Adjustable electroplating clamp for PCB electroplating

Abstract

The invention discloses an adjustable electroplating clamp for PCB electroplating, and belongs to the technical field of PCB electroplating, the adjustable electroplating clamp comprises an electroplating processing seat and a clamping plate platform used for clamping a PCB, the bottom end of the clamping plate platform is fixedly connected with a plurality of I-shaped plates through a plurality of hanging columns, and the two parallel bottom ends of the I-shaped plates are fixedly connected with adjusting motors through mounting plates. Through the arrangement of the gear assembly and the cam plates, different cam plates can rotate to alternately clamp and limit a PCB, so that different parts of the PCB are clamped and limited, a fixed clamping mode of a certain part of the PCB is avoided, and the situation that stress generated in the electroplating process of the PCB cannot be released is avoided; and meanwhile, limiting clamping plates and a tightening assembly are arranged, the two limiting clamping plates can get close to each other in the downward moving process, in the PCB moving process, the whole plate is limited, and the situation that the electroplating effect is affected due to large shaking caused by up-down and left-right movement of the plate is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of PCB electroplating, and in particular to an adjustable electroplating fixture for PCB electroplating. Background Art

[0002] PCB electroplating refers to the process of depositing a metal layer on the surface of a circuit board to enhance conductivity, corrosion resistance and solderability.

[0003] During the electroplating process of the current PCB board, the PCB board is generally clamped on a gantry, and then moved up and down, front and back, and goes through multiple slots such as pickling and degreasing, water washing, micro-etching, copper plating, acid dipping, and tinning. However, the machine moves up and down, front and back during the whole process, which makes the PCB board shake greatly. When the PCB board is lifted, the copper liquid tends to flow downward, and uneven copper plating will occur from a microscopic point of view, resulting in poor electroplating effect of the PCB board. In addition, if the thickness of the copper layer is uneven during the electroplating process, the copper layer on one side of the PCB board is thicker and the other side is thinner, which will cause uneven force on the board during thermal expansion and contraction, and the stress generated on the PCB board during the electroplating process cannot be released in time and accumulates inside the board, which will cause the PCB board to warp. Therefore, an adjustable electroplating fixture for PCB electroplating is proposed. Summary of the invention

[0004] The purpose of the present invention is to solve the problem that in the prior art, the machine moves up and down and forward and backward during the whole process, which makes the PCB board shake greatly. When the PCB board is lifted, the copper liquid tends to flow downward, and uneven copper plating occurs from a microscopic point of view, resulting in poor electroplating effect of the PCB board. In addition, if the thickness of the copper layer is uneven during the electroplating process, the copper layer on one side of the PCB board is thicker and the other side is thinner, which will cause uneven force on the board during thermal expansion and contraction, and the stress generated on the PCB board during the electroplating process cannot be released in time and accumulates inside the board, which will cause the warping of the PCB board. An adjustable electroplating fixture for PCB electroplating is proposed.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions: An adjustable electroplating fixture for electroplating a PCB board, comprising an electroplating processing seat and a clamping plate platform for clamping the PCB board, wherein the bottom end of the clamping plate platform is fixedly connected to a plurality of I-shaped plates through a plurality of hanging columns, and the two parallel bottom ends of the I-shaped plates are fixedly connected to an adjustment motor through a mounting plate, and the output end of the adjustment motor is connected to two adjustment shafts through a gear assembly, and six cam plates are fixedly connected to the outer side wall of the adjustment shaft, and the six cam plates are arranged opposite to each other in pairs, and the three cam plates located at one end of the adjustment shaft are arranged at 120 degrees to each other, and a plate fixture is arranged below the cam plate; The bottoms of the four ends of the I-shaped plate are fixedly connected with guide rods, the outer walls at both ends of the guide rods are connected with magnetic adjustment components through flat plates, a guide magnetic ring is arranged between the two magnetic adjustment components, the outer walls of the guide magnetic rings are fixedly connected with a cross bar through a connecting plate, the outer walls of the guide magnetic rings are fixedly connected with two mutually symmetrical fixing seats, the side walls of the fixing seats are connected with a limiting clamp through a tightening assembly, a detection tube is arranged on the outer side of the limiting clamp, and a detection assembly for detecting the warping of the PCB board is arranged on the upper end of the detection tube.

[0006] Preferably, a plurality of processing grooves are fixedly connected to the top of the electroplating processing seat, two electrically controlled guide rails are fixedly connected to the top of the electroplating processing seat, the electrically controlled guide rails are slidably connected to lifting guide rails, and the two lifting guide rails are slidably connected to the two ends of the clamping platform through two sliding seats respectively.

[0007] Preferably, the gear assembly consists of a driving gear and two driven gear rings, the output end of the adjustment motor is fixedly connected to the end of the driving gear through a driving shaft, the driving gear is meshed with the driven gear ring on one side, and the two driven gear rings are meshed.

[0008] Preferably, the inner side wall of the driven gear ring is fixedly connected to the outer side wall of the adjustment shaft, the end of the adjustment shaft is rotatably connected to the side wall of the mounting plate, the side wall of the mounting plate is rotatably connected to a clamp shaft, the outer side wall of the clamp shaft is rotatably connected to a plate clamp, a torsion spring is arranged in the plate clamp, and the cam plate is made of spring steel and has good elasticity.

[0009] Preferably, the magnetic adjustment assembly consists of a central electromagnetic column and a plurality of edge electromagnetic columns, the planar plate is fixedly connected to the central electromagnetic column and the plurality of edge electromagnetic columns respectively, and the plurality of edge electromagnetic columns are arranged on the periphery of the central electromagnetic column.

[0010] Preferably, the tightening assembly consists of a slide plate and a tightening slide rod, a slide groove is provided on the side wall of the fixed seat, the inner wall of the slide groove is slidably connected to the tightening slide rod through the slide plate, and the inner wall of the guide magnetic ring is slidably connected to the outer wall of the guide rod.

[0011] Preferably, a trapezoidal guide plate is fixedly connected to the top of the flat plate located below, and guide grooves are provided on both inclined side walls of the trapezoidal guide plate. The inner side walls of the guide grooves are slidably connected to the ends of the tightening slide rods, and the slide plate is slidably connected to the cross bar. The slide plate is fixedly connected to the limit clamp plate through a plurality of arc plates, and the limit clamp plate is slidably connected to the cross bar.

[0012] Preferably, the detection assembly consists of a piston plate and a corresponding photoelectric sensor, the end of the cross bar is fixedly connected to the outer wall of the detection tube through a limit plate, the inner wall of the lower end of the detection tube is fixedly connected to the detection panel through a telescopic rod, the inner wall of the upper end of the detection tube is slidably connected to the corresponding photoelectric sensor through the piston plate, and the detection tube is filled with liquid.

[0013] Compared with the prior art, the present invention has the following beneficial effects: 1. Through the arrangement of the gear assembly and the cam plate, this scheme can utilize different cam plates to rotate alternately to clamp and limit the PCB plate, so that different parts of the PCB plate can be clamped and limited, avoiding the situation where a certain part of the PCB plate is fixedly clamped, so that the stress generated by the PCB plate during the electroplating process cannot be released.

[0014] 2. This solution uses the setting of the limit clamp and the tightening component to make the two limit clamps approach each other during the downward movement. During the movement of the PCB plate, the entire plate is limited to avoid large shaking caused by the up, down, left and right movement of the plate, which affects the electroplating effect.

[0015] 3. Through the setting of the detection panel and the detection component, this scheme can utilize the pressure change on the detection panels on both sides when the PCB board is warped, and convert this change into the height change of the corresponding photoelectric sensor on the detection tube, so as to quickly detect the warping condition of the PCB board after electroplating. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of the three-dimensional structure of an adjustable electroplating fixture for electroplating a PCB board proposed by the present invention; Figure 2 This is a schematic structural diagram of the bottom of a clamping plate platform in an adjustable electroplating fixture for PCB electroplating proposed by the present invention; Figure 3 for Figure 2 The enlarged view of point A in the middle; Figure 4 This is a schematic diagram of the structure below the I-shaped plate in an adjustable electroplating fixture for PCB electroplating proposed by the present invention; Figure 5 for Figure 4 The enlarged view of point B in the middle; Figure 6 A schematic diagram of the structure of multiple plate fixture positions in an adjustable electroplating fixture for PCB electroplating proposed by the present invention; Figure 7 This is a schematic structural diagram of a gear assembly in an adjustable electroplating fixture for PCB electroplating proposed by the present invention; Figure 8This is a structural schematic diagram of a tightening component in an adjustable electroplating fixture for PCB electroplating proposed by the present invention; Fig. 9 The present invention is a schematic structural diagram of a detection component in an adjustable electroplating fixture for PCB electroplating.

[0017] In the figure: 1. Electroplating processing seat; 2. Clamping plate platform; 3. Electric control guide rail; 4. Lifting guide rail; 5. Slide seat; 6. I-shaped plate; 7. Adjustment motor; 8. Driving gear; 9. Driven gear ring; 10. Adjustment shaft; 11. Cam plate; 12. Clamp shaft; 13. Plate clamp; 14. Guide rod; 15. Center electromagnetic column; 16. Edge electromagnetic column; 17. Guide magnetic ring; 18. Fixed seat; 19. Slide plate; 20. Tightening slide rod; 21. Trapezoidal guide plate; 22. Limit clamp; 23. Detection panel; 24. Detection tube; 25. Piston plate; 26. Opposing photoelectric sensor. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0019] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0020] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "mounted / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0021] Example, see Figures 1 to 9, an adjustable electroplating fixture for electroplating of PCB boards, comprising an electroplating processing seat 1 and a clamping plate platform 2 for clamping PCB boards, the bottom ends of the clamping plate platform 2 are respectively fixedly connected with multiple I-shaped plates 6 through multiple hanging columns, the two parallel bottom ends of the I-shaped plates 6 are fixedly connected with adjustment motors 7 through mounting plates, the output end of the adjustment motor 7 is connected with two adjustment shafts 10 through a gear assembly, six cam plates 11 are fixedly connected to the outer wall of the adjustment shaft 10, the six cam plates 11 are arranged opposite to each other in pairs, the three cam plates 11 located at one end of the adjustment shaft 10 are arranged at 120 degrees to each other, and a plate fixture 13 is arranged below the cam plates 11; Furthermore, a plurality of processing grooves are fixedly connected to the top of the electroplating processing seat 1, and two electrically controlled guide rails 3 are fixedly connected to the top of the electroplating processing seat 1. The electrically controlled guide rails 3 are slidably connected to the lifting guide rails 4. The two lifting guide rails 4 are slidably connected to the two ends of the clamping plate platform 2 through two slide seats 5 respectively. The gear assembly consists of a driving gear 8 and two driven gear rings 9. The output end of the adjustment motor 7 is fixedly connected to the end of the driving gear 8 through the driving shaft. The driving gear 8 is meshed with the driven gear ring 9 on one side. The two driven gear rings 9 are meshed. The inner side wall of the driven gear ring 9 is fixedly connected to the outer side wall of the adjustment shaft 10. The end of the adjustment shaft 10 is rotatably connected to the side wall of the mounting plate. The side wall of the mounting plate is rotatably connected to the clamp shaft 12. The outer side wall of the clamp shaft 12 is rotatably connected to the plate clamp 13. A torsion spring is arranged in the plate clamp 13. The cam plate 11 is made of spring steel and has good elasticity. It should be noted that: the upper edge of the PCB plate to be electroplated is placed between a plurality of plate clamps 13. Under the action of the torsion spring, the plate clamp 13 is initially kept in an open state. Then, the start-adjusting motor 7 is controlled to drive the driving gear 8 to rotate through the driving shaft. The rotation of the driving gear 8 will drive the driven gear ring 9 on one side to rotate, so that the two meshing driven gear rings 9 rotate in opposite directions. The rotation of the driven gear ring 9 drives the six cam plates 11 to rotate through the adjustment shaft 10. The cam plates 11 are controlled to stop after rotating a certain angle, so that the two symmetrical cam plates 11 can be pressed just tightly on the two symmetrical plate clamps 1. 3, so that the plate clamp 13 clamps and limits the PCB plate, and then the slide seat 5 slides in the lifting guide rail 4 to control the lifting of the clamping platform 2, and then the lifting guide rail 4 slides in the electric control guide rail 3 to realize different electroplating processing of the PCB plate. During the copper plating process of the PCB plate, the control adjustment motor 7 is controlled to rotate slowly, and the multiple cam plates 11 will rotate accordingly, and before the next group of two symmetrical cam plates 11 are pressed on the corresponding plate clamp 13, the two symmetrical cam plates 11 that are pressed will be elastically deformed due to the pressing force, and after the next group of cam plates 11 are pressed, they will rotate out and disengage; The above advantages are as follows: different cam plates 11 can be rotated alternately to clamp and limit the PCB board, so that different parts of the PCB board can be clamped and limited, avoiding the situation where a certain part of the PCB board is fixedly clamped, so that the stress generated by the PCB board during the electroplating process cannot be released; The bottoms of the four ends of the I-shaped plate 6 are fixedly connected with guide rods 14, and the outer walls of both ends of the guide rods 14 are connected with magnetic adjustment components through plane plates. A guide magnetic ring 17 is arranged between the two magnetic adjustment components. The outer wall of the guide magnetic ring 17 is fixedly connected with a cross bar through a connecting plate. The outer wall of the guide magnetic ring 17 is fixedly connected with two mutually symmetrical fixing seats 18, and the side walls of the fixing seats 18 are connected with a limited clamping plate 22 through a tightening assembly. Further, the magnetic adjustment component is composed of a central electromagnetic column 15 and a plurality of edge electromagnetic columns 16, the plane plate is fixedly connected to the central electromagnetic column 15 and the plurality of edge electromagnetic columns 16 respectively, the plurality of edge electromagnetic columns 16 are arranged on the periphery of the central electromagnetic column 15, the tightening component is composed of a slide plate 19 and a tightening slide bar 20, a slide groove is provided on the side wall of the fixed seat 18, the inner side wall of the slide groove is slidably connected to the tightening slide bar 20 through the slide plate 19, the inner side wall of the guide magnetic ring 17 is slidably connected to the outer side wall of the guide rod 14, a trapezoidal guide plate 21 is fixedly connected to the top of the plane plate located below, guide grooves are provided on both inclined side walls of the trapezoidal guide plate 21, the inner side wall of the guide groove is slidably connected to the end of the tightening slide bar 20, the slide plate 19 is slidably connected to the cross bar, the slide plate 19 is fixedly connected to the limit clamping plate 22 through a plurality of arc plates, and the limit clamping plate 22 is slidably connected to the cross bar; It should be noted that: after the electroplating of the PCB board is completed, current is respectively passed through the central electromagnetic column 15 and the plurality of edge electromagnetic columns 16, so that the central electromagnetic column 15 and the plurality of edge electromagnetic columns 16 have magnetic fields in opposite directions, and the guide magnetic ring 17 slides on the guide rod 14 under the action of the composite magnetic field (the central electromagnetic column 15 exhibits magnetic repulsion, and the edge electromagnetic column 16 exhibits magnetic attraction). By controlling the magnetic force of the central electromagnetic column 15 and the plurality of edge electromagnetic columns 16, the sliding distance of the guide magnetic ring 17 is controlled, and the lifting and sliding of the guide magnetic ring 17 in the electroplating solution is controlled by the change of magnetic force. Compared with the existing push rod structure, it can avoid the push rod structure from moving inside and outside the electroplating solution, splashing the electroplating solution onto the PCB board on one side, and affecting the electroplating effect; The sliding of the guide magnetic ring 17 will drive the two fixing seats 18 to slide, and the movement of the fixing seats 18 will drive the tightening slide bar 20 to slide through the slide plate 19. The two tightening slide bars 20 will slide on the trapezoidal guide plate 21 and move closer to each other, thereby driving the two slide plates 19 to move closer to each other, so that the two limit clamps 22 move closer to each other and clamp and limit the bottom of the PCB plate; The above advantages are as follows: in this way, the two limiting clamps 22 can be used to move closer to each other during the downward movement, and the entire PCB plate can be limited during the movement of the PCB plate, thereby avoiding large shaking caused by the upward, downward, leftward and rightward movement of the plate, which affects the electroplating effect; A detection tube 24 is arranged outside the limit clamping plate 22, and a detection component for detecting the warpage of the PCB board is arranged on the upper end of the detection tube 24; Further, the detection assembly is composed of a piston plate 25 and a beam photoelectric sensor 26, the end of the crossbar is fixedly connected to the outer wall of the detection tube 24 through a limit plate, the inner wall of the lower end of the detection tube 24 is fixedly connected to the detection panel 23 through a telescopic rod, the inner wall of the upper end of the detection tube 24 is slidably connected to the beam photoelectric sensor 26 through the piston plate 25, and the detection tube 24 is filled with liquid; It should be noted that: during the downward movement of the guide magnetic ring 17, the detection tubes 24 on both sides will be driven to move downward synchronously through the cross bar, and the detection panel 23 will be pressed against the PCB board through the structure of the telescopic rod, wherein the telescopic rod is connected to the liquid in the detection tube 24. When the PCB board is warped, one of the detection panels 23 on both sides of the PCB board will extend and the other will contract, so that the piston plate 25 on one side is pressed by the liquid, driving the opposing photoelectric sensor 26 on this side to move upward, and the piston plate 25 on the other side is attracted by the liquid, driving the opposing photoelectric sensor 26 on the other side to move downward, so that there is a height difference between the opposing photoelectric sensors 26 on both sides, which is then detected; The above advantages are: when the PCB board is warped, the pressure change on the detection panels 23 on both sides can be used to convert this change into the height change of the corresponding photoelectric sensor 26 on the detection tube 24, so as to quickly detect the warping of the PCB board after electroplating; When the present invention is in use, the upper edge of the PCB plate to be electroplated is placed between a plurality of plate clamps 13. Under the action of the torsion spring, the plate clamp 13 is initially kept in an open state. Then, the start-adjusting motor 7 is controlled to drive the driving gear 8 to rotate through the driving shaft. The rotation of the driving gear 8 drives the driven gear ring 9 on one side to rotate, so that the two meshing driven gear rings 9 rotate in opposite directions. The rotation of the driven gear ring 9 drives the six cam plates 11 to rotate through the adjustment shaft 10. The cam plates 11 are controlled to stop after rotating a certain angle, so that the two symmetrical cam plates 11 can be pressed against the two symmetrical plate clamps 13, so that the plate clamps 13 clamp and limit the PCB plate. Then, the slide seat 5 slides in the lifting guide rail 4 to control the clamping plate platform 2. The lifting and lowering of the lifting guide rail 4 is then realized by sliding the lifting guide rail 4 in the electric control guide rail 3 to realize different electroplating processing of the PCB plate. During the copper plating process of the PCB plate, the control adjustment motor 7 is slowly rotated, and the multiple cam plates 11 will rotate accordingly. Before the next group of two symmetrical cam plates 11 are pressed on the corresponding plate clamp 13, the two pressed symmetrical cam plates 11 will be elastically deformed due to the pressing force, and after the next group of cam plates 11 are pressed, they will rotate out of separation. In this way, different cam plates 11 can be rotated to alternately clamp and limit the PCB plate, so that different parts of the PCB plate can be clamped and limited, avoiding the fixed clamping method of a certain part of the PCB plate, so that the stress generated by the PCB plate during the electroplating process cannot be released. After the electroplating of the PCB board is completed, current is respectively passed through the central electromagnetic column 15 and the plurality of edge electromagnetic columns 16, so that the central electromagnetic column 15 and the plurality of edge electromagnetic columns 16 have magnetic fields in opposite directions, and the guide magnetic ring 17 slides on the guide rod 14 under the action of the composite magnetic field (the central electromagnetic column 15 exhibits magnetic repulsion, and the edge electromagnetic column 16 exhibits magnetic attraction). By controlling the magnetic force of the central electromagnetic column 15 and the plurality of edge electromagnetic columns 16, the sliding distance of the guide magnetic ring 17 is controlled, and the lifting and sliding of the guide magnetic ring 17 in the electroplating solution is controlled by the change of magnetic force. Compared with the existing push rod structure, the push rod structure can be prevented from moving in and out of the electroplating solution, splashing the electroplating solution onto the PCB board on one side, and affecting the electroplating effect; The sliding of the guide magnetic ring 17 will drive the two fixing seats 18 to slide, and the movement of the fixing seats 18 will drive the tightening slide bar 20 to slide through the slide plate 19. The two tightening slide bars 20 will slide on the trapezoidal guide plate 21 and approach each other, thereby driving the two slide plates 19 to approach each other, so that the two limiting clamps 22 are close to each other and clamp the bottom of the PCB plate. In this way, the two limiting clamps 22 can be used to approach each other during the downward movement process, and the entire PCB plate can be limited during the movement of the PCB plate, so as to avoid large shaking caused by the up, down, left and right movement of the plate, which affects the electroplating effect; During the downward movement of the guide magnetic ring 17, the detection tubes 24 on both sides will be driven to move downward synchronously through the cross bar, and the detection panel 23 will be pressed against the PCB board through the structure of the telescopic rod, wherein the telescopic rod is connected to the liquid in the detection tube 24. When the PCB board is warped, one of the detection panels 23 on both sides of the PCB board will extend and the other will contract, so that the piston plate 25 on one side is pressed by the liquid, driving the opposing photoelectric sensor 26 on this side to move upward, and the piston plate 25 on the other side is attracted by the liquid, driving the opposing photoelectric sensor 26 on the other side to move downward, so that there is a height difference between the opposing photoelectric sensors 26 on both sides, which is then detected. In this way, the pressure change on the detection panels 23 on both sides when the PCB board is warped can be used to convert this change into a height change of the opposing photoelectric sensor 26 on the detection tube 24, so as to quickly detect the warping of the PCB board after electroplating.

[0022] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An adjustable electroplating fixture for electroplating a PCB board, comprising an electroplating processing seat (1) and a clamping platform (2) for clamping the PCB board, characterized in that: The bottom end of the clamping plate platform (2) is fixedly connected to a plurality of I-shaped plates (6) via a plurality of suspension columns, and the two parallel bottom ends of the I-shaped plates (6) are fixedly connected to an adjustment motor (7) via a mounting plate, and the output end of the adjustment motor (7) is connected to two adjustment shafts (10) via a gear assembly, and six cam plates (11) are fixedly connected to the outer wall of the adjustment shaft (10), and the six cam plates (11) are arranged opposite to each other in pairs, and the three cam plates (11) located at one end of the adjustment shaft (10) are arranged at 120 degrees to each other, and a plate clamp (13) is arranged below the cam plate (11); The bottoms of the four ends of the I-shaped plate (6) are fixedly connected to guide rods (14), the outer walls of the two ends of the guide rods (14) are connected to magnetic adjustment components via a plane plate, a guide magnetic ring (17) is arranged between the two magnetic adjustment components, the outer wall of the guide magnetic ring (17) is fixedly connected to a cross bar via a connecting plate, the outer wall of the guide magnetic ring (17) is fixedly connected to two mutually symmetrical fixing seats (18), the side wall of the fixing seat (18) is connected to a limit clamping plate (22) via a tightening assembly, a detection tube (24) is arranged on the outside of the limit clamping plate (22), and a detection assembly for detecting the warpage of the PCB board is arranged on the upper end of the detection tube (24).

2. The adjustable electroplating fixture for PCB electroplating according to claim 1, characterized in that: The top of the electroplating processing seat (1) is fixedly connected to a plurality of processing grooves, the top of the electroplating processing seat (1) is fixedly connected to two electric control guide rails (3), the electric control guide rails (3) are slidably connected to a lifting guide rail (4), and the two lifting guide rails (4) are slidably connected to the two ends of the clamping platform (2) via two slide seats (5), respectively.

3. The adjustable electroplating fixture for PCB electroplating according to claim 1, characterized in that: The gear assembly consists of a driving gear (8) and two driven gear rings (9); the output end of the adjustment motor (7) is fixedly connected to the end of the driving gear (8) via a driving shaft; the driving gear (8) is meshed with the driven gear ring (9) on one side; and the two driven gear rings (9) are meshed with each other.

4. The adjustable electroplating fixture for PCB electroplating according to claim 3, characterized in that: The inner wall of the driven gear ring (9) is fixedly connected to the outer wall of the adjustment shaft (10); the end of the adjustment shaft (10) is rotatably connected to the side wall of the mounting plate; the side wall of the mounting plate is rotatably connected to a clamp shaft (12); the outer wall of the clamp shaft (12) is rotatably connected to a plate clamp (13); a torsion spring is arranged in the plate clamp (13); and the cam plate (11) is made of spring steel and has good elasticity.

5. The adjustable electroplating fixture for PCB electroplating according to claim 1, characterized in that: The magnetic adjustment component is composed of a central electromagnetic column (15) and a plurality of edge electromagnetic columns (16); the planar plate is fixedly connected to the central electromagnetic column (15) and the plurality of edge electromagnetic columns (16), respectively; and the plurality of edge electromagnetic columns (16) are arranged on the periphery of the central electromagnetic column (15).

6. The adjustable electroplating fixture for PCB electroplating according to claim 1, characterized in that: The tightening assembly is composed of a slide plate (19) and a tightening slide rod (20); a slide groove is provided on the side wall of the fixing seat (18); the inner side wall of the slide groove is slidably connected to the tightening slide rod (20) via the slide plate (19); and the inner side wall of the guide magnetic ring (17) is slidably connected to the outer side wall of the guide rod (14).

7. The adjustable electroplating fixture for PCB electroplating according to claim 6, characterized in that: A trapezoidal guide plate (21) is fixedly connected to the top of the flat plate at the bottom, and guide grooves are provided on both inclined side walls of the trapezoidal guide plate (21). The inner side walls of the guide grooves are slidably connected to the ends of the tightening slide bars (20), and the slide plate (19) is slidably connected to the cross bar. The slide plate (19) is fixedly connected to the limit clamp plate (22) via a plurality of arc-shaped plates, and the limit clamp plate (22) is slidably connected to the cross bar.

8. The adjustable electroplating fixture for PCB electroplating according to claim 1, characterized in that: The detection assembly is composed of a piston plate (25) and a beam photoelectric sensor (26); the end of the crossbar is fixedly connected to the outer wall of the detection tube (24) via a limit plate; the inner wall of the lower end of the detection tube (24) is fixedly connected to the detection panel (23) via a telescopic rod; the inner wall of the upper end of the detection tube (24) is slidably connected to the beam photoelectric sensor (26) via the piston plate (25); and the detection tube (24) is filled with liquid.

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