (MIDs) as pixels in display panels has received widespread attention and research. Currently, due to the yield problem of mass transfer, it is impossible to manufacture large-size display devices in one go. Small-size display devices are usually spliced ​​together to form large-size spliced ​​display devices.

[0003] To reduce the bezel size of display devices and decrease the seam width of splicing display devices, individual display panels can currently use traces located on the side of the display panel to connect the traces on the display surface with drivers (such as circuit boards or driver chips) located on the non-display surface. As a result, when multiple display panels are combined to form a larger splicing display device, the spacing between adjacent display panels can be smaller, thereby improving display quality. Summary of the Invention

[0004] On one hand, a display panel is provided. The display panel includes a first substrate, a plurality of first electrodes, a second substrate, a plurality of second electrodes, a plurality of connecting leads, and a connecting layer. The first substrate includes opposing first and second surfaces, and a plurality of side surfaces connecting the first and second surfaces, at least one side surface being a selected side surface; the first surface includes a display area and a peripheral area located on at least one side of the display area, the peripheral area being closer to the selected side surface than the display area.

[0005] A second substrate is disposed on a second surface, and a plurality of second electrodes are disposed on the side of the second substrate away from the first substrate and close to a selected side. A connecting layer is disposed between the first substrate and the second substrate, and the connecting layer adheres to the first substrate and the second substrate; the orthographic projection of the connecting layer on the second surface falls within the orthographic projection range of the second substrate on the second surface. A connecting lead extends from the first surface through the selected side to the second surface; one end of the connecting lead is connected to the first electrode, and the other end is connected to the second electrode.

[0006] In some embodiments, the connecting layer includes at least one slot extending from the upper surface of the connecting layer to the lower surface of the connecting layer.

[0007] In some embodiments, the slotting includes at least one first slot and / or at least one second slot, wherein the first and second slots extend in different directions. The boundaries of the first and second slots do not overlap with the boundaries of the connecting layer.

[0008] In some embodiments, the slots penetrate the connecting layer in a predetermined direction, which is parallel to the lower surface of the connecting layer. When the connecting layer includes multiple slots, the multiple slots are spaced apart.

[0009] In some embodiments, when the slot penetrates the connecting layer along a first direction, the slot is located on the side of the second electrode away from the selected side. The first direction is parallel to the second surface and the selected side.

[0010] In some embodiments, the slots are mesh-like.

[0011] In some embodiments, the boundary of the connecting layer near the selected side is closer to the selected side than the boundary of the second substrate near the selected side.

[0012] In some embodiments, the boundary of the connecting layer near the selected side overlaps with the boundary of the second substrate near the selected side.

[0013] In some embodiments, the boundary of the interconnect layer near the selected side is further away from the selected side than the boundary of the second substrate near the selected side.

[0014] In some embodiments, the second substrate includes a main body and a plurality of protrusions disposed on the main body near a selected side, one end of each protrusion being connected to the main body and the other end extending toward the selected side. The plurality of protrusions are spaced apart along a first direction.

[0015] In some embodiments, in orthographic projection onto a reference surface, the protrusion overlaps with at least one second electrode; the reference surface is parallel to a selected side surface.

[0016] In some embodiments, the second substrate includes a plurality of first vias arranged in an array, the first vias extending from the upper surface of the second substrate to the lower surface of the second substrate.

[0017] In some embodiments, a plurality of first vias are arranged in multiple columns along a second direction, and at least one second electrode is disposed on both sides of each column of first vias. The second direction is perpendicular to the first direction and the selected side.

[0018] In some embodiments, along a first direction, the size of the first via is smaller than the gap between the two adjacent second electrodes.

[0019] In some embodiments, the connecting layer further includes a plurality of second vias extending from the upper surface of the connecting layer to the lower surface of the connecting layer, and the second vias communicating with the first vias.

[0020] In some embodiments, the display panel further includes a buffer layer disposed on the side of the second substrate away from the first substrate. The buffer layer covers the edge portion of the second substrate near a selected side, and connecting leads cross the buffer layer and are connected to a second electrode.

[0021] In some embodiments, the buffer layer does not overlap with the second electrode, and there is a gap between the buffer layer and the selected side.

[0022] In some embodiments, the buffer layer includes a first slope and a second slope connected together. Along a second direction, and from a selected side toward the second substrate, the height of the first slope gradually increases, and the height of the second slope gradually decreases, with a smooth transition between the first slope and the second slope.

[0023] In some embodiments, the slope angles of the first slope and the second slope are both acute angles.

[0024] In some embodiments, the edge portion of the second substrate near the selected side extends relative to the boundary of the connecting layer near the selected side, and the edge portion of the second substrate, together with the side and the second surface of the connecting layer, forms a gap region, and a portion of the buffer layer fills the gap region.

[0025] On the other hand, a display device is provided. The display device includes: an integrated circuit chip and a display panel as described in any of the above embodiments; the integrated circuit chip is electrically connected to a second electrode of the display panel.

[0026] In another aspect, a splicing display device is provided. The splicing display device includes: a plurality of display devices as described in the above embodiments, spliced ​​together.

[0027] In another aspect, a splicing display device is provided. The splicing display device includes: a plurality of display panels as described in any of the above embodiments, spliced ​​together. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0029] Figure 1 This is a cross-sectional structural diagram of a display panel according to some embodiments;

[0030] Figure 2 This is a cross-sectional structural diagram of a display panel during the manufacturing process according to some embodiments;

[0031] Figure 3 This is a structural diagram of one side of the first surface of a display panel according to some embodiments;

[0032] Figure 4This is a structural diagram of one side of the second surface of a display panel according to some embodiments;

[0033] Figure 5 For a display panel according to some embodiments Figure 4 Cross-sectional structure diagram of mid-section line AA;

[0034] Figure 6 According to Figure 5 An enlarged structural diagram of area B of the display panel shown;

[0035] Figure 7 According to Figure 5 Another enlarged view of area B of the display panel shown;

[0036] Figure 8 This is a structural diagram of the connection layer according to some embodiments;

[0037] Figure 9 This is a structural diagram of the connection layer according to some other embodiments;

[0038] Figure 10 This is a structural diagram of the connection layer according to some other embodiments;

[0039] Figure 11 This is a structural diagram of the connection layer according to some other embodiments;

[0040] Figure 12 This is a structural diagram of the connection layer according to some other embodiments;

[0041] Figure 13 This is a structural diagram of the connection layer according to some other embodiments;

[0042] Figure 14 This is a structural diagram of a second substrate according to some embodiments;

[0043] Figure 15 This is a structural diagram of a second substrate according to some other embodiments;

[0044] Figure 16 This is a structural diagram of a second substrate according to some other embodiments;

[0045] Figure 17 For a display panel according to some embodiments Figure 15 Cross-sectional structure diagram of the mid-section line CC;

[0046] Figure 18 This is a structural diagram of one side of the second surface of a display panel according to some embodiments;

[0047] Figure 19 This is a structural diagram of one side of the second surface of a display panel according to some other embodiments;

[0048] Figure 20 This is a structural diagram of a display device according to some embodiments;

[0049] Figure 21 This is a structural diagram of a splicing display device according to some embodiments. Detailed Implementation

[0050] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0051] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0052] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0053] In describing some embodiments, the terms "coupled" and "connected," and their derivative expressions, may be used. The term "connected" should be interpreted broadly; for example, a "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection via an intermediate medium. The term "coupled," for example, indicates that two or more components have direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0054] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0055] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0056] The use of “applies to” or “configured to” in this article implies an open and inclusive language that does not preclude applicability to or configuration to devices that perform additional tasks or steps.

[0057] In addition, the use of “based on” implies openness and inclusivity, because processes, steps, calculations or other actions “based on” one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0058] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0059] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0060] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0061] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0062] The following sections will describe the display panel, display device, and splicing display device provided in this disclosure.

[0063] In this disclosure, Figure 1 This is a cross-sectional structural diagram of a display panel according to some embodiments. To facilitate a clear description of the structural changes of the display panel during the manufacturing process, [the following is provided]. Figure 2 The structure of the first electrode 12 and the light-emitting device 201 of the display panel is not shown in the diagram. Figure 2 The diagram shown is a cross-sectional view of only the first substrate 11, electrode carrier 13', second electrode 14, adhesive 16', and connecting lead 15.

[0064] Figure 3 , Figure 4 , Figure 18 and Figure 19 This is a plan view of the display panel 100 according to some other embodiments. Figure 5According to Figure 4 The cross-sectional view of the display panel 100 obtained by section line AA in the figure. Figure 6 and Figure 7 According to Figure 5 An enlarged view of area B of the display panel shown.

[0065] The second electrode 14 and the connecting layer 16 are respectively disposed on opposite sides of the second substrate 13. To clearly describe the arrangement of the slot C in the connecting layer 16, the second electrode 14 and the connecting layer 16 are placed on one side of the second substrate 13, resulting in the following: Figures 8 to 13 This is a structural diagram of the connection layer. Figures 14 to 16 This is a structural diagram of the second substrate.

[0066] Figure 17 For the display panel 100 according to some embodiments along Figure 15 The cross-sectional structure diagram of the cross-section line CC in the figure is shown. In order to clearly describe the correspondence between the second via K2 on the connection layer 16 and the first via K1 on the second substrate 13, the structure of the first electrode 12 and the connecting lead 15 in the display panel 100 is not shown in the figure. Figure 20 This is a plan view of a display device 1000 according to some embodiments. Figure 21 This is a plan view of a splicing display device 2000 according to some embodiments.

[0067] In some embodiments, such as Figure 1 As shown, the display panel 100 includes: a first substrate 11, a driving circuit layer 19, a plurality of light-emitting devices 201, a plurality of first electrodes 12, an electrode carrier 13', a plurality of second electrodes 14, and a plurality of connecting leads 15. The first substrate 11 includes opposing first surfaces 11a and second surfaces 11b, and a plurality of side surfaces 11c connecting the first surfaces 11a and the second surfaces 11b, at least one side surface 11c being a selected side surface 11cc. The driving circuit layer 19, the light-emitting devices 201, and the first electrodes 12 are disposed on the first surface 11a, and the driving circuit layer 19 is electrically connected to the first electrodes 12 and the light-emitting devices 201, respectively. The electrode carrier 13' is disposed on the second surface 11b of the first substrate 11, and the second electrodes 14 are disposed on the side of the electrode carrier 13' away from the first substrate 11. One end of the connecting lead 15 is connected to the first electrode 12, and the other end of the connecting lead 15 extends from the first surface 11a through the selected side surface 11cc to the second surface 11b and is connected to the second electrode 14.

[0068] For example, the thickness of the first substrate 11 ranges from 0.1 mm to 1 mm.

[0069] For example, each first electrode 12 is disposed opposite to a second electrode 14 along a direction perpendicular to the first surface 11a of the first substrate 11. In a normal projection onto the first surface 11a, each first electrode 12 overlaps or substantially overlaps with a second electrode 14.

[0070] For example, such as Figure 1 As shown, the display panel 100 also includes a driving circuit board 21 disposed on the side of the second electrode 14 away from the first substrate 11. The driving circuit board 21 is configured to emit a driving signal, such as a display driving signal. The driving signal is transmitted sequentially through the second electrode 14, the connecting lead 15, and the first electrode 12 to the driving circuit layer 19, and then transmitted through the driving circuit layer 19 to the light-emitting device 201, thereby controlling the light-emitting device 201 to emit light and enabling the display panel 100 to display an image.

[0071] For example, the driving circuit layer 19 includes structures such as multiple signal lines and multiple pads, with the pads electrically connected to the signal lines. Each signal line is connected to a first electrode 12, for example, and the pins of the light-emitting device 201 are connected to the pads, for example.

[0072] In some examples, the electrode carrier 13' is bonded to the first substrate 11 by adhesive 16'. The electrode carrier 13' and adhesive 16' are approximately the same size, and the surface of the electrode carrier 13' near the first substrate 11 is completely covered by adhesive 16'. When the ambient temperature changes, the adhesive 16' will expand or contract due to the influence of the ambient temperature. The magnitude of the deformation of the adhesive 16' under temperature influence is related to the amount of ambient temperature change.

[0073] For example, in the manufacturing process of the display panel, after forming the connecting leads 15, a die bonding process is also included. This die bonding process fixes multiple light-emitting devices 201 onto the first substrate 11. In the die bonding process, for example, the pins of the multiple light-emitting devices 201 are soldered onto pads using a soldering process. During the soldering process, the ambient temperature (the temperature around the adhesive 16') rises, for example, from room temperature (20±5℃) to 150℃~380℃, and then gradually decreases back to room temperature. During this process, the ambient temperature changes significantly. The boundary between the electrode carrier 13' and the adhesive 16' near the selected side 11cc is, for example, approximately flush. During the ambient temperature change, the adhesive 16' expands due to heat during the temperature rise phase and then gradually shrinks during the temperature drop phase. During the expansion or contraction deformation of the adhesive 16' under the influence of temperature, the spacing between the second electrodes 14 will increase or decrease. The part of the connecting lead 15 located on the second surface 11b is connected to the second electrode 14. Therefore, during this process, the connecting lead 15 is subjected to tensile and / or shear forces, which can easily lead to breakage.

[0074] Meanwhile, because the first substrate 11 is relatively thin, the adhesive 16' expands or contracts under the influence of ambient temperature, which in turn causes the first substrate 11 to bend. For example, as... Figure 2 As shown, the adhesive 16' shrinks and deforms, causing the first substrate 11 to bend and deform. At this time, the second surface 11b of the first substrate 11 where the adhesive 16' is applied changes from a plane to a curved surface that bulges towards the first surface 11a. The bending of the first substrate 11 is, for example, greater than 0.1 mm. The connecting lead 15 is subjected to shear force along the first direction X and tensile force along the second direction Y, which poses a risk of breakage.

[0075] Based on this, embodiments of the present disclosure provide a display panel 100. For example... Figure 3 , Figure 4 and Figure 5 As shown, the display panel 100 includes a first substrate 11, a plurality of first electrodes 12, a second substrate 13, a plurality of second electrodes 14, a plurality of connecting leads 15, and a connecting layer 16.

[0076] like Figure 3 As shown, the first surface 11a includes a display area AA and a peripheral area AN located on at least one side of the display area AA, the peripheral area AN being closer to a selected side 11cc than the display area AA. A plurality of first electrodes 12 are arranged at intervals along a first direction X in the peripheral area AN. Figure 4 and Figure 5 As shown, a second substrate 13 is disposed on a second surface 11b, and a plurality of second electrodes 14 are disposed on the side of the second substrate 13 away from the first substrate 11. A first direction X is parallel to the second surface 11b and a selected side surface 11cc of the first substrate 11.

[0077] like Figure 5 As shown, the connecting lead 15 extends from the first surface 11a through a selected side 11cc to the second surface 11b. One end of the connecting lead 15 is connected to the first electrode 12, and the other end is connected to the second electrode 14. A connecting layer 16 is disposed between the first substrate 11 and the second substrate 13, and the connecting layer 16 adheres to the first substrate 11 and the second substrate 13; the orthographic projection of the second surface 11b falls within the orthographic projection range of the second substrate 13 on the second surface 11b.

[0078] like Figure 2As shown, the connecting layer 16 may expand or contract under the influence of temperature. The deformation of the connecting layer 16 in the first direction X and the second direction Y will have a stress effect on the connecting lead 15. For example, the deformation of the connecting layer 16 in the first direction X may cause the part of the connecting lead 15 connected to the second electrode 14 to be subjected to shear force, and the deformation of the connecting layer 16 in the second direction Y may cause the part of the connecting lead 15 connected to the second electrode 14 to be subjected to tensile force, thereby posing a risk of disconnection of the connecting lead 15.

[0079] By reducing the area of ​​the connecting layer 16, the connecting layer 16 only covers a portion of the surface of the second substrate 13 near the first substrate 11. Compared to a design where the connecting layer 16 completely covers the surface of the second substrate 13, the reduced contact area between the connecting layer 16 and the second substrate 13 and the first substrate 11 results in a smaller deformation of the connecting layer 16 when it expands or contracts under the influence of ambient temperature. This reduces the shear force and / or tensile force on the connecting lead 15, preventing the connecting lead 15 from breaking under the stress generated by the deformation of the connecting layer 16. This ensures the reliability of the connecting lead 15, allowing the driving signal to be transmitted to the light-emitting device 201 through the connecting lead 15, and ensuring that the display panel 100 can display normally.

[0080] Meanwhile, as the contact area between the connecting layer 16 and the second substrate 13 and the first substrate 11 is reduced, the bending deformation of the first substrate 11 is also reduced when the connecting layer 16 expands or contracts. This allows the first surface 11a and the second surface 11b of the first substrate 11 to remain planar (curvature less than 0.1 mm, remaining planar or approximately planar) during the fabrication of the display panel 100. This avoids the problem of the connecting lead 15 breaking due to the bending deformation of the first substrate 11 under tension, thus ensuring the reliability of the connecting lead 15 and enabling the driving signal to be transmitted to the light-emitting device 201 through the connecting lead 15, ensuring that the display panel 100 can display normally.

[0081] In some embodiments, the material of the connecting layer 16 includes, but is not limited to, at least one of thermosetting adhesive, pressure-sensitive adhesive, or textured adhesive.

[0082] For example, the coefficient of thermal expansion of the connecting layer 16 material is less than or equal to 20 PPM / ℃.

[0083] In some embodiments of this disclosure, the coefficient of thermal expansion of the material of the connecting layer 16 needs to be kept within a set range so that the deformation of the connecting layer 16 when it expands or contracts under the influence of ambient temperature is small. Therefore, when the connecting layer 16 deforms, the relative position change of the selected side of the second substrate 13 and the first substrate 11 is small, thereby reducing the force on the connecting lead 15 when the connecting layer 16 deforms, thus avoiding the problem of the connecting lead 15 breaking, thereby ensuring the reliability of the connecting lead 15, so that the driving signal can be transmitted to the light-emitting device 201 through the connecting lead 15, and ensuring that the display panel 100 can display normally.

[0084] See Figure 4 and Figure 5 Along the second direction Y, the distance between the boundary of the second electrode 14 near the selected side 11cc and the boundary of the second substrate 13 near the selected side 11cc is d2.

[0085] In some embodiments, 1.6mm ≥ d2 ≥ 1mm. Since a second substrate 13 and a connecting layer 16 are also provided between the second electrode 14 and the first substrate 11, the distance between the second electrode 14 and the first substrate 11 is relatively large. In the portion of the connecting lead 15 located on the second surface 11b, the distance between the portion located on the second substrate 13 and the portion near the selected side 11cc and the first substrate 11 is different. The portion of the connecting lead 15 connected to the second electrode 14 located on the second substrate 13 near the selected side 11cc is subjected to greater force, which makes the portion of the connecting lead 15 located on the second substrate 13 at risk of peeling off from the first substrate 11.

[0086] For example, when adhesive is used in the connecting layer 16, uneven application of the adhesive can cause air bubbles between the second substrate 13 and the first substrate 11. These air bubbles may exist between the first substrate 11 and the connecting layer 16, or between the connecting layer 16 and the second substrate 13. When the adhesive expands or contracts under the influence of ambient temperature, air bubbles may also be generated within the adhesive. When these air bubbles overflow from between the second substrate 13 and the first substrate 11 toward the selected side 11cc, air bubbles may exist between the portion of the connecting lead 15 near the selected side 11cc and the second surface 11b of the first substrate 11. This reduces the connection stability of the connecting lead 15, creating a risk that the connecting lead 15 may peel off from the first substrate 11, and creating a risk that the connection between the second electrode 14 and the connecting lead 15 may break.

[0087] In other embodiments, such as Figure 4 and Figure 5As shown, the boundary of the second electrode 14 near the selected side 11cc is farther away from the boundary of the second substrate 13 near the selected side 11cc than the boundary of the second substrate 13 near the selected side 11cc. Along the second direction Y, the distance between the boundary of the second electrode 14 near the selected side 11cc and the boundary of the second substrate 13 near the selected side 11cc is 0.5mm ≥ d21 ≥ 0.1mm.

[0088] For example, such as Figure 4 and Figure 5 As shown, the end of the connecting lead 15 that is close to the second electrode 14 is connected or overlaps.

[0089] When the connecting lead 15 overlaps with the second electrode 14, the contact area between the connecting lead 15 and the second electrode 14 is increased, reducing the risk of disconnection and thus increasing the connection stability. When the overlapping portions of the connecting lead 15 and the second electrode 14 along the second direction Y have the same size, by increasing the distance d2 between the boundary of the second electrode 14 near the selected side 11cc and the boundary of the second substrate 13 near the selected side 11cc, the size of the portion of the connecting lead 15 on the second substrate 13 is increased, increasing the contact area between the connecting lead 15 and the second substrate 13. This makes the connection between the connecting lead 15 and the second substrate 13 tighter, reducing the risk of the connecting lead 15 peeling off from the second substrate 13 and increasing the connection stability. This ensures the reliability of the connecting lead 15, allowing the driving signal to be transmitted to the light-emitting device 201 through the connecting lead 15, ensuring the display panel 100 can display normally.

[0090] The distance d2 between the boundary of the second electrode 14 near the selected side 11cc and the boundary of the second substrate 13 near the selected side 11cc can be selected according to design requirements. This is only an example and is not intended to limit the present disclosure.

[0091] For example, a plurality of first electrodes 12 are arranged at intervals along a first direction X, and each first electrode 12 extends along a second direction Y. The plurality of first electrodes 12 may have the same or different dimensions along the first direction X, and the plurality of first electrodes 12 have the same dimensions along the second direction Y.

[0092] For example, the spacing between any two adjacent first electrodes 12 may be the same or not exactly the same.

[0093] By controlling the spacing between adjacent first electrodes 12, during the formation of the connecting lead 15, while ensuring the effective connection between the connecting lead 15 and its corresponding first electrode 12, it prevents the connecting lead 15 from contacting other first electrodes 12 adjacent to its corresponding first electrode 12, thereby avoiding short circuits caused by the same connecting lead 15 being electrically connected to two or more first electrodes 12.

[0094] In some embodiments, such as Figure 5 As shown, the display panel 100 also includes a protective layer 18 that covers at least a plurality of connecting leads 15.

[0095] For example, the material of the protective layer 18 includes, but is not limited to, SiN (silicon nitride) or epoxy resin.

[0096] By setting a protective layer 18 to cover multiple connecting leads 15, the problem of water and oxygen corrosion caused by contact between the connecting leads 15 and air and / or moisture in the air is avoided. The protective layer 18 can also prevent the connecting leads 15 from contacting other conductive structures in the display panel 100, thereby avoiding short circuit problems. At the same time, the protective layer 18 can also prevent the connecting leads 15 from being damaged by bumps, reducing the problem of partial loss or breakage of the connecting leads 15 caused by bumps, thereby ensuring the reliability of the connecting leads 15, so that the driving signal can be transmitted to the light-emitting device 201 through the connecting leads 15, and ensuring that the display panel 100 can display normally.

[0097] For example, a protective layer 18 is formed on the side of the connecting lead 15 away from the first substrate 11 using a deposition process or a printing process. The protective layer 18 covers multiple connecting leads 15, thereby preventing the connecting leads 15 from coming into contact with air and / or water vapor in the air and causing water and oxygen corrosion.

[0098] For example, such as Figure 5 As shown, multiple connecting leads 15 are covered by a protective layer 18. The distance between the outermost boundary of the multiple connecting leads 15 and the boundary of the protective layer 18 is d14, where 22μm≥d14≥18μm.

[0099] For example, such as Figure 5 As shown, the protective layer 18 also covers portions of the plurality of second electrodes 14 near selected side 11cc; or, completely covers the plurality of second electrodes 14.

[0100] For example, such as Figure 5 As shown, the protective layer 18 at least covers the portion of the plurality of first electrodes 12 near the selected side 11cc; or completely covers the plurality of first electrodes 12.

[0101] The protective layer 18 covers the parts of the first electrode 12 and the second electrode 14 that do not need to be connected to other structures, thereby preventing the connecting lead 15 from coming into contact with air and / or water vapor in the air, which would cause water and oxygen corrosion. The protective layer 18 can also prevent the first electrode 12 and the second electrode 14 from coming into contact with other conductive structures in the display panel 100, thereby preventing short circuits. At the same time, the protective layer 18 can also prevent the first electrode 12 and the second electrode 14 from being damaged by impacts, reducing the problem of partial loss or breakage of the first electrode 12 and the second electrode 14 caused by impacts, thereby ensuring the reliability of the first electrode 12 and the second electrode 14, so that the driving signal can be transmitted to the light-emitting device 201 in sequence through the second electrode 14, the connecting lead 15 and the first electrode 12, ensuring that the display panel 100 can display normally.

[0102] In some embodiments, such as Figure 5 As shown, the display panel 100 further includes a buffer layer 17 disposed on the side of the second substrate 13 away from the first substrate 11. The buffer layer 17 covers the edge portion of the second substrate 13 near the selected side 11cc. A connecting lead 15 crosses the buffer layer 17 and is connected to the second electrode 14.

[0103] By setting a buffer layer 17, the adhesion between the portion of the second substrate 13 near the selected side 11cc and the first substrate 11 is increased, preventing the second electrode 14 from deviating from the set position due to the displacement of the second substrate 13. This ensures that the connecting lead 15 and the second electrode 14 can be effectively connected, thereby ensuring that the driving signal can be transmitted to the light-emitting device 201 through the connecting lead 15, and ensuring that the display panel 100 can display normally.

[0104] For example, the second substrate 13 expands and contracts under the influence of temperature. The buffer layer 17 fixes the second substrate 13 to the side close to the selected side 11cc. Since the position of the second electrode 14 is close to the selected side 11cc, it can be understood that the second electrode 14 can still be kept in the set position and will not be offset when the second substrate 13 expands and contracts. This ensures that the connecting lead 15 can be effectively connected to the second electrode 14.

[0105] In some examples, such as Figure 1 As shown, the distance k1 between the surface of the second electrode 14 away from the first substrate 11 and the first substrate 11 is greater than the thickness of the connecting lead 15. There is a significant step difference between the second electrode 14 and the first substrate 11. Therefore, when the connecting lead 15 extends from the second surface 11b of the first substrate 11 to the second substrate 13 and connects with the second electrode 14, it is prone to breakage at the step difference position, which prevents the drive signal from being transmitted normally.

[0106] For example, the material of the buffer layer 17 includes, but is not limited to, reinforcing adhesive.

[0107] For example, the coefficient of thermal expansion of the material of the buffer layer 17 is less than or equal to 20 PPM / ℃.

[0108] The coefficient of thermal expansion of the material of the buffer layer 17 needs to be within the set range so that the deformation of the buffer layer 17 when it expands or contracts under the influence of ambient temperature is small. This avoids the problem that the second substrate 13 will be displaced due to the expansion and contraction deformation of the buffer layer 17, causing the second electrode 14 to deviate from the set position, and ensures that the connecting lead 15 can maintain an effective connection with the second electrode 14.

[0109] For example, after the second substrate 13 is attached, a reinforcing adhesive is printed on the edge of the second substrate 13 near the selected side 11cc using a printing process to fill the step difference position, thereby reducing the step difference when the connecting lead 15 extends from the second surface 11b to the surface of the second substrate 13, thus preventing the problem of the driving signal not being able to be transmitted normally due to the breakage of the connecting lead 15.

[0110] In some embodiments, the thickness of the second electrode 14 is less than 5 μm, such as... Figure 6 As shown, the buffer layer 17 does not overlap with the second electrode 14.

[0111] In other embodiments, the thickness of the second electrode 14 is greater than or equal to 5 μm, such as... Figure 7 As shown, the buffer layer 17 also covers the edge portion of the second electrode 14 near the selected side 11cc.

[0112] By placing the buffer layer 17 on the second electrode 14 away from the selected side 11cc, the buffer layer 17 overlaps with the second electrode 14. This fills the step difference between the side of the second electrode 14 closest to the selected side 11cc and the second substrate 13, reducing the step difference when the connecting lead 15 extends from the second substrate 13 to the surface of the second electrode 14, thereby preventing the problem of the driving signal not being able to be transmitted normally due to the breakage of the connecting lead 15.

[0113] For example, such as Figure 7 As shown, along the second direction Y, the size d17 of the overlapping portion between the buffer layer 17 and the second electrode 14 is less than or equal to 100 μm.

[0114] In some embodiments, such as Figure 6 and Figure 7 As shown, the buffer layer 17 includes a first slope 171 and a second slope 172 connected together. Along the second direction Y, and from the selected side 11cc to the second substrate 13, the height of the first slope 171 gradually increases, and the height of the second slope 172 gradually decreases, with a smooth transition between the first slope 171 and the second slope 172.

[0115] The first slope 171 is closer to the selected side 11cc than the second slope 172. The connecting lead 15 is disposed, for example, on the side of the buffer layer 17 away from the first substrate 11. The connecting lead 15 is located on the second surface 11b of the first substrate 11. From the selected side 11cc towards the second electrode 14, the distance between the connecting lead 15 and the first substrate 11 along the third direction Z gradually increases. The third direction Z is perpendicular to the second surface 11b of the first substrate 11 and parallel to the selected side 11cc.

[0116] Compared to the portion of the connecting lead 15 located on the second surface 11b that crosses the second substrate 13 near the selected side 11cc and connects to the second electrode 14, this reduces the variation in distance between the connecting lead 15 and the first substrate 11 along the third direction Z, avoiding the problem of connecting lead 15 breaking due to large step differences, ensuring the reliability of the connecting lead 15, ensuring effective connection between the second electrode 14 and the connecting lead 15, enabling the driving signal to be transmitted to the light-emitting device 201 through the connecting lead 15, and ensuring that the display panel 100 can display normally.

[0117] For example, such as Figure 5 As shown, the buffer layer 17 is far from the surface of the first substrate 11 and arches in a direction away from the first substrate 11, forming a hill shape.

[0118] In some embodiments, such as Figure 6 and Figure 7 As shown, the slope angles of the first slope 171 and the second slope 172 are both acute angles.

[0119] With this design, the distance between the connecting lead 15 extending from the second surface 11b of the first substrate 11 to the second substrate 13 and connecting with the second electrode 14 gradually increases. The gentler the increase in distance, the closer the connecting lead 15 is to being disposed on a plane. Therefore, the slope angles of the first slope 171 and the second slope 172 are set to acute angles to ensure that the connecting lead 15 can be approximately disposed on a plane, thereby reducing the risk of breakage of the connecting lead 15, ensuring that the connecting lead 15 and the second electrode 14 can be effectively connected, and thus ensuring that the driving signal can be transmitted to the light-emitting device 201 through the connecting lead 15, and ensuring that the display panel 100 can display normally.

[0120] For example, such as Figure 6 and Figure 7 As shown, the angle between the tangent plane at any point on the first slope 171 and the second slope 172 and the second surface 11b is α, where 50°≥α≥30°.

[0121] In some embodiments, such as Figure 6 and Figure 7 As shown, the edge portion of the second substrate 13 near the selected side 11cc extends relative to the boundary of the connecting layer 16 near the selected side 11cc. The edge portion of the second substrate 13, the side 11c and the second surface 11b of the connecting layer 16 form a gap region Q, and a portion of the buffer layer 17 fills the gap region Q.

[0122] By setting the buffer layer 17, while filling the gap area Q between the portion of the second substrate 13 near the selected side 11cc and the first substrate 11, it also serves to connect the second substrate 13 and the first substrate 11, ensuring the tightness of the adhesion between the second substrate 13 and the first substrate 11, preventing the edge portion of the second substrate 13 from lifting, thereby reducing the risk of the connecting lead 15 breaking under the action of the lifted portion of the second substrate 13 when the edge portion of the second substrate 13 lifts, ensuring the reliability of the connecting lead 15, and enabling the driving signal to be transmitted to the light-emitting device 201 through the connecting lead 15, ensuring that the display panel 100 can display normally.

[0123] For example, such as Figure 6 and Figure 7 As shown, along the third direction Z, the distance between the buffer layer 17 and the second substrate 13 is d10, 120μm≥d10>0.

[0124] In some examples, such as Figure 7 As shown, the buffer layer 17 covers the edge portion of the second electrode 14 near the selected side 11cc. Along the third direction Z, the distance between the buffer layer 17 and the second electrode 14 is d16, where 20μm≥d16>0.

[0125] In some embodiments, such as Figure 5 As shown, there is a gap between the buffer layer 17 and the selected side 11cc.

[0126] It is understandable that the buffer layer 17 is close to the boundary of the selected side 11cc, and there may be a certain gap between it and the selected side 11cc, or they may overlap or roughly overlap.

[0127] In some embodiments, such as Figure 5 As shown, along the second direction Y, the distance between the second substrate 13 and the selected side 11cc is d12. For example, 1.1mm ≥ d12 ≥ 0.9mm.

[0128] It is understandable that by controlling the distance between the second substrate 13 and the selected side 11cc, compared to the design where the boundary of the second substrate 13 near the selected side 11cc overlaps or substantially overlaps with the selected side 11cc, while reserving space for the installation of the buffer layer 17, the length of the portion of the connecting lead 15 located between the second substrate 13 and the selected side 11cc is extended. Combined with the installation of the buffer layer 17, the connecting lead 15 can be approximately installed on a plane, thereby reducing the risk of the connecting lead 15 breaking under the influence of the step difference between the second electrode 14 and the first substrate 11.

[0129] For example, such as Figure 6 and Figure 7 As shown, along the second direction Y, the size of the buffer layer 17 is d13, where d13 ≥ 0.6 mm.

[0130] For example, such as Figure 6 and Figure 7 As shown, along the second direction Y, the distance between the buffer layer 17 away from the boundary of the selected side 11cc and the boundary of the second substrate 13 near the selected side 11cc is d131, 0.3mm≥d131≥0.2mm.

[0131] For example, such as Figure 6 and Figure 7 As shown, along the second direction Y, the distance between the buffer layer 17 near the boundary of the selected side 11cc and the second substrate 13 near the boundary of the selected side 11cc is d132, 0.3mm≥d132≥0.2mm.

[0132] See Figure 6 and Figure 7 The distance between the boundary of the connecting layer 16 near the selected side 11cc and the boundary of the second substrate 13 near the selected side 11cc is d3.

[0133] like Figure 1 In the display panel shown, the second electrode 14 is far from the surface of the first substrate 11, and the distance k1 between the second electrode 14 and the first substrate 11 is relatively large, for example, 100 μm. Thus, there is a large step difference in the part of the second electrode 14 near the selected side 11cc. The part of the connecting lead 15 located at this step difference position is subjected to greater force. When the first substrate 11 bends or when the electrode carrier 1' moves relative to the first substrate 11, the connecting lead 15 is prone to breakage, resulting in an open circuit in the display panel. This causes the electrical signal to be unable to be transmitted normally, making the display panel unable to display normally.

[0134] In some embodiments, such as Figure 6 and Figure 7As shown, the boundary of the connecting layer 16 near the selected side 11cc is farther away from the selected side 11cc than the boundary of the second substrate 13 near the selected side 11cc; or, the boundary of the connecting layer 16 near the selected side 11cc overlaps or substantially overlaps with the boundary of the second substrate 13 near the selected side 11cc.

[0135] For example, 0.3mm ≥ d3 > 0.

[0136] Adopting such Figure 6 and Figure 7 In the design shown, the distance between the portion of the second substrate 13 excluding the connecting layer 16 and the first substrate 11 is smaller than the distance between the portion of the second substrate 13 and the first substrate 11 including the connecting layer 16. With this design, when the second substrate 13 is attached to the second surface 11b of the first substrate 11, while ensuring effective attachment of the second substrate 13, the distance between the connecting lead 15 located on the second substrate 13 near the boundary of the selected side 11cc and the first substrate 11 gradually increases in the direction gradually moving away from the selected side 11cc. Compared to using... Figure 1 The design shown reduces the step difference between the second substrate 13 and the first substrate 11 near the selected side 11cc, thereby reducing the force on the connecting lead 15 at the step difference and preventing the connecting lead 15 from breaking due to excessive force. This ensures the reliability of the connecting lead 15 and allows the driving signal to be transmitted to the light-emitting device 201 through the connecting lead 15, ensuring that the display panel 100 can display normally.

[0137] In some embodiments, such as Figure 8 , Figure 9 , Figure 10 and Figure 11 As shown, the connecting layer 16 includes at least one slot C, which extends from the upper surface of the connecting layer 16 to the lower surface of the connecting layer 16.

[0138] During the manufacturing process of the display panel, such as the die bonding process, a large amount of heat is generated, which causes the interconnect layer 16 to expand or contract and deform under the influence of ambient temperature. The deformation of the interconnect layer 16 causes a change in the relative position between the second substrate 13 and the first substrate 11, which in turn causes a change in the relative position between the second electrode 14 and the connecting lead 15, making the connecting lead 15 susceptible to breakage. At the same time, the interconnect layer 16 is attached to the surface of the first substrate 11. Therefore, the expansion and contraction deformation of the interconnect layer 16 will also cause the first substrate 11 to bend and deform, further increasing the risk of breakage of the connecting lead 15.

[0139] By patterning the connecting layer 16 and creating slots C on it, the slots C can disperse the high-temperature stress on the connecting layer 16 when the ambient temperature changes, thereby reducing the deformation of the connecting layer 16 caused by the ambient temperature and thus reducing the risk of breakage of the connecting leads 15 during the manufacturing process of the display panel. Simultaneously, because the deformation of the connecting layer 16 caused by the ambient temperature is reduced, the bending deformation of the first substrate 11 caused by the deformation of the connecting layer 16 is also reduced, further reducing the risk of breakage of the connecting leads 15 during the manufacturing process of the display panel.

[0140] Meanwhile, when attaching the second substrate 13, air bubbles may exist between the connecting layer 16 and the first substrate 11 and / or between the connecting layer 16 and the second substrate 13 due to uneven attachment. When the adhesive material expands or contracts under the influence of ambient temperature, air bubbles may also be generated in the adhesive material. The air bubbles can be discharged through the groove C, thereby ensuring the flatness and tightness of the attachment between the second substrate 13 and the first substrate 11.

[0141] It is understood that the slot C can be perpendicularly penetrating from the upper surface of the connecting layer 16 to the lower surface of the connecting layer 16, or the slot C can be obliquely penetrating from the upper surface of the connecting layer 16 to the lower surface of the connecting layer 16. For example, the slot C penetrates the connecting layer 16 along a third direction Z, which is perpendicular to the first direction X and the second surface 11b. Alternatively, the direction in which the slot C penetrates the connecting layer 16 forms an angle θ with the upper or lower surface of the connecting layer 16, where 90° ≥ θ > 0.

[0142] This is provided as an example only and is not intended to limit the scope of this disclosure.

[0143] For example, such as Figure 8 As shown, the dimension of the slot C perpendicular to its extension direction is c, where 5mm ≥ c ≥ 1mm.

[0144] If the size of the slot C is too large, the slotted portion of the connecting layer 16 will be too large, resulting in a small area for bonding, which will affect the bonding effect of the connecting layer 16. Conversely, if the size of the slot C is too small, the slot C may close due to expansion and deformation when the connecting layer 16 expands, affecting its ability to disperse the high-temperature stress on the connecting layer 16. By controlling the width of the slot C, the high-temperature stress on the connecting layer 16 is effectively dispersed while ensuring the bonding effect of the connecting layer 16, making the second substrate 13 adhere firmly and preventing poor adhesion of the second substrate 13 from causing poor connection between the second electrode 14 and the connecting lead 15.

[0145] For example, such as Figure 8As shown, when the connecting layer 16 includes multiple slots C, the distance between any two adjacent slots C is d4, where d4 ≥ 10 mm.

[0146] For example, such as Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 12 and Figure 13 As shown, along the second direction Y, the slot C closest to the second electrode 14 has a distance of d5 between it and the second electrode 14, where d5 ≥ 5 mm.

[0147] When attaching the second substrate 13, air bubbles may exist between the connecting layer 16 and the first substrate 11 and / or between the connecting layer 16 and the second substrate 13 due to uneven attachment. When the adhesive expands or contracts under the influence of ambient temperature, air bubbles may also be generated in the adhesive. The air bubbles can be discharged through the slot C. When the distance between the slot C and the second electrode 14 is too small, the air bubbles may overflow to the position between the second electrode 14 and the first substrate 11, and there is a possibility that the air bubbles may further overflow in the direction of the selected side 11cc of the first substrate 11, resulting in air bubbles in the part between the connecting lead 15 and the first substrate 11, which affects the flatness and tightness of the attachment between the connecting lead 15 and the first substrate 11.

[0148] By controlling the distance between the slot C and the second electrode 14, air bubbles generated during the attachment of the second substrate 13 are prevented from overflowing to the position between the second electrode 14 and the first substrate 11. This ensures the tightness of the attachment between the second substrate 13 and the first substrate 11, while preventing the connecting lead 15 from breaking due to the attachment air bubbles of the second substrate 13 or causing poor connection between the second electrode 14 and the connecting lead 15. This ensures the reliability of the connecting lead 15, allowing the driving signal to be transmitted to the light-emitting device 201 through the connecting lead 15, and ensuring that the display panel 100 can display normally.

[0149] In some embodiments, such as Figure 8 As shown, the slot C includes at least one first slot C1 and / or at least one second slot C2, wherein the first slot C1 and the second slot C2 extend in different directions. The boundaries of the first slot C1 and the second slot C2 do not overlap with the boundary of the connecting layer 16.

[0150] By setting slots C (first slot C1 and / or second slot C2) in the connecting layer 16, the bonding area of ​​the connecting layer 16 is reduced while ensuring the bonding effect of the second substrate 13. This reduces the overall expansion and contraction deformation of the connecting layer 16 under the influence of ambient temperature, etc. At the same time, by setting the first slot C1 and / or second slot C2 in the connecting layer 16, the expansion and contraction deformation of the connecting layer 16 in the direction perpendicular to the extension direction of the first slot C1 and / or second slot C2 can be improved. This reduces the deformation of the first substrate 11 under the influence of the expansion and contraction deformation of the connecting layer 16, while reducing the risk of breakage of the connecting lead 15 caused by the expansion and contraction deformation of the connecting layer 16. This ensures the reliability of the connecting lead 15, allowing the driving signal to be transmitted to the light-emitting device 201 through the connecting lead 15, and ensuring that the display panel 100 can display normally.

[0151] like Figure 8 As shown, the first slot C1 and the second slot C2 are located within the connecting layer 16. Therefore, there are no gaps at the boundary of the connecting layer 16, which allows the edge of the connecting layer 16 to be well covered and not easily lifted, effectively avoiding the problem of poor adhesion of the second substrate 13 caused by the edge of the connecting layer 16 lifting. Meanwhile, the first slot C1 and / or the second slot C2 can also serve as venting channels. When the second substrate 13 is attached, air bubbles may exist between the connecting layer 16 and the first substrate 11 and / or between the connecting layer 16 and the second substrate 13 due to uneven attachment. When the adhesive material expands or contracts under the influence of ambient temperature, air bubbles may also be generated in the adhesive material. These air bubbles can be discharged through the first slot C1 and the second slot C2, thereby ensuring the tightness of the attachment between the second substrate 13 and the first substrate 11. This prevents air bubbles from overflowing in the selected side 1cc direction, which could lead to poor bonding between the connecting lead 15 and the first substrate 11. It also prevents the connecting lead 15 from peeling off from the first substrate 11, reduces the risk of breakage of the connecting lead 15, ensures the reliability of the connecting lead 15, and enables the driving signal to be transmitted to the light-emitting device 201 through the connecting lead 15, ensuring that the display panel 100 can display normally.

[0152] For example, such as Figure 8 As shown, the dimension of the slot C along the first direction X is smaller than the dimension of the connecting layer 16 along the first direction X. The dimension of the slot C along the second direction Y is smaller than the dimension of the connecting layer 16 along the second direction Y.

[0153] In some embodiments, such as Figure 9 , Figure 10 and Figure 11 As shown, the slot C penetrates the connecting layer 16 along a predetermined direction. When the connecting layer 16 includes multiple slots C, the multiple slots C are spaced apart. The predetermined direction is parallel to the upper or lower surface of the connecting layer 16.

[0154] For example, the extension directions of the multiple slots C may be the same or not exactly the same. When the extension directions of the multiple slots C are not exactly the same, the extension directions of the multiple slots C are allowed to intersect.

[0155] In some examples, at least two of the multiple slots C intersect.

[0156] It is understood that the connection layer 16 may include only one slot C extending in any direction, or multiple slots C spaced apart extending in the same direction, or multiple slots C with not exactly the same extension direction. It is understood that the multiple slots may have one or more extension directions.

[0157] By providing a slot C extending in a set direction within the connection layer 16, the bonding area of ​​the connection layer 16 is reduced while ensuring the bonding effect of the second substrate 13. This reduces the overall expansion and contraction deformation of the connection layer 16 under the influence of ambient temperature and other factors, thereby reducing the risk of breakage of the connection lead 15 due to the expansion and contraction deformation of the connection layer 16.

[0158] Meanwhile, the slot C also serves as a venting channel. When the second substrate 13 is attached, air bubbles may exist between the connecting layer 16 and the first substrate 11 and / or between the connecting layer 16 and the second substrate 13 due to uneven attachment. Under the influence of ambient temperature, when the adhesive material expands or contracts, air bubbles may also be generated within the adhesive material. These air bubbles can be discharged through the slot C, thereby ensuring the tightness of the attachment between the second substrate 13 and the first substrate 11. This prevents air bubbles from overflowing in the selected side 1cc direction, which could lead to poor bonding between the connecting lead 15 and the first substrate 11. It also prevents the connecting lead 15 from peeling off from the first substrate 11, reduces the risk of breakage of the connecting lead 15, ensures the reliability of the connecting lead 15, and enables the driving signal to be transmitted to the light-emitting device 201 through the connecting lead 15, ensuring that the display panel 100 can display normally.

[0159] For example, the direction can be set parallel to the selected side 11cc, or the direction can be set perpendicular to the selected side 11cc, or the angle formed between the direction and the selected side 11cc can be an acute angle.

[0160] In some examples, such as Figure 9 As shown, the slot C penetrates the connecting layer 16 along the first direction X.

[0161] In other examples, such as Figure 10 As shown, part of the slot C penetrates the connecting layer 16 along the first direction X, and part of the slot C penetrates the connecting layer 16 along the second direction Y.

[0162] The distance between the boundary of the connecting layer 16 and the second electrode 14 along the second direction Y is d6, where d6 ≥ 5 mm.

[0163] like Figure 9 and Figure 10 As shown, when the slot C penetrates the connecting layer 16 along the first direction X, the distance d5 between the slot C closest to the second electrode 14 and the second electrode 14 is equal to the distance d6 between the boundary of the connecting layer 16 and the second electrode 14 along the second direction Y.

[0164] In some other examples, such as Figure 11 As shown, multiple slots C obliquely penetrate the connecting layer 16, and the extension directions of the multiple slots C are different. The angle formed between the extension direction of each slot C and the selected side 11cc is an acute angle.

[0165] In some embodiments, such as Figure 9 As shown, when the slot C penetrates the connecting layer 16 along the first direction X, the slot C is located on the side of the second electrode 14 away from the selected side 11cc.

[0166] When the second substrate 13 is attached, air bubbles may form between the connecting layer 16 and the first substrate 11 and / or between the connecting layer 16 and the second substrate 13 due to uneven attachment, or when the adhesive expands or contracts under the influence of ambient temperature. When these air bubbles are expelled through the slot C, the connecting layer 16 may lift up at the boundary of the slot C. If the lifted part is located between the second electrode 14 and the first substrate 11, it may cause the second electrode 14 to deviate from the preset position. This may result in the connecting lead 15 and the second electrode 14 not being able to connect effectively, and the driving signal cannot be transmitted to the light-emitting device 201 normally, causing the display panel to fail to display normally.

[0167] By setting the slot C on the side of the second electrode 14 away from the selected side 11cc, the connecting layer 16 is prevented from lifting at the boundary of the slot C, thereby ensuring that the connecting lead 15 and the second electrode 14 can be effectively connected, and thus ensuring that the driving signal can be transmitted to the light-emitting device 201 through the connecting lead 15, and ensuring that the display panel 100 can display normally.

[0168] In some embodiments, such as Figure 12 and Figure 13 As shown, there are multiple slots C, which intersect each other and can form a grid.

[0169] For example, when forming the connecting layer 16, a single, solid parent layer may be formed first, and then grid-like slots C may be formed in the solid parent layer to obtain multiple blocks arranged in an array; or, when forming the connecting layer 16, the multiple blocks arranged in an array may be formed directly. When the connecting layer 16 includes multiple blocks, the shape of the blocks may include, but is not limited to, at least one of the following shapes: rectangle, trapezoid, triangle, or parallelogram.

[0170] like Figure 12 and Figure 13 As shown, when the shape of the connecting layer 16 is an array of multiple blocks, all of the multiple blocks are located on the side of the second electrode 14 away from the selected side 11cc.

[0171] For example, the distance between the boundary of the block closest to the second electrode 14 and the second electrode 14 along the second direction Y is d6, where d6 ≥ 5 mm.

[0172] In some embodiments, such as Figures 8 to 16 As shown, the second substrate 13 includes a main body 131 and a plurality of protrusions 132 disposed on the side of the main body 131 near the selected side 11cc. One end of each protrusion 132 is connected to the main body 131, and the other end extends toward the selected side 11cc. The plurality of protrusions 132 are spaced apart along a first direction X, which is parallel to the first surface 11a and the selected side 11cc.

[0173] During the fabrication process of the display panel 100, such as the high temperature generated in the die bonding process, the second substrate 13 is affected by temperature. The material of the second substrate 13 will deform under the influence of temperature change, which will cause the position of the second electrode 14 on it to deviate from the preset position, making the connection between the connecting lead 15 and the second electrode 14 unreliable and posing a risk of disconnection.

[0174] By patterning the side of the second substrate 13 near the selected side 11cc, multiple protrusions 132 are formed on the side of the second substrate 13 near the selected side 11cc. Compared with the design of a flat boundary that is flush with the selected side 11cc, the area of ​​the side surface of the second substrate 13 is increased, which allows the second substrate 13 to dissipate heat better and reduces the area of ​​the second substrate 13. This reduces the deformation of the material of the second substrate 13 under temperature changes, thereby ensuring the connection reliability of the second electrode 14 and the connecting lead 15. This allows the driving signal to be transmitted to the light-emitting device 201 through the second electrode 14 and the connecting lead 15, ensuring that the display panel 100 can display normally. Meanwhile, the patterned boundary of the second substrate 13 can disperse edge stress, reduce the impact of ambient temperature changes on the second substrate 13, reduce the deformation of the second substrate 13 caused by temperature, and ensure that the second electrode 14 on the second substrate 13 can be kept in a set position without deformation, thereby ensuring that the connecting lead 15 and the second electrode 14 can be effectively connected, and thus ensuring that the driving signal can be transmitted to the light-emitting device 201 through the connecting lead 15, and ensuring that the display panel 100 can display normally.

[0175] For example, the material of the second substrate 13 includes, but is not limited to, polyimide (PI, Polyimide Film).

[0176] For example, the material of the second electrode 14 includes, but is not limited to, copper foil.

[0177] In some embodiments, in a positive projection onto the reference plane M, the protrusion 132 overlaps with at least one second electrode 14; the reference plane M is parallel to a selected side surface 11cc.

[0178] It is understood that at least one second electrode 14 is provided corresponding to each protrusion 132. For example... Figure 4 and Figure 5 As shown, each protrusion 132 is provided with one, two or three second electrodes 14.

[0179] This is provided as an example only and is not intended to limit the scope of this disclosure.

[0180] For example, such as Figure 16 As shown, along the second direction Y, the dimension of the protrusion 132 is d8, where d8 ≥ 0.2 mm.

[0181] By controlling the width of the protrusion 132 (e.g., along the protrusion 132) Figure 4 and Figure 5 The dimensions in the second direction Y shown are used to prevent the protrusion 132 from being too small, which would cause it to not adhere firmly to the first substrate 11 and cause the position of the second electrode 14 to deviate from the preset position. This would result in the connection lead 15 and the second electrode 14 possibly failing to connect effectively. The effective bonding area of ​​the protrusion 132 is ensured, thereby ensuring the tightness of the fit between the protrusion 132 and the first substrate 11. This ensures that the connection lead 15 and the second electrode 14 can be effectively connected, so that the driving signal can be transmitted to the light-emitting device 201 through the connection lead 15, and the display panel 100 can display normally.

[0182] For example, such as Figure 16 As shown, along the first direction X, the distance between any two adjacent second electrodes 14 is d1, and the distance between any two adjacent protrusions 132 is d7, where d11 > d1 > d7 ≥ 30 μm.

[0183] It should be noted that, as Figure 16 As shown, any protrusion 132 is correspondingly disposed with at least one second electrode 14, and the at least one second electrode 14 corresponding to each protrusion 132 is regarded as an electrode group W. The distance d1 between any two adjacent second electrodes 14 is greater than the distance d7 between any two adjacent protrusions 132. Here, any two adjacent second electrodes 14 belong to the two electrode groups W corresponding to the two protrusions 132 respectively.

[0184] By controlling the spacing between two adjacent protrusions 132, the effective bonding area of ​​the protrusions 132 is ensured while increasing the surface area of ​​the side surface of the connecting layer 16. This allows the connecting layer 16 to dissipate heat better, disperse the high-temperature stress on the connecting layer 16, and thus reduce the deformation caused by the ambient temperature, thereby reducing the risk of breakage of the connecting lead 15 during the manufacturing process of the display panel. Simultaneously, because the deformation caused by the ambient temperature on the connecting layer 16 is reduced, the bending deformation of the first substrate 11 caused by the deformation of the connecting layer 16 is also reduced, further reducing the risk of breakage of the connecting lead 15 during the manufacturing process of the display panel.

[0185] In some examples, such as Figure 16 As shown, along the first direction X, the size of the protrusion 132 is greater than the distance between the outermost boundaries of the k second electrodes 14 corresponding to the protrusion 132. Each protrusion 132 is provided corresponding to k second electrodes 14, where k is a positive integer, greater than or equal to 1.

[0186] Along the first direction X, the dimension of the protrusion 132 is d15. Among them, a q For the k second electrodes 14 corresponding to the protrusion 132, the dimension of the q-th second electrode 14 along the first direction X is... The sum of the dimensions of the k second electrodes 14 corresponding to the protrusion 132 along the first direction X, where k ≥ q ≥ 1.

[0187] For example, such as Figure 18 As shown, along the first direction X, the size of the second electrode 14 is a, where a ≥ 0.06 mm.

[0188] For example, such as Figure 18 As shown, along the second direction Y, the size of the second electrode 14 is b, 0.2mm ≥ b ≥ 0.08mm.

[0189] It is understandable that, among the k second electrodes 14 corresponding to each protrusion 132, the size a of the k first electrodes 12 is... q They can all be the same; or the dimensions a of the k first electrodes 12 can be the same. q Not exactly the same.

[0190] In some embodiments, such as Figure 14 , Figure 15 , Figure 16 and Figure 17 As shown, the second substrate 13 includes a plurality of first vias K1 arranged in an array, the first vias K1 extending from the upper surface of the second substrate 13 to the lower surface of the second substrate 13.

[0191] When attaching the second substrate 13, air bubbles may exist between the connecting layer 16 and the second substrate 13 due to uneven attachment, and / or air bubbles may also be generated in the adhesive material when it expands or contracts under the influence of ambient temperature. The air bubbles can be discharged through the slot C on the connecting layer 16 and / or through the first via K1, thereby ensuring the flatness and tightness of the attachment between the second substrate 13 and the connecting layer 16, and in turn ensuring the flatness and tightness of the attachment between the second substrate 13 and the first substrate 11. This prevents the connecting lead 15 from breaking due to the air bubbles attached to the second substrate 13 or causing poor connection between the second electrode 14 and the connecting lead 15, ensuring the reliability of the connecting lead 15, and enabling the driving signal to be transmitted to the light-emitting device 201 through the connecting lead 15, ensuring that the display panel 100 can display normally.

[0192] For example, such as Figure 14 , Figure 15 and Figure 16 As shown, the first through hole K1 can be at least one of the following shapes: oblique cylinder, cylinder, frustum, prism, frustum, etc.

[0193] like Figure 14 , Figure 15 and Figure 16 As shown, the arbitrary cross-sectional shape of the first via K1 parallel to the second surface 11b includes, but is not limited to, circles, ellipses, trapezoids, rectangles, and polygons. For a first via K1, any two of its multiple cross-sections parallel to the second surface 11b are similar or congruent.

[0194] For example, such as Figure 14 , Figure 15 and Figure 16 As shown, the array of multiple first vias K1 can be at least one of the following: honeycomb arrangement, matrix arrangement, linear arrangement, or circular arrangement. When the multiple first vias K1 are arranged in a linear array, they can be arranged in a linear array along a straight line, curve, or broken line.

[0195] For example, such as Figure 14 , Figure 15 and Figure 16 As shown, the boundaries of the multiple first vias K1 do not overlap with the boundaries of the second substrate 13.

[0196] For example, such as Figure 14 , Figure 15 and Figure 16 As shown, the dimension of the first via K1 along the first direction X is less than or equal to the dimension of the second substrate 13 along the first direction X.

[0197] For example, such as Figure 14 , Figure 15 and Figure 16As shown, the dimension of the first via K1 along the second direction Y is less than or equal to the dimension of the second substrate 13 along the second direction Y.

[0198] In some examples, the orthographic projection of multiple first vias K1 onto the second surface 11b falls within the orthographic projection range of the second substrate 13 onto the second surface 11b.

[0199] For example, such as Figure 17 As shown, the first via K1 is inclined through the second substrate 13 along a set direction, and the angle formed between the set direction and the upper surface of the second substrate 13 is an acute angle.

[0200] In some embodiments, such as Figure 15 As shown, multiple first vias K1 are arranged in multiple columns along the second direction Y, and at least one second electrode 14 is provided on both sides of each column of first vias K1.

[0201] When air bubbles are present in the portion between the second electrode 14 and the first substrate 11, such as the portion between the second substrate 13 and the connecting layer 16 located between the second electrode 14 and the first substrate 11, the second electrode 14 may deviate from its preset position. This can cause the connecting lead 15 to fail to connect effectively with the second electrode 14 during the formation of the connecting lead 15, preventing the driving signal from being transmitted normally to the light-emitting device 201 and causing the display panel to fail to display normally.

[0202] By setting the first via K1, air bubbles present between the second substrate 13 and the connecting layer 16, located between the second electrode 14 and the first substrate 11, can be discharged through the first via K1, so that the position of the second electrode 14 can be maintained in the set position, thereby ensuring that the connecting lead 15 and the second electrode 14 can be effectively connected, and thus ensuring that the driving signal can be transmitted to the light-emitting device 201 through the connecting lead 15, and ensuring that the display panel 100 can display normally.

[0203] In some embodiments, such as Figure 15 As shown, along the first direction X, the size of the first via K1 is smaller than the gap between the two adjacent second electrodes 14.

[0204] For example, in the orthographic projection onto the second surface 11b of the first substrate 11, the second electrode 14 is spaced apart from the first via K1.

[0205] When attaching the second substrate 13, air bubbles may be present between the connecting layer 16 and the second substrate 13 due to uneven attachment. These air bubbles can be discharged through the first via K1. When the first via K1 overlaps with the second electrode 14, the second electrode 14 may come into contact with other conductive structures in the display panel 100 through the first via K1, causing a short circuit. At the same time, since the first via K1 overlaps with the second electrode 14, when air bubbles are discharged from the first via K1, the edge of the second electrode 14 may lift up, posing a risk of peeling off from the second substrate 13.

[0206] By controlling the size of the first via K1 between two adjacent second electrodes 14, the problem of the second electrode 14 possibly contacting other structures through the first via K1 can be effectively avoided. At the same time, the problem of the edge of the second electrode 14 lifting up when air bubbles are discharged through the first via K1 can be avoided, thereby ensuring the tightness of the second electrode 14 and the second substrate 13.

[0207] It is understandable that, among the multiple first vias K1, the size of the remaining first vias K1, except for the first via K1 located between two adjacent second electrodes 14, can be less than, greater than or equal to the gap between two adjacent second electrodes 14 along the first direction X.

[0208] In some embodiments, such as Figure 17 As shown, the connecting layer 16 includes a plurality of second vias K2, which extend from the upper surface of the connecting layer 16 to the lower surface of the connecting layer 16, and the second vias K2 communicate with the first vias K1.

[0209] When attaching the second substrate 13, air bubbles may exist between the connecting layer 16 and the first substrate 11 and / or between the connecting layer 16 and the second substrate 13 due to uneven attachment. When the adhesive material expands or contracts under the influence of ambient temperature, air bubbles may also be generated in the adhesive material. By providing multiple second vias K2 on the connecting layer 16 that correspond to multiple first vias K1 respectively, air bubbles can be discharged through the second vias K2 and / or the first vias K1, thereby ensuring the flatness and tightness of the attachment between the second substrate 13 and the first substrate 11.

[0210] For example, the shape of the second via K2 is the same as that of the first via K1 through which it passes, and the second via K2 and the first via K1 correspond one-to-one.

[0211] For example, the second via K2 can be at least one of the following shapes: oblique cylinder, cylinder, frustum, prism, frustum, etc.

[0212] The cross-sectional shape of the second via K2 parallel to the second surface 11b includes, but is not limited to, circles, ellipses, trapezoids, rectangles, and polygons. For a first via K1, any two of its multiple cross-sections parallel to the second surface 11b are similar or congruent.

[0213] For example, such as Figure 17 As shown, the second via K2 penetrates the connecting layer 16 at an angle along a set direction, and the angle formed between the set direction and the upper surface of the connecting layer 16 is an acute angle.

[0214] In some embodiments, such as Figure 18 and Figure 19 As shown, the display panel 100 also includes a plurality of fan-out lines 22 disposed on the second substrate 13. The first end 221 of each fan-out line 22 is electrically connected to a second electrode 14, and the second end of each fan-out line 22 is electrically connected to the drive circuit board 21.

[0215] By setting the fan-out line 22, the overall size of the signal line (e.g., the second electrode 14 or the connecting lead 15) connected to the drive circuit board 21 is narrowed along the first direction X, thereby reducing the size of the drive circuit board 21 connected to the signal line and thus reducing the thickness of the display panel 100.

[0216] It is understood that the second electrode 13 and the fan-out line 22 can be an integral structure or two electrically connected parts, which can be designed according to needs. This is only an example and is not intended to limit this disclosure.

[0217] For example, such as Figure 4 , Figure 18 and Figure 19 As shown, the second electrode 14 can be directly connected to the drive circuit board 21, or the second electrode 14 can be connected to the drive circuit board 21 through other structures, such as the fan-out line 22.

[0218] For example, such as Figure 4 , Figure 18 and Figure 19 As shown, multiple second electrodes 14 can be connected to the same drive circuit board 21, or multiple second electrodes 14 can be connected to multiple drive circuit boards 21 respectively.

[0219] In some embodiments, such as Figure 18 As shown, along the first direction X, the distance between any two adjacent second electrodes 14 is d1. The distance between the second electrodes 14 can be set as needed; either the distance d1 between any two adjacent second electrodes 14 is the same, or the distance d1 between any two adjacent second electrodes 14 is not exactly the same.

[0220] For example, such as Figure 19As shown, the multiple second electrodes 14 are divided into multiple electrode groups W, each electrode group W including p second electrodes 14, where p is a positive integer and p≥1. The distance d11 between any two adjacent electrode groups W is greater than or equal to the distance d1 between any two adjacent second electrodes 14 within each electrode group W.

[0221] In some examples, along the first direction X, the distance d11 between any two adjacent electrode groups W is ≥0.1mm.

[0222] By controlling the spacing d1 between adjacent second electrodes 14 and the spacing d11 between adjacent electrode groups W, during the formation of the connecting lead 15, while ensuring the effective connection between the connecting lead 15 and its corresponding second electrode 14, it prevents the connecting lead 15 from contacting other second electrodes 14 adjacent to its corresponding second electrode 14, thereby avoiding short circuits caused by the same connecting lead 15 being electrically connected to two or more second electrodes 14.

[0223] For example, the dimensions of the second substrate 13 are related to a plurality of second electrodes 14 and a plurality of fan-out lines 22. Figure 19 As shown, the orthographic projection of the second electrode 14 and the fan-out line 22 onto the second surface 11b falls within the orthographic projection range of the second substrate 13 onto the second surface 11b. The dimension f of the second substrate 13 along the second direction Y is designed based on the dimensions of the second electrode 14 and the fan-out line 22 along the second direction Y.

[0224] For example, such as Figure 19 As shown, along the first direction X, the distance between the two boundaries of the plurality of second electrodes 14 that are furthest apart is d8, and the size of the second substrate 13 is d9, where d9 > d8.

[0225] like Figure 19 As shown, along the second direction Y, the size of the second substrate 13 is d9, 50mm≥d9≥3mm.

[0226] For example, the driving circuit board 21 includes, but is not limited to, PCB (Printed Circuit Board) or FPC (Flexible Printed Circuit).

[0227] For example, such as Figure 4 , Figure 18 and Figure 19 As shown, the shape of the second substrate 13 includes, but is not limited to, a rectangle, a "T" shape, and a "Π" shape.

[0228] For example, such as Figure 19As shown, the second surface 11b includes a connection region BN and a bonding region BB located on the side of the connection region BN away from the selected side 11cc. The connection region BN is located close to the selected side 11cc. The second electrode 14 is located in the connection region BN, and the second end 222 of the fan-out line 22 is located in the bonding region BB.

[0229] For example, such as Figure 5 As shown, the protective layer 18 can also cover the first end 221 of multiple fan-out lines 22.

[0230] In some embodiments, such as Figure 5 As shown, the light-emitting layer 20 includes multiple light-emitting devices 201, multiple light-emitting driving chips 202, and a protective film 203.

[0231] For example, the light-emitting device 201 includes, but is not limited to, OLED (Organic Light-Emitting Diode), Mini LED (Mini Light-Emitting Diode), Micro LED (Micro Light-Emitting Diode), etc.

[0232] For example, the light-emitting layer 20 further includes a light-emitting driver chip 202, which is electrically connected to the driving circuit layer 19. The light-emitting driver chip 202 is configured to drive and control the light-emitting brightness of the light-emitting device 201. The pads in the driving circuit layer 19 include, for example, device pads and driving pads. The pins of the light-emitting device 201 are connected to the device pads, and the leads of the light-emitting driver chip 202 are connected to the driving pads.

[0233] Each light-emitting driver chip 202 is configured to control one or more light-emitting devices 201. For example, each light-emitting driver chip 202 controls three light-emitting devices 201.

[0234] For example, the material of the protective film 203 can be black silicone or black resin, etc.

[0235] The protective film 203 can protect multiple light-emitting devices 201 and prevent them from being damaged during the subsequent process after the formation of the light-emitting devices 201.

[0236] For example, such as Figure 5 As shown, the protective film 203 covers at least a plurality of light-emitting devices 201 and fills the gap areas of the plurality of light-emitting devices 201.

[0237] In some examples, the protective film 203 is the film layer structure furthest from the first substrate 11 in the display panel 100. The protective film 203 covers one side of the first surface 11a of the first substrate 11, the selected side surface 11cc, and the portion of the second surface 11b close to the selected side surface 11cc.

[0238] For example, the display panel 100 includes sub-pixels of multiple colors, wherein the sub-pixels of multiple colors include at least a first color sub-pixel, a second color sub-pixel, and a third color sub-pixel, wherein the first color, the second color, and the third color are three primary colors (e.g., red, green, and blue). Each sub-pixel includes, for example, at least one light-emitting device 201.

[0239] Embodiments of this disclosure also provide a display device 1000. For example... Figure 20 As shown, the display device 1000 includes an integrated circuit chip and a display panel 100 as described in any of the above embodiments, wherein the integrated circuit chip is electrically connected to the second electrode 14 of the display panel 100.

[0240] For example, the integrated circuit chip is electrically connected to the driver circuit board 21 and is configured to send a drive signal to the display panel 100, thereby driving the display panel 100 to display an image.

[0241] In the display device 1000, a control signal is issued by an integrated circuit chip, and then the drive signal is transmitted to the second electrode 14 of the display panel 100 through the drive circuit board 21. The drive signal is transmitted to the drive circuit layer 19 through the second electrode 14, the connecting lead 15 and the first electrode 12 in sequence, and then to the light-emitting layer 20 through the drive circuit layer 19, thereby controlling the light-emitting device 201 in the light-emitting layer 20 to emit light, so that the display device 1000 displays an image.

[0242] Using Mini LED or Micro LED as the light-emitting device 201 results in a smaller size. On the same first substrate, the density of light-emitting devices per unit area can be higher. Furthermore, the light-emitting device 201 can be driven independently or in zones, thereby improving the uniformity of display brightness and thus improving the display quality of the display device 1000.

[0243] The above-described display device 1000 has the same structure and beneficial technical effects as the display panel 100 provided in some of the above embodiments, and will not be described again here.

[0244] Embodiments of this disclosure also provide a splicing display device 2000.

[0245] In some embodiments, such as Figure 21 As shown, the splicing display device 2000 includes: a plurality of display panels 100 spliced ​​together as described in any of the above embodiments.

[0246] In other embodiments, the splicing display device 2000 includes a plurality of display devices 1000 as described in the above embodiments, spliced ​​together.

[0247] The following description uses a splicing display device 2000, which includes multiple spliced ​​display panels 100, as an example.

[0248] For example, such as Figure 21 As shown, the display panel 100 is, for example, rectangular.

[0249] In some examples, such as Figure 21 As shown, multiple display panels 100 in the splicing display device 2000 are arranged in an array.

[0250] like Figure 3 As shown, in the display panel 100, a plurality of first electrodes 12 are arranged in parallel along the first direction X. Correspondingly, a plurality of connecting leads 15 are also arranged in parallel along the first direction X. The other direction, which is parallel to the first surface 11a of the display panel 100 and perpendicular to the first direction X, is called the second direction Y.

[0251] For example, such as Figure 3 and Figure 21 As shown, the display panel 100 includes a selected side 11cc.

[0252] like Figure 21 As shown, multiple such Figure 3 When the display panels 100 shown are spliced, for example, the selected sides 11cc of multiple display panels 100 are all set along the first direction X. In this way, among the multiple display panels 100 arranged in a row along the first direction X, there is basically no seam between two adjacent display panels 100 along the first direction X. However, among the multiple display panels 100 arranged in a column along the second direction Y, there is a splicing gap between two adjacent display panels 100. That is to say, the size of the splicing gap between two adjacent display panels 100 in the multiple display panels 100 arranged in a row along the first direction X is smaller than the size of the splicing gap between two adjacent display panels 100 in the multiple display panels 100 arranged in a column along the second direction Y.

[0253] In this way, when viewing the splicing display device 2000, the seam between two adjacent display panels 100 is difficult to be seen with the naked eye within the viewing distance, thus making the display image of the splicing display device 2000 more complete and presenting a better display effect.

[0254] For example, in such Figure 21In the splicing display device 2000 shown, each display panel 100 includes at least three colors of sub-pixels. The sub-pixels of these colors include at least a first color sub-pixel, a second color sub-pixel, and a third color sub-pixel. The first color, the second color, and the third color are three primary colors (e.g., red, green, and blue). Each sub-pixel includes, for example, at least one light-emitting device 201.

[0255] The above-mentioned splicing display device 2000 also has the same structure and beneficial technical effects as the display panel 100 provided in some of the above embodiments, which will not be described again here.

[0256] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A display panel, comprising: A first substrate includes a first surface and a second surface opposite to each other, and a plurality of side surfaces connecting the first surface and the second surface, at least one side surface being a selected side surface; the first surface includes a display area and a peripheral area located on at least one side of the display area, the peripheral area being closer to the selected side surface than the display area; Multiple first electrodes are disposed in the peripheral area; A second substrate is disposed on the second surface. The second substrate includes a main body portion and a plurality of protrusions disposed on the side of the main body portion near the selected side. One end of the protrusion is connected to the main body, and the other end extends toward the selected side. The plurality of protrusions are spaced apart along a first direction, which is parallel to the second surface and the selected side surface; A connecting layer is disposed between the first substrate and the second substrate, and the connecting layer adheres the first substrate and the second substrate; The orthographic projection of the connecting layer on the second surface falls within the orthographic projection range of the second substrate on the second surface; Multiple second electrodes are disposed on the side of the second substrate away from the first substrate and close to the selected side. Multiple connecting leads extend from the first surface through the selected side to the second surface, with one end of the connecting lead connected to the first electrode and the other end connected to the second electrode.

2. The display panel according to claim 1, wherein, The connecting layer includes at least one slot; the slot extends from the upper surface of the connecting layer to the lower surface of the connecting layer.

3. The display panel according to claim 2, wherein, The slotting includes: at least one first slotting, and / or at least one second slotting, wherein the first slotting and the second slotting extend in different directions; The boundaries of the first slot and the second slot do not overlap with the boundary of the connecting layer.

4. The display panel according to claim 2, wherein, The slot penetrates the connecting layer along a predetermined direction, which is parallel to the lower surface of the connecting layer. When the connecting layer includes multiple slots, the multiple slots are spaced apart.

5. The display panel according to claim 4, wherein, When the slot penetrates the connecting layer along the first direction, the slot is located on the side of the second electrode away from the selected side.

6. The display panel according to claim 2, wherein, The slots are mesh-like.

7. The display panel according to any one of claims 1 to 6, wherein, The boundary of the connecting layer near the selected side overlaps with the boundary of the second substrate near the selected side; or, The boundary of the connecting layer near the selected side is further away from the selected side than the boundary of the second substrate near the selected side.

8. The display panel according to claim 1, wherein, In a projection onto a reference plane, the protrusion overlaps with at least one of the second electrodes; the reference plane is parallel to the selected side surface.

9. The display panel according to any one of claims 1 to 6 and 8, wherein, The second substrate includes a plurality of first vias arranged in an array, the first vias extending from the upper surface of the second substrate to the lower surface of the second substrate.

10. The display panel according to claim 9, wherein, Multiple first vias are arranged in multiple columns along a second direction, the second direction being perpendicular to the first direction and the selected side; at least one second electrode is provided on both sides of each column of first vias.

11. The display panel according to claim 10, wherein, Along the first direction, the size of the first via is smaller than the gap between the two adjacent second electrodes.

12. The display panel according to claim 10 or 11, wherein, The connecting layer further includes: a plurality of second vias, the second vias extending from the upper surface of the connecting layer to the lower surface of the connecting layer, and the second vias communicating with the first vias.

13. The display panel according to claim 10 or 11, wherein, The display panel also includes: A buffer layer is disposed on the side of the second substrate away from the first substrate, covering the edge portion of the second substrate near the selected side. The connecting lead crosses the buffer layer and is connected to the second electrode.

14. The display panel according to claim 13, wherein, The buffer layer does not overlap with the second electrode, and there is a gap between the buffer layer and the selected side.

15. The display panel according to claim 14, wherein, The buffer layer includes a first slope and a second slope connected together; along the second direction and from the selected side toward the second substrate, the height of the first slope gradually increases and the height of the second slope gradually decreases, with a smooth transition between the first slope and the second slope.

16. The display panel according to claim 15, wherein, The slope angles of the first slope and the second slope are both acute angles.

17. The display panel according to any one of claims 14 to 16, wherein, The edge portion of the second substrate near the selected side extends relative to the boundary of the connecting layer near the selected side. The edge portion of the second substrate, together with the side of the connecting layer and the second surface, forms a gap region, and a portion of the buffer layer fills the gap region.

18. A display device, comprising: The integrated circuit chip and the display panel as described in any one of claims 1 to 17, wherein the integrated circuit chip is electrically connected to the second electrode.

19. A splicing display device, comprising a plurality of display devices as described in claim 18 spliced ​​together; or, It includes multiple display panels that are spliced ​​together as described in any one of claims 1 to 17.

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