Ultraviolet curing anaerobic adhesive as well as preparation method and application thereof

Abstract

The invention discloses an ultraviolet light curing anaerobic adhesive as well as a preparation method and application thereof. The ultraviolet light curing anaerobic adhesive comprises the following raw material components in parts by weight: 20-40 parts of epoxy acrylate; 10 to 20 parts of modified epoxy resin; 10 to 20 parts of an anaerobic monomer; 5-10 parts of a toughening agent; 1-3 parts of a thixotropic agent; 0.5 to 5 parts of an accelerant; 3-8 parts of a photoinitiator; 2-5 parts of a thermal initiator; and 0.1 to 0.5 part of a polymerization inhibitor. The polyether amine (amino structure) and the alicyclic epoxy resin (epoxy group) can fully react, and the adhesive strength is effectively improved by utilizing the advantages that the alicyclic epoxy resin can improve the heat resistance, low temperature resistance and the like of the product.

Description

Technical Field

[0001] The invention belongs to the technical field of glue and relates to an anaerobic adhesive, and in particular to an ultraviolet light-cured anaerobic adhesive and a preparation method and application thereof. Background Art

[0002] Anaerobic adhesive is an adhesive that can cure rapidly under anaerobic conditions. It is widely used in thread locking, sealing, etc. in the fields of machinery, electronics, and automobiles. However, traditional anaerobic adhesives usually require a long curing time, and the performance after curing is insufficient in certain specific environments. The dual curing process of UV-curing anaerobic adhesive is a synergistic process: first, initial bonding is achieved through rapid curing by ultraviolet light, and then further curing is achieved through an anaerobic curing system in an anaerobic or low-oxygen environment, thereby improving the bonding strength and weather resistance of the adhesive. With the development of technology, this dual curing mechanism enables UV-curing anaerobic adhesives to maintain good performance under a variety of environmental conditions and has broad application prospects.

[0003] A Chinese invention patent with application number 201910150661.5 discloses an anaerobic structural adhesive and a preparation method thereof. The formula includes, by mass, 30-60 parts of polyurethane acrylate, 30-40 parts of acrylate monomer, 2-5 parts of accelerator, 3-5 parts of cross-linker, 1-5 parts of initiator, 0.5-1 part of stabilizer, 0.1-0.5 part of metal chelator, and 0.5-1 part of dye. The anaerobic structural adhesive is suitable for fixing motor magnets. The selection of the formula accelerates the curing time of the structural adhesive, enhances the bonding strength and impact resistance of the structural adhesive, so as to meet the requirements of strong vibration, assembly line operation, and high durability in the motor industry. However, there is still room for improvement in its peel strength. Summary of the invention

[0004] In order to solve the above technical problems, the object of the present invention is to provide a UV-curable anaerobic adhesive.

[0005] In order to achieve the above object, the present invention provides a UV-curable anaerobic adhesive, which comprises the following raw material components in parts by weight: Epoxy acrylate 20-40 parts; Modified epoxy resin 10-20 parts; Anaerobic monomer 10~20 parts; Toughening agent 5~10 parts; Thixotropic agent 1~3 parts; Accelerator 0.5~5 parts; Photoinitiator 3~8 parts; Thermal initiator 2~5 parts; Inhibitor 0.1~0.5 parts.

[0006] Optimally, the preparation of the epoxy acrylate comprises the following steps: Add bisphenol A epoxy resin into a reaction vessel equipped with a stirrer, a thermometer, and a reflux condenser, and heat to 80-90° C. to obtain preheated epoxy resin; Acrylic acid, triethylamine and p-methoxyphenol are mixed and then added dropwise to the preheated epoxy resin; the reaction temperature is controlled to be 95-105° C. during the addition, the mass of the acrylic acid and the triethylamine are independently 0.1-3% of the mass of the bisphenol A epoxy resin, and the mass of the p-methoxyphenol is 0.01-1% of the mass of the bisphenol A epoxy resin; After the addition is completed, the reaction temperature is maintained to continue the reaction for a period of time; then the temperature is raised to 110-120°C to reduce the acid value to ≤5 mgKOH / g; and the material is cooled and discharged.

[0007] Optimally, the preparation of the modified epoxy resin comprises the following steps: Add polyetheramine with functionality ≥ 2 and alicyclic epoxy resin in proportion to a reaction vessel equipped with a stirrer, a thermometer and a condenser, and react at 60-100°C for 2-4 hours; after the reaction is completed, cool and discharge the material; The molar ratio of the amino group of the polyetheramine to the epoxy group of the alicyclic epoxy resin is 0.8-1.2.

[0008] Optimally, the anaerobic monomer is a mixture of one or more selected from the group consisting of glycidyl methacrylate, isobornyl methacrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, 1,4-butanediol dimethacrylate, ethoxylated bisphenol A dimethacrylate and trimethylolpropane trimethacrylate.

[0009] Optimally, the toughening agent is a mixture of one or more selected from carboxyl-terminated butadiene acrylonitrile rubber, core-shell rubber and linear polybutadiene-polyacrylonitrile copolymer.

[0010] Optimally, the thixotropic agent has a specific surface area of ​​70-450m 2 / g of hydrophobic fumed silica.

[0011] Optimally, the promoter is a mixture of one or more selected from triethylamine, N,N-dimethylaniline and N,N-diethylaniline.

[0012] Optimally, the photoinitiator is a mixture of one or more selected from 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 1-hydroxy-cyclohexyl-phenyl ketone, ethyl 2,4,6-trimethylbenzoylphenylphosphonate and methyl benzoylformate; The thermal initiator is a mixture of one or more selected from dibenzoyl peroxide and tert-butyl perbenzoate; The polymerization inhibitor is a mixture of one or more selected from hydroquinone, p-hydroxyanisole and 2,6-di-tert-butyl-p-cresol.

[0013] Another object of the present invention is to provide a method for preparing the above-mentioned UV-curable anaerobic adhesive, comprising the following steps: The epoxy acrylate, modified epoxy resin, toughening agent, anaerobic monomer and thixotropic agent in the formula are mixed and stirred for 0.5 to 2 hours; then the accelerator and inhibitor in the formula are added, and stirring is continued for 0.5 to 2 hours; Then add the photoinitiator and thermal initiator in the formula amount, evacuate, maintain pressure and stir for 2h-4h; vacuum defoam and discharge the material.

[0014] Another object of the present invention is to provide an application of the above-mentioned UV-curing anaerobic adhesive for thread locking and / or sealing.

[0015] The UV-curable anaerobic adhesive of the present invention adopts specific epoxy acrylates, modified epoxy resins and combines them with anaerobic monomers, photoinitiators, toughening agents, thixotropic agents, etc., so that polyetheramine (amino structure) and alicyclic epoxy resin (epoxy group) can be fully reacted, which can improve the heat resistance and low temperature resistance of the product and effectively improve the bonding strength. DETAILED DESCRIPTION

[0016] The UV-curable anaerobic adhesive of the present invention comprises the following raw material components in parts by weight: 20-40 parts of epoxy acrylate; 10-20 parts of modified epoxy resin; 10-20 parts of anaerobic monomer; 5-10 parts of toughening agent; 1-3 parts of thixotropic agent; 0.5-5 parts of accelerator; 3-8 parts of photoinitiator; 2-5 parts of thermal initiator; 0.1-0.5 parts of polymerization inhibitor. By using specific epoxy acrylate, modified epoxy resin and combining with anaerobic monomer, photoinitiator, toughening agent, thixotropic agent, etc., polyether amine (amino structure) and alicyclic epoxy resin (epoxy group) can be fully reacted, and the alicyclic epoxy resin can be used to improve the heat resistance and low temperature resistance of the product, and effectively improve the bonding force.

[0017] The preparation of the epoxy acrylate comprises the following steps: adding bisphenol A epoxy resin into a reaction vessel equipped with a stirrer, a thermometer, and a reflux condenser, and heating to 80-90°C to obtain a preheated epoxy resin; mixing acrylic acid, triethylamine, and p-methoxyphenol, and then dripping them into the preheated epoxy resin; controlling the reaction temperature to be 95-105°C during dripping, the mass of the acrylic acid and the triethylamine being independently 0.1-3% of the mass of the bisphenol A epoxy resin, and the mass of the p-methoxyphenol being 0.01-1% of the mass of the bisphenol A epoxy resin; after the dripping is completed, maintaining the reaction temperature and continuing the reaction for a period of time; then heating to 110-120°C to reduce the acid value to ≤5mgKOH / g; and cooling the material. Because the ring-opening esterification of acrylic acid and epoxy group is an exothermic reaction, dripping too quickly may cause a sharp rise in temperature and induce side reactions; after the dripping is completed, maintaining the reaction temperature and continuing the reaction for a period of time, during which the acid value is regularly sampled and measured to monitor the degree of reaction. If the product viscosity is high, an appropriate amount of active diluent trimethylolpropane triacrylate and inhibitor (p-methoxyphenol) can be added when cooled to 80°C to adjust the product performance and facilitate subsequent processing.

[0018] The preparation of the modified epoxy resin comprises the following steps: adding polyetheramine with functionality ≥ 2 and alicyclic epoxy resin in proportion to a reaction vessel equipped with a stirrer, a thermometer and a condenser, reacting at 60-100°C for 2-4 hours; cooling and discharging after the reaction; the molar ratio of the amino group of the polyetheramine to the epoxy group of the alicyclic epoxy resin is 0.8-1.2. The obtained polyetheramine has an amino structure that fully reacts with the epoxy group of the alicyclic epoxy resin to form a three-dimensional network structure, thereby improving the heat resistance and low temperature resistance of the product and effectively improving the adhesion.

[0019] The anaerobic monomer is a mixture of one or more selected from glycidyl methacrylate, isobornyl methacrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, 1,4-butanediol dimethacrylate, ethoxylated bisphenol A dimethacrylate and trimethylolpropane trimethacrylate. The toughening agent is a mixture of one or more selected from carboxyl-terminated butadiene acrylonitrile rubber (CTBN), core-shell rubber (CSR) and linear polybutadiene-polyacrylonitrile copolymer. The thixotropic agent has a specific surface area of ​​70-450m 2 / g of hydrophobic fumed silica. The accelerator is a mixture of one or more selected from triethylamine, N,N-dimethylaniline and N,N-diethylaniline. The photoinitiator is a mixture of one or more selected from 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 1-hydroxy-cyclohexyl-phenyl ketone, ethyl 2,4,6-trimethylbenzoylphenylphosphonate and methyl benzoylformate; the thermal initiator is a mixture of one or more selected from dibenzoyl peroxide (BPO) and tert-butyl perbenzoate (TBPB); the inhibitor is a mixture of one or more selected from hydroquinone, p-hydroxyanisole and 2,6-di-tert-butyl-p-cresol.

[0020] The preparation method of the above-mentioned UV-curable anaerobic adhesive comprises the following steps: mixing and stirring the epoxy acrylate, modified epoxy resin, toughening agent, anaerobic monomer and thixotropic agent in the formula amount for 0.5-2 hours; then adding the accelerator and polymerization inhibitor in the formula amount, and continuing stirring for 0.5-2 hours; then adding the photoinitiator and thermal initiator in the formula amount, vacuuming, maintaining pressure and stirring for 2-4 hours; vacuum defoaming and discharging. The above-mentioned UV-curable anaerobic adhesive is used for thread locking and / or sealing.

[0021] Specifically, the preparation method and application of the above-mentioned UV-curable anaerobic adhesive is applied to the threads, and the light reaction is carried out for 5 to 30 seconds to complete the surface curing of the anaerobic adhesive and isolate oxygen; in low temperature environments such as winter, the curing speed may be slow, and heating can be used to accelerate the curing. Among them, the light irradiation band is a mixture of one or several of the bands of 200nm to 760nm of a mercury lamp or a UV LED lamp; preferably, the light irradiation band is a mixture of one or several of the bands of 250nm to 500nm of a mercury lamp or a UV LED lamp; more preferably, the light irradiation band is a mixture of one or several of the bands of 300nm to 405nm of a mercury lamp or a UV LED lamp.

[0022] In order to enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are only embodiments of a part of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained under the premise of equivalent changes and modifications made by ordinary technicians in the field should belong to the scope of protection of the present invention.

[0023] Preparation Example 1 This example provides a method for preparing epoxy acrylate, comprising the following steps: Add 100g of bisphenol A epoxy resin (brand E51) into a reaction vessel equipped with a stirrer, a thermometer, and a reflux condenser, and heat to 80°C; After acrylic acid (0.1g), triethylamine (catalyst, 0.1g) and p-methoxyphenol (inhibitor, 0.01g) are uniformly mixed, slowly dripped into the above-mentioned preheated bisphenol A epoxy resin (the reaction temperature is strictly controlled at about 100°C during the dripping process); after the dripping is completed, keep the temperature for reaction and take samples regularly (about 15-20min) to measure the acid value to monitor the reaction degree; in the later stage of the reaction, increase the temperature to 110-120°C to reduce the acid value to ≤5mgKOH / g (at this time, the reaction is considered to be basically completed); After the reaction is completed, the material is cooled to about 80°C and discharged.

[0024] Preparation Example 2 This example provides a method for preparing epoxy acrylate, comprising the following steps: Add 100g of bisphenol A epoxy resin (brand E51) into a reaction vessel equipped with a stirrer, a thermometer, and a reflux condenser, and heat to 80°C; After mixing acrylic acid (3g), triethylamine (catalyst, 3g) and p-methoxyphenol (inhibitor, 1g) evenly, slowly add them dropwise to the preheated bisphenol A epoxy resin (the reaction temperature is strictly controlled at about 100°C during the addition process); after the addition is completed, keep the reaction warm and take samples regularly (about 15-20min) to measure the acid value to monitor the reaction degree; in the later stage of the reaction, increase the temperature to 110-120°C to reduce the acid value to ≤5mgKOH / g (at this time, the reaction is considered to be basically completed); After the reaction is completed, the material is cooled to about 80°C and discharged.

[0025] Preparation Example 3 This example provides a method for preparing epoxy acrylate, comprising the following steps: Add 100g of bisphenol A epoxy resin (brand E51) into a reaction vessel equipped with a stirrer, a thermometer, and a reflux condenser, and heat to 80°C; After acrylic acid (1g), triethylamine (catalyst, 1g) and p-methoxyphenol (inhibitor, 0.5g) are uniformly mixed, slowly dripped into the above-mentioned preheated bisphenol A epoxy resin (the reaction temperature is strictly controlled at about 100°C during the dripping process); after the dripping is completed, keep the temperature for reaction and take samples regularly (about 15-20min) to measure the acid value to monitor the reaction degree; in the later stage of the reaction, increase the temperature to 110-120°C to reduce the acid value to ≤5mgKOH / g (at this time, the reaction is considered to be basically completed); After the reaction is completed, the material is cooled to about 80°C and discharged. Example 1

[0026] This embodiment provides a UV-curable anaerobic adhesive, which is as follows: The UV-curable anaerobic adhesive includes the following components in the following amounts and types: 40 g of epoxy acrylate (prepared in Preparation Example 1), 15 g of modified epoxy resin, 20 g of anaerobic monomer, 5 g of toughening agent, 3 g of thixotropic agent, 2.5 g of accelerator, 4.5 g of photoinitiator, 2 g of thermal initiator, and 0.2 g of inhibitor; The modified epoxy resin was prepared according to the following steps: polyetheramine with a functionality of 2 (GA2-2000, 60 g) and alicyclic epoxy resin (2021P, 50 g) were added into a reaction vessel equipped with a stirrer, a thermometer and a condenser; stirring was started, and the reaction was carried out at 80° C. for 4 hours. After the reaction was completed, the material was cooled and discharged.

[0027] The anaerobic monomers include 15g of hydroxyethyl methacrylate, 3g of triethylene glycol dimethacrylate and 2g of trimethylolpropane trimethacrylate; the toughening agent is core-shell rubber (CSR-1), and the thixotropic agent is a specific surface area of ​​180m 2 / g of hydrophobic fumed silica (180H), the accelerator is triethylamine; the photoinitiator contains 3g of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide and 1.5g of 1-hydroxy-cyclohexyl-phenyl ketone (that is, the mass ratio of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide and 1-hydroxy-cyclohexyl-phenyl ketone is 2:1); the thermal initiator is dibenzoyl peroxide (BPO) and the inhibitor is 2,6-di-tert-butyl-p-cresol.

[0028] This embodiment also provides a preparation method and application of the above-mentioned UV-curable anaerobic adhesive, which is carried out at normal temperature and pressure, in a yellow light room or in a light-shielded environment, as follows: S1. Mix the formulated amount of epoxy acrylate, modified epoxy resin, toughening agent, anaerobic monomer and thixotropic agent and stir for 0.5 h; then add the formulated amount of accelerator and inhibitor and stir for 2 h; S2, add the formulated amount of photoinitiator and thermal initiator, evacuate, maintain pressure and stir for 2 hours; vacuum defoam and discharge; S3, then the UV-curing anaerobic adhesive is applied on the thread by coating / extrusion, and then placed in a light curing machine for light reaction for 5 seconds to initiate the curing of the adhesive, thereby obtaining a UV-curing anaerobic adhesive with adhesive effect (the UV-curing light source uses a 1000W medium-pressure mercury lamp with a light intensity of 80mw / cm 2 , the effective light radiation center wavelength is 365nm). Example 2

[0029] This embodiment provides a UV-curable anaerobic adhesive and a preparation method and application thereof, which is basically the same as that in Embodiment 1, except that the contents of the raw material components of the UV-curable anaerobic adhesive are different: Epoxy acrylate 35g, modified epoxy resin 20g, anaerobic monomer 10g, toughening agent 10g, thixotropic agent 1g, accelerator 0.5g, photoinitiator 3g, thermal initiator 3g, inhibitor 0.1g. Example 3

[0030] This embodiment provides a UV-curable anaerobic adhesive and a preparation method and application thereof, which is basically the same as that in Embodiment 1, except that the contents of the raw material components of the UV-curable anaerobic adhesive are different: Epoxy acrylate 20g, modified epoxy resin 10g, anaerobic monomer 15g, toughening agent 8g, thixotropic agent 2g, accelerator 5g, photoinitiator 8g, thermal initiator 5g, inhibitor 0.5g. Example 4

[0031] This embodiment provides a UV-curable anaerobic adhesive and a preparation method and application thereof, which is basically the same as that in Example 1, except that the photoinitiator is 4.5 g of 1-hydroxy-cyclohexyl-phenyl ketone. Example 5

[0032] This embodiment provides a UV-curable anaerobic adhesive and a preparation method and application thereof, which is basically the same as that in Embodiment 1, except that the thermal initiator is tert-butyl perbenzoate (TBPB).

[0033] Comparative Example 1 This example provides a UV-curable anaerobic adhesive and a preparation method and application thereof, which is basically the same as that in Example 1, except that the epoxy acrylate is commercially available Sartomer CN158.

[0034] Comparative Example 2 This example provides a UV-curable anaerobic adhesive and a preparation method and application thereof, which is basically the same as that in Example 1, except that a conventional alicyclic epoxy resin (2021P) is used without modification.

[0035] Comparative Example 3 This example provides a UV-curable anaerobic adhesive and a preparation method and application thereof, which is basically the same as that in Example 1, except that the epoxy acrylate is used in excess to 50 g.

[0036] Comparative Example 4 This example provides a UV-curable anaerobic adhesive and a preparation method and application thereof, which are basically the same as those in Example 1, except that the modified epoxy resin is used in excess to 30 g.

[0037] The UV-curable anaerobic adhesives in Examples 1-5 and Comparative Examples 1-4, as well as the existing UV glue (3525) and anaerobic glue (double bond DB515) were subjected to performance tests such as appearance, glass peel strength test after UV irradiation and after 24 hours, hot and cold shock, high temperature and high humidity, etc. The test results are shown in Table 1.

[0038] Table 1 Performance of UV-curable anaerobic adhesives in Examples 1-5 and Comparative Examples 1-4

[0039] Note: The specific test methods are as follows: (1) Appearance: Visually inspect the colloid color after curing; (2) Thermal shock: Tested in accordance with GB / T2423.22-2002 standard; (3) Peel strength: tested in accordance with GB / T 2792-2014 standard; (4) High temperature and high humidity test: Tested in accordance with GB / T 2423.3-2016 standard.

[0040] It can be seen from Table 1 that the UV-curable anaerobic adhesives prepared in Examples 1-5 of the present invention have high initial peel strength, good resistance to cold and heat shock, good resistance to high temperature and humidity, and good aging resistance at a wavelength of 270-800nm ​​after UV irradiation. Compared with existing products, they have good application prospects. Among them, Comparative Example 1 is a purchased epoxy acrylate substituted for self-synthesized polyepoxy acrylate, and the peel strength is not as good as synthetic resin, especially in terms of aging resistance; the test results of Comparative Example 2 show that the use of unmodified epoxy resin will reduce the peel strength and poor high temperature resistance; Comparative Example 3 shows that increasing the resin ratio will reduce the cold and heat shock peel strength; the test results of Comparative Example 4 show that increasing the proportion of modified epoxy resin has an effect on the cold and heat shock peel strength.

[0041] The above description is only a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. At the same time, the above description should be understandable and implementable for those with ordinary knowledge in the relevant technical field. Therefore, other equivalent changes or modifications that do not deviate from the concepts disclosed in the present invention should be included in the scope of protection of the present invention.

Claims

1. A UV-curable anaerobic adhesive, characterized in that: It includes the following raw material components in parts by weight: Epoxy acrylate 20-40 parts; Modified epoxy resin 10-20 parts; Anaerobic monomer 10~20 parts; Toughening agent 5~10 parts; Thixotropic agent 1~3 parts; Accelerator 0.5~5 parts; Photoinitiator 3~8 parts; Thermal initiator 2~5 parts; Inhibitor 0.1~0.5 parts.

2. The UV-curable anaerobic adhesive according to claim 1, characterized in that: The preparation of the epoxy acrylate comprises the following steps: Add bisphenol A epoxy resin into a reaction vessel equipped with a stirrer, a thermometer, and a reflux condenser, and heat to 80-90° C. to obtain preheated epoxy resin; Acrylic acid, triethylamine and p-methoxyphenol are mixed and then added dropwise to the preheated epoxy resin; the reaction temperature is controlled to be 95-105° C. during the addition, the mass of the acrylic acid and the triethylamine are independently 0.1-3% of the mass of the bisphenol A epoxy resin, and the mass of the p-methoxyphenol is 0.01-1% of the mass of the bisphenol A epoxy resin; After the dropwise addition is completed, the reaction temperature is maintained and the reaction is continued for a period of time; Then raise the temperature to 110~120℃ to reduce the acid value to ≤5mgKOH / g; cool and discharge the material.

3. The UV-curable anaerobic adhesive according to claim 1, characterized in that: The preparation of the modified epoxy resin comprises the following steps: Add polyetheramine with functionality ≥ 2 and alicyclic epoxy resin in proportion to a reaction vessel equipped with a stirrer, a thermometer and a condenser, and react at 60-100°C for 2-4 hours; after the reaction is completed, cool and discharge the material; The molar ratio of the amino group of the polyetheramine to the epoxy group of the alicyclic epoxy resin is 0.8-1.

2.

4. The UV-curable anaerobic adhesive according to claim 1, characterized in that: The anaerobic monomer is a mixture of one or more selected from the group consisting of glycidyl methacrylate, isobornyl methacrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, 1,4-butanediol dimethacrylate, ethoxylated bisphenol A dimethacrylate and trimethylolpropane trimethacrylate.

5. The UV-curable anaerobic adhesive according to claim 1, characterized in that: The toughening agent is a mixture of one or more selected from carboxyl-terminated butadiene acrylonitrile rubber, core-shell rubber and linear polybutadiene-polyacrylonitrile copolymer.

6. The UV-curable anaerobic adhesive according to claim 1, characterized in that: The thixotropic agent has a specific surface area of ​​70-450m 2 / g of hydrophobic fumed silica.

7. The UV-curable anaerobic adhesive according to claim 1, characterized in that: The accelerator is a mixture of one or more selected from triethylamine, N,N-dimethylaniline and N,N-diethylaniline.

8. The UV-curable anaerobic adhesive according to claim 1, characterized in that: The photoinitiator is a mixture of one or more selected from 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 1-hydroxy-cyclohexyl-phenyl ketone, ethyl 2,4,6-trimethylbenzoylphenylphosphonate and methyl benzoylformate; The thermal initiator is a mixture of one or more selected from dibenzoyl peroxide and tert-butyl perbenzoate; The polymerization inhibitor is a mixture of one or more selected from hydroquinone, p-hydroxyanisole and 2,6-di-tert-butyl-p-cresol.

9. The method for preparing the UV-curable anaerobic adhesive according to any one of claims 1 to 8, characterized in that: The following steps are involved: The epoxy acrylate, modified epoxy resin, toughening agent, anaerobic monomer and thixotropic agent in the formula are mixed and stirred for 0.5 to 2 hours; then the accelerator and inhibitor in the formula are added, and stirring is continued for 0.5 to 2 hours; Then add the photoinitiator and thermal initiator in the formula amount, evacuate, maintain pressure and stir for 2h-4h; vacuum defoam and discharge the material.

10. The use of the UV-curable anaerobic adhesive according to any one of claims 1 to 8, characterized in that: For thread locking and / or sealing.

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