A crystalline silicon substrate off-line transport device and transport method

By combining receiving, reversing, adjusting, and extracting mechanisms, the problem of inaccurate positioning during the silicon wafer production line process is solved, achieving precise positioning and reliable placement, simplifying the robot structure, reducing costs, and improving durability.

CN119953846BActive Publication Date: 2025-11-14INNER MONGOLIA XINGGU TECH CO LTD
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Patent Information

Application Number
CN202510268870.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-03-07
Publication Date
2025-11-14
Estimated Expiration
2045-03-07

AI Technical Summary

Technical Problem

In the existing technology, the positioning of the silicon wafers during the production line is inaccurate, which causes the silicon wafers to be placed in a different position, making them prone to collisions, resulting in incomplete corners or appearance defects. In addition, the robot structure is complex, costly, and has poor durability.

Method used

The system employs a receiving mechanism, a reversing mechanism, an adjusting mechanism, and an extraction mechanism. Through the up-and-down floating structure of the second conveyor belt and the adjustment of the friction block of the speed limiting shaft, combined with the push block step groove of the push shaft, the precise positioning and reliable placement of the crystalline silicon plate are achieved.

Benefits of technology

It achieves precise positioning and reliable placement during the silicon wafer roll-off process, simplifies the robot structure, reduces equipment costs, and improves working durability.

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Abstract

This invention discloses a crystalline silicon substrate off-line transport device and method, including a receiving mechanism, a reversing mechanism, an adjusting mechanism, and an extraction mechanism for a robotic arm to extract the crystalline silicon substrate. The receiving mechanism receives the crystalline silicon substrate and transfers it to the reversing mechanism. The reversing mechanism moves up and down via a second conveyor belt, allowing the crystalline silicon substrate to switch between a first and a second transport direction throughout the transport process. The crystalline silicon substrate enters the front section of the adjusting mechanism, where a speed-limiting shaft creates a speed difference between one side of the substrate to correct its offset angle. The substrate enters the rear section of the adjusting mechanism, where a pushing plate corrects the center offset distance and positions the substrate accordingly. The substrate then enters the extraction mechanism for final positioning and is extracted and moved by the robotic arm, ultimately achieving precise positioning and reliable placement of the crystalline silicon substrate during the off-line process.
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Citation Information

Patent Citations

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  • Mobile transmission device for silicon wafers

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