Electroplating equipment

Abstract

The invention provides electroplating equipment which comprises a shell, a transverse moving mechanism and a spraying device, an electroplating cavity and a waiting cavity which are spaced in the horizontal direction are formed in the shell, the transverse moving mechanism is connected to the interior of the shell, and the spraying device is connected to the transverse moving mechanism and used for spraying electroplating liquid to wafers and spraying the electroplating liquid to the wafers under driving of the transverse moving mechanism. The spraying device is arranged between the electroplating cavity and the waiting cavity and moves between the electroplating cavity and the waiting cavity, and the spraying device does not need to be stopped when the wafer is replaced, so that the electroplating efficiency of the wafer is improved, and the electroplating efficiency of the electroplating equipment on the wafer is further improved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor manufacturing technology, and more specifically, to an electroplating device. Background Art

[0002] In the field of semiconductor processing technology, the semiconductor electroplating process is to deposit a metal film layer on the surface of the wafer through the electroplating equipment to achieve electrical interconnection between multiple devices on the surface of the wafer. When electroplating the target wafer, a fixture is required to clamp the wafer and immerse the wafer below the liquid level of the electroplating solution in the electroplating chamber for electroplating.

[0003] At present, in the existing electroplating equipment, the spraying mechanism electroplates the wafer by spraying the plating liquid onto the wafer. However, in the existing electroplating equipment, the spraying mechanism is usually fixed at a specific position to electroplate the wafer. When the above technical solution is adopted, when the wafer is electroplated, since the spraying mechanism is in a fixed state, after completing the electroplating process of one wafer, the spraying mechanism needs to be shut down. After completing the replacement of the wafer, the spraying mechanism can start the electroplating process of the wafer, resulting in reduced production efficiency of the electroplating equipment. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide an electroplating device to solve the technical problem in the prior art that the spraying device needs to be shut down when replacing the wafer.

[0005] To achieve the above purpose, the technical solution adopted in this application is: to provide an electroplating device, including: A shell body, wherein a plating cavity and a waiting cavity are provided inside and are spaced apart in a horizontal direction, and the plating cavity and the waiting cavity are communicated with each other; A transverse movement mechanism connected to the housing; A spraying device connected to the transverse movement mechanism and having a first position and a second position, wherein the transverse movement mechanism drives the spraying device to move between the first position and the second position; When the spraying device is located at the first position, along the vertical direction, the position of the spraying device corresponds to the position of the electroplating chamber and is located above the electroplating chamber, and is used to spray the electroplating liquid to the target wafer located in the electroplating chamber; When the spraying device is located at the second position, the position of the spraying device corresponds to the position of the waiting chamber, and the spraying device is partially accommodated in the waiting chamber, and the waiting chamber replenishes the plating liquid to the plating chamber.

[0006] Optionally, the transverse movement mechanism comprises: A transverse movement module extending along the horizontal direction; A lifting cylinder is connected to the lateral movement module, and the spraying device is connected to the lifting cylinder. The lifting cylinder is used to adjust the distance between the spraying device and the target wafer when the spraying device is located at the second position.

[0007] Optionally, the transverse movement mechanism comprises: A transverse movement module extending along the horizontal direction; A connecting seat is connected to the transverse movement module, and the spraying device is connected to the connecting seat.

[0008] Optionally, the spraying device comprises: Ion exchange mechanism; an anode mechanism connected to one side of the ion exchange mechanism, and a side of the anode mechanism away from the ion exchange mechanism is connected to the transverse movement mechanism, the anode mechanism is provided with an anode cavity and a first flow channel, the first flow channel is communicated with the anode cavity, and the first flow channel is used for anode liquid to flow into and out of the anode cavity; A cathode mechanism connected to a side of the ion exchange mechanism away from the anode mechanism, the cathode mechanism being provided with a cathode cavity and a spraying hole, the spraying hole being in communication with the cathode cavity, and the cathode cavity being passed through a second flow channel so that the cathode liquid flows into and out of the cathode cavity; Wherein, when the cathode mechanism is located at the first position, the position of the cathode mechanism is arranged relative to the electroplating chamber; When the cathode mechanism is located at the second position, the cathode mechanism is arranged opposite to the waiting chamber.

[0009] Optionally, the anode mechanism comprises: An anode housing is provided with the first flow channel; An anode plate is installed in the anode housing, and the anode cavity is formed between the anode plate and the ion exchange mechanism.

[0010] Optionally, the first flow channel includes: A first liquid inlet channel is disposed at the center of the anode shell and communicated with the anode cavity; a flow guide channel, connected with the first liquid inlet channel and the anode cavity, and extending from the center of the anode shell toward the outside of the anode shell, the flow guide channel having an opening, and a portion of the opening of the flow guide channel is covered by a portion of the side wall of the anode plate; The first liquid outlet channel is arranged on the anode shell and communicated with the flow guide channel.

[0011] Optionally, the guide channel includes: A first flow guide channel extends along the radial direction of the anode shell and has a first opening, wherein the first opening is communicated with the anode cavity; The second flow guiding channel is arranged in a ring around the anode shell and communicated with the first flow guiding channel. The second flow guiding channel has a second opening, and the second opening is covered by a part of the side wall of the anode plate.

[0012] Optionally, there are multiple second flow guiding channels, and the multiple second flow guiding channels extend along the radial direction of the anode shell.

[0013] Optionally, the guide channel extends in a spiral shape along the radial direction of the anode shell.

[0014] Optionally, there are multiple anode plates, and the multiple anode plates are evenly spaced along the circumference of the anode housing; A third flow guiding channel is formed between any two adjacent anode plates. The position of the third flow guiding channel corresponds to the position of the first flow guiding channel, and the third flow guiding channel connects the first flow guiding channel and the anode cavity.

[0015] Optionally, the anode plate is provided with an air guide hole, and the air guide hole passes through the anode plate; The anode shell is provided with an exhaust hole, the exhaust gas passes through the anode shell, and the air guide hole is communicated with the exhaust hole.

[0016] Optionally, a guide portion is provided on one side of the anode plate close to the anode cavity, the guide portion is communicated with the air guide hole, and the guide portion is formed by a preset line segment rotating around the axis of the air guide hole.

[0017] Optionally, the cathode mechanism comprises: A cathode housing connected to a side of the ion exchange mechanism away from the anode mechanism, the cathode housing being provided with the cathode cavity; The ion plating plate is connected to the side of the cathode shell away from the ion exchange mechanism, and the plating holes are arranged on the ion plating plate.

[0018] Optionally, the second flow channel includes: A second liquid inlet channel is provided in the anode housing; A communication channel, disposed in the ion exchange mechanism and connected to the second liquid inlet channel; The second liquid outlet channel is arranged in the cathode shell and is communicated with the cathode cavity and the communication channel.

[0019] Optionally, the ion exchange mechanism comprises: A mounting frame, located between the anode mechanism and the cathode housing, and provided with a through hole, the through hole connecting the anode cavity and the cathode cavity; The ion exchange membrane is installed on one side of the mounting frame close to the anode cavity.

[0020] The beneficial effect of the electroplating equipment provided by the present application is that compared with the prior art, the spraying device provided by the present application includes a shell, a transverse movement mechanism, and a spraying device. The shell is provided with a plating chamber and a waiting chamber spaced apart in a horizontal direction. The transverse movement mechanism is connected to the shell, and the spraying device is connected to the transverse movement mechanism for spraying plating liquid onto the wafer and moving between the plating chamber and the waiting chamber under the drive of the transverse movement mechanism. When the wafer is replaced, the spraying device does not need to be shut down, thereby improving the electroplating efficiency of the wafer, thereby improving the electroplating efficiency of the electroplating equipment on the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0022] Figure 1 A schematic diagram of the structure of the electroplating equipment provided in the embodiment of the present application; Figure 2 A cross-sectional view of an electroplating device provided in an embodiment of the present application; Figure 3 A schematic diagram of the structure of a transverse movement module provided in one embodiment of the present application; Figure 4 A schematic diagram of the structure of a transverse shift module provided in another embodiment of the present application Figure 5 A schematic diagram of the structure of the spray coating device provided in an embodiment of the present application when it is located in the second position; Figure 6 A three-dimensional diagram of a spray coating device provided in an embodiment of the present application; Figure 7 A cross-sectional view of a spray coating device provided in an embodiment of the present application; Figure 8 A cross-sectional view of the spraying device provided in an embodiment of the present application from another perspective; Fig. 9 A three-dimensional diagram of an anode mechanism provided in an embodiment of the present application; Fig.10 A three-dimensional diagram of an anode housing provided in an embodiment of the present application; Fig.11 A front view of the anode housing provided in an embodiment of the present application; Fig.12 A three-dimensional diagram of a mounting frame provided in an embodiment of the present application; Fig.13 This is a schematic structural diagram of the cathode shell provided in an embodiment of the present application.

[0023] Among them, the reference numerals in the figure are: 100, shell; 110, electroplating chamber; 111, liquid inlet; 112, liquid outlet; 120, waiting chamber; 130, avoidance; 200, lateral movement mechanism; 210, lateral movement module; 220, lifting cylinder; 221, cylinder body; 222, piston rod; 230, connecting seat; 300, spraying device; 400, anode mechanism; 410, anode shell; 411, exhaust hole; 420, anode plate; 421, air guide hole; 422, guide part; 430, anode chamber; 440, first flow channel; 441, first inlet Liquid channel; 442, guide channel; 4421, first guide channel; 4422, second guide channel; 4423, third guide channel; 443, first liquid outlet channel; 500, ion exchange mechanism; 510, mounting frame; 511, through hole; 520, ion exchange membrane; 600, cathode mechanism; 610, cathode shell; 620, ion plating plate; 621, plating hole; 630, cathode cavity; 640, second flow channel; 641, second liquid inlet channel; 642, connecting flow channel; 643, second liquid outlet channel. DETAILED DESCRIPTION

[0024] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0025] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0026] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0027] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0028] Please also read Figures 1 to 13 , the electroplating equipment provided in the embodiment of the present application is now described.

[0029] The present application provides an electroplating device, which includes a housing 100 , a transverse movement mechanism 200 and a spraying device 300 .

[0030] Specifically, a plating chamber 110 and a waiting chamber 120 are provided in the housing 100 and are spaced apart in a horizontal direction, and the plating chamber 110 and the waiting chamber 120 are communicated with each other.

[0031] The transverse movement mechanism 200 is connected to the housing 100. The spraying device 300 is connected to the transverse movement mechanism 200 and has a first position and a second position. The transverse movement mechanism 200 drives the spraying device 300 to move between the first position and the second position.

[0032] When the spraying device 300 is located at the first position, along the vertical direction, the position of the spraying device 300 corresponds to the position of the electroplating chamber 110 and is located above the electroplating chamber 110 for spraying the electroplating liquid to the target wafer located in the electroplating chamber 110 .

[0033] When the spraying device 300 is located at the second position, the position of the spraying device 300 corresponds to the position of the waiting chamber 120 , and the spraying device 300 is partially accommodated in the waiting chamber 120 , and the waiting chamber 120 replenishes the plating liquid to the plating chamber 110 .

[0034] A wafer clamp is disposed in the electroplating chamber 110 , and the wafer clamp is used to clamp a target wafer.

[0035] The electroplating chamber 110 is provided with a liquid inlet 111 and a liquid outlet 112. The liquid inlet 111 is provided with a liquid inlet pump, and the liquid outlet 112 is provided with a liquid outlet pump. The liquid injection pump is used to inject the reaction liquid into the electroplating chamber 110, and the liquid outlet pump is used to discharge the reaction liquid from the electroplating chamber 110.

[0036] The housing 100 is provided with an escape opening 130 for the robot to transport the target wafer.

[0037] Initially, the liquid outlet pump is started to discharge the reaction liquid in the plating chamber 110 out of the plating chamber 110 so that the wafer is located above the reaction liquid. After the robot places the target wafer on the wafer clamp, the wafer clamp clamps the target wafer. At this time, the spraying device 300 is in the non-plating time, and the spraying device 300 moves to the waiting chamber 120, that is, the second position, under the drive of the lateral movement module 210. At the same time, the reaction liquid flows from the spraying device 300 into the waiting chamber 120, and then flows into the plating chamber 110 to replenish the plating chamber 110, thereby shortening the time for the subsequent liquid inlet pump to replenish the plating chamber 110.

[0038] It should be noted that when the reaction liquid flows from the waiting chamber 120 into the electroplating chamber 110 , the wafer is always located above the liquid surface of the reaction liquid.

[0039] When the target wafer needs to be electroplated, the liquid outlet pump stops working and the liquid inlet pump starts to inject the reaction liquid into the electroplating chamber 110, and make the liquid level of the reaction liquid exceed the height of the target wafer. At this time, the lateral movement module 210 drives the spraying device 300 to move from the waiting chamber 120 to the electroplating chamber 110, and opposite to the target wafer, that is, the first position, so as to inject cathode liquid onto the surface to be electroplated of the target wafer, thereby performing the electroplating process on the target wafer.

[0040] After the electroplating process on the target wafer is completed, the lateral movement module 210 drives the spraying device 300 to move into the waiting chamber 120, and the liquid outlet pump is started and restarted to facilitate electroplating on the next target wafer.

[0041] It should be noted that, in the present application, the reaction liquid is the cathode liquid flowing out of the spraying device 300 .

[0042] Compared with the prior art, the spraying device 300 provided in the present application includes a shell 100, a transverse movement mechanism 200, and a spraying device 300. The shell 100 is provided with a plating chamber 110 and a waiting chamber 120 spaced apart in a horizontal direction. The transverse movement mechanism 200 is connected to the shell 100. The spraying device 300 is connected to the transverse movement mechanism 200 and is used to spray plating liquid onto the wafer. Driven by the transverse movement mechanism 200, the spraying device 300 moves between the plating chamber 110 and the waiting chamber 120. When the wafer is replaced, the spraying device 300 does not need to be shut down, thereby improving the plating efficiency of the wafer, thereby improving the plating efficiency of the wafer by the plating equipment.

[0043] In one implementation of this application, see Figure 3 The transverse movement mechanism 200 includes a transverse movement module 210 and a lifting cylinder 220.

[0044] The traverse module 210 extends in the horizontal direction. The lifting cylinder 220 is connected to the traverse module 210, and the spraying device 300 is connected to the lifting cylinder 220. The traverse module 210 drives the spraying device 300 to move between the first position and the second position through the lifting cylinder 220. The lifting cylinder 220 is used to adjust the distance between the spraying device 300 and the target wafer when the spraying device 300 is located at the second position.

[0045] The lifting cylinder 220 includes a cylinder body 221 and a piston rod 222 connected to the cylinder body 221 and sliding relative to the cylinder body 221. The cylinder body 221 is fixedly connected to the sliding seat on the traverse module 210, and the spraying device 300 is connected to the piston rod 222. When the spraying device 300 moves to a position corresponding to the position of the target wafer, that is, the second position, the distance between the spraying device 300 and the target wafer can be adjusted by the lifting cylinder 220.

[0046] In another implementation of this application, see Figure 4 The transverse movement mechanism 200 includes a transverse movement module 210 and a connecting seat 230, the spraying device 300 is connected to the connecting seat 230, and the transverse movement module 210 drives the spraying device 300 to move between the first position and the second position through the connecting seat 230.

[0047] In this application, please see Figures 3 to 6 The spraying device 300 includes an anode mechanism 400 , an ion exchange mechanism 500 , and a cathode mechanism 600 .

[0048] Among them, the anode mechanism 400 is connected to one side of the ion exchange mechanism 500, and the side of the anode mechanism 400 away from the ion exchange mechanism 500 is connected to the lifting cylinder 220 or the connecting seat 230 on the transverse movement mechanism 200, and the anode mechanism 400 is provided with an anode cavity 430 and a first flow channel 440, and the first flow channel 440 is connected to the anode cavity 430, and the first flow channel 440 is used for the anode liquid to flow into and out of the anode cavity 430.

[0049] The cathode mechanism 600 is connected to the side of the ion exchange mechanism 500 away from the anode mechanism 400. The cathode mechanism 600 is provided with a cathode cavity 630 and a spray hole 621. The spray hole 621 is connected to the cathode cavity 630, and the cathode cavity 630 passes through a second flow channel 640 to allow cathode liquid to flow into and out of the cathode cavity 630.

[0050] When the spraying device 300 is located at the first position, the cathode mechanism 600 is disposed opposite to the electroplating chamber 110. When the spraying device 300 is located at the second position, the cathode mechanism 600 is disposed opposite to the waiting chamber 120.

[0051] Specifically, in the present application, the anode mechanism 400 includes an anode housing 410 and an anode plate 420. The ion exchange mechanism 500 includes a mounting frame 510 and an ion exchange membrane 520. The cathode mechanism 600 includes a cathode housing 610 and an ion plating plate 620.

[0052] See also Figures 7 and 8 The anode mechanism 400 includes an anode shell 410 and an anode plate 420. The anode shell 410 is connected to one side of the mounting frame 510. The anode plate 420 is installed in the anode shell 410 by bolts, and the diameter of the anode plate 420 is equal to the diameter of the target wafer. The anode plate 420 is made of phosphor copper. In the anode mechanism 400, an anode cavity 430 and a first flow channel 440 are provided on the anode shell 410. The anode cavity 430 is formed between the anode plate 420 and the ion exchange mechanism 500. The first flow channel 440 is connected to the anode cavity 430, and the first flow channel 440 is used for the anode liquid to flow into and out of the anode cavity 430.

[0053] The mounting frame 510 is located between the anode mechanism 400 and the cathode mechanism 600, and the anode housing 410 is connected to one side of the mounting frame 510. The mounting frame 510 is provided with a through hole 511, and the through hole 511 connects the anode cavity 430 and the cathode cavity 630. The ion exchange membrane 520 is installed on one side of the mounting frame 510 close to the anode plate 420. Among them, the anode cavity 430 is formed between the ion exchange membrane 520 and the anode plate 420.

[0054] Specifically, the cathode housing 610 is connected to the side of the mounting frame 510 away from the anode mechanism 400, and the cathode housing 610 is provided with a cathode cavity 630. The ion plating plate 620 is connected to the side of the cathode housing 610 away from the ion exchange mechanism 500, and the ion plating plate 620 is provided with plating holes 621.

[0055] The plating holes 621 are connected to the cathode chamber 630 , and there are multiple plating holes 621 . The multiple plating holes 621 are evenly distributed on the ion plating plate 620 to form a plating area, and the diameter of the plating area is equal to the diameter of the target wafer.

[0056] When the anolyte enters the anode chamber 430 from the first flow channel 440, the anolyte flows through the anode plate 420, thereby improving the uniformity of the distribution of metal ions in the anolyte.

[0057] The cathode shell 610 is connected to the side of the ion exchange mechanism 500 facing away from the anode mechanism 400. A cathode cavity 630 is provided on the cathode shell 610. The cathode cavity 630 passes through a second flow channel 640 to allow cathode liquid to flow into and out of the cathode cavity 630. The metal ions in the anode cavity 430 enter the cathode cavity 630 under the filtration of the ion exchange mechanism 500 and mix with the cathode liquid.

[0058] The ion plating plate 620 is connected to the side of the cathode housing 610 away from the ion exchange mechanism 500, and the ion plating plate 620 is provided with a plating hole 621, which is connected to the cathode chamber 630. The cathode liquid in the cathode chamber 630 flows from the plating hole 621 to the surface to be plated of the target wafer.

[0059] It should be noted that when the surface to be plated of the target wafer is subjected to the electroplating process, the ion plating plate 620 is spaced apart from the electroplated surface of the target wafer on one side facing the target wafer, and is used to clamp the target wafer. The clamping mechanism moves toward or away from the sub-plating plate 620. The distance between the surface to be plated and the ion plating plate 620 can be adjusted to between 3-12 mm as needed. Preferably, the distance between the surface to be plated and the ion plating plate 620 can be adjusted to 12 mm.

[0060] Compared with the prior art, the plating device 300 provided in the present application includes an ion exchange mechanism 500, an anode mechanism 400, a cathode shell 610 and an ion plating plate 620, wherein the anode mechanism 400 and the cathode shell 610 are respectively arranged on both sides of the ion exchange mechanism 500, and the ion plating plate 620 is arranged on the side of the cathode shell 610 away from the ion exchange mechanism 500, wherein a first flow channel 440 and an anode cavity 430 are provided in the anode mechanism 400, and the first flow channel 440 is used to inject and flow the anode liquid into and out of the anode cavity 430 to improve the fluidity of the anode liquid. At the same time, when the anode liquid is flowing, the anode liquid contacts the middle anode plate 420 of the anode mechanism 400, so as to facilitate the metal ions to pass through the ion exchange mechanism 500 into the cathode cavity 630 and then be sprayed by the plating plate on the surface to be electroplated of the target wafer, so as to improve the electroplating effect on the target wafer.

[0061] In an embodiment of the present invention, the first flow channel 440 includes a first liquid inlet channel 441 , a flow guide channel 442 and a first liquid outlet channel 443 .

[0062] For details, please refer to Figures 7 to 11 The first liquid inlet channel 441 is disposed at the center of the anode housing 410 and penetrates the anode housing 410 . The first liquid inlet channel 441 is connected to the anode cavity 430 . The first liquid inlet channel 441 is used to inject the anode liquid into the anode cavity 430 .

[0063] The flow channel 442 is connected to the first liquid inlet channel 441 and the anode cavity 430, and extends from the center of the anode housing 410 toward the outside of the anode housing 410. The flow channel 442 has an opening, and part of the opening of the flow channel 442 is covered by part of the side wall of the anode plate 420.

[0064] During the process of the anode liquid being injected into the anode cavity 430 from the first liquid inlet channel 441, part of the anode liquid directly enters the anode cavity 430 from the first liquid inlet channel 441, and another part of the anode liquid enters the guide channel 442. Since the partial opening of the guide channel 442 is covered by part of the side wall of the anode plate 420, when the anode liquid flows in the guide channel 442, the contact area between the anode liquid and the anode plate 420 is increased, thereby facilitating improving the uniformity of mixing of metal ions in the anode cavity 430.

[0065] The first liquid outlet channel 443 is disposed in the anode housing 410 and communicated with the flow guide channel 442 . As the anode liquid is continuously injected from the first liquid inlet channel 441 , the anode liquid in the anode cavity 430 is discharged from the anode cavity 430 through the first liquid outlet channel 443 .

[0066] In one embodiment of the present application, there are multiple first liquid outlet channels 443 , and the multiple first liquid outlet channels 443 are evenly spaced along the circumference of the anode housing 410 . Preferably, there are twelve first liquid outlet channels 443 .

[0067] In one embodiment of the present application, see Fig. 9 , Fig.11 and Fig.12 The guide channel 442 includes a first guide channel 4421 and a second guide channel 4422 .

[0068] The first flow guiding channel 4421 extends along the radial direction of the anode shell 410 and has a first opening. The first flow guiding channel 4421 is connected to the anode cavity 430 through the first opening.

[0069] The second flow guiding channel 4422 is annularly disposed on the anode housing 410 and communicates with the first flow guiding channel 4421, wherein the second flow guiding channel 4422 has a second opening, and the second opening is shielded by a portion of the side wall of the anode plate 420. There are multiple second flow guiding channels 4422, and the multiple second flow guiding channels 4422 extend along the radial direction of the anode housing 410.

[0070] Among the anode liquid entering the guide channel 442, part of the anode liquid directly enters the anode cavity 430 from the first guide channel 4421, and another part enters multiple second guide channels 4422, and the anode liquid entering the second guide channel 4422 enters the anode cavity 430 from the first guide channel 4421, thereby improving the uniformity of mixing of metal ions in the anode liquid.

[0071] It should be noted that the anode plate 420 and the plurality of second guide channels 4422 are coaxially arranged, and the diameter of the second guide channel 4422 located at the outermost side of the anode housing 410 is equal to the diameter of the anode plate 420 .

[0072] Preferably, in the present application, the number of the second conducting flow channels is 6, and the 6 second guiding channels 4422 are coaxially arranged.

[0073] In another embodiment of the present application, the guide channel 442 extends in a spiral shape along the radial direction of the anode shell 410 .

[0074] Specifically, when the flow guiding channel 442 extends in a spiral shape, the diameter of the flow guiding channel is equal to the diameter of the anode plate 420 , and the inner port of the flow guiding channel 442 is connected to the first liquid inlet channel 441 , and the flow guiding channel 442 is connected to the anode chamber 430 .

[0075] In one embodiment of the present application, see Fig. 9 There are multiple anode plates 420 , and each anode plate 420 is a fan-shaped structure. The multiple anode plates 420 are evenly spaced along the circumference of the anode housing 410 .

[0076] Preferably, the number of the anode plates 420 is 6, and the 6 anode plates 420 are evenly spaced along the circumference of the anode plates 420 .

[0077] In this application, please refer to Fig. 9 In the technical solution in which the guide channel 442 includes a first guide channel 4421 and a second guide channel 4422, a third guide channel 4423 is formed between any two adjacent anode plates 420 among the multiple anode plates 420, and the position of the third guide channel 4423 corresponds to the position of the first guide channel 4421, and the third guide channel 4423 connects the first guide channel 4421 and the anode cavity 430.

[0078] In the technical solution of the present application when the guide channel 442 extends in a spiral shape, the third guide channel 4423 is used to connect the guide channel 442 with the anode cavity 430 .

[0079] In one embodiment of the present application, the anode plate 420 is provided with air guide holes 421 .

[0080] For details, please refer to Figures 8 to 9 , the air guide hole 421 penetrates the anode plate 420. The anode shell 410 is provided with an exhaust hole 411, the exhaust penetrates the anode shell 410, and the air guide hole 421 is connected to the exhaust hole 411. The air contained in the anode liquid in the anode cavity 430 is discharged from the anode cavity 430 through the air guide hole 421 and the exhaust hole 411.

[0081] In one embodiment of the present application, a guide portion 422 is provided on one side of the anode plate 420 close to the anode chamber 430, the guide portion 422 is connected to the air guide hole 421, and the guide portion 422 is formed by rotating a preset line segment around the axis of the air guide hole 421, and the diameter of the end of the guide portion 422 away from the air guide hole 421 is larger than the diameter of the end of the guide portion 422 close to the guide portion 422. The guide portion 422 is used to guide the air in the anode liquid into the guide hole, and then discharged from the exhaust hole 411.

[0082] In the present application, the second flow channel 640 includes a second liquid inlet channel 641 , a connecting flow channel 642 , and a second liquid outlet channel 643 .

[0083] For details, please refer to Figures 8 to 13 The second liquid inlet channel 641 is provided in the anode housing 410 and is located outside the first liquid inlet channel 441. The communication channel 642 is provided in the mounting frame 510 and communicates with the second liquid inlet channel 641. The second liquid outlet channel 643 is provided in the cathode housing 610 and communicates with the cathode cavity 630 and the communication channel 642.

[0084] The number of the second liquid inlet channels 641, the connecting channels 642, and the second liquid outlet channels 643 are all multiple, and the number of the second liquid inlet channels 641, the connecting channels 642, and the second liquid outlet channels 643 are equal. Each connecting channel 642 is used to connect the corresponding second liquid inlet channel 641 and the second liquid outlet channel 643.

[0085] Preferably, in the present application, the number of the second liquid inlet channel 641 , the connecting flow channel 642 , and the second liquid outlet channel 643 are all 12.

[0086] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. An electroplating device, characterized in that: include: A shell body, wherein a plating cavity and a waiting cavity are provided inside and are spaced apart in a horizontal direction, and the plating cavity and the waiting cavity are communicated with each other; A transverse movement mechanism connected to the housing; A spraying device connected to the transverse movement mechanism and having a first position and a second position, wherein the transverse movement mechanism drives the spraying device to move between the first position and the second position; When the spraying device is located at the first position, along the vertical direction, the position of the spraying device corresponds to the position of the electroplating chamber and is located above the electroplating chamber, and is used to spray the electroplating liquid to the target wafer located in the electroplating chamber; When the spraying device is located at the second position, the position of the spraying device corresponds to the position of the waiting chamber, and the spraying device is partially accommodated in the waiting chamber, and the waiting chamber replenishes the plating liquid to the plating chamber.

2. The electroplating equipment according to claim 1, characterized in that The traverse mechanism comprises: A transverse movement module extending along the horizontal direction; A lifting cylinder is connected to the lateral movement module, and the spraying device is connected to the lifting cylinder. The lifting cylinder is used to adjust the distance between the spraying device and the target wafer when the spraying device is located at the second position.

3. The electroplating equipment according to claim 1, characterized in that: The traverse mechanism comprises: A transverse movement module extending along the horizontal direction; A connecting seat is connected to the transverse movement module, and the spraying device is connected to the connecting seat.

4. The electroplating equipment according to claim 1, 2 or 3, characterized in that: The spraying device comprises: Ion exchange mechanism; an anode mechanism connected to one side of the ion exchange mechanism, and a side of the anode mechanism away from the ion exchange mechanism is connected to the transverse movement mechanism, the anode mechanism is provided with an anode cavity and a first flow channel, the first flow channel is communicated with the anode cavity, and the first flow channel is used for anode liquid to flow into and out of the anode cavity; A cathode mechanism connected to a side of the ion exchange mechanism away from the anode mechanism, the cathode mechanism being provided with a cathode cavity and a spraying hole, the spraying hole being in communication with the cathode cavity, and the cathode cavity being passed through a second flow channel so that the cathode liquid flows into and out of the cathode cavity; Wherein, when the cathode mechanism is located at the first position, the position of the cathode mechanism is arranged relative to the electroplating chamber; When the cathode mechanism is located at the second position, the cathode mechanism is arranged opposite to the waiting chamber.

5. The electroplating equipment according to claim 4, characterized in that: The anode mechanism comprises: An anode housing is provided with the first flow channel; An anode plate is installed in the anode housing, and the anode cavity is formed between the anode plate and the ion exchange mechanism.

6. The electroplating equipment according to claim 5, characterized in that: The first flow channel comprises: A first liquid inlet channel is disposed at the center of the anode shell and communicated with the anode cavity; a flow guide channel, connected with the first liquid inlet channel and the anode cavity, and extending from the center of the anode shell toward the outside of the anode shell, the flow guide channel having an opening, and a portion of the opening of the flow guide channel is covered by a portion of the side wall of the anode plate; The first liquid outlet channel is arranged on the anode shell and communicated with the flow guide channel.

7. The electroplating equipment according to claim 6, characterized in that: The diversion channel comprises: A first flow guide channel extends along the radial direction of the anode shell and has a first opening, wherein the first opening is communicated with the anode cavity; The second flow guiding channel is arranged in a ring around the anode shell and communicated with the first flow guiding channel. The second flow guiding channel has a second opening, and the second opening is covered by a part of the side wall of the anode plate.

8. The electroplating equipment according to claim 7, characterized in that: There are a plurality of the second flow guiding channels, and the plurality of the second flow guiding channels extend along the radial direction of the anode shell.

9. The electroplating equipment according to claim 7, characterized in that: The flow guide channel extends in a spiral shape along the radial direction of the anode shell.

10. The electroplating equipment according to claim 8, characterized in that: The number of the anode plates is multiple, and the multiple anode plates are evenly spaced along the circumference of the anode shell; A third flow guiding channel is formed between any two adjacent anode plates. The position of the third flow guiding channel corresponds to the position of the first flow guiding channel, and the third flow guiding channel connects the first flow guiding channel and the anode cavity.

11. The electroplating equipment according to claim 10, characterized in that The anode plate is provided with an air guide hole, and the air guide hole passes through the anode plate; The anode shell is provided with an exhaust hole, the exhaust gas passes through the anode shell, and the air guide hole is communicated with the exhaust hole.

12. The electroplating equipment according to claim 11, characterized in that A flow guide portion is provided on one side of the anode plate close to the anode cavity. The flow guide portion is communicated with the air guide hole and is formed by a preset line segment rotating around the axis of the air guide hole.

13. The electroplating equipment according to claim 12, characterized in that The cathode mechanism comprises: A cathode housing connected to a side of the ion exchange mechanism away from the anode mechanism, the cathode housing being provided with the cathode cavity; The ion plating plate is connected to the side of the cathode shell away from the ion exchange mechanism, and the plating holes are arranged on the ion plating plate.

14. The electroplating equipment according to claim 12, characterized in that: The second flow channel comprises: A second liquid inlet channel is provided in the anode housing; A communication channel, disposed in the ion exchange mechanism and connected to the second liquid inlet channel; The second liquid outlet channel is arranged in the cathode shell and is communicated with the cathode cavity and the communication channel.

15. The electroplating equipment according to claim 14, characterized in that The ion exchange mechanism comprises: A mounting frame, located between the anode mechanism and the cathode housing, and provided with a through hole, the through hole connecting the anode cavity and the cathode cavity; The ion exchange membrane is installed on one side of the mounting frame close to the anode cavity.

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