Automatic feeding and discharging device for finished integrated circuit board detection
By designing an automatic loading and unloading device, using the coordination of the rectangular detection groove, the lifting side plate and the lifting baffle, the automatic loading and unloading problem in the detection of finished integrated circuit boards in the prior art is solved, and an efficient automatic detection process is achieved.
Patent Information
- Application Number
- CN202510448486.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-10
- Publication Date
- 2025-05-09
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The prior art is difficult to realize automatic loading and unloading in the detection of finished integrated circuit boards, resulting in high labor costs and low efficiency.
An automatic loading and unloading device is designed, including a testing workbench, loading and conveying mechanism and unloading mechanism. Through the coordination of the rectangular detection groove, the lifting side plate and the lifting baffle, the automatic loading and unloading of the integrated circuit board is realized.
It realizes automatic loading and unloading of finished integrated circuit boards, improves detection efficiency and reduces labor costs.
Smart Images

Figure CN119951762A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of circuit board detection and conveying, in particular to an automatic loading and unloading device for finished integrated circuit board detection. Background Art
[0002] Chips and various electronic components are welded on the circuit board to form an integrated circuit. After the welding production of the integrated circuit board is completed, it needs to be transported to the inspection station for inspection. The process is to detect the welding conditions of various components and whether the welding positions of the components are correct. It is also necessary to detect whether there are short circuits or open circuits on the integrated circuit board, such as base copper short circuits, thin line short circuits, electroplating short circuits, etc. These defects will cause the circuit board to be unable to be used normally in the future due to quality problems; the current detection device uses machine vision imaging equipment to image the surface of the integrated circuit board and then compare it with the standard image to achieve rapid detection of the integrated circuit board. In the field of circuit board transportation, in order to avoid the extrusion damage of the circuit board caused by the difficulty in controlling the clamping force, the negative pressure adsorption method is basically used for loading and unloading of the integrated circuit board. However, since the integrated circuit board is full of chips and components, the area of the negative pressure adsorption on the integrated circuit board is greatly reduced, resulting in the inability to complete the loading and unloading of the integrated circuit board by the negative pressure adsorption method. Therefore, in the inspection of the finished integrated circuit board, manual loading is basically used, which has high labor costs and low efficiency. Summary of the invention
[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide an automatic loading and unloading device for finished integrated circuit board testing to solve the deficiencies of the prior art.
[0004] The objective of the present invention is achieved through the following technical solutions: an automatic loading and unloading device for finished integrated circuit board inspection, comprising an inspection workbench, a loading conveying mechanism and a unloading conveying mechanism, a rectangular inspection slot being provided through the top of the inspection workbench, the loading conveying mechanism and the unloading conveying mechanism being provided on two vertical sides of the rectangular inspection slot, an inspection plate being provided above and below the inspection workbench, an industrial camera being installed on the end face of the inspection plate close to the rectangular inspection slot, a loading window communicating with the rectangular inspection slot being provided on the side of the inspection workbench close to the loading conveying mechanism, a lifting side plate being provided in contact with the side of the inspection workbench close to the loading conveying mechanism, an unloading window communicating with the rectangular inspection slot being provided on the side of the inspection workbench close to the unloading conveying mechanism, a lifting baffle being provided in contact with the side of the inspection workbench close to the unloading conveying mechanism, a supporting boss being fixed to the inner wall of the lifting baffle and the inner wall of the rectangular inspection slot opposite thereto, and a supporting platform being fixed to the inner wall of the lifting side plate and the inner wall of the rectangular inspection slot opposite thereto; The loading conveying mechanism includes two groups of conveying belts arranged opposite to each other, and a limiting plate is arranged on the conveying plane of the conveying belt. A conveying space for the integrated circuit board is formed between the two limiting plates. The structure of the unloading conveying mechanism is the same as that of the loading conveying mechanism.
[0005] Furthermore, a pushing mechanism is provided at one end of the inspection workbench away from the unloading and conveying mechanism, and the pushing mechanism is used to push the integrated circuit board in the rectangular inspection slot from the unloading window onto the unloading and conveying mechanism. The pushing mechanism includes a pushing cylinder and a pushing plate. The pushing cylinder is horizontally installed on the inspection workbench, and the pushing plate is provided in contact with the top surface of the supporting boss away from the unloading and conveying mechanism. The telescopic shaft of the pushing cylinder can be movably inserted into the rectangular inspection slot to connect with the pushing plate.
[0006] Furthermore, the support platform is provided with a plurality of loading and unloading switching mechanisms at equal intervals along its length direction, the loading and unloading switching mechanisms comprising a mounting column, a lifting seat and a ball bearing, the mounting column being embedded and installed in the support platform, the top surface of the mounting column being flush with the top surface of the support platform, the lifting seat being arranged in the mounting column, the lifting seat having the freedom to move axially along the mounting column, the ball bearing being rotatably installed on the top of the lifting seat, and a circular hole for partially passing the ball bearing through being opened on the top of the mounting column.
[0007] Furthermore, a mounting cavity is provided in the mounting column, and a circular hole communicating with the mounting cavity is provided on the top and bottom surfaces of the mounting column, the lifting seat is arranged in the mounting cavity, and a driving rod is connected to the bottom of the lifting seat, and the driving rod passes through the circular hole at the bottom, and a wedge-shaped surface is provided on the side of the bottom of the driving rod close to the lifting side plate, and a pressure plate is provided between the wedge-shaped surface and the lifting side plate, and a switching cylinder is horizontally installed on the outer wall of the lifting side plate, and a telescopic shaft of the switching cylinder movably passes through the lifting side plate to connect the pressure plate, and a spring is connected to the bottom of the lifting seat, and the other end of the spring is connected to the step formed by the mounting cavity and the circular hole, and when the spring is in a normal state, the ball is located in the mounting cavity.
[0008] Furthermore, a large diameter hole and a small diameter hole are sequentially opened from top to bottom at a position corresponding to the mounting column on the top surface of the support platform, the mounting column is adapted in the large diameter hole, the drive rod passes through the small diameter hole, and a screw is provided on the side wall of the support platform, and the screw is threadedly connected to the mounting column.
[0009] Furthermore, a negative pressure cavity is provided in the support platform on the lifting side plate, and a plurality of negative pressure holes are opened on the top surface of the support platform, and the negative pressure holes are connected to the negative pressure cavity.
[0010] Furthermore, a first base is arranged below the lifting side plate, a first linear drive module is installed on the first base, an output direction of the first linear drive module is parallel to the conveying direction of the loading and conveying mechanism, the bottom of the lifting side plate is connected to the telescopic shaft of the first lifting cylinder, the bottom of the first lifting cylinder is connected to the first slide plate, and the first slide plate is installed on the slide seat of the first linear drive module.
[0011] Furthermore, a second base is provided below the lifting baffle, a second lifting cylinder is installed on the second base, and a telescopic shaft of the second lifting cylinder is connected to the lifting baffle.
[0012] Furthermore, the top and bottom of the detection workbench are connected with 7-shaped brackets, and a detection cylinder is vertically installed on the 7-shaped bracket. The telescopic axes of the two detection cylinders are respectively connected to the two detection plates, and the detection light source is installed on the detection plate.
[0013] Furthermore, the feeding conveying mechanism also includes a conveying platform, and a second linear drive module is arranged at the bottom of both ends of each group of the conveying belts, and the conveying direction of the second linear drive module is perpendicular to the conveying direction of the feeding conveying mechanism, and the conveying frame of the conveying belt is connected to the slide seat of the second linear drive module, and a telescopic shaft is arranged between the limit plate and the conveying frame, and the two ends of the telescopic shaft are respectively fixedly connected to the conveying frame and the limit plate, and an adjusting spring is sleeved on the telescopic shaft, and a limit screw is passed through the middle part of the limit plate, and the tail end of the limit screw passes through the conveying frame and is threadedly connected to the limit nut.
[0014] The beneficial effects of the present invention are: The integrated circuit board is conveyed to the rectangular inspection slot for inspection by the loading and conveying mechanism. After the inspection is completed, the integrated circuit board is sent out of the rectangular inspection slot by the unloading and conveying mechanism. The two sets of relatively arranged conveyor belts expose the positions of the integrated circuit board soldering components to ensure that the components will not be affected during the conveying process. In order to enable the integrated circuit board to be loaded and unloaded smoothly, a lifting side plate and a lifting baffle are set. When loading, the lifting side plate moves down to open the loading window to ensure that the integrated circuit board can be smoothly conveyed to the rectangular inspection slot. When unloading, the lifting baffle moves down to open the unloading window, thereby smoothly sending out the integrated circuit board in the rectangular inspection slot, realizing automatic loading and unloading of finished integrated circuit boards and improving the inspection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 The structure of an automatic loading and unloading device for finished integrated circuit board testing of the present invention is shown in FIG. Figure 1 ; Figure 2 The structure of an automatic loading and unloading device for finished integrated circuit board testing of the present invention is shown in FIG. Figure 2 ; Figure 3 The structure of an automatic loading and unloading device for finished integrated circuit board testing of the present invention is shown in FIG. Figure 3 ; Figure 4 for Figure 3 Enlarged view of point A in the middle; Figure 5 The structure of an automatic loading and unloading device for finished integrated circuit board testing of the present invention is shown in FIG. Figure 4 ; Figure 6 The structure of an automatic loading and unloading device for finished integrated circuit board testing of the present invention is shown in FIG. Figure 5 ; Figure 7 It is a schematic diagram of the internal structure of a detection workbench in an automatic loading and unloading device for finished integrated circuit board detection according to the present invention; Figure 8 for Figure 7 Enlarged view of point B in the middle; In the figure, 1-detection workbench, 2-rectangular detection slot, 3-detection plate, 4-industrial camera, 5-lifting side plate, 6-lifting baffle, 7-support boss, 8-support platform, 9-conveyor belt, 10-limiting plate, 11-push cylinder, 12-push plate, 13-mounting column, 14-lifting seat, 15-ball, 16-round hole, 17-mounting cavity, 18-driving rod, 19-wedge surface, 20-pressure plate, 21-switching cylinder, 22-spring , 23-large diameter hole, 24-small diameter hole, 25-screw, 27-negative pressure hole, 28-first lifting cylinder, 29-first slide, 30-first base, 31-first linear drive module, 32-second base, 33-second lifting cylinder, 34-7-shaped bracket, 35-detection cylinder, 36-conveyor platform, 37-second linear drive module, 38-telescopic shaft, 39-adjusting spring, 40-limiting screw, 41-limiting nut. DETAILED DESCRIPTION
[0016] The technical solution of the present invention is further described in detail below in conjunction with the accompanying drawings, but the protection scope of the present invention is not limited to the following.
[0017] Embodiment 1: Figures 1 to 8As shown, an automatic loading and unloading device for finished integrated circuit board inspection comprises an inspection workbench 1, a loading conveying mechanism and a unloading conveying mechanism. A rectangular inspection slot 2 is provided through the top of the inspection workbench 1. The two vertical sides of the rectangular inspection slot 2 are respectively provided with a loading conveying mechanism and a unloading conveying mechanism. Inspection plates 3 are provided above and below the inspection workbench 1. An industrial camera 4 is installed on the end face of the inspection plate 3 close to the rectangular inspection slot 2. The current visual inspection equipment can only inspect a single side of the integrated circuit board. After the single-side inspection is completed, the integrated circuit board needs to be flipped 180° for the second side inspection. Since more components are welded on the integrated circuit board, the space required for flipping is large. Flipping in a small range is likely to cause collision damage to the components. For this reason, the inspection method carried by the traditional inspection table is abandoned, and a rectangular inspection The testing slot 2 is provided, and the integrated circuit board is suspended and placed in the rectangular testing slot 2. The testing boards 3 are installed above and below the integrated circuit board. The industrial camera 4 on the testing board 3 is used for imaging, so as to realize the double-sided testing of the integrated circuit board and improve the testing efficiency. A loading window connected to the rectangular testing slot 2 is provided on the side of the testing workbench 1 close to the loading and conveying mechanism, and a lifting side plate 5 is provided on the side of the testing workbench 1 close to the loading and conveying mechanism. A unloading window connected to the rectangular testing slot 2 is provided on the side of the testing workbench 1 close to the unloading and conveying mechanism, and a lifting baffle 6 is provided on the side of the testing workbench 1 close to the unloading and conveying mechanism. The inner wall of the lifting baffle 6 and the inner wall of the rectangular testing slot 2 opposite thereto are fixed with supporting bosses 7, and the inner wall of the lifting side plate 5 and the inner wall of the rectangular testing slot 2 opposite thereto are fixed with supporting platforms 8.The loading and conveying mechanism includes two groups of conveyor belts 9 arranged opposite to each other. A limit plate 10 is arranged on the conveying plane of the conveyor belt 9. A conveying space for the integrated circuit board is formed between the two limit plates 10. The structure of the unloading and conveying mechanism is the same as that of the loading and conveying mechanism. The integrated circuit board is suspended in the rectangular detection groove 2 for detection, which can make the components suspended and will not interfere with the detection workbench 1. The integrated circuit board is conveyed to the rectangular detection groove 2 for detection by the loading and conveying mechanism. After the detection is completed, the integrated circuit board is sent out of the rectangular detection groove 2 by the unloading and conveying mechanism. Since there are no soldered components near the side of the integrated circuit board, this position is used to carry the integrated circuit board for transportation. The area of this position is small, and negative pressure adsorption cannot be used for loading and unloading. Therefore, a loading and conveying mechanism and a unloading and conveying mechanism are set, and the side walls of the integrated circuit board are placed on the two sides respectively. The two conveyor belts 9 are arranged on a plurality of conveyor belts 9, so that the middle part of the integrated circuit board is located between the two conveyor belts 9, so that the components on the integrated circuit board will not be affected during the loading process. The limit plate 10 on the conveyor belt 9 limits the integrated circuit board for conveying, so as to avoid the integrated circuit board from being offset during the conveying process, and ensure that the integrated circuit board can be smoothly conveyed to the rectangular detection slot 2. In order to enable the integrated circuit board to be smoothly loaded and unloaded, a lifting side plate 5 and a lifting baffle 6 are set. When loading, the lifting side plate 5 moves down to open the loading window, and the conveyor belt 9 of the loading and conveying mechanism conveys the integrated circuit board to the rectangular detection slot 2, and then the lifting side plate 5 is reset to perform visual inspection of the integrated circuit board. After the inspection is completed, when unloading, the lifting baffle 6 moves down to open the unloading window, so that the integrated circuit board in the rectangular detection slot 2 is smoothly sent out, and the automatic loading and unloading of the finished integrated circuit board is realized, thereby improving the inspection efficiency.During specific implementation, it also includes a defective product conveying mechanism, which includes a jacking assembly and a defective product conveying assembly. The structure of the defective product conveying assembly is the same as that of the loading conveying mechanism. The defective product conveying assembly is located on one side of the unloading conveying mechanism, and the conveying direction of the defective product conveying assembly is perpendicular to the conveying direction of the unloading conveying mechanism. The jacking assembly includes a U-shaped top plate, a jacking cylinder and a jacking base. A linear drive module is arranged on the jacking base. The conveying direction of the linear drive module is parallel to the conveying direction of the defective product conveying assembly. The cylinder body of the jacking cylinder is vertically installed on the slide seat of the linear drive module. The telescopic shaft of the jacking cylinder is connected to the closed end of the U-shaped top plate. When the quality inspection of the integrated circuit board is qualified, the defective The defective product conveying mechanism is not started, and the unloading conveying mechanism conveys the qualified integrated circuit board to the designated position. When the quality inspection of the integrated circuit board fails, when the integrated circuit board is conveyed to the top of the defective product conveying mechanism, the defective product conveying mechanism is started, and the U-shaped top plate is driven upward by the lifting cylinder, so that the U-shaped top plate lifts the integrated circuit board from the unloading conveying mechanism, so that the bottom surface of the integrated circuit board is flush with the conveying surface of the defective product conveying component, and then the linear drive module drives the integrated circuit board to move close to the defective product conveying component, so that one end of the integrated circuit board is located on the conveying surface of the defective product conveying component, and finally the defective integrated circuit board is conveyed to the designated position by the defective product conveying component. ;
[0018] Furthermore, if Figures 1 to 4 As shown, the top and bottom of the detection workbench 1 are connected with 7-shaped brackets 34, and a detection cylinder 35 is vertically installed on the 7-shaped bracket 34. The telescopic axes of the two detection cylinders 35 are respectively connected to two detection plates 3, and a detection light source is installed on the detection plate 3. The detection plate 3 is driven to move up and down by the telescopic movement of the detection cylinder 35. During detection, the detection plate 3 is driven to move into the rectangular detection groove 2. The upper and lower ports of the rectangular detection groove 2 are respectively closed by the two upper and lower detection plates 3, so that the integrated circuit board is detected in the closed rectangular detection groove 2. The imaging light source is provided by the detection light source, thereby avoiding the influence of external light sources on the imaging of the industrial camera 4, making the detection structure more accurate.
[0019] Embodiment 2: Based on Embodiment 1, Figures 1 to 5As shown, the feeding conveying mechanism also includes a conveying platform 36, and a second linear drive module 37 is provided at the bottom of each end of each group of conveyor belts 9. The conveying direction of the second linear drive module 37 is perpendicular to the conveying direction of the feeding conveying mechanism. The conveying frame of the conveyor belt 9 is connected to the slide seat of the second linear drive module 37, and a telescopic shaft 38 is provided between the limit plate 10 and the conveying frame. The two ends of the telescopic shaft 38 are respectively fixedly connected to the conveying frame and the limit plate 10, and an adjusting spring 39 is sleeved on the telescopic shaft 38. A limit screw 40 is penetrated in the middle of the limit plate 10, and the tail of the limit screw 40 passes through the conveying frame and is threadedly connected to the limit nut 41. The spacing between the two groups of conveyor belts 9 is adjustable to adapt to the transportation of integrated circuit boards of different sizes and improve the scope of application. The conveyor belt 9 is driven to move by the second linear drive module 37 to adjust the distance between the two groups of conveyor belts 9 to adapt to the size of the detected integrated circuit board. Secondly, the relative position between the limit plate 10 and the conveyor belt 9 is adjustable , so as to adjust according to the spare width of the side of the integrated circuit board. On the premise that the components on the integrated circuit board do not contact the conveyor belt 9, the contact area between the integrated circuit board and the conveyor belt 9 is as large as possible, so that the bearing force area of the integrated circuit board is larger. At the same time, the position adjustment of the limit plate 10 can be fine-tuned according to the size of the integrated circuit board, so that the two limit plates 10 can limit the conveying deviation of the integrated circuit board. The specific adjustment method is: by screwing the limit nut 41, the limit nut 41 is moved on the limit screw 40, so that the limit screw 40 drives the limit plate 10 to move, so that the limit plate 10 squeezes the adjustment spring 39 to move close to the conveyor frame, and the distance between the edge of the conveyor belt 9 and the limit plate 10 is expanded, or the limit plate 10 moves away from the conveyor frame under the reaction force of the adjustment spring 39, and the distance between the edge of the conveyor belt 9 and the limit plate 10 is reduced, so that the feed conveying mechanism and the unloading conveying mechanism are more adaptable, and meet the automatic loading and unloading of integrated circuit boards of various sizes.
[0020] Embodiment 3: When unloading, the lifting baffle 6 moves downward to open the unloading window, so that there is a certain distance between the unloading conveying mechanism and the unloading window. Secondly, the unloading conveying mechanism cannot move to the rectangular detection slot 2 to convey the integrated circuit board. Therefore, based on the embodiment 2, as shown in FIG. Figures 1 to 6As shown, a pushing mechanism is arranged at one end of the inspection workbench 1 away from the unloading and conveying mechanism, and the pushing mechanism is used to push the integrated circuit board in the rectangular inspection slot 2 from the unloading window to the unloading and conveying mechanism. The pushing mechanism includes a pushing cylinder 11 and a pushing plate 12. The pushing cylinder 11 is horizontally installed on the inspection workbench 1, and the top surface of the supporting boss 7 away from the unloading and conveying mechanism is contacted with the pushing plate 12. The telescopic shaft of the pushing cylinder 11 movably penetrates into the rectangular inspection slot 2 to connect with the pushing plate 12. When the integrated circuit board is loaded in the rectangular inspection slot 2, the supporting boss 7 and the supporting plane are connected. The platform 8 jointly supports the integrated circuit board, so that the integrated circuit board is in a suspended state, so that the components on the integrated circuit board are in a naked state, the imaging is clearer, and there is no covering or blocking. When the detection is completed, the lifting baffle 6 moves downward to open the unloading window, and the pushing cylinder 11 drives the pushing plate 12 to move close to the integrated circuit board, and pushes the integrated circuit board out of the unloading window, so that one end of the integrated circuit board falls on the conveyor belt 9 of the unloading conveying mechanism, and then cooperates with the action of the conveyor belt 9 to send the integrated circuit board out of the rectangular detection slot 2, realizing the automatic unloading process.
[0021] Furthermore, a second base 32 is provided below the lifting baffle 6, and a second lifting cylinder 33 is installed on the second base 32. The telescopic shaft of the second lifting cylinder 33 is connected to the lifting baffle 6, and the lifting baffle 6 is driven to move up and down by the telescopic movement of the second lifting cylinder 33. When unloading, the lifting baffle 6 moves downward to open the unloading window. After unloading is completed, the lifting baffle 6 moves up and resets to close the unloading window.
[0022] Embodiment 4: When the lifting side plate 5 moves downward to open the loading window, there is a certain distance between the conveying end of the conveyor belt 9 and the detection workbench 1, which causes the conveyor belt 9 to be unable to completely convey the integrated circuit board to the rectangular detection slot 2. Therefore, based on the embodiment 3, as shown in FIG. Figures 1 to 5As shown, a first base 30 is arranged below the lifting side plate 5, and a first linear drive module 31 is installed on the first base 30. The output direction of the first linear drive module 31 is parallel to the conveying direction of the loading and conveying mechanism. The bottom of the lifting side plate 5 is connected to the telescopic shaft of the first lifting cylinder 28, and the bottom of the first lifting cylinder 28 is connected to the first slide plate 29. The first slide plate 29 is installed on the slide seat of the first linear drive module 31. When loading, the lifting side plate 5 moves downward to open the loading window, and the conveyor belt 9 conveys one end of the integrated circuit board to the rectangular detection groove 2, and supports the integrated circuit board through the supporting boss 7. When the conveyor belt 9 can no longer convey the integrated circuit board, the first linear drive module 31 drives the lifting side plate 5 to move away from the detection workbench 1. In order to avoid interference between the loading and conveying mechanism and the lifting side plate 5, the conveying platform 36 in the loading and conveying mechanism has horizontal movement freedom. Specifically, a slide rail is arranged on the ground, and a slide rail is slidably matched with the slide rail The slider and the conveying platform 36 are installed on the slide rail slider. The conveying platform 36 is driven by the pushing cylinder. The pushing cylinder drives the loading and conveying mechanism to move away from the detection workbench 1, so that the lifting side plate 5 will not interfere with the loading and conveying mechanism when it rises and resets. Then, the first lifting cylinder 28 drives the lifting side plate 5 to move upward, so that the lifting side plate 5 is located behind the integrated circuit board after being reset. At this time, the supporting platform 8 on the lifting side plate 5 contacts the integrated circuit board. Then, the first linear drive module 31 drives the lifting side plate 5 to move close to the detection workbench 1. During the movement, the lifting side plate 5 pushes the integrated circuit board to continue to move into the rectangular detection groove 2. When the lifting side plate 5 contacts the detection workbench 1 to close the loading window, the integrated circuit board is completely loaded into the rectangular detection groove 2. At this time, the four sides of the integrated circuit board are respectively in contact with the two supporting bosses 7 and the two supporting platforms 8, so that the integrated circuit board can be smoothly loaded into the rectangular detection groove 2.
[0023] Furthermore, a negative pressure cavity is provided in the support platform 8 on the lifting side plate 5, and a plurality of negative pressure holes 27 are opened on the top surface of the support platform 8, and the negative pressure holes 27 are connected to the negative pressure cavity. Since the loading and conveying mechanism limits the conveying of the integrated circuit board, in the process of the lifting side plate 5 pushing the integrated circuit board into the rectangular detection groove 2, in order to avoid the integrated circuit board from being offset, the lifting side plate 5 is connected to the vacuum pump through the negative pressure pipe, and the negative pressure cavity is generated with the vacuum pump. The integrated circuit board is adsorbed on the support platform 8 of the lifting side plate 5 through the negative pressure holes 27, so that the lifting side plate 5 can accurately push the integrated circuit board into the rectangular detection groove 2, thereby realizing accurate loading of the integrated circuit board.
[0024] Embodiment 5: Based on Embodiment 4, Figures 1 to 8As shown, a plurality of loading and unloading switching mechanisms are arranged at equal intervals on the support platform 8 along its length direction, and the loading and unloading switching mechanisms include a mounting column 13, a lifting seat 14 and a ball 15. The mounting column 13 is embedded and installed in the support platform 8, and the top surface of the mounting column 13 is flush with the top surface of the support platform 8. The lifting seat 14 is arranged in the mounting column 13, and the lifting seat 14 has the freedom to move along the axial direction of the mounting column 13. The top of the lifting seat 14 is rotatably installed with a ball 15, and a circular hole 16 for the ball 15 to partially pass through is opened on the top of the mounting column 13. A mounting cavity 17 is arranged in the mounting column 13, and a circular hole 16 connected to the mounting cavity 17 is opened on the top and bottom surfaces of the mounting column 13. The lifting seat 14 is arranged on the mounting column 13. In the cavity 17, the bottom of the lifting seat 14 is connected with a driving rod 18, and the driving rod 18 passes through the circular hole 16 at the bottom. A wedge-shaped surface 19 is provided on the side of the bottom of the driving rod 18 close to the lifting side plate 5. A pressing plate 20 is provided between the wedge-shaped surface 19 and the lifting side plate 5. A switching cylinder 21 is horizontally installed on the outer wall of the lifting side plate 5. The telescopic shaft of the switching cylinder 21 movably passes through the lifting side plate 5 to connect the pressing plate 20. A spring 22 is connected to the bottom of the lifting seat 14, and the other end of the spring 22 is connected to the step formed by the installation cavity 17 and the circular hole 16. When the spring 22 is in a normal state, the ball 15 is located in the installation cavity 17. When unloading, the vacuum pump is stopped. At this time, since the negative pressure hole 27 is closed by the integrated circuit board, the negative pressure The negative pressure cavity is in a closed state, so that the negative pressure state in the negative pressure cavity is not broken in the first time, which affects the unloading of the integrated circuit board. Secondly, the thickness of the integrated circuit board is very thin. In order to make the integrated circuit board smoothly located on the moving path of the pushing mechanism, a loading and unloading switching mechanism is set. When loading, the pressing plate 20 is separated from the driving rod 18, so that the ball 15 is located in the installation cavity 17 under the force of the spring 22, so that the integrated circuit board contacts the supporting platform 8 and is adsorbed, so as to realize accurate loading. When unloading, the switching cylinder 21 drives the pressing plate 20 to squeeze the wedge surface 19 of the driving rod 18, and the driving rod 18 is moved upward under the guidance of the wedge surface 19, so that the driving rod 18 drives the lifting seat 14 to move upward, and the lifting seat 14 drives the ball 15 to move upward, so that the ball 15 passes through the round hole 16 at the top, thereby lifting the integrated circuit board, separating the integrated circuit board from the supporting platform 8 and the supporting boss 7, supporting the integrated circuit board through the ball 15, and finally, pushing the integrated circuit board out of the unloading window through the pushing mechanism. In this process, the integrated circuit board and the ball 15 are in rolling contact, which greatly reduces the friction force on the integrated circuit board during unloading and avoids wear of the integrated circuit board. After unloading, the switching cylinder 21 drives the pressing plate 20 to move away from the driving rod 18, and the driving rod 18 is reset downward under the reaction force of the spring 22, so that the ball 15 returns to the installation cavity 17, so that it is in the loading state.
[0025] Furthermore, a large diameter hole 23 and a small diameter hole 24 are sequentially opened from top to bottom at the position corresponding to the mounting column 13 on the top surface of the support platform 8. The mounting column 13 is adapted in the large diameter hole 23, and the driving rod 18 passes through the small diameter hole 24. The side wall of the support platform 8 is provided with a screw 25, and the screw 25 is threadedly connected to the mounting column 13. The mounting column 13 is installed in the large diameter hole 23 through the screw 25, and the small diameter hole 24 allows the driving rod 18 to pass through smoothly. Through the interaction between the pressure plate 20 and the driving rod 18, the position of the ball 15 is adjusted to realize the switching of loading and unloading.
Claims
1. An automatic loading and unloading device for finished integrated circuit board testing, characterized in that: The invention comprises an inspection workbench (1), a loading conveying mechanism and a unloading conveying mechanism, wherein a rectangular inspection slot (2) is provided through the top of the inspection workbench (1), the loading conveying mechanism and the unloading conveying mechanism are provided on two vertical sides of the rectangular inspection slot (2), an inspection plate (3) is provided above and below the inspection workbench (1), an industrial camera (4) is installed on the end surface of the inspection plate (3) close to the rectangular inspection slot (2), a loading window connected to the rectangular inspection slot (2) is provided on one side of the inspection workbench (1) close to the loading conveying mechanism, and the A lifting side plate (5) is provided on the side of the inspection workbench (1) close to the loading conveying mechanism, a material unloading window connected to the rectangular inspection slot (2) is provided on the side of the inspection workbench (1) close to the unloading conveying mechanism, a lifting baffle (6) is provided on the side of the inspection workbench (1) close to the unloading conveying mechanism, a supporting boss (7) is fixed to the inner wall of the lifting baffle (6) and the inner wall of the rectangular inspection slot (2) opposite thereto, and a supporting platform (8) is fixed to the inner wall of the lifting side plate (5) and the inner wall of the rectangular inspection slot (2) opposite thereto; The loading conveying mechanism comprises two groups of conveying belts (9) arranged opposite to each other, a limiting plate (10) is arranged on the conveying plane of the conveying belts (9), and a conveying space for the integrated circuit board is formed between the two limiting plates (10), and the structure of the unloading conveying mechanism is the same as that of the loading conveying mechanism.
2. The automatic loading and unloading device for finished integrated circuit board testing according to claim 1, characterized in that: A pushing mechanism is provided at one end of the inspection workbench (1) away from the unloading and conveying mechanism, and the pushing mechanism is used to push the integrated circuit board in the rectangular inspection slot (2) from the unloading window onto the unloading and conveying mechanism. The pushing mechanism comprises a pushing cylinder (11) and a pushing plate (12). The pushing cylinder (11) is horizontally mounted on the inspection workbench (1), and the top surface of the supporting boss (7) away from the unloading and conveying mechanism is contacted with the pushing plate (12). The telescopic shaft of the pushing cylinder (11) movably penetrates into the rectangular inspection slot (2) to connect with the pushing plate (12).
3. The automatic loading and unloading device for finished integrated circuit board testing according to claim 1, characterized in that: The support platform (8) is provided with a plurality of loading and unloading switching mechanisms at equal intervals along its length direction. The loading and unloading switching mechanisms comprise a mounting column (13), a lifting seat (14) and a ball (15). The mounting column (13) is embedded and installed in the support platform (8). The top surface of the mounting column (13) is flush with the top surface of the support platform (8). The lifting seat (14) is arranged in the mounting column (13). The lifting seat (14) has the freedom to move along the axial direction of the mounting column (13). The ball (15) is rotatably installed on the top of the lifting seat (14). A circular hole (16) for partially passing the ball (15) is opened on the top of the mounting column (13).
4. The automatic loading and unloading device for finished integrated circuit board testing according to claim 3, characterized in that: The mounting column (13) is provided with a mounting cavity (17), and the top and bottom surfaces of the mounting column (13) are both provided with circular holes (16) communicating with the mounting cavity (17). The lifting seat (14) is arranged in the mounting cavity (17), and the bottom of the lifting seat (14) is connected with a driving rod (18), and the driving rod (18) passes through the circular hole (16) at the bottom. The bottom of the driving rod (18) is provided with a wedge-shaped surface (19) on one side close to the lifting side plate (5), and the wedge-shaped surface (19) is in contact with the lifting side plate (5). A pressure plate (20) is arranged between the plates (5); a switching cylinder (21) is horizontally mounted on the outer wall of the lifting side plate (5); a telescopic shaft of the switching cylinder (21) movably passes through the lifting side plate (5) to connect to the pressure plate (20); a spring (22) is connected to the bottom of the lifting seat (14); the other end of the spring (22) is connected to a step formed by the mounting cavity (17) and the circular hole (16); when the spring (22) is in a normal state, the ball (15) is located in the mounting cavity (17).
5. The automatic loading and unloading device for finished integrated circuit board testing according to claim 4, characterized in that: A large diameter hole (23) and a small diameter hole (24) are sequentially provided on the top surface of the support platform (8) at a position corresponding to the mounting column (13) from top to bottom, the mounting column (13) is fitted into the large diameter hole (23), the driving rod (18) passes through the small diameter hole (24), and a screw (25) is provided on the side wall of the support platform (8), and the screw (25) is threadedly connected to the mounting column (13).
6. The automatic loading and unloading device for finished integrated circuit board testing according to claim 5, characterized in that: A negative pressure cavity is provided in the support platform (8) on the lifting side plate (5), and a plurality of negative pressure holes (27) are provided on the top surface of the support platform (8), wherein the negative pressure holes (27) are connected to the negative pressure cavity.
7. The automatic loading and unloading device for finished integrated circuit board testing according to claim 1, characterized in that: A first base (30) is provided below the lifting side plate (5), a first linear drive module (31) is mounted on the first base (30), an output direction of the first linear drive module (31) is parallel to the conveying direction of the loading conveying mechanism, the bottom of the lifting side plate (5) is connected to the telescopic shaft of the first lifting cylinder (28), the bottom of the first lifting cylinder (28) is connected to the first slide plate (29), and the first slide plate (29) is mounted on the slide seat of the first linear drive module (31).
8. The automatic loading and unloading device for finished integrated circuit board testing according to claim 1, characterized in that: A second base (32) is provided below the lifting baffle (6), a second lifting cylinder (33) is mounted on the second base (32), and a telescopic shaft of the second lifting cylinder (33) is connected to the lifting baffle (6).
9. The automatic loading and unloading device for finished integrated circuit board testing according to claim 1, characterized in that: The top and bottom of the detection workbench (1) are both connected to a 7-shaped bracket (34), a detection cylinder (35) is vertically mounted on the 7-shaped bracket (34), the telescopic shafts of the two detection cylinders (35) are respectively connected to the two detection plates (3), and a detection light source is mounted on the detection plate (3).
10. The automatic loading and unloading device for finished integrated circuit board testing according to claim 1, characterized in that: The feeding conveying mechanism further comprises a conveying platform (36), a second linear drive module (37) is arranged at the bottom of both ends of each group of the conveying belts (9), the conveying direction of the second linear drive module (37) is perpendicular to the conveying direction of the feeding conveying mechanism, the conveying frame of the conveying belt (9) is connected to the slide seat of the second linear drive module (37), a telescopic shaft (38) is arranged between the limit plate (10) and the conveying frame, the two ends of the telescopic shaft (38) are respectively fixedly connected to the conveying frame and the limit plate (10), an adjusting spring (39) is sleeved on the telescopic shaft (38), a limit screw (40) is passed through the middle of the limit plate (10), and the tail of the limit screw (40) passes through the conveying frame and is threadedly connected to the limit nut (41).
Citation Information
Patent Citations
Equipment for automatically detecting appearance of welded semiconductor chip
CN116106221A
Auxiliary device for egg embryo formation activity detection
CN116116743A
Detection device for electroplated HDI circuit board
CN119146864A
Feeding detection device for flaky materials
CN210775250U
Detection device for PCB (Printed Circuit Board) detection machine
CN217484217U
Cited By
Remote automatic conveying system for circuit board electroplating
CN120573467A
Circuit board power-on voltage detection device
CN121091042A