Polytetrafluoroethylene sealing ring forming device

Abstract

The invention belongs to the technical field of sealing ring forming, and particularly relates to a polytetrafluoroethylene sealing ring forming device which comprises a forming main frame, a sealing ring forming die is installed on the inner side of the forming main frame, opening and closing mechanisms are arranged at the two ends of the forming main frame, and a heat exchange mechanism is integrated in the forming main frame. The sealing ring forming die comprises a fixing ring base, a forming supporting ring and symmetrically-arranged sealing ring forming dies, and a sealing ring forming cavity is formed in each sealing ring forming die. The problems that a traditional heating and cooling system (such as an electric heating wire heating device and an external water cooling device) is low in response speed, large in thermal inertia and difficult to achieve rapid switching, so that time consumed in the feeding and cooling stages is increased, and the production efficiency is limited are solved. According to the invention, through a semiconductor chilling plate bilateral synchronous heat absorption and heat dissipation technology, in combination with precise control of the capillary heat conduction layer and the circulating pump, rapid switching between a heating mode and a cooling mode is realized, and compared with a traditional water cooling / electric heating system, the efficiency is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of sealing ring molding, and in particular relates to a polytetrafluoroethylene sealing ring molding device. Background Art

[0002] As a high-performance sealing element, polytetrafluoroethylene (PTFE) sealing rings are widely used in chemical industry, aerospace and other fields due to their excellent corrosion resistance, low friction coefficient and wide temperature range stability. At present, the main molding methods of PTFE sealing rings include sintering molding and push molding. Sintering molding uses high-temperature treatment to melt and solidify PTFE powder, which is suitable for the production of thick-walled products, but its process cycle is long, energy consumption is high, and it is difficult to achieve precision molding of complex structures. Although push molding can improve efficiency, the temperature and pressure must be precisely controlled during the processing to ensure that the material flows fully and solidifies quickly, which places high demands on equipment performance; In the existing technology, the production of PTFE sealing rings mostly adopts high temperature and high pressure molding combined with post-cutting process. However, this method has significant defects: the traditional heating and cooling system (such as electric heating wire heating and external water cooling device) has slow response speed and large thermal inertia, and it is difficult to achieve fast switching, which leads to increased time consumption in the feeding and cooling stages and limited production efficiency; Therefore, it is necessary to design a polytetrafluoroethylene sealing ring molding device to solve the above problems. Summary of the invention

[0003] The object of the present invention is to provide a polytetrafluoroethylene sealing ring molding device to solve the problems raised in the above background technology.

[0004] To achieve the above object, the present invention provides the following technical solution: a polytetrafluoroethylene sealing ring forming device, comprising: A molding main frame, a sealing ring molding die is installed on the inner side of the molding main frame, opening and closing mechanisms are arranged at both ends of the molding main frame, and a heat exchange mechanism is integrated inside the molding main frame; The sealing ring forming mold comprises a fixed ring seat, a forming support ring and a symmetrically arranged forming sealing ring mold, a sealing ring forming cavity is arranged inside the forming sealing ring mold, an injection forming channel is formed between the fixed ring seat and the forming support ring, and the injection forming channel is connected with the sealing ring forming cavity; The heat exchange mechanism includes a semiconductor refrigeration plate, a cooling heat exchange tube, a heating heat exchange tube, a cooling circulation pump, a heating circulation pump and a molding mold heat exchange tube. The two sides of the semiconductor refrigeration plate are thermally coupled with the cooling heat exchange tube and the heating heat exchange tube respectively. The cooling circulation pump and the heating circulation pump control the connection between the cooling heat exchange tube and the heating heat exchange tube and the molding mold heat exchange tube through a branch pipe and a heat exchange valve to quickly adjust the temperature of the sealing ring molding cavity.

[0005] Preferably, the inner walls of the cooling heat exchange tube and the heating heat exchange tube are both provided with a capillary heat conductive layer, and the cooling heat exchange tube and the heating heat exchange tube are attached to the surface of the semiconductor refrigeration plate through a heat exchange valve.

[0006] Preferably, a heat-insulating baffle, a heat-dissipating film and a formed heat-exchange plate are sequentially arranged on the outer side of the heat-exchange tube of the molding mold, and the formed heat-exchange plate is in direct contact with the inner wall of the molding cavity of the sealing ring.

[0007] Preferably, an opening and closing sealing groove is provided on the inner side of the molding sealing ring mold, and an opening and closing sealing ring is provided in the opening and closing sealing groove for sealingly cooperating with the molding support ring when closed.

[0008] Preferably, a heating wire is embedded in the inner side of the molding support ring, and the heating wire is distributed along the built-in channels of the fixed ring seat and the molding support ring, so as to maintain the fluidity of the material injected into the molding channel. A snap-fit ​​sealing groove is provided at the end of the molding sealing ring mold, and a snap-fit ​​sealing ring is provided on the inner side of the snap-fit ​​sealing groove.

[0009] Preferably, the opening and closing mechanism includes an opening and closing hydraulic cylinder, an opening and closing mounting plate, an opening and closing sliding plate, a molding die mounting seat and an opening and closing guide slot, and the opening and closing hydraulic cylinder drives the opening and closing sliding plate to drive the molding sealing ring die to move along the opening and closing guide slot; An opening and closing guide slide plate is fixed on one side of the opening and closing sliding plate, and the opening and closing guide slide plate is slidably matched with the opening and closing guide sliding groove.

[0010] Preferably, a reinforcement mechanism is provided at the upper end of the main molding frame, and the reinforcement mechanism includes a reinforcement hydraulic cylinder and a reinforcement pressure plate, and the reinforcement pressure plate presses the end of the molding sealing ring mold to enhance stability after closing.

[0011] Preferably, guide mechanisms are provided at both ends of the molding main frame, and the guide mechanisms include positioning guide rods and positioning guide frames. The positioning guide rods are fixed to the ends of the molding sealing ring mold and are slidably installed in the positioning guide grooves of the positioning guide frames.

[0012] Preferably, the guiding mechanism also includes a positioning guide seat, a positioning guide hole is provided on the inner side of the positioning guide seat, both ends of the heat exchange tube of the molding mold are connected to heat exchange connecting pipes, the heat exchange connecting pipe passes through the positioning guide hole and moves synchronously with the molding sealing ring mold to ensure the stability of the heat exchange pipeline connection.

[0013] Preferably, a mounting center column and a mounting side frame are fixed to the supporting main seat of the forming main frame by bolts, a supporting center frame is provided in the middle of the mounting center column, two ends of the supporting center frame are fixed to the mounting side frames, and forming mold mounting grooves are provided at both ends of the mounting center column, and the fixing ring seat, the forming support ring and the forming sealing ring mold are all installed in the forming mold mounting groove.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. Through the semiconductor refrigeration plate double-sided synchronous heat absorption and heat dissipation technology, combined with the capillary heat conduction layer and the precise control of the circulation pump, the rapid switching of heating and cooling modes is realized, which is more efficient than the traditional water cooling / electric heating system. In the feeding stage, the heating heat exchange tube is quickly heated to the set temperature to ensure the fluidity of the polytetrafluoroethylene material; in the curing stage, the cooling heat exchange tube is quickly cooled to quickly shape the material; dynamic regulation shortens the single molding cycle and reduces energy consumption.

[0015] 2. The hydraulically driven reinforcement mechanism and multi-level guide system, including positioning guide rods, opening and closing guide slides and reinforcement pressure plates, are used to improve the mold closing accuracy and solve the misalignment problem caused by vibration or thermal expansion of traditional molds.

[0016] 3. The heat-dissipating film and the heat-exchange plate are integrated on the outside of the heat exchange tube of the molding mold, and the precise temperature control of the semiconductor refrigeration plate is combined to make the temperature distribution in the molding cavity of the sealing ring uniform, avoiding material degradation caused by local overheating or internal cracks caused by uneven cooling.

[0017] 4. Through the integrated heat exchange mechanism design, the traditional independent heating furnace and cooling water tank are eliminated, the equipment footprint is reduced, and the cooling water consumption is reduced (the traditional process requires continuous water supply); the Peltier effect of the semiconductor refrigeration plate can realize the recycling of heat energy, and the comprehensive energy consumption is lower than that of similar equipment.

[0018] 5. The opening and closing mechanism and the guide mechanism adopt a modular design, which supports the rapid disassembly and replacement of mold components, shortening the maintenance time; in addition, the redundant design of the heat exchange valve and the branch pipe allows the system to switch to the backup channel when a single-side pipeline fails. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 It is a front view structural schematic diagram of the present invention; Figure 3 It is a schematic diagram of the opening and closing structure of the present invention; Figure 4 It is a schematic diagram of the molding cavity structure of the present invention; Figure 5 It is a schematic diagram of the reinforcement structure of the present invention; Figure 6 For the present invention Figure 1 The enlarged structural diagram at A in the middle; Figure 7 It is a schematic diagram of the heat exchange structure of the present invention; Figure 8 It is a schematic diagram of the circulation heat exchange tapping structure of the present invention; Fig. 9 It is a schematic diagram of the heat exchange capillary structure of the present invention; Fig.10This is a schematic diagram of heat exchange pipe connection of the present invention; In the figure: 1. Main frame for forming; 11. Main support seat; 12. Middle column for installation; 13. Middle support frame; 14. Side frame for installation; 2. Sealing ring forming die; 21. Fixed ring seat; 22. Forming support ring; 23. Sealing ring forming die; 24. Sealing ring forming cavity; 25. Opening and closing sealing groove; 26. Opening and closing sealing ring; 27. Engaging sealing ring; 28. Engaging sealing groove; 29. ​​Injection molding channel; 3. Opening and closing mechanism; 31. Opening and closing hydraulic cylinder; 32. Opening and closing mounting plate; 33. Opening and closing sliding plate; 34. Forming die mounting seat; 35. Opening and closing guide slide plate; 36. Opening and closing guide slide groove; 4. Reinforcement mechanism ; 41. Reinforced hydraulic cylinder; 42. Reinforced pressure plate; 43. Molding mold mounting groove; 5. Guide mechanism; 51. Positioning guide frame; 52. Positioning guide groove; 53. Positioning guide rod; 54. Positioning guide seat; 55. Positioning guide hole; 6. Heat exchange mechanism; 61. Semiconductor refrigeration plate; 62. Cooling heat exchange tube; 621. Capillary heat conductive layer; 63. Heating heat exchange tube; 64. Cooling circulation pump; 65. Heating circulation pump; 66. Molding mold heat exchange tube; 661. Insulation partition; 662. Heat-dissipating thermal conductive film; 663. Molding heat exchange plate; 67. Heat exchange connecting pipe; 68. Branch pipe; 69. Heat exchange valve. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] Example 1: Please refer to Figures 1 to 10 The present invention provides a technical solution: a polytetrafluoroethylene sealing ring molding device, comprising a molding main frame 1, a sealing ring molding die 2 is installed on the inner side of the molding main frame 1, opening and closing mechanisms 3 are arranged at both ends of the molding main frame 1, and a heat exchange mechanism 6 is arranged inside the molding main frame 1; The forming main frame 1 includes a supporting main seat 11, a mounting center column 12 is fixedly installed in the middle of the supporting main seat 11 by bolts, mounting side frames 14 are fixedly installed at both ends of the supporting main seat 11 by bolts, a supporting center frame 13 is arranged in the middle of the mounting center column 12, both ends of the supporting center frame 13 are fixed to the mounting side frames 14 by bolts, and a reinforcing mechanism 4 is arranged at the upper end of the mounting center column 12; The sealing ring forming mold 2 includes a fixed ring seat 21 fixed on the installation center column 12, a forming support ring 22 is fixedly installed on one side of the installation center column 12, a forming sealing ring mold 23 is arranged on the outer side of the forming support ring 22, and the two ends of the forming sealing ring mold 23 are connected with the guide mechanism 5, and the inside of the forming sealing ring mold 23 is provided with a sealing ring forming cavity 24, and the end of the forming sealing ring mold 23 is provided with a snap-fit ​​sealing groove 28, and the inner side of the snap-fit ​​sealing groove 28 is provided with a snap-fit ​​sealing ring 27, and the snap-fit ​​sealing groove 28 cooperates with the snap-fit ​​sealing ring 27 to ensure the sealing of the forming sealing ring mold 23 when it is closed, and an injection molding channel 29 is arranged on the inner side of the installation center column 12, and one end of the injection molding channel 29 is connected to the sealing ring through the built-in channel inside the molding support ring 22 and the fixed ring seat 21. The sealing ring molding cavity 24 is connected, the shape of the molding sealing ring mold 23 is set to be semicircular, and the molding sealing ring mold 23 is symmetrically installed on the outer side of the molding support ring 22. The inner side of the molding sealing ring mold 23 is provided with an opening and closing sealing groove 25, and the inner side of the opening and closing sealing groove 25 is provided with an opening and closing sealing ring 26. When in use, the molding sealing ring mold 23 and the molding support ring 22 are sealed by the opening and closing sealing ring 26; the inner side of the molding support ring 22 is provided with a heating wire, and the position of the heating wire corresponds to the position of the built-in channel inside the molding support ring 22 and the fixed ring seat 21. When in use, the extrusion equipment connected to the injection molding channel 29 squeezes the heated polytetrafluoroethylene material into the sealing ring molding cavity 24, and the heating of the heating wire ensures that the material is always in a liquid state; The heat exchange mechanism 6 includes a semiconductor refrigeration plate 61 installed in the support main seat 11 and a molding mold heat exchange tube 66 installed in the molding sealing ring mold 23. A cooling heat exchange tube 62 and a heating heat exchange tube 63 are respectively arranged on both sides of the semiconductor refrigeration plate 61. One end of the cooling heat exchange tube 62 is connected to a cooling circulation pump 64, and one end of the heating heat exchange tube 63 is connected to a heating circulation pump 65. Both ends of the molding mold heat exchange tube 66 are connected to a heat exchange connecting tube 67. The heat exchange connecting tube 67, the cooling heat exchange tube 62, and the heating heat exchange tube 63 are connected to the heating circulation pump 65. The heat exchange pipe 63, the cooling circulation pump 64 and the heating circulation pump 65 are all connected with a branch pipe 68 and a heat exchange valve 69. The heat exchange connecting pipe 67 is connected with the cooling heat exchange pipe 62 and the heating heat exchange pipe 63 through the branch pipe 68 and the heat exchange valve 69. The surfaces of the cooling heat exchange pipe 62 and the heating heat exchange pipe 63 are provided with a heat exchange valve 69, and the cooling heat exchange pipe 62 and the heating heat exchange pipe 63 are attached to the surface of the semiconductor refrigeration sheet 61 through the heat exchange valve 69. The interior of the cooling heat exchange pipe 62 and the heating heat exchange pipe 63 is A capillary heat conductive layer 621 is provided, and the semiconductor refrigeration sheet 61 is operated to dissipate heat on one side of the surface to heat the heating heat exchange tube 63 and the internal medium, and the heating circulation pump 65 is operated to heat the inner side of the heat exchange tube 66 of the molding die, thereby heating the inner side of the sealing ring molding cavity 24; after the extrusion is completed, the heat exchange valve 69 connecting the heating heat exchange tube 63 and the molding die heat exchange tube 66 is closed, and the heat exchange valve 69 connecting the cooling heat exchange tube 62 and the molding die heat exchange tube 66 is opened, and the semiconductor refrigeration sheet 61 is connected to the heating heat exchange tube 63 is heated while cooling the cooling heat exchange tube 62 and the internal medium; a heat-distributing thermal film 662 is arranged on the outer side of the molding die heat exchange tube 66, a heat-distributing thermal film 662 is arranged on one side of the heat-distributing thermal film 662, and a molding heat exchange plate 663 is arranged on the other side of the heat-distributing thermal film 662, and the molding heat exchange plate 663 corresponds to the inner side position of the sealing ring molding cavity 24, so as to ensure that the molding die heat exchange tube 66 can quickly exchange heat with the polytetrafluoroethylene material in the sealing ring molding cavity 24 during heat exchange when in use.

[0022] From the above description, it can be seen that the present invention has the following beneficial effects: during assembly, the sealing ring molding mold 2 is installed on the molding main frame 1 through the opening and closing mechanism 3, and when in use, it is connected to the extrusion equipment through the injection molding channel 29, and the molding sealing ring mold 23 is quickly docked and clamped on one side of the molding support ring 22 through the opening and closing mechanism 3, and the cooling heat exchange tube 62 and the heating heat exchange tube 63 are quickly cooled and heated by the semiconductor refrigeration plate 61 absorbing and dissipating heat on both sides, and the cooling circulation pump 64 and the heating circulation pump 65 are connected to the molding mold heat exchange tube 66, so as to quickly heat or cool the polytetrafluoroethylene material in the sealing ring molding cavity 24, thereby facilitating the rapid flow of materials and rapid molding after adding materials, thereby speeding up processing efficiency.

[0023] Example 2: Please refer to Figures 1 to 10As shown, on the basis of the first embodiment, the present invention provides a technical solution: the opening and closing mechanism 3 includes a forming mold mounting seat 34 fixed on the supporting middle frame 13, an opening and closing mounting plate 32 fixed on the mounting side frame 14, and an opening and closing hydraulic cylinder 31 fixed on the opening and closing mounting plate 32, the piston rod of the opening and closing hydraulic cylinder 31 is fixedly installed with an opening and closing sliding plate 33 by bolts, one end of the opening and closing sliding plate 33 is fixed to the forming sealing ring mold 23 by bolts, and when in use, the opening and closing hydraulic cylinder 31 drives the opening and closing sliding plate 33 and the forming sealing ring mold 23 to move; an opening and closing guide slot 36 is provided on one side of the supporting middle frame 13, an opening and closing guide slide plate 35 is fixedly installed on one side of the opening and closing sliding plate 33 by screws, and the opening and closing guide slide plate 35 is slidably installed in the opening and closing guide slot 36, and the sliding guide of the opening and closing guide slot 36 and the opening and closing guide slide plate 35 makes the opening and closing sliding plate 33 drive the forming sealing ring mold 23 to move more stably; For further information, see Figures 1 to 5 The reinforcement mechanism 4 includes a reinforcement hydraulic cylinder 41 fixed to the upper end of the installation center column 12 and a reinforcement pressure plate 42 installed on the piston rod of the reinforcement hydraulic cylinder 41 by bolts. The reinforcement pressure plate 42 is pressed on the end of the molding sealing ring mold 23. The two ends of the installation center column 12 are provided with molding mold mounting grooves 43. The fixed ring seat 21, the molding support ring 22 and the molding sealing ring mold 23 are all installed in the molding mold mounting groove 43. When in use, the opening and closing hydraulic cylinder 31 drives the opening and closing sliding plate 33 and the molding sealing ring mold 23 to move, so that the molding sealing ring mold 23 is aligned into a ring shape. The reinforcement hydraulic cylinder 41 pushes the reinforcement pressure plate 42 to press on the end of the molding sealing ring mold 23 to ensure that the molding sealing ring mold 23 is more stable after alignment.

[0024] The reinforcement mechanism 4 and the opening and closing mechanism 3 of the above-mentioned technical solution are adopted. When in use, the opening and closing hydraulic cylinder 31 drives the opening and closing sliding plate 33 and the molding sealing ring mold 23 to move, thereby opening the molding sealing ring mold 23 to remove the inner molded sealing ring. When in use, the reinforcement hydraulic cylinder 41 and the reinforcement pressure plate 42 of the reinforcement mechanism 4 press and position the end of the molding sealing ring mold 23, thereby ensuring that the molding sealing ring molds 23 are more stable when they are matched.

[0025] For further information, see Figures 1 to 6The guide mechanism 5 includes a positioning guide rod 53 fixed to the outer side of the end of the molding sealing ring mold 23 and a positioning guide frame 51 integrally formed at the end of the mounting side frame 14. A positioning guide groove 52 is provided on the inner side of the positioning guide frame 51. The positioning guide rod 53 is slidably installed in the positioning guide groove 52. When the molding sealing ring mold 23 moves, the positioning guide rod 53 moves with it. The positioning guide frame 51 and the positioning guide groove 52 cooperate to position and guide the positioning guide rod 53, thereby ensuring that the molding sealing ring mold 23 is more stable when moving; the guide mechanism 5 also includes a positioning guide seat 54 fixed to the mounting side frame 14. A positioning guide hole 55 is provided on the inner side of the positioning guide seat 54. The heat exchange connecting pipe 67 is slidably connected to the positioning guide seat 54 through the positioning guide hole 55. When in use, the molding sealing ring mold 23 moves to drive the heat exchange connecting pipe 67 to move. The positioning guide seat 54 cooperates to position the heat exchange connecting pipe 67, thereby ensuring that the heat exchange connecting pipe 67 is stably connected to the molding sealing ring mold 23.

[0026] The guiding mechanism 5 using the above technical solution, through the designed positioning guide rod 53 and positioning guide seat 54, can ensure that the molding sealing ring mold 23 is more stable when moving through the guidance of the positioning guide rod 53 and the positioning guide frame 51 during use, thereby reducing the deviation phenomenon after long-term use. The heat exchange connecting pipe 67 is supported and guided by the positioning guide seat 54, so as to ensure that the heat transfer medium can stably enter the molding mold heat exchange pipe 66 through the heat exchange connecting pipe 67 without affecting the movement of the molding sealing ring mold 23.

[0027] The working principle and use process of the present invention are as follows: when in use, the opening and closing hydraulic cylinder 31 drives the opening and closing sliding plate 33 and the forming sealing ring mold 23 to move, so that the forming sealing ring mold 23 is aligned into a ring shape and pressed on the outside of the forming support ring 22, and the reinforcing hydraulic cylinder 41 pushes the reinforcing pressing plate 42 to press on the end of the forming sealing ring mold 23, ensuring that the forming sealing ring mold 23 is more stable after alignment. At the same time, the semiconductor refrigeration plate 61 runs on one side to dissipate heat to heat the heating heat exchange tube 63 and the internal medium, and the heating circulation pump 65 runs to heat the inner side of the heat exchange tube 66 of the forming mold, thereby heating the inner side of the sealing ring forming cavity 24, and the extrusion equipment connected to the injection molding channel 29 squeezes the heated polytetrafluoroethylene material into the sealing ring forming cavity. In the cavity 24, the heating effect is combined to ensure that the sealing ring molding cavity 24 can be fully filled during extrusion to avoid cooling and solidification. After extrusion is completed, the heat exchange valve 69 connecting the heating heat exchange tube 63 and the molding mold heat exchange tube 66 is closed, and the heat exchange valve 69 connecting the cooling heat exchange tube 62 and the molding mold heat exchange tube 66 is opened. The semiconductor refrigeration plate 61 heats the heating heat exchange tube 63 and cools the cooling heat exchange tube 62 and the internal medium at the same time. After being drawn into the molding mold heat exchange tube 66 by the cooling circulation pump 64, it can be quickly cooled and molded, thereby ensuring better results during molding production, and no other large-scale equipment such as refrigeration and heating is required to reduce the volume. After molding, the opening and closing hydraulic cylinder 31 drives the molding sealing ring mold 23 to open and demold.

[0028] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0029] The above description is only used to illustrate the technical solution of the present invention rather than to limit it. Other modifications or equivalent substitutions made to the technical solution of the present invention by ordinary technicians in this field should be included in the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solution of the present invention.

Claims

1. A polytetrafluoroethylene sealing ring forming device, characterized in that: include: A molding main frame (1), a sealing ring molding die (2) is installed on the inner side of the molding main frame (1), opening and closing mechanisms (3) are arranged at both ends of the molding main frame (1), and a heat exchange mechanism (6) is integrated inside the molding main frame (1); The sealing ring forming mold (2) comprises a fixed ring seat (21), a forming support ring (22) and a symmetrically arranged sealing ring forming mold (23); a sealing ring forming cavity (24) is provided inside the sealing ring forming mold (23); an injection molding channel (29) is formed between the fixed ring seat (21) and the forming support ring (22); and the injection molding channel (29) is communicated with the sealing ring forming cavity (24); The heat exchange mechanism (6) comprises a semiconductor refrigeration plate (61), a cooling heat exchange tube (62), a heating heat exchange tube (63), a cooling circulation pump (64), a heating circulation pump (65) and a molding mold heat exchange tube (66). The two sides of the semiconductor refrigeration plate (61) are thermally coupled to the cooling heat exchange tube (62) and the heating heat exchange tube (63) respectively. The cooling circulation pump (64) and the heating circulation pump (65) control the connection between the cooling heat exchange tube (62) and the heating heat exchange tube (63) and the molding mold heat exchange tube (66) through a branch pipe (68) and a heat exchange valve (69), so as to quickly adjust the temperature of the sealing ring molding cavity (24).

2. The device according to claim 1, characterized in that: The inner walls of the cooling heat exchange tube (62) and the heating heat exchange tube (63) are both provided with a capillary heat conduction layer (621), and the cooling heat exchange tube (62) and the heating heat exchange tube (63) are attached to the surface of the semiconductor refrigeration plate (61) through a heat exchange valve (69).

3. The device according to claim 1, characterized in that: The outer side of the molding die heat exchange tube (66) is provided with a heat-insulating baffle (661), a heat-dissipating heat-conducting film (662), and a molding heat exchange plate (663) in sequence, and the molding heat exchange plate (663) is in direct contact with the inner wall of the sealing ring molding cavity (24).

4. The device according to claim 1, characterized in that: An opening and closing sealing groove (25) is provided on the inner side of the molding sealing ring mold (23), and an opening and closing sealing ring (26) is provided in the opening and closing sealing groove (25) for sealingly cooperating with the molding support ring (22) when closed.

5. The device according to claim 1, characterized in that: A heating wire is embedded inside the molding support ring (22), and the heating wire is distributed along the built-in channels of the fixed ring seat (21) and the molding support ring (22), and is used to maintain the fluidity of the material injected into the molding channel (29). A snap-fit ​​sealing groove (28) is provided at the end of the molding sealing ring mold (23), and a snap-fit ​​sealing ring (27) is provided inside the snap-fit ​​sealing groove (28).

6. The device according to claim 1, characterized in that: The opening and closing mechanism (3) comprises an opening and closing hydraulic cylinder (31), an opening and closing mounting plate (32), an opening and closing sliding plate (33), a molding die mounting seat (34) and an opening and closing guide slide groove (36); the opening and closing hydraulic cylinder (31) drives the opening and closing sliding plate (33) to drive the molding sealing ring mold (23) to move along the opening and closing guide slide groove (36); An opening and closing guide slide plate (35) is fixed to one side of the opening and closing sliding plate (33), and the opening and closing guide slide plate (35) is slidably matched with the opening and closing guide sliding groove (36).

7. The device according to claim 1, characterized in that: A reinforcing mechanism (4) is provided at the upper end of the main molding frame (1), the reinforcing mechanism (4) comprising a reinforcing hydraulic cylinder (41) and a reinforcing pressing plate (42), the reinforcing pressing plate (42) pressing the end of the molding sealing ring mold (23) to enhance stability after closing.

8. The device according to claim 1, characterized in that: Guide mechanisms (5) are provided at both ends of the molding main frame (1). The guide mechanisms (5) include positioning guide rods (53) and positioning guide frames (51). The positioning guide rods (53) are fixed to the ends of the molding sealing ring mold (23) and are slidably mounted in positioning guide grooves (52) of the positioning guide frames (51).

9. The device according to claim 8, characterized in that: The guide mechanism (5) further comprises a positioning guide seat (54), a positioning guide hole (55) being provided inside the positioning guide seat (54), both ends of the molding die heat exchange tube (66) being connected to heat exchange connecting tubes (67), the heat exchange connecting tube (67) passing through the positioning guide hole (55) and moving synchronously with the molding sealing ring mold (23), thereby ensuring the stability of the heat exchange pipeline connection.

10. The device according to claim 5, characterized in that: A mounting middle column (12) and a mounting side frame (14) are fixed to a supporting main seat (11) of the molding main frame (1) by bolts, a supporting middle frame (13) is provided in the middle of the mounting middle column (12), both ends of the supporting middle frame (13) are fixed to the mounting side frames (14), molding die mounting grooves (43) are provided at both ends of the mounting middle column (12), and a fixing ring seat (21), a molding support ring (22) and a molding sealing ring mold (23) are all installed in the molding die mounting grooves (43).

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